Liquid cooling assembly, on-board charger and vehicle

Abstract

The present application relates to the technical field of liquid cooling and heat dissipation. Disclosed are a liquid cooling assembly, an on-board charger and a vehicle. The liquid cooling assembly comprises: a heat dissipation base, the heat dissipation base comprising a heat dissipation substrate, and a first heat dissipation side plate and a second heat dissipation side plate which are arranged on the heat dissipation substrate, wherein the first heat dissipation side plate and the second heat dissipation side plate are arranged spaced apart from each other in the direction of width of the heat dissipation substrate and cooperate with the heat dissipation substrate to enclose and form a heat dissipation cavity for mounting a heating element, and a cooling flow channel is formed inside the heat dissipation substrate, the first heat dissipation side plate and the second heat dissipation side plate; and an end cover, which is arranged at an end portion of the heat dissipation base and connected to the heat dissipation substrate, the first heat dissipation side plate and the second heat dissipation side plate. The technical solution of the present application increases the heat dissipation area of the liquid cooling assembly.

Description

Liquid cooling components, on-board chargers and vehicles

[0001] This application claims priority to Chinese Patent Application No. 202422743618.9, filed on November 11, 2024, entitled "Liquid Cooling Components and On-board Charger", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of liquid cooling technology, and more particularly to a liquid cooling component, an on-board charger, and a vehicle. Background Technology

[0003] As the performance of electronic devices continues to improve, their power consumption and heat generation also increase. To ensure stable operation of electronic devices in high-temperature environments, heat dissipation has become a hot research topic. Traditional air cooling methods are insufficient to meet the heat dissipation requirements of high-power electronic devices, and liquid cooling technology is gradually becoming a key technology for solving the heat dissipation problem of high-power electronic devices. Liquid cooling technology has advantages such as high heat dissipation efficiency, low noise, and uniform temperature; however, in practical applications, the heat dissipation area of ​​existing liquid cooling components is relatively small, which limits the heat dissipation effect. Summary of the Invention

[0004] The main objective of this application is to provide a liquid cooling component, an on-board charger, and a vehicle, with the aim of increasing the heat dissipation area of ​​the liquid cooling component.

[0005] To achieve the above objectives, embodiments of this application propose a liquid cooling assembly, which includes:

[0006] A heat sink includes a heat sink substrate and a first heat sink side plate and a second heat sink side plate disposed on the heat sink substrate. The first and second heat sink side plates are spaced apart along the width direction of the heat sink substrate and cooperate with the heat sink substrate to form a heat sink cavity for mounting a heat-generating element. Cooling channels are formed inside the heat sink substrate, the first heat sink side plate, and the second heat sink side plate.

[0007] An end cap is provided at the end of the heat sink body and connects the heat sink base plate, the first heat sink side plate and the second heat sink side plate.

[0008] In one embodiment, the cooling channel includes a first channel and a second channel disposed on the heat dissipation substrate and spaced apart along the width direction of the heat dissipation substrate, a third channel disposed on the first heat dissipation side plate, and a fourth channel disposed on the second heat dissipation side plate. The first channel and the third channel are connected to form an inlet channel, and the second channel and the fourth channel are connected to form an outlet channel.

[0009] In one embodiment, the end cap includes a first sub-cap disposed at one end of the heat sink body. The first sub-cap has a liquid outlet manifold that connects the liquid inlet channel and the liquid outlet channel.

[0010] In one embodiment, the liquid cooling assembly further includes a flow guide plate disposed between the first sub-cover and the heat sink body. The flow guide plate is provided with a flow guide channel, and the liquid inlet channel and the liquid outlet channel are connected to the liquid outlet manifold through the flow guide channel.

[0011] In one embodiment, the drainage channel includes an inlet drainage sub-channel and an outlet drainage sub-channel that are independently arranged. The inlet drainage sub-channel connects the inlet channel and the outlet manifold, and the outlet drainage sub-channel connects the outlet channel and the outlet manifold.

[0012] In one embodiment, the first heat dissipation side plate is provided with at least two liquid inlet channels, and the at least two liquid inlet channels are spaced apart along the height direction of the first heat dissipation side plate; the second heat dissipation side plate is provided with at least two liquid outlet channels, and the at least two liquid outlet channels are spaced apart along the height direction of the second heat dissipation side plate.

[0013] In one embodiment, the end cap includes a second sub-cap located at the other end of the heat sink body. An inlet connector and an outlet connector are provided between the second sub-cap and the heat sink body. The inlet connector is connected to the inlet channel, and the outlet connector is connected to the outlet channel.

[0014] In one embodiment, the second cover is provided with an inlet chamber and an outlet chamber, the inlet chamber being connected to an inlet connector and an inlet channel, and the outlet chamber being connected to an outlet channel and an outlet connector.

[0015] In one embodiment, the liquid cooling assembly further includes a liquid inlet pipe connected to a liquid inlet connector; and / or, the liquid cooling assembly further includes a liquid outlet pipe connected to a liquid outlet connector.

[0016] In one embodiment, the heat sink is integrally extruded.

[0017] In one embodiment, the interior of the cooling channel is provided with reinforcing ribs.

[0018] In one embodiment, the surface of the heat sink is provided with a mounting structure for assembly to an installation medium.

[0019] In one embodiment, the mounting structure is a mounting leg, with one end of the mounting leg fixed to the outer surface of the heat sink and the other end of the mounting leg having a mounting hole.

[0020] In one embodiment, the heat dissipation substrate, the first heat dissipation side plate, and the second heat dissipation side plate are all welded and fixed to the end cap.

[0021] In one embodiment, the end cap has a cooling channel inside that communicates with the cooling flow channel.

[0022] In one embodiment, the heat dissipation substrate, the first heat dissipation side plate, and the second heat dissipation side plate form a U-shaped structure, and the three inner side walls of the heat dissipation cavity are all heat dissipation surfaces corresponding to the cooling flow channels.

[0023] To achieve the above objectives, this application provides an on-board charger, which includes the liquid cooling components described above.

[0024] To achieve the above objectives, this application provides a vehicle that includes the on-board charger described above.

[0025] The technical solution of this application forms cooling channels inside the heat dissipation substrate, the first heat dissipation side plate, and the second heat dissipation side plate, allowing at least three sides of the heat-generating element to contact the cooling channels for heat dissipation. While maintaining the same volume of the heat sink, this effectively increases the heat dissipation area. The coolant can then fully contact the surface of the heat-generating element during its flow, absorbing more heat from the element's surface and thus improving the heat dissipation effect. Simultaneously, power devices can be mounted on the outer surfaces of the heat dissipation substrate, the first heat dissipation side plate, and the second heat dissipation side plate, effectively increasing the heat dissipation area and further improving the overall heat dissipation effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 is an exploded structural diagram of an embodiment of the on-board charger of this application;

[0028] Figure 2 is an exploded structural diagram of an embodiment of the liquid cooling component of this application;

[0029] Figure 3 is an exploded structural diagram of another embodiment of the liquid cooling component of this application;

[0030] Figure 4 is a partial cross-sectional view of an embodiment of the liquid cooling component of this application.

[0031] Reference numerals: 100, Heat sink base; 110, Heat sink base plate; 120, First heat sink side plate; 130, Second heat sink side plate; 200, End cap; 210, First sub-cap; 211, Liquid outlet manifold; 220, Second sub-cap; 300, Cooling channel; 310, First channel; 320, Second channel; 330, Third channel; 340, Fourth channel; 400, Drain plate; 410, Drain channel; 510, Liquid inlet connector; 520, Liquid outlet connector; 600, Mounting structure; 710, Liquid inlet pipe; 720, Liquid outlet pipe.

[0032] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the embodiments of this application.

[0034] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0035] Furthermore, in the embodiments of this application, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the embodiments of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0037] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the embodiments of this application.

[0038] Liquid cooling technology, with its advantages of high heat dissipation efficiency, low noise, and uniform temperature, has gradually become a key technology for solving the heat dissipation problem of high-power electronic devices. Existing U-shaped liquid cooling plates typically only have cooling channels on the bottom or side plates to form a heat dissipation surface. The limited number of heat dissipation surfaces restricts the layout of heat-generating components, hindering their heat dissipation and resulting in poor overall cooling performance.

[0039] In view of this, the present application provides a liquid cooling component and an on-board charger, in which cooling channels are formed inside the heat dissipation substrate, the first heat dissipation side plate and the second heat dissipation side plate. While keeping the volume of the heat dissipation base unchanged, the heat dissipation area is effectively increased. During the flow of the coolant, it can fully contact the surface of the heat-generating element and absorb more heat from the surface of the heat-generating element, thereby improving the heat dissipation effect.

[0040] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0041] As shown in Figures 1 to 4, this application provides a liquid cooling assembly, which includes:

[0042] The heat sink 100 includes a heat sink substrate 110 and a first heat sink side plate 120 and a second heat sink side plate 130 disposed on the heat sink substrate 110. The first heat sink side plate 120 and the second heat sink side plate 130 are spaced apart along the width direction of the heat sink substrate 110 and cooperate with the heat sink substrate 110 to form a heat sink cavity for mounting a heat-generating element. Cooling channels 300 are formed inside the heat sink substrate 110, the first heat sink side plate 120 and the second heat sink side plate 130. Understandably, the heat dissipation substrate 110, the first heat dissipation side plate 120, and the second heat dissipation side plate 130 form a U-shaped liquid cooling plate. Magnetic devices and other heat-generating components can be housed within the heat dissipation cavity. Since cooling channels 300 are formed inside the heat dissipation substrate 110, the first heat dissipation side plate 120, and the second heat dissipation side plate 130, all three sides of the heat dissipation cavity form heat dissipation surfaces. Compared to setting cooling channels 300 only on the bottom plate and side plates, this increases the heat dissipation area, thereby increasing the contact area between the heat-generating components and the coolant. The coolant can fully contact the surface of the heat-generating components, and the heat generated by the heat-generating components can be promptly carried away by the flow of the coolant, thus improving the heat dissipation effect. Simultaneously, other heat-generating components such as MOSFETs and circuit boards can be placed on the outer surfaces of the heat dissipation substrate 110, the first heat dissipation side plate 120, and the second heat dissipation side plate 130, effectively improving the flexibility of the heat-generating component layout and ensuring heat dissipation performance. Optionally, the heat sink 100 is integrally extruded. The heat sink 100 can be extruded to a corresponding length according to the number of heating devices or the length of the heating elements. Compared with traditional die casting, this avoids the repeated development of die casting molds, reduces production costs, and offers better versatility.

[0043] An end cap 200 is disposed at the end of the heat sink 100 and connects the heat sink base 110, the first heat sink side plate 120, and the second heat sink side plate 130. Specifically, the end cap 200 can block the cooling channel 300. Optionally, the heat sink base 110, the first heat sink side plate 120, and the second heat sink side plate 130 are all welded to the end cap 200 to improve sealing. In one embodiment, the end cap 200 may also have a cooling channel communicating with the cooling channel 300 inside, thereby further increasing the heat dissipation area and improving the heat dissipation effect.

[0044] In this embodiment, by forming cooling channels inside the heat dissipation substrate 110, the first heat dissipation side plate 120, and the second heat dissipation side plate 130, at least three sides of the heat-generating element can contact the cooling channels 300 for heat dissipation. While maintaining the same volume of the heat sink 100, the heat dissipation area is effectively increased. During the flow of the coolant, it can fully contact the surface of the heat-generating element, absorbing more heat from the surface of the element, thereby improving the heat dissipation effect. Simultaneously, heat dissipation power devices can also be mounted on the outer surface of the heat sink 100; that is, power devices can be mounted on the outer surfaces of the heat dissipation substrate 110, the first heat dissipation side plate 120, and the second heat dissipation side plate 130, effectively increasing the heat dissipation area and thus improving the overall heat dissipation effect.

[0045] In one embodiment of this application, referring to Figures 2 and 3, the cooling channel 300 includes a first channel 310 and a second channel 320 disposed on the heat dissipation substrate 110 and spaced apart along the width direction of the heat dissipation substrate 110, a third channel 330 disposed on the first heat dissipation side plate 120, and a fourth channel 340 disposed on the second heat dissipation side plate 130. The first channel 310 and the third channel 330 are connected to form an inlet channel, and the second channel 320 and the fourth channel 340 are connected to form an outlet channel.

[0046] Specifically, a cavity is formed inside the heat dissipation substrate 110. A partition plate, arranged along the length of the heat dissipation substrate 110, divides the cavity into two sub-cavities spaced apart along the width of the heat dissipation substrate 110. One sub-cavity forms a first flow channel 310, and the other forms a second flow channel 320. The first flow channel 310 communicates with a third flow channel 330 located on the first heat dissipation side plate 120, forming an inlet channel for coolant input. The second flow channel 320 communicates with a fourth flow channel 340 located on the second heat dissipation side plate 130, forming an outlet channel for coolant output. This achieves independent inlet and outlet channels. Optionally, the inlet and outlet channels can be directly connected or connected to an external cooling source. Both methods can achieve coolant circulation; the preferred method can be chosen in practical applications, and no limitation is made here.

[0047] In one embodiment of this application, referring to Figures 2 and 3, the end cover 200 includes a first sub-cover 210 disposed at one end of the heat sink 100. The first sub-cover 210 has a liquid outlet manifold 211, which connects the liquid inlet channel and the liquid outlet channel. Specifically, the first sub-cover 210 has a first groove on the side facing the heat sink 100. When the end cover 200 is assembled to the heat sink 100, the first groove and the end face of the heat sink 100 cooperate to form the liquid outlet manifold 211. Coolant from the liquid inlet channel flows into the liquid outlet manifold 211, then flows through the liquid outlet manifold 211 into the liquid outlet channel, and finally flows out of the heat sink 100. In this way, a circulation loop of coolant is conveniently formed. The coolant continuously flows along the circulation loop to carry away heat and achieve cooling of the heat-generating element. Moreover, other heat-generating devices such as MOSFETs can be disposed on the outer surface of the first sub-cover 210, further increasing the overall heat dissipation area of ​​the liquid cooling assembly and facilitating the layout and arrangement of power devices.

[0048] In one embodiment of this application, referring to Figures 3 and 4, the liquid cooling assembly further includes a flow guide plate 400 disposed between the first sub-cover 210 and the heat sink 100. The flow guide plate 400 is provided with a flow channel 410, through which the inlet channel and the outlet channel are connected to the outlet manifold 211. To reduce flow resistance, the flow guide plate 400 is disposed between the end cover 200 and the heat sink 100, allowing the coolant to flow in a predetermined direction. Specifically, the flow channel 410 includes an independently disposed inlet flow guide sub-channel and an outlet flow guide sub-channel. The inlet flow guide sub-channel connects the inlet channel and the outlet manifold 211, and the outlet flow guide sub-channel connects the outlet channel and the outlet manifold 211. Thus, the coolant in the inlet channel enters the outlet manifold 211 via the inlet flow guide sub-channel, and then enters the outlet channel via the outlet flow guide sub-channel. Optionally, multiple liquid inlet drainage channels and multiple liquid outlet drainage channels can be provided. Specifically, the first heat dissipation side plate 120 is provided with at least two liquid inlet drainage channels, which are spaced apart along the height direction of the first heat dissipation side plate 120; the second heat dissipation side plate 130 is provided with at least two liquid outlet drainage channels, which are spaced apart along the height direction of the second heat dissipation side plate 130.

[0049] In one embodiment of this application, referring to Figures 2 to 4, the end cover 200 includes a second sub-cover 220, located at the other end of the heat sink 100. An inlet connector 510 and an outlet connector 520 are provided between the second sub-cover 220 and the heat sink 100. The inlet connector 510 connects to the inlet channel, and the outlet connector 520 connects to the outlet channel. Thus, the coolant inlet and outlet are located at the same end of the heat sink 100, making assembly more convenient and the structure more compact. Furthermore, without changing the length of the heat sink 100, the space occupied in the longitudinal direction of the heat sink 100 can be reduced, thereby increasing the effective heat dissipation area.

[0050] In one embodiment of this application, the second sub-cover 220 is provided with an inlet chamber and an outlet chamber. The inlet chamber is connected to the inlet connector 510 and the inlet channel, and the outlet chamber is connected to the outlet channel and the outlet connector 520. Thus, coolant will also flow on the inner surface of the second sub-cover 220. Heat-generating devices such as MOSFETs can be installed on the outer surface of the second sub-cover 220 to achieve heat dissipation, further increasing the effective heat dissipation area.

[0051] In one embodiment of this application, referring to FIG1, the liquid cooling assembly further includes a liquid inlet pipe 710, which is connected to a liquid inlet connector 510, so that coolant can be conveniently input into the liquid inlet channel through the liquid inlet pipe 710; and / or, the liquid cooling assembly further includes a liquid outlet pipe 720, which is connected to a liquid outlet connector 520, so that coolant can be conveniently output.

[0052] In one embodiment of this application, the cooling channel 300 is provided with reinforcing ribs inside. This improves the structural strength of the cooling channel 300, increases the convection exchange area, and enhances heat dissipation efficiency. Optionally, the reinforcing ribs are configured as elliptical teeth.

[0053] In one embodiment of this application, referring to Figures 2 and 3, the surface of the heat sink 100 is provided with a mounting structure 600 for assembly onto the mounting medium, thereby facilitating the assembly and fixation of the entire liquid cooling assembly. Optionally, the mounting structure 600 is a mounting leg, with one end of the mounting leg fixed to the outer surface of the heat sink 100 and the other end of the mounting leg having a mounting hole.

[0054] To achieve the above objectives, this application provides an on-board charger, which includes the liquid cooling component described above. Specifically, the specific structure of the liquid cooling component is as described in the above embodiments. Since this on-board charger adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0055] To achieve the above objectives, this application provides a vehicle that includes the on-board charger described above. Specifically, the on-board charger's structure is as described in the above embodiments. Since this vehicle employs all the technical solutions described in the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions described in the above embodiments, which will not be elaborated upon here. In one embodiment, the vehicle can be a conventional gasoline-powered vehicle or a new energy vehicle such as an electric vehicle; no limitation is made here.

[0056] The above description is merely an exemplary implementation of this application and does not limit the patent scope of the embodiments of this application. Any equivalent structural transformations made based on the technical concept of this application and the description and drawings of the embodiments of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the embodiments of this application.

Claims

1. A liquid cooling assembly, the liquid cooling assembly comprising: A heat sink body includes a heat sink substrate and a first heat sink side plate and a second heat sink side plate disposed on the heat sink substrate. The first heat sink side plate and the second heat sink side plate are spaced apart along the width direction of the heat sink substrate and cooperate with the heat sink substrate to form a heat sink cavity for mounting a heat-generating element. Cooling channels are formed inside the heat sink substrate, the first heat sink side plate and the second heat sink side plate. and An end cap is disposed at the end of the heat sink and connects the heat sink base, the first heat sink side plate, and the second heat sink side plate.

2. The liquid cooling assembly according to claim 1, wherein, The cooling channel includes a first channel and a second channel disposed on the heat dissipation substrate and spaced apart along the width direction of the heat dissipation substrate, a third channel disposed on the first heat dissipation side plate, and a fourth channel disposed on the second heat dissipation side plate. The first channel and the third channel are connected to form an inlet channel, and the second channel and the fourth channel are connected to form an outlet channel.

3. The liquid cooling assembly according to claim 2, wherein, The end cap includes a first sub-cap located at one end of the heat sink. The first sub-cap has a liquid outlet manifold that connects the liquid inlet channel and the liquid outlet channel.

4. The liquid cooling assembly according to claim 3, wherein, The liquid cooling assembly also includes a flow guide plate disposed between the first sub-cover and the heat dissipation base. The flow guide plate is provided with a flow guide channel, and the liquid inlet channel and the liquid outlet channel are connected to the liquid outlet manifold through the flow guide channel.

5. The liquid cooling assembly according to claim 4, wherein, The drainage channel includes an inlet drainage sub-channel and an outlet drainage sub-channel that are independently arranged. The inlet drainage sub-channel connects the inlet channel to the outlet manifold, and the outlet drainage sub-channel connects the outlet channel to the outlet manifold.

6. The liquid cooling assembly according to claim 5, wherein, The first heat dissipation side plate has at least two liquid inlet drainage channels, and the at least two liquid inlet drainage channels are spaced apart along the height direction of the first heat dissipation side plate; the second heat dissipation side plate has at least two liquid outlet drainage channels, and the at least two liquid outlet drainage channels are spaced apart along the height direction of the second heat dissipation side plate.

7. The liquid cooling assembly according to any one of claims 1-5, wherein, The end cap includes a second sub-cap located at the other end of the heat sink. A liquid inlet connector and a liquid outlet connector are provided between the second sub-cap and the heat sink. The liquid inlet connector is connected to the liquid inlet channel, and the liquid outlet connector is connected to the liquid outlet channel.

8. The liquid cooling assembly according to claim 7, wherein, The second sub-cover is provided with an inlet chamber and an outlet chamber. The inlet chamber is connected to the inlet connector and the inlet channel, and the outlet chamber is connected to the outlet channel and the outlet connector.

9. The liquid cooling assembly according to claim 8, wherein, The liquid cooling assembly further includes a liquid inlet pipe connected to the liquid inlet connector; and / or, the liquid cooling assembly further includes a liquid outlet pipe connected to the liquid outlet connector.

10. The liquid cooling assembly according to any one of claims 1-5, 8, and 9, wherein, The heat sink is integrally extruded.

11. The liquid cooling assembly according to any one of claims 1-5, 8, and 9, wherein, The cooling channel is equipped with reinforcing ribs inside.

12. The liquid cooling assembly according to claim 11, wherein, The reinforcing ribs are configured with elliptical teeth.

13. The liquid cooling assembly according to any one of claims 1-5, 8, and 9, wherein, The surface of the heat sink is provided with a mounting structure for assembly into the mounting medium.

14. The liquid cooling assembly according to claim 13, wherein, The mounting structure is a mounting leg, one end of which is fixed to the outer surface of the heat sink, and the other end of which is provided with a mounting hole.

15. The liquid cooling assembly according to any one of claims 1-5, 8, and 9, wherein, The heat dissipation substrate, the first heat dissipation side plate, and the second heat dissipation side plate are all welded and fixed to the end cap.

16. The liquid cooling assembly according to claim 1, wherein, The end cap has a cooling channel inside that communicates with the cooling flow channel.

17. The liquid cooling assembly according to any one of claims 1-5, 8, and 9, wherein, The heat dissipation substrate, the first heat dissipation side plate, and the second heat dissipation side plate form a U-shaped structure, and the three inner side walls of the heat dissipation cavity are all heat dissipation surfaces corresponding to the cooling flow channels.

18. An on-board charger, the on-board charger comprising a liquid-cooled assembly as described in any one of claims 1 to 17.

19. A vehicle comprising an on-board charger as claimed in claim 18.

Images