Method for producing a three-dimensionally structured conductive component

Abstract

The invention relates to a method for producing a three-dimensionally structured component (10) which is conductive at least in sections, the method comprising: providing a three-dimensionally structured, in particular 3D-printed, component blank (12); depositing, by means of atomic layer deposition (ALD), a conductive base layer (18) made of a base material (20) on at least one portion of the surface (14) of the component blank (12) or on at least one portion of an intermediate layer (16) optionally previously applied to the component blank (12); and electrochemically depositing a metal layer (22) on at least one portion of the base layer (18). The invention also relates to an assembly comprising at least one component which has been produced by this method.

Description

[0001]

[0002] MAU / MAI

[0003] Title: Method for producing a three-dimensionally structured, conductive

[0004] component

[0005] Description

[0006] The invention relates to a method for manufacturing a three-dimensionally structured, at least partially conductive component and a construction unit comprising at least one such component.

[0007] Additive manufacturing processes, also known as 3D printing, have gained increasing importance in recent years. These processes typically involve applying or structuring a material layer by layer to create a three-dimensionally structured component. In particular, these methods enable the production of three-dimensional components with a high degree of design freedom and, at the same time, high precision.

[0008] A wide variety of technologies have been developed within additive manufacturing processes. For example, lithographic processes such as stereolithography or two- or multi-photon lithography are well-known, in which a usually liquid or solid lithographic material is cured using a light beam, especially a laser beam. Other processes include, for example, selective laser sintering (SLS) or fused deposition modeling (FDM).

[0009] However, the selection of available printing materials remains limited. In particular, 3D-printed components often lack the desired electrical properties. Many additive manufacturing processes rely on structuring non-conductive or only partially conductive plastic materials. To increase the conductivity of components, it is known, for example, to metallize the surface of 3D-printed components using PVD processes or to make their surface conductive using wet chemical methods. The invention aims to provide a method that enables the efficient production of three-dimensionally structured and conductive components.

[0010] This problem is solved according to the invention by a method according to claim 1. The method is a method for producing a three-dimensionally structured and at least partially conductive component.

[0011] According to the process, a three-dimensionally structured component blank is first provided. In particular, the component blank can be a 3D-printed component blank. The component blank can be made of a non-conductive material. The component blank can also be made of a conductive material. For example, the component blank can be made of plastic. The component blank can also be made of metal, ceramic, or glass.

[0012] In a further step of the process, a conductive base layer made of a base material is deposited, in particular directly, onto at least one section of the surface of the component blank. In this respect, at least one section of the surface of the component blank is coated with a conductive base layer made of a base material. The deposition of the base layer is preferably carried out by means of atomic layer deposition (ALD).

[0013] Alternatively, an intermediate layer can be deposited on at least a section of the component blank's surface before the base layer is deposited, preferably by atomic layer deposition (ALD). The base layer can then be deposited on at least a section of the previously deposited intermediate layer.

[0014] In a further step of the process, a conductive metal layer is deposited on at least a section of the base layer. The metal layer is deposited electrochemically, in particular by galvanic process. This process is therefore specifically a method for metallizing component blanks, especially 3D-printed ones.

[0015] According to the proposed method, at least two conductive layers are sequentially applied to a component blank. The conductive base layer can serve as an electrode, particularly a cathode, for the subsequent electrochemical deposition of the Meta 11 layer. In this way, even component blanks made of non-conductive materials can be reliably metallized. Furthermore, the base layer promotes a particularly homogeneous metal deposition. This is especially facilitated by the use of atomic layer deposition for the base layer, which enables the particularly uniform coating of component blanks, even those with complex geometries, since the process is intrinsically designed such that the growth rate does not vary, or only varies slightly, along the surface to be coated.

[0016] In atomic layer deposition (ALD), the material to be deposited is usually chemically bound to one or more carrier gases, known as precursors. These precursors are alternately fed into a reaction chamber and reacted with the substrate, whereupon the substance bound in the gas is deposited onto the substrate material.

[0017] Another advantage of atomic layer deposition is that conductive layers can be reliably deposited at comparatively low temperatures, which increases the range of usable blank materials. In this context, it is particularly advantageous if the component blank is made of a material that exhibits temperature stability up to at least 80 °C, and especially up to at least 150 °C, 200 °C, 250 °C, and 300 °C.

[0018] As mentioned above, providing the component blank can involve manufacturing it using an additive manufacturing process, particularly 3D printing, e.g., one- or two-photon polymerization or laser sintering. Furthermore, it is conceivable to produce the component blank using selective laser etching.

[0019] It is conceivable that the component blank is coated after its manufacture without further pretreatment steps according to the process described above. It is also conceivable that the component blank undergoes a pretreatment, e.g., a heat treatment, after its manufacture and before the application of the base layer or the optional intermediate layer.

[0020] The base material is, in particular, an oxide ceramic. For example, the base material can comprise or consist of a transparent conductive oxide, especially indium tin oxide (ITO). Preferably, however, the base material comprises or consists of zinc oxide, especially doped zinc oxide. The process therefore preferably comprises the deposition, by means of atomic layer deposition, of a base layer comprising or consisting of zinc oxide or doped zinc oxide. An advantage of zinc oxide results in particular from the comparatively fast deposition rate during atomic layer deposition, so that a conductive base layer can be produced with a comparatively short time expenditure. As explained in more detail below, zinc oxide is also relatively easy to remove and thus structure. Furthermore, the conductivity of zinc oxide can be adjusted as required by suitable doping, for example with aluminum, indium, or gallium.

[0021] Advantageous thicknesses of the base layer are in the range of 30-500 nm, preferably 50-300 nm, preferably 80-300 nm, and more preferably 100-200 nm.

[0022] The metal layer can, for example, comprise or consist of copper, silver, or gold. The Meta II layer can also comprise, and in particular consist of, a copper alloy. Preferably, the metal layer comprises copper or a copper alloy. In particular, the metal layer consists of copper or a copper alloy. Therefore, according to the method, after the deposition of the base layer, an electrochemical, in particular galvanic, copper deposition can be carried out on at least a section of the base layer.

[0023] In a particularly advantageous embodiment, the base material can comprise or consist of zinc oxide, especially doped zinc oxide, and the metal layer can comprise or consist of copper or a copper alloy.

[0024] As mentioned above, in an advantageous embodiment of the process, an intermediate layer can be deposited, particularly directly, onto at least one section of the component's surface by atomic layer deposition (ALD) before the base layer is deposited. Such an intermediate layer can improve the adhesion of the base layer to the component blank. A further advantage of the intermediate layer can arise if the component blank is to be removed after the metal layer has been deposited (explained in more detail below). In this case, the intermediate layer can form a protective layer against unwanted detachment of the base layer, particularly the zinc oxide layer. It has proven particularly advantageous if the intermediate layer comprises or consists of aluminum oxide.The use of aluminum oxide for the interlayer has the advantage that atomic layer deposition of aluminum oxide is a comparatively controllable process with a high deposition rate. In particular, largely defect-free, compact, and dense aluminum oxide layers can be produced using atomic layer deposition. Specifically, the interlayer can be an amorphous aluminum oxide layer.

[0025] For the intermediate layer, layer thicknesses of less than 100 nm, more particularly less than 50 nm, more particularly less than 40 nm, and preferably less than 30 nm, have proven to be advantageous.

[0026] In a particularly advantageous embodiment, the method may comprise the following steps, preferably in the order given: a) providing a three-dimensionally structured component blank; b) depositing, by atomic layer deposition, an intermediate layer on at least one section of the surface of the component blank, wherein the intermediate layer comprises or consists of aluminum oxide, preferably with a layer thickness of 20-50 nm; c) depositing, by atomic layer deposition (ALD), a conductive base layer of a base material on at least one section of the (previously deposited) intermediate layer, wherein the base material comprises or consists of zinc oxide or doped zinc oxide, preferably with a layer thickness of 100-200 nm;d) Electrochemical, in particular galvanic, deposition of a metal layer on at least one section of the base layer, wherein the metal layer preferably comprises copper, silver or gold, in particular copper.

[0027] In general terms, after the deposition of the base layer and before the deposition of the metal layer, the base layer, and in particular the optional intermediate layer, can be section by section removed and thus structured. This allows for the selective deposition of the metal layer at defined positions on the component blank, thereby enabling locally controlled generation of conductivity on the component blank, for example, to create conductive traces or electrical circuits.

[0028] The sectional removal of the base layer and optionally the intermediate layer can be carried out mechanically and / or chemically. Advantageously, the sectional removal of the base layer and optionally the intermediate layer can include the application, particularly locally, of an etching liquid, especially an acid. In particular, the sectional removal of the base layer and optionally the intermediate layer can include the impregnation, particularly locally, of the base layer and optionally the intermediate layer with an etching liquid, especially an acid. The removal of the base layer and the optional intermediate layer can thus include the etching or dissolution, particularly locally, of the base layer and optionally the intermediate layer using an etching liquid, especially an acid.

[0029] For the sectional removal of the base layer, dilute hydrochloric acid, and especially 0.5% hydrochloric acid, has proven particularly advantageous. For the optional removal of the intermediate layer, concentrated potassium hydroxide, for example, has proven advantageous.

[0030] As part of an advantageous further development, the component blank can have one or more fluid absorption structures. The at least one fluid absorption structure is formed, in particular, in a section of the component blank.

[0031] The at least one fluid receiving structure is specifically designed to receive and preferably retain a fluid. In particular, the fluid receiving structure can be designed to retain a fluid via capillary forces. The fluid receiving structure can also have a wicking effect. In particular, the fluid receiving structure can have one or more fluidically interconnected cavities. Alternatively or additionally, the at least one fluid receiving structure can be designed to guide a fluid to defined areas of the surface of the component blank.

[0032] The at least one fluid absorption structure can be formed on a surface of the component blank. For example, the fluid absorption structure can be provided in the form of local depressions, in particular channels, on the surface of the component blank. Parts of the volume of the component blank can also be designed as a fluid absorption structure. For example, the component blank can be porous in sections. In this respect, the at least one fluid absorption structure can be formed by a porous section of the component blank. It is also conceivable that a porous structure, in particular a lattice structure, is applied locally to a surface of the component blank, and is particularly likely to be created during the manufacturing of the component blank. Preferably, the at least one fluid absorption structure is designed as a lattice structure.

[0033] The at least one fluid absorption structure can preferably be integrated into the component blank during its manufacture, particularly 3D printing. Thus, the same methods used to provide the component blank can be applied to define electrically conductive and non-conductive areas on the coated component blank.

[0034] The at least one fluid absorption structure is designed, and the base layer and the optional intermediate layer are applied, such that the structure is also reflected in the base layer and the optional intermediate layer. In particular, the fluid absorption structure can have one or more fluidically interconnected cavities, wherein the cavities are dimensioned, and the base layer and the optional intermediate layer are applied, such that the cavities remain fluidically interconnected after application of the base layer and the optional intermediate layer, and in particular are not closed. For example, if the fluid absorption structure is configured as a lattice structure, the lattice spacing can be greater than twice the combined thickness of the base layer and the optional intermediate layer.

[0035] Such fluid absorption structures can facilitate the local removal of the base layer and, optionally, the intermediate layer. In particular, fluid absorption structures can be provided at locations on the component blank where no Meta II layer is to be deposited later, or where only a metal layer is to be deposited.

[0036] In a first implementation, it is conceivable, for example, that the section-by-section removal of the base layer and optionally the intermediate layer includes the application of an etching fluid into the at least one fluid receiving structure. The at least one fluid receiving structure, in particular a lattice structure, can localize the etching fluid within it, thus avoiding the removal of the base layer in adjacent areas. In particular, it is conceivable that the fluid receiving structure provides a capillary effect, keeping the etching fluid localized within it. It is also conceivable that the fluid receiving structure directs the etching fluid to defined areas of the component blank's surface, thereby further localizing the etching reaction.In summary, the at least one fluid receiving structure can be advantageously used to provide an electrically non-conductive area on at least one section of the component blank without having to remove or otherwise abrade any material from the component blank. This is advantageous, for example, if the at least one section of the component blank is important for mechanical stability, but it is simultaneously necessary or desirable for that same section to be electrically non-conductive.

[0037] As part of an alternative second implementation, it is conceivable, for example, that the removal of at least the base layer and optionally the intermediate layer involves first applying a protective fluid, particularly an inert or passivating fluid, such as oil, resin solution, or varnish (e.g., 3D printing resin), or a protective compound, such as a potting compound or UV-curing compound, into the fluid receiving structures. Subsequently, an etching fluid, such as 0.5% hydrochloric acid, can be applied to the component blank, particularly to the base layer. Specifically, after applying the protective fluid, the component blank can be immersed in an etching fluid, particularly 0.5% hydrochloric acid, to remove the base layer. The protective fluid or compound is specifically inert to the etching fluid, meaning that the protective fluid or compound...The protective compound is essentially not removed by the etching fluid. Therefore, a reversal of the selectivity is possible in the sense that the base layer and the optional intermediate layer in the area of ​​the fluid-receiving structure are precisely not removed.

[0038] Advantageously, the process can include structuring the base layer and, optionally, the intermediate layer using a laser after the deposition of the base layer and before the deposition of the metal layer. In particular, the sectional removal of the base layer and, optionally, the intermediate layer can include irradiation with a laser beam, and in particular, can be carried out using a laser. Thus, the process can include laser treatment after the deposition of the base layer and, optionally, before the deposition of the metal layer, to sectionally remove or assist the removal of the base layer and, optionally, the intermediate layer. The removal of the base layer and, optionally, the intermediate layer using a laser can be performed in addition to or as an alternative to removal using an etching fluid.

[0039] Alternatively, the metal layer can be structured by selectively (locally) masking the surface of the component blank before depositing the base layer or the optional intermediate layer. For example, it is conceivable to apply adhesive tape to sections of the component blank's surface before depositing the base layer or the optional intermediate layer, and then remove this tape after deposition of the base layer or the metal layer. Advantageously, the adhesive tape could be Kapton tape. The tape can also be removed before deposition of the metal layer.

[0040] In general terms, it is possible that the component blank, with its optional deposited intermediate layer, base layer, and metal layer, can be further used as a component, for example, as an electrode, connector (especially multi-pin connectors, coaxial connectors), or antenna (especially horn antennas). In this respect, the process can be completed after the deposition of the metal layer. The three-dimensionally structured, conductive component produced according to the process can then be a coated component blank. Therefore, the proposed process can be considered a method for metallizing a component blank, particularly one that is 3D-printed.

[0041] It is also conceivable that the component blank is removed after the metal layer has been deposited. The three-dimensionally structured, conductive component produced according to the process can then be, in particular, a hollow structure, especially a metallic hollow structure. For this purpose, it can be advantageous if, after the metal layer has been applied and before the component blank has been removed, at least one local recess is created in the metal layer, the underlying base layer, and the optional intermediate layer. The component blank material can then be removed through this recess from the interior of the shell structure formed by the metal layer, leaving only a shell structure comprising the metal layer, the base layer, and the optional intermediate layer. The recess can be created mechanically, chemically, and / or electrochemically.

[0042] Removing the component blank can involve, in particular, selectively dissolving or melting it. For a plastic component blank, removal might involve dissolving it with a suitable solvent. For a glass component blank, removal might involve dissolving it with hydrofluoric acid. For a metal component blank, removal might involve melting it. In the latter case, it can be particularly advantageous if the metal is a low-melting-point metal, such as an indium-based alloy.

[0043] During the removal of the component blank, the base layer and / or the optional intermediate layer can serve as a protective layer for the metal layer. To also protect the outer surface of the metal layer facing away from the base layer against unwanted effects such as solvents or acids, it is also conceivable that, before removing the component blank, the outer surface of the metal layer facing away from the base layer is at least partially, but preferably completely, covered or shielded.

[0044] In particular, it is conceivable that a protective layer is applied to the outer metal layer facing away from the base layer before the component blank is removed. For example, a protective layer, especially an aluminum oxide layer, can be deposited by means of atomic layer deposition. It is also conceivable that the outer metal layer facing away from the base layer is coated with a resin as a protective layer.

[0045] The base layer and the optional intermediate layer can remain on the metal layer, particularly on the (inner) surface of the metal layer, after the component blank has been removed. However, it is also conceivable that the base layer and the optional intermediate layer are removed at least partially, preferably completely, after the component blank has been removed. In particular, the base layer and the optional intermediate layer can be removed chemically, for example, by dissolving them with acid. As mentioned above, hydrochloric acid, and more specifically 0.5% dilute hydrochloric acid, has proven particularly advantageous for dissolving the base layer.

[0046] In general terms, after the metal layer has been deposited, the component blank (i.e., the metallized component blank) can be cast or embedded, at least partially, in a stabilizing compound, or overmolded or coated with a stabilizing compound to fix the component blank in place. This can be particularly advantageous if the component blank is to be removed subsequently. The stabilizing compound could be, for example, an epoxy resin or polymethyl methacrylate (PMMA).

[0047] In a particularly advantageous embodiment, the method may comprise the following steps, in particular in the order given: a) providing a three-dimensionally structured component blank; b) (optionally) depositing, by atomic layer deposition (ALD), an intermediate layer on at least one section of the surface of the component blank; c) depositing, by atomic layer deposition (ALD), a conductive base layer made of a base material directly on at least one section of the surface of the component blank or on at least one section of the optionally previously deposited intermediate layer.d) (optional) Sectional removal of the base layer, in particular and the optional intermediate layer, in particular comprising locally impregnating the base layer and optionally the intermediate layer with acid; e) Electrochemical, in particular galvanic, deposition of a metal layer on at least one section of the base layer; f) (optional) At least sectional embedding of the coated component blank in a stabilizing mass or overmolding or coating of the coated component blank with a stabilizing mass; g) (optional) At least sectional covering of the metal layer, in particular applying a protective layer to at least one section of the surface of the metal layer; h) Removal of the component blank, in particular by selectively dissolving or melting the component blank; i) (optional) at least sectional removal of the base layer and the optional intermediate layer.

[0048] For further advantageous designs of the individual procedural steps, reference is made to the above disclosure.

[0049] In general terms, it is possible to apply an additional layer to at least a portion of the surface of the metal layer (the side facing away from the base layer) after the metal layer has been deposited. This additional layer can, for example, protect the metal layer from environmental influences. The additional layer can serve as a protective layer. Applying the additional layer can be advantageous regardless of whether the metallized component blank is used further as a component or whether the component blank is removed.

[0050] It can be advantageous if the additional layer is conductive. Therefore, the process can include, after the deposition of the metal layer, applying a conductive additional layer to the metal layer. Advantageous materials for the additional layer include precious metals, in particular gold or silver, conductive nitrides, and conductive oxides. Preferably, the additional layer is a layer of a conductive oxide, in particular doped tin oxide, preferably indium-doped tin oxide, or zinc oxide, in particular doped zinc oxide, preferably aluminum-doped zinc oxide. An additional layer of doped zinc oxide, in particular aluminum-doped zinc oxide, has proven to be particularly preferred. The use of zinc oxide has proven particularly advantageous in embodiments of the metal layer comprising copper or a copper alloy.

[0051] The additional layer can be applied in particular by means of atomic layer deposition.

[0052] In a particularly advantageous embodiment, the method may comprise the following steps, in particular in the order given: a) providing a three-dimensionally structured component blank; b) (optionally) depositing, by atomic layer deposition (ALD), an intermediate layer on at least one section of the surface of the component blank; c) depositing, by atomic layer deposition (ALD), a conductive base layer made of a base material, in particular comprising doped zinc oxide, directly onto at least one section of the surface of the component blank or onto at least one section of the optionally previously deposited intermediate layer.d) (optional) Sectional removal of the base layer, in particular and the optional intermediate layer; e) Electrochemical, in particular galvanic, deposition of a metal layer, in particular of copper, onto at least one section of the base layer; f) (optional) Deposition, in particular by atomic layer deposition, of an additional layer, preferably conductive, in particular of doped zinc oxide, onto at least one section of the metal layer.

[0053] The invention also relates to a component assembly comprising at least one component manufactured according to a method described above. The component assembly can, for example, be an electrode, particularly for life science applications. The component assembly can also, for example, be a horn antenna for high-frequency applications. The component assembly can also, for example, be a connector, particularly a multi-pin connector, and more specifically, a coaxial connector.

[0054] The invention is explained in more detail below with reference to the figures. It shows:

[0055] Figure 1 Flowchart to illustrate one embodiment of the process as well as simplified schematic sketches to illustrate the individual process steps;

[0056] Figure 2 simplified schematic representation of an exemplary design of a

[0057] Component blank with fluid absorption structure; and

[0058] Figure 3 simplified schematic representation of another exemplary embodiment of the component blank with fluid intake structure.

[0059] In the following description and in the figures, the same reference symbols are used for identical or corresponding features.

[0060] Figure 1 shows on the left a flowchart illustrating the individual process steps of an embodiment of a method for manufacturing a three-dimensionally structured and conductive component 10. Optional process steps are indicated by dashed boxes. On the right side of Figure 1, simplified schematic sketches illustrating the individual process steps are shown.

[0061] According to the procedure, a three-dimensionally structured component blank 12 is provided in a first step. In the example shown, the component blank 12 has a cuboid shape. However, any other geometry is conceivable. For better illustration, the following sketches show the component blank 12 and the layers explained below in a sectional view.

[0062] The provision of the component blank 12 may in particular include the production of the component blank 12 using an additive manufacturing process, e.g. using lithographic processes.

[0063] In an optional further step 102, an intermediate layer 16 is deposited on at least one section of the surface 14 of the component blank 12 by means of atomic layer deposition (ALD). Preferably, the intermediate layer 16 is an aluminum oxide layer.

[0064] The intermediate layer 16 preferably has a layer thickness of about 30 nm.

[0065] In a further step 104, a conductive base layer 18 made of a base material 20 is deposited on at least one section of the intermediate layer 16. The base layer 18 is deposited by atomic layer deposition (ALD). Preferably, the base material 20 is zinc oxide or doped zinc oxide. The base layer 18 preferably has a thickness of about 100–200 nm.

[0066] In embodiments not shown, it is also conceivable that no intermediate layer 16 is provided (i.e., step 102 is not provided). In this case, the base layer 18 can be deposited directly onto the surface 14 of the component blank 12 by means of atomic layer deposition.

[0067] In an optional further step 106, the base layer 18 and the optional intermediate layer 16 can be removed section by section and thus structured (not shown). For this purpose, the base layer 18 and the optional intermediate layer 16 can be impregnated with an etching fluid, in particular acid, and thus locally dissolved. To support selective dissolution of the base layer 18, it is also conceivable that the component blank 12 has local fluid absorption structures 28 (explained in more detail below with reference to Figures 2 and 3). In yet other embodiments, it is also conceivable that the section by section removal of the base layer 18 and the optional intermediate layer 16 is carried out using a laser.

[0068] In a further step 108, a metal layer 22 is then electrochemically deposited onto at least a section of the base layer 18. For this purpose, for example, the component blank 12, coated with the base layer 18 and the optional intermediate layer 16, can be placed in an electroplating bath comprising an electrolyte liquid containing the metal to be deposited and an electrode immersed in the electrolyte liquid. The electrode serves as the anode. The anode material can be identical to the metal to be deposited. The cathode can then be formed by the conductive base layer 18. If an electric current is now passed between the anode (metal to be deposited) and the cathode (base layer 18), the metal is dissolved and transferred to the cathode, i.e., to the base layer 18, and deposited there. In particular, the metal can be copper, silver, or gold. In particular, the metal layer 22 can be a copper layer.The process can end after the deposition of the Meta II layer 22. Therefore, the component blank 12 coated with the metal layer 22 can form the component 10.

[0069] However, as explained below, it is also conceivable that the component blank 12 is removed after the deposition of the metal layer 22, so that a metallic hollow structure 26 is formed.

[0070] To protect the metal layer 22 during the removal of the component blank 12, in an optional step 110 prior to removal of the component blank 12, the outer surface 24 of the metal layer 22 facing away from the base layer 18 can be provided with a protective layer (not shown). For example, an aluminum oxide layer can be deposited onto the metal layer 22 by means of atomic layer deposition. It is also possible to cover the metal layer 22 with a resin layer.

[0071] In a further step 112, the component blank 12 can then be removed. For this purpose, it can be advantageous if, after the application of the metal layer 22, a local recess (not shown), in particular a hole, is provided in the metal layer 22 and the base layer 18 and the optional intermediate layer 16 such that the material of the component blank 12 can be removed through this recess. As mentioned above, the removal of the component blank 12 can involve dissolving the component blank 12 in a suitable solvent or melting the component blank 12. Optionally, the component blank 12 coated with the metal layer 22 can be embedded in a stabilizing mass (not shown), e.g., comprising PMMA or epoxy resin, or overmolded with a stabilizing mass before the component blank is removed.

[0072] In an optional further step 114, after the removal of the component blank 12, the base layer 18 and the optional intermediate layer 16 can then be removed at least sectionally, but preferably completely, e.g. by dissolving with acid, in particular dilute hydrochloric acid.

[0073] In further embodiments not shown, after the deposition of the metal layer 22 (step 108), an additional layer, in particular a conductive one, can be applied to the outer surface 24 of the metal layer 22 facing away from the base layer 18. For example, it is conceivable that an additional layer of doped zinc oxide is deposited onto the Meta II layer 22 by means of atomic layer deposition.

[0074] Figure 2 shows a simplified example of a component blank 12. The component blank 12 is only shown as a tube as an example.

[0075] The component blank 12 has a fluid receiving structure 28 in sections. The fluid receiving structure 28 has a plurality of fluidically interconnected cavities 30.

[0076] The fluid absorption structure 28 is formed by a porous section 32 of the component blank 12 as an example. In particular, the fluid absorption structure 28 is designed as a lattice structure.

[0077] In such a configuration with fluid absorption structure 28, the base layer 18 is also produced on the fluid absorption structure 28 in step 104. Optionally, the intermediate layer 16 may have been deposited on the fluid absorption structure 28 beforehand in step 102.

[0078] The fluid receiving structure 28 is dimensioned such that the cavities 30 are not closed by the application of the base layer 18 and the optional intermediate layer 16.

[0079] As mentioned above, by selectively applying an etching liquid to the fluid receiving structure 28 the base layer 18 and optionally the intermediate layer 16 can be locally removed, so that the area of ​​the fluid receiving structure 28 is not metallized during the subsequent metallization (step 108 in Fig. 1).

[0080] In this specific example, one obtains a tube that is mechanically connected but electrically divided into a left and a right area by the fluid intake structure 28.

[0081] Figure 3 shows another exemplary embodiment of a component blank 12 with a fluid absorption structure 28, in which the fluid absorption structure 28 is applied to a surface 34 of the component blank 12, which in this example is rod-shaped. In this embodiment, the base layer 18 and optionally the intermediate layer 16 can then be locally removed by selectively applying the etching fluid into the fluid absorption structure 28, so that the area of ​​the fluid absorption structure 28 is not metallized during the subsequent metallization.

[0082] In the configuration according to Fig. 3, a gap is thus obtained in the metal layer 22 in the area of ​​the fluid receiving structure 28 on the surface 34. Except for this non-conductive gap itself, however, the other areas of the surface 30 remain electrically connected to each other (via the interior of the rod).

Claims

Patent claims 1. Method for producing a three-dimensionally structured, at least partially conductive component (10), comprising: - Providing a three-dimensionally structured, in particular 3D-printed, component blank (12); - Deposition, by means of atomic layer deposition (ALD), of a conductive base layer (18) made of a base material (20) on at least one section of the surface (14) of the component blank (12) or on at least one section of an optionally previously applied intermediate layer (16) on the component blank (12); - electrochemical deposition of a metal layer (22) on at least one section of the base layer (18).

2. The method of claim 1, wherein the base material (20) comprises or consists of zinc oxide, in particular doped zinc oxide.

3. Method according to one of claims 1 or 2, wherein the base layer (18) has a layer thickness of 30 to 500 nm, preferably of 50 to 300 nm, more preferably of 80 to 300 nm, more preferably of 100 to 200 nm.

4. Method according to any of the preceding claims, wherein the metal layer (22) comprises, and in particular consists of, copper, silver, gold or a copper alloy.

5. Method according to one of the preceding claims, wherein an intermediate layer (16) is deposited on at least one section of the surface (14) of the component blank (12) by means of atomic layer deposition (ALD) prior to the deposition of the base layer (18).

6. Method according to the previous claim, wherein the intermediate layer (16) comprises aluminium oxide and / or has a layer thickness of less than 100 nm, in particular less than 50 nm, further in particular less than 40 nm, preferably 30 nm.

7. Method according to one of the preceding claims, wherein after the deposition of the base layer (18) and before the deposition of the metal layer (22) the base layer (18), in particular and the optional intermediate layer (16), is removed section by section, in particular chemically and / or mechanically.

8. Method according to the preceding claim, wherein the section-by-section removal of the base layer (18) and optionally the intermediate layer (16) comprises the application of an etching liquid, in particular dilute hydrochloric acid, further in particular 0.5% hydrochloric acid, to the base layer (18).

9. Method according to claim 7, wherein the component blank (12) has at least one local fluid receiving structure, in particular a lattice structure, wherein the section-by-section removal of the base layer (18) and optionally the intermediate layer (16) comprises the application of an etching liquid, in particular dilute hydrochloric acid, further in particular 0.5% hydrochloric acid, into the at least one fluid receiving structure.

10. Method according to claim 7, wherein the component blank (12) has at least one local fluid receiving structure, in particular a lattice structure, comprising the section-by-section removal of the base layer (18) and optionally the intermediate layer (16): - Applying a protective fluid or mass, especially inert or passivating, into the fluid receiving structures, - Applying an etching liquid to the component blank (12), in particular soaking or immersing the component blank (12) in an etching liquid.

11. Method according to the preceding claim, wherein the protective fluid is a resin, an oil or a varnish.

12. Method according to claim 10 or 11, wherein the protective compound is a potting compound or a UV-curing compound.

13. Method according to any one of claims 7 to 12, wherein the section-by-section removal of the base layer (18) and optionally the intermediate layer (16) comprises irradiation with a laser beam.

14. Method according to one of the preceding claims, wherein the component blank (12) is, after deposition of the metal layer (22), at least partially cast into a stabilizing mass or overmolded with the stabilizing mass at least partially.

15. Method according to one of the preceding claims, wherein after deposition of the Meta II layer (22) the component blank (12) is removed, in particular by selective dissolution or melting of the component blank (12).

16. Method according to the previous claim, wherein, prior to the removal of the component blank (12), the surface (24) of the metal layer (22) facing away from the base layer (18) is at least partially, but preferably completely, covered or shielded.

17. Method according to claim 15, wherein a protective layer is applied to the surface (24) of the metal layer (22) facing away from the base layer (18) before the component blank (12) is removed.

18. Method according to the preceding claim, wherein the protective layer is deposited by atomic layer deposition (ALD).

19. Method according to claim 15, wherein a resin is applied to the surface (24) of the metal layer (22) facing away from the base layer (18) before the component blank (12) is removed.

20. Method according to one of claims 15 to 19, wherein after removal of the component blank (12) the base layer (18) and the optional intermediate layer (16) are removed at least section by section, preferably completely, in particular chemically.

21. Method according to any one of claims 1 to 13, wherein after the deposition of the metal layer (22) a conductive additional layer is applied to the metal layer (22).

22. Method according to the preceding claim, wherein the additional layer comprises a precious metal, a conductive nitride or a conductive oxide, preferably doped zinc oxide, further preferably aluminum-doped zinc oxide.

23. Method according to claim 21 or 22, wherein the additional layer is deposited by atomic layer deposition (ALD).

24. Construction unit comprising at least one component manufactured according to the method of any of the preceding claims.

25. Assembly according to the preceding claim, wherein the assembly is an electrode, a horn antenna, a connector, a multi-pole connector, a coaxial connector, or a waveguide structure.

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