Vehicle glass assembly
The optimized bonding film structure for transparent antennas between double-bonded glass addresses weight, cost, and design change issues by using a single film and pad, ensuring reliable adhesion and reduced thickness.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- LG ELECTRONICS INC
- Filing Date
- 2025-02-18
- Publication Date
- 2026-05-15
AI Technical Summary
Conventional methods for installing transparent antennas between double-laminated glass require additional bonding films, leading to increased weight, thickness, and potential design changes, as well as higher costs and reliability issues.
A glass assembly with a optimized bonding film structure is proposed, where a transparent antenna is inserted between double-bonded glass, using a single bonding film and a mounting pad to minimize weight and adhesive film usage, ensuring reliable adhesion and reduced design changes.
The solution reduces the amount of bonding film by 10 to 50 times compared to conventional methods, minimizing weight increase, costs, and avoiding design changes, while maintaining antenna performance and reliability.
Smart Images

Figure KR2025002342_15052026_PF_FP_ABST
Abstract
Description
Automotive glass assembly
[0001] This specification relates to a glass assembly for a vehicle. More specifically, it relates to a glass assembly in which the bonding film structure is optimized in double-bonded glass and a method for manufacturing the same.
[0002] As technology advances from 4G (LTE) to 5G communication, automotive antennas are also continuously required to have network scalability, moving from existing FM / AM antennas and LTE antennas to 5G antennas or V2X antennas.
[0003] With the full-scale launch of 5G communication, automotive antennas are also expanding from existing FM / AM, LTE (4G), and GNSS (Global Navigation Satellite System) antennas to 5G Sub6 and V2X communication that support high frequencies. Accordingly, automotive antennas can be expanded in various ways, including shark fin antennas, in-dash, in-spoiler, and side mirror types, taking into account performance, design, and network scalability.
[0004] However, as the frequency of 5G signals increases, they have high directivity and are prone to signal loss in the presence of obstacles. To minimize signal loss in the 5G band, it is advantageous for signal transmission and reception to be closer to the exterior of the vehicle, where obstacles can be minimized.
[0005] Conventional shark fin antennas are advantageous for signal transmission and reception when installed on the exterior of a vehicle, but they have the disadvantage of limited network scalability due to the limited space required to accommodate various antennas such as 5G, V2X, and satellite antennas. Therefore, antennas have various requirements, including not only antenna performance that includes such signal loss, but also network scalability to support future high-speed communication, design flexibility that does not interfere with the vehicle's unique design, and ease of installation that allows for actual vehicle mounting.
[0006] In this regard, transparent antennas formed on vehicle glass are attracting attention as future antennas because they can be implemented as high-performance antennas without interfering with vehicle design and offer high network scalability.
[0007] Transparent antennas can be installed in various locations such as the front windshield, rear windshield, side windshield, roof glass, side mirrors, and front lamps, so they offer a significant advantage to automobile companies in that they can install antennas while maintaining their unique design and communication configuration.
[0008] Recently, there has been a preference for structures in which a transparent antenna is inserted between double-laminated glass, such as a front glass, so an efficient installation method is required. When installing a transparent antenna by inserting it between double-laminated glass, the use of additional bonding film is inevitably required to suppress bubble formation and achieve perfect bonding. Conventionally, a method of manufacturing by applying two bonding films of the same thickness and size to the front and back surfaces of the transparent antenna has been mainly used.
[0009] The present specification aims to solve the aforementioned problems and other problems. The present specification is intended to propose a glass laminate structure in which a transparent antenna is disposed between double-bonded glass.
[0010] This specification is intended to minimize weight increase by reducing the amount of additional adhesive film required in double-bonded glass manufactured by inserting a transparent antenna between the glass panes.
[0011] This specification is intended to propose a glass assembly and a method for manufacturing the same that can reduce the risk of design changes caused by an increase in glass thickness.
[0012] To achieve the above or other purposes, a vehicle glass assembly according to the present specification comprises: a first glass; a second glass disposed opposite to the first glass; a mounting pad disposed on a second surface of the first glass; a bonding film disposed on a first surface of the second glass; a first substrate disposed on the mounting pad; and a second substrate having a feed line formed thereon and bonded to the bonding film. In a state where the first glass and the second glass are bonded, the bonding film is formed with a first thickness in a first region between the first surface of the second glass and the second surface of the first glass. In a state where the first glass and the second glass are bonded, the bonding film is formed with a second thickness between the second surface of the mounting pad and the first surface of the second glass in a second region adjacent to the first region. In a state prior to the bonding of the first glass and the second glass, the mounting pad may be formed in the second region and a third region where the second substrate is disposed.
[0013] According to an embodiment, the glass assembly may further include an antenna transparent electrode portion formed on the first substrate and a feed line connected to the end of the antenna transparent electrode portion to apply a signal.
[0014] According to an embodiment, the bonding film may be formed with a third thickness in a third region between the second surface of the first glass and the second surface of the second substrate. The second thickness may be formed to be thicker than the third thickness.
[0015] According to an embodiment, in a first state prior to the bonding of the first glass and the second glass, the bonding film may be formed with a uniform thickness in the first region, the second region, and the third region. The uniform thickness may be formed within a range between the first thickness and the second thickness.
[0016] According to an embodiment, the bonding film and the mounting pad may be formed of the same material. In the first region, the second region, and the third region, the material of the bonding film and the material of the mounting pad may be mixed to form a bonding layer.
[0017] According to an embodiment, the bonding film may be formed from a first material, and the mounting pad may be formed from a second material that is different from the first material. The adhesive strength between the first glass and the second glass and the first material may be formed to be higher than the adhesive strength between the first glass and the second glass and the second material. The adhesive strength between the first substrate and the second substrate and the second material may be formed to be higher than the adhesive strength between the first substrate and the second substrate and the first material.
[0018] According to an embodiment, the first thickness of the first region of the bonding film may be formed to be 300 µm to 1200 µm. The fourth thickness of the mounting pad may be formed to be 50 µm to 500 µm. The fifth thickness of the first substrate on which the antenna transparent electrode is formed may be formed to be 30 µm to 300 µm. The first thickness of the first region of the bonding film may be formed to be equal to the sum of the second thickness of the second region and the fourth thickness of the mounting pad.
[0019] According to an embodiment, the first thickness of the bonding film may be formed to be thicker than the sum of the fifth thickness of the first substrate on which the antenna transparent electrode is formed and the sixth thickness of the second substrate on which the feed line is formed.
[0020] According to an embodiment, the first length of the mounting pad may be formed to be 10% to 50% longer in the first axial direction than the second length of the first substrate. The first width of the mounting pad may be formed to be 10% to 50% wider in the second axial direction orthogonal to the first axis than the second width of the first substrate.
[0021] According to an embodiment, in a first state prior to the bonding of the first glass and the second glass, the thickness of the mounting pad may be formed in a range between 90% and 100% of the fifth thickness of the first substrate on which the antenna transparent electrode is formed. In a second state in which the first glass and the second glass are bonded, the fourth thickness of the mounting pad may be formed to be thicker than the fifth thickness of the first substrate on which the antenna transparent electrode is formed.
[0022] According to an embodiment, the first thickness of the first region of the bonding film can be formed to be equal to the sum of the fourth thickness of the mounting pad, the sixth thickness of the second substrate, and the third thickness of the third region of the bonding film.
[0023] According to an embodiment, the fifth thickness of the mounting pad is formed to be thicker than the third thickness of the third region of the bonding film, so that the second substrate can be positioned closer to the first glass than to the second glass.
[0024] According to an embodiment, the second substrate on which the feed line is formed may be formed as a flexible substrate. The first end of the feed line may be connected to a metal electrode forming the antenna transparent electrode portion of the first substrate by an ACF bonding portion. The second end of the feed line may be connected to a signal line of a coaxial cable.
[0025] According to an embodiment, a black mask region may be formed on the first surface of the first glass. At least a portion of the antenna transparent electrode may be disposed in an outer region of the black mask region. At least a portion of the feed line may be disposed to overlap with the black mask region.
[0026] According to an embodiment, the bonding film may include a first bonding film region formed with a second thickness within a predetermined range based on 760 µm in the first region and the second region; and a second bonding film region formed on the first bonding film in the first region with a fourth thickness thinner than 100 µm.
[0027] A method for manufacturing a vehicle glass assembly according to another aspect of the present specification comprises: a bonding film placement process of placing a bonding film on a first surface of a second glass to be positioned opposite to a first glass; a feed line connection process of connecting an antenna transparent electrode formed on a first substrate and a feed line formed on a second substrate; a bonding film adhesion process of adhering a second surface of the first glass to the bonding film; a mounting pad placement process of placing a mounting pad on the first glass; a first substrate attachment process of attaching the first substrate, on which the antenna transparent electrode is formed, to the mounting pad; and a glass bonding process of bonding the first glass and the second glass so that the ends of the first glass and the ends of the second glass are aligned. In a state where the first glass and the second glass are bonded, the bonding film may be formed with a first thickness between the first surface of the second glass and the second surface of the first glass in a first region. In the state where the first glass and the second glass are bonded, the bonding film may be formed with a second thickness between the second surface of the mounting pad and the first surface of the second glass in a second region adjacent to the first region. In the state prior to the bonding of the first glass and the second glass, the mounting pad may be formed in the second region and a third region where the second substrate is disposed. The first thickness may be formed to be thicker than the second thickness.
[0028] According to an embodiment, in the glass bonding process, the bonding film may be formed with a third thickness in a third region between the second surface of the first glass and the second surface of the first glass. The second thickness may be formed to be thicker than the third thickness.
[0029] According to an embodiment, in the glass bonding process, the first thickness of the first region of the bonding film may be formed to be 300 µm to 1200 µm. The fourth thickness of the mounting pad may be formed to be 50 µm to 500 µm. The first thickness of the first region of the bonding film may be formed to be equal to the sum of the second thickness of the second region and the fourth thickness of the mounting pad.
[0030] According to an embodiment, in the glass bonding process, the first thickness of the bonding film may be formed to be thicker than the sum of the fifth thickness of the first substrate on which the antenna transparent electrode is formed and the sixth thickness of the second substrate on which the feed line is formed. The first thickness of the first region of the bonding film may be formed to be equal to the sum of the fourth thickness of the mounting pad, the sixth thickness of the second substrate, and the third thickness of the third region of the bonding film.
[0031] According to an embodiment, in the process of placing the mounting pad, the first length of the mounting pad may be formed to be 10% to 50% longer in the first axial direction than the first length of the first substrate. The first width of the mounting pad may be formed to be 10% to 50% wider in the second axial direction orthogonal to the first axis than the second width of the first substrate. In the first state before the first glass and the second glass are bonded, the thickness of the mounting pad may be formed in a range between 90% and 100% of the fifth thickness of the first substrate on which the antenna transparent electrode is formed. In the second state after the first glass and the second glass are bonded, the fourth thickness of the mounting pad may be formed to be thicker than the fifth thickness of the first substrate on which the antenna transparent electrode is formed.
[0032] According to an embodiment, the second substrate on which the feed line is formed may be formed as a flexible substrate. During the feed line connection process, the first end of the feed line may be connected to a metal electrode forming the antenna transparent electrode portion of the first substrate and an ACF bonding portion. The method may further include a coaxial cable connection process in which the second end of the feed line is connected to a signal line of a coaxial cable following the glass bonding process.
[0033] The technical effects of the vehicle glass assembly with a double-bonded glass structure and the method for manufacturing the same according to the present specification are described as follows.
[0034] According to the present specification, a substrate having a transparent antenna and a substrate having a feed line can be arranged between double-bonded glass to have excellent adhesion.
[0035] According to the present specification, a substrate having a transparent antenna and a substrate having a feed line can be arranged between double-bonded glass to have high reliability without variation in antenna characteristics.
[0036] According to the present specification, the increase in glass weight can be reduced by minimizing the amount of bonding film additionally used for mounting a transparent antenna.
[0037] According to the present specification, the amount of additional adhesive film required in double-bonded glass manufactured by inserting a transparent antenna between the glass panes can be reduced, thereby minimizing weight increase and reducing costs.
[0038] According to the present specification, the risk of having to make design changes due to an increase in glass thickness in a glass assembly of a double-bonded glass structure and a method for manufacturing the same can be reduced.
[0039] According to the present specification, the amount of bonding film used is reduced by 10 to 50 times compared to conventional methods, thereby minimizing the increase in raw material costs associated with the application of a transparent antenna to double-bonded glass.
[0040] According to the present specification, when the glass thickness increases due to the use of two bonded films, the issue of the inconvenience of requiring design changes to the vehicle frame on which the glass is mounted can be resolved.
[0041] According to the present specification, by using a single bonding film and a mounting pad with an optimized structure, when a transparent antenna is inserted and installed between double-bonded glass, bubble formation can be suppressed and perfect bonding can be achieved.
[0042] Further scope of the applicability of this specification will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of this specification are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of this specification, should be understood as being given merely as examples.
[0043] FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.
[0044] FIG. 2 is a configuration diagram of a vehicle according to an embodiment of the present specification.
[0045] Figure 3 shows a perspective view of a vehicle glass that can be combined or attached to the frame of a vehicle.
[0046] Figure 4 shows a cross-sectional view of the glass of Figure 3 combined with the frame of the vehicle.
[0047] Figure 5 shows an antenna assembly and a connector structure placed in the transparent and opaque regions of the glass of a vehicle.
[0048] Figure 6 shows cross-sectional views of glass assemblies of a double-bonded glass structure.
[0049] FIG. 7 shows a cross-sectional view of the first structure before the first substrate having an antenna transparent electrode formed thereon and the second substrate having a feed line formed thereon are combined with a bonding film, and the second structure combined.
[0050] FIGS. 8 and 9 show a cross-sectional view of the structure before the first and second glasses of a glass assembly, formed with an adhesive film and a seating pad of the same material, are joined, and a cross-sectional view of the joined structure.
[0051] FIGS. 10 and FIGS. 11 show a cross-sectional view of the structure before the first and second glasses of a glass assembly, formed with an adhesive film and a seating pad made of different materials, are joined, and a cross-sectional view of the joined structure.
[0052] FIG. 12 shows a front view on a two-dimensional area in which the internal regions of the glass assembly of FIG. 9 and FIG. 11 are shown.
[0053] FIG. 13 shows a cross-sectional view of a glass assembly in which a second substrate with feed lines formed on the side and front of the first glass is disposed.
[0054] FIG. 14 shows the connection structure of the first substrate and the second substrate of FIG. 13 and the connection structure of the second substrate and the coaxial cable.
[0055] FIG. 15 shows a flowchart of a method for manufacturing a glass assembly for a vehicle according to the present disclosure.
[0056] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components, regardless of drawing symbols, are assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings and should be understood to include all modifications, equivalents, and substitutions that fall within the concept and technical scope of this specification.
[0057] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.
[0058] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.
[0059] A singular expression includes a plural expression unless the context clearly indicates otherwise.
[0060] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.
[0061] Hereinafter, a transparent antenna module according to the present specification and a method for manufacturing the same will be described in detail. In this regard, FIG. 1 is a drawing illustrating a vehicle according to an embodiment of the present specification.
[0062] Referring to FIG. 1, a vehicle (1) may be equipped with at least one communication antenna. The vehicle (1) may transmit and / or receive signals of various frequency bands using the communication antenna. The vehicle (1) may perform communication such as V2V (Vehicle-to-Vehicle), V2I (Vehicle to Infrastructure), V2P (Vehicle-to-Pedestrian), and V2N (vehicle-to-network).
[0063] The above antenna may be composed of a substrate made of a material such as PET (polyethylene terephthalate) and an antenna pattern formed on the substrate. For example, the antenna may be a transparent antenna.
[0064] The antenna may be placed on the dielectric of the vehicle (1). The antenna may be placed on the glass of the vehicle (1). The antenna may be attached to or coupled to the front glass (101), door glass (102, 103), quarter glass (104), rear windshield (not shown), side mirror (not shown), sunroof (105), or lamp glass (106). For example, the antenna may be a transparent antenna.
[0065] FIG. 2 is a configuration diagram of a vehicle according to an embodiment of the present specification. Referring to FIG. 2, the vehicle (1) may include an object detection device (410), a communication device (420), a user interface device (431), a driving operation device (432), a vehicle driving device (433), a driving system (434), a navigation system (435), a sensing unit (436), an interface unit (437), a memory (438), a power supply unit (439), and / or a control unit (440). Alternatively, the vehicle (1) may include additional configurations other than the above configurations, or omit some of the above configurations.
[0066] The object detection device (410) may be a device for detecting an object located outside the vehicle (1). For example, the object detection device (410) may include a processor (411), a camera (412), a radar (413), a lidar (414), an ultrasonic sensor (415) and / or an infrared sensor (416).
[0067] The communication device (420) may be a device for performing communication with an external device. The communication device (420) may include at least one of a transmitting antenna, a receiving antenna, an RF (Radio Frequency) circuit or an RF element capable of implementing various communication protocols for performing communication. For example, the communication device (420) may include a processor (421), a short-range communication unit (422), a location information unit (423), a V2X communication unit (424), an optical communication unit (425), a broadcast transmission and reception unit (426), and / or an ITS communication unit (427).
[0068] The user interface device (431) may be a device for interaction between the vehicle (1) and the user. The vehicle (1) may implement a UI (User Interface) or UX (User Experience) through the user interface device (431).
[0069] The driving control device (432) may be a device that receives user input for driving. The vehicle driving device (433) may be a device that electrically controls the operation of various devices within the vehicle (1). The driving system (434) may be a system that controls various operations of the vehicle (1). The navigation system (435) may provide navigation information. The sensing unit (436) may sense the state of the vehicle (1).
[0070] The interface unit (437) can serve as a passage for various types of external devices connected to the vehicle (1). The memory (438) can store basic data for the unit of the vehicle (1), control data for controlling the operation of the unit, input / output data, etc. The power supply unit (439) can supply power required for the operation of each component. The control unit (440) can control the overall operation of each unit within the vehicle (1). The control unit (440) can be implemented as an Electronic Control Unit (ECU) and / or a Telematics Control Unit (TCU).
[0071] Meanwhile, the glass of a vehicle having a transparent antenna module implemented according to the present specification can be combined with the frame of the vehicle. In this regard, FIG. 3 shows a perspective view of a vehicle glass that can be combined or attached to the frame of a vehicle. FIG. 4 shows a cross-sectional view in which the glass of FIG. 3 and the frame of the vehicle are combined.
[0072] Referring to FIGS. 3 and 4, the glass (10, 10') may be joined to or attached to the frame (9) of the vehicle and may cover an opening (9h) of the frame (9). For example, the glass (10, 10') may be a glass of the vehicle (1), such as a front glass (101), door glass (102, 103), quarter glass (104), rear windshield, side mirror, sunroof (105), or lamp glass (106) (see FIG. 1).
[0073] The groove (9g) of the frame (9) may extend along the edge of the glass (10, 10') and define the boundary of the opening (9h). For example, the frame (9) may include a metal material, and a sealant (7) may be filled between the groove (9g) and the glass (10, 10'). The groove (9g) may be formed to have a step with respect to the inner boundary of the frame (9). A glass assembly (10) having an opaque area (12) formed in the groove (9g) formed to have a step with respect to the inner end of the frame (9) may be placed therein. As the glass assembly (10) is placed in the groove (9g), the step with respect to the groove (9g) may be considered non-existent from the outside of the vehicle.
[0074] The antenna (20) may be located on one side of the glass assembly (10) or inside the glass assembly (10). The antenna (20) may be transparent. The antenna (20) may be flexible.
[0075] A connection module including a connector (100c) may be positioned between the edge of the glass (10, 10') and the antenna (20) and may be located on one side of the glass (10, 10'). The connector (100c) of the connection module may be electrically connected to the antenna (20) through a substrate (30). An inner cover (8) may be opposite to the glass assembly (10) with respect to the frame (9) and may cover the connection module. The inner cover (8) may be referred to as an interior cover (8). The connection module may be referred to as a connector device, a Pakra jack portion, or a connector assembly.
[0076] Meanwhile, a vehicle antenna assembly in which a transparent antenna module according to the present specification is implemented can be placed in a transparent area and an opaque area of the vehicle's glass. In this regard, FIG. 5 shows an antenna assembly and a connector structure placed in a transparent area and an opaque area of the vehicle's glass.
[0077] Referring to FIG. 5, the glass assembly (10) may include a transparent region (11) and an opaque region (12). The opaque region (12) may be a black mask region or a frit region. For example, the transparent region (11) may occupy most of the glass assembly (10), and the opaque region (12) may be adjacent to one edge of the glass assembly (10). The transparent region (11) and the opaque region (12) may be formed with the same width (W10), and the height (H11) of the transparent region (11) may be greater than the height (H12) of the opaque region (12).
[0078] An antenna (20) may be positioned on the transparent area (11) adjacent to the boundary between the transparent area (11) and the opaque area (12). A connection module including a connector (100c) may be positioned on the opaque area (12), and the connector (100c) of the connection module may be connected to the antenna (20) through the housing bottom plate (111). The housing bottom plate (111) may be fastened to the housing top plate (112) to form a housing (110h). The connector (100c) may be accommodated inside the housing (110h). The housing (110h) accommodating the connector (100c) may be placed in the opaque area (12). Meanwhile, at least a portion of the connection module may be positioned in the transparent area (11).
[0079] Hereinafter, a glass assembly having a transparent antenna part for a vehicle according to the present specification will be described in detail. In this regard, FIG. 6 shows cross-sectional views of glass assemblies having a double-bonded glass structure.
[0080] FIG. 6(a) shows a glass assembly (10) of a double bonded glass structure in which a bonding film (1020) is placed between a first glass (10a) and a second glass (10b). FIG. 6(b) shows a double bonded glass structure in which a bonding film (1020) is placed between a first glass (10a) and a second glass (10b).
[0081] FIG. 6(b) shows a glass assembly (10) of a double-bonded glass structure in which a bonding film (1020) and a second bonding film (1030a) are placed between a first glass (10a) and a second glass (10b). In the structure of FIG. 6(a) where no transparent antenna is formed, only one bonding film (1020) is used. However, as in FIG. 6(b), when a transparent antenna is placed between the first glass (10a) and the second glass (10b), two bonding films must be used. The use of additional bonding films increases the thickness and weight of the glass. Accordingly, design changes may be required for vehicles equipped with double-bonded glass with a transparent antenna, and an increase in costs may also occur.
[0082] Meanwhile, double-bonded glass in the form of a first glass (10a) and a second glass (10b) can be used for the front windshield of a vehicle, architectural double windows, etc. A transparent antenna in the form of a film can be placed between the first glass (10a) and the second glass (10b). A bonding film (1020) and a second bonding film (1030a) can be placed between the first glass (10a) and the second glass (10b). The bonding film (1020) and the second bonding film (1030a) can be referred to as the first bonding film and the second bonding film, respectively. The first bonding film and the second bonding film can each form a first PVB layer and a second PVB layer.
[0083] A transparent antenna having an antenna transparent electrode portion (1110) formed between a first bonding film and a second bonding film can be inserted and bonded at a high temperature to form a vehicle glass assembly (10) with a double bonding glass structure.
[0084] Referring to FIG. 6(b), a first substrate (1100) having an antenna transparent electrode portion (1110) formed thereon may be disposed on a second bonding film (1030a). The first substrate (1100) may include a first dielectric (1010a) and an antenna transparent electrode portion (1110). An end of the antenna transparent electrode portion (1110) may be connected to a feed line (1200f) of a second substrate (1200). The second substrate (1200) may include a second dielectric (1010b) and a feed line (1200f). At least a portion of the second substrate (1200) may be formed to protrude beyond the end of the first glass (10a) and the end of the second glass (10b).
[0085] When a transparent antenna is inserted into a double-bonded glass structure, an additional bonding film is required to maintain the bonding strength between the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed, the second substrate (1200) on which the feed line (1200f) is formed, and the first and second glasses (10a, 10b). A second bonding film (1030a) may be formed as an additional bonding film to maintain the bonding strength between the first and second glasses (10a, 10b).
[0086] A glass assembly (10) with a double-bonded glass structure can be used for the front windshield of a vehicle. Meanwhile, a glass assembly (10) with a double-bonded glass structure can be used for the rear windshield or side windshield of a vehicle.
[0087] When a transparent antenna is inserted into a glass assembly (10) of a double-bonded glass structure, a mounting pad may be placed with an additional bonding film to maintain bonding strength between the antenna and the feed line (1200f) and the glass. The additional second bonding film (1030a) may be applied with the same size or same area as the original bonding film (1020) or the first and second glass (10a, 10b). Accordingly, due to the size of the second bonding film (1030a), the weight and thickness of the glass assembly (10) increase when the antenna is inserted into the first and second glass (10a, 10b), which may cause a significant increase in price.
[0088] In this regard, the bonding film (1020) bonded to the first and second glass (10a, 10b) may include one or more of polyvinyl butyral (PVB) and ethylene vinyl acetate (EVA).
[0089] According to the embodiment, polyvinyl butyral (PVB) may be more preferable than ethylene acetate (EVA) as the bonding film (1020). The thickness of the bonding film (1020) bonding the first and second glasses (10a, 10b) may be 350 µm to 1200 µm, but is not limited thereto. According to the embodiment, the thickness of the bonding film (1020) of the vehicle glass assembly (10) may be formed to a value of 380 µm or 760 µm. A bonding film (1020) having a thickness of 380 µm or more may be used in the vehicle glass assembly (10).
[0090] Meanwhile, in the vehicle glass assembly (10) according to the present disclosure, the mounting pad may be configured to allow a first substrate (1100) having an antenna transparent electrode portion (1110) formed thereon to be mounted thereon. Accordingly, the mounting pad may be formed with a length on one axis that is smaller than that of the bonding film (1020).
[0091] Meanwhile, as shown in FIG. 6(a), a first substrate (1100) and a second substrate (1200) may be placed on a bonding film (1020). In this regard, FIG. 7 shows a cross-sectional view of a first structure before the first substrate, on which an antenna transparent electrode is formed, and a second substrate, on which a feed line is formed, are bonded to the bonding film, and a second structure bonded to it.
[0092] FIG. 7(a) shows a glass assembly of a first structure before a first substrate (1100) having an antenna transparent electrode (1110) formed thereon and a second substrate (1200) having a feed line (1200f) formed thereon are combined with a bonding film (1020). FIG. 7(b) shows a glass assembly of a second structure before a first substrate (1100) having an antenna transparent electrode (1110) formed thereon and a second substrate (1200) having a feed line (1200f) formed thereon are combined with a bonding film (1020).
[0093] Referring to FIG. 7, a first substrate (1100) having an antenna transparent electrode portion (1110) formed thereon can be inserted into double-bonded glass. In this regard, only a bonding film (1020) may be used without an additional mounting pad. The antenna transparent electrode portion (1110) of the first substrate (1100) and the feed line (1200f) of the second substrate (1200) may be bonded and connected by a first bonding portion (1210). A transparent adhesive, such as OCA (Optically Clear Adhesive), may be bonded to the first bonding portion (1210). The transparent adhesive used in the first bonding portion (1210) may be an acrylic-based adhesive, a silicone-based adhesive, etc., but is not limited thereto. The thickness of the first bonding portion (1210) may be formed to be 25 µm to 100 µm.
[0094] The second surface of the second substrate (1200) and the second glass (10b) can be bonded by the second bonding part (1220). A transparent adhesive or an opaque adhesive, such as OCA (Optically Clear Adhesive), can be bonded to the first bonding part (1210).
[0095] A first dielectric (1010a) of a first substrate (1100) and a second dielectric (1010b) of a second substrate (1200) may be arranged and attached to one side of the inner side of the second glass (10b). A bonding film (1020) and a first glass (10a) may be laminated and bonded on the upper surface of the first dielectric (1010a) of the first substrate (1100) and the second dielectric (1010b) of the second substrate (1200).
[0096] As a first substrate (1100) having an antenna transparent electrode portion (1110) formed thereon is inserted into the glass assembly (10) of FIG. 7, a void space (1100s) is formed due to the step difference of the first bonding portion (1210) in the form of an ACF. Incomplete bonding occurs due to the air within the void space (1100s) caused by the step difference of the first bonding portion (1210), causing a fine defect in appearance. In addition, there is a concern that the void space (1100s) caused by the step difference of the first bonding portion (1210) will continue to grow over time. Therefore, reliability issues of the glass assembly (10) may arise as the size of the void space (1100s) caused by the step difference of the first bonding portion (1210) increases.
[0097] In addition, another disadvantage is that a process is required to attach one side of the second substrate (1200) on which the feed line (1200f) is formed to the side and surface of the first glass (10a) using a transparent adhesive. If this attachment process is not performed, the substrate and the glass do not adhere to each other, causing bubbles to form and potentially degrading the quality of the glass assembly (10) of the double-bonded glass structure. Furthermore, due to this attachment process, an issue may arise where the time required to attach the antenna assembly to the glass panel of the vehicle is excessively increased.
[0098] The adhesive film and the mounting pad of the glass assembly may be formed of the same material or different materials. FIGS. 8 and 9 show a cross-sectional view of the structure before the first and second glasses of the glass assembly, in which the adhesive film and the mounting pad are formed of the same material, are joined, and a cross-sectional view of the joined structure.
[0099] Referring to FIGS. 8 and 9, the bonding film (1020) and the mounting pad (1030) may be formed from the same material. In this regard, the material of the bonding film (1020) and the material of the mounting pad (1030) may be mixed in the first region (R1), the second region (R2), and the third region (R3) to form a bonding layer (1050). The material of the bonding film (1020) and the mounting pad (1030, 1030b) may be selected as polyvinyl butyral (PVB). As another example, the material of the bonding film (1020) and the mounting pad (1030, 1030b) may be selected as ethylene vinyl acetate (EVA).
[0100] FIGS. 10 and FIGS. 11 show a cross-sectional view of the structure before the first and second glasses of a glass assembly, formed with an adhesive film and a seating pad made of different materials, are joined, and a cross-sectional view of the joined structure.
[0101] Referring to FIGS. 10 and 11, the bonding film (1020) and the mounting pad (1030b) may be formed from different materials. The bonding film (1020) may be formed from a first material. The mounting pad (1030b) may be formed from a second material different from the first material of the bonding film (1020). The first material of the bonding film (1020) may be selected as polyvinyl butyral (PVB). The second material of the mounting pad (1030b) may be selected as ethylene vinyl acetate (EVA).
[0102] FIGS. 8 and 10 are cross-sectional views of a glass assembly having a first structure prior to the bonding film having a second substrate being bonded to a mounting pad having a first substrate. FIGS. 9 and 11 are cross-sectional views of a glass assembly having a second structure prior to the bonding film having a mounting pad having a first substrate being bonded to a mounting pad having a second substrate. Meanwhile, FIG. 12 shows a front view of a two-dimensional area in which internal regions of the glass assembly of FIGS. 9 and 11 are indicated.
[0103] With reference to FIGS. 8 to 12, a vehicle glass assembly (10) according to the present disclosure is described. The glass assembly (10) may be configured to include a first glass (10a), a second glass (10b), a bonding film (1020), a mounting pad (1030, 1030b), a first substrate (1100), and a second substrate (1200). The glass assembly (10) may further be configured to include an antenna transparent electrode portion (1110) and a feed line (1200f).
[0104] The antenna transparent electrode portion (1110) and the feed line (1200f) constitute an antenna assembly (1000). A first substrate (1100) on which the antenna transparent electrode portion (1110) is formed and a second substrate (1200) on which the feed line (1200f) is formed constitute an antenna assembly (1000). The first substrate (1100) on which the antenna transparent electrode portion (1110) is formed may be formed as a transparent substrate. The second substrate (1200) on which the feed line (1200f) is formed may be formed as an opaque substrate.
[0105] A second glass (10b) may be placed opposite to the first glass (10a). A mounting pad (1030, 1030b) may be placed on the second surface of the first glass (10a). A bonding film (1020) may be placed on the first surface of the second glass (10b) and bonded to the first surface of the second glass (10b). A first substrate (1100) may be placed on the mounting pad (1030, 1030b). The first surface of the first substrate (1100) may be attached to the second surface of the mounting pad (1030, 1030b).
[0106] An antenna transparent electrode portion (1110) and a connecting transparent electrode portion (1120) may be formed on the first surface of the first substrate (1100). A ground pattern may be formed on the second surface of the first substrate (1100). The first substrate (1100) may be configured to include a first dielectric (1010a) and an antenna transparent electrode portion (1110). The first substrate (1100) may be configured to include a first dielectric (1010a), an antenna transparent electrode portion (1110), and a connecting transparent electrode portion (1120).
[0107] The end of the antenna transparent electrode part (1110) and the feed line (1200f) can be connected. The feed line (1200f) connected to the end of the antenna transparent electrode part (1110) can be configured to apply a signal of a specific frequency to the antenna transparent electrode part (1110).
[0108] A feed line (1200f) may be formed on the first surface of the second substrate (1200). A ground pattern may be formed on the second surface of the second substrate (1200). The second substrate (1200) may be configured to include a second dielectric (1010b) and a feed line (1200f). The second substrate (1200) may be placed on a bonding film (1020). The second surface of the second substrate (1200) may be bonded to the bonding film (1020).
[0109] In a state where the first glass (10a) and the second glass (10b) are bonded, the bonding film (1020) may be formed differently depending on the region. In a state where the first glass (10a) and the second glass (10b) are bonded, the bonding film (1020) may be formed with a first thickness (t1) between the first surface of the second glass (10b) and the second surface of the first glass (10a) in the first region (R1).
[0110] In a state where the first glass (10a) and the second glass (10b) are bonded, the bonding film (1020) may be formed with a second thickness (t2) between the second surface of the mounting pad (1030, 1030b) and the first surface of the second glass (10b) in a second region (R2) adjacent to the first region (R1). The bonding film (1020) may be formed such that the first thickness (t1) of the first region (R1) is thicker than the second thickness (t2) of the second region (R2) of the bonding film (1020). In a state prior to the bonding of the first glass (10a) and the second glass (10b), the mounting pad (1030, 1030b) may be formed in a third region (R3) where the second region (R2) and the second substrate (1200) are placed.
[0111] The bonding film (1020) may be formed with different thicknesses in a third region (R3) adjacent to a second region (R2). The bonding film (1020) may be formed with a third thickness (t3) between the second surface of the first glass (10a) and the second surface of the second substrate (1200) in the third region (R3). The second thickness (t2) of the second region (R2) of the bonding film (1020) may be formed to be thicker than the third thickness (t3) of the third region (R3) of the bonding film (1020).
[0112] Meanwhile, in the first state prior to the first glass (10a) and the second glass (10b) being bonded, the bonding film (1020) has a uniform thickness (t) in the first region (R1), the second region (R2), and the third region (R3). u It can be formed as ). The uniform thickness (t) of the bonding film (1020) u) can be formed in a range between the first thickness (t1) and the second thickness (t2). The uniform thickness (t) of the bonding film (1020) u ) can be formed to be thinner than the first thickness (t1) and thicker than the second thickness (t2).
[0113] As the first glass (10a) and the second glass (10b) are compressed, the second thickness (t2) of the second region (R2) of the bonding film (1020) is the uniform thickness (t) of the bonding film (1020) in the first state prior to bonding. u It is reduced compared to ). In this regard, as the first glass (10a) and the second glass (10b) are compressed, the thickness of the second region (R2) and the third region (R3) of the bonding film (1020) is reduced. Accordingly, the first thickness (t1) of the first region (R1) of the bonding film (1020) is reduced compared to the uniform thickness (t) prior to bonding. u It increases compared to ). In addition, the material of the settling film (1030) penetrates into the first region (R1) of the bonding film (1020), and the first thickness (t1) of the first region (R1) of the bonding film (1020) can be increased.
[0114] Meanwhile, the bonding film (1020) and the mounting pad (1030, 1030b) may be formed of the same material or different materials.
[0115] The bonding film (1020) and the mounting pad (1030) may be formed from the same material. In this regard, the material of the bonding film (1020) and the material of the mounting pad (1030) may be mixed in the first region (R1), the second region (R2), and the third region (R3) to form a bonding layer (1050).
[0116] The materials of the bonding film (1020) and the mounting pad (1030, 1030b) may be selected as polyvinyl butyral (PVB). As another example, the materials of the bonding film (1020) and the mounting pad (1030, 1030b) may be selected as ethylene vinyl acetate (EVA).
[0117] If the bonding film (1020) and the mounting pad (1030) are formed from the same material, the possibility of film layer separation occurring due to a decrease in bonding strength of the double-bonded glass when different materials are used can be prevented. In addition, since the bonding film (1020) and the mounting pad (1030) are formed from the same material, durability stability is increased, ensuring reliability during long-term use. Furthermore, since the bonding film (1020) and the mounting pad (1030) are formed from the same material, the refractive index is the same, which can prevent distortion in the driver's field of vision.
[0118] Meanwhile, the bonding film (1020) and the mounting pad (1030b) may be formed from different materials. The bonding film (1020) may be formed from a first material. The mounting pad (1030b) may be formed from a second material different from the first material of the bonding film (1020). The adhesion force between the first glass (10a) and the second glass (10b) and the first material may be formed to be higher than the adhesion force between the first glass (10a) and the second glass (10b) and the second material. The adhesion force between the first substrate (1100) and the second substrate (1200) and the second material may be formed to be higher than the adhesion force between the first substrate (1100) and the second substrate (1200) and the first material.
[0119] Accordingly, the first material of the bonding film (1020) has a higher adhesion force with the first glass (10a) and the second glass (10b) than the adhesion force of the second material of the mounting pad (1030b). The second material of the mounting pad (1030b) has a higher adhesion force with the first substrate (1100) and the second substrate (1200) than the adhesion force of the first material of the bonding film (1020).
[0120] The first material of the bonding film (1020) may be selected as polyvinyl butyral (PVB). The second material of the mounting pad (1030b) may be selected as ethylene vinyl acetate (EVA).
[0121] Even if the bonding film (1020) and the mounting pad (1030b) are formed from different materials, the mounting pad (1030, 1030b) is placed only in a part of the glass assembly (10). In this regard, the mounting pad (1030, 1030b) is applied to the top of the front or rear glass in a location that does not affect the driver's field of vision. In addition, since it is used in a very localized area of the glass assembly (10) that is large enough to cover a transparent antenna, there is almost no reduction in bonding strength. For example, even if the bonding film (1020) is made of PVB and the mounting pad (1030b) is made of the much cheaper EVA, it does not affect the performance of the double-bonded glass. On the other hand, in a structure where the bonding film (1020) and the mounting pad are placed to cover the entire glass with the same size, different materials cannot be used.
[0122] In this regard, PVB has very strong adhesion to glass and can be used primarily in double-laminated glass, such as vehicle windshields or bulletproof glass. PVB maintains strong adhesion by forming strong hydrogen bonds with the glass surface. PVB adheres strongly to glass and offers excellent shock absorption and transparency.
[0123] Although EVA has relatively lower direct adhesion to glass than PVB, sufficient adhesion can be formed through a high-temperature lamination process. The adhesion of EVA varies depending on the vinyl acetate (VA) content, and the adhesion can be increased when used with specific crosslinking agents such as peroxide. EVA has good moisture resistance and can be bonded to various materials such as glass, plastic, and metal. Therefore, the mounting pad (1030, 1030b) that is bonded to the first substrate (1100) and the second substrate (1200) can be formed of EVA.
[0124] Meanwhile, in the first state before the first glass (10a) and the second glass (10b) are bonded, the uniform thickness (tu) of the bonding film (1020) can be formed to be 300 µm to 1200 µm. It is preferable that the uniform thickness (tu) of the bonding film (1020) be formed to be thicker than the sum of the thicknesses of the first substrate (1100) on which the transparent antenna is formed and the second substrate (1200) on which the wire (1200f) is formed. In the second state where the first glass (10a) and the second glass (10b) are bonded, the first thickness (t1) of the first region (R1) of the bonding film (1020) can be formed to be 300 µm to 1200 µm.
[0125] The fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to be 50 µm to 500 µm. It is preferable that the fourth thickness (t4) of the mounting pad (1030, 1030b) be at least 90% of the fifth thickness (t5) of the first substrate (1100) on which the transparent antenna is formed. The first thickness (t1) of the first region (R1) of the bonding film (1020) can be formed to be thicker than the fourth thickness (t4) of the mounting pad (1030, 1030b). The fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed to be 30 µm to 300 µm.
[0126] As the fifth thickness (t5) of the first substrate (1100) is formed to be between 30 µm and 300 µm, it is preferable that the fourth thickness (t4) of the mounting pad (1030, 1030b) be formed to be in the range between 50 µm and 200 µm. This is because if the fourth thickness (t4) of the mounting pad (1030, 1030b) is thinner than the fifth thickness (t5) of the first substrate (1100) by a certain amount, it may not be able to completely cover the first substrate (1100), and there is a probability that bubbles will form. However, applying the thinnest bonding film (1020) within the range where bubbles do not form can minimize the increase in thickness and weight of the entire double-bonded glass due to antenna insertion. In addition, by applying the thinnest bonding film (1020) within the range where bubbles do not form, the inconvenience of changing the vehicle design due to the increase in thickness of the double-bonded glass can be avoided.
[0127] Accordingly, the fourth thickness (t4) of the mounting pad (1030, 1030b) on which the first substrate (1100) is placed can be formed to be thicker than the fifth thickness (t5) of the first substrate (1100). If the fifth thickness (t5) of the first substrate (1100) is formed to be 30 µm, the fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to be 50 µm. If the fifth thickness (t5) of the first substrate (1100) is formed to be 300 µm, the fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to be 500 µm. Accordingly, the fourth thickness (t4) of the mounting pad (1030, 1030b) on which the first substrate (1100) is placed can be formed to be about 1.6 times thicker than the fifth thickness (t5) of the first substrate (1100).
[0128] When the fourth thickness (t4) of the mounting pad (1030, 1030b) is formed to a minimum thickness of 50 µm, the first thickness (t1) of the bonding film (1020) is formed to a minimum thickness of 300 µm. In this regard, in order to maintain the bonding force between the first glass (10a) and the second glass (10b), the first thickness (t1) of the bonding film (1020) needs to maintain a minimum thickness of 300 µm. When the fourth thickness (t4) of the mounting pad (1030, 1030b) is formed to a maximum thickness of 500 µm, the first thickness (t1) of the bonding film (1020) is formed to a minimum thickness of 1200 µm.
[0129] In this regard, considering the total thickness of the glass assembly (10) including the first glass (10a) and the second glass (10b), the first thickness (t1) of the bonding film (1020) needs to be formed to a maximum thickness of 1200 µm or less. Accordingly, the first thickness (t1) of the bonding film (1020) can be formed to a thickness of 2.4 to 6 times the fourth thickness (t4) of the mounting pad (1030, 1030b).
[0130] The first thickness (t1) of the first region (R2) of the bonding film (1020) can be formed to be equal to the sum of the second thickness (t2) of the second region (R2) and the fourth thickness (t4) of the mounting pad (1030, 1030b). In this regard, the mounting pad (1030, 1030b) can be formed in the upper region of the area where the second region (R2) of the bonding film (1020) is formed.
[0131] Meanwhile, the first thickness (t1) of the bonding film (1020) can be formed to be thicker than the sum of the fifth thickness (t5) of the first substrate (1100) and the sixth thickness (t6) of the second substrate (1200) so that the first substrate (1100) and the second substrate (1200) are placed and fixed within the glass assembly (10).
[0132] Meanwhile, the first length (L1) of the mounting pad (1030, 1030b) may be formed to be 10% to 50% longer in the first axial direction (e.g., X-axis direction) than the second length (L2) of the first substrate (1100). The first width (W1) of the mounting pad (1030, 1030b) may be formed to be 10% to 50% wider in the second axial direction (e.g., Y-axis direction) orthogonal to the first axis than the second width (W2) of the first substrate (1100). The first length (L1) and first width (W1) of the mounting pad (1030, 1030b) are formed to be at least 10% longer than the second length (L2) and second width (W2) of the first substrate (1100), so that the first substrate (1100) can be mounted and fixed within the area where the mounting pad (1030, 1030b) is formed.
[0133] If the difference between the first length (L1) and first width (W1) of the mounting pad (1030, 1030b) and the second length (L2) and second width (W2) of the first substrate (1100) is less than 10%, there is a possibility that the transparent antenna cannot be fully covered and a void space may occur. If the difference between the first length (L1) and first width (W1) of the mounting pad (1030, 1030b) and the second length (L2) and second width (W2) of the first substrate (1100) is greater than 50%, it causes an unnecessary increase in material costs and weight.
[0134] According to the connection structure of the first substrate (1100) and the second substrate (1200), the first substrate (1100) may be offset in one direction on a first axis where a mounting pad (1030, 1030b) is formed. The second distance (D2) between the second end of the mounting pad (1030, 1030b) and the second end of the first substrate (1100) may be formed to be longer than the first distance (D1) between the first end of the mounting pad (1030, 1030b) and the first end of the first substrate (1100).
[0135] Meanwhile, if the first length (L1) and first width (W1) of the mounting pad (1030, 1030b) are formed to be 10% longer than the second length (L2) and second width (W2) of the first substrate (1100), the first distance (D1) may not be sufficient for the first substrate (1100) to be mounted and fixed. Therefore, considering the offset placement structure of the first substrate (1100) based on the difference between the first distance (D1) and the second distance (D2), the first length (L1) and first width (W1) of the mounting pad (1030, 1030b) may be formed to be up to 50% longer than the second length (L2) and second width (W2) of the first substrate (1100). In this regard, considering the opaque region (12) of the glass assembly (10), the second distance (D2) may be formed to be greater than the minimum separation distance. A first substrate (1100) may be placed in the transparent region (11) of the glass assembly (10). A second substrate (1200) may be placed in the opaque region (12) of the glass assembly (10).
[0136] As described above, the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be placed and seated on the mounting pad (1030, 1030b). In the first state before the first glass (10a) and the second glass (10b) are bonded, the thickness (t4a) of the mounting pad (1030, 1030b) can be formed thinner than the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion is formed. In the first state before the first glass (10a) and the second glass (10b) are bonded, the thickness (t4a) of the mounting pad (1030, 1030b) can be formed within a range between 90% and 100% of the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion is formed. It is preferable that the thickness (t4a) of the mounting pad (1030, 1030b) be at least 90% of the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode is formed.
[0137] In a second state where the first glass (10a) and the second glass (10b) are bonded, the fourth thickness (t4) of the mounting pad (1030, 1030b) may be formed to be thicker than the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion is formed. The fourth thickness (t4) on the Z-axis of the mounting pad (1030, 1030b) is formed to be greater than or equal to the fifth thickness (t5) on the Z-axis of the first substrate (1100). The fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed may be formed in a range between 90% and 100% of the fourth thickness (t4) of the mounting pad (1030, 1030b).
[0138] As described above, the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed to be 30 µm to 300 µm. The fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to be 50 µm to 500 µm. Meanwhile, the second surface of the mounting pad (1030, 1030b) and the second surface of the first substrate (1100) can be formed at the same position on the Z-axis. Accordingly, the thickness on the Z-axis between the first surface of the mounting pad (1030, 1030b) and the first surface of the first substrate (1100) can be formed to be 10% or less of the fifth thickness (t5) of the first substrate (1100).
[0139] In this regard, the fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to be at least 50 µm. The thickness on the Z-axis between the first surface of the mounting pad (1030, 1030b) and the first surface of the first substrate (1100) can be formed to be 5 µm. Accordingly, the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed to be 45 µm.
[0140] Meanwhile, the fifth thickness (t5) of the first substrate (1100) can be formed to a maximum of 300 µm. The thickness on the Z-axis between the first surface of the mounting pad (1030, 1030b) and the first surface of the first substrate (1100) can be formed to 30 µm. Accordingly, the fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to 330 µm. As the fifth thickness (t5) of the first substrate (1100) is formed to 45 µm to 300 µm, the fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to 50 µm to 330 µm.
[0141] In a glass assembly (10) according to the present disclosure, a third region (R3) of a second substrate (1200) bonding film (1020) may be sequentially laminated in a lower region of a mounting pad (1030, 1030b). The first thickness (t1) of the first region (R1) of the bonding film (1020) may be formed to be equal to the sum of the fourth thickness (t4) of the mounting pad (1030, 1030b), the sixth thickness (t6) of the second substrate (1200), and the third thickness (t3) of the third region (R3) of the bonding film (1020).
[0142] The fifth thickness of the mounting pad (1050) can be formed to be thicker than the third thickness (t3) of the third region (R3) of the bonding film (1020). Accordingly, the second substrate (1200) can be positioned closer to the first glass (10a) than to the second glass (10b).
[0143] In this regard, the second substrate (1200) may be placed on the side and front of the first glass (10a). Accordingly, the power loss of the feed line (1200f) of the second substrate (1200) placed on the side and front of the first glass (10a) can be reduced. In this regard, FIG. 13 shows a cross-sectional view of a glass assembly in which a second substrate with a feed line formed on the side and front of the first glass is placed. FIG. 14 shows the connection structure of the first substrate and the second substrate of FIG. 13 and the connection structure of the second substrate and the coaxial cable.
[0144] With reference to FIGS. 8 to 14, a connection structure of a vehicle glass assembly (10) according to the present disclosure will be described. A second substrate (1200) having a feed line (1200f) formed thereon may be formed as a flexible substrate. A second substrate (1200) having a feed line (1200f) formed thereon may be formed as a flexible printed circuit board (FPCB) with a flexible substrate structure.
[0145] As described above, the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed to be 30 µm to 300 µm. Preferably, the fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed to be 75 µm to 150 µm.
[0146] It is preferable that the first dielectric (1010a) of the first substrate (1100) be formed in the form of a film having a visible light transmittance of 80% or more. Materials such as PET (Polyethylene terephthalate), COP (cyclic olefin polymer), PEN (polyethylene naphthalate), PES (polyether sulfone), PC (polycarbonate), and acetyl celluloid may be used as the first dielectric (1010a). Meanwhile, it is more preferable that the transparent substrate of the first dielectric (1010a) be PET. The thickness of the first dielectric (1010a) of the transparent substrate may be 25 μm to 125 μm, but is not limited thereto.
[0147] The thickness of the second substrate (1200) on which the feed line (1200f) is formed increases as the number of stacked layers increases. An FPCB having 1 to 4 copper layers can be used as the second substrate (1200). The thickness of the second substrate (1200) formed as an FPCB can be formed to be 50 µm to 500 µm.
[0148] The first end of the feed line (1200f) can be connected by a metal electrode (1111) and an ACF bonding part (1210) that form the antenna transparent electrode part (1110) of the first substrate (1100). A resin layer (1112) can be formed between the metal electrodes (1111). The metal electrodes (1111) and the resin layer (1112) can form the antenna transparent electrode part (1110). The second end of the feed line (1200f) can be connected to the signal line (110) of the coaxial cable (100c) by an ACF bonding part (1230).
[0149] Meanwhile, an opaque region (12), which is a black mask region, may be formed on the first surface of the first glass (10a). At least a portion of the antenna transparent electrode portion (1110) may be placed in an outer region of the opaque region (12), which is a black mask region. At least a portion of the feed line (1200f) may be placed so as to overlap with the opaque region (12), which is a black mask region. Accordingly, the transparency of the transparent antenna can be maintained while reducing the feed loss of the feed line (1200f) of the second substrate (1200) placed on the side and front of the first glass (10a). As the feed line (1200f) is placed in the opaque region (12) of the first glass (10a), a decrease in the transparency of the transparent antenna does not occur.
[0150] The first glass (10a) may be formed facing the inner region of the vehicle. The second glass (10b) may be formed facing the outer region of the vehicle. The first glass (10a) and the second glass (10b) may form a double bonded glass structure joined by a bonding film (1020) and a set film (1030). The bonding film (1020) and the set film (1030) may include one or more of polyvinyl butyral (PVB) and ethylene vinyl acetate (EVA).
[0151] As the first and second glass (10a, 10b) are bonded, the bonding film (1020) may be configured to include a first bonding film region (1021) and a second bonding film region (1022). The first bonding film region (1021) may be configured to include a first region (R1), a second region (R2), and a third region (R3) of the bonding film (1020). The first bonding film region (1021) may be formed in the first region (R1) and the second region (R2) of the bonding film (1020) with a second thickness (t2) of a predetermined range based on 760 µm. The first bonding film region (1021) may be formed in the third region (R3) of the bonding film (1020) with a third thickness (t3) that is thinner than the second thickness (t2).
[0152] A second bonding film region (1022) may be formed with a fourth thickness (t4) on the first bonding film region (1021) in the first region (R1) of the bonding film (1020). The second bonding film region (1022) and the mounting film (1030) may be formed with the same fourth thickness (t4).
[0153] The first bonding film region (1021) and the second bonding film region (1022) may be formed from the same material. As another example, the first bonding film region (1021) and the second bonding film region (1022) may be formed from different materials. The first bonding film region (1021) may be formed such that the proportion of a first material, such as PVB, which has strong adhesion to glass, is higher than the proportion of a second material, such as EVA, which has strong adhesion to the substrate. The second bonding film region (1022) may be formed such that the proportion of a second material, such as EVA, which has strong adhesion to the substrate, is higher than the proportion of a first material, such as PVB, which has strong adhesion to glass.
[0154] The above describes a glass assembly for a vehicle according to the present disclosure. The following describes a method for manufacturing a glass assembly according to another aspect of the present disclosure. In this regard, FIG. 15 shows a flowchart of a method for manufacturing a glass assembly for a vehicle according to the present disclosure.
[0155] Referring to FIGS. 8 through 15, a method for manufacturing a vehicle glass assembly may be configured to include a bonding film placement process (S110), a power supply line connection process (S120), a bonding film adhesion process (S130), a mounting pad placement process (S140), a first substrate attachment process (S150), and a glass bonding process (S160). A method for manufacturing a vehicle glass assembly may further include a coaxial cable connection process (S210). A method for manufacturing a vehicle glass assembly may be performed by a glass assembly manufacturing device. A method for manufacturing a vehicle glass assembly may be performed by a control device (or control unit, processor) of a glass assembly manufacturing device.
[0156] In the bonding film placement process (S110), a bonding film (1020) may be placed on the first surface of the second glass (10b) to be placed opposite the first glass (10a). In the feed line connection process (S120), the antenna transparent electrode portion (1110) formed on the first substrate (1100) and the feed line (1200f) formed on the second substrate (1200) may be connected.
[0157] In the bonding film bonding process (S130), the second surface of the second substrate (1200) can be bonded to the bonding film (1020). In the mounting pad placement process (S140), a mounting pad (1030, 1030b) can be placed on the first glass (10a). In the first substrate attachment process (S150), the first substrate (1100) having an antenna transparent electrode portion (1110) formed thereon can be attached to the mounting pad (1030, 1030b). In the glass bonding process (S150), the first glass (10a) and the second glass (10b) can be bonded so that the ends of the first glass (10a) and the ends of the second glass (10b) are aligned.
[0158] The method of manufacturing a vehicle glass assembly is not limited to the sequence of FIG. 15. For example, after a bonding film bonding process (S130) in which a second substrate (1200) is bonded to a bonding film (1020) is performed, a power line connection process (S120) may be performed. Additionally, after the power line connection process (S120) is performed, a bonding film placement process (S110) and a bonding film bonding process (S130) may be performed.
[0159] The first glass (10a) and the second glass (10b) are bonded through a glass bonding process (S150). With the first glass (10a) and the second glass (10b) bonded, a bonding film (1020) can be formed with a first thickness (t1) between the first surface of the second glass (10b) and the second surface of the first glass (10a) in a first region (R1). With the first glass (10a) and the second glass (10b) bonded, the bonding film (1020) can be formed with a second thickness (t2) between the second surface of the seating pad (1030, 1030b) and the first surface of the second glass (10b) in a second region (R2) adjacent to the first region (R1). The bonding film (1020) may be formed such that the first thickness (t1) of the first region (R1) is thicker than the second thickness (t2) of the second region (R2) of the bonding film (1020). Meanwhile, before the first glass (10a) and the second glass (10b) are bonded, the mounting pad (1030, 1030b) may be formed in the third region (R3) where the second region (R2) and the second substrate (1020) are placed.
[0160] In the glass bonding process (S150), the bonding film (1020) may be formed with different thicknesses in a third region (R3) adjacent to a second region (R2). In the glass bonding process (S150), the bonding film (1020) may be formed with a third thickness (t3) in the third region (R3) between the second surface of the first glass (10a) and the second surface of the second substrate (1200). In the glass bonding process (S150), the second thickness (t2) of the second region (R2) of the bonding film (1020) may be formed to be thicker than the third thickness (t3) of the third region (R3) of the bonding film (1020).
[0161] In the glass bonding process (S150), the first thickness (t1) of the first region (R2) of the bonding film (1020) can be formed to be 300 µm to 1200 µm. In the glass bonding process (S150), the fourth thickness (t4) of the mounting pad (1030, 1030b) can be formed to be 50 µm to 500 µm. In the glass bonding process (S150), the first thickness (t1) of the first region (R2) of the bonding film (1020) can be formed to be equal to the sum of the second thickness (t2) of the second region (R2) and the fourth thickness (t4) of the mounting pad (1030, 1030b).
[0162] In the glass bonding process (S150), the first substrate (1100) and the second substrate (1200) can be placed and fixed within the glass assembly (10). In the glass bonding process (S150), the first thickness (t1) of the bonding film (1020) can be formed to be thicker than the sum of the fifth thickness (t5) of the first substrate (1100) and the sixth thickness (t6) of the second substrate (1200). In the glass bonding process (S150), the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed to be thicker than the sum of the fifth thickness (t5) of the first substrate (1100) on which the feed line (1200f) is formed and the sixth thickness (t6) of the second substrate (1200) on which the feed line (1200f) is formed.
[0163] In the glass bonding process (S150), a third region (R3) of the second substrate (1200) bonding film (1020) can be sequentially laminated in the lower region of the mounting pad (1030, 1030b) in the glass assembly (10). In the glass bonding process (S150), the first thickness (t1) of the first region (R1) of the bonding film (1020) can be formed to be equal to the sum of the fourth thickness (t4) of the mounting pad (1030, 1030b), the sixth thickness (t6) of the second substrate (1200), and the third thickness (t3) of the third region (R3) of the bonding film (1020).
[0164] In the mounting pad placement process (S140), the first length (L1) of the mounting pad (1030, 1030b) may be formed to be 10% to 50% longer in the first axial direction than the second length (L2) of the first substrate (1100). In the mounting pad placement process (S140), the first width (W1) of the mounting pad (1030, 1030b) may be formed to be 10% to 50% wider in the second axial direction orthogonal to the first axis than the second width (W2) of the first substrate (1100). In the mounting pad placement process (S140), the first length (L1) and first width (W1) of the mounting pad (1030, 1030b) are formed to be at least 10% longer than the second length (L2) and second width (W2) of the first substrate (1100), so that the first substrate (1100) can be mounted and fixed within the area where the mounting pad (1030, 1030b) is formed.
[0165] In the mounting pad placement process (S140), the fourth thickness (t4) on the Z-axis of the mounting pad (1030, 1030b) is formed to be greater than or equal to the fifth thickness (t5) on the Z-axis of the first substrate (1100). The fifth thickness (t5) of the first substrate (1100) on which the antenna transparent electrode portion (1110) is formed can be formed in a range between 90% and 100% of the fourth thickness (t4) of the mounting pad (1030, 1030b).
[0166] Following the glass bonding process (S150), a coaxial cable connection process (S210) may be performed to connect the second end of the feed line (1200f) to the signal line (110) of the coaxial cable (100c). In this regard, the second substrate (1200) on which the feed line (1200f) is formed may be formed as a flexible substrate. In the feed line connection process (S120), the first end of the feed line (1200) may be connected by an ACF bonding part (1210) to a metal electrode (1111) that forms the antenna transparent electrode part (1110) of the first substrate (1100).
[0167] For the above, we have examined the vehicle glass assembly with a double-bonded glass structure and the method for manufacturing the same according to the present specification. The technical effects of the vehicle glass assembly with a double-bonded glass structure and the method for manufacturing the same according to the present specification are described as follows.
[0168] According to the present specification, a substrate having a transparent antenna and a substrate having a feed line can be arranged between double-bonded glass to have excellent adhesion.
[0169] According to the present specification, a substrate having a transparent antenna and a substrate having a feed line can be arranged between double-bonded glass to have high reliability without variation in antenna characteristics.
[0170] According to the present specification, the increase in glass weight can be reduced by minimizing the amount of bonding film additionally used for mounting a transparent antenna.
[0171] According to the present specification, the amount of additional adhesive film required in double-bonded glass manufactured by inserting a transparent antenna between the glass panes can be reduced, thereby minimizing weight increase and reducing costs.
[0172] According to the present specification, the risk of having to make design changes due to an increase in glass thickness in a glass assembly of a double-bonded glass structure and a method for manufacturing the same can be reduced.
[0173] According to the present specification, the amount of bonding film used is reduced by 10 to 50 times compared to conventional methods, thereby minimizing the increase in raw material costs associated with the application of a transparent antenna to double-bonded glass.
[0174] According to the present specification, when the glass thickness increases due to the use of two bonded films, the issue of the inconvenience of requiring design changes to the vehicle frame on which the glass is mounted can be resolved.
[0175] According to the present specification, by using a single bonding film and a mounting pad with an optimized structure, when a transparent antenna is inserted and installed between double-bonded glass, bubble formation can be suppressed and perfect bonding can be achieved.
[0176] Further scope of the applicability of this specification will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of this specification are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of this specification, should be understood as being given merely as examples.
[0177] In relation to the foregoing specification, a method for designing or manufacturing a glass assembly having a transparent antenna formed thereon may be implemented as computer-readable code on a medium on which a program is recorded. A computer-readable medium includes all types of recording devices in which data that can be read by a computer system is stored. Examples of computer-readable media include a Hard Disk Drive (HDD), a Solid State Disk (SSD), a Silicon Disk Drive (SSD), ROM, RAM, a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc., and also include implementations in the form of a carrier wave (e.g., transmission over the Internet). Additionally, the computer may include a control unit of a terminal.
[0178] Meanwhile, the above detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of this specification shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of this specification are included within the scope of this specification.
Claims
1. In a vehicle glass assembly, First glass; A second glass positioned opposite to the first glass; A seating pad disposed on the second surface of the first glass; A bonding film disposed on the first surface of the second glass; A first substrate disposed on the above-mentioned mounting pad; An antenna transparent electrode portion formed on the first substrate; A feed line connected to the end of the transparent electrode portion of the antenna to apply a signal; and The above feed line is formed, and the second substrate is bonded to the bonding film, and In a state where the first glass and the second glass are bonded, the bonding film is formed with a first thickness in a first region between the first surface of the second glass and the second surface of the first glass, and In a state where the first glass and the second glass are bonded, the bonding film is formed with a second thickness between the second surface of the mounting pad and the first surface of the second glass in a second region adjacent to the first region, and In the state prior to the bonding of the first glass and the second glass, the mounting pad is formed in the second region and the third region where the second substrate is disposed, and A vehicle glass assembly in which the first thickness is formed to be thicker than the second thickness.
2. In Paragraph 1, The bonding film is formed with a third thickness between the second surface of the first glass and the second surface of the second substrate in the third region, and A vehicle glass assembly in which the second thickness is formed to be thicker than the third thickness.
3. In Paragraph 2, In the first state prior to the bonding of the first glass and the second glass, the bonding film is formed with a uniform thickness in the first region, the second region, and the third region, and A vehicle glass assembly in which the uniform thickness is formed within a range between the first thickness and the second thickness.
4. In Paragraph 3, The bonding film and the mounting pad are formed of the same material, and A vehicle assembly in which the material of the bonding film and the material of the seating pad are mixed in the first region, the second region, and the third region to form a bonding layer.
5. In Paragraph 3, The bonding film is formed of a first material, and the seating pad is formed of a second material that is different from the first material, and The adhesive strength between the first glass and the second glass and the first material is higher than the adhesive strength between the first glass and the second glass and the second material, and A vehicle assembly having a higher adhesion force between the first substrate and the second substrate and the second material than between the first substrate and the second substrate and the first material.
6. In Paragraph 2, The first thickness of the first region of the bonding film is formed to be 300 µm to 1200 µm, and The fourth thickness of the above-mentioned mounting pad is formed to be 50 µm to 500 µm, and The fifth thickness of the first substrate on which the antenna transparent electrode portion is formed is formed to be 30 µm to 300 µm, and A vehicle glass assembly in which the first thickness of the first region of the bonding film is formed to be equal to the sum of the second thickness of the second region and the fourth thickness of the mounting pad.
7. In Paragraph 2, A vehicle glass assembly in which the first thickness of the bonding film is formed to be thicker than the sum of the fifth thickness of the first substrate on which the antenna transparent electrode is formed and the sixth thickness of the second substrate on which the feed line is formed.
8. In Paragraph 1, The first length of the above-mentioned mounting pad is formed to be 10% to 50% longer in the first axial direction than the second length of the above-mentioned first substrate, and A vehicle glass assembly, wherein the first width of the above-mentioned mounting pad is formed to be 10% to 50% wider than the second width of the above-mentioned first substrate in the direction of the second axis orthogonal to the first axis.
9. In Paragraph 6, In the first state prior to the bonding of the first glass and the second glass, the thickness of the mounting pad is formed to be in a range between 90% and 100% of the fifth thickness of the first substrate on which the antenna transparent electrode is formed, and A vehicle glass assembly in which, in a second state in which the first glass and the second glass are bonded, the fourth thickness of the mounting pad is formed to be thicker than the fifth thickness of the first substrate on which the antenna transparent electrode portion is formed.
10. In Paragraph 9, A vehicle glass assembly in which the first thickness of the first region of the bonding film is formed to be equal to the sum of the fourth thickness of the mounting pad, the sixth thickness of the second substrate, and the third thickness of the third region of the bonding film.
11. In Paragraph 10, A vehicle glass assembly in which the fifth thickness of the above-mentioned mounting pad is formed to be thicker than the third thickness of the third region of the above-mentioned bonding film, so that the second substrate is positioned closer to the first glass than to the second glass.
12. In Paragraph 2, The second substrate on which the above feed line is formed is formed as a flexible substrate, and The first end of the above feed line is connected by a metal electrode forming the antenna transparent electrode portion of the first substrate and an ACF bonding portion, and A vehicle glass assembly in which the second end of the above-mentioned power line is connected to a signal line of a coaxial cable.
13. In Paragraph 6, A black mask region is formed on the first surface of the first glass, and At least a portion of the above-mentioned antenna transparent electrode is disposed in the outer region of the above-mentioned black mask region, and A vehicle glass assembly in which at least a portion of the above feed line is positioned to overlap with the above black mask area.
14. In Paragraph 6, The bonded film above is, A first bonding film region formed in the first region and the second region with a second thickness within a predetermined range based on 760 µm; and A vehicle glass assembly comprising a second bonding film region formed on the first bonding film in the first region with a fourth thickness thinner than 100 µm.
15. A method for manufacturing a glass assembly for a vehicle, A bonding film placement process for placing a bonding film on the first surface of a second glass to be positioned opposite the first glass; A feed line connection process connecting an antenna transparent electrode formed on a first substrate and a feed line formed on a second substrate; A bonding film bonding process for bonding the second surface of the second substrate to the bonding film; A process of placing a mounting pad on the first glass above; A first substrate attachment process of attaching the first substrate having the antenna transparent electrode portion formed thereon to the above-mentioned mounting pad; and The method includes a glass bonding process for bonding the first glass and the second glass so that the ends of the first glass and the ends of the second glass are aligned, and In a state where the first glass and the second glass are bonded, the bonding film is formed with a first thickness in a first region between the first surface of the second glass and the second surface of the first glass, and In the state where the first glass and the second glass are bonded, the bonding film is formed with a second thickness between the second surface of the mounting pad and the first surface of the second glass in a second region adjacent to the first region, and In the state prior to the bonding of the first glass and the second glass, the mounting pad is formed in the second region and the third region where the second substrate is disposed, and A method for manufacturing a vehicle glass assembly, wherein the first thickness is formed to be thicker than the second thickness.
16. In Paragraph 15, In the above glass bonding process The bonding film is formed with a third thickness in a third region between the second surface of the first glass and the second surface of the first glass, and A method for manufacturing a vehicle glass assembly, wherein the second thickness is formed to be thicker than the third thickness.
17. In Paragraph 16, In the above glass bonding process, The first thickness of the first region of the bonding film is formed to be 300 µm to 1200 µm, and The fourth thickness of the above-mentioned mounting pad is formed to be 50 µm to 500 µm, and A method for manufacturing a vehicle glass assembly, wherein the first thickness of the first region of the bonding film is formed to be equal to the sum of the second thickness of the second region and the fourth thickness of the seating pad.
18. In Paragraph 17, In the above glass bonding process, The first thickness of the bonding film is formed to be thicker than the sum of the fifth thickness of the first substrate on which the antenna transparent electrode is formed and the sixth thickness of the second substrate on which the feed line is formed, and A method for manufacturing a vehicle glass assembly, wherein the first thickness of the first region of the bonding film is formed to be equal to the sum of the fourth thickness of the mounting pad, the sixth thickness of the second substrate, and the third thickness of the third region of the bonding film.
19. In Paragraph 17, In the above process of placing the mounting pad, The first length of the above-mentioned mounting pad is formed to be 10% to 50% longer in the first axial direction than the first length of the above-mentioned first substrate, and The first width of the above-mentioned mounting pad is formed to be 10% to 50% wider than the second width of the first substrate in the direction of the second axis orthogonal to the first axis, and In the first state prior to the bonding of the first glass and the second glass, the thickness of the mounting pad is formed to be in a range between 90% and 100% of the fifth thickness of the first substrate on which the antenna transparent electrode is formed, and A method for manufacturing a vehicle glass assembly, wherein in a second state in which the first glass and the second glass are bonded, the fourth thickness of the mounting pad is formed to be thicker than the fifth thickness of the first substrate on which the antenna transparent electrode portion is formed.
20. In Paragraph 16, The second substrate on which the above feed line is formed is formed as a flexible substrate, and In the above feed line connection process, the first end of the feed line is connected to the metal electrode forming the antenna transparent electrode part of the first substrate and the ACF bonding part, and A method for manufacturing a vehicle glass assembly, further comprising a coaxial cable connection process that connects the second end of the feed line to the signal line of the coaxial cable following the glass bonding process.