Apparatus and method for treating substrates in a CVD reactor

Abstract

The invention relates to an apparatus and a method for treating substrates, comprising a process chamber (1) in which a first number (N1) of storage locations (3) is provided for a respective substrate (22). A first cassette (K1) is populated with a second number (N2) of substrates which are to be processed. The processed substrates are stored in a second cassette (K2) which also has a second number (N2) of storage locations (31). Since the first number (N1) is mutually prime with respect to the second number (N2), the unprocessed substrates (22) and the processed substrates (32) are buffer-stored within the apparatus respectively in first and second storage elements (S1, S2), the buffer storage taking place in such a way that always first cassettes (K1) which are fully laden can be fed to the apparatus and always cassettes (K2) which are fully filled can be removed from the apparatus.

Description

Description Device and method for treating substrates in a CVD reactor field of technology

[0001] The invention relates to a device for treating substrates. Such a device has at least one CVD reactor connected to a transfer chamber via a loading port. A robot equipped with a gripper is located in the transfer chamber. This gripper is used to remove substrates from a process chamber of the CVD reactor and to insert unprocessed substrates into the process chamber. The device has a first chamber into which a first cassette containing unprocessed substrates can be inserted. A second chamber contains a second cassette that holds processed substrates. The gripper can be used to insert the processed substrates into the second cassette and to remove the unprocessed substrates from the first cassette.

[0002] The problem described above also arises with an arrangement of several CVD reactors, a so-called cluster. The first number is then determined by the total number of storage locations of all CVD reactors belonging to the cluster. A cassette arrangement can be used here, containing one or more identical cassettes. The total number of storage locations of the one or more cassettes in the cassette arrangement then constitutes the second number if the greatest common divisor of the total number of storage locations of all CVD reactors belonging to the cluster and the number of storage locations in the storage volume of the cassette arrangement is less than the number of storage locations in the storage volume of the cassette arrangement. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 Such a cluster has a transfer chamber connected to several CVD reactors, each of which has a process chamber with storage spaces.

[0003] Furthermore, it is required to be able to track the path of a substrate through the various production steps. Therefore, a processed substrate placed in a cassette of a cassette array must be located in the same position as it was in the cassette of the cassette array containing the substrates to be processed. For example, a substrate to be processed that is located in the topmost storage position of the cassette should, after processing, also be located in the topmost storage position of a cassette. State of the art

[0004] Devices and methods of this type are known from the CN 108292922 A, CN 115132629 A, CN 21232591, WO 2017 / 094695 Al, US 10,347,516 Bl, US 2020 / 0354828 Al and DE 102019123556 Al.

[0005] The CVD reactor's process chamber contains a first set of storage locations for substrates. This first set can be even or odd, for example, 5, 7, or 9. The cassette has a second set of storage locations, different from the first, which could be, for example, 25. If the first set of storage locations is a divisor of the second set, all unprocessed substrates stored in the cassette can be processed sequentially in the CVD reactor, for example, by depositing one or more layers onto the substrate surface. If, for example, the process chamber has five storage locations, all substrates in the cassette can be coated in five consecutive runs. Afterward, the two cassettes can be exchanged. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 However, if the quantities have a greatest common divisor that is smaller than the first quantity, this method is not possible. In particular, it is currently not possible to carry out the processes in such a way that each completely filled cassette is processed completely. Summary of the invention

[0006] The invention is therefore based on the objective of specifying measures by which fully filled cassettes can be changed in configurations where the first number is not a divisor of the second number.

[0007] The problem is solved by the invention specified in the claims. The dependent claims not only represent advantageous further developments of the invention specified in the dependent claims, but also independent solutions to the problem.

[0008] First and foremost, additional storage elements are proposed that can temporarily hold unprocessed substrates during the processing of the unprocessed substrates stored in the first cassette, or that can temporarily hold the processed substrates after the substrates have been processed. It is advantageous if each storage element has a third number of storage locations for one substrate, where the third number is smaller than the first. It is sufficient if the third number is at most less than the first number by the common divisor, which can also be 1.

[0009] The invention relates to an allocation rule by which the unprocessed substrates are introduced into a storage volume of the first storage element or removed from it again. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 or with which the processed substrates are introduced into a storage volume of the second storage element or removed from it again.

[0010] In its simplest embodiment, the device comprises a CVD reactor with a process chamber that has a first number of storage locations. The device has a first cassette and a second cassette, both of which are identical in construction.

[0011] The first cassette contains a second set of unprocessed substrates, from which a first set of substrates are processed sequentially in the process chamber. After processing, the substrates are transferred as processed substrates to the second cassette. This continues until the remaining quantity in the first cassette is less than the first set. When this occurs, the system checks whether the first storage element contains a sufficient number of unprocessed substrates to replenish the remaining quantity to the first set. The remaining quantity, along with a corresponding number of substrates from the storage element to replenish the first set, are then transferred to the process chamber for processing. The now completely emptied first cassette can then be replaced with a cassette filled with unprocessed substrates.During the process, the presence of unprocessed substrates in the first storage element, which can be used for replenishment, is continuously or at regular intervals checked. The first storage element is replenishment achieved by transferring unprocessed substrates from the first cassette into it. If the first storage element does not contain a sufficient number of unprocessed substrates to replenish the remaining quantity, the remaining substrate from the first cassette is transferred to the first storage element. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 The storage element therefore requires a maximum of one less initial number of substrates.

[0012] The second cassette is filled with the processed substrates taken from the process chamber until the number of free storage spaces in the second cassette's storage volume is less than the number in the first. If sufficient free storage spaces remain in the second storage element, an excess of processed substrates exceeding the number of free storage spaces can be stored in the second storage element. The second cassette, now completely full, can then be replaced with an empty one.However, if it becomes apparent that the second storage element does not have enough free storage spaces to accommodate an excess of processed substrates, the remaining free storage spaces of the second cassette are completely filled with processed substrates taken from the second storage element. This ensures that even then, a fully filled second cassette can be exchanged for an empty one. At each step or at predefined intervals, it can be checked whether processed substrates from the second storage element can be transferred to the second cassette. Preferably, however, excess processed substrates from different runs are collected in the second storage element and then transferred to the second cassette at a later time.

[0013] In another embodiment, the device has several CVD reactors that can be loaded and unloaded via a common transfer chamber. In the previously described embodiment, and preferably in this embodiment, the first cassette arrangement can have several first cassettes and the second cassette arrangement can have several second cassettes. The first number then corresponds to the total number of 31326N1PCT drg / g 27.10.2025 Ai 2024-13 Storage locations of the process chambers of the multiple CVD reactors. The second number corresponds to the total number of storage locations of the first or second cassette arrangement. The storage locations of each cassette arrangement are sequential. The sequence begins, for example, with the top storage location of the first cassette, provided the cassette arrangement contains multiple cassettes. The sequence continues through the storage locations below and the top storage location of a second cassette. The storage locations of the cassettes in the cassette arrangement thus have a numberable order. The processed substrates are placed in the cassettes of the second cassette arrangement in the same order in which they were removed from the cassettes of the first cassette arrangement. This measure allows individual substrates to be tracked throughout a process sequence.

[0014] The invention also relates to a device for carrying out the method. The device comprises a process chamber with a first number of storage positions, each for a substrate. A support ring, carrying a substrate, can be placed in the storage position. An intermediate storage area can be provided where the support rings, each carrying a substrate, are temporarily stored. The substrates can be removed from or placed onto the support rings using a robot gripper. The robot gripper can also place the substrates into the cassettes or storage elements, or transport them back and forth between the cassettes and storage elements. The support rings can also be brought into the process chamber using the gripper.The device has a control unit in which an execution program is stored that controls the transport of the substrates according to the previously described method. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0015] The invention further relates to a storage element that can be accommodated together with a cassette in a chamber of the device. The chamber has a base with projections. The cassette, or storage element, has a bottom with corresponding recesses. The top of the storage element also has projections that can be inserted into the recesses of the cassette, so that the storage element and cassette can be stacked on top of each other in the chamber. The base of the chamber can have a sensor that can detect the presence of a cassette. The top of the storage element can have a similar sensor that is operatively connected to the sensor on the base of the chamber, so that the control unit, to which the sensor in the base is coupled, can check whether a cassette is present in the chamber.While the storage element remains permanently in the chamber, the cassette is replaced in the manner described above.

[0016] The base can be rigidly connected to the chamber's housing and be an integral part of it. However, it is also possible for the base to be movable within the chamber, i.e., within the housing that forms the chamber. For example, the base can be shifted vertically or horizontally relative to the housing. It can also be rotated relative to the housing. The base provides a support surface for the storage element. Brief description of the drawings

[0017] An embodiment of the invention is explained below with reference to the accompanying drawings. These show: Fig. 1 schematically shows a device for treating substrates; 31326N1PCT drg / g 27.10.2025 Ai 2024-13 Fig. 2 a chamber 60 for receiving a cassette Kl, K2 and a storage element SI, S2; Fig. 3 is a simplified representation according to Figure 1 of a device with several CVD reactors 1 and each a first cassette arrangement and a second cassette arrangement, wherein the cassette arrangements each have only one cassette Kl, K2; Fig. 4 is a simplified representation according to Figure 1 of a device with several CVD reactors 1 and several first cassettes Kl and second cassettes K2. Description of the embodiments

[0018] The device shown in Figure 1 has a CVD reactor comprising a process chamber 1 containing a gas inlet (not shown) through which process gas is fed into the process chamber. A heater (not shown) can heat a susceptor 2, which is rotatably arranged within the process chamber 1, to a process temperature. At this temperature, reactive gases decompose, depositing a layer on the surface of substrates 22. This layer can be a III-V layer, a IV-IV layer, or a II-VI layer.

[0019] However, a device according to the invention can also have a different reactor in which substrates are, for example, thermally treated.

[0020] In the exemplary embodiment, a total of nine bearing positions 3 are provided on the susceptor 2, at each of which a support ring 4 is placed. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 can, wherein each support ring 4 can support a substrate 22 to be coated. This number is here referred to as the first number NI, which is 9 in the exemplary embodiment.

[0021] Process chamber 1 adjoins a transfer chamber 10 via a closable opening in the form of a gate 13. A robot 11, equipped with a gripper 12, is located in the transfer chamber. The gripper 12 can grasp and transport both support rings 4 and substrates 22, 32.

[0022] A transfer chamber 10 adjoins an intermediate storage chamber 40 with a closable opening in the form of a gate 14, which has intermediate storage locations 41. In the exemplary embodiment, the number of intermediate storage locations 41 corresponds to the first number NI, but can also be greater.

[0023] The transfer chamber 10 is adjoined by chambers 60 (not shown in Figure 1) which each contain a cassette Kl, K2 and a storage element SI, S2, and each of which has a lockable opening in the form of a gate 15, 16.

[0024] Two cassettes Kl, K2 are provided, each with a storage volume 20, 30, which includes a second number N2 of storage locations 21, 31. Each of the storage locations 21, 31 is capable of holding a substrate, with the first cassette Kl holding unprocessed substrates 22 and the second cassette Kl holding processed substrates 32. The second number N2 is 25 in the exemplary embodiment. On its underside, the cassette Kl, K2 has recesses 63 that correspond to projections 62 extending from a base 61 of the chamber 60. By means of these projections 62 engaging in the recesses 63, the cassette Kl, K2 can be positioned precisely in the chamber 60. The base 61 also has a sensor 66, which is equipped with a 31326N1PCT drg / g 27.10.2025 Ai 2024-13 Control unit 50 interacts. The control unit 50 can detect via this sensor 66 whether a cassette Kl, K2 is in the chamber.

[0025] According to the invention, in addition to the two cassettes Kl, K2, a storage element SI, S2 is also positioned in chamber 60. The storage element SI, S2 has a storage volume 25, 35 for receiving a third number N3 of substrates. The storage volume 25, 35 has N3 storage locations 26, 36, each for receiving one substrate 22, 32. In the exemplary embodiment, the third number is N38.

[0026] On its underside, the storage element SI, S2 has recesses 64 that correspond to the projections 62. On its upper side, the storage elements SI, S2 have projections 65 arranged in the same way as the projections 62, so that a cassette Kl, K2 can be placed on the upper side of each storage element SI, S2. The upper side of the storage element SI, S2 also has a sensor 67, which is connected via a connecting element 68 to the sensor 66 or the control unit 50, so that the control unit 50 can detect whether a cassette Kl, K2 is in chamber 60. While the storage elements SI, S2 are permanently located in their respective chambers 60, the cassettes Kl, K2 are exchanged.

[0027] According to the invention, it is therefore possible to retrofit a treatment device with a reactor or other treatment chamber in which a substrate carrier, i.e., a susceptor 2, is replaced by another substrate carrier, wherein a substrate carrier originally having five storage locations has been replaced by one now having, for example, nine storage locations. Only a storage element SI, S2, which remains permanently in the chambers, is inserted there. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0028] The base 61 of chamber 60 can have a plurality of sensors 66, which are arranged regularly across the surface of the base 61, for example, at the vertices of equally spaced, perpendicularly intersecting lines. These sensors 66 can be sensor pins that can engage in recesses 63 of cassettes Kl, K2 arranged in a corresponding pattern. These recesses 63 can have different depths. The cassettes Kl, K2 can be coded by means of these variable depths, which can be determined by the sensors.

[0029] The upward-facing outer wall of the storage element SI, S2 can have this type of sensor arrangement on the base 61, so that these sensors can interact with the recesses 63 of varying depths on the underside of the cassette Kl, K2.

[0030] The underside of the storage element SI, S2 can have the same arrangement of recesses 64 as the underside of the cassette Kl, K2. Actuators can be arranged in these recesses, allowing the depth of the recess to be changed. The depth of the recess is changed using sensor values ​​acquired from the associated sensor on the top side of the storage element SI, S2, so that the underside of the storage element SI, S2 is a replica of the underside of the cassette Kl, K2 supported by the storage element SI, S2.

[0031] The base 61 can be rigidly connected to the chamber. However, it is also possible that the base 61 is a separate element of the chamber, which is movable relative to the chamber walls, for example. The base 61 supports the storage elements SI and S2. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0032] In this embodiment, the first number NI, which here is 9, and the second number N2, which here is 25, have a greatest common divisor T of 1. In embodiments not shown, the greatest common divisor T can be 2 or 3. However, the greatest common divisor T is smaller than the first number NI, which in turn is smaller than the second number N2.

[0033] The number of storage locations 26, 36 in the two storage elements SI, S2 can also correspond to the number NI of storage locations 3 of susceptor 2. If, in addition, the material from which the storage elements SI, S2 are made is a heat-resistant material, for example quartz or metal—that is, a material that does not lose its shape or properties when heated above 200°C—then at least the second storage element S2, in which the processed substrates 32 are stored, can be used as a temporary cooling chamber to cool the hot substrates, which may have been taken directly from process chamber 1, before they are placed in cassette K2. Storage element S1 and, in particular, storage element S2 can thus be used as intermediate storage.

[0034] The method according to the invention begins with loading the first cassette Kl with a second number (here 25) of unprocessed substrates 22. The first cassette Kl, now fully loaded with substrates 22, is inserted into chamber 60, so that the gripper 11 has access to the unprocessed substrates 22. A completely empty second cassette Kl is inserted into chamber 60, so that the gripper 11 has access to the storage locations 31. The two storage elements SI and S2 are completely empty. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0035] The table below shows the sequence of numerous steps used to perform numerous runs. The first column identifies the respective step, the second column the respective run, the third column the number of unprocessed substrates 22 in the first cassette Kl, the fourth column the number of unprocessed substrates 22 in the first storage element S1, the fifth column the number of processed substrates 32 in the second cassette K2, and the sixth column the number of processed substrates 32 in the second storage element S2. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 In the first step, the first cassette Kl, fully loaded with 25 unprocessed substrates 22, and the second cassette Kl, which has 25 empty storage places 31, are inserted, so that substrates 22 can be placed into the process chamber with the gripper 12, or substrates 32 can be removed from the process chamber and, if necessary, placed in the second cassette K2 after intermediate storage in the intermediate storage 40. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0036] In the second step, an initial run is started in which nine unprocessed substrates 22 are taken from cassette Kl and placed in process chamber 1. There, they are processed. After the processing of the unprocessed substrates 22, the processed substrates 32 are removed from process chamber 1 and temporarily stored in buffer 40. Transport is carried out using support rings 4, which can later remain in buffer 40.

[0037] In the third step, a second run is started, in which nine more unprocessed substrates 22 are taken from cassette Kl and placed in process chamber 1. There are then only seven unprocessed substrates 22 in the first cassette Kl and no processed substrate 32 in the second cassette K2.

[0038] In the fourth step, which is carried out during the second run, the seven remaining unprocessed substrates 22 forming a residual stock are moved from the first cassette Kl to the first storage element S1, so that the first cassette Kl is empty.

[0039] In the fifth step, which is also performed during the second run, the empty first cassette Kl is exchanged for a fully filled first cassette Kl, and the nine processed substrates 32 are transferred from the intermediate storage 40 into the second cassette Kl. The substrates processed in the meantime are transferred from process chamber 1 into the now empty intermediate storage 40. The second cassette K2 then contains nine processed substrates 32. The intermediate storage 40 contains nine processed substrates, and process chamber 1 is empty. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0040] In the sixth step, a third run is initiated, in which nine unprocessed substrates 20 are taken from cassette Kl and inserted into process chamber 1. The first cassette Kl then contains only sixteen unprocessed substrates 22. Both process chamber 1 and intermediate storage 40 are now fully loaded.

[0041] In the seventh step, a fourth run is initiated by first removing the nine processed substrates 32 from the intermediate storage unit 40 and inserting them into the second cassette K2, so that there are eighteen processed substrates 32 there. Then, the nine processed substrates 32 are removed from process chamber 1 and placed in intermediate storage unit 40. Nine unprocessed substrates 22 are removed from the first cassette Kl and inserted into process chamber 1. After the seventh step, i.e., during the fourth run, there are seven substrates in the first cassette Kl, seven substrates in the first intermediate storage unit 40, eighteen substrates in the second cassette K2, and no substrate in the second intermediate storage unit.

[0042] In the eighth step, a fifth run is initiated. Following the sequence described previously, the intermediate storage unit 40 is first emptied, then filled with the processed substrates 32 from process chamber 1, and the remaining seven substrates are taken from the first cassette Kl, along with two unprocessed substrates 22 from the first storage element S1. These nine substrates are placed in process chamber 1 and processed as described above. The first cassette Kl is now empty, and the first storage element S1 contains five unprocessed substrates 22. The second cassette K2 contains only seven free storage spaces 31, meaning that of the nine processed substrates 32, only seven substrates 32 can be stored in the second cassette K2. The excess of two substrates 32 is stored in the second storage element S2. 31326N1PCT drg / g 27.10.2025 Ai 2024-13

[0043] In the ninth step, the two cassettes Kl, K2 are exchanged, so that twenty-five unprocessed substrates 22 are available in the first cassette Kl and twenty-five free storage places 31 are available in the second cassette K2.

[0044] In the tenth step, a sixth run is started, so that the first cassette Kl contains sixteen substrates 22 and the second cassette K2 contains nine substrates. After the tenth step, the cassettes Kl, K2 and the storage elements SI, S2 are in a filling state as shown in Figure 1.

[0045] In the eleventh step, a seventh run is started, so that the first cassette Kl contains only seven substrates 22 and the second cassette K2 contains eighteen substrates. Thus, the first cassette Kl contains a remaining stock of seven substrates and the second cassette K2 has only seven free storage spaces 31.

[0046] In the twelfth step, an eighth run is initiated, but only seven substrates are available in the first cassette Kl for loading process chamber 1. This remaining stock is replenished by two unprocessed substrates 22 taken from the first storage element S1. The number of substrates then in the first storage element S1 is only 3. Of the nine processed substrates 32, only seven can be placed in the second cassette K2. The remaining two processed substrates 32 are stored in the second storage element S2, increasing the number there to 4.

[0047] In the thirteenth step, which can be performed during the eighth run, the fully taught first cassette Kl is used against a 31326N1PCT drg / g 27.10.2025 Ai 2024-13 The fully filled cassette is replaced with an empty cassette.

[0048] The process continues analogously in the further steps, whereby the number of unprocessed substrates 22 temporarily stored in the first storage element S1 is gradually reduced to 1 and the number of processed substrates 32 temporarily stored in the second storage element S2 is gradually increased to 8.

[0049] After the nineteenth step, the first cassette Kl contains a remaining quantity of seven substrates 22. The first storage element S1 contains only one substrate 22, so the nine substrates 22 required to completely fill the process chamber 1 are not available. Therefore, in the twentieth step, the remaining seven substrates 22 are transferred to the first storage element S1. The first cassette Kl is then completely emptied and is replaced in the twenty-first step with a fully filled first cassette Kl.

[0050] In the twenty-second step, a fourteenth run is performed, after the first cassette Kl contains sixteen substrates 22, the first storage element S1 contains eight substrates 22, the second cassette K2 contains twenty-five substrates 32, and the second storage element S2 contains eight substrates 22 thirty-two substrates.

[0051] Then, in the twenty-third step, the second cassette K2 is replaced with an empty cassette.

[0052] In the twenty-fifth step, a sixteenth run is performed in which the process chamber is loaded with seven substrates 22 from the first cassette Kl. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 and two substrates are filled from the first storage element S1. Nine substrates are introduced from the intermediate storage into the second cassette K2.

[0053] After the twenty-fifth step, a check reveals that the sum of the free memory locations of the second cassette K2 and the second memory element S2 is less than nine. It is only seven.

[0054] In the twenty-sixth step, the seven free storage locations of the second cassette K2 are filled with seven substrates 32 from the second storage element S2, so that the second cassette K2 is completely filled. In this step, the first cassette Kl, which was emptied after the twenty-fifth step, is also replaced by a filled cassette Kl.

[0055] In the twenty-seventh step, the filled second cassette K2 is exchanged for an empty second cassette K2.

[0056] In steps 28 to 30, the seventeenth, eighteenth and nineteenth runs are carried out in the manner described above, after cassette Kl has completely emptied, the number of substrates stored in the first storage element S1 has increased to four, the second cassette K2 has completely filled and the number of substrates stored in the second storage element S2 has increased to three.

[0057] In step 31, the cassettes Kl, K2 are replaced again.

[0058] The procedure is continued analogously to the steps described above up to step 39 by performing a run after seven substrates 22 have been placed in the first cassette Kl and two in the first storage element S1. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 Substrate 22, in the second cassette K2 twenty-five substrates 32 and in the second storage element S2 seven substrates 32 are present.

[0059] In step 40, the fully filled cassette K2 is exchanged for an empty cassette K2.

[0060] In step 41, a twenty-fifth run is performed, in which the seven substrates 22 of the first cassette Kl and the two substrates 22 of the first storage element S1 are brought into the process chamber 1.

[0061] In the forty-second step, the emptied first cassette Kl is exchanged for a filled cassette K2.

[0062] In the forty-third step, a twenty-sixth run is performed. In the forty-fourth step, it is recognized that the sum of the free spaces in the second cassette K2 and in the second storage element S2 is less than nine. The seven substrates 32 of storage element S2 are moved into the second cassette K2 in the forty-fourth step, so that it is completely filled, and in the forty-fifth step, it can be exchanged for an empty second cassette K2.

[0063] After the forty-fifth step, both the second cassette K2 and the second storage element S2 are completely empty.

[0064] The process can be continued with any number of steps, wherein in a refilling step a certain number of unprocessed substrates 22, for example seven, are transferred from the first cassette Kl into the first storage element S1, and this number of unprocessed substrates 22 is reduced as needed to replace residual amounts of 31326N1PCT drg / g 27.10.2025 Ai 2024-13 The second storage element S2 serves to replenish the unprocessed substrates 22. It accommodates a surplus of processed substrates 32 that cannot be added to the second cassette K2. Once the second storage element S2 has gradually filled, it is completely emptied when an upper fill level is exceeded, particularly when the second storage element S2 is completely full. This is achieved by transferring the temporarily stored processed substrates 32 to the second cassette K2. This can also occur, for example, if an empty second cassette K2 is available.

[0065] Substrates 22 can be moved between the first cassette Kl and the first storage element S1 at any time, so that the number of substrates 22 contained in the first cassette Kl after moving is a multiple of the first number NI.

[0066] Substrates 32 can be moved between the second cassette K2 and the second storage element S2 at any time, so that the number of free storage places in the second cassette K2 corresponds to a multiple of the first number NI.

[0067] The process is preferably carried out such that a processed substrate is located in the second cassette K2 at the same position where it was previously located as an unprocessed substrate in the first cassette Kl. For example, a treated substrate that was located at the top storage location 21 in the first cassette Kl is placed at the top storage location 31 of the second cassette K2.

[0068] Figure 3 shows another embodiment in which the device has four CVD reactors, each with a process chamber 1. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 CVD reactors are loaded and unloaded by a shared robot 11 in a shared transfer chamber 10. The loading and unloading of the CVD reactors takes place sequentially according to the procedure described above. One CVD reactor is loaded and unloaded at a time. During this time, a treatment process takes place in the other CVD reactors.

[0069] Figure 4 shows another embodiment in which the device has four CVD reactors, each with a process chamber 1. The CVD reactors are loaded and unloaded by a common robot 11 in a common transfer chamber 10. Here, too, the number of storage locations in a process chamber 1 can be nine. The first number NI is formed here by the total number of storage locations of all process chambers 1 and is therefore thirty-six.

[0070] While the cassette arrangements in the first embodiment each contain only one cassette Kl, K2, here the first cassette arrangement contains three first cassettes Kl and the second cassette arrangement contains three second cassettes K2, so that the second number here is seventy-five. Space can be provided in the intermediate storage 40 for the number of substrates of a process chamber 1. The intermediate storage 40 can thus have at least nine storage locations 41. However, it is also possible that the number of storage locations of the intermediate storage 40 is a multiple of this number, for example eighteen, twenty-seven, or thirty-six.

[0071] Here it is possible to discharge or load several CVD reactors in immediate succession. In this embodiment of the process, several first cassettes can be emptied one after the other. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 will be filled, and then several second K2 cassettes will be filled one after the other.

[0072] It is considered particularly advantageous that, due to the “in-situ sorting”, the order of the substrates in the cassettes Kl, K2 is maintained.

[0073] The foregoing statements serve to explain the inventions covered by the application as a whole, which each independently further develop the prior art at least through the following combinations of features, whereby two, several or all of these combinations of features may also be combined, namely:

[0074] A method for treating substrates, particularly in an arrangement with at least one CVD reactor, which has a process chamber 1 with a first number NI storage locations 3 each for a substrate 22, wherein a first cassette arrangement with at least one first cassette Kl and a second cassette arrangement with at least one second cassette K2, each with a storage volume 20, 30, is used, wherein the storage volume 20, 30 has a second number N2 storage locations 21, 31 for each substrate 22, 32, wherein a first storage element S1 and a second storage element S2, each with a storage volume 25, 35, are used, wherein the storage volume 25, 35 has a third number N3 storage locations 26, 36 for each substrate 22, 32, wherein the first number NI is less than the second number N2 and a greatest common divisor T of the first number NI and the second number N2 is less than the first number NI.wherein the third number N3 corresponds at least to the first number NI reduced by the common divisor T, wherein the first cassette Kl contains unprocessed substrates 22, of which a first number NI substrates 22 are successively added, 31326N1PCT drg / g 27.10.2025 Ai 2024-13 The first cassette K2 is treated in process chamber 1 and, after treatment, is stored as processed substrates 32 in the second cassette K2, wherein a residual stock of unprocessed substrates 22 from the first cassette Kl, provided it is less than the first number NI, is stored in the storage volume 25 of the first storage element S1, or is replenished to the first number NI by removing unprocessed substrates 22 stored in the storage volume 25 of the first storage element S1, and the then completely emptied first cassette Kl is exchanged for a first cassette Kl completely filled with unprocessed substrates 22, wherein any excess by which the first number NI of the processed substrates 32 exceeds the number of free storage spaces 31 of the storage volume 30 of the second cassette K2 is stored in a storage volume 35 of a second storage element S2, or a number of free storage spaces 31 of the storage volume 30 that is less than the first number NI,by removing processed substrates 32 from the storage volume 35 of the second storage element S2, and the then completely filled second cassette K2 is exchanged for an empty second cassette K2.

[0075] A method characterized in that the greatest common divisor T is equal to 1 and / or the third number N3 corresponds exactly to the first number NI reduced by the common divisor T.

[0076] A method characterized in that an intermediate storage unit 40 with intermediate storage places 41 is used to temporarily store the processed substrates 32 taken from the process chamber 1 before they are inserted into the storage volume 30 of the second cassette K2.

[0077] A method characterized in that substrates 22 are connected between the first cassette Kl and the first storage element S1 such that 31326N1PCT drg / g 27.10.2025 Ai 2024-13 are exchanged such that after the exchange the number of substrates 22 contained in the first cassette Kl corresponds to a one or multiple of the first number NI and / or that substrates 32 are exchanged between the second cassette K2 and the second storage element S2 such that after the exchange the number of free storage places 31 in the second cassette K2 corresponds to a one or multiple of the first number NI.

[0078] A device characterized in that it is used for treating substrates, in particular with a CVD reactor, which has a process chamber 1 with a first number NI storage locations 3 each for a substrate 22, with a first cassette Kl and a second cassette K2 each with a storage volume 20, 30, which has a second number N2 storage locations 21, 31 each for a substrate 22, 32, with a first storage element S1 and a second storage element S2 each with a storage volume 25, 35, which has a third number N3 storage locations 26, 36 each for a substrate 22, 32, wherein the first number NI is smaller than the second number N2 and a greatest common divisor T of the first number NI and the second number N2 is smaller than the first number NI,wherein the third number N3 corresponds at least to the first number NI reduced by the common divisor T and is connected to a control device 50 for controlling a robot 11 for relocating the substrates 22, 32 according to a method of claims 1 to 4.

[0079] A device characterized in that the greatest common divisor T is equal to 1 and / or the third number N3 corresponds exactly to the first number NI reduced by the common divisor T.

[0080] A device characterized by an intermediate storage unit 40 with intermediate storage locations 41 for intermediate storage from the 31326N1PCT drg / g 27.10.2025 Ai 2024-13 Processed substrates 32 removed from process chamber 1 before being placed into the storage volume 30 of the second cassette K2.

[0081] A device characterized in that the first number NI is equal to 9, the second number N2 is equal to 25 and the third number N3 is equal to 8.

[0082] A storage element for insertion into a chamber 60 for receiving a first cassette Kl or a second cassette K2, wherein the chamber 60 has a bottom 61 with projections 62 and the cassette Kl, K2 has corresponding recesses 63, wherein the bottom 61 can be fixedly connected to the chamber 60 or movable relative to the chamber 60, wherein a bottom of the storage element SI, S2 has recesses 64 corresponding to the projections 62 and a top of the storage element Sl, S2 has projections 65 corresponding to the recesses 63 of the cassette Kl, K2.

[0083] A storage element characterized in that the bottom 61 has a sensor 66 for detecting the presence of a cassette Kl, K2 or a storage element SI, S2 and the top of the storage element SI, S2 has a sensor 67 for detecting the presence of a cassette Kl, K2, which is operatively coupled to the sensor 66 by means of a connecting element 68.

[0084] All disclosed features are essential to the invention (individually, but also in combination with one another). The disclosure of the application hereby incorporates in full the disclosure content of the associated / attached priority documents (copy of the earlier application), also for the purpose of incorporating features of these documents into the claims of the present application. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 The application must be included. The dependent claims, even without the features of a referenced claim, characterize independent inventive developments of the prior art with their features, in particular for the purpose of filing divisional applications based on these claims. The invention specified in each claim may additionally include one or more of the features described above, in particular those identified by reference numerals and / or listed in the reference numeral list. The invention also relates to designs in which individual features mentioned in the preceding description are not implemented, in particular insofar as they are recognizably unnecessary for the respective purpose or can be replaced by other technically equivalent means. 31326N1PCT drg / g 27.10.2025 Ai 2024-13 List of reference symbols 1 Trial Chamber 2 Susceptor 50 Control Unit 3 storage spaces 4 support ring 60 chamber 61 Floor 10 Transfer Chamber 62 lead 11 robots, 63 recesses 12 grippers 64 recesses 13 goals, 65 lead 14 Gate 66 Sensor 15 Gate 67 Sensor 16 Gate 68 Connecting element 20 storage volume Kl first cassette 21 Storage space K2 second cassette 22 unprocessed substrate 51 first storage element 25 storage volume 52 second storage element 26 first storage location NI number of storage locations 3 of the susceptor 2 30 Storage volume N2 Number of storage locations 21, 31 31 Storage location of storage volume 20, 30 32 Processed substrate N3 Number of storage locations 26, 35 Storage volume 36 in storage volume 25, 35 36 Second storage location T Greatest common divisor of NI and N2 40 buffers 41 cache space 31326N1PCT drg / g 27.10.2025 Ai 2024-13

Claims

1. 29 2. Claims 1. Method for treating substrates, in particular in an arrangement with at least one CVD reactor, 4. comprising a process chamber (1) with a first number (NI) of storage places (3) each for a substrate (22), 5. wherein a first cassette arrangement with at least one first cassette (Kl) and a second cassette arrangement with at least one second cassette (K2) each having a storage volume (20, 30) is used, wherein the storage volume (20, 30) has a second number (N2) storage locations (21, 31) for each substrate (22, 32), 6. wherein a first storage element (Sl) and a second storage element (S2) each with a storage volume (25, 35) is used, the storage volume (25, 35) having a third number (N3) storage places (26, 36) for each substrate (22, 32), 7.where the first number (NI) is smaller than the second number (N2) and a greatest common divisor (T) of the first number (NI) and the second number (N2) is smaller than the first number (NI), 8. where the third number (N3) is at least equal to the first number (NI) reduced by the common divisor (T), 9. wherein the first cassette (Kl) contains unprocessed substrates (22), of which a first number (NI) of substrates (22) are successively treated in the at least one process chamber (1) and, after treatment, are deposited as processed substrates (32) in the arrangement of one or more second cassettes (K2), 10. wherein a residual amount of unprocessed substrates (22) of the arrangement of one or more first cassettes (Kl), provided it is smaller than the first number (NI), is stored in the storage volume (25) of the first storage element (Sl) or by a withdrawal from the 11.31326N1PCT drg / g 27,10,2025 Ai 2024-13 30 12. The storage volume (25) of the first storage element (Sl) is filled to the first number (NI) of unprocessed substrates (22) and the then completely emptied one or more first cassettes (Kl) of the first cassette arrangement are exchanged for a second cassette arrangement of one or more first cassettes (Kl) completely filled with unprocessed substrates (22), 13. wherein an excess by which the first number (NI) of processed substrates (32) exceeds the number of free storage spaces (31) of the storage volume (30) of the second cassette arrangement is stored in a storage volume (35) of a second storage element (S2), or a number of free storage spaces (31) of the storage volume (30) that is less than the first number (NI) is filled by removing processed substrates (32) from the storage volume (35) of the second storage element (S2), and the then completely filled second cassette arrangement is exchanged for an empty second cassette arrangement.

2. Method according to claim 1, characterized in that the largest common divisor (T) is equal to 1 and / or the third number (N3) corresponds exactly to the first number (NI) reduced by the common divisor (T).

3. Method according to one of the preceding claims, characterized in that an intermediate storage unit (40) with intermediate storage places (41) is used to temporarily store the processed substrates (32) taken from the process chamber (1) before they are inserted into the storage volume (30) of the second cassette (K2).

4. Method according to one of the preceding claims, characterized in that between the first cassette arrangement and the first 17.31326N1PCT drg / g 27,10,2025 Ai 2024-13 Storage element (Sl) Substrates (22) are exchanged such that after the exchange the number of substrates (22) contained in the first cassette arrangement corresponds to a one or multiple of the first number (NI) and / or that between the second cassette arrangement and the second storage element (S2) substrates (32) are exchanged such that after the exchange the number of free storage locations (31) in the second cassette arrangement corresponds to a one or multiple of the first number (NI).

5. Method according to one of the preceding claims, characterized in that the first cassette arrangement and the second cassette arrangement each comprise exactly one cassette (Kl, K2), wherein one or more CVD reactors are used.

6. Method according to one of the preceding claims, characterized in that the first cassette arrangement and the second cassette arrangement each comprise several cassettes (Kl, K2), wherein one or more CVD reactors are used, wherein the first number (NI) is the total number of storage locations of the one or more CVD reactors and the second number (N2) is the total number of storage locations (21, 22) of the first cassette arrangement or the second cassette arrangement.

7. Method according to one of the preceding claims, characterized in that the storage locations (21, 31) in the one or more cassettes (Kl, K2) of the first and second cassette arrangement have a sequence and the processed substrates are arranged in the same sequence in the one or more cassettes (K2) of the second cassette arrangement in which they were taken from the one or more cassettes (Kl) of the first cassette arrangement. 21.31326N1PCT drg / g 27,10,2025 Ai 2024-13 8. Device for treating substrates, in particular with at least one CVD reactor, 22. comprising a process chamber (1) with a first number (NI) of storage places (3) each for a substrate (22), 23. comprising a first cassette order with at least one first cassette (Kl) and a second cassette order with at least one second cassette (K2), each with a storage volume (20, 30) having a second number (N2) of storage locations (21, 31) for each substrate (22, 32), comprising a first storage element (Sl) and a second storage element (S2), each with a storage volume (25, 35) having a third number (N3) of storage locations (26, 36) for each substrate (22, 32), wherein the first number (NI) is smaller than the second number (N2) and a greatest common divisor (T) of the first number (NI) and the second number (N2) is smaller than the first number (NI), 24.where the third number (N3) is at least equal to the first number (NI) reduced by the common divisor (T) and 25. with a control device (50) for controlling a robot (11) for relocating the substrates (22, 32) according to a method of claims 1 to 7.

9. Device according to claim 8, characterized in that the greatest common divisor (T) is equal to 1 and / or the third number (N3) corresponds exactly to the first number (NI) reduced by the common divisor (T).

10. Device according to one of claims 8 or 9, characterized by an intermediate storage unit (40) with intermediate storage locations (41) for intermediate storage of processed material taken from the process chamber (1). 28.31326N1PCT drg / g 27,10,2025 Ai 2024-13 33 29. Substrates (32) before being placed into the storage volume (30) of the second cassette (K2).

11. Device according to one of claims 8 to 10, characterized in that the first number (NI) is equal to 9, the second number (N2) is equal to 25 and the third number (N3) is equal to 8.

12. Device according to one of claims 8 to 11, characterized in that the first cassette arrangement and the second cassette arrangement each comprise exactly one cassette (Kl, K2), wherein one or more CVD reactors are provided.

13. Device according to one of claims 8 to 11, characterized in that the first cassette arrangement and the second cassette arrangement each comprise several cassettes (Kl, K2).

14. Storage element (SI, S2) for a device according to one of claims 7 to 10 for insertion into a chamber (60) for receiving the first cassette (Kl) or the second cassette (K2), 34. wherein the chamber (60) has a bottom (61) with projections (62) and the cassette (Kl, K2) has corresponding recesses (63), wherein the bottom (61) can be fixedly connected to the chamber (60) or movable relative to the chamber (60), wherein a bottom of the storage element (SI, S2) has recesses (64) corresponding to the projections (62) and a top of the storage element (SI, S2) has projections (65) corresponding to the recesses (63) of the cassette (Kl, K2). 35.31326N1PCT drg / g 27,10,2025 Ai 2024-13 34 15. Storage element according to claim 14, characterized in that the bottom (61) has a sensor (66) for detecting the presence of a cassette (Kl, K2) or a storage element (SI, S2) and the top of the storage element (SI, S2) has a sensor (67) for detecting the presence of a cassette (Kl, K2) which is operatively coupled to the sensor (66) by means of a connecting element (68).

16. Method, device or storage element, characterized by one or more of the characterizing features of one of the preceding claims. 38.31326N1PCT drg / g 27,10,2025 Ai 2024-13

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