Optical module

Abstract

An optical module (200), comprising a first optical transmitting component (400a), a first optical receiving assembly (501) and a signal processing chip (310) which are arranged in a first propagation direction of a first optical signal; the first optical receiving assembly (501) comprises a first reflective surface (5112), a second reflective surface (5113), a third reflective surface (5142) and an optical receiving chip (515), the first reflective surface (5112) being arranged on an optical path in the first propagation direction, the second reflective surface (5113) being arranged on an optical path in a second propagation direction, the third reflective surface (5142) being located on a reflecting optical path of the second reflective surface (5113), and the optical receiving chip (515) being located on a reflecting optical path of the third reflective surface (5142). The first optical signal is reflected once by the first reflective surface (5112) and then reflected once by the second reflective surface (5113), such that the propagation direction of the first optical signal is deflected twice and accordingly the placement direction of the first optical receiving assembly (501) is also deflected twice, thereby shortening the size of the first optical receiving assembly (501) in the first propagation direction of the first optical signal, and further shortening the distance between the first optical transmitting component (400a) and the signal processing chip (310).

Description

An optical module

[0001] This application claims priority to Chinese Patent Application No. 202411562055.1, filed on November 4, 2024; and priority to Chinese Patent Application No. 202521866043.8, filed on August 29, 2025; the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0003] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Summary of the Invention

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] An optical receiving component, located on the circuit board, is used to receive optical signals;

[0007] Optical receiver chip;

[0008] The structure of the optical receiving component satisfies any one of the following:

[0009] The optical receiving component includes a first optical receiving assembly located on the surface of the circuit board for receiving a first optical signal; the first optical receiving assembly includes: a first reflective surface, a third reflective surface, and an optical receiving matching chip.

[0010] The first reflective surface is disposed on the optical path of the first optical signal in the first propagation direction; the first optical signal is reflected by the first reflective surface, so that the propagation direction of the first optical signal changes from the first propagation direction to the second propagation direction;

[0011] The third reflective surface is located on the reflected light path of the first reflective surface; the light receiving chip is located on the reflected light path of the third reflective surface.

[0012] A signal processing chip is disposed on the surface of the circuit board, and the optical receiving matching chip is electrically connected to the signal processing chip.

[0013] Alternatively, the optical receiving component may include a third optical receiving assembly, which includes: a receiving fiber optic adapter, a first lens, a third displacement prism, a beam splitter, a second lens, a deflection prism, and a first enclosure.

[0014] The first lens is located on the output optical path of the receiving fiber optic adapter;

[0015] The third displacement prism is located in the light output path of the first lens and is used to change the displacement of the light signal, but does not change the transmission direction of the light signal.

[0016] The beam splitter is located in the light output path of the third displacement prism; the beam splitter and the first lens are respectively located on both sides of the third displacement prism; the beam splitter is closer to the center of the circuit board than the first lens;

[0017] The second lens is located in the output optical path of the beam splitter;

[0018] The deflection prism is located in the light-emitting path of the second lens and is used to change the transmission direction of the optical signal. The optical receiving chip is located in the light-emitting path of the deflection prism.

[0019] The first enclosure has a storage notch; the storage notch faces the second lens, and the light receiving chip is disposed at the storage notch. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0022] Figure 2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0023] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0024] Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 5 is an internal structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0026] Figure 6 is an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0027] Figure 7 is a partial exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0028] Figure 8 is a structural diagram of a collimator adapter array provided according to some embodiments of the present disclosure;

[0029] Figure 9 is a structural diagram of a first optical receiving component provided according to some embodiments of the present disclosure;

[0030] Figure 10 is a structural diagram of a first optical receiving component provided according to some embodiments of the present disclosure from another perspective;

[0031] Figure 11 is a structural diagram of another first optical receiving component provided according to some embodiments of the present disclosure;

[0032] Figure 12 is a structural diagram of an optical receiving component provided according to some embodiments of the present disclosure;

[0033] Figure 13 is a structural diagram of another optical receiving component provided according to some embodiments of the present disclosure;

[0034] Figure 14 is an internal structural diagram of another optical module provided according to some embodiments of the present disclosure;

[0035] Figure 15 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure from another perspective;

[0036] Figure 16 is a cross-sectional view of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0037] Figure 17 is an internal structural diagram of another optical module provided according to some embodiments of the present disclosure;

[0038] Figure 18 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure from another perspective;

[0039] Figure 19 is a cross-sectional view of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0040] Figure 20a is an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0041] Figure 20b is an internal structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0042] Figure 20c is an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0043] Figure 21a is a partially exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0044] Figure 21b is a partially exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0045] Figure 21c is a partially exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0046] Figure 21d is a partially exploded view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0047] Figure 22a is an exploded view of a third optical receiving component provided according to some embodiments of the present disclosure;

[0048] Figure 22b is a partial view of a third optical receiving component provided according to some embodiments of the present disclosure;

[0049] Figure 23 is a structural diagram of a first protective housing provided according to some embodiments of the present disclosure;

[0050] Figure 24 is a cross-sectional view of the internal structure of an optical module according to some embodiments of the present disclosure;

[0051] Figure 25 is a structural diagram of a second protective housing provided according to some embodiments of the present disclosure;

[0052] Figure 26 is a cross-sectional view of the internal structure of an optical module provided according to some embodiments of the present disclosure. Detailed Implementation

[0053] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0054] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0055] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0056] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0057] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0058] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0059] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0060] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0061] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0062] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0063] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0064] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0065] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0066] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0067] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0068] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0069] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in a receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0070] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0071] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0072] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0073] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0074] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0075] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, in some embodiments, the optical module 200 includes a shell, which includes an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0076] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0077] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0078] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200.

[0079] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0080] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0081] As shown in Figures 3 and 4, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0082] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0083] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0084] In some embodiments, the circuit board further includes gold fingers formed on its end surfaces, the gold fingers consisting of a plurality of independent pins. (Circuit board 300VS circuit board; reference numerals are strongly indicative and should be consistent with the form shown in the figures. If the concept has more embodiments, it is not recommended to introduce reference numerals; reference numerals are recommended to be introduced in embodiments consistent with the figures.)

[0085] In some implementations, the gold fingers are located on one side of the surface of the circuit board 300 (e.g., the upper surface shown in Figure 4); in other implementations, the gold fingers are located on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to applications with high pin count requirements.

[0086] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0087] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0088] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0089] In some embodiments, the optical module includes an optical emitting component 400, as shown in Figures 3 and 4. The optical emitting component 400 is used to emit a second optical signal.

[0090] In some embodiments, the optical module includes an optical receiving component 500, as shown in Figures 3 and 4. The optical receiving component 500 is used to receive a first optical signal and convert the first optical signal into an electrical signal.

[0091] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0092] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0093] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0094] In some embodiments, the light emitting component 400 may be disposed on the surface of the circuit board 300.

[0095] Figure 5 is an internal structural diagram of an optical module according to some embodiments. Figure 6 is an exploded view of the internal structure of an optical module according to some embodiments. As shown in Figures 5 and 6, in some embodiments, the circuit board 300 may have an insertion port 320. The light emitting component 400 may be placed at the insertion port 320 of the circuit board 300.

[0096] In some embodiments, the optical module may include a first support plate 900. The first support plate 900 may be embedded in the insertion port 320 of the circuit board 300. The first support plate 900 may support the light emitting component 400 so that the emitted light path of the light emitting component 400 is flush with the upper surface of the circuit board 300. The material of the first support plate 900 may be metal.

[0097] In some embodiments, a signal processing chip 310 may be disposed on the surface of the circuit board 300. The signal processing chip 310 may be a digital signal processing (DSP) chip. The signal processing chip 310 may process electrical signals transmitted by the optical network terminal through the gold fingers, and may also process electrical signals transmitted by the optical receiving component 500.

[0098] In some implementations, a driver chip may be provided on the surface of the circuit board 300. One end of the driver chip may be connected to the signal processing chip 310, and the other end of the driver chip may be connected to the light emitting component 400, so that the driver chip provides a high-frequency driving signal under the action of the processed electrical signal provided by the signal processing chip 310, thereby causing the light emitting component 400 to emit a second light signal under the action of the high-frequency driving signal.

[0099] In some embodiments, the signal processing chip 310 may integrate a driver chip. The signal processing chip 310 may be connected to the light emitting component 400 via a first signal line to provide a high-frequency driving signal to the light emitting component 400, thereby enabling the light emitting component 400 to emit light signals under the action of the high-frequency driving signal. For example, the circuit board 300 is provided with signal pads 330, and the signal processing chip 310 may be connected to the signal pads 330 via a first signal line. The signal pads 330 are wire-connected to the laser chip of the light emitting component 400.

[0100] In some embodiments, the optical receiver 500 may be connected to the signal processing chip 310 via a second signal line, so that the signal processing chip 310 can process the high-frequency electrical signal provided by the optical receiver 500 and transmitted via the second signal line. For example, the optical receiver matching chip of the optical receiver 500 may be connected to the signal processing chip 310 via the second signal line.

[0101] Both the first and second signal lines can be high-speed data links to transmit high-speed signals.

[0102] As shown in Figure 5, in some embodiments, the optical receiving matching chip of the optical receiving component 500, the signal pad 330 connected to the optical emitting component 400, and the signal processing chip 310 can be located on the same surface of the circuit board 300. For example, the signal pad 330 connected to the optical emitting component 400, the optical receiving matching chip of the optical receiving component 500, and the signal processing chip 310 can be disposed on the upper surface of the circuit board 300 along the first propagation direction of the first optical signal.

[0103] The light emitting component 400 can be embedded in the circuit board 300 or located on the same surface of the circuit board 300 as the light receiving component 500. Due to the limited width of the circuit board 300, the light emitting component 400 and the light receiving component 500 cannot be arranged side by side along the width direction of the circuit board 300. In some embodiments, the light emitting component 400 and the light receiving component 500 are arranged along the length direction of the circuit board 300. For example, the light emitting component 400 and the light receiving component 500 are arranged along the first propagation direction of the first optical signal, and the light receiving chip and the light receiving matching chip of the light receiving component 500 are arranged along the first propagation direction of the first optical signal. The first propagation direction of the first optical signal is from opening 205 to opening 204 along the length direction of the circuit board 300.

[0104] A first optical signal from the outside propagates along a first propagation direction. An optical receiver chip and an optical receiver matching chip are positioned along the same first propagation direction, thus separating the optical receiver matching chip from the optical transmitter. In the first propagation direction of the first optical signal, the optical receiver matching chip is located between the optical transmitter and the signal processing chip. Both the optical receiver matching chip and the optical transmitter are connected to the signal processing chip via high-speed data links. From an impedance matching perspective, the shorter the distance between the optical receiver matching chip and the optical transmitter and signal processing chip, the better.

[0105] In some embodiments, the light emitting component 400, the light receiving component 500, and the signal processing chip 310 are arranged along the first propagation direction of the first light signal. In this case, the light emitting component 400, the light receiving chip, the light receiving matching chip, and the signal processing chip 310 are arranged along the first propagation direction of the first light signal, resulting in the signal processing chip 310 being far away from the light emitting component 400.

[0106] Since the light emitting component 400 remains fixed, to shorten the distance between the signal processing chip 310 and the light emitting component 400, the signal processing chip 310 needs to be moved closer to the light emitting component 400.

[0107] In some embodiments, the first optical signal entering the light receiving component 500 propagates first along a first propagation direction and then along a second propagation direction. Since the second propagation direction is not along the length of the circuit board 300 but along its width, the propagation direction of the first optical signal is bent, causing a bend in the placement orientation of the light receiving component 500, thus shortening the size of the light receiving component 500 along the first propagation direction of the first optical signal, and consequently shortening the distance between the light emitting component 400 and the signal processing chip 310. For example, the light receiving component 500 may include a first reflective surface, which can adjust the propagation direction of the optical signal, causing the first optical signal entering the light receiving component 500 to change from the first propagation direction to the second propagation direction. For example, the first and second propagation directions are perpendicular.

[0108] The first optical signal propagates along a second propagation direction. After adjusting the propagation direction, the first optical signal then propagates along a third propagation direction, which is different from the first propagation direction. This difference in propagation direction causes a bend in the propagation direction of the first optical signal, resulting in a bend in the orientation of the optical receiving component 500. This shortens the size of the optical receiving component 500 along the first propagation direction of the first optical signal, thereby shortening the distance between the optical emitting component 400 and the signal processing chip 310. For example, the optical receiving component 500 may include a second reflective surface, which can adjust the propagation direction of the optical signal, causing the first optical signal entering the optical receiving component 500 to change from the second propagation direction to the third propagation direction. For example, the first and third propagation directions are opposite.

[0109] In some embodiments, the optical module 200 may include a first light receiving component 501. The first light receiving component 501 may be located on one side of the light emitting component 400. The first light receiving component 501 may be disposed on the surface of the circuit board 300. For example, the first light receiving component 501 is located on the upper surface of the circuit board 300.

[0110] In some embodiments, the optical module 200 may include a second light receiving component 502. The second light receiving component 502 may be located on the other side of the light emitting component 400. The second light receiving component 502 may be disposed on the surface of the circuit board 300. For example, the second light receiving component 502 may be disposed on the upper surface of the circuit board 300.

[0111] In some embodiments, the first light receiving component 501 and the second light receiving component 502 may be arranged side by side on the circuit board 300, with a gap between them. Of course, in some embodiments, there may be no gap between the first light receiving component 501 and the second light receiving component 502.

[0112] Figure 7 is a partially exploded view of the internal structure of an optical module according to some embodiments. Figure 8 is a structural diagram of a collimation adapter array according to some embodiments. As shown in Figures 7 and 8, in some embodiments, the optical emitting component 400 may include a laser chip array 410. The laser chip array 410 may be disposed on a first support plate 900. The laser chip array 410 may include at least one laser chip to emit at least one optical signal. For example, the laser chip array 410 may include four laser chips arranged side by side along the width of the circuit board to emit eight optical signals. The laser chips may be 100G EML laser chips, and eight 100G EML laser chips emit a 100G optical signal of one wavelength according to a high-frequency drive signal, so that the laser chip array 410a emits eight 100G optical signals.

[0113] In some embodiments, the laser chip array 410 may include a laser chip array 410a, which may include four laser chips arranged side-by-side along the width of the circuit board to emit four optical signals. The laser chip array 410 may also include a laser chip array 410b, which may include four laser chips arranged side-by-side along the width of the circuit board to emit four optical signals. Laser chip arrays 410a and 410b may be arranged side-by-side along the width of the circuit board.

[0114] In some embodiments, the light emitting component 400 may include a second lens array 420. The second lens array 420 may be disposed on the first support plate 900. The second lens array 420 may be located in the light emission direction of the laser chip array 410 to collimate the light signal emitted by the laser chip array 410.

[0115] The second lens array 420 may include at least one collimating lens to collimate at least one optical signal. For example, the second lens array 420 includes eight collimating lenses arranged side-by-side along the width of the circuit board to collimate eight optical signals. Each collimating lens has a light-transmitting surface through which the optical signal passes.

[0116] In some embodiments, the second lens array 420 may include a second lens array 420a, which may include four collimating lenses arranged side-by-side along the width direction of the circuit board to collimate four optical signals. The second lens array 420 may also include a second lens array 420b, which may include four collimating lenses arranged side-by-side along the width direction of the circuit board to collimate four optical signals. The second lens array 420a and the second lens array 420b may be arranged side-by-side along the width direction of the circuit board.

[0117] The collimating lenses in the second lens array 420 correspond one-to-one with the laser chips in the laser chip array 410, so that one collimating lens collimates the light signal emitted by one laser chip.

[0118] In some embodiments, the light emitting component 400 may include an optical multiplexer array 430. The optical multiplexer array 430 may be disposed on the first support plate 900. The optical multiplexer array 430 may be located in the collimating direction or the converging direction of the second lens array 420. The optical multiplexer array 430 can combine multiple light signals of different wavelengths into a single light signal comprising multiple different wavelengths.

[0119] In some embodiments, the optical multiplexer array 430 may include an optical multiplexer 430a to combine multiple optical signals of different wavelengths into a single optical signal. The optical multiplexer array 430 may also include an optical multiplexer 430b to combine multiple optical signals of different wavelengths into a single optical signal. For example, optical multiplexers 430a and 430b are arranged side-by-side along the width of the circuit board. Optical multiplexer 430a can combine four optical signals of different wavelengths into a single optical signal, and optical multiplexer 430b can combine four optical signals of different wavelengths into another optical signal.

[0120] In some embodiments, the optical emitting component 400 may include a collimator adapter array 610. The collimator adapter array 610 can receive optical signals. The collimator adapter array 610 may include a first collimator. The collimator adapter array 610 may include a second collimator. The first and second collimator adapters can form the collimator adapter array 610. The collimator adapter, also known as an optical fiber collimator, may include a pigtail and a focusing lens, and can convert optical signals within the pigtail into collimated light, or couple collimated light into the pigtail.

[0121] The laser chip array 410a, the second lens array 420a, the optical multiplexer 430a, and the first collimator adapter constitute the first light emitting component 400a, as shown on one side of the X-ray in Figure 8. The laser chip array 410b, the second lens array 420b, the optical multiplexer 430b, and the second collimator adapter constitute the second light emitting component 400b, as shown on the other side of the X-ray in Figure 8.

[0122] In some embodiments, the collimation adapter array 610 may include a body 611. The body 611 may have a first through-hole 612. One end of the first through-hole 612 is fitted with a second pigtail 613, and the other end of the first through-hole 612 is fitted with a first lens 614 to facilitate the installation of the first lens 614. The second pigtail 613 and the first lens 614 constitute a second collimation adapter, and the first lens 614 can couple a second optical signal to the second pigtail 613.

[0123] The body 611 may have a second through hole 615. One end of the second through hole 615 is fitted with a second pigtail 616, and the other end of the second through hole 615 is fitted with a first lens 617 to facilitate the installation of the first lens 617. The second pigtail 616 and the first lens 617 form a first collimation adapter, and the first lens 617 can couple another beam of second optical signal to the second pigtail 616.

[0124] The body 611 integrates the first collimator and the second collimator together through the first through hole 612 and the second through hole 615, which can reduce the distance between the first collimator and the second collimator, and thus reduce the size of the collimator array 610 in the width direction of the circuit board 300.

[0125] In some embodiments, the first through hole 612 and the second through hole 615 are not connected to each other in order to avoid crosstalk between the second optical signal in the first through hole 612 and the second optical signal in the second through hole 615.

[0126] In some embodiments, the light emitting component 400 may include a thermoelectric cooler (TEC) 440. The thermoelectric cooler 440 may be disposed on the first support plate 900. A laser chip array 410 may be placed on the thermoelectric cooler 440 to control the operating temperature of the laser chip array 410 within a target temperature range. A second lens array 420 may be placed on the thermoelectric cooler 440 such that the central axis of the second lens array 420 is flush with the light emission port of the laser chip array 410.

[0127] The thermoelectric cooler 440 may include a first electrode post and a second electrode post, both of which are connected to the output terminal of the driving circuit, so that the driving circuit provides operating current to the thermoelectric cooler 440. The driving circuit provides operating current to the thermoelectric cooler 440 to heat or cool the thermoelectric cooler 400, thereby controlling the temperature of the laser chip array 410 within the target temperature range.

[0128] The MCU can be connected to the drive circuit so that the MCU can control the output current of the drive circuit, thereby achieving heating or cooling of the semiconductor cooler 400, so that the operating temperature of the laser chip array 410 can be controlled within the target temperature range.

[0129] As shown in Figure 7, the optical emission path of the optical emitting component 400 is as follows: the laser chip array 410 emits eight optical signals, the eight optical signals are collimated by the second lens array 420, and the collimated eight optical signals are combined by the optical multiplexer array 430 and then received by the collimation adapter array 610.

[0130] As shown in Figure 7, in some embodiments, the light emitting component 400 can be supported in the middle of the upper surface of the first support plate 900, and the circuit board 300 can be supported at the edge of the upper surface of the first support plate 900.

[0131] A first bearing surface 910 may be formed in the middle of the upper surface of the first support plate 900. The first bearing surface 910 can support the semiconductor cooler 440. A second bearing surface 930 may be formed in the middle of the upper surface of the first support plate 900. The second bearing surface 930 can support the optical multiplexer array 430 and the collimator adapter array 610. A third bearing surface 920 may be formed at the edge of the upper surface of the first support plate 900. The third bearing surface 920 can support the circuit board 300.

[0132] In some embodiments, a limiting portion 940 may be provided between the second bearing surface 930 and the third bearing surface 920. The limiting portion 940 may be connected to a side wall of the opening 320 to define the position of the first support plate 900 on the circuit board 300.

[0133] In some embodiments, the first bearing surface 910 is more recessed than the second bearing surface 930 so that the central axis of the second lens array 420 on the semiconductor cooler 440 is aligned with the central axis of the light inlet of the optical multiplexer array 430, thereby allowing the optical signal collimated by the second lens array 420 to be incident on the optical multiplexer array 430.

[0134] In some embodiments, the first bearing surface 910 is more recessed than the third bearing surface 920 so that the light output path of the laser chip array 410 on the semiconductor cooler 440 is flush with the upper surface of the circuit board 300.

[0135] Figure 9 is a structural diagram of a first optical receiving component according to some embodiments. Figure 10 is a structural diagram of a first optical receiving component according to some embodiments from another perspective. Figure 11 is a structural diagram of another first optical receiving component according to some embodiments. As shown in Figures 9, 10, and 11, in some embodiments, the first optical receiving component 501 may include an optical fiber fixing member. The optical fiber fixing member is used to fix the optical fiber. The first optical signal propagates within the optical fiber fixing member along a first propagation direction.

[0136] In some implementations, the fiber optic fixing element can be a collimator 620. The collimator 620 can collimate the received first optical signal. Within the collimator 620, the first optical signal propagates along a first propagation direction.

[0137] The collimator 620 can be a collimator adapter, which can collimate the received first optical signal. The collimator adapter, also known as an optical fiber collimator, can include a first pigtail 621 and a second lens 622, which can convert the first optical signal in the first pigtail 621 into collimated light.

[0138] The collimator 620 may include an optical fiber adapter and a second lens 622. The optical fiber adapter includes a first pigtail 621, and the second lens 622 can convert the first optical signal in the first pigtail 621 into collimated light. The first pigtail 621 is used to transmit a single beam of first optical signal including multiple wavelengths.

[0139] In some embodiments, the fiber optic fastener may be a fiber optic array 620a. The fiber optic array 620a includes a plurality of optical fibers, each optical fiber transmitting a first optical signal of a single wavelength, so that the fiber optic array can transmit multiple first optical signals.

[0140] In some embodiments, the first optical receiving component 501 may include a first reflective surface 5112. The first reflective surface 5112 may be disposed on the optical path in the first propagation direction. The first optical signal undergoes total internal reflection through the first reflective surface 5112, causing the propagation direction of the first optical signal to change from the first propagation direction to a second propagation direction. The first reflective surface 5112 may face the light-emitting surface of the optical fiber fixing member so that the first reflective surface 5112 can receive the first optical signal emitted by the optical fiber fixing member. For example, the light-emitting surface of the first pigtail 621 faces the first reflective surface 5112; the light-emitting surface of the optical fiber array 620a faces the first reflective surface 5112.

[0141] Since the second propagation direction is not set along the length of the circuit board 300, but along the width of the circuit board 300, that is, the second propagation direction is different from the first propagation direction, the propagation direction of the first optical signal is bent once, which causes the placement direction of the optical receiving component 500 to also bend once, shortening the size of the first optical receiving component 501 along the first propagation direction of the first optical signal, thereby shortening the distance between the first optical emitting component 400a and the signal processing chip 310.

[0142] In some embodiments, the second propagation direction can be set perpendicular to the first propagation direction, and the second propagation direction can be from back to front along the width direction of the circuit board 300.

[0143] In some embodiments, the first light receiving component 501 may include a second reflective surface 5113. The second reflective surface 5113 may be disposed on the optical path in the second propagation direction, i.e., located on the reflected light path of the first reflective surface 5112. The first light signal undergoes total internal reflection through the second reflective surface 5113, causing the propagation direction of the first light signal to change from the second propagation direction to the third propagation direction.

[0144] Because the third propagation direction is different from the first propagation direction, the propagation direction of the first optical signal is bent twice, which causes the placement direction of the first optical receiving component 501 to also be bent twice, shortening the size of the first optical receiving component 501 along the first propagation direction of the first optical signal, thereby shortening the distance between the first optical emitting component 400a and the signal processing chip 310.

[0145] In some implementations, the second reflecting surface 5113 may be tilted toward the first reflecting surface 5112 so that the first reflecting surface 5112 and the second reflecting surface 5113 are not parallel, thus making the first propagation direction and the third propagation direction different.

[0146] In some embodiments, the first reflecting surface 5112 and the second reflecting surface 5113 can form a first displacement prism 511. The first displacement prism 511 can adjust the propagation direction of the first optical signal. The first displacement prism 511 can be located on the right side of the optical fiber fixing member. The first displacement prism 511 can be located in the light-emitting direction of the optical fiber fixing member, that is, the optical fiber fixing member is located in the light-incident direction of the first displacement prism 511, so that the first displacement prism 511 can adjust the propagation direction of the first optical signal emitted through the optical fiber fixing member, so that the propagation direction of the first optical signal changes from a first propagation direction to a third propagation direction. The first propagation direction and the third propagation direction are opposite.

[0147] In some embodiments, the first displacement prism 511 may include an incident light exit surface 5111. One end of the incident light exit surface 5111 may be connected to one end of the first reflecting surface 5112. The other end of the incident light exit surface 5111 may be connected to one end of the second reflecting surface 5113. The fact that one end of the incident light exit surface 5111 can be connected to one end of the first reflecting surface 5112, and the other end of the incident light exit surface 5111 can be connected to one end of the second reflecting surface 5113, facilitates precise control of the angle between the first reflecting surface 5112 and the second reflecting surface 5113. The incident light exit surface 5111 may face the fiber optic fixing member, so that the first optical signal emitted from the fiber optic fixing member is incident on the first displacement prism 511 via the incident light exit surface 5111.

[0148] The first reflecting surface 5112, the second reflecting surface 5113, and the incident light exiting surface 5111 constitute a first displacement prism 511, which is a triangular prism. The first reflecting surface 5112 and the second reflecting surface 5113 are different surfaces of the triangular prism. The tilt direction of the first reflecting surface 5112 relative to the incident light exiting surface 5111 is different from the tilt direction of the second reflecting surface 5113 relative to the incident light exiting surface 5111, resulting in different first and third propagation directions.

[0149] In some embodiments, the first displacement prism 511 may include a connecting surface 5114. One end of the connecting surface 5114 may be connected to the other end of the first reflecting surface 5112. The other end of the connecting surface 5114 may be connected to the other end of the second reflecting surface 5113. Connecting one end of the connecting surface 5114 to the other end of the first reflecting surface 5112 and the other end of the connecting surface 5114 to the other end of the second reflecting surface 5113 can reduce the size of the first displacement prism 511 along the first propagation direction of the first optical signal.

[0150] The first reflecting surface 5112, the second reflecting surface 5113, the light-incident surface 5111, and the connecting surface 5114 constitute the first displacement prism 511, which is a trapezoidal body. The first reflecting surface 5112 and the second reflecting surface 5113 are two opposing inclined surfaces of the trapezoidal body, which makes the first propagation direction and the second propagation direction different.

[0151] In some embodiments, the first optical receiving component 501 may include an optical demultiplexer 512. The optical demultiplexer 512 can divide a first optical signal comprising multiple different wavelengths into multiple beams. The optical demultiplexer 512 may be located in the reflected optical path of the first reflecting surface 5112 or the second reflecting surface 5113, so that the optical demultiplexer 512 can receive the first optical signal reflected by the first reflecting surface 5112 or the second reflecting surface 5113.

[0152] The optical demultiplexer 512 can be located on the reflected light path of the first reflecting surface 5112, so that the first reflecting surface 5112 and the optical demultiplexer 512 can be arranged along the second propagation direction.

[0153] The optical demultiplexer 512 can be located on the reflected light path of the second reflecting surface 5113, so that the first displacement prism 511 and the optical demultiplexer 512 can be arranged along the third propagation direction, that is, the optical demultiplexer 512 and the collimator 620 are located on the same side of the second reflecting surface 5113. For example, the light-incident side of the optical demultiplexer 512 can face the light-incident and light-exiting surface 5111 of the first displacement prism 511, so that the optical demultiplexer 512 can be located in the light-exiting direction of the first displacement prism 511.

[0154] In some embodiments, the optical demultiplexer 512 and the optical fiber fixing member are located on the same side of the first displacement prism 511, so that the optical demultiplexer 512 can be located in the light output direction of the first displacement prism 511.

[0155] When the optical fiber fixing component is a collimator 620, the first reflecting surface 5112 and the second reflecting surface 5113 change the first optical signal of a single beam including multiple wavelengths, and the first optical receiving component 501 may include an optical demultiplexer 512.

[0156] When the optical fiber fixing component is an optical fiber array 620a, the first reflective surface 5112 and the second reflective surface 5113 change the propagation direction of multiple first optical signals, and the first optical receiving component 501 does not include an optical demultiplexer 512.

[0157] In some embodiments, the first light receiving component 501 may include a first lens array 513. The first lens array 513 is used for converging the first optical signal.

[0158] The first lens array 513 may include at least one converging lens to converge at least one beam of first optical signal. For example, the first lens array 513 includes eight converging lenses arranged side by side along the width of the circuit board to converge eight beams of first optical signal.

[0159] When the optical fiber fixing component is a collimator 620, the first optical receiving component 501 may include an optical demultiplexer 512, and the first lens array 513 may be located in the light output direction of the optical demultiplexer 512, that is, the first lens array 513 is located on the light output side of the optical demultiplexer 512.

[0160] The first optical signal is bent twice on the first reflective surface 5112 and the second reflective surface 5113. The placement angle of the first optical receiving component 501 is significantly bent behind the second reflective surface 5113, so that the optical demultiplexer 512 and the collimator 620 are located on the same side of the second reflective surface 5113.

[0161] When the fiber optic fixing component is fiber optic array 620a, the first optical receiving component 501 does not include optical demultiplexer 512, and the first lens array 513 can be located on the reflected light path of the second reflecting surface 5113 so that the first lens array 513 and the fiber optic array 620a are located on the same side of the second reflecting surface 5113.

[0162] The first optical signal is bent twice on the first reflective surface 5112 and the second reflective surface 5113. The placement angle of the first optical receiving component 501 is significantly bent behind the second reflective surface 5113, so that the first lens array 513 and the fiber array 620a are located on the same side of the second reflective surface 5113.

[0163] In some embodiments, the first light receiving component 501 may include a third reflective surface 5142. The third reflective surface 5142 may be located in the light-emitting direction of the first lens array 513, that is, the first lens array 513 may be located in the incident light path of the third reflective surface 5142, so that the third reflective surface 5142 may be located in the reflected light path of either the first reflective surface 5112 or the second reflective surface 5113, allowing the third reflective surface 5142 to receive the first light signal reflected by the second reflective surface 5113. The third reflective surface 5142 can adjust the propagation direction of the first light signal through total internal reflection, changing the propagation direction of the first light signal from a second or third propagation direction to a fifth propagation direction. The fifth propagation direction is from top to bottom along the thickness direction of the circuit board 300.

[0164] The first optical signal, after being reflected by the first reflecting surface 5112, does not propagate towards the surface of the circuit board 300. Similarly, the first optical signal, after being reflected by the second reflecting surface 5113, does not propagate towards the surface of the circuit board 300, so that the first optical signal propagates on a surface flush with the surface of the circuit board 300. Theoretically, this "not propagating towards the circuit board" can be horizontally positioned, meaning the plane containing the first, second, and third propagation directions is flush with the surface of the circuit board. However, in reality, considering potential errors, this may not be so absolute.

[0165] Since the photosensitive surface of the light receiving chip 515 faces away from the surface of the circuit board 300, in order for the light receiving chip 515 to receive the first light signal, it is necessary to change the propagation direction of the first light signal so that the first light signal is directed toward the surface of the circuit board 300. After being reflected by the third reflecting surface 5142, the first light signal is directed toward the surface of the circuit board 300, so that the photosensitive surface of the light receiving chip 515 can receive the first light signal.

[0166] The third reflecting surface 5142 can form a second displacement prism 514. The second displacement prism 514 can be located on the converging direction of the first lens array 513. The second displacement prism 514 and the optical demultiplexer 512 can be located on different sides of the first lens array 513. The second displacement prism 514 can adjust the propagation direction of the first optical signal so that the propagation direction of the first optical signal changes from the second or third propagation direction to the fifth propagation direction.

[0167] The second displacement prism 514 may include an incident light surface 5141. The incident light surface 5141 may face the first lens array 513 so that the first light signal converged by the first lens array 513 is incident on the second displacement prism 514 through the incident light surface 5141. The incident light surface 5141 may face the third reflecting surface 5142 so that the third reflecting surface 5142 can receive the first light signal incident on the incident light surface 5141.

[0168] The second displacement prism 514 may include a light-emitting surface 5143. The light-emitting surface 5143 may face the third reflecting surface 5142 so that the first light signal reflected by the third reflecting surface 5142 can be transmitted out through the light-emitting surface 5143.

[0169] In some embodiments, the first light receiving component 501 may include a light receiving chip 515. The light receiving chip 515 may be located on the surface of the circuit board 300. The light receiving chip 515 may be located in the reflected light path of the third reflecting surface 5142, so that the light receiving chip 515 can receive the first light signal reflected by the third reflecting surface 5142. The light receiving chip 515 can convert the first light signal into a current signal. For example, the light receiving chip 515 faces the light emitting surface 5143, so that the light receiving chip 515 can be located in the light emitting direction of the second displacement prism 514.

[0170] The first optical signal propagates along the first propagation direction, then along the second propagation direction, then along the third propagation direction, and finally along the fifth propagation direction, causing the placement direction of the first optical receiving component 501 to bend. That is, the optical receiving chip 515 can be located between the first optical emitting component 400a and the first lens array 513, the optical demultiplexer 512 and the first displacement prism 511, so as to shorten the size of the first optical receiving component 501 along the first propagation direction of the first optical signal, thereby shortening the distance between the first optical emitting component 400a and the signal processing chip 310.

[0171] In some embodiments, the first optical receiving component 501 may include an optical receiving matching chip 516. The optical receiving matching chip 516 may be located on the surface of the circuit board 300. The optical receiving matching chip 516 may be electrically connected to the optical receiving chip 515. The optical receiving matching chip 516 may be a transimpedance amplifier, enabling it to convert the current signal from the optical receiving chip 515 into a voltage signal. The optical receiving matching chip 516 may be connected to the signal processing chip 310 via a second signal line.

[0172] In some embodiments, the first optical emitting component 400a, the optical receiving matching chip 516, and the signal processing chip 310 are arranged along a first propagation direction, while the optical receiving chip 515 and the optical receiving matching chip 516 are arranged along another direction. This shortens the distance between the first optical emitting component 400a and the signal processing chip 310 compared to the first optical emitting component 400a and the signal processing chip 310 being arranged along the first propagation direction.

[0173] In some embodiments, the first optical receiving component 501 may include a support plate 517. The support plate 517 may be located on the surface of the circuit board 300. The support plate 517 may support the second displacement prism 514, the first lens array 513, the first displacement prism 511, and the optical fiber fixing member, which not only allows the optical receiving chip 515 to be located below the second displacement prism 514, but also allows the optical signal emitted from the optical fiber fixing member to be transmitted sequentially through the first displacement prism 511, the first lens array 513, and the second displacement prism 514 to the optical receiving chip 515.

[0174] Figure 12 is a structural diagram of an optical receiving component according to some embodiments. As shown in Figure 12, in some embodiments, the second optical receiving component 502 may include an optical fiber fixing member. The optical fiber fixing member is used to fix the optical fiber. The first optical signal propagates within the optical fiber fixing member along a first propagation direction.

[0175] In some implementations, the fiber optic fixing element can be a collimator 630. The collimator 630 can collimate the received first optical signal. Within the collimator 630, the first optical signal propagates along a first propagation direction.

[0176] The collimator 630 can be a collimator adapter, which can collimate the received first optical signal. The collimator adapter, also known as an optical fiber collimator, can include a first pigtail 631 and a second lens 632, which can convert the first optical signal in the first pigtail 631 into collimated light.

[0177] The collimator 630 may include an optical fiber adapter and a second lens 632. The optical fiber adapter includes a first pigtail 631, and the second lens 632 can convert the first optical signal in the first pigtail 631 into collimated light. The first pigtail 631 is used to transmit a single beam of first optical signal including multiple wavelengths.

[0178] In some embodiments, the fiber optic fastener may be a fiber optic array. The fiber optic array includes multiple optical fibers, each fiber transmitting a first optical signal of one wavelength, so that the fiber optic array can transmit multiple first optical signals.

[0179] In some embodiments, the second optical receiving component 502 may include a first reflective surface. The first reflective surface may be disposed on the optical path in the first propagation direction. The first optical signal undergoes total internal reflection by the first reflective surface, causing the propagation direction of the first optical signal to change from the first propagation direction to a fourth propagation direction. The first reflective surface may face the light-emitting surface of the optical fiber fixing member so that the first reflective surface can receive the first optical signal emitted by the optical fiber fixing member. For example, the light-emitting surface of the first pigtail faces the first reflective surface; the light-emitting surface of the optical fiber array faces the first reflective surface.

[0180] Since the second propagation direction is not set along the length of the circuit board 300, but along the width of the circuit board 300, that is, the fourth propagation direction is different from the first propagation direction, the propagation direction of the first optical signal is bent once, which causes the placement direction of the second optical receiving component 502 to also bend once, shortening the size of the second optical receiving component 502 along the first propagation direction of the first optical signal, thereby shortening the distance between the second optical emitting component 400b and the signal processing chip 310.

[0181] In some embodiments, the fourth propagation direction can be set perpendicular to the first propagation direction, and the second propagation direction can be from front to back along the width direction of the circuit board 300.

[0182] In some embodiments, the second light receiving component 502 may include a second reflective surface. The second reflective surface may be disposed on the optical path in the fourth propagation direction, i.e., located on the reflected light path of the first reflective surface. The first light signal undergoes total internal reflection through the second reflective surface, causing the propagation direction of the first light signal to change from the fourth propagation direction to the third propagation direction.

[0183] Because the third propagation direction is different from the first propagation direction, the propagation direction of the first optical signal is bent twice, which causes the placement direction of the second optical receiving component 502 to also be bent twice, shortening the size of the second optical receiving component 502 along the first propagation direction of the first optical signal, thereby shortening the distance between the second optical emitting component 400b and the signal processing chip 310.

[0184] In some implementations, the second reflecting surface may be tilted toward the first reflecting surface so that the first and second reflecting surfaces are not parallel, resulting in different first and third propagation directions.

[0185] In some embodiments, the first reflecting surface and the second reflecting surface can form a first displacement prism 521. The first displacement prism 521 can adjust the propagation direction of the first optical signal. The first displacement prism 521 can be located on the right side of the optical fiber fixing member. The first displacement prism 521 can be located in the light-emitting direction of the optical fiber fixing member, that is, the optical fiber fixing member is located in the light-incident direction of the first displacement prism 521, so that the first displacement prism 521 can adjust the propagation direction of the first optical signal emitted through the optical fiber fixing member, so that the propagation direction of the first optical signal changes from a first propagation direction to a third propagation direction. The first propagation direction and the third propagation direction are opposite.

[0186] In some embodiments, the first displacement prism 521 may include an incident light-exiting surface. One end of the incident light-exiting surface may be connected to one end of the first reflecting surface. The other end of the incident light-exiting surface may be connected to one end of the second reflecting surface. The connection between the incident light-exiting surface and the second reflecting surface facilitates precise control of the angle between the first and second reflecting surfaces. The incident light-exiting surface may face the fiber optic fixing member, so that the first optical signal emitted from the fiber optic fixing member is incident on the first displacement prism 521 via the incident light-exiting surface.

[0187] The first reflecting surface, the second reflecting surface, and the incident and exiting light surfaces constitute a first displacement prism 521, which is a triangular prism. The first reflecting surface and the second reflecting surface are different surfaces of the triangular prism. The tilt direction of the first reflecting surface relative to the incident and exiting light surfaces is different from the tilt direction of the second reflecting surface relative to the incident and exiting light surfaces, resulting in different first and third propagation directions.

[0188] In some embodiments, the first displacement prism 521 may include a connecting surface. One end of the connecting surface may be connected to the other end of the first reflecting surface. The other end of the connecting surface may be connected to the other end of the second reflecting surface. Connecting one end of the connecting surface to the other end of the first reflecting surface and the other end of the connecting surface to the other end of the second reflecting surface can reduce the size of the first displacement prism 521 along the first propagation direction of the first optical signal.

[0189] The first reflecting surface, the second reflecting surface, the incident light and exit light surfaces, and the connecting surface constitute the first displacement prism 521, which is a trapezoidal body. The first reflecting surface and the second reflecting surface are two opposing inclined surfaces of the trapezoidal body, which makes the first propagation direction and the second propagation direction different.

[0190] In some embodiments, the second optical receiving component 502 may include an optical demultiplexer 522. The optical demultiplexer 522 can divide a first optical signal comprising multiple different wavelengths into multiple beams. The optical demultiplexer 522 may be located in the reflected light path of the first reflecting surface or the second reflecting surface, so that the optical demultiplexer 522 can receive the first optical signal reflected by the first reflecting surface or the second reflecting surface.

[0191] The optical demultiplexer 522 can be located on the reflected light path of the first reflecting surface, so that the first reflecting surface and the optical demultiplexer can be arranged along the second propagation direction.

[0192] The optical demultiplexer 522 can be located on the reflected light path of the second reflecting surface, such that the first displacement prism 521 and the optical demultiplexer 522 can be arranged along the third propagation direction, that is, the optical demultiplexer 522 and the collimator 630 are located on the same side of the second reflecting surface. For example, the incident light side of the optical demultiplexer 522 can face the incident light exit surface of the first displacement prism 521, so that the optical demultiplexer 522 can be located in the light exit direction of the first displacement prism 521.

[0193] In some embodiments, the optical demultiplexer 522 and the optical fiber fixing member are located on the same side of the first displacement prism 521, so that the optical demultiplexer 522 can be located in the light output direction of the first displacement prism 521.

[0194] When the optical fiber fixing component is a collimator 630, the first reflecting surface and the second reflecting surface change the single beam of the first optical signal, which includes multiple wavelengths, and the second optical receiving component 502 may include an optical demultiplexer 522.

[0195] When the optical fiber fixing component is an optical fiber array, the first reflective surface and the second reflective surface change the propagation direction of multiple first optical signals, and the second optical receiving component 502 does not include an optical demultiplexer 522.

[0196] In some embodiments, the second light receiving component 502 may include a first lens array 523. The first lens array 523 is used for converging the first optical signal.

[0197] The first lens array 523 may include at least one converging lens to converge at least one beam of first optical signal. For example, the first lens array 523 includes eight converging lenses arranged side by side along the width of the circuit board to converge eight beams of first optical signal.

[0198] When the optical fiber fixing component is a collimator 630, the second optical receiving component 502 may include an optical demultiplexer 522, and the first lens array 523 may be located in the light output direction of the optical demultiplexer 522, that is, the first lens array 523 is located on the light output side of the optical demultiplexer 522.

[0199] The first optical signal is bent twice on the first and second reflecting surfaces. The placement angle of the second optical receiving component 502 is significantly bent behind the second reflecting surface, so that the optical demultiplexer 522 and the collimator 630 are located on the same side of the second reflecting surface.

[0200] When the fiber optic fixing component is a fiber optic array, the second optical receiving component 502 does not include an optical demultiplexer 522, and the first lens array 523 can be located on the reflected light path of the second reflecting surface so that the first lens array 523 and the fiber optic array are located on the same side of the second reflecting surface.

[0201] The first optical signal is bent twice on the first and second reflecting surfaces. The placement angle of the second optical receiving component 502 is significantly bent behind the second reflecting surface, so that the first lens array 523 and the fiber array are located on the same side of the second reflecting surface.

[0202] In some embodiments, the second light receiving component 502 may include a third reflective surface. The third reflective surface may be located in the light-emitting direction of the first lens array 523, that is, the first lens array 523 may be located in the incident light path of the third reflective surface, so that the third reflective surface can be located in the reflected light path of either the first or second reflective surface, allowing the third reflective surface to receive the first light signal reflected by the second reflective surface. The third reflective surface can adjust the propagation direction of the first light signal through total internal reflection, changing the propagation direction of the first light signal from a fourth or third propagation direction to a fifth propagation direction. The fifth propagation direction is from top to bottom along the thickness direction of the circuit board 300.

[0203] The first optical signal, after being reflected by the first reflecting surface, does not propagate towards the surface of the circuit board 300. Similarly, the first optical signal, after being reflected by the second reflecting surface, does not propagate towards the surface of the circuit board 300, so that the first optical signal propagates on a surface flush with the surface of the circuit board 300. Theoretically, this "not propagating towards the circuit board" can be horizontally positioned, meaning the plane containing the first, second, and third propagation directions is flush with the surface of the circuit board. However, in reality, considering potential errors, this may not be so absolute.

[0204] Since the photosensitive surface of the light receiving chip 525 faces away from the surface of the circuit board 300, in order for the light receiving chip 525 to receive the first light signal, it is necessary to change the propagation direction of the first light signal so that the first light signal is directed toward the surface of the circuit board 300. After being reflected by the third reflecting surface, the first light signal is directed toward the surface of the circuit board 300, so that the photosensitive surface of the light receiving chip 525 can receive the first light signal.

[0205] The third reflecting surface can form the second displacement prism 524. The second displacement prism 524 can be located in the converging direction of the first lens array 523. The second displacement prism 524 and the optical demultiplexer 522 can be located on different sides of the first lens array 523. The second displacement prism 524 can adjust the propagation direction of the first optical signal so that the propagation direction of the first optical signal changes from the second or third propagation direction to the fifth propagation direction.

[0206] The second displacement prism 524 may include an incident light surface. The incident light surface may face the first lens array 523 so that the first light signal converged by the first lens array 523 is incident on the second displacement prism 524 via the incident light surface. The incident light surface may face the third reflecting surface so that the third reflecting surface can receive the first light signal incident on the incident light surface.

[0207] The second displacement prism 524 may include a light-emitting surface. The light-emitting surface may face the third reflecting surface so that the first light signal reflected by the third reflecting surface can be transmitted through the light-emitting surface.

[0208] In some embodiments, the second light receiving component 502 may include a light receiving chip 525. The light receiving chip 525 may be located on the surface of the circuit board 300. The light receiving chip 525 may be located in the reflected light path of the third reflecting surface, so that the light receiving chip 525 can receive the first light signal reflected by the third reflecting surface. The light receiving chip 525 can convert the first light signal into a current signal. For example, the light receiving chip 525 faces the light emitting surface, so that the light receiving chip 525 can be located in the light emitting direction of the second displacement prism 524.

[0209] The first optical signal propagates along the first propagation direction, then along the fourth propagation direction, then along the third propagation direction, and finally along the fifth propagation direction. This causes the placement direction of the second optical receiving component 502 to bend, meaning that the optical receiving chip 525 can be located between the second optical emitting component 400b and the first lens array 523, the optical demultiplexer 522, and the first displacement prism 521. This shortens the size of the second optical receiving component 502 along the first propagation direction of the first optical signal, thereby shortening the distance between the second optical emitting component 400b and the signal processing chip 310.

[0210] In some embodiments, the second optical receiving component 502 may include an optical receiving matching chip 526. The optical receiving matching chip 526 may be located on the surface of the circuit board 300. The optical receiving matching chip 526 may be electrically connected to the optical receiving chip 525. The optical receiving matching chip 526 may be a transimpedance amplifier, enabling it to convert the current signal from the optical receiving chip 525 into a voltage signal. The optical receiving matching chip 526 may be connected to the signal processing chip 310 via a second signal line.

[0211] In some embodiments, the second optical emitting component 400b, the optical receiving matching chip 526, and the signal processing chip 310 are arranged along a first propagation direction, while the optical receiving chip 525 and the optical receiving matching chip 526 are arranged along another direction. This shortens the distance between the second optical emitting component 400b and the signal processing chip 310 compared to the first optical emitting component, optical receiving chip, optical receiving matching chip, and signal processing chip being arranged along the first propagation direction.

[0212] In some embodiments, the second optical receiving component 502 may include a support plate. The support plate may be located on the surface of the circuit board 300. The support plate may support the second displacement prism 524, the first lens array 523, the first displacement prism 521, and the optical fiber fixing member, which not only allows the optical receiving chip 525 to be located below the second displacement prism 524, but also allows the optical signal emitted from the optical fiber fixing member to be transmitted sequentially through the first displacement prism 521, the first lens array 523, and the second displacement prism 524 to the optical receiving chip 525.

[0213] As shown in Figure 12, in some embodiments, there is a gap between the first optical receiving component 501 and the second optical receiving component 502 to avoid the pigtail of the optical receiving component 500 being positioned above the optical emitting component 400, thereby reducing the impact of the optical receiving component 500 on the optical emitting component 400.

[0214] Figure 13 is a structural diagram of another optical receiving component according to some embodiments. As shown in Figure 13, there is no gap between the first optical receiving component 501 and the second optical receiving component 502, so that the first optical receiving component 501 is connected to the second optical receiving component 502.

[0215] One side of the optical demultiplexer 512 of the first optical receiving component 501 is connected to one side of the optical demultiplexer 522 of the second optical receiving component 502, and one side of the second displacement prism 514 of the first optical receiving component 501 is connected to one side of the second displacement prism 524 of the second optical receiving component 502, so that the first optical receiving component 501 and the second optical receiving component 502 are connected.

[0216] The structure of the light receiving component 500 is applicable not only to the case where the light receiving component 500 and the signal processing chip 310 are located on the same surface of the circuit board 300, but also to the case where the light receiving component 500 and the signal processing chip 310 are located on different surfaces of the circuit board 300.

[0217] Figure 14 is an internal structural diagram of another optical module according to some embodiments. Figure 15 is a schematic diagram of the internal structure of another optical module according to some embodiments from another perspective. Figure 16 is a cross-sectional view of the internal structure of another optical module according to some embodiments. As shown in Figures 14, 15, and 16, in some embodiments, the signal pad 330 connected to the light emitting component 400 and the first light receiving component 501 may be located on the same surface of the circuit board 300, and the first light receiving component 501 and the signal processing chip 310 may be located on different surfaces of the circuit board 300.

[0218] The first light receiving component 501 and the signal processing chip 310 are located on different surfaces of the circuit board 300. The signal processing chip 310 can be moved closer to the first light emitting component 400a, which can shorten the distance between the signal processing chip 310 and the first light emitting component 400a.

[0219] In some embodiments, the circuit board 300 may have a first via 311, one end of which may be connected to a first solder ball of the signal processing chip 310, and the other end of which may be connected to a signal pad 330 via a first wire bonding. The first via 311 and the first wire bonding form a first signal line, which connects the first solder ball of the signal processing chip 310 to the signal pad 330.

[0220] The circuit board 300 may have a second via 312. One end of the second via 312 can be connected to the second solder ball of the signal processing chip 310, and the other end of the second via 312 can be connected to the optical receiver matching chip 516 via a second wire bonding. The second via and the second wire bonding form a second signal line, which connects the second solder ball of the signal processing chip 310 to the optical receiver matching chip 516.

[0221] In some embodiments, the first solder ball, the second solder ball, the first via 311, and the second via 312 of the signal processing chip 310 may be located between the signal pad 330 and the optical receiver matching chip 516 to shorten the distance between the signal processing chip 310 and the signal pad 330 and the optical receiver matching chip 516, respectively.

[0222] Figure 17 is an internal structural diagram of another optical module according to some embodiments. Figure 18 is a schematic diagram of the internal structure of another optical module according to some embodiments from another perspective. Figure 19 is a cross-sectional view of the internal structure of another optical module according to some embodiments. As shown in Figures 17, 18, and 19, in some embodiments, the signal pad 330 and the signal processing chip 310 connected to the light emitting component 400 may be located on the same surface of the circuit board 300, while the first light receiving component 501 and the signal processing chip 310 are located on different surfaces of the circuit board 300.

[0223] In some embodiments, the circuit board 300 may have a second via 312. One end of the second via 312 may be connected to the second solder ball of the signal processing chip 310, and the other end of the second via 312 may be connected to the optical receiver matching chip 516 via a second wire bonding. The second via 312 and the second wire bonding form a second signal line, which connects the second solder ball of the signal processing chip 310 to the optical receiver matching chip 516.

[0224] In some embodiments, the second via 312 may be located between the signal pad 330 and the optical receiver matching chip 516 to shorten the distance between the signal processing chip 310 and the signal pad 330 and the optical receiver matching chip 516, respectively.

[0225] The first optical receiving component 501 and the second optical receiving component 502 are connected. In order to provide a receiving space for the pigtail of the collimation adapter of the optical receiving component 500, in some embodiments, a receiving groove 950 is formed on the lower surface of the first support plate 900. The receiving groove 950 can provide a receiving space to accommodate the pigtail of the optical fiber fixing of the optical receiving component 500. For example, the receiving groove 950 may include a first receiving groove 951, which can accommodate the first pigtail 621 of the optical fiber fixing of the first optical receiving component 501; the receiving groove 950 may also include a second receiving groove 952, which can accommodate the second pigtail 631 of the optical fiber fixing of the second optical receiving component 502.

[0226] Figure 20a is an exploded view of the internal structure of an optical module according to some embodiments. Figure 20b is an exploded view of the internal structure of an optical module according to some embodiments. Figure 20c is an exploded view of the internal structure of an optical module according to some embodiments. As shown in Figures 20a, 20b, and 20c, in some embodiments, the optical module may include an optical emitting component 400. The optical emitting component 400 is used to emit optical signals.

[0227] In some embodiments, the light emitting component 400 may be disposed on the circuit board 300. For example, the light emitting component 400 may be disposed on the upper surface of the circuit board 300.

[0228] In some embodiments, the light emitting component 400 may be embedded in the through hole 310 of the circuit board 300.

[0229] In some embodiments, the optical module may include a second support plate 920. A light emitting component 400 may be disposed on the second support plate 920. The second support plate 920 may be embedded in a through hole 310 so that the light emitting component 400 can be embedded in the through hole 310 of the circuit board 300.

[0230] In some embodiments, the optical module may include an optical receiving component 500. The optical receiving component 500 is used to receive optical signals. The optical receiving component 500 may be located at one end of the optical emitting component 400. The optical receiving component 500 may be disposed on the circuit board 300. For example, the optical receiving component 500 may be disposed on the lower surface of the circuit board 300.

[0231] In some embodiments, the optical module may include a first protective housing 910. The first protective housing 910 may be disposed over the light emitting component 400 to protect the light emitting component 400.

[0232] In some embodiments, the optical module may include a second protective housing 930. The second protective housing 930 may be disposed over the optical receiving component 500 to protect the optical receiving component 500.

[0233] Figure 21a is a partially exploded view of the internal structure of an optical module according to some embodiments. Figure 21b is a partially exploded view of the internal structure of an optical module according to some embodiments. As shown in Figures 21a and 21b, the light emitting component 400 is disposed on the second support plate 920, and the second support plate 920 is embedded in the through hole 310 of the circuit board 300.

[0234] As shown in Figures 21a and 21b, in some embodiments, the light receiving component 500 may include a third light receiving component 510.

[0235] In some embodiments, the light receiving component 500 may include a fourth light receiving component 520. The fourth light receiving component 520 may be arranged side by side with the third light receiving component 510 along the width direction of the circuit board 300.

[0236] In some embodiments, the optical receiving component 500 may include a first enclosure 530. The first enclosure 530 may be located around the optical receiving chip and the transimpedance amplifier chip of the third optical receiving component 510 to protect the optical receiving chip and the transimpedance amplifier chip of the third optical receiving component 510.

[0237] In some embodiments, the optical receiving component 500 may include a second enclosure 540. The second enclosure 540 may be located around the optical receiving chip and the transimpedance amplifier chip of the fourth optical receiving component 520 to protect the optical receiving chip and the transimpedance amplifier chip of the fourth optical receiving component 520.

[0238] Figure 21c is a partially exploded view of the internal structure of an optical module according to some embodiments. As shown in Figure 21c, in some embodiments, the optical emitting component 400 may include a laser chip array 410. The laser chip array 410 may include at least two laser chips, enabling the laser chip array 410 to emit at least two optical signals. For example, the laser chip array 410 may include eight laser chips arranged in parallel, enabling the laser chip array 410 to emit eight optical signals.

[0239] In some embodiments, the laser chip array 410 may include a first sub-laser chip array 411, which may include four laser chips arranged in parallel, so that the first sub-laser chip array 411 can emit four optical signals.

[0240] In some embodiments, the laser chip array 410 may include a second sub-laser chip array 412, which may include four laser chips arranged in parallel, so that the second sub-laser chip array 412 can emit four optical signals.

[0241] In some embodiments, the light emitting component 400 may include a first lens array 420. The first lens array 420 may be located in the light output path of the laser chip array 410 so that the first lens array 420 can receive the light signal emitted by the laser chip array 410. The first lens array 420 may be a collimating lens array, which can collimate the received light signal.

[0242] In some embodiments, the first lens array 420 may include a first sub-lens array 421, which may be located in the light output path of the first sub-laser chip array 411, so that the first sub-lens array 421 can receive the light signal emitted by the first sub-laser chip array 411 and collimate the received light signal.

[0243] In some embodiments, the first lens array 420 may include a second sub-lens array 422, which may be located in the light output path of the second sub-laser chip array 412, so that the second sub-lens array 422 can receive the light signal emitted by the second sub-laser chip array 412 and collimate the received light signal.

[0244] In some embodiments, the light emitting component 400 may include a beam combiner array 430. The beam combiner array 430 may be located in the light output path of the first lens array 420, so that the beam combiner array 430 can receive multiple light signals emitted from the first lens array 420 and combine the multiple light signals.

[0245] In some embodiments, the beam combiner array 430 may include a first beam combiner 431. The first beam combiner 431 may be located in the output optical path of the first sub-lens array 421, so that the first beam combiner 431 can receive multiple optical signals emitted from the first sub-lens array 421 and combine the multiple optical signals into one optical signal.

[0246] In some embodiments, the beam combiner array 430 may include a second beam combiner 432. The second beam combiner 432 may be located in the output optical path of the second sub-lens array 422, so that the second beam combiner 432 can receive multiple optical signals emitted from the second sub-lens array 422 and combine the multiple optical signals into one optical signal.

[0247] In some embodiments, the light emitting component 400 may include a second lens array 440. The second lens array 440 may be located in the light output path of the beam combiner array 430, so that the second lens array 440 can receive the light signal emitted by the beam combiner array 430. The second lens array 440 may be a converging lens array, so that the second lens array 440 can converge the received light signal.

[0248] In some embodiments, the second lens array 440 may include a first converging lens 441. The first converging lens 441 may be located in the light output path of the first beam combiner 431, so that the first converging lens 441 can receive the light signal emitted by the first beam combiner 431 and converge the received light signal.

[0249] In some embodiments, the second lens array 440 may include a second converging lens 442. The second converging lens 442 may be located in the light output path of the second beam combiner 432, so that the second converging lens 442 can receive the light signal emitted by the second beam combiner 432 and converge the received light signal.

[0250] In some embodiments, the optical emitting component 400 may include an optical fiber adapter array 450. The optical fiber adapter array 450 may be located in the optical output path of the second lens array 440, so that the optical fiber adapter array 450 can receive the optical signal converged by the second lens array 440.

[0251] In some embodiments, the fiber optic adapter array 450 may include a first transmitting fiber optic adapter 451. The first transmitting fiber optic adapter 451 may be located in the output optical path of the first converging lens 441 so that the first transmitting fiber optic adapter 451 can receive the optical signal converged by the first converging lens 441.

[0252] In some embodiments, the fiber optic adapter array 450 may include a second transmitting fiber optic adapter 452. The second transmitting fiber optic adapter 452 may be located in the output optical path of the second converging lens 442 so that the second transmitting fiber optic adapter 452 can receive the optical signal converged by the second converging lens 442.

[0253] In some embodiments, the second support plate 920 may include a first support surface 922. The first support surface 922 may be located at one end of the second support plate 920. The laser chip array 410 and the first lens array 420 may be placed on the first support surface 922.

[0254] In some embodiments, the second support plate 920 may include a second support surface 923. A beam combiner array 430 and a second lens array 440 may be placed on the second support surface 923.

[0255] In some embodiments, the second support surface 923 protrudes from the first support surface 922 so that the central axis of the laser chip array 410, the central axis of the first lens array 420, the central axis of the beam combiner array 430, and the central axis of the second lens array 440 are aligned at the same height, thereby ensuring the stability and accuracy of the optical signal during transmission.

[0256] In some embodiments, the edge of the second support surface 923 may be provided with a first limiting portion 927. The first limiting portion 927 may be connected to the side of the first light combiner 431 to limit the position of the first light combiner 431 in the width direction of the second support plate 920.

[0257] In some embodiments, a second limiting portion 926 may be provided at the edge of the second supporting surface 923. The second limiting portion 926 may be connected to the side of the second light combiner 432 to define the position of the second light combiner 432 in the width direction of the second supporting plate 920.

[0258] In some embodiments, the second support plate 920 may include a third support surface 924. The third support surface 924 may be located at the other end of the second support plate 920. The fiber optic adapter array 450 may be placed on the third support surface 924.

[0259] In some embodiments, the second support surface 923 protrudes from the third support surface 924 so that the central axis of the second lens array 440 is aligned with the central axis of the fiber optic adapter array 450, thereby ensuring the stability and accuracy of the optical signal during transmission.

[0260] The fiber optic adapter array 450 can be positioned in front of the second support surface 923 to define the position of the fiber optic adapter array 450 in the length direction of the support plate.

[0261] In some embodiments, a third limiting portion 925 may be provided on the third supporting surface 924. One side of the third limiting portion 925 may be in contact with the side of the first transmitting fiber optic adapter 451, and the other side of the third limiting portion 925 may be in contact with the side of the second transmitting fiber optic adapter 452, so as to define the position of the fiber optic adapter array 450 in the width direction of the supporting plate.

[0262] In some embodiments, there is a gap between the third support surface 924 and the second support surface 923. The bottom surface of the gap may be recessed into the third support surface to accommodate adhesive overflow during the mounting of the fiber optic adapter array. The bottom surface of the gap may be recessed into the second support surface to accommodate adhesive overflow during the mounting of the second lens array.

[0263] In some embodiments, the second support plate 920 may include a fourth support surface 921. The fourth support surface 921 may be in contact with the lower surface of the circuit board 300 so that the second support plate 920 can support the circuit board 300.

[0264] Figure 21d is a partially exploded view of the internal structure of an optical module according to some embodiments. As shown in Figure 21d, in some embodiments, the first enclosure 530 may include a first enclosure plate 531, which may be arranged along the length of the circuit board 300.

[0265] In some embodiments, the first enclosure 530 may include a second enclosure plate 532. The second enclosure plate 532 may be disposed along the width direction of the circuit board 300. One end of the second enclosure plate 532 may be connected to a second end of the first enclosure plate 531.

[0266] In some embodiments, the first enclosure 530 may include a third enclosure plate 533. The third enclosure plate 533 may be disposed along the length of the circuit board 300. A first end of the third enclosure plate 533 may be connected to the other end of the second enclosure plate 532.

[0267] The first enclosure 531, the second enclosure 532, and the third enclosure 533 are connected in sequence to make the first enclosure 530 U-shaped, that is, the first enclosure 530 forms a storage notch 534. The storage notch 534 can hold the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the third optical receiving component 510, so as to protect the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the third optical receiving component 510.

[0268] The length of the notch 534 is greater than or equal to the sum of the lengths of the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the third optical receiving component 510, and the width of the notch 534 is greater than or equal to the sum of the widths of the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the third optical receiving component 510, so that the notch 534 can completely cover the optical receiving chip 519 and the transimpedance amplifier chip 5191 of the third optical receiving component 510, thereby preventing the optical receiving chip 519 and the transimpedance amplifier chip 5191 from being interfered with or damaged by the external environment.

[0269] Figure 22a is an exploded view of a third optical receiving component according to some embodiments. Figure 22b is a partial view of a third optical receiving component according to some embodiments. As shown in Figures 22a and 22b, in some embodiments, the third optical receiving component 510 may include an optical receiving chip 519. The optical receiving chip 519 can convert the received optical signal into a current signal. The optical receiving chip 519 may be located on a circuit board 300.

[0270] In some embodiments, the third optical receiving component 510 may include a transimpedance amplifier chip 5191. The transimpedance amplifier chip 5191 may be electrically connected to the optical receiving chip 519 so that the transimpedance amplifier chip 5191 can receive the current signal converted by the optical receiving chip 519. The transimpedance amplifier chip 5191 can convert the current signal into a voltage signal. The transimpedance amplifier chip 5191 may be located on the circuit board 300.

[0271] In some embodiments, the light receiving chip 519 and the transimpedance amplifier chip 5191 may be located on the same surface of the circuit board 300 to reduce the wire bonding distance between the light receiving chip 519 and the transimpedance amplifier chip 5191.

[0272] In some embodiments, the third optical receiving component 510 may include a receiving fiber optic adapter 513.

[0273] In some embodiments, the third optical receiving component 510 may include a first lens 514. The first lens 514 may be located in the output optical path of the receiving fiber optic adapter 513 so that the first lens 514 can receive the optical signal emitted by the receiving fiber optic adapter 513. The first lens 514 may be a collimating lens so that the first lens 514 can collimate the received optical signal to obtain collimated light.

[0274] In some embodiments, the third light receiving component 510 may include a third displacement prism 515. The third displacement prism 515 may be located in the light output path of the first lens 514, so that the third displacement prism 515 can receive the light signal collimated by the first lens 514. The third displacement prism 515 can change the displacement of the light signal, but does not change the transmission direction of the light signal.

[0275] In some embodiments, the third displacement prism 515 may include a fourth reflecting surface 5151. The fourth reflecting surface 5151 may be located in the light output path of the first lens 514, so that the fourth reflecting surface 5151 can receive the light signal collimated by the first lens 514. The fourth reflecting surface 5151 can reflect the received light signal.

[0276] In some embodiments, the third displacement prism 515 may include a fifth reflecting surface 5152. The fifth reflecting surface 5152 may be located in the reflected light path of the fourth reflecting surface 5151, so that the fifth reflecting surface 5152 can receive the light signal reflected by the fourth reflecting surface 5151. The fifth reflecting surface 5152 can reflect the received light signal.

[0277] In some embodiments, the fourth reflective surface 5151 and the fifth reflective surface 5152 are arranged in parallel so that the transmission direction of the light signal remains unchanged after it undergoes two reflections inside the third displacement prism 515, and only the displacement changes.

[0278] In some embodiments, the fifth reflective surface 5152 is closer to the center of the circuit board 300 than the fourth reflective surface 5151, so that the received light path of the third light receiving component 510 is shifted toward the center of the circuit board 300 after passing through the third displacement prism 515.

[0279] In some embodiments, the third light receiving component 510 may include a beam splitter 516. The beam splitter 516 may be located in the light output path of the third displacement prism 515 so that the beam splitter 516 can receive the light signal emitted by the third displacement prism 515. For example, the beam splitter 516 may be located in the light reflection path of the fifth reflecting surface 5152, such that the beam splitter 516 is closer to the center of the circuit board 300 relative to the first lens 514.

[0280] Beam splitter 516 may include an inlet port facing the first lens 514, so that collimated light enters beam splitter 516 through the inlet port. Beam splitter 516 can split a collimated beam into multiple collimated beams. Beam splitter 516 may include an outlet port through which multiple collimated beams can exit.

[0281] The optical signal emitted by the optical fiber adapter 513 is transmitted horizontally, and the optical signal of the incident light receiver chip 519 is transmitted vertically. In some embodiments, the third optical receiver component 510 may include a deflection prism 518 so that the optical signal transmitted horizontally is emitted vertically downward after passing through the deflection prism 518.

[0282] In some embodiments, the beam splitter 516 and the first lens 514 are located on both sides of the third displacement prism 515. The third displacement prism 515 does not change the transmission direction of the light signal, so that the light signal emitted from the first lens 514 can be incident on the beam splitter 516 after the displacement is changed by the third displacement prism 515.

[0283] In some embodiments, the beam splitter 516 is closer to the center of the circuit board 300 than the first lens 514, so that the received light path of the third light receiving component 510 is shifted toward the center of the circuit board 300 after passing through the third displacement prism 515, thereby increasing the distance between the light receiving chip 519 and the edge of the circuit board 300.

[0284] In some embodiments, the third light receiving component 510 may include a second lens 517. The second lens 517 may be a converging lens to converge collimated light. The light receiving chip 519 may be located in the light output path of the second lens 517 so that the light receiving chip 519 can receive the light signal converged by the second lens 517.

[0285] In some embodiments, the second lens 517 may be located in the light-emitting path of the deflection prism 518 so that the second lens 517 can receive the collimated light emitted by the deflection prism 518. For example, the second lens 517 may be connected to the light-emitting surface of the deflection prism 518.

[0286] In some embodiments, the deflection prism 518 may be located in the light-emitting path of the second lens 517. For example, the light-incident surface of the deflection prism 518 is connected to the second lens 517.

[0287] The second lens 517 is connected to the deflection prism 518 to reduce the distance between the second lens 517 and the deflection prism 518, so that the light signal emitted by the deflection prism 518 can be received and focused more effectively by the second lens 517.

[0288] In some embodiments, the second lens 517 and the deflection prism 518 can be integrally formed, which not only simplifies the structure of the third light receiving component 510, but also effectively improves the alignment accuracy between optical elements.

[0289] In some embodiments, the second lens 517 and the deflection prism 518 may be bonded together to improve the optical coupling efficiency and mechanical stability between them. The bonding material may be selected from materials with high light transmittance, low coefficient of thermal expansion, and good mechanical strength to ensure optimal optical and mechanical performance.

[0290] In some embodiments, the light receiving chip 519 may be located at the focal point of the second lens 517, so that the light receiving chip 519 can more effectively receive the light signal converged by the second lens 517, thereby improving the reception efficiency and accuracy of the light signal.

[0291] In some embodiments, the deflection prism 518 may include an incident surface. The incident surface may face the beam splitter 516 so that multiple collimated beams are incident on the deflection prism 518 through the incident surface.

[0292] In some embodiments, the deflecting prism 518 may include a reflective surface. One end of the reflective surface may be connected to the other end of the connecting surface. The reflective surface may face the incident light surface so that it can receive collimated light entering the deflecting prism 518 via the incident light surface. The reflective surface can reflect the incident light signal, thereby changing the transmission direction of the light signal from the horizontal direction to the vertical direction.

[0293] In some embodiments, the deflecting prism 518 may include a light-emitting surface. One end of the light-emitting surface may be connected to the other end of the reflective surface. The other end of the light-emitting surface may be connected to the other end of the incident surface. The light-emitting surface may face the reflective surface so that the light signal reflected by the reflective surface can be emitted through the light-emitting surface. The light-emitting surface may face the light receiving chip 519 so that the light receiving chip 519 can receive the light signal emitted through the light-emitting surface.

[0294] In some embodiments, the third optical receiving component 510 may include a first support plate 511. The material of the first support plate 511 may be glass. The first support plate 511 may be disposed on the circuit board 300. The first support plate 511 may be provided with a receiving fiber optic adapter 513, a first lens 514, a third displacement prism 515, a beam splitter 516, and a second lens 517, which not only makes the optical axis of the horizontally transmitted optical signal flush with the central axis of each device, but also reduces the loss of the optical signal during transmission and improves the transmission efficiency and stability of the optical signal.

[0295] In some embodiments, the first support plate 511 may include a first support portion 5111. The first support portion 5111 may be disposed along the length direction of the circuit board 300. The first support portion 5111 may house the receiving fiber optic adapter 513 and the first lens 514.

[0296] In some embodiments, the first support plate 511 may include a second support portion 5112. The second support portion 5112 may be disposed along the width direction of the circuit board 300. One end of the second support portion 5112 may be connected to the first support portion 5111. A third displacement prism 515 may be disposed on the second support portion 5112.

[0297] In some embodiments, the first support portion 5111 and the second support portion 5112 can be arranged vertically so that the first support plate 511 composed of the first support portion 5111 and the second support portion 5112 is L-shaped, which can reduce the space occupied by the first support plate 511 on the circuit board 300.

[0298] In some embodiments, the first support plate 511 may include a third support portion 5113. The third support portion 5113 may be disposed along the length direction of the circuit board 300. The third support portion 5113 may be connected to the other end of the second support portion 5112. The third support portion 5113 may be provided with a beam splitter 516 and a second lens 517.

[0299] In some embodiments, the second support portion 5112 and the third support portion 5113 can be arranged vertically so that the first support plate 511 composed of the second support portion 5112 and the third support portion 5113 is L-shaped, which can reduce the space occupied by the first support plate 511 on the circuit board 300.

[0300] The second lens 517 is connected to the light-incident surface of the deflection prism 518, so that the deflection prism 518 can be set on the first support plate 511, thereby making the central axis of the second lens 517 and the central axis of the deflection prism 518 at the same height.

[0301] The coefficient of thermal expansion of circuit board 300 differs significantly from that of the first support plate 511, resulting in low connection stability between the circuit board 300 and the first support plate 511. To improve the connection stability between circuit board 300 and the first support plate 511, in some embodiments, the third optical receiving component 510 may include a second support plate 512. The second support plate 512 may be disposed on circuit board 300, and the first support plate 511 may be disposed on the second support plate 512. The coefficient of thermal expansion of the second support plate 512 is between that of circuit board 300 and the first support plate 511, resulting in higher connection stability between circuit board 300, the second support plate 512, and the first support plate 511. For example, the material of the second support plate 512 may be aluminum nitride (AlN).

[0302] In some embodiments, the second support plate 512 can be arranged along the length direction of the circuit board 300, and the top surface of the second support plate 512 can be in contact with the other end of the second support portion 5112 of the first support plate 511 and the bottom surface of the third support portion 5113, so that the second support plate 512 can support the first support plate 511 and reduce the space occupied by the third light receiving component 510 on the circuit board 300.

[0303] In some embodiments, the third light receiving component 510 may include a third support plate 5192. A light receiving chip 519 may be disposed on the third support plate 5192 to increase the height of the light receiving chip 519, so that the light receiving chip 519 is located at the focal point of the second lens 517, thereby improving the receiving efficiency and accuracy of the light receiving chip 519.

[0304] The structure of the third optical receiving component 510 is the same as that of the fourth optical receiving component 520, and will not be described again here.

[0305] In some embodiments, the vertical distance d1 between the beam splitter 516 of the third light receiving component 510 and the fourth light receiving component 520 is smaller than the vertical distance d2 between the first lens 514 of the third light receiving component 510 and the fourth light receiving component 520, so as to shorten the distance between the light receiving chip 519 of the third light receiving component 510 and the light receiving chip of the fourth light receiving component 520, making the structure of the light receiving component more compact, thereby reducing the volume of the entire optical module.

[0306] Figure 23 is a structural diagram of a first protective housing according to some embodiments. Figure 24 is a cross-sectional view of the internal structure of an optical module according to some embodiments. As shown in Figures 23 and 24, in some embodiments, the first protective housing 910 may include a first base plate 911.

[0307] In some embodiments, the first protective housing 910 may include a first side plate 912. The bottom of the first side plate 912 is connected to the first base plate 911. The top of the first side plate 912 may be in contact with the upper surface of the circuit board 300.

[0308] In some embodiments, the first protective housing 910 may include a second side plate 913. The bottom of the second side plate 913 is connected to the first base plate 911. One end of the second side plate 913 is connected to one end of the first side plate 912. The top of the second side plate 913 may contact and connect with the upper surface of the circuit board 300.

[0309] In some embodiments, the first protective housing 910 may include a third side plate 914. The bottom of the third side plate 914 is connected to the first base plate 911. One end of the third side plate 914 is connected to the other end of the first side plate 912. The top of the third side plate 914 may contact the upper surface of the circuit board 300.

[0310] In some embodiments, the first protective housing 910 may include a fourth side plate 915. The bottom of the fourth side plate 915 is connected to the first base plate 911. One end of the fourth side plate 915 is connected to the other end of the second side plate 913, and the other end of the fourth side plate 915 is connected to the other end of the third side plate 914. The fourth side plate 915 may be in contact with the top surface of the second support plate 920.

[0311] The top surface of the second support plate 920 is higher than the upper surface of the circuit board 300. The fourth side plate 915 protrudes from the first side plate 912, the second side plate 913 and the third side plate 914, increasing the area between the first protective shell 910 and the circuit board 300 and the second support plate 920, and improving the connection stability between the first protective shell 910 and the circuit board 300 and the second support plate 920.

[0312] In some embodiments, the fourth side plate 915 may form a first clearance notch 9151. The first clearance notch 9151 may allow passage of the receiving fiber optic adapter 513 connected to the third optical receiving assembly 510.

[0313] In some embodiments, the fourth side plate 915 may form a second clearance notch 9152. The second clearance notch 9152 may allow passage of the receiving fiber optic adapter connected to the fourth optical receiving assembly 520.

[0314] Figure 25 is a structural diagram of a second protective housing according to some embodiments. Figure 26 is a cross-sectional view of the internal structure of an optical module according to some embodiments. As shown in Figures 25 and 26, in some embodiments, the second protective housing 930 may include a second base plate 931.

[0315] In some embodiments, the second protective housing 930 may include a fifth side plate 932. The bottom of the fifth side plate 932 is connected to the second bottom plate 931, and the top of the fifth side plate 932 is in contact with the lower surface of the circuit board 300, so that the second protective housing 930 and the circuit board 300 form a storage cavity, and a light receiving component 500 may be disposed in the storage cavity to protect the light receiving component 500.

[0316] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: Circuit board; An optical receiving component, located on the circuit board, is used to receive optical signals; Optical receiver chip; The structure of the optical receiving component satisfies any one of the following: The optical receiving component includes a first optical receiving assembly located on the surface of the circuit board for receiving a first optical signal; the first optical receiving assembly includes: a first reflective surface, a third reflective surface, and an optical receiving matching chip. The first reflective surface is disposed on the optical path of the first optical signal in the first propagation direction; the first optical signal is reflected by the first reflective surface, so that the propagation direction of the first optical signal changes from the first propagation direction to the second propagation direction; The third reflective surface is located on the reflected light path of the first reflective surface; the light receiving chip is located on the reflected light path of the third reflective surface. A signal processing chip is disposed on the surface of the circuit board, and the optical receiving matching chip is electrically connected to the signal processing chip. Alternatively, the optical receiving component may include a third optical receiving assembly, which may include: a receiving fiber optic adapter, a first lens, a third displacement prism, a beam splitter, a second lens, a deflection prism, and a first enclosure. The first lens is located on the output optical path of the receiving fiber optic adapter; The third displacement prism is located in the light output path of the first lens and is used to change the displacement of the light signal, but does not change the transmission direction of the light signal. The beam splitter is located in the light output path of the third displacement prism; the beam splitter and the first lens are respectively located on both sides of the third displacement prism; the beam splitter is closer to the center of the circuit board than the first lens; The second lens is located in the output optical path of the beam splitter; The deflection prism is located in the light-emitting path of the second lens and is used to change the transmission direction of the optical signal. The optical receiving chip is located in the light-emitting path of the deflection prism. The first enclosure has a storage notch; the storage notch faces the second lens, and the light receiving chip is disposed at the storage notch.

2. The optical module according to claim 1, characterized in that, The first optical receiving component further includes: A second reflecting surface is disposed on the optical path in the second propagation direction; the first optical signal is reflected by the second reflecting surface, causing the propagation direction of the first optical signal to change from the second propagation direction to a third propagation direction; the third propagation direction is different from the first propagation direction; The third reflecting surface is located on the reflected light path of the second reflecting surface.

3. The optical module according to claim 2, characterized in that, The optical module further includes an optical emitting component, which includes: A first light emitting component is embedded in the circuit board or located on the same surface of the circuit board as the first light receiving component, and is electrically connected to the signal processing chip for emitting a second light signal; the first light emitting component, the first light receiving component, and the signal processing chip are arranged along a first propagation direction of the first light signal; The first light emitting component, the light receiving matching chip, and the signal processing chip are arranged along the first propagation direction, while the light receiving chip and the light receiving matching chip are arranged along another direction.

4. The optical module according to claim 1, characterized in that, The first optical receiving component and the signal processing chip are located on different surfaces of the circuit board.

5. The optical module according to claim 2, characterized in that, The first optical receiving component includes: Collimator, including: A first pigtail, facing the first reflective surface, is used to transmit a single beam of a first optical signal comprising multiple wavelengths; An optical demultiplexer is located on the reflected light path of the second reflecting surface, such that the optical demultiplexer and the collimator are located on the same side of the second reflecting surface; The first lens array is located in the light output direction of the optical demultiplexer and in the incident light path of the third reflecting surface.

6. The optical module according to claim 2, characterized in that, The first optical receiving component includes: An optical fiber array, facing the first reflective surface, includes multiple pigtails for transmitting multiple beams of the first optical signal; The first lens array is located on the incident light path of the third reflecting surface and on the reflected light path of the second reflecting surface, so that the first lens array and the fiber array are located on the same side of the second reflecting surface.

7. The optical module according to claim 2, characterized in that, The first light signal is reflected by the first reflective surface and does not travel to the surface of the circuit board; the first light signal is reflected by the second reflective surface and does not travel to the surface of the circuit board; the first light signal is reflected by the third reflective surface and travels to the surface of the circuit board.

8. The optical module according to claim 2, characterized in that, The second reflective surface is inclined toward the first reflective surface.

9. The optical module according to claim 2, characterized in that, The first reflecting surface and the second reflecting surface constitute a first displacement prism. The first reflecting surface and the second reflecting surface are different surfaces of the first displacement prism. The first reflecting surface and the second reflecting surface are respectively connected to the light-incident and light-exiting surfaces of the first displacement prism. The tilt direction of the first reflecting surface relative to the light-incident and light-exiting surfaces is different from the tilt direction of the second reflecting surface relative to the light-incident and light-exiting surfaces.

10. The optical module according to claim 2, characterized in that, The first reflecting surface and the second reflecting surface form a first displacement prism. The first displacement prism is a trapezoidal body, and the first reflecting surface and the second reflecting surface are two opposing inclined surfaces of the trapezoidal body.

11. The optical module according to claim 1, characterized in that, The third displacement prism includes: The fourth reflecting surface is located in the light-emitting path of the first lens; The fifth reflective surface is located on the reflected light path of the fourth reflective surface, closer to the center of the circuit board than the fourth reflective surface, and is arranged parallel to the fourth reflective surface.

12. The optical module according to claim 1, characterized in that, The third optical receiving component further includes: The first support plate includes: A first support portion is provided along the length of the circuit board to support the receiving fiber optic adapter and the first lens; The second support is provided along the width direction of the circuit board, and one end is connected to the first support to support the third displacement prism; The third support portion is arranged along the length of the circuit board and connected to the other end of the second support portion, supporting the beam splitter and the second lens; the third support portion is closer to the middle of the circuit board than the first support portion; A second support plate is provided on which the first support plate is mounted; the coefficient of thermal expansion of the second support plate is between the coefficient of thermal expansion of the first support plate and the coefficient of thermal expansion of the circuit board. The third support plate supports the optical receiving chip.

13. The optical module according to claim 1, characterized in that, The optical receiving component further includes: A fourth light receiving component is arranged side by side with the third light receiving component; the vertical distance between the beam splitter of the third light receiving component and the fourth light receiving component is less than the vertical distance between the first lens of the third light receiving component and the fourth light receiving component.

14. The optical module according to claim 1, characterized in that, The first enclosure includes: The first enclosure plate is provided along the length of the circuit board; The second enclosure is arranged along the width direction of the circuit board, and one end is connected to the first enclosure; The third enclosure is arranged along the length of the circuit board and connected to the other end of the second enclosure; the first enclosure, the second enclosure, and the third enclosure are connected in sequence so that the first enclosure forms a storage notch, the length of the storage notch is greater than or equal to the length of the optical receiving chip, and the width of the storage notch is greater than or equal to the width of the optical receiving chip.

15. The optical module according to claim 1, characterized in that, The third optical receiving component further includes: A transimpedance amplifier chip, electrically connected to the optical receiver chip, is disposed at the storage opening of the first enclosure; The length of the placement notch is greater than or equal to the sum of the lengths of the optical receiving chip and the transimpedance amplifier chip, and the width of the placement notch is greater than or equal to the sum of the widths of the optical receiving chip and the transimpedance amplifier chip.

16. The optical module according to claim 1, characterized in that, Also includes: The light emitting component includes: Laser chip array, used to emit optical signals; A beam combiner array is located on the output optical path of the laser chip array; First optical combiner; The second beam combiner is arranged side by side with the first beam combiner; An optical fiber adapter array, located on the output optical path of the optical combiner array, includes: First transmitting fiber optic adapter; The second transmitting fiber optic adapter is arranged side by side with the first transmitting fiber optic adapter; A second support plate is embedded in a through-hole of the circuit board, and the light-emitting component is disposed on its surface so that the light-emitting component is embedded in the through-hole; the second support plate includes: The first supporting surface is connected to the bottom surface of the laser chip array; The second supporting surface is connected to the bottom surface of the light combiner array; The third supporting surface is connected to the bottom surface of the fiber optic adapter array; The first limiting part is arranged along the length direction of the circuit board, located at one edge of the second supporting surface, and connected to the side of the first light combiner; The second limiting part is arranged along the length direction of the circuit board, located at the other edge of the second supporting surface, and connected to the side of the second light combiner; The third limiting part is disposed in the middle of the third supporting surface, with one side connected to the side of the first transmitting fiber optic adapter and the other side connected to the side of the second transmitting fiber optic adapter.

17. The optical module according to claim 16, characterized in that, Also includes: A first protective housing, covering the light-emitting component, includes: First base plate; The first side plate is connected to the first base plate at the bottom and to the circuit board at the top. The second side plate is connected to the first base plate at the bottom, connected to the circuit board at the top, and connected to one end of the first side plate at one end. The third side plate is connected to the first base plate at the bottom, to the circuit board at the top, and to the other end of the first side plate at one end. The fourth side plate is connected to the first base plate at the bottom, to the second support plate at the top, and has one end connected to the other end of the second side plate and the other end connected to the other end of the third side plate, forming: The first clearance gap is used to avoid the first transmitting fiber optic adapter; The second clearance gap is used to avoid the second transmitting fiber optic adapter; The top of the fourth side plate protrudes beyond the tops of the first side plate, the second side plate, and the third side plate.

18. The optical module according to claim 14, characterized in that, Also includes: The second protective housing is placed over the light receiving component.

19. The optical module according to claim 16, characterized in that, There is a gap between the second supporting surface and the third supporting surface, and the bottom surface of the gap is recessed into the third supporting surface.

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