Power module and power device
By adopting a pluggable power section and drive section design in the power module, the problem of the drive circuit being susceptible to parasitic impedance is solved, achieving efficient assembly and reliable operation, and improving the switching characteristics and maintainability of the power module.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- HUAWEI DIGITAL POWER TECH CO LTD
- Filing Date
- 2025-05-14
- Publication Date
- 2026-06-04
AI Technical Summary
In existing power modules, the drive circuit is easily affected by parasitic impedance and signals, resulting in poor switching characteristics. At the same time, the increased number of pins makes assembly more difficult and maintenance more inconvenient.
The power and drive sections are designed with pluggable connections. The signal pins are pluggable to the printed circuit board, and the drive circuit is located on the printed circuit board. This shortens the drive path, reduces parasitic inductance, and supports the separate lead-out of high-current power pins and low-current signal pins.
It improves the switching characteristics and assembly efficiency of power devices, reduces maintenance costs, enhances the maintainability and operational reliability of power modules, and reduces the impact of thermal coupling.
Smart Images
Figure CN2025094866_04062026_PF_FP_ABST
Abstract
Description
A power module and power device
[0001] Cross-reference to related applications
[0002] This application claims priority to Chinese Patent Application No. 202411756509.9, filed on November 29, 2024, entitled "A Power Module and Power Device", the entire contents of which are incorporated herein by reference. Technical Field
[0003] This application relates to the field of power electronics technology, and in particular to a power module and power device. Background Technology
[0004] A power module is a functional module that combines power devices according to certain functions and then packages them into a whole. It is widely used in power equipment such as servo motors, frequency converters, or inverters. With the rapid development of electrification and digitalization in the energy industry, the application market for power modules has increased significantly.
[0005] Switching of power devices requires a driver circuit. Currently, the driver circuit is usually located on an external circuit board, connecting the power device to the outside of the power module via pins to achieve interconnection between the power device and the driver circuit. However, with this interconnection method, the driver circuit is particularly susceptible to parasitic impedance and signal interference, thus affecting the switching characteristics of the power device. Furthermore, as the number of power devices in a power module increases, the number of pins used for connection to the driver circuit also increases, leading to increased assembly difficulty between the power module and the external circuit board. Summary of the Invention
[0006] This application provides a power module and power device to improve the assembly efficiency of power devices and drive circuits while ensuring the switching characteristics of power devices, thereby improving the power density of power devices.
[0007] Firstly, this application provides a power module comprising a power section and a drive section. The power section includes a power chip, a package, and signal pins, with the package encapsulating the power chip. The signal pins are electrically connected to the power chip. The drive section includes a printed circuit board and a drive circuit, with the drive circuit disposed on the printed circuit board. The signal pins are pluggably connected to the printed circuit board and electrically connected to the drive circuit, which provides a drive level to the power chip via the signal pins. By employing the power module design provided in this application, the power section and drive section are interconnected in a pluggable manner. This not only enables rapid assembly of the power section and drive section, allowing them to be used as a single unit, but also allows the power section to be used independently, meeting various application requirements in different scenarios. Furthermore, it facilitates shortening the drive path from the drive circuit to the power chip, reducing parasitic inductance and thus minimizing oscillations to ensure the switching characteristics of the power chip. Furthermore, it facilitates the modification of parameters in the drive circuit within the drive section, as well as the repair and replacement of components in both the power and drive sections. This improves the maintainability of the power module, increases yield, and reduces maintenance costs. Moreover, the separate structure of the power and drive sections effectively reduces thermal coupling between them, thereby mitigating the impact of temperature rise in the power section on the drive section and enhancing the operational reliability of the drive circuit.
[0008] To facilitate pluggable connection between the signal pins and the printed circuit board, in one possible implementation of this application, a portion of the signal pins is located outside the package, thereby bringing the signal ports of the power chip outside the package. Additionally, the printed circuit board includes sockets, and the signal pins are pluggable to these sockets.
[0009] Additionally, the wall of the socket can be covered with a conductive layer, which is electrically connected to the drive circuit. This allows the drive circuit to be routed to the socket via the conductive layer, enabling electrical connection between the signal pins and the drive circuit when the pins are plugged into the socket. This reduces the path length from the power chip to the drive circuit, thereby reducing parasitic inductance and improving the switching characteristics of the power chip.
[0010] In one possible implementation of this application, the portion of the signal pin located outside the package includes a spring contact, which elastically abuts against the conductive layer when inserted into the socket. This improves the contact reliability between the signal pin and the conductive layer, enabling a reliable electrical connection between the signal pin and the drive circuit. It also enhances the ease of insertion and removal of the signal pin from the printed circuit board, thereby improving the assembly and disassembly efficiency of the power unit and the drive unit.
[0011] In one possible implementation of this application, the driving circuit includes a driving chip and passive components, which are disposed on the surface of a printed circuit board. The driving chip and passive components are electrically connected through internal traces on the printed circuit board to form a driving loop.
[0012] In this application, along the direction from the driver chip to the printed circuit board, the projection of the driver chip covers at least a portion of the projection of the socket. This facilitates a shorter path between the driver chip and the socket, thereby reducing parasitic impedance.
[0013] Furthermore, in this application, the opening of the socket and the driver chip can be located on different surfaces of the printed circuit board. This facilitates the connection between the signal pins and the socket, and also helps to achieve miniaturization of the power module design.
[0014] In one possible implementation of this application, the power unit further includes a power pin electrically connected to the power chip, and the power pin is configured to support a current value greater than that supported by the signal pin. This allows the power pin to be used for the flow of large currents, thereby achieving the power conversion function.
[0015] In this application, the signal pins and power pins extend from different ends of the package. This helps reduce mutual interference between the signal pins and power pins, thereby improving the operational stability of the power module.
[0016] In one possible implementation of this application, the projection of the signal pin is located within the outline of the package projection along the thickness direction of the power section. This reduces the coupling between the signal pin and the power pin, thereby reducing mutual signal interference, and also facilitates the miniaturization design of the power module.
[0017] Secondly, this application also provides a power device, which includes a housing and a power module from the first aspect, the power module being housed within the housing. In the power device provided by this application, the high assembly efficiency and maintainability of the power module's power section and drive section improve the maintainability of the power device, thereby improving its power density. Attached Figure Description
[0018] Figure 1 is a schematic diagram of a photovoltaic power generation system provided in an embodiment of this application;
[0019] Figure 2 is a simplified structural diagram of a power device provided in an embodiment of this application;
[0020] Figure 3 is a schematic diagram of a power module provided in an embodiment of this application;
[0021] Figure 4 is a structural schematic diagram of the power module shown in Figure 3 from another angle;
[0022] Figure 5 is a driving circuit system architecture diagram of a power module provided in an embodiment of this application;
[0023] Figure 6 is an exploded view of the architecture shown in Figure 5;
[0024] Figure 7 is a schematic diagram of a drive section of the power module shown in Figure 3;
[0025] Figure 8 is a cross-sectional view of a drive unit provided in an embodiment of this application;
[0026] Figure 9 is a schematic diagram of a power section in the power module shown in Figure 3;
[0027] Figure 10 is a schematic diagram of another structure of the power section of the power module provided in the embodiment of this application.
[0028] Reference numerals: 1000-Photovoltaic module; 2000-Inverter; 3000-Transformer; 4000-Grid; 5000-Load; 100-Power device; 10-Housing; 20-Circuit board; 30-Power module; 1-Power section; 101-Power chip; 102-Package; 103-Signal pin; 104-Power pin; 2-Drive section; 201-Printed circuit board; 2011-Internal wiring; 202-Drive circuit; 2021-Drive chip; 2022-Passive component; 203-Jack. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.
[0030] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0031] Power devices are widely used in photovoltaic power generation systems, energy storage systems, and powertrain systems of new energy vehicles to convert current or voltage in these systems. Power devices can include inverters, microinverters, or optimizers in photovoltaic power generation systems; converters in energy storage systems; motor controllers, on-board chargers (OBCs), or microcontroller units (MCUs) in the powertrains of new energy vehicles; or blade power supplies for power stations.
[0032] Taking a photovoltaic (PV) power generation system as an example, Figure 1 is a schematic diagram of an application scenario of the PV power generation system provided in this application embodiment. The PV power generation system includes a PV module 1000, an inverter 2000, and a transformer 3000. The PV module 1000 is a DC power supply composed of solar cells connected in series or parallel, used to convert the energy of sunlight into DC electrical energy. The inverter 2000 is a DC-to-AC power device that converts the DC power output from the PV module 1000 into AC power for output to the transformer 3000. The transformer 3000 then transforms the AC power output from the inverter 2000 and connects it to the AC power grid 4000, thereby achieving grid connection of the PV power generation system. Alternatively, the AC power output from the inverter 2000 can be supplied to a load 5000 to power the load 5000.
[0033] Figure 2 is a simplified structural diagram of a power device provided in an embodiment of this application. Referring to Figure 2, the power device 100 may include a housing 10, a circuit board 20 housed within the housing 10, and a power module 30, which is electrically connected to the circuit board 20. The power module 30 is the core component of the power device 100 that enables power conversion; it may contain various power devices, which are connected in a certain functional combination and then packaged into a single unit using a packaging process.
[0034] Circuit board 20 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex PCB, etc. The drive circuits for the power devices in the power module 30 are typically located on circuit board 20. Multiple ports of the power devices can be led out to the outside of the power module 30 via pins to achieve electrical connection with the drive circuit on circuit board 20. Due to the relatively long trace length from the power device to the drive circuit, when the power of the power device is high, the drive circuit is particularly susceptible to parasitic impedance and signal interference, thus affecting the switching characteristics of the power device. Furthermore, as the number of power devices in the power module 30 increases, the number of pins electrically connected to circuit board 20 also increases, significantly increasing the assembly difficulty of the power module 30 and circuit board 20, thereby affecting the assembly efficiency of the power module 30 and circuit board 20.
[0035] To address these issues, intelligent power modules (IPMs) have been proposed. These modules integrate power devices and drive circuits to reduce parasitic interference from external traces, thereby improving the switching characteristics of the power devices and increasing assembly efficiency. However, the integrated design of intelligent power modules results in higher costs. Furthermore, since both the power devices and drive circuits are packaged, the parameters of the drive circuit are difficult to adjust, and failure of either the drive circuit or the power device will render the entire power module unusable. In addition, high-power devices generate significant heat, which can cause the temperature of the driving components in the drive circuit to rise. If this temperature exceeds the maximum tolerance of the driving components, it can lead to malfunctions in the drive circuit.
[0036] In view of this, the power module provided in this application interconnects the power section and the drive section by splicing them together. This reduces the impact of parasitics on the drive circuit, improves the assembly efficiency and maintainability of the power section and the drive section, and effectively improves the thermal coupling phenomenon in the power module, thereby ensuring the reliable operation of the power module. To facilitate understanding of the solution provided in this application, a detailed description will be given below with reference to specific embodiments.
[0037] Figure 3 is a schematic diagram of a power module provided in an embodiment of this application. As shown in Figure 3, in this application, the power module includes two parts: a power unit 1 and a driving unit 2. The power unit 1 includes a power chip 101 and a package 102. The package 102 encapsulates the power chip 101 to protect it.
[0038] In this application, the power chip 101 may include an integrated circuit (IC) chip, an insulated gate bipolar transistor (IGBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), a diode, or a power transistor. Furthermore, the package form of the power chip 101 may be, but is not limited to, a small outline package (SOP), a dual in-line package (DIP), a quad flat no-leads package (QFN), a quad flat package (QFP), or a ball grid array package (BGA).
[0039] This application does not limit the packaging form of the power unit 1. Exemplary examples include housing packaging, molding packaging, or embedded packaging. Housing packaging is a method that uses a housing and a substrate carrying the power chip 101 and other power devices to form a cavity, and then fills the cavity with encapsulation materials such as silicone gel to form a package to protect the power devices. Molding packaging involves placing the substrate carrying the power chip 101 and other power devices into a dedicated injection mold, using softened epoxy resin or other molding compound as the package, and encapsulating the power devices under certain pressure and temperature conditions to protect the internal components. Embedded packaging involves embedding the power chip 101 and other power devices into a substrate, and using vias, copper pillars, and traces to achieve interconnection. Since the packaging processes for these various packaging forms are relatively mature, they will not be described in detail here.
[0040] Referring again to FIG3, the power unit 1 further includes a signal pin 103, which is electrically connected to the power chip 101. In the embodiment shown in FIG3, a portion of the signal pin 103 is located outside the package 102, thereby bringing the signal port of the power chip 101 to the outside of the package 102. This facilitates testing of the power unit 1 using the signal pin 103.
[0041] It is understood that the number of signal pins 103 can be the same as the number of signal ports of the power chip 101, so that the signal pins 103 and signal ports are connected in a one-to-one correspondence, thereby leading each signal port of the power chip 101 to the outside of the package 102, so as to realize the electrical connection between the power chip 101 and the external circuit.
[0042] In this embodiment, the driving unit 2 includes a printed circuit board (PCB) 201 and a driving circuit 202, wherein the driving circuit 202 is disposed on the PCB 201. Referring to FIG4, which is a structural schematic diagram of the power module shown in FIG3 from another angle, the signal pin 103 of the power unit 1 is pluggably connected to the PCB 201, and the driving circuit 202 is electrically connected to the signal pin 103 to provide a driving level to the power chip 101, thereby driving and controlling the switching of the power chip 101 and performing related functional control.
[0043] Referring to Figure 5, which is a driving circuit system architecture diagram of a power module provided in an embodiment of this application. Also referring to Figure 6, which is an exploded view of the architecture shown in Figure 5. In the embodiments shown in Figures 5 and 6, the power chip 101 of the power unit 1 is arranged in a half-bridge circuit configuration to achieve interconnection with the driving circuit 202 of the driving unit 2. In other possible embodiments of this application, the power chip 101 of the power unit 1 may also be arranged in other ways, such as a boost chopper circuit or a buck converter circuit, which can be designed according to actual needs.
[0044] As shown in Figure 7, Figure 7 is a schematic diagram of the drive section of the power module shown in Figure 3. In this application, the drive circuit 202 may include a drive chip 2021 and passive components 2022. The passive components 2022 may include, for example, resistors, capacitors, or inductors. The drive chip 2021 and the passive components 2022 may be disposed on the surface of the printed circuit board 201. Furthermore, the drive chip 2021 and the passive components 2022 may be electrically connected through internal traces (not shown in Figure 7) of the printed circuit board 201 to form a drive circuit.
[0045] It is understood that the driver chip 2021 can provide a drive level to the power chip 101 through the passive component 2022. This application does not limit the correspondence between the driver chip 2021 and the power chip 101. For example, one driver chip 2021 can provide a drive level to multiple power chips 101, or the driver chip 2021 and the power chip 101 can be electrically connected in a one-to-one correspondence, which can be specifically configured according to the actual function to be implemented.
[0046] To enable the signal pin 103 to be inserted into the printed circuit board 201, a socket 203 can be provided at the end of the printed circuit board 201. Additionally, referring to FIG8, a cross-sectional view of a driving section provided in an embodiment of this application, it can be used to illustrate the connection relationship between the driving circuit 202 and the socket 203. As can be seen from FIG8, the driving circuit 202 can be connected to the socket 203 via internal traces 2011 of the printed circuit board 201, thereby leading the driving circuit 202 to the socket 203.
[0047] It is understood that the signal pins 103 of the power unit 1 can be inserted into the sockets 203 and electrically connected to the drive circuit 202 through the sockets 203. Therefore, in this application, the number of sockets 203 can be the same as the number of signal pins 103, so that the signal pins 103 can be inserted into each socket 203 in a one-to-one correspondence.
[0048] Referring to Figures 7 and 8, in this application, along the direction from the driver chip 2021 to the printed circuit board 201, the projection of the driver chip 2021 covers at least a portion of the projection of the socket 203. This facilitates the shortening of the path from the driver chip 2021 to the socket 203, thereby shortening the path of the entire drive circuit and reducing the parasitic impedance of the drive circuit.
[0049] In addition, as shown in Figure 8, in this embodiment, the opening of the socket 203 and the driver chip 2021 are located on different surfaces of the printed circuit board 201, so as to facilitate the connection between the signal pin 103 and the socket 203, and to facilitate the miniaturization design of the power module.
[0050] It is worth noting that in the embodiment shown in Figure 8, the passive component 2022 and the driver chip 2021 are located on the same surface of the printed circuit board 201. However, in other possible embodiments of this application, the passive component 2022 and the driver chip 2021 may also be located on different surfaces of the printed circuit board 201. They can all be configured according to specific usage and design needs, and are not limited herein.
[0051] In this application, the wall of the socket 203 may be covered with a conductive layer, such as a copper layer, so that the driving circuit 202 can be electrically connected to the conductive layer. Alternatively, the driving chip 2021 can be electrically connected to the conductive layer through the passive component 2022. Thus, when the signal pin 103 is inserted into the socket 203, the signal pin 103 abuts against the conductive layer, thereby achieving electrical connection with the driving circuit 202. This facilitates a shorter driving path between the driving chip 2021 and the power chip 101, reducing parasitic driving inductance and thus reducing oscillations, thereby improving the operational stability of the power module.
[0052] In one possible embodiment of this application, the portion of the signal pin 103 located outside the package 102 includes a spring contact that elastically abuts against the conductive layer when inserted into the socket 203. This improves the contact reliability between the signal pin 103 and the conductive layer, thereby achieving a reliable electrical connection between the signal pin 103 and the drive circuit 202, and also enhances the ease of insertion and removal of the signal pin 103 from the printed circuit board 201.
[0053] Figure 9 is a schematic diagram of a power section in the power module shown in Figure 3. As shown in Figure 9, in this embodiment, each signal pin 103 of the power section 1 is located on the same side of the package 102, which facilitates the one-to-one connection of each signal pin 103 with each socket 203 of the drive section 2.
[0054] Referring again to Figure 9, the power unit 1 also includes a power pin 104, which is also electrically connected to the power chip 101. In this application, the power pin 104 is used to support a current value greater than that supported by the signal pin 103. Therefore, the power pin 104 can be used for the flow of large currents, such as currents above 100A, for power conversion. Conversely, the signal pin 103 can be used for the flow of small currents, such as currents below 10A, for receiving drive signals.
[0055] Referring again to Figure 9, in this embodiment, the signal pin 103 and power pin 104 of the power unit 1 are respectively led out from two opposite ends of the package 102. This facilitates the insertion and removal of the signal pin 103 from the drive unit 2, while also reducing mutual interference between the signal pins 103 and 104 of the power unit 1, thereby improving the operational stability of the power module.
[0056] In other possible embodiments, the signal pins 103 and 104 of the power unit 1 can also be led out to the outside of the package 102 in other possible ways. For example, in the power unit 1 shown in FIG. 10, the direction in which the signal pins 103 of the power unit 1 are led out from the package 102 is perpendicular to the direction in which the power pins 104 are led out from the package 102. Specifically, the signal pins 103 can be led out to the outside of the package 102 along the thickness direction of the power unit 1. Therefore, in the thickness direction of the power unit 1, the projection of the signal pins 103 is located within the outline of the projection of the package 102. This application refers to this type of signal pin 103 lead-out as top lead-out. In this embodiment, the driving unit 2 and the power unit 1 can be stacked. This reduces the coupling between the signal pins 103 and 104, thereby reducing mutual signal interference, and also facilitates the miniaturization design of the power module.
[0057] It is understood that in this application, the signal pin 103 and power pin 104 of the power unit 1 are led out from different ends of the package 102, which helps to reduce signal interference between the signal pin 103 and the power pin 104 and facilitates the miniaturization design of the power module.
[0058] In addition, the portion of the signal pin 103 of the power unit 1 located outside the package 102 can be bent in any direction, and can be rationally designed according to the relative positional relationship between the power unit 1 and the drive unit 2. These are not listed individually here, but should all be understood to fall within the protection scope of this application.
[0059] In the above embodiments, the pluggable connection between the signal pin 103 and the printed circuit board 201 is described using the example of the signal pin 103 extending outside the package 102 and the printed circuit board 201 including the socket 203. However, the pluggable connection between the signal pin 103 and the printed circuit board 201 is not limited to this. For example, in one possible embodiment, the signal pin 103 can be configured as a recess, while a protrusion electrically connected to the drive circuit 202 is provided on the surface of the printed circuit board 201, so that the pluggable connection between the signal pin 103 and the printed circuit board 201 is achieved by inserting the protrusion into the recess. In other possible embodiments, the signal pin 103 and the printed circuit board 201 can also be pluggable in any other possible way, which will not be listed here, but should all be understood to fall within the protection scope of this application.
[0060] Because the power unit 1 and drive unit 2 of the power module provided in this application are configured as separate structures, it facilitates the shortening of the drive path between the drive chip 2021 and the power chip 101, thereby reducing drive parasitic inductance and oscillation, thus ensuring the switching characteristics of the power chip 101. Furthermore, it facilitates the modification of parameters of the drive circuit 202 in the drive unit 2, as well as the repair and replacement of components in the power unit 1 and drive unit 2, thereby improving the maintainability of the power module, increasing yield, and reducing maintenance costs. Moreover, the separate structure of the power unit 1 and drive unit 2 effectively reduces thermal coupling between them, thereby reducing the impact of temperature rise in the power unit 1 on the drive unit 2, and improving the operational reliability of the drive circuit 202.
[0061] In addition, by adopting the power module design provided in this application, the power unit 1 and the drive unit 2 are interconnected in a pluggable manner, which not only enables the rapid assembly of the power unit 1 and the drive unit 2 so that the power unit 1 and the drive unit 2 can be used as a whole after assembly, but also allows the power unit 1 to be used alone, so as to meet various usage requirements in different scenarios.
[0062] It is worth mentioning that when the power module provided in this application is applied to a power device, the power module can be placed inside the housing of the power device, and the power pins 104 of the power section 1 of the power module can be directly connected to passive devices such as capacitors to achieve power conversion. This can help reduce the space occupied by the power module inside the housing, so as to accommodate more power modules without changing the size of the power device, thereby improving the power density of the power device.
[0063] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between different embodiments are consistent and can be referenced in each other. Technical features in different embodiments can be combined to form new embodiments based on their inherent logical relationships.
[0064] It is worth mentioning that the chip 102 packaging solution described above in this application can be used not only for power module packaging, but also for other module packaging involving chips or other devices, such as the packaging of RF chips and power amplifiers in the antenna field, or intelligent control devices in the field of artificial intelligence, or the packaging of central processing units (CPUs) and graphics processing units (GPUs) in servers, etc., which will not be listed here one by one.
[0065] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A power module, characterized in that, It includes a power unit and a drive unit, wherein: The power unit includes a power chip, a package, and signal pins; the package encapsulates the power chip; the signal pins are electrically connected to the power chip. The driving unit includes a printed circuit board and a driving circuit, the driving circuit being disposed on the printed circuit board; the signal pin is pluggably connected to the printed circuit board, and the signal pin is electrically connected to the driving circuit; the driving circuit is used to provide a driving level to the power chip through the signal pin.
2. The power module as described in claim 1, characterized in that, The signal pin is located outside the package; the printed circuit board includes a socket, and the signal pin is pluggably connected to the socket.
3. The power module as described in claim 2, characterized in that, The wall of the socket is covered with a conductive layer, which is electrically connected to the drive circuit.
4. The power module as described in claim 3, characterized in that, The portion of the signal pin located outside the package includes a spring, which elastically abuts against the conductive layer when inserted into the socket.
5. The power module as described in any one of claims 2 to 4, characterized in that, The driving circuit includes a driving chip and passive components, which are disposed on the surface of the printed circuit board; and the driving chip and the passive components are electrically connected through internal traces of the printed circuit board.
6. The power module as described in claim 5, characterized in that, Along the direction from the driver chip to the printed circuit board, the projection of the driver chip covers at least a portion of the projection of the socket.
7. The power module as described in claim 5 or 6, characterized in that, The opening of the socket and the driver chip are located on different surfaces of the printed circuit board.
8. The power module according to any one of claims 1 to 7, characterized in that, The power unit further includes a power pin, which is electrically connected to the power chip. The power pin supports a current value that is greater than the current value supported by the signal pin.
9. The power module as described in claim 8, characterized in that, The signal pin and the power pin extend from different ends of the package.
10. The power module as described in claim 9, characterized in that, Along the thickness direction of the power section, the projection of the signal pin lies within the outline of the projection of the package.
11. A power device, characterized in that, It includes a housing and a power module as described in any one of claims 1 to 10, wherein the power module is housed within the housing.