Optical assembly, optical module and related device

Abstract

An optical assembly (300), an optical module and an optical communication device. The optical assembly (300) comprises a die (301) and N hermetic packaging modules, wherein the die (301) comprises M optical input ports and an optical transmission port (321), the optical transmission port (321) being connected to an optical fiber assembly (503); the N hermetic packaging modules include a first hermetic packaging module (510) and a second hermetic packaging module (520); and the M optical input ports include a first optical input port (311) and a second optical input port (312), the first optical input port (311) being connected to the first hermetic packaging module (510), and the second optical input port (312) being connected to the second hermetic packaging module (520). The die (301) internally comprises a photonic integrated chip (530), and the photonic integrated chip (530) comprises a multiplexer (501), a first optical waveguide (531) and a second optical waveguide (532), wherein a first end of the first optical waveguide (531) is in optical path alignment with the first hermetic packaging module (510), a first end of the second optical waveguide (532) is in optical path alignment with the second hermetic packaging module (520), and the multiplexer (501) is connected to each of a second end of the first optical waveguide (531) and a second end of the second optical waveguide (532). Further disclosed are an optical module comprising the optical assembly (300), and an optical communication device.

Description

An optical component, an optical module, and related equipment

[0001] This application claims priority to Chinese Patent Application No. CN202411555004.6, filed on October 31, 2024, entitled "An optical component, optical module and related equipment", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of optical communication technology, and in particular to an optical component, an optical module, and related equipment. Background Technology

[0003] Optical components are an important hardware part of optical communication services, and their function is to convert electrical signals into optical signals.

[0004] Figure 1 shows an example of the overall structure of an existing optical component. The existing optical component includes a glass slide 101, a laser 110, a laser 120, and an optical fiber assembly 102. Laser 110 emits a first optical signal, and laser 120 emits a second optical signal. The wavelength of the first optical signal is different from the wavelength of the second optical signal. Glass slide 101 receives the first optical signal from laser 110 and transmits it to optical fiber assembly 102 for output. Glass slide 101 receives the second optical signal from laser 120 and reflects it back to optical fiber assembly 102 for output.

[0005] However, this optical component requires strict control over the position of the glass plate 101 to ensure that the first optical signal is incident on the glass plate 101 at a specific angle so that the glass plate 101 can successfully transmit the first optical signal to the fiber optic assembly 102. It also requires that the second optical signal is incident on the glass plate 101 at a specific angle so that the glass plate 101 can successfully reflect the second optical signal to the fiber optic assembly 102. This increases the sensitivity of the glass plate 101 to angles, increases the complexity of the optical component assembly, and reduces the assembly efficiency. Summary of the Invention

[0006] This application provides an optical component, an optical module, and related equipment, which can effectively reduce the complexity of assembling optical components and improve assembly efficiency.

[0007] In a first aspect, this application provides an optical component, including a die and N hermetically sealed modules, where N is any integer greater than or equal to 2. The die includes M input optical ports and transmission optical ports, where M is any integer greater than or equal to 2, for example, M = N. The transmission optical ports are connected to an optical fiber assembly. The N hermetically sealed modules include a first hermetically sealed module and a second hermetically sealed module. The first hermetically sealed module is used for hermetically sealing a first laser, and the second hermetically sealed module is used for hermetically sealing a second laser. The M input optical ports include a first input optical port and a second input optical port. The first input optical port is connected to the first hermetically sealed module, and the second input optical port is connected to the second hermetically sealed module. The die... The device internally includes a photonic integrated chip, which comprises a multiplexer, a first optical waveguide, and a second optical waveguide. A first end of the first optical waveguide is aligned with the optical path of the first hermetically sealed module, and a first end of the second optical waveguide is aligned with the optical path of the second hermetically sealed module. The multiplexer is connected to the second ends of the first and second optical waveguides, respectively. The multiplexer is used to receive a first optical signal from the first laser through the first optical waveguide and a second optical signal from the second laser through the second optical waveguide. The multiplexer is also used to multiplex the first and second optical signals to obtain a combined optical signal and to transmit the combined optical signal to the optical fiber assembly.

[0008] As shown in this aspect, the photonic integrated chip is fixed inside the die using a non-hermetic packaging method. The photonic integrated chip features high integration and low power consumption. Therefore, it can effectively improve the speed of optical components, reduce power consumption, reduce size, and improve integration and reliability. While reducing the size of the optical component, it effectively reduces the area occupied by the component on the circuit board, increases the integration of the circuit board, and reduces the heat dissipation difficulty. With the photonic integrated chip fixed inside the die, when the first hermetic packaging module is connected to the first optical input port, it ensures the alignment of the first optical waveguide with the optical path of the first hermetic packaging module, specifically ensuring the alignment of the first optical waveguide with the optical path of the first laser. When the second hermetic packaging module is connected to the second optical input port, it ensures the alignment of the second optical waveguide with the optical path of the second hermetic packaging module, specifically ensuring the alignment of the second optical waveguide with the optical path of the second laser. This ensures that the first and second optical signals can be successfully transmitted to the multiplexer on the photonic integrated chip and reduces the loss during the transmission of the first and second optical signals to the multiplexer. The multiplexer receives a first optical signal through a first optical waveguide and a second optical signal through a second optical waveguide. When the first and second optical signals enter the multiplexer, there is no need to specifically correct their transmission angles. For example, existing optical components may include multiple glass slides to achieve multiplexing of multiple optical signals; however, the positional relationship between different glass slides needs to be defined. The multiplexer implemented using a photonic integrated chip as shown in this aspect can directly achieve multiplexing of multiple optical signals, reducing the complexity of the optical component structure, improving the integration level of the optical component, and increasing assembly efficiency.

[0009] Based on the first aspect, in one optional implementation, the rate of the first optical signal emitted by the first laser is different from the rate of the second optical signal emitted by the second laser.

[0010] As shown in this aspect, the same optical component can integrate N lasers with different emission rates, reducing the overall package size of the optical component, improving the integration level, and realizing the need for miniaturization of optical components that support multiple different rates.

[0011] Based on the first aspect, in one optional implementation, the first laser emits the first optical signal corresponding to the first standard, and the second laser emits the second optical signal corresponding to the second standard, wherein the first standard and the second standard are two standards among Gigabit Passive Optical Network (GPON), 50GPON, and 10GPON, respectively.

[0012] As shown in this aspect, the same optical component can integrate N lasers supporting different standards, reducing the overall package size of the optical component, improving the integration level, and realizing the need for miniaturization of optical components supporting multiple different standards.

[0013] Based on the first aspect, in one optional implementation, the optical window of the first hermetically sealed module is aligned with the optical path of the first optical waveguide, and the optical window of the first hermetically sealed module is used to couple the first optical signal to the first optical waveguide; the optical window of the second hermetically sealed module is aligned with the optical path of the second optical waveguide, and the optical window of the second hermetically sealed module is used to couple the second optical signal to the second optical waveguide.

[0014] Using this implementation, for example, the optical window of the first hermetically sealed module can converge the first optical signal to the first optical waveguide, and the optical window of the second hermetically sealed module can converge the second optical signal to the second optical waveguide, thereby reducing the loss in the process of transmitting the first optical signal from the first hermetically sealed module to the photonic integrated chip, and reducing the loss in the process of transmitting the second optical signal from the second hermetically sealed module to the photonic integrated chip.

[0015] Based on the first aspect, in one optional implementation, a first lens group is included between the optical window of the first hermetically sealed module and the first optical waveguide. The first lens group includes at least one lens and is used to couple the first optical signal emitted from the first hermetically sealed module to the first optical waveguide. A second lens group is included between the optical window of the second hermetically sealed module and the second optical waveguide. The second lens group includes at least one lens and is used to couple the second optical signal emitted from the second hermetically sealed module to the second optical waveguide.

[0016] Using this implementation, the first lens group can effectively improve the coupling efficiency of the first optical signal to the first optical waveguide, and the second lens group can effectively improve the coupling efficiency of the second optical signal to the second optical waveguide.

[0017] Based on the first aspect, in one optional implementation, the photonic integrated chip further includes a multiplexing / demultiplexing module and K detectors, where K is any integer greater than or equal to 1, and the K detectors include a first detector. The multiplexing / demultiplexing module is optically aligned with the optical fiber assembly, and the multiplexing / demultiplexing module is connected to the first detector and the multiplexer respectively. The multiplexing / demultiplexing module is used to transmit the multiplexed optical signal from the multiplexer to the optical fiber assembly, and to transmit the first target optical signal from the optical fiber assembly to the first detector. The first detector is used to perform photoelectric conversion on the first target optical signal to obtain a first electrical signal.

[0018] Using this implementation, the optical component can support bidirectional applications on a single fiber. That is, the optical component can transmit optical signals from the hermetically sealed module to the optical fiber component, and can also perform photoelectric conversion on the optical signals from the optical fiber component through the first detector to achieve bidirectional optical signal transmission.

[0019] Based on the first aspect, in one optional implementation, the K detectors further include a second detector, the photonic integrated chip further includes a first demultiplexer, the multiplexing / demultiplexing module is also connected to the first demultiplexer, and the first demultiplexer is respectively connected to the first detector and the second detector; the multiplexing / demultiplexing module is also used to transmit optical signals from the optical fiber assembly to the first demultiplexer; the first demultiplexer is used to demultiplex the optical signals to obtain a first target optical signal and a second target optical signal, and is used to transmit the first target optical signal to the first detector and to transmit the second target optical signal to the second detector; the second detector is used to perform photoelectric conversion on the second target optical signal to obtain a second electrical signal.

[0020] Using this implementation method, the optical component can perform photoelectric conversion on multiple optical signals to improve the signal processing capability of the optical component.

[0021] Based on the first aspect, in one optional implementation, the first detector is electrically connected to a flexible circuit board (FPC), the FPC is electrically connected to a circuit board, and the FPC is used to transmit the first electrical signal from the first detector to the circuit board.

[0022] By adopting this implementation method, the detectors of the optical component are electrically connected to the circuit board via FPC, which effectively reduces impedance discontinuities, reduces the size of the optical component, and improves the integration of the optical component.

[0023] Based on the first aspect, in an optional implementation, the photonic integrated chip further includes a first modulator and a second modulator respectively connected to the multiplexer. The first optical waveguide is located between the first hermetically sealed module and the first modulator. The first modulator is used to receive the first optical signal from the first hermetically sealed module through the first optical waveguide and to modulate the first optical signal to obtain a first modulated optical signal. The second optical waveguide is located between the second hermetically sealed module and the second modulator. The second modulator is used to receive the second optical signal from the second hermetically sealed module through the second optical waveguide and to modulate the second optical signal to obtain a second modulated optical signal. The multiplexer is used to multiplex the first modulated optical signal and the second modulated optical signal to obtain the combined optical signal.

[0024] This implementation places the modulator on the photonic integrated chip. Externalizing the modulator within the hermetically sealed module facilitates high-speed, high-precision modulation of the optical signal emitted from the hermetically sealed module. Furthermore, externalizing the modulator reduces the heat dissipation pressure on the hermetically sealed module, improving the stability of the optical signal emitted by the optical component. This external placement effectively increases the optical power of the optical signal emitted by the hermetically sealed module, thereby increasing the optical power of the optical signal emitted by the optical component and improving communication efficiency.

[0025] Based on the first aspect, in an optional implementation, the photonic integrated chip further includes a second demultiplexer, a first modulator, and a third modulator. The first optical waveguide is located between the first hermetically sealed module and the second demultiplexer. The second demultiplexer is used to receive the first optical signal from the first hermetically sealed module through the first optical waveguide and to demultiplex the first optical signal to obtain a first sub-optical signal and a second sub-optical signal. The first modulator is used to modulate the first sub-optical signal to obtain a third sub-optical signal and to transmit the third sub-optical signal to the multiplexer. The third modulator is used to modulate the second sub-optical signal to obtain a fourth sub-optical signal and to transmit the fourth sub-optical signal to the multiplexer. The multiplexer is used to multiplex the third sub-optical signal and the fourth sub-optical signal to obtain a combined optical signal.

[0026] Using this implementation, the first optical signal emitted by the first hermetically sealed module is a multiplexed optical signal. The multiplexed optical signal emitted by the first hermetically sealed module can be modulated by the photonic integrated chip and successfully transmitted to the optical fiber assembly. This reduces power consumption, increases the modulation rate, and improves the efficiency of transmitting the combined optical signal to the optical fiber assembly.

[0027] Based on the first aspect, in one optional implementation, a third lens group is included between the photonic integrated chip and the optical fiber assembly, the third lens group including at least one lens; the third lens group couples the combined optical signal from the photonic integrated chip to the optical fiber assembly.

[0028] By adopting this implementation method, the third lens group effectively reduces the loss of optical signals transmitted between the third optical waveguide and the optical fiber assembly.

[0029] Based on the first aspect, in one optional implementation, the photonic integrated chip further includes a third optical waveguide, which is coupled to the optical fiber assembly.

[0030] By adopting this implementation method, the photonic integrated chip is coupled to the optical fiber component through a third optical waveguide, which improves the transmission efficiency of optical signals and reduces the transmission loss of optical signals.

[0031] Based on the first aspect, in one optional implementation, the first hermetically sealed module and the second hermetically sealed module are in a transistor outline TO package or a box package.

[0032] Using this implementation method, the first hermetically sealed module can adopt a variety of packaging types, which expands the application scenarios of optical components.

[0033] Secondly, this application provides an optical module, including a circuit board and one or more optical components connected to the circuit board, wherein the optical components are as described in any of the first aspects above. For an explanation of the beneficial effects, please refer to the first aspect, and will not be repeated here.

[0034] Thirdly, this application provides an optical communication device, including a device board and an optical module as described in the second aspect above, connected to the device board.

[0035] Fourthly, this application provides a radar, including a processor and an optical component connected to the processor, the optical component being as described in any of the first aspects above; the processor is configured to send a first detection electrical signal to a first hermetically sealed module and to send a second detection electrical signal to a second hermetically sealed module; the first hermetically sealed module is configured to process the first detection electrical signal into a first optical signal, and the second hermetically sealed module is configured to process the second detection electrical signal into a second optical signal, the first optical signal and the second optical signal being used to detect relevant information of a target object.

[0036] Fifthly, this application provides an optical network including multiple optical communication devices, each of which is as described in the third aspect above, and will not be elaborated further.

[0037] Sixthly, embodiments of this application provide a means of transportation, which includes radar as described in the fourth aspect above.

[0038] In a seventh aspect, this application provides an optical component, including a die and a hermetically sealed module. The die includes an input port and a transmission port. The transmission port is connected to an optical fiber component. The hermetically sealed module is used to hermetically seal at least one laser. The input port is connected to the hermetically sealed module. The die contains a photonic integrated chip, which is used to transmit optical signals from the hermetically sealed module to the optical fiber component.

[0039] As described in this aspect, the photonic integrated chip is fixed inside the die using a non-hermetic packaging method. The photonic integrated chip features high integration and low power consumption. Therefore, it can effectively improve the speed of optical components, reduce power consumption, reduce size, and improve integration and reliability. While reducing the size of the optical component, it effectively reduces the area occupied by the component on the circuit board, increases the integration of the circuit board, and reduces the heat dissipation difficulty. With the photonic integrated chip fixed inside the die, even when the hermetic packaging module is connected to the optical input port, the photonic integrated chip can ensure that the optical signal emitted by the hermetic packaging module can be successfully transmitted to the optical fiber component and reduce transmission losses. For an explanation of the beneficial effects of the optional implementation methods described below, please refer to the first aspect, which will not be repeated here.

[0040] Based on the seventh aspect, in one optional implementation, the hermetically sealed module includes at least one laser that emits optical signals corresponding to at least two of the following standards: Gigabit Passive Optical Network (GPON), 50GPON, and 10GPON.

[0041] Based on the seventh aspect, in one optional implementation, the photonic integrated chip includes an optical waveguide, the optical window of the hermetically sealed module is aligned with the optical path of the optical waveguide, and the optical window of the hermetically sealed module is used to couple the optical signal to the optical waveguide.

[0042] Based on the seventh aspect, in an optional implementation, the photonic integrated chip further includes a multiplexing / demultiplexing module and K detectors, where K is any integer greater than or equal to 1, and the K detectors include a first detector. The multiplexing / demultiplexing module is aligned with the optical path of the optical fiber assembly, and the multiplexing / demultiplexing module is connected to the first detector. The multiplexing / demultiplexing module is used to transmit the optical signal from the hermetically sealed module to the optical fiber assembly, and to transmit the first target optical signal from the optical fiber assembly to the first detector. The first detector is used to perform photoelectric conversion on the first target optical signal to obtain a first electrical signal.

[0043] Based on the seventh aspect, in an optional implementation, the K detectors further include a second detector, the photonic integrated chip further includes a first demultiplexer, the multiplexing / demultiplexing module is also connected to the first demultiplexer, and the first demultiplexer is respectively connected to the first detector and the second detector; the multiplexing / demultiplexing module is also used to transmit optical signals from the optical fiber assembly to the first demultiplexer; the first demultiplexer is used to demultiplex the optical signals to obtain a first target optical signal and a second target optical signal, and is used to transmit the first target optical signal to the first detector and to transmit the second target optical signal to the second detector; the second detector is used to perform photoelectric conversion on the second target optical signal to obtain a second electrical signal.

[0044] Based on the seventh aspect, in one optional implementation, the first detector is electrically connected to a flexible circuit board (FPC), the FPC is electrically connected to a circuit board, and the FPC is used to transmit the first electrical signal from the first detector to the circuit board.

[0045] Based on the seventh aspect, in an optional implementation, the photonic integrated chip further includes a modulator, which is used to receive the optical signal from the hermetically sealed module and to modulate the optical signal to obtain a modulated optical signal.

[0046] Based on the seventh aspect, in an optional implementation, the photonic integrated chip further includes a multiplexer, a second demultiplexer, a first modulator, and a third modulator. The second demultiplexer is used to receive the optical signal from the hermetically sealed module and to demultiplex the optical signal to obtain a first sub-optical signal and a second sub-optical signal. The first modulator is used to modulate the first sub-optical signal to obtain a third sub-optical signal and to transmit the third sub-optical signal to the multiplexer. The third modulator is used to modulate the second sub-optical signal to obtain a fourth sub-optical signal and to transmit the fourth sub-optical signal to the multiplexer. The multiplexer is used to multiplex the third sub-optical signal and the fourth sub-optical signal to obtain a combined optical signal and to transmit the combined optical signal to the optical fiber assembly.

[0047] Based on the seventh aspect, in one optional implementation, the hermetically sealed module adopts a transistor outline TO package or a box package. Attached Figure Description

[0048] Figure 1 is an example diagram of the overall structure of an existing optical component;

[0049] Figure 2a is a structural example of an optical network;

[0050] Figure 2b shows another example of an optical network structure;

[0051] Figure 3 is a structural example diagram of the first embodiment of the optical component provided in this application;

[0052] Figure 4 is an example cross-sectional view of the optical component shown in Figure 3;

[0053] Figure 5 is a structural block diagram of the first embodiment of the optical component shown in Figure 3;

[0054] Figure 6 is a structural block diagram of a second embodiment of the optical component shown in Figure 3;

[0055] Figure 7 is a structural block diagram of a third embodiment of the optical component shown in Figure 3;

[0056] Figure 8 is a structural block diagram of the fourth embodiment of the optical component shown in Figure 3;

[0057] Figure 9 is a structural block diagram of the fifth embodiment of the optical component shown in Figure 3;

[0058] Figure 10 is a structural block diagram of the sixth embodiment of the optical component shown in Figure 3;

[0059] Figure 11 is a structural example diagram of an embodiment of the radar provided in this application;

[0060] Figure 12 is a structural example diagram of an embodiment of the transportation vehicle provided in this application;

[0061] Figure 13 is a structural example diagram of a second embodiment of the optical component provided in this application. Detailed Implementation

[0062] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0063] Figure 2a is a structural example of an optical network. For example, the optical network 200 shown in this example is a passive optical network (PON). The optical network 200 includes a first optical communication device 201, an optical distribution network (ODN) 210, and at least one second optical communication device 202. The first optical communication device 201 is connected to at least one second optical communication device 202 through the ODN 210. This example does not limit the number of second optical communication devices 202 included in the optical network. The ODN 210 includes a passive splitter, a backbone fiber (Feeder) connecting the first optical communication device 201 and the passive splitter, and a drop fiber connecting the second optical communication device 202 and the passive splitter.

[0064] The first optical communication device 201 shown in this example is an optical line terminal (OLT), and the second optical communication device 202 can be an optical network unit (ONU) or an optical network terminal (ONT). The first optical communication device 201 connects to upper-layer network-side devices (e.g., switches, routers). The second optical communication device 202 can connect to user-side devices; for example, the second optical communication device 202 provides Ethernet user ports or plain old telephone service (POTS) user ports to connect to user-side devices. It should be noted that the description of the optical network type shown in Figure 2a is an optional example and is not limited. For example, an optical network can also be applied to an optical transport network (OTN), in which case both the first optical communication device 201 and the second optical communication device 202 are OTN devices. If the optical network 200 is applied to a wireless mesh network, it is also called a multi-hop network. This mesh includes multiple transmission devices with mesh functionality. The first optical communication device 201 and the second optical communication device 202 are any two connected from a plurality of transmission devices. The optical network 200 shown in this example can also be applied to any one or more combinations of data center networks (DCN), metropolitan area networks (MAN), optical access networks (OAN), synchronous digital hierarchy (SDH), Ethernet passive optical networks (EPON), Ethernet, flexible Ethernet (FlexE), wavelength division multiplexing (WDM), etc., without specific limitations.

[0065] Taking the first optical communication device 201 as an example, the type of the first optical communication device 201 can vary depending on the different application scenarios of the optical network. For instance, the first optical communication device 201 can be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc., or it can be a computing server (usually referred to as a server), a high-performance computer (HPC), a storage server, or a memory resource pool, etc. This example does not limit the type of the first optical communication device 201, as long as it has electro-optical conversion function and an optical interface capable of connecting to optical fibers. For a description of the type of the second optical communication device 202, please refer to the description of the first optical communication device 201; details will not be elaborated here.

[0066] Taking the first optical communication device 201 as an example, the first optical communication device 201 includes a device board and one or more optical modules. The optical module can also be called a photoelectric conversion module, optical transceiver, optical transceiver module, etc., without specific limitations. This example does not limit the packaging form of the optical module. The packaging form of the optical module can be an optical transceiver board (OTB), a near package optics (NPO), an on-board optics (OBO) based on optical input & output (OIO) technology, a co-package optics (CPO), a small form-factor pluggable (SFP), etc. This example does not limit the number of device boards included in the first optical communication device 201. The device boards are integrated with the first optical communication device 201, or the device boards are independent pluggable boards. This example does not limit the number of optical modules included in the first optical communication device 201. The optical module can be integrated into the equipment board or pluggable onto the equipment board, etc., with no specific limitations. Specifically, the equipment board encapsulates a processor and a connector, which is used to connect the processor and the optical module. The processor can be one or more chips, or one or more integrated circuits. For example, the processor can be one or more of the following: neural processing unit (NPU), optical digital signal processor (oDSP), field-programmable gate array (FPGA), application-specific integrated circuit (ASIC), system-on-chip (SoC), central processing unit (CPU), network processor (NP), microcontroller unit (MCU), programmable logic device (PLD), network interface card chip, storage interface chip, or other integrated chips, etc. The processor has a transmit interface and a receive interface, which are respectively connected to the connector. The connector provides an electrical interface, enabling a pluggable electrical connection with the optical module.The second optical communication device 202 includes a device board and one or more optical modules. For details, please refer to the description of the first optical communication device 201. Detailed descriptions will not be repeated here.

[0067] Fiber to the home (FTTH) is a fiber optic communication transmission method. The access network portion of the aforementioned optical network can achieve wider coverage through FTTH. Furthermore, fiber to the office (FTTO) and fiber to the building (FTTB) are also proposed as similar communication transmission methods, which can also be the application architecture of the optical modules provided in this application. The example shown in Figure 2b is based on FTTH and is described exemplarily.

[0068] Building upon FTTH, to address the issue of wireless fidelity (WiFi) coverage in home networks, fiber optic cables can be extended further into residents' rooms. Optical terminal equipment providing WiFi access is installed inside the rooms, thus reducing the distance between the user's terminal and the WiFi access point and improving signal quality. This application scenario is called Fiber to the Room (FTTR).

[0069] Figure 2b shows another example of an optical network structure, specifically a schematic diagram of the FTTR system architecture. The FTTR and FTTH networks can be viewed as cascaded PON systems. In FTTH, the OLT is deployed in the central office (CO), and the ONU is deployed in the home's information box. The master device in FTTR can replace the ONU in FTTH. This master device has similar functions to the OLT in the FTTH scenario, and also similar functions to the ONU in the FTTH scenario. That is to say, the master device in FTTR is a device that combines the functions of OLT and ONU, and can act as a network device connecting FTTH and FTTR. The slave devices in FTTR can be deployed in each room of the home to connect with user terminals (stations). These slave devices are essentially similar network devices to the ONUs in FTTH. The slave devices in FTTR enter each room, and the slave gateway can also function as an access point (AP), allowing direct WiFi connection with user terminals. User terminals can connect to slave devices and transmit data via a WiFi connection established between them.

[0070] It should be understood that multiple slave devices can be deployed in an FTTR, each connected to a corresponding downlink port on the master device. The master device can achieve unified management and configuration of all slave devices. The master device may include one or more optical modules provided in this application, and the slave devices may also include one or more optical modules provided in this application. It should be noted that the master device may also be called a "master gateway," "master optical modem," or "master FTTR device," etc., and the slave device may also be called a "slave gateway," "slave optical modem," or "slave FTTR device," etc., and this application does not limit their specific names. The first optical communication device shown in Figure 2a can also be a master device under the FTTR architecture, and the second optical communication device shown in Figure 2a can also be a slave device under the FTTR architecture.

[0071] Based on the architecture in Figure 2a above, in some scenarios, when a slave device in FTTR provides services to a user terminal, the data transmission method by which the user terminal accesses the slave device may be different from the data transmission method of the devices in FTTH and FTTR. For example, FTTH or FTTR communicates internally through optical fiber, while the slave device and the terminal can communicate through a wireless network. This wireless network may include, but is not limited to, WiFi, near field communication (NFC), infrared, Starflash, Bluetooth, or ZigBee.

[0072] The optical module provided in this application embodiment will be described below based on the aforementioned optical network architecture. In the example shown in Figure 2a, the optical module is located in the first optical communication device; in the example shown in Figure 2b, the optical module is located on the main device. It should be noted that this embodiment does not limit the specific location of the optical module. Specifically, the optical module includes a circuit board and one or more optical components connected to the circuit board. For example, the optical component receives an electrical signal from the circuit board and performs electro-optical conversion on the electrical signal to obtain an optical signal, which is then emitted by the optical component through an optical fiber component. Alternatively, the optical component receives an optical signal through an optical fiber component, performs photoelectric conversion on the optical signal to obtain an electrical signal, and transmits the electrical signal to the circuit board. The circuit board can be a printed circuit board (PCB). The PCB has a processor encapsulated in it, which is used to process the electrical signal to be sent to the optical component and the electrical signal from the optical component. For a description of the processor type on the PCB, please refer to the description of the processor type on the device board shown in Figure 2a, which will not be elaborated here. For example, the processor can perform functions such as compensation based on a feed forward equalizer (FFE) or a continuous time linear equalizer (CTLE), analog-to-digital conversion, clock recovery, channel compensation, and multiple-in multiple-out (MIMO) equalization on electrical signals. It should be noted that this embodiment does not limit the types of electrical signal processing performed by the processor.

[0073] Figure 3 is a structural example diagram of the first embodiment of the optical component provided in this application. Figure 4 is a cross-sectional structural example diagram of the optical component shown in Figure 3. Figure 5 is a structural block diagram of the first embodiment of the optical component shown in Figure 3.

[0074] The optical component 300 shown in this embodiment includes a die 301 and N hermetically sealed modules, where N is any integer greater than or equal to 2. It is understood that this embodiment does not limit the number of hermetically sealed modules included in the optical component 300. For example, if N is 2, the N hermetically sealed modules specifically include a first hermetically sealed module 510 and a second hermetically sealed module 520. Taking the first hermetically sealed module 510 as an example, the first hermetically sealed module 510 specifically includes a base 512 and a sealing cover 513. The sealing cover 513 is placed on the base 512, so that the base 512 and the sealing cover 513 form a sealed cavity. The first laser 511 is located inside this sealed cavity, thereby isolating the first laser 511 from the external environment of the first hermetically sealed module 510, preventing moisture, contaminants, etc., from corroding the first laser 511, and improving the reliability and lifespan of the first laser 511. The sealing cover 513 has a light window 514, allowing the first light signal emitted by the first laser 511 to pass through the light window 514. The first hermetically sealed module 510 may include one or more first lasers. This embodiment does not limit the specific number of first lasers hermetically sealed in the first hermetically sealed module 510. This embodiment does not limit the packaging type of the first hermetically sealed module 510; for example, the packaging type of the first hermetically sealed module 510 may be a transistor outline (TO) or a box type, etc.This embodiment does not limit the type of the first laser 511, as long as the first laser can realize the conversion of electrical signals to optical signals. For example, the first laser 511 can be a direct modulation laser (DML), an electro-absorption modulated laser (EML), a vertical cavity surface emitting laser (VCSEL), a distributed bragg reflector (DBR), a fabric-pérot laser, a distributed feedback laser, a modulated grating y-branch (MG-Y) laser, a multi-channel interference (MCI) laser, a V-cavity laser, and a chirped sampled grating-distributed reflector laser (CSG-DR) laser, etc. For example, the first laser can also employ a structure combining a laser and a modulator, where the modulator can be a Mach-Zehnder modulator (MZM) or a micro-ring modulator (MRM), etc. The second hermetically sealed module 520 is used to hermetically seal the second laser 521. For a description of the second hermetically sealed module 520 hermetically sealing the second laser 521, please refer to the description of the first hermetically sealed module 510 hermetically sealing the first laser 511; further details will not be elaborated here.

[0075] The die 301 shown in this embodiment includes M optical input ports and a transmission optical port 321, where M is any integer greater than or equal to 2. This embodiment does not limit the relationship between M and N; in this embodiment, M = N is used as an example. Specifically, the M optical input ports include a first optical input port 311 and a second optical input port 312. The first optical input port 311 is used to connect to the first hermetic mounting module 510 to ensure that the first optical signal emitted from the first hermetic mounting module 510 can be transmitted to the inside of the die 301 via the first optical input port 311. The second optical input port 312 is used to connect to the second hermetic mounting module 520 to ensure that the second optical signal emitted from the second hermetic mounting module 520 can be transmitted to the inside of the die 301 via the second optical input port 312. Taking the first optical input port 311 as an example, the first hermetic mounting module 510 can be connected to the first optical input port 311 by means of snap-fit ​​connection, threaded connection, riveting connection, locking connection, sliding connection, pin connection, welding, or adhesive bonding. For instructions on connecting the second hermetic module 520 to the second optical inlet port 312, please refer to the instructions on connecting the first hermetic module 510 to the first optical inlet port 311. Specific details will not be repeated here.

[0076] Inside the die 301 shown in this embodiment, a photonic integrated circuit (PIC) 530 is fixed using a non-hermetic packaging method. The PIC 530 is an optical signal processing chip manufactured using planar waveguide technology, characterized by high integration, miniaturization, and high reliability. Therefore, the photonic integrated circuit 530 can effectively improve the speed of optical components, reduce power consumption, and enhance the integration and reliability of optical components. The PIC 530 can be a silicon photonic chip or a chip manufactured based on III-V compound semiconductor materials. For example, the photonic integrated circuit 530 can be fixed inside the die 301 using a chip-on-carrier (COC) package. The photonic integrated circuit 530 is an optical chip manufactured based on silicon photonics technology.

[0077] The photonic integrated chip 530 includes a first optical waveguide 531 and a second optical waveguide 532. The first optical waveguide 531 is located between the first light inlet 311 and the multiplexer 501. When the first hermetically sealed module 510 is connected to the first light inlet 311, the first hermetically sealed module 510 and the first end optical path of the first optical waveguide 531 are aligned. Specifically, the light outlet of the first laser 511 included in the first hermetically sealed module 510 is aligned with the first end optical path of the first optical waveguide 531, so that the first optical signal emitted from the light outlet of the first laser 511 can pass through the first light inlet 311 and be incident on the first end of the first optical waveguide. The alignment of the optical path between the output port of the first laser 511 and the first end of the first optical waveguide 531 specifically refers to the alignment of the output port of the first laser 511 and the first end of the first optical waveguide 531 through free-space optical path alignment. Free-space optical path alignment means a non-contact alignment between the output port of the first laser 511 and the first end of the first optical waveguide 531, ensuring that the first optical signal emitted from the output port of the first laser 511 is successfully transmitted to the first end of the first optical waveguide 531. The first optical signal can then be transmitted via the first optical waveguide 531. The second optical waveguide 532 is located between the second optical inlet 312 and the multiplexer 501. When the second hermetically sealed module 520 is connected to the second optical inlet 312, the optical paths of the second hermetically sealed module 520 and the first end of the second optical waveguide 532 are aligned. Specifically, the output port of the second laser 521 included in the second hermetically sealed module 520 is aligned with the optical path of the first end of the second optical waveguide 532. For an explanation of the alignment of the output port of the second laser 521 with the optical path of the first end of the second optical waveguide 532, please refer to the explanation of the alignment of the output port of the first laser 511 with the optical path of the first end of the first optical waveguide 531. Further details are omitted here. When the output port of the second laser 521 is aligned with the optical path of the first end of the second optical waveguide 532, the second optical signal emitted from the output port of the second laser 521 can pass through the second optical inlet 312 and enter the first end of the second optical waveguide 532, allowing the second optical signal to be transmitted via the second optical waveguide 532. The second ends of the first optical waveguide 531 and the second ends of the second optical waveguide 532 are respectively connected to a multiplexer (MUX) 501. The multiplexer 501 is used to multiplex the first optical signal from the first optical waveguide 531 and the second optical signal from the second optical waveguide 532 to obtain a combined optical signal. The multiplexer 501 transmits the combined optical signal to the transmission port 321 included in the die 301.This embodiment does not limit the implementation of the multiplexer 501. For example, the multiplexer 501 can be implemented as a wavelength division multiplexing (WDM), a Mach-Zehnder interferometer (MZI) filter, an arrayed waveguide grating (AWG), a multimode interference coupler, a reflective echelle grating, a grating coupler, etc.

[0078] In this embodiment, the photonic integrated chip 530 is fixed inside the die 301. With the first hermetic packaging module 510 connected to the first light inlet 311, the optical paths of the first optical waveguide 531 and the first laser 511 are aligned. With the second hermetic packaging module 520 connected to the second light inlet 312, the optical paths of the second optical waveguide 532 and the second laser 521 are aligned. This ensures that the first and second optical signals can be successfully transmitted to the multiplexer 501 on the photonic integrated chip 530, and reduces the loss during the transmission of the first and second optical signals to the multiplexer 501. The first laser is packaged within the first hermetic packaging module using a mature industry chain, allowing it to be directly packaged onto the optical component without changing its packaging form, thus improving the packaging efficiency of the optical component. The multiplexer 501 directly realizes the multiplexing of multiple optical signals, eliminating the need for multiple optical signals to be multiplexed through multiple glass slides with specific positional relationships as shown in existing solutions. This reduces the complexity of optical components and improves assembly efficiency.

[0079] For example, the first hermetic packaging module 510 includes a first laser 511 that emits a first optical signal, and the wavelength of the first optical signal can be λ1. The optical window 514 of the first hermetic packaging module 510 can be implemented by one or more lenses. The optical window 514 is used to couple the first optical signal emitted by the first laser 511 to the first end of the first optical waveguide 531. Here, coupling means that the optical window 514 is used to change the propagation direction of the first optical signal emitted by the first laser 511, so that the first optical signal can be accurately and with low loss incident on the first end of the first optical waveguide 531, thereby improving the signal quality of the first optical signal incident on the first optical waveguide 531. For example, the optical window 514 of the first hermetic packaging module 510 converges the first optical signal emitted by the first laser 511. To ensure that the first optical signal, after being converged through the optical window 514, can be successfully transmitted to the first end of the first optical waveguide 531, the optical path of the optical window 514 and the first end of the first optical waveguide 531 are aligned to ensure that the first optical signal emitted from the optical window 514 can be successfully transmitted to the first end of the first optical waveguide 531. It should be noted that the optical window 514 shown in this embodiment may not have a convergence function, but only a light transmission function. In this case, the first optical signal emitted from the first laser 511 can successfully pass through the optical window 514. To improve the coupling efficiency of the first optical signal, a first lens group may be included between the optical window 514 and the first end of the first optical waveguide 531. The first lens group includes one or more lenses and is used to couple the first optical signal emitted from the optical window 514 to the first end of the first optical waveguide 531. For example, the first lens group is used to converge the first optical signal emitted from the optical window 514 to the first end of the first optical waveguide 531. The second end of the first optical waveguide 531 is connected to the multiplexer 501, so the multiplexer 501 receives the first optical signal via the first optical waveguide 531. Alternatively, the optical window 514 may have a collimation function, in which case the optical window 514 collimates the first optical signal, and the first lens group is used to converge the collimated first optical signal to the first end of the first optical waveguide 531. Or, if the optical window 514 has a focusing function, then the optical window 514 focuses the first optical signal emitted from the first laser 511, and the first lens group further focuses the first optical signal from the optical window 514, transmitting the converged optical signal to the first end of the first optical waveguide 531, thus improving the coupling efficiency of the first optical signal to the first optical waveguide.

[0080] For example, the second hermetic module 520 includes a second laser that emits a second optical signal, and the wavelength of this second optical signal can be λ2. For a description of the optical window of the second hermetic module 520, please refer to the description of the optical window of the first hermetic module 510; details will not be repeated here. It can be understood that the optical window of the second hermetic module 520 is aligned with the optical path of the first end of the second optical waveguide 532 to ensure that the second optical signal emitted from the optical window of the second hermetic module 520 is successfully transmitted to the first end of the second optical waveguide 532. A second lens group may be included between the optical window of the second hermetic module 520 and the first end of the second optical waveguide 532. The second lens group includes one or more lenses. For a description of the second lens group, please refer to the description of the first lens group mentioned above; details will not be repeated here. The second end of the second optical waveguide 532 is connected to the multiplexer 501; therefore, the multiplexer 501 receives the second optical signal via the second optical waveguide 532. The first optical signal and the second optical signal are transmitted to the multiplexer 501 through the first optical waveguide 531 and the second optical waveguide 532 on the photonic integrated chip 530, thereby improving the efficiency of the transmission of the first optical signal and the second optical signal to the multiplexer 501 and reducing the loss.

[0081] In the field of optical communication, the commercial deployment of gigabit-capable PON (GPON) and 10-gigabit-capable passive optical network (XG-PON) is nearing its peak. Currently, 50-gigabit passive optical network (50GPON) and even higher-speed PON standards are about to be officially commercialized. This has led to a demand for optical components to simultaneously support GPON, 10GPON, 50GPON, and even higher speeds, meaning that optical components need to adopt multiple standards in one. For example, optical components might adopt a two-standard integration or a three-standard integration. For instance, the first laser in the first hermetically sealed module emits a first optical signal corresponding to a first standard, and the second laser emits a second optical signal corresponding to a second standard, where the first standard is different from the second standard. In other words, the first and second standards could be two of the following: GPON, 10GPON, and 50GPON. It is understood that the different lasers shown in this embodiment can emit optical signals corresponding to different standards. This difference in emission rates can be seen in the fact that the rate of the first optical signal emitted by the first laser differs from the rate of the second optical signal emitted by the second laser. For example, if the first laser emits a first optical signal corresponding to GPON, the rate of that first optical signal can be approximately 2.488 gigabits per second (Gbps). Similarly, if the first laser emits a first optical signal corresponding to 10GPON, the rate of that first optical signal can be approximately 10Gbps. Furthermore, if the first laser emits a first optical signal corresponding to 50GPON, the rate of that first optical signal is typically much higher than the rate of the optical signal corresponding to the GPON standard; for instance, the rate of the first optical signal emitting a 50GPON signal is approximately 50Gbps. Optionally, the difference in emission rates can also be seen in the wavelength of the first optical signal emitted by the first laser being different from the wavelength of the second optical signal emitted by the second laser. For example, if the first laser emits a first optical signal corresponding to GPON, the wavelength range of the first optical signal emitted by the first laser can be from 1480nm to 1500nm. As another example, if the first laser emits a first optical signal corresponding to 10GPON, the wavelength range of the first optical signal emitted by the first laser can be from 1575 to 1580nm. Similarly, if the first laser emits a first optical signal corresponding to 50GPON, the wavelength range of the first optical signal emitted by the first laser can be from 1340 to 1344nm. Optionally, the different standards of optical signals emitted by different lasers in this embodiment can also be reflected in the fact that the optical power and mode of the first optical signal emitted by the first laser are different from the optical power and mode of the second optical signal emitted by the second laser.It should be clarified that this embodiment does not limit the standard type corresponding to the optical signal emitted by each laser. For example, the laser can also emit optical signals corresponding to a standard with a lower speed than GPON, or it can emit optical signals corresponding to a standard with a higher speed than 50GPON.

[0082] The die 301 also includes a transmission optical port 321, which connects to the fiber optic assembly 503. The photonic integrated chip 530 also includes a third optical waveguide 533, the first end of which is connected to the multiplexer 501, and the second end of which is aligned with the optical path of the fiber optic assembly 503. The multiplexer 501 emits a combined optical signal through the third optical waveguide 533, which can be transmitted to the fiber optic assembly 503 via the transmission optical port 321. This embodiment uses the fiber optic assembly 503 as an example; in other examples, the optical assembly and the fiber optic assembly 503 can be discrete. This embodiment does not limit the method by which the fiber optic assembly 503 is connected to the transmission optical port 321; any method such as pluggable, pigtail, soldering, mechanical fixing, or adhesive bonding can be used. For example, the fiber optic assembly 503 can be a ferrule connector (FC), a subscriber connector (SC), a lucent connector (LC), a straight tip (ST), a fiber optic distributed data interface (FDDI), or a multi-fiber push-on connector (MPO). The fiber optic assembly 503 can also be connected to the fiber optic cable via movable connectors, modular fiber optic access structures, etc., without specific limitations.

[0083] To improve the efficiency of multiplexer 501 in transmitting combined optical signals to optical fiber assembly 503, a coupling module may be included between the third optical waveguide connected to multiplexer 501 and the transmission port 321. For example, this coupling module may be a mode converter. The mode converter is used to match the mode size between the optical fiber included in optical fiber assembly 503 and the third optical waveguide, thereby reducing the loss of the third optical waveguide in transmitting combined optical signals to optical fiber assembly 503. This mode converter may be a three-dimensional tapered mode converter, a double-layer tapered mode converter, an inverted tapered mode converter, or a suspended mode converter. It should be noted that this embodiment uses a mode converter as an example for the coupling module, but this is not a limitation. For example, the coupling module may also be an optical fiber coupler, a grating coupler, a waveguide coupler, etc., without specific limitations.

[0084] Figure 6 is a structural block diagram of a second embodiment of the optical component shown in Figure 3. The optical component in this embodiment includes a die 603, a first hermetically sealed module 601 and a second hermetically sealed module 602 connected to the die 603, and a photonic integrated chip 610 located inside the die 603. For a detailed description of the die 603, the first hermetically sealed module 601, and the second hermetically sealed module 602, please refer to the above embodiments; specific details will not be repeated here. The photonic integrated chip 610 includes a multiplexer 611 connected to both the first hermetically sealed module 601 and the second hermetically sealed module 602. For a description of the multiplexer 611, please refer to the above embodiments; specific details will not be repeated here. The photonic integrated chip 610 in this embodiment also includes a multiplexing / demultiplexing module 612 and K detectors, where K is any integer greater than or equal to 1. If K is 1, then the photonic integrated chip 610 includes one detector, which is directly connected to the multiplexing / demultiplexing module 612. If the value of K is greater than 1, then the photonic integrated chip 610 includes multiple detectors. For example, the photonic integrated chip 610 includes a first detector 621 and a second detector 622. The photonic integrated chip 610 also includes a first demultiplexer 613. The multiplexing and demultiplexing module 612 is connected to the multiplexer 611 and the first demultiplexer 613 through optical waveguides. The first demultiplexer 613 is connected to the first detector 621 and the second detector 622 through optical waveguides.

[0085] The third optical waveguide 643 connected to the multiplexing / demultiplexing module 612 is aligned with the optical path of the transmission port 614. The transmission port 614 is connected to the fiber optic assembly 615. For a description of the fiber optic assembly 615 and the transmission port 614, please refer to the corresponding description in Figure 5; details will not be repeated here. The multiplexing / demultiplexing module 612 is a single-fiber bidirectional device that can utilize WDM technology to achieve bidirectional transmission of optical signals. For example, when the multiplexing / demultiplexing module 612 receives a multiplexed optical signal from the multiplexer 611, it can transmit the multiplexed optical signal to the fiber optic assembly 615. When the multiplexing / demultiplexing module 612 receives an optical signal from the optical fiber assembly 615, the multiplexing / demultiplexing module 612 can transmit the optical signal to the first demultiplexing module 613. The first demultiplexing module 613 is used to demultiplex the optical signal to obtain a first target optical signal and a second target optical signal. The first demultiplexer 613 transmits the first target optical signal to the first detector 621 through the fourth optical waveguide 641, and transmits the second target optical signal to the second detector 622 through the fifth optical waveguide 642.

[0086] The first detector 621 is used to perform photoelectric conversion on the first target optical signal to obtain a first electrical signal. The first detector 621 can be a photodiode (PIN diode) or an avalanche photodiode (APD), etc. The second detector 622 is used to perform photoelectric conversion on the second target optical signal to obtain a second electrical signal. For a description of the type of the second detector 622, please refer to the description of the first detector 621; further details will not be provided here.

[0087] Referring again to Figures 3 and 4, the optical component further includes a flexible printed circuit (FPC) 401. The FPC 401 is used to electrically connect the first detector 621 and the second detector 622, and is also electrically connected to a circuit board. The FPC 401 is used to transmit the first and second electrical signals to the circuit board, which can be a PCB. The PCB has a processor packaged within it, which processes the first and second electrical signals. It should be noted that this embodiment uses the FPC to fan out the electrical signals emitted by the detectors on the photonic integrated chip onto the circuit board, but this is not a limitation; it is sufficient as long as the electrical signals emitted by the detectors can be successfully transmitted to the circuit board. Optionally, the FPC401 shown in this embodiment may further include a first transimpedance amplifier (TIA) and a second TIA. The first TIA receives a first electrical signal from the photonic integrated chip, amplifies the power of the first electrical signal, and sends the amplified first electrical signal to the circuit board. The second TIA receives a second electrical signal from the photonic integrated chip, amplifies the power of the second electrical signal, and sends the amplified second electrical signal to the circuit board. The first detector 621 can be electrically connected to the input terminal of the first TIA via wire bonding, and the second detector 622 can be electrically connected to the input terminal of the second TIA via wire bonding. The output terminals of both the first and second TIAs are electrically connected to the circuit board. This embodiment uses the FPC including the first and second TIAs as an example; in other examples, the first and second TIAs may also be located on the PCB or on the photonic integrated chip. The detectors shown in this embodiment, electrically connected to the circuit board via the FPC, effectively reduce impedance discontinuities, while simultaneously reducing the size of the optical components and improving their integration.

[0088] Taking the first hermetic packaging module as an example, the first hermetic packaging module shown in the above embodiment includes a first modulator. The first modulator receives a first optical signal from a first laser, modulates the first optical signal, and transmits the modulated first optical signal to the photonic integrated chip through the optical window of the first hermetic packaging module. It can be understood that the first and second optical signals received by the photonic integrated chip in the above embodiment are modulated optical signals. In the embodiment shown in Figure 7, the first and second optical signals received by the photonic integrated chip are unmodulated optical signals. Figure 7 is a structural block diagram of a third embodiment of the optical component shown in Figure 3. The optical component shown in the embodiment includes a die 703, a first hermetic packaging module 701 and a second hermetic packaging module 702 connected to the die 703, and the optical component also includes a photonic integrated chip 710 located inside the die 703. For a detailed description of the die 703, the first hermetic packaging module 701, and the second hermetic packaging module 702, please refer to the above embodiments; further details will not be repeated here. The photonic integrated chip 710 specifically includes a multiplexer 711, a multiplexing / demultiplexing module 712, a first demultiplexer 713, a first detector 721, and a second detector 722. For detailed descriptions, please refer to the corresponding description in Figure 6; further details are omitted here. The photonic integrated chip 710 shown in this embodiment also includes a first modulator 731 and a second modulator 732. The first modulator 731 is connected to the multiplexer 711 via an optical waveguide, and the first optical waveguide connected to the first modulator 731 is aligned with the optical path of the first hermetically sealed module 701. The second modulator 732 is connected to the multiplexer 711 via an optical waveguide, and the second optical waveguide connected to the second modulator 732 is aligned with the optical path of the second hermetically sealed module 702. For explanations of the alignment of the first optical waveguide with the first hermetically sealed module and the second optical waveguide with the second hermetically sealed module, please refer to the above embodiment; further details are omitted here. The first modulator 731 shown in this embodiment receives a first optical signal from the first hermetically sealed module 701 via a first optical waveguide on the photonic integrated chip. The first modulator 731 modulates the first optical signal to obtain a first modulated optical signal and transmits the first modulated optical signal to the multiplexer 711. This embodiment does not limit the type of the first modulator; for example, the first modulator can be an MZI or a micro-ring modulator. The second modulator 732 receives a second optical signal from the second hermetically sealed module 702 via a second optical waveguide on the photonic integrated chip. The second modulator 732 modulates the second optical signal to obtain a second modulated optical signal and transmits the second modulated optical signal to the multiplexer 711. For a description of the type of the second modulator 732, please refer to the description of the type of the first modulator 731; further details are omitted here.

[0089] As shown in this embodiment, taking the first modulator as an example, the first modulator is placed on the photonic integrated chip. The first modulator, externally mounted on the first hermetically sealed module, facilitates high-speed and high-precision modulation of the first optical signal emitted from the first hermetically sealed module. Furthermore, external mounting of the first modulator on the first hermetically sealed module reduces the heat dissipation pressure on the module and improves the stability of the optical signal emitted by the optical component. The first hermetically sealed module eliminates the need for a hermetically sealed first modulator, thereby increasing the optical power of the first optical signal emitted by the module, effectively improving the optical power of the optical signal emitted by the optical component, and enhancing communication efficiency.

[0090] Figure 8 is a structural block diagram of a fourth embodiment of the optical component shown in Figure 3. The optical component shown in this embodiment includes a die 803, a first hermetically sealed module 801 and a second hermetically sealed module 802 connected to the die 803, and a photonic integrated chip 810 located inside the die 803. For a detailed description of the die 803, the first hermetically sealed module 801, and the second hermetically sealed module 802, please refer to the above embodiment; details will not be repeated here. The photonic integrated chip 810 specifically includes a multiplexer 811, a multiplexing / demultiplexing module 812, a first demultiplexer 813, a first detector 821, and a second detector 822. For a detailed description, please refer to the corresponding description in Figure 7; details will not be repeated here. The photonic integrated chip 810 shown in this embodiment also includes a second demultiplexer 850, a first modulator 831, a second modulator 832, and a third modulator 833. For a description of the first modulator 831 and the second modulator 832, please refer to the corresponding description in Figure 7; details will not be repeated here. A third modulator 833 can be connected between the second demultiplexer 850 and the multiplexer 811 shown in this embodiment. The number of modulators connected between the second demultiplexer 850 and the multiplexer 811 is L, where L is any integer greater than or equal to 2. This embodiment does not limit the value of L. For a description of the second demultiplexer 850, please refer to the description of the first demultiplexer shown in the above embodiment; details will not be repeated here. The first optical waveguide connected to the second demultiplexer 850 is aligned with the optical path of the first hermetically sealed module 801. The second demultiplexer 850 receives a first optical signal from the first hermetically sealed module 801. This first optical signal is a multiplexed optical signal. The second demultiplexer 850 then demultiplexes the first optical signal to obtain a first sub-optical signal and a second sub-optical signal. The second demultiplexer 850 sends a first sub-optical signal to the first modulator 831 and a second sub-optical signal to the third modulator 833. The first modulator 831 modulates the first sub-optical signal to obtain a third sub-optical signal, and the third modulator 833 modulates the second sub-optical signal to obtain a fourth sub-optical signal. The first modulator 831 sends the third sub-optical signal through the optical waveguide multiplexer 811, and the third modulator 833 sends the fourth sub-optical signal through the optical waveguide multiplexer 811. When the multiplexer 811 receives the third sub-optical signal, the fourth sub-optical signal, and the second optical signal, it performs multiplexing to obtain a combined optical signal. For an explanation of how the multiplexer 811 transmits the combined optical signal to the optical fiber assembly 815, please refer to the above embodiment; specific details will not be repeated here.

[0091] Figure 9 is a structural block diagram of a fifth embodiment of the optical component shown in Figure 3. The optical component in this embodiment includes a die 903, a first hermetically sealed module 901 and a second hermetically sealed module 902 connected to the die 903, and a photonic integrated chip 904 located inside the die 903. This embodiment does not limit the specific structure of the photonic integrated chip 904; for example, the structure of the photonic integrated chip 904 can be seen in any of the embodiments shown in Figures 5, 6, 7, or 8, and will not be described in detail here. The photonic integrated chip 904 in this embodiment includes a third optical waveguide 905. For example, in the example shown in Figure 5, the third optical waveguide is located between the multiplexer 501 and the transmission optical port 321. In the examples shown in Figures 6, 7, and 8, the third optical waveguide is located between the multiplexing / demultiplexing module and the transmission optical port. A third lens group is included between the photonic integrated chip 904 and the optical fiber component 906 in this embodiment, and the third lens group includes at least one lens. The third lens group is used to couple optical signals between the fiber optic assembly 906 and the third optical waveguide 905. For example, the third lens group includes a first lens 907 and a second lens 908. This embodiment does not limit the number of lenses included in the third lens group. For example, the second lens 908 receives the combined optical signal from the third optical waveguide 905. For a description of the combined optical signal, please refer to the above embodiment, which will not be repeated here. The second lens 908 collimates the combined optical signal and transmits the collimated combined optical signal to the first lens 907. The first lens 907 is used to converge the combined optical signal and converge the converged combined optical signal to the fiber optic assembly 906. If the fiber optic assembly 906 transmits an optical signal to the photonic integrated chip 904, the first lens 907 receives the optical signal from the fiber optic assembly and collimates the optical signal. The first lens 907 transmits the collimated optical signal to the second lens 908, and the second lens 908 converges the optical signal and converges the optical signal to the third optical waveguide 905. Based on the third lens group shown in this embodiment, the loss of optical signals transmitted between the third optical waveguide and the optical fiber assembly is effectively reduced. It should be noted that this embodiment does not limit the number of lenses included in the third lens group. For example, if the third lens group includes one lens, the lens can focus the combined optical signal from the third optical waveguide 905 onto the optical fiber assembly 906. Or, the lens can also focus the optical signal from the optical fiber assembly 906 onto the third optical waveguide 905.

[0092] This embodiment does not limit the positional relationship between the third lens group and the transmission optical port of the chip 903. For example, the third lens group may be located between the transmission optical port and the third optical waveguide 905, or the third lens group may be located inside the transmission optical port, etc. The specific relationship is not limited.

[0093] Figure 10 is a structural block diagram of the sixth embodiment of the optical component shown in Figure 3. The optical component shown in this embodiment includes a die 1003, a first hermetically sealed module 1001 and a second hermetically sealed module 1002 connected to the die 1003, and a photonic integrated chip 1004 located inside the die 1003. This embodiment does not limit the specific structure of the photonic integrated chip 1004; for example, the structure of the photonic integrated chip 1004 can be seen in any embodiment shown in Figures 5, 6, 7, or 8, and will not be described in detail here. The photonic integrated chip 1004 shown in this embodiment includes a third optical waveguide 1005. For a description of the third optical waveguide 1005, please refer to the description of the third optical waveguide corresponding to Figure 9, and will not be described in detail here. The optical fiber component 1006 shown in this embodiment includes an optical fiber 1007 for transmitting optical signals. In this embodiment, optical fiber 1007 extends through the transmission optical port to the photonic integrated chip 1004, thereby coupling optical fiber 1007 with the third optical waveguide 1005 and realizing the transmission of optical signals between the third optical waveguide 1005 and optical fiber 1007. The coupling between optical fiber 1007 and third optical waveguide 1005 means that the axial center of optical fiber 1007 is aligned with and in contact with the axial center of third optical waveguide 1005. Alternatively, the axial center of optical fiber 1007 and the axial center of third optical waveguide 1005 may be on the same straight line, and there may be a certain gap between the end of optical fiber 1007 and the end of third optical waveguide 1005. In this embodiment, the size of the gap is not limited, as long as the transmission of optical signals between the third optical waveguide 1005 and optical fiber 1007 is achieved. For example, the end of the optical fiber 1007 and the end of the third optical waveguide 1005 are bonded together with optical adhesive. The optical adhesive can achieve refractive index matching between the ends of the optical fiber 1007 and the third optical waveguide 1005, thereby improving the coupling efficiency of optical signals between the optical fiber 1007 and the third optical waveguide 1005.

[0094] This application also provides an optical module, which includes a PCB and an optical component connected to the PCB. The optical component is used to transmit and receive service electrical signals with the PCB. For a description of the optical component, please refer to the above embodiment. For a description of the optical module, please refer to the description corresponding to Figure 2a. Detailed explanations are omitted here.

[0095] This embodiment also provides an optical communication device. For a description of the structure of the optical communication device, please refer to the description corresponding to Figure 2a, which will not be repeated here.

[0096] This embodiment also provides an optical network, which includes a first optical communication device and a second optical communication device. For a description of the optical components included in the first and second optical communication devices, please refer to the above embodiment; specific details will not be repeated here. The optical fiber components of the first and second optical communication devices are connected by optical fibers.

[0097] Figure 11 is a structural example diagram of one embodiment of the radar provided in this application. This embodiment uses a lidar (Light Detection Radar) as an example. Lidar is a target detection technology. The lidar emits a light signal, which is diffusely reflected when it encounters a target object. The distance, azimuth, altitude, speed, attitude, shape, and other characteristics of the target object are determined by the reflected target light signal. Lidar is applied to fields such as intelligent driving vehicles, intelligent aircraft, 3D printing, virtual reality (VR), augmented reality (AR), and service robots. The intelligent driving in this embodiment can be unmanned driving, autonomous driving, or assisted driving.

[0098] The lidar 1100 shown in this embodiment includes a processor 1101 and a first optical component 1102 and a second optical component 1103 respectively connected to the processor 1101. For a description of the first optical component 1102, please refer to the above embodiment; specific details will not be repeated here. Specifically, the processor 1101 sends a first detection electrical signal and a second detection electrical signal to the first hermetically sealed module and the second hermetically sealed module in the first optical component 1102. The first laser in the first hermetically sealed module emits a first optical signal based on the first detection electrical signal. The second laser in the second hermetically sealed module emits a second optical signal based on the second detection electrical signal. The intensity, frequency, and phase of the first and second optical signals are modulated to adapt to detection requirements, improving detection accuracy and efficiency. When the first and second optical signals encounter the target object, they are reflected on the surface of the target object. Specifically, after the target object receives the first optical signal, the reflected first echo light signal is received by the second optical component 1103 of the lidar 1100, and after the target object receives the second optical signal, the reflected second echo light signal is received by the second optical component 1103 of the lidar 1100. The second optical component 1103 is used to convert the first echo light signal into a first electrical signal and the second echo light signal into a second electrical signal. The second optical component 1103 sends the first and second electrical signals to the processor 1101, which obtains relevant information about the target object based on the first and second electrical signals. Simultaneously, the lidar 1100 can also acquire the position information of each point on the surface of the target object and generate a point cloud image of the target object by emitting light signals with different spatial orientations towards the target object. This embodiment does not limit the structure of the second optical component 1103, as long as it can convert each received echo light signal into an electrical signal. For example, the second optical component 1103 includes a die, which includes a transmission optical port connected to an optical fiber component for receiving echo optical signals. The die internally includes a photonic integrated chip, which includes a receiving optical waveguide, a demultiplexer, and multiple detectors. For example, the multiple detectors specifically include a first detector and a second detector. For a description of the optical fiber component and the photonic integrated chip including the receiving optical waveguide, demultiplexer, and detectors, please refer to the above embodiments; further details will not be repeated here.The receiving optical waveguide is aligned with the optical fiber assembly to receive the echo optical signal from the optical fiber assembly. The receiving optical waveguide transmits the echo optical signal to the demultiplexer. The demultiplexer demultiplexes the echo optical signal to obtain a first echo optical signal and a second echo optical signal. The demultiplexer sends the first echo optical signal to a first detector, which converts the first echo optical signal into a first electrical signal. The demultiplexer sends the second echo optical signal to a second detector, which converts the second echo optical signal into a second electrical signal. The photonic integrated chip sends the first electrical signal and the second electrical signal to the processor 1101.

[0099] It should be clarified that this embodiment takes the lidar 1100 including a second optical component for detection as an example. In other examples, the lidar may only include a processor and a first optical component, without including the second optical component for detection.

[0100] The lidar 1100 shown in Figure 11 can be applied to vehicles as an example. In other examples, lidar 1100 can also be applied to fixed radar (such as radar fixed on highways, monitoring radar, radar in industrial scenarios, etc.). Lidar 1100 can also be applied to radar of unmanned transport vehicles in logistics warehouses or radar of smart home appliances in smart homes (such as automatic cleaning robots), etc., without specific limitations.

[0101] This embodiment also provides a vehicle, the specific structure of which is illustrated in Figure 12, which is a structural example of an embodiment of the vehicle provided in this application. The vehicle shown in this example can be a car, truck, motorcycle, public vehicle, lawnmower, recreational vehicle, amusement park vehicle, tram, golf cart, train, handcart, or drone, etc. This embodiment configures the vehicle 1200 in a fully or partially automated driving mode. The vehicle shown in this embodiment includes a vehicle body, which is used to fix a sensor system 1220, an advanced driving assistance system (ADAS) 1210, peripheral devices 1230, and a computer system 1240.

[0102] Sensing system 1220 includes one or more sensors that sense environmental information about the vicinity of vehicle 1200. For example, sensing system 1220 may include a positioning system, such as a Global Positioning System (GPS) or BeiDou Navigation Satellite System. Sensing system 1220 also includes an inertial measurement unit (IMU), lidar, and cameras. For a description of lidar, please refer to the embodiment corresponding to Figure 11; specific details are not limited thereto. Sensing system 1220 may also include sensors for monitoring internal systems of vehicle 1200 (e.g., in-vehicle air quality monitor, fuel gauge, oil temperature gauge, etc.). Sensor data from one or more of these sensors can be used to detect objects and their corresponding characteristics (position, shape, orientation, speed, etc.). The positioning system can be used to estimate the geographical location of vehicle 1200. The IMU is used to sense changes in the position and orientation of vehicle 1200 based on inertial acceleration. The IMU may be a combination of an accelerometer and a gyroscope. LiDAR can use radio signals to detect target objects in the environment surrounding a vehicle 1200, such as pedestrians, vehicles, or buildings.

[0103] The ADAS1210 continuously senses the surrounding environment during vehicle operation, collecting data to identify, detect, and track static and dynamic objects. It then combines this data with navigation map data for system calculations and analysis, allowing the driver to anticipate potential hazards and effectively increasing driving comfort and safety. For example, the ADAS1210 can control the vehicle using data acquired by its sensor system. Furthermore, the ADAS1210 can control the vehicle based on driving-related information, such as key data displayed on the vehicle's dashboard (fuel consumption, engine speed, temperature, etc.), vehicle speed, steering wheel angle, or vehicle attitude data.

[0104] Vehicle 1200 interacts with external sensors, other vehicles, other computer systems, or users via peripheral device 1230. Peripheral device 1230 may include a wireless communication system, an onboard computer, a microphone, and / or a speaker. For example, the onboard computer may provide information to the user of vehicle 1200. The user interface may also operate the onboard computer to receive user input. The onboard computer may be operated via a touchscreen. In other cases, peripheral device 1230 may provide a means for vehicle 1200 to communicate with other devices located within the vehicle. For example, a microphone may receive audio (e.g., voice commands or other audio input) from the user of vehicle 1200. A speaker may output audio to the user of vehicle 1200. The wireless communication system may communicate wirelessly with one or more devices directly or via a communication network.

[0105] Some or all of the functions of the vehicle 1200 are controlled by a computer system 1240. The computer system 1240 can control the functions of the vehicle 1200 based on input received from various systems (e.g., sensor system 1220, ADAS 1210, peripheral devices 1230) and from a user interface. The computer system 1240 may include at least one processor that executes instructions stored in memory.

[0106] Figure 13 is a structural example diagram of a second embodiment of the optical component provided in this application. The optical component 1300 shown in this embodiment includes a die 1301 and a hermetically sealed module 1302. For a detailed description of the hermetically sealed module 1302, please refer to the description corresponding to Figure 3; details will not be repeated here. The die 1301 shown in this embodiment includes an input port 1322 and a transmission port 1321. This embodiment does not limit the relative positional relationship between the input port 1322 and the transmission port 1321. Figure 13 shows an example where the axis of the input port 1322 is perpendicular to the axis of the transmission port 1321. In other examples, the axis of the input port 1322 and the axis of the transmission port 1321 can intersect at any angle. Alternatively, the axis of the input port 1322 and the axis of the transmission port 1321 can be parallel. For example, the axis of the optical input port 1322 can coincide with the axis of the optical transmission port 1321. The optical input port 1322 is used to connect to the hermetically sealed module 1302 to ensure that the optical signal emitted from the hermetically sealed module 1302 can be transmitted to the inside of the die 1301 via the optical input port 1322. For an explanation of the connection between the hermetically sealed module 1302 and the optical input port 1322, please refer to the corresponding description in Figure 3, which will not be repeated here. Inside the die 1301 shown in this embodiment, a photonic integrated circuit (PIC) is fixed in a non-hermetically sealed manner. For an explanation of the photonic integrated circuit, please refer to the corresponding description in Figure 3, which will not be repeated here. The photonic integrated chip includes an optical waveguide. When the hermetically sealed module 1302 is connected to the optical input port 1322, the optical paths of the hermetically sealed module 1302 and the optical waveguide are aligned. Specifically, the optical signals emitted from the output ports of one or more lasers included in the hermetically sealed module 1302 can pass through the optical input port 1322 and be incident on the optical waveguide. In this embodiment, the photonic integrated chip is fixed inside the die 1301. When the hermetically sealed module 1302 is connected to the optical input port 1322, it ensures that the optical signals emitted from the output ports of the lasers in the hermetically sealed module 1302 can be transmitted to the transmission port 1321 via the photonic integrated chip, and reduces the loss during the transmission of the optical signal to the transmission port 1321. For a description of the laser packaged in the hermetically sealed module 1302, please refer to the above embodiment; specific details will not be repeated here. In the field of optical communication, the commercial deployment of gigabit-capable PON (GPON) and 10-gigabit-capable passive optical network (XG-PON) is nearing its peak. Currently, 50-gigabit passive optical network (50-gigabit PON, 50GPON) and even faster PON standards are about to be officially commercialized.Therefore, a demand has been put forward for optical components to simultaneously achieve GPON, 10GPON, 50GPON, and even higher speeds, meaning that the optical components need to adopt multiple standards in one. For example, the optical components can adopt two standards in one, or three standards in one, etc. For example, at least one laser of the hermetically sealed module 1302 emits optical signals corresponding to at least two standards of GPON, 10GPON, and 50GPON. The die 1301 also includes a transmission optical port 1321, which connects to the optical fiber assembly 1303. For a description of the transmission optical port 1321 and the optical fiber assembly 1303, please refer to the above embodiment, and specific details will not be repeated here.

[0107] Optionally, the photonic integrated chip shown in this embodiment further includes a multiplexing / demultiplexing module and K detectors, where K is any integer greater than or equal to 1. If K is 1, please refer to the description corresponding to Figure 6 for an explanation of the K detectors and the multiplexing / demultiplexing module; details will not be repeated here. Optionally, the K detectors include a first detector and a second detector. The photonic integrated chip further includes a first demultiplexer. The multiplexing / demultiplexing module is also connected to the first demultiplexer. The first demultiplexer is connected to both the first detector and the second detector. Please refer to the description corresponding to Figure 6 for a detailed explanation; details will not be repeated here. Optionally, the optical component further includes an FPC, which is used to electrically connect the K detectors. Please refer to the above embodiment for a detailed explanation; details will not be repeated here. Optionally, the hermetically sealed module 1302 includes a modulator. The modulator receives optical signals from a laser inside the hermetically sealed module 1302, modulates the optical signals, and transmits the modulated optical signals to the photonic integrated chip through the optical window of the hermetically sealed module 1302. Optionally, the optical signal received by the photonic integrated chip from the hermetically sealed module 1302 is an unmodulated optical signal. Therefore, the photonic integrated chip 710 also includes a modulator, wherein the modulator is aligned with the optical path of the hermetically sealed module 1302 via an optical waveguide on the photonic integrated chip. In this embodiment, the modulator receives the optical signal from the hermetically sealed module 1302 via the optical waveguide on the photonic integrated chip. The modulator modulates the optical signal to obtain a modulated optical signal. For details, please refer to the description corresponding to Figure 7, which will not be repeated here. Optionally, the photonic integrated chip shown in this embodiment also includes a second demultiplexer, a first modulator, a third modulator, and a multiplexer. For details, please refer to the description corresponding to Figure 8, which will not be repeated here.

[0108] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0109] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical component, characterized in that, The device includes a die and N hermetically sealed modules, where N is any integer greater than or equal to 2. The die includes M optical input ports and a transmission port, where M is any integer greater than or equal to 2. The transmission port is connected to an optical fiber assembly. The N hermetically sealed modules include a first hermetically sealed module and a second hermetically sealed module. The first hermetically sealed module is used to hermetically seal a first laser, and the second hermetically sealed module is used to hermetically seal a second laser. The M optical input ports include a first optical input port and a second optical input port. The first optical input port is connected to the first hermetically sealed module, and the second optical input port is connected to the second hermetically sealed module. The die contains a photonic integrated chip, which includes a multiplexer, a first optical waveguide, and a second optical waveguide. The first end of the first optical waveguide is aligned with the optical path of the first hermetically sealed module, and the first end of the second optical waveguide is aligned with the optical path of the second hermetically sealed module. The multiplexer is connected to the second end of the first optical waveguide and the second end of the second optical waveguide, respectively. The multiplexer is used to receive a first optical signal from the first laser through the first optical waveguide and a second optical signal from the second laser through the second optical waveguide. The multiplexer is also used to multiplex the first optical signal and the second optical signal to obtain a combined optical signal and to transmit the combined optical signal to the optical fiber assembly.

2. The optical component according to claim 1, characterized in that, The rate of the first optical signal emitted by the first laser is different from the rate of the second optical signal emitted by the second laser.

3. The optical component according to claim 1 or 2, characterized in that, The first laser emits the first optical signal corresponding to the first standard, and the second laser emits the second optical signal corresponding to the second standard. The first standard and the second standard are two standards among Gigabit Passive Optical Network (GPON), 50GPON, and 10GPON, respectively.

4. The optical component according to any one of claims 1 to 3, characterized in that, The optical window of the first hermetically sealed module is aligned with the optical path of the first optical waveguide, and the optical window of the first hermetically sealed module is used to couple the first optical signal to the first optical waveguide. The optical window of the second hermetically sealed module is aligned with the optical path of the second optical waveguide, and the optical window of the second hermetically sealed module is used to couple the second optical signal to the second optical waveguide.

5. The optical component according to any one of claims 1 to 4, characterized in that, The first hermetically sealed module includes a first lens group between its optical window and the first optical waveguide. The first lens group includes at least one lens and is used to couple the first optical signal emitted from the first hermetically sealed module to the first optical waveguide. The second hermetically sealed module includes a second lens group between its optical window and the second optical waveguide. The second lens group includes at least one lens and is used to couple the second optical signal emitted from the second hermetically sealed module to the second optical waveguide.

6. The optical component according to any one of claims 1 to 5, characterized in that, The photonic integrated chip also includes a multiplexing / demultiplexing module and K detectors, where K is any integer greater than or equal to 1. The K detectors include a first detector. The multiplexing / demultiplexing module is aligned with the optical path of the optical fiber assembly. The multiplexing / demultiplexing module is connected to the first detector and the multiplexer, respectively. The multiplexing / demultiplexing module is used to transmit the multiplexed optical signal from the multiplexer to the optical fiber assembly, and to transmit the first target optical signal from the optical fiber assembly to the first detector; The first detector is used to perform photoelectric conversion on the first target optical signal to obtain a first electrical signal.

7. The optical component according to claim 6, characterized in that, The K detectors also include a second detector, the photonic integrated chip also includes a first demultiplexer, the multiplexing / demultiplexing module is also connected to the first demultiplexer, and the first demultiplexer is connected to the first detector and the second detector respectively; The multiplexing / demultiplexing module is also used to transmit optical signals from the optical fiber assembly to the first demultiplexer; The first demultiplexer is used to demultiplex the optical signal to obtain the first target optical signal and the second target optical signal, and is used to transmit the first target optical signal to the first detector and the second target optical signal to the second detector; The second detector is used to perform photoelectric conversion on the second target optical signal to obtain a second electrical signal.

8. The optical component according to claim 6 or 7, characterized in that, The first detector is electrically connected to a flexible circuit board (FPC), and the FPC is electrically connected to a circuit board. The FPC is used to transmit the first electrical signal from the first detector to the circuit board.

9. The optical component according to any one of claims 1 to 8, characterized in that, The photonic integrated chip further includes a first modulator and a second modulator respectively connected to the multiplexer. The first optical waveguide is located between the first hermetically sealed module and the first modulator. The first modulator is used to receive the first optical signal from the first hermetically sealed module through the first optical waveguide and to modulate the first optical signal to obtain a first modulated optical signal. The second optical waveguide is located between the second hermetically sealed module and the second modulator. The second modulator is used to receive the second optical signal from the second hermetically sealed module through the second optical waveguide and to modulate the second optical signal to obtain a second modulated optical signal. The multiplexer is used to multiplex the first modulated optical signal and the second modulated optical signal to obtain the combined optical signal.

10. The optical component according to any one of claims 1 to 8, characterized in that, The photonic integrated chip further includes a second demultiplexer, a first modulator, and a third modulator. The first optical waveguide is located between the first hermetically sealed module and the second demultiplexer. The second demultiplexer is used to receive the first optical signal from the first hermetically sealed module through the first optical waveguide, and to demultiplex the first optical signal to obtain a first sub-optical signal and a second sub-optical signal. The first modulator is used to modulate the first sub-optical signal to obtain a third sub-optical signal, and to transmit the third sub-optical signal to the multiplexer; The third modulator is used to modulate the second sub-optical signal to obtain a fourth sub-optical signal, and transmit the fourth sub-optical signal to the multiplexer; The multiplexer is used to multiplex the third sub-optical signal and the fourth sub-optical signal to obtain a combined optical signal.

11. The optical component according to any one of claims 1 to 10, characterized in that, A third lens group is included between the photonic integrated chip and the optical fiber assembly, and the third lens group includes at least one lens. The third lens group is used to receive the combined optical signal from the photonic integrated chip and to couple the combined optical signal to the optical fiber assembly.

12. The optical component according to any one of claims 1 to 10, characterized in that, The photonic integrated chip also includes a third optical waveguide, which is coupled to the optical fiber assembly.

13. The optical component according to any one of claims 1 to 12, characterized in that, The first hermetically sealed module and the second hermetically sealed module are in transistor-outline TO package or box package.

14. An optical module, characterized in that, It includes a circuit board and one or more optical components connected to the circuit board, the optical components being as described in any one of claims 1 to 13.

15. An optical communication device, characterized in that, It includes a device board and an optical module as described in claim 14 connected to the device board.

16. A radar, characterized in that, Includes a processor and an optical component connected to the processor, the optical component being as described in any one of claims 1 to 13; The processor is used to send a first detection electrical signal to the first hermetically sealed module and to send a second detection electrical signal to the second hermetically sealed module; The first hermetically sealed module is used to process the first detection electrical signal into the first optical signal, and the second hermetically sealed module is used to process the second detection electrical signal into the second optical signal. The first optical signal and the second optical signal are used to detect relevant information of the target object.

17. An optical component, characterized in that, The device includes a die and a hermetically sealed module. The die includes an input optical port and a transmission optical port. The transmission optical port is connected to an optical fiber assembly. The hermetically sealed module is used to hermetically seal at least one laser. The input optical port is connected to the hermetically sealed module. The die contains a photonic integrated chip, which is used to transmit optical signals from the hermetically sealed module to the optical fiber assembly.

18. The optical component according to claim 17, characterized in that, The hermetically sealed module includes at least one laser that emits optical signals corresponding to at least two of the following standards: Gigabit Passive Optical Network (GPON), 50GPON, and 10GPON.

19. The optical component according to claim 17 or 18, characterized in that, The photonic integrated chip includes an optical waveguide, and the optical window of the hermetically sealed module is aligned with the optical path of the optical waveguide. The optical window of the hermetically sealed module is used to couple the optical signal to the optical waveguide.

20. The optical component according to any one of claims 17 to 19, characterized in that, The photonic integrated chip also includes a multiplexing / splitting module and K detectors, where K is any integer greater than or equal to 1, and the K detectors include a first detector. The multiplexing / splitting module is aligned with the optical path of the optical fiber assembly, and the multiplexing / splitting module is connected to the first detector. The multiplexing and splitting module is used to transmit the optical signal from the hermetically sealed module to the optical fiber assembly, and to transmit the first target optical signal from the optical fiber assembly to the first detector; The first detector is used to perform photoelectric conversion on the first target optical signal to obtain a first electrical signal.

21. The optical component according to claim 20, characterized in that, The K detectors also include a second detector, the photonic integrated chip also includes a first demultiplexer, the multiplexing / demultiplexing module is also connected to the first demultiplexer, and the first demultiplexer is connected to the first detector and the second detector respectively; The multiplexing / demultiplexing module is also used to transmit optical signals from the optical fiber assembly to the first demultiplexer; The first demultiplexer is used to demultiplex the optical signal to obtain the first target optical signal and the second target optical signal, and is used to transmit the first target optical signal to the first detector and the second target optical signal to the second detector; The second detector is used to perform photoelectric conversion on the second target optical signal to obtain a second electrical signal.

22. The optical component according to claim 20 or 21, characterized in that, The first detector is electrically connected to a flexible circuit board (FPC), and the FPC is electrically connected to a circuit board. The FPC is used to transmit the first electrical signal from the first detector to the circuit board.

23. The optical component according to any one of claims 17 to 22, characterized in that, The photonic integrated chip also includes a modulator, which is used to receive the optical signal from the hermetically sealed module and to modulate the optical signal to obtain a modulated optical signal.

24. The optical component according to any one of claims 17 to 22, characterized in that, The photonic integrated chip further includes a multiplexer, a second demultiplexer, a first modulator, and a third modulator. The second demultiplexer is used to receive the optical signal from the hermetically sealed module and to demultiplex the optical signal to obtain a first sub-optical signal and a second sub-optical signal. The first modulator is used to modulate the first sub-optical signal to obtain a third sub-optical signal, and to transmit the third sub-optical signal to the multiplexer; The third modulator is used to modulate the second sub-optical signal to obtain a fourth sub-optical signal, and transmit the fourth sub-optical signal to the multiplexer; The multiplexer is used to multiplex the third sub-optical signal and the fourth sub-optical signal to obtain a combined optical signal, and to transmit the combined optical signal to the optical fiber assembly.

25. The optical component according to any one of claims 17 to 24, characterized in that, The hermetically sealed module is packaged in a transistor-outline TO package or a box-type BOX package.

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