Antenna module and communication device

Abstract

An antenna module (100) is provided with a first substrate (130A) and a second substrate (130B) having a side surface (137) connected to the first substrate (130A). The second substrate (130B) is provided with a radiation element (121B), a ground electrode (GND2), a connection communication electrode (155) and a connection ground electrode (150) disposed on the side surface (137), and power supply wiring (171). The power supply wiring (171) is disposed in the same layer as the radiation element (121B) in the second substrate (130B). The connection ground electrode (150) is disposed so as to surround the connection communication electrode (155) on the side surface (137).

Description

Antenna Module and Communication Device

[0001] The present disclosure relates to an antenna module and a communication device.

[0002] International Publication No. 2023 / 210118 (Patent Document 1) discloses an antenna module configured by connecting a first substrate and a second substrate each having an antenna element in an L shape. In this antenna module, connection electrodes of the same size are arranged on the connection surface of the first substrate with the second substrate and the connection surface of the second substrate with the first substrate, and the two connection electrodes are connected to supply a high-frequency signal from the first substrate to the radiation element of the second substrate via the two connection electrodes.

[0003] International Publication No. 2023 / 210118

[0004] In the configuration disclosed in International Publication No. 2023 / 210118 (Patent Document 1), in order to improve the connectivity of the transmission path of the high-frequency signal, it is conceivable to increase the size of the two connection electrodes to increase the contact area between the two connection electrodes. However, simply increasing the size of the two connection electrodes alone may cause a part of the two connection electrodes to function as a stub (so-called open stub) whose tip is open and branched from the transmission path of the high-frequency signal, and the transmission characteristics of the high-frequency signal may deteriorate.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to improve the signal transmission characteristics between the first substrate and the second substrate and the connection strength between the first substrate and the second substrate in a configuration for transmitting a high-frequency signal from the first substrate to the radiation element of the second substrate.

[0006] The antenna module according to this disclosure comprises a first flat substrate including a first signal line for transmitting a first high-frequency signal, and a second flat substrate including a side surface connected to the first substrate and a first main surface and a second main surface facing each other and connected by the side surface. The second substrate comprises a first flat radiating element arranged along the first main surface, a ground electrode arranged along the second main surface in the region between the first radiating element and the second main surface, a first connecting communication electrode arranged on the side surface and connected to the first signal line of the first substrate, a first connecting ground electrode arranged on the side surface and connected to the ground electrode, and a first wiring for transmitting a first high-frequency signal from the first connecting communication electrode to the first radiating element. The first wiring is arranged in a region of the second substrate closer to the first radiating element than the ground electrode, without penetrating the ground electrode. The first connecting ground electrode is arranged on the side surface to surround the first connecting communication electrode.

[0007] The communication device described herein is equipped with an on-board antenna module.

[0008] According to this disclosure, in a configuration in which a high-frequency signal from a first substrate is transmitted to a radiating element on a second substrate, the signal transmission characteristics between the first substrate and the second substrate, and the connection strength between the first substrate and the second substrate can be improved.

[0009] This is an example of a block diagram of a communication device to which an antenna module is applied. This is a partial perspective view (1) of the antenna module. This is a side perspective view of the antenna module and a partial side view (1) of the circuit board. This is a partial perspective view (2) of the antenna module. This is a side perspective view of the antenna module and a partial side view (2) of the circuit board. This is a partial perspective view (3) of the antenna module. This is a side perspective view of the antenna module and a partial side view (3) of the circuit board. This is a partial perspective view (4) of the antenna module. This is a side perspective view of the antenna module and a partial side view (4) of the circuit board. This is a partial perspective view (5) of the antenna module and a partial side view (5) of the circuit board. This is a partial perspective view (6) of the antenna module. This is a partial side view of the antenna module. This is a side view of the antenna module. This is a diagram showing a modified arrangement of the connecting ground electrode.

[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.

[0011] (Basic Configuration of Communication Device) Figure 1 is an example of a block diagram of a communication device 10 to which the antenna module 100 according to this embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone or tablet, or a personal computer equipped with communication functions. An example of the frequency band of radio waves used in the antenna module 100 according to this embodiment is, for example, millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz and 60 GHz, but it is also applicable to radio waves in frequency bands other than those mentioned above.

[0012] Referring to Figure 1, the communication device 10 comprises an antenna module 100 and a BBIC 200 which constitutes a baseband signal processing circuit. The antenna module 100 comprises an RFIC 110 which is an example of a power supply circuit and an antenna device 120. The communication device 10 upconverts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and downconverts the high-frequency signal received by the antenna device 120 and processes the signal with the BBIC 200.

[0013] The antenna device 120 includes a dielectric substrate 105 having a substrate 130A (first substrate) and a substrate 130B (second substrate). At least one radiating element is arranged on each of the substrates 130A and 130B. In Figure 1, one example configuration is shown in which four radiating elements 121A are arranged on substrate 130A and four radiating elements 121B are arranged on substrate 130B, but the number of radiating elements arranged on each substrate is not limited to this. Substrate 130A does not need to have any radiating elements 121A. Also, in Figure 1, an example is shown in which the radiating elements are arranged in a one-dimensional array in a single row on each of the substrates 130A and 130B, but the radiating elements may be arranged in a two-dimensional array on each of the substrates 130A and 130B. Alternatively, each substrate may have a single radiating element. In this embodiment, the radiating elements 121A and 121B are patch antenna elements having a substantially square flat plate shape.

[0014] The RFIC 110 comprises switches 111A to 111H, 113A to 113H, 117A, and 117B, power amplifiers 112AT to 112HT, low-noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase shifters 115A to 115H, signal combiners / distributors 116A and 116B, mixers 118A and 118B, and amplification circuits 119A and 119B. Of these, the configuration of switches 111A to 111D, 113A to 113D, 117A, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, signal combiner / distributor 116A, mixer 118A, and amplification circuit 119A constitutes the circuit for the high-frequency signal radiated from the radiating element 121A on the circuit board 130A. Furthermore, the configuration of switches 111E-111H, 113E-113H, 117B, power amplifiers 112ET-112HT, low-noise amplifiers 112ER-112HR, attenuators 114E-114H, phase shifters 115E-115H, signal combiner / distributor 116B, mixer 118B, and amplification circuit 119B constitutes a circuit for high-frequency signals radiated from the radiating element 121B on the substrate 130B.

[0015] When transmitting a high-frequency signal, switches 111A to 111H and 113A to 113H are switched to the power amplifier 112AT to 112HT side, and switches 117A and 117B are connected to the transmitting amplifiers of the amplification circuits 119A and 119B. When receiving a high-frequency signal, switches 111A to 111H and 113A to 113H are switched to the low-noise amplifier 112AR to 112HR side, and switches 117A and 117B are connected to the receiving amplifiers of the amplification circuits 119A and 119B.

[0016] The signal transmitted from the BBIC200 is amplified by amplification circuits 119A and 119B and upconverted by mixers 118A and 118B. The upconverted high-frequency signal, the transmitted signal, is split into four by signal combiners / distributors 116A and 116B, and passes through the corresponding signal paths to supply power to different radiating elements 121A and 121B. By individually adjusting the phase shift of the phase shifters 115A to 115H placed in each signal path, the directivity of the radio waves output from the radiating elements on each board can be adjusted. In addition, attenuators 114A to 114D adjust the strength of the transmitted signal.

[0017] The received signals, which are high-frequency signals received by each radiating element 121A and 121B, are transmitted to the RFIC 110 and combined in the signal combiners / distributors 116A and 116B via four different signal paths. The combined received signals are down-converted by the mixers 118A and 118B, further amplified by the amplification circuits 119A and 119B, and then transmitted to the BBIC 200.

[0018] The RFIC 110 is formed, for example, as a single-chip integrated circuit component including the above circuit configuration. Alternatively, the devices corresponding to each radiating element 121A, 121B in the RFIC 110 (switch, power amplifier, low-noise amplifier, attenuator, phase shifter) may be formed as a single-chip integrated circuit component for each corresponding radiating element.

[0019] (Antenna Module Configuration) Next, the configuration of the antenna module 100 in this embodiment will be described in detail with reference to Figures 2 and 3.

[0020] Figure 2 is a partial perspective view of the antenna module 100. As described above, the antenna module 100 includes substrates 130A and 130B, each having a flat plate shape. Substrates 130A and 130B are, for example, multilayer resin substrates formed by laminating multiple resin layers made of resins such as epoxy and polyimide, multilayer resin substrates formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, and multilayer resin substrates formed by laminating multiple resin layers made of fluororesin. Note that substrates 130A and 130B do not necessarily have a multilayer structure and may be single-layer substrates.

[0021] The substrate 130A (first substrate) is a flat substrate including two opposing main surfaces 131 and 132. The substrate 130A includes signal lines 141 for transmitting high-frequency signals from the RFIC 110 to the substrate 130B. Note that the detailed configuration of the substrate 130A is not shown in Figure 2 and Figure 3 described later.

[0022] The substrate 130B (second substrate) includes a side surface 137 and two main surfaces 135 and 136 that face each other and are connected by the side surface 137. In the following description, the normal direction of the main surface 132 of substrate 130A is the Z-axis direction, the normal direction of the main surface 135 of substrate 130B is the X-axis direction, and the direction perpendicular to the Z-axis direction and the X-axis direction is the Y-axis direction.

[0023] In the antenna module 100, the side surface 137 of the substrate 130B is connected by soldering to the positive X-axis end of the main surface 132 of the substrate 130A. As a result, the cross-sectional shape of the substrates 130A and 130B when viewed from the Y-axis direction is approximately L-shaped.

[0024] The substrate 130B includes a flat-shaped radiating element 121B arranged along the main surface 135 of the substrate 130B. In the following description, an example is given in which the radiating element 121B is arranged inside the substrate 130B, but the radiating element 121B may also be arranged so as to be exposed on the main surface 135 of the substrate 130B.

[0025] Figure 3 shows a side perspective view of the antenna module 100 as seen from the Y-axis direction (left figure (A)), and a partial side view of the substrate 130B as seen from the Z-axis direction (right figure (B)). As described above, the antenna module 100 includes substrates 130A and 130B.

[0026] In addition to the radiating element 121B described above, the substrate 130B includes a ground electrode GND2, a connecting ground electrode 150, a connecting communication electrode 155, and a power supply wiring 171.

[0027] The ground electrode GND2 is a flat-plate-shaped ground electrode positioned along the main surface 136 in the region between the radiating element 121B and the main surface 136.

[0028] The connecting ground electrode 150 is located in the negative Y-axis end region of the side surface 137 of the substrate 130B and is connected by soldering to the connecting ground electrode 160 located on the main surface 132 of the substrate 130A.

[0029] The connecting communication electrode 155 is located on the side surface 137 of the substrate 130B and is connected by solder to the connecting communication electrode 165 located on the main surface 132 of the substrate 130A. The connecting communication electrode 165 located on the main surface 132 of the substrate 130A is connected to the signal line 141 of the substrate 130A. As a result, the connecting communication electrode 155 is connected to the signal line 141 of the substrate 130A.

[0030] The power supply wiring 171 connects the connection communication electrode 155 to the power supply point SP1 of the radiating element 121B. As a result, the high-frequency signal from the RFIC 110 is transmitted to the power supply point SP1 of the radiating element 121B via the signal line 141 and connection communication electrode 165 on the substrate 130A, the connection communication electrode 155 on the substrate 130B, and the power supply wiring 171.

[0031] As shown in Figure 2, the radiating element 121B has a roughly square shape when viewed from the X-axis direction, but a notch 125 is formed in the center of the side located in the negative Y-axis direction, recessed toward the positive Y-axis direction. In this embodiment, the tip of the notch 125 becomes the feed point SP1 of the radiating element 121B. The feed point SP1 of the radiating element 121B is located at a position offset from the center of the radiating element 121B in the negative Y-axis direction. As a result, when a high-frequency signal is supplied to the feed point SP1 of the radiating element 121B, radio waves with the Y-axis direction as the polarization direction are radiated from the radiating element 121B in the positive X-axis direction.

[0032] The connection communication electrodes 155 and power supply wiring 171 of the substrate 130B are arranged in a region of the substrate 130B that is closer to the radiating element 121B than to the ground electrode GND2. More specifically, the connection communication electrodes 155 and power supply wiring 171 of the substrate 130B are arranged in the same layer of the substrate 130B where the radiating element 121B is arranged. The power supply wiring 171 is arranged in the same layer as the radiating element 121B and connected to the radiating element 121B without penetrating the ground electrode GND2. As a result, the power supply wiring 171 is not unnecessarily long compared to the case where the power supply wiring 171 is arranged in a region further from the radiating element 121B than to the ground electrode GND2 and penetrates the ground electrode GND2, thereby improving the signal transmission characteristics from the substrate 130A to the radiating element 121B of the substrate 130B.

[0033] Furthermore, the connecting ground electrode 150 is positioned on the side surface 137 so as to surround the connecting communication electrode 155. More specifically, the connecting ground electrode 160 is positioned so as to surround the connecting communication electrode 155 in three directions (positive X-axis, negative X-axis, and negative Y-axis). This makes it easier for the connecting ground electrode 150 to block the influence of ambient noise on the connecting communication electrode 155, compared to the case where the connecting ground electrode 150 is positioned in only one direction around the connecting communication electrode 155 and does not surround it, thereby improving the signal transmission characteristics. In addition, a larger area can be secured for the solder connection between substrate 130A and substrate 130B, thereby improving the connection strength between substrate 130A and substrate 130B.

[0034] Furthermore, the connecting ground electrode 160 has portions that contact the three edges (the edge located in the positive direction of the X-axis, the edge located in the negative direction of the X-axis, and the edge located in the negative direction of the Y-axis) of the side surface 137 around the connecting communication electrode 155. This allows for a larger solder connection area between substrate 130A and substrate 130B, thereby improving the connection strength between substrate 130A and substrate 130B.

[0035] As described above, in the antenna module 100 according to this embodiment, in a configuration in which a high-frequency signal from the substrate 130A is transmitted to the radiating element 121B of the substrate 130B, the signal transmission characteristics between the substrate 130A and the substrate 130B, and the connection strength between the first substrate and the second substrate can be improved.

[0036] In this embodiment, the "substrate 130A" and the "signal line 141" may correspond to the "first substrate" and the "first signal line" in this disclosure, respectively.

[0037] In this embodiment, "substrate 130B," "side surface 137," "main surface 135," and "main surface 136" may correspond to "second substrate," "side surface," "first main surface," and "second main surface" in this disclosure, respectively.

[0038] The "radiating element 121B", "ground electrode GND2", "connection communication electrode 155", "connection ground electrode 150", and "power supply wiring 171" in the present embodiment may respectively correspond to the "first radiating element", "ground electrode", "first connection communication electrode", "first connection ground electrode", and "first wiring" in the present disclosure.

[0039] (Modification Example 1) The antenna module 100 according to the above-described embodiment was a so-called single-band type, but the antenna module may be a so-called dual-band type.

[0040] FIG. 4 is a partial perspective view of the antenna module 100A according to the present modification example 1. The antenna module 100A is obtained by changing the substrates 130A and 130B of the above-described antenna module 100 to substrates 130AA and 130BA, respectively.

[0041] FIG. 5 is a side perspective view (left figure (A)) when the antenna module 100A according to the present modification example 1 is viewed from the Y-axis direction, and a partial side view (right figure (B)) of the substrate 130BA when the antenna module 100A is viewed in a perspective manner from the Z-axis direction.

[0042] The substrate 130AA is obtained by adding a signal line 142 and a connection communication electrode 166 to the above-described substrate 130A. The signal line 142 is a signal line for transmitting a high-frequency signal from the RFIC 110 to the substrate 130BA. A high-frequency signal having a frequency lower than that of the signal line 141 is supplied from the RFIC 110 to the signal line 142.

[0043] The substrate 130BA is obtained by adding a radiating element 122B, a connection communication electrode 156, and a power supply wiring 172 to the above-described substrate 130B.

[0044] The radiating element 122B is a patch antenna element having a flat plate shape that is disposed in a region between the ground electrode GND2 and the radiating element 121B on the substrate 130BA and is disposed parallel to the radiating element 121B. The size of the radiating element 122B is larger than the size of the radiating element 121B.

[0045] The connection communication electrode 156 and the power supply wiring 172 are arranged in the region between the ground electrode GND2 and the radiating element 121B on the substrate 130BA. More specifically, the connection communication electrode 156 and the power supply wiring 172 are arranged in the same layer as the layer where the radiating element 121B is arranged on the substrate 130BA. And the power supply wiring 172 is arranged in the same layer as the radiating element 121B without penetrating the ground electrode GND2 and is connected to the radiating element 122B. Thereby, compared with the case where the power supply wiring 172 is arranged in the region farther from the radiating element 122B than the ground electrode GND2 and penetrates the ground electrode GND2, the power supply wiring 172 is suppressed from becoming unnecessarily long, so that the signal transmission characteristics from the substrate 130AA to the radiating element 122B of the substrate 130BA can be improved.

[0046] Further, the connection ground electrode 150 is arranged on the side surface 137 of the substrate 130BA so as to surround both of the connection communication electrodes 155 and 156 in three directions (the positive direction of the X axis, the negative direction of the X axis, and the negative direction of the Y axis). Thereby, since it becomes easy to block the influence of noise from the surroundings on the connection communication electrodes 155 and 156 by the connection ground electrode 150, the signal transmission characteristics to the radiating elements 121B and 122 can be improved. In addition, similar to the first embodiment described above, since a large area of the solder connection between the substrate 130A and the substrate 130B can be secured, the connection strength between the substrate 130A and the substrate 130B can be improved.

[0047] As described above, the present disclosure can also be applied to the so-called dual-band type antenna module 100A.

[0048] The "substrate 130AA" and the "signal line 142" in the first modification example 1 can respectively correspond to the "first substrate" and the "second signal line" in the present disclosure.

[0049] The "substrate 130BA", the "radiating element 122B", the "connection communication electrode 156", and the "power supply wiring 172" in the first modification example 1 can respectively correspond to the "second substrate", the "second radiating element", the "second connection communication electrode", and the "second wiring" in the present disclosure.

[0050] (Modification 2) In the above-described embodiment or Modification 1, the connecting communication electrode 155 and the radiating element 121B are connected via a power supply wiring 171 arranged on the same layer as the radiating element 121B. However, the connecting communication electrode 155 and the radiating element 121B may be connected via a power supply wiring and power supply vias arranged on a different layer from the radiating element 121B.

[0051] Figure 6 is a partial perspective view of the antenna module 100B according to this modification 2. Antenna module 100B is the same as antenna module 100A according to modification 1 described above, but with the substrate 130BA replaced by substrate 130BB.

[0052] Figure 7 shows a side perspective view of the antenna module 100B according to this modified example 2, viewed from the Y-axis direction (left figure (A)), and a partial side view of the substrate 130BB, viewed from the Z-axis direction of the antenna module 100A (right figure (B)).

[0053] The substrate 130BB is obtained by changing the radiating element 121B of the substrate 130BA to the radiating element 121BB, and changing the power supply wiring 171 of the substrate 130BA to power supply wiring 171a and power supply via 171b.

[0054] The radiating element 121BB has a substantially square shape when viewed from the X-axis direction. The radiating element 121BB does not have a notch like the notch 125 of the radiating element 121B described above.

[0055] The power supply wiring 171a is located in the layer between the radiating element 121BB and the radiating element 122B on the substrate 130BA. In other words, the power supply wiring 171a is located in a different layer from the layer on which the radiating element 121BB is located.

[0056] The power supply via 171b extends in the X-axis direction and connects the power supply wiring 171a to the power supply point of the radiating element 121BB.

[0057] As described above, the connecting communication electrode 155 and the radiating element 121BB may be connected via power supply wiring 171a and power supply via 171b, which are located in the region between the radiating element 121BB and the radiating element 122B.

[0058] In this modified example 2, the "power supply wiring 171a" and "power supply via 171b" may correspond to the "first power supply line" and "first power supply via" in this disclosure, respectively.

[0059] (Modification 3) In the above embodiment, power is supplied from the power supply wiring 171 to the radiating element 121B by directly connecting the end of the power supply wiring 171 to the radiating element 121B. However, power may be supplied from the power supply wiring 171 to the radiating element 121B without contact by capacitive coupling between the electrode placed at the end of the power supply wiring 171 and the radiating element 121B.

[0060] Figure 8 is a partial perspective view of the antenna module 100C according to this modification 3. Antenna module 100C is the same as antenna module 100B according to modification 2 described above, but with the substrate 130BB replaced by substrate 130BC.

[0061] Figure 9 shows a side perspective view of the antenna module 100C according to this modified example 3, viewed from the Y-axis direction (left figure (A)), and a partial side view of the substrate 130BC, viewed from the Z-axis direction (right figure (B)).

[0062] The substrate 130BC is the same as the substrate 130BB described above, with the addition of a capacitive power supply electrode 171c.

[0063] The capacitive power supply electrode 171c is positioned at the end of the power supply via 171b in the positive X-axis direction. The capacitive power supply electrode 171c does not contact the radiating element 121BB, but it supplies power to the power supply point of the radiating element 121BB non-contact by capacitive coupling with the radiating element 121BB.

[0064] As described above, a capacitive power supply electrode 171c may be placed at the end of the combination of the power supply wiring 171a and the power supply via 171b, and power may be supplied to the radiating element 121BB without contact by capacitive coupling of the capacitive power supply electrode 171c and the radiating element 121BB.

[0065] In this modified example 3, the "combination of power supply wiring 171a and power supply via 171b" and the "capacitive power supply electrode 171c" can correspond to the "first power supply line" and the "capacitive power supply electrode" in this disclosure, respectively.

[0066] (Modification 4) Although the antenna module 100 in the above-described embodiment was a so-called single-polarization type, the antenna module may also be a so-called dual-polarization type.

[0067] Figure 10 is a partial perspective view of the antenna module 100D according to this modification 4. The antenna module 100D is the same as the antenna module 100A according to the modification 1 described above, but with the substrates 130AA and 130BA replaced by substrates 130AD and 130BD.

[0068] Figure 11 shows a side perspective view of the antenna module 100D according to this modified example 4, viewed from the Y-axis direction (left figure (A)), and a partial side view of the substrate 130BD, viewed from the Z-axis direction (right figure (B)).

[0069] The circuit board 130AD is the same as the circuit board 130AA described above, with the addition of signal lines 141D and 142D. Signal line 141D is a signal line for transmitting a high-frequency signal with the same frequency as the high-frequency signal transmitted by signal line 141. Signal line 142D is a signal line for transmitting a high-frequency signal with the same frequency as the high-frequency signal transmitted by signal line 142.

[0070] The substrate 130BD is the same as the substrate 130BA described above, but with the radiating elements 121B and 122B replaced by radiating elements 121BD and 122BD, respectively, and further with the addition of a connecting ground electrode 150D, connecting communication electrodes 155D and 156D, and power supply wiring 171D and 172D.

[0071] The connecting ground electrode 150D is positioned in the end region on the positive Y-axis side of the side surface 137 of the substrate 130BD and is connected by solder to a connecting ground electrode (not shown) positioned on the main surface 132 of the substrate 130A. Furthermore, the connecting ground electrode 160D is positioned to surround the three directions (positive X-axis, negative X-axis, and positive Y-axis) around the connecting communication electrodes 155D and 156D.

[0072] The connecting communication electrodes 155D and 156D are connected to the signal lines 141D and 142D of the circuit board 130AD, respectively.

[0073] The radiating element 121BD is a dual-polarization type patch antenna element. The feed line 171 connects the connecting communication electrode 155 to the first feed point of the radiating element 121BD. A high-frequency signal from the signal line 141 of the substrate 130AD is transmitted to the first feed point of the radiating element 121BD via the connecting communication electrode 155 and the feed line 171, causing the radiating element 121BD to emit a radio wave of a first frequency with the Y-axis direction as the polarization direction in the positive X-axis direction.

[0074] The power supply wiring 171D connects the connection communication electrode 155D to the second power supply point of the radiating element 121BD. A high-frequency signal from the signal line 141D of the substrate 130AD is transmitted to the second power supply point of the radiating element 121BD via the connection communication electrode 155D and the power supply wiring 171D, causing the radiating element 121BD to emit a first frequency radio wave with polarization in the Z-axis direction in the positive X-axis direction.

[0075] The radiating element 122BD is also a dual-polarization type patch antenna element. The size of the radiating element 122BD is larger than the size of the radiating element 122BD.

[0076] The power supply wiring 172D connects the connecting communication electrode 156D to the first power supply point of the radiating element 122BD. A high-frequency signal from the signal line 142D of the substrate 130AD is transmitted to the first power supply point of the radiating element 122BD via the connecting communication electrode 156D and the power supply wiring 172D, causing the radiating element 122BD to emit radio waves of a second frequency with polarization in the Y-axis direction in the positive X-axis direction.

[0077] The power supply wiring 172 connects the connecting communication electrode 156 to the second power supply point of the radiating element 122BD. A high-frequency signal from the signal line 142 of the substrate 130AD is transmitted to the second power supply point of the radiating element 122BD via the connecting communication electrode 156 and the power supply wiring 172, causing the radiating element 122BD to emit radio waves of a second frequency with polarization in the Z-axis direction in the positive X-axis direction.

[0078] By using an antenna module 100D with the above configuration, it is possible to support so-called dual polarization.

[0079] In this modified example 4, the "substrate 130AD" and "signal line 141D" may correspond to the "first substrate" and "second signal line" in this disclosure, respectively.

[0080] In this modified example 4, the "substrate 130BD," "connection communication electrode 155D," "connection ground electrode 150D," and "power supply wiring 171D" may correspond to the "second substrate," "second connection communication electrode," "second connection ground electrode," and "second wiring" in this disclosure, respectively.

[0081] (Modification 5) Modification 5 describes a configuration in which the antenna module is miniaturized by fitting the protrusion of one substrate into the recess of the other substrate.

[0082] Figure 12 is a partial perspective view of the antenna module 100E according to this modification 5. The antenna module 100E is the antenna module 100C according to the above-described modification 3, with the substrates 130AA and 130BC replaced by substrates 130AE and 130BE.

[0083] Figure 13 is a partial side view of the antenna module 100E according to this modified example 5, as seen from the X-axis direction.

[0084] At the end of the main surface 132 of the substrate 130AE in the positive X-axis direction, a recess is formed that extends in the positive Z-axis direction and penetrates to the main surface 131.

[0085] A protrusion is formed in the center of the side surface 137 of the substrate 130BE in the Y-axis direction, projecting in the positive Z-axis direction. As a result, when the substrate 130BE is viewed from above in the X-axis direction, the substrate 130BE has a roughly T-shape. The protrusion of the substrate 130BE fits into the recess of the substrate 130AE and is fitted into the recess of the substrate 130AE.

[0086] As shown in Figure 13, when the substrate 130BE is viewed from above in the X-axis direction, a portion of the radiating elements 121B and 122B of the substrate 130BE is located on the protruding portion of the substrate 130BE. In other words, when the substrate 130BE is viewed from above in the X-axis direction, a portion of the radiating elements 121B and 122B of the substrate 130BE overlaps with the substrate 130AE.

[0087] By adopting this configuration, the dimensions of the substrate 130BE in the Z-axis direction can be reduced, thereby enabling miniaturization of the device.

[0088] The antenna module 100E shown in Figures 12 and 13 is a so-called dual-band type antenna module. However, it is not essential that it be a dual-band type antenna module; the configuration of Modified Example 5 can also be applied to a single-band type antenna module as shown in Figures 2 and 3. Furthermore, the configuration of Modified Example 5 can also be applied to a dual-band and dual-polarization antenna module as shown in Figures 10 and 11.

[0089] (Modification 6) In this Modification 6, an example of an array antenna in which multiple substrates 130BE of Modification 5 are arranged in the Y-axis direction will be described.

[0090] Figure 14 is a side view of the antenna module 100F according to this modified example 6, as seen from the X-axis direction. The antenna module 100F includes a substrate 130AE and a plurality of substrates 130BE. At the end of the substrate 130AE in the positive direction of the X-axis, a plurality of recesses are arranged in the Y-direction at predetermined distances apart. The protrusions of the plurality of substrates 130BE are arranged to fit into the plurality of recesses of the substrate 130AE, respectively.

[0091] In the array-type antenna module 100F shown in Figure 14, the device can be miniaturized in the same way as in the modified example 5 described above.

[0092] (Modification 7) In the above-described embodiment 1, the connecting ground electrode 160 is arranged on the side surface 137 of the substrate 130B (second substrate) so as to surround the connecting communication electrode 155 in three directions. However, the arrangement of the connecting ground electrode 160 is not limited to this. For example, the connecting ground electrode 160 may be arranged so as to surround the entire circumference of the connecting communication electrode 155.

[0093] Figure 15 shows a modified arrangement of the connecting ground electrode 160. In addition, Figure 15 shows an example in which two connecting communication electrodes 155 and 156 are arranged on the side surface 137 of the substrate 130B.

[0094] As shown on the left side of Figure 15, the connecting ground electrode 160 may be positioned to surround the entire circumference of both the two connecting communication electrodes 155 and 156. This makes it easier for the connecting ground electrode 150 to block the influence of ambient noise on the connecting communication electrodes 155 and 156, thereby improving the signal transmission characteristics to the radiating elements 121B and 122B.

[0095] As shown on the right side of Figure 15, the connecting ground electrode 160 may be positioned to surround the entire circumference of each of the two connecting communication electrodes 155 and 156. Specifically, the connecting ground electrode 160 may be positioned to include a first portion 161 that surrounds the entire circumference of both connecting communication electrodes 155 and 156, and a second portion 162 that is connected to the first portion 161 and positioned in the region between the connecting communication electrodes 155 and 156. This improves the signal transmission characteristics to the radiating elements 121B and 122B, and also improves the isolation between the radiating elements 121B and 122B.

[0096] In this modified example 5, “Part 1 161” and “Part 2 162” may correspond to “Part 1” and “Part 2” in this disclosure, respectively.

[0097] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope of the claims are intended to be included.

[0098] 10 Communication equipment, 100, 100A-100F Antenna module, 105 Dielectric substrate, 111A-113H, 117A, 117B Switch, 112AR-112DR, 112ER-112HR Low-noise amplifier, 112AT-112DT, 112ET-112HT Power amplifier, 114A-114H Attenuator, 115A-115H Phase shifter, 116A, 116B Distributor, 118A, 118B Mixer, 119A, 119B Amplifier circuit, 120 Antenna equipment, 121A, 121B, 121BB, 121BD, 122, 122B, 122BD Radiating element, 125 Notches, 130A, 130AA, 130AD, 130AE Substrate (first substrate), 130B, 130BA, 130BB, 130BC, 130BD, 130BE Substrate (second substrate), 131, 132, 135, 136 Main surface, 137 Side surface, 141, 141D, 142, 142D Signal lines, 150, 150D, 160, 160D Connecting ground electrodes, 155, 155D, 156, 156D, 165, 166 Connecting communication electrodes, 161 First part, 162 Second part, 171, 171D, 171a, 172, 172D Power supply wiring, 171b Power supply via, 171c Capacitive power supply electrode, GND2 Ground electrode.

Claims

1. An antenna module comprising: a first flat substrate including a first signal line for transmitting a first high-frequency signal; a second flat substrate including a side surface connected to the first substrate and a first main surface and a second main surface facing each other and connected by the side surface, wherein the second substrate comprises: a first flat radiating element disposed along the first main surface; a ground electrode disposed along the second main surface in the region between the first radiating element and the second main surface; a first connecting communication electrode disposed on the side surface and connected to the first signal line of the first substrate; a first connecting ground electrode disposed on the side surface and connected to the ground electrode; and a first wiring for transmitting the first high-frequency signal from the first connecting communication electrode to the first radiating element, wherein the first wiring is disposed in the region of the second substrate closer to the first radiating element than the ground electrode without penetrating the ground electrode, and the first connecting ground electrode is disposed on the side surface so as to surround the first connecting communication electrode.

2. The antenna module according to claim 1, wherein the second substrate is a laminate whose stacking direction is the normal direction to the first main surface, and the first wiring is arranged in the same layer on the second substrate as the layer on which the first radiating element is arranged.

3. The antenna module according to claim 1, wherein the second substrate is a laminate with the direction of lamination as the normal direction to the first main surface, and the first wiring includes a first feed line arranged in the layer between the first radiating element and the ground electrode, and a first feed via extending in the direction of normal to the first main surface.

4. The antenna module according to claim 1, wherein the second substrate is a laminate with the direction of lamination as the normal direction to the first main surface, and the first wiring includes a first feed line disposed in the layer between the first radiating element and the ground electrode, and a capacitive feed electrode for non-contact transmission of the first high-frequency signal from the first feed line to the first radiating element.

5. The antenna module according to claim 1, wherein the first substrate has a recess formed in the direction normal to the side surface, the second substrate includes a convex portion that protrudes from the side surface in the direction normal to the side surface and is disposed in the recess of the first substrate, and at least a part of the first radiating element is disposed in the convex portion.

6. The antenna module according to claim 1, wherein a plurality of combinations of the first signal line on the first substrate and the first radiating element, the first connecting communication electrode, the first connecting ground electrode, and the first wiring on the second substrate are arranged in a predetermined direction.

7. The antenna module according to claim 1, wherein the first substrate further includes a second signal line for transmitting a second high-frequency signal, the second substrate further comprises a flat plate-shaped second radiating element disposed in the region of the second substrate between the ground electrode and the first radiating element and disposed parallel to the first radiating element, a second connecting communication electrode disposed on the side and connected to the second signal line of the first substrate, and a second wiring connecting the second connecting communication electrode and the second radiating element, wherein the second wiring is disposed in the region of the second substrate between the ground electrode and the first radiating element without penetrating the ground electrode, the first wiring is disposed in the region of the second substrate between the ground electrode and the first radiating element without penetrating the ground electrode, and the first connecting ground electrode is disposed to surround the first connecting communication electrode and the second connecting communication electrode.

8. The antenna module according to claim 1, wherein the first wiring transmits the first high-frequency signal from the first connection communication electrode to the first feed point of the first radiating element, the first substrate further includes a second signal line for transmitting the first high-frequency signal, the second substrate comprises a second connection communication electrode disposed on the side and connected to the second signal line of the first substrate, a second connection ground electrode disposed on the side and connected to the ground electrode, and a second wiring for transmitting the first high-frequency signal from the second connection communication electrode to the second feed point of the first radiating element, the second wiring is disposed in a region of the second substrate closer to the first radiating element than the ground electrode without penetrating the ground electrode, and the second connection ground electrode is disposed to surround the second connection communication electrode.

9. The antenna module according to claim 7 or 8, wherein the first connecting ground electrode is arranged to surround the entire circumference of the first connecting communication electrode and the second connecting communication electrode.

10. The antenna module according to claim 9, wherein the first connecting ground electrode includes a first portion arranged to surround the entire circumference of the first connecting communication electrode and the second connecting communication electrode, and a second portion connected to the first portion and arranged in the region between the first connecting communication electrode and the second connecting communication electrode.

11. A communication device equipped with an antenna module according to any one of claims 1 to 8.

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