Electronic device comprising frame, and method for manufacturing frame

Abstract

According to various embodiments of the present disclosure, provided is a frame of an electronic device, and the frame comprises: a first metal portion which at least partially forms the side surface of the electronic device; a second metal portion located in the electronic device; a conductive adhesive member which is provided between the first metal portion and the second metal portion; a first non-metal member which is located in the electronic device and is bonded to the conductive adhesive member, the first metal portion, and the second metal portion; and a second non-metal member which is at least partially located in the electronic device and is bonded to the first non-metal member, the first metal portion, and the second metal portion, wherein the bonding surface between the conductive adhesive member and the first non-metal member has a concavo-convex portion.

Description

Electronic device including a frame and method of manufacturing the frame

[0001] The present disclosure relates to an electronic device including a frame and a method for manufacturing the frame.

[0002] The frame of the electronic device may include heterogeneous metal parts joined together through an adhesive material.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] During the manufacturing process of the frame, the adhesive material may be damaged or contaminated by impact (e.g., cutting impact) or heat that may occur during at least one process, such as external shape processing, making it difficult to secure bonding strength between dissimilar metal parts using only the adhesive material.

[0005] Various embodiments of the present disclosure provide an electronic device including a frame capable of improving bonding strength between dissimilar metal parts and a method for manufacturing the frame.

[0006] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be understood by those skilled in the art from the description below.

[0007] According to various embodiments of the present disclosure, a frame of an electronic device is provided, the frame comprising a first metal part, a second metal part, a conductive adhesive member, a first non-metal member, and a second non-metal member. The first metal part forms at least a portion of the side of the electronic device. The second metal part is located inside the electronic device. A conductive adhesive member is disposed between the first metal part and the second metal part. The first non-metal member is located inside the electronic device and is bonded to the conductive adhesive member, the first metal part, and the second metal part. The second non-metal member is located inside the electronic device and is bonded to the first non-metal member, the first metal part, and the second metal part. The bonding surface between the conductive adhesive member and the first non-metal member includes irregularities.

[0008] According to various embodiments of the present disclosure, a method for manufacturing a frame is provided, the method of manufacturing including the action of forming a first base material and a second base material. The method of manufacturing a frame includes the action of joining the first base material and the second base material through a conductive adhesive member and forming a first uneven adhesive surface for a first molding on the conductive adhesive member. The method of manufacturing a frame includes the action of forming a first molding portion that is joined to the first base material, the second base material, and the conductive adhesive member through a first molding and includes a second uneven adhesive surface for a second molding. The method of manufacturing a frame includes the action of forming a third uneven adhesive surface for a second molding on the first base material and forming a fourth uneven adhesive surface for a second molding on the second base material. The method of manufacturing a frame includes the action of forming a second molding portion joined to the first base material, the second base material, and the first molding portion through a second molding.

[0009] An electronic device including a frame and a method for manufacturing a frame according to embodiments of the present disclosure can reduce bonding problems between dissimilar metal parts and improve bonding strength between dissimilar metal parts.

[0010] In addition, effects that can be obtained or predicted by various embodiments of the present disclosure will be disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0011] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken together with the accompanying drawings.

[0012] FIG. 1 is a drawing showing various aspects of an electronic device according to various embodiments of the present disclosure.

[0013] FIG. 2 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0014] FIG. 3 is a drawing showing a frame according to various embodiments of the present disclosure.

[0015] FIG. 4 is a cross-sectional view of a portion of a frame cut along line A-A' of FIG. 3 according to various embodiments of the present disclosure.

[0016] FIG. 5 is a cross-sectional view of a portion of a frame cut along line B-B' of FIG. 3 according to various embodiments of the present disclosure.

[0017] FIG. 6 is a cross-sectional view of a portion of a frame cut along line C-C' of FIG. 3 according to various embodiments of the present disclosure.

[0018] FIG. 7 is a cross-sectional perspective view of a portion of a frame cut along line C-C' of FIG. 3 according to various embodiments of the present disclosure.

[0019] FIG. 8 is a cross-sectional view showing two members joined together according to various embodiments of the present disclosure.

[0020] FIG. 9 is a cross-sectional view of a portion of a frame cut along line B-B' of FIG. 3 and a portion of a conductive adhesive member according to various embodiments of the present disclosure.

[0021] FIG. 10 is a cross-sectional view of a portion of a frame cut along line B-B' of FIG. 3 and a portion of a conductive adhesive member according to various embodiments of the present disclosure.

[0022] FIG. 11 is a cross-sectional view of a portion of a frame cut along line B-B' of FIG. 3 and a portion of a conductive adhesive member according to various embodiments of the present disclosure.

[0023] FIG. 12 shows a flowchart of a method for manufacturing a frame according to various embodiments of the present disclosure.

[0024] FIGS. 13, 14a, 14b, 14c, 15a, 15b, 16a, 16b, 17, 18a, 18b, and 19 are drawings for explaining each process of the flowchart of FIG. 11 according to various embodiments of the present disclosure.

[0025] Hereinafter, various embodiments of the present disclosure are described in more detail with reference to the accompanying drawings.

[0026] The following description is provided to facilitate a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents, with reference to the attached drawings. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of known functions and configurations may be omitted for the sake of clarity and brevity.

[0027] The terms and words used in the following description and claims are not limited to their bibliographic meanings and are used merely to enable the inventor to understand the present disclosure clearly and consistently. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0028] The various embodiments of the present disclosure and the terms used therein are not limited to the specific embodiments of the technical features described in the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a corresponding component from other corresponding components and do not limit the corresponding components in any other aspect (e.g., importance or order). Where one element (e.g., a first component) is referred to as "coupled" or "connected" to another element (e.g., a second component), with or without the term "functionally," it means that the said component may be connected to the said other component directly or through a third component.

[0029] Each of the components described above (e.g., modules or programs) may include a single or multiple entities. One or more of the aforementioned components may be omitted, or one or more other components may be added. Generally or additionally, multiple components (e.g., modules) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to integration.

[0030] In the present disclosure, where the term “substantially” is used to define a structural part (structure or structural element), an expression including the term “substantially” is understood or interpreted as a technical feature produced within the technical tolerance of the method used to manufacture it.

[0031] In this disclosure, the expression “comprising” means that a specific effect or result can be obtained within a specific tolerance, and that a person skilled in the art knows how to obtain such tolerance. It should be understood that terms such as “comprising” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this disclosure, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0032] In the present disclosure, the term “and / or” may be understood to include all of one or more combinations that the associated components may define.

[0033] In the drawings of the present disclosure, the thickness, proportion, and / or dimensions of the components are for the purpose of effectively illustrating the technical content and are not limited to the thickness, proportion, and / or dimensions depicted.

[0034] In the drawings of the present disclosure, at least one structural component may be depicted transparently or translucently to aid in understanding the structural relationships between the components.

[0035] In the present disclosure, "placed on XX" may be understood as being placed adjacent to or in substantial contact with XX, coupled to XX, or included in XX.

[0036] In the present disclosure, "located on XX" may be understood as being located adjacent to or in substantial contact with XX, coupled to XX, or included in XX.

[0037] In this disclosure, terms such as "above," "upper," "upper," "lower," "lower," or "lower" may be used to describe the relationships between components illustrated in the drawings. These terms are relative concepts and may be described based on the directions indicated in the drawings.

[0038] In the present disclosure, where a first component (or region, layer, part, etc.) is described as being "on," "connected," or "joined" to a second component, it may be understood that it may be directly placed, connected, or joined to the second component, or that a third component may be placed between them.

[0039] In the present disclosure, “ZZ between XX and YY” may be understood as ZZ being positioned in substantial contact with XX or YY or ZZ being directly coupled to XX or YY. “ZZ between XX and YY” may be understood as ZZ being positioned between XX and YY with at least one other component between XX and ZZ and / or at least one component between YY and ZZ in between. “ZZ between XX and YY” may be understood as at least one other component between XX and ZZ connecting XX and ZZ and / or at least one other component between YY and ZZ connecting YY and ZZ.

[0040] In this disclosure, unless otherwise noted, "conductivity" may be understood as "electrical conductivity" and "nonconductivity" may be understood as "electrical insulation." In context, or where thermal properties are mentioned, "conductivity" may be understood as "thermal conductivity."

[0041] The "comparative examples" mentioned in this disclosure are provided merely for comparison with the embodiments of this disclosure and do not constitute prior art to the various embodiments of this disclosure.

[0042] FIG. 1 is a drawing showing various aspects of an electronic device (1) according to various embodiments of the present disclosure.

[0043] It may be understood in this disclosure that all combinations of features and / or embodiments disclosed in connection with FIG. 1 are conceived and included. All combinations of features described below in connection with FIG. 1 may be considered to be included in this disclosure as specific examples.

[0044] Referring to FIG. 1, an electronic device (1) may include a housing (10) that provides (or forms) at least a portion of the exterior of the electronic device (1). The housing (10) may provide (or form), for example, a front (10A) of the electronic device (1), a rear (10B) of the electronic device (1), and a side (10C) of the electronic device (1). In various embodiments, the housing (10) may refer to a structure (or structure) that provides at least a portion of the front (10A), the rear (10B), and the side (10C).

[0045] According to various embodiments, the housing (10) may include a front plate (also called a front cover, a first cover, or a first plate) (11), a rear plate (also called a rear cover, a second cover, or a second plate) (12), and / or a side portion (also called a side structure, a side bezel, a side bezel structure, a side wall portion, a side structure, or a side) (13).

[0046] According to various embodiments, the front plate (11) may provide (or form) at least a portion of the front (10A) of the electronic device (1). The front plate (11) may be substantially transparent in at least a portion. The front plate (11) may include, for example, a glass plate or a polymer plate containing various coating layers. The direction in which the front (10A) of the electronic device (1) faces is defined as the positive direction of the z-coordinate axis. "When viewed from above the front (10A) of the electronic device (1)" may be understood as the same as "when viewed from a direction orthogonal to the front (10A) of the electronic device (1)," "when viewed from above the front plate (11)," or "when viewed from a direction orthogonal to the front plate (11)."

[0047] According to various embodiments, the rear plate (12) may provide (or form) at least a portion of the rear (10B) of the electronic device (1). The rear plate (12) may be substantially opaque. The rear plate (12) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials. The direction in which the rear (10B) of the electronic device (1) faces is defined by the negative direction of the z-axis. "When viewed from above the rear (10B) of the electronic device (1)" may be understood as the same as "when viewed in a direction orthogonal to the rear (10B) of the electronic device (1)," "when viewed from above the rear plate (12)," or "when viewed in a direction orthogonal to the rear plate (12)."

[0048] According to various embodiments, the side portion (13) may surround at least part of the space between the front plate (11) and the rear plate (12). The side portion (13) may provide (or form) at least part of the side (10C) of the electronic device (1). The side portion (13) may include a metallic material and / or a non-metallic material (e.g., a polymer).

[0049] According to various embodiments, the side portion (13) may include a first side portion (also called a first side wall, first side wall portion, or first side) (131), a second side portion (also called a second side wall, second side wall portion, or second side) (132), a third side portion (also called a third side wall, third side wall portion, or third side) (133), and / or a fourth side portion (also called a fourth side wall, fourth side wall portion, or fourth side) (134). When viewed from above on the front (10A) or rear (10B) of the electronic device (10), the first side portion (131) and the third side portion (133) may extend in a direction parallel to the x-axis, and the second side portion (132) and the fourth side portion (134) may extend in a direction parallel to the y-axis. The first side portion (131) may be spaced apart from the third side portion (133) in the positive direction of the y-axis and may be substantially parallel to the third side portion (133). The first side portion (131) may provide (or form) a first side corresponding to the positive direction of the y-axis among the sides (10C) of the electronic device (1). The third side portion (133) may provide (or form) a third side corresponding to the negative direction of the y-axis among the sides (10C) of the electronic device (1). The second The side portion (132) may connect or extend one end of the first side portion (131) and one end of the third side portion (133). The fourth side portion (134) may connect or extend the other end of the first side portion (131) and the other end of the third side portion (133). When viewed from above on the front (10A) or rear (10B) of the electronic device (1), the second side portion (132) may be spaced apart from the fourth side portion (134) in the positive direction of the x-axis and may be substantially parallel to the fourth side portion (134). The second side portion (132) may provide (or form) a second side corresponding to the positive direction of the x-axis among the sides (10C) of the electronic device (1).The fourth side portion (134) can provide (or form) a fourth side corresponding to the negative direction of the x-axis among the sides (10C) of the electronic device (1).

[0050] According to various embodiments, the side portion (13) may include a first metal portion (also referred to as side metal, outer metal, side metal portion, outer metal portion, side metal structure, outer metal structure, side conductive structure, or outer metal structure) (31). The first metal portion (31) may include, for example, a first metal portion (311), a second metal portion (312), a third metal portion (313), a fourth metal portion (314), a fifth metal portion (315), and / or a sixth metal portion (316). When viewed from above on the front (10A) of the electronic device (10), the first through sixth metal portions (311, 312, 313, 314, 315, 316) may be arranged along the edge of the front plate (11). The first metal part (31) comprises a first segment (e.g., a first gap) between the first metal part (311) and the second metal part (312), a second segment (e.g., a second gap) between the second metal part (312) and the third metal part (313), a third segment (e.g., a third gap) between the third metal part (313) and the fourth metal part (314), a fourth segment (e.g., a fourth gap) between the fourth metal part (314) and the fifth metal part (315), a fifth segment (e.g., a fifth gap) between the fifth metal part (315) and the sixth metal part (316), and a sixth segment (e.g., a sixth It may include a gap. The side portion (13) may include a first nonmetallic portion (also called a side nonmetal, outer nonmetal, side nonmetallic portion, outer nonmetallic portion, side nonmetallic structure, outer nonmetallic structure, side nonconductive structure, or outer nonmetallic structure) (33).The first non-metallic part (33) may include a first non-metallic part (331) located in the first segment, a second non-metallic part (332) located in the second segment, a third non-metallic part (333) located in the third segment, a fourth non-metallic part (334) located in the fourth segment, a fifth non-metallic part (335) located in the fifth segment, and a sixth non-metallic part (336) located in the sixth segment. The first metallic part (311) and the second metallic part (312) may be physically separated from each other with the first non-metallic part (331) in between. The second metallic part (312) and the third metallic part (313) may be physically separated from each other with the second non-metallic part (332) in between. The third metal part (313) and the fourth metal part (314) can be physically separated from each other with the third non-metal part (333) in between. The fourth metal part (314) and the fifth metal part (315) can be physically separated from each other with the fourth non-metal part (334) in between. The fifth metal part (315) and the sixth metal part (316) can be physically separated from each other with the fifth non-metal part (335) in between. The first metal part (311) and the sixth metal part (316) can be physically separated from each other with the sixth non-metal part (336) in between. The side (10C) of the electronic device (1) may include surface regions provided (or formed) by the first to sixth portions of the metal part (311, 312, 313, 314, 315, 316) of the first metal part (31), and surface regions provided (or formed) by the first to sixth portions of the non-metal part (33) of the first non-metal part (33).The surface areas provided by the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) and the surface areas provided by the first to sixth partial non-metal parts (331, 332, 333, 334, 335, 336) can be arranged smoothly. The location, shape, or number of the partial metal parts and partial non-metal parts included in the side part (13) are not limited to the illustrated example.

[0051] According to various embodiments, the electronic device (1) may include a display module (also called a display) (201). The display module (201) is located inside the electronic device (1), and the display area (also called an active area or screen area) of the display module (201) may be visually exposed (or visible) through the front plate (11).

[0052] According to various embodiments, the electronic device (1) may include one or more camera modules. For example, the electronic device (1) may include a first camera module (202), a second camera module (203), and / or a third camera module (203) as at least one rear camera module corresponding to the rear (10B) of the electronic device (1), but is not limited thereto. For example, the electronic device (1) may include a fourth camera module (204) as a front camera module corresponding to the front (10A) of the electronic device (1), but is not limited thereto.

[0053] According to various embodiments, the fourth camera module (205) may be positioned in alignment with an opening provided in the display area of ​​the display module (201) or at least partially inserted into the opening. External light may pass through the front plate (11) and the opening in the display area to reach the fourth camera module (205).

[0054] According to various embodiments, the fourth camera module (205) may be positioned on the back surface of the display area of ​​the display module (201) or below or beneath the display area. When viewed from outside the electronic device (1), the fourth camera module (205), or the location of the fourth camera module (205), may not be substantially visually distinguishable (or exposed). External light may pass through the front plate (11) and the display area to reach the fourth camera module (205). In various embodiments, the fourth camera module (205) may be positioned aligned with a recess (not separately shown) provided on the back surface of the display area, or at least partially inserted into the recess.

[0055] According to various embodiments, the electronic device (1) may include one or more light-emitting modules. For example, the electronic device (1) may include a front light-emitting module corresponding to the front (10A) of the electronic device (1). The front light-emitting module may be configured to visually provide status information of the electronic device (1). The front light-emitting module may provide a light source linked to the operation of the fourth camera module (205). For example, the electronic device (1) may include a rear light-emitting module (206) corresponding to the rear (10B) of the electronic device (1). The rear light-emitting module (206) may provide a light source linked to the operation of the first camera module (202), the second camera module (203), and / or the third camera module (204). The front light-emitting module and / or the rear light-emitting module may include, for example, a light-emitting diode (LED), an IR LED, or a xenon lamp, but are not limited thereto.

[0056] According to various embodiments, the electronic device (1) may include one or more sensor modules. For example, the electronic device (1) may include a sensor module (207) including an optical sensor (e.g., a proximity sensor or an illuminance sensor) located inside the electronic device (1) corresponding to the front (10A) of the electronic device (1). In various embodiments, the sensor module (207) may be located behind or beneath the display area of ​​the display module (201). When viewed from the outside of the electronic device (1), the sensor module (207), or the location of the sensor module (207), may not be substantially visually distinguishable (or exposed). External light may pass through the front plate (11) and the display area to reach the sensor module (207). In various embodiments, the sensor module (207) may be positioned aligned with a recess (not separately shown) provided on the back of the display area or at least partially inserted into the recess.

[0057] According to various embodiments, the sensor module (207) may be positioned in alignment with an opening provided in the display area of ​​the display module (201) or at least partially inserted into the opening. External light may pass through the front plate (11) and the opening in the display area to reach the sensor module (207). The opening in the display area aligned with or overlapping the sensor module (207) may be provided in the form of a hole. In various embodiments, when viewed from above on the front (10A) of the electronic device (1), the opening in the display area aligned with or overlapping the sensor module (207) may be provided as a notch (not separately shown).

[0058] According to various embodiments, the electronic device (1) may include one or more acoustic input modules. For example, the electronic device (1) may include a first acoustic input module including a first microphone (also referred to as the first microphone) located inside the electronic device (1) corresponding to a first microphone hole (208) of a third side portion (133). For example, the electronic device (1) may include a second acoustic input module including a second microphone (also referred to as the second microphone) located inside the electronic device (1) corresponding to a second microphone hole (209) of a first side portion (131).

[0059] According to various embodiments, the electronic device (1) may include one or more sound output modules. For example, the electronic device (1) may include a first sound output module including a first speaker located inside the electronic device (1) corresponding to a first speaker hole (210) of a third side portion (133). The electronic device (1) may be configured to play multimedia or recording data through the first speaker. For example, the electronic device (1) may include a second sound output module including a second speaker located inside the electronic device (1) corresponding to a second speaker hole (211) provided in the front plate (11) or the first side portion (131) between the front plate (11) and the first side portion (131). The second speaker may be a call receiver used for calls.

[0060] According to various embodiments, the electronic device (1) may include one or more key input modules. A key input module included in the electronic device (1) may include, for example, a first key (also called a first side key) (212) located in a first key hole (e.g., the first key hole (701) in FIG. 6 and 7) of a first side portion (131), a second key (also called a second side key) (213) located in a second key hole of the first side portion (131), and a key signal generator configured to generate a key signal in response to a press or touch on the first key and / or the second key.

[0061] According to various embodiments, the electronic device (1) may include one or more connection terminals. For example, the electronic device (1) may include a first connection terminal (e.g., a first connector) (214) located inside the electronic device (1) corresponding to a first connection terminal hole (e.g., a first connector hole) of the third side portion (133). The electronic device (1) may receive power and / or data from an external electronic device or transmit to an external electronic device through the first connection terminal (214). The first connection terminal (214) may include, for example, a USB (universal serial bus) connector or an HDMI (high-definition multimedia interface) connector. For example, the electronic device (1) may include a second connection terminal (e.g., a second connector) located inside the electronic device (1) corresponding to a second connection terminal hole (e.g., a second connector hole) of the third side portion (133). The cover member (215) may be positioned in the second connection terminal hole to cover the second connection terminal. An external storage medium, such as a SIM (subscriber identity module) card (or USIM (universal SIM) card) or a memory card (e.g., an SD (secure digital memory) card), may be connected to the second connection terminal.

[0062] FIG. 2 is an exploded perspective view of an electronic device (1) according to various embodiments of the present disclosure.

[0063] FIG. 3 is a drawing showing a frame (14) according to various embodiments of the present disclosure.

[0064] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 2 and 3 is conceived and included. Any combination of features described below in connection with FIGS. 2 and 3 may be considered to be included in this disclosure as specific examples.

[0065] Referring to FIGS. 2 and 3, the electronic device (1) may include a front plate (11), a rear plate (12), a frame (14), a second support (23), a third support (24), a display module (201), a first printed circuit board (PCB) (25), a second PCB (26), and / or a battery (27). Descriptions of some components identical to those in the preceding embodiment may not be repeated.

[0066] According to various embodiments, a frame (also referred to as a frame structure or framework) (14) may be a structural element that supports a plurality of electrical components and / or one or more supports. The frame (14) may include a side portion (13) and a first support portion (also referred to as a first support member, first support member, first support structure, support plate, or bracket) (22). The first support portion (22) may be located at least partially between the front plate (11) and the rear plate (12). The first support portion (22) may be connected to the side portion (13) or extend from the side portion (13). The first support portion (22) may include a metallic material and / or a non-metallic material (e.g., a polymer).

[0067] According to various embodiments, the first support member (22) may include a first support surface (22A) facing the front plate (11) and a second support surface (22B) facing the rear plate (12) and provided on the opposite side from the first support surface (22A). The first support surface (22A) may provide a front mounting portion for stably placing or supporting one or more components (e.g., front plate (11) and display module (201)). The front mounting portion may be provided as a combination of surface areas of different heights. The second support surface (22B) may provide a rear mounting portion for stably placing or supporting one or more components (e.g., rear plate (12), first PCB (25), second PCB (26), and battery (27)). The rear mounting portion may be provided as a combination of surface areas of different heights.

[0068] According to various embodiments, the electronic device (1) may include a first space between the first support surface (22A) of the first support member (22) and the front plate (11) (e.g., the first space (2201) of FIG. 4, 5, and 6), and a second space between the second support surface (22B) of the first support member (22) and the rear plate (12) (e.g., the second space (2202) of FIG. 4, 5, and 6). A component such as a display module (201) may be at least partially supported by the first support surface (22A) in the first space or disposed on the first support surface (22A). Components such as the first camera module (202) (see FIG. 1), the second camera module (203) (see FIG. 1), the third camera module (204) (see FIG. 1), the second support member (23), the third support member (24), the first PCB (25), the second PCB (26), and the battery (27) may be at least partially supported by the second support surface (22B) in the second space or placed on the second support surface (22B).

[0069] According to various embodiments, the first support member (22) may include a second metal part (also referred to as inner metal, inner metal part, inner metal structure, or inner conductive structure) (32) and a second non-metal part (also referred to as inner non-metal, inner non-metal part, inner non-metal structure, or inner non-conductive structure) (34) connected to the second metal part (32). In various embodiments, the first support surface (22A) and / or the second support surface (22B) of the first support member (22) may be provided (or formed) by a combination of the second metal part (32) and the second non-metal part (34).

[0070] According to various embodiments, the first metal part (31) of the side part (13) and the second metal part (32) of the first support part (22) can be connected.

[0071] According to various embodiments, the first metal material included in the first metal part (31) of the side part (13) may be different from the second metal material included in the second metal part (32) of the first support part (22).

[0072] According to various embodiments, the first metal material included in the first metal part (31) of the side part (13) may be the same as the second metal material included in the second metal part (32) of the first support part (22).

[0073] According to various embodiments, the first non-metallic part (33) of the side part (13) and the second non-metallic part (34) of the first support part (22) can be connected.

[0074] According to various embodiments, the first non-metallic material included in the first non-metallic part (33) of the side part (13) may be the same as the second metallic material included in the second non-metallic part (34) of the first support part (22).

[0075] According to various embodiments, the first non-metallic material included in the first non-metallic part (33) of the side part (13) may be different from the second metallic material included in the second non-metallic part (34) of the first support part (22).

[0076] According to various embodiments, the first support member (22) can be understood as part of the housing (10).

[0077] According to various embodiments, electronic components such as a display (201), a first PCB (25), a second PCB (26), or a battery (27), or various components related to electronic components may be placed on a frame (14) or a first support (22), or supported by a frame (14) or a first support (22).

[0078] According to various embodiments, the display module (201) may be positioned between the front plate (11) and the first support (22). The display module (201) may be placed (or coupled) to the front plate (11) and / or the first support (22). In various embodiments, the display module (201) may be coupled to the front plate (11) through an optically clear adhesive member (or optically clear adhesive material) such as OCA (optical clear adhesive), OCR (optical clear resin), or SVR (super view resin).

[0079] According to various embodiments, the first PCB (25) and the second PCB (26) may be positioned between the rear plate (12) and the first support (22). The first PCB (25) and the second PCB (26) may be placed or coupled to the first support (22).

[0080] According to various embodiments, a plurality of electronic components may be electrically connected to the first PCB (25). Some of the plurality of electronic components may be placed on the first PCB (25). Other of the plurality of electronic components may be electrically connected to the first PCB (25) through an electrical path such as a flexible printed circuit board (FPCB) or a cable. The plurality of electronic components may include, for example, a display module (201), a second microphone corresponding to a second microphone hole (209) (see FIG. 1), a first camera module (202), a second camera module (203), a third camera module (204), a fourth camera module (205), a rear light-emitting module (206) (see FIG. 1), a sensor module (207) (see FIG. 1), and / or a key input module including a first key (212) and a second key.

[0081] According to various embodiments, a plurality of electronic components may be electrically connected to the second PCB (26). Some of the plurality of electronic components may be placed on the second PCB (26). Other of the plurality of electronic components may be electrically connected to the second PCB (26) through an electrical path such as an FPCB or a cable. The plurality of electronic components may include, for example, a first microphone corresponding to a first microphone hole (208), a first speaker corresponding to a first speaker hole (210), a first connection terminal (214), or a second connection terminal corresponding to a cover member (215).

[0082] According to various embodiments, the first PCB (25) and the second PCB (26) may be electrically connected through an electrical path such as an FPCB.

[0083] According to various embodiments, the battery (27) may be positioned between the rear plate (12) and the first support (22). The battery (27) may be placed or coupled to the first support (22). The battery (27) is a device for supplying power to at least one component of the electronic device (1) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0084] According to various embodiments, the first PCB (25) and the second PCB (26) may be spaced apart from each other at least partially with the battery (27) in between when viewed from above the rear plate (12). When viewed from above the rear plate (12), the first PCB (25) may be located at least partially between the first side portion (131) and the battery (27). When viewed from above the rear plate (12), the second PCB (26) may be located at least partially between the third side portion (133) and the battery (27).

[0085] According to various embodiments, when viewed from above the rear plate (12), the first PCB (25) may further include a protrusion (not separately shown) extending between the second side portion (132) and the battery (27), or between the fourth side portion (134) and the battery (27). The protrusion may be electrically connected to the second PCB (26) through an electrical path such as an FPCB.

[0086] According to various embodiments, an integrated or single PCB (not otherwise shown) replacing the first PCB (25) and the second PCB (26) may be provided (or formed). The integrated or single PCB may include, for example, a first substrate portion located between the first side portion (131) and the battery (27) when viewed from above the rear plate (12), a second substrate portion located between the third side portion (133) and the battery (27), and a third substrate portion connecting the first substrate portion and the second substrate portion. The third substrate portion may be located between the second side portion (132) and the battery (27) or between the fourth side portion (134) and the battery (27) when viewed from above the rear plate (12). The third portion may be implemented substantially rigidly or flexibly.

[0087] According to various embodiments, the second metal part (32) of the first support (22) may be electrically connected to a first ground area (not separately shown) included in the first PCB (25). The second metal part (32) of the first support (22) may be electrically connected to the first ground area of ​​the first PCB (25) through, for example, a conductive adhesive material or a flexible conductor (or a flexible conductive part or a flexible conductive member) disposed between the second metal part (32) and the first PCB (25). The flexible conductive member may include, for example, a conductive clip (e.g., a conductive structure including an elastic structure), a pogo pin, a spring, a conductive poron, a conductive rubber, a conductive tape, a conductive foam, or a conductive connector.

[0088] According to various embodiments, the second metal part (32) of the first support (22) may be electrically connected to a second ground area (not separately shown) included in the second PCB (26). The second metal part (32) of the first support (22) may be electrically connected to the second ground area of ​​the second PCB (26), for example, through a conductive adhesive material or a flexible conductor (or a flexible conductive part or a flexible conductive member) disposed between the second metal part (32) and the second PCB (26).

[0089] According to various embodiments, the first ground area of ​​the first PCB (25) and the second ground area of ​​the second PCB (26) may be electrically connected through an electrical connection member (e.g., FPCB) (not separately shown) that electrically connects the first PCB (25) and the second PCB (26).

[0090] According to various embodiments, at least some of the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) included in the first metal part (31) of the side part (13) may be electrically connected to the first ground area of ​​the first PCB (25). At least some of the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) included in the first metal part (31) may be electrically connected to the first ground area included in the first PCB (25), for example, through a conductive adhesive material or flexible conductor (or flexible conductive part or flexible conductive member) disposed between the first metal part (31) and the first PCB (25).

[0091] According to various embodiments, at least some of the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) included in the first metal part (31) of the side part (13) may be electrically connected to the second ground area of ​​the second PCB (26). At least some of the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) included in the first metal part (31) may be electrically connected to the second ground area included in the second PCB (26), for example, through a conductive adhesive material or flexible conductor (or flexible conductive part or flexible conductive member) disposed between the first metal part (31) and the second PCB (26).

[0092] According to various embodiments, at least one conductive layer (e.g., a metal sheet for electromagnetic shielding, such as a copper sheet) included in the display module (201) may be electrically connected to the second metal part (32) of the first support (22) through a conductive material (e.g., a conductive adhesive material) or a flexible conductor (or, a flexible conductive part or a flexible conductive member) disposed between the display module (201) and the second metal part (32) of the first support (22).

[0093] According to various embodiments, a combination of at least a portion of a first metal portion (31) included in a side portion (13), at least a portion of a second metal portion (32) included in a first support portion (22), a first ground area of ​​a first PCB (25), a second ground area of ​​a second PCB (26), and at least one conductive layer in a display module (201) may be defined or interpreted as a ground structure (or also referred to as ground) of an electronic device (1). The ground structure of the electronic device (1) may further include a first metal part (31) of the side part (13), a second metal part (32) of the first support part (22), a first ground area of ​​the first PCB (25), a second ground area of ​​the second PCB (26), or various other conductors (or conductive members, conductive areas, metal bodies, or metal areas) electrically connected to at least one conductive layer of the display module (201).

[0094] According to various embodiments, the ground structure of the electronic device (1) can reduce or prevent electromagnetic interference (EMI) to the electrical elements included in the electronic device (1). The ground structure of the electronic device (1) can, for example, reduce or prevent the electromagnetic effect of noise from outside the electronic device (1) on the electrical elements included in the electronic device (1). The ground structure of the electronic device (1) can, for example, reduce or prevent electromagnetic interference between the electrical elements included in the electronic device (1).

[0095] According to various embodiments, although not otherwise illustrated, the electronic device (1) may include a first conductive region and a second conductive region. The first conductive region and the second conductive region may be electrically connected or electrically and physically connected. When the first conductive region is configured to substantially radiate electromagnetic waves, the first conductive region in the combination of the first conductive region and the second conductive region may operate as an antenna radiator, and the second conductive region in the combination of the first conductive region and the second conductive region may operate as a ground structure of the electronic device (1) distinct from the antenna radiator. When the first conductive region is configured to substantially radiate electromagnetic waves, the combination of the first conductive region and the second conductive region may operate as a ground structure of the electronic device (1), and the first conductive region may operate as an antenna radiator implemented through a part of the ground structure of the electronic device (1). If the first conductive region is configured to substantially radiate electromagnetic waves, the second conductive region may function as an antenna ground that exerts an electromagnetic effect on the first conductive region (e.g., an antenna radiator). The antenna ground may contribute to securing antenna radiation performance (or radio wave transmission / reception performance or communication performance) and / or coverage with respect to the antenna radiator. The antenna ground may reduce electromagnetic interference (EMI) or signal loss with respect to the antenna radiator.

[0096] According to various embodiments, a portion of the ground structure of the electronic device (1) may be configured as an antenna radiator. A portion of the ground structure of the electronic device (1) may be electrically connected to a wireless communication circuit placed on a first PCB (25) or a second PCB (26). A portion of the ground structure of the electronic device (1) may receive an electromagnetic signal (or, wireless signal, RF signal, or radiated current) from the wireless communication circuit and operate as an antenna radiator (or, radiator, radiating part, or resonator). The wireless communication circuit may include, for example, a wireless communication module such as an RFIC (radio frequency integrated circuit), or a processor (e.g., an AP (application processor) or a CP (communication processor)).

[0097] According to various embodiments, at least a portion of the ground structure of the electronic device (1) may function as a heat spreader that diffuses and / or disperses heat emitted from one or more electronic components within the electronic device (1).

[0098] According to various embodiments, a second support member (also referred to as a second support body, a second support member, or a second support structure) (23) may be positioned between the rear plate (12) and the first support member (22). At least a portion of the first PCB (25) may be positioned between the first support member (22) and the second support member (23). The second support member (23) may protect the first PCB (25). The second support member (23) may be joined to the first support member (22) and / or the first PCB (25) by screw fastening or various other methods.

[0099] According to various embodiments, a third support (also referred to as a third support body, a third support member, or a third support structure) (34) may be positioned between the rear plate (12) and the first support (22). At least a portion of the second PCB (26) may be positioned between the first support (22) and the third support (24). The third support (24) may protect the second PCB (26). The third support (24) may be joined to the first support (22) and / or the second PCB (26) by screw fastening or various other methods.

[0100] According to various embodiments, when viewed from above on the rear plate (12), the second support member (23) and the third support member (24) may be spaced apart from each other at least partially with the battery (27) in between.

[0101] According to various embodiments, the frame (14) can be understood as the "front case" of the electronic device (1), and the second support (23) and / or the third support (24) can be understood as the "rear case" of the electronic device (1).

[0102] According to various embodiments, the second support (23) and / or the third support (24) may be understood as part of the housing (10).

[0103] According to various embodiments, the second support (23) or the third support (24) may include a metallic material and / or a non-metallic material (e.g., a polymer).

[0104] According to various embodiments, at least some of the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) included in the first metal part (31) of the side part (13) may be configured to operate as antenna radiators. At least some of the first to sixth partial metal parts (311, 312, 313, 314, 315, 316) of the first metal part (31) may be electrically connected to a wireless communication circuit disposed on (e.g., surface mounted) the first PCB (25) or the second PCB (26).

[0105] According to various embodiments, the second support (23) or the third support (24) may include a non-conductive material (not otherwise shown) and at least one conductive pattern (not otherwise shown) disposed on the non-conductive material. The at least one conductive pattern may be disposed on the non-conductive material, for example, via laser direct structuring (LDS). LDS may be a method of using a laser to design a pattern on the non-conductive material and plating a conductive material, such as copper or nickel, over it to form a conductive pattern. The at least one conductive pattern included in the second support (23) or the third support (24) may be configured to function as an antenna radiator. The at least one conductive pattern included in the second support (23) or the third support (24) may be electrically connected to a wireless communication circuit disposed on (e.g., surface-mounted) the first PCB (25) or the second PCB (26).

[0106] The electronic device (1) may further include various components depending on the form in which it is provided. These components may vary in their variations according to the convergence trends of the electronic device (1) and cannot all be listed, but components equivalent to those mentioned above may be additionally included in the electronic device (1). In various embodiments, depending on the form in which it is provided, certain components from the above-mentioned components may be excluded or replaced with other components. It should be understood that the present disclosure envisions and includes all combinations of the features and / or embodiments mentioned above. That is, all combinations of the features mentioned above should be considered to be included in the present disclosure as specific examples.

[0107] FIG. 4 is a cross-sectional view of a portion of a frame (14) cut along line A-A' of FIG. 3 according to various embodiments of the present disclosure.

[0108] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIG. 4 is conceived and included. Any combination of features described below in connection with FIG. 4 may be considered to be included in this disclosure as specific examples.

[0109] Referring to FIG. 4, the frame (14) may include a first metal part (31), a second metal part (32), and a conductive adhesive member (4). The frame (14) may include a first non-metal member (51) and a second non-metal member (52).

[0110] According to various embodiments, the first metal part (31) may at least surround the second metal part (32) when viewed from above on the front (10A) (see FIG. 1) or rear (10B) (see FIG. 1) of the electronic device (1). The first metal part (31) may be formed of a first metal material, and the second metal part (32) may be formed of a second metal material different from the first metal material.

[0111] According to various embodiments, the first metal part (31) forms part of the exterior of the electronic device (1), and the first metal material forming the first metal part (31) may be more aesthetically pleasing and glossy than the second metal material forming the second metal part (32). The first metal part (31) forms part of the exterior of the electronic device (1), and the first metal material forming the first metal part (31) may have superior corrosion resistance than the second metal material forming the second metal part (32). In various embodiments, the first metal part (31) forms part of the exterior of the electronic device (1), and the first metal material forming the first metal part (31) may have greater strength than the second metal material forming the second metal part (32). In various embodiments, the second metal material of the second metal part (32) may have a lower specific gravity than the first metal material of the first metal part (31) to reduce the weight of the frame (14). The first metal part (31) may be formed of, for example, stainless steel or titanium, but is not limited thereto. The second metal part (32) may be formed of, for example, aluminum, but is not limited thereto.

[0112] According to various embodiments, a conductive adhesive member (4) may be disposed between a first metal part (31) and a second metal part (32). The first metal part (31) and the second metal part (32) may be electrically and physically connected through the conductive adhesive member (4). The conductive adhesive member (4) may include an electrically conductive bond comprising, for example, an electrically conductive metal material (e.g., conductive powder) such as silver (Ag) or aluminum (Al). The conductive adhesive member (4) may be understood as a component included in the first support part (22). Connecting the first metal part (31) and the second metal part (32) through the conductive adhesive member (4) may be understood as "adhesion." Adhesion may be understood as attaching or bonding the first surface of the first metal part (31) and the second surface of the second metal part (32) through the conductive adhesive member (4).

[0113] According to various embodiments, the conductive adhesive member (4) may be formed by curing an adhesive placed between the first metal part (31) and the second metal part (32). The adhesive may exist in a liquid state (or solution) or a paste state at room temperature by dissolving or dispersing an adhesive component (e.g., conductive powder) in a solvent (e.g., an organic solvent). When the adhesive placed between the first metal part (31) and the second metal part (32) is dried, the solvent of the adhesive may evaporate and the adhesive component of the adhesive may be cured. Curing can be understood as a chemical reaction in which the adhesive component reacts to become high molecular weight, and at the same time, the adhesive component becomes stronger (e.g., increased cohesive force) due to intermolecular bonding (e.g., crosslinking). The bonding force between the first metal part (31) and the second metal part (32) can be understood as the ability of the conductive adhesive member (4) to adhere to the first surface of the first metal part (31) and the second surface of the second metal part (32) and bond the first surface of the first metal part (31) and the second surface of the second metal part (32) to each other. The bonding force between the first metal part (31) and the second metal part (32) can be understood as an adhesion force (or adhesive strength) (e.g., maximum tensile stress) measured, for example, at the first interface between the conductive adhesive member (4) and the first metal part (31), and / or at the second interface between the conductive adhesive member (4) and the second metal part (32).

[0114] According to various embodiments, the bonding force of the first metal part (31) and the second metal part (32) through the conductive adhesive member (4) may be about 25 MPa (mega pascal) or 25 MPa or more, but is not limited thereto.

[0115] According to various embodiments, the portion where the first metal part (31) and the second metal part (32) are joined through the conductive adhesive member (4) can be understood as the ‘first joint portion (6A)’ of the frame (14). The first joint portion (6A) may include the conductive adhesive member (4), a first joint surface (also referred to as the first interface or first joint interface) (601) between the conductive adhesive member (4) and the first metal part (31), and a second joint surface (also referred to as the second interface or second joint interface) (602) between the conductive adhesive member (4) and the second metal part (32).

[0116] According to various embodiments, the first bonding surface (601) of the first bonding portion (6A) may include a physical bond (also referred to as a physical interaction) between the conductive adhesive member (4) and the first metal portion (31). The physical bond at the first bonding surface (601) may be understood as a shape in which molecules of the conductive adhesive member (4) and molecules of the first metal portion (31) are bonded by a force of attraction (e.g., intermolecular force) to each other. The adhesive force between the conductive adhesive member (4) and the first metal portion (31) at the first bonding surface (601) may be determined by a balance between a cohesion force and an interfacial force. The cohesion force at the first bonding surface (601) may be understood as the strength after the adhesive for the conductive adhesive member (4) has cured. The interface bonding surface at the first bonding surface (601) can be understood as a physical interaction between the conductive adhesive member (4) and the first metal part (31).

[0117] According to various embodiments, the second bonding surface (602) of the first bonding portion (6A) may include a physical bond between the conductive adhesive member (4) and the second metal portion (32). The physical bond at the second bonding surface (602) may be understood as a shape in which molecules of the conductive adhesive member (4) and molecules of the second metal portion (32) are bonded by a force (e.g., intermolecular force) pulling each other. The adhesive force between the conductive adhesive member (4) and the second metal portion (32) at the second bonding surface (602) may be determined by a balance between cohesive force and interfacial bonding force. The cohesive force at the second bonding surface (602) may be understood as the strength after the adhesive for the conductive adhesive member (4) has cured. The interfacial bonding surface at the second bonding surface (602) may be understood as a physical interaction between the conductive adhesive member (4) and the second metal portion (32).

[0118] According to various embodiments, at least some of the first to sixth metal parts (311, 312, 313, 314, 315, 316) (see FIG. 3) included in the first metal part (31) may be configured as an antenna radiator. Electrically connecting the first metal part (31) and the second metal part (32) through a conductive adhesive member (4) can improve antenna radiation performance by extending or reinforcing the antenna ground so that at least some of the second metal part (32) can function as an antenna ground for the antenna radiator.

[0119] According to various embodiments, the first non-metallic portion (33) of the side portion (13) of FIG. 3 and the second non-metallic portion (34) of the first support portion (22) of FIG. 3 may be provided (or formed) by the first non-metallic member (51) and the second non-metallic member (52). For example, the first non-metallic portion (33) of the side portion (13) of FIG. 3 may include a portion of the second non-metallic member (52), and the second non-metallic portion (34) of the first support portion (22) of FIG. 3 may include the remaining portion of the first non-metallic member (51) and the second non-metallic member (52).

[0120] According to various embodiments, at least a portion of the first non-metallic member (51) may be covered by the second non-metallic member (52) so as not to be exposed to the outside of the frame (14). At least a portion of the first non-metallic member (51) may be located inside the frame (14) so ​​as not to be exposed to the outside of the frame (14).

[0121] According to various embodiments, the first support surface (22A) of the first support member (22) may be provided (or formed) by a combination of the second metal part (32) and the second non-metal member (52). In various embodiments, the second support surface (22B) of the first support member (22) may be provided (or formed) by a combination of the second metal part (32) and the second non-metal member (52). A component such as a display module (201) may be at least partially supported by the first support surface (22A) or placed on the first support surface (22A) in the first space (2201) between the first support surface (22A) of the first support member (22) and the front plate (11). Components such as the first camera module (202) (see FIG. 1), the second camera module (203) (see FIG. 1), the third camera module (204) (see FIG. 1), the second support member (23) (see FIG. 2), the third support member (24) (see FIG. 2), the first PCB (25) (see FIG. 2), the second PCB (26) (see FIG. 2), and the battery (27) (see FIG. 2) may be at least partially supported by the second support surface (22B) or placed on the second support surface (22B) in the second space (2202) between the second support surface (22B) of the first support member (22) and the rear plate (12).

[0122] According to various embodiments, although not separately illustrated, a portion of the first non-metallic member (51) may be exposed to the outside of the frame (14). The first support surface (22A) of the first support member (22) may be provided (or formed) by a combination of the second metal part (32), the first non-metallic member (51), and the second non-metallic member (52). The second support surface (22B) of the first support member (22) may be provided (or formed) by a combination of the second metal part (32), the first non-metallic member (51), and the second non-metallic member (52).

[0123] According to various embodiments, the first support member (22) may include a rim portion (221) of the first support member (22) adjacent to and connected to the side portion (13). The rim portion (221) may be positioned at least partially along the side portion (13). The rim portion (221) may be formed, for example, in a loop shape (or annular shape) along the side portion (13). To support the annular first rim area (also referred to as the first rim portion) of the front plate (11) and the annular second rim area (also referred to as the second rim portion) of the rear plate (12), at least a portion of the rim portion (221) of the first support member (22) may be provided (or formed) to be relatively thicker in a direction parallel to the z-axis compared to other portions of the first support member (22). The front plate (11) may be placed or joined to the frame (14) through a first adhesive member (or first adhesive member) (not separately shown) placed between the first edge area of ​​the front plate (11) and the edge portion (221) of the first support portion (22). The rear plate (12) may be placed or joined to the frame (14) through a second adhesive member (or second adhesive member) (not separately shown) placed between the second edge area of ​​the rear plate (12) and the edge portion (221) of the first support portion (22). The first adhesive member, as a first sealing member, can reduce or prevent foreign substances, such as moisture or dust, from entering the interior of the electronic device (1) (see FIG. 1) through the front plate (11) and the frame (14). The second adhesive member, as a second sealing member, can reduce or prevent foreign substances such as moisture or dust from entering the interior of the electronic device (1) (see FIG. 1) through between the rear plate (12) and the frame (14).

[0124] According to various embodiments, the conductive adhesive member (4) may be included in the edge portion (221) of the first support portion (22).

[0125] According to various embodiments, a portion of the second metal part (32) may be included in the edge part (221) of the first support part (22).

[0126] According to various embodiments, at least a portion of the first non-metallic member (51) may be included in the edge portion (221) of the first support portion (22).

[0127] According to various embodiments, at least a portion of the second non-metallic member (52) may be included in the edge portion (221) of the first support portion (22).

[0128] According to various embodiments, the second non-metallic member (52) may provide (or form) a first attachment area in which a first adhesive member (not separately shown) is disposed for connection with the front plate (11) at the edge portion (221) of the first support portion (22).

[0129] According to various embodiments, the second non-metallic member (52) may provide (or form) a second attachment area in which a second adhesive member (not separately shown) is disposed for connection with the rear plate (12) at the edge portion (221) of the first support portion (22).

[0130] According to various embodiments, the first non-metallic member (51) may be formed through primary molding (e.g., primary insert injection molding). The second non-metallic member (52) may be formed through secondary molding (e.g., secondary insert injection molding).

[0131] According to various embodiments, the first metal part (31) and the second metal part (32) may be physically separated from a part of the frame (14) corresponding to line A-A' of FIG. 3. The first metal part (31) and the second metal part (32) may be connected through a conductive adhesive member (4), a first non-metal member (51), and a second non-metal member (52).

[0132] According to various embodiments, the first non-metallic member (51) may be bonded to a conductive adhesive member (4). The first non-metallic member (51) may be bonded to a first metal part (31). The first non-metallic member (51) may be bonded to a second metal part (32). The frame (14) may include a second bonding part (6B) for the first non-metallic member (51). The second bonding part (6B) may include a third bonding surface (also referred to as a third interface or third bonding interface) (603) between the first non-metallic member (51) and the conductive adhesive member (4). The second bonding part (6B) may include a fourth bonding surface (also referred to as a fourth interface or fourth bonding interface) (604) between the first non-metallic member (51) and the first metal part (31). The second joint (6B) may include a fifth joint surface (also called a fifth interface or fifth joint interface) (605) between the first non-metallic member (51) and the second metal part (32).

[0133] According to various embodiments, the third bonding surface (603) of the second bonding portion (6B) may include a mechanical connection (also referred to as mechanical interaction) between the conductive adhesive member (4) and the first non-metallic member (51). The third bonding surface (603) may include unevenness or irregularities (also referred to as an uneven structure). The irregularities included in the third bonding surface (603) may include, for example, a plurality of grooves formed in the conductive adhesive member (4), and a plurality of protrusions (also referred to as inserts) of the first non-metallic member (51) located (e.g., inserted or filled) in the plurality of grooves of the conductive adhesive member (4). Mechanical bonding at the third bonding surface (603) can be understood as a phenomenon (e.g., anchor effect or anchoring effect) in which a first molding liquid (e.g., first molten resin) in the first molding for the first non-metallic member (51) seeps into a plurality of grooves of the conductive adhesive member (4) and hardens to bond with the conductive adhesive member (4). The third bonding surface (603) may include physical bonding between the conductive adhesive member (4) and the first non-metallic member (51). Physical bonding at the third bonding surface (603) can be understood as a shape in which molecules of the conductive adhesive member (4) and molecules of the first non-metallic member (51) are bonded by a force (e.g., intermolecular force) pulling each other. The adhesive force between the conductive adhesive member (4) and the first non-metallic member (51) at the third bonding surface (603) can be determined by a balance between cohesive force and interfacial bonding force. The cohesive force at the third bonding surface (603) can be understood as the strength after the first molding liquid has cured in the first molding for the first non-metallic member (51). The interfacial bonding force at the third bonding surface (603) can be understood as the physical interaction at the interface between the first non-metallic member (51) and the conductive adhesive member (4).

[0134] According to various embodiments, the irregularities included in the third bonding surface (603) of the second bonding portion (6B) can be understood as the surface of the conductive adhesive member (4) at the third bonding surface (603) having surface roughness (e.g., the degree of irregularity of the micro-protrusions appearing on the surface expressed as height) for mechanical bonding between the conductive adhesive member (4) and the first non-metallic member (51).

[0135] According to various embodiments, the irregularities included in the third bonding surface (603) of the second bonding portion (6B) can be understood as the surface of the conductive adhesive member (4) at the third bonding surface (603) having a surface roughness greater than the surface of the first metal part (31) at the fourth bonding surface (604) of the second bonding portion (6B). The irregularities included in the third bonding surface (603) of the second bonding portion (6B) can be understood as the surface of the conductive adhesive member (4) at the third bonding surface (603) having a surface roughness greater than the surface of the second metal part (32) at the fifth bonding surface (605) of the second bonding portion (6B).

[0136] According to various embodiments, a plurality of grooves included in the conductive adhesive member (4) of the third bonding surface (603) can be formed by transferring the adhesive for the conductive adhesive member (4) through a film having an uneven surface (e.g., the film (1420) of FIG. 14c) when curing.

[0137] According to various embodiments, a plurality of grooves included in the conductive adhesive member (4) of the third bonding surface (603) may have substantially the same cross-sectional shape. A plurality of grooves included in the conductive adhesive member (4) of the third bonding surface (603) may be arranged in at least some substantially constant patterns, but are not limited thereto.

[0138] According to various embodiments, a plurality of grooves included in the conductive adhesive member (4) of the third bonding surface (603) may have at least some different cross-sectional shapes.

[0139] According to various embodiments, the plurality of grooves included in the conductive adhesive member (4) of the third bonding surface (603) may include a plurality of pores or dimples, but are not limited thereto.

[0140] According to various embodiments, the fourth bonding surface (604) of the second bonding portion (6B) may include a physical bond between the first metal portion (31) and the first non-metal member (51). The physical bond at the fourth bonding surface (604) can be understood as a shape in which molecules of the first metal portion (31) and molecules of the first non-metal member (51) are bonded by a force (e.g., intermolecular force) pulling each other. The adhesive force between the first metal portion (31) and the first non-metal member (51) at the fourth bonding surface (604) may be determined by a balance between cohesive force and interfacial bonding force. The cohesive force at the fourth bonding surface (604) can be understood as the strength after the first molding liquid has cured in the first molding for the first non-metal member (51). The interfacial bonding force at the fourth bonding surface (604) can be understood as a physical interaction at the interface between the first non-metallic member (51) and the first metal part (31).

[0141] According to various embodiments, the fifth bonding surface (605) of the second bonding portion (6B) may include a physical bond between the second metal portion (32) and the first non-metal member (51). The physical bond at the fifth bonding surface (605) can be understood as a shape in which molecules of the second metal portion (32) and molecules of the first non-metal member (51) are bonded by a force (e.g., intermolecular force) pulling each other. The adhesive force between the second metal portion (32) and the first non-metal member (51) at the fifth bonding surface (605) may be determined by a balance between cohesive force and interfacial bonding force. The cohesive force at the fifth bonding surface (605) can be understood as the strength after the first molding liquid has cured in the first molding for the first non-metal member (51). The interfacial bonding force at the fifth bonding surface (605) can be understood as a physical interaction at the interface between the first non-metallic member (51) and the second metal part (32).

[0142] According to various embodiments, the first non-metallic member (51) can increase or supplement the bonding strength between the first metal part (31) and the second metal part (32). Since it may be difficult to secure the bonding strength between the first metal part (31) and the second metal part (32) solely through the first joint (6A) between the first metal part (31) and the second metal part (32), the first non-metallic member (51) can supplement the bonding strength between the first metal part (31) and the second metal part (32). The first non-metallic member (51) can supplement the brittleness of the conductive adhesive member (4) of the first joint (6A).

[0143] According to various embodiments, the first non-metallic member (51) can protect the conductive adhesive member (4). The first non-metallic member (51) can cover the conductive adhesive member (4) so ​​that at least a portion of the conductive adhesive member (4) is not exposed to the outside of the frame (14). During surface processing or shape processing, or during movement for surface processing or shape processing, the first non-metallic member (51) can reduce or prevent damage or breakage of the conductive adhesive member (4) from the external environment. Since the first non-metallic member (51) protects the conductive adhesive member (4), it can reduce or prevent the bonding strength of the first joint (6A) from being reduced due to the external environment. For example, the first non-metallic member (51) can reduce or prevent deformation or breakage of the conductive adhesive member (4) from impact (e.g., cutting impact) or heat that may occur during at least one process, such as shape processing, during the manufacturing process of the frame (14). For example, the first non-metallic member (51) can reduce or prevent contamination of the conductive adhesive member (4) during the manufacturing process of the frame (14).

[0144] According to various embodiments, the second non-metallic member (52) can increase or supplement the bonding force between the first metal part (31) and the second metal part (32). The second non-metallic member (52) can serve as a base for the non-metallic portion of the exterior of the frame (14). The second non-metallic member (52) can be bonded to the first non-metallic member (51). The second non-metallic member (52) can be bonded to the first metal part (31). The second non-metallic member (52) can be bonded to the second metal part (32). The frame (14) may include a third bonding portion (6C) for the second non-metallic member (52). The third joint (6C) may include a sixth joint surface (also referred to as a sixth interface or sixth joint interface) (606) between the second non-metallic member (52) and the first non-metallic member (51). The third joint (6C) may include a seventh joint surface (also referred to as a seventh interface or seventh joint interface) (607) between the second non-metallic member (52) and the first metal part (31). The third joint (6C) may include an eighth joint surface (also referred to as an eighth interface or eighth joint interface) (608) between the second non-metallic member (52) and the second metal part (32).

[0145] According to various embodiments, the sixth bonding surface (606) of the third bonding portion (6C) may include a mechanical bond between the first non-metallic member (51) and the second non-metallic member (52). The sixth bonding surface (606) may include an irregularity (also referred to as an irregular structure). It may include a plurality of grooves formed in the first non-metallic member (51) included in the sixth bonding surface (606), and a plurality of protrusions of the second non-metallic member (52) located (e.g., inserted or filled) in the plurality of grooves of the first non-metallic member (51). Mechanical bonding at the sixth bonding surface (606) can be understood as a phenomenon (e.g., anchor effect) in which a second molding liquid (e.g., second molten resin) seeps into and hardens into a plurality of grooves of the first nonmetal member (51) during secondary molding for the second nonmetal member (52) to bond with the first nonmetal member (51). The sixth bonding surface (606) may include physical bonding between the first nonmetal member (51) and the second nonmetal member (52). Physical bonding at the sixth bonding surface (606) can be understood as a shape in which molecules of the first nonmetal member (51) and molecules of the second nonmetal member (52) are bonded by a force (e.g., intermolecular force) pulling each other. The adhesive force between the first non-metallic member (51) and the second non-metallic member (52) at the sixth bonding surface (606) can be determined by a balance between cohesive force and interfacial bonding force. At the sixth bonding surface (606), the cohesive force can be understood as the strength after the second molding liquid has cured in the secondary molding for the second non-metallic member (52). At the sixth bonding surface (606), the interfacial bonding force can be understood as the physical interaction at the interface between the second non-metallic member (52) and the first non-metallic member (51).

[0146] According to various embodiments, the irregularities included in the sixth joint surface (606) of the third joint (6C) can be understood as the surface of the first non-metallic member (51) at the sixth joint surface (606) having surface roughness for mechanical bonding between the first non-metallic member (51) and the second non-metallic member (52).

[0147] According to various embodiments, a plurality of grooves of the first non-metallic member (51) at the sixth joint surface (606) of the third joint (6C) may be formed by a mold in a primary molding for the first non-metallic member (51). A plurality of grooves included in the first non-metallic member (51) at the sixth joint surface (606) may be formed by transferring the molding surface of the mold in the primary molding.

[0148] According to various embodiments, a plurality of grooves included in the first non-metallic member (51) of the sixth bonding surface (606) may have substantially the same cross-sectional shape. A plurality of grooves included in the first non-metallic member (51) of the sixth bonding surface (606) may be arranged in at least some substantially constant patterns, but are not limited thereto.

[0149] According to various embodiments, a plurality of grooves included in the first non-metallic member (51) of the sixth bonding surface (606) may have at least some different cross-sectional shapes.

[0150] According to various embodiments, the plurality of grooves included in the first non-metallic member (51) of the sixth bonding surface (606) may include a plurality of pores or dimples, but are not limited thereto.

[0151] According to various embodiments, the seventh bonding surface (607) of the third bonding portion (6C) may include a mechanical bond between the first metal portion (31) and the second non-metal member (52). The seventh bonding surface (607) may include irregularities (also referred to as irregular structure). The irregularities included in the seventh bonding surface (607) may include, for example, a plurality of grooves formed in the first metal portion (31), and a plurality of protrusions of the second non-metal member (52) located (e.g., inserted or filled) in the plurality of grooves of the first metal portion (31). The mechanical bond at the seventh bonding surface (607) may be understood as a phenomenon (e.g., anchor effect) in which, during secondary molding for the second non-metal member (52), the second molding liquid seeps into and hardens in the plurality of grooves of the first metal portion (31) to bond with the first metal portion (31). The seventh bonding surface (607) may include a physical bond between the first metal part (31) and the second non-metal member (52). The physical bond at the seventh bonding surface (607) can be understood as a shape in which molecules of the first metal part (31) and molecules of the second non-metal member (52) are bonded by a force (e.g., intermolecular force) pulling them together. The adhesive force between the first metal part (31) and the second non-metal member (52) at the seventh bonding surface (607) may be determined by a balance between cohesive force and interfacial bonding force. The cohesive force at the seventh bonding surface (607) can be understood as the strength after the second molding liquid has cured in the second molding for the second non-metal member (52). The interfacial bonding force at the seventh bonding surface (607) can be understood as a physical interaction at the interface between the second non-metallic member (52) and the first metal part (31).

[0152] According to various embodiments, the irregularities included in the seventh joint surface (607) of the third joint (6C) can be understood as the surface of the first metal part (31) at the seventh joint surface (607) having surface roughness for mechanical bonding between the first metal part (31) and the second non-metal member (52).

[0153] According to various embodiments, in order to form the seventh bonding surface (607) of the third bonding portion (6C), an oxide film may be formed on the first metal portion (31) before secondary molding through chemical surface treatment (e.g., anodizing (also called anodic oxidation)). The oxide film of the first metal portion (31) at the seventh bonding surface (607) may include a plurality of grooves. The oxide film of the first metal portion (31) at the seventh bonding surface (607) may include, for example, a plurality of pores (e.g., micro pores or nano pores) or dimples (e.g., micro dimples, nano dimples). The oxide film of the first metal part (31) at the seventh bonding surface (607) may be, for example, a TRI film formed through a TRI system that bonds metal and resin. Mechanical and physical bonding between the first metal part (31) and the second non-metal member (52) may be formed by the oxide film of the first metal part (31). The second non-metal member (52) formed through secondary molding (e.g., a component of the second non-metal member (52)) may penetrate into the oxide film of the first metal part (31) and be closely bonded with the oxide film of the first metal part (31).

[0154] According to various embodiments, a plurality of grooves of the first metal part (31) included in the seventh joint surface (607) of the third joint part (6C) can be formed through various surface processing (e.g., surface treatment), such as etching, CNC (computer numerical control) processing, or laser processing (e.g., laser hatching).

[0155] According to various embodiments, a plurality of grooves of the first metal part (31) included in the seventh joint surface (607) of the third joint part (6C) can be formed through sandblasting.

[0156] According to various embodiments, the eighth bonding surface (608) of the third bonding portion (6C) may include a mechanical bond between the second metal portion (32) and the second non-metal member (52). The eighth bonding surface (608) may include irregularities (also referred to as irregular structure). The irregularities included in the eighth bonding surface (608) may include, for example, a plurality of grooves formed in the second metal portion (32), and a plurality of protrusions of the second non-metal member (52) located (e.g., inserted or filled) in the plurality of grooves of the second metal portion (32). The mechanical bond at the eighth bonding surface (608) may be understood as a phenomenon (e.g., anchor effect) in which, during secondary molding for the second non-metal member (52), the second molding liquid seeps into and hardens in the plurality of grooves of the second metal portion (32) to bond with the second metal portion (32). The eighth bonding surface (608) may include a physical bond between the second metal part (32) and the second non-metal member (52). The physical bond at the eighth bonding surface (608) can be understood as a shape in which molecules of the second metal part (32) and molecules of the second non-metal member (52) are bonded by a force (e.g., intermolecular force) that attracts each other. The adhesive force between the second metal part (32) and the second non-metal member (52) at the eighth bonding surface (608) may be determined by a balance between cohesive force and interfacial bonding force. The cohesive force at the eighth bonding surface (608) can be understood as the strength after the second molding liquid has cured in the secondary molding for the second non-metal member (52). The interfacial bonding force at the eighth bonding surface (608) can be understood as a physical interaction at the interface between the second non-metallic member (52) and the second metallic part (32).

[0157] According to various embodiments, the irregularities included in the eighth joint surface (608) of the third joint (6C) can be understood as the surface of the second metal part (32) at the eighth joint surface (608) having surface roughness for mechanical bonding between the second metal part (32) and the second non-metal member (52).

[0158] According to various embodiments, in order to form the eighth bonding surface (608) of the third bonding portion (6C), an oxide film may be formed on the second metal portion (32) through chemical surface treatment (e.g., anodizing) prior to secondary molding. The oxide film of the second metal portion (32) at the eighth bonding surface (608) may include a plurality of grooves. The oxide film of the second metal portion (32) at the eighth bonding surface (608) may include, for example, a plurality of dimples (e.g., micro dimples or nano dimples) or pores (e.g., micro pores or nano pores). The oxide film of the second metal portion (32) at the eighth bonding surface (608) may be, for example, a TRI film formed through a TRI system that bonds metal and resin. Mechanical and physical bonding between the second metal part (32) and the second non-metal member (52) can be formed by the oxide film of the second metal part (32). The second non-metal member (52) formed through secondary molding (e.g., a component of the second non-metal member (52)) can penetrate into the oxide film of the second metal part (32) and be closely bonded with the oxide film of the second metal part (32).

[0159] According to various embodiments, a plurality of grooves of the second metal part (32) included in the eighth joint surface (608) of the third joint part (6C) can be formed through various surface processing (e.g., surface treatment), such as etching, CNC machining, or laser processing (e.g., laser hatching).

[0160] According to various embodiments, a plurality of grooves of the second metal part (32) included in the eighth joint surface (608) of the third joint part (6C) can be formed through sandblasting.

[0161] According to various embodiments, the nonmetallic material contained in the first nonmetallic member (51) may be different from the nonmetallic material contained in the second nonmetallic member (52). The nonmetallic material contained in the first nonmetallic member (51) and the nonmetallic material contained in the second nonmetallic member (52) may be, for example, different polymeric materials or polymer composite materials. The first non-metallic member (51) is intended to supplement the bonding force between the first metal part (31) and the second metal part (32) before secondary molding, and the non-metallic material of the first non-metallic member (51) may be capable of forming a relatively large physical bond (e.g., intermolecular force between the first non-metallic member (51) and the first metal part (31), and intermolecular force between the first non-metallic member (51) and the second metal part (32)) with respect to the first metal part (31) and the second metal part (32) compared to the non-metallic material of the second non-metallic member (52).

[0162] According to various embodiments, the nonmetallic material contained in the first nonmetallic member (51) may be the same as the nonmetallic material contained in the second nonmetallic member (52). The nonmetallic material contained in the first nonmetallic member (51) and the nonmetallic material contained in the second nonmetallic member (52) may be, for example, the same polymeric material or polymer composite material.

[0163] According to various embodiments, physical properties such as viscosity and temperature during injection molding that the first molding liquid of a non-metallic material for the first non-metallic member (51) must have may vary depending on the conditions of the first molding. Physical properties such as viscosity and temperature during injection molding that the second molding liquid of a non-metallic material for the second non-metallic member (52) must have may vary depending on the conditions of the second molding. For example, the first molding liquid of a non-metallic material for the first non-metallic member (51) in the first molding may have a greater viscosity than the second molding liquid of a non-metallic material for the second non-metallic member (52) in the second molding.

[0164] According to various embodiments, the first bonding surface (601) and the second bonding surface (602) of the first bonding portion (6A) may not substantially include irregularities. The first bonding surface (601) of the first bonding portion (6A) may be understood as not substantially including a mechanical bond between the conductive adhesive member (4) and the first metal portion (31). The second bonding surface (602) of the first bonding portion (6A) may be understood as not substantially including a mechanical bond between the conductive adhesive member (4) and the second metal portion (32). The surface of the first metal part (31) at the first bonding surface (601) of the first bonding part (6A), and the surface of the second metal part (32) at the second bonding surface (602) of the first bonding part (6A) may be understood to be implemented smoothly so as not to substantially include irregularities, for example, or to have surface roughness that makes it difficult to substantially implement mechanical bonding.

[0165] There may be a comparative example in which a plurality of grooves are formed on the surface of the first metal part (31) through laser processing (e.g., laser hatching) (but not limited thereto) to form a mechanical bond to the first bonding surface (601) of the first bonding part (6A). In the comparative example, it may be difficult to fill the plurality of grooves of the first metal part (31) with the conductive adhesive member (4), resulting in a bonding defect of the first bonding surface (601). In the comparative example, because an oxide material may remain as a residue on the surface of the first metal part (31) due to laser processing, a bonding defect such as the first bonding surface (601) between the conductive adhesive member (4) and the first metal part (31) containing an air gap may occur. In the comparative example, unwanted deformation of the first metal part (31) may occur due to laser processing. According to the present disclosure, since the surface of the first metal part (31) at the first bonding surface (601) of the first bonding part (6A) substantially does not contain irregularities, the aforementioned bonding defects on the first bonding surface (601) that may occur in comparative examples can be reduced or prevented. In the present disclosure, the fact that the surface of the first metal part (31) at the first bonding surface (601) of the first bonding part (6A) substantially does not contain irregularities can be understood as not performing processing for forming irregularities (e.g., laser processing) because it substantially does not contain irregularities, or performing processing to smooth the surface so as not to substantially contain irregularities (e.g., surface treatment such as anodizing, electrolytic polishing, or chemical polishing).

[0166] There may be a comparative example in which a plurality of grooves are formed on the surface of the second metal part (32) through laser processing (e.g., laser hatching) (but not limited thereto) to form a mechanical bond to the second bonding surface (602) of the first bonding part (6A). In the comparative example, it may be difficult to fill the plurality of grooves of the second metal part (32) with the conductive adhesive member (4), resulting in a bonding defect of the second bonding surface (602). In the comparative example, because an oxide material may remain as a residue on the surface of the second metal part (32) due to laser processing, a bonding defect such as the second bonding surface (602) between the conductive adhesive member (4) and the second metal part (32) containing an air gap may occur. In the comparative example, unwanted deformation of the second metal part (32) may occur due to laser processing. According to the present disclosure, since the surface of the second metal part (32) at the second bonding surface (602) of the first bonding part (6A) substantially does not contain irregularities, the aforementioned bonding defects on the second bonding surface (602) that may occur in comparative examples can be reduced or prevented. In the present disclosure, the fact that the surface of the second metal part (32) at the second bonding surface (602) of the first bonding part (6A) substantially does not contain irregularities can be understood as not performing processing for forming irregularities (e.g., laser processing) because it substantially does not contain irregularities, or performing processing to smooth the surface so that it substantially does not contain irregularities (e.g., surface treatment such as anodizing, electrolytic polishing, or chemical polishing).

[0167] According to various embodiments, the fourth bonding surface (604) of the second bonding portion (6B) may not substantially contain any irregularities. The fourth bonding surface (604) of the second bonding portion (6B) may be understood as not substantially containing any mechanical connection between the first non-metallic member (51) and the first metal portion (31). The surface of the first metal portion (31) at the fourth bonding surface (604) of the second bonding portion (6B) may be understood, for example, to be implemented smoothly so as not to substantially contain any irregularities, or to have a surface roughness that makes it difficult to substantially implement a mechanical connection.

[0168] There may be a comparative example in which a plurality of grooves are formed on the surface of the first metal part (31) through laser processing (e.g., laser hatching) (but not limited thereto) to form a mechanical bond to the fourth bonding surface (604) of the second bonding part (6B). In the comparative example, it may be difficult to fill the plurality of grooves of the first metal part (31) with the first non-metal member (51), resulting in a bonding defect of the fourth bonding surface (604). In the comparative example, because an oxide material may remain as a residue on the surface of the first metal part (31) due to laser processing, a bonding defect such as the fourth bonding surface (604) between the first non-metal member (51) and the first metal part (31) containing an air gap may occur. In the comparative example, unwanted deformation of the first metal part (31) may occur due to laser processing. According to the present disclosure, since the surface of the first metal part (31) at the fourth bonding surface (604) of the second bonding part (6B) substantially does not contain irregularities, the aforementioned bonding defects for the fourth bonding surface (604) that may occur in comparative examples can be reduced or prevented. In the present disclosure, the fact that the surface of the first metal part (31) at the fourth bonding surface (604) of the second bonding part (6B) substantially does not contain irregularities can be understood as not performing processing for forming irregularities (e.g., laser processing) because it substantially does not contain irregularities, or performing processing to smooth the surface so that it substantially does not contain irregularities (e.g., surface treatment such as anodizing, electrolytic polishing, or chemical polishing).

[0169] According to various embodiments, the fifth bonding surface (605) of the second bonding portion (6B) may not substantially contain any irregularities. The fifth bonding surface (605) of the second bonding portion (6B) may be understood as not substantially containing any mechanical connection between the first non-metallic member (51) and the second metal portion (32). The surface of the second metal portion (32) at the fifth bonding surface (605) of the second bonding portion (6B) may be understood, for example, to be implemented smoothly so as not to substantially contain any irregularities, or to have a surface roughness that makes it difficult to substantially implement a mechanical connection.

[0170] There may be a comparative example in which a plurality of grooves are formed on the surface of the second metal part (32) through laser processing (e.g., laser hatching) (but not limited thereto) to form a mechanical bond to the fifth bonding surface (605) of the second bonding part (6B). In the comparative example, it may be difficult to fill the plurality of grooves of the second metal part (32) with the first non-metal member (51), resulting in a bonding defect of the fifth bonding surface (605). In the comparative example, because an oxide material may remain as a residue on the surface of the second metal part (32) due to laser processing, a bonding defect such as the fifth bonding surface (605) between the first non-metal member (51) and the second metal part (32) containing an air gap may occur. In the comparative example, unwanted deformation of the second metal part (32) may occur due to laser processing. According to the present disclosure, since the surface of the second metal part (32) at the fifth bonding surface (605) of the second bonding part (6B) substantially does not contain irregularities, the aforementioned bonding defects for the fifth bonding surface (605) that may occur in comparative examples can be reduced or prevented. In the present disclosure, the fact that the surface of the second metal part (32) at the fifth bonding surface (605) of the second bonding part (6B) substantially does not contain irregularities can be understood as not performing processing for forming irregularities (e.g., laser processing) because it substantially does not contain irregularities, or performing processing to smooth the surface so that it substantially does not contain irregularities (e.g., surface treatment such as anodizing, electrolytic polishing, or chemical polishing).

[0171] According to various embodiments, the sixth joint surface (606) of the third joint (6C) may not substantially include any irregularities. The sixth joint surface (606) of the third joint (6C) may be understood as not substantially including any mechanical connection between the first non-metallic member (51) and the second non-metallic member (52).

[0172] According to various embodiments, the seventh joining surface (607) of the third joining portion (6C) may not substantially include any irregularities. The seventh joining surface (607) of the third joining portion (6C) may be understood as not substantially including any mechanical connection between the second non-metallic member (52) and the first metal portion (31).

[0173] According to various embodiments, the eighth joining surface (608) of the third joining portion (6C) may not substantially include any irregularities. It may be understood that the eighth joining surface (608) of the third joining portion (6C) does not substantially include a mechanical connection between the second non-metallic member (52) and the second metallic portion (32).

[0174] According to various embodiments, the relative positions between the first metal part (31), the second metal part (32), the conductive adhesive member (4), the first non-metal member (51), and the second non-metal member (52) according to the cross-sectional view of FIG. 4 are not limited to line A-A' of FIG. 3.

[0175] FIG. 5 is a cross-sectional view of a portion of a frame (14) cut along line B-B' of FIG. 3 according to various embodiments of the present disclosure.

[0176] Referring to FIG. 5, the frame (14) may include a first metal part (31), a second metal part (32), and a conductive adhesive member (4). The frame (14) may include a first non-metal member (51) and a second non-metal member (52). The frame (14) may include a first joint part (6A). The first joint part (6A) may include a conductive adhesive member (4), a first joint surface (601), and a second joint surface (602). The frame (14) may include a fourth joint surface (604) and a fifth joint surface (605). The frame (14) may include a third joint part (6C). The third joint part (6C) may include a sixth joint surface (606), a seventh joint surface (607), and an eighth joint surface (608). Descriptions of some components identical to those in the preceding examples may not be repeated.

[0177] According to various embodiments, the first metal part (31) and the second metal part (32) may be physically in contact with a part of the frame (14) corresponding to line B-B' of FIG. 3.

[0178] According to various embodiments, in a part of the frame (14) corresponding to line B-B' of FIG. 3, the first non-metallic member (51) may be physically separated from the conductive adhesive member (4), and the third bonding surface (603) of the second bonding part (6B) according to the example of FIG. 4 may be omitted.

[0179] According to various embodiments, the relative positions between the first metal part (31), the second metal part (32), the conductive adhesive member (4), the first non-metal member (51), and the second non-metal member (52) according to the cross-sectional view of FIG. 5 are not limited to line B-B' of FIG. 3.

[0180] FIG. 6 is a cross-sectional view of a portion of a frame (14) cut along line C-C' of FIG. 3 according to various embodiments of the present disclosure.

[0181] FIG. 7 is a cross-sectional perspective view of a portion of a frame (14) cut along line C-C' of FIG. 3 according to various embodiments of the present disclosure.

[0182] It is understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 6 and 7 is conceived and included. Any combination of features described below in connection with FIGS. 6 and 7 may be considered to be included in this disclosure as specific examples.

[0183] Referring to FIGS. 6 and 7, the frame (14) may include a first metal part (31), a second metal part (32), and a conductive adhesive member (4). The frame (14) may include a first non-metal member (51) and a second non-metal member (52). The frame (14) may include a fourth bonding surface (604) and a fifth bonding surface (605). The frame (14) may include a third bonding part (6C). The third bonding part (6C) may include a sixth bonding surface (606), a seventh bonding surface (607), and an eighth bonding surface (608). Descriptions of some components identical to those in the preceding embodiment may not be repeated.

[0184] According to various embodiments, the first metal part (31) and the second metal part (32) may be physically separated in a part of the frame (14) corresponding to line C-C' of FIG. 3. The first metal part (31) and the second metal part (32) may be connected through the first non-metal member (51) and the second non-metal member (52) in a part of the frame (14) corresponding to line C-C' of FIG. 3.

[0185] According to various embodiments, the frame (14) may include a key input module support configured to place and support a key input module. The key input module support may be provided (or formed) on a rim portion (221) included in a first support portion (22) of the frame (14). The key input module support may include a first key hole (701) provided (or formed) on a first metal portion (31) of a side portion (13). The key input module support may include a second key hole provided (or formed) on a first metal portion (31) of a side portion (13). The key input module support may include a recess (702) provided (or formed) on a rim portion (221) of the first support portion (22) of the frame (14). The first key hole (701) and the second key hole may be arranged in a direction parallel to the y-axis. When viewed in the negative direction of the x-axis, the first key hole (701) and the second key hole may overlap with the recess (702). The first key hole (701), the second key hole, and the recess (702) may be understood as the 'side hole area' of the frame (14). The key input module may be located in the side hole area of ​​the frame (14). The side hole area of ​​the frame (14) may be separated from the first space (2201) between the first support surface (22A) of the first support member (22) and the front plate (11) by a portion of the edge portion (221) of the first support member (22). The side hole area of ​​the frame (14) can be separated from the second space (2202) between the second support surface (22B) of the first support member (22) and the rear plate (12) by another part of the edge portion (221) of the first support member (22).

[0186] According to various embodiments, the recessed surface forming the recess (702) of the first support member (22) may be provided (or formed) by the first non-metallic member (51), the second non-metallic member (52), and the second metal member (32), but is not limited thereto.

[0187] According to various embodiments, the frame (14) may be implemented such that the conductive adhesive member (4) (see FIG. 4 and 5) is not exposed to the outside of the frame (14) through the side hole area (or first key hole (701)) of the frame (14). For example, the conductive adhesive member (4) may not extend into the side hole area (or first key hole (701)). Preventing the conductive adhesive member (4) from extending into the side hole area (or first key hole (701)) can reduce or prevent damage, breakage, or contamination of the conductive adhesive member (4) from the external environment during the manufacturing process of the frame (14). Preventing the conductive adhesive member (4) from extending into the side hole area (or first key hole (701)) can reduce or prevent the bonding strength between the first metal part (31) and the second metal part (32) from being reduced due to the external environment.

[0188] According to various embodiments, a portion of the edge portion (221) of the first support portion (22) may be a support wall (222) configured to support the first key (212) (see FIG. 1), the second key (213) (see FIG. 1), and the key signal generator. The support wall (222) may form a portion of the recessed surface forming the recess (702). When viewed in the negative direction of the x-axis, the first key hole (701) of the first metal portion (31) and the second key hole of the first metal portion (31) may overlap with the support wall (222) of the edge portion (22) of the first support portion (22). The first key (212) of the key input module (see FIG. 1) may be located in the side hole area of ​​the frame (14) and may be exposed to the outside through the first key hole (701). The second key (213) (see FIG. 1) of the key input module is located in the side hole area of ​​the frame (14) and may be exposed to the outside through the second key hole. The key signal generating unit of the key input module may include a first key signal generating unit configured to generate a key signal in response to a touch of pressing or touching the first key (212), and a second key signal generating unit configured to generate a key signal in response to a touch of pressing or touching the second key. The first key signal generating unit is located in the side hole area of ​​the frame (14) and may be positioned between the first key (212) (see FIG. 1) and the support wall (222). The second key signal generating unit is located in the side hole area of ​​the frame (14) and may be positioned between the second key (213) (see FIG. 1) and the support wall (222).

[0189] According to various embodiments, the support wall (222) included in the edge portion (221) of the first support portion (22) may be formed by a part of the second metal portion (32) and the second non-metal member (52), but is not limited thereto.

[0190] According to various embodiments, the support wall (222) included in the edge portion (221) of the first support portion (22) may include an opening (703) that spatially connects the recess (702) and the second space (2202). The electronic device (1) (see FIG. 1) or key input module may include an electrical connection member (not separately shown), such as an FPCB or a cable, that penetrates the opening (703) of the support wall (222) to electrically connect the key signal generator located in the recess (702) and the first PCB (25) (see FIG. 2) located in the second space (2202).

[0191] FIG. 8 is a cross-sectional view showing two members joined together according to various embodiments of the present disclosure.

[0192] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIG. 8 is conceived and included. Any combination of features described below in connection with FIG. 8 may be considered to be included in this disclosure as specific examples.

[0193] Referring to FIG. 8, the joining surface (830) between the first member (810) and the second member (820) may include a mechanical connection. The mechanical connection at the joining surface (830) between the first member (810) and the second member (820) may include, for example, a plurality of grooves (831) included in the first member (810), and a plurality of protrusions (832) of the second member (820) inserted into the plurality of grooves (831). Due to the anchoring effect caused by the plurality of grooves (831) and the plurality of protrusions (832), the first member (810) and the second member (820) may be mechanically joined. The joining surface (830) between the first member (810) and the second member (820) may include a physical connection. The physical bond at the joint surface (830) between the first member (810) and the second member (820) can be understood as a shape in which the molecules of the first member (810) and the molecules of the second member (820) are bonded by a force (e.g., intermolecular force) pulling each other. The cross-sectional shape of the plurality of grooves (831) and the plurality of protrusions (832) located in the plurality of grooves (831) may vary as in the first example (801), the second example (802), or the third example (803). In the third example (803), the joint surface (830) between the first member (810) and the second member (820) may include a mechanical bond of a dovetail joint. In various embodiments, as shown in the cross-sectional view of FIG. 8, the plurality of grooves (831) of the first member (810) may be formed in substantially the same shape, but are not limited thereto. In various embodiments, as shown in the cross-sectional view of FIG. 8, the plurality of grooves (831) of the first member (810) may be arranged at a constant distance apart in a straight direction, but are not limited thereto.

[0194] According to various embodiments, the conductive adhesive member (4) of FIG. 4 may be a first member (810) comprising a plurality of grooves (831), and the first non-metallic member (51) of FIG. 4 may be a second member (820) comprising a plurality of protrusions (832). The third bonding surface (603) of the second bonding portion (6B) of FIG. 4 may include a mechanical bond including an anchor effect. The mechanical bond at the third bonding surface (603) of FIG. 4 may include an anchor effect in which, during the first molding for the first non-metallic member (51), the first molding liquid seeps into the plurality of grooves of the conductive adhesive member (4), hardens, and bonds with the conductive adhesive member (4). In various embodiments, a plurality of grooves of the conductive adhesive member (4) of the third bonding surface (603) of FIG. 4 may be formed by transferring the adhesive for the conductive adhesive member (4) through a film having an uneven surface (e.g., the film (1420) of FIG. 14c) when curing. The third bonding surface (603) of the second bonding portion (6B) of FIG. 4 may include a physical bond.

[0195] According to various embodiments, the first non-metallic member (51) of FIG. 4 may be a first member (810) comprising a plurality of grooves (831), and the second non-metallic member (52) of FIG. 4 may be a second member (820) comprising a plurality of protrusions (832). The sixth bonding surface (606) of the third bonding portion (6C) of FIG. 4 may include a mechanical bond including an anchor effect. The mechanical bond at the sixth bonding surface (606) of FIG. 4 may include an anchor effect in which, during secondary molding for the second non-metallic member (52), the second molding liquid seeps into the plurality of grooves of the first non-metallic member (51), hardens, and bonds with the first non-metallic member (51). In various embodiments, a plurality of grooves of the first non-metallic member (51) of the sixth bonding surface (606) of FIG. 4 may be formed by a mold in a primary molding for the first non-metallic member (51). A plurality of grooves of the first non-metallic member (51) of the sixth bonding surface (606) of FIG. 4 may be formed by transferring the molding surface of the mold in the primary molding. The sixth bonding surface (606) of the third bonding portion (6C) of FIG. 4 may include a physical bond.

[0196] According to various embodiments, the first metal part (31) of FIG. 4 may be a first member (810) comprising a plurality of grooves (831), and the second non-metal member (52) of FIG. 4 may be a second member (820) comprising a plurality of protrusions (832). The seventh bonding surface (607) of the third bonding part (6C) of FIG. 4 may include a mechanical bond including an anchor effect. The mechanical bond at the seventh bonding surface (607) of FIG. 4 may include an anchor effect in which, during secondary molding for the second non-metal member (52), the second molding liquid seeps into the plurality of grooves of the first metal part (31), hardens, and bonds to the first metal part (31). The seventh bonding surface (607) of the third bonding part (6C) of FIG. 4 may include a physical bond.

[0197] According to various embodiments, the second metal part (32) of FIG. 4 may be a first member (810) comprising a plurality of grooves (831), and the second non-metal member (52) of FIG. 4 may be a second member (820) comprising a plurality of protrusions (832). The eighth bonding surface (608) of the third bonding part (6C) of FIG. 4 may include a mechanical bond including an anchor effect. The mechanical bond at the eighth bonding surface (608) of FIG. 4 may include an anchor effect in which, during secondary molding for the second non-metal member (52), the second molding liquid seeps into the plurality of grooves of the second metal part (32), hardens, and bonds to the second metal part (32). The eighth bonding surface (608) of FIG. 4 may include a physical bond.

[0198] FIG. 9 is a cross-sectional view of a portion of a frame (14) cut along line B-B' of FIG. 3 and a portion of a conductive adhesive member (4) according to various embodiments of the present disclosure.

[0199] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIG. 9 is conceived and included. Any combination of features described below in connection with FIG. 9 may be considered to be included in this disclosure as specific examples.

[0200] Referring to FIG. 9, the frame (14) may include a first metal part (31), a second metal part (32), and a conductive adhesive member (4). The frame (14) may include a first non-metal member (51) and a second non-metal member (52). The frame (14) may include a first joint part (6A). The first joint part (6A) may include a first joint surface (601), a second joint surface (602), and a conductive adhesive member (4).

[0201] According to various embodiments, the conductive adhesive member (4) may include an opening (901). The opening (901) may be, for example, a straight opening (e.g., an opening extended in a straight direction) when viewed in the negative direction of the x-axis, but is not limited thereto.

[0202] According to various embodiments, the second bonding surface (602) of the second metal part (32) may include a recess (902). A conductive adhesive member (4) may be positioned in the recess (902).

[0203] FIG. 10 is a cross-sectional view of a portion of a frame (14) cut along line B-B' of FIG. 3 and a portion of a conductive adhesive member (4) according to various embodiments of the present disclosure.

[0204] It may be understood in this disclosure that all combinations of features and / or embodiments disclosed in connection with FIG. 10 are conceived and included. All combinations of features described below in connection with FIG. 10 may be considered to be included in this disclosure as specific examples.

[0205] Referring to FIG. 10, the frame (14) may include a first metal part (31), a second metal part (32), and a conductive adhesive member (4). The frame (14) may include a first non-metal member (51) and a second non-metal member (52). The frame (14) may include a first joint part (6A). The first joint part (6A) may include a first joint surface (601), a second joint surface (602), and a conductive adhesive member (4).

[0206] According to various embodiments, the conductive adhesive member (4) may include a plurality of openings (1001). The plurality of openings (1001) may be circular when viewed in the negative direction of the x-axis, for example, but are not limited thereto.

[0207] According to various embodiments, when viewed in the negative direction of the x-axis, the second bonding surface (602) of the second metal part (32) may include a plurality of recesses (1002) aligned (or overlapping) with a plurality of openings (1001) of the conductive adhesive member (4).

[0208] FIG. 11 is a cross-sectional view of a portion of a frame (14) cut along line B-B' of FIG. 3 and a portion of a conductive adhesive member (4) according to various embodiments of the present disclosure.

[0209] It may be understood in this disclosure that all combinations of features and / or embodiments disclosed in connection with FIG. 11 are conceived and included. All combinations of features described below in connection with FIG. 11 may be considered to be included in this disclosure as specific examples.

[0210] Referring to FIG. 11, the frame (14) may include a first metal part (31), a second metal part (32), and a conductive adhesive member (4). The frame (14) may include a first non-metal member (51) and a second non-metal member (52). The frame (14) may include a first joint part (6A). The first joint part (6A) may include a first joint surface (601), a second joint surface (602), and a conductive adhesive member (4).

[0211] According to various embodiments, the conductive adhesive member (4) may include a plurality of openings (1101). The plurality of openings (1001) may be circular when viewed in the negative direction of the x-axis, for example, but are not limited thereto.

[0212] According to various embodiments, the second bonding surface (602) of the second metal part (32) may include a plurality of recesses (1102) aligned (or overlapping) with a plurality of openings (1101) of the conductive adhesive member (4). The plurality of recesses (1102) may be provided (or formed) by, for example, a concave curved surface relative to the plurality of recesses (1002) according to the example of FIG. 10, but are not limited thereto.

[0213] According to various embodiments, although not separately illustrated, the shape of the conductive adhesive member (4) and the shape of the second bonding surface (602) of the second metal part (32) may vary and are not limited to the examples of FIG. 9, 10, or 11. The shape of the conductive adhesive member (4) and the shape of the second bonding surface (602) of the second metal part (32) may be implemented to improve the physical and electrical connection between the first metal part (31) and the second metal part (32) while reducing the amount of conductive adhesive member (4) used.

[0214] FIG. 12 shows a flowchart of a method for manufacturing a frame according to various embodiments of the present disclosure.

[0215] FIGS. 13, 14a, 14b, 14c, 15a, 15b, 16a, 16b, 17, 18a, 18b, and 19 are drawings for explaining each process of the flowchart of FIG. 12 according to various embodiments of the present disclosure.

[0216] In describing the method of manufacturing the frame, the shape of at least one structural element may change as it undergoes at least one external processing (e.g., cutting), but the name and reference numeral referring to at least one structural element are used identically. The cross-sectional view of FIG. 14b, the cross-sectional views of FIG. 14c, the cross-sectional view of FIG. 15b, the cross-sectional view of FIG. 16b, the cross-sectional view of FIG. 17, the cross-sectional view of FIG. 18b, and the cross-sectional view of FIG. 19 may be understood to be for the same location (e.g., the location corresponding to line A-A' in FIG. 3) to show the structural change as it undergoes the processes.

[0217] Referring to FIGS. 12 and 13, in operation 1201, a first base metal (also called parent metal) (1310) and a second base metal (1320) may be formed. The first base metal (1310) may serve as the base of the first metal part (31) of FIG. 4. The second base metal (1320) may serve as the base of the second metal part (32) of FIG. 4. The first base metal (1310) and / or the second base metal (1320) may be formed through processing methods such as CNC machining, casting, or pressing, but are not limited thereto.

[0218] Referring to FIGS. 12, 14a, and 14b, in operation 1203, a first base material (1310) and a second base material (1320) are bonded through a conductive adhesive member (1330) (e.g., the conductive adhesive member (4) of FIG. 4), and a first uneven adhesive surface (1901) for primary molding may be formed on the conductive adhesive member (1330). The first uneven adhesive surface (1901) may be a surface of the conductive adhesive member (4) comprising a plurality of grooves at the third bonding surface (603) of the second bonding portion (6B) of FIG. 4. Through operation 1203, a primary structure (1400) comprising the first base material (1310), the second base material (1320), and the conductive adhesive member (1330) may be formed.

[0219] A method for forming the first uneven adhesive surface (1901) of the conductive adhesive member (4) will be described with reference to FIG. 14c. Referring to FIG. 14c, after placing (e.g., applying) the adhesive (1410) for the conductive adhesive member (1330) between the first base material (1310) and the second base material (1320), a film (1420) having an uneven surface can be placed on the adhesive (1410). The film (1420) having an uneven surface may be an uneven film or a pattern film having an uneven pattern. After curing the adhesive (1410) and separating the film (1420), a conductive adhesive member (1330) including the first uneven adhesive surface (1901) on which the uneven pattern of the film (1420) is transferred can be formed.

[0220] According to various embodiments, the first uneven adhesive surface (1901) of the conductive adhesive member (1330) may be formed by hatching using a laser after curing the adhesive (1410), but the method of forming the first uneven adhesive surface (1901) is not limited thereto and may be various.

[0221] According to various embodiments, the manufacturing method may further include shaping the first base material (1310) and / or the second base material (1320) as an operation between operation 1201 and operation 1203. By shaping, a space (e.g., a molding space for the conductive adhesive member (1330)) may be formed between the first base material (1310) and the second base material (1320) to be disposed therein.

[0222] Referring to FIGS. 12, 15a, and 15b, in operation 1205, a first molding portion (1340) may be formed by first molding, which is joined to a first base material (1310), a second base material (1320), and a conductive adhesive member (1330), and includes a second uneven adhesive surface (1902) for second molding. The first molding portion (1340) may serve as the base for the first non-metallic member (51) of FIG. 4. The first molding may include insert injection molding. In the first molding, for example, a first structure (also called a first insert structure) (1400) (see FIG. 14a) comprising a first base material (1310), a second base material (1320), and a conductive adhesive member (1330) is positioned inside a mold, a first molding liquid (e.g., a first molten resin) is injected into the mold, the injected first molding liquid is cooled (or cured), and a molded product is taken out from the mold, thereby forming a first molding part (1340) bonded to the first structure (1400) (see FIG. 14a). A second uneven adhesive surface (1902) of the first molding part (1340) can be formed by the mold in the first molding. The second uneven adhesive surface (1902) of the first molding part (1340) can be formed by transferring the molding surface of the mold in the first molding. Through the operation 1205, a second structure (1500) including the first structure (1400) (see FIG. 14a) and the first molding part (1340) can be formed.

[0223] According to various embodiments, the first molding liquid of the first molding may include a thermosetting resin or a thermoplastic resin. The first molding liquid of the first molding may include, for example, PC (polycarbonate), PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), PA (polyamide), PPA (polyphthalamide), PET (polyethylene terephthalate), PEEK (polyetheretherketone), or PPSU (polyphenylene sulfone), but is not limited thereto.

[0224] According to various embodiments, when the first molding liquid of the first molding is a thermosetting resin, inorganic material (e.g., inorganic material) may not be added to the first molding liquid of the first molding. Not adding inorganic material to the first molding liquid of the first molding (or, the first molding liquid does not contain inorganic material) improves the fluidity and permeability of the first molding liquid during the first molding, thereby making it easier to form a structure in which the first non-metallic member (51) (see FIG. 4) protects the conductive adhesive member (1330) more firmly.

[0225] According to various embodiments, the first molding liquid of the first molding may have a smaller amount of mineral than the second molding liquid of the second molding.

[0226] According to various embodiments, the first molding part (1340) can increase or supplement the bonding strength between the first base material (1310) and the second base material (1320). The first molding part (1340) can supplement the brittleness of the conductive adhesive member (1330).

[0227] According to various embodiments, the first molding part (1340) can protect the conductive adhesive member (1330). The first molding part (1340) can cover the conductive adhesive member (1330) so that at least a portion of the conductive adhesive member (1330) is not exposed to the outside. During the manufacturing process, the first molding part (1340) can reduce or prevent damage or breakage of the conductive adhesive member (1330) from the external environment. Since the first molding part (1340) protects the conductive adhesive member (1330), it can reduce or prevent the bonding strength between the first base material (1310) and the second base material (1320) from being reduced due to the external environment. The first molding part (1340) can reduce or prevent deformation or breakage of the conductive adhesive member (1330) from impact (e.g., cutting impact) or heat that may occur during at least one process, such as external shape processing, during the manufacturing process. The first molding part (1340) can reduce or prevent contamination of the conductive adhesive member (1330) during the manufacturing process.

[0228] Referring to FIGS. 12, 16a, and 16b, in operation 1207, a primary shape processing (e.g., cutting) may be performed. The primary shape processing may include, but is not limited to, CNC machining. A tertiary structure (1600) may be formed by the primary shape processing of a secondary structure (1500) (see FIG. 15a). The primary shape processing may form a tertiary structure (1600) which is a second insert structure to be positioned within the mold during secondary molding.

[0229] Referring to FIGS. 12 and 17, in operation 1209, a third uneven adhesive surface (1903) for the second molding may be formed on the first base material (1310), and a fourth uneven adhesive surface (1904) for the second molding may be formed on the second base material (1320). A fourth structure (1700) may be formed by operation 1209.

[0230] According to various embodiments, the third uneven adhesive surface (1903) of the first base material (1310) and the fourth uneven adhesive surface (1904) of the second base material (1320) may be formed through chemical surface treatment. For example, the first base material (1310) may include an oxide film (e.g., a TRI film formed through a TRI system) including the third uneven adhesive surface (1903) through anodizing. For example, the second base material (1320) may include an oxide film (e.g., a TRI film formed through a TRI system) including the fourth uneven adhesive surface (1904) through anodizing.

[0231] According to various embodiments, the third uneven adhesive surface (1903) of the first base material (1310) and / or the fourth uneven adhesive surface (1904) of the second base material (1320) may be formed by hatching using a laser, but the method of forming the third uneven adhesive surface (1903) and / or the fourth uneven adhesive surface (1904) is not limited thereto and may vary.

[0232] Referring to FIGS. 12, 18a, and 18b, in operation 1211, a first base material (1310), a second base material (1320), and a second molding part (1350) joined to the first molding part (1340) can be formed through secondary molding. The second molding part (1350) can serve as the base for the second non-metallic member (52) of FIG. 4. The secondary molding may include insert injection molding. A second molding process may be performed by, for example, positioning a fourth structure (1700) (also called a second insert structure) (see FIG. 17) inside a mold, injecting a second molding liquid (e.g., a second molten resin) into the mold, cooling (or curing) the injected second molding liquid, and removing the molded product from the mold to form a third structure (1700) (see FIG. 17) and a second molding part (1350) bonded to the third structure (1700). Through this operation, a fourth structure (1800) comprising the third structure (1700) (see FIG. 17) and a first molding part (1340) may be formed.

[0233] According to various embodiments, the second molding liquid of the secondary molding may include a thermoplastic resin. The second molding liquid of the secondary molding may include, for example, PC, PBT, PPS, PA, PPA, PET, PEEK, or PPSU, but is not limited thereto.

[0234] According to various embodiments, the second molding liquid of the second molding may be to which inorganic materials such as GF (glass fiber), CA (carbon fiber), or Talc are added. The inorganic materials added to the second molding liquid of the second molding may improve the impact resistance and / or durability of the second molding part (1350).

[0235] According to various embodiments, physical properties such as viscosity and temperature of the first molding liquid of the first molding may vary depending on the conditions of the first molding. Physical properties such as viscosity and temperature of the second molding liquid of the second molding may vary depending on the conditions of the second molding. For example, the first molding liquid of the first molding may have a higher viscosity than the second molding liquid of the second molding.

[0236] According to various embodiments, the first resin for forming the first molding liquid may have a higher viscosity than the second resin for forming the second molding liquid due to material characteristics under the same conditions. The first resin for the first molding liquid of the first molding and the second resin for the second molding liquid of the second molding may have different melt flow indices (MFI) due to material characteristics. The melt flow index acts as one of the most important factors when processing the material regarding the melting characteristics of the polymer material, and can be understood as a value indicating the discharge amount (or flowability) of the resin per unit time. For example, the second resin may contain added inorganic GF. Since GF hinders flow in the molten state, the second resin may have different melt flow indices in the molten state depending on the content of GF. For example, the higher the content of GF, the more the second resin may have a melt flow index with reduced fluidity in the molten state. According to various embodiments of the present disclosure, the first resin may have a higher GF content compared to the second resin and may have a melt flow index with relatively low fluidity in the molten state compared to the second resin. According to various embodiments of the present disclosure, the second resin may have a lower GF content compared to the first resin and may have a melt flow index with relatively high fluidity in the molten state compared to the first resin. For example, the first resin may have a GF content of about 40%, and the second resin may have a GF content of about 30%.

[0237] Referring to FIGS. 12 and 19, in operation 1213, a secondary shape processing (e.g., cutting) may be performed. The secondary shape processing may include, but is not limited to, CNC machining. A frame (1900) (e.g., the frame (14) of FIG. 3) may be substantially formed by the secondary shape processing of the quaternary structure (1800) (see FIG. 18a).

[0238] According to various embodiments, although not separately illustrated, the manufacturing method may further include various processes such as surface treatment.

[0239] According to various embodiments, although not separately illustrated, the technical features of the present disclosure may be applied to structural elements (e.g., a frame, or at least a part of a housing) included in electronic devices of other shapes (e.g., a plate type electronic device, a foldable electronic device, a slideable electronic device, a stretchable electronic device, or a rollable electronic device) that are not limited to a bar type electronic device (e.g., the electronic device (1) of FIG. 1).

[0240] According to various embodiments, although not otherwise illustrated, a foldable electronic device may include a first housing (or a first frame), a second housing (or a second frame), and a hinge module (also referred to as a hinge assembly, a hinge portion, or a hinge structure) rotatably connecting the first housing and the second housing. In an example of an in-folding type foldable electronic device in which a screen (or flexible display module) is implemented to fold inward, the foldable electronic device may include a hinge cover (referred to as a hinge housing) coupled to the hinge module. The hinge cover may not be visually exposed in the unfolded state of the foldable electronic device. In the folded state of the foldable electronic device, the hinge cover may be visually exposed through a gap between the first housing and the second housing to provide (or form) part of the appearance of the foldable electronic device. In an example of an in-folding type foldable electronic device in which a screen is implemented to fold outward, the hinge cover may be omitted. The first housing may include a first side portion forming at least a portion of the first side of the first housing, and a first support portion located within the first housing and connected to the first side portion. The second housing may include a second side portion forming at least a portion of the second side of the second housing, and a second support portion located within the second housing and connected to the second side portion. According to various embodiments, the technical features of the present disclosure may be applied to a joining structure between the first side portion and the first support portion. According to various embodiments, they may be applied to a joining structure between the second side portion and the second support portion.

[0241] According to various embodiments, although not otherwise illustrated, a foldable electronic device may be implemented as a multi-foldable electronic device configured such that a plurality of housings (e.g., a first housing, a second housing, and a third housing) (e.g., a first frame, a second frame, and a third frame) overlap each other in a folded state of the foldable electronic device. In an example in which the multi-foldable electronic device comprises a first housing, a second housing, and a third housing, the first housing and the second housing may be rotatably connected through a first hinge module (also referred to as a first hinge assembly, a first hinge part, or a first hinge structure), and the second housing and the third housing may be rotatably connected through a second hinge module (also referred to as a second hinge assembly, a second hinge part, or a second hinge structure). In the folded state of the multi-foldable electronic device, the second housing may be positioned between the first housing and the third housing, such that the first housing, the second housing, and the third housing are stacked on top of each other. Depending on the direction in which the multi-foldable electronic device is folded, the device may include a first hinge cover (also referred to as the first hinge housing) coupled to the first hinge module or a second hinge cover (also referred to as the second hinge housing) coupled to the second hinge module so that the first hinge module or the second hinge module is not visually exposed. The first housing may include a first side portion forming at least a portion of the first side of the first housing, and a first support portion located within the first housing and connected to the first side portion. The second housing may include a second side portion forming at least a portion of the second side of the second housing, and a second support portion located within the second housing and connected to the second side portion. The third housing may include a third side portion forming at least a portion of the third side of the third housing, and a third support portion located within the third housing and connected to the third side portion.According to various embodiments, the technical features of the present disclosure may be applied to a joining structure between a first side member and a first support member. According to various embodiments, the technical features of the present disclosure may be applied to a joining structure between a second side member and a second support member. According to various embodiments, the technical features of the present disclosure may be applied to a joining structure between a third side member and a third support member.

[0242] According to various embodiments of the present disclosure, a frame (e.g., frame (14)) of an electronic device (e.g., electronic device (1)) comprises a first metal part (e.g., first metal part (31)), a second metal part (e.g., second metal part (32)), a conductive adhesive member (e.g., conductive adhesive member (4)), a first non-metal part (e.g., first non-metal part (51)), and a second non-metal part (e.g., second non-metal part (52)). The first metal part forms at least a portion of the side of the electronic device (e.g., side (10C)). The second metal part is located inside the electronic device. A conductive adhesive member is disposed between the first metal part and the second metal part. A first non-metal member is located inside the electronic device and is bonded to the conductive adhesive member, the first metal part, and the second metal part. The second non-metal member is located at least partially inside the electronic device and is bonded to the first non-metal member, the first metal part, and the second metal part. The bonding surface (e.g., the fifth bonding surface (605)) between the conductive adhesive member and the first non-metal member includes irregularities.

[0243] According to various embodiments of the present disclosure, a first non-metallic member (e.g., the first non-metallic member (51)) can cover a conductive adhesive member (e.g., a conductive adhesive member (4)) so that the conductive adhesive member is not exposed to the outside.

[0244] According to various embodiments of the present disclosure, a first metal part (e.g., first metal part (31)) may include a key hole (e.g., first key hole (701)) in which a side key (e.g., first key (212)) is located. A conductive adhesive member (e.g., conductive adhesive member (4)) may not extend into the key hole so as not to be exposed to the outside through the key hole.

[0245] According to various embodiments of the present disclosure, the irregularities included in the bonding surface (e.g., fifth bonding surface (605)) between the conductive adhesive member (e.g., conductive adhesive member (4)) and the first non-metallic member (e.g., first non-metallic member (51)) may include a plurality of grooves formed in the conductive adhesive member and a plurality of protrusions of the first non-metallic member inserted into the plurality of grooves of the conductive adhesive member.

[0246] According to various embodiments of the present disclosure, a plurality of grooves of a conductive adhesive member (e.g., conductive adhesive member (4)) can be formed by transfer by a film having an uneven surface (e.g., film (1420)).

[0247] According to various embodiments of the present disclosure, the bonding surface (e.g., sixth bonding surface (606)) between the first non-metallic member (e.g., first non-metallic member (51)) and the second non-metallic member (e.g., second non-metallic member (52)) may include irregularities.

[0248] According to various embodiments of the present disclosure, a first non-metallic member (e.g., a first non-metallic member (51)) may be formed through primary molding. A second non-metallic member (e.g., a second non-metallic member (52)) may be formed through secondary molding. The irregularities included in the joining surface (e.g., a sixth joining surface (606)) between the first non-metallic member and the second non-metallic member may include a plurality of grooves formed in the first non-metallic member through primary molding, and a plurality of protrusions of the second non-metallic member inserted into the plurality of grooves of the first non-metallic member.

[0249] According to various embodiments of the present disclosure, the bonding surface (e.g., seventh bonding surface (607)) between the second non-metallic member (e.g., second non-metallic member (52)) and the first metal part (e.g., first metal part (31)), and the bonding surface (e.g., eighth bonding surface (608)) between the second non-metallic member and the second metal part (e.g., second metal part (32)) may include irregularities.

[0250] According to various embodiments of the present disclosure, the irregularities included in the joining surface (e.g., seventh joining surface (607)) between the second non-metallic member (e.g., second non-metallic member (52)) and the first metal part (e.g., first metal part (31)), and the joining surface (e.g., eighth joining surface (608)) between the second non-metallic member and the second metal part (e.g., second metal part (32)) may include a plurality of pores formed in the first metal part and the second metal part, and a plurality of protrusions of the second non-metallic member inserted into the plurality of pores.

[0251] According to various embodiments of the present disclosure, a plurality of pores formed in a first metal part (e.g., the first metal part (31)) and a second metal part (e.g., the second metal part (32)) can be formed through anodizing.

[0252] According to various embodiments of the present disclosure, the first nonmetallic member (e.g., the first nonmetallic member (51)) may not contain inorganic material or may have a lower inorganic content than the second nonmetallic member (e.g., the second nonmetallic member (52)).

[0253] According to various embodiments of the present disclosure, the first metal part (e.g., the first metal part (31)) may be formed of titanium, and the second metal part (e.g., the second metal part (32)) may be formed of aluminum.

[0254] According to various embodiments of the present disclosure, a portion of the second non-metallic member (e.g., the second non-metallic member (52)) is located in at least one segment formed in the first metal part (e.g., the first metal part (31)) and can form a side of the electronic device (e.g., the side (10C)) together with the first metal part.

[0255] According to various embodiments of the present disclosure, a conductive adhesive member (e.g., conductive adhesive member (4)) may include a plurality of openings (e.g., a plurality of openings (1001)). A second metal part (e.g., a second metal part (32)) may include a plurality of recesses (e.g., a plurality of recesses (1002)) aligned with the plurality of openings of the conductive adhesive member.

[0256] According to various embodiments of the present disclosure, a method for manufacturing a frame (e.g., frame (14)) includes an operation (e.g., operation 1201) of forming a first base material (e.g., first base material (1310)) and a second base material (e.g., second base material (1320)). The method for manufacturing the frame includes joining the first base material and the second base material through a conductive adhesive member (e.g., conductive adhesive member (1330)) and forming a first uneven adhesive surface (e.g., first uneven adhesive surface (1901)) for a primary molding on the conductive adhesive member (e.g., operation 1203). A method for manufacturing a frame includes an action (e.g., action 1205) of forming a first molding part (e.g., first molding part (1340)) that is joined to a first base material, a second base material, and a conductive adhesive member through a first molding and includes a second uneven adhesive surface (e.g., second uneven adhesive surface (1902)) for a second molding. A method for manufacturing a frame includes an action (e.g., action 1209) of forming a third uneven adhesive surface (e.g., third uneven adhesive surface (1903)) for a second molding on the first base material and forming a fourth uneven adhesive surface (e.g., fourth uneven adhesive surface (1904)) for a second molding on the second base material. A method for manufacturing a frame includes an operation (e.g., operation 1211) of forming a first base material, a second base material, and a second molding part (e.g., second molding part (1350)) joined to the first molding part through secondary molding.

[0257] According to various embodiments of the present disclosure, a first molding part (e.g., the first molding part (1340)) can cover a conductive adhesive member (e.g., the conductive adhesive member (1330)) so that the conductive adhesive member is not exposed to the outside.

[0258] According to various embodiments of the present disclosure, a first uneven adhesive surface (e.g., first uneven adhesive surface (1901)) of a conductive adhesive member (e.g., conductive adhesive member (1330)) may be formed by transfer by a film having an uneven surface (e.g., film (1420)).

[0259] According to various embodiments of the present disclosure, a third uneven adhesive surface (e.g., a third uneven adhesive surface (1903)) and a fourth uneven adhesive surface (e.g., a fourth uneven adhesive surface (1904)) may be formed through anodizing.

[0260] According to various embodiments of the present disclosure, the first molding liquid of the first molding may not contain inorganic material or may have a smaller amount of inorganic material than the second molding liquid of the second molding.

[0261] According to various embodiments of the present disclosure, the first molding liquid of the primary molding may include a thermosetting resin.

[0262] The embodiments disclosed in this disclosure and the drawings are provided merely as examples to facilitate the explanation of the technical content and to aid in understanding this disclosure, and are not intended to limit the scope of this disclosure. Accordingly, it should be understood that the scope of the various embodiments of this disclosure includes modifications or variations other than those disclosed herein. Additionally, it will be understood that any embodiment(s) described herein may be used in conjunction with any other embodiment(s) described herein. For example, this disclosure is presented in the form of providing multiple embodiments each defining a number of features, but it is emphasized that some of these embodiments are connected only by reference to the same drawings or drawings. This disclosure should be understood to include all combinations of these embodiments, unless there is an obvious contradiction between two (or more) embodiments. For example, where features are presented as optional in this disclosure, all combinations of such optional features are included in this disclosure.

Claims

In the frame (14) of the electronic device (1), A first metal part (31) forming at least a portion of the side (10C) of the electronic device (1); A second metal part (32) located inside the electronic device (1); A conductive adhesive member (4) disposed between the first metal part (31) and the second metal part (32); A first non-metallic member (51) located inside the electronic device (1) and bonded to the conductive adhesive member (4), the first metal part (31), and the second metal part (32); and It comprises a second non-metallic member (52) that is located at least partially inside the electronic device (1) and is joined to the first non-metallic member (51), the first metal part (31), and the second metal part (32). The bonding surface (605) between the conductive adhesive member (4) and the first non-metallic member (51) is a frame including irregularities. In Article 1, The first non-metallic member (51) is a frame that covers the conductive adhesive member (4) so ​​that the conductive adhesive member (4) is not exposed to the outside. In Article 1, The first metal part (31) includes a key hole (701) in which a side key (212) is located, and The above conductive adhesive member (4) is a frame that does not extend into the key hole (701) so as not to be exposed to the outside through the key hole (701). In Article 1, The irregularities included in the bonding surface (605) between the conductive adhesive member (4) and the first non-metallic member (51) are, A plurality of grooves formed in the conductive adhesive member (4), and A frame comprising a plurality of protrusions of the first non-metallic member (51) inserted into the plurality of grooves of the conductive adhesive member (4). In Article 4, The plurality of grooves of the conductive adhesive member (4) are a frame formed by transfer by a film (1420) having an uneven surface. In Article 1, The joining surface (606) between the first non-metallic member (51) and the second non-metallic member (52) is a frame including irregularities. In Article 6, The first non-metallic member (51) is formed through primary molding, and The second non-metallic member (52) is formed through secondary molding, and The irregularities included in the joining surface (606) between the first non-metallic member (51) and the second non-metallic member (52) are, A plurality of grooves formed in the first non-metallic member (51) through the first molding, and A frame comprising a plurality of protrusions of the second non-metallic member (52) inserted into the plurality of grooves of the first non-metallic member (51). In Article 1, The joint surface (607) between the second non-metallic member (52) and the first metal part (31), and the joint surface (608) between the second non-metallic member (52) and the second metal part (32) are a frame including irregularities. In Article 8, The irregularities included in the joining surface (607) between the second non-metallic member (52) and the first metal part (31), and the joining surface (608) between the second non-metallic member (52) and the second metal part (32), are A plurality of pores formed in the first metal part (31) and the second metal part (32), and A frame comprising a plurality of protrusions of the second non-metallic member (52) inserted into the plurality of pores of the first metal part (31) and the second metal part (32). In Article 9, The plurality of pores formed in the first metal part (31) and the second metal part (32) are a frame formed through anodizing. In Article 1, The first non-metallic member (51) is a frame that does not contain inorganic material or has a lower inorganic content than the second non-metallic member (52). In Article 1, A frame in which the first metal part (31) is formed of titanium and the second metal part (32) is formed of aluminum. In Article 1, A portion of the second non-metallic member (52) is located in at least one segment formed in the first metal part (31), and together with the first metal part (31), forms the side (10C) of the electronic device (1) frame. In Article 1, The conductive adhesive member (4) comprises a plurality of openings (1001), and the second metal part (32) comprises a plurality of recesses (1002) aligned with the plurality of openings (1001) of the conductive adhesive member (4). In the method of manufacturing the frame (14), Operation (1201) of forming the first base material (1310) and the second base material (1320); The operation (1203) of joining the first base material (1310) and the second base material (1320) through a conductive adhesive member (1330) and forming a first uneven adhesive surface (1901) for the first molding on the conductive adhesive member (1330); An operation (1205) of forming a first molding part (1340) that is joined to the first base material (1310), the second base material (1320), and the conductive adhesive member (1330) through the first molding above, and includes a second uneven adhesive surface (1902) for the second molding; The operation (1209) of forming a third uneven adhesive surface (1903) for the second molding on the first base material (1310) and forming a fourth uneven adhesive surface (1904) for the second molding on the second base material (1320); and A method comprising the operation (1211) of forming the first base material (1310), the second base material (1320), and the second molding part (1350) joined to the first molding part (1340) through the second molding above.

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