Optical transceiver device and optical module

Abstract

An optical transceiver device (100) and an optical module. The optical transceiver device (100) comprises a BOX housing (1), wherein an optical port (2) and a ceramic plug member (3) are respectively arranged on two side walls of the BOX housing (1); an optical transmitting unit (4) and an optical receiving unit (5) are located inside the BOX housing (1) and are both electrically connected to the ceramic plug member (3); the optical transmitting unit (4) cooperates with the optical port (2) to form an optical transmitting path (40), and the optical port (2) cooperates with the optical receiving unit (5) to form an optical receiving path (50); and the optical receiving unit (5) comprises an optical path deflection assembly (53), which comprises a first reflecting mirror (531) and a second reflecting mirror (532) spaced apart in a vertical direction, the first reflecting mirror (531) being configured to reflect light incident in a horizontal direction to allow the light to exit in the vertical direction, and the second reflecting mirror (532) being configured to reflect the light from the first reflecting mirror (531) to allow the light to exit in the horizontal direction, such that the optical transmitting path (40) and part of the optical receiving path (50) are distributed at intervals in the vertical direction.

Description

Optical transceiver devices and optical modules

[0001] This application claims priority to Chinese Patent Application No. 202411517403.3, filed on October 28, 2024, entitled "Optical Transceiver Device and Optical Module", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical communication technology, and in particular to optical transceiver devices and optical modules. Background Technology

[0003] Passive Optical Network (PON), as an access network technology, enables the establishment of physical connections between users and network providers. With the increasing demand for home bandwidth, the rate requirements for optical modules and devices in PON have evolved from 1.25Gbps and 10Gbps to 50Gbps. To ensure low-cost deployment of optical modules in PON networks, these modules must be backward compatible. Specifically, 50GPON optical modules will continue to use a small-form-pluggable (SFP) package and need to be compatible with 1.25G / 10G / 50G rates. Meanwhile, their performance requirements continue to increase (evolving from Class C+ to Class D). This presents significant challenges to the miniaturization of optical devices, as each device needs to house three sets of transceiver optical chips and corresponding passive components to ensure high optical and electrical performance.

[0004] Currently, the main packaging form of PON optical devices in access networks is TO packaging. The size of these devices increases significantly with the number of transceiver ports, resulting in excessively large package sizes for 50G PON tri-rate compatible optical devices. While BOX packaging is more expensive than TO packaging, it offers advantages in reducing the overall package size of optical devices.

[0005] In related technologies, BOX-packaged optical transceivers include: a BOX housing, a Transmitter Optical Sub-Assembly (TOSA), a Receiver Optical Sub-Assembly (ROSA), a multiplexing component, and a wavelength division multiplexing component housed inside the BOX housing, and an optical port disposed on the BOX housing. The TOSA, ROSA, multiplexing component, and wavelength division multiplexing component are arranged at intervals on the bottom wall of the BOX housing. Furthermore, to prevent optoelectronic crosstalk between the transmitter and receiver, the transmitting and receiving ends need to be spaced a certain distance apart. This results in a relatively large package size in both length and width, making it difficult to meet the miniaturization requirements of optical transceivers.

[0006] Public content

[0007] This disclosure provides an optical transceiver device and optical module, which can solve the technical problems existing in related technologies. Specifically, the technical solution is as follows.

[0008] An optical transceiver device includes: a BOX housing, an optical port, a ceramic connector, a transmitting optical unit, and a receiving optical unit. The optical port and the ceramic connector are respectively disposed on two sidewalls of the BOX housing distributed along its length. The transmitting optical unit and the receiving optical unit are located inside the BOX housing and are both electrically connected to the ceramic connector. The transmitting optical unit and the optical port cooperate to form a transmitting optical path, and the optical port and the receiving optical unit cooperate to form a receiving optical path. The receiving optical unit includes an optical path deflection assembly, which includes: a first reflector and a second reflector spaced apart in a vertical direction. The first reflector reflects light incident in a horizontal direction, causing it to exit in a vertical direction. The second reflector reflects light from the first reflector to exit in a horizontal direction, thereby causing the transmitting optical path and a portion of the receiving optical path to be spaced apart in a vertical direction. The horizontal direction is the extension direction of the plane defined by the length and width of the BOX housing, and the vertical direction is the height direction of the BOX housing.

[0009] The optical transceiver device provided in this embodiment includes a first reflector and a second reflector spaced vertically in the optical path reversing component of the receiving optical unit. The first reflector reflects light incident horizontally and directs it vertically to the second reflector. The second reflector reflects light emitted vertically from the first reflector and directs it horizontally. This results in the transmitting optical path and a portion of the receiving optical path being spaced vertically, i.e., the transmitting optical path and a portion of the receiving optical path are separated in the height direction of the BOX housing. Correspondingly, the height space of the BOX housing adds an extra layout dimension for the components, allowing the transmitting optical unit and a portion of the receiving optical unit to be separated in the height direction of the BOX housing. Since they are arranged at different height planes, it not only facilitates the compact arrangement of the components in the transmitting and receiving optical units in the horizontal direction, achieving miniaturized packaging of the optical transceiver device, but also effectively avoids crosstalk between the transmitting and receiving optical paths. As can be seen, the optical transceiver device provided in this disclosure can achieve small-size BOX packaging by making reasonable use of the height space of the BOX housing, which meets the requirements of current small form pluggable (SFP) devices for packaging size and device performance, and is suitable for application in access network PON.

[0010] In some possible implementations, the transmitting optical unit includes: a transmitting optical component and a multiplexing component sequentially distributed along the length direction of the BOX housing, with the transmitting optical component arranged adjacent to the ceramic connector; the receiving optical unit further includes a receiving optical component and a wavelength division component, and the optical path deflection component further includes a third reflector, wherein the receiving optical component, the wavelength division component, and the third reflector are sequentially distributed along the length direction of the BOX housing, with the receiving optical component arranged adjacent to the ceramic connector, the third reflector and the second reflector being sequentially distributed along the width direction of the BOX housing, and the second reflector and the first reflector being sequentially distributed along the height direction of the BOX housing; the first reflector, the transmitting optical unit, and the optical port are disposed on the same height plane of the BOX housing.

[0011] In some possible implementations, the transmitting optical component and the receiving optical component at least partially overlap along the width direction of the BOX housing, and / or the multiplexing component and the demultiplexing component at least partially overlap.

[0012] The overlapping design described above helps to reduce the space occupied by each component in the width direction of the BOX housing, thereby significantly reducing the package size of the optical transceiver in the width direction.

[0013] In some possible implementations, the beam combiner and the optical path deflection assembly include a shared filter and a shared lens. The shared filter, the shared lens, and the optical port cooperate to form a common transmit and receive optical path portion of the transmit optical path and the receive optical path. When used in the transmit optical path, the shared filter is used to transmit the transmit light emitted by the beam combiner to the shared lens. When used in the receive optical path, the shared filter is used to reflect the receive light emitted by the shared lens to the first reflector.

[0014] In some possible implementations, the bottom or top wall of the BOX housing is used as a reference horizontal plane, and the projection of the common lens on the reference horizontal plane is located between the projection of the second reflector on the reference horizontal plane and the projection of the third reflector on the reference horizontal plane.

[0015] In some possible implementations, the optical transceiver further includes: a support member fixed to the inside of the BOX housing, wherein the transmitting optical unit and the receiving optical unit are supported by support members of different heights.

[0016] In some possible implementations, the receiving optical component and the wavelength division component are supported by a first support member, and the first support member is made of metal.

[0017] In some possible implementations, a second support member is fixedly connected to the surface of the first reflector facing the second reflector, and a third support member is fixedly connected to the surface of the second reflector facing the first reflector, with the second support member abutting against the third support member.

[0018] In some examples, the transmitting optical component includes: an optical chip for electro-optical conversion and a first lens, the optical chip for electro-optical conversion being electrically connected to the ceramic connector; the multiplexing component further includes: a multiplexer, wherein the optical chip for electro-optical conversion, the first lens, the multiplexer, the shared filter, the shared lens, and the optical port are arranged sequentially at intervals along the transmitting optical path;

[0019] The receiving optical component includes: an optical chip for photoelectric conversion and a transimpedance amplifier, wherein the optical chip for photoelectric conversion is electrically connected to the transimpedance amplifier, and the transimpedance amplifier is also electrically connected to the ceramic connector; the wavelength division component further includes: a wavelength division unit, wherein the optical port, the shared lens, the shared filter, the first reflector, the second reflector, the third reflector, the wavelength division unit, the optical chip for photoelectric conversion, and the transimpedance amplifier are arranged sequentially at intervals along the receiving optical path;

[0020] The optical port, the shared lens, the shared filter, and the first reflector together constitute the first horizontal optical path segment of the receiving optical path; the first reflector and the second reflector together constitute the vertical optical path segment of the receiving optical path; the second reflector and the third reflector together constitute the second horizontal optical path segment of the receiving optical path; and the wavelength division multiplexer, the optical chip for photoelectric conversion, and the transimpedance amplifier together constitute the third horizontal optical path segment of the receiving optical path.

[0021] Furthermore, the transmitting optical component further includes: an isolator, the optical chip for electro-optical conversion, the first lens, the isolator, the multiplexer, the shared filter, the shared lens, and the optical port are arranged sequentially at intervals along the transmitting optical path; and / or, the receiving optical component further includes a deflector prism, and the wavelength division component further includes a bandpass filter, the optical port, the shared lens, the shared filter, the first reflector, the second reflector, the third reflector, the wavelength division unit, the bandpass filter, the deflector prism, the optical chip for photoelectric conversion, and the transimpedance amplifier are arranged sequentially at intervals along the receiving optical path.

[0022] In other examples, the transmitting optical component includes an optical chip for electro-optical conversion and a first lens, the optical chip for electro-optical conversion being electrically connected to the ceramic connector, and the multiplexing component further includes a multiplexing filter chip and a second lens, wherein the optical chip for electro-optical conversion, the first lens, the multiplexing filter chip, the second lens, the common filter, the common lens, and the optical port are arranged sequentially at intervals along the transmitting optical path;

[0023] The receiving optical component includes an optical chip for photoelectric conversion and a transimpedance amplifier. The optical chip for photoelectric conversion is electrically connected to the transimpedance amplifier, and the transimpedance amplifier is also electrically connected to the ceramic connector. The wavelength division component further includes a third lens and a wavelength division filter chip, wherein the optical port, the shared lens, the shared filter, the first reflector, the second reflector, the third reflector, the third lens, the wavelength division filter chip, the optical chip for photoelectric conversion, and the transimpedance amplifier are arranged sequentially at intervals along the receiving optical path.

[0024] The optical port, the shared lens, the shared filter, and the first reflector together constitute the first horizontal optical path segment of the receiving optical path. The first reflector and the second reflector together constitute the vertical optical path segment of the receiving optical path. The second reflector and the third reflector together constitute the second horizontal optical path segment of the receiving optical path. The third reflector, the third lens, the wavelength division filter chip, the optical chip for photoelectric conversion, and the transimpedance amplifier together constitute the third horizontal optical path segment of the receiving optical path.

[0025] In some other examples, the transmitting optical component includes an optical chip for electro-optical conversion and a first lens, the optical chip for electro-optical conversion being electrically connected to the ceramic connector, and the multiplexing component further includes a multiplexing filter chip and a second lens, wherein the optical chip for electro-optical conversion, the first lens, the multiplexing filter chip, the second lens, the common filter, the common lens, and the optical port are arranged sequentially at intervals along the transmitting optical path;

[0026] The receiving optical component includes a transimpedance amplifier electrically connected to the ceramic connector. The wavelength division component further includes a third lens and a first integrated chip. The optical port, the shared lens, the shared filter, the first reflector, the second reflector, the third reflector, the third lens, the first integrated chip, and the transimpedance amplifier are arranged sequentially at intervals along the receiving optical path. The first integrated chip includes a coupled wavelength division filter chip and a photodetector chip, and the photodetector chip is electrically connected to the transimpedance amplifier.

[0027] The optical port, the shared lens, the shared filter, and the first reflector together constitute the first horizontal optical path segment of the receiving optical path; the first reflector and the second reflector together constitute the vertical optical path segment of the receiving optical path; the second reflector and the third reflector together constitute the second horizontal optical path segment of the receiving optical path; and the third reflector, the third lens, the first integrated chip, and the optical chip for photoelectric conversion together constitute the third horizontal optical path segment of the receiving optical path.

[0028] In some other examples, the transmitting optical component includes a continuous light source and a first lens, and the multiplexing component further includes a second lens and a second integrated chip, wherein the continuous light source, the first lens, the second integrated chip, the second lens, the common filter, the common lens, and the optical port are arranged sequentially at intervals along the transmitting optical path, and the second integrated chip includes a coupled multiplexing filter chip and an electro-optic modulation chip, the electro-optic modulation chip being electrically connected to the ceramic connector;

[0029] The receiving optical component includes a transimpedance amplifier electrically connected to the ceramic connector. The wavelength division component further includes a third lens and a first integrated chip. The optical port, the shared lens, the shared filter, the first reflector, the second reflector, the third reflector, the third lens, the first integrated chip, and the transimpedance amplifier are arranged sequentially at intervals along the receiving optical path. The first integrated chip includes a coupled wavelength division filter chip and a photodetector chip, and the photodetector chip is electrically connected to the transimpedance amplifier.

[0030] The optical port, the shared lens, the shared filter, and the first reflector together constitute the first horizontal optical path segment of the receiving optical path; the first reflector and the second reflector together constitute the vertical optical path segment of the receiving optical path; the second reflector and the third reflector together constitute the second horizontal optical path segment of the receiving optical path; and the third reflector, the third lens, the first integrated chip, and the optical chip for photoelectric conversion together constitute the third horizontal optical path segment of the receiving optical path.

[0031] In some possible implementations, the transmitting optical components are configured to transmit multiple signals with different wavelengths, and the multiplexer is used to combine the optical transmission signals from the multiple transmitting optical components and output them to the optical port;

[0032] The receiving optical component is configured to receive multiple signals with different wavelengths. The wavelength division component is used to receive and separate the optical receiving signals from the optical port, and to output the separated multiple optical receiving signals to the corresponding receiving optical components.

[0033] On the other hand, embodiments of this disclosure provide an optical module comprising: at least one pair of the aforementioned optical transceivers and optical fibers, wherein the end of each optical fiber is connected to the optical port of each pair of optical transceivers. Attached Figure Description

[0034] Figure 1 is a cross-sectional view of an exemplary optical transceiver device provided in an embodiment of this disclosure in the horizontal direction;

[0035] Figure 2 is a schematic diagram of the assembly relationship between an exemplary first reflector and a second reflector provided in an embodiment of this disclosure;

[0036] Figure 3 is a schematic diagram of the appearance of an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0037] Figure 4 is an optical path diagram of an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0038] Figure 5 is a cross-sectional view in the horizontal direction of another exemplary optical transceiver device provided in the embodiments of this disclosure;

[0039] Figure 6 is an orientational diagram of the transmission optical unit and part of the receiving optical unit in an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0040] Figure 7 is an orientation diagram of an exemplary first and second reflector provided in an embodiment of this disclosure;

[0041] Figure 8 is a cross-sectional view in the horizontal direction of an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0042] Figure 9 is a schematic diagram of the assembly of some components in an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0043] Figure 10 is a cross-sectional view in the horizontal direction of another exemplary optical transceiver device provided in the embodiments of this disclosure;

[0044] Figure 11 is a schematic diagram of the assembly of some components in another exemplary optical transceiver device provided in this embodiment of the present disclosure;

[0045] Figure 12 is a schematic diagram of the assembly of some components in an exemplary optical transceiver device 2 provided in an embodiment of this disclosure;

[0046] Figure 13 is a schematic diagram of the assembly of some components in another exemplary optical transceiver device II provided in this embodiment of the present disclosure;

[0047] Figure 14 is a schematic diagram of the assembly of some components in an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0048] Figure 15 is a schematic diagram of the assembly of some components in another exemplary optical transceiver device provided in this embodiment of the present disclosure;

[0049] Figure 16 is a schematic diagram of the assembly of some components in an exemplary optical transceiver device provided in an embodiment of this disclosure;

[0050] Figure 17 is a schematic diagram of the assembly of some components in another exemplary optical transceiver device four provided in the embodiments of this disclosure;

[0051] Figure 18 is a cross-sectional view of an exemplary optical module provided in an embodiment of this disclosure in the horizontal direction.

[0052] The reference numerals in the attached figures represent: 100, optical transceiver; 200, optical fiber; 1, BOX housing; 2, optical port; 3, ceramic connector; 4, transmitting optical unit; 40, transmitting optical path; 41, transmitting optical assembly; 411, optical chip for electro-optical conversion; 412, first lens; 413, isolator; 414, fourth lens; 415, continuous light source; 42, multiplexing assembly; 421, multiplexer; 422, multiplexing filter chip; 423, second lens; 424, second integrated chip; 5, receiving optical unit; 50, receiving optical path; 501, first horizontal optical path segment; 502, vertical optical path segment; 503, second horizontal optical path segment; 504, third horizontal optical path segment; 51, receiving optical assembly; 511, optical chip for photoelectric conversion; 512, transimpedance amplifier; 513, deflection prism; 52, wavelength division assembly; 521. Wavelength divider; 522. Bandpass filter; 523. Third lens; 524. Wavelength divider filter chip; 525. First integrated chip; 53. Optical path deflection assembly; 531. First reflector; 532. Second reflector; 533. Third reflector; 61. Shared filter; 62. Shared lens; 7. Support component; 71. First support component; 72. Second support component; 73. Third support component. Detailed Implementation

[0053] As users' demand for home bandwidth continues to increase, the rate requirements for optical devices in Passive Optical Networks (PONs) have evolved from 1.25Gbps and 10Gbps to 50Gbps. To ensure low-cost deployment of optical devices in PON networks, these devices need to be compatible with 1.25G / 10G / 50G rates. Simultaneously, their performance requirements need to be continuously improved (evolving from Class C+ to Class D). This presents significant challenges to the miniaturization and packaging of optical devices, as they require the simultaneous placement of three sets of transceiver optical chips and corresponding passive components to ensure high optical and electrical performance.

[0054] For optical device packaging, the commonly used packaging processes currently include the following three types: Transistor Outline (TO) packaging based on a coaxial base; Box packaging using a square housing; and Chip On Board (COB) packaging, which places the chip directly onto the substrate. COB packaging is mainly for non-hermetic applications and cannot support the hermetic requirements of access network PON. Both TO and BOX packaging can meet the hermetic requirements of access network PON. However, for TO packaging, the size of the optical device increases significantly with the increase in the number of transceiver ports, making the package size of 50G PON optical devices relatively large. Compared with TO packaging, BOX packaging has an advantage in reducing package size.

[0055] In related technologies, BOX-packaged optical transceivers include: a BOX housing; a Transmitter Optical Sub-Assembly (TOSA), a Receiver Optical Sub-Assembly (ROSA), a multiplexing component, and a wavelength division multiplexing component housed inside the BOX housing; and an optical port disposed on the BOX housing. The TOSA, ROSA, multiplexing component, and wavelength division multiplexing component are arranged at intervals on the bottom wall of the BOX housing, and also at intervals on the upper and lower walls of the bottom wall. Furthermore, to prevent optoelectronic crosstalk between the transmitter and receiver, the transmitting and receiving ends need to be spaced a certain distance apart. This results in a relatively large package size in both length and width, making it difficult to meet the miniaturization requirements of optical transceivers. In particular, when the optical transceiver needs to be compatible with a larger number of rate schemes, its package size increases significantly.

[0056] To address the technical problems existing in related technologies, this disclosure provides an optical transceiver device 100, as shown in Figure 1. The optical transceiver device 100 includes: a BOX housing 1, an optical port 2, a ceramic connector 3, a transmitting optical unit 4, and a receiving optical unit 5. The optical port 2 and the ceramic connector 3 are respectively disposed on two side walls of the BOX housing 1 distributed along its length direction. The transmitting optical unit 4 and the receiving optical unit 5 are located inside the BOX housing 1 and are both electrically connected to the ceramic connector 3. Furthermore, the transmitting optical unit 4 and the optical port 2 cooperate to form a transmitting optical path 40, and the optical port 2 and the receiving optical unit 5 cooperate to form a receiving optical path 50.

[0057] The receiving optical unit 5 includes an optical path deflection component 53, as shown in Figure 2. The optical path deflection component 53 includes a first reflector 531 and a second reflector 532 arranged at intervals along the vertical direction. The first reflector 531 is used to reflect light incident in the horizontal direction so that it exits in the vertical direction. The second reflector 532 is used to reflect light from the first reflector 531 so that it exits in the horizontal direction, thereby making the transmitting optical path 40 and part of the receiving optical path 50 distributed at intervals along the vertical direction.

[0058] It should be noted that the structure of the BOX shell 1 involved in this embodiment can be seen in Figure 3. As shown in Figure 3, the BOX shell 1 is a rectangular box shape, which may include a shell portion with an opening and a cover plate. The cover plate is connected to the opening of the shell portion, making the BOX shell 1 a sealed container. The location of the cover plate can be considered as the top or upper part of the BOX shell 1. In addition, the BOX shell 1 is usually made of materials such as ceramics or metals.

[0059] In this embodiment of the disclosure, the "horizontal direction" refers to the extension direction of the plane defined by the length and width of the BOX shell 1 (i.e., the plane defined by the X coordinate direction and the Y coordinate direction in Figure 3, where the X coordinate direction represents the length direction and the Y coordinate direction represents the width direction), and the vertical direction refers to the height direction of the BOX shell 1 (i.e., the Z coordinate direction in Figure 3).

[0060] The optical transceiver 100 provided in this embodiment includes a first reflector 531 and a second reflector 532 spaced apart vertically in the optical path deflection component 53 of the receiving optical unit 5. The first reflector 531 reflects horizontally incident light, causing it to exit vertically to the second reflector 532. The second reflector 532 reflects vertically exiting light from the first reflector 531, causing it to exit horizontally. Thus, the transmitting optical path 40 and a portion of the receiving optical path 50 are spaced apart vertically, i.e., the transmitting optical path... The transmitting optical unit 40 and part of the receiving optical path 50 are separated in the height direction of the BOX housing 1. Correspondingly, by utilizing the height space of the BOX housing 1, an additional layout dimension for the components is added, allowing the transmitting optical unit 4 and part of the receiving optical unit 5 to be separated in the height direction of the BOX housing 1. Since they are arranged at different height planes, it not only facilitates the compact arrangement of the components in the transmitting optical unit 4 and the receiving optical unit 5 in the horizontal direction, realizing the miniaturization of the optical transceiver device 100, but also effectively avoids crosstalk between the transmitting optical path 40 and the receiving optical path 50. It can be seen that the optical transceiver device 100 provided in this embodiment of the present disclosure, by making reasonable use of the height space of the BOX housing 1, can achieve a small-size BOX package, meeting the requirements of current small form pluggable (SFP) devices for package size and device performance, and is suitable for applications in access network PON.

[0061] The related technology involves optical transceivers in which components are spaced apart within the same two-dimensional space, i.e., arranged along a plane defined by the length and width of the BOX housing. Consequently, the transmitting and receiving optical paths are also distributed within the same two-dimensional space; for example, the transmitting and receiving optical paths are spaced apart along the width direction of the BOX housing, and the optical elements involved in both paths are spaced apart along the length direction of the BOX housing. As the number of optical elements increases, it is necessary to increase the packaging size and width of the BOX housing in the length direction. Compared with related technologies, the optical transceiver 100 provided in this disclosure has a portion of its receiving optical path 50 and transmitting optical path 40 separated in the height direction of the BOX housing 1. In this way, the optical elements in the transmitting optical path 40 that are spaced apart along the length direction of the BOX housing 1 and the optical elements in the receiving optical path 50 that are spaced apart along the length direction of the BOX housing 1 can be arranged crosswise without causing signal crosstalk. As a result, the arrangement of the optical elements in the optical transceiver 100 in the length direction of the BOX housing 1 is more compact, effectively shortening the packaging size of the optical transceiver 100 in the length direction.

[0062] For example, as shown in Figure 2, the first reflector 531 has a 45° reflective surface, and the second reflector 532 also has a 45° reflective surface. The first reflector 531 and the second reflector 532 are arranged at intervals in the height direction of the BOX housing 1. In application, the first reflector 531 uses its 45° reflective surface to deflect the direction of light incident in the horizontal direction by 90°, so that it exits in the vertical direction and then enters the 45° reflective surface of the second reflector 532. The 45° reflective surface of the second reflector 532 deflects the direction of light incident in the vertical direction by 90°, so that it exits in the horizontal direction, thereby smoothly entering the light receiving component 51.

[0063] In this embodiment of the present disclosure, one of the first reflector 531 and the second reflector 532 is located above and the other is located below, both of which can achieve separation of the optical path in the height direction. For example, the first reflector 531 can be located on the bottom wall of the BOX housing 1, and the second reflector 532 can be located above the first reflector 531.

[0064] In some examples, as shown in Figure 1, the transmitting optical unit 4 includes a transmitting optical component 41 and a multiplexing component 42 sequentially distributed along the length of the BOX housing 1, with the transmitting optical component 41 arranged adjacent to the ceramic connector 3. The receiving optical unit 5 also includes a receiving optical component 51 and a wavelength division component 52. The optical path deflection component 53 further includes a third reflector 533. The receiving optical component 51, the wavelength division component 52, and the third reflector 533 are sequentially distributed along the length of the BOX housing 1, with the receiving optical component 51 arranged adjacent to the ceramic connector 3. The third reflector 533 and the second reflector 532 are sequentially distributed along the width of the BOX housing 1, and the second reflector 532 and the first reflector 531 are sequentially distributed along the height of the BOX housing 1. Furthermore, the first reflector 531, the transmitting optical unit 4, and the optical port 2 are disposed on the same height plane of the BOX housing 1 (e.g., all disposed on the bottom wall of the BOX housing 1).

[0065] It should be noted that although the transmitting optical component 41 and the receiving optical component 51 are arranged on different height planes of the BOX housing 1, both are arranged adjacent to the ceramic plug 3. It can be assumed that the transmitting optical component 41 and the receiving optical component 51 are arranged along the width direction of the BOX housing 1, and the multiplexing component 42 and the splitting component 52 are also arranged along the width direction of the BOX housing 1.

[0066] Referring to Figure 4, the transmitting optical path 40 is linearly distributed along the length of the BOX housing 1. The receiving optical path 50 has a path bend. The first reflector 531 from the optical port 2 to the path bend assembly 53 forms the first horizontal optical path segment 501 of the receiving optical path 50. The first reflector 531 and the second reflector 532 cooperate to form the vertical optical path segment 502 of the receiving optical path 50. The second reflector 532 and the third reflector 533 cooperate to form the second horizontal optical path segment 503 of the receiving optical path 50. The third reflector 533, the wavelength division assembly 52, and the receiving optical assembly 51 cooperate to form the third horizontal optical path segment 504 of the receiving optical path 50.

[0067] As can be seen, the second horizontal optical path segment 503 and the third horizontal optical path segment 504 are separated from the first horizontal optical path segment 501 and the transmitting optical path 40 at the height of the BOX housing 1, thereby realizing that the transmitting optical path 40 and part of the receiving optical path 50 are distributed at intervals in the vertical direction.

[0068] By further configuring the third reflector 533, the optical signal emitted by the second reflector 532 can be reflected and deflected in the same horizontal plane to ensure that the optical signal smoothly enters the wavelength division component 52. The received optical signal takes the optical port 2 of the first horizontal optical path segment 501 as the starting point of the transmission path, and passes through the vertical optical path segment 502, the second horizontal optical path segment 503 and the third horizontal optical path segment 504 in sequence, and is finally converted into an electrical signal and transmitted to the ceramic plug 3.

[0069] Based on the above, the transmitting optical component 41 and the receiving optical component 51 are spaced apart (i.e., separately arranged) in the height direction of the BOX housing 1, and the multiplexing component 42 and the demultiplexing component 52 are spaced apart in the height direction of the BOX housing 1. The receiving optical component 51 and the demultiplexing component 52 can be arranged above or below the transmitting optical component 41 and the multiplexing component 42, thereby achieving separation in the height direction of the BOX housing 1. Under the premise of preventing crosstalk between the transmitting optical path 40 and the receiving optical path 50, the components are arranged compactly along the length direction of the BOX housing 1.

[0070] Based on this, along the width direction of the BOX housing 1, the transmitting optical component 41 and the receiving optical component 51 at least partially overlap, and / or, the multiplexing component 42 and the demultiplexing component 52 at least partially overlap. Using the bottom or top wall of the BOX housing 1 as a reference horizontal plane, that is, the projections of the transmitting optical component 41 and the receiving optical component 51 on the reference horizontal plane at least partially coincide, and the projections of the multiplexing component 42 and the demultiplexing component 52 on the reference horizontal plane at least partially coincide. This overlapping area can be seen in the shaded area of ​​Figure 1.

[0071] Since the transmitting optical unit 4 and the receiving optical unit 5 are staggered in the height direction, the aforementioned overlapping design can be further implemented, which helps to reduce the space occupied by each component in the width direction of the BOX housing 1, thereby significantly reducing the package size of the optical transceiver device 100 in the width direction. In summary, the optical transceiver device 100 provided in this embodiment can effectively reduce both its length and width dimensions, achieving miniaturized packaging. At the same time, the optical transceiver device 100 has excellent performance and can be applied to multimode (e.g., trimode) access networks (PON).

[0072] Based on the aforementioned optical transceiver device 100 scheme, as shown in Figure 5, the multiplexing assembly 42 and the optical path deflection assembly 53 include a shared filter 61 and a shared lens 62. The shared filter 61, the shared lens 62, and the optical port 2 cooperate to form the common transceiver optical path portion of the transmitting optical path 40 and the receiving optical path 50. When used in the transmitting optical path 40, the shared filter 61 is used to transmit the transmitted light emitted from the multiplexing assembly 42 to the shared lens 62; when used in the receiving optical path 50, the shared filter 61 is used to reflect the received light emitted from the shared lens 62 to the first reflector 531. The shared filter 61, the shared lens 62, and the optical port 2 cooperate to form the common transceiver optical path portion of the transmitting optical path 40, and the optical port 2, the shared lens 62, and the shared filter 61 cooperate to form the common transceiver optical path portion of the receiving optical path 50.

[0073] The shared filter 61 can be an angled filter that transmits the transmitted light and reflects the received light. The transmitted light path 40 and the received light path 50 use the shared filter 61 for wavelength division.

[0074] When used in the transmitting optical path 40, the transmitted light emitted from the transmitting optical component 41 is transmitted through a shared filter 61 and converged by a shared lens 62 before entering the optical port 2, achieving horizontal straight-line emission from the transmitting optical path 40. When used in the receiving optical path 50, the light emitted from the optical port 2 is collimated by the shared lens 62 before being emitted. The emitted light is further reflected by the shared filter 61 to the first reflecting mirror 531, and then reflected by the first reflecting mirror 531 to the second reflecting mirror 532, achieving a change in direction for the receiving optical path 50.

[0075] By adjusting the rotation angle of the first reflector 531, the light incident horizontally, i.e., the light reflected by the shared filter 61, can be directed onto the 45° reflecting surface of the first reflector 531. By adjusting the rotation angle of the second reflector 532, its outgoing light can be directed horizontally out in the desired orientation.

[0076] Using the bottom or top wall of the BOX housing 1 as a reference horizontal plane, as shown in Figure 5, the projection of the shared lens 62 on the reference horizontal plane can be located between the projection of the second reflector 532 on the reference horizontal plane and the projection of the third reflector 533 on the reference horizontal plane, and the light receiving path will not be affected.

[0077] In related technologies, since the receiving optical path and the transmitting optical path are arranged in the same two-dimensional space, when the same lens and the same filter are used, the shared lens must be far away from the receiving optical path in the length direction of the BOX housing. That is, the distance between the shared lens and the shared filter is large in order to allow the receiving optical path to pass through without interference, which results in a large package size of the optical transceiver in the length direction.

[0078] In this embodiment, by positioning the projection of the shared lens 62 onto the reference horizontal plane between the projections of the second reflector 532 and the third reflector 533 onto the reference horizontal plane, the shared lens 62 makes reasonable use of the space along the length of the BOX housing 1 and does not interfere with the second horizontal optical path segment 503. Under the premise of allowing the receiving optical path 50 to pass through without interference, the spacing between the shared filter 61 and the shared lens 62 is reduced compared to related technologies, achieving a compact arrangement of each component along the length of the BOX housing 1, thereby effectively shortening the packaging size of the optical transceiver device 100 in the length direction.

[0079] In this embodiment, the second horizontal optical path segment 503 can be located above the transmitting optical path 40 and the first horizontal optical path segment 501 (see Figure 2), or it can be located below the transmitting optical path 40 and the first horizontal optical path segment 501 in the vertical direction (not shown in the figure). The above-mentioned solutions can be achieved by adjusting the mirror angle of the first reflector 531.

[0080] As shown in Figure 6, the optical transceiver device 100 also includes a support member 7 fixed inside the BOX housing 1, and the transmitting optical unit 4 and the receiving optical unit 5 are supported by the support members 7 of different heights.

[0081] The transmitting optical unit 4 and the receiving optical unit 5 can be supported by support members 7 of different heights. By adaptively designing the height of their respective support members 7, the height requirements of the transmitting optical unit 4 and the receiving optical unit 5 can be achieved.

[0082] Taking the example where part of the receiving optical path 50 is located above the transmitting optical path 40, a taller support member 7 can be used to support the second reflector 532 and the third reflector 533 in the receiving optical assembly 51, the wavelength division multiplexing assembly 52, and the optical path reversing assembly 53. This allows the receiving optical assembly 51 and the wavelength division multiplexing assembly 52 to be separated from the transmitting optical assembly 41 and the wavelength multiplexing assembly 42 at the height of the BOX housing 1, and allows the receiving optical assembly 51 and the wavelength division multiplexing assembly 52 to at least partially overlap with the transmitting optical assembly 41 and the wavelength multiplexing assembly 42 in the width direction of the BOX housing 1. For example, the support member 7 can be in the form of a boss.

[0083] In some examples, as shown in Figure 6, the receiving optical component 51 and the wavelength division component 52 are supported by the first support member 71, which is made of metal. Thus, while providing support, the transmitting optical unit 4 and the receiving optical unit 5 can also be photoelectrically shielded to prevent photoelectric signal crosstalk between the transmitting optical unit 4 and the receiving optical unit 5 in a small space.

[0084] In other examples, as shown in Figure 7, the surface of the first reflector 531 facing the second reflector 532 is fixedly connected to the second support member 72, and the surface of the second reflector 532 facing the first reflector 531 is fixedly connected to the third support member 73. The second support member 72 and the third support member 73 abut against each other, for example, by adhesive bonding. This allows the first reflector 531 and the second reflector 532 to form an easy-to-place reflector assembly, simplifying assembly.

[0085] The second support member 72 and the third support member 73 are, for example, transparent optical materials, which allow light signals to pass smoothly in a straight line without light signal deflection or light loss.

[0086] For the third reflector 533 in the optical path deflection assembly 53, its support 7 can also be made of the same transparent optical material as the second support 72 and the third support 73.

[0087] For any of the aforementioned optical transceiver devices 100, the transmitting optical component 41 is configured to transmit multiple signals with different wavelengths (e.g., 2, 3, or more), and the multiplexer component 42 is used to combine the optical transmission signals from the multiple transmitting optical components 41 and output them to the optical port 2; the receiving optical component 51 is configured to receive multiple signals with different wavelengths (e.g., 2, 3, or more), and the wavelength divider component 52 is used to receive and separate the optical reception signals from the optical port 2, and output the separated multiple optical reception signals to the corresponding receiving optical components 51 respectively. Thus, the optical transceiver device 100 not only meets the application requirements of multimode PON, but also takes into account a smaller package size.

[0088] For example, the optical transceiver 100 provided in this embodiment of the present disclosure is compatible with transmission rates of 1.25Gbps, 10Gbps and 50Gbps at the same time. Accordingly, the transmitting optical component 41 is configured to have three different transmitting wavelengths, and the receiving optical component 51 is configured to have three different receiving wavelengths.

[0089] For any of the aforementioned optical transceiver devices 100, the optical port 2 and the ceramic connector 3 are respectively arranged on two side walls distributed along the length direction of the BOX housing 1, and the ceramic connector 3 sealably penetrates the corresponding side wall of the BOX housing 1. The portion of the ceramic connector 3 located inside the BOX housing 1 has multiple gold fingers to facilitate electrical connection with the transmitting optical unit 4 and the receiving optical unit 5. The portion of the ceramic connector 3 located outside the BOX housing 1 also has multiple gold fingers to facilitate electrical connection with external devices (e.g., circuit boards). The electrical connection between the ceramic connector 3 and the aforementioned components can be achieved by wire bonding, offering advantages of high density and high bandwidth.

[0090] Based on the arrangement of any of the optical transceivers 100 mentioned above, the following examples of some optical transceivers will be used to further illustrate their structural arrangement and advantages.

[0091] Example 1

[0092] Example 1 provides an optical transceiver device 100, as shown in Figures 8 and 9. Its transmitting optical component 41 includes an optical chip 411 for electro-optical conversion and a first lens 412. The optical chip 411 for electro-optical conversion is electrically connected to a ceramic connector 3. The multiplexing component 42 further includes a multiplexer 421. The optical chip 411 for electro-optical conversion, the first lens 412, the multiplexer 421, the shared filter 61, the shared lens 62, and the optical port 2 are arranged sequentially at intervals along the transmitting optical path 40.

[0093] The optical chip 411 for electro-optical conversion converts electrical signals into optical signals. It can be a laser or laser diode with modulation capabilities, such as a direct modulation laser (DML) or an external modulation laser (EML). The optical chip 411 is electrically connected to the ceramic connector 3 to receive electrical signals transmitted by the ceramic connector 3 and convert them into optical signals. The multiplexer 421 combines optical signals of multiple wavelengths into a single composite signal for multiplexing.

[0094] The receiving optical component 51 includes an optical chip 511 for photoelectric conversion and a transimpedance amplifier 512. The optical chip 511 for photoelectric conversion is electrically connected to the transimpedance amplifier 512, and the transimpedance amplifier 512 is also electrically connected to the ceramic connector 3. The wavelength division component 52 includes a wavelength division converter 521. The optical path deflection component 53 includes a first reflector 531, a second reflector 532, and a third reflector 533. The optical port 2, the shared lens 62, the shared filter 61, the first reflector 531, the second reflector 532, the third reflector 533, the wavelength division converter 521, the optical chip 511 for photoelectric conversion, and the transimpedance amplifier 512 are arranged sequentially and at intervals along the receiving optical path 50.

[0095] Among them, the optical port 2, the shared lens 62, the shared filter 61, and the first reflector 531 cooperate to form the first horizontal optical path segment 501, the first reflector 531 and the second reflector 532 cooperate to form the vertical optical path segment 502, the second reflector 532 and the third reflector 533 cooperate to form the second horizontal optical path segment 503, and the third reflector 533, the demultiplexer 521, the optical chip 511 for photoelectric conversion, and the transimpedance amplifier 512 cooperate to form the third horizontal optical path segment 504.

[0096] The optical chip 511 for photoelectric conversion converts optical signals into electrical signals. For example, it can be a photodetector, photodiode, etc. The optical chip 511 is electrically connected to a transimpedance amplifier 512, which is also electrically connected to a ceramic connector 3. Thus, the electrical signal transmitted by the optical chip 511 is amplified by the transimpedance amplifier 512 and then transmitted to the ceramic connector 3. The wavelength divider 521 is used to separate the composite signal containing optical signals of different wavelengths to obtain individual optical signals of different wavelengths.

[0097] For Example 1, Figures 8 and 9 illustrate the three-mode optical transceiver device 100, and its working principle is as follows:

[0098] For signal transmission on the optical path 40, the electrical signal is transmitted via the ceramic connector 3 to three optical chips 411 for electro-optical conversion. After electro-optical conversion, the three emitted optical signals are collimated by the first lens 412 and then enter the combiner 421 to form a composite optical signal. The composite optical signal enters a shared filter 61, which allows the optical signal emitted by the optical chips 411 to pass directly through. Thus, the composite optical signal is transmitted through the shared filter 61 and then enters a shared lens 62. After being converged by the shared lens 62, it enters the optical port 2 and is finally coupled to the optical fiber 200 connected to the optical port 2 for transmission.

[0099] For signal transmission on the receiving optical path 50, the optical signal at the receiving end enters through the optical fiber 200 and then through the optical port 2 into the shared lens 62. After being collimated by the shared lens 62, it enters the shared filter 61. The shared filter 61 reflects the optical signal at the receiving end. Specifically, the shared filter 61 reflects the optical signal at the receiving end to the first reflector 531. The first reflector 531 converts the horizontally incident optical signal into a vertically incident signal and sends it to the second reflector 532. The second reflector 532 converts the vertically incident optical signal into a horizontally incident signal. Finally, the outgoing optical signal is reflected again by the third reflector 533 to change the incident angle in the horizontal direction, allowing it to smoothly enter the demultiplexer 521 for wavelength division processing, obtaining three separated optical signals. The three optical signals enter their respective corresponding optical chips 511 for photoelectric conversion, completing the photoelectric conversion and forming three electrical signals. These signals are then amplified sequentially by their corresponding transimpedance amplifiers 512, and the amplified electrical signals are input to the ceramic connector 3.

[0100] As can be seen, for the optical transceiver device 100 described in Example 1, based on the first reflector 531 and the second reflector 532, the transmitting optical path 40 and part of the receiving optical path 50 are separated in the height direction of the BOX housing 1, thereby allowing the transmitting optical path 40 and the receiving optical path 50 to overlap in the horizontal direction without causing crosstalk to the transmission of each optical signal.

[0101] For the optical transceiver device 100 involved in Example 1, the components in its transmitting optical unit 4 are spaced apart along the length direction of the BOX housing 1. The receiving optical component 51, the demultiplexer 521, and the third reflector 533 in its receiving optical unit 5 are spaced apart along the length direction of the BOX housing 1. The third reflector 533 and the second reflector 532 are spaced apart along the width direction of the BOX housing 1. The second reflector 532 and the first reflector 531 are spaced apart along the height direction of the BOX housing 1. The connection between the first reflector 531 and the shared filter 61 is arranged at an angle relative to both the width and length directions of the BOX housing 1.

[0102] Since the transmitting optical component 41 in the transmitting optical unit 4 and the receiving optical component 51 in the receiving optical unit 5 of the optical transceiver device 100 are distributed along the width direction of the BOX housing 1, the transmitting optical component 41 is located below the receiving optical component 51 and the two may partially overlap in the width direction of the BOX housing 1 (of course, they may not overlap; to clearly show their orientation, Figures 8 and 9 show the non-overlapping arrangement). The multiplexer 421 and the demultiplexer 521 are distributed along the width direction of the BOX housing 1, with the multiplexer 421 located below the demultiplexer 521 and the two partially overlapping in the width direction of the BOX housing 1 (see Figure 8).

[0103] As can be seen, the transmitting optical unit 4 and the receiving optical unit 5 of the optical transceiver 100 are located on different horizontal planes, thus allowing the optical elements in the transmitting optical unit 4 and the receiving optical unit 5 to overlap in the horizontal direction without causing interference. Therefore, while ensuring the excellent performance of the optical transceiver 100, its package size in both the length and width directions is effectively reduced. As shown in Figure 8, the projection of the shared lens 62 on the horizontal plane is located between the projections of the second reflector 532 and the third reflector 533 on the horizontal plane. This compact arrangement helps to reduce the package size of the BOX housing 1 in the length direction.

[0104] Based on the optical transceiver device 100 described in Example 1, further as shown in Figures 10 and 11, the transmitting optical component 41 further includes: an isolator 413, an optical chip 411 for electro-optical conversion, a first lens 412, an isolator 413, a multiplexer 421, a shared filter 61, a shared lens 62, and an optical port 2 arranged sequentially at intervals along the transmitting optical path 40. And / or, the receiving optical component 51 further includes a deflector prism 513, and the wavelength division multiplexing component 52 further includes a bandpass filter 522, with the optical port 2, the shared lens 62, the shared filter 61, a first reflector 531, a second reflector 532, a third reflector 533, a wavelength division multiplexing component 521, a bandpass filter 522, a deflector prism 513, an optical chip 511 for photoelectric conversion, and a transimpedance amplifier 512 arranged sequentially at intervals along the receiving optical path 50.

[0105] Isolator 413 is disposed between the first lens 412 and the combiner 421, and can eliminate part of the optical signal returning to the first lens 412 and the optical chip 411 used for electro-optical conversion, ensuring excellent light output quality of the optical chip 411 used for electro-optical conversion. Of course, isolator 413 is an optional solution. If the optical chip 411 used for electro-optical conversion has excellent anti-reflection performance, isolator 413 can be omitted.

[0106] The optical chip 511 used for photoelectric conversion is usually in the form of surface incidence, with its incident surface usually facing the top wall of the BOX housing 1. By setting a deflection prism 513, the angle of the emitted light is changed to ensure that the light signal is deflected from the horizontal direction to vertical downward incidence, so that the light signal is vertically incident on the optical chip 511 used for photoelectric conversion.

[0107] The bandpass filter 522 is used to improve the isolation between optical signals to prevent mutual interference. Of course, the bandpass filter 522 is optional; if the isolation requirement between the received optical signals is not high, or if the demultiplexer 521 can provide sufficiently high signal isolation, the bandpass filter 522 may not be used. In some examples, the bandpass filter 522 is a narrowband bandpass filter.

[0108] In this implementation scheme, the three optical signals obtained by the demultiplexer 521 enter their respective bandpass filters 522 for isolation, and after being directionally deflected by the deflection prism 513, they are vertically incident on the optical chip 511 used for photoelectric conversion.

[0109] Example 2

[0110] Example 2 provides an optical transceiver device 100, as shown in Figure 12. The transmitting optical component 41 includes an optical chip 411 for electro-optical conversion and a first lens 412. The optical chip 411 for electro-optical conversion is electrically connected to a ceramic connector 3. The multiplexing component 42 also includes a multiplexing filter chip 422 and a second lens 423. The optical chip 411 for electro-optical conversion, the first lens 412, the multiplexing filter chip 422, the second lens 423, the common filter 61, the common lens 62, and the optical port 2 are arranged sequentially at intervals along the transmitting optical path 40.

[0111] The transmitting optical component 41 involved in Example 2 can be referred to the transmitting optical component 41 involved in Example 1, and will not be described again here. Unlike the multiplexer 421 used in Example 1, Example 2 uses a multiplexing filter chip 422, that is, the multiplexing filter is integrated and arranged on a chip, in chip form. The multiplexing filter chip 422 includes optical waveguides (also known as optical port units) required for coupling multiple transmitting optical signals and filters for combining multiple transmitting optical signals. Compared with the traditional spatial optical filtering element multiplexer 421, the multiplexing filter chip 422 is smaller in size, which is beneficial for further reducing the package size of the optical transceiver device 100 and improving its integration.

[0112] The receiving optical component 51 includes an optical chip 511 for photoelectric conversion and a transimpedance amplifier 512. The optical chip 511 for photoelectric conversion is electrically connected to the transimpedance amplifier 512, and the transimpedance amplifier 512 is also electrically connected to the ceramic connector 3. The wavelength division component 52 includes a third lens 523 and a wavelength division filter chip 524. The optical port 2, the shared lens 62, the shared filter 61, the first reflector 531, the second reflector 532, the third reflector 533, the third lens 523, the wavelength division filter chip 524, the optical chip 511 for photoelectric conversion, and the transimpedance amplifier 512 are arranged sequentially at intervals along the receiving optical path 50. The optical port 2, the shared lens 62, the shared filter 61, and the first reflector 531 together form the first horizontal optical path segment 501. The first reflector 531 and the second reflector 532 together form the vertical optical path segment 502. The second reflector 532 and the third reflector 533 together form the second horizontal optical path segment 503. The third reflector 533, the third lens 523, the wavelength division filter chip 524, the optical chip 511 for photoelectric conversion, and the transimpedance amplifier 512 together form the third horizontal optical path segment 504.

[0113] The receiving optical component 51 involved in Example 2 can be referred to the receiving optical component 51 involved in Example 1, and will not be described again here. Unlike the wavelength divider 521 used in Example 1, Example 2 uses a wavelength division multiplexing filter chip 524, that is, the wavelength division multiplexing filter is integrated and arranged on a chip, in chip form. The wavelength division multiplexing filter chip 524 includes optical waveguides required for coupling multiple receiving optical signals, and filters for separating multiple received optical signals. Compared with the traditional spatial optical filtering element wavelength divider 521, the wavelength division multiplexing filter chip 524 is smaller in size, which is beneficial for further reducing the package size of the optical transceiver device 100 and improving its integration. The wavelength division multiplexing filter chip 524 can be directly coupled to the optical chip 511 used for photoelectric conversion, or it can be coupled by placing a lens between the two. Figure 12 only illustrates the direct coupling scheme.

[0114] For Example 2, Figure 12 illustrates a three-mode optical transceiver device 100, the working principle of which is as follows:

[0115] For signal transmission on the optical transmission path 40, the electrical signal is transmitted via the ceramic connector 3 to three optical chips 411 for electro-optical conversion. After electro-optical conversion, the three emitted optical signals are collimated by the first lens 412 and then enter the combining filter chip 422 to form a composite optical signal. The composite optical signal enters a shared filter 61, which allows the optical signal emitted by the optical chips 411 to pass directly through. Thus, the composite optical signal is transmitted through the shared filter 61 and then enters a shared lens 62. After being converged by the shared lens 62, it enters the optical port 2 and is finally coupled to the optical fiber 200 connected to the optical port 2 for transmission.

[0116] For signal transmission on the receiving optical path 50, the optical signal at the receiving end enters through the optical fiber 200 and then through the optical port 2 into the shared lens 62. After being collimated by the shared lens 62, it enters the shared filter 61. The shared filter 61 reflects the optical signal at the receiving end. Specifically, the shared filter 61 reflects the optical signal at the receiving end to the first reflector 531. The first reflector 531 converts the horizontally incident optical signal into a vertically incident signal and sends it to the second reflector 532. The second reflector 532 converts the vertically incident optical signal into a horizontally incident signal. Finally, the outgoing optical signal is reflected again by the third reflector 533 to change the incident angle in the horizontal direction, allowing it to smoothly enter the third lens 523. After collimation, it enters the wavelength division filter chip 524 for wavelength division processing to obtain three separated optical signals. The three optical signals enter their respective corresponding optical chips 511 for photoelectric conversion to complete photoelectric conversion, forming three electrical signals, which are then amplified sequentially by their corresponding transimpedance amplifiers 512. The amplified electrical signals are then input to the ceramic connector 3.

[0117] Based on the optical transceiver device 100 described in Example 2, further as shown in Figure 13, the transmitting optical component 41 further includes an isolator 413 and a fourth lens 414, wherein the optical chip 411 for electro-optic conversion, the first lens 412, the isolator 413, the fourth lens 414, the multiplexing filter chip 422, the second lens 423, the shared filter 61, the shared lens 62, and the optical port 2 are arranged sequentially at intervals along the transmitting optical path 40. And / or, the receiving optical component 51 further includes a deflection prism 513, and the wavelength division component 52 further includes a bandpass filter 522, wherein the optical port 2, the shared lens 62, the shared filter 61, the first reflector 531, the second reflector 532, the third transmitting mirror 533, the third lens 523, the wavelength division filter chip 524, the bandpass filter 522, the deflection prism 513, the optical chip 511 for photoelectric conversion, and the transimpedance amplifier 512 are arranged sequentially at intervals along the receiving optical path 50.

[0118] The arrangement and function of the isolator 413, bandpass filter 522, and deflection prism 513 can be found in Example 1, and will not be repeated here. Furthermore, when using the multiplexer chip 422, the isolator 413 needs to be used in conjunction with the fourth lens 414 to collimate the beam.

[0119] In addition, the orientation arrangement of the components in the optical transceiver device 100 involved in Example 2, namely the transmitting optical unit 4 and the receiving optical unit 5, can be found in Example 1.

[0120] Example 3

[0121] Example 3 provides an optical transceiver device 100, as shown in Figure 14. The transmitting optical component 41 includes an optical chip 411 for electro-optical conversion and a first lens 412. The optical chip 411 for electro-optical conversion is electrically connected to a ceramic connector 3. The multiplexing component 42 also includes a multiplexing filter chip 422 and a second lens 423. The optical chip 411 for electro-optical conversion, the first lens 412, the multiplexing filter chip 422, the second lens 423, the common filter 61, the common lens 62, and the optical port 2 are arranged sequentially at intervals along the transmitting optical path 40.

[0122] The transmitting optical component 41 involved in Example 3 can be referred to the transmitting optical component 41 involved in Example 1, and will not be described again here. The multiplexing filter chip 422 involved in Example 3 can be referred to Example 2, and will not be described again here. Compared with the traditional space optical filtering element multiplexer 421, the multiplexing filter chip 422 is smaller in size, which is beneficial to further reduce the package size of the optical transceiver device 100 and improve its integration.

[0123] The receiving optical component 51 includes a transimpedance amplifier 512, which is electrically connected to the ceramic connector 3. The wavelength division component 52 also includes a third lens 523 and a first integrated chip 525. The optical port 2, the shared lens 62, the shared filter 61, the first reflector 531, the second reflector 532, the third transmitting mirror 533, the third lens 523, the first integrated chip 525, and the transimpedance amplifier 512 are arranged sequentially at intervals along the receiving optical path 50. The first integrated chip 525 includes a wavelength division filter chip and a photodetector chip coupled together, and the photodetector chip is electrically connected to the transimpedance amplifier 512.

[0124] Among them, the optical port 2, the shared lens 62, the shared filter 61, and the first reflector 531 cooperate to form the first horizontal optical path segment 501, the first reflector 531 and the second reflector 532 cooperate to form the vertical optical path segment 502, the second reflector 532 and the third reflector 533 cooperate to form the second horizontal optical path segment 503, and the third reflector 533, the third lens 523, the first integrated chip 525, and the optical chip 511 for photoelectric conversion cooperate to form the third horizontal optical path segment 504.

[0125] The wavelength division multiplexing (WDM) component 52 in Example 3 employs a first integrated chip 525, which includes a WDM filter chip and a photodetector chip, enabling the first integrated chip 525 to perform both WDM and photoelectric conversion functions. Compared to Example 2, which uses a separate optical chip 511 for photoelectric conversion and a WDM filter chip 524, the inclusion of the first integrated chip 525 helps to further reduce the package size of the optical transceiver device 100 and improve its integration density.

[0126] For Example 3, Figure 14 illustrates a three-mode optical transceiver device 100, whose working principle is as follows:

[0127] For signal transmission on the optical transmission path 40, the electrical signal is transmitted via the ceramic connector 3 to three optical chips 411 for electro-optical conversion. After electro-optical conversion, the three emitted optical signals are collimated by the first lens 412 and then enter the combining filter chip 422 to form a composite optical signal. The composite optical signal enters a shared filter 61, which allows the optical signal emitted by the optical chips 411 to pass directly through. Thus, the composite optical signal is transmitted through the shared filter 61 and then enters a shared lens 62. After being converged by the shared lens 62, it enters the optical port 2 and is finally coupled to the optical fiber 200 connected to the optical port 2 for transmission.

[0128] For signal transmission on the receiving optical path 50, the optical signal at the receiving end enters through the optical fiber 200 and then enters the shared lens 62 through the optical port 2. After being collimated by the shared lens 62, it enters the shared filter 61. The shared filter 61 reflects the optical signal at the receiving end. Specifically, the shared filter 61 reflects the optical signal at the receiving end to the first reflector 531. The first reflector 531 converts the horizontally incident optical signal into a vertically incident signal and sends it to the second reflector 532. The second reflector 532 converts the vertically incident optical signal into a horizontally incident signal. Finally, the outgoing optical signal is reflected again by the third reflector 533 to change the incident angle in the horizontal direction, so that it can smoothly enter the first integrated chip 525. The wavelength division filtering chip in the first integrated chip 525 performs wavelength division processing on the composite optical signal, and then inputs it to its photodetector chip for photoelectric conversion. The resulting three electrical signals are then amplified sequentially by the corresponding transimpedance amplifiers 512. The amplified electrical signals are then input to the ceramic connector 3.

[0129] Based on the optical transceiver device 100 described in Example 3, further as shown in Figure 15, the transmitting optical component 41 also includes: an isolator 413 and a fourth lens 414. The optical chip 411 for electro-optical conversion, the first lens 412, the isolator 413, the fourth lens 414, the multiplexing filter chip 422, the second lens 423, the shared filter 61, the shared lens 62, and the optical port 2 are arranged sequentially and at intervals along the transmitting optical path 40. The arrangement and function of the isolator 413 can be found in Example 1, and will not be repeated here.

[0130] In addition, the orientation arrangement of the components in the optical transceiver device 100 involved in Example 3, namely the transmitting optical unit 4 and the receiving optical unit 5, can be seen in Example 1.

[0131] Example 4

[0132] Example 4 provides an optical transceiver device 100, as shown in Figure 16. The transmitting optical component 41 includes a continuous light source 415 and a first lens 412, wherein the continuous light source 415 is electrically connected to a ceramic connector 3. The multiplexing component 42 further includes a second lens 423 and a second integrated chip 424, wherein the continuous light source 415, the first lens 412, the second integrated chip 424, the second lens 423, a common filter 61, a common lens 62, and an optical port 2 are arranged sequentially at intervals along the transmitting optical path 40. The second integrated chip 424 includes a coupled multiplexing filter chip and an electro-optic modulation chip to enable the transmission of optical signals between them. The electro-optic modulation chip is also electrically connected to the ceramic connector 3. The second integrated chip 424 includes an optical waveguide required for coupling multiple transmitting optical signals, a multiplexing filter chip for combining multiple transmitted optical signals, and an electro-optic modulation chip for modulating multiple transmitted optical signals.

[0133] The multiplexing component 42 in Example 4 employs a second integrated chip 424, which includes a multiplexing filter chip and an electro-optic modulation chip, enabling the second integrated chip 424 to perform both multiplexing and electro-optic conversion functions. Compared to Example 3, which uses a separate optical chip 411 for electro-optic conversion and a multiplexing filter chip 422, the inclusion of the second integrated chip 424 helps to further reduce the package size of the optical transceiver 100 and improve its integration density.

[0134] The receiving optical component 51 includes a transimpedance amplifier 512, which is electrically connected to the ceramic connector 3. The wavelength division component 52 also includes a third lens 523 and a first integrated chip 525. The optical port 2, a shared lens 62, a shared filter 61, a first reflector 531, a second reflector 532, a third reflector 533, a third lens 523, a first integrated chip 525, and a transimpedance amplifier 512 are arranged sequentially at intervals along the receiving optical path 50. The first integrated chip 525 includes a coupled wavelength division filter chip and a photodetector chip to enable the transmission of optical signals between the two. The photodetector chip is also electrically connected to the transimpedance amplifier 512.

[0135] Optical port 2, shared lens 62, shared filter 61, and first reflector 531 together constitute the first horizontal optical path segment 501. First reflector 531 and second reflector 532 together constitute the vertical optical path segment 502. Second reflector 532 and third reflector 533 together constitute the second horizontal optical path segment 503. Third reflector 533, third lens 523, first integrated chip 525, and optical chip 511 for photoelectric conversion together constitute the third horizontal optical path segment 504. The wavelength division multiplexing component 52 involved in Example 4 can be found in the wavelength division multiplexing component 52 involved in Example 3, and will not be described again here.

[0136] For Example 4, Figure 16 illustrates a three-mode optical transceiver device 100, whose working principle is as follows:

[0137] For signal transmission on the optical path 40, the control electrical signal is transmitted via the ceramic connector 3 to three continuous light sources 415, causing them to emit continuous light. The three continuous light sources are collimated by the first lens 412 and then enter the second integrated chip 424. Specifically, the electro-optic modulation chip of the second integrated chip 424 performs photoelectric conversion on the continuous light sources to form an electrical signal. The electrical signal is then combined by a multiplexing filter chip to form a composite optical signal. The composite optical signal enters a shared filter 61, and after transmission through the shared filter 61, it enters a shared lens 62. After being converged by the shared lens 62, it enters the optical port 2 and is finally coupled to the optical fiber 200 connected to the optical port 2 for transmission.

[0138] For signal transmission on the receiving optical path 50, the optical signal at the receiving end enters through the optical fiber 200 and then enters the shared lens 62 through the optical port 2. After being collimated by the shared lens 62, it enters the shared filter 61. The shared filter 61 reflects the optical signal at the receiving end. Specifically, the shared filter 61 reflects the optical signal at the receiving end to the first reflector 531. The first reflector 531 converts the horizontally incident optical signal into a vertically incident signal and sends it to the second reflector 532. The second reflector 532 converts the vertically incident optical signal into a horizontally incident signal. Finally, the outgoing optical signal is reflected again by the third reflector 533 to change the incident angle in the horizontal direction, so that it can smoothly enter the third lens 523 for collimation and then enter the first integrated chip 525. The wavelength division filtering chip in the first integrated chip 525 performs wavelength division processing on the composite optical signal, and then inputs it to its photodetector chip for photoelectric conversion. The resulting three electrical signals are then amplified sequentially by the corresponding transimpedance amplifier 512. The amplified electrical signals are then input to the ceramic plug 3.

[0139] Based on the optical transceiver device 100 described in Example 4, and further as shown in Figure 17, the transmitting optical component 41 also includes: an isolator 413 and a fourth lens 414. The optical chip 411 for electro-optical conversion, the first lens 412, the isolator 413, the fourth lens 414, the multiplexing filter chip 422, the second lens 423, the shared filter 61, the shared lens 62, and the optical port 2 are arranged sequentially and at intervals along the transmitting optical path 40. The arrangement and function of the isolator 413 can be found in Example 1, and will not be repeated here.

[0140] In addition, the orientation arrangement of the components in the optical transceiver device 100 involved in Example 4 and the optical receiving unit 5 can be seen in Example 1.

[0141] In summary, the optical transceiver 100 provided in this embodiment of the present disclosure, by setting its transmitting optical path 40 and part of its receiving optical path 50 at different height positions in the BOX housing 1 and partially overlapping or intersecting them in the horizontal direction, achieves the stacking and multiplexing of the transmitting and receiving optical paths. Thus, the optical elements of the transmitting and receiving ends are separated in the height direction and partially overlapped in the horizontal direction, effectively reducing the packaging size of the optical transceiver 100 in both the length and width directions, meeting the design requirements of small-size optical modules, and achieving a high-density layout.

[0142] On the other hand, this disclosure also provides an optical module, as shown in Figure 18, which includes at least one pair of any of the aforementioned optical transceivers 100 and optical fibers 200, with the end of each optical fiber 200 connected to the optical port 2 of each pair of optical transceivers 100.

[0143] The optical module provided in this embodiment has all the advantages of the optical transceiver device 100 mentioned above, and will not be repeated here.

[0144] The above description is only for the purpose of enabling those skilled in the art to understand the technical solutions disclosed herein, and is not intended to limit the scope of this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. An optical transceiver device, wherein, The optical transceiver device (100) includes: a BOX housing (1), an optical port (2), a ceramic connector (3), a transmitting optical unit (4), and a receiving optical unit (5); The optical port (2) and the ceramic plug (3) are respectively disposed on two side walls of the BOX housing (1) along its length direction. The transmitting optical unit (4) and the receiving optical unit (5) are located inside the BOX housing (1) and are both electrically connected to the ceramic plug (3). The transmitting optical unit (4) and the optical port (2) cooperate to form a transmitting optical path (40), and the optical port (2) and the receiving optical unit (5) cooperate to form a receiving optical path (50). The receiving optical unit (5) includes an optical path reversing component (53), which includes a first reflector (531) and a second reflector (532) spaced apart along the vertical direction. The first reflector (531) is used to reflect light incident along the horizontal direction so that it exits along the vertical direction. The second reflector (532) is used to reflect light from the first reflector (531) so that it exits along the horizontal direction, thereby making the transmitting optical path (40) and part of the receiving optical path (50) spaced apart along the vertical direction. Wherein, the horizontal direction is the extension direction of the plane defined by the length and width of the BOX shell (1), and the vertical direction is the height direction of the BOX shell (1).

2. The optical transceiver device according to claim 1, wherein, The optical transmission unit (4) includes an optical transmission component (41) and a multiplexing component (42) arranged sequentially along the length of the BOX housing (1), and the optical transmission component (41) is arranged adjacent to the ceramic plug (3). The receiving optical unit (5) further includes a receiving optical component (51) and a wavelength division component (52). The optical path deflection component 53 further includes a third reflector (533). The receiving optical component (51), the wavelength division component (52), and the third reflector (533) are distributed sequentially along the length of the BOX housing (1). The receiving optical component (51) is arranged adjacent to the ceramic plug (3). The third reflector (533) and the second reflector (532) are distributed sequentially along the width of the BOX housing (1). The second reflector (532) and the first reflector (531) are distributed sequentially along the height of the BOX housing (1). The first reflector (531) is disposed at the same height plane as the light transmitting unit (4) and the light port (2) of the BOX housing (1).

3. The optical transceiver device according to claim 2, wherein, Along the width direction of the BOX housing (1), the transmitting optical component (41) and the receiving optical component (51) overlap at least partially, and / or the multiplexing component (42) and the splitting component (52) overlap at least partially.

4. The optical transceiver device according to claim 2, wherein, The wave combiner (42) and the optical path deflection assembly (53) include a common filter (61) and a common lens (62). The common filter (61), the common lens (62), and the optical port (2) cooperate to form the common optical path for transmitting and receiving of the transmitting optical path (40) and the receiving optical path (50). When used in the transmitting optical path (40), the common filter (61) is used to transmit the transmitting light emitted by the multiplexing assembly (42) to the common lens (62). When used in the receiving optical path (50), the common filter (61) is used to reflect the received light emitted from the common lens (62) back to the first reflector (531).

5. The optical transceiver device according to claim 4, wherein, Using the bottom or top wall of the BOX housing (1) as a reference horizontal plane, the projection of the common lens (62) on the reference horizontal plane is located between the projection of the second reflector (532) on the reference horizontal plane and the projection of the third reflector (533) on the reference horizontal plane.

6. The optical transceiver device according to claim 2, wherein, The optical transceiver device (100) further includes a support member (7) fixed inside the BOX housing (1), and the transmitting optical unit (4) and the receiving optical unit (5) are supported by the support member (7) of different heights.

7. The optical transceiver device according to claim 6, wherein, The receiving optical component (51) and the wavelength division component (52) are supported by a first support member (71), and the first support member (71) is made of metal.

8. The optical transceiver device according to claim 6, wherein, A second support member (72) is fixedly connected to the surface of the first reflector (531) facing the second reflector (532), and a third support member (73) is fixedly connected to the surface of the second reflector (532) facing the first reflector (531), and the second support member (72) abuts against the third support member (73).

9. The optical transceiver device according to claim 4, wherein, The transmitting optical component (41) includes an optical chip (411) for electro-optic conversion and a first lens (412). The optical chip (411) for electro-optic conversion is electrically connected to the ceramic plug (3). The multiplexing component (42) further includes a multiplexer (421). The optical chip (411) for electro-optic conversion, the first lens (412), the multiplexer (421), the shared filter (61), the shared lens (62), and the optical port (2) are arranged sequentially at intervals along the transmitting optical path (40). The receiving optical component (51) includes: an optical chip (511) for photoelectric conversion and a transimpedance amplifier (512), wherein the optical chip (511) for photoelectric conversion is electrically connected to the transimpedance amplifier (512), and the transimpedance amplifier (512) is also electrically connected to the ceramic connector (3); the wavelength division component (52) further includes: a wavelength division unit (521), wherein the optical port (2), the common lens (62), the common filter (61), the first reflector (531), the second reflector (532), the third reflector (533), the wavelength division unit (521), the optical chip (511) for photoelectric conversion and the transimpedance amplifier (512) are arranged sequentially at intervals along the receiving optical path (50); The optical port (2), the shared lens (62), the shared filter (61), and the first reflector (531) together constitute the first horizontal optical path segment (501) of the receiving optical path (50). The first reflector (531) and the second reflector (532) together constitute the vertical optical path segment (502) of the receiving optical path (50). The second reflector (532) and the third reflector (533) together constitute the second horizontal optical path segment (503) of the receiving optical path (50). The wave demultiplexer (521), the optical chip (511) for photoelectric conversion, and the transimpedance amplifier (512) together constitute the third horizontal optical path segment (504) of the receiving optical path (50).

10. The optical transceiver device according to claim 9, wherein, The transmitting optical component (41) further includes: an isolator (413), the optical chip (411) for electro-optic conversion, the first lens (412), the isolator (413), the multiplexer (421), the shared filter (61), the shared lens (62), and the optical port (2) arranged sequentially at intervals along the transmitting optical path (40); and / or, The receiving optical component (51) further includes a deflection prism (513), and the wavelength division component (52) further includes a bandpass filter (522). The optical port (2), the shared lens (62), the shared filter (61), the first reflector (531), the second reflector (532), the third reflector (533), the wavelength division unit (521), the bandpass filter (522), the deflection prism (513), the optical chip (511) for photoelectric conversion, and the transimpedance amplifier (512) are arranged sequentially at intervals along the receiving optical path (50).

11. The optical transceiver device according to claim 4, wherein, The transmitting optical component (41) includes an optical chip (411) for electro-optic conversion and a first lens (412). The optical chip (411) for electro-optic conversion is electrically connected to the ceramic plug (3). The multiplexing component (42) further includes a multiplexing filter chip (422) and a second lens (423). The optical chip (411) for electro-optic conversion, the first lens (412), the multiplexing filter chip (422), the second lens (423), the common filter (61), the common lens (62), and the optical port (2) are arranged sequentially at intervals along the transmitting optical path (40). The receiving optical component (51) includes an optical chip (511) for photoelectric conversion and a transimpedance amplifier (512). The optical chip (511) for photoelectric conversion is electrically connected to the transimpedance amplifier (512), and the transimpedance amplifier (512) is also electrically connected to the ceramic connector (3). The wavelength division component (52) further includes a third lens (523) and a wavelength division filter chip (524). The optical port (2), the shared lens (62), the shared filter (61), the first reflector (531), the second reflector (532), the third reflector (533), the third lens (523), the wavelength division filter chip (524), the optical chip (511) for photoelectric conversion, and the transimpedance amplifier (512) are arranged sequentially at intervals along the receiving optical path (50). The optical port (2), the shared lens (62), the shared filter (61), and the first reflector (531) together constitute the first horizontal optical path segment (501) of the receiving optical path (50). The first reflector (531) and the second reflector (532) together constitute the vertical optical path segment (502) of the receiving optical path (50). The second reflector (532) and the third reflector (533) together constitute the second horizontal optical path segment (503) of the receiving optical path (50). The third reflector (533), the third lens (523), the wavelength division multiplexing filter chip (524), the optical chip (511) for photoelectric conversion, and the transimpedance amplifier (512) together constitute the third horizontal optical path segment (504) of the receiving optical path (50).

12. The optical transceiver device according to claim 4, wherein, The transmitting optical component (41) includes an optical chip (411) for electro-optic conversion and a first lens (412). The optical chip (411) for electro-optic conversion is electrically connected to the ceramic plug (3). The multiplexing component (42) further includes a multiplexing filter chip (422) and a second lens (423). The optical chip (411) for electro-optic conversion, the first lens (412), the multiplexing filter chip (422), the second lens (423), the common filter (61), the common lens (62), and the optical port (2) are arranged sequentially at intervals along the transmitting optical path (40). The receiving optical component (51) includes a transimpedance amplifier (512), which is electrically connected to the ceramic connector (3). The wavelength division component (52) further includes a third lens (523) and a first integrated chip (525). The optical port (2), the shared lens (62), the shared filter (61), the first reflector (531), the second reflector (532), the third reflector (533), the third lens (523), the first integrated chip (525), and the transimpedance amplifier (512) are arranged sequentially at intervals along the receiving optical path (50). The first integrated chip (525) includes a coupled wavelength division filter chip and a photodetector chip, which are electrically connected to the transimpedance amplifier (512). The optical port (2), the shared lens (62), the shared filter (61), and the first reflector (531) together constitute the first horizontal optical path segment (501) of the receiving optical path (50). The first reflector (531) and the second reflector (532) together constitute the vertical optical path segment (502) of the receiving optical path (50). The second reflector (532) and the third reflector (533) together constitute the second horizontal optical path segment (503) of the receiving optical path (50). The third reflector (533), the third lens (523), the first integrated chip (525), and the optical chip (511) for photoelectric conversion together constitute the third horizontal optical path segment (504) of the receiving optical path (50).

13. The optical transceiver device according to claim 4, wherein, The transmitting optical component (41) includes a continuous light source (415) and a first lens (412). The wave combining component (42) further includes a second lens (423) and a second integrated chip (424). The continuous light source (415), the first lens (412), the second integrated chip (424), the second lens (423), the shared filter (61), the shared lens (62), and the optical port (2) are arranged sequentially at intervals along the transmitting optical path (40). The second integrated chip (424) includes a coupled wave combining filter chip and an electro-optic modulation chip. The electro-optic modulation chip is also electrically connected to the ceramic connector (3). The receiving optical component (51) includes a transimpedance amplifier (512), which is electrically connected to the ceramic connector (3). The wavelength division component (52) further includes a third lens (523) and a first integrated chip (525). The optical port (2), the shared lens (62), the shared filter (61), the first reflector (531), the second reflector (532), the third reflector (533), the third lens (523), the first integrated chip (525), and the transimpedance amplifier (512) are arranged sequentially at intervals along the receiving optical path (50). The first integrated chip (525) includes a coupled wavelength division filter chip and a photodetector chip, which are electrically connected to the transimpedance amplifier (512). The optical port (2), the shared lens (62), the shared filter (61), and the first reflector (531) together constitute the first horizontal optical path segment (501) of the receiving optical path (50). The first reflector (531) and the second reflector (532) together constitute the vertical optical path segment (502) of the receiving optical path (50). The second reflector (532) and the third reflector (533) together constitute the second horizontal optical path segment (503) of the receiving optical path (50). The third reflector (533), the third lens (523), the first integrated chip (525), and the optical chip (511) for photoelectric conversion together constitute the third horizontal optical path segment (504) of the receiving optical path (50).

14. The optical transceiver device according to any one of claims 2-13, wherein, The transmitting optical component (41) is configured to transmit multiple signals with different wavelengths, and the multiplexer component (42) is used to combine the optical transmission signals from the multiple transmitting optical components (41) and output them to the optical port (2); The receiving optical component (51) is configured to receive multiple optical signals with different wavelengths. The wavelength division component (52) is used to receive and separate the optical signals received from the optical port (2) and send the separated multiple optical signals to the corresponding receiving optical component (51).

15. An optical module, wherein, The optical module includes at least one pair of optical transceiver devices (100) and optical fibers (200) as described in any one of claims 1-14, with the end of each optical fiber (200) connected to the optical port (2) of each pair of optical transceiver devices (100).

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