Communication module
The communication module addresses high-frequency signal transmission losses by using conductive paste and convex portions to connect IC chip electrodes directly to substrate electrodes, ensuring stable and miniaturized signal transmission for 5G and 6G systems.
WO2026110654A1PCT designated stage Publication Date: 2026-05-28MURATA MFG CO LTD
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Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2025-11-10
- Publication Date
- 2026-05-28
Smart Images
Figure JP2025039303_28052026_PF_FP_ABST
Abstract
This communication module includes: a substrate; an IC chip including a high-frequency circuit disposed on the substrate; an electrode provided to a surface of the IC chip facing the substrate; a substrate electrode provided at a location on the substrate that overlaps the electrode; a conductive member provided to the substrate electrode and formed of a conductive paste; and a protrusion provided at the substrate conductive-member periphery. An electrode of the IC chip is connected to the substrate electrode via the conductive member.
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