Heat dissipation structure, container, and data center

Abstract

Embodiments of the present application provide a heat dissipation structure, a container, and a data center. The heat dissipation structure comprises at least one rack, a cooling device, a top frame, and a support platform. The rack comprises a cabinet used for integrally mounting a plurality of computing devices and a medium flow path used for allowing a cooling medium to flow through the plurality of computing devices; the cooling device comprises a heat exchange module and a first pipe set connected between the heat exchange module and the medium flow path; the top frame is fixed to the top of the rack, and at least part of the first pipe set is supported on the top frame; and the rack and the cooling device are integrated on the support platform, the heat exchange module is disposed on one side of the rack in a first direction, and the first pipe set is located on one side of the heat exchange module in a second direction. In this way, a skid structure is formed, thereby improving the integration level and structural stability of the heat dissipation structure, and achieving unified transportation and delivery, and the heat dissipation structure can be directly in place after delivery, thereby reducing the requirements for land flatness and a concrete foundation.

Description

Heat dissipation structure, containers and data centers

[0001] This application claims priority to Chinese Patent Application No. 2024116872066, filed on November 22, 2024, entitled "Heat Dissipation Structure, Container and Data Center", the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202422872126X, filed on November 22, 2024, entitled "Heat Dissipation Structure, Container and Data Center", the entire contents of which are incorporated herein by reference.

[0003] This application claims priority to Chinese Patent Application No. 2024116872456, filed on November 22, 2024, entitled "Frame Structure and Data Center", the entire contents of which are incorporated herein by reference.

[0004] This application claims priority to Chinese Patent Application No. 2024228705820, filed on November 22, 2024, entitled "Frame Structure and Data Center", the entire contents of which are incorporated herein by reference.

[0005] This application claims priority to Chinese Patent Application No. 2024116912896, filed on November 22, 2024, entitled "Rack, Computing Assembly and Data Center", the entire contents of which are incorporated herein by reference.

[0006] This application claims priority to Chinese Patent Application No. 2024228707120, filed on November 22, 2024, entitled "Rack, Computing Assembly and Data Center", the entire contents of which are incorporated herein by reference.

[0007] This application claims priority to Chinese Patent Application No. 2024116902023, filed on November 22, 2024, entitled “Support Platform, Container and Data Center for Data Center”, the entire contents of which are incorporated herein by reference.

[0008] This application claims priority to Chinese Patent Application No. 2024228656523, filed on November 22, 2024, entitled “Support Platform, Container and Data Center for Data Center”, the entire contents of which are incorporated herein by reference.

[0009] This application claims priority to Chinese Patent Application No. 2024116872776, filed on November 22, 2024, entitled "Media Distribution Piping, Piping Bundles, Cabinets, Computing Assemblies and Data Centers", the entire contents of which are incorporated herein by reference.

[0010] This application claims priority to Chinese Patent Application No. 2024228707506, filed on November 22, 2024, entitled "Media Distribution Piping, Piping Bundles, Cabinets, Computing Assemblies and Data Centers", the entire contents of which are incorporated herein by reference.

[0011] This application claims priority to Chinese Patent Application No. 2024116912665, filed on November 22, 2024, entitled "Cooling Equipment and Data Center", the entire contents of which are incorporated herein by reference.

[0012] This application claims priority to Chinese Patent Application No. 202422870697X, filed on November 22, 2024, entitled "Cooling Equipment and Data Center", the entire contents of which are incorporated herein by reference. Technical Field

[0013] This application relates to the field of data center technology, and in particular to a heat dissipation structure, a container, and a data center. Background Technology

[0014] Data centers typically consist of multiple computing devices and cooling systems to dissipate heat from each device. Before delivery, each computing device and cooling system operates independently and requires separate packaging, resulting in high transportation costs. Furthermore, after delivery, the placement of the computing and cooling systems needs to be adjusted to fit the site, followed by assembly and testing, leading to a lengthy deployment cycle. Summary of the Invention

[0015] This application provides a heat dissipation structure, a container, and a data center to solve or alleviate one or more technical problems in the prior art.

[0016] As one aspect of the embodiments of this application, the embodiments of this application provide a heat dissipation structure, including:

[0017] At least one rack, the rack including a cabinet and a media flow path, the cabinet for integrating and installing multiple computing devices, and the media flow path for supplying cooling media to flow through the multiple computing devices;

[0018] The cooling device includes a heat exchange module and a first piping group, the first piping group being connected between the heat exchange module and the medium flow path of at least one rack;

[0019] A top frame is fixed to the top of at least one rack, and at least part of the first piping assembly is supported by the top frame;

[0020] A support platform, at least one rack and cooling equipment are integrated on the support platform, a heat exchange module is disposed on one side of the at least one rack in a first direction, and a first pipeline group is located on one side of the heat exchange module in a second direction, the second direction intersecting the first direction.

[0021] In one implementation, the support platform includes:

[0022] The frame structure, support plate, and frame body are provided. The frame structure has a first region and a second region arranged in a first direction. The support plate covers the first region. The frame body is disposed in the second region.

[0023] At least one frame is mounted on a support plate, and the heat exchange module is supported on the upper part of the frame.

[0024] In one embodiment, the cooling device further includes a second piping group connected between the heat exchange module and the cold source device;

[0025] The second region includes three sub-regions arranged in the second direction. The orthographic projection of the frame in the horizontal plane is located in the middle sub-region, and the bottom of the frame is connected to the middle sub-region.

[0026] At least a portion of the pipe sections of the first pipeline group and at least a portion of the pipe sections of the second pipeline group have their orthographic projections in the horizontal plane located in two sub-regions on either side.

[0027] In one embodiment, the support plate includes multiple plates arranged in a spliced ​​manner, each plate being connected to the frame structure by corresponding fasteners.

[0028] A gap is defined between two adjacent plates, which is used to guide the liquid on the support plate to the area below the support plate.

[0029] In one embodiment, the upper surface of the plate has a plurality of spaced-apart protrusions.

[0030] In one embodiment, the top frame includes a plurality of crossbeams and at least one longitudinal beam; the plurality of crossbeams extend along a first direction and are distributed side by side at intervals in a second direction, and the crossbeams are fixedly connected to the top of at least one frame; the longitudinal beam extends along the second direction.

[0031] Among them, at least one longitudinal beam is fixedly connected between two adjacent crossbeams, and part of the first pipeline group is supported by the longitudinal beam.

[0032] In one embodiment, the plurality of crossbeams include a first beam and a second beam, the first beam and the second beam being fixedly connected to the top of at least one frame;

[0033] The longitudinal beam includes a first section and a second section connected together. The first section is connected between the first beam and the second beam. The second section is located on the side of the second beam away from the first beam and extends to the outer side of the frame in the second direction.

[0034] The first pipeline assembly is partially supported by the second section.

[0035] In one embodiment, there are multiple racks, and the multiple racks are arranged side by side along a first direction;

[0036] There are multiple longitudinal beams, each corresponding to a different frame, and the longitudinal beams are located on top of their respective frames.

[0037] In one embodiment, the top frame further includes at least one pipe support seat, which corresponds one-to-one with at least one longitudinal beam. The pipe support seat is disposed in the second section of the corresponding longitudinal beam, and part of the first pipe group is supported by the pipe support seat.

[0038] In one embodiment, the pipe support has a slot with an upwardly facing opening, and the inner wall of the slot is an arc-shaped surface that matches the shape of the outer peripheral wall of the pipe in the first pipe group.

[0039] In one embodiment, the heat dissipation structure further includes: a power distribution cabinet, disposed on the support platform and located on the other side of at least one rack in the first direction, so as to be opposite to the heat exchange module in the first direction;

[0040] The rack also includes a power distribution unit located inside the cabinet, which is connected to the power distribution cabinet via power cables.

[0041] In one embodiment, the top frame further includes at least one bracket, which corresponds one-to-one with at least one rack. The bracket is disposed on the top of the corresponding rack and located between the first beam and the second beam. The top of the bracket has a support surface for supporting power supply cables.

[0042] In one embodiment, a first cable pass hole is formed on the top of the rack cabinet. The first cable pass hole is located on the side of the corresponding bracket away from the power distribution cabinet in a first direction. The first cable pass hole is used for the corresponding power supply cable to pass through and connect to the corresponding power distribution unit.

[0043] The top of the distribution cabinet has a second cable pass hole, which is used for power supply cables to pass through and connect to the distribution cabinet.

[0044] In one embodiment, the heat exchange module has a first heat exchange flow path for supplying a cooling medium and a second heat exchange flow path for supplying a heat exchange medium, wherein the cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium.

[0045] The first pipeline group includes a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path and is also connected to the liquid inlet of the medium flow path of the frame; the first liquid return pipeline is connected to the input end of the first heat exchange flow path and is also connected to the liquid outlet of the medium flow path.

[0046] The cooling equipment also includes a second piping group, which is connected between the second heat exchange flow path of the heat exchange module and the cold source equipment, and is located on the other side of the heat exchange module in the second direction.

[0047] In one embodiment, the first liquid supply line includes a first liquid supply sub-line and a second liquid supply sub-line connected to each other. The first liquid supply sub-line and the second liquid supply sub-line extend along a first direction and are arranged side by side and spaced apart in a second direction.

[0048] The first liquid supply sub-pipeline has a liquid supply inlet at one end near the heat exchange module, and the liquid supply inlet is connected to the output end of the first heat exchange flow path; the second liquid supply sub-pipeline has a liquid supply outlet, and the liquid supply outlet is connected to the liquid inlet of the medium flow path.

[0049] The first return pipeline includes a first return section, which extends along a first direction; the first return section has a return inlet, which is connected to the outlet of the medium flow path.

[0050] In one embodiment, there are multiple racks, and the multiple racks are arranged side by side along a first direction;

[0051] There are multiple liquid supply outlets, which are arranged at intervals in the first direction of the second liquid supply sub-pipeline and are connected one-to-one with the liquid inlet of the medium flow path of multiple racks.

[0052] There are multiple return liquid inlets, which are arranged at intervals in the first direction of the first return liquid section and are connected one-to-one with the liquid outlet of the medium flow path of multiple racks.

[0053] In one embodiment, the first liquid supply sub-pipeline, the second liquid supply sub-pipeline, and the first liquid return section are all supported on the top frame, and the first liquid return section is disposed between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

[0054] In one embodiment, the first return liquid pipeline further includes a second return liquid section and a third return liquid section connected to each other, the second return liquid section and the third return liquid section extending vertically respectively; the end of the first return liquid section away from the heat exchange module is closed, the end of the first return liquid section adjacent to the heat exchange module is connected to the first end of the second return liquid section, the second end of the second return liquid section is connected to the first end of the third return liquid section, and the second end of the third return liquid section is connected to the input end of the first heat exchange flow path.

[0055] In one embodiment, the support platform includes a frame structure having a second region, the second region including three sub-regions arranged in a second direction, the three sub-regions being a middle sub-region and two sub-regions located on both sides.

[0056] The orthographic projections of the second and third return fluid sections in the horizontal plane are located in a sub-region on the side adjacent to the first supply fluid pipeline.

[0057] In one embodiment, the second pipeline group includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path and is also connected to the medium output end of the cold source equipment; the second liquid return pipeline is connected to the output end of the second heat exchange flow path and is also connected to the medium return end of the cold source equipment.

[0058] In one embodiment, the support platform includes a frame structure having a second region, the second region including three sub-regions arranged in a second direction, the three sub-regions being a middle sub-region and two sub-regions located on both sides.

[0059] The orthographic projection of the second supply line and the second return line in the horizontal plane is located in a sub-region on the side away from the first supply line.

[0060] In one embodiment, the cooling device further includes a first power unit and a second power unit. The first power unit is connected to a first pipeline group and is used to provide power for the flow of the cooling medium. The second power unit is connected to a second pipeline group and is used to provide power for the flow of the heat exchange medium.

[0061] In one embodiment, the support platform includes a frame structure having a second region, the second region including three sub-regions arranged in a second direction, the three sub-regions being a middle sub-region and two sub-regions located on both sides.

[0062] The first and second power units of the cooling equipment are respectively located in two sub-areas on both sides.

[0063] In one embodiment, the cooling device further includes a liquid storage module, which includes a first liquid storage tank and a second liquid storage tank. The first liquid storage tank is connected to a first pipeline group and is used to replenish the first pipeline group with cooling medium. The second liquid storage tank is connected to a second pipeline group and is used to replenish the second pipeline group with heat exchange medium.

[0064] In one embodiment, the cooling device further includes a pressure stabilizing module, which includes a first pressure stabilizing tank and a second pressure stabilizing tank. The first pressure stabilizing tank is connected to a first pipeline group and is used to stabilize the pressure of the first pipeline group. The second pressure stabilizing tank is connected to a second pipeline group and is used to stabilize the pressure of the second pipeline group.

[0065] In one embodiment, the support platform includes a frame structure and a frame body, with the frame body disposed within the frame structure; wherein the liquid storage module and / or voltage stabilizing module of the cooling equipment are disposed inside the frame body.

[0066] In one embodiment, the medium flow path includes a cooling pipe, an inlet distribution pipe, and a return distribution pipe, wherein the cooling pipe is used to make thermally conductive contact with the heat-generating components of the computing device to cool the heat-generating components;

[0067] The liquid inlet distribution line and the liquid return distribution line are located on one side of the cabinet. The liquid inlet distribution line has a liquid inlet and multiple liquid delivery ports. The liquid inlet is connected to the liquid supply inlet of the first pipeline group. The multiple liquid delivery ports are used to correspond one-to-one with the cooling pipelines of multiple computing devices and are respectively used to connect to the input end of the cooling pipelines of multiple computing devices.

[0068] The return liquid distribution pipeline has multiple return liquid ports and outlet liquid ports. The multiple return liquid ports are used to correspond one-to-one with the cooling pipelines of multiple computing devices and are used to connect to the output end of the cooling pipelines of multiple computing devices. The outlet liquid port is connected to the return liquid inlet of the first pipeline group.

[0069] In one embodiment, the cabinet defines a first accommodating space for integrating and installing multiple computing devices arranged vertically.

[0070] The inlet and outlet liquid distribution lines are vertically arranged on the side of the cabinet adjacent to the first pipeline group in the second direction, and multiple inlet and outlet liquid ports are arranged vertically at intervals.

[0071] In one embodiment, the inlet distribution line and the return distribution line are located on opposite sides of the projection of the multiple computing devices in the vertical plane, respectively.

[0072] Multiple liquid inlets and multiple liquid return outlets are distributed facing each other in a first direction, with the multiple liquid inlets adjacent to one side of the multiple computing devices in the first direction and the multiple liquid return outlets adjacent to the other side of the multiple computing devices in the first direction.

[0073] In one embodiment, an inlet is formed on the side of the inlet distribution pipe adjacent to the first pipe group in the second direction and near the top of the inlet distribution pipe; an outlet is formed on the side of the return distribution pipe adjacent to the first pipe group in the second direction and near the top of the return distribution pipe.

[0074] In one embodiment, an exhaust valve is provided at the top of both the liquid inlet distribution pipe and the liquid return distribution pipe.

[0075] In one embodiment, the exhaust port of the exhaust valve is connected to a flexible connecting pipe that extends to the bottom of the cabinet to discharge gas from the inlet distribution pipe and the return distribution pipe, respectively.

[0076] In one embodiment, the cabinet includes a cabinet body and a shelf disposed inside the cabinet body, the shelf defining a first accommodating space, the shelf and the cabinet body defining a second accommodating space, the second accommodating space and the first accommodating space being distributed side by side in a first direction.

[0077] The rack also includes multiple power distribution units, which are arranged vertically in the second accommodating space.

[0078] In one embodiment, there are multiple racks arranged side by side along a first direction; the racks also include a top connecting plate disposed on the top of the rack and extending above the adjacent racks; the top of the top connecting plate and the top of the adjacent racks respectively have top connecting holes facing each other in the vertical direction, and the racks are fixed to the adjacent racks by fasteners passing through the top connecting holes.

[0079] In one embodiment, the rack also includes lifting rings detachably mounted on the top of the rack for attaching lifting ropes to move the rack or cooling structure.

[0080] In one embodiment, the rack further includes a bottom connecting plate that extends downwardly at the bottom of the cabinet in a second direction, with the upper end of the bottom connecting plate fixed to the cabinet and the lower end of the bottom connecting plate fixed to the support platform.

[0081] As another aspect of the embodiments of this application, the embodiments of this application also provide a container, including:

[0082] The heat dissipation structure of any of the above embodiments;

[0083] The heat dissipation structure is located inside the enclosure.

[0084] In one embodiment, the housing includes a frame that protrudes upward from one side of the bottom of the housing in a second direction.

[0085] The support platform is spaced apart from the frame on one side adjacent to the frame in the second direction to form a groove for drainage.

[0086] In one embodiment, the frame is formed with a plurality of drainage holes, which are spaced apart in a first direction.

[0087] As another aspect of the embodiments of this application, the embodiments of this application also provide a data center, including: a heat dissipation structure of any of the above embodiments or a container of any of the above embodiments and a plurality of computing devices, wherein the plurality of computing devices are integrated and installed in the cabinet of the heat dissipation structure.

[0088] According to the heat dissipation structure of the present application embodiment, the frame and cooling equipment are integrated into a unified support platform to form a skid structure, which improves the integration and structural stability of the heat dissipation structure, and realizes unified transportation and delivery. After delivery, it can be directly placed in place, reducing the requirements for land flatness and concrete foundation.

[0089] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0090] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0091] Figure 1 shows a schematic diagram of a heat dissipation structure according to an embodiment of this application;

[0092] Figure 2A shows a three-dimensional structural schematic diagram of the support platform of the heat dissipation structure according to an embodiment of the present application;

[0093] Figure 2B shows an exploded structural diagram of the support platform of the heat dissipation structure according to an embodiment of the present application;

[0094] Figure 2C shows a schematic diagram of the support platform of the heat dissipation structure according to an embodiment of the present application from one perspective;

[0095] Figure 2D shows a schematic diagram of the support platform of the heat dissipation structure according to an embodiment of the present application from another perspective;

[0096] Figure 3A shows a schematic diagram of the top frame of the heat dissipation structure according to an embodiment of this application;

[0097] Figure 3B shows an enlarged view of region A in Figure 1;

[0098] Figure 3C shows a partial schematic diagram of the top frame of the heat dissipation structure according to an embodiment of this application;

[0099] Figure 4A shows a schematic diagram of the cooling principle of the heat dissipation structure according to an embodiment of this application;

[0100] Figure 4B shows a schematic diagram of the cooling device with a heat dissipation structure according to an embodiment of the present application from one view.

[0101] Figure 4C shows a schematic diagram of the cooling device with a heat dissipation structure according to an embodiment of the present application from another perspective;

[0102] Figure 5A shows a schematic diagram of the heat dissipation structure of the rack according to an embodiment of the present application;

[0103] Figure 5B shows an enlarged view of region A in 5A;

[0104] Figure 5C shows a schematic diagram of the heat dissipation structure of the rack according to an embodiment of the present application from one view.

[0105] Figure 5D shows a schematic diagram of the heat dissipation structure of the rack according to an embodiment of the present application from another perspective;

[0106] Figure 5E shows an enlarged view of region B in Figure 5D;

[0107] Figure 5F shows a top view of the heat dissipation structure of the rack according to an embodiment of this application;

[0108] Figure 6 shows a schematic diagram of the structure of a container according to an embodiment of this application.

[0109] Explanation of reference numerals in the attached drawings: 1-Heat dissipation structure, 2-Container; 1000-Rack, 100-Cabinet, 100a-First accommodating space, 100b-Second accommodating space, 101-Roller, 110-Cabinet body, 111-Fixing hole, 112-Cover plate, 113-Power cable, 114-First cable passage hole; 120-Shelf, 1200-Support frame, 121-Column, 122-Support plate, 122a-Fixing piece, 122b-Bearing piece, 123-Mounting plate, 124-Power supply support base, 130-Wiring post, 131-Cable duct; 140-Return liquid distribution pipeline, 141-Outlet, 142-Return liquid port, 150-Inlet liquid distribution pipeline, 151-Inlet, 152-Supply port, 153-Connector, 160-Second exhaust valve, 161-Exhaust port, 170-Lifting ring, 180-Bottom connecting plate, 190-Top connecting plate; 200-Cooling equipment, 10-Heat exchange module, 10a-First heat exchange flow path, 10b-Second heat exchange flow path, 210-Medium flow path, 215-Cooling pipeline, 216-Supply connection pipeline, 217-Return liquid connection pipeline, 230-Computing equipment; 20-First pipeline group, 21-First liquid supply pipeline, 211-First liquid supply sub-pipeline, 212-Second liquid supply sub-pipeline, 212a-Liquid supply outlet, 212b-First exhaust valve, 213-Liquid inlet pipeline, 22-First return pipeline, 221-First return section, 221a-Return inlet, 222-Second return section, 223-Third return section, 224-First replenishment branch pipe, 224a-First replenishment interface, 225-First pressure stabilizing branch pipe, 226-Liquid outlet pipeline; 30-Second pipeline group, 31-Second liquid supply pipeline, 311-First liquid supply section, 312-Second liquid supply section, 313-Second replenishment branch pipe, 313a-Second replenishment interface, 314-Second pressure stabilizing branch pipe, 32-Second return pipeline; 40-First power unit, 50-Second power unit, 60-First pressure stabilizing tank, 70-Second pressure stabilizing tank, 80-First liquid storage tank, 90-Second liquid storage tank; 300-Top frame, 310-Crossbeam, 3101-First beam body, 3111-First through hole; 3102-Second beam body, 320-Longitudinal beam, 321-First section, 322-Second section, 3221-Mounting groove; 330-Pipeline support, 331-Slot, 332-First elastic leg, 333-Second elastic leg, 340-Bracket, 341-Vertical plate, 342-Horizontal plate;400-Supporting platform, 410-Frame structure, 410a-First area, 410b-Second area, 410b1-Sub-area, 411-First support beam, 412-Second support beam, 413-Third support beam, 420-Supporting plate, 421-Plate body, 422-Gap, 423-Protruding structure, 4231-First protrusion, 4232-Second protrusion, 424-Vertical part, 430-Frame body, 431-Vertical frame, 432-Horizontal frame, 440-Foot, 441-Base, 442-Screw; 500-Cold source equipment, 600-Distribution cabinet, 601-Second wiring hole, 700-Box body, 701-Frame, 702-Drain hole; L1-First direction, L2-Second direction. Detailed Implementation

[0110] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0111] In related technologies, the computing devices 230 and cooling devices 200 of the heat dissipation structure 1 are independent of each other and need to be packaged separately, resulting in high transportation costs. Moreover, after the heat dissipation structure 1 is delivered, the arrangement of each computing device 230 and cooling device 200 needs to be matched and adjusted with the site before assembly and testing, leading to a long deployment cycle.

[0112] Based on the aforementioned deficiencies in related technologies, this application provides a heat dissipation structure 1 that integrates the computing device 230 and cooling device 200 of the heat dissipation structure 1, achieving overall modular delivery and optimal space utilization, thereby improving the convenience and efficiency of deploying the heat dissipation structure 1.

[0113] Figure 1 shows a schematic diagram of the heat dissipation structure 1 according to an embodiment of this application.

[0114] Referring to Figure 1 and in conjunction with Figure 4A, the heat dissipation structure 1 provided in this embodiment includes at least one rack 1000, a cooling device 200, a top frame 300, and a support platform 400. Specifically, the rack 1000 includes a cabinet 100 and a media flow path 210. The cabinet 100 is used to integrate and install multiple computing devices 230, and the media flow path 210 is used to supply cooling media to flow through the multiple computing devices 230. The cooling device 200 includes a heat exchange module 10 and a first pipe group 20, which connects the heat exchange module 10 and the media flow path 210 of at least one rack 1000.

[0115] In this embodiment, the cooling device 200 can use liquid cooling to cool the computing devices 230 of each rack 1000. The medium flow path 210 passes through multiple computing devices 230, allowing the cooling medium to flow through each computing device 230 during its internal flow, so that the cooling medium can exchange heat with each computing device 230, thereby transferring the heat generated by the computing devices 230 during operation to the cooling medium, and thus achieving cooling of multiple computing devices 230.

[0116] The first pipeline group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the rack 1000. It is used to transport the low-temperature cooling medium cooled by the heat exchange module 10 to the medium flow path 210 of the rack 1000, and then transport the high-temperature cooling medium after flowing through the rack 1000 back to the heat exchange module 10 from the medium flow path 210 of the rack 1000. In this way, the cooling medium is circulated between the heat exchange module 10 and the medium flow path 210 of the rack 1000, thereby circulating and cooling each computing device 230.

[0117] In this embodiment, the top frame 300 is fixed to the top of at least one rack 1000, and at least a portion of the first pipe assembly 20 is supported by the top frame 300. At least one rack 1000 and the cooling device 200 are integrated into a support platform 400. The heat exchange module 10 is disposed on one side of the at least one rack 1000 in a first direction L1, and the first pipe assembly 20 is located on one side of the heat exchange module 10 in a second direction L2, which intersects with the first direction L1.

[0118] In the embodiments of this application, the first direction L1 and the second direction L2 can be two mutually perpendicular horizontal directions.

[0119] In this embodiment, the heat dissipation structure 1's frame 1000 and cooling device 200 are integrated onto a unified support platform 400, forming a skid structure. This improves the integration of the heat dissipation structure 1, enabling unified transportation and delivery. Furthermore, it can be directly installed after delivery, reducing requirements for land leveling and concrete foundations. Additionally, the heat exchange module 10 and the first piping group 20 are spatially compatible with the frame 1000, and the top frame 300 provides a supporting and fixing structure for the first piping group 20 of the cooling device 200, enhancing the overall structural stability of the heat dissipation structure 1.

[0120] In one embodiment, the heat dissipation structure 1 may further include a power distribution cabinet 600. When the heat dissipation structure 1 is applied to a data center, the power distribution cabinet 600 directly supplies power to the computing devices 230 in the data center. In a high-density equipment environment like a data center, water and electricity separation can effectively prevent safety hazards caused by liquid leakage to electrical equipment, ensuring the efficient, safe, and stable operation of the data center.

[0121] For example, the power distribution cabinet 600 may be spaced apart from the cooling equipment 200.

[0122] In some examples, the power distribution cabinet 600 and the cooling equipment 200 are distributed on opposite sides of at least one rack 1000 in the first direction L1. That is, the cooling equipment 200 is located on one side of at least one rack 1000 in the first direction L1, and the power distribution cabinet 600 is located on the other side of at least one rack 1000 in the first direction L1. While increasing the spacing between the power distribution cabinet 600 and the cooling equipment 200, the rack 1000 provides physical isolation between the power distribution cabinet 600 and the cooling equipment 200, thereby greatly improving the overall reliability of the data center.

[0123] In other examples, the distribution cabinet 600 and the cooling equipment 200 are distributed on opposite sides of at least one rack 1000 in the second direction L2, and the distribution cabinet 600 and the cooling equipment 200 are isolated from each other by at least one rack 1000, thereby improving the safety of water and electricity separation.

[0124] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0125] Those skilled in the art will understand that, based on the fundamental principle of separating the distribution cabinet 600 from the cooling equipment 200, there are many other ways to separate the distribution cabinet 600 from the cooling equipment 200. For example, the distribution cabinet 600 and the cooling equipment 200 can be separated vertically in at least one rack 1000, meaning one of the distribution cabinet 600 and the cooling equipment 200 is located above the rack 1000, and the other is located below the rack 1000, thus achieving physical isolation between the distribution cabinet 600 and the cooling equipment 200. Another example is that the distribution cabinet 600 and the cooling equipment 200 are not isolated by the rack 1000; this can be achieved by adding other objects for isolation or by directly increasing the distance between them to achieve water and electricity separation. It should be noted that this is only an example, and the separation method between the distribution cabinet 600 and the cooling equipment 200 is not limited to the aforementioned example.

[0126] Additionally, it should be noted that in the example where the heat dissipation structure 1 is located inside the enclosure 700, forming a container-like structure, the positional relationship between the power distribution cabinet 600 and the cooling device 200 and the enclosure 700 can vary beyond simply being housed within the enclosure 700. For instance, one of the power distribution cabinet 600 and the cooling device 200 can be located inside the enclosure 700, while the other can be located outside. The enclosure 700 provides physical isolation between the power distribution cabinet 600 and the cooling device 200, thereby improving the safety of water and electricity separation. Another example is that both the power distribution cabinet 600 and the cooling device 200 can be located outside the enclosure 700, on different sides of the enclosure. The enclosure 700 provides physical isolation between the power distribution cabinet 600 and the cooling device 200, ensuring the safety of water and electricity separation. It should be noted that this is merely an example, and the positional relationship between the power distribution cabinet 600 and the cooling device 200 relative to the enclosure 700 is not limited to the aforementioned examples.

[0127] In one embodiment, the rack 1000 further includes a power distribution unit. Multiple power distribution units may be installed in the cabinet 100 of each rack 100. The power distribution unit is connected to the power distribution cabinet 600 via a power supply cable 113. The power distribution unit is connected to the computing device 230 in the cabinet 100, thereby improving the convenience of power supply to the computing device 230.

[0128] In one embodiment, there are multiple racks 1000, which are arranged side by side along a first direction L1; a heat exchange module 10 is disposed on one side of the multiple racks 1000 in the first direction L1, and a first pipeline group 20 is connected between the heat exchange module 10 and the medium flow path 210 of the multiple racks 1000.

[0129] In one embodiment, the cooling device 200 further includes a second pipeline group 30, which is connected between the heat exchange module 10 and the cold source device 500. The second pipeline group 30 is used to transport the heat exchange medium that has been heated by absorbing heat from the cooling medium through the heat exchange module 10 to the cold source device 500, and then transport the heat exchange medium that has been cooled by the cold source device 500 back to the heat exchange module 10. In this way, the heat exchange medium is circulated between the heat exchange module 10 and the cold source device 500, thereby circulating and cooling the cooling medium.

[0130] The following describes in detail the support platform 400, top frame 300, cooling device 200 and rack 1000 of the heat dissipation structure 1 in the embodiments of this application.

[0131] Figure 2A shows a three-dimensional structural schematic diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application. Figure 2B shows an exploded structural schematic diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application. Figure 2C shows a structural schematic diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application from one perspective. Figure 2D shows a structural schematic diagram of the support platform 400 of the heat dissipation structure 1 according to an embodiment of the present application from another perspective.

[0132] Referring to Figures 2A to 2D, the support platform 400 of the heat dissipation structure 1 in this embodiment may include a frame structure 410, a support plate 420, and a frame 430. The frame structure 410 has a first region 410a and a second region 410b arranged in a first direction L1. The support plate 420 covers the first region 410a, and the frame is disposed in the second region 410b. At least one rack 1000 is disposed on the support plate 420, and the heat exchange module 10 is supported on the upper part of the frame. This improves the stability of the rack 1000 and the heat exchange module 10, and also raises the heat exchange module 10 to facilitate the connection between the heat exchange module 10 and the first pipe assembly 20 supported on the top frame 300.

[0133] For example, the frame structure 410 includes a plurality of first support beams 411 extending along a first direction L1 and a plurality of second support beams 412 extending along a second direction L2, with a plurality of second support beams 412 connecting adjacent first support beams 411.

[0134] In some examples, the first support beam 411 is welded to the second support beam 412 for fixed connection.

[0135] In other examples, the first support beam 411 and the second support beam 412 are fixedly connected by fasteners.

[0136] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the connection between the first support beam 411 and the second support beam 412 can also be achieved in various other ways, such as riveting, pin connection, or snap-fit ​​connection, to realize the fixed connection between the first support beam 411 and the second support beam 412, and is not limited to these.

[0137] For example, the first support beam 411 and the second support beam 412 may be made of metal, and the first support beam 411 and the second support beam 412 may have regular shapes.

[0138] In some examples, the first support beam 411 and the second support beam 412 can be made of steel, and the vertical cross-section of the first support beam 411 and the second support beam 412 can both be I-shaped.

[0139] In other examples, the first support beam 411 and the second support beam 412 may be made of aluminum alloy, and the vertical cross-sections of the first support beam 411 and the second support beam 412 may both be rectangular.

[0140] It should be noted that the shape and material of the first support beam 411 and the second support beam 412 are not limited to the above examples. Their cross-sectional shape can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, etc., and their material can also be copper, carbon steel, alloy steel, etc., or other composite materials with high strength and support, etc., and are not limited to these.

[0141] For example, a plurality of second support beams 412 connected between two adjacent first support beams 411 and distributed in the second direction L2 may be relatively distributed and / or staggered. As shown in FIG2B, at least some of the second support beams 412 are staggered in the second direction L2 to optimize load distribution, avoid local stress concentration, and improve the structural stability and rigidity of the support platform 400.

[0142] In some examples, the frame 430 is welded to the first region 410a of the frame structure 410.

[0143] In other examples, the frame 430 may be connected to the first region 410a of the frame structure 410 by means of fasteners, riveting, pin connections, or snap-fit ​​connections. This is merely an example, and the connection methods between the frame 430 and the frame structure 410 are not limited to these.

[0144] For example, the frame 430 includes a vertical frame 431 and a horizontal frame 432, with the bottom end of the vertical frame 431 connected to the first region 410a and the horizontal frame 432 connected to the top end of the vertical frame 431.

[0145] In some examples, the size of the first region 410a in the first direction L1 is larger than the size of the second region 410b in the first direction L1, so as to reasonably allocate space for the rack 1000 and the cooling equipment 200.

[0146] In some examples, the dimensions of the first region 410a in the second direction L2 are approximately equal to the dimensions of the second region 410b in the second direction L2. This satisfies the space requirements of the rack 1000 and the cooling equipment 200 in the second direction L2 while maintaining the overall regularity of the support platform 400, making it easier for the heat dissipation structure 1 to be housed in the container and improving the ease of handling the heat dissipation structure 1.

[0147] It should be noted that the dimensions of the first region 410a and the second region 410b can be flexibly set according to the actual situation to provide load-bearing space for the rack 1000 and the cooling equipment 200, and to ensure that the rack 1000 and the cooling equipment 200 are distributed in different regions on the support platform 400.

[0148] In one embodiment, the second region 410b includes three sub-regions 410b1 arranged in the second direction L2. The orthographic projection of the frame 430 in the horizontal plane is located in the middle sub-region 410b1, and the bottom end of the frame 430 is connected to the middle sub-region 410b1. At least a portion of the pipe segments of the first pipe group 20 and at least a portion of the pipe segments of the second pipe group 30 are respectively located in the two sub-regions 410b1 on both sides in the horizontal plane. That is, at least a portion of the pipe segments of the first pipe group 20 and at least a portion of the pipe segments of the second pipe group 30 are respectively located on opposite sides of the heat exchange module 10 in the second direction L2. This fully utilizes the space on both sides of the heat exchange module 10 in the second direction L2, so that the first pipe group 20 and the second pipe group 30 do not interfere with each other, and improves the structural compactness of the heat dissipation structure 1, which is beneficial to improving the convenience of pipe connection between the cooling device 200, the frame 1000, and the cold source device 500.

[0149] In one embodiment, the support plate 420 includes a plurality of plates 421 arranged in a spliced ​​manner.

[0150] In some examples, each plate 421 is connected to the frame structure 410 by corresponding fasteners.

[0151] For example, screw holes are formed at the relative positions of the support plate 420, the first support beam 411 and / or the second support beam 412 of the frame structure 410, and the support plate 420 is fixed to the frame structure 410 by passing through the screw holes corresponding to the plate 421 and the first support beam 411 and / or the second support beam 412 in sequence.

[0152] In other examples, the plate 421 is welded and fixedly connected to the frame structure 410. For example, the plate 421 is welded and fixedly connected to the first support beam 411 and / or the second support beam 412 of the frame structure 410, respectively.

[0153] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that there are many other ways to connect the plate 421 and the frame structure 410, such as riveting, pin connection, or snap-fit ​​connection, all of which can achieve a fixed connection between the plate 421 and the frame structure 410. This is also just an example, and the connection methods between the plate 421 and the frame structure 410 are not limited to these.

[0154] For example, the power distribution cabinet 600 and the cooling equipment 200 can be arranged on the support platform 400.

[0155] In some examples, the power distribution cabinet 600 and the cooling equipment 200 are integrated in different areas of the support platform 400. On the one hand, the support platform 400 raises the power distribution cabinet 600 so that it does not come into contact with the placement surface of the data center, which can prevent water from accumulating on the placement surface and affecting the power distribution cabinet 600 if the cooling equipment 200 leaks. On the other hand, the support platform 400 can guide any leaks that may occur from the cooling equipment 200 to the outside of the support platform 400, completely isolating water and electricity, and further improving the security of the data center.

[0156] In a specific example, both the distribution cabinet 600 and the rack 1000 are located on the support plate 420 of the first region 410a of the support platform 400, while the cooling device 200 is located in the second region 410b of the support platform 400. Due to the frame structure of the second region 410b, any leakage from the cooling device 200 can be discharged to the outside of the support platform 400 through the second region 410b, preventing it from accumulating on the support platform 400 and from flowing from the second region 410b to the support plate 420 in the first region 410a, thus avoiding the problem of leakage from the distribution cabinet 600.

[0157] In this embodiment, the power distribution cabinet 600, rack 1000, and cooling equipment 200 are all integrated into the support platform 400. While ensuring complete isolation of water and electricity, this improves the integration of the heat dissipation structure 1 or the data center. It not only effectively utilizes vertical and horizontal space, reduces the physical footprint, and facilitates overall transportation and delivery, but also simplifies monitoring and management processes, making it easier for maintenance personnel to operate and maintain the system. Furthermore, the integrated design reduces the distance and time for power and signal transmission, improves the response speed of the data center, and enhances the overall reliability of the data center.

[0158] For example, the support platform 400 of this embodiment incorporates a defensive design to prevent liquid discharge. Specifically, a gap 422 is defined between two adjacent plates 421, which is used to guide liquid on the support plate 420 to the underside of the support plate 420, preventing liquid from depositing on the support plate 420.

[0159] It is understood that in this embodiment, the liquid refers to the cooling medium of the computing device 230 and / or the heat exchange medium that exchanges heat with the cooling medium to lower its temperature. The cooling medium and the heat exchange medium can be fluid media with good thermal conductivity and stability, such as cooling water, refrigerant, etc., and this application embodiment does not specifically limit them.

[0160] For example, the width of the gap 422 between two adjacent plates 421 can be 0.5 to 2 mm, such as 0.5 mm, 0.8 mm, 1 mm, 1.5 mm or 2 mm. A gap 422 of this size can ensure that the liquid can be discharged smoothly while having almost no impact on the support strength and rigidity of the support platform 400.

[0161] For example, the thickness of the plate 421 can be 2-4mm, which can ensure the structural strength of the support plate 40 and control the overall weight of the support plate 420.

[0162] In one embodiment, the upper surface of the plate 421 is formed with spaced protrusions 423. The protrusions 423 are used for anti-slip, thereby preventing workers from slipping when stepping on the support plate 420. At the same time, the protrusions 423 can also improve the structural strength and toughness of the support plate 420.

[0163] Among them, multiple protrusions 423 can be evenly distributed on the upper surface of the plate 421.

[0164] In some examples, the multiple protrusion structures 423 include multiple first protrusions 4231 and multiple second protrusions 4232, the first protrusions 4231 and the second protrusions 4232 intersect in the extension direction of the horizontal plane, and the first protrusions 4231 and the second protrusions 4232 are alternately distributed in the second direction L2 to increase the anti-slip effect and structural strength of the support plate 420.

[0165] As shown in Figure 2A, the extension direction of the first protrusion 4231 is approximately perpendicular to the extension direction of the second protrusion 4232. The plate 421 has multiple rows of first protrusions 4231 and multiple rows of second protrusions 4232 in the second direction L2. Each row of first protrusions 4231 includes multiple first protrusions 4231 spaced apart in the first direction L1, and each row of second protrusions 4232 includes multiple second protrusions 4232 spaced apart in the first direction L1. The rows of first protrusions 4231 and the rows of second protrusions 4232 are alternately distributed in the second direction L2.

[0166] In one embodiment, the frame structure 410 is connected to two third support beams 413 on opposite sides of the second direction L2, and the third support beams 413 extend along the first direction L1. A support plate 420 covers the top of the two third support beams 413 and the frame structure 410. The support plate 420 has two downwardly extending vertical portions 424 on opposite sides of the second direction L2, respectively located on opposite sides of the two third support beams 413 in the second direction L2. In this embodiment, the support plate 420 is supported by the frame structure 410 in the middle and the two third support beams 413 on both sides, improving the support strength. Furthermore, the two vertical portions 424 on opposite sides of the support plate 420 in the second direction L2 can position the support plate 420 and the frame structure 410 during assembly, facilitating the placement of the support plate 420.

[0167] In some examples, the support plate 420 is welded and fixedly connected to the third support beam 413.

[0168] In other examples, the support plate 420 is fixedly connected to the third support beam 413 by fasteners.

[0169] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the connection between the support plate 420 and the third support beam 413 can also be achieved in various other ways, such as riveting, pin connection, or snap-fit ​​connection, and is not limited to these.

[0170] In one embodiment, the third support beam 413 may be provided with a plurality of feet 440 arranged at intervals along the first direction L1. Each foot 440 includes a base 441 and a screw 442 connected to the base 441 and extending vertically through the bottom wall of the third support beam 413. The screw 442 is used to cooperate with a nut to level the support platform 400. This can overcome the influence of unevenness of the placement surface, such as the ground or the bottom wall of a container, on the stability of the support platform 400, and ensure the overall stability of the support platform 400.

[0171] For example, the bottom of the base 441 may be provided with a rubber pad to increase friction and prevent slippage.

[0172] In some examples, the third support beam 413 is welded and fixedly connected to the first support beam 411 of the frame structure 410.

[0173] In other examples, the third support beam 413 is fixedly connected to the first support beam 411 by fasteners.

[0174] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that there are many other ways to connect the third support beam 413 and the first support beam 411, such as riveting, pin connection, or snap-fit ​​connection, as long as a fixed connection between the third support beam 413 and the first support beam 411 can be achieved, and it is not limited to these methods.

[0175] For example, the third support beam 413 has a regular shape and is made of metal.

[0176] In some examples, the vertical cross-section of the third support beam 413 is I-shaped, and the material of the third support beam 413 can be steel.

[0177] In other examples, the vertical cross-section of the third support beam 413 can be rectangular, and the material of the third support beam 413 can be aluminum alloy.

[0178] It should be noted that the shape and material of the third support beam 413 are not limited to the above examples. Its cross-sectional shape can also be H-shaped, T-shaped, C-shaped, circular or Z-shaped, etc., and its material can also be copper, carbon steel, alloy steel, etc., or other composite materials with high strength and support, etc., and is not limited to these.

[0179] Figure 3A shows a schematic diagram of the top frame 300 of the heat dissipation structure 1 according to an embodiment of the present application, Figure 3B shows an enlarged view of region A in Figure 1, and Figure 3C shows a partial schematic diagram of the top frame 300 of the heat dissipation structure 1 according to an embodiment of the present application.

[0180] Referring to Figures 3A to 3C, and in conjunction with Figure 1, the top frame 300 of the heat dissipation structure 1 in this embodiment may include a plurality of crossbeams 310 and at least one longitudinal beam 320. The plurality of crossbeams 310 extend along a first direction L1 and are arranged side by side and spaced apart along a second direction L2. The crossbeams 310 are fixedly connected to the top of at least one rack 1000. At least one longitudinal beam 320 extends along the second direction L2 such that the crossbeams 310 and the longitudinal beam 320 intersect. At least one longitudinal beam 320 is fixedly connected between two adjacent crossbeams 310, and a portion of the first pipe assembly 20 is supported by the longitudinal beam 320.

[0181] The top frame 300 of the heat dissipation structure 1 in this application embodiment can be fixed by connecting multiple crossbeams 310 to the top of the rack 1000. This allows the tops of the multiple racks 1000 to be connected through the multiple crossbeams 310, thereby fixing the tops of the multiple racks 1000 and preventing the racks 1000 from shaking or colliding with each other due to bumps during transportation of the heat dissipation structure 1.

[0182] In addition, by setting up a longitudinal beam 320 that intersects with and connects to the crossbeam 310, the stability of the top frame 300 is increased. At the same time, it provides a supporting and fixing structure for the first pipe assembly 20 of the cooling equipment 200. This not only facilitates the connection between the first pipe assembly 20 and the medium flow path 210 of the frame 1000, but also eliminates the need for an additional fixing structure for the first pipe assembly 20, which helps to improve the structural compactness and space utilization.

[0183] For example, the crossbeam 310 and the top of the cabinet 100 of the rack 1000 can be fixedly connected by fasteners. The connection method may include, but is not limited to: bolt connection, screw connection, riveting, key connection, pin connection, magnetic connection or snap-fit ​​connection, etc., and the embodiments of this application do not specifically limit this.

[0184] In some examples, the longitudinal beam 320 and the transverse beam 310 can be fixedly connected by means of snap-fit, welding or other methods.

[0185] In other examples, the longitudinal beam 320 and the transverse beam 310 can be connected by fasteners, riveting, pin connections, etc. This is merely an example; the connection methods between the longitudinal beam 320 and the transverse beam 310 are not limited to these.

[0186] In one embodiment, the top frame 300 may be located directly above the top of the frame 1000, and a portion of the pipe section of the first pipe assembly 20 supported by the longitudinal beams 320 of the top frame 300 is also located directly above the top of the frame 1000, ensuring the stability of the first pipe assembly 20.

[0187] In another embodiment, the plurality of crossbeams 310 of the top frame 300 include a first beam 3101 and a second beam 3102, which are fixedly connected to the top of at least one rack 1000. The longitudinal beam 320 includes a first section 321 and a second section 322 connected together. The first section 321 connects between the first beam 3101 and the second beam 3102, and the second section 322 is located on the side of the second beam 3102 away from the first beam 3101 and extends to the outer side of the rack 1000 in the second direction L2, wherein a portion of the first pipe assembly 20 is supported by the second section 322. In other words, the top frame 300 is not entirely located directly above the top of the rack 1000. A portion of the longitudinal beam 320 of the top frame 300, namely the second section 322, extends from the top of the rack 1000 to the outer side of the rack 1000 in the second direction L2, such that at least a portion of the pipe section of the first pipe group 20 supported by the second section 322 is located on the outer side of the rack 1000 in the second direction L2, rather than directly above the top of the rack 1000.

[0188] Therefore, when the first piping group 20 leaks, the liquid will drip onto the outside of the rack 1000 instead of onto the top of the rack 1000, thus avoiding any impact on the rack 1000. Moreover, the first piping group 20 is located on the outside of the rack 1000 in the second direction, providing reasonable space for the connection between the medium flow path 210 of the rack 1000 and the first piping group 20, so as to facilitate the connection between the medium flow path 210 of the rack 1000 and the first piping group 20.

[0189] For example, the projection of the first section 321 of the longitudinal beam 320 in the horizontal plane is within the range of the projection of the rack 1000 in the horizontal plane, and the projection of the second section 322 of the longitudinal beam 320 in the horizontal plane is outside the range of the projection of the rack 1000 in the horizontal plane. That is, the second section 322 is located entirely on the outer side of the rack 1000 in the second direction L2, so that all the pipe sections of the first pipe group 20 supported by the second section 322 are located on the outer side of the rack 1000 in the second direction L2. This facilitates the connection between the medium flow path 210 of the rack 1000 and the first pipe group 20, while ensuring that the first pipe group 20 completely avoids the top of the rack 1000, thus avoiding the impact on the rack 1000 when the first pipe group 20 leaks, thereby improving the safety of the heat dissipation structure 1.

[0190] The top of the frame 1000 may be provided with multiple first mounting holes, and the first beam 3101 and the second beam 3102 are provided with corresponding second mounting holes. The connection and fixation between the first beam 3101, the second beam 3102 and the frame 1000 are achieved by bolts passing through the first mounting holes and the second mounting holes.

[0191] The first beam 3101 can be disposed near the side edge of the top of the rack 1000 away from the first pipe assembly 20, and the second beam 3102 can be disposed near the side edge of the top of the rack 1000 close to the first pipe assembly 20. That is, the first beam 3101 and the second beam 3102 are respectively connected to both sides of the rack 1000 in the second direction L2, so that both sides of the rack 1000 in the second direction L2 are fixed and limited by the first beam 3101 and the second beam 3102, which helps to improve the connection stability of multiple racks 1000.

[0192] In one embodiment, there are multiple racks 1000 arranged side-by-side along a first direction L1. There are also multiple longitudinal beams 320, each corresponding to one rack 1000. The longitudinal beams 320 are located on top of their respective racks 1000; that is, each rack 1000 has a longitudinal beam 320 extending along a second direction L2 on its top. Correspondingly, crossbeams 310 connect the multiple racks 1000. This optimizes the load distribution on the longitudinal beams 320, avoids localized stress concentration, and improves the structural stability and strength of the top frame 300, ensuring stable support for the first pipeline assembly 20. Furthermore, the longitudinal beams 320 and crossbeams 310 limit the top of each rack 1000, improving the stability of the top connection between the multiple racks 1000.

[0193] In one embodiment, the top frame 300 further includes at least one pipe support 330, which is correspondingly disposed with at least one longitudinal beam 320. The pipe support 330 is disposed in the second section 322 of the corresponding longitudinal beam 320, and a portion of the first pipe assembly 20 is supported by the pipe support 330. The pipe support 330 can position the first pipe assembly 20 for installation, facilitating the installation of the first pipe assembly 20. At the same time, the multiple pipe support 330s support and fix the first pipe assembly 20 at different positions in the first direction L1, improving the stability of the first pipe assembly 20.

[0194] In one embodiment, the pipe support base 330 is provided with a slot 331, which has an upward opening. The pipes of the first pipe group 20 are engaged in the corresponding slot 331. The inner wall surface of the slot 331 is an arc-shaped surface that matches the shape of the outer peripheral wall of the pipes of the first pipe group 20, so that the outer wall surface of the pipes and the inner wall surface of the slot 331 can fit as closely as possible, thereby improving the stability of the pipe support.

[0195] For example, the pipe support 330 has multiple slots 331, and multiple pipe segments of the first pipe group 20 are engaged with the corresponding slots 331.

[0196] For example, the pipe support 330 includes a first elastic leg 332 and a second elastic leg 333, both made of elastic material. The first elastic leg 332 and the second elastic leg 333 are respectively connected to the second section 322 of the longitudinal beam 320 and extend upward. A groove 331 for accommodating the pipes of the first pipe assembly 20 is formed between the first elastic leg 332 and the second elastic leg 333.

[0197] The first elastic leg 332 and the second elastic leg 333 deform under the pressure of the pipes in the first pipe assembly 20, opening the slot 331 and allowing the pipes of the first pipe assembly 20 to be inserted into the slot 331, thus improving the installation efficiency of the pipes in the first pipe assembly 20. After the pipes of the first pipe assembly 20 are inserted into the slot 331, the first elastic leg 332 and the second elastic leg 333 can clamp the pipes of the first pipe assembly 20, improving the connection stability between the pipes of the first pipe assembly 20 and the pipe support 330.

[0198] For example, the second section 322 has a mounting groove 3221 extending along the second direction L2, and a pipe support 330 is disposed within the mounting groove 3221, and the mounting groove 3221 is used to limit the pipe support 330 in the first direction L1. The pipe support 330 is fixedly connected to the mounting groove 3221 by fasteners, or the pipe support 330 is welded to the mounting groove 3221.

[0199] In one embodiment, referring to Figure 3B, the longitudinal beam 320 is engaged with the first beam body 3101 and the second beam body 3102. Specifically, the first beam body 3101 has at least one first through hole 3111, which penetrates the first beam body 3101 in the second direction L2. The second beam body 3102 has at least one second through hole, which penetrates the second beam body 3102 in the second direction L2. The at least one first through hole 3111 and the at least one second through hole are correspondingly arranged in the second direction L2, and at least one longitudinal beam 320 passes through the corresponding first through hole 3111 and second through hole.

[0200] For example, the shape of the first through hole 3111 and the shape of the second through hole are adapted to the shape of the longitudinal beam 320 so that the longitudinal beam 320 can be locked in the first through hole 3111 and the second through hole to achieve the fixation between the longitudinal beam 320, the first beam body 3101 and the second beam body 3102.

[0201] For example, at least one of the first beam 3101, the second beam 3102, and the longitudinal beam 320 may be made of metal, and at least one of the first beam 3101, the second beam 3102, and the longitudinal beam 320 may have a regular shape.

[0202] In some examples, the first beam 3101, the second beam 3102, and the longitudinal beam 320 can be made of steel and can be C-shaped.

[0203] In other examples, the first beam 3101, the second beam 3102, and the longitudinal beam 320 can be made of aluminum profiles, which reduces the weight of the top frame 300 while ensuring its strength.

[0204] It should be noted that the shape and material of the first beam 3101, the second beam 3102, and the longitudinal beam 320 are not limited to the above examples. Their materials can also be carbon steel, alloy steel, or other composite materials with high strength and support. Their shapes can also be I-shaped, rectangular, circular, H-shaped, T-shaped, C-shaped, or Z-shaped, etc., and are not limited to these.

[0205] The first beam 3101, the second beam 3102, and the longitudinal beam 320 can not only be designed differently in terms of material and shape, but also achieve the effect of reducing weight and increasing strength at the same time through structural design optimization.

[0206] Specifically, in some examples, the first beam 3101 and the second beam 3102 may have openings facing each other in the second direction L2, and the longitudinal beam 320 has an upwardly facing opening to form a mounting groove 3221 using the opening of the longitudinal beam 320.

[0207] In other examples, each side of the first beam 3101 and the second beam 3102 may define a first groove extending along a first direction L1 to reduce the weight of the first beam 3101 and the second beam 3102. Each side of the longitudinal beam 320 shall define a second groove extending along a second direction L2 to reduce the weight of the longitudinal beam 320.

[0208] In other examples, multiple reinforcing ribs may be provided inside the first beam 3101, the second beam 3102, and the longitudinal beam 320 to improve the tensile, compressive, and bending strength of the top frame 300, enabling the top frame 300 to withstand greater loads without failure.

[0209] It should be noted that the above examples are merely illustrative and do not constitute a limitation on this application. Those skilled in the art will understand that the structures of the first beam 3101, the second beam 3102, and the longitudinal beam 320 can have various other designs, such as honeycomb beams, corrugated beams, etc. These designs enhance strength while reducing material usage and weight. This is also merely an illustrative example, and the structure is not limited to the aforementioned examples.

[0210] In some embodiments, referring to FIG3C, the longitudinal beam 320 may overlap the upper part of the first beam 3101 and the second beam 3102. Specifically, the lower surface of the longitudinal beam 320 has a first supporting plane, and the upper surfaces of the first beam 3101 and the second beam 3102 have second supporting planes, and the second supporting planes of the first beam 3101 and the second beam 3102 overlap the first supporting plane of the longitudinal beam 320.

[0211] In some examples, the longitudinal beam 320 can be secured to the first beam 3101 and the second beam 3102 at the lap joint by fasteners.

[0212] In other examples, the joint between the longitudinal beam 320 and the first beam 3101 and the second beam 3102 can be welded and fixed.

[0213] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the connection between the longitudinal beam 320 and the first beam 3101 and the second beam 3102 at the lap joint can be in many other ways, such as riveting, pin connection, or snap-fit ​​connection, and is not limited to these.

[0214] In one embodiment, the top frame 300 further includes at least one bracket 340, which corresponds one-to-one with at least one rack 1000. The bracket 340 is disposed on the top of the corresponding rack 1000 and located between the first beam 3101 and the second beam 3102. The top of the bracket 340 has a supporting surface for supporting the power supply cable 113. The bracket 340 can support the power supply cable 113 on the top of the rack 1000, facilitating the connection of the power supply cable 113 to the distribution cabinet 600 and the power distribution unit, and also uniformly organizes the power supply cable 113, avoiding cable clutter.

[0215] For example, the bracket 340 includes two vertical plates 341 and a horizontal plate 342. The two vertical plates 341 are respectively disposed on opposite sides of the horizontal plate 342 in the second direction L2. The lower end of the vertical plates 341 is connected to the cabinet 100 of the rack 1000. The horizontal plate 342 is connected to the upper end of the two vertical plates 341. The upper surface of the horizontal plate 342 defines a support surface. The power supply cable 113 is supported on the upper surface of the horizontal plate 342.

[0216] For example, the horizontal position of the horizontal plate 342 is higher than the horizontal position of the crossbeam 310 and / or the longitudinal beam 320, so that the arrangement of the crossbeam 310 and the longitudinal beam 320 does not affect the layout of the power supply cable 113.

[0217] For example, the top frame 300 includes multiple brackets corresponding one-to-one with multiple racks 1000 arranged side-by-side in the first direction L1, with a bracket provided on the top of the cabinet 100 of each rack 1000. The power cable 113 extends along the first direction L1 and is supported by multiple brackets arranged in the ground direction in the first direction L1, thereby improving the stability and neatness of the arrangement of the power cable 113.

[0218] In some examples, bracket 340 may be made of aluminum to reduce its weight.

[0219] In other examples, the bracket 340 may be made of copper, carbon steel, alloy steel, or plastic with high strength and support to enhance the support strength of the bracket 340.

[0220] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the material of the bracket 340 is not limited to the above description, and can also be any composite material composed of different materials, such as a composite of metal and plastic, a composite of metal and rubber, glass fiber reinforced plastic, or carbon fiber reinforced plastic, etc., and is not limited thereto.

[0221] In one embodiment, the top of the cabinet 100 of the rack 1000 has a first cable pass 114, which is located on the side of the corresponding bracket 340 away from the power distribution cabinet 600 in the first direction L1. The first cable pass 114 is used for the corresponding power supply cable 113 to pass through and connect to the corresponding power distribution unit. The top of the power distribution cabinet 600 has a second cable pass 601, which is used for the power supply cable 113 to pass through and connect to the power distribution cabinet 600. This allows the power supply cable 113 to be arranged in the space above the power distribution cabinet 600 and the rack 1000, improving space utilization and facilitating the connection of the power supply cable 113 to the power distribution units of the power distribution cabinet 600 and the rack 1000, respectively.

[0222] For example, the heat dissipation structure 1 has multiple power supply cables 113 corresponding to multiple racks 1000. The multiple power supply cables 113 are arranged side by side in the second direction L2 and supported by multiple brackets 340 arranged in the first direction L1. This can avoid the crossing and tangling of the multiple power supply cables 113 and reduce the difficulty of organizing the power supply cables 113.

[0223] Figure 4A shows a schematic diagram of the cooling principle of the heat dissipation structure 1 according to an embodiment of the present application. Figure 4B shows a schematic diagram of the cooling device 200 of the heat dissipation structure 1 according to an embodiment of the present application from one perspective. Figure 4C shows a schematic diagram of the cooling device 200 of the heat dissipation structure 1 according to an embodiment of the present application from another perspective.

[0224] Referring to Figures 4A to 4C, and in conjunction with Figure 1, in the cooling device 200 of the heat dissipation structure 1 provided in this embodiment, the heat exchange module 10 may internally define a first heat exchange flow path 10a and a second heat exchange flow path 10b. The first heat exchange flow path 10a is used for the flow of cooling medium, and the second heat exchange flow path 10b is used for the flow of heat exchange medium. The cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium.

[0225] The first pipeline group 20 may include a first liquid supply pipeline 21 and a first liquid return pipeline 22. The first liquid supply pipeline 21 may be connected to the output end of the first heat exchange flow path 10a, and the first liquid supply pipeline 21 may be connected to the liquid inlet 151 of the medium flow path 210 of the frame 1000; the first liquid return pipeline 22 may be connected to the input end of the first heat exchange flow path 10a, and the first liquid return pipeline 22 may be connected to the liquid outlet 141 of the medium flow path 210 of the frame 1000.

[0226] The second pipeline group 30 may include a second liquid supply pipeline 31 and a second liquid return pipeline 32; the second liquid supply pipeline 31 may be connected to the input end of the second heat exchange flow path 10b, and the second liquid supply pipeline 31 may be connected to the medium output end of the cold source device 500; the second liquid return pipeline 32 may be connected to the output end of the second heat exchange flow path 10b, and the second liquid return pipeline 32 may be connected to the medium return end of the cold source device 500; wherein, the first pipeline group 20 and the second pipeline group 30 may be respectively arranged on opposite sides of the heat exchange module 10.

[0227] In this embodiment, the heat exchange module 10 can realize heat exchange of fluids in different heat exchange flow paths. The heat exchange module 10 can adopt a plate type, shell-and-tube type, or spiral plate type structure, and its shell and partitions can be made of materials with high thermal conductivity and corrosion resistance, such as copper, stainless steel, nickel-based alloys, or titanium alloys, to improve the heat exchange efficiency and durability of the heat exchange module 10. This embodiment does not limit the specific type and structure of the heat exchange module 10.

[0228] As shown in Figures 1 and 4A, the first pipe group 20 is connected to the first heat exchange flow path 10a, and the second pipe group 30 is connected to the second heat exchange flow path 10b. The first pipe group 20 and the second pipe group 30 can be respectively arranged on opposite sides of the heat exchange module 10. It should be noted that the illustration of the first heat exchange flow path 10a and the second heat exchange flow path 10b in the heat exchange module 10 in Figure 1 is for the purpose of facilitating the understanding of the connection relationship between the first heat exchange flow path 10a, the second heat exchange flow path 10b and the first pipe group 20 and the second pipe group 30. The embodiments of this application do not limit the specific structural design of the heat exchange between the first heat exchange flow path 10a and the second heat exchange flow path 10b. For example, parallel heat exchange flow paths, cross heat exchange flow paths, or spiral heat exchange flow paths can be used.

[0229] For example, the heat exchange module 10 can realize heat exchange between the cooling medium in the first heat exchange flow path 10a and the heat exchange medium in the second heat exchange flow path 10b, so as to reduce the temperature of the cooling medium and ensure that the cooling medium is in a low temperature state before entering the first pipeline group 20 through the output end of the first heat exchange flow path 10a. The cold source device 500 can be used to cool the circulating heat exchange medium to ensure that it is in a low temperature state before entering the second heat exchange flow path 10b.

[0230] Specifically, the low-temperature cooling medium can enter the first liquid supply line 21 through the output end of the first heat exchange flow path 10a, and then enter the medium flow path 210 of the frame 1000 through the first liquid supply line 21 to absorb the heat generated by the frame 1000 during operation; the high-temperature cooling medium after absorbing heat can flow back to the input end of the first heat exchange flow path 10a through the first liquid return line 22, and exchange heat with the heat exchange medium in the second heat exchange flow path 10b in the first heat exchange flow path 10a, thus circulating.

[0231] The low-temperature heat exchange medium can flow out from the medium output end of the cold source device 500 and enter the second heat exchange flow path 10b via the second liquid supply pipeline 31. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b rises, and the high-temperature heat exchange medium flows back to the medium return end of the cold source device 500 through the second liquid return pipeline 32. The cold source device 500 further processes the heat exchange medium to cool it down again, preparing it for the next cooling cycle. This application embodiment does not specifically limit the structure and type of the cold source device 500. For example, the cold source device 500 can cool the heat exchange medium by using a gaseous medium or a liquid medium, specifically a cooling tower or a dry cooler.

[0232] In this embodiment, by setting the first pipe group 20 and the second pipe group 30 on opposite sides of the heat exchange module 10, it is beneficial to improve the convenience of pipe connection between the cooling device 200 and the frame 1000 and the cold source device 500. On the other hand, it can make full use of the space on both sides of the heat exchange module 10, so that the first pipe group 20 and the second pipe group 30 do not interfere with each other, and can also improve the space utilization rate, thereby improving the structural compactness of the heat dissipation structure 1.

[0233] In one embodiment, the first liquid supply line 21 may include a first liquid supply sub-line 211 and a second liquid supply sub-line 212 connected to each other. The first liquid supply sub-line 211 and the second liquid supply sub-line 212 may extend along a first direction L1 and be arranged side by side and spaced apart in a second direction L2. The first liquid supply sub-line 211 has a liquid supply inlet at one end near the heat exchange module 10 and is connected to the output end of the first heat exchange flow path 10a. The second liquid supply sub-line 212 is connected to the end of the first liquid supply sub-line 211 away from the heat exchange module 10. The second liquid supply sub-line 211 has a liquid supply outlet 212a and is connected to the liquid inlet 151 of the medium flow path 210. The first return pipeline 22 may include a first return section 221, which extends along the first direction L1. The first return section 221 may be provided with a return inlet 221a, which is connected to the outlet 141 of the medium flow path 210.

[0234] This embodiment uses two liquid supply sub-pipes arranged side by side at intervals. On the one hand, it can evenly distribute the flow rate of the medium and avoid a single pipe bearing excessively high flow velocity and pressure, thereby reducing the pressure loss of fluid flow and reducing the local resistance of the fluid when entering and leaving the pipe. On the other hand, by setting each liquid supply sub-pipe independently, it can reduce the thermal interference of cooling fluid between pipes and improve the overall heat exchange efficiency of the cooling equipment 200.

[0235] In one embodiment, the second liquid supply sub-pipeline 212 may be provided with a plurality of liquid supply outlets 212a. The plurality of liquid supply outlets 212a may be arranged at intervals along the first direction L1 and correspond one-to-one with the liquid inlets 151 of the medium flow paths 210 of the plurality of racks 1000. Each liquid supply outlet 212a may be connected to the liquid inlet 151 of the corresponding medium flow path 210 of the rack 1000.

[0236] For example, each liquid supply outlet 212a can be connected to the liquid inlet 151 of the media flow path 210 of the corresponding rack 1000 via the liquid inlet pipe 213. The liquid supply outlet 212a can be located at the bottom of the wall of the second liquid supply sub-pipe 212.

[0237] In one embodiment, the first return liquid section 221 may be provided with a plurality of return liquid inlets 221a. The plurality of return liquid inlets 221a may be arranged at intervals along the first direction L1 and correspond one-to-one with the liquid outlets 141 of the medium flow paths 210 of the plurality of racks 1000. Each return liquid inlet 221a may be connected to the liquid outlet 141 of the corresponding medium flow path 210 of the rack 1000.

[0238] For example, each return inlet 221a can be connected to the outlet 141 of the media flow path 210 of the corresponding rack 1000 via the outlet pipe 226. The high-temperature cooling medium in the media flow path 210 of each rack 1000 enters the first return pipe 22 through the return inlet 221a, and then flows back to the first heat exchange flow path 10a of the heat exchange module 10 through the first return pipe 22.

[0239] In some examples, at least one of the inlet line 213 and the outlet line 226 is a flexible hose to accommodate space constraints and facilitate installation and disassembly.

[0240] In other examples, at least one of the inlet pipe 213 and the outlet pipe 226 is a rigid pipe to improve the structural strength of the pipe.

[0241] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the flexible hoses used in the inlet pipe 213 and the outlet pipe 226 can be flexible and bendable pipes such as plastic pipes and corrugated pipes, while the rigid pipes can be metal pipes with greater hardness such as copper pipes, aluminum pipes, and stainless steel pipes, or plastic pipes with greater hardness and support, or rigid pipes made of plastic, metal, or composite materials with a certain degree of hardness and bending ability.

[0242] The materials of the inlet pipe 213 and the outlet pipe 226 are not limited to the examples above, and can be any combination of the above materials, such as pipes combining soft and hard materials, all of them being flexible pipes, or all of them being rigid pipes, etc., and are not limited to these. According to the above embodiment, by setting multiple return inlets 221a arranged at intervals along the first direction L1, the return path of the cooling medium is evenly distributed, optimizing space utilization. At the same time, the modular design of the supply outlet 212a and the return inlet 221a corresponding to the rack 1000 facilitates the overall expansion and maintenance of the cooling equipment 200. When it is necessary to add or remove racks 1000, only the position and number of the corresponding supply outlet 212a and return inlet 221a need to be adjusted, which improves the flexibility and maintenance efficiency of the cooling equipment 200.

[0243] In one embodiment, the first liquid supply line 21 and the first liquid return line 22 can both be arranged on one side of the frame 1000 in the second direction L2, for example, on the side of the second direction L2 adjacent to the medium flow path 210 of the frame 1000, and fixedly supported by a support structure arranged on one side of the frame 1000 in the second direction L2 to ensure the stability of each line.

[0244] In one embodiment, the first supply sub-pipe 211 of the first supply pipe 21, the second supply sub-pipe 212, and the first return section 221 of the first return pipe 22 can be supported on the top frame 300. The top frame 300 not only fixes the multiple racks 1000, but also provides fixed support for some sections of the first supply pipe 21 and the first return pipe 22, thus avoiding the problems of increased space occupation and increased cost caused by setting up a separate support structure.

[0245] Furthermore, the first return section 221 is set between the first supply sub-pipe 211 and the second supply sub-pipe 212, reducing the crossing and overlap between pipes, reducing heat exchange between the first supply pipe 21 and the first return pipe 22, which is conducive to maintaining the uniformity of the cooling medium temperature and improving the cooling effect. At the same time, it improves the compactness of the arrangement of the first supply pipe 21 and the first return pipe 22 with the frame 1000, facilitates the connection between the supply outlet 212a of the first pipe group 20 and the inlet 151 of the medium flow path 210 of the frame 1000, and facilitates the connection between the return inlet 221a of the first pipe group 20 and the outlet 141 of the medium flow path 210 of the frame 1000.

[0246] For example, the ends of the first liquid supply sub-pipe 211 and the second liquid supply sub-pipe 212 that are away from the heat exchange module 10 are connected to each other, and the first liquid return section 221 can be arranged between the first liquid supply sub-pipe 211 and the second liquid supply sub-pipe 212 in the second direction L2, so as to make full use of the space between the first liquid supply sub-pipe 211 and the second liquid supply sub-pipe 212.

[0247] In one embodiment, a first exhaust valve 212b is provided at the end of the second liquid supply sub-pipe 212 adjacent to the heat exchange module 10. This valve is used to exhaust air from the system, prevent air from obstructing the flow of the cooling medium, reduce pressure loss caused by air during the flow of the cooling medium, and ensure smooth flow of the cooling medium.

[0248] In one embodiment, the first return liquid pipeline 22 further includes a second return liquid section 222 and a third return liquid section 223 connected to each other, with the second return liquid section 222 and the third return liquid section 223 extending vertically. The end of the first return liquid section 221 away from the heat exchange module 10 is closed, the end of the first return liquid section 221 adjacent to the heat exchange module 10 is connected to the first end of the second return liquid section 222, the second end of the second return liquid section 222 is connected to the first end of the third return liquid section 223, and the second end of the third return liquid section 223 is connected to the input end of the first heat exchange flow path 10a.

[0249] The upper end of the second return liquid section 222 forms its first end, and the upper end of the second return liquid section 222 is connected to the end of the first return liquid section 221 adjacent to the heat exchange module 10; the lower end of the second return liquid section 222 forms its second end, and the lower end of the second return liquid section 222 is connected to the first end of the third return liquid section 223. The lower end of the third return liquid section 223 forms its first end, the upper end of the third return liquid section 223 forms its second end, and the upper end of the third return liquid section 223 is connected to the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0250] More specifically, the second return liquid section 222 and the third return liquid section 223 can be arranged side by side and spaced apart in the first direction L1, so that the second return liquid section 222 and the third return liquid section 223 are coplanar in the vertical plane, thereby further reducing the space occupied by the first return liquid pipe 22 in the second direction L2. This effectively optimizes the pipe layout, making the cooling equipment 200 more compact and facilitating pipe installation and maintenance.

[0251] For example, the orthographic projections of the second return liquid section 222 and the third return liquid section 223 in the horizontal plane are located within a sub-region 410b1 of the frame structure 410 of the bottom support platform 400. Specifically, the second region 410b of the frame structure 410 has three sub-regions 410b1 arranged in the second direction L2. The three sub-regions 410b1 are the middle sub-region 410b1 and the two sub-regions 410b1 on both sides. The middle sub-region 410b1 is provided with a frame, and the heat exchange module 10 is located on the upper part of the frame. The second return liquid section 222 and the third return liquid section 223 are both located in a sub-region 410b1 on one side adjacent to the first liquid supply pipeline 21, making full use of the space above the support platform 400 and facilitating the connection of the third return liquid section 223 to the input end of the first heat exchange flow path 10a of the heat exchange module 10.

[0252] In one embodiment, the projections of the second supply pipe 31 and the second return pipe 32 onto the horizontal plane are located within a sub-region 410b1 of the support platform 400 on the side away from the first supply pipe 21. That is, the second supply pipe 31 and the second return pipe 32 of the second pipe group 30 are distributed on opposite sides of the heat exchange module 10 in the first direction, along with the second return section 222 and the third return section 223 of the first pipe group 20. This further concentrates the various pipes of the cooling device 200, improving the structural compactness of the cooling device 200.

[0253] In one embodiment, the cooling device 200 further includes a first power unit 40, which is connected to the first pipeline group 20 and is used to provide power for the flow of the cooling medium.

[0254] For example, the first power unit 40 is disposed between the second end of the second return section 222 and the first end of the third return section 223.

[0255] For example, the first power unit 40 may be disposed in a sub-region 410b1 on one side of the support platform 400, that is, the first power unit 40 is disposed on one side of the heat exchange module 10 in the first direction and may be fixed in the sub-region 410b1 on that side of the support platform 400 to improve the structural compactness of the cooling device 200.

[0256] For example, the first power unit 40 may be a fluid power pump for driving the cooling medium to flow in the pipeline. Optionally, the first power unit 40 may be a fluid power pump with a head of 3 bar and a flow rate of 60 m3 / h.

[0257] In one embodiment, the cooling device 200 further includes a liquid storage module, which includes a first liquid storage tank 80 connected to a first pipeline group 20. The first liquid storage tank 80 is used to contain cooling medium and to replenish the first pipeline group 20 with cooling medium.

[0258] In one embodiment, the first return line 22 may further include a first replenishment branch 224. The first end and the second end of the first replenishment branch 224 may be connected to the interior of the second return section 222, respectively. The pipe wall of the first replenishment branch 224 may be provided with a first replenishment interface 224a. The first replenishment interface 224a is connected to the interior of the first storage tank 80 through a first connecting branch (not shown in the figure).

[0259] In this embodiment, the cooling device 200 can replenish the cooling medium by cooperating with the first liquid storage tank 80 and the first liquid replenishment branch pipe 224. For example, an automatic water pump can replenish the cooling medium in the first pipeline group 20, and a filter can be used to filter the cooling medium.

[0260] The cooling device 200 can automatically replenish the cooling medium during operation through the first liquid storage tank 80, the first liquid replenishment branch pipe 224, and the automatic water replenishment pump, ensuring that the total amount of cooling medium inside the cooling device 200 is maintained at an appropriate level. Optionally, the volume of the first liquid storage tank 80 can be 30L.

[0261] In one embodiment, the first liquid storage tank 80 can be disposed inside the frame of the support platform 400, that is, the first liquid storage tank 80 is located below the heat exchange module 10, so as to make full use of the space below the heat exchange module 10, reduce the space occupied by the first liquid storage tank 80 in the horizontal direction, and further improve the structural compactness of the cooling device 200. For example, the first liquid storage tank 80 is fixed to the frame inside the frame.

[0262] In one embodiment, the cooling device 200 further includes a pressure stabilizing module, which includes a first pressure stabilizing tank connected to the first pipeline group 20 for stabilizing the pressure of the first pipeline group 20.

[0263] In one embodiment, the first return line 22 may further include a first pressure-stabilizing branch 225, the first end of which may be connected to the interior of the first pressure-stabilizing tank 60, and the second end of which may be connected to the interior of the third return section 223.

[0264] In this embodiment, the pressure within the cooling device 200 can be regulated and stabilized using a pressure stabilizing tank. During operation, temperature changes and fluid flow may cause fluctuations in the internal pressure of the cooling device 200. The first pressure stabilizing tank 60 can be used to maintain the pressure balance of the cooling device 200, preventing excessively high or low pressure from affecting the heat dissipation effect. Furthermore, when the flow rate of the cooling medium within the cooling device 200 suddenly changes, the first pressure stabilizing tank 60 can act as a buffer, reducing the impact of flow fluctuations on the system and protecting other components of the cooling device 200.

[0265] The cooling medium can flow freely between the third return section 223 and the first pressure-stabilizing tank 60 via the first pressure-stabilizing branch pipe 225. When the system pressure is too high, excess cooling medium will enter the first pressure-stabilizing tank 60; when the system pressure is too low, the cooling medium in the first pressure-stabilizing tank 60 will flow back into the system to maintain pressure stability. This improves the stability, reliability, and heat exchange efficiency of the cooling equipment 200. Optionally, the volume of the first pressure-stabilizing tank 60 can be 20L.

[0266] In one embodiment, the first pressure stabilizing tank 60 may be disposed inside the frame of the support platform 400. For example, the first pressure stabilizing tank 60 is fixed in the middle sub-region 410b1 of the support platform 400. The heat exchange module 10, the first liquid storage tank 80 and the first pressure stabilizing tank 60 are arranged sequentially from top to bottom in the vertical direction, thereby further utilizing the space below the heat exchange module 10, reducing the space occupied by the first pressure stabilizing tank 60 in the horizontal direction, and further improving the structural compactness of the cooling device 200.

[0267] In one embodiment, the second liquid supply pipeline 31 may include a first liquid supply section 311 and a second liquid supply section 312 connected to each other. The first end of the first liquid supply section 311 may be connected to the medium output end of the cold source device 500, the second end of the first liquid supply section 311 may be connected to the first end of the second liquid supply section 312, and the second end of the second liquid supply section 312 may be connected to the input end of the second heat exchange flow path 10b. The first liquid supply section 311 and the second liquid supply section 312 may extend vertically and be spaced apart in the first direction L1.

[0268] For example, the upper end of the first liquid supply section 311 forms its first end, and the upper end of the first liquid supply section 311 is connected to the medium output end of the cold source device 500 through a pipeline. The lower end of the first liquid supply section 311 forms its second end, and the lower end of the first liquid supply section 311 is connected to the first end of the second liquid supply section 312. The lower end of the second liquid supply section 312 forms its first end, the upper end of the second liquid supply section 312 forms its second end, and the upper end of the second liquid supply section 312 is connected to the input end of the second heat exchange flow path 10b.

[0269] With this configuration, the first liquid supply section 311 and the second liquid supply section 312 can form a continuous liquid supply path. During the cooling process, the low-temperature heat exchange medium can flow out from the medium output end of the cold source device 500, and enter the second heat exchange flow path 10b via the first liquid supply section 311 and the second liquid supply section 312. Through the heat exchange module 10, the cooling medium in the first heat exchange flow path 10a can exchange heat with the heat exchange medium in the second heat exchange flow path 10b to reduce the temperature of the cooling medium. After heat exchange, the temperature of the heat exchange medium in the second heat exchange flow path 10b increases. The heat exchange medium can return to the medium return end of the cold source device 500 through the second return pipe 32, where the cold source device 500 further processes the heat exchange medium to cool it down again, preparing it for the next cooling cycle. This can improve the heat exchange efficiency of the cooling device 200 in the heat dissipation structure 1 and prevent the computing elements of the computing device 230 from experiencing performance degradation and hardware damage due to overheating.

[0270] Furthermore, by arranging the first liquid supply section 311 and the second liquid supply section 312 at intervals in the first direction L1, the space occupied by the second liquid supply pipeline 31 in the second direction L2 can be reduced, further improving the structural compactness of the cooling device 200.

[0271] In one embodiment, the cooling device 200 further includes a second power unit 50, which is connected to the second pipeline group 30 and is used to provide power for the flow of the heat exchange medium.

[0272] For example, the second power unit 50 can be disposed in a sub-region 410b1 on the other side of the support platform 400. That is, the second power unit 50 is disposed on the other side of the heat exchange module 10 in the first direction L1, and is distributed and disposed in the two sub-regions 410b1 on both sides respectively with the first power unit 40. It can be fixed in the sub-region 410b1 on this side of the support platform 400 to improve the structural compactness of the cooling device 200.

[0273] For example, the second power unit 50 is disposed between the second end of the first liquid supply section 311 and the first end of the second liquid supply section 312. For example, the second power unit 50 may be a fluid power pump to drive the heat exchange medium to flow in the pipeline. Optionally, the second power unit 50 may be a fluid power pump with a head of 2.5 bar and a flow rate of 65 m3 / h.

[0274] In one embodiment, the liquid storage module of the cooling device 200 further includes a second liquid storage tank 90, which is connected to the second pipeline group 30. The second liquid storage tank 90 is used to contain the cooling medium and to replenish the heat exchange medium to the second pipeline group 30.

[0275] In one embodiment, the second liquid supply line 31 may further include a second liquid replenishment branch 313. The first end and the second end of the second liquid replenishment branch 313 may be connected to the interior of the first liquid supply section 311, respectively. The pipe wall of the second liquid replenishment branch 313 may be provided with a second liquid replenishment interface 313a. The second liquid replenishment interface 313a may be connected to the interior of the second liquid storage tank 90 through a second connecting branch (not shown in the figure).

[0276] In this embodiment, the cooling device 200 can replenish the heat exchange medium by cooperating with the second liquid storage tank 90 and the second replenishment branch pipe 313. For example, the cooling medium in the second pipeline group 30 can be replenished by an automatic water pump, and the cooling medium can be filtered by a filter. The second replenishment interface 313a can be connected to the interior of the second liquid storage tank 90 below the heat exchange module 10 via a second connecting branch pipe (not shown in the figure). Furthermore, the cooling device 200 can automatically replenish the cooling medium during operation via the second liquid storage tank 90, the second replenishment branch pipe 313, and the automatic water pump, ensuring that the total amount of heat exchange medium inside the cooling device 200 remains at an appropriate level.

[0277] In one embodiment, the second liquid storage tank 90 can be disposed inside the frame structure 410 of the support platform 400, that is, the second liquid storage tank 90 is located below the heat exchange module 10, thereby making full use of the space below the heat exchange module 10, reducing the space occupied by the second liquid storage tank 90 in the horizontal direction, and further improving the structural compactness of the cooling device 200.

[0278] For example, the second liquid storage tank 90 and the first liquid storage tank 80 can be arranged side by side and adjacent to each other in the second direction L2, which further makes full use of the space below the heat exchange module 10, reduces the space occupied by the second liquid storage tank 90 in the horizontal direction, and further improves the structural compactness of the cooling device 200.

[0279] In one embodiment, the pressure stabilizing module of the cooling device 200 may further include a second pressure stabilizing tank 70, which is connected to the second pipeline group 30 and is used to stabilize the pressure of the second pipeline group 30.

[0280] In one embodiment, the second liquid supply line 31 may further include a second pressure-stabilizing branch line 314. The first end of the second pressure-stabilizing branch line 314 is connected to the interior of the second pressure-stabilizing tank 70, and the second end of the second pressure-stabilizing branch line 314 is connected to the interior of the first liquid supply section 311. Through the cooperation of the second liquid storage tank 90 and the second replenishment branch line 313, the replenishment function of the second pipeline group 30 in the cooling equipment 200 is realized. The pressure within the cooling equipment 200 can be adjusted and stabilized through the second pressure-stabilizing tank 70, thereby improving the stability, reliability, and heat exchange efficiency of the cooling system. Optionally, the volume of the second liquid storage tank 90 may be 30L, and the volume of the second pressure-stabilizing tank 70 may be 20L.

[0281] In one embodiment, the second pressure stabilizing tank 70 may be disposed inside the frame of the support platform 400. For example, the second pressure stabilizing tank 70 is fixed within the middle sub-region 410b1 of the support platform 400, and is arranged side-by-side with the first pressure stabilizing tank 60 in the second direction L2. That is, the heat exchange module 10, the second liquid storage tank 90, and the second pressure stabilizing tank 70 are arranged sequentially from top to bottom in the vertical direction, and the second pressure stabilizing tank 70 and the first pressure stabilizing tank 60 are adjacent and side-by-side in the second direction L2, thereby further utilizing the space below the heat exchange module 10, further improving the structural compactness of the cooling device 200, and reducing the space occupied by the second pressure stabilizing tank 70 in the horizontal direction.

[0282] In one embodiment, the input end of the first heat exchange flow path 10a may be located below the output end of the first heat exchange flow path 10a; the input end of the second heat exchange flow path 10b may be located above the output end of the second heat exchange flow path 10b. In some examples, the flow direction of the medium within the first pipe group 20 and the second pipe group 30 may be set according to specific application requirements, and the specific positional relationship between the input and output ends of the heat exchange flow paths may be set accordingly based on the actual flow direction of the cooling medium and the heat exchange medium within the pipe group.

[0283] Figure 5A shows a structural schematic diagram of the rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application. Figure 5B shows an enlarged view of region A in Figure 5A. Figure 5C shows a structural schematic diagram of the rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application from one perspective. Figure 5D shows a structural schematic diagram of the rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application from another perspective. Figure 5E shows an enlarged view of region B in Figure 5D. Figure 5F shows a top view of the rack 1000 of the heat dissipation structure 1 according to an embodiment of the present application.

[0284] Referring to Figures 5A to 5F, and in conjunction with Figure 4A, in the heat dissipation structure 1 of this application embodiment, the medium flow path 210 of the rack 1000 includes a cooling pipe 215, an inlet liquid distribution pipe 150, and a return liquid distribution pipe 140. The cooling pipe 215 is used to make thermal contact with the heat-generating components of the computing device 230 to cool the heat-generating components.

[0285] For example, cooling pipes 215 may be disposed inside computing device 230. Cooling pipes 215 may be attached to or embedded in critical heat-generating components of computing device 230, such as central processing unit, graphics processor, memory module and other heat-generating electronic components.

[0286] Liquid inlet distribution line 150 and liquid return distribution line 140 are located on one side of cabinet 100. Liquid inlet distribution line 150 has a liquid inlet 151 and multiple liquid delivery ports 152. Liquid inlet 151 is connected to the liquid supply inlet of the first pipeline group 20. Multiple liquid delivery ports 152 correspond one-to-one with the cooling pipelines 215 of multiple computing devices 230 and are respectively connected to the input end of the cooling pipelines 215 of the multiple computing devices 230. Liquid return distribution line 140 has multiple liquid return ports 142 and liquid outlet ports 141. Multiple liquid return ports 142 correspond one-to-one with the cooling pipelines 215 of multiple computing devices 230 and are respectively connected to the output end of the cooling pipelines 215 of the multiple computing devices 230. Liquid outlet ports 141 are connected to the liquid return inlet of the first pipeline group 20.

[0287] In this embodiment, the rack 1000 not only houses each computing device 230 but also cools them. Its compact structure and small footprint facilitate maintenance and reduce costs. Furthermore, a liquid inlet distribution pipe 150 and a liquid return distribution pipe 140 enable liquid supply and return distribution to the multiple computing devices 230, reducing the number of components in the rack 1000 and simplifying its overall structure. This also facilitates centralized management, allows for more effective temperature control, and reduces energy consumption.

[0288] In one embodiment, the cabinet 100 defines a first accommodating space 100a, which can be used to integrate and install multiple computing devices 230 arranged vertically. The liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 are respectively vertically arranged on the side of the cabinet 100 adjacent to the first pipe group 20 in the second direction L2, and multiple liquid inlets 152 and multiple liquid return outlets 142 are arranged vertically at intervals. This facilitates the connection of the liquid inlet 151 of the liquid inlet distribution pipe 150 and the liquid outlet 141 of the liquid return distribution pipe 140 to the liquid supply outlet 212a and the liquid return inlet 221a of the first pipe group 20, respectively. Furthermore, it ensures that the arrangement direction of each liquid inlet 152 and each liquid return outlet 142 is consistent with the arrangement direction of each computing device 230, facilitating the connection of each liquid inlet 152 and each liquid return outlet 142 to the cooling pipes 215 inside each computing device 230.

[0289] In some examples, the cross-section of the inlet distribution pipe 150 and the return distribution pipe 140 can both be square, for example, rectangular. In other examples, the inlet distribution pipe 150 and the return distribution pipe 140 can be circular pipes. It should be noted that this is only illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the inlet distribution pipe 150 and the return distribution pipe 140 can also be corrugated pipes, irregularly shaped pipes, spiral pipes, multi-layer composite pipes, etc., and are not limited thereto.

[0290] For example, the inner diameter of the inlet distribution pipe 150 and the return distribution pipe 140 can be 70mm to 160mm to ensure the flow rate of the cooling medium while reducing pressure loss.

[0291] For example, the inner diameter of the liquid inlet 151 and the liquid outlet 141 can be 50mm to 150mm to ensure that the liquid inlet 151 and the liquid outlet 141 have a sufficient flow of cooling medium, while reducing the flow velocity at the liquid inlet 151 and the liquid outlet 141, thereby reducing friction loss and pressure drop, and ensuring that the cooling medium at each liquid inlet 151 and the liquid outlet 141 has sufficient pressure.

[0292] For example, the inner diameter of the liquid inlet 152 and the liquid return port 142 can be 8mm to 20mm to increase the flow rate of the cooling medium at the liquid inlet 152 and the liquid return port 142, so as to ensure that the flow rate at the liquid inlet 152 and the liquid return port 142 matches the flow rate at the liquid inlet 151 and the liquid outlet 141, respectively.

[0293] For example, each liquid inlet 152 can be connected to the input end of each cooling pipe 215 of each computing device 230 through the liquid inlet connection pipe 216, and each liquid return inlet 142 can be connected to the output end of each cooling pipe 215 of each computing device 230 through the liquid return connection pipe 217.

[0294] In some examples, at least one of the liquid delivery connection line 216 and the liquid return connection line 217 is a flexible hose to accommodate space constraints and facilitate installation and disassembly.

[0295] In other examples, at least one of the liquid delivery connection pipe 216 and the liquid return connection pipe 217 is a rigid pipe to improve the structural strength of the pipes.

[0296] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the flexible hoses used in the liquid delivery connection pipe 216 and the liquid return connection pipe 217 can be flexible and bendable, such as plastic pipes or corrugated pipes. The rigid pipes can be metal pipes with high hardness, such as copper pipes, aluminum pipes, or stainless steel pipes, or plastic pipes with high hardness and support, or rigid pipes made of plastic, metal, or composite materials with a certain degree of hardness and bending ability.

[0297] The materials of the liquid delivery connection pipe 216 and the liquid return connection pipe 217 are not limited to the above examples. They can also be any combination of the above materials, such as pipes with a combination of soft and hard materials, pipes that are all soft or pipes that are all hard, etc.

[0298] In one embodiment, the projections of the inlet distribution line 150 and the return distribution line 140 in the vertical plane are located on both sides of the projections of the plurality of computing devices 230 in the vertical plane; the plurality of liquid inlets 152 and the plurality of liquid return outlets 142 are distributed facing each other in the first direction L1, with the plurality of liquid inlets 152 adjacent to one side of the plurality of computing devices 230 in the first direction L1, and the plurality of liquid return outlets 142 adjacent to the other side of the plurality of computing devices 230 in the first direction L1. This simplifies the arrangement of the liquid inlet hoses between each liquid inlet 152 and the input end of each cooling line 215, and simplifies the arrangement of the liquid return hoses between each liquid return outlet 142 and the output end of each cooling line 215, thereby shortening the length of the liquid inlet hoses and the liquid return hoses.

[0299] In one embodiment, an inlet 151 is formed on the side of the inlet distribution pipe 150 adjacent to the first pipe group 20 in the second direction L2, and near the top of the inlet distribution pipe 150; an outlet 141 is formed on the side of the return distribution pipe 140 adjacent to the first pipe group 20 in the second direction L2, and near the top of the return distribution pipe 140. This shortens the distance between the inlet 151 of the inlet distribution pipe 150 and the outlet 141 of the return distribution pipe 140 and the first pipe group 20, facilitating the connection of the inlet 151 and the outlet 141 to the supply inlet and return inlet 221a of the first pipe group 20, respectively.

[0300] In one embodiment, an exhaust valve, namely a second exhaust valve 160, can be provided at the top end of the liquid inlet distribution pipe 150 and the top end of the liquid return distribution pipe 140. This utilizes the natural upward characteristic of gas to make it easier for gas to reach the second exhaust valve 160 and be discharged, thereby reducing the gas content in the pipes and improving the efficiency of the liquid inlet distribution pipe 150 and the liquid return distribution pipe 140 in transporting the cooling medium.

[0301] For example, the second exhaust valve 160 is a mechanical valve. Under normal circumstances, the valve of the second exhaust valve 160 is closed. When air or gas accumulates in the cooling medium in the liquid inlet distribution line 150 and the liquid return distribution line 140, the gas rises and accumulates at the top of the second exhaust valve 160. When the gas pressure is high enough, the valve of the second exhaust valve 160 opens and the gas is discharged. After the gas is discharged, the valve closes quickly.

[0302] In one embodiment, the exhaust port 161 of the second exhaust valve 160 may be connected to a flexible connecting pipe (not shown), which extends to the bottom of the cabinet 100 to discharge gas from the inlet distribution pipe 150 and the return distribution pipe 140, respectively. Moisture is guided through the flexible connecting pipe to the support platform 400 at the bottom of the cabinet 100 and discharged to the outside through gaps in the bottom support platform 400, preventing moisture from affecting the computing devices 230 inside the cabinet 100.

[0303] In one embodiment, the cabinet 100 includes a cabinet body 110 and a shelf 120. The shelf 120 is disposed inside the cabinet body 110 and defines a first accommodating space 100a. By providing accommodating space for the computing device 230 through the independent shelf 120, the weight of the computing device 230 can be distributed, avoiding excessive stress on the overall structure of the cabinet 100 and improving the overall stability and safety of the cabinet 100.

[0304] A second accommodating space 100b is defined between the shelf 120 and the cabinet 110. The second accommodating space 100b and the first accommodating space 100a are arranged in a first direction L1. Multiple power distribution units of the rack 1000 can be arranged vertically in the second accommodating space 100b. The concentration of multiple computing devices 230 and multiple power distribution units within a single cabinet 100 improves space utilization and facilitates power management and maintenance. Furthermore, by distributing power from the external power distribution cabinet 600 to the various computing devices 230 inside the cabinet 100 through multiple power distribution units, power cabling is simplified, avoiding cable clutter.

[0305] For example, the number of power distribution units may be less than the number of computing devices 230, that is, one power distribution unit can distribute power to multiple computing devices 230.

[0306] In some examples, the shelf 120 can be welded to the inside of the cabinet 110.

[0307] In other examples, the shelf 120 can be secured to the interior of the cabinet 110 with fasteners.

[0308] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that there are many other ways to fix the shelf 120 to the cabinet 110, such as riveting, slot embedding, magnetic adsorption, or suction cup adsorption.

[0309] For example, the shelf 120 can be made of metal. In some examples, the shelf 120 can be made of steel. In other examples, the shelf 120 can be made of aluminum alloy. It should be noted that the material of the shelf 120 is not limited to the foregoing examples, and its material can also be copper, carbon steel, alloy steel, or other composite materials with high strength and support, etc., and is not limited to these.

[0310] In one embodiment, the shelf 120 includes two support frames 1200 spaced apart in a first direction L1, meaning the first accommodating space 100a is defined by the two support frames 1200. Each support frame 1200 includes multiple columns 121 and multiple support plates 122. The multiple columns 121 are spaced apart in a second direction L2, and the multiple support plates 122 are spaced apart vertically and connected to the multiple columns 121. The multiple support plates 122 of one support frame 1200 and the multiple support plates 122 of the other support frame 1200 are arranged facing each other in the first direction L1, so that the computing device 230 can be supported by the two opposing support frames 1200. This improves the stability of the computing device 230 and provides a regular and orderly arrangement space for the computing device 230, facilitating its management and maintenance.

[0311] For example, each support frame 1200 includes two columns 121, which are respectively arranged on both sides in the second direction L2 to form the vertical support of the support frame 1200. A plurality of support plates 122 arranged at intervals in the vertical direction are connected between the two columns 121. The plurality of support plates 122 constitute the support platform 400 of each computing device 230 to enhance the overall strength of the shelf 120.

[0312] For example, the support plate 122 may include a vertically extending fixing piece 122a and a horizontally extending bearing piece 122b. The fixing piece 122a is fixed to a plurality of corresponding columns 121, and the bearing piece 122b extends horizontally from the lower end of the fixing piece 122a toward the support plate 122 of another support frame 1200, forming a plurality of pairs of opposing bearing pieces 122b arranged at intervals in the vertical direction. Each computing device 230 can be directly pushed into the space above the corresponding pair of bearing pieces 122b along the second direction L2, which is easy to place and convenient to operate.

[0313] For example, a support platform can be arranged between two opposing fixed plates 122a, with the support platform located above the two opposing support plates 122b. The computing device 230 can be placed on the corresponding support platform, thereby improving the stability of the placement of the computing device 230.

[0314] In one embodiment, the rack 1000 may further include a plurality of power support bases 124 arranged vertically at intervals in the second accommodating space 100b. The plurality of power support bases 124 are connected between the cabinet 110 and the shelf 120 to support a plurality of power distribution units respectively, ensuring the stability of the placement of the power distribution units. Referring to FIG5C, the support frame 1200 on the right side of the shelf 120 in the first direction L1 is connected to the right side wall of the cabinet 110 in the first direction L1 by a plurality of power support bases 124 arranged vertically at intervals. Exemplarily, each power support base 124 can hold one power distribution unit.

[0315] In some examples, the power supply support 124 can be welded and fixed between the cabinet 110 and the shelf 120. In other examples, the power supply support 124 can be fixed between the cabinet 110 and the shelf 120 using fasteners. It should be noted that this is merely illustrative and does not constitute a limitation of this application. Those skilled in the art will understand that the power supply support 124 can be connected to the cabinet 110 and the shelf 120 in various other ways, such as riveting, pin connection, or snap-fit ​​connection, and is not limited to these.

[0316] For example, the inlet distribution pipe 150 is vertically arranged on one of the support frames 1200 of the shelf 120 on the side adjacent to the first pipe group 20 in the second direction L2, and the return distribution pipe 140 is vertically arranged on the other support frame 1200 on the side adjacent to the first pipe group 20 in the second direction L2.

[0317] For example, the inlet distribution line 150 and the return distribution line 140 can be detachably fixed to the shelf 120.

[0318] In some examples, a plurality of vertically spaced mounting plates 123 connect the column 121 to the cabinet 110 of the cabinet 100. The column 121 is adjacent to the second accommodating space 100b in the first direction L1 and adjacent to the first piping group 20 in the second direction L2. The liquid inlet distribution pipe 150 is fixed to the corresponding mounting plate 123 by a connector 153 thereon. One of the columns 121 of another support frame 1200 may be provided with a plurality of other vertically spaced mounting plates (not shown), and the liquid return distribution pipe 140 is fixed to the corresponding other mounting plate by a connector 153 thereon.

[0319] In other examples, the inlet distribution line 150 and the return distribution line 140 can be detachably connected to the shelf 120 by means of snap-fit ​​connection, magnetic adsorption or suction cup adsorption, and are not limited to this.

[0320] For example, the inlet distribution line 150 and the return distribution line 140 can be fixedly connected to the shelf 120. For instance, the connectors 153 of the inlet distribution line 150 and the return distribution line 140 can be fixed to the corresponding columns 121 of the shelf 120 by means of screws, welding or riveting.

[0321] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the connection between the liquid inlet distribution pipe 150, the liquid return distribution pipe 140 and the shelf 120 can also be in various other ways, such as clamp fixing, binding fixing or buckle fixing, etc., and is not limited to these.

[0322] In one embodiment, the rack 1000 further includes wiring posts 130, which are vertically arranged on the other side of the shelf 120 in the second direction L2. The wiring posts 130 have multiple cable trays 131 for network cables to pass through. The network cables are used to connect to the network interface of the computing device 230 to realize the network connection of the computing device 230.

[0323] For example, the wiring post 130 is provided with multiple weight-reducing holes to reduce its overall weight.

[0324] In some examples, the wiring post 130 can be welded to the interior of the cabinet 110. In other examples, the wiring post 130 can be fixed to the interior of the cabinet 110 using fasteners. It should be noted that the above are merely illustrative examples and do not constitute a limitation of this application. Those skilled in the art will understand that there are many other ways to fix the wiring post 130 to the cabinet 110, such as riveting, slot embedding, magnetic adsorption, or suction cup adsorption, and these are not limited to these methods.

[0325] In one embodiment, the rack 1000 further includes a top connecting plate 190, which is disposed on the top of the cabinet 100 and extends above adjacent cabinets 100. The top connecting plate and the top of the adjacent cabinets 100 each have vertically opposite top connecting holes, and the cabinets 100 and adjacent cabinets 100 are fixed together by fasteners passing through the top connecting holes. That is, two adjacent cabinets 100 arranged in the first direction L1 can be connected together by the top connecting plate 190 to construct multiple racks 1000 arranged and connected in sequence, thereby forming a stable integrated set of multiple racks 1000, which facilitates transportation and delivery.

[0326] For example, the top connecting plate 190 may be disposed on the edge of the top of the cabinet 110 in the first direction L1 to facilitate connection with the adjacent cabinet 100.

[0327] For example, two top connecting plates 190 are installed on the top of the rack 100 on the first side of the first direction L1, and are spaced apart on the second direction L2. The two top connecting plates 190 on the second direction L2 are connected to the adjacent rack 100, which improves the stability of the connection between the two adjacent racks 100, thereby making the connection between multiple racks 1000 more stable and avoiding the shaking of the racks 1000 during transportation.

[0328] In one embodiment, referring to FIG5F, a cover plate 112 covers the first cable passage 114, and the cover plate 112 is installed on the top wall of the cabinet 110. Specifically, the top of the cabinet 110 defines a plurality of first fixing holes around the outer periphery of the first cable passage 114, and the cover plate 112 has a plurality of second fixing holes corresponding one-to-one with the plurality of first fixing holes. Before the power supply cable 113 is connected, the cover plate 112 is fixed above the cable passage by fasteners that pass through the second fixing holes and the first fixing holes in sequence. That is to say, before the power supply cable 113 is connected, the first cable passage 114 is covered by the cover plate 112. For example, during the transportation and handling of the cabinet 100, the cover plate 112 covers the first cable passage 114 to prevent debris from falling into the cabinet 100. After delivery, the cover plate 112 is removed, and the power supply cable 113 passes through the first cable passage 114 and connects to the power distribution unit inside the cabinet 100.

[0329] In one embodiment, a lifting ring 170 may be provided on the top of the cabinet 100. The lifting ring 170 is detachably provided on the top of the cabinet 100 for connecting lifting ropes to facilitate the handling of the cabinet 100. Multiple lifting rings 170 may be provided to improve the stability of the cabinet 100 during handling.

[0330] For example, a lifting ring 170 is provided at each of the four corners of the top of the cabinet 100, which helps to maintain the balance and stability of the cabinet 100 when it is lifted.

[0331] For example, the lifting ring 170 includes an annular portion and a mounting portion. The mounting portion is connected to the top of the cabinet 100, and the annular portion is located above the mounting portion for easy connection to a lifting rope. The lifting ring 170 is vertically oriented, ensuring the cabinet 100 remains upright when lifted, which helps maintain the stability of the cabinet 100 and facilitates its placement. For example, the mounting portion can be a bolt, and screw holes are formed at positions on the top of the cabinet 100 corresponding to the mounting portion. The bolt and screw holes facilitate the installation and removal of the lifting ring 170.

[0332] In one embodiment, the bottom of the cabinet 100 may have vertically extending fixing holes 111, so as to fix the cabinet 100 to the support platform 400 by fasteners passing through the fixing holes 111, so as to maintain the stability of the cabinet 100 and facilitate transportation.

[0333] For example, the four corner areas at the bottom of the cabinet 100 can each be provided with fixing holes 111. The cabinet 100 is fixed to the support platform 400 through the four fixing holes 111, making it more stable and less prone to shaking during transportation.

[0334] In one embodiment, the rack 1000 further includes a bottom connecting plate 180, which extends downward at an angle from the bottom of the rack 100 on the outer side of the second direction L2. The upper end of the bottom connecting plate 180 is fixed to the rack 100, and the lower end of the bottom connecting plate 180 is fixed to the support platform 400. This forms a stable triangular structure for the bottom connecting plate 180, improving the stability of the connection between the rack 100 and the support platform 400.

[0335] For example, the bottom connecting plate 180 has a connection hole for connecting to the cabinet 100 and a connection hole for connecting to the support platform 400. The bottom connecting plate 180 is fixed to the cabinet 100 and the support platform 400 respectively by fasteners passing through the corresponding connection holes.

[0336] For example, the bottom of the cabinet 100 is provided with bottom connecting plates 180 on the two outer sides in the second direction L2, which improves the stability of the connection between the cabinet 100 and the support platform 400.

[0337] In one embodiment, the bottom of the cabinet 100 may be equipped with multiple casters 101 to facilitate the individual movement of the cabinet 100. For example, the bottom of the cabinet 100 is equipped with four casters 101, which are evenly spaced and installed in the areas near the four corners of the bottom of the cabinet 100.

[0338] This application also provides a container 2, including a container body 700 and a heat dissipation structure 1 as described in any of the above embodiments, wherein the heat dissipation structure 1 is disposed inside the container body 700. This forms a container-type heat dissipation structure 1, which facilitates transportation and delivery, while providing a robust structure to prevent the influence of the external environment.

[0339] In some examples, the heat dissipation structure 1 is placed directly inside the container 700. To ensure the stability of the heat dissipation structure 1 during the handling of the container 2, the internal dimensions of the container 700 can be matched with the external dimensions of the heat dissipation structure 1 to prevent it from moving; or a buffer protective layer can be added between the heat dissipation structure 1 and the container 700 to provide additional protection against its movement.

[0340] In other examples, the heat dissipation structure 1 is fixed inside the housing 700. For example, the support platform 400 and / or top frame 300 of the heat dissipation structure 1 can be fixed to the bottom wall and / or side wall of the housing 700 by fasteners.

[0341] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0342] Those skilled in the art will understand that the arrangement of the heat dissipation structure 1 relative to the housing 700 can take other forms. For example, an anti-slip pad can be added to the bottom of the housing 700, or shock-absorbing pads or shock absorbers can be used to isolate the heat dissipation structure 1 from the housing 700 to reduce vibration and impact generated during handling. Furthermore, clamps or clips can be installed inside the housing 700, or the heat dissipation structure 1 can be fixed by magnetic attraction or vacuum adsorption. This is merely an example, and the arrangement of the heat dissipation structure 1 relative to the housing 700 is not limited to the aforementioned examples.

[0343] In one embodiment, the housing 700 includes a frame 701, which protrudes upward from the bottom of the housing 700 on one side in the second direction L2. The support platform 400 is spaced apart from the frame 701 on the side adjacent to the frame 701 in the second direction L2 to form a groove for draining liquid. That is, when the support platform 400 is arranged at the bottom of the housing 700, it needs to maintain a certain distance from the frame 701 of the housing 700 in the second direction to reserve a channel for liquid discharge and facilitate timely liquid discharge.

[0344] The frame 701 may have a plurality of drainage holes 702 spaced apart in the first direction L1. Liquid in the groove is discharged to the outside of the box 700 through the drainage holes 702 to prevent water from accumulating at the bottom of the box 700.

[0345] For example, there are two drain holes 702. The two drain holes 702 can together form a forklift hole, which facilitates forklift handling of containers.

[0346] In some examples, the shape and size of the container 700 can be set according to the standard 40-foot container, with overall dimensions of 12.192m * 2.438m * 2.438m. Therefore, after integrating the heat dissipation structure 1 inside the container 700, it can be directly packed and transported by sea or land, without the need for secondary assembly after transportation, thus improving the convenience of transportation and delivery.

[0347] The above is merely a specific example and does not constitute a limitation of this application. Those skilled in the art will understand that the shape and size of the container 700 can be arbitrarily set according to actual circumstances. For ease of transportation, the shape and size of the container 700 can be set with reference to standard containers, for example, it can adopt the same shape and size as standard 20-foot, 40-foot, or 45-foot containers, and is not limited thereto.

[0348] The shape and size of the enclosure 700 can also be designed in other ways. For example, a compact design can be adopted, making the internal shape and dimensions of the enclosure 700 similar to the shape and dimensions of the heat dissipation structure 1, reducing unnecessary space and preventing the heat dissipation structure 1 from moving within the enclosure 700; or, a space-saving design can be adopted, reserving a certain amount of buffer space around the inside of the enclosure 700 to facilitate the placement of fillers or cushioning materials, providing additional protection. This is only an example, and the shape and size of the enclosure 700 are not limited to the examples described above.

[0349] This embodiment also provides a data center, including multiple computing devices 230 and a heat dissipation structure 1 or container 2 of any of the above embodiments. Multiple computing devices 230 can be integrated and installed in the cabinet 100 of each heat dissipation structure 1 to form a skid-integrated data center, or the heat dissipation structure 1 can be placed in a container to form a containerized data center.

[0350] Compared to traditional data centers, the data center provided in this embodiment can be pre-assembled and tested. After delivery, it can be put into use on-site simply by connecting the power distribution cabinet 600 and the network via power cable 113 and network cable, respectively, thus greatly saving deployment time. Moreover, the data center in this embodiment has a high degree of standardization and consistency, which can reduce the uncertainty and potential problems of on-site construction, thereby reducing construction and operating costs. In addition, the modular design of the data center can be customized according to different needs, including different power densities, cooling solutions, and network configurations, to meet the needs of various application scenarios.

[0351] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0352] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0353] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0354] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0355] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0356] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, include: At least one rack, the rack including a cabinet and a media flow path, the cabinet for integrating and installing multiple computing devices, and the media flow path for supplying cooling media through the multiple computing devices; The cooling device includes a heat exchange module and a first piping group, the first piping group being connected between the heat exchange module and the medium flow path of the at least one rack; A top frame is fixed to the top of the at least one rack, and at least part of the first piping assembly is supported by the top frame; A support platform is provided, wherein at least one rack and the cooling device are integrated on the support platform, the heat exchange module is disposed on one side of the at least one rack in a first direction, and the first pipeline group is located on one side of the heat exchange module in a second direction, the second direction intersecting the first direction.

2. The heat dissipation structure according to claim 1, characterized in that, The support platform includes: The frame structure, support plate, and frame body are provided. The frame structure has a first region and a second region arranged in the first direction. The support plate covers the first region. The frame body is disposed in the second region. The at least one frame is mounted on the support plate, and the heat exchange module is supported on the upper part of the frame.

3. The heat dissipation structure according to claim 2, characterized in that, The cooling device also includes a second pipeline assembly, which is connected between the heat exchange module and the cold source device; The second region includes three sub-regions arranged in the second direction, with the orthographic projection of the frame in the horizontal plane located in the middle sub-region, and the bottom end of the frame connected to the middle sub-region; At least a portion of the pipe segments of the first pipeline group and at least a portion of the pipe segments of the second pipeline group are projected onto the horizontal plane in the two sub-regions on either side.

4. The heat dissipation structure according to claim 2, characterized in that, The support plate comprises multiple plates that are spliced ​​together and arranged in a manner, and each plate is connected to the frame structure by a corresponding fastener. A gap is defined between two adjacent plates, the gap being used to guide liquid on the support plate to the area below the support plate.

5. The heat dissipation structure according to claim 4, characterized in that, The upper surface of the plate has a plurality of spaced protrusions.

6. The heat dissipation structure according to claim 1, characterized in that, The top frame includes a plurality of crossbeams and at least one longitudinal beam; the plurality of crossbeams extend along the first direction and are distributed side by side at intervals in the second direction, and the crossbeams are fixedly connected to the top of the at least one frame; the longitudinal beam extends along the second direction; At least one longitudinal beam is fixedly connected between two adjacent crossbeams, and part of the first pipeline group is supported by the longitudinal beam.

7. The heat dissipation structure according to claim 6, characterized in that, The plurality of crossbeams include a first beam and a second beam, the first beam and the second beam being fixedly connected to the top of the at least one frame; The longitudinal beam includes a first section and a second section connected together. The first section is connected between the first beam and the second beam. The second section is located on the side of the second beam away from the first beam and extends to the outer side of the frame in the second direction. The first pipeline assembly is partially supported by the second section.

8. The heat dissipation structure according to claim 6, characterized in that, The number of racks is multiple, and the multiple racks are arranged side by side along the first direction; There are multiple longitudinal beams, and each longitudinal beam corresponds to one of the multiple frames. The longitudinal beams are located on the top of the corresponding frames.

9. The heat dissipation structure according to claim 7, characterized in that, The top frame also includes at least one pipe support seat, which corresponds one-to-one with the at least one longitudinal beam. The pipe support seat is disposed in the second section of the corresponding longitudinal beam, and part of the first pipe group is supported by the pipe support seat.

10. The heat dissipation structure according to claim 9, characterized in that, The pipe support has a slot with an upward-facing opening, and the inner wall of the slot is an arc-shaped surface that matches the shape of the outer peripheral wall of the pipe in the first pipe assembly.

11. The heat dissipation structure according to claim 7, characterized in that, Also includes: A power distribution cabinet is disposed on the support platform and located on the other side of the at least one rack in the first direction, so as to be opposite the heat exchange module in the first direction; The rack also includes a power distribution unit disposed inside the cabinet, which is connected to the power distribution cabinet via a power supply cable.

12. The heat dissipation structure according to claim 11, characterized in that, The top frame also includes at least one bracket, which corresponds one-to-one with the at least one rack. The bracket is disposed on the top of the corresponding rack and located between the first beam and the second beam. The top of the bracket has a support surface for supporting the power supply cable.

13. The heat dissipation structure according to claim 12, characterized in that, The top of the rack cabinet has a first cable pass hole, which is located on the side of the corresponding bracket away from the power distribution cabinet in the first direction. The first cable pass hole is used for the corresponding power supply cable to pass through and connect to the corresponding power distribution unit. The top of the distribution cabinet has a second cable pass hole for the power supply cable to pass through and connect to the distribution cabinet.

14. The heat dissipation structure according to claim 1, characterized in that, The heat exchange module has a first heat exchange flow path for supplying cooling medium and a second heat exchange flow path for supplying heat exchange medium. The cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to reduce the temperature of the cooling medium. The first pipeline assembly includes a first liquid supply pipeline and a first liquid return pipeline; the first liquid supply pipeline is connected to the output end of the first heat exchange flow path and is also connected to the liquid inlet of the medium flow path of the frame; the first liquid return pipeline is connected to the input end of the first heat exchange flow path and is also connected to the liquid outlet of the medium flow path. The cooling device also includes a second pipeline assembly, which is connected between the second heat exchange flow path of the heat exchange module and the cold source device, and is located on the other side of the heat exchange module in the second direction.

15. The heat dissipation structure according to claim 14, characterized in that, The first liquid supply pipeline includes a first liquid supply sub-pipeline and a second liquid supply sub-pipeline connected to each other. The first liquid supply sub-pipeline and the second liquid supply sub-pipeline extend along the first direction and are arranged side by side and spaced apart in the second direction. The first liquid supply sub-pipeline has a liquid supply inlet at one end adjacent to the heat exchange module, and the liquid supply inlet is connected to the output end of the first heat exchange flow path; the second liquid supply sub-pipeline has a liquid supply outlet, and the liquid supply outlet is connected to the liquid inlet of the medium flow path. The first return pipeline includes a first return section, which extends along the first direction; the first return section has a return inlet, which is connected to the outlet of the medium flow path.

16. The heat dissipation structure according to claim 15, characterized in that, The number of racks is multiple, and the multiple racks are arranged side by side along the first direction; The number of liquid supply outlets is multiple, and the multiple liquid supply outlets are arranged at intervals in the first direction of the second liquid supply sub-pipeline, and are connected one-to-one with the liquid inlet of the medium flow path of the multiple racks. The number of liquid return inlets is multiple, and the multiple liquid return inlets are arranged at intervals in the first direction of the first liquid return section, and are connected one-to-one with the liquid outlet of the medium flow path of the multiple frames.

17. The heat dissipation structure according to claim 15, characterized in that, The first liquid supply sub-pipeline, the second liquid supply sub-pipeline, and the first liquid return section are all supported by the top frame, and the first liquid return section is disposed between the first liquid supply sub-pipeline and the second liquid supply sub-pipeline.

18. The heat dissipation structure according to claim 15, characterized in that, The first return liquid pipeline further includes a second return liquid section and a third return liquid section connected to each other, the second return liquid section and the third return liquid section extending vertically respectively; the end of the first return liquid section away from the heat exchange module is closed, the end of the first return liquid section adjacent to the heat exchange module is connected to the first end of the second return liquid section, the second end of the second return liquid section is connected to the first end of the third return liquid section, and the second end of the third return liquid section is connected to the input end of the first heat exchange flow path.

19. The heat dissipation structure according to claim 18, characterized in that, The support platform includes a frame structure, the frame structure having a second region, the second region including three sub-regions arranged in the second direction, the three sub-regions being the middle sub-region and the two sub-regions located on both sides; The orthographic projections of the second return section and the third return section in the horizontal plane are located in the sub-region adjacent to the first supply pipeline.

20. The heat dissipation structure according to claim 14, characterized in that, The second pipeline assembly includes a second liquid supply pipeline and a second liquid return pipeline; the second liquid supply pipeline is connected to the input end of the second heat exchange flow path and is also connected to the medium output end of the cold source equipment; the second liquid return pipeline is connected to the output end of the second heat exchange flow path and is also connected to the medium return end of the cold source equipment.

21. The heat dissipation structure according to claim 20, characterized in that, The support platform includes a frame structure, the frame structure having a second region, the second region including three sub-regions arranged in the second direction, the three sub-regions being the middle sub-region and the two sub-regions located on both sides; The orthographic projection of the second supply line and the second return line in the horizontal plane is located in the sub-region on the side away from the first supply line.

22. The heat dissipation structure according to claim 14, characterized in that, The cooling equipment further includes a first power unit and a second power unit. The first power unit is connected to the first pipeline group and is used to provide power for the flow of the cooling medium. The second power unit is connected to the second pipeline group and is used to provide power for the flow of the heat exchange medium.

23. The heat dissipation structure according to claim 1, characterized in that, The support platform includes a frame structure, the frame structure having a second region, the second region including three sub-regions arranged in the second direction, the three sub-regions being the middle sub-region and the two sub-regions located on both sides; The first power unit and the second power unit of the cooling equipment are respectively located in the two sub-regions on both sides.

24. The heat dissipation structure according to claim 14, characterized in that, The cooling device further includes a liquid storage module, which includes a first liquid storage tank and a second liquid storage tank. The first liquid storage tank is connected to the first pipeline group and is used to replenish the first pipeline group with cooling medium. The second liquid storage tank is connected to the second pipeline group and is used to replenish the second pipeline group with heat exchange medium.

25. The heat dissipation structure according to claim 14, characterized in that, The cooling device further includes a pressure stabilizing module, which includes a first pressure stabilizing tank and a second pressure stabilizing tank. The first pressure stabilizing tank is connected to the first pipeline group and is used to stabilize the pressure of the first pipeline group. The second pressure stabilizing tank is connected to the second pipeline group and is used to stabilize the pressure of the second pipeline group.

26. The heat dissipation structure according to claim 1, characterized in that, The support platform includes a frame structure and a frame body, with the frame body disposed within the frame structure; wherein the liquid storage module and / or voltage stabilizing module of the cooling equipment are disposed inside the frame body.

27. The heat dissipation structure according to claim 1, characterized in that, The medium flow path includes a cooling pipe, an inlet distribution pipe, and a return distribution pipe. The cooling pipe is used to make thermal contact with the heat-generating components of the computing device to cool the heat-generating components. The liquid inlet distribution pipeline and the liquid return distribution pipeline are located on one side of the cabinet. The liquid inlet distribution pipeline has a liquid inlet and multiple liquid delivery outlets. The liquid inlet is connected to the liquid supply inlet of the first pipeline group. The multiple liquid delivery outlets are used to correspond one-to-one with the cooling pipelines of the multiple computing devices and are respectively used to connect to the input end of the cooling pipelines of the multiple computing devices. The return liquid distribution pipeline has multiple return liquid ports and multiple outlet liquid ports. The multiple return liquid ports are respectively used to correspond one-to-one with the cooling pipelines of the multiple computing devices and are respectively used to connect to the output end of the cooling pipelines of the multiple computing devices. The outlet liquid port is connected to the return liquid inlet of the first pipeline group.

28. The heat dissipation structure according to claim 27, characterized in that, The cabinet defines a first accommodating space for the integrated installation of multiple computing devices arranged vertically. The liquid inlet distribution pipeline and the liquid return distribution pipeline are respectively arranged vertically on the side of the cabinet adjacent to the first pipeline group in the second direction, and the plurality of liquid inlets and the plurality of liquid return outlets are respectively arranged vertically at intervals.

29. The heat dissipation structure according to claim 27, characterized in that, The projections of the liquid inlet distribution pipeline and the liquid return distribution pipeline in the vertical plane are located on both sides of the projections of the plurality of computing devices in the vertical plane; The plurality of liquid inlets and the plurality of liquid return outlets are distributed facing each other in the first direction, and the plurality of liquid inlets are adjacent to one side of the plurality of computing devices in the first direction, and the plurality of liquid return outlets are adjacent to the other side of the plurality of computing devices in the first direction.

30. The heat dissipation structure according to claim 27, characterized in that, The inlet is formed on the side of the inlet distribution pipe adjacent to the first pipe group in the second direction, and near the top of the inlet distribution pipe; the outlet is formed on the side of the return distribution pipe adjacent to the first pipe group in the second direction, and near the top of the return distribution pipe.

31. The heat dissipation structure according to claim 27, characterized in that, An exhaust valve is installed at the top of both the liquid inlet distribution pipe and the liquid return distribution pipe.

32. The heat dissipation structure according to claim 31, characterized in that, The exhaust port of the exhaust valve is connected to a flexible connecting pipe, which extends to the bottom of the cabinet to discharge the gas in the liquid inlet distribution pipe and the liquid return distribution pipe, respectively.

33. The heat dissipation structure according to claim 28, characterized in that, The cabinet includes a cabinet body and a shelf disposed inside the cabinet body. The shelf defines a first accommodating space, and the shelf and the cabinet body define a second accommodating space. The second accommodating space and the first accommodating space are distributed side by side in the first direction. The rack also includes multiple power distribution units, which are arranged vertically in the second accommodating space.

34. The heat dissipation structure according to claim 1, characterized in that, The number of racks is multiple, and the multiple racks are arranged side by side along the first direction; The rack also includes a top connecting plate, which is disposed on the top of the cabinet and extends above the adjacent cabinet; the top of the top connecting plate and the top of the adjacent cabinet are respectively provided with top connecting holes facing each other in the vertical direction, and the cabinet and the adjacent cabinet are fixed by fasteners passing through the top connecting holes.

35. The heat dissipation structure according to claim 1, characterized in that, The rack also includes lifting rings, which are detachably mounted on the top of the rack and are used to connect lifting ropes for moving the rack or the heat dissipation structure.

36. The heat dissipation structure according to claim 1, characterized in that, The rack also includes a bottom connecting plate, which extends downward at an angle to the outside of the bottom of the cabinet in the second direction, with the upper end of the bottom connecting plate fixed to the cabinet and the lower end of the bottom connecting plate fixed to the support platform.

37. A container, characterized in that, include: The heat dissipation structure according to any one of claims 1-36; The enclosure, wherein the heat dissipation structure is disposed inside the enclosure.

38. The container according to claim 37, characterized in that, The box body includes a frame, which protrudes upward from one side of the bottom of the box body in a second direction; The support platform is spaced apart from the frame on one side adjacent to the frame in the second direction to form a groove for drainage.

39. The container according to claim 38, characterized in that, The frame is formed with a plurality of drainage holes, which are spaced apart in the first direction.

40. A data center, characterized in that, include: The heat dissipation structure according to any one of claims 1 to 36 or the container according to any one of claims 37 to 39; Multiple computing devices are integrated and installed within the cabinet of the heat dissipation structure.

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