Carrying base transfer method and semiconductor processing system

Abstract

The present application provides a carrying base transfer method and a semiconductor processing system. The semiconductor processing system comprises a transfer device, a buffer chamber, a main control device, and at least two process chambers. A buffering device capable of adjusting the size of a carrying region is arranged in the buffer chamber. The carrying base transfer method comprises: the main control device acquires information about at least one process chamber and determines, on the basis of the received information about the at least one process chamber, a process chamber in which a carrying base transfer-out step needs to be performed; the main control device controls the transfer device to transfer a carrying base in the process chamber to the buffer chamber, and the main control device acquires size information of the carrying base and controls, on the basis of the received size information of the carrying base, the buffering device to adjust the size of the carrying region to match the size of the carrying base; and the main control device controls the transfer device to place the carrying base on the buffering device having adjusted the size of the carrying region. Thus, the transfer of carrying bases of different sizes is centralized on one production line, and the same buffering device can accommodate carrying bases of different sizes, thereby improving the storage flexibility and utilization rate of each buffering device.

Description

Carrier base transfer method and semiconductor processing system

[0001] This application is based on and claims priority to Chinese Patent Application No. 2024115522027, filed on November 1, 2024, entitled “Method for Transporting Carrier Base and Semiconductor Processing System”, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This application relates to the field of semiconductor manufacturing technology, and more specifically, to a carrier substrate transfer method and a semiconductor processing system. Background Technology

[0003] The substrate plays a crucial role in semiconductor manufacturing as a vital component that supports the workpiece (such as a wafer). After being placed on the substrate, the wafer is transferred to the process chamber to complete processes such as vapor deposition. After the process is completed, the substrate, or the substrate holding the coated wafer, needs to be transferred to a buffer chamber for cooling and preparation for subsequent use or removal of the coated wafer.

[0004] Some current semiconductor processing systems are equipped with multiple process chambers that can accommodate carrier substrates of different sizes. The carrier substrates of different sizes can hold wafers of different sizes, or they can hold wafers of the same size but different numbers, thereby enabling parallel processing of multiple numbers or sizes of wafers in the semiconductor processing system.

[0005] In terms of caching for carrier substrates or substrates carrying coated wafers, existing technologies typically employ multiple caching devices to store carrier substrates or substrates carrying coated wafers of specific sizes. While this method can store carrier substrates of different sizes, it requires a large number of caching devices, increasing space usage. Furthermore, it may result in a situation where a transfer chamber accommodating one size of carrier substrate is idle, while another size of carrier substrate, especially when its size is smaller than the aforementioned carrier substrate, cannot find a corresponding caching device, thus reducing space utilization. Summary of the Invention

[0006] The purpose of this application is to provide a carrier base transfer method and a semiconductor processing system, which can concentrate the transfer process of carrier bases of different sizes into one production line, and the same buffer device can accommodate carrier bases of different sizes, thereby improving the storage flexibility and utilization of each buffer device.

[0007] Firstly, the carrier base transmission method provided in this application includes:

[0008] S0, Providing semiconductor processing systems;

[0009] The semiconductor processing system includes at least a transfer device, a transfer chamber, at least two process chambers, and a main control device; the transfer chamber is equipped with a buffer device for placing a carrier base and whose carrier area size is adjustable; each process chamber contains a carrier base, and at least some process chambers contain carrier bases of different sizes; each process chamber is equipped with a vision device for acquiring carrier base size information; the main control device is communicatively connected to each process chamber, the transfer device, and the buffer device.

[0010] S1. The main control device obtains and determines the process chamber that needs to perform the bearing base transfer step based on the information received from at least one process chamber.

[0011] S2. The main control device controls the transfer device to transfer the carrier base in the process room to the transfer room. The main control device acquires and controls the buffer device to adjust the size of the carrier area to match the size of the carrier base according to the received size information of the carrier base.

[0012] S3. The main control device controls the transfer device to place the bearing base on the buffer device whose bearing area size has been adjusted.

[0013] Secondly, the semiconductor processing system provided in this application includes a transfer device, a transfer chamber, at least two process chambers, and a main control device; the transfer chamber is equipped with a buffer device for placing a carrier base and whose carrier area size is adjustable; at least some of the process chambers accommodate carrier bases of different sizes, and the main control device is communicatively connected to each process chamber, the transfer device, and the buffer device.

[0014] The semiconductor processing system provided in this application is used to perform the aforementioned carrier base transfer method.

[0015] Optionally, the buffer device includes several linear displacement mechanisms arranged radially, each linear displacement mechanism having a support seat slidably mounted on it. The buffer device also includes a drive mechanism that is communicatively connected to the main control device and connected to each support seat.

[0016] Optionally, in step S2, the step of the main control device acquiring and controlling the buffer device to adjust the size of the bearing area according to the size information of the bearing base includes: the main control device sending a bearing area size adjustment command to the drive mechanism according to the size information of the bearing base, and the drive mechanism responding to the bearing area size adjustment command driving at least one support to slide along the extension direction of the corresponding linear displacement mechanism until the top of each support forms a bearing area for placing the bearing base.

[0017] Optionally, the buffer device includes a positioning device that is communicatively connected to the main control device.

[0018] Optionally, in step S2, the step of the main control device issuing a load-bearing area size adjustment command to the drive mechanism based on the size information of the load-bearing base includes: the positioning device acquiring and sending the position information of each support to the main control device; and the main control device issuing a load-bearing area size adjustment command to the drive mechanism based on the position information of each support and the size information of the load-bearing base.

[0019] Optionally, the main control device stores a first load lower limit threshold and a load difference threshold range, and the buffer device includes several linear displacement mechanisms arranged radially. Each linear displacement mechanism is slidably provided with a support seat, and each support seat is a liftable support seat and is provided with a load sensing device that is communicatively connected to the main control device.

[0020] Optionally, in step S3, the step of the main control device controlling the transfer device to place the carrier base to be transferred onto the buffer device whose carrier area size has been adjusted includes:

[0021] S31. The main control device controls the transfer device to place the bearing base on the buffer device whose bearing area size has been adjusted, and maintains the holding relationship between the transfer device and the bearing base.

[0022] S32. The main control device acquires and determines, based on the load values ​​sent by each load-bearing sensor, that the load value of each support is greater than or equal to the first lower load threshold, and that the difference between the load values ​​of any two support is within the range of load difference minus the threshold.

[0023] S33, The main control device controls the transfer device to release the holding relationship between itself and the bearing base.

[0024] Optionally, the main control device also stores a second lower load-bearing threshold that is less than the first lower load-bearing threshold, wherein the second lower load-bearing threshold is not less than 5% of the first lower load-bearing threshold.

[0025] Optionally, after step S31 is completed, the main control device acquires and determines, based on each load value, that the load values ​​of the M support seats are greater than or equal to the second lower load threshold and less than the first lower load threshold, and the load values ​​of the remaining support seats are greater than or equal to the first lower load threshold. Then, step S33 is executed, and the main control device performs micro-adjustment of the M support seats until step S32 is satisfied.

[0026] Optionally, M is an integer greater than or equal to 1 and less than the number of supports.

[0027] Optionally, after step S31 is completed, the main control device acquires and determines, based on the received load values, that the load value of at least one support is less than the second lower load threshold. Then, it controls the transfer device to carry the load-bearing base away from the transfer chamber, and the main control device adjusts the lifting and lowering of at least one support.

[0028] Optionally, the support base includes a lifting body and a support body movably sleeved around the lifting body. Each lifting body is equipped with a load-bearing sensor, each lifting body is communicatively connected to the main control device, and the height of each support body is consistent.

[0029] Optionally, the step of the main control device adjusting the height of at least one support includes: the main control device controlling the height of each lifting body on the buffer device until each lifting body is at the same height as the corresponding support body, or is housed in the corresponding support body.

[0030] Optionally, the transfer room is provided with at least one transfer buffer cavity, and the buffer device is set in the transfer buffer cavity. The buffer device includes several linear displacement mechanisms distributed radially, and each linear displacement mechanism is slidably provided with a liftable support base. The main control device is communicatively connected to each support base.

[0031] Optionally, after step S3 is completed, the main control device controls each support to rise synchronously so that each support rises to the set upper limit position, thereby preventing the transfer device holding the bearing base from entering the space between the upper limit position and the inner top wall of the transfer buffer cavity.

[0032] Optionally, the semiconductor processing system may also include several vision devices that are communicatively connected to the main control unit and located in each process room.

[0033] Optionally, in step S1, the step of the main control device acquiring and determining the process chamber that needs to perform the carrier base transfer step based on the information received from at least one process chamber includes: the main control device acquiring image information in the process chamber through a vision device in the process chamber; if the main control device determines that the process chamber does not contain a carrier base based on the image information acquired by the vision device, then the process chamber is determined to be the process chamber that needs to be transferred into the carrier base.

[0034] Optionally, the semiconductor processing system may also include a pre-processing chamber and a transport unit, the transport unit being equipped with a buffer device that is communicatively connected to the main control unit.

[0035] Optionally, before performing step S1, the following steps may also be performed:

[0036] S01. The main control device acquires and determines the process chamber that needs to be transferred to the bearing base based on the information received from the transfer device or at least one process chamber.

[0037] S02. The main control device acquires and controls the buffer device of the transport device to adjust the size of the carrying area based on the size information of the carrying base that the process room to be transferred to the carrying base can accommodate.

[0038] S03. Place a support base that matches the size of the support area on the transport device on the corresponding support area;

[0039] S04. The main control device controls the transport device to transport the carrier base to the pre-processing room.

[0040] Compared with the prior art, the beneficial effects of this application include at least the following.

[0041] The carrier substrate transfer method and semiconductor processing system of this application include a transfer device, a transfer chamber, and at least two process chambers. The transfer chamber is equipped with a buffer device for placing carrier substrates and whose carrier area size is adjustable. At least some process chambers accommodate carrier substrates of different sizes. After the main control device determines the process chamber that needs to perform the carrier substrate transfer step based on the information received from at least one process chamber, it controls the buffer device to adjust the carrier area size accordingly and controls the transfer device to transfer the carrier substrate to the transfer chamber and place it on the buffer device whose carrier area size has been adjusted. This integrates the transfer process of carrier substrates of different sizes on a single production line, reducing the number of production lines, space occupation, and equipment cost expenditure.

[0042] Meanwhile, since the size of the carrying area of ​​the cache device in the transfer room can be adjusted, the size of the carrying area of ​​the cache device can be adjusted to meet the cache requirements of different sized carrying bases, thereby improving the storage flexibility and utilization of the cache device. Attached Figure Description

[0043] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 is a flowchart illustrating a carrier base transmission method according to an embodiment of this application;

[0045] Figure 2 is a schematic diagram of the composition of a semiconductor processing system according to an embodiment of this application;

[0046] Figure 3 is a schematic diagram of a process chamber according to an embodiment of this application;

[0047] Figure 4 is a perspective structural diagram of a cache device according to an embodiment of this application;

[0048] Figure 5 is a top view of the buffer device shown in Figure 4;

[0049] Figure 6 is a schematic diagram of the working state of the buffer device shown in Figure 4 with the size of the carrying area increased.

[0050] Figure 7 is a schematic diagram of the working state of the buffer device shown in Figure 4 with the carrying area size reduced;

[0051] Figure 8 is a structural diagram of a buffer device with a position measuring device according to an embodiment of this application;

[0052] Figure 9 is a schematic diagram of the structure of a transfer chamber with multiple transfer buffer cavities as shown in an embodiment of this application;

[0053] Figure 10 is a top view of a transfer chamber with multiple transfer buffer cavities as shown in an embodiment of this application;

[0054] Figure 11 is a schematic diagram of the working state of a semiconductor processing system with a shipping device according to an embodiment of this application;

[0055] Figure 12 is a schematic diagram of a working state of the transfer device and transfer chamber shown in an embodiment of this application;

[0056] Figure 13 is a schematic diagram of another working state of the transfer device and transfer room shown in an embodiment of this application.

[0057] The reference numerals in the figure are as follows: 1. Transfer device; 11. Clamping device; 2. Transfer chamber; 201. Transfer buffer chamber; 3. Process chamber; 31. Gas injection device; 32. Heating device; 33. Rotation device; 34. Isolation device; 35. Exhaust device; 4. Vision device; 5. Main control device; 6. Pre-processing chamber; 7. Transport device; 100. Buffer device; 101. Linear displacement mechanism; 102. Support base; 1021. Lifting body; 1022. Support body; 103. Positioning device; S. Bearing area; 01. Bearing base; 02. Wafer. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0059] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0060] This application provides a carrier base transfer method and a semiconductor processing system. The technical solution of this application will be described in detail below with reference to the accompanying drawings.

[0061] Example 1

[0062] As shown in Figure 2, this embodiment provides a semiconductor processing system, including a transfer device 1, a transit chamber 2, a process chamber 3, and a main control device 5. There are two process chambers 3. The transit chamber 2 is equipped with a buffer device 100 for placing a carrier base and whose bearing area size is adjustable. At least some of the process chambers 3 accommodate carrier bases of different sizes. The main control device 5 is communicatively connected to each process chamber 3, the transfer device 1, and the buffer device 100.

[0063] In the semiconductor processing system of this embodiment, a buffer device 100 with an adjustable bearing area is provided in the transfer chamber 2. Therefore, when facing the buffering requirements of bearing bases 01 of different sizes, the bearing area size of the buffer device 100 can be adaptively adjusted to bear bearing bases 01 of different sizes.

[0064] In one embodiment, the number of buffer devices 100 in the transfer chamber 2 is one. When a carrier base 01 to be transferred in one process chamber 3 is transferred to the buffer device 100 and cooled to room temperature, the carrier base 01 is transferred out of the transfer chamber 2. At this time, the size of the carrying area of ​​the buffer device 100 is adapted to the carrier base 01. When a carrier base 01 of a different size to be transferred in another process chamber 3 needs to be transferred to the buffer device 100, because the carrying area of ​​the buffer device 100 can be flexibly adjusted, adjusting the size of the carrying area of ​​the buffer device 100 can still be used to buffer carrier bases 01 of different sizes transferred out of another process chamber 3, thereby making full use of the buffer device 100 and improving the buffering flexibility for carrier bases 01 of different sizes.

[0065] In another embodiment, as shown in FIG2, the number of buffer devices 100 in the transfer chamber 2 is multiple, which further enhances the buffering capacity of the transfer chamber 2. Furthermore, since the size of the bearing area of ​​the unloaded buffer device 100 can be adaptively adjusted according to the size of the bearing base to be transferred, the buffer device 100 has more flexible adaptability and improves utilization.

[0066] Meanwhile, the adjustable-size buffer device 100, together with the transfer device 1 and the main control device 5, can integrate the transfer process of different sized bearing bases on a single production line, reducing the number of production lines, space occupation and equipment cost expenditure, reducing the idle rate of the buffer device 100, and improving utilization.

[0067] In this embodiment, as shown in FIG2, the transfer device 1 may include a clamping device 11 for clamping the sidewall of the bearing base 01 and having an adjustable clamping size. The transfer device 1 clamps the bearing base 01 through the clamping device 11 to achieve the transfer of the bearing base 01. For example, the clamping device 11 may include two clamping arms arranged opposite each other and a drive structure. The drive structure may be one or a combination of several of the following: a motor, a servo motor, a linear module, a cylinder, a linkage mechanism, etc. The drive structure can move the distance between the two clamping arms closer or further apart, changing the clamping size of the clamping device 11, thereby making it suitable for clamping bearing bases of different sizes. The specific implementation means are conventional techniques in the art. In other embodiments, the transfer device 1 may also transfer the bearing base 01 by supporting it. The specific implementation means are conventional techniques in the art.

[0068] The carrier bases 01 of different sizes support wafers 02 of different sizes, or support wafers 02 of the same size but different numbers. In this embodiment, as shown in FIG2, there are two process chambers 3, and the carrier bases 01 contained in each of the two process chambers 3 are of different sizes. In some embodiments, there are at least two process chambers 3, and at least some of the process chambers 3 contain carrier bases 01 of different sizes, which can be selected according to process requirements, which is beneficial to realize parallel processing of multiple quantities or multiple sizes of wafers 02 and improve production capacity.

[0069] In some embodiments, each process chamber 3 is equipped with a vision device 4. The main control device 5 is communicatively connected to the vision device 4. The vision device 4 is used to acquire and feed back image information of the process chamber 3 to the main control device 5, so that the main control device 5 can acquire the size information of the support base 01 in the process chamber 3, or determine whether the support base 01 exists in the process chamber 3.

[0070] In some embodiments, the vision device 4 may include at least a camera, which captures images of the carrier base 01 to be transported and sends them to the main control device 5. The main control device 5 analyzes the images to determine the size information of the carrier base 01. Alternatively, the vision device 4 may include a camera and a vision processing device. The vision processing device 4 has independent image processing capabilities, which can analyze the images captured by the camera, calculate the size information of the carrier base 01, and then send the size information of the carrier base 01 to the main control device 5.

[0071] In this embodiment, the main control device 5 can be a programmable logic controller (PLC), an industrial personal computer (IPC), a single-board computer (SBC), an embedded system, a digital signal processor (DSP), a field-programmable gate array (FPGA), a microcontroller (MCU), a cloud server, etc.

[0072] In this embodiment, the transfer chamber 2 may be equipped with a load-bearing sensor for sensing the mass of objects supported on the buffer device 100. The load-bearing sensor is communicatively connected to the main control device 5. The main control device 5 uses the load-bearing information fed back by the load-bearing sensor to determine whether the supporting base has been placed on the corresponding buffer device 100 in the transfer chamber 2 and whether stable support can be achieved. Specifically, the load-bearing sensor may be a weighing sensor.

[0073] In this embodiment, as shown in Figures 4 and 5, the buffer device 100 may include linear displacement mechanisms 101 radially distributed around a central position O, with at least one slidable support 102 mounted on each linear displacement mechanism 101. The buffer device 100 also includes a drive mechanism (not shown) communicatively connected to the main control device 5, which controls the drive mechanism to change the position of the support 102 on the linear displacement mechanism 101.

[0074] As shown in Figure 5, the bearing plane formed by the top surfaces of the support seats 102 on all linear displacement mechanisms 101 is the bearing area S (the bearing area S includes at least a portion of the top surface of each support seat 102). As shown in Figure 6, when the support seats 102 on all linear displacement mechanisms 101 move away from the center position O, the size of the bearing area S increases. As shown in Figure 7, when they move closer to the center position O, the size of the bearing area S decreases. When the bearing base 01 is placed in the bearing area S, the top surface of each support seat 102 contacts the bottom surface of the bearing base 01 to achieve a stable support function.

[0075] In some embodiments, the main control device 5 controls the position, direction of movement and distance of each support 102 on the linear displacement mechanism 101 to be consistent, that is, each support 102 is synchronously adjusted on the linear displacement mechanism 101.

[0076] In other embodiments, the support seats 102 that need to be adjusted are selectively adjusted according to the size data of the bearing base 01 to be transferred, and the movement direction and movement distance of these support seats 102 are controlled so that the enclosed bearing area S can provide stable support for the bearing base 01.

[0077] In this embodiment, the linear displacement mechanism 101 can be a lead screw module or a synchronous belt module. At this time, the driving mechanism can be a servo motor that drives the lead screw module, synchronous belt module, etc. The driving mechanism drives the linear displacement mechanism 101 to work, so that the support seat 102 installed on the linear displacement mechanism 101 is displaced to change its position.

[0078] In this embodiment, the linear displacement mechanism 101 can also be a guide rail, and the support base 102 can be provided with a sliding groove. The support base 102 is mounted on the guide rail through the cooperation of the sliding groove and the guide rail. The driving mechanism can include a motor and a traveling wheel driven by the motor. The driving mechanism is mounted on the support base 102, and the traveling wheel contacts the guide rail or a surface near the guide rail. The motor controls the rotation of the traveling wheel, thereby causing the support base 102 to slide along the guide rail to change its position.

[0079] In this embodiment, as shown in FIG8, the buffer device 100 may further include a positioning device 103. A positioning device 103 is provided next to each linear displacement mechanism 101. The positioning device 103 is used to detect the position of the support 102 in the linear displacement mechanism 101. The positioning device 103 is communicatively connected to the main control device 5. The main control device 5 uses the position signal fed back by the positioning device 103 to determine whether the size of the bearing area is compatible with the size of the bearing base to be transferred. The positioning device 103 may be, but is not limited to, a grating sensor, an ultrasonic sensor, a proximity switch, etc.

[0080] In this embodiment, as shown in Figures 9 and 10, the transfer chamber 2 may be provided with multiple transfer buffer cavities 201, and a buffer device 100 may be provided in each transfer buffer cavity 201.

[0081] In some embodiments, the number of buffer devices 100 in each transit buffer cavity 201 is at least two. Each buffer device 100 in the same transit buffer cavity 201 can be arranged horizontally or vertically.

[0082] In this embodiment, as shown in FIG9, the transfer buffer cavities 201 in the transfer chamber 2 can be arranged vertically. Alternatively, as shown in FIG12, the transfer buffer cavities 201 in the transfer chamber 2 can be arranged in the same planar space.

[0083] Since the transfer chamber 2 has multiple transfer buffer cavities 201, and each transfer buffer cavity 201 is equipped with a buffer device 100, it is possible to buffer multiple sizes of bearing bases 01 in the same transfer chamber 2.

[0084] In this embodiment, as shown in FIG11, the semiconductor processing system may further include a pre-processing chamber 6. After the carrier substrate 01, which has been cleaned and purged, enters the pre-processing chamber 6 to hold the wafer, the main control device 5 controls the transfer device 1 to transfer it to the corresponding process chamber that needs to be transferred into the carrier substrate.

[0085] In some embodiments, as shown in FIG11, the semiconductor processing system further includes a transport device 7, which includes a buffer device 100 with an adjustable carrying area size, facilitating the transfer of carrier bases of different sizes to the forward processing chamber 6 on the same production line. The main control device 5 adjusts the carrying area size of the buffer device 100 set in the transport device 7 according to the size information of the carrier base to be transferred into the process chamber 3, so as to carry the corresponding carrier base. The corresponding carrier base 01 outside the transport device 7 is placed on the carrying area of ​​the buffer device 100 set in the transport device 7 by manual or mechanical control.

[0086] In some embodiments, the pre-processing chamber 6 can also be used to clean and purge the carrier base 01. After the carrier base 01 has been cleaned and purged in the pre-processing chamber 6, the cleaned wafer is placed on the carrier base 01. Since the cache device 100 supports the carrier base 01 through the carrier region S, most of the surface of the carrier base 01 is exposed, which improves the cleaning and purging effect.

[0087] In some embodiments, the wafer 02 may be loaded onto the cleaned and purged carrier base 01, and then the carrier base 01 may be transported to the pre-processing chamber 6 by the transport device 7. In this case, the carrier base 01 is a base carrying the wafer 02.

[0088] In this embodiment, as shown in Figures 12 and 13, the buffer device 100 of the semiconductor processing system can be configured as a liftable buffer device. For example, each support base 102 includes a lifting body 1021 and a support body 1022. The support body 1022 is movably sleeved around the lifting body 1021 and mounted on the linear displacement mechanism 101 in a slidable and position-changeable manner. Each lifting body 1021 is communicatively connected to the main control device 5, and the top of the lifting body 1021 is used to support the bearing base 01. The main control device 5 controls the lifting body 1021 to move up and down relative to the support body 1022.

[0089] In some embodiments, the lifting body 1021 is equipped with a load-bearing sensing device.

[0090] Example 2

[0091] This application provides a method for transporting a carrier base, which is implemented using the semiconductor processing system described in Embodiment 1.

[0092] Referring to Figure 1, the carrier base transmission method of this embodiment includes at least:

[0093] S1. The main control device obtains and determines the process chamber that needs to perform the bearing base transfer step based on the information received from at least one process chamber.

[0094] S2. The main control device controls the transfer device to transfer the carrier base in the process room to the transfer room. The main control device acquires and controls the buffer device to adjust the size of the carrier area to match the size of the carrier base according to the received size information of the carrier base.

[0095] S3. The main control device controls the transfer device to place the bearing base on the buffer device whose bearing area size has been adjusted.

[0096] In step S1 of this embodiment, referring to FIG2, when the processing process of the current wafer 02 in the process chamber 3 is completed, the process chamber 3 sends process information to the main control device 5 to indicate that the process flow (e.g., vapor deposition process) of the current wafer 02 in the process chamber 3 has been completed and the step of transferring the carrier base to be transferred (i.e., the carrier base carrying the substrate, and the substrate having a semiconductor material layer deposited on it) to the transfer chamber 2 needs to be performed.

[0097] Specifically, referring to Figures 2 and 3, the process chamber 3 is equipped with a gas injection device 31, a heating device 32, a pressure control device (not shown in the figure), an exhaust device 35, a rotating device 33, and an isolation device 34, all of which are communicatively connected to the main control device 5. The main control device 5 stores process program information. The support base 01 is located on the rotating device 33 inside the process chamber 3, the heating device 32 is located below the support base 01, the gas injection device 31 is located at the top of the process chamber 3 and is opposite to the surface of the support base 01 that carries the substrate, and the exhaust device 35 is located at the bottom of the process chamber 3. The main control unit 5 controls the isolation device 34 to close according to the process program information, and the heating device 32 to heat up so that the temperature inside the process chamber 3 meets the process temperature requirements. It controls the pressure control device (not shown in the figure) and the exhaust device (not shown in the figure) to ensure that the pressure inside the process chamber 3 meets the process pressure requirements. It also controls the gas injection device 31 to provide the process chamber 3 with the appropriate type and flow rate of process gas to induce a vapor deposition reaction on the substrate surface. Finally, it controls the rotating device 33 to rotate the substrate to grow a semiconductor material layer that meets the process requirements. After the vapor deposition reaction is completed, the main control unit 5 controls the gas injection device 31 to inject an inert purging gas (e.g., nitrogen) into the process chamber 3. It controls the rotating device 33 to gradually decelerate to a stop and then move along the axial direction of the process chamber 3 to a suitable position to facilitate the transfer of the carrier base 01 by the subsequent transfer device 1 entering the process chamber 3. It also controls the pressure control device and the exhaust device 35 to ensure that the pressure difference inside and outside the process chamber 3 meets the transfer requirements (e.g., the pressure inside the process chamber 3 is consistent with the pressure in the area where the transfer device 1 is located). Finally, it controls the isolation device 34 to be in the open state.

[0098] In some embodiments, each process chamber 3 may be equipped with a vision device 4. The main control device 5 is communicatively connected to the vision device 4.

[0099] After receiving the process information indicating the completion of wafer processing in process chamber 3 and determining that the step of transferring the carrier base 01 to transfer chamber 2 is required, the main control device 5 obtains the base size information of the carrier base 01 to be transferred through the vision device 4 in process chamber 3. Specifically, after determining that the isolation device 34 is in the open state, the main control device 5 confirms that the carrier base 01 needs to be transferred out of the corresponding process chamber 3. In this case, the carrier base 01 is the carrier base carrying the coated wafer.

[0100] In some embodiments, after the main control device 5 determines that the isolation device 34 is in the open state, it can first control the wafer picking mechanism to enter the corresponding process chamber 3 to perform wafer picking operation on the wafer 02, and then confirm that the corresponding process chamber 3 needs to be transferred out of the carrier base 01.

[0101] In step S2 of the carrier base transfer method in this embodiment, the main control device 5 controls the empty buffer device 100 in the transfer chamber 2 to adjust the size of its bearing area to match the size of the carrier base 01 to be transferred in the process chamber 3 based on the carrier base size information. Specifically, in some embodiments, referring to FIG2, the main control device 5 receives the base size information acquired and sent by the vision device 4 in the process chamber 3 and generates a control signal. The main control device 5 sends the control signal to an empty buffer device 100 in the transfer chamber 2 to adjust the size of the bearing area of ​​the buffer device 100 to match the size of the carrier base 01 to be transferred, so that the buffer device 100 can stably bear the corresponding carrier base 01. In other embodiments, the main control device 5 pre-stores the size information of the bearing base 01 that each process chamber 3 can accommodate, that is, the correspondence between the size information of the process chamber and the bearing base. When the main control device 5 determines the process chamber 3 that needs to perform the step of transferring the bearing base 01 out through step S1, it compares the size information of the bearing base with the pre-stored correspondence between the size information of the process chamber and the bearing base.

[0102] In one embodiment, the phrase "adjusting the size of the bearing area of ​​the buffer device 100 to match the size of the bearing base 01 to be transported" means that the main control device 5 obtains the bottom surface size information of the bearing base 01 to be transported, and adjusts the size of the bearing area S (as shown in Figure 5) of the buffer device 100 according to the size information, so that the size of the bearing area S is less than or equal to the bottom surface size of the bearing base 01 to achieve stable bearing.

[0103] In this embodiment, as shown in Figures 4 to 7, the buffer device 100 may include a plurality of linear displacement mechanisms 101 arranged radially, each linear displacement mechanism 101 being slidably mounted on a support base 102. The buffer device 100 also includes a drive mechanism (not shown in the figures) communicatively connected to the main control device 5. Therefore, in step S2, the step of the main control device 5 acquiring and controlling the buffer device 100 to adjust the size of the bearing area to adapt to the size of the bearing base 01 based on the received size information of the bearing base 01 includes:

[0104] The main control device 5 sends a load-bearing area size adjustment command to the drive mechanism according to the size information of the load-bearing base. In response to the load-bearing area size adjustment command, the drive mechanism drives at least one support seat 102 to slide along the extension direction of the corresponding linear displacement mechanism 101 until the top of each support seat 102 forms a load-bearing area for placing the load-bearing base.

[0105] In some embodiments, as shown in FIG8, the buffer device 100 may include a positioning device 103 communicatively connected to the main control device 5, with one positioning device 103 disposed next to each linear displacement mechanism 101. Therefore, in step S2, the step of the main control device 5 issuing a bearing area size adjustment command to the drive mechanism based on the size information of the bearing base may include:

[0106] The positioning device 103 acquires and sends the position information of each support 102 to the main control device 5;

[0107] The main control device 5 sends a load-bearing area size adjustment command to the drive mechanism based on the position information of each support 102 and the size information of the load-bearing base.

[0108] In this embodiment, a load-bearing sensor can be provided on each support 102. The load-bearing sensor is communicatively connected to the main control device 5, and the main control device 5 pre-stores a first load-bearing lower limit threshold and a load-bearing difference threshold range. Step S3, in which the main control device 5 controls the transfer device 1 to place the bearing base 01 onto the buffer device 100 whose load-bearing area size has been adjusted, includes:

[0109] S31, the main control device 5 controls the transfer device 1 to place the bearing base 01 on the buffer device 100 whose bearing area size has been adjusted, and keeps the transfer device 1 in a holding relationship with the bearing base 01.

[0110] S32. The main control device 5 obtains the load values ​​sent by each load-bearing sensor, determines that the load value of each support is greater than the first lower load threshold, and the difference between any two load values ​​is within the range of load difference minus the threshold.

[0111] S33, The main control device 5 controls the transfer device 1 to release the holding relationship between it and the bearing base.

[0112] In step S33 of this embodiment, after the main control device 5 controls the transfer device 1 to release the holding relationship with the bearing base, it controls the transfer device 1 to move away from the transfer chamber 2.

[0113] Since each support base 102 of the buffer device 100 of this application involves height adjustment in height and size adjustment of the bearing area in planar direction, in order to further ensure that the bearing area can stably support the bearing base 01 after the main control device 5 controls the transfer device 1 to transfer the bearing base 01 to the bearing area, in step S31 of this application, after the main control device 5 controls the transfer device 1 to place the bearing base 01 to be transferred on the buffer device 100 with the bearing area size adjusted, the transfer device 1 also maintains the holding relationship between the transfer device 1 and the bearing base 01. It is equivalent to forming a target bearing position relationship on the buffer device 100 by holding the bearing base 01 through the transfer device 1. And in step S32, it is determined whether the bearing area meets the condition of stable support for the bearing base 01 under the condition of S31. Specifically, after the load-bearing value of each support 102 is greater than the first lower load-bearing threshold, and the difference between any two load-bearing values ​​is within the range of load difference minus threshold, the main control device 5 controls the transfer device 1 to release the holding relationship with the bearing base 01, thereby ensuring that each support 102 has formed a stable support for the bearing base 01, that is, ensuring that the bearing area of ​​the buffer device 100 forms a stable support for the bearing base 01.

[0114] In some embodiments, the first load-bearing lower limit threshold N0 is calculated based on the load-bearing base 01 with the smallest weight carried by the cache device 100, that is: the weight carried by each support 102 after the load-bearing base 01 with the smallest weight is stably placed on the cache device 100.

[0115] In some embodiments, the first lower load limit threshold N0 is related to the weight of the load base 01 held by the transfer device 1. The main control device 5 has pre-stored the correspondence data between the load base 01 that each process chamber 3 can accommodate, its weight, and the first lower load limit threshold N0. After the main control device 5 determines the information of the load base 01 that needs to be transferred out of the corresponding process chamber 3 through step S2, it obtains the first lower load limit threshold N0 from the correspondence data based on the information.

[0116] In some embodiments, the transfer device 1 is equipped with a load-bearing sensing device, which can acquire and feed back the weight of the clamped load-bearing base 01 to the main control device 5. The main control device 5 acquires and obtains the corresponding first load-bearing lower limit threshold based on the weight of the load-bearing base 01 sent by the transfer device 1 and the pre-stored correspondence data between the weight of the load-bearing base and the first load-bearing lower limit threshold.

[0117] To reduce or avoid instability of the center of gravity of the bearing base 01 due to excessive height differences between the support seats 102, the main control device 5 controls the transfer device 1 to place the bearing base 01 to be transferred onto the buffer device 100 whose bearing area size has been adjusted through step S31. After maintaining the holding relationship between the buffer device 1 and the bearing base 01, step S32 is executed to determine the first lower bearing limit threshold and the range of the load difference minus the threshold, so as to ensure that the center of gravity of the bearing base 01 is stable after step S33. Specifically, referring to Figure 4, the first lower bearing limit threshold of each of the four support seats 102 is N0 and the height is consistent. When the bearing base 01 is stably supported by each support seat 102, and the loads borne by each support seat 102 are N1, N2, N3 and N4, and N1, N2, N3 and N4 are all greater than or equal to N0, and the difference between the load values ​​of any two support seats, such as (N1-N2), (N4-N1) etc., is within the range of load difference minus threshold, then it is considered that the bearing area plays a role in stably supporting the bearing base 01.

[0118] Furthermore, the stable support of each support 102 to the bearing base 01 is the result of the joint action of each support 102. Moreover, the bottom surface of the bearing base 01 is not completely flat in some cases. Therefore, judging and adjusting each support 102 to jointly support the bearing base 01 by the load-bearing value is more time-saving and safer and more reliable.

[0119] In some embodiments, the main control device 5 also stores a second lower load-bearing threshold that is less than the first lower load-bearing threshold, and the second lower load-bearing threshold is not less than 5% of the first lower load-bearing threshold. After step S31 is completed, the main control device 5 obtains and determines, based on each load value, that the load values ​​of the M support seats 102 are greater than or equal to the second lower load-bearing threshold and less than the first lower load-bearing threshold, and the load values ​​of the remaining support seats 102 are greater than or equal to the first lower load-bearing threshold, step S33 is executed, and then the main control device 5 performs micro-adjustment of the M support seats 102 until step S32 is satisfied, where M is an integer greater than or equal to 1 and less than the number of support seats. Since the load-bearing value of each support 102 is greater than or equal to the second lower load-bearing threshold, and the second lower load-bearing threshold is not less than 5% of the first lower load-bearing threshold, it indicates that each support 102 and the bottom surface of the bearing base 01 have formed a load-bearing relationship. There is no risk that the bearing base 01 will fall due to mismatch between the area of ​​the load-bearing area and the bottom surface size of the bearing base 01, or that it will slip due to significant unevenness after placement. In this case, it is only necessary to adjust the support 102 whose load-bearing values ​​are greater than or equal to the second lower load-bearing threshold and less than the first lower load-bearing threshold. Therefore, the holding relationship between the transfer device 1 and the bearing base 01 can be released first through step S33. At this time, the bearing base 01 can be supported by each support and will not fall. In this case, in order to further facilitate the stable support of the bearing base 01, the main control device 5 can perform micro-motion lifting adjustment until the main control device 5 determines that the load-bearing value of each support 102 meets the requirements of step S32. The micro-motion lifting adjustment can be performed using the height of one of the support seats 102 whose load-bearing value is greater than the first lower load-bearing threshold as a reference height, and the heights of M support seats 102 to be adjusted can be adjusted sequentially. In some embodiments, the height adjustment sequence of the support seats 102 is based on the diagonal principle. For example, using the height of one support seat 102 (denoted as the first support seat) as a reference, the next support seat 102 to be adjusted is the support seat that is diagonally related to the first support seat. In some embodiments, during the micro-motion adjustment of the target support seat 102, appropriate step-by-step control can be performed, that is, adjusting a portion of the height each time, which is more conducive to the stable placement of the bearing base 01 during the micro-motion adjustment process and prevents it from slipping.

[0120] In some embodiments, after step S31 is completed, the main control device 5 acquires and determines, based on the received load-bearing values ​​of each support 102, that the load-bearing value of at least one support 102 is less than the second lower load-bearing threshold. Then, it controls the transfer device 1 to maintain the holding relationship with the bearing base 01 and controls the transfer device 1 to carry the bearing base 01 away from the transfer chamber 2. The main control device 5 then adjusts the lifting of at least one support 102. When the main control device 5 determines that the load-bearing value of a support 102 is less than the second lower load-bearing threshold, it indicates that the load-bearing relationship between the support 102 and the bearing base is weak or there is no contact relationship, making it easy for the bearing base 01 to fall from the load-bearing area due to unstable support. In this case, if the bearing base 01 is placed first and then the lifting adjustment is performed directly, the bearing base 01 may not be able to stably support itself on the load-bearing area.

[0121] In some embodiments, the support base 102 includes a lifting body 1021 and a support body 1022 movably sleeved around the lifting body 1021. The heights of the support bodies 1022 are consistent. Each lifting body 1021 is equipped with a load-bearing sensor and is communicatively connected to the main control device 5. The step of the main control device 5 adjusting the height of at least one support base 102 includes: the main control device 5 controlling the lifting of each lifting body 1021 on the buffer device 100 until each lifting body 1021 is at the same height as its corresponding support body 1022. In another embodiment, the step of the main control device 5 adjusting the height of at least one support base 102 includes: the main control device 5 controlling the lifting of each lifting body 1021 on the buffer device 100 until each lifting body 1021 is housed within its corresponding support body 1022, so that the bearing base 01 can be stably supported by the support bodies 1022 of consistent height. Compared to the scheme of readjusting the height of each lifting body 1021 to be consistent, the above control method does not require judging whether the height of each lifting body 1021 is consistent, and it is more time-saving for achieving stable support of the bearing base 01.

[0122] In some embodiments, the lifting body 1021 is equipped with a load-bearing sensing device. When the top surface of each lifting body 1021 is aligned with the top surface of the corresponding support body 1022, the transfer device 1 holds the bearing base 01 again and places it on the bearing area surrounded by each support 102. The main control device 5 can also detect the load-bearing status of each support 102, thereby further determining whether the top surface of each lifting body 1021 is aligned with the top surface of the corresponding support body 1022 or whether each lifting body 1021 is contained within the corresponding support body 1022, so as to further ensure the accuracy of the determination.

[0123] In one embodiment, as shown in FIG9 or FIG10, at least one transfer buffer cavity 201 is provided in the transfer chamber 2, and the buffer device 100 is disposed in the transfer buffer cavity 201. As shown in FIG12 and FIG13, after step S3 is completed, the main control device 5 controls each support seat 102 to rise synchronously so that each support seat 102 rises to a set upper limit position, so as to prevent the transfer device 1 holding the bearing base 01 from entering the space between the upper limit position and the inner top wall of the transfer buffer cavity 201.

[0124] As shown in Figure 13, after each support base 102 rises synchronously to the set upper limit position, the height of the empty space above the bearing base 01 can prevent the transfer device 1 holding other bearing bases 01 from entering again, thereby preventing the stacking problem that occurs when the transfer device 1 holds other bearing bases 01 and enters the empty space and stacks the bearing bases 01 it holds on the bearing bases 01 that have already been placed in the bearing area.

[0125] In this embodiment, as shown in FIG2, the transfer device 1 may include a clamping device 11 for clamping the sidewall of the bearing base 01 and having an adjustable clamping size. Therefore, in step S3, the step of the main control device 5 controlling the transfer device 1 to transfer the bearing base in the process chamber 3 to the transfer chamber 2 may include: the main control device 5 acquiring and, based on the received size information of the bearing base, controlling the clamping device 11 to adjust the clamping size to match the size of the bearing base 01 to be transferred, and then controlling the clamping device 11 to clamp the bearing base 01 to be transferred and move it to the transfer chamber 2.

[0126] In this embodiment, as shown in FIG11, the semiconductor processing system may further include a pre-processing chamber 6 and a transport device 7, wherein the transport device 7 is provided with a buffer device 100.

[0127] In some embodiments, the pretreatment chamber 6, the transfer chamber 2, and the process chamber 3 are arranged around the transfer device 1.

[0128] In some embodiments, before performing step S1, the following steps are further performed:

[0129] S01, the main control device 5 obtains and determines, based on the information received from the transfer device 1 or at least one process chamber 3, the process chamber 3 that needs to be transferred to the bearing base 01.

[0130] S02, the main control device 5 acquires and controls the buffer device 100 of the transport device 7 to adjust the size of the corresponding bearing area according to the received size information of a process chamber that can accommodate the bearing base 01 to be transferred to the bearing base.

[0131] S03. Place the bearing base 01, which is adapted to the size of the bearing area on the consignment device, on the corresponding bearing area;

[0132] S04, the main control device 5 controls the transport device 7 to transport the carrier base 01 to the pre-processing chamber 6.

[0133] In some embodiments, after step S04 is completed, the wafer is placed on the carrier base 01 in the preprocessing chamber 6, and then the main control device 5 controls the transfer device 1 to transfer the carrier base 01 containing the wafer to the corresponding process chamber 3.

[0134] In some more specific embodiments, the transport device 7 is a movable pallet, such as a pallet equipped with a robotic arm.

[0135] In some specific embodiments, the pre-processing chamber 6 is a glove box.

[0136] In step S01 of some embodiments, after the main control device 5 controls the transfer device 1 to move the support base 01 in the process chamber 3 out of the process chamber 3, it will receive corresponding information from the transfer device 1. The main control device 5 determines that the process chamber 3 needs to be transferred into the support base 01 based on the corresponding information from the transfer device 1.

[0137] In some embodiments, each process chamber 3 is equipped with a vision device 4. In step S01, the main control device 5 determines which process chamber 3 needs to be transferred to the support base 01 based on the information sent by the vision device 4 of each process chamber 3. Specifically, after the transfer device 1 transfers the support base out of the process chamber 3, the main control device 5 obtains image information of the process chamber 3 through the vision device 4 in the process chamber 3. If the main control device 5 determines based on the image information obtained by the vision device 4 that the process chamber 3 does not contain a support base, then the process chamber 3 is determined to be the process chamber 3 that needs to be transferred to the support base 01.

[0138] In some embodiments, the main control device 5 can determine the process chamber 3 that needs to be transferred to the support base 01 based on the time point at which the rotating device 33 gradually decelerates to a stop and moves along the axial direction of the process chamber 3 to a suitable position after the inert purging gas (e.g., nitrogen) is injected into the corresponding process chamber 3 by the control gas injection device 31, and the time point at which the pressure difference between the inside and outside of the process chamber 3 meets the transfer requirements. Alternatively, it can determine the process chamber 3 that needs to be transferred to the support base 01 based on the time point at which the pressure control device and the exhaust device 35 ensure the pressure difference between the inside and outside of the process chamber 3 meets the transfer requirements. That is, even before the support base 01 of the process chamber 3 has been transferred out, the device can predict in advance, based on the process cycle, that the process chamber 3 will subsequently need to be transferred to another support base 01. This allows the time point at which the subsequent execution of the transfer from the support base 01 of the process chamber 3 coincides with or is not significantly different from the time point at which the aforementioned S04 is completed, thus improving efficiency. Specific judgment points can be reasonably set according to the efficiency requirements of the process for processing different batches of materials.

[0139] In step S02 of some embodiments, the main control device 5 pre-stores the size information of the bearing base 01 that each process chamber 3 can accommodate, that is, the correspondence between the size information of the process chamber and the bearing base. When the main control device 5 determines in step S01 that the process chamber 3 that needs to be transferred to the bearing base 01 needs to be transferred, it compares the corresponding bearing base size information in the pre-stored correspondence between the size information of the process chamber and the bearing base.

[0140] In step S03 of some embodiments, the main control device 5 controls the transfer device 1 to place the carrier base 01 to be transferred onto the buffer device 100 of the transport device 7, whose carrier area size has been adjusted. The transfer device 1 performing step S03 can be the same transfer device as the transfer device 1 performing steps S2 and S3, or it can be a different transfer device. The specific selection is necessary to improve the efficiency of the semiconductor processing system production line.

[0141] In step S04 of some embodiments, the main control device 5 controls the transport device 7 to carry the carrier base 01 to the pre-processing chamber 6.

[0142] The above description is merely a partial embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for conveying a support base, characterized in that, include: S0, Providing semiconductor processing systems; The semiconductor processing system includes at least a transfer device, a transfer chamber, at least two process chambers, and a main control device; The transfer chamber is equipped with a buffer device for placing the bearing base and whose bearing area size is adjustable; each of the process chambers contains a bearing base, and at least some of the process chambers contain bearing bases of different sizes; the main control device is communicatively connected to each of the process chambers, the transfer device, and the buffer device. S1. The main control device acquires and determines, based on information received from at least one of the process chambers, which process chambers require the execution of the bearing base transfer step. S2. The main control device controls the transfer device to transfer the bearing base in the process chamber to the transfer chamber. The main control device acquires and controls the buffer device to adjust the size of the bearing area to match the size of the bearing base according to the received size information of the bearing base. S3. The main control device controls the transfer device to place the bearing base on the buffer device whose bearing area size has been adjusted.

2. The method for conveying a support base according to claim 1, characterized in that, The buffer device includes a plurality of linear displacement mechanisms arranged radially, each linear displacement mechanism having a support seat slidably disposed thereon, and the buffer device also includes a drive mechanism that is communicatively connected to the main control device and connected to each of the support seats; In step S2, the step of the main control device acquiring and controlling the buffer device to adjust the size of the bearing area to match the size of the bearing base according to the received size information of the bearing base includes: The main control device sends a load-bearing area size adjustment command to the drive mechanism according to the size information of the load-bearing base. In response to the load-bearing area size adjustment command, the drive mechanism drives at least one of the support seats to slide along the extension direction of the corresponding linear displacement mechanism until the top of each support seat forms a load-bearing area for placing the load-bearing base.

3. The method for conveying a support base according to claim 2, characterized in that, The cache device includes a position measuring device that is communicatively connected to the main control device; In step S2, the step of the main control device issuing a load-bearing area size adjustment command to the drive mechanism based on the size information of the load-bearing base includes: The positioning device acquires and sends the position information of each support seat to the main control device; The main control device sends an adjustment command for the bearing area size to the drive mechanism based on the position information of each support and the size information of the bearing base.

4. The method for conveying a support base according to claim 1, characterized in that, The main control device stores a first load lower limit threshold and a load difference threshold range. The buffer device includes several linear displacement mechanisms arranged radially. Each linear displacement mechanism is slidably provided with a support seat. Each support seat is a liftable support seat and is provided with a load sensing device that is communicatively connected to the main control device. In step S3, the step of the main control device controlling the transfer device to place the bearing base on the buffer device whose bearing area size has been adjusted includes: S31. The main control device controls the transfer device to place the bearing base on the buffer device whose bearing area size has been adjusted, and keeps the transfer device in a holding relationship with the bearing base. S32. The main control device acquires and determines, based on the load values ​​sent by each load-bearing sensor, that the load value of each support is greater than or equal to the first lower load threshold, and the difference between the load values ​​of any two support is within the range of the load difference minus the threshold. S33, The main control device controls the transfer device to release the holding relationship with the bearing base.

5. The method for conveying a bearing base according to claim 4, characterized in that, The main control device also stores a second lower load-bearing threshold that is less than the first lower load-bearing threshold, and the second lower load-bearing threshold is not less than 5% of the first lower load-bearing threshold. After step S31 is completed, the main control device acquires and determines, based on each load-bearing value, that the load-bearing values ​​of the M support seats are greater than or equal to the second lower load-bearing threshold and less than the first lower load-bearing threshold, and that the load-bearing values ​​of the remaining support seats are greater than or equal to the first lower load-bearing threshold. Then, step S33 is executed, and the main control device performs micro-adjustment of the M support seats until step S32 is satisfied; wherein, M is an integer greater than or equal to 1 and less than the number of support seats.

6. The method for conveying a bearing base according to claim 4, characterized in that, The main control device also stores a second lower load-bearing threshold that is less than the first lower load-bearing threshold, and the second lower load-bearing threshold is not less than 5% of the first lower load-bearing threshold. After step S31 is completed, the main control device acquires and determines, based on the received load values, that the load value of at least one of the support seats is less than the second load lower limit threshold. Then, it controls the transfer device to carry the load-bearing base away from the transfer chamber, and the main control device adjusts the lifting and lowering of at least one of the support seats.

7. The method for conveying a bearing base according to claim 6, characterized in that, The support base includes a lifting body and a support body movably sleeved around the lifting body. The height of each support body is the same. Each lifting body is equipped with the load-bearing sensing device. Each lifting body is communicatively connected to the main control device. The step of the main control device adjusting the height of at least one of the support seats includes: The main control device controls the lifting of each of the lifting bodies on the buffer device until each lifting body is at the same height as the corresponding support body, or is housed within the corresponding support body.

8. The method for conveying a bearing base according to claim 1, characterized in that, The transfer chamber is provided with at least one transfer buffer cavity, and the buffer device is disposed in the transfer buffer cavity. The buffer device includes several linear displacement mechanisms arranged radially, and each linear displacement mechanism is slidably provided with a liftable support base. The main control device is communicatively connected to each of the support bases. After step S3 is completed, the main control device controls each of the support seats to rise synchronously to raise each of the support seats to the set upper limit position, so as to prevent the transfer device holding the bearing base from entering the space between the upper limit position and the inner top wall of the transfer buffer cavity.

9. The method for conveying a bearing base according to claim 1, characterized in that, The semiconductor processing system also includes a pre-processing chamber and a transport device, wherein the transport device is equipped with a buffer device that is communicatively connected to the main control device; Before performing step S1, the following steps are also performed: S01. The main control device acquires and determines, based on the information received from the transfer device or at least one of the process chambers, that the process chamber needs to be transferred to the bearing base. S02. The main control device acquires and controls the buffer device provided by the transport device to adjust the size of the corresponding bearing area based on the received size information of the bearing base that the process chamber to be transferred into the bearing base can accommodate. S03. Place the support base, which is adapted to the size of the support area on the transport device, on the corresponding support area; S04. The main control device controls the transport device to transport the carrier base to the pre-processing room.

10. The method for conveying a support base according to claim 1, characterized in that, It also includes several vision devices that are communicatively connected to the main control device and located in each of the process rooms; In step S1, the step of the main control device acquiring and determining, based on information received from at least one of the process chambers, which process chambers requires the removal of the support base includes: The main control device acquires image information in the process room through the vision device in the process room; If the main control device determines, based on the image information acquired by the vision device, that the process chamber does not contain a support base, then the process chamber is determined to be the process chamber that needs to be transferred to a support base.

11. A semiconductor processing system, characterized in that, The semiconductor processing system includes a transfer device, a transfer chamber, at least two process chambers, and a main control device; the transfer chamber is equipped with a buffer device for placing a support base and whose support area size is adjustable; at least some of the process chambers contain support bases of different sizes, and the main control device is communicatively connected to each of the process chambers, the transfer device, and the buffer device.

12. The semiconductor processing system according to claim 11, characterized in that, The buffer device includes a plurality of linear displacement mechanisms arranged radially, each of which is slidably provided with a support base. The buffer device also includes a drive mechanism that is communicatively connected to the main control device and connected to each of the support bases.

13. The semiconductor processing system according to claim 11, characterized in that, The buffer device includes a positioning device that is communicatively connected to the main control device.

14. The semiconductor processing system according to claim 11, characterized in that, Each of the aforementioned process chambers is equipped with a vision device that is communicatively connected to the main control device.

15. The semiconductor processing system according to claim 12, characterized in that, The support base includes a lifting body and a support body movably sleeved around the lifting body. Each lifting body is equipped with a load-bearing sensing device, and each lifting body is communicatively connected to the main control device.

16. The semiconductor processing system according to claim 11, characterized in that, It also includes at least one shipping device, which is equipped with at least one of the buffer devices that are communicatively connected to the main control device.

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