Array antenna and electronic device

Abstract

The present application relates to the technical field of antennas, and provides an array antenna and an electronic device, which can solve the problems of low flatness, high costs and low processing accuracy of existing PCB substrate-based array antennas. The array antenna in the present application comprises a radiation structure, a phase shifter, and a feeding structure. The radiation structure, the phase shifter, and the feeding structure are integrated on at least one dielectric substrate. The phase shifter is connected to the radiation structure, and the feeding structure is connected to the phase shifter by means of a via hole passing through the dielectric substrate. The array antenna of the present application is based on a glass-based semiconductor process, and compared with existing PCB-based array antennas, has the advantages of high flatness, low costs, and high processing accuracy.

Description

Array antennas and electronic devices Technical Field

[0001] This disclosure belongs to the field of antenna technology, specifically relating to an array antenna and electronic device. Background Technology

[0002] Compared to 4G and 3G signals, 5G signals offer significant advantages in terms of low latency and high throughput. Furthermore, in 5G mobile communication systems, higher frequency bands, wider bandwidth, and larger antenna arrays enable high-precision, high-resolution sensing, thus achieving Integrated Sensing and Communication (ISAC), or simply integrated sensing. A communication system with integrated sensing, such as a base station antenna, refers to a communication system capable of sensing the attributes and states of the network, users, terminals, or environmental objects. While communicating, it can also act as a sensor, sending and receiving wireless signals and obtaining information such as distance, speed, and angle from these signals, providing high-precision positioning, gesture capture, motion recognition, and the detection and tracking of passive objects.

[0003] However, due to the high-frequency characteristics of 5G signals, their transmission distance is much shorter than that of 4G or 3G signals. Therefore, for the same coverage area, the construction density of 5G base stations is often much higher than that of 4G or 3G base stations, resulting in higher construction costs and energy consumption for 5G base station antennas. Furthermore, to enable accurate sensing and positioning by base station antennas, high beam pointing accuracy is typically required. Precise beam pointing requires the spacing between the digital channels of the adjustable antenna to be as small as possible, and the beam should not be too wide. Related technologies often achieve high beam pointing accuracy by increasing the number of digital channels and antenna elements. However, increasing the number of digital channels or antenna elements leads to increased antenna power consumption and manufacturing costs.

[0004] Therefore, there is an urgent need to provide an antenna that can meet the requirements of integrated communication and sensing while reducing power consumption and cost.

[0005] Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art. On the one hand, it provides an array antenna, which includes a radiating structure, a phase shifter and a feeding structure; wherein the radiating structure, the phase shifter and the feeding structure are integrated on at least one dielectric substrate; the phase shifter and the radiating structure are connected, and the feeding structure is connected to the phase shifter through a via through the dielectric substrate.

[0007] In some examples, the at least one dielectric substrate includes a first dielectric substrate and a second dielectric substrate; the phase shifter includes a phase shifting main body disposed on the first dielectric substrate and a first reference electrode disposed on the first dielectric substrate away from the phase shifting main body; the second dielectric substrate is disposed on the side of the first reference electrode away from the first dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate away from the first reference electrode.

[0008] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the first feed terminals of the N phase-shifting main bodies; the second feed terminals of the phase-shifting main bodies are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0009] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0010] In some examples, the second power divider is disposed on the side of the second dielectric substrate away from the first reference electrode and is disposed on the same layer as the radiating structure; the first power divider is disposed on the side of the first dielectric substrate away from the first reference electrode and is disposed on the same layer as the phase-shifting main body.

[0011] In some examples, a coupling slot is provided on the first reference electrode; the first feed terminal of the second power divider, the coupling slot, and the second feed terminal of the phase shifting body overlap in their orthogonal projections on the first dielectric substrate.

[0012] In some examples, a guiding structure is also included; the at least one dielectric substrate further includes a third dielectric substrate and a fourth dielectric substrate; the third dielectric substrate is disposed on the side of the phase-shifting body that is away from the first dielectric substrate, and the fourth dielectric substrate is disposed on the side of the radiating structure that is away from the second dielectric substrate; the guiding structure is disposed on the side of the fourth dielectric substrate that is away from the radiating structure.

[0013] In some examples, a first dielectric layer is filled between the third dielectric substrate and the first dielectric substrate, and between the fourth dielectric substrate and the second dielectric substrate.

[0014] In some examples, a second reference electrode is also included; the at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; the phase shifter includes a phase shifting main body disposed on the first dielectric substrate and a first reference electrode disposed on the first dielectric substrate away from the phase shifting main body; the third dielectric substrate is disposed on the side of the first reference electrode away from the first dielectric substrate; the second dielectric substrate is disposed on the side of the third dielectric substrate away from the first dielectric substrate, the second reference electrode is disposed on the side of the second dielectric substrate close to the third dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate away from the second reference electrode.

[0015] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the first feed terminals of the N phase-shifting main bodies; the second feed terminals of the phase-shifting main bodies are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0016] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0017] In some examples, the second power divider is disposed on the side of the second dielectric substrate opposite to the second reference electrode and is disposed on the same layer as the radiating structure; the first power divider is disposed on the side of the first dielectric substrate opposite to the first reference electrode and is disposed on the same layer as the phase-shifting main body.

[0018] In some examples, a feed core is also included that penetrates the first dielectric substrate, the first reference electrode, the third dielectric substrate, the second reference electrode, and the second dielectric substrate; the second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider through the feed core.

[0019] In some examples, the at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; the phase shifter includes a phase shifting main body disposed on the first dielectric substrate and a first reference electrode disposed on the first dielectric substrate away from the phase shifting main body; the third dielectric substrate is disposed on the side of the first reference electrode away from the first dielectric substrate; the second dielectric substrate is disposed on the side of the third dielectric substrate away from the first dielectric substrate; the second power divider is disposed on the side of the second dielectric substrate close to the third dielectric substrate; and the radiating structure is disposed on the side of the second dielectric substrate away from the second power divider.

[0020] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the first feed terminals of the N phase-shifting main bodies; the second feed terminals of the phase-shifting main bodies are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0021] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0022] In some examples, the radiating structure and the second power divider are electrically connected through a via through the second dielectric substrate; the first power divider is disposed on the side of the first dielectric substrate opposite to the first reference electrode and is disposed in the same layer as the phase-shifting body.

[0023] In some examples, a feed core is also included that extends through the first dielectric substrate, the first reference electrode, and the third dielectric substrate; the second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider through the feed core.

[0024] In some examples, a second reference electrode is also included; the at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; the phase shifter includes a phase shifting main body disposed on the first dielectric substrate and a first reference electrode disposed on the first dielectric substrate away from the phase shifting main body; the third dielectric substrate is disposed on the side of the first reference electrode away from the first dielectric substrate; the second dielectric substrate is disposed on the side of the third dielectric substrate away from the first dielectric substrate, the second reference electrode is disposed on the side of the second dielectric substrate close to the third dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate away from the second reference electrode.

[0025] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the first feed terminals of the N phase-shifting main bodies; the second feed terminals of the phase-shifting main bodies are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0026] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0027] In some examples, the first power divider and the second power divider are disposed on the side of the second dielectric substrate away from the second reference electrode and are disposed in the same layer as the radiating structure.

[0028] In some examples, a first feed core, a second feed core, and a third feed core are also included that penetrate the first dielectric substrate, the first reference electrode, the third dielectric substrate, the second reference electrode, and the second dielectric substrate; the feed end of the feed structure is connected to the first feed end of the first power divider through the first feed core, the second feed end of the first power divider is connected to the first feed end of the phase-shifting main body through the second feed core, and the second feed end of the phase-shifting main body is connected to the first feed end of the second power divider through the third feed core.

[0029] In some examples, a guiding structure is also included; the at least one dielectric substrate further includes a fourth dielectric substrate disposed on the side of the radiating structure opposite to the second dielectric substrate; the guiding structure is disposed on the side of the fourth dielectric substrate opposite to the radiating structure.

[0030] In some examples, a first dielectric layer is filled between the first dielectric substrate and the third dielectric substrate, between the third dielectric substrate and the second dielectric substrate, and between the second dielectric substrate and the fourth dielectric substrate.

[0031] In some examples, isolation walls are provided on both sides of the subarray; the isolation walls are located on the side of the third dielectric substrate away from the first reference electrode and intersect with the plane where the third dielectric substrate is located; and the height of the isolation walls is not less than the height of the plane where the patch structure is located.

[0032] In some examples, the isolation wall includes a fifth dielectric substrate and a first isolation layer and a second isolation layer disposed on both sides of the fifth dielectric substrate.

[0033] In some examples, the at least one dielectric substrate includes a second dielectric substrate; the phase shifter includes a phase shifting body portion disposed on the second dielectric substrate and a first reference electrode disposed on the side of the second dielectric substrate opposite to the phase shifting body portion; the radiating structure is disposed on the side of the second dielectric substrate opposite to the first reference electrode.

[0034] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the first feed terminals of the N phase-shifting main bodies; the second feed terminals of the phase-shifting main bodies are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0035] In some examples, the feed end of the feed structure is connected to the first feed end of the phase-shifting body through a via penetrating the second dielectric substrate.

[0036] In some examples, the first power divider and the second power divider are disposed on the side of the second dielectric substrate away from the first reference electrode and are disposed in the same layer as the radiating structure.

[0037] In some examples, a guiding structure is also included; the at least one dielectric substrate further includes a third dielectric substrate and a fourth dielectric substrate; the third dielectric substrate is disposed on the side of the first reference electrode opposite to the second dielectric substrate, the fourth dielectric substrate is disposed on the side of the radiating structure opposite to the second dielectric substrate, and the guiding structure is disposed on the side of the fourth dielectric substrate opposite to the radiating structure.

[0038] In some examples, a first dielectric layer is filled between the second dielectric substrate and the third dielectric substrate, and between the second dielectric substrate and the fourth dielectric substrate.

[0039] In some examples, a third reference electrode is also included; the at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; the phase shifter includes a transmission component, a first reference electrode, a phase shifting body, and a second reference electrode; the transmission component and the phase shifting body are electrically connected; the transmission component is disposed on the first dielectric substrate, and the first reference electrode is disposed on a side of the first dielectric substrate opposite to the transmission component; the second dielectric substrate is disposed on a side of the first reference electrode opposite to the first dielectric substrate, the phase shifting body is disposed on a side of the second dielectric substrate close to the first reference electrode, and the second reference electrode is disposed on a side of the second dielectric substrate opposite to the phase shifting body; the third dielectric substrate is disposed on a side of the second reference electrode opposite to the second dielectric substrate, the third reference electrode is disposed on a side of the third dielectric substrate close to the second reference electrode, and the radiating structure is disposed on a side of the third dielectric substrate opposite to the third reference electrode.

[0040] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the N transmission components, the transmission components being connected to the first feed terminals of the phase-shifting main body; the second feed terminals of the phase-shifting main body are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0041] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0042] In some examples, a first connector penetrating the first dielectric substrate, a second connector penetrating the second dielectric substrate, and a third connector penetrating the third dielectric substrate are also included; a first end of the first connector is connected to the transmission component, and a second end is connected to a first feed terminal of the phase-shifting main body; a first end of the second connector is connected to a second feed terminal of the phase-shifting main body, and a second end is connected to a first end of the third connector; a second end of the third connector is connected to a first feed terminal of the second power divider; the second end of the first connector and the first feed terminal of the phase-shifting main body, and the second end of the second connector and the first end of the third connector are connected by solder balls.

[0043] In some examples, the at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; the phase shifter includes a transmission component, a first reference electrode, a phase shifting body, and a second reference electrode; the transmission component and the phase shifting body are electrically connected; the transmission component is disposed on the first dielectric substrate, and the first reference electrode is disposed on a side of the first dielectric substrate opposite to the transmission component; the second dielectric substrate is disposed on a side of the first reference electrode opposite to the first dielectric substrate, the phase shifting body is disposed on a side of the second dielectric substrate close to the first reference electrode, and the second reference electrode is disposed on a side of the second dielectric substrate opposite to the phase shifting body; the third dielectric substrate is disposed on a side of the second reference electrode opposite to the second dielectric substrate, and the radiating structure is disposed on a side of the third dielectric substrate opposite to the second reference electrode.

[0044] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the N transmission components, the transmission components being connected to the first feed terminals of the phase-shifting main body; the second feed terminals of the phase-shifting main body are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0045] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0046] In some examples, the first power divider is disposed on the side of the first dielectric substrate opposite to the first reference electrode and is disposed on the same layer as the transmission component; the second power divider is disposed on the side of the third dielectric substrate opposite to the third reference electrode and is disposed on the same layer as the radiation structure.

[0047] In some examples, a first connector extending through the first dielectric substrate is also included; a first end of the first connector is connected to the transmission component, and a second end is connected to a first power supply terminal of the phase-shifting main body; and the second end of the first connector and the first power supply terminal of the phase-shifting main body are connected by solder balls.

[0048] In some examples, the second reference electrode has a coupling gap; the coupling gap, the first feed terminal of the second power divider, and the second feed terminal of the phase-shifting main body overlap on the orthographic projection of their respective components on the first dielectric substrate; the second feed terminal of the phase-shifting main body is electrically connected to the first feed terminal of the second power divider through the coupling gap.

[0049] In some examples, the at least one dielectric substrate includes a first dielectric substrate and a second dielectric substrate; the phase shifter includes a transmission component, a first reference electrode, a phase shifting body, and a second reference electrode; the transmission component and the phase shifting body are electrically connected; the transmission component is disposed on the first dielectric substrate, and the first reference electrode is disposed on a side of the first dielectric substrate opposite to the transmission component; the second dielectric substrate is disposed on a side of the first reference electrode opposite to the first dielectric substrate, and the second reference electrode is disposed on a side of the second dielectric substrate close to the first reference electrode; the phase shifting body and the radiating structure are disposed on a side of the second dielectric substrate close to the side opposite to the second reference electrode.

[0050] In some examples, at least one antenna element is included, the antenna element comprising N subarrays, the subarrays comprising M radiating structures; the antenna element further comprises a first power divider dividing N into N and a second power divider dividing M into M; the feed terminals of the feed structures are connected to the first feed terminals of the first power divider; the N second feed terminals of the first power divider are correspondingly connected to the N transmission components, the transmission components being connected to the first feed terminals of the phase-shifting main body; the second feed terminals of the phase-shifting main body are correspondingly connected to the first feed terminals of the second power divider; the M second feed terminals of the second power divider are correspondingly connected to the M radiating structures in one of the subarrays.

[0051] In some examples, the reference electrode of the feed structure is connected to the first reference electrode through a via through the first dielectric substrate.

[0052] In some examples, the first power divider is disposed on the side of the first dielectric substrate opposite to the first reference electrode and is disposed on the same layer as the transmission component; the second power divider is disposed on the side of the second dielectric substrate opposite to the second reference electrode and is disposed on the same layer as the phase-shifting main body and the radiation structure.

[0053] In some examples, a first connector penetrating the first dielectric substrate and a second connector penetrating the second dielectric substrate are also included; a first end of the first connector is connected to the transmission component, and a second end is connected to the first end of the second connector; a second end of the second connector is connected to the second feed terminal of the phase-shifting body; the second end of the first connector and the first end of the second connector are connected by solder balls.

[0054] In a second aspect, the present invention provides an electronic device comprising the array antenna described in any of the above examples. Attached Figure Description

[0055] Figure 1 is a top view of the array antenna provided in this disclosure.

[0056] Figure 2 is a top perspective view of one antenna element in the array antenna shown in Figure 1.

[0057] Figure 3 is a schematic diagram of the antenna element feeding process shown in Figure 2.

[0058] Figure 4 shows the simulation results of the scanning capability of one antenna module in the array antenna shown in Figure 1.

[0059] Figure 5 is a schematic diagram of the first structure of the antenna element shown in Figure 2 along section AB.

[0060] Figure 6 is a schematic diagram of the second structure of the antenna element shown in Figure 2 along section AB.

[0061] Figure 7 is a schematic diagram of the third structure of the antenna element shown in Figure 2 along section AB.

[0062] Figure 8 is a schematic diagram of the fourth structure of the antenna element shown in Figure 2 along section AB.

[0063] Figure 9 is a schematic diagram of the fifth structure of the antenna element shown in Figure 2 along section AB.

[0064] Figure 10 is a schematic diagram of the sixth structure of the antenna element shown in Figure 2 along section AB.

[0065] Figure 11 is a schematic diagram of the seventh structure of the antenna element shown in Figure 2 along section AB.

[0066] Figure 12 is a schematic diagram of the eighth structure of the antenna element shown in Figure 2 along section AB.

[0067] Figure 13 is a schematic diagram of the phase-shifting main body.

[0068] Figure 14 is a flowchart of the fabrication process of the first dielectric substrate in Example 1.

[0069] Figure 15 is a flowchart of the fabrication process of the second dielectric substrate in Example 1.

[0070] The attached figures are labeled as follows:

[0071] 4. Radiation structure; 41. Subarray; 42. Antenna element; 43. Antenna module; 80. Phase shifter; 81. First power divider; 82. Second power divider; 83. Feed structure; 84. Coupling slot; 831. Feed terminal of the feed structure; 832. Reference electrode of the feed structure; 801. Phase shifting main body; 802. First reference electrode; 9. Directioning structure; 11. First dielectric substrate; 12. Second dielectric substrate; 13. Third dielectric substrate; 14. Fourth dielectric substrate; 21 1. First dielectric layer; 6. Via; 5. Isolation wall; 15. Fifth dielectric substrate; 151. First isolation layer; 152. Second isolation layer; 401. Second reference electrode; 7. Feed cell; 71. First feed cell; 72. Second feed cell; 73. Third feed cell; 91. First connector; 92. Second connector; 93. Third connector; 803. Transmission assembly; 402. Third reference electrode; 85. First switch chip; 86. Second switch chip; 87. Phase delay line. Detailed Implementation

[0072] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0073] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0074] As used herein, “parallel” and “perpendicular” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°.

[0075] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0076] In this article, "electrical connection" includes the situation where constituent elements are connected together by a component that has a certain electrical function. There are no particular restrictions on the "component that has a certain electrical function" as long as it enables the transmission and reception of electrical signals between the connected constituent elements. Examples of "components that have a certain electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0077] This document describes exemplary embodiments with reference to sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0078] Compared to 4G and 3G networks, 5G communication offers advantages in low latency and high throughput. However, its high-frequency characteristics result in a significantly shorter transmission distance compared to 4G and 3G networks. Therefore, to meet coverage requirements, 5G communication systems often require the construction of more base stations. As a key node in the 5G communication network, the performance of base station antennas is crucial. 5G base station antennas typically employ array antennas, consisting of multiple arrayed elements, each with a corresponding phase-adjustable channel. This type of antenna composed of multiple elements is also known as a 5G Multiple-Input Multiple-Output (MIMO) antenna.

[0079] Due to the high frequency of 5G signals, transmission losses are relatively high. In recent years, increasing the number of elements in the antenna array has been a common method to achieve better coverage. For antennas with a large number of elements, improving beam flexibility and enabling more complex beamforming and signal processing functions requires more phase-tunable channels to enhance the antenna's control and adjustment capabilities. This means maximizing the number of phase-tunable channels. However, increasing the number of phase-tunable channels can easily lead to a significant increase in antenna power consumption. Therefore, 5G base station antennas use a "1-to-1" digital channel approach for horizontal elements. That is, during signal transmission, the antenna simultaneously receives signals using two elements, compares and combines the signals received by the two elements, and then transmits them to the same digital channel for phase shifting and other processing to achieve better reception performance and reduce signal attenuation. However, since base station antennas are often located at high altitudes to cover users downwards, a "1-to-many" approach is typically used in the vertical direction, depending on the number of phase-tunable channels, for beam adjustment to achieve narrower beam coverage. With the development of integrated sensing technology and the rapid growth of the low-altitude economy, 5G base station antennas are required to achieve precise target positioning in the vertical plane, covering both low-flying drones and ground vehicles. In other words, the scanning range of the 5G base station antenna in the vertical direction required for sensing functions is greater than that required for communication functions. In related technologies, each digital channel controls six antenna elements in the vertical direction, but this results in poor scanning capability in the vertical plane, failing to meet the ±12° scanning requirement. Furthermore, these technologies often use traditional mechanical lever phase shifters as phase-shifting devices in the vertical plane of the array antenna. Lever phase shifters rely on mechanical means to achieve beam scanning, making it difficult to achieve rapid beam scanning and thus hindering the antenna's sensing capabilities. Additionally, the vibrator, as the main radiating component of the antenna, typically includes a printed circuit board (PCB), radiating patches mounted on the PCB, and a feeding structure for powering the radiating patches. However, PCBs are expensive, have poor flatness and processing precision, easily leading to poor antenna radiation performance and increased costs.

[0080] In short, existing 5G base station antennas suffer from problems such as low beam flexibility in the vertical direction, small scanning range, imprecise manufacturing process, and high cost. Therefore, there is an urgent need to provide an antenna that is low-cost, low-power, high-precision, and has a large vertical scanning range.

[0081] To address at least one of the aforementioned technical problems, this disclosure provides an array antenna. Figure 1 is a top view of the array antenna provided in this disclosure. As shown in Figure 1, the array antenna may include multiple antenna elements 42, each antenna element 42 includes multiple subarrays 41, and each subarray 41 includes multiple radiating structures 4. The polarization direction of the electromagnetic waves radiated by the radiating structure 4 can be a single polarization direction or a dual polarization direction; when the polarization direction of the electromagnetic waves radiated by the radiating structure 4 is a dual polarization direction, the two polarization directions can be +45° and -45°, or 0° and 90°, respectively. It is understood that Figure 1 is merely an example where each antenna element 42 includes two subarrays 41 arranged adjacent to each other along the second direction, and each subarray 41 includes three radiating structures 4 arranged adjacent to each other along the second direction. It should be noted that in this document, the first direction refers to the horizontal direction, and the second direction refers to the vertical direction.

[0082] Figure 2 is a top perspective view of one antenna element in the array antenna shown in Figure 1. As shown in Figure 2, the array antenna of this disclosure includes a radiating structure 4, a phase shifter 80, and a feeding structure 83. The radiating structure 4, the phase shifter 80, and the feeding structure 83 are integrated on at least one dielectric substrate; the phase shifter 80 is connected to the radiating structure 4, and the feeding structure 83 is connected to the phase shifter 4 through a via penetrating the dielectric substrate.

[0083] Figure 3 shows the circuit structure and feeding process of the antenna element shown in Figure 2. As shown in Figure 3, taking the polarization direction of the electromagnetic wave radiated by the radiating structure 4 as an example, which includes +45° and -45°, one antenna element 42 corresponds to the same radio frequency channel. This radio frequency channel includes two feeding structures 83. The radio frequency signal excited by one feeding structure 83 has a polarization direction of 45°, and the radio frequency signal excited by the other feeding structure 83 has a polarization direction of -45°. Next, the feeding process of the antenna element 42 will be introduced only as an example of the transmission process of the radio frequency signal with a polarization direction of 45°. Referring again to Figures 2 and 3, for the feed structure 83 with a polarization direction of 45°, its feed terminal is connected to the first feed terminal of a 1-to-2 power divider 81; for the 1-to-2 power divider 81, its two second feed terminals are respectively connected to the first feed terminals of two phase shifters 80; for the phase shifter 80, its second feed terminal is correspondingly connected to the first feed terminal of a 1-to-3 power divider 82; for the 1-to-3 power divider 82, its three second feed terminals are respectively connected to three radiating structures 4 to provide radio frequency signals with a 45° polarization direction to the three radiating structures 4. Those skilled in the art will understand that the transmission process of radio frequency signals with a polarization direction of -45° is the same as that of radio frequency signals with a polarization direction of 45°, and will not be described again here.

[0084] It should be noted that those skilled in the art should understand that when an antenna element 42 includes N subarrays 41, a 1-to-2 power divider can be a 1-to-N power divider; when a subarray 41 includes M radiating structures 4, a 1-to-3 power divider can be a 1-to-M power divider. For the sake of clarity, the "1-to-2 power divider" and the "1-to-N power divider" are collectively referred to as the first power divider 81, and the "1-to-3 power divider" and the "1-to-M power divider" are collectively referred to as the second power divider 82.

[0085] The following section uses the antenna element 42 shown in Figures 1-3 as an example to introduce the working process and principle of the array antenna of this disclosure. The array antenna of this disclosure can be a transceiver antenna. For an antenna element 42, it includes two subarrays 41, and each subarray 41 includes three radiating structures 4. When the array antenna is a receiving antenna, after the six radiating structures 4 in the antenna element 42 simultaneously receive the signals radiated in space, the signals received by the three radiating structures 4 belonging to one subarray 41 are transmitted to their corresponding 1-to-3 power divider 82, and the signals received by the other three radiating structures 4 belonging to another subarray 41 are transmitted to their corresponding other 1-to-3 power divider 82. The six signals are combined into two signals by the two 1-to-3 power dividers 82, and then transmitted to two phase shifters 80 respectively. After phase shifting, the signals are transmitted to a 1-to-2 power divider 81, and after power combining, they are transmitted to the feed structure 83 to complete signal reception. When the array antenna is a transmitting antenna, for a feeding structure 83, the received radio frequency signal is transmitted to a 1-to-2 power divider 81 to generate two signals. These two signals are then transmitted to two phase shifters 80, and after phase shifting, they are transmitted to two 1-to-3 power dividers 82. For a 1-to-3 power divider 82, the signal is split into three paths, which are then transmitted to three corresponding radiating structures 4. The radiating structures 4 radiate the radio frequency signal into the external space, thus completing the signal transmission.

[0086] In some examples, the array antenna can be divided into multiple antenna modules arranged along a first direction. Taking Figure 1 as an example, multiple antenna modules 43 are arranged side by side along the first direction, and each antenna module 43 includes four antenna elements 42 arranged side by side along a second direction. That is, each antenna module 43 includes 24 radiating structures arranged side by side along the second direction. To verify the scanning capability of the array antenna provided in this disclosure in the vertical direction and to determine whether it meets the requirements of a coherent antenna, this disclosure simulates the scanning capability of one antenna module 43 in the array antenna in the vertical direction. Figure 4 shows the simulation results of the scanning capability of the antenna module in the vertical direction. Compared to the "1-to-6" digital channel method, the array antenna disclosed herein adds a set of phase shifters 80 for every three radiating structures 4. That is, the three radiating structures 4 are treated as a subarray 41. The signals received by the three radiating structures 4 in the subarray 41 are power-combined and then phase-adjusted. The two signals adjusted by the two phase shifters 80 are then power-combined. This can improve the beam coverage and beam flexibility of the array antenna in the vertical direction. As can be seen from Figure 4, the adjusted array antenna can achieve a scanning range of ±12° in the vertical direction, proving that it can meet the requirements of rapid scanning of the inductive-conductive integrated antenna in the vertical plane.

[0087] The structure of the array antenna provided in this disclosure will be specifically described below with reference to several specific embodiments.

[0088] Example 1:

[0089] Figure 5 is a schematic diagram of one structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 5, in the array antenna provided in Embodiment 1, at least one dielectric substrate includes a first dielectric substrate 11 and a second dielectric substrate 12. The phase shifter 80 includes a phase shifting main body 801 disposed on the first dielectric substrate 11 and a first reference electrode 802 disposed on the side of the first dielectric substrate 11 opposite to the phase shifting main body 801. The second dielectric substrate 12 is disposed on the side of the first reference electrode 802 opposite to the first dielectric substrate 801, and the radiating structure 4 is disposed on the side of the second dielectric substrate 12 opposite to the first reference electrode 802. In addition, a first power divider 81 is disposed on the side of the first dielectric substrate 11 opposite to the first reference electrode 802 and is disposed in the same layer as the phase shifting main body 801; a second power divider 82 is disposed on the side of the second dielectric substrate 12 opposite to the first reference electrode 802 and is disposed in the same layer as the radiating structure 4.

[0090] Referring to Figures 2 and 5, in some examples, an antenna element 42 includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. Specifically, in the antenna element 42, the feed terminal 831 of its feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are correspondingly connected to the first feed terminals of the phase shifting main bodies 801 of the two phase shifters 80; the second feed terminals of the phase shifting main bodies 801 are correspondingly connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are correspondingly connected to the three radiating structures 4 in one subarray 41.

[0091] Referring again to Figure 5, in some examples, the power supply structure 83 includes an SMP power supply plug, and the reference electrode 832 of the SMP power supply plug is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0092] In the array antenna provided in this embodiment, the first dielectric substrate 11 and the second dielectric substrate 12 are glass substrates. The radiating structure 4 and the first power divider 82 can be formed by depositing a conductive layer on the second dielectric substrate 12 and then patterning the conductive layer using a patterning process. Similarly, the first reference electrode 802 can be formed by depositing a conductive layer on the first dielectric substrate 11. The phase-shifting main body 801 and the first power divider 81 can also be formed by depositing a conductive layer on the side of the first dielectric substrate 11 away from the first reference electrode 802 and then patterning the conductive layer. For example, the conductive layers deposited on the first dielectric substrate 11 and the second dielectric substrate 12 can be metal materials with high conductivity, such as copper, aluminum, and gold. The vias 6 on the first dielectric substrate 11 can be formed using a through-glass via (TGV) process. Simply put, the TGV process refers to creating through holes on a glass substrate and filling them with metal to connect electronic components or devices on different layers.

[0093] Those skilled in the art will understand that in the prior art, the radiating structure 4, the feeding structure 83, the first power divider 81, the second power divider 82, and the phase shifter 80 are usually integrated on a PCB substrate. However, PCB substrates typically suffer from high cost, low flatness, and poor processing accuracy. In the above embodiment 1, by integrating the radiating structure 4, the feeding structure 83, the first power divider 81, the second power divider 82, and the phase shifter 80 on a glass substrate, and simultaneously achieving electrical connection of the components through TGV technology, i.e., using glass-based semiconductor technology to form an array antenna, compared to the prior art, it has at least the following advantages: 1. Glass substrates have more stable microwave and thermal performance than PCB substrates, and are larger in size and have higher flatness, thus helping to reduce the manufacturing cost of the antenna; 2. The processing accuracy of glass-based semiconductor technology is about 2μm, while the processing accuracy of PCB substrates is about 50μm. Therefore, this embodiment has higher processing accuracy than the prior art, which helps to improve the consistency between the simulation test of the model and the actual object, thereby reducing the antenna debugging cost and improving the antenna reliability.

[0094] Referring to Figure 2, in some examples, a coupling slot 84 is provided on the first reference electrode 802, and the first feed terminal of the second power divider 82, the coupling slot 84, and the second feed terminal of the phase-shifting main body 801 overlap in their orthogonal projections on the first dielectric substrate 11. In this case, if the array antenna is used as a receiving antenna, the signal transmission process in one antenna element 42 is as follows: after the six radiating structures 4 receive the signal, they are respectively transmitted to the second feed terminal of the second power divider 82 connected to them; the signals of the three radiating structures 4 belonging to the same subarray 41 are combined by a second power divider 82 and coupled to the second feed terminal of the phase-shifting main body 801 through the coupling slot 84 of the first reference electrode 802; the signal is phase-shifted by the phase-shifting main body 801 and transmitted to the second feed terminal of the first power divider 81; the signals received by the two second feed terminals of the first power divider 81 are combined by the first power divider 81 and transmitted to the feed structure 83.

[0095] Furthermore, still referring to FIG5, in some examples, the array antenna further includes a guiding structure 9. At least one dielectric substrate further includes a third dielectric substrate 13 and a fourth dielectric substrate 14, wherein the third dielectric substrate 13 is disposed on the side of the phase-shifting main body 801 opposite to the first dielectric substrate 11, and the fourth dielectric substrate 14 is disposed on the side of the radiating structure 4 opposite to the second dielectric substrate 12. The guiding structure 9 is disposed on the side of the fourth dielectric substrate 14 opposite to the radiating structure 4. Even further, in some examples, a first dielectric layer 21 is filled between the third dielectric substrate 13 and the first dielectric substrate 11, and between the fourth dielectric substrate 14 and the second dielectric substrate 12.

[0096] Similarly, the fourth dielectric substrate 14 in the above example also uses a glass substrate to achieve low-loss signal transmission. The guiding structure 9 can be formed by depositing a conductive layer on the fourth dielectric substrate 14 and then patterning the conductive layer. Typically, the guiding structure 9 corresponds one-to-one with the radiating structure 4, and the orthogonal projection of the guiding structure 9 on the second dielectric substrate 12 at least covers the orthogonal projection of the radiating structure 4 on the second dielectric substrate 12. In this case, the guiding structure 9 can improve the directivity and gain of the antenna by reflecting and focusing the radiated energy of the radiating structure 4. The third dielectric substrate 13 can be made of plexiglass, for example, using materials with supporting functions such as acrylic, to serve as a substrate support. The first dielectric layer 21 can be made of foam, for example, using polymethacrylic acid isocyanate (PMI) or polypropylene (PP) foam materials. These materials have a dielectric constant close to that of air. Of course, foam materials with lower dielectric loss values ​​are preferred. When foam is filled between the third dielectric substrate 13 and the first dielectric substrate 11, the third dielectric substrate 13 can also be a traditional aluminum plate instead of plexiglass as the carrier substrate.

[0097] Referring again to Figure 5, in some examples, the array antenna further includes an isolation wall 5, which is disposed on both sides of the subarray 41. Exemplarily, the isolation wall 5 may be disposed on the side of the first dielectric substrate 11 opposite to the phase-shifting main body 801 and intersects with the plane on which the first dielectric substrate 11 is located; simultaneously, the height of the isolation wall 5 should not be less than the height of the plane on which the patch structure 9 is located. Exemplarily, the isolation wall 5 includes a fifth dielectric substrate 15 and a first isolation layer 151 and a second isolation layer 152 disposed on both sides of the fifth dielectric substrate 15. For example, the fifth dielectric substrate 15 may also be a glass substrate, and the first isolation layer 151 and the second isolation layer 152 may be formed by depositing a conductive layer on the fifth dielectric substrate and then patterning the conductive layer.

[0098] In the above example, by setting isolation walls 5 on both sides of the subarray 41, mutual interference between the signals transmitted or received by the two subarrays 41 located on both sides of the isolation wall 5 can be avoided, thereby improving the reliability and stability of the antenna.

[0099] Example 2:

[0100] Figure 6 is a schematic diagram of the second structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 6, in addition to the radiating structure 4, the phase shifter 80, and the feeding structure 83, the array antenna provided in Embodiment 2 also includes a second reference electrode 401. In this embodiment, at least one dielectric substrate includes a first dielectric substrate 11, a second dielectric substrate 12, and a third dielectric substrate 13. The phase shifter 80 includes a phase shifting main body 801 disposed on the first dielectric substrate 11 and a first reference electrode 802 disposed on the side of the first dielectric substrate 11 away from the phase shifting main body 801. The third dielectric substrate 13 is disposed on the side of the first reference electrode 802 away from the first dielectric substrate 11. The second dielectric substrate 12 is disposed on the side of the third dielectric substrate 13 away from the first dielectric substrate 11, the second reference electrode 401 is disposed on the side of the second dielectric substrate 12 close to the third dielectric substrate 13, and the radiating structure 4 is disposed on the side of the second dielectric substrate 12 away from the second reference electrode 401. In addition, similar to Embodiment 1, the first power divider 81 is disposed on the side of the first dielectric substrate 11 away from the first reference electrode 802 and is disposed on the same layer as the phase shifting main body 801; the second power divider 82 is disposed on the side of the second dielectric substrate 12 away from the first reference electrode 802 and is disposed on the same layer as the radiation structure 4.

[0101] The difference between Embodiment 2 and Embodiment 1 is that in Embodiment 1, the first reference electrode 802 is used as both the ground electrode of the phase-shifting main body 801 and the ground electrode of the radiating structure 4. In Embodiment 2, the first reference electrode 802 is used as the ground electrode of the phase-shifting main body 801, and the second reference electrode 401 is used as the ground electrode of the radiating structure 4. The advantage of this arrangement is that when the signal lines of the phase shifter 80 are interconnected, it is often necessary to cut slots in the first reference electrode 802 for routing. If the radiating structure 4 and the phase shifter 80 share the same ground electrode, the slots on the ground electrode will destroy the integrity of the ground electrode and easily affect the radiation performance. Therefore, by setting a separate second reference electrode 401 for the radiating structure 4, the shared ground electrode can be avoided from affecting the radiation performance of the antenna.

[0102] Referring to Figures 2 and 6, similar to Embodiment 1, an antenna element 42 includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. Specifically, in the antenna element 42, the feed terminal 831 of its feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are correspondingly connected to the first feed terminals of the phase shifting main bodies 801 of the two phase shifters 80; the second feed terminals of the phase shifting main bodies 801 are correspondingly connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are correspondingly connected to the three radiating structures 4 in one subarray 41.

[0103] Referring again to Figure 6, in some examples, the power supply structure 83 includes an SMP power supply plug, and the reference electrode 832 of the SMP power supply plug is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0104] Similar to Embodiment 1, in the array antenna provided in Embodiment 2, the first dielectric substrate 11 and the second dielectric substrate 12 are glass substrates; the radiating structure 4, the first power divider 82, and the second reference electrode 401 can be formed by depositing conductive layers on both sides of the second dielectric substrate 12 and then patterning the conductive layers using a patterning process; similarly, the first reference electrode 802, the phase-shifting main body 801, and the first power divider 81 can be formed by depositing conductive layers on both sides of the first dielectric substrate 11 and then patterning the conductive layers. For example, the conductive layers deposited on the first dielectric substrate 11 and the second dielectric substrate 12 can be metal materials with high conductivity, such as copper, aluminum, or gold. The vias 6 on the first dielectric substrate 11 can be formed using a TGV process.

[0105] Those skilled in the art will understand that in the prior art, the radiating structure 4, the feeding structure 83, the first power divider 81, the second power divider 82, and the phase shifter 80 are usually integrated on a PCB substrate. However, PCB substrates typically suffer from high cost, low flatness, and poor processing accuracy. In the above embodiment 2, by integrating the radiating structure 4, the feeding structure 83, the first power divider 81, the second power divider 82, and the phase shifter 80 on a glass substrate, and simultaneously achieving electrical connection of the components through TGV technology, i.e., using glass-based semiconductor technology to form an array antenna, compared to the prior art, it has at least the following advantages: 1. Compared to PCB substrates, glass substrates have more stable microwave and thermal performance, and are larger in size and have higher flatness, thus helping to reduce the manufacturing cost of the antenna; 2. The processing accuracy of glass-based semiconductor technology is about 2μm, while the processing accuracy of PCB substrates is about 50μm. Therefore, this embodiment has higher processing accuracy than the prior art, which is beneficial to improving the consistency between the simulation test of the model and the actual object, thereby reducing the antenna debugging cost and improving the antenna reliability.

[0106] Referring to Figure 6, in some examples, the array antenna provided in Embodiment 2 further includes a feed core 7 penetrating the first dielectric substrate 11, the first reference electrode 802, the third dielectric substrate 13, the second reference electrode 401, and the second dielectric substrate 12. The second feed terminal of the phase-shifting main body 801 is connected to the first feed terminal of the second power divider 82 through the feed core 7 to realize signal conduction between the second power divider 82 and the phase-shifting main body 801 located on different layers.

[0107] Referring again to Figure 6, in some examples, the array antenna provided in Embodiment 2 further includes at least one dielectric substrate, which includes a fourth dielectric substrate 14 disposed on the side of the radiating structure 4 opposite to the second dielectric substrate 12; the array antenna also includes a guiding structure 9 disposed on the side of the fourth dielectric substrate 14 opposite to the radiating structure 4. Further, in some examples, a first dielectric layer 21 is filled between the first dielectric substrate 11 and the third dielectric substrate 13, between the third dielectric substrate 13 and the second dielectric substrate 12, and between the second dielectric substrate 12 and the fourth dielectric substrate 14.

[0108] In the above example, the fourth dielectric substrate 14 is also a glass substrate to achieve low-loss signal transmission. The guiding structure 9 can be formed by depositing a conductive layer on the fourth dielectric substrate 14 and then patterning the conductive layer. Typically, the guiding structure 9 corresponds one-to-one with the radiating structure 4, and the orthogonal projection of the guiding structure 9 on the second dielectric substrate 12 at least covers the orthogonal projection of the radiating structure 4 on the second dielectric substrate 12. In this case, the guiding structure 9 can improve the directivity and gain of the antenna by reflecting and focusing the radiated energy of the radiating structure 4. The third dielectric substrate 13 can be made of plexiglass, for example, using materials with supporting functions such as acrylic, to serve as a substrate support; of course, the third dielectric substrate 13 can also be made of traditional aluminum plate, and this disclosure does not limit this. The first dielectric layer 21 can be made of foam, for example, using polymethacrylic acid isocyanate (PMI) or polypropylene (PP) foam materials, which have a dielectric constant close to that of air. Of course, foam materials with lower dielectric loss values ​​are preferred.

[0109] Referring again to Figure 6, in some examples, isolation walls 5 are provided on both sides of the subarray 41. These isolation walls 5 are located on the side of the third dielectric substrate 13 facing away from the first reference electrode 802 and intersect with the plane of the third dielectric substrate 13. Furthermore, the height of the isolation wall 5 is not less than the height of the plane where the patch structure 9 is located. Exemplarily, the isolation wall 5 may include a fifth dielectric substrate 15 and a first isolation layer 151 and a second isolation layer 152 disposed on both sides of the fifth dielectric substrate 15. The fifth dielectric substrate 15 may also be a glass substrate, and the first isolation layer 151 and the second isolation layer 152 can be formed by depositing a conductive layer on the fifth dielectric substrate and then patterning the conductive layer. In the above examples, by providing isolation walls 5 on both sides of the subarray 41, mutual interference between signals transmitted or received by the two subarrays 41 located on both sides of the isolation wall 5 can be avoided, thereby improving the reliability and stability of the antenna.

[0110] Example 3:

[0111] Figure 7 is a schematic diagram of the third structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 7, in this embodiment, at least one dielectric substrate includes a first dielectric substrate 11, a second dielectric substrate 12, and a third dielectric substrate 13. The phase shifter 80 includes a phase shifting main body 801 disposed on the first dielectric substrate 11 and a first reference electrode 802 disposed on the side of the first dielectric substrate 11 opposite to the phase shifting main body 801. The third dielectric substrate 13 is disposed on the side of the first reference electrode 802 opposite to the first dielectric substrate 11. The second dielectric substrate 12 is disposed on the side of the third dielectric substrate 13 opposite to the first dielectric substrate 11, the second power divider 82 is disposed on the side of the second dielectric substrate 12 close to the third dielectric substrate 13, and the radiating structure 4 is disposed on the side of the second dielectric substrate 12 opposite to the second power divider 82.

[0112] Additionally, similar to Embodiments 1 and 2, the first power divider 81 is disposed on the side of the first dielectric substrate 11 facing away from the first reference electrode 802, and is disposed on the same layer as the phase shifting main body 801. For an antenna element 42, it includes two subarrays 41, and each subarray 41 includes three radiating structures 4; therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. Specifically, in the antenna element 42, the feed terminal 831 of its feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are correspondingly connected to the first feed terminals of the phase shifting main bodies 801 of the two phase shifters 80; the second feed terminals of the phase shifting main bodies 801 are one-to-one connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are one-to-one connected to the three radiating structures 4 in one subarray 41. In some examples, the power supply structure 83 includes an SMP power supply plug, the reference electrode 832 of which is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0113] The difference between Embodiment 3 and Embodiments 1 and 2 is that, in Embodiments 1 and 2, the radiating structure 4 and the second power divider 82 are located on the same side of the second dielectric substrate 12 and are on the same layer, while in Embodiment 3, the radiating structure 4 and the second power divider 82 are located on opposite sides of the second dielectric substrate 12. Referring to Figure 7, in this case, the radiating structure 4 and the second power divider 82 are electrically connected through a via 61 penetrating the second dielectric substrate 12. The radiating structure 4 and the second power divider 82 are located on different layers in Embodiment 3, i.e., a layered feeding method is adopted, which is beneficial for improving the polarization isolation of the antenna.

[0114] Similar to Embodiment 2, the array antenna provided in Embodiment 3 also includes a feed core 7 to realize the connection between the second feed terminal of the phase shifting main body 801 and the first feed terminal of the second power divider 82; however, due to the difference mentioned above, the feed core 7 in this embodiment only needs to penetrate the first dielectric substrate 11, the first reference electrode 802 and the third dielectric substrate 13.

[0115] Referring again to Figure 7, apart from the differences mentioned above, the array antennas provided in Embodiment 3 and Embodiment 2 are largely the same. For example, the array antenna provided in Embodiment 3 also includes a fourth dielectric substrate 14 and a guiding structure 9; for another example, a first dielectric layer 21 is filled between the third dielectric substrate 13 and the first dielectric substrate 11, and between the fourth dielectric substrate 14 and the second dielectric substrate 12; and for yet another example, the array antenna also includes an isolation wall 5, which is disposed on both sides of the subarray 41. The specific structures, materials selected, and beneficial effects of the guiding structure 9, the first dielectric layer 21, and the isolation wall 5 are all the same as in Embodiment 2, and will not be repeated here.

[0116] Example 4:

[0117] Figure 8 is a schematic diagram of the fourth structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 8, in addition to the radiating structure 4, the phase shifter 80, and the feeding structure 83, the array antenna provided in Embodiment 4 also includes a second reference electrode 401. In this embodiment, at least one dielectric substrate includes a first dielectric substrate 11, a second dielectric substrate 12, and a third dielectric substrate 13; the phase shifter 80 includes a phase shifting main body 801 disposed on the first dielectric substrate 11, and a first reference electrode 802 disposed on the side of the first dielectric substrate 11 away from the phase shifting main body 801. The third dielectric substrate 13 is disposed on the side of the first reference electrode 802 away from the first dielectric substrate 11; the second dielectric substrate 12 is disposed on the side of the third dielectric substrate 13 away from the first dielectric substrate 11, the second reference electrode 401 is disposed on the side of the second dielectric substrate 12 close to the third dielectric substrate 13, and the radiating structure 4 is disposed on the side of the second dielectric substrate 12 away from the second reference electrode 401.

[0118] Similar to Embodiments 1-3, in Embodiment 4, for an antenna element 42, it includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. Specifically, in the antenna element 42, the feed terminal 831 of its feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are correspondingly connected to the first feed terminals of the phase shifting main bodies 801 of the two phase shifters 80; the second feed terminals of the phase shifting main bodies 801 are correspondingly connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are correspondingly connected to the three radiating structures 4 in a subarray 41. In some examples, the feed structure 83 includes an SMP feed plug, and the reference electrode 832 of the SMP feed plug is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0119] Unlike Embodiments 1-3, in Embodiment 4, both the first power divider 81 and the second power divider 82 are disposed on the side of the second dielectric substrate 12 away from the second reference electrode 401, and are disposed on the same layer as the radiating structure 4. In this case, the array antenna provided in Embodiment 4 also includes a first feed core 71, a second feed core 72, and a third feed core 73 penetrating the first dielectric substrate 11, the first reference electrode 802, the third dielectric substrate 13, the second reference electrode 401, and the second dielectric substrate 12. The feed terminal 831 of the feed structure 83 is connected to the first feed terminal of the first power divider 81 through the first feed core 71; the second feed terminal of the first power divider 81 is connected to the first feed terminal of the phase-shifting main body 801 through the second feed core 72; and the second feed terminal of the phase-shifting main body 801 is connected to the first feed terminal of the second power divider 82 through the third feed core 73.

[0120] Compared to Examples 1 and 3, Example 4 adds a second reference electrode 401 to the radiation structure 4. This configuration avoids the problem that when the radiation structure 4 and the ground electrode of the phase-shifting main body 801 are reused, the signal lines of the phase-shifting main body 801 need to be interconnected, which would damage the integrity of the ground electrode of the radiation structure 4 and thus affect the radiation efficiency of the radiation structure 4.

[0121] Furthermore, in Embodiment 4, signal transmission between the feed structure 83 and the first power divider 81, between the first power divider 81 and the phase-shifting main body 801, and between the phase-shifting main body 801 and the second power divider 82, is achieved using a feed core. Compared to the schemes in Embodiments 1-3, this method has the following advantages: 1. Reduced transmission loss: Since the feed core is usually designed with low-loss materials, signal loss during transmission can be effectively reduced; 2. Resistance to external signal interference: Since a shielding design is usually used on the outside of the feed core, interference from external signals on the transmitted signal can be reduced; 3. Good reliability and durability: The feed core is usually formed using high-quality materials and high-precision processes, thus having high reliability and durability, thereby improving the reliability of the antenna.

[0122] Referring again to Figure 8, except for the differences mentioned above, the array antennas provided in Embodiment 4 and Embodiment 2 are largely the same. For example, the array antenna provided in Embodiment 4 also includes a fourth dielectric substrate 14 and a guiding structure 9; for another example, a first dielectric layer 21 is filled between the third dielectric substrate 13 and the first dielectric substrate 11, and between the fourth dielectric substrate 14 and the second dielectric substrate 12; and for yet another example, the array antenna also includes an isolation wall 5, which is disposed on both sides of the subarray 41. The specific structures, materials selected, and beneficial effects of the guiding structure 9, the first dielectric layer 21, and the isolation wall 5 are all the same as in Embodiment 2, and will not be repeated here.

[0123] Example 5:

[0124] Figure 9 is a schematic diagram of the fifth structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 9, in the array antenna provided in Embodiment 5, at least one dielectric substrate includes a second dielectric substrate 12. The phase shifter 80 includes a phase shifting main body 801 disposed on the second dielectric substrate 12 and a first reference electrode 802 disposed on the side of the second dielectric substrate 12 opposite to the phase shifting main body 801; the radiating structure 4 is disposed on the side of the second dielectric substrate 12 opposite to the first reference electrode 802.

[0125] Similar to Embodiments 1-4, in Embodiment 5, for an antenna element 42, it includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. Specifically, in the antenna element 42, the feed terminal 831 of its feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are correspondingly connected to the first feed terminals of the phase shifting main bodies 801 of the two phase shifters 80; the second feed terminals of the phase shifting main bodies 801 are correspondingly connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are correspondingly connected to the three radiating structures 4 in one subarray 41.

[0126] Unlike Embodiments 1-4, in Embodiment 5, the first power divider 81, the phase-shifting main body 801, and the second power divider 82 are all disposed on the side of the second dielectric substrate 12 away from the first reference electrode 802, and are disposed on the same layer as the radiating structure 4. In this case, the power supply structure 83, that is, the power supply terminal 831 of the SMP power supply plug, is connected to the first power supply terminal of the phase-shifting main body 801 through the through-hole 62 penetrating the second dielectric substrate 12.

[0127] Compared with Examples 1-4, the array antenna provided in Example 5 has the following advantages by arranging the first power divider 81, the phase shifting main body 801, the second power divider 82 and the radiating structure 4 in the same layer: 1. It improves the integration of the antenna to reduce the profile height of the antenna; 2. The transmission loss generated when the signal is transmitted between the same layers is much smaller than the loss when it is transmitted between multiple layers, so the transmission loss can be effectively reduced.

[0128] Referring to Figure 9, in some examples, the array antenna provided in Embodiment 5 further includes a guiding structure 9; at least one dielectric substrate further includes a third dielectric substrate 13 and a fourth dielectric substrate 14. The third dielectric substrate 13 is disposed on the side of the first reference electrode 802 facing away from the second dielectric substrate 12, the fourth dielectric substrate 14 is disposed on the side of the radiating structure 4 facing away from the second dielectric substrate 12, and the guiding structure 9 is disposed on the side of the fourth dielectric substrate 12 facing away from the radiating structure 4. In other examples, the array antenna provided in Embodiment 5 is filled with a first dielectric layer 21 between the second dielectric substrate 12 and the third dielectric substrate 13, and between the second dielectric substrate 12 and the fourth dielectric substrate 14. In still other examples, the array antenna provided in Embodiment 5 further includes isolation walls 5 located on both sides of the subarray 41.

[0129] Those skilled in the art will understand that the specific structure, material selection, and beneficial effects of the guiding structure 9, the first medium layer 21, and the isolation wall 5 in the above examples are the same as those in Examples 1-4, and will not be repeated here.

[0130] Example 6:

[0131] Figure 10 is a schematic diagram of the sixth structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 10, in addition to the radiating structure 4, the phase shifter 80, and the feeding structure 83, the array antenna provided in Embodiment 6 also includes a third reference electrode 402. At least one dielectric substrate includes a first dielectric substrate 11, a second dielectric substrate 12, and a third dielectric substrate 13; the phase shifter 80 includes a transmission component 803, a first reference electrode 802, a phase shifting main body 801, and a second reference electrode 401, and the transmission component 803 and the phase shifting main body 801 are electrically connected. The transmission component 803 is disposed on the first dielectric substrate 11, and the first reference electrode 802 is disposed on the side of the first dielectric substrate 11 away from the transmission component 803; the second dielectric substrate 12 is disposed on the side of the first reference electrode 802 away from the first dielectric substrate 11. The phase shifting main body 801 is disposed on the side of the second dielectric substrate 12 close to the first reference electrode 802, and the second reference electrode 402 is disposed on the side of the second dielectric substrate 12 away from the phase shifting main body 801. The third dielectric substrate 13 is disposed on the side of the second reference electrode 401 away from the second dielectric substrate 12, and the third reference electrode 13 is disposed on the side of the third dielectric substrate 13 close to the second reference electrode 401. The radiating structure 4 is disposed on the side of the third dielectric substrate 13 away from the third reference electrode 402. In addition, the first power divider 81 and the transmission component 803 are disposed on the same layer; the second power divider 82 and the radiating structure 4 are disposed on the same layer.

[0132] Similar to Embodiments 1-5, in Embodiment 6, for an antenna element 42, it includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. Unlike Embodiments 1-5, in the antenna element 42 of Embodiment 6, the feed terminal 831 of its feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are connected to the first feed terminals of the transmission components 803 of the two phase shifters 80; the second feed terminals of the transmission components 803 are correspondingly connected to the first feed terminals of the phase shifting main body 801; the second feed terminals of the phase shifting main body 801 are one-to-one connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are one-to-one connected to the three radiating structures 4 in one subarray 41.

[0133] Similar to Embodiments 1-4, in Embodiment 6, the power supply structure 83 includes an SMP power supply plug, and the reference electrode 832 of the SMP power supply plug is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0134] Referring to Figure 10, unlike Embodiments 1-5, the array antenna provided in Embodiment 6 further includes a first connector 91 penetrating the first dielectric substrate 11, a second connector 92 penetrating the second dielectric substrate 12, and a third connector 93 penetrating the third dielectric substrate 13. The first end of the first connector 91 is connected to the transmission assembly 803, and the second end is connected to the first feed terminal of the phase-shifting main body 801; the first end of the second connector 92 is connected to the second feed terminal of the phase-shifting main body 801, and the second end is connected to the first end of the third connector 93; the second end of the third connector 93 is connected to the first feed terminal of the second power divider 82. Furthermore, the second end of the first connector 91 and the first feed terminal of the phase-shifting main body 801, and the second end of the second connector 92 and the first end of the third connector 93, are connected by solder balls.

[0135] Similar to Embodiments 1-5, the first dielectric substrate 11, the second dielectric substrate 12, and the third dielectric substrate 13 in this embodiment can all be glass substrates. The circuit structures on each dielectric substrate can be formed by patterning the conductive layer after depositing a conductive layer on the dielectric substrate. After the circuit structures on each dielectric substrate are formed, a ball grid array (BGA) process can be used to form connectors on each glass substrate layer. The connectors enable the glass substrate layers to form a whole, thereby realizing cross-layer signal connection. Compared with the above embodiments, this embodiment has the following advantages: 1. The circuit structures integrated on each glass substrate layer can be fabricated separately and simultaneously, reducing fabrication time and cost; 2. Using solder balls as the output ports of the circuit structures on each glass substrate layer helps to unify the specifications and interfaces of equipment produced by different manufacturers, forming a unified standard, allowing equipment manufacturers to design any connection port with the antenna main equipment.

[0136] Of course, similar to Embodiments 1-5, the array antenna in this embodiment can also be provided with a guiding structure 9 and an isolation wall 5, etc. The specific structure and material selection are similar to those in the above embodiments, and will not be repeated here.

[0137] Example 7:

[0138] Figure 11 is a schematic diagram of the seventh structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 11, in addition to the radiating structure 4, the phase shifter 80, and the feeding structure 83, the array antenna provided in Embodiment 7 also includes a second reference electrode 402. At least one dielectric substrate includes a first dielectric substrate 11, a second dielectric substrate 12, and a third dielectric substrate 13; the phase shifter 80 includes a transmission component 803, a first reference electrode 802, a phase shifting main body 801, and a second reference electrode 401, and the transmission component 803 and the phase shifting main body 801 are electrically connected. The transmission component 803 is disposed on the first dielectric substrate 11, and the first reference electrode 802 is disposed on the side of the first dielectric substrate 11 away from the transmission component 803; the second dielectric substrate 12 is disposed on the side of the first reference electrode 802 away from the first dielectric substrate 11. The phase shifting main body 801 is disposed on the side of the second dielectric substrate 12 close to the first reference electrode 802, and the second reference electrode 401 is disposed on the side of the second dielectric substrate 12 away from the phase shifting main body 801. The third dielectric substrate 13 is disposed on the side of the second reference electrode 401 opposite to the second dielectric substrate 12, and the radiating structure 4 is disposed on the side of the third dielectric substrate 13 opposite to the second reference electrode 401. In addition, the first power divider 81 and the transmission component 803 are disposed on the same layer; the second power divider 82 and the radiating structure 4 are disposed on the same layer.

[0139] Similar to Embodiment 6, for an antenna element 42, it includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. The feed terminal 831 of the feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are connected to the first feed terminals of the transmission components 803 of the two phase shifters 80; the second feed terminals of the transmission components 803 are correspondingly connected to the first feed terminals of the phase shifting main body 801; the second feed terminals of the phase shifting main body 801 are correspondingly connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are correspondingly connected to the three radiating structures 4 in one subarray 41.

[0140] Similar to Embodiment 6, the power supply structure 83 in Embodiment 7 includes an SMP power supply plug, and the reference electrode 832 of the SMP power supply plug is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0141] Referring to Figure 11, unlike Embodiment 6, the array antenna provided in this embodiment only includes a first connector 91 that penetrates the first dielectric substrate 11. The first end of the first connector 91 is connected to the transmission component 803, and the second end is connected to the first feed terminal of the phase-shifting main body 801; the second end of the first connector 91 and the first feed terminal of the phase-shifting main body 801 are connected by solder balls.

[0142] More specifically, unlike Embodiment 6, in the array antenna provided in this embodiment, the second reference electrode 401 has a coupling slot 84, which can be an "H-shaped" slot as shown in FIG2. Furthermore, there is an overlap between the coupling slot 84, the first feed terminal of the second power divider 82, and the second feed terminal of the phase-shifting main body 801 projected onto the first dielectric substrate 11. The second feed terminal of the phase-shifting main body 801 is electrically connected to the first feed terminal of the second power divider 82 through the coupling slot 84.

[0143] Of course, this embodiment may also include structures such as the guiding structure 9 and the isolation wall 5. The specific structure and material selection can be found above, and will not be repeated here.

[0144] Example 8:

[0145] Figure 12 is a schematic diagram of the eighth structure of the antenna element shown in Figure 2 along section AB. As shown in Figure 12, in the array antenna provided in Embodiment 8, at least one dielectric substrate includes a first dielectric substrate 11 and a second dielectric substrate 12. The phase shifter 80 includes a transmission component 803, a first reference electrode 802, a phase shifting main body 801, and a second reference electrode 401, and the transmission component 803 and the phase shifting main body 801 are electrically connected. The transmission component 803 is disposed on the first dielectric substrate 11, and the first reference electrode 802 is disposed on the side of the first dielectric substrate 11 away from the transmission component 803. The second dielectric substrate 12 is disposed on the side of the first reference electrode 802 away from the first dielectric substrate 11, and the second reference electrode 401 is disposed on the side of the second dielectric substrate 12 close to the first reference electrode 802. The phase shifting main body 801 and the radiating structure 4 are disposed on the side of the second dielectric substrate 12 close to the side away from the second reference electrode 401. In addition, the first power divider 81 and the transmission component 803 are arranged on the same layer; the second power divider 82, the phase shifting main body 802 and the radiation structure 4 are arranged on the same layer.

[0146] Similar to Embodiment 6, in this embodiment, an antenna element 42 includes two subarrays 41, and each subarray 41 includes three radiating structures 4. Therefore, the first power divider 81 in the antenna element 42 is a 1-to-2 power divider, and the second power divider 82 is a 1-to-3 power divider. The feed terminal 831 of the feed structure 83 is connected to the first feed terminal of the first power divider 81; the two second feed terminals of the first power divider 81 are connected to the first feed terminals of the transmission components 803 of the two phase shifters 80; the second feed terminals of the transmission components 803 are correspondingly connected to the first feed terminals of the phase shifting main body 801; the second feed terminals of the phase shifting main body 801 are correspondingly connected to the first feed terminals of the second power divider 82, and the three second feed terminals of the second power divider 82 are correspondingly connected to the three radiating structures 4 in one subarray 41.

[0147] Similar to Embodiment 6, the power supply structure 83 in this embodiment includes an SMP power supply plug, and the reference electrode 832 of the SMP power supply plug is connected to the first reference electrode 802 through a via 6 penetrating the first dielectric substrate 11.

[0148] Referring to Figure 12, unlike Embodiment 6, the array antenna provided in this embodiment includes a first connector 91 penetrating the first dielectric substrate 11 and a second connector 92 penetrating the second dielectric substrate 12. The first end of the first connector 91 is connected to the transmission component 803, and the second end is connected to the first end of the second connector 92; the second end of the second connector 92 is connected to the second feed terminal of the phase-shifting main body 801. Furthermore, the second end of the first connector 91 and the first end of the second connector 92 are connected by solder balls.

[0149] Of course, this embodiment may also include structures such as the guiding structure 9 and the isolation wall 5. The specific structure and material selection can be found above, and will not be repeated here.

[0150] In some examples, the phase shifter 801, as shown in FIG13, includes a first switch chip 85, a second switch chip 86, and a phase delay line 87, wherein the first switch chip 85 and the second switch chip 86 are used to switch the signal path. Compared with the traditional mechanical lever-type phase shifter, this type of phase shifter 80 has a faster switching speed and is therefore easier to achieve fast beam scanning.

[0151] In summary, in the embodiments provided in the first aspect of this disclosure, the dielectric substrate is a glass substrate, and the radiating structure 4, the first power divider 81, the second power divider 82, and the phase shifter 80 integrated on the glass substrate can be formed by patterning the conductive layer deposited on the glass substrate using glass-based semiconductor technology. In addition, the vias penetrating the dielectric substrate and used to connect the feed structure 83 and the phase shifter 80 can be formed using TGV technology. The array antenna formed in this way has advantages over array antennas integrated on PCB substrates, such as high flatness, low manufacturing cost, high processing accuracy, and high reliability and durability.

[0152] Secondly, this disclosure provides a method for manufacturing the above-mentioned array antenna. The following will only take the process of manufacturing the array antenna provided in Example 1 as an example to introduce the method for manufacturing the array antenna in this disclosure.

[0153] Those skilled in the art will understand that for the array antenna provided in Embodiment 1 (the cross-sectional structure is shown in Figure 5), at least one dielectric substrate mainly includes a first dielectric substrate 11 and a second dielectric substrate 12. Therefore, its fabrication method mainly includes the fabrication steps of a circuit structure integrated on the first dielectric substrate 11 and a circuit structure integrated on the second dielectric substrate 12.

[0154] First, the fabrication process of the first dielectric substrate 11 is introduced. Figure 14 shows the fabrication process flow of the first dielectric substrate. As shown in Figure 14, the fabrication process related to the first dielectric substrate 11 includes:

[0155] Step S11: Provide a first dielectric substrate 11. For example, the first dielectric substrate 11 is a glass substrate, which has a first surface S1 and a second surface S2 disposed opposite to each other.

[0156] Step S12: Using TGV process, the first dielectric substrate 11 is laser modified and wet etched to form a via 6 penetrating the first dielectric substrate 11.

[0157] Step S13: A conductive layer is deposited on the first surface S1 of the first dielectric substrate 11 using a deposition process. For example, the deposition process can be physical vapor deposition (PVD) or chemical vapor deposition (CVD), etc.; the conductive layer can be a metal, such as copper or aluminum.

[0158] Step S14: Using a patterning process, the conductive layer deposited on the first surface S1 of the first dielectric substrate 11 is patterned, and a first reference electrode 802 and a coupling gap 84 located on the first reference electrode 802 are formed simultaneously. Exemplarily, the patterning process includes photoresist formation, exposure, development, and etching processes.

[0159] Step S15: A conductive layer is deposited on the second surface S2 of the first dielectric substrate 11 using a deposition process.

[0160] Step S16: Using a patterning process, the conductive layer deposited on the second surface S2 of the first dielectric substrate 11 is patterned, and a first power divider 81 and a phase-shifting main body 801 are formed simultaneously. The second feed terminal of the phase-shifting main body 801 overlaps with the projection of the coupling gap 84 on the first dielectric substrate 11.

[0161] Step S17: Using surface mount technology (SMT), the SMP power supply connector is mounted on the second surface S2 side of the first dielectric substrate 11. The reference electrode 832 of the SMP power supply connector is connected to the first reference electrode 802 via a via 6, and the power supply terminal 831 is connected to the first power supply terminal of the first power divider 81.

[0162] Next, the fabrication process of the second dielectric substrate 12 will be described. Figure 15 shows the fabrication process flow of the second dielectric substrate. As shown in Figure 15, the fabrication process related to the second dielectric substrate 12 includes:

[0163] Step S21: Provide a second dielectric substrate 12. For example, the first dielectric substrate 12 is a glass substrate, which has a third surface S3 and a fourth surface S4 disposed opposite to each other, and the fourth surface S4 is closer to the first surface S1.

[0164] Step S22: A conductive layer is deposited on the third surface S3 of the second dielectric substrate 12 using a deposition process.

[0165] Step S23: Using a patterning process, the conductive layer deposited on the third surface S3 of the second dielectric substrate 12 is patterned, and a second power divider 82 and a radiating structure 4 are formed simultaneously. The first feed terminal of the second power divider 82, the coupling gap 84, and the second feed terminal of the phase shifting main body 801 overlap in their orthogonal projections on the second dielectric substrate 12.

[0166] Those skilled in the art will understand that the fabrication processes of the various dielectric substrates and circuit structures in the other embodiments are similar to the steps described above, and will not be repeated here.

[0167] Thirdly, this disclosure provides an electronic device that includes the array antenna provided in any embodiment of the first aspect.

[0168] In some examples, the electronic device also includes: a transceiver unit, a radio frequency transceiver, a signal amplifier, a power amplifier, and a filtering unit. The array antenna in the electronic device can serve as either a transmitting antenna or a receiving antenna. The transceiver unit may include a baseband and a receiving end. The baseband provides signals in at least one frequency band, such as 2G, 3G, 4G, and 5G signals, and transmits these signals to the radio frequency transceiver. After receiving the signal, the array antenna in the electronic device can process it through the filtering unit, power amplifier, signal amplifier, and radio frequency transceiver before transmitting it to the receiving end in the transceiver unit. The receiving end may be, for example, a smart gateway.

[0169] Furthermore, the RF transceiver is connected to the transceiver unit and is used to modulate the signals transmitted by the transceiver unit, or to demodulate the signals received by the antenna unit before transmitting them to the transceiver unit. Specifically, the RF transceiver may include a transmitting circuit, a receiving circuit, a modulation circuit, and a demodulation circuit. After the transmitting circuit receives various types of signals provided by the baseband, the modulation circuit can modulate these signals before sending them to the antenna unit. The antenna unit receives the signals and transmits them to the receiving circuit of the RF transceiver. The receiving circuit then transmits the signals to the demodulation circuit, which demodulates the signals before transmitting them to the receiving end.

[0170] Furthermore, the RF transceiver is connected to a signal amplifier and a power amplifier, which are then connected to a filtering unit. The filtering unit is connected to at least one antenna unit. During signal transmission by the electronic device, the signal amplifier improves the signal-to-noise ratio (SNR) of the RF transceiver's output signal before transmitting it to the filtering unit; the power amplifier amplifies the power of the RF transceiver's output signal before transmitting it to the filtering unit. The filtering unit may specifically include a duplexer and a filtering circuit. The filtering unit combines the signals output from the signal amplifier and power amplifier, filters out noise, and then transmits them to the antenna unit, which radiates the signal. During signal reception by the electronic device, the antenna unit receives the signal and transmits it to the filtering unit. The filtering unit filters out noise from the received signal and then transmits it to the signal amplifier and power amplifier. The signal amplifier increases the gain of the received signal, improving the SNR; the power amplifier amplifies the power of the received signal. The signal received by the antenna unit is processed by the power amplifier and signal amplifier before being transmitted to the RF transceiver, which then transmits it to the transceiver unit.

[0171] In some examples, the signal amplifier may include various types of signal amplifiers, such as low-noise amplifiers, without limitation.

[0172] In some examples, the electronic device provided in this disclosure also includes a power management unit connected to a power amplifier and providing the power amplifier with a voltage for amplifying signals.

[0173] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An array antenna comprising a radiating structure, a phase shifter, and a feeding structure; wherein, The radiating structure, the phase shifter, and the feeding structure are integrated on at least one dielectric substrate; The phase shifter and the radiating structure are electrically connected, and the feeding structure is electrically connected to the phase shifter through a via penetrating the dielectric substrate.

2. The array antenna according to claim 1, wherein, The at least one dielectric substrate includes a first dielectric substrate and a second dielectric substrate; The phase shifter includes a phase shifting main body disposed on the first dielectric substrate, and a first reference electrode disposed on the side of the first dielectric substrate opposite to the phase shifting main body; The second dielectric substrate is disposed on the side of the first reference electrode opposite to the first dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate opposite to the first reference electrode.

3. The array antenna according to claim 2, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are correspondingly connected to the first power supply terminals of the N phase-shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

4. The array antenna according to claim 3, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

5. The array antenna according to claim 4, wherein, The second power divider is disposed on the side of the second dielectric substrate away from the first reference electrode, and is disposed on the same layer as the radiating structure; The first power divider is disposed on the side of the first dielectric substrate away from the first reference electrode, and is disposed in the same layer as the phase-shifting main body.

6. The array antenna according to claim 5, wherein, A coupling gap is formed on the first reference electrode; the first feed terminal of the second power divider, the coupling gap, and the second feed terminal of the phase shifting body overlap in their orthogonal projections on the first dielectric substrate.

7. The array antenna according to any one of claims 2-6, wherein, It also includes directional structures; The at least one dielectric substrate further includes a third dielectric substrate and a fourth dielectric substrate; The third dielectric substrate is disposed on the side of the phase-shifting main body that is away from the first dielectric substrate, and the fourth dielectric substrate is disposed on the side of the radiation structure that is away from the second dielectric substrate. The guiding structure is disposed on the side of the fourth dielectric substrate opposite to the radiating structure.

8. The array antenna according to claim 7, wherein, A first dielectric layer is filled between the third dielectric substrate and the first dielectric substrate, and between the fourth dielectric substrate and the second dielectric substrate.

9. The array antenna according to claim 1, wherein, It also includes a second reference electrode; The at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; The phase shifter includes a phase shifting main body disposed on the first dielectric substrate, and a first reference electrode disposed on the side of the first dielectric substrate opposite to the phase shifting main body; The third dielectric substrate is disposed on the side of the first reference electrode opposite to the first dielectric substrate; The second dielectric substrate is disposed on the side of the third dielectric substrate away from the first dielectric substrate, the second reference electrode is disposed on the side of the second dielectric substrate close to the third dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate away from the second reference electrode.

10. The array antenna according to claim 9, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are correspondingly connected to the first power supply terminals of the N phase-shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

11. The array antenna according to claim 10, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

12. The array antenna according to claim 11, wherein, The second power divider is disposed on the side of the second dielectric substrate away from the second reference electrode, and is disposed on the same layer as the radiating structure; The first power divider is disposed on the side of the first dielectric substrate away from the first reference electrode, and is disposed in the same layer as the phase-shifting main body.

13. The array antenna according to claim 12, wherein, It also includes a power supply cell that penetrates the first dielectric substrate, the first reference electrode, the third dielectric substrate, the second reference electrode, and the second dielectric substrate; The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider through the feed core.

14. The array antenna according to claim 1, wherein, The at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; The phase shifter includes a phase shifting main body disposed on the first dielectric substrate, and a first reference electrode disposed on the side of the first dielectric substrate opposite to the phase shifting main body; The third dielectric substrate is disposed on the side of the first reference electrode opposite to the first dielectric substrate; The second dielectric substrate is disposed on the side of the third dielectric substrate opposite to the first dielectric substrate.

15. The array antenna according to claim 14, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are correspondingly connected to the first power supply terminals of the N phase-shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiating structures in one of the subarrays in a one-to-one correspondence. The second power divider is disposed on the side of the second dielectric substrate close to the third dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate away from the second power divider.

16. The array antenna according to claim 15, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

17. The array antenna according to claim 16, wherein, The radiating structure and the second power divider are electrically connected through a via penetrating the second dielectric substrate; The first power divider is disposed on the side of the first dielectric substrate away from the first reference electrode, and is disposed in the same layer as the phase-shifting main body.

18. The array antenna according to claim 17, wherein, It also includes a power supply cell that penetrates the first dielectric substrate, the first reference electrode, and the third dielectric substrate; The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider through the feed core.

19. The array antenna according to claim 1, wherein, It also includes a second reference electrode; The at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; The phase shifter includes a phase shifting main body disposed on the first dielectric substrate, and a first reference electrode disposed on the side of the first dielectric substrate opposite to the phase shifting main body; The third dielectric substrate is disposed on the side of the first reference electrode opposite to the first dielectric substrate; The second dielectric substrate is disposed on the side of the third dielectric substrate away from the first dielectric substrate, the second reference electrode is disposed on the side of the second dielectric substrate close to the third dielectric substrate, and the radiating structure is disposed on the side of the second dielectric substrate away from the second reference electrode.

20. The array antenna according to claim 19, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are correspondingly connected to the first power supply terminals of the N phase-shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

21. The array antenna according to claim 20, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

22. The array antenna according to claim 21, wherein, The first power divider and the second power divider are disposed on the side of the second dielectric substrate away from the second reference electrode, and are disposed in the same layer as the radiation structure.

23. The array antenna according to claim 22, wherein, It also includes a first feed cell, a second feed cell, and a third feed cell that penetrate the first dielectric substrate, the first reference electrode, the third dielectric substrate, the second reference electrode, and the second dielectric substrate; The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider through the first power supply core. The second power supply terminal of the first power divider is connected to the first power supply terminal of the phase shifting main body through the second power supply core. The second power supply terminal of the phase shifting main body is connected to the first power supply terminal of the second power divider through the third power supply core.

24. The array antenna according to any one of claims 9-23, wherein, It also includes directional structures; The at least one dielectric substrate further includes a fourth dielectric substrate disposed on the side of the radiating structure opposite to the second dielectric substrate. The guiding structure is disposed on the side of the fourth dielectric substrate opposite to the radiating structure.

25. The array antenna according to claim 24, wherein, A first dielectric layer is filled between the first dielectric substrate and the third dielectric substrate, between the third dielectric substrate and the second dielectric substrate, and between the second dielectric substrate and the fourth dielectric substrate.

26. The array antenna according to claim 25, wherein, Isolation walls are provided on both sides of the subarray; the isolation walls are located on the side of the third dielectric substrate away from the first reference electrode and intersect with the plane where the third dielectric substrate is located; and the height of the isolation walls is not less than the height of the plane where the patch structure is located.

27. The array antenna according to claim 26, wherein, The isolation wall includes a fifth dielectric substrate and a first isolation layer and a second isolation layer disposed on both sides of the fifth dielectric substrate.

28. The array antenna according to claim 1, wherein, The at least one dielectric substrate includes a second dielectric substrate; The phase shifter includes a phase shifting main body disposed on the second dielectric substrate, and a first reference electrode disposed on the side of the second dielectric substrate opposite to the phase shifting main body; The radiating structure is disposed on the side of the second dielectric substrate opposite to the first reference electrode.

29. The array antenna according to claim 28, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are correspondingly connected to the first power supply terminals of the N phase-shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

30. The array antenna according to claim 29, wherein, The power supply terminal of the power supply structure is connected to the first power supply terminal of the phase-shifting main body through a via penetrating the second dielectric substrate.

31. The array antenna according to claim 30, wherein, The first power divider and the second power divider are disposed on the side of the second dielectric substrate away from the first reference electrode, and are disposed in the same layer as the radiation structure.

32. The array antenna according to claim 31, wherein, It also includes directional structures; The at least one dielectric substrate further includes a third dielectric substrate and a fourth dielectric substrate; The third dielectric substrate is disposed on the side of the first reference electrode away from the second dielectric substrate, the fourth dielectric substrate is disposed on the side of the radiating structure away from the second dielectric substrate, and the guiding structure is disposed on the side of the fourth dielectric substrate away from the radiating structure.

33. The array antenna according to claim 32, wherein, A first dielectric layer is filled between the second dielectric substrate and the third dielectric substrate, and between the second dielectric substrate and the fourth dielectric substrate.

34. The array antenna according to claim 1, wherein, It also includes a third reference electrode; The at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; The phase shifter includes a transmission component, a first reference electrode, a phase shifting body, and a second reference electrode; The transmission component and the phase-shifting main body are electrically connected; The transmission component is disposed on the first dielectric substrate, and the first reference electrode is disposed on the side of the first dielectric substrate opposite to the transmission component. The second dielectric substrate is disposed on the side of the first reference electrode away from the first dielectric substrate, the phase-shifting main body is disposed on the side of the second dielectric substrate close to the first reference electrode, and the second reference electrode is disposed on the side of the second dielectric substrate away from the phase-shifting main body; The third dielectric substrate is disposed on the side of the second reference electrode away from the second dielectric substrate, the third reference electrode is disposed on the side of the third dielectric substrate close to the second reference electrode, and the radiating structure is disposed on the side of the third dielectric substrate away from the third reference electrode.

35. The array antenna according to claim 34, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are connected to the N transmission components respectively, and the transmission components are connected to the first power supply terminal of the phase shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

36. The array antenna according to claim 35, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

37. The array antenna according to claim 36, wherein, It also includes a first connector penetrating the first dielectric substrate, a second connector penetrating the second dielectric substrate, and a third connector penetrating the third dielectric substrate; The first end of the first connector is connected to the transmission component, and the second end is connected to the first power supply terminal of the phase-shifting main body; the first end of the second connector is connected to the second power supply terminal of the phase-shifting main body, and the second end is connected to the first end of the third connector; the second end of the third connector is connected to the first power supply terminal of the second power divider. The second end of the first connector is connected to the first power supply end of the phase-shifting main body, and the second end of the second connector is connected to the first end of the third connector by solder balls.

38. The array antenna according to claim 1, wherein, The at least one dielectric substrate includes a first dielectric substrate, a second dielectric substrate, and a third dielectric substrate; The phase shifter includes a transmission component, a first reference electrode, a phase shifting body, and a second reference electrode; The transmission component and the phase-shifting main body are electrically connected; The transmission component is disposed on the first dielectric substrate, and the first reference electrode is disposed on the side of the first dielectric substrate opposite to the transmission component. The second dielectric substrate is disposed on the side of the first reference electrode away from the first dielectric substrate, the phase-shifting main body is disposed on the side of the second dielectric substrate close to the first reference electrode, and the second reference electrode is disposed on the side of the second dielectric substrate away from the phase-shifting main body; The third dielectric substrate is disposed on the side of the second reference electrode opposite to the second dielectric substrate, and the radiating structure is disposed on the side of the third dielectric substrate opposite to the second reference electrode.

39. The array antenna according to claim 38, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are connected to the N transmission components respectively, and the transmission components are connected to the first power supply terminal of the phase shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

40. The array antenna according to claim 39, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

41. The array antenna according to claim 40, wherein, The first power divider is disposed on the side of the first dielectric substrate away from the first reference electrode and is disposed on the same layer as the transmission component; The second power divider is disposed on the side of the third dielectric substrate opposite to the second reference electrode and is disposed on the same layer as the radiation structure.

42. The array antenna according to claim 41, wherein, It also includes a first connector that penetrates the first dielectric substrate; The first end of the first connector is connected to the transmission component, and the second end is connected to the first power supply terminal of the phase shifting main body; and the second end of the first connector and the first power supply terminal of the phase shifting main body are connected by solder balls.

43. The array antenna according to claim 42, wherein, The second reference electrode has a coupling gap; the coupling gap, the first feed terminal of the second power divider, and the second feed terminal of the phase shifting body overlap in their orthogonal projections on the first dielectric substrate; The second feed terminal of the phase-shifting main body is electrically connected to the first feed terminal of the second power divider through the coupling gap.

44. The array antenna according to claim 1, wherein, The at least one dielectric substrate includes a first dielectric substrate and a second dielectric substrate; The phase shifter includes a transmission component, a first reference electrode, a phase shifting body, and a second reference electrode; The transmission component and the phase-shifting main body are electrically connected; The transmission component is disposed on the first dielectric substrate, and the first reference electrode is disposed on the side of the first dielectric substrate opposite to the transmission component. The second dielectric substrate is disposed on the side of the first reference electrode opposite to the first dielectric substrate, and the second reference electrode is disposed on the second dielectric substrate. The substrate is located on the side closest to the first reference electrode, and the phase-shifting main body and the radiation structure are disposed on the side of the second dielectric substrate closest to the side away from the second reference electrode.

45. The array antenna according to claim 44, wherein, It includes at least one antenna element, the antenna element includes N subarrays, and the subarrays include M radiating structures; N and M are positive integers not less than 1; The antenna unit also includes a first power divider that divides N into one power divider and a second power divider that divides M into one power divider. The power supply terminal of the power supply structure is connected to the first power supply terminal of the first power divider; the N second power supply terminals of the first power divider are connected to the N transmission components respectively, and the transmission components are connected to the first power supply terminal of the phase shifting main body. The second feed terminal of the phase-shifting main body is connected to the first feed terminal of the second power divider in a one-to-one correspondence; the M second feed terminals of the second power divider are connected to the M radiation structures in one of the subarrays in a one-to-one correspondence.

46. ​​The array antenna according to claim 45, wherein, The reference electrode of the power supply structure is connected to the first reference electrode through a via that penetrates the first dielectric substrate.

47. The array antenna according to claim 46, wherein, The first power divider is disposed on the side of the first dielectric substrate away from the first reference electrode and is disposed on the same layer as the transmission component; The second power divider is disposed on the side of the second dielectric substrate away from the second reference electrode, and is disposed in the same layer as the phase-shifting main body and the radiation structure.

48. The array antenna according to claim 47, wherein, It also includes a first connector penetrating the first dielectric substrate and a second connector penetrating the second dielectric substrate; The first end of the first connector is connected to the transmission component, and the second end is connected to the first end of the second connector; the second end of the second connector is connected to the second power supply end of the phase-shifting main body. The second end of the first connector and the first end of the second connector are connected by solder balls.

49. An electronic device comprising an array antenna as described in any one of claims 1-48.

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