Foldable electronic device comprising fpcb

Abstract

According to one embodiment of the present disclosure, a foldable electronic device may be provided. The foldable electronic device comprises: a first housing including a flexible printed circuit board (FPCB) and a first component; a second housing including a second component; a hinge assembly rotatably connecting the first housing and the second housing; a flexible display disposed from the first housing to the second housing across a folding area in which the hinge assembly is disposed; and a flexible printed circuit board (FPCB) electrically connecting the first component and the second component, including a plurality of layers, and including a flex portion corresponding to the folding area and a rigid portion at one end and the other end of the flex portion. In addition, a signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board includes a metal material, and includes a first area, a second area, and a third area divided according to the degree of bending in the folding area of the flexible printed circuit board. At least one of the plurality of layers may be formed so that the metal material has different thicknesses in the first area, the second area, and the third area on the same layer. Various other embodiments are also applicable.

Description

Foldable electronic device including FPCB

[0001] Various embodiments of the present disclosure relate to electronic devices, for example, electronic devices including an FPCB.

[0002] Driven by remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. Recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" may refer to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and vehicle navigation systems. For example, these electronic devices can output stored information as sound or video.

[0004] With the increasing integration density of electronic devices and the widespread adoption of high-speed, high-capacity wireless communication, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For example, not only communication functions but also entertainment functions like games, multimedia functions like music and video playback, communication and security functions like mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can carry them conveniently.

[0005] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0006] According to one embodiment of the present disclosure, a foldable electronic device may be provided. The foldable electronic device may include a flexible printed circuit board (FPCB) and a first housing including a first component; a second housing including a second component; a hinge assembly rotatably connecting the first housing and the second housing; a flexible display disposed from the first housing to the second housing across a folding region where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) that electrically connects the first component and the second component and includes a plurality of layers, a flex portion corresponding to the folding region, and a rigid portion at one end and the other end of the flex portion. In addition, the signal line for transmitting signals and / or power included in the plurality of layers of the flexible printed circuit board comprises a metallic material and includes a first region, a second region, and a third region distinguished according to the degree of curvature in the folding region of the flexible printed circuit board, and at least one of the plurality of layers may be formed such that the metallic material has different thicknesses in the first region, the second region, and the third region on the same layer.

[0007] A foldable electronic device may include a flexible printed circuit board (FPCB), a first housing including a first component; a second housing including a second component; a hinge assembly rotatably connecting the first housing and the second housing; a flexible display disposed from the first housing to the second housing across a folding area where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) that electrically connects the first component and the second component and includes a plurality of layers, a flex portion corresponding to the folding area, and a rigid portion at one end and the other end of the flex portion. And, a signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board comprises a metal material and includes a first region, a second region and a third region distinguished according to the degree of bending in the folding region of the flexible printed circuit board, wherein the first region corresponds to a flex portion in the flexible printed circuit board where the signal line is bent, and the metal material of the first region is formed to have the thinnest thickness among the first region, the second region and the third region, and the third region corresponds to a rigid portion in the flexible printed circuit board where the signal line is placed flat, and the metal material of the third region is formed to have the thickest thickness among the first region, the second region and the third region, and the metal material of the second region may be formed to be thicker than the thickness of the metal material of the first region and thinner than the thickness of the metal material of the third region.

[0008] A foldable electronic device may include a flexible printed circuit board (FPCB), a first housing including a first component; a second housing including a second component; a hinge assembly rotatably connecting the first housing and the second housing; a flexible display disposed from the first housing to the second housing across a folding area where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) that electrically connects the first component and the second component and includes a plurality of layers, a flex portion corresponding to the folding area, and a rigid portion at one end and the other end of the flex portion. In addition, the signal line for transmitting signals and / or power included in the plurality of layers of the flexible printed circuit board includes a metallic material and includes a first region, a second region, and a third region distinguished according to the degree of curvature in the folding region of the flexible printed circuit board, wherein the third region is formed to have a thicker thickness than the first region and the second region in the layer formed at the outermost edge of the flexible printed circuit board among the plurality of layers, and the layer disposed inside the two layers formed at the outermost edge of the flexible printed circuit board among the plurality of layers may be formed such that the metallic material included in the signal line in the first region and the second region has different thicknesses.

[0009] According to one embodiment of the present disclosure, a method for manufacturing a flexible printed circuit board is provided. A method for manufacturing a flexible printed circuit board for connecting a first component and a second component within a foldable electronic device may include: providing a plurality of layers for a flexible printed circuit board, wherein at least one of the plurality of layers comprises a signal line for signal and / or power transmission comprising a metal material; processing the flexible printed circuit board, wherein the processing of the flexible printed circuit board defines a first region, a second region, and a third region classified according to the degree of bending within a folding region corresponding to a folding region of a foldable electronic device; and processing the metal material such that the first region, the second region, and the third region on the same layer within at least one layer have different thicknesses.

[0010] The aspects, configurations, and / or advantages described above regarding one embodiment of the present disclosure may become more apparent from the following detailed description with reference to the accompanying drawings.

[0011] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment of the present disclosure.

[0012] FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0013] FIG. 3 is a front view, a side view, and a rear view of a folded state of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 4 is an exploded perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0015] FIG. 5 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 6 is an enlarged cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 7 is a perspective view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0018] FIG. 8 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 9 is a front view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0020] FIG. 10 shows a cross-sectional view of a flexible printed circuit board according to one embodiment.

[0021] FIG. 11 shows a cross-sectional view of a flexible printed circuit board according to one embodiment.

[0022] FIG. 12 shows a cross-sectional view of a flexible printed circuit board according to one embodiment.

[0023] FIG. 13 shows a cross-sectional view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0024] FIG. 14 shows an X-ray photograph of a flexible printed circuit board according to one embodiment of the present disclosure.

[0025] FIG. 15 shows a cross-sectional view of a flexible printed circuit board according to one embodiment.

[0026] FIG. 16 is a cross-sectional view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0027] FIG. 17 is a drawing showing a manufacturing method according to one embodiment of the present disclosure.

[0028] FIG. 18 is a drawing showing a manufacturing method according to one embodiment of the present disclosure.

[0029] FIG. 19 is a drawing showing a manufacturing method according to one embodiment of the present disclosure.

[0030] FIG. 20 is a drawing showing a manufacturing method according to one embodiment of the present disclosure.

[0031] Throughout the attached drawings, similar parts, configurations, and / or structures may be assigned similar reference numbers.

[0032] A foldable electronic device includes a plurality of electronic components, and the plurality of electronic components may be spaced apart from each other within the foldable housing of the foldable electronic device. For the transmission of signals and / or power between the spaced-apart electronic components, a flexible printed circuit board (FPCB) including signal lines may be used. For example, the flexible printed circuit board may be positioned to cross the hinge assembly (or hinge module, hinge structure) of the foldable electronic device, and a repetitive bending motion may be performed at the portion of the flexible printed circuit board corresponding to the hinge assembly.

[0033] Flexible printed circuit boards are required to possess high durability to ensure a long service life even under repeated bending. The signal lines included in flexible printed circuit boards are primarily composed of metal layers, such as copper; the thinner the metal layer and the thicker the insulating layer surrounding it, the higher the durability. The use of metallic materials in signal lines can provide the conductivity required for the power and high-speed signal transmission needed in electronic devices. However, if the metal layer is thin, the resistance is high, making it difficult to provide signal lines with stable and high transmission efficiency.

[0034] For example, when supplying power from a battery to other electronic components inside a foldable electronic device, the thickness of the metal layer may need to be secured to a certain thickness or greater to ensure stable power supply and high transmission efficiency. However, forming a thick metal layer runs counter to the trend of miniaturization of foldable electronic devices and involves a trade-off with the durability of the flexible printed circuit board; therefore, caution is required in the design of the flexible printed circuit board.

[0035] The present disclosure aims to provide a flexible printed circuit board capable of transmitting signals and / or power reliably and efficiently while having high durability, and an electronic device including the same (e.g., a foldable electronic device).

[0036] One embodiment of the present disclosure is intended to at least resolve the problems and / or disadvantages described above and at least provide the advantages described below, and can provide a miniaturized connector and / or an electronic device including the same (e.g., a foldable electronic device) that is easy to miniaturize and / or water-resistant.

[0037] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which this disclosure belongs from the description below.

[0038] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described in the present disclosure may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0039] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0040] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0041] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment of the present disclosure.

[0042] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0043] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0044] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0045] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0046] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0047] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0048] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0049] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0050] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0051] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0052] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0053] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0054] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0055] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0056] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0057] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0058] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0059] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0060] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0061] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0062] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0063] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0064] The electronic device according to the various embodiments of the present disclosure may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of the present disclosure is not limited to the devices described above.

[0065] The various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, each of phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationally,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0066] The term “module” as used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0067] Various embodiments of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0068] According to one embodiment, the method according to various embodiments of the present disclosure may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0069] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0070] FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device (101) according to one embodiment of the present disclosure. FIG. 3 illustrates a front view, a side view, and a rear view of a folded state of an electronic device (101) according to one embodiment of the present disclosure.

[0071] Referring to FIG. 2 and FIG. 3, an electronic device (101) according to one embodiment may include a first housing (210), a second housing (220), a flexible display (230) and a hinge cover (260) disposed in the first housing (210) and the second housing (220).

[0072] The flexible display (230) may be referred to as a "foldable display" or simply as a "display." Hereinafter, in FIGS. 2 and FIGS. 3, it may be referred to as the first display (230) to distinguish it from other displays (e.g., the second display (239)). According to one embodiment, the surface on which the first display (230) is placed may be defined as the front surface of the electronic device (101). The front surface of the electronic device (101) may be formed by a front plate (e.g., a glass plate or a polymer plate containing various coating layers) in which at least a portion is substantially transparent. And, the opposite surface of the front surface may be defined as the rear surface of the electronic device (101). The rear surface of the electronic device (101) may be formed by a rear plate (hereinafter referred to as the "rear cover") that is substantially opaque. The rear cover may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Additionally, a surface surrounding the space between the front and the rear may be defined as a side of the electronic device (101). The side may be formed by a side bezel structure (or "side member") comprising metal and / or polymer, which is combined with the front plate and the rear cover. In some embodiments, the rear cover and the side bezel structure may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0073] According to one embodiment, the electronic device (101) may include at least one of a first display (230), an audio module (241, 243, 245), a sensor module (255), a camera device (251, 253), a key input device (211, 212, 213), and a connector hole (214). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (211, 212, 213)) or additionally include another component (e.g., a light-emitting element).

[0074] According to one embodiment, the first display (230) may be a display in which at least some area can be deformed into a flat or curved surface. According to one embodiment, the first display (230) may include a folding area (231c), a first area (231a) disposed on one side (e.g., the upper side of the folding area (231c) shown in FIG. 2) relative to the folding area (231c), and a second area (231b) disposed on the other side (e.g., the lower side of the folding area (231c) shown in FIG. 2). However, the area division of the first display (230) shown in FIG. 2 is exemplary, and the first display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the area of ​​the first display (230) may be divided by a folding area (231c) or a folding axis (A), but in one embodiment, the area of ​​the first display (230) may be divided based on a different folding area (231c) or a different folding axis (e.g., a folding axis perpendicular to the folding axis (A)).

[0075] According to one embodiment, a microphone hole (241) may have a microphone placed inside to acquire external sound, and in some embodiments, a plurality of microphones may be placed to detect the direction of sound.

[0076] According to one embodiment, the speaker holes (243, 245) may include an external speaker hole (243) and a receiver hole (245) for communication. In some embodiments, the speaker holes (243, 245) and the microphone hole (241) may be implemented as a single hole, or a speaker may be included without speaker holes (243, 245) (e.g., a piezo speaker). The location and number of the microphone hole (241) and the speaker holes (243, 245) may vary depending on the embodiment.

[0077] According to one embodiment, the electronic device (101) may include a first camera device (251) disposed on a first surface (210a) of a first housing (210) of the electronic device (101), and a second camera device (253) disposed on a second surface (210b). In addition, the electronic device (101) may further include a flash (not shown). The camera devices (251, 253) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp.

[0078] According to one embodiment, the sensor module (255) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. Although not illustrated in the drawings, the electronic device (101) may additionally or substantially include other sensor modules (e.g., the sensor module (176) of FIG. 1) in addition to the sensor module (255) provided on the second surface (210b) of the first housing (210). The electronic device (101) may include at least one of, for example, a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor as a sensor module.

[0079] According to one embodiment, the key input devices (211, 212, 213) may be disposed on the side of a foldable housing (e.g., hinge cover (260), first housing (210), and / or second housing (220)). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (211, 212, 213), and the key input devices not included may be implemented in other forms, such as soft keys, on the first display (230). In some embodiments, the key input devices may be configured so that key input is implemented by a sensor module (e.g., a gesture sensor).

[0080] According to one embodiment, the connector hole (214) may be configured to accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, or additionally or substantially, a connector for transmitting and receiving audio signals with an external electronic device.

[0081] According to one embodiment, a foldable housing may be implemented by combining a first housing (210), a second housing (220), a first back cover (240), a second back cover (250), and / or a hinge module (e.g., the hinge structure (270) of FIG. 4 described below, the hinge assembly (330) of FIG. 5). The foldable housing of the electronic device (101) is not limited to the form and combination shown in FIG. 2 and may be implemented by other shapes or combinations and / or combinations of parts. For example, in one embodiment, the first housing (210) and the first back cover (240) may be formed integrally, and the second housing (220) and the second back cover (250) may be formed integrally. According to one embodiment of the present disclosure, the term 'housing' may mean a combination and / or combined configuration of various other parts not mentioned. For example, the first area (231a) of the first display (230) may be described as forming one side of the first housing (210), and in one embodiment, the first area (231a) of the first display (230) may be described as being placed or attached to one side of the first housing (210).

[0082] According to one embodiment, the first housing (210) is connected to a hinge module (e.g., the hinge structure (270) of FIG. 4 described below, the hinge assembly (330) of FIG. 5 described below) and may include a first surface (210a) facing a first direction and a second surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to a hinge module (e.g., the hinge structure (270) of FIG. 4 described below, the hinge assembly (330) of FIG. 5 described below) and may include a third surface (220a) facing a third direction and a fourth surface (220b) facing a fourth direction opposite to the third direction, and may rotate or pivot relative to the first housing (210) around the hinge module (or folding axis (A)).

[0083] According to one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides (or upper / lower sides) around the folding axis (A). The angle or distance at which the first housing (210) and the second housing (220) intersect each other may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or an intermediate state of partial unfolding (or partial folding). According to one embodiment, the unfolded state of the electronic device (101) may be referred to as the first state, the folded state of the electronic device (101) may be referred to as the second state, and the intermediate state of the electronic device (101) may be referred to as the third state.

[0084] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metal or non-metal material having a selected size of rigidity to support the first display (230). The at least portion formed of the metal material may be provided as a ground plane or a radiating conductor of the electronic device (101), and when provided as a ground plane, may be electrically connected to a ground line formed on a printed circuit board (e.g., printed circuit board (216, 226) of FIG. 4).

[0085] According to one embodiment, a first rear cover (240) is positioned on one side of the folding axis (A) on the rear of the electronic device (101) (e.g., the upper side in FIG. 2) and may have a substantially rectangular periphery, for example, and the periphery may be wrapped by a first housing (210) (and / or a side bezel structure). Similarly, a second rear cover (250) is positioned on the other side of the folding axis (A) on the rear of the electronic device (101) (e.g., the lower side in FIG. 2) and its periphery may be wrapped by a second housing (220) (and / or a side bezel structure).

[0086] According to one embodiment, the first rear cover (240) and the second rear cover (250) may have a substantially symmetrical shape with respect to the folding axis (A). However, the first rear cover (240) and the second rear cover (250) do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device (101) may include the first rear cover (240) and the second rear cover (250) of various shapes. In one embodiment, the first rear cover (240) may be formed integrally with the first housing (210), and the second rear cover (250) may be formed integrally with the second housing (220).

[0087] According to one embodiment, the first rear cover (240), the second rear cover (250), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (101) (e.g., printed circuit boards (216, 226) of FIG. 4, or batteries (215, 225)) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear of the electronic device (101). For example, at least a portion of the second display (239) may be visually exposed through the first rear cover (240). In one embodiment, one or more components or sensors may be visually exposed through the first rear cover (240). In various embodiments, the components or sensors may include a proximity sensor, a rear camera, and / or a flash. In addition, although not separately illustrated in the drawing, one or more parts or sensors may be visually exposed through the second rear cover (250).

[0088] According to one embodiment, a front camera device (251) exposed on the front of the electronic device (101) through one or more openings or a rear camera device (253) exposed through a first rear cover (240) may include one or more lenses, an image sensor, and / or an image signal processor. A flash (not shown) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101).

[0089] According to one embodiment, the foldable housing (210, 220, 260) may include a hinge cover (260), a first housing (210), and a second housing (220). The first housing (210) and the second housing (220) may be rotated with respect to a hinge module (e.g., the hinge structure (270) of FIG. 4, the hinge assembly (330) of FIG. 5). When the electronic device (101) moves from an unfolded state to a folded state, the first housing (210) and the second housing (220) may be rotated with respect to the hinge module so as to be closer to each other. When the electronic device (101) is moved from a folded state to an unfolded state, a portion of the first housing (210) and a portion of the second housing (220) may be rotated relative to the hinge cover (260) so as to move away from each other. According to one embodiment of the present disclosure, the folding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) are rotated relative to the hinge module (e.g., the hinge structure (270) of FIG. 4, the hinge assembly (330) of FIG. 5) when the first housing (210) and / or the second housing (220) are moved from an unfolded state to a folded state. The unfolding direction of the first housing (210) and / or the second housing (220) may include the direction in which the first housing (210) and / or the second housing (220) rotates relative to the hinge module (e.g., the hinge structure (270) of FIG. 4, the hinge assembly (330) of FIG. 5) when the first housing (210) and / or the second housing (220) transition from a folded state to an unfolded state.

[0090] According to one embodiment, the electronic device (101) can be varied such that the first display (230) is in a folded state or the first display (230) is in an unfolded state. For example, the first housing (210) and the second housing (220) can be rotated about a folding axis (A) between a folded state in which the first region (231a) and the second region (231b) of the first display (230) face each other, and an unfolded state (e.g., the electronic device (101) shown in FIG. 2 is in an unfolded state) by a specified angle from the folded state.

[0091] According to one embodiment, as the first housing (210) and the second housing (220) rotate about a folding axis (A), the electronic device (101) may include a folded state and an unfolded state. The folded state may be a state in which the first housing (210) and the second housing (220) face each other, and the angle formed by the first housing (210) and the second housing (220) may be less than a predetermined angle (e.g., approximately 10 degrees). The unfolded state may be a state in which the electronic device (101) is fully unfolded or partially unfolded, and the angle formed by the first housing (210) and the second housing (220) may be greater than the predetermined angle.

[0092] FIG. 2 illustrates an unfolded state of an electronic device (101) in which the first housing (210) and the second housing (220) form an angle of approximately 180°. FIG. 3 illustrates a folded state of an electronic device (101) in which the first housing (210) and the second housing (220) are positioned facing each other. In the folded state, the first region (231a) and the second region (231b) of the first display (230) can be positioned to face each other, and the folding region (231c) can be bent.

[0093] According to one embodiment, the folding of the electronic device (101) can be implemented in two ways: 'in-folding,' where the first region (231a) and the second region (231b) are folded to face each other, and 'out-folding,' where the first region (231a) and the second region (231b) are folded to face opposite directions. For example, in the in-folding manner, the first region (231a) and the second region (231b) may be substantially concealed in the folded state, and in the fully unfolded state, the first region (231a) and the second region (231b) may be positioned to face substantially the same direction. For example, in an out-folding state, the first region (231a) and the second region (231b) may be positioned to face opposite directions and be visually exposed to the outside, and in a fully unfolded state, the first region (231a) and the second region (231b) may be positioned to face substantially the same direction.

[0094] According to one embodiment, the first display (230) may include a display panel (not shown) and a window member (not shown), at least a portion of which may be formed flexibly. Although not separately illustrated, it will be readily understood by those skilled in the art that the first display (230) or the display panel may include various layer(s), such as a light-emitting layer, a substrate(s) encapsulating the light-emitting layer, an electrode or conductive line layer, and / or an adhesive layer(s) bonding adjacent different layers. When the first display (230) (e.g., a folding region (231c)) is deformed into a flat shape and a curved shape, relative displacement may occur between the layers forming the first display (230). The relative displacement due to the deformation of the first display (230) may increase as the point is further from the folding axis (A) and / or as the thickness of the first display (230) increases.

[0095] According to one embodiment, a window member, for example, a thin film plate, can serve as a protective film for protecting a display panel. As a protective film, the thin film plate may use a material that protects the display panel from external impacts, is resistant to scratches, and causes fewer wrinkles in the folding area (231c) even during repeated folding and unfolding operations of the housings (210, 220). For example, the material of the thin film plate may include a clear polyimide film (CPI) or ultra-thin glass (UTG).

[0096] According to one embodiment, the electronic device (101) may further include a protective member (206)(s) or a decorative cover (218, 228)(s) disposed on at least a portion of the edge of the first display (230) on the front (e.g., the first side (210a) or the third side (220a)). As an example, the protective member (206) and the decorative cover (218, 228) may be connected to each other to surround the edge of the first display (230). The protective member (206) or the decorative cover (218, 228) may prevent at least a portion of the edge of the first display (230) from coming into contact with a mechanical structure (e.g., the first housing (210) or the second housing (220)). The protective member (206) or the decorative cover (218, 228) may be visually exposed to the outside of the electronic device (101).

[0097] According to one embodiment, the decorative covers (218, 228) and the protective member (206) may be connected to each other. As an example, the decorative covers (218, 228) and the protective member (206) may be formed integrally. The decorative covers (218, 228) may extend along the folding axis (A). The decorative covers (218, 228) may include a first decorative cover (218) positioned between a portion of the edge of the first region (231a) of the first display (230) and the inner wall of the first housing (210). The decorative covers (218, 228) may include a second decorative cover (228) positioned between a portion of the edge of the second region (231b) of the first display (230) and the inner wall of the second housing (220). As an example, the first decorative cover (218) and the second decorative cover (228) can be extended substantially parallel along the folding axis (A).

[0098] According to one embodiment, a speaker hole (245) may be formed in a decorative cover (218) or protective member (206) interposed between the edge of the first area (231a) of the first display (230) and the inner wall of the first housing (210). As an example, the speaker hole (245) may be formed in the first decorative cover (218).

[0099] FIG. 4 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0100] Referring to FIG. 4, according to one embodiment of the present disclosure, the first display (230) may be visually exposed through a significant portion of the front surface of the electronic device (101). In some embodiments, the shape of the first display (230) may be formed to be generally identical to the outer shape of the front surface of the electronic device (101).

[0101] In FIG. 4, 'Y' may represent the longitudinal direction of the electronic device (101) in the unfolded state (first state) of the electronic device (101).

[0102] The foldable housing of the electronic device (101) may include a first housing (210) and a second housing (220). According to one embodiment, the first housing (210) may include a first surface (210a) and a second surface (210b) facing in the opposite direction to the first surface (210a), and the second housing (220) may include a third surface (220a) and a fourth surface (220b) facing in the opposite direction to the third surface (220a). The electronic device (101) or the foldable housing (210, 220, 260) may additionally or substantially include a bracket assembly (217, 227). The bracket assembly (217, 227) may include a first bracket assembly (217) disposed in a first housing (210) and a second bracket assembly (227) disposed in a second housing (220). At least a portion of the bracket assembly (217, 227), for example, at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227), may serve as a plate to support the hinge structure (270).

[0103] The electronic device (101) may include a flexible display (230) positioned from a first housing (210) to a second housing (220) across an area where a hinge structure (270) (e.g., the hinge module of FIG. 2 to 3, the hinge assembly (330) of FIG. 5 described below) is positioned.

[0104] According to one embodiment, various electrical components may be disposed on the printed circuit board (216, 226). For example, the printed circuit board (216, 226) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0105] According to one embodiment, the printed circuit boards (216, 226) may include a first printed circuit board (216) disposed on the side of the first bracket assembly (217) and a second printed circuit board (226) disposed on the side of the second bracket assembly (227). The first printed circuit board (216) and the second printed circuit board (226) may be disposed inside a space formed by a foldable housing (210, 220, 260), a bracket assembly (217, 227), a first rear cover (240) and / or a second rear cover (250). Components for implementing various functions of the electronic device (101) may be disposed separately on the first printed circuit board (216) and the second printed circuit board (226). For example, a processor may be placed on the first printed circuit board (216), and an audio interface may be placed on the second printed circuit board (226).

[0106] According to one embodiment, a battery (215, 225) for supplying power to an electronic device (101) may be disposed adjacent to a printed circuit board (216, 226). At least a portion of the battery (215, 225) may be disposed substantially coplanar with, for example, the printed circuit board (216, 226). According to one embodiment, a first battery (215) may be disposed adjacent to a first printed circuit board (216), and a second battery (225) may be disposed adjacent to a second printed circuit board (226). The battery (215, 225) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (215, 225) may be integrally placed inside the foldable housing (210, 220, 260) and may also be detachably placed in the foldable housing (210, 220, 260).

[0107] According to one embodiment, the hinge structure (270) provides a folding axis (e.g., folding axis (A) of FIG. 2) and may be configured to rotatably connect or combine the foldable housing (210, 220, 260) and / or the bracket assembly (217, 227). The hinge structure (270) may include a first hinge structure (271) disposed on the side of the first printed circuit board (216) and a second hinge structure (272) disposed on the side of the second printed circuit board (226). The hinge structure (270) may be disposed between the first printed circuit board (216) and the second printed circuit board (226). According to one embodiment, the hinge structure (270) may be substantially integral with at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227).

[0108] According to one embodiment, the 'housing structure' may refer to a foldable housing (210, 220, 260) and at least one component disposed inside the foldable housing (210, 220, 260) being assembled and / or combined. The housing structure may include a first housing structure and a second housing structure. For example, a configuration assembled to include at least one of a first housing (210), a first bracket assembly (217) disposed inside the first housing (210), a first printed circuit board (216), and a first battery (215) may be referred to as the 'first housing structure'. As another example, a configuration assembled to include at least one of a second housing (220), a second bracket assembly (227) disposed inside the second housing (220), a second printed circuit board (226), and a second battery (225) may be referred to as a ‘second housing structure.’ However, it should be noted that the ‘first housing structure and second housing structure’ are not limited to the addition of the components described above, and may additionally include or omit various other components.

[0109] According to one embodiment, the flexible connecting member (280) may be, for example, a flexible printed circuit board (FPCB). The flexible connecting member (280) may connect various electrical components placed on the first printed circuit board (216) and the second printed circuit board (226). To this end, the flexible connecting member (280) may be positioned to cross the 'first housing structure' and the 'second housing structure'. According to one embodiment, the flexible connecting member (280) may be positioned to cross at least a portion of the hinge structure (270). According to one embodiment, the flexible connecting member (280) may be configured to connect the first printed circuit board (216) and the second printed circuit board (226) across the hinge structure (270), for example, along a direction parallel to the y-axis of FIG. 4. For example, the flexible connecting member (280) may be extended or positioned through an opening (273, 274) formed in the hinge structure (270). At this time, one part (281) of the flexible connecting member (280) may be positioned to span one side (e.g., upper) of the first hinge structure (271), and another part (282) of the flexible connecting member (280) may be positioned to span one side (e.g., upper) of the second hinge structure (272). And, yet another part (283) of the flexible connecting member (280) may be positioned on the other side (e.g., lower) of the first hinge structure (271) and the second hinge structure (272). A space enclosed by at least a portion of the first hinge structure (271), at least a portion of the second hinge structure (272), and at least a portion of the hinge cover (260) (hereinafter referred to as the ‘conductive line space (wiring space) (hereinafter the internal space (S) of FIG. 5)’) may be formed at a location adjacent to the first hinge structure (271) and the second hinge structure (272). According to one embodiment, at least a portion (e.g., 283) of a flexible connecting member (280) may be disposed within the conductive line space.

[0110] According to one embodiment, the hinge cover (260) may be configured to accommodate or enclose at least a portion of the hinge structure (270) or the conductive line space. In some embodiments, the hinge cover (260) may form a conductive line space together with the hinge structure (270) and protect a configuration disposed within the conductive line space (e.g., at least a portion (283) of the flexible connecting member (280)) from external impact. According to one embodiment, the hinge cover (260) may be disposed between the first housing (210) and the second housing (220). In an in-folding electronic device (101), the hinge cover (260) may be at least partially concealed by the foldable housings (210, 220, 260). For example, in the folded state, the hinge cover (260) may be visually exposed to the outside space between the rear of the first housing (210) (e.g., the first rear cover (240)) and the rear of the second housing (220) (e.g., the second rear cover (250)), and in the unfolded state, it may be substantially received into the interior of the first housing (210) or the second housing (220) and visually concealed.

[0111] According to one embodiment, an antenna module (219, 229) (e.g., antenna module (197) of FIG. 1) may be positioned between a rear cover (240, 250) and a battery (215, 225). According to one embodiment, the antenna module (219, 229) may include a first antenna module (219) positioned on the side of the first housing (210) and a second antenna module (229) positioned on the side of the second housing (220). The antenna module (219, 229) may be able to communicate near-field with an external device or wirelessly transmit and receive power required for charging by including, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. In one embodiment, an antenna structure may be formed by a side bezel structure of a foldable housing (210, 220, 260) and / or a part or combination thereof of a bracket assembly.

[0112] According to one embodiment, the rear cover (240, 250) may include a first rear cover (240) and a second rear cover (250). The rear cover (240, 250) may be combined with the foldable housing (210, 220, 260) to protect the above-described components (e.g., printed circuit board (216, 226), battery (215, 225), flexible connector (280), or antenna module (219, 229)) disposed within the foldable housing (210, 220, 260). As previously mentioned, the rear cover (240, 250) may be formed substantially integrally with the foldable housing (210, 220, 260).

[0113] According to one embodiment, a protective member (206) and / or a decorative cover (218, 228) may protect at least a portion of the edge of the first display (230). The protective member (206) may be positioned between the edge of the first region (231a, see FIG. 2) of the first display (230) and the inner wall of the first housing (210) and / or between the edge of the second region (231b, see FIG. 2) of the first display (230) and the inner wall of the second housing (220) to prevent the edge of the first display (230) from coming into direct contact with the inner wall of the housings (210, 220).

[0114] FIG. 5 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure. FIG. 6 is an enlarged cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure.

[0115] Specifically, FIG. 5 is a cross-sectional view illustrating a hinge portion of a foldable electronic device (301). FIG. 6 is an enlarged cross-sectional view illustrating the structure near the first fixing portion (341-1) of the flexible printed circuit board (340) in FIG. 5.

[0116] The detailed configuration of a foldable electronic device (301) according to one embodiment of the present disclosure, which is not described below, may be the same as the detailed configuration of an electronic device (101) according to one embodiment of the present disclosure described in relation to FIGS. 1 to 4.

[0117] Hereinafter, a foldable electronic device (301) (e.g., the electronic device (101) of FIGS. 1 to 4) may include a first housing (311), a second housing (312), a flexible display (e.g., the display module (160) of FIG. 1, the display (230) of FIGS. 2 to 4), a first support member (321), a second support member (322), a hinge assembly (330) (e.g., the hinge structure (270) and hinge cover (260) of FIG. 4), a flexible printed circuit board (340), a first holder (351), a second holder (352), a first front plate (353), a second front plate (354), a first sealing member (355), and a second sealing member (356). However, depending on the embodiment, some of these may be omitted from the foldable electronic device (301), and other additional configurations may be included.

[0118] Hereinafter, 'unfolded state of the foldable electronic device (301)' may mean the unfolded state of the foldable electronic device (301) (e.g., the unfolded state of FIG. 2), and 'folded state of the foldable electronic device (301)' may mean the folded state of the foldable electronic device (301) (e.g., the folded state of FIG. 3).

[0119] Hereinafter, the ‘first direction (+Y direction)’ may refer to a direction toward the folding surface (F) with respect to the first housing (311) or a direction toward the opposite side of the folding surface (F) with respect to the second housing (312) (e.g., right direction with respect to FIG. 5) when the foldable electronic device (301) is in an unfolded state (first state). Here, the folding surface (F) is a surface perpendicular to the folding axis (A) of FIG. 2, and the first housing (311) and the second housing (312) may behave symmetrically with respect to the folding surface (F). According to one embodiment, the hinge assembly (330) included in the foldable electronic device (301) may have a shape that is symmetric with respect to the folding surface (F). According to another embodiment, in addition to the hinge assembly (330), various components included in the foldable electronic device (301) may be symmetrically arranged with respect to the folding surface (F). The 'second direction (-Y direction)' is the opposite direction to the first direction (+Y direction), and when the foldable electronic device (301) is in an unfolded state, it may mean a direction facing the opposite side of the folding surface (F) with respect to the first housing (311) or a direction facing the folding surface (F) with respect to the second housing (312) (e.g., left direction with respect to FIG. 5). Additionally, the first thickness direction (+Z direction) may mean the direction in which the foldable electronic device (301) is folded with respect to the thickness direction of the foldable electronic device (301), the first support member (321) and / or the second support member (322) (e.g., upward direction with respect to FIG. 5). Additionally, the second thickness direction (-Z direction) may mean a direction opposite to the first thickness direction (+Z direction), and a direction opposite to the direction in which the foldable electronic device (301) is folded relative to the thickness direction of the foldable electronic device (301), the first support member (321) and / or the second support member (322) (e.g., the downward direction in FIG. 5).

[0120] Below, the specific structure not described in relation to the second housing (312) area can be understood as a symmetrical structure of the specific structure described in relation to the first housing (311) area with respect to the folding surface (F).

[0121] According to one embodiment, the foldable electronic device (301) may include a first housing (311) (e.g., the first housing (210) of FIGS. 2 to 4). For example, a first support member (321), a part of a flexible printed circuit board (340), a first holder (351), a first front plate (353), and / or a first sealing member (355) may be disposed inside the first housing (311). The first housing (311) may be referred to as a 'housing'.

[0122] According to one embodiment, the foldable electronic device (301) may include a hinge assembly (330). The hinge assembly (330) may be connected to a first housing (311) and a second housing (312). The hinge assembly (330) may be positioned between the first housing (311) and the second housing (312). The hinge assembly (330) may rotatably connect the first housing (311) and the second housing (312) around a folding surface (F).

[0123] According to one embodiment, the hinge assembly (330) (e.g., the hinge structure (270) and hinge cover (260) of FIG. 4) may include an internal space (S). The internal space (S) may be defined as the hinge cover (332) (e.g., the hinge cover (260) of FIG. 4), the first hinge plate (333-1), and the second hinge plate (333-2). The internal space (S) may refer to the space between the hinge cover (332) (e.g., the hinge cover (260) of FIG. 4) and the first hinge plate (333-1), and the space between the hinge cover (332) and the second hinge plate (333-2).

[0124] According to one embodiment, the foldable electronic device (301) may include a first support member (321) (e.g., the first bracket assembly (217) of FIG. 4). The first support member (321) may be disposed in a first housing (311). For example, the first support member (321) may be disposed in an inner space of the first housing (311). The first support member (321) may serve as a structure for the components disposed in the first housing (311). The first support member (321) may be referred to as a 'support member'. According to one embodiment, the inner space (S) of the hinge assembly (330) may include the space between a part of the first support member (321) and the first hinge plate (333-1). The internal space (S) may include the space between part of the second support member (322) and the second hinge plate (333-2).

[0125] According to one embodiment, the first support member (321) may include a first seating groove (3211). The first seating groove (3211) may be recessed toward the second thickness direction (-Z direction) from the surface of the first support member (321) facing the first thickness direction (+Z direction). The first seating groove (3211) may be formed in the internal space (S) region of the hinge assembly (330) in the first support member (321). For example, the first seating groove (3211) may be formed in a region adjacent to the internal space (S) region. For example, the first seating groove (3211) may be formed on the second direction (-Y direction) side of the hinge cover (332) when the foldable electronic device (301) is in an unfolded state. A first fixing portion (341-1) of a flexible printed circuit board (340) can be seated in the first mounting groove (3211). The first mounting groove (3211) may be referred to as the 'mounting groove'.

[0126] According to one embodiment, the first support member (321) may include a first through hole (3212). The first through hole (3212) may be formed on the side opposite to the folding surface (F) with respect to the first seating groove (3211). For example, the first through hole (3212) may be formed on the second direction (-Y direction) side of the first seating groove (3211) when the foldable electronic device (301) is in an unfolded state. The first through hole (3212) may be formed by penetrating the first support member (321) in the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction). A flexible printed circuit board (340) may pass through the first through hole (3212). For example, a portion (e.g., a first outer curve (343-1)) disposed on the first thickness direction (+Z direction) side of the first support member (321) of the flexible printed circuit board (340) may extend through the first through hole (3212) to the second thickness direction (-Z direction) side of the first support member (321). The first through hole (3212) may be referred to as a 'through hole'.

[0127] According to one embodiment, the first support member (321) may include a first rib (3213). The first rib (3213) may be positioned between the first seating groove (3211) and the first through hole (3212). The first rib (3213) may protrude in the first thickness direction (+Z direction) from the bottom surface (3211a) of the first seating groove (3211). For example, the first rib (3213) may form a wall defining the first through hole (3212) and / or a wall defining the first seating groove (3211). For example, the first rib (3213) can be understood as a portion formed by the first seating groove (3211) in the first support member (321) being recessed in the second thickness direction (-Z direction) from the surface facing the first thickness direction (+Z direction) of the first support member (321). The first rib (3213) may be referred to as a 'rib'.

[0128] According to one embodiment, the first support member (321) may include a first inner wall (3214). The first inner wall (3214) may protrude in a first thickness direction (+Z direction) from the bottom surface (3211a) of the first seating groove (3211). The first inner wall (3214) may form a side wall on the folding surface (F) of the first seating groove (3211). For example, the first inner wall (3214) may be understood as a side wall in the first direction (+Y direction) of the first seating groove (3211) formed as the first seating groove (3211) is recessed. The first inner wall (3214) may be referred to as an 'inner wall'.

[0129] According to one embodiment, the foldable electronic device (301) may include a second housing (312) (e.g., the second housing (220) of FIGS. 2 to 4). For example, a second support member (322), a part of a flexible printed circuit board (340), a second holder (352), a second front plate (354), and / or a second sealing member (356) may be disposed inside the second housing (312). The second housing (312) may be referred to as a 'housing'.

[0130] The description of the first support member (321), first seating groove (3211), first through hole (3212), first rib (3213), and first inner wall (3214) of the first housing (311) described above may be applied to the description of the second support member (322), second seating groove (3221), second through hole (3222), second rib (3223), and second inner wall (3224) of the second housing (312). Hereinafter, the description of components to which the description of other embodiments is applied will be omitted.

[0131] According to one embodiment, the foldable electronic device (301) may include a flexible printed circuit board (340) (e.g., the flexible connecting member (280) of FIG. 4). The flexible printed circuit board (340) may be disposed in the internal space (S) of the first housing, the second housing (312), and the hinge assembly (330). For example, the flexible printed circuit board (340) may extend from the first housing (311) through the internal space (S) of the hinge assembly (330) to the second housing (312).

[0132] According to one embodiment, the flexible printed circuit board (340) can pass through the first through hole (3212). For example, a first outer bend (343-1) disposed on the first thickness direction (+Z direction) side of the first support member (321) (e.g., the first rib (3213)) and a first extension (e.g., the first extension (345-1) of FIG. 7) disposed on the second thickness direction (-Z direction) side of the first support member (321) can be connected to each other by the flexible printed circuit board (340) passing through the first through hole (3212).

[0133] According to one embodiment, the flexible printed circuit board (340) can pass through the second through hole (3222). For example, a second outer bend (343-2) positioned in the first thickness direction (+Z direction) of the second support member (322) (e.g., the second rib (3223)) and a second extension (e.g., the second extension (345-2) of FIG. 7) positioned in the second thickness direction (-Z direction) of the second support member (322) can be connected to each other by the flexible printed circuit board (340) passing through the second through hole (3222).

[0134] According to one embodiment, a flexible printed circuit board (340) may be positioned between a first sealing member (355) and a first rib (3213). For example, the flexible printed circuit board (340) may be positioned on the first direction (+Y direction) side of the first sealing member (355) and on the second direction (-Y direction) side of the first rib (3213). The flexible printed circuit board (340) may be extended in close contact with the first rib (3213). For example, the flexible printed circuit board (340) may be in close contact with the first rib (3213) by the first sealing member (355) being fitted into the first through hole (3212). Through this, waterproofing and / or dustproofing in the first through hole (3212) can be achieved even though the flexible printed circuit board (340) passes through the first through hole (3212).

[0135] According to one embodiment, a flexible printed circuit board (340) may be positioned between a second sealing member (356) and a second rib (3223). For example, the flexible printed circuit board (340) may be positioned on the second direction (-Y direction) side of the second sealing member (356) and on the first direction (+Y direction) side of the second rib (3223). The flexible printed circuit board (340) may be extended in close contact with the second rib (3223). For example, the flexible printed circuit board (340) may be in close contact with the second rib (3223) by the second sealing member (356) being fitted into the second through hole (3222). Through this, waterproofing and / or dustproofing in the second through hole (3222) can be achieved even though the flexible printed circuit board (340) passes through the second through hole (3222).

[0136] According to one embodiment, the flexible printed circuit board (340) may include a portion capable of bending deformation. For example, when the foldable electronic device (301) is in a folded state, the length of the space where the flexible printed circuit board (340) can be placed between the first through hole (3212) and the second through hole (3222) may be greater than the length of the space where the flexible printed circuit board (340) can be placed between the first through hole (3212) and the second through hole (3222) when the foldable electronic device (301) is in an unfolded state. The flexible printed circuit board (340) may be provided in a curved shape and may include a portion capable of bending deformation to accommodate the length of the space where the flexible printed circuit board (340) can be placed between the first through hole (3212) and the second through hole (3222) as the foldable electronic device (301) changes from an unfolded state to a folded state. For example, the flexible printed circuit board (340) may include a first inner curved portion (342-1) and a second inner curved portion (342-2). This will be described in detail later.

[0137] According to one embodiment, the flexible printed circuit board (340) may include a first fixing part (341-1). The first fixing part (341-1) may be positioned on the first thickness direction (+Z direction) side of the first support member (321). For example, the first fixing part (341-1) may be positioned in the internal space (S) of the hinge assembly (330). The first fixing part (341-1) may be referred to as a 'fixing part'.

[0138] According to one embodiment, the first fixing part (341-1) may be fixed to the first support member (321) of the first housing (311). The first fixing part (341-1) may be seated in the first seating groove (3211). For example, the first fixing part (341-1) may be inserted into and seated in the first seating groove (3211). For example, the first fixing part (341-1) may be attached to the bottom surface of the first seating groove (3211). For example, the first fixing part (341-1) may be attached to the bottom surface of the first seating groove (3211) by an attachment member (e.g., adhesive member (A1)). However, not limited thereto, the first fixing part (341-1) may also be coupled to the bottom surface of the first seating groove (3211) through a separate mechanical coupling structure. When the first fixing part (341-1) is seated (or inserted) into the first seating groove (3211), both ends of the first fixing part (341-1) of the flexible printed circuit board (340) (e.g., the first end (341-11) and the second end (341-12) of FIG. 6) can be bent in the first thickness direction (+Z direction).

[0139] According to one embodiment, the flexible printed circuit board (340) may include a first inner bend (342-1). The first inner bend (342-1) may be a part of the flexible printed circuit board (340) that is bent at the first housing (311) side when the foldable electronic device (301) is in an unfolded state. The first inner bend (342-1) may be formed convexly in the first thickness direction (+Z direction) when the foldable electronic device (301) is in an unfolded state. The first inner bend (342-1) may be connected to a first end (341-11) that is bent at the folding surface (F) side of the first fixing part (341-1). For example, the first inner bend (342-1) may extend from the first end (341-11) facing the first direction (+Y direction) of the first fixed part (341-1). At least a portion of the first inner bend (342-1) may be positioned on the first thickness direction (+Z direction) side of the first support member (321). At least a portion of the first inner bend (342-1) may be positioned on the first thickness direction (+Z direction) side of the hinge cover (332). The first inner bend (342-1) may be positioned in the internal space (S) of the hinge assembly (330). The first inner bend (342-1) may be referred to as the 'inner bend'.

[0140] According to one embodiment, the first inner bend (342-1) may be bent at least once by the hinge cover (332). For example, the first inner bend (342-1) may be bent in a shape that surrounds the hinge cover (332). The first cover end (3321) of the hinge cover (332) may be disposed inside the bent shape of the first inner bend (342-1). For example, the first inner bend (342-1) may be a part that surrounds the periphery of the first cover end (3321) when the foldable electronic device (301) is in an unfolded state.

[0141] According to one embodiment, the first fixing part (341-1) is seated in the first seating groove (3211), so that the flexible printed circuit board (340) can be bent at least twice between the hinge cover (332) and the first rib (3213). According to one embodiment, the flexible printed circuit board (340) can be bent twice between the hinge cover (332) and the first rib (3213) as shown in FIGS. 5 and 6. For example, the flexible printed circuit board (340) can have a cross-section in the shape of a camel hump between the hinge cover (332) and the first rib (3213). Due to this structure, the extended length of the flexible printed circuit board (340) can be sufficiently secured, so when the foldable electronic device (301) is converted to a folded state, tension is applied to the flexible printed circuit board (340), thereby preventing or reducing damage to the flexible printed circuit board (340).

[0142] According to one embodiment, the first inner curve (342-1) may be a part that deforms when the foldable electronic device (301) is converted from an unfolded state to a folded state. For example, the curvature (or radius of curvature (R)) of the first inner curve (342-1) when the foldable electronic device (301) is in an unfolded state may be different from the curvature (or radius of curvature) of the first inner curve (342-1) when the foldable electronic device (301) is in a folded state. For example, the first inner curve (342-1) may be unfolded compared to the state shown in FIG. 5 as the foldable electronic device (301) is converted from an unfolded state to a folded state.

[0143] According to one embodiment, the first inner bend (342-1) may include a first part (342-11) and a second part (342-12) that are positioned on both sides of the peak portion of the first inner bend (342-1) and are parallel to the first thickness direction (+Z direction) and / or the second thickness direction (-Z direction). The first part (342-11) may be positioned on the side opposite to the folding surface (F) (e.g., the second direction (-Y direction) side) centered on the peak of the first inner bend (342-1). The second part (342-12) may be positioned on the side of the folding surface (F) (e.g., the first direction (+Y direction) side) centered on the peak of the first inner bend (342-1).

[0144] According to one embodiment, the first inner curve (342-1) may include a third part (342-13). The third part (342-13) may be a part positioned between the first part (342-11) and the second part (342-12). The third part (342-13) may be a curved part. For example, the third part (342-13) may be a part that is convexly curved toward the first thickness direction (+Z direction) from the first inner curve (342-1).

[0145] According to one embodiment, the flexible printed circuit board (340) may include a first outer bend (343-1). The first outer bend (343-1) may be connected to a second end (341-12) of a first fixed part (341-1). The second end (341-12) may be the opposite end of the first end (341-11). For example, the first outer bend (343-1) may extend from the second end (341-12) toward the second direction (-Y direction) of the first fixed part (341-1). For example, the first outer bend (343-1) may be placed in the internal space (S) of the hinge assembly (330). The first outer bend (343-1) may be referred to as the 'outer bend'.

[0146] According to one embodiment, the first outer curve (343-1) may be formed convexly in the first thickness direction (+Z direction). The first outer curve (343-1) may be formed in close contact with the first rib (3213). For example, the first outer curve (343-1) may be understood as a portion protruding in the first thickness direction (+Z direction) by the first rib (3213) as the first fixing portion (341-1) is inserted into and seated in the first seating groove (3211). However, it is not limited thereto, and if the first rib (3213) is not provided on the first support member (321), the first outer curve (343-1) may not be formed.

[0147] According to one embodiment, a portion of the first outer bend (343-1) may be positioned inside the first through hole (3212). For example, a portion of the first outer bend (343-1) positioned on the second direction (-Y direction) side of the first rib (3213) may be positioned inside the first through hole (3212) and between the first sealing member (355) and the first rib (3213).

[0148] According to one embodiment, the second inner bend (342-2) may have a shape that is symmetrical to the shape of the first inner bend (342-1) with respect to the folding surface (F). The description of the first fixing part (341-1), the first inner bend (342-1), and the first outer bend (343-1) of the first housing (311) described above may be applied to the description of the second fixing part (341-2), the second inner bend (342-2), and the second outer bend (343-2) of the second housing (312). Hereinafter, the description of components to which the description of other embodiments is applied will be omitted.

[0149] According to one embodiment, the flexible printed circuit board (340) may include a central portion (344). The central portion (344) may be placed on the hinge cover (332). The central portion (344) may be placed in the internal space (S) of the hinge assembly (330). For example, the central portion (344) may be a portion that is in close contact with the hinge cover (332) when the foldable electronic device (301) is in an unfolded state. A first inner curve (342-1) and a second inner curve (342-2) may be connected by the central portion (344). According to one embodiment, a second end (342-12) of the first inner curve (342-1) may be connected to a first end (344-1) of the central portion (344).

[0150] According to one embodiment, the flexible printed circuit board (340) may include a connector portion, although not illustrated in the drawing. The connector portion may be provided to transmit a signal transmitted through the flexible printed circuit board (340) to another electronic component.

[0151] According to one embodiment, at least a portion of a flexible printed circuit board (340) may be accommodated in the internal space (S) of the hinge assembly (330). For example, a first fixed portion (341-1), a first inner bend (342-1), a first outer bend (343-1), a second fixed portion (341-2), a second inner bend (342-2) and / or a second outer bend (343-2) of the flexible printed circuit board (340) may be accommodated in the internal space (S).

[0152] According to one embodiment, the hinge assembly (330) may include a first hinge plate (333-1). The first hinge plate (333-1) may be positioned on the first thickness direction (+Z direction) side of the first support member (321). The first hinge plate (333-1) may be positioned on the first thickness direction (+Z direction) side of the flexible printed circuit board (340). The first hinge plate (333-1) may be positioned on the first thickness direction (+Z direction) side of the hinge cover (332). The first hinge plate (333-1) may be fixed to the first support member (321). The first hinge plate (333-1) can cover at least a portion of the flexible printed circuit board (340), the first holder (351), the first front plate (353), and the first sealing member (355). The first hinge plate (333-1) may be referred to as the 'hinge plate'.

[0153] According to one embodiment, the hinge assembly (330) may include a second hinge plate (333-2). The second hinge plate (333-2) may be positioned on the first thickness direction (+Z direction) side of the second support member (322). The second hinge plate (333-2) may be positioned on the first thickness direction (+Z direction) side of the flexible printed circuit board (340). The second hinge plate (333-2) may be positioned on the first thickness direction (+Z direction) side of the hinge cover (332). The second hinge plate (333-2) may be fixed to the second support member (322). The second hinge plate (333-2) can cover at least a portion of the flexible printed circuit board (340), the second holder (352), the second front plate (354), and the second sealing member (356). The second hinge plate (333-2) may be referred to as the 'hinge plate'.

[0154] According to one embodiment, the first hinge plate (333-1) and the second hinge plate (333-2) can cover the internal space of the hinge assembly (330) together with the hinge cover (332).

[0155] According to one embodiment, the hinge assembly (330) may include a center portion (334). The center portion (334) may be a portion positioned between the first hinge plate (333-1) and the second hinge plate (333-2) when the foldable electronic device (301) is in an unfolded state. When the foldable electronic device (301) is in an unfolded state, a folded state, or an intermediate state, the center portion (334) may be configured to support a flexible display (e.g., the display module (160) of FIG. 1, the display (230) of FIG. 2 to 4). According to one embodiment, the center portion (334) may be formed such that the end of the first hinge plate (333-1) and the end of the second hinge plate (333-2) each come into contact with each other. However, it is not necessarily limited thereto, and the shape of the center portion (334) may vary. According to one embodiment, a hinge assembly (330) in which the center portion (334) is omitted may also be applied. According to one embodiment, the center portion (334) may have a shape that extends along the folding axis (e.g., the folding axis (A) of FIG. 2) and may be referred to as a 'center bar'.

[0156] According to one embodiment, the foldable electronic device (301) may further include an interlocking member connected to a first hinge plate (333-1) and a second hinge plate (333-2), respectively, to interlock mechanical movement between the first hinge plate (333-1) and the second hinge plate (333-2). For example, an interlocking gear or an interlocking arm and slider structure may be provided as an example of the interlocking member.

[0157] According to one embodiment, the foldable electronic device (301) may include a first holder (351). The first holder (351) may be positioned on the first thickness direction (+Z direction) side of the first fixing part (341-1). The first holder (351) may be positioned between the first inner bend (342-1) and the first outer bend (343-1). At least a portion of the first holder (351) may be seated in the first seating groove (3211). The first holder (351) may fix the first fixing part (341-1) to the first seating groove (3211). For example, a force may be applied to the first fixing part (341-1) to detach from the first seating groove (3211) by the elastic restoring force of the flexible printed circuit board (340), and the first holder (351) may press the first fixing part (341-1) to prevent the first fixing part (341-1) from detaching from the first seating groove (3211). According to one embodiment, the first holder (351) may be attached to the first fixing part (341-1) by an attachment member (e.g., adhesive member (A2)). The first holder (351) may be referred to as a 'holder'.

[0158] The description of the first holder (351) above may also be applied to the second holder (352).

[0159] FIG. 7 is a perspective view of a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view of a part of an electronic device according to one embodiment of the present disclosure. FIG. 9 is a front view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0160] FIG. 7 is a perspective view illustrating the central portion (344) and the surrounding portion of a flexible printed circuit board (340). FIG. 8 is a cross-sectional view illustrating a hinge portion divided into multiple regions along the longitudinal direction of a foldable electronic device (301). FIG. 9 is a drawing dividing multiple regions of a flexible printed circuit board (340).

[0161] The detailed configuration of a foldable electronic device (301) according to one embodiment of the present disclosure, which is not described below, may be identical to the detailed configuration of an electronic device (e.g., electronic device (101), foldable electronic device (301)) according to one embodiment of the present disclosure described in relation to FIGS. 1 to 6. The description of identical detailed components is omitted to the extent of overlap.

[0162] According to one embodiment, a flexible printed circuit board (340) may include a plurality of conductive lines formed along the longitudinal direction of a foldable electronic device (301) for signal transmission between a component (e.g., a processor) placed in a first housing (311) and a component placed in a second housing (312). The plurality of conductive lines may include various conductive lines, such as conductive lines for digital signal transmission, conductive lines for RF signal transmission, and conductive lines for power supply. Furthermore, the conductive lines for electrical signal transmission can be implemented by placing a plurality of conductive lines on the flexible printed circuit board (340). For example, the plurality of conductive lines may be composed of a metal material (e.g., copper). Accordingly, the plurality of conductive lines on the flexible printed circuit board (340) may form a metal layer. And, the flexible printed circuit board (340) may include an insulating layer (e.g., a coverlay) disposed adjacent to the metal layer to electrically insulate the conductive lines from other conductive lines.

[0163] The flexible printed circuit board (340) of the present disclosure may be divided into a plurality of regions along the longitudinal direction of the foldable electronic device (301). To ensure a repeatable operating life, the flexible printed circuit board (340) of the present disclosure may be configured such that one part includes a region in which the thickness of the metal layer is formed thinly, and another part includes a region in which the thickness of the metal layer is formed relatively thickly to form a low DC resistance. Due to the part in which the thickness of the metal layer is formed relatively thickly, stable and efficient power supply through the flexible printed circuit board (340) may be possible. According to one embodiment, if the thickness of the metal layer is relatively thin, it is flexible compared to the part in which the thickness of the metal layer is relatively thicker, and conversely, if the thickness of the metal layer is relatively thick, it may be rigid compared to the part in which the thickness of the metal layer is relatively thicker.

[0164] According to one embodiment, the metal layer thickness of the central portion (344) may be formed to be relatively thicker than other regions. That is, the central portion (344) may be relatively rigid. For example, in a flexible printed circuit board (340), the P0 region, where the central portion (344) is formed, may have a metal layer formed to be relatively thicker than other regions. For example, the central portion (344) may have a lower DC resistance compared to the first inner bend (342-1) (e.g., P1-1 region) and / or the second inner bend (342-2) (e.g., P1-2 region). Additionally, for example, the central portion (344) may have a stronger structural rigidity compared to the first inner bend (342-1) (e.g., P1-1 region) and / or the second inner bend (342-2) (e.g., P1-2 region). The central portion (344) is a portion positioned between the first inner bend (342-1) and the second inner bend (342-2), and the metal layer of the central portion (344) is formed thickly so that it can support the mutually facing ends of the first inner bend (342-1) and / or the second inner bend (342-2). This thicker and harder central portion can serve as a structural framework to stabilize the two thinner and more flexible inner bends during the folding and unfolding process. This structural framework prevents torsional twisting and lateral misalignment of the flexible portions, ensuring that they follow a predictable and controlled bending path. This induced movement can significantly reduce local stress concentrations occurring in the curves of the bent portions, thereby preventing premature fatigue failure of the thin inner signal line. Through this, the first inner curve (342-1) and the second inner curve (342-2) can have a curved shape according to the designed shape.

[0165] According to one embodiment, the first inner bend (342-1) in the flexible printed circuit board (340) may have a metal layer formed relatively thinly compared to other regions. For example, the region P1-1, where the first inner bend (342-1) is formed in the flexible printed circuit board (340), may have a metal layer formed relatively thinly compared to other regions (e.g., the central portion (344) and / or the first fixed portion (341-1)). According to one embodiment, instead of the metal layer of the first inner bend (342-1) being relatively thin compared to other regions (e.g., the central portion (344) and / or the first fixed portion (341-1)), it may contain a material that is more flexible than the metal layer and is relatively thick compared to other regions (e.g., the central portion (344) and / or the first fixed portion (341-1)). For example, the first inner bend (342-1) may be formed to be relatively flexible. For example, the first inner bend (342-1) may have a high DC resistance because the metal layer is formed thinly compared to the central part (344) (e.g., P0 region) and / or the first fixed part (341-1) (e.g., P2-1 region). On the other hand, by including a thick flexible material, the first inner bend (342-1) may have flexible structural rigidity compared to the central part (344) (e.g., P0 region) and / or the first fixed part (341-1) (e.g., P2-1 region). That is, the first inner bend (342-1) may have high durability compared to the central part (344) (e.g., P0 region) and / or the first fixed part (341-1) (e.g., P2-1 region). The first inner curved portion (342-1) is a portion that protrudes and bends in the first thickness direction (+Z direction) from the central portion (344) and / or the first fixed portion (341-1), and when the thickness of the metal layer of the first inner curved portion (342-1) is formed thinly, the design shape of the first inner curved portion (342-1) can be easily changed.Although the embodiment illustrated in the drawing discloses a symmetric flexible printed circuit board (340) comprising a first inner bend (342-1) and a second inner bend (342-2), the principles of the invention can be applied equally to an asymmetric design. For example, the flexible printed circuit board (340) may consist of only one inner bend formed adjacent to a thin, thick central portion or fixed portion to accommodate a device having an asymmetric folding mechanism or a single main folding axis. The first inner bend (342-1) is a portion that deforms when the foldable electronic device (301) is converted from an unfolded state to a folded state, and if the thickness of the metal layer of the first inner bend (342-1) is formed thinly, the shape of the first inner bend (342-1) can be easily deformed to prevent or reduce damage to the flexible printed circuit board (340).

[0166] According to one embodiment, the second inner bend (342-2) in the flexible printed circuit board (340) may have a metal layer formed relatively thinly compared to other regions. For example, the region P1-2, where the second inner bend (342-2) is formed in the flexible printed circuit board (340), may have a metal layer formed relatively thinly compared to other regions (e.g., the central region (344)). According to one embodiment, instead of the metal layer of the second inner bend (342-2) being relatively thin compared to other regions (e.g., the central region (344) and / or the second fixed region (341-2)), it may contain a material that is more flexible than the metal layer and is relatively thick compared to other regions (e.g., the central region (344) and / or the second fixed region (341-2)). For example, the second inner bend (342-2) may be formed to be relatively flexible. For example, the second inner bend (342-2) may have a high DC resistance because the metal layer is formed thinly compared to the central part (344) (e.g., P0 region) and / or the second fixed part (341-2) (e.g., P2-2 region). On the other hand, by including a thick flexible material, the second inner bend (342-2) may have flexible structural rigidity compared to the central part (344) (e.g., P0 region) and / or the second fixed part (341-2) (e.g., P2-2 region). That is, the second inner bend (342-2) may have high durability compared to the central part (344) (e.g., P0 region) and / or the second fixed part (341-2) (e.g., P2-2 region). The second inner bend (342-2) is a portion that protrudes and bends in the first thickness direction (+Z direction) from the central portion (344) and / or the second fixed portion (341-2), and if the thickness of the metal layer of the second inner bend (342-2) is formed thinly, the design shape of the second inner bend (342-2) can be easily changed.The second inner bend (342-2) is a part that deforms when the foldable electronic device (301) is converted to an unfolded state or a folded state. When the thickness of the metal layer of the second inner bend (342-2) is formed thinly, the shape of the second inner bend (342-2) can be easily deformed to prevent or reduce damage to the flexible printed circuit board (340).

[0167] According to one embodiment, in a flexible printed circuit board (340), the region (P0-1) between the first inner bend (342-1) and the central part (344) and the region (P0-2) between the second inner bend (342-2) and the central part (344) may be formed such that the thickness of the metal layer is thicker than that of the first inner bend (342-1) and the second inner bend (342-2), and the thickness of the metal layer is thinner than that of the central part (344). According to one embodiment, the region (P0-1) between the first inner bend (342-1) and the central part (344) and the region (P0-2) between the second inner bend (342-2) and the central part (344) may be formed such that the thickness of the metal layer has an intermediate thickness. This intermediate thickness can create a gradual change in stiffness between thin, highly elongated sections (P1-1, P1-2) and a thicker, more rigid central region (P0). Such a gradual change can be important in preventing the formation of a stress riser at the boundary where mechanical failure frequently occurs in flexible circuits. By smoothing the stress distribution during bending, this design can distribute mechanical strain over a wide area, thereby significantly improving the overall fatigue life and reliability of the flexible printed circuit board.

[0168] According to one embodiment, for convenience of distinction, the first inner bend (342-1) and the second inner bend (342-2) of the flexible printed circuit board (340) may be referred to as a first region having a relatively thin metal layer, and the central portion (344) of the flexible printed circuit board (340) may be referred to as a third region having a relatively thick metal layer compared to the first inner bend (342-1) and the second inner bend (342-2). Additionally, the area between the first inner bend (342-1) and the central portion (344) and the area between the second inner bend (342-2) and the central portion (344) may be referred to as a second region having a metal layer of medium thickness. The definition of the first, second, and third regions based on the degree of bending may provide a functional zoning of the circuit. This enables a bespoke, highly engineered solution and can have the technical effect of forming a "strain map" across the flexible portion where material properties are precisely tailored and applied only where functionally required. This can go beyond a conventional, standardized approach, which is a targeted and localized optimization. According to one embodiment, the second region may correspond to the first end (344-1) and the second end (344-2) of the central portion (344). In this way, the flexible printed circuit board (340) according to one embodiment may have the first region, the second region, and the third region corresponding to the first inner curve (342-1) (or the second inner curve (342-2)), the first end (344-1) (or the second end (344-2)) of the central region (344), and the central region (344), respectively, but the boundaries of each region are not limited only to the embodiments shown in FIG. 8 and FIG. 9 and the previously mentioned embodiments.According to one embodiment, a portion of the first inner bend (342-1) (or the second inner bend (342-2)) may be included in a second region having a metal layer of medium thickness. Alternatively, according to another embodiment, the first end (344-1) and the second end (344-2) of the central portion (344) may be included in a first region having a metal layer of thin thickness or in a third region having a metal layer of thick thickness. Note that the boundaries of FIGS. 8 and FIGS. 9 are for convenience of explanation.

[0169] According to one embodiment, the first fixed portion (341-1) of the flexible printed circuit board (340) may also be formed with a metal layer thickness greater than that of the first inner curved portion (342-1). For example, the metal layer in the P2-1 region, where the first fixed portion (341-1) is formed in the flexible printed circuit board (340), may be formed thicker compared to the first inner curved portion (342-1) (e.g., P1-1 region). For example, the P2-1 region, where the first fixed portion (341-1) is formed in the flexible printed circuit board (340), may have stronger structural rigidity compared to the first inner curved portion (342-1) (e.g., P1-1 region). The first fixing part (341-1) is a part that is fixed to the first seating groove (3211), and the thickness of the metal layer of the first fixing part (341-1) is formed to be thicker than that of the adjacent first inner curved part (342-1), so that the first fixing part (341-1) can be firmly fixed (or attached) to the first seating groove (3211). According to one embodiment, the first fixing part (341-1) may include a metal layer having a thickness smaller than that of the central part (344) but thicker than that of the metal layer of the first inner curved part (342-1). The first fixing part (341-1) may also be referred to as a second region having a metal layer of intermediate thickness.

[0170] According to one embodiment, the second fixed portion (341-2) of the flexible printed circuit board (340) may also be formed with a metal layer thickness greater than that of the second inner curved portion (342-2). For example, the metal layer in the P2-2 region, where the second fixed portion (341-2) is formed in the flexible printed circuit board (340), may be formed thicker compared to the second inner curved portion (342-2) (e.g., P1-2 region). For example, the P2-2 region, where the second fixed portion (341-2) is formed in the flexible printed circuit board (340), may have stronger structural rigidity compared to the second inner curved portion (342-2) (e.g., P1-2 region). The second fixing part (341-2) is a part that is fixed to the second seating groove (3221), and the thickness of the metal layer of the second fixing part (341-2) is formed to be thicker than that of the adjacent second inner curved part (342-2), so that the second fixing part (342-1) can be firmly fixed (or attached) to the second seating groove (3221). According to one embodiment, the second fixing part (341-2) may include a metal layer having a thickness smaller than that of the central part (344) but thicker than that of the metal layer of the second inner curved part (342-2). The second fixing part (342-2) may also be referred to as a second region having a metal layer of intermediate thickness.

[0171] According to one embodiment, the first outer bend (343-1) may include a metal layer thicker than the thickness of the first fixed portion (341-1). For example, the first outer bend (343-1) (e.g., P3-1 region) may have stronger structural rigidity compared to the first inner extension (342-1) (e.g., P1-1 region) and / or the first fixed portion (341-1) (e.g., P2-1 region). The first outer bend (343-1) is a portion that bends in close contact with the first rib (3213), and the height and / or thickness of the first rib (3213) may be smaller than the height and / or thickness of the first cover end (3321) of the hinge cover (332). Since less stress is applied to the first outer bend (343-1) that is bent in close contact with the first rib (3213) than to the first inner bend (342-1) that is bent in close contact with the first cover end (3321) of the hinge cover (332), the DC resistance can be lowered by having a relatively thick metal layer. According to one embodiment, the first extension (345-1) connected to the first outer bend (343-1) may also include a metal layer thicker than the thickness of the first fixing part (341-1). According to one embodiment, the first outer bend (343-1) and the first extension (345-1) may include a metal layer having a relatively thick thickness. The first outer bend (343-1) and the first extension (345-1) may be referred to as a third region having a thick thickness.

[0172] According to one embodiment, the second outer bend (343-2) may include a metal layer thicker than the thickness of the second fixed portion (341-2). For example, the second outer bend (343-2) (e.g., P3-2 region) may have stronger structural rigidity compared to the second inner extension (342-2) (e.g., P1-2 region) and / or the second fixed portion (341-2) (e.g., P2-2 region). The second outer bend (343-2) is a portion that bends in close contact with the second rib (3223), and the height and / or thickness of the second rib (3223) may be smaller than the height and / or thickness of the second cover end (3322) of the hinge cover (332). Since less stress is applied to the second outer bend (343-2) that is bent in close contact with the second rib (3223) than to the second inner bend (342-2) that is bent in close contact with the cover end (3322) of the hinge cover (332), the DC resistance can be lowered by having a relatively thick metal layer. According to one embodiment, the second extension (345-2) connected to the second outer bend (343-2) may also include a metal layer thicker than the thickness of the second fixing part (341-2). According to one embodiment, the second outer bend (343-2) and the second extension (345-2) may include a metal layer having a relatively thick thickness. The second outer bend (343-2) and the second extension (345-2) may be referred to as a third region having a thick thickness.

[0173] However, it should be noted that in the above embodiment, the thickness of the metal layer of the first outer curved portion (343-1) and the first extension portion (345-1), and the thickness of the metal layer of the second outer curved portion (343-2) and the second extension portion (345-2) may be set differently depending on the embodiment.

[0174] Hereinafter, a flexible printed circuit board (400) and a method for manufacturing the same, wherein the thickness of the metal layer is set differently among a plurality of regions separated along the longitudinal direction of an electronic device, will be described through the embodiments of FIGS. 10 to 20.

[0175] FIG. 10 shows a cross-sectional view of a flexible printed circuit board according to one embodiment. FIG. 11 shows a cross-sectional view of a flexible printed circuit board according to one embodiment. FIG. 12 shows a cross-sectional view of a flexible printed circuit board according to one embodiment.

[0176] FIGS. 10 to 12 may illustrate a flexible printed circuit board (400) according to a comparative example for comparison with the flexible printed circuit board (540) of the present disclosure according to the embodiments of FIGS. 13 to 15 described later. FIGS. 10 to 13 and FIG. 15 below may show an enlarged view of a portion of a cross-section in a state where a plurality of layers are stacked in a flexible printed circuit board.

[0177] Referring to FIG. 10, a flexible printed circuit board (400) according to one embodiment (comparative embodiment) may include a layered structure (or stacked structure) of a plurality of layers (L1, L2, L3, L4, L5, L6). For example, in FIG. 10, one side and the other side of the flexible printed circuit board (400) may include rigid portions (401, 402) for being fixed to a housing (e.g., the first housing structure (311), the second housing structure (312) of FIG. 2 to 3) along the longitudinal direction (e.g., the Y-axis direction). And, between the rigid portions (401, 402), a flexible portion (403) may be included. According to one embodiment, the flex portion (403) may be a portion corresponding to the folding area of ​​the foldable electronic device (e.g., the folding area of ​​the display (e.g., the folding area (231c) of FIG. 2). According to one embodiment, the flex portion (403) may be referred to as the "folding area of ​​the flexible printed circuit board (400)" corresponding to the folding area of ​​the foldable electronic device (e.g., the folding area of ​​the display (e.g., the folding area (231c) of FIG. 2).

[0178] According to various embodiments, the first rigid part (401) and the second rigid part (403) may form the same layer and the same structure. However, they are not necessarily limited thereto, and may form various arrangements and various layered structures. Additionally, in the drawings, the first rigid part (401) and the second rigid part (403) are depicted as having a symmetrical shape, but they are not necessarily limited thereto. Below, the first rigid part (401) and the flex part (403) will be described, and the description of the second rigid part (402) may be omitted. The description of the first rigid part (401) may be applied to the second rigid part (402).

[0179] FIG. 10 illustrates a layered structure (or laminated structure) of a first rigid portion (401) and a flex portion (403) of a flexible printed circuit board (400) comprising a plurality of conductive layers and insulating layers. Referring to FIG. 10, according to one embodiment (comparative embodiment), the first rigid portion (401) comprises a first layer (L1) including a first-1 substrate layer (414) and a first conductive layer (411), a second layer (L2) including a second-1 substrate layer (424), a second conductive layer (421), a second insulating layer (423), and a second-2 substrate layer (425), a third layer (L3) including a third-1 substrate layer (434), a third conductive layer (431), a third insulating layer (433), and a third-2 substrate layer (435), a fourth layer (L4) including a fourth-1 substrate layer (444), a fourth conductive layer (441), a fourth insulating layer (443), and a fourth-2 substrate layer (445), a fifth-1 substrate layer (454), and a fifth It may include a fifth layer (L5) comprising a conductive layer (451), a fifth insulating layer (453), and a fifth-second substrate layer (455), and a sixth layer (L6) comprising a sixth-first substrate layer (464) and a sixth conductive layer (461). According to one embodiment, the first layer (L1), the second layer (L2), the third layer (L3), the fourth layer (L4), the fifth layer (L5), and the sixth layer (L6) may be bonded to the first rigid portion (401). In the flex portion (403), the second layer (L2), the third layer (L3), the fourth layer (L4), and the fifth layer (L5) may be designed to have an air gap (G) between adjacent layers. By having an air gap (G) between layers in the flex section (403), bending in the folding area of ​​the flexible printed circuit board (400) can be performed smoothly.

[0180] An embodiment of FIG. 10 discloses a flexible printed circuit board (400) comprising six layers, but embodiments of the present disclosure are not limited thereto. Depending on the embodiment, the flexible printed circuit board (400) may comprise fewer layers or a greater number of layers as shown in the drawings.

[0181] The second layer (L2), the third layer (L3), the fourth layer (L4), and the fifth layer (L5) may include a plurality of conductive lines, i.e., signal lines, for transmitting signals and / or power. In the embodiment of FIG. 10, the second layer (L2), the third layer (L3), the fourth layer (L4), and the fifth layer (L5) are illustrated as having two substrate layers around (above and below) the conductive layer, according to one embodiment, employing a stripline type signal transmission method. However, this is not limited thereto, and for example, when employing a signal transmission method according to a microstrip type signal transmission method, one of the two substrate layers around the conductive layer may be omitted. For example, the substrate layer may include polyimide and / or a flexible copper clad laminate (FCCL), but is not limited thereto. For example, the conductive layer includes copper but is not necessarily limited thereto. For example, the insulating layer may include a coverlay and / or an adhesive material, but is not limited thereto.

[0182] The first layer (L1) and the sixth layer (L6) may be layers located on the outermost layer of the flexible printed circuit board (400). According to one embodiment, the first layer (L1) and the sixth layer (L6) are present in the first rigid portion (401) and may be omitted in the flex portion (403). According to one embodiment, the first layer (L1) and the sixth layer (L6) may be layers provided for connection through inter-layer vias (V1, V2). The first layer (L1), the second layer (L2), the third layer (L3), the fourth layer (L4), the fifth layer (L5), and the sixth layer (L6) may be electrically connected to each other through vias (V2), but this may be achieved through a copper plating process using the first layer (L1) and the sixth layer (L6). In the embodiment of FIG. 10, a metal layer (412, 462) according to a copper plating process for via connection may be additionally provided in the first layer (L1) and the sixth layer (L6), respectively.

[0183] According to one embodiment, a shielding layer such as a metal paste (416) or a black layer (417) may be further provided on the outer edge of the first layer (L1), and a shielding layer such as a metal paste (466) or a black layer (467) may also be further provided on the outer edge of the sixth layer (L6).

[0184] In the flexible printed circuit board (400) illustrated in FIG. 10, a second layer (L2), a third layer (L3), a fourth layer (L4), and a fifth layer (L5) may be used as layers for transmitting a signal between a first housing structure and a second housing structure. Additionally, the second layer (L2), the third layer (L3), the fourth layer (L4), and the fifth layer (L5) may include a conductive layer that forms a signal line. In the embodiment of FIG. 10, the thickness of the conductive layer made of metal (e.g., copper) is formed uniformly over the entire length of the flex portion (403). With only the structure disclosed in FIG. 10, it may be difficult to achieve the objective of stably and efficiently supplying power using the flexible printed circuit board (400) by increasing the repetitive operation life of the flexible printed circuit board (400) while simultaneously lowering the DC resistance.

[0185] In the embodiments of FIGS. 11 and FIGS. 12 (comparative embodiments), another embodiment of the layered structure (or laminated structure) of the first rigid portion (401) and the flex portion (403) of a flexible printed circuit board (400) comprising a plurality of conductive layers and insulating layers is illustrated. Referring to FIG. 11, according to one embodiment (comparative embodiment), the first rigid portion (401) comprises a first layer (L1) including a first-1 substrate layer (414), a first conductive layer (411), a first insulating layer (413), and a first-2 substrate layer (415); a second layer (L2) including a second-1 substrate layer (424), a second conductive layer (421), a second insulating layer (423), and a second-2 substrate layer (425); a third layer (L3) including a third-1 substrate layer (434), a third conductive layer (431), a third insulating layer (433), and a third-2 substrate layer (435); and a fourth layer including a fourth-1 substrate layer (444), a fourth conductive layer (441), a fourth insulating layer (443), and a fourth-2 substrate layer (445). Layers (L4) may be included. According to one embodiment, the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) may be bonded to the first rigid portion (401). In the flex portion (403), the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) may be designed to have an air gap (G) between adjacent layers. By having an air gap (G) between layers in the flex portion (403), bending in the folding area of ​​the flexible printed circuit board (400) can be performed smoothly. According to one embodiment, a shielding layer such as a metal paste (416) or a black layer (417) may be further provided on the outer edge of the first layer (L1), and a shielding layer such as a metal paste (446) or a black layer (447) may also be further provided on the outer edge of the fourth layer (L4).

[0186] The embodiments of FIGS. 11 and 12 (comparative embodiments) disclose a flexible printed circuit board (400) comprising four layers. In the embodiments of FIGS. 11 and 12, a metal layer (412, 442) formed by a copper plating process for via connection may be additionally provided in the first layer (L1) and the fourth layer (L4), respectively. The embodiment of FIG. 11 discloses a flexible printed circuit board (400) formed by a partial copper plating method, and the embodiment of FIG. 12 discloses a flexible printed circuit board (400) to which a partial copper plating method is not applied.

[0187] In the case of the embodiment of FIG. 12, compared to the embodiment of FIG. 11, the total thickness of the conductive layer in the first layer (L1) and the fourth layer (L4) may be increased due to the addition of metal layers (412, 442) in the first layer (L1) and the fourth layer (L4) in the flex portion (403). As a result, strain may be increased during the folding operation of the foldable electronic device.

[0188] Even if a partial copper plating method is used to reduce the strain in the flex portion (403) where the folding operation is performed as in the embodiment of FIG. 11, only the thickness of the conductive layer in the first layer (L1) and the fourth layer (L4) present in the outermost layer of the flexible printed circuit board (400) can be partially adjusted, and since the thickness of the conductive layer in the second layer (L2) and the third layer (L3) is maintained constant, it may be difficult to achieve the purpose of increasing the repetitive operation life of the flexible printed circuit board (400) or, additionally or generally, lowering the DC resistance.

[0189] FIG. 13 shows a cross-sectional view of a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 14 shows an X-ray photograph of a flexible printed circuit board according to one embodiment of the present disclosure. FIG. 15 shows a cross-sectional view of a flexible printed circuit board according to one embodiment.

[0190] The detailed configuration of the foldable electronic device (501) and the flexible printed circuit board (500) according to one embodiment of the present disclosure, which is not described below, may be identical to the detailed configuration of the electronic device (e.g., electronic device (101), foldable electronic device (301)) and the flexible printed circuit board (340; 400) according to one embodiment of the present disclosure described in relation to FIGS. 1 to 12. The description of identical detailed components is omitted to the extent of overlap.

[0191] Referring to FIG. 13, a flexible printed circuit board (500) according to one embodiment may include a layered structure (or stacked structure) of a plurality of layers (L1, L2, L3, L4). For example, in FIG. 13, one side and the other side of the flexible printed circuit board (500) may include rigid portions for being fixed to a housing (e.g., the first housing structure (311), the second housing structure (312) of FIG. 2 to 3) along the longitudinal direction (e.g., the Y-axis direction). And, between the rigid portions, a flexible portion may be included. According to one embodiment, the flexible portion may be a portion corresponding to a folding area of ​​a foldable electronic device (e.g., a folding area of ​​a display (e.g., 231c of FIG. 2)). According to one embodiment, the flex portion may be referred to as a “folding area of ​​a flexible printed circuit board (500)” corresponding to the folding area of ​​the foldable electronic device (e.g., the folding area of ​​the display (e.g., the folding area (231c) of FIG. 2).

[0192] According to various embodiments, the first rigid part and the second rigid part may form the same layer and the same structure. However, they are not necessarily limited thereto, and various arrangements and various layered structures may be formed. Additionally, the first rigid part and the second rigid part are depicted as having a symmetrical shape in the drawings, but they are not necessarily limited thereto. Below, the first rigid part and the flex part are described, and the description of the second rigid part may be omitted. The description of the first rigid part may be applied to the second rigid part. In the embodiment of FIG. 13, the first rigid part may correspond to the P3-1 region, and the second rigid part may correspond to the P3-2 region. The flex part may correspond to the P2-1 region, P1-1 region, P0-1 region, P0 region, P0-2 region, P1-2 region, and P2-2 region. In this disclosure, for convenience of explanation, the first rigid part, the second rigid part, and the flex part are described with reference to the embodiment of FIG. 13, but it should be noted that the number and / or range of regions corresponding to the first rigid part, the second rigid part, and the flex part are not necessarily limited thereto.

[0193] FIG. 13 illustrates a layered structure (or laminated structure) of a flexible printed circuit board (500) comprising a plurality of conductive layers and insulating layers. The first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) included in the flexible printed circuit board (500) illustrated in FIG. 13 can all be used as layers for transmitting a signal between a first housing structure and a second housing structure. Additionally, the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) may include a conductive layer forming a signal line. Referring to FIG. 13, according to one embodiment, a flexible printed circuit board (500) may include a first layer (L1) comprising a first-1 substrate layer (514), a first conductive layer (511), a first insulating layer (513), and a first-2 substrate layer (515); a second layer (L2) comprising a second-1 substrate layer (524), a second conductive layer (521), a second insulating layer (523), and a second-2 substrate layer (525); a third layer (L3) comprising a third-1 substrate layer (534), a third conductive layer (531), a third insulating layer (533), and a third-2 substrate layer (535); and a fourth layer (L4) comprising a fourth-1 substrate layer (544), a fourth conductive layer (541), a fourth insulating layer (543), and a fourth-2 substrate layer (545). According to one embodiment, the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) can be bonded to the first rigid portion and the second rigid portion. In the flex portion, the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) can be designed to have an air gap (G) between adjacent layers. By having an air gap (G) between layers in the flex portion, bending in the folding area of ​​the flexible printed circuit board (500) can be performed smoothly.

[0194] An embodiment of FIG. 13 discloses a flexible printed circuit board (500) comprising four layers, but embodiments of the present disclosure are not limited thereto. Depending on the embodiment, the flexible printed circuit board (500) may comprise fewer layers or a greater number of layers as shown in the drawings.

[0195] The first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) may each include a plurality of conductive lines as layers for transmitting signals and / or power. In the embodiment of FIG. 13, the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) are illustrated as having two substrate layers surrounding (above and below) the conductive layer, according to one embodiment, employing a stripline type signal transmission method. However, this is not limited thereto; for example, when employing a signal transmission method according to a microstrip type signal transmission method, one of the two substrate layers surrounding the conductive layer may be omitted. For example, the substrate layer may include polyimide and / or a flexible copper clad laminate (FCCL), but is not limited thereto. For example, the conductive layer may include copper, but is not necessarily limited thereto. For example, the insulating layer may include, but is not limited to, a coverlay and / or an adhesive material.

[0196] The first layer (L1) and the fourth layer (L4) may be layers located at the outermost layer of the flexible printed circuit board (500). According to one embodiment, a shielding layer, such as a metal paste (516) or a black layer (517), may be further provided on the outer edge of the first layer (L1), and a shielding layer, such as a metal paste (546) or a black layer (547), may also be further provided on the outer edge of the fourth layer (L4). By placing the thickest and most conductive layer on the outer edge of the multilayer stack, a technical effect can be obtained in which electromagnetic shielding is improved for more sensitive signal lines in the inner layers. These outer layers can act as effective ground layers or power layers to suppress electromagnetic interference (EMI) and prevent crosstalk between signals in different layers. This can improve the signal integrity of the entire flexible printed circuit board and may be particularly useful for high-frequency signals. In addition, to further stabilize the rigid portions of the device, the hardest layers can be placed furthest from the neutral bending axis.

[0197] According to one embodiment, the first layer (L1), the second layer (L2), the third layer (L3), and the fourth layer (L4) may be electrically connected to each other through vias. The first layer (L1) and the fourth layer (L4) may additionally be provided with metal layers (512, 542). The metal layers (512, 542) may be implemented through a copper plating process using the first layer (L1) and the fourth layer (L4). The dual-purpose use of this copper plating process may have the useful advantage of eliminating the need for a separate metal deposition operation to thicken the signal lines. This makes it possible to make the manufacturing process more simplified and cost-effective, reduces potential failure points, and can contribute to making the stack-up of the flexible printed circuit board thinner overall in the rigid region, which is very important for the thin design of modern foldable devices. According to the present disclosure, the metal layer (512, 542) is provided not only to the first rigid portion and the second rigid portion, but may also be provided to the flex portion. The flexible printed circuit board (500) of the present disclosure can lower the DC resistance by further including the metal layer (512, 542) in the flex portion. In addition, according to the present disclosure, the repeated operation life of the flexible printed circuit board (500) can be increased by forming a thin thickness of the conductive layer in a part of the region corresponding to the flex portion of the layers for signal transmission.

[0198] According to the present disclosure, when a flexible printed circuit board (500) includes a first region, a second region, and a third region separated according to the degree of curvature in the folding region in a region corresponding to the folding region of a foldable electronic device (501), the flexible printed circuit board (500) of the present disclosure may have metal materials of different thicknesses in the first region, the second region, and the third region on the same layer.

[0199] For example, referring to FIGS. 7 through 9 together with FIGS. 13 and 14, in a flexible printed circuit board (500), the first inner curved portion (342-1) and the second inner curved portion (342-2), which have the largest curvature within the flex portion, can be designated as the first area (P1-1, P1-2). Also, in the flexible printed circuit board (500), the central portion (344), which has the smallest curvature in the flex portion, and the first rigid portion and the second rigid portion, can be designated as the third area (P0, P3-1, P3-2). Also, in the flexible printed circuit board (500), the area (P2-1, P0-1, P0-2, P2-2) in the flex portion that has less curvature than the first area and more curvature than the third area can be designated as the second area.

[0200] According to one embodiment of the present disclosure, as illustrated in FIGS. 13 and 14, a flexible printed circuit board (500) may include a first region, a second region, and a third region having different thicknesses, wherein the first region may include P1-1 and P1-2, the second region may include P2-1, P0-1, P0-2, and P2-2, and the third region may include P0, P3-1, and P3-2. This division of regions may be an example in which the flexible printed circuit board (500) is symmetrically arranged around the folding axis (or folding surface) of a foldable electronic device (e.g., the foldable electronic device (301) of FIGS. 5 to 7). For convenience, the following description will focus mainly on the embodiments illustrated in FIGS. 13 and 14 and below, but it should be noted that the division of regions is not necessarily limited thereto.

[0201] For example, in some embodiments, the flexible printed circuit board (500) may include only two regions having different thicknesses, or may include regions divided into four or more. In some embodiments, the flexible printed circuit board (500) may include only one of P1-1 and P1-2 as a first region. Also, in some embodiments, the flexible printed circuit board (500) may include only at least one of P2-1, P0-1, P0-2, and P2-2 as a second region. Also, in some embodiments, the flexible printed circuit board (500) may include only at least one of P0, P3-1, and P3-2 as a third region. Also, according to some embodiments, the region divisions shown in FIG. 13 and FIG. 14 may belong to regions other than the aforementioned regions. For example, P0-1 and PO-2 may be included in the first region rather than the second region. Also, for example, P3-1. It is also possible to apply an embodiment in which the P3-2 region is included in the second region or, depending on the case, in the first region. Additionally, for example, P4-1 and P4-2 of FIGS. 8 and 9, which are not mentioned, may be included in the third region. Various other embodiments are also possible.

[0202] According to one embodiment, the thickness of the conductive layer for implementing a conductive line in the second region may be formed to be thicker than that of the first region. Here, the thickness of the first region of each layer may be made thinner than the thickness of the second region by an etching process.

[0203] According to one embodiment, the sum of the thickness of the conductive layer for implementing the conductive line in the third region and the thickness of the additional metal layer according to the copper plating process may be greater than the thickness of the conductive layer for implementing the conductive line in the second region. At this time, it is noted that the thickness of each layer, including the conductive layer, the insulating layer, and the substrate layer, is formed to be constant.

[0204] According to one embodiment, the sum of the thickness of the conductive layer for implementing a conductive line in the third region and the thickness of the additional metal layer according to the copper plating process is greater than the thickness of the conductive layer for implementing a conductive line in the second region, and this can be applied only to the outermost layer (e.g., the first layer (L1), the fourth layer (L4)) of the flexible printed circuit board (500) where copper plating is performed.

[0205] FIG. 15 shows a cross-sectional view of a flexible printed circuit board (500) viewed from a different direction than the embodiment shown in FIG. 13. Referring to FIG. 15, the flexible printed circuit board (500) may have conductive lines of different functions arranged along the width direction (X-axis direction) of the foldable electronic device. Additionally, the additional metal layers (512, 542) may be optionally provided to suit the function required for each conductive line.

[0206] In the embodiment of FIG. 13, the components of each layer (e.g., metal layer) are shown as being left-right symmetrical with respect to the P0 region, which is the central region formed in the flexible printed circuit board (500); however, with reference to FIG. 15, the arrangement position of the metal layer may be asymmetrical when the direction in which the flexible printed circuit board (500) is viewed is different.

[0207] Additionally, referring to FIG. 15, the thicknesses of the conductive layers included in the flexible printed circuit board (500) may differ from layer to layer or may be formed differently even within a single layer.

[0208] Additionally, referring to FIG. 15, the conductive layer included in the flexible printed circuit board (500) may have a discrete form along the longitudinal direction (e.g., Y-axis direction) of the electronic device in each layer.

[0209] Hereinafter, through the embodiments of FIGS. 16 to 20, we will examine a method for manufacturing a flexible printed circuit board (500) according to one embodiment of the present disclosure.

[0210] FIG. 16 is a cross-sectional view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0211] FIG. 16 may show a cross-sectional view of one layer included in a flexible printed circuit board (500).

[0212] The layer (500) included in the flexible printed circuit board (500) may include a first-1 substrate layer (514), a first conductive layer (511), a first insulating layer (513), and a first-2 substrate layer (515). Here, the first conductive layer (511) may be shown to be made of substantially the same material as the additional metal layer (512). In the first region (A1), the first conductive layer (511) may have the thinnest thickness of the metal material, and in the third region (A3), the first conductive layer (511) may have the thickest thickness of the metal material. In the second region (A2), the thickness of the metal material of the first conductive layer (511) may have a thickness between the thickness in the first region (A1) and the thickness in the third region (A3). At this time, the insulating layer (513) can be formed with the thickest thickness in the first region (A1) where the thickness of the metal material is thinnest, and the thinnest thickness in the third region (A3) where the thickness of the metal material is thickest.

[0213] In order to form metal materials having different thicknesses, such as the embodiment shown in FIG. 16, the present disclosure may use a subtractive method and an additive method.

[0214] FIG. 17 is a drawing illustrating a manufacturing method according to one embodiment of the present disclosure. FIG. 18 is a drawing illustrating a manufacturing method according to one embodiment of the present disclosure. FIG. 19 is a drawing illustrating a manufacturing method according to one embodiment of the present disclosure. FIG. 20 is a drawing illustrating a manufacturing method according to one embodiment of the present disclosure.

[0215] FIG. 17 shows a subtractive method, FIG. 18 shows an additive method, FIG. 19 shows an example manufactured using the subtractive method after the additive method, and FIG. 20 shows an example manufactured using the additive method after the subtractive method.

[0216] Referring to FIG. 17, according to the subtractive method, after forming a first conductive layer (511) on a first-1 substrate layer (514), a dry film (518) can be developed in an outer region (e.g., a second region) other than the target region (e.g., a first region). Then, by performing selective etching, the thickness of the conductive layer can be formed differently in different regions of the flexible printed circuit board (500). With the first conductive layer (511) and the dry film (518) developed on the first-1 substrate layer (514), the target region of the conductive layer can be etched to a desired depth through an exposure operation for a predetermined time. After that, by performing a peeling operation of the dry film (518), a flexible printed circuit board (500) with different thicknesses of the conductive layer in two different regions can be obtained.

[0217] Referring to FIG. 18, according to the additive method, after forming a first conductive layer (511) on a first-1 substrate layer (514), a dry film (518) is developed in a target area (e.g., a first area), and a copper plating process is performed on an area outside the target area (e.g., a second area) so that the thickness of the conductive layer can be formed differently in different areas of the flexible printed circuit board (500). A first conductive layer (511) can be formed on the first-1 substrate layer (514), and a second conductive layer (512) can be formed thereon. Then, with the first-1 substrate layer (514), the first conductive layer (511), and the second conductive layer (512) formed, and a dry film (518) developed between the second conductive layer (512), the thickness of the conductive layer can be increased to a desired height through a copper plating process. After that, by peeling off the dry film (518), a flexible printed circuit board (500) with different thicknesses of the conductive layer in two different regions can be obtained.

[0218] Referring to FIG. 19, according to an embodiment manufactured using a subtractive method after an additive method, a first conductive layer (511) is formed on a first-1 substrate layer (514), and then a copper plating method (or copper plating process) is performed to form an additional metal layer (512). Then, a dry film (518) is developed on an outer area (e.g., a second area and a third area) other than a target area (e.g., a first area) to cover the additional metal layer, and the target area of ​​the conductive layer can be etched to a desired depth through an exposure operation for a predetermined time. After that, by peeling off the dry film (518), a flexible printed circuit board (500) with different thicknesses of the conductive layer in three different areas can be obtained.

[0219] Referring to FIG. 20, according to an embodiment manufactured using an additive method after a subtractive method, a flexible printed circuit board (500) having different thicknesses of conductive layers in two different regions is obtained by performing the process according to the embodiment of FIG. 17. Then, a dry film (518) is developed to cover a target region (e.g., a first region) and a part of the outer region of the target region (e.g., a second region), and the target region of the conductive layer can be etched to a desired depth through an exposure operation for a predetermined time. Before developing the dry film (518), an additional metal layer (512) is formed in a region further outward (e.g., a third region) than the target region (e.g., a first region) and a part of the outer region of the target region (e.g., a second region). After that, by undergoing a peeling operation of the dry film (518), a flexible printed circuit board (500) having different thicknesses of conductive layers in three different regions can be obtained.

[0220] According to one embodiment of the present disclosure, a foldable electronic device (101; 301) comprising a flexible printed circuit board (FPCB) may be provided. The foldable electronic device may include a first housing (210; 311) comprising a first component; a second housing (220; 312) comprising a second component; a hinge assembly (270; 330) rotatably connecting the first housing and the second housing; a flexible display (160; 230) disposed from the first housing to the second housing across an area where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) (280; 340; 500) electrically connecting the first component and the second component and comprising a plurality of layers. Signal lines for signal and / or power transmission included in the plurality of layers of the flexible printed circuit board include a metallic material, and the folding region of the flexible printed circuit board corresponding to the folding region of the foldable electronic device includes a first region, a second region, and a third region distinguished according to the degree of bending, and at least one of the plurality of layers may be formed such that the metallic material in the first region, the second region, and the third region on the same layer has different thicknesses. While embodiments of the first, second, and third regions provide an advantage in progressive stiffness, it is also considered that the present invention may be implemented with at least two regions having different metal thicknesses. For example, one embodiment may include only a first region, which is the thinnest region corresponding to the primary bending zone, and a third region, which is the thickest region for the rigid parts, excluding a distinguished second region. Forming the metallic material to have different thicknesses in defined regions on a single layer in this way can achieve several technical synergistic effects.This allows mechanical and electrical requirements to be separated, enabling the thinnest first region to maximize flexibility and the thickest third region to minimize electrical resistance. This results in an intentionally designed non-uniform stiffness distribution across the entire flexible printed circuit board, which induces bending behavior and concentrates deformation in the areas designed to withstand bending. This controlled bending can significantly improve overall reliability and the mean time between failures (MTBF) beyond the intended life cycle of the foldable device.

[0221] According to one embodiment, the first region corresponds to a flex portion where the signal line is bent in the flexible printed circuit board, and the metal material of the first region may be formed to have the thinnest thickness among the first region, the second region, and the third region. The technical effect of this particular relationship may be the optimal separation of mechanical and electrical properties. By forming the metal of the most flexible first region as thin as possible, bending stress and mechanical deformation can be minimized, and the fatigue life of the conductor can be maximized. At the same time, by forming the metal of the third region, which has less flexibility, as thick as possible, electrical resistance can be minimized, and high power integrity and signal fidelity can be ensured. Such a purpose-built design can directly resolve the inherent trade-off between mechanical durability and electrical performance as a single integrated solution. The third region corresponds to a rigid portion in the flexible printed circuit board where the signal lines are arranged flatly, and the metal material of the third region may be formed to have the thickest thickness among the first region, the second region, and the third region. As a non-limiting embodiment, for example, the thickness of the metal material in the first region may be 5 μm to 15 μm. The thickness of the third region may be 25 μm to 75 μm. The ratio of the thickness of the metal in the third region to the thickness of the first region may be at least 2:1 and may be 3:1 to 5:1 in order to significantly improve conductivity without compromising the overall flexibility of the flexible printed circuit board.

[0222] According to one embodiment, the signal line may include copper (cu) and be formed such that the thickness of the copper is thinnest in the first region and the thickness of the copper is thickest in the third region. The thickness of the copper in the third region may be the sum of the thickness of the copper included in the conductive line and the thickness of the copper added in the copper plating process for forming the via.

[0223] According to one embodiment, the third region may be formed on two layers formed at the outermost edge of the flexible printed circuit board among the plurality of layers.

[0224] According to one embodiment, among the plurality of layers, the layers disposed inside the two layers formed at the outermost edge of the flexible printed circuit board may be formed such that the metal material included in the signal line has different thicknesses in two different regions.

[0225] According to one embodiment, a hinge cover (260; 332) covering the hinge assembly may be included. The flexible printed circuit board may include a first inner bend (342-1) and a second inner bend (342-2) that are bent in correspondence with the cover ends (3321, 3322) of the hinge cover, and may include a central portion (344) disposed between the first inner bend and the second inner bend. In the first inner bend and the second inner bend, the metal material included in the signal line may be formed thinly. In the central portion, the metal material included in the signal line may be formed relatively thickly compared to the metal material included in the signal line in the first inner bend and the second inner bend.

[0226] According to one embodiment, in the region between the first inner bend and the central portion, the thickness of the metal material included in the signal line may be formed to be thicker than the thickness of the metal material included in the signal line at the first inner bend and thinner than the thickness of the metal material included in the signal line at the central portion. In the region between the second inner bend and the central portion, the thickness of the metal material included in the signal line may be formed to be thicker than the thickness of the metal material included in the signal line at the second inner bend and thinner than the thickness of the metal material included in the signal line at the central portion.

[0227] According to one embodiment, the flexible printed circuit board may include a first fixing portion (341-1) and a second fixing portion (341-2) that are seated on a support member (321, 322) of the foldable electronic device. It may include a first outer bending portion (343-1) extending from the first fixing portion in a direction opposite to the folding axis of the foldable electronic device and a second outer bending portion (343-2) extending from the second fixing portion in a direction opposite to the folding axis. The thickness of the metal material included in the signal line in the first outer bending portion and the second outer bending portion may be formed to be thicker than the thickness of the metal material included in the signal line in the first inner bending portion and the second inner bending portion.

[0228] According to one embodiment, an air gap may be formed between adjacent layers among the plurality of layers of the flexible printed circuit board.

[0229] According to one embodiment, at least two layers among the plurality of layers of the flexible printed circuit board, including a substrate layer, a conductive layer, and an insulating layer, may be formed to have substantially the same thickness for each layer.

[0230] According to one embodiment, the flexible printed circuit board may be manufactured according to one of an additive process, a subtractive process, a subtractive process after an additive process, or an additive process after a subtractive process.

[0231] According to one embodiment, the first region is a region formed to be the thinnest compared to the second region or the third region, and can be formed by an additive method or a subtractive method. The third region can be formed by a copper plating method.

[0232] According to one embodiment of the present disclosure, a foldable electronic device (101; 301) comprising a flexible printed circuit board (FPCB) may be provided. The foldable electronic device may include a first housing (210; 311) comprising a first component; a second housing (220; 312) comprising a second component; a hinge assembly (270; 330) rotatably connecting the first housing and the second housing; a flexible display (160; 230) disposed from the first housing to the second housing across a folding area where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) (280; 340; 500) electrically connecting the first component and the second component, comprising a plurality of layers, a flex portion corresponding to the folding area, and a rigid portion at one end and the other end of the flex portion. A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board comprises a metallic material and may include a first region, a second region, and a third region distinguished according to the degree of curvature in the folding region of the flexible printed circuit board. The first region corresponds to a flex portion in the flexible printed circuit board where the signal line is bent, and the metallic material of the first region may be formed to have the thinnest thickness among the first region, the second region, and the third region. The third region corresponds to a rigid portion in the flexible printed circuit board where the signal line is arranged flat, and the metallic material of the third region may be formed to have the thickest thickness among the first region, the second region, and the third region. The metallic material of the second region may be formed to be thicker than the thickness of the metallic material of the first region and thinner than the thickness of the metallic material of the third region.

[0233] According to one embodiment, the signal line may include copper (cu) and be formed such that the thickness of the copper is thinnest in the first region and the thickness of the copper is thickest in the third region. The thickness of the copper in the third region may be the sum of the thickness of the copper included in the conductive line and the thickness of the copper added in the copper plating process for forming the via.

[0234] According to one embodiment, the third region may be formed to have a thicker thickness than the first region and the second region in the outermost layer of the flexible printed circuit board among the plurality of layers.

[0235] According to one embodiment, among the plurality of layers, the layers disposed inside the two layers formed at the outermost edge of the flexible printed circuit board may be formed such that the metal material included in the signal line has different thicknesses in two different regions.

[0236] According to one embodiment, a hinge cover (260; 332) covering the hinge assembly may be included. The flexible printed circuit board may include a first inner bend (342-1) and a second inner bend (342-2) that are bent in correspondence with the cover ends (3321, 3322) of the hinge cover, and may include a central portion (344) disposed between the first inner bend and the second inner bend. In the first inner bend and the second inner bend, the metal material included in the signal line may be formed thinly. In the central portion, the metal material included in the signal line may be formed relatively thickly compared to the metal material included in the signal line in the first inner bend and the second inner bend.

[0237] According to one embodiment, the first region is a region formed to be the thinnest compared to the second region or the third region, and can be formed by an additive method or a subtractive method. The third region can be formed by a copper plating method.

[0238] According to one embodiment of the present disclosure, a foldable electronic device (101; 301) comprising a flexible printed circuit board (FPCB) may be provided. The foldable electronic device may include: a first housing (210; 311) comprising a first component; a second housing (220; 312) comprising a second component; a hinge assembly (270; 330) rotatably connecting the first housing and the second housing; a flexible display (160; 230) disposed from the first housing to the second housing across a folding area where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) (280; 340; 500) that electrically connects the first component and the second component, comprises a plurality of layers, and includes a flex portion corresponding to the folding area and a rigid portion at one end and the other end of the flex portion. The signal lines for transmitting signals and / or power included in the plurality of layers of the flexible printed circuit board may include a metallic material and may include a first region, a second region, and a third region distinguished according to the degree of curvature in the folding region of the flexible printed circuit board.

[0239] The third region may be formed to have a thicker thickness than the first and second regions in the outermost layer of the flexible printed circuit board among the plurality of layers. The layer disposed inside the two layers formed on the outermost edge of the flexible printed circuit board among the plurality of layers may be formed such that the metal material included in the signal line in the first and second regions has different thicknesses.

[0240] According to one embodiment, the first region is a region formed to be the thinnest compared to the second region or the third region, and can be formed by an additive method or a subtractive method. The third region can be formed by a copper plating method.

[0241] Although the present disclosure has been described by way of example with respect to one embodiment, it should be understood that the embodiment is for illustrative purposes only and is not intended to limit the present disclosure. It will be obvious to those skilled in the art that various changes in form and detailed configuration may be made without departing from the whole context of the present disclosure, including the appended claims and their equivalents.

[0242] The following additional aspects of the present disclosure are also defined.

[0243] Aspect 1. According to one embodiment of the present disclosure, a foldable electronic device comprising a flexible printed circuit board (FPCB) may be provided. The foldable electronic device may include: a first housing comprising a first component; a second housing comprising a second component; a hinge assembly rotatably connecting the first housing and the second housing; a flexible display disposed from the first housing to the second housing across a folding region where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) electrically connecting the first component and the second component, comprising a plurality of layers, a flex portion corresponding to the folding region, and rigid portions at one end and the other end of the flex portion. Signal lines for signal and / or power transmission included in the plurality of layers of the flexible printed circuit board may include a metallic material and may include a first region, a second region, and a third region separated according to the degree of curvature in the folding region of the flexible printed circuit board. The first region corresponds to a flex portion where the signal line is bent in the flexible printed circuit board, and the metal material of the first region is formed to be the thinnest among the metal materials of the first region, the second region, and the third region, and the third region corresponds to a rigid portion where the signal line is arranged flat in the flexible printed circuit board, and the metal material of the third region is formed to be the thickest among the metal materials of the first region, the second region, and the third region, and the metal material of the second region may be formed to be thicker than the metal material of the first region and thinner than the metal material of the third region.

[0244] A second aspect (aspect 2). In the foldable electronic device of the first aspect, the signal line comprises copper, the thickness of the copper is thinnest in the first region and thickest in the third region, and the thickness of the copper in the third region may be the sum of the thickness of the conductive phosphorus and the thickness of the copper added by the copper plating method for forming vias.

[0245] A third aspect (aspect 3). In the foldable electronic device of the second aspect, the third area may be formed to have a thicker thickness than the first area and the second area in a layer formed on the outer side of the flexible printed circuit board among a plurality of layers.

[0246] Aspect 4. In the foldable electronic device of the third aspect, among the plurality of layers, the layer disposed inside the two layers formed on the outer side of the flexible printed circuit board may be formed such that the metal material included in the signal line has different thicknesses in two different regions.

[0247] A fifth aspect (aspect 5). Any one of the first to fourth aspects of the foldable electronic device further includes a hinge cover covering a hinge assembly, and the flexible printed circuit board includes a first inner curve and a second inner curve that are curved corresponding to the cover ends of the hinge cover, and includes a central portion disposed between the first inner curve and the second inner curve, wherein the metal material included in the signal lines of the first inner curve and the second inner curve is formed thinly, and the metal material included in the signal lines of the central portion may be formed relatively thickly compared to the metal material included in the signal lines of the first inner curve and the second inner curve.

[0248] Aspect 6. In any one of the first to fifth aspects of a foldable electronic device, the first region is the region having the thinnest thickness compared to the second region or the third region, the first region is formed by an additive or subtractive process, and the third region can be formed by a copper plating process.

[0249] Aspect 7. According to one embodiment of the present disclosure, a foldable electronic device comprising a flexible printed circuit board (FPCB) may be provided. The foldable electronic device may include: a first housing comprising a first component; a second housing comprising a second component; a hinge assembly rotatably connecting the first housing and the second housing; a flexible display disposed from the first housing to the second housing across a folding region where the hinge assembly is disposed; and a flexible printed circuit board (FPCB) electrically connecting the first component and the second component, comprising a plurality of layers, a flex portion corresponding to the folding region, and rigid portions at one end and the other end of the flex portion. Signal lines for signal and / or power transmission included in the plurality of layers of the flexible printed circuit board may include a metallic material and may include a first region, a second region, and a third region separated according to the degree of curvature in the folding region of the flexible printed circuit board. The third region may be formed to have a thicker thickness than the first region and the second region in the outermost layer of the flexible printed circuit board among the plurality of layers, and the layer disposed inside the two outermost layers of the flexible printed circuit board among the plurality of layers may be formed such that the metal material included in the signal line has different thicknesses in the first region and the second region.

[0250] Aspect 8. In the foldable electronic device of the seventh aspect, the first region is formed to have the thinnest thickness compared to the second region or the third region, and is formed by an additive or subtractive method, and the third region can be formed by a copper plating method.

Claims

1. A foldable electronic device (101; 301) comprising a flexible printed circuit board (FPCB), A first housing (210; 311) including a first component; A second housing (220; 312) including a second part; A hinge assembly (270; 330) that rotatably connects the first housing and the second housing; A flexible display (160; 230) disposed from the first housing across the area where the hinge assembly is disposed to the second housing; and It includes a flexible printed circuit board (FPCB) (280; 340; 500) that electrically connects the first component and the second component and includes a plurality of layers, and A signal line for transmitting a signal and / or power included in the plurality of layers of the flexible printed circuit board comprises a metal material, and the folding region of the flexible printed circuit board corresponding to the folding region of the foldable electronic device comprises a first region, a second region, and a third region distinguished according to the degree of curvature, and at least one of the plurality of layers is formed such that the metal material in the first region, the second region, and the third region on the same layer has different thicknesses.

2. In Paragraph 1, The first region corresponds to a flex portion where the signal line is bent in the flexible printed circuit board, and the metallic material of the first region is formed to have the thinnest thickness among the first region, the second region, and the third region, A foldable electronic device in which the third region corresponds to a rigid portion in which the signal line is flatly arranged on the flexible printed circuit board, and the metal material of the third region is formed to have the thickest thickness among the first region, the second region, and the third region.

3. In Paragraph 2, The above signal line comprises copper (Cu), and is formed such that the thickness of the copper is thinnest in the first region and the thickness of the copper is thickest in the third region, and A foldable electronic device in which the thickness of the copper in the third region is the sum of the thickness of the copper included in the conductive line and the thickness of the copper added in the copper plating method for forming vias.

4. In Paragraph 2 or 3, The above third region is a foldable electronic device formed on two layers formed at the outermost edge of the flexible printed circuit board among the plurality of layers.

5. In Paragraph 2 or 3, A foldable electronic device in which a layer disposed inside the two outermost layers of the flexible printed circuit board among the plurality of layers is formed such that the metal material included in the signal line has different thicknesses in two different regions.

6. In any one of paragraphs 1 to 5, It includes a hinge cover (260; 332) that covers the above hinge assembly, and The flexible printed circuit board comprises a first inner bend (342-1) and a second inner bend (342-2) that are bent in correspondence with the cover ends (3321, 3322) of the hinge cover, and a central portion (344) disposed between the first inner bend and the second inner bend. In the first inner bend and the second inner bend, the metal material included in the signal line is formed thinly, and A foldable electronic device in which the metal material included in the signal line at the central portion is formed to be relatively thicker than the metal material included in the signal line at the first inner bend portion and the second inner bend portion.

7. In Paragraph 6, In the region between the first inner bend and the central portion, the thickness of the metal material included in the signal line is formed to be thicker than the thickness of the metal material included in the signal line at the first inner bend and thinner than the thickness of the metal material included in the signal line at the central portion, A foldable electronic device in which the thickness of the metal material included in the signal line in the region between the second inner curve and the central portion is formed to be thicker than the thickness of the metal material included in the signal line in the second inner curve and thinner than the thickness of the metal material included in the signal line in the central portion.

8. In Paragraph 6 or 7, The flexible printed circuit board includes a first fixing part (341-1) and a second fixing part (341-2) that are seated on a support member (321, 322) of the foldable electronic device, and It includes a first outer curved portion (343-1) extending from the first fixed portion in a direction opposite to the folding axis of the foldable electronic device, and a second outer curved portion (343-2) extending from the second fixed portion in a direction opposite to the folding axis, A foldable electronic device in which the thickness of the metal material included in the signal line in the first outer bend and the second outer bend is thicker than the thickness of the metal material included in the signal line in the first inner bend and the second inner bend.

9. In paragraphs 1 through 8, A foldable electronic device having an air gap formed between adjacent layers among the plurality of layers of the flexible printed circuit board.

10. In paragraphs 1 through 9, A foldable electronic device in which at least two layers, including a substrate layer, a conductive layer, and an insulating layer, among the plurality of layers of the flexible printed circuit board, are formed to have substantially the same thickness for each layer.

11. In any one of paragraphs 1 through 10, The above flexible printed circuit board is a foldable electronic device manufactured according to one of an additive process, a subtractive process, a subtractive process after an additive process, or an additive process after a subtractive process.

12. In any one of paragraphs 1 to 11, The first region is a region formed to have the thinnest thickness compared to the second region or the third region, and is formed by an additive method or a subtractive method, and The above third region is a foldable electronic device formed by a copper plating method.

13. A method for manufacturing a flexible printed circuit board for connecting a first component and a second component within a foldable electronic device, wherein An operation of providing a plurality of layers for a flexible printed circuit board, wherein at least one of the plurality of layers includes a signal line for signal and / or power transmission comprising a metal material, and An operation of processing a flexible printed circuit board, wherein the operation of processing the flexible printed circuit board defines a first region, a second region, and a third region classified according to the degree of bending within a folding region corresponding to a folding region of a foldable electronic device; and A method for manufacturing a flexible printed circuit board comprising the operation of processing a metal material such that a first region, a second region, and a third region on the same layer within at least one layer have different thicknesses.

14. In claim 13, in the operation of processing the metal material, The metallic material within the first region corresponding to the curved flexible portion of the signal line is made thinnest among the thicknesses of the first region, the second region, and the third region, and A method for manufacturing a flexible printed circuit board by making the metal material in a third region corresponding to a rigid portion where signal lines are arranged flatly the thickest among the thicknesses of the first region, the second region, and the third region.

15. In claim 14, in the operation of processing the metal material, The above metal material contains copper, and The operation of forming a metallic material that makes the above-mentioned third region the thickest is A method for manufacturing a flexible printed circuit board comprising performing a copper plating process for forming vias, such that the thickness of the copper in the third region becomes the sum of the thickness of the conductive line and the thickness of the copper added by the copper plating process.

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