High-frequency power coupler for a power converter for an industrial process assembly

Abstract

The invention relates to a high-frequency power coupler (1) for coupling a plurality of HF input signals in order to form an HF output signal for outputting HF power to an industrial process assembly (100), preferably a plasma process assembly, gas laser excitation, or heating assembly, the HF power coupler having: a. a plurality of HF inputs (11, 12, 13, 14, 15), b. an HF output (7), c. a coupling unit (19), d. an impedance matching line (20) which extends from the coupling unit (19) to the HF output (7) and has a length which is designed to bring about an impedance matching function between the output of the coupling unit and the HF output, and e. an upper mounting plate (23), a middle mounting plate (25), and a lower mounting plate (27), the middle mounting plate (25) being provided between the upper and the lower mounting plate, wherein f. the impedance matching line (20) is provided between the upper and the middle mounting plate and between the lower and the middle mounting plate.

Description

[0001] 2023P00582WG

[0002] 1

[0003] High-frequency power coupler for a power converter for an industrial process arrangement

[0004] The invention relates to a high-frequency power coupler for coupling multiple RF input signals to a single RF output signal, for supplying RF power to an industrial process arrangement, preferably a plasma process arrangement, gas laser excitation, or heating arrangement. The invention further relates to an electrical power converter for an industrial process arrangement, preferably a plasma process arrangement, gas laser excitation, or heating arrangement, comprising such an RF power coupler.

[0005] In this application, "HF" stands for high frequency. High frequency here refers to a frequency of at least 1 MHz. Preferably, it also refers to a frequency of no more than 100 MHz.

[0006] Such industrial process setups are often operated at very high power levels. Very high power here refers to an electrical output power of at least 20 kW at an RF output. These applications are also referred to as high-power applications.

[0007] A plasma process setup, especially for gas laser excitation, particularly for high-frequency RF applications, can be very complex and often has to meet high requirements, for example, regarding performance, efficiency, operational readiness / availability, and space requirements. This also requires, for example, the efficient transmission of high electrical RF power, which may necessitate precise electrical matching or adjustment.

[0008] Due to space constraints in such industrial processes, it is necessary to save space in the control cabinets to meet all customer requirements. Furthermore, it is desirable to accommodate more RF power converters and RF power couplers in a single cabinet, which leads to volume issues. An overly cramped design often results in insufficient mechanical stability and reduced resistance to electromagnetic interference because shielding is often inadequate and cables are routed too close together.

[0009] The invention is based on the objective of improving a high-frequency power coupler of the type mentioned above, in particular by making it more compact and simultaneously improving its stability. 2023P00582WG

[0010] 2

[0011] This problem is solved by an RF power coupler with the features according to claim 1. Further aspects are disclosed in the description, dependent claims and subclaims.

[0012] In one aspect, an RF power coupler for coupling multiple RF input signals to a single RF output signal, for supplying RF power to an industrial process arrangement, preferably a plasma process arrangement, gas laser excitation, or heating arrangement, is disclosed. The RF power coupler comprises: a. multiple RF inputs, b. an RF output, c. a coupling unit, d. an impedance matching line extending from the coupling unit to the RF output and having a length designed to effect impedance matching from the output of the coupling unit to the RF output, e. an upper mounting plate, a middle mounting plate, and a lower mounting plate, wherein the middle mounting plate is arranged between the upper and the lower mounting plates, and f. wherein the impedance matching line is arranged between the upper and the middle mounting plates and between the lower and the middle mounting plates.

[0013] A space-saving arrangement of the impedance matching line can ensure that the high-frequency power coupler can be built in a particularly space-saving and stable manner.

[0014] In one aspect, the RF power coupler is designed for a power output of 1 kW to 10 kW at one, or preferably all, RF inputs. Because the RF power coupler is designed to integrate high power into a compact design, it can be installed in control cabinets or industrial plants, saving space. This is particularly advantageous when space is limited but high RF power is still required. The power range of 1 kW to 10 kW can cover a wide variety of RF applications, from small laboratory setups to large industrial applications such as plasma processes, gas lasers, or heating systems. This versatility makes the RF power coupler attractive for a broad range of applications.

[0015] In one aspect, the RF power coupler is designed for a high frequency in the range of 1 MHz to 100 MHz, preferably in the range of 10 MHz to 30 MHz, particularly in the 2023P00582WG.

[0016] 3

[0017] The operating range is from 13 MHz to 14 MHz and / or from 26 MHz to 28 MHz, with particular preference given to 13.56 MHz or 27.12 MHz. The frequency range from 1 MHz to 100 MHz covers many industrial and scientific applications. This includes, among others, plasma excitation, induction heating, and certain applications in high-frequency technology, such as the control of gas lasers. This makes the coupler suitable for use in many different fields. The specific frequencies of 13.56 MHz and 27.12 MHz are common industrial ISM frequencies in many countries, where "ISM" stands for "Industry, Science, and Medicine." These frequencies are approved for use in industrial applications in many countries, meaning the RF power coupler can be operated in many countries without additional frequency licenses. This can simplify deployment and reduce regulatory hurdles.Adapting the coupler to these frequencies enables precise impedance matching and efficient power transfer. At these frequencies, it is possible to transmit high power with low losses, leading to improved overall system energy efficiency. These advantages make the RF power coupler not only versatile and adaptable, but also particularly efficient and suitable for specific industrial applications requiring the aforementioned high power output.

[0018] In one aspect, the coupling unit can be implemented on a printed circuit board (PCB). Integrating the coupling unit onto a PCB allows for a space-saving and compact solution. This reduces the required installation space, which is particularly advantageous in modern, densely packed electronic systems. Implementing the coupling unit on a PCB can facilitate mass production and reduce manufacturing costs compared to discrete components. Integration on a PCB allows for precise definition of connections and impedances. This ensures consistent, reliable performance of the coupling unit and reduces potential deviations or interference. The coupling unit on a PCB can be easily connected to other circuits and components also housed on the same board.This can reduce wiring effort and simplify the overall system design. Direct connections on the circuit board, eliminating long cable runs, can reduce signal loss and unwanted reflections. This can lead to more efficient signal transmission and improved coupling unit performance. A circuit board implementation can be designed to effectively dissipate heat generated by the electronic components. A circuit board coupling unit can be easily integrated into modular systems, enhancing the expandability and flexibility of the 2023P00582WG.

[0019] This can increase the overall system capacity. Additional components or functions can be added on the same circuit board or via additional boards. When the coupling unit is securely mounted on the circuit board, the risk of assembly or connection errors due to loose cables or inaccurate connections can be reduced. This can lead to greater operational reliability and reduce the need for maintenance.

[0020] RF inputs can be electrical connections, specifically electrical connectors such as coaxial plugs on a housing. Coaxial plugs allow for quick and easy connection of RF inputs to external devices, saving installation time. They are standardized electrical connectors used in many industrial applications, increasing compatibility with existing systems. Coaxial plugs offer good shielding and reduce signal loss, which is advantageous in RF applications. Using housing-mounted coaxial plugs ensures a mechanically stable connection that can withstand vibrations or mechanical stress. Integrating the coaxial plugs into the housing allows for a space-saving arrangement of the connections, contributing to the overall system compactness.

[0021] Coaxial connectors can be attached, specifically soldered, to this coupling unit circuit board as RF inputs. Soldering the coaxial connectors to the circuit board ensures a durable and stable electrical connection, increasing operational reliability. Directly mounting and soldering the coaxial connectors reduces contact resistance and signal loss, which is advantageous in RF applications. Integrating the coaxial connectors directly onto the circuit board reduces the footprint and supports a compact design, which is beneficial for densely packed electronic systems. Soldered connections offer high and reliable mechanical stability, ensuring the coaxial connectors remain securely attached even under vibration or mechanical stress. The soldering of the coaxial connectors during production can be automated, simplifying manufacturing and ensuring consistent results.Direct mounting on the circuit board can help to dissipate heat more effectively, which can improve the overall performance and lifespan of the RF inputs.

[0022] These RF input connectors can be positioned so that they protrude from the housing of the RF power coupler on one side. This provides direct access to the connectors, facilitating the installation and replacement of cables or external devices. 2023P00582WG

[0023] 5. This can accelerate the process. Positioning the connectors on one side of the enclosure can reduce the amount of internal wiring, which can decrease the risk of electromagnetic interference. Having the connectors on one side of the enclosure also facilitates neat cable routing, improving clarity and ease of maintenance. Securely anchoring the connectors to the enclosure wall can ensure a mechanically stable arrangement that remains stable even under shock or vibration.

[0024] The coupling unit can be designed to couple the electrical power present at its inputs to a common power at its output. This can be achieved by routing a connecting line from each RF input to a common neutral point. Routing the connecting lines to a common neutral point ensures a uniform and symmetrical distribution of the RF power, which can improve signal quality. The use of a common neutral point and central connecting lines allows for a compact and organized layout of the coupling unit, which is advantageous in confined installation spaces. Routing the connecting lines to a neutral point also facilitates precise impedance matching between the inputs and the output, which can reduce losses and increase efficiency.

[0025] The neutral point can be connected to one end of the impedance matching line. The neutral point acts as a central collection point for the electrical power of the RF inputs, allowing the power to be transferred evenly and efficiently to the output. Connecting the neutral point to the impedance matching line enables stable bundling of the input powers into a common output power, which can increase the reliability of the system. Connecting the neutral point to the impedance matching line can also allow for a compact design, reducing the space required and thus making it easier to integrate the system into existing enclosures or control cabinets.

[0026] The other end of the impedance matching line can be connected to the RF output. Such a connection improves impedance matching between the RF inputs and the output, ensuring efficient power transfer with minimal losses. Connecting the other end of the impedance matching line to the RF output also simplifies the coupler design by providing a clear and space-saving routing. The coupling unit can be configured with multiple RF inputs, each connected via equal-length lines less than Ω / 10. These equal-length lines ensure that the RF signals arrive at the coupling unit synchronously and without phase shifts, improving signal quality and reducing interference.Using cables of equal length can facilitate precise impedance matching between the RF inputs and the coupling unit, contributing to stable and efficient power distribution. Shorter cables, e.g., less than Ω / 10, can reduce losses due to attenuation or stray signal, increasing RF power efficiency and improving transmission. Shorter cable lengths also allow for a space-saving and compact design of the coupling unit, which is particularly advantageous in confined installation spaces. Furthermore, shorter cables (less than Ω / 10) can reduce unwanted resonance effects, increasing the system's frequency stability and improving efficiency in high-frequency applications.

[0027] In this disclosure, "Ä" represents the wavelength of the RF frequency. This wavelength depends on the material in which the wave propagates. In the case of an impedance matching line, this could be the material of the insulating layer. The insulating layer is described in more detail below.

[0028] The impedance matching line can be arranged planarly in multiple layers as a stripline. The term "stripline" is also known as "microstrip" in English. The planar arrangement of the stripline in multiple layers allows for a compact design, thus making efficient use of available space, especially in confined installation areas. A stripline can provide precise impedance control, which can improve power coupling efficiency and reduce losses due to mismatches. A stripline can exhibit low losses in RF signals because it offers good conductivity and can efficiently transmit the signal along the surface of the conductor. A stripline can be easily integrated onto printed circuit boards and can be simple to manufacture, which can reduce production costs and facilitate mass production.The planar arrangement of striplines across multiple levels can enable better heat dissipation, which can help reduce the risk of overheating and thermal problems. A multi-level stripline is well protected, which increases the mechanical stability of the entire system, especially against vibration and shock. A stripline can offer good control over electromagnetic interference in confined spaces, as it can often be placed in narrow areas between conductive layers, providing effective shielding (2023P00582WG).

[0029] 7. Since striplines are specifically designed for RF applications, they offer high frequency stability and precise signal transmission, which can ensure reliable and stable system performance.

[0030] One, or preferably several, mounting plates can be made of metal, particularly copper or aluminum, that is electrically and thermally conductive. Both copper and aluminum have excellent thermal conductivity. This allows for effective dissipation of heat generated during operation, which can extend the service life of the components and prevent overheating. Aluminum offers high, and copper offers very high, electrical conductivity, which can improve current flow throughout the assembly and reduce power losses. Aluminum also offers good electrical conductivity, although somewhat lower than copper, but has the advantage of being lighter. Mounting plates made of metal, such as copper or aluminum, offer high mechanical strength, which can increase the stability of the entire assembly and provide protection against mechanical stresses such as vibrations or shocks.Metallic mounting plates can provide effective shielding against electromagnetic interference, as metals block RF signals and thus reduce interference with other components.

[0031] Both metals, especially aluminum, are corrosion-resistant, which increases the durability of the mounting plates in demanding environments and reduces maintenance requirements. Aluminum combines these advantages with the additional benefits of low weight, low cost, high corrosion resistance, and low emissions, which is particularly desirable in the semiconductor industry.

[0032] One, or preferably several, mounting plates can be permanently attached to the housing of the RF power coupler. This fixed mounting of the plates to the housing stabilizes the entire structure of the RF power coupler, which can improve its mechanical robustness against vibrations and shocks. The direct connection of the mounting plates to the housing allows for efficient heat dissipation, thus improving component cooling. The fixed mounting of the metal plates to the housing can provide better shielding against electromagnetic interference, resulting in more stable RF performance and reduced signal interference. Furthermore, the fixed mounting of the plates to the housing can simplify the overall system design, as the components are compactly and securely fixed, which can facilitate handling and installation.A fixed mounting of the panels on the inside of the housing can save space, as the components can be arranged closer together, which can lead to a more compact design, especially in tight control cabinets of 2023P00582WG.

[0033] 8

[0034] The advantage is that if the housing can also be used as a passive cooling surface, the efficiency of heat dissipation is further increased, especially in high-performance applications that require good cooling. The fixed mounting can provide additional protection for the internal components of the RF power coupler from external influences such as dust or moisture, which can extend the system's lifespan.

[0035] In one aspect, one of the mounting plates is designed as a cooling plate with a coolant channel for conveying a cooling fluid. Integrating a coolant channel into a mounting plate allows for targeted and effective dissipation of heat generated during operation, which can improve the cooling of the RF components. By integrating the cooling function directly into the mounting plate, the need for additional external heat sinks or fans can be reduced, resulting in a more compact system design. When liquid cooling is used, it is quieter than fan or air cooling. This can contribute to quieter system operation, which is advantageous in sensitive environments. Liquid cooling is often more efficient than air cooling because liquids have a higher heat capacity. This can improve the overall efficiency of the system, as less energy is required for cooling.The coolant channel ensures targeted and / or uniform cooling across the entire mounting plate surface, thus preventing localized overheating. This constant cooling prevents thermal stress on the components, which can lead to a lower failure rate and increased reliability of the RF power coupler.

[0036] In one aspect, the middle mounting plate is designed as a cooling plate with a coolant channel for conveying a cooling fluid. This cooling channel allows for targeted heat dissipation directly in the center of the assembly, where most components are located. This helps to effectively remove heat from the critical areas of the RF power coupler. Cooling the middle plate can lead to a more even distribution of cooling capacity between the upper and lower mounting plates, resulting in more stable and uniform cooling of the overall system. With cooling centralized in the middle mounting plate, the RF power coupler can operate under higher loads without overheating, thus increasing the overall system performance.

[0037] In one aspect, both the upper and lower mounting plates are designed as cooling plates with a coolant channel for conveying a coolant. Cooling both the upper and lower mounting plates ensures comprehensive heat dissipation on both sides of the assembly, thus ensuring the overall system 2023P00582WQ

[0038] 9. Cooling from multiple sides of the RF power coupler assembly prevents the formation of heat build-up points, which is particularly important in areas with high power requirements.

[0039] In the aforementioned performance range and in use in semiconductor manufacturing, it is advantageous if heat is dissipated by coolant, because forced air cooling through a housing is undesirable, especially in cleanrooms.

[0040] In one aspect, an insulating layer is provided between the impedance matching line and one, in particular several, or preferably all, of the mounting plates. Here, "insulating layer" refers to an electrically insulating layer, not a thermally insulating layer. This insulating layer can be a hard material layer, such as ceramic, or an insulating circuit board material, such as FR4 or PTFE.

[0041] The insulating layer can positively influence the dielectric properties of the impedance matching line. This can enable more precise impedance control, resulting in better matching to RF components and improved signal transmission. This insulating layer between the impedance matching line and the mounting plates can contribute to the safety, stability, and performance of the RF power coupler by providing electrical, mechanical, and thermal protection.

[0042] In one aspect, the insulating layer is made of PTFE. "PTFE" is an abbreviation for polytetrafluoroethylene. PTFE has a very high dielectric strength, meaning it can function very well as an electrical insulator. It can effectively reduce the risk of short circuits and unwanted electrical connections between the impedance matching line and the mounting plates. PTFE has a low dielectric loss factor, which can reduce energy losses in high-frequency signals. This can help ensure that signal transmission over the impedance matching line remains efficient and that the quality of the RF signals is maintained. PTFE is extremely temperature-resistant and remains stable over a wide temperature range. This allows the insulating layer to remain resilient even at high operating temperatures without losing its insulating properties, which can be particularly advantageous in high-power applications.PTFE is resistant to many chemicals and environmental influences. This protects it from corrosion and chemical reactions, which can increase the lifespan of the insulating layer and surrounding components, even in demanding industrial environments. The dielectric constant of PTFE remains stable over a wide frequency range. This can facilitate precise impedance matching, as the 2023P00582WQ...

[0043] The electrical properties of the insulating layer do not change significantly with frequency. PTFE is relatively easy to process into thin layers and mold into various shapes. This can facilitate its integration as an insulating material in complex assemblies such as RF power couplers. Choosing PTFE as the insulating layer material can support reliable electrical insulation, stable high-frequency transmission, and high resistance to thermal and chemical stresses, which can improve the quality and longevity of the entire system.

[0044] One aspect is the ceramic insulating layer. Ceramic materials have very high dielectric strength, which allows them to act as highly effective insulators. They offer strong protection against electrical breakdowns, reducing the risk of short circuits between the impedance matching line and the mounting plates. Ceramic is extremely heat-resistant and retains its insulating properties even at very high temperatures. This makes it particularly suitable for applications where high operating temperatures may occur and can contribute to system stability. Ceramic materials exhibit low dielectric losses, which can help ensure efficient RF signal transmission. The low power dissipation ensures that energy transfer via the impedance matching line is not affected. The dielectric constant of ceramic remains stable even with changing temperatures and frequencies.This can facilitate precise impedance matching in the high-frequency range and ensure consistent performance of the RF power coupler. Ceramic is resistant to many aggressive chemicals and environmental influences. This makes it resistant to corrosion and ensures that the insulating layer retains its properties even in demanding industrial environments. Ceramic has high thermal conductivity compared to many other insulators. This allows for better heat dissipation, resulting in a more stable operating temperature for surrounding components. Choosing ceramic as the insulating layer material can offer a combination of excellent electrical insulation, high thermal and mechanical stability, and resistance to external influences, thus enhancing the reliability and durability of the RF power coupler.

[0045] The dielectric constant of the material influences the required length of the impedance matching conductor. The larger this dielectric constant of the material (Δr), the smaller, shorter, and therefore more space-saving the impedance matching conductor can be. Typical values ​​are 9 for ceramics and 2 for PTFE.

[0046] Therefore, ceramic would be the preferred choice. 2023P00582WG

[0047] 11

[0048] It should be noted that ceramic is brittle and can break, especially on the relatively large surfaces required here. These surfaces are at least 500 cm². 2 .

[0049] Additionally, due to the poor formability of ceramics, air gaps can form between the mounting plates and the insulating layer. Because of the different dielectric properties of air and ceramics, this can lead to high field strengths in the air gaps. This can cause corona or partial discharges, which can be detrimental to efficiency and potentially damaging to the material.

[0050] Therefore, it can also be advantageous here to use a material that is less brittle, even if the dielectric constant of the material 8r is significantly smaller.

[0051] It should be noted that PTFE is deformable.

[0052] In one aspect, the impedance matching line has a length of A / 4. This allows for good impedance matching.

[0053] In one aspect, the impedance matching line is designed in a meandering shape. This allows for efficient use of space while avoiding an unnecessary increase in inductance.

[0054] In one aspect, the impedance matching cable is made of metal. Due to the high electrical conductivity of metal, less heat is generated during the transmission of RF energy. This can help keep the cable's operating temperature low and reduce the need for complex cooling measures. Metals have high thermal conductivity, which allows the generated heat to be dissipated quickly. This can contribute to better temperature distribution and prevent certain areas from overheating. Using metal as the material for the impedance matching cable can enable reliable transmission of high-frequency signals, as metallic materials operate stably and with low loss even at high frequencies. This is advantageous for consistent impedance matching and the reduction of signal distortion.

[0055] In one aspect, the impedance matching cable is made of aluminum. Metallic materials, such as aluminum, offer very good electrical conductivity. This allows high-frequency signals to be transmitted with low resistance, which can increase signal transmission efficiency and reduce energy losses. Aluminum combines this advantage with the additional benefits of low weight, low cost, high corrosion resistance, and low emissions, which is particularly desirable in the semiconductor industry. 2023P00582WG

[0056] 12

[0057] One aspect of the impedance matching cable is its use of copper. Metallic materials like copper offer exceptionally good electrical conductivity. This allows RF signals to be transmitted with low resistance, which can increase signal transmission efficiency and reduce energy losses. Copper combines this advantage with the additional benefits of very good thermal conductivity.

[0058] In one aspect, the impedance matching cable has a meandering design. This allows for efficient use of space without unnecessarily increasing inductance. The meandering shape enables the cable to be housed in a small space. This is particularly useful when the physical length of the cable is critical for impedance matching, but available space is limited. The meandering design allows for fine-tuning of the cable's resonant characteristics to achieve precise matching at specific frequencies. This is especially advantageous in high-frequency applications where accurate cable tuning is essential. Due to its shape, a meandering cable can better absorb and compensate for certain mechanical stresses and vibrations. This allows for a more robust structure that withstands mechanical influences and maintains stability over a longer period.

[0059] In one aspect, the mounting plates are arranged parallel to each other in such a way that they make contact with the impedance matching line on both sides via the insulating layer, thus providing cooling. This two-sided cooling allows the impedance matching line to handle higher electrical power levels without the risk of overheating. This can make the RF power coupler more resistant to power spikes and thermal loads. With this cooling method, additional external cooling devices such as fans or separate heat sinks can be reduced or eliminated, as the integrated plates already ensure effective heat dissipation. This saves space and simplifies the overall design. A particularly compact arrangement is thus possible, allowing for a 19" rack-mountable configuration.

[0060] In one aspect, the middle mounting plate features a recess for routing the impedance matching cable between its two layers. This allows for a particularly low-radiation configuration. The recess in the middle mounting plate enables precise and secure routing of the impedance matching cable. This ensures the cable remains stable in place and preserves the system's mechanical structure even under external influences. Integrating the cable into the recess allows for better utilization of vertical installation space. The cable can be routed through the plate without requiring additional width, enabling a more compact design. The recess also provides better protection for the cable against mechanical damage.The central plate can provide an additional physical barrier, protecting the sensitive impedance matching wire from shocks, vibrations, or external influences. The recess allows for close contact between the wire and the plate, facilitating heat transfer. This enables the plate to directly absorb heat from the impedance matching wire and conduct it to a cooling system, thus promoting a more uniform temperature distribution. Precise positioning of the wire by the recess ensures a stable electrical connection, contributing to the reliability of the high-frequency transmission. This allows for consistent impedance matching, reducing signal loss. The recess also provides clear wire routing, simplifying installation.Even during maintenance, the impedance matching line remains easily accessible without requiring disassembly of the entire assembly. This design of the central mounting plate with a recess offers a well-conceived solution for integrating the impedance matching line, reducing space requirements while simultaneously improving system stability and efficiency.

[0061] In one aspect, the impedance matching line is routed from one layer to the other along the edge of the central mounting plate. This can allow for a particularly space-saving arrangement.

[0062] In one aspect, the insulating layer between the impedance matching conductor and the center mounting plate is also located in the recess area to electrically isolate the impedance matching conductor from the center mounting plate. This isolation allows the electrical environment of the impedance matching conductor to remain stable, which can be important for consistent impedance matching. This can contribute to smooth high-frequency transmission and help reduce signal reflections, thus increasing the overall system efficiency. The insulating layer can also provide additional protection when transmitting high voltages, such as those that can occur in high-frequency applications. It can reduce the risk of high voltages arcing to the center mounting plate, thereby increasing operational reliability.The insulating layer can provide an additional physical barrier, protecting the impedance matching conductor from direct mechanical stresses through the recess. This can reduce the risk of abrasion or damage that could result from movement or vibration. The insulating layer can also help regulate heat conduction between the impedance matching conductor and the center mounting plate. This allows for more controlled heat dissipation and prevents overheating of the conductor while maintaining electrical insulation.

[0063] In one aspect, one, and preferably several, mounting plate(s) has a cooling channel for conveying a coolant. The cooling channels in the mounting plates enable direct and uniform dissipation of the heat generated during the operation of the RF components. The coolant efficiently carries away the heat, thus maintaining the assembly temperature at a constant level. The integrated cooling channels significantly reduce the risk of overheating throughout the assembly. Even at high power levels and during extended periods of operation, this allows the components to operate within a safe temperature range. The ability to actively dissipate heat enables the system to operate stably even under high loads and demanding operating conditions. Constant cooling ensures that performance is not compromised by thermal effects.When cooling channels are arranged in several or all mounting plates, heat can be dissipated evenly across the entire system. This can reduce the formation of hotspots and ensure a balanced temperature distribution, which helps to distribute the stress on the components more evenly. Constant cooling reduces the thermal stress on the electrical and mechanical components. This can extend the lifespan of the components, as thermal cycling and material fatigue may be less pronounced. When cooling channels are integrated directly into the mounting plates, the need for external cooling systems such as additional heat sinks or fans is eliminated. This can save space and simplify the design, especially for compact assemblies. With cooling channels in multiple plates, the cooling capacity can be tailored to specific requirements.The flow rate and temperature of the coolant can be variably adjusted to ensure targeted cooling depending on the heat generation.

[0064] In one aspect, one, or in particular several, preferably all mounting plate(s) are connected to a constant potential. This constant potential should preferably be ground. This enables a particularly low-radiation arrangement.

[0065] In one aspect, one, in particular several, and especially preferably all mounting plates are connected to ground. Connecting the mounting plates to ground can further enhance the electrical safety of the system. Potential leakage currents or electrical disturbances can be dissipated, which can reduce the risk of short circuits or uncontrolled voltages. In another aspect, one, in particular several, and especially preferably all mounting plates can be connected to a metallic housing. This enables a particularly low-radiation arrangement. The mounting plates, which are at a constant potential, can act as a shield, thereby reducing electromagnetic interference within the system. This can contribute to a more stable and interference-free transmission of the high-frequency signals. The connection to a constant potential ensures that the electrical potential of the plates remains uniform.This can create a stable electrical environment for the components and wiring in the RF power coupler, which can improve signal quality and help reduce reflections. When all mounting plates are at the same potential level, voltage differences between the plates can be reduced or eliminated. This can lower the risk of unwanted voltage flashovers or sparking that could cause damage.

[0066] In one aspect, coolant connections are provided for one, preferably several, and most preferably all mounting plates. This allows for efficient coolant supply and drainage. Using coolant connections directly on the mounting plates eliminates the need for additional external cooling devices. This saves space and simplifies the design of the entire RF power coupler. Targeted cooling of each plate prevents localized overheating. This contributes to a uniform temperature distribution throughout the assembly and prevents thermal stress points that could negatively impact component performance and lifespan.

[0067] In one aspect, an electrical power converter for an industrial process arrangement, preferably a plasma process arrangement, gas laser excitation, or heating arrangement, is disclosed. This electrical power converter comprises: a high-frequency power coupler as described in this disclosure, and several RF amplifier arrangements designed to be connected to the RF inputs of the RF power coupler.

[0068] In one aspect, the RF amplifier arrangements are connected to the RF inputs of the high-frequency power coupler.

[0069] The RF power coupler enables the aggregation of signals from multiple RF amplifier arrays and transmits them in a bundled manner to the industrial process array. This ensures efficient transmission of high-frequency energy, thereby increasing the overall system performance. The combination of RF power couplers and RF amplifier arrays can provide a clean and stable 2023P00582WG

[0070] 16

[0071] The RF signal is amplified. The power coupler helps ensure that the amplifiers operate efficiently and that the signal is transmitted to the industrial process setup without significant distortion. Integrating RF amplifier arrays and the coupler into a single system reduces the required footprint. This is particularly advantageous when the power converter needs to be integrated into compact control cabinets or space-constrained industrial plants. Close coupling between the RF amplifier arrays and the RF power coupler helps to minimize transmission losses. This allows for the utilization of more available energy, which can improve the overall system efficiency. Since multiple RF amplifier arrays can be connected to the RF power coupler's inputs, the system's power output can be flexibly adapted to the specific requirements of each application.This allows the power output to be increased or decreased depending on the process requirements. This design of an electrical power converter with an RF power coupler and multiple RF amplifier arrangements can offer a versatile and efficient solution for demanding high-frequency industrial applications, with advantages in adaptability, energy efficiency, and integration.

[0072] In one aspect, the electrical power converter features a control device that controls the RF amplifier arrangements, in particular their phase relationship to each other, so that the power in the coupling unit is essentially fully coupled at the star point. This improves efficiency.

[0073] The development is explained in more detail below with reference to the advantageous embodiments shown in the figures. However, the development is not limited to any one of these embodiments. The figures show:

[0074] Fig. 1: an oblique view of a high-frequency power coupler;

[0075] Fig. 2: an oblique view of a high-frequency power coupler with housing parts removed;

[0076] Fig. 3: a cross-sectional view through a high-frequency power coupler without a housing;

[0077] Fig. 4: an oblique view of a high-frequency power coupler with housing parts removed;

[0078] Fig. 5: a cross-sectional view through part of a high-frequency power coupler;

[0079] Fig. 6: a schematic representation of an industrial process arrangement;

[0080] Fig. 7 shows a schematic representation of a coupling unit.

[0081] Fig. 1: shows an oblique view of a high-frequency power coupler 1. This RF power coupler is designed to couple multiple RF input signals to a single RF output signal, for supplying RF power to an industrial process arrangement, 2023P00582WG

[0082] 17 preferably a plasma process arrangement, gas laser excitation or heating arrangement. This RF power coupler comprises: a. several RF inputs 11, 12, 13, 14, 15, here configured as RF coaxial connectors, which protrude from the housing 33, b. an RF output 7, here configured as a high-power RF connector, also in a coaxial configuration, c. a coupling unit 19, which here is arranged on a coupling unit circuit board 49, d. an impedance matching line 20, which extends from the coupling unit 19 to the RF output 7 and has a length designed to effect impedance matching from the output of the coupling unit to the RF output, e. an upper mounting plate 23, a middle mounting plate 25 and a lower mounting plate 27, wherein the middle mounting plate 25 is arranged between the upper and the lower mounting plate and f.wherein the impedance matching line 20 is arranged between the upper mounting plate 23 and the middle mounting plate 25 and between the lower mounting plate 27 and the middle mounting plate 25.

[0083] The meandering shape of the impedance matching line 20 is clearly visible here.

[0084] Also shown are several fastening elements 35, in particular screws, with which, for example, the mounting plates 23, 25, 27 are connected to the housing 33.

[0085] Also shown are insulating layers 29, which are arranged between impedance matching line 20 and the mounting plates 23, 25, 27.

[0086] Also shown is a temperature sensor 37, which is arranged on one of the insulating layers 29.

[0087] Also shown are several coolant channels 5, arranged in the upper mounting plate 23 and in the lower mounting plate 27 for the passage of coolant.

[0088] Also shown are two coolant connections 8 for supplying and discharging coolant. The coolant connections 8 are connected to the coolant channels 5.

[0089] Also shown is a control connection 36 for control and data lines, e.g. for the measured signal from the temperature sensor 37.

[0090] Also shown is a recess 31, which provides the middle mounting plate 25 for the routing of the impedance matching line 20. 2023P00582WG

[0091] 18

[0092] Also shown is a cylinder 32, which provides an electrical connection of the impedance matching line 20 between the two layers of the impedance matching line 20.

[0093] Also shown are shielding spring contacts 34. These can be used to improve the electromagnetic properties of the RF power coupler.

[0094] Not shown, but conceivable, is an arrangement in which the impedance matching line 20 is guided at the edge of the middle mounting plate 25.

[0095] Fig. 2: shows an oblique view of the high-frequency power coupler 1 from Fig. 1 with at least partially removed housing parts, and without the upper mounting plate 23, so that the impedance matching line 20 on the insulating layer 29 is more clearly visible.

[0096] In this and all subsequent figures, the same components have the same reference numbers.

[0097] Fig. 3 shows a cross-sectional view through the RF power coupler 1 from Fig. 1 or Fig. 2 with at least some housing parts removed and without the upper mounting plate 23, so that the impedance matching line 20 on the insulating layer 29 is more clearly visible. The section plane passes through the lower mounting plate 27, the middle mounting plate 25, the insulating layer 29, the recess 31, the cylinder 32, and the impedance matching line 20. This clarifies the path of the impedance matching line 20. In particular, the transition from the position between the upper and middle mounting plates 23, 25 to the position between the lower and middle mounting plates 25, 27 by means of the recess 31 and the cylinder 32 is clearly visible. The cylinder 32 is made of metal, specifically copper. It serves to connect the impedance matching line 20 between the two layers. It is arranged insulated from the mounting plate.This therefore features recess 31, the diameter of which is correspondingly larger.

[0098] Also visible here is the coolant channel 5, which connects the two coolant connections 8 and is located in the lower mounting plate 27. A coolant 6, e.g., water, can be carried in it to dissipate the heat that may be generated by the impedance matching line 20 during operation. A coolant channel 5 can, of course, also be located in the upper and / or middle mounting plates 23, 25. In the present case, such a coolant channel 5 is indeed also provided in the upper mounting plate 23. However, the upper mounting plate 23 is not shown in this figure for the sake of clarity. Fig. 4 shows an oblique view of the RF power coupler 1 from Figs. 1-3 with at least some of the housing parts removed. In contrast to Fig. 3, the upper mounting plate 23 is shown here. The components that are not normally visible, such as the impedance matching line 20, the coolant channel 5, or the cylinder 32, are shown with dashed lines.

[0099] Fig. 5 shows a cross-sectional view through a portion of the RF power coupler 1 from Figs. 1-4. The side view of the upper mounting plate 23, the middle mounting plate 25, and the lower mounting plate 27 is shown. Two insulating layers 29 are located between each of the mounting plates. The impedance matching line 20 is arranged between these insulating layers 29, thus running in two layers. The RF inputs H, 12, 13, 14, and 15 are located on the same side of the housing 36 as the RF output 7. The impedance matching line 20 runs in a meandering pattern from the connection side of the housing to the opposite side, then changes position via the recess 31 and the cylinder 32, and in the second position also meanders back to the connection side of the housing 36. This design optimizes space utilization. The impedance matching line 20 runs on both sides of the middle mounting plate 25.

[0100] It is further shown here how the insulating layer 29 is also arranged in the area of ​​the recess 31 between the impedance matching line 20 and the middle mounting plate 25, for electrical insulation of the impedance matching line 20 from the middle mounting plate 25.

[0101] Fig. 6 shows a schematic representation of an industrial process arrangement 100. The industrial process arrangement 100 includes an electrical power converter 4 as part of the industrial process arrangement 100. This is a gas laser excitation with an impedance matching device 64 connected to the power converter 4. The electrical power converter 4 includes: a. A high-frequency power coupler 1, as described in this disclosure, b. Several RF amplifier arrangements 62, each connected to one of the RF inputs 11, 12, 13, 14, 15 of the RF power coupler 1.

[0102] The RF output 7 of the RF power coupler 1 is connected to the gas laser excitation arrangement 63 via a high-power interconnect 74. The high-power interconnect 74 is preferably a coaxial interconnect. These are manufactured with fixed impedances, preferably 50 Ω. For this reason, among others, the preferred output impedance of the high-frequency 2023P00582WG

[0103] 20

[0104] Power coupler 1 is also set to 50 Ω. The RF power supplied by power converter 4 is routed to an impedance matching device 64. This device typically has several reactances, such as inductance(s) or capacitance(s). These can each be partially or fully variable, i.e., adjustable, to match the input impedance of the load to the output impedance of RF power coupler 1.

[0105] The gas laser excitation arrangement 63 has several discharge tubes 69 in which a plasma is generated using RF power. Upon recombination of the charged components of this plasma, the laser beam is produced by selecting a suitable gas, pressure, and mirror arrangement. This laser beam is then emitted at the laser outlet 68. Such a laser can be used in an EUV system. To generate and maintain the plasma in the discharge tubes 69, RF power is supplied to these tubes via electrodes. The RF power is transmitted from the impedance matching device 64 via a first connecting line 66, in particular an RF signal connecting line, to a first electrode arrangement 67, in particular an RF signal electrode arrangement.

[0106] The first connecting line 66 can have a first matching inductance 65, in particular an RF signal matching inductance, which can act as part of the impedance matching.

[0107] Opposite the first electrode arrangement 67, a second electrode arrangement 73, in particular a ground-side electrode arrangement, is arranged. This is connected to a ground terminal 72 via a second connecting line 70, in particular a ground-side connecting line. The second connecting line 70 can have an impedance matching inductance 71, in particular a ground-side impedance matching inductance, which can act as part of the impedance matching.

[0108] Between the first electrode arrangement 67 and the second electrode arrangement 73, an electric RF field can build up during operation, which is used for plasma excitation.

[0109] The housing 33 of the RF power coupler 1 is connected to a ground terminal 72.

[0110] The housing of the gas laser excitation arrangement 63 is connected to a ground connection 72.

[0111] Fig. 7 shows a schematic representation of a coupling unit 19. The coupling unit 19 includes a coupling unit circuit board 49 on which the RF inputs 11, 12, 13, 14, 15 are arranged. These can be connected to the coupling unit circuit board 49 as coaxial connectors. 2023P00582WG

[0112] 21 soldered. The coaxial connectors are shown in Figures 1 to 4. They protrude from the housing 33.

[0113] The control connection 36 can also be located on the coupling unit circuit board 49. This is also shown in Figures 1 to 4. It also protrudes from the housing 33.

[0114] The RF inputs 11, 12, 13, 14, 15 are each connected to a star point 10 via connecting lines 41, 42, 43, 44, 45. The star point 10 is connected to the first endpoint of the impedance matching line 20 in the RF power coupler 1. The second endpoint of the impedance matching line 20 is connected to the RF output 7, as also shown in Figures 1 to 4.

[0115] The connecting lines 41, 42, 43, 44, 45 can each be interrupted by RF switching units 51, 52, 53, 53, 55. These RF switching units 51, 52, 53, 53, 55 can be configured, for example, as RF relays. Semiconductor-based switching units, such as PIN diodes or transistors, are also conceivable. These RF switching units 51, 52, 53, 53, 55 can be used to disconnect individual connections during operation. This can be helpful, for example, if one of the amplifier assemblies 62 needs to be replaced while the other amplifier assemblies 62 remain in operation. In semiconductor manufacturing, for example, in plasma generation for semiconductor processes or in EUV lithography, this can offer a significant advantage. The RF switching units 51, 52, 53, 55 can be controlled via signal paths connected to the control terminal 36. This can be done in particular via the coupling unit circuit board 49. This is shown in Fig.Figure 7 shows an example of the RF switching unit 51, 52.

[0116] The features disclosed in the foregoing description, claims and drawings may be important, both individually and in combination, for the realization of the invention in its various embodiments.

Claims

22 Claims 1. High-frequency power coupler (1) for coupling multiple RF input signals to a single RF output signal, for supplying RF power to an industrial process arrangement (100), preferably a plasma process arrangement, gas laser excitation, or heating arrangement, wherein the RF power coupler comprises: a. multiple RF inputs (11, 12, 13, 14, 15), b. an RF output (7), c. a coupling unit (19), d. an impedance matching line (20) extending from the coupling unit (19) to the RF output (7) and having a length designed to effect impedance matching from the output of the coupling unit to the RF output, e. an upper mounting plate (23), a middle mounting plate (25), and a lower mounting plate (27), wherein the middle mounting plate (25) is arranged between the upper and lower mounting plates, and f.wherein the impedance matching line (20) is arranged between the upper and middle mounting plates and between the lower and middle mounting plates.

2. High-frequency power coupler according to claim 1, wherein at least one of the mounting plates (23, 25, 27) is designed as a cooling plate with a coolant channel (5) for passing a coolant through it.

3. High-frequency power coupler according to one of the preceding claims, wherein the middle mounting plate (25) is designed as a cooling plate with a coolant channel (5) for passing a coolant through it.

4. High-frequency power coupler according to one of the preceding claims, wherein the upper mounting plate (23) and the lower mounting plate (27) are each designed as a cooling plate with a coolant channel (5) for passing a coolant through it.

5. High-frequency power coupler according to one of the preceding claims, wherein an insulating layer (29) is provided between the impedance matching line (20) and one of the mounting plates (23, 25, 27), in particular several mounting plates (23, 25, 27), preferably all mounting plates (23, 25, 27).

6. High-frequency power coupler according to one of the preceding claims, wherein the impedance matching line (20) has a length of Ä / 4.

7. High-frequency power coupler according to any of the preceding claims, wherein the insulating layer (29) is made of PTFE or ceramic.

8. High-frequency power coupler according to one of the preceding claims, wherein the impedance matching line (20) is made of metal, in particular copper or aluminium.

9. High-frequency power coupler according to one of the preceding claims, wherein the impedance matching line (20) is designed in a meandering shape.

10. High-frequency power coupler according to one of the preceding claims, wherein the mounting plates (23, 25, 27) are arranged parallel to each other and the impedance matching line (20) touches both sides of the insulating layer (29) in order to cool it.

11. High-frequency power coupler according to one of the preceding claims, wherein the middle mounting plate (25) has a recess (31) for the passage of the impedance matching line (20).

12. High-frequency power coupler according to one of the preceding claims, wherein the impedance matching line (20) is guided at the edge of the middle mounting plate (25).

13. High-frequency power coupler according to one of the preceding claims, wherein the insulating layer (29) between impedance matching line (20) and middle mounting plate (25) is also arranged in the area of ​​the recess (31) for electrical isolation of the impedance matching line (20) from the middle mounting plate (25).

14. High-frequency power coupler according to one of the preceding claims, wherein one, in particular several, particularly preferably all mounting plate(s) (23, 25, 27) are connected to a constant potential, preferably to ground.

15. High-frequency power coupler according to one of the preceding claims, wherein one, in particular several, particularly preferably all mounting plate(s) (23, 25, 27) are connectable to a metallic housing (37).

16. High-frequency power coupler according to one of the preceding claims, wherein coolant connections (39) are provided for one, in particular several, particularly preferably all mounting plate(s) (23, 25, 27).

17. Electrical power converter (4) for an industrial process arrangement (100), preferably a plasma process arrangement, gas laser excitation or heating arrangement, comprising: a. A high-frequency power coupler (1) according to one of the preceding claims, b. Several RF amplifier arrangements (62) designed to be connected to the RF inputs (11, 12, 13, 14, 15) of the high-frequency power coupler (1).

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