Substrate detection device, substrate processing device, substrate delivery device, substrate cleaning device, and substrate detection method

Abstract

Provided is a novel substrate detection technique different from inventions described in the background.　Provided is a substrate detection device comprising: at least one radar device having a transmitter that transmits radio waves to a substrate held by a substrate holding unit, and a receiver that receives radio waves reflected by the substrate; and a detector that detects the presence or absence of the substrate on the basis of the radio waves received by the receiver.

Description

Substrate detection device, substrate processing device, substrate transfer device, substrate cleaning device, and substrate detection method

[0008] ,

[0001] The present invention relates to a substrate detection device, a substrate processing device, a substrate transfer device, a substrate cleaning device, and a substrate detection method.

[0002] As a method for detecting the presence or absence of a substrate, (1) a method of irradiating the substrate with visible light and comparing the amount of light detected by an optical fiber sensor with a threshold value to detect the presence or absence of the substrate, or (2) a method of providing a pendulum mechanism on the substrate placement surface and detecting the presence or absence of the substrate by utilizing the fact that the pendulum sinks when the substrate is placed are known.

[0003] In the method of (1), since no mechanism contacts the substrate, there is no loss of the substrate or the optical fiber sensor. However, there is a risk of optical corrosion by irradiating the substrate with visible light. Also, when using an optical fiber sensor in an environment where liquids such as cleaning liquid or polishing liquid scatter, there is a risk of irregular reflection of visible light due to the light projecting part of the optical fiber sensor or the liquid adhering to the substrate, resulting in false detection.

[0004] In the method of (2), since there is contact between the substrate and the pendulum mechanism, the pendulum mechanism may be damaged or soiled, and maintenance such as part replacement or cleaning is required. Furthermore, there is also a risk of scratching the substrate due to contact with the pendulum mechanism. Also, if the pendulum mechanism is complex, the possibility of malfunction increases.

[0005] Japanese Unexamined Patent Application Publication No. 2023 - 111109, Japanese Unexamined Patent Application Publication No. 2023 - 105587, Japanese Unexamined Patent Application Publication No. 11 - 219930

[0006] An object of the present invention is to provide a novel substrate detection technique different from the inventions described in the above background art.

[0007] As an example, the following solution means are provided.

[0008] [1] At least one radar device having a transmitting unit that transmits radio waves to a substrate held by a substrate holding unit and a receiving unit that receives the radio waves reflected by the substrate, and a detection unit that detects the presence or absence of the substrate based on the radio waves received by the receiving unit. A substrate detection device comprising:

[0009] [2] A substrate detection device comprising: at least one radar device having a transmitting unit that transmits radio waves to a substrate held in a substrate holding unit and a receiving unit that receives radio waves reflected from the substrate; and a detection unit that detects whether or not the substrate is held at a predetermined angle based on the radio waves received by the receiving unit.

[0010] [3] The substrate detection device according to [2], wherein the detection unit detects whether or not the substrate is held at a predetermined angle based on the difference between the distance to the substrate based on the radio waves received by the receiving unit and a predetermined distance.

[0011] [4] The substrate detection device according to [2], wherein the at least one radar device includes a first radar device having a first transmitter that emits radio waves at a first position on a substrate held in the substrate holder and a first receiver that receives radio waves reflected from the substrate, and a second radar device having a second transmitter that emits radio waves at a second position on a substrate held in the substrate holder and a second receiver that receives radio waves reflected from the substrate, the detection unit detects whether the substrate is held at a predetermined angle based on the distance to the substrate based on the radio waves received by the first receiver and the distance to the substrate based on the radio waves received by the second receiver.

[0012] [5] A substrate detection device according to any one of [2] to [4], further comprising a control unit that controls the tilt of the substrate so that the tilt of the substrate is eliminated when it is determined that the substrate is not held at a predetermined angle.

[0013] [6] A substrate detection device according to any one of [1] to [5], comprising a resin member provided between a substrate held by the substrate holding portion and the radar device.

[0014] [7] A substrate processing apparatus comprising the substrate holding portion and the substrate detection device according to any one of [1] to [6].

[0015] [9] A substrate transfer device having the substrate holding part and the substrate detection device described in any one of [1] to [6].

[0016] [9] A substrate transfer device comprising: a plurality of pins for holding a substrate; a plurality of top ring guides provided corresponding to each of the plurality of pins, into which the top ring head of a substrate polishing device fits, the upper surface of which is located outside and above the corresponding pin; a plurality of lifting mechanisms provided corresponding to each of the plurality of pins for individually raising and lowering the corresponding pin; at least one radar device having a transmitting unit for transmitting radio waves to a substrate held by at least a portion of the plurality of pins, and a receiving unit for receiving radio waves reflected by the substrate; a detection unit for detecting whether the substrate is held at a predetermined angle based on the radio waves received by the receiving unit; and a control unit for controlling one of the plurality of lifting mechanisms based on the detection result.

[0017]

[10] If it is detected that the substrate is not held at a predetermined angle, the control unit controls at least one of the lifting mechanisms so that the substrate is no longer tilted, the substrate transfer device according to [9].

[0018]

[11] A substrate transfer device comprising: a plurality of pins for holding a substrate; a resin pin base for supporting the plurality of pins; a top ring guide into which the top ring head of a substrate polishing device fits; a resin top ring guide base for supporting the top ring guide; at least one radar device having a transmitting unit that transmits radio waves to a substrate held by at least a portion of the plurality of pins via the pin base and the top ring guide base, and a receiving unit that receives radio waves reflected from the substrate via the pin base and the top ring guide base; and a detection unit that detects whether or not the substrate is held at a predetermined angle based on the radio waves received by the receiving unit.

[0019]

[12] A substrate cleaning device comprising: a substrate holding portion; a substrate detection device according to any one of [1] to [6]; and a cleaning member for cleaning a substrate held in the substrate holding portion.

[0020]

[13] A substrate detection method comprising the steps of: transmitting radio waves to a substrate held in a substrate holding section; receiving radio waves reflected from the substrate; and determining the presence or absence of a substrate based on the received radio waves.

[0021]

[14] A substrate detection method comprising the steps of: transmitting radio waves to a substrate held by a substrate holding portion; receiving radio waves reflected by the substrate; and detecting whether or not the substrate is held at a predetermined angle based on the received radio waves.

[0022] A block diagram showing the schematic configuration of a substrate detection device 200 according to one embodiment. A block diagram showing the schematic configuration of a substrate detection device 200 according to one embodiment. A diagram illustrating the relationship between the radar device 10 and the substrate W. A diagram showing the state in which the substrate W is held at an angle. A diagram showing the state in which the substrate W is held at an angle. A schematic configuration diagram of the substrate processing device 100. A diagram showing how the substrate W is transferred from the substrate transport device 6b to the substrate polishing device 3 via the pusher 61. A schematic plan view of the pusher 61. A schematic cross-sectional view of the pusher 61. A diagram illustrating the state in which a part of the substrate W rides up onto the top ring guide 65 and is held at an angle. A schematic plan view of the pusher 61, which is a first modified example. A schematic cross-sectional view of the pusher 61, which is a first modified example. A diagram illustrating the operation of the substrate detection device 200. A schematic cross-sectional view of the pusher 61, which is a second modified example. A perspective view showing the overall configuration of an example of a substrate cleaning device 4 equipped with the substrate detection device 200. A perspective view showing the overall configuration of another example of a substrate cleaning device 4 equipped with the substrate detection device 200.

[0023] Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

[0024] (First Embodiment) Figures 1A and 1B are block diagrams showing the schematic configuration of a substrate detection device 200 according to one embodiment. The substrate detection device 200 comprises one (Figure 1A) or a plurality (two in Figure 1B) radar devices 10 and a detection unit 11. The substrate W to be detected is held, for example, in a substrate holding unit 20 of a substrate processing device, and the radar device 10 may be positioned below it.

[0025] The radar device 10 includes a transmitting unit 10a that emits radio waves (radar waves) to the substrate W, and a receiving unit 10b that receives the radio waves reflected by the substrate W. When the substrate detection device 200 includes multiple radar devices 10, the transmitting units 10a emit radio waves at different locations on the substrate W. As the radar device 10, for example, the RF-SH01 radar displacement meter manufactured by Keyence Corporation can be used.

[0026] As shown in Figure 2, the distance L between the radar device 10 and the substrate W is, for example, 50 to 150 mm. The radio wave transmission angle θ is, for example, about 5 to 20 degrees. For accurate detection, it is desirable that all of the transmitted radio waves are contained within the substrate W. The frequency band of the radio waves is, for example, millimeter waves. In this case, since the radio waves penetrate resin, a resin component can be placed between the radar device 10 and the substrate W.

[0027] Returning to Figures 1A and 1B, the detection unit 11 performs predetermined detection processing based on the radio waves received by the receiving unit 10b.

[0028] A specific example of the detection process is the detection of the presence or absence of a substrate W. For example, the detection unit 11 detects the presence or absence of a substrate W by determining whether the receiving unit 10b can receive reflected radio waves within a predetermined time from the transmission of radio waves by the transmitting unit 10a. Alternatively, the detection unit 11 calculates the distance to the target from the difference between the time of radio wave transmission and the time of reflected radio wave reception, and determines whether the calculated distance is within a predetermined threshold to detect the presence or absence of a substrate W. If the substrate detection device 200 is equipped with multiple radar devices 10, the detection unit 11 calculates the distance to the substrate W for each radar device 10 and determines whether each of them is within a threshold. If all are within the threshold, the detection unit 11 may determine that a substrate W exists.

[0029] Another example of the detection process is the detection of whether or not the substrate W is held at a predetermined angle (the tilt of the substrate W). Under normal conditions, as shown in Figures 1A and 1B, the substrate W is held at a predetermined angle (usually horizontal or vertical). However, for some reason, it may be held at an angle, as shown in Figures 3A and 3B. The substrate detection device 200 can detect such tilts.

[0030] For example, as shown in Figure 3A, if the substrate detection device 200 includes one radar device 10, the detection unit 11 calculates the distance to the substrate W, determines whether the calculated distance is within a predetermined threshold, and detects whether the substrate W is tilted or not.

[0031] Furthermore, as shown in Figure 3B, if the substrate detection device 200 includes two or more radar devices 10, the detection unit 11 may calculate the distance to the substrate W for each radar device 10 and perform tilt detection. For example, if all of the calculated distances are within a threshold, the detection unit 11 may determine that the substrate W is not tilted. Alternatively, if multiple radars are placed at equal distances from a substrate W held in a normal state, and the difference between the distance between one radar device 10 and the substrate W and the distance between another radar device 10 and the substrate W is within a threshold, the detection unit 11 may determine that the substrate W is not tilted.

[0032] When detecting the tilt of the substrate W, it is desirable that the substrate detection device 200 includes a control unit 12 that controls the tilt of the substrate W so that it is held at a predetermined angle without tilting.

[0033] Some or all of the processing in the detection unit 11 and the control unit 12 may be performed, for example, by a processor executing a predetermined program.

[0034] (Second Embodiment) The second embodiment described below relates to a substrate processing apparatus having the substrate detection device 200 described in the first embodiment.

[0035] Figure 4 is a schematic diagram of the substrate processing apparatus 100. The substrate processing apparatus 100 is, for example, a CMP apparatus and comprises a substantially rectangular housing 1 and a load port 2 arranged adjacent to the housing 1.

[0036] A substrate cassette (not shown) for storing multiple substrates W is placed on the load port 2. Examples of substrates W include semiconductor wafers. However, the substrates W to be processed are not limited to semiconductor wafers, but may also be other types of substrates W used in the manufacture of semiconductor devices, such as glass substrates or ceramic substrates. Furthermore, a device including a semiconductor film or a metal film is formed on at least one surface of the substrate W.

[0037] The substrate processing apparatus 100 comprises one or more (four in Figure 4) substrate polishing devices 3a to 3d (which may be collectively referred to as "substrate polishing device 3" unless otherwise specified), one or more (two in Figure 1) substrate cleaning devices 4a and 4b (which may be collectively referred to as "substrate cleaning device 4" unless otherwise specified), and one or more (two in Figure 4) substrate drying devices 5a and 5b (which may be collectively referred to as "substrate drying device 5" unless otherwise specified), all of which are arranged inside the housing 1.

[0038] As an example, the substrate polishing devices 3a to 3d are arranged along one longitudinal side of the housing 1. The substrate cleaning devices 4a and 4b and the substrate drying devices 5a and 5b are arranged alternately along the other longitudinal side of the housing 1.

[0039] The substrate polishing apparatus 3 polishes the surface of the substrate W. More specifically, the substrate polishing apparatus 3 has a top ring 32 and a polishing pad 33, which will be described later. The substrate W is polished by supplying slurry from a slurry supply mechanism (not shown) onto the polishing pad 33 of the substrate polishing apparatus 3, while the top ring 32 presses the surface of the substrate W against the polishing pad 33, holding and rotating it. Polishing debris and slurry may remain on the substrate W after polishing.

[0040] The substrate cleaning device 4 cleans the surface of the substrate W after polishing. More specifically, the substrate cleaning device 4 cleans the surface of the substrate W by rotating the substrate W and pressing a substrate cleaning tool (not shown in Figure 1) against the surface of the substrate W. A specific example of the substrate cleaning device 4 will be described later.

[0041] The substrate drying apparatus 5 dries the surface of the substrate W after cleaning. For example, the substrate drying apparatus 5 is a spin drying apparatus that dries the substrate W by spraying isopropyl alcohol vapor from a spray nozzle onto the rotating substrate W, while simultaneously rotating the substrate W at high speed and drying the substrate W by centrifugal force.

[0042] Further, the substrate processing apparatus 100 includes substrate transfer devices 6a, 6b, 6ca to 6cd (when not particularly distinguishing these, they are collectively referred to as "substrate transfer device 6", and when not particularly distinguishing 6ca to 6cd, they may be collectively referred to as "substrate transfer device 6c"), and pushers 61a to 61d (when not particularly distinguishing these, they may be collectively referred to as "pusher 61"), and these are arranged inside the housing 1.

[0043] The substrate transfer device 6a is an EFEM (Equipment Front End Module) robot and is arranged adjacent to the load port 2. The substrate transfer device 6b is a linear transfer module and extends in the longitudinal direction at the central part of the housing 1. The substrate transfer devices 6ca to 6cd are process robots and are respectively arranged near the substrate cleaning devices 4a, 4b and the substrate drying devices 5a, 5b. An example of the operation of the substrate transfer device 6 and the flow of the substrate W to be processed is generally as follows.

[0044] The substrate transfer device 6a takes out the substrate W before processing from the load port 2 and places it on the substrate transfer device 6b. The substrate transfer device 6b moves the substrate W to in front of any one of the pushers 61a to 61d (here, pusher 61a). Then, the substrate transfer device 6ca receives the substrate W from the substrate transfer device 6b and places it on the pusher 61a.

[0045] Next, the pusher 61a delivers the substrate W to the top ring 32 of the substrate polishing apparatus 3a (the details will be described later). Then, the top ring 32 moves the substrate on the polishing pad 33, and the substrate is polished.

[0046] The substrate W polished by the substrate polishing apparatus 3a is delivered from the top ring 32 to the pusher 61a. Then, the substrate transfer device 6ca receives the substrate W from the pusher 61a and moves it to the substrate cleaning device 4a. Then, the substrate W is cleaned.

[0047] The substrate transfer device 6ca receives the substrate W cleaned by the substrate cleaning device 4a and moves it to the substrate drying device 5a. Then, the substrate W is dried.

[0048] The substrate transfer device 6cb receives the substrate W dried by the substrate drying device 5a and places it on the substrate transfer device 6b. The substrate transfer device 6b moves the substrate W to the vicinity of the substrate transfer device 6a. Then, the substrate transfer device 6a receives the substrate W and moves it to the load port 2.

[0049] Note that the arrangement of the substrate polishing device 3, the substrate cleaning device 4, the substrate drying device 5, and the substrate transfer device 6 is merely illustrative. It is sufficient to provide one or more substrate transfer devices 6 capable of transferring the substrate W in the order of the substrate polishing device 3, the substrate cleaning device 4, and the substrate drying device 5.

[0050] FIG. 5 is a diagram showing a state in which the substrate W is delivered from the substrate transfer device 6b to the substrate polishing device 3 via the pusher 61 (delivery device). The substrate processing device 100 is partitioned by a plate 71 into an electrical component area below and a polishing area above. The substrate transfer device 6b, the pusher 61, and the substrate polishing device 3 are arranged in the upper polishing area.

[0051] The substrate W is placed on the substrate transfer device 6b. The substrate transfer device 6b is movable in the horizontal and vertical directions with respect to the placed substrate W and conveys the substrate W to the pusher 61. The pusher 61 delivers the substrate W conveyed from the substrate transfer device 6b to the substrate polishing device 3.

[0052] FIG. 6A is a schematic plan view of the pusher 61, and FIG. 6B is a schematic cross-sectional view of the pusher 61 (cross-section taken along line A - A' in FIG. 6A). The pusher 61 includes a plurality (three in the examples of FIGS. 6A and 6B) of pins 62, a pin base 63, a lifting actuator 64, a plurality (three in the examples of FIGS. 6A and 6B) of top ring guides 65, and a top ring guide base 66.

[0053] The pins 62 hold the substrate W transported from the substrate transport device 6b. There are no particular restrictions on the shape of the pins 62, but for example, they are cylindrical in shape extending vertically and hold the substrate W on their upper surface. The pins 62 are arranged at equal intervals along the circumference. The pin base 63 supports the three pins 62 from below. The lifting actuator 64 moves the pin base 63 and the three pins 62 up and down together. The top ring guide 65 guides the top ring head 31 (described later) of the substrate polishing device 3, and its upper surface is located outside and above the position where the substrate W is held (the upper surface of the pins 62). There are the same number of top ring guides 65 as the pins 62, and they may be provided corresponding to each other. The top ring guide base 66 supports the top ring guide 65 from below.

[0054] Returning to Figure 5, the substrate polishing apparatus 3 has a top ring 32 with a top ring head 31 at its tip, and a polishing table 34 with a polishing pad 33 on its upper surface. The top ring head 31 can hold a substrate W on its lower surface. The top ring 32 can be raised and lowered by a drive mechanism (not shown) and can rotate around the main spindle 35. As the top ring 32 oscillates relative to the rotating polishing table 34, pressing the substrate W held by the top ring head 31 against the polishing pad 33, the substrate W is polished.

[0055] The transfer of the substrate W from the pusher 61 to the substrate polishing device 3 is roughly as follows: The substrate W from the substrate transport device 6b is placed on the pin 62 of the pusher 61. The top ring 32 rotates and lowers so that the top ring head 31 fits into the top ring guide 65 of the pusher 61. In this state, the lifting actuator 64 of the pusher 61 raises the pin 62, transferring the substrate W by pressing it against the top ring head 31 of the substrate polishing device 3. Furthermore, the top ring 32 rises, and the spindle 35 rotates to move the substrate W above the polishing table 34. Then, the substrate W is polished by the substrate polishing device 3.

[0056] A substrate detection device 200 can be provided on such a pusher 61. For example, as shown in Figures 6A and 6B, the pusher 61 has two radar devices 10, which are connected to the detection unit 11 (Figures 1A and 1B). The placement of the radar devices 10 is arbitrary, but they can be placed, for example, below the substrate W, more specifically in the polishing area on the top ring guide base 66. The two radar devices 10 can also be arranged so that radio waves reach positions that are point-symmetric with respect to the center of the substrate W. Then, the substrate W detection process described in the first embodiment can be performed.

[0057] For example, Figure 6B shows the substrate W being held normally (horizontally). However, if some error occurs during transport of the substrate W by the substrate transport device 6b or the top ring 32, a part of the substrate W may ride up onto the top ring guide 65 and be held at an angle (falling diagonally), as shown in Figure 7. In this case, the substrate detection device 200 can detect the tilt of the substrate W as described in Figure 3A or Figure 3B.

[0058] Figures 8A and 8B are schematic plan and cross-sectional views, respectively, of a pusher 61, which is a first modified example of Figures 6A and 6B. This pusher 61 is equipped with a lifting actuator 64 and a radar device 10 corresponding to each of the pins 62. The lifting actuator 64 can individually raise and lower the corresponding pin 62. The radar device 10 emits radio waves near the corresponding pin 62. The substrate detection device 200 has a control unit 12 in addition to the detection unit 11 (Figures 3A and 3B).

[0059] When the detection unit 11 of the substrate detection device 200 detects a tilt of the substrate W, the control unit 12 adjusts the position of the substrate W so that the tilt of the substrate W is eliminated. As a specific example, as shown in Figure 8B, suppose the substrate W is held normally by two pins 62, but rides up onto a top ring guide 65 near one of the pins 62. In this case, the distance between the radar device 10 corresponding to the pin 62 on the top ring guide 65 onto which the substrate W has ridden is detected as longer than the distance between the other radar devices 10 and the substrate W.

[0060] In other words, as the distance between the radar device 10 and the substrate W corresponding to a specific pin 62 increases, it is detected that the substrate W is tilted so that the pin 62 is higher. Therefore, the control unit 12 controls the lifting actuator 64 corresponding to that pin 62 to raise the pin 62. Specifically, in the state shown in Figure 8B, the pin 62 and the substrate W are not in contact, but as the lifting actuator 64 rises, the upper surface of the pin 62 comes into contact with the lower surface of the substrate W, and the pin 62 is pushed up.

[0061] This increases the tilt of the substrate W, causing it to slide and move in the opposite direction from the raised pin 62. As a result, the substrate W moves to a position offset from the top ring guide 65, as shown in Figure 8C. In this state, the control unit 12 controls the lifting actuator 64 to lower the raised pin 62 back to its original position, thereby holding the substrate W in a normal horizontal position.

[0062] Figure 9 is a schematic cross-sectional view of a pusher 61, which is a second modified example of Figures 6A and 6B. In this pusher 61, the radar device 10 is located in the electrical area below the pin base 63 and below the top ring guide base 66. The pin base 63 and the top ring guide base 66 are made of resin. As a result, radio waves (millimeter-wave radar) from the radar device 10 pass through these resin components to reach the substrate W, and the reflected radio waves pass through these resin components to reach the radar device 10.

[0063] By placing the radar device 10 in the electrical area, or in other words, by covering the top of the radar device 10 with a resin component, the risk of water ingress into the radar device 10 can be reduced. Furthermore, components (brackets and screws) for installing the radar device 10 are no longer needed in the polishing area, and the portion exposed in the polishing area can be made flat. As a result, polishing fluid and cleaning fluid are less likely to accumulate in the polishing area, and discharge to the drainage duct becomes easier. Consequently, the risk of contamination of the substrate W by splashing accumulated polishing fluid and cleaning fluid can be reduced.

[0064] The above was an example of mounting the substrate detection device 200 on the pusher 61, but the substrate detection device 200 can also be mounted on the substrate cleaning device 4 (Figure 4).

[0065] Figure 10 is a perspective view showing the overall configuration of an example of a substrate cleaning apparatus 4 equipped with a substrate detection device 200. The substrate cleaning apparatus 4 includes a spindle (substrate holding part) 41, roll-shaped cleaning members 42a, 42b, and drive mechanisms 43a, 44b.

[0066] The spindles 41 support and hold the peripheral edge of the substrate W. Specifically, the spindles 41 have a holding portion (spool) 41a at their upper end, and two are arranged on each side of the substrate W with respect to the longitudinal direction of the cleaning members 42a and 42b. The holding portion 41a of the spindles 41 can engage with the outer peripheral edge of the substrate W. When the spindles 41 move closer to each other, the holding portions 41a engage with the outer peripheral edge of the substrate W, holding the substrate W horizontally, and when they move further apart, they release the substrate W. At least one spindle 41 is provided with a spindle drive mechanism (not shown) equipped with a servo motor, and when the spindle 41 is rotationally driven, the substrate W rotates in the horizontal plane.

[0067] The cleaning members 42a and 42b are cylindrical in shape, for example, made of sponge or PVA, and are positioned above and below the substrate W, respectively. The drive mechanisms 43a and 43 move the cleaning members 42a and 42b vertically up and down, respectively, and also rotate them along their central axes. Although not shown, nozzles for supplying cleaning liquid (pure water or chemical solution) to the upper and lower surfaces of the substrate W may be provided.

[0068] In the above configuration, the cleaning members 42a and 42b are retracted above and below the substrate W by the drive mechanisms 43a and 43b, respectively, and the spindles 41 are moved left and right parallel to each other so that they are further apart than in the state shown in Figure 10, waiting for the substrate W to be transported. The substrate W is transported by the handle of the substrate transport device 6c from the end opposite to the drive mechanisms 43a and 43b, parallel to the longitudinal direction of the cleaning members 42a and 42b, above the spindles 41.

[0069] Furthermore, the hand descends, placing the outer periphery of the substrate W on the shoulder of the holding portion 41a of the spindle 41. Next, the spindle 41 is displaced inward to the position shown in Figure 10, and the holding portion 41a of the spindle 41 holds the outer edge of the substrate W that has been lowered by the hand. After that, the hand is retracted from the cleaning device.

[0070] Then, while rotating the substrate W, the drive mechanisms 43a and 43b raise and lower the cleaning members 42a and 42b relative to the substrate W, bringing them into contact with the upper and lower surfaces of the substrate W, and rotate the cleaning members 42a and 42b. As a result, both sides of the substrate W are sandwiched between the cleaning members 42a and 42b, and the substrate W is roll-cleaned.

[0071] In such a substrate cleaning apparatus 4, the radar device 10 is provided below the position where the substrate W is held.

[0072] Figure 11 is a perspective view showing the overall configuration of another example of a substrate cleaning apparatus 4 equipped with a substrate detection device 200. The substrate cleaning apparatus 4 includes a spin chuck (substrate holding part) 44 equipped with a servo motor 44a, a pen-shaped cleaning member 45, and a swinging arm 46.

[0073] The spin chuck 44 holds the substrate W horizontally by vacuum suction. The substrate W is then rotated in the horizontal plane at a predetermined rotational speed by the servo motor 44a. The cleaning member 45 is made of, for example, sponge or PVA. The oscillating arm 46 has the cleaning member 45 at its tip and is movable up and down. A drive mechanism (not shown) provided within the oscillating arm 46 rotates the cleaning member 45 in the horizontal plane. Although not shown, a nozzle for supplying cleaning liquid (pure water or chemical solution) may be provided on the upper surface of the substrate W.

[0074] In the above configuration, the substrate W is transported onto the spin chuck 44 by the handle of the substrate transport device 6c, and the surface to be cleaned is held facing upward. The oscillating arm 46 is raised, and by oscillating the oscillating arm 46 while it remains in the raised position, the cleaning member 45 is moved to approximately the center of the substrate W. Then, the oscillating arm 46 lowers the cleaning member 45 and brings it into contact with the substrate W with a predetermined pressure.

[0075] In this state, the servo motor 44a rotates the substrate W, and the oscillating arm 46 oscillates while rotating the cleaning member 45, thereby scrubbing the upper surface of the substrate W.

[0076] In such a substrate cleaning apparatus 4, the radar device 10 is provided below the position where the substrate W is held.

[0077] In the above examples, we have described cases in which the substrate detection device 200 is mounted on the pusher 61 or the substrate cleaning device 4, but the substrate detection device 200 can be optionally installed in the substrate processing device 100, such as the substrate polishing device 3, substrate drying device 5, substrate transport device 6, etc.

[0078] In the substrate processing apparatus 100, the substrate W is washed and polished in a series of processes including loading, holding, rotating, washing, polishing, and transporting, under conditions where liquids such as water, chemicals, and slurries are scattered. In this embodiment using the radar device 10, the radar device 10's characteristic of not being affected by the external environment makes it possible to detect the target object even in the aforementioned conditions. Furthermore, although the substrate processing apparatus 100 is a situation where liquids such as water, chemicals, and slurries are scattered and corrosion is likely to occur, the characteristic of the radio waves from the radar device 10 being electromagnetic waves with wavelengths different from visible light makes it possible to detect the object without causing photocorrosion even in the aforementioned conditions.

[0079] Any part or all of the functional components described herein may be implemented by program. Programs referred to herein may be recorded non-temporarily on a computer-readable recording medium.

[0080] Such programs may be installed on a computer (so-called native apps). In that case, the program may be downloaded to the computer via a communication line such as the internet (including wireless communication), or it may be distributed already installed on the computer.

[0081] Alternatively, the program may run on a web browser (a so-called web application). In that case, the computer may receive the program, written in a markup language file (e.g., an HTML file), from a server and execute it through the web browser.

[0082] Based on the above description, those skilled in the art may be able to conceive of additional effects and various modifications of the present invention, but the embodiments of the present invention are not limited to the individual embodiments described above. For example, inventions that take only a part of each embodiment, or inventions that combine multiple embodiments, are naturally conceivable. Various additions, modifications, and partial deletions are possible as long as they do not depart from the conceptual idea and spirit of the present invention derived from the contents of the claims and their equivalents.

[0083] For example, what is described herein as a single device (or component, hereinafter the same) (including what is depicted as a single device in the drawings) may be implemented by multiple devices. Conversely, what is described herein as multiple devices (including what is depicted as multiple devices in the drawings) may be implemented by a single device. Alternatively, some or all of the means or functions that are included in one device may be included in another device. Furthermore, a "system" may consist of one device or two or more devices.

[0084] Furthermore, not all matters described herein are mandatory requirements. In particular, matters described herein but not included in the claims can be considered optional additional matters.

[0085] Furthermore, unless otherwise specified, the term “means” in this specification and the claims means hardware (or functions realized by hardware) and does not include human beings (or human mental activity).

[0086] It should also be noted that the applicant is only aware of the prior art inventions described in the "Prior Art Documents" section of this specification, and the present invention is not necessarily intended to solve the problems described in those prior art inventions. The problems that the present invention aims to solve should be determined by considering this specification as a whole. For example, if this specification describes that a certain effect is achieved by a particular configuration, it can also be said that the problem that is the inverse of that predetermined effect is solved. However, this does not necessarily mean that such a particular configuration is an essential requirement.

[0087] 200 Substrate detection device 10 Radar device 10a Transmitter 10b Receiver 11 Detection unit 12 Control unit 20 Substrate holding unit 100 Substrate processing device 1 Housing 2 Load port 3, 3a to 3d Substrate polishing device 31 Top ring head 32 Top ring 33 Polishing pad 34 Polishing table 35 Main spindle 4, 4a, 4b Substrate cleaning device 41 Spindle 41a Holding unit 42a, 42b Cleaning member 43a, 43b Drive mechanism 44 Spin chuck 44a Servo motor 45 Cleaning member 46 Swivel arm 5, 5a, 5b Substrate drying device 6, 6a, 6b, 6ca to 6cd Substrate transport device 61, 61a to 61d Pusher 62 Pin 63 Pin base 64 Lifting actuator 65 Top ring guide 66 Top ring guide base 71 Pan W circuit board

Claims

1. A substrate detection device comprising: at least one radar device having a transmitting unit that transmits radio waves to a substrate held in a substrate holding unit, and a receiving unit that receives radio waves reflected from the substrate; and a detection unit that detects whether the substrate is present or not, or whether the substrate is held at a predetermined angle, based on the radio waves received by the receiving unit.

2. The substrate detection device according to claim 1, wherein the detection unit detects whether or not the substrate is held at a predetermined angle based on the difference between the distance to the substrate based on the radio waves received by the receiving unit and a predetermined distance.

3. The substrate detection device according to claim 1, wherein the at least one radar device includes a first radar device having a first transmitter that emits radio waves at a first position on a substrate held in the substrate holder and a first receiver that receives radio waves reflected from the substrate, and a second radar device having a second transmitter that emits radio waves at a second position on a substrate held in the substrate holder and a second receiver that receives radio waves reflected from the substrate, and the detection unit detects whether the substrate is held at a predetermined angle based on the distance to the substrate based on the radio waves received by the first receiver and the distance to the substrate based on the radio waves received by the second receiver.

4. A substrate detection device according to any one of claims 1 to 3, further comprising a control unit that controls the tilt of the substrate so that the tilt of the substrate is eliminated when it is determined that the substrate is not held at a predetermined angle.

5. A substrate detection device according to any one of claims 1 to 3, comprising a resin member provided between a substrate held by the substrate holding portion and the radar device.

6. A substrate processing apparatus comprising the substrate holding portion and the substrate detection device according to any one of claims 1 to 3.

7. A substrate transfer device having the substrate holding portion and the substrate detection device according to any one of claims 1 to 3.

8. A substrate transfer device comprising: a plurality of pins for holding a substrate; a resin pin base for supporting the plurality of pins; a top ring guide into which the top ring head of a substrate polishing device fits; a resin top ring guide base for supporting the top ring guide; at least one radar device having a transmitting unit that transmits radio waves to a substrate held by at least a portion of the plurality of pins via the pin base and the top ring guide base, and a receiving unit that receives radio waves reflected from the substrate via the pin base and the top ring guide base; and a detection unit that detects whether or not the substrate is held at a predetermined angle based on the radio waves received by the receiving unit.

9. A substrate cleaning apparatus comprising: a substrate holding section; a substrate detection device according to any one of claims 1 to 3; and a cleaning member for cleaning a substrate held by the substrate holding section.

10. A substrate detection method comprising: a step of transmitting radio waves to a substrate held in a substrate holding section; a step of receiving radio waves reflected from the substrate; and a step of detecting whether a substrate is present or not, or whether the substrate is held at a predetermined angle, based on the received radio waves.

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