Omnidirectional ceiling-mounted antenna, preparation method therefor, and electronic device

Abstract

The present disclosure relates to the technical field of communications, and provides an omnidirectional ceiling-mounted antenna, a preparation method therefor, and an electronic device. The omnidirectional ceiling-mounted antenna of the present disclosure comprises a reflector plate, a radiating structure, and a feeding structure, wherein the reflector plate is connected to the radiating structure by means of a first connection structure, and planes in which the reflector plate and the radiating structure are respectively located define a certain included angle; and the feeding structure is electrically connected to the radiating structure by means of a first via extending through the reflector plate.

Description

Omnidirectional ceiling-mounted antenna and its fabrication method, electronic equipment Technical Field

[0001] This disclosure belongs to the field of communication technology, specifically relating to an omnidirectional ceiling antenna and its manufacturing method, as well as electronic equipment. Background Technology

[0002] With the continuous advancement of wireless communication technology, wireless communication devices are increasingly being applied to all aspects of people's lives. Current antenna systems can be broadly categorized into outdoor and indoor types. Extensive coverage of outdoor base stations by various operators has gradually been established, 5G users continue to grow, and 5G services such as high-definition video streaming, Virtual Reality (VR), Augmented Reality (AR), smart healthcare, and smart factories are developing rapidly. On the other hand, analysis shows that in the 5G era, indoor voice traffic accounts for 69.7%, and data traffic reaches as high as 90%. Outdoor base stations alone cannot meet the demands of users' high-traffic services. Therefore, deep indoor coverage determines the future direction of 5G user development and has become the focus of operators' 5G network construction at this stage.

[0003] Indoor ceiling-mounted antennas are an important solution for indoor antenna deployment. Currently, the electrical performance of antennas is no longer the "bottleneck" for indoor coverage. Due to the aesthetic issues of indoor antennas, coupled with some residents' deep misunderstandings and strong resistance to electromagnetic radiation, antenna deployment has not yet achieved true in-home coverage. Indoor coverage in residential areas is basically achieved by outdoor antennas.

[0004] In recent years, operators and antenna manufacturers have begun to explore the use of transparent antennas to address aesthetic concerns. For example, transparent antennas are already being used to replace outdoor spotlight antennas. However, no indoor transparent antennas have yet been released. This is because indoor antennas have higher aesthetic requirements, are more complex to design, and traditional indoor antennas are inexpensive, while transparent antennas are more expensive. These factors limit research into indoor transparent antennas. Therefore, the key challenge in achieving large-scale commercialization of indoor transparent antennas lies in balancing performance, aesthetics, and cost. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide an omnidirectional ceiling antenna and its manufacturing method, as well as an electronic device.

[0006] This disclosure provides an omnidirectional ceiling-mounted antenna, which includes a reflector, a radiating structure, and a feeding structure; wherein the reflector and the radiating structure are connected by a first connecting structure, and the planes in which the two are located have a certain angle; the feeding structure is electrically connected to the radiating structure through a first through-hole penetrating the reflector.

[0007] The radiating structure includes a first dielectric substrate and a radiating component disposed on the first dielectric substrate; the power supply structure is connected to the radiating component.

[0008] The radiating component includes a first substrate disposed on the first dielectric substrate, a radiating portion disposed on the side of the first substrate facing away from the first dielectric substrate, and a first adhesive layer for bonding the first substrate to the first dielectric substrate.

[0009] The radiating assembly further includes a second adhesive layer disposed between the radiating portion and the first substrate.

[0010] The radiating part is made of copper foil.

[0011] The radiation component further includes a protective film or encapsulation layer disposed on the side of the radiation portion away from the first dielectric substrate.

[0012] The radiating part includes a main body and a connecting part connected to the main body; the connecting part is connected to the feeding structure.

[0013] The main body includes a conductive mesh.

[0014] The main body has a first window recessed toward its center, and the connecting part is connected to the first window and extends in a direction away from the center of the main body.

[0015] It also includes multiple branches connecting the main body, and the multiple branches are symmetrically arranged with the extension direction of the connecting part as the axis of symmetry.

[0016] The power supply structure includes a transmission cable; the transmission cable includes a first transmission end and a second transmission end; the first transmission end passes through the first via and is connected to the radiation structure, and the shielding layer of the transmission cable is fixedly connected to the reflector at the first transmission end position through a second connection structure.

[0017] The power supply structure includes a transmission cable;

[0018] The omnidirectional ceiling antenna further includes a third connection structure; the third connection structure includes a first connection component and a second connection component; the first connection component has a hollow portion, the second connection component has a first connection through hole, the first connection component and the second connection component are connected, and the hollow portion communicates with the first connection through hole; the third connection structure is sleeved on the outside of the transmission cable through the hollow portion and the first connection through hole, and the second connection component is fixed on the side of the reflector away from the radiation structure.

[0019] The third connection structure further includes a third connection component disposed at the end of the first connection component away from the second connection component. The third connection component is installed inside the hollow part and is used to fix the transmission cable to the first connection component.

[0020] The first connection structure includes at least one fourth connection component; the fourth connection component includes a first part and a second part that are interconnected; the first part is connected to the radiating structure, and the second part is connected to the reflector.

[0021] This disclosure provides a method for fabricating an omnidirectional ceiling-mounted antenna as described in any of the preceding embodiments, wherein the method includes:

[0022] Provide a reflector and a feeding structure;

[0023] A radiating structure is formed, and the reflector and the radiating structure are connected by a first connecting structure. The plane where the reflector is located and the plane where the radiating structure is located have a certain angle. The power feeding structure is electrically connected to the radiating structure through a first through-hole penetrating the reflector.

[0024] The formation of the radiating structure includes: providing a first dielectric substrate and forming a radiating component on the first dielectric substrate;

[0025] The step of forming the radiating component on the first dielectric substrate includes:

[0026] Provide the first substrate;

[0027] A first conductive thin film is sputtered onto the first substrate, and a pattern including a radiating portion is formed by a patterning process.

[0028] The first substrate with the radiating portion is flipped over, and a first adhesive layer and a release film are sequentially formed on the side of the first substrate away from the radiating portion.

[0029] Remove the release film and attach the first adhesive layer to the first dielectric substrate.

[0030] The formation of the radiating structure includes: providing a first dielectric substrate and forming a radiating component on the first dielectric substrate;

[0031] The step of forming the radiating component on the first dielectric substrate includes:

[0032] Provide the first substrate;

[0033] A first conductive film is sputtered onto the first substrate as a seed layer, the seed layer is electroplated to form a first conductive layer, and a pattern including a radiating portion is formed on the first conductive layer by a patterning process.

[0034] The first substrate with the radiating portion is flipped over, and a first adhesive layer and a release film are sequentially formed on the side of the first substrate away from the radiating portion.

[0035] Remove the release film and attach the first adhesive layer to the first dielectric substrate.

[0036] The formation of the radiating structure includes: providing a first dielectric substrate and forming a radiating component on the first dielectric substrate;

[0037] The step of forming the radiating component on the first dielectric substrate includes:

[0038] Provide the first substrate;

[0039] A second adhesive layer is formed on the first substrate, and a copper foil is formed on the side of the second adhesive layer opposite to the first substrate. The copper foil is patterned to include a radiating portion by a patterning process.

[0040] The first substrate with the radiating portion is flipped over, and a first adhesive layer and a release film are sequentially formed on the side of the first substrate away from the radiating portion.

[0041] Remove the release film and attach the first adhesive layer to the first dielectric substrate.

[0042] Before flipping the first substrate with the radiating portion, the method further includes:

[0043] A protective film or encapsulation layer is formed on the side of the radiating portion that is away from the first substrate.

[0044] Before flipping the first substrate with the radiating portion, the method further includes:

[0045] The step of blackening the radiating part.

[0046] This disclosure discloses an electronic device that includes any of the omnidirectional ceiling antennas described above. Attached Figure Description

[0047] Figure 1 is a schematic diagram of the structure of an omnidirectional ceiling antenna according to an embodiment of this disclosure.

[0048] Figure 2 is an exploded view of an omnidirectional ceiling antenna according to an embodiment of this disclosure.

[0049] Figure 3 is a cross-sectional view of the radial structure according to an embodiment of this disclosure.

[0050] Figure 4 is a cross-sectional view of a radiating component according to an embodiment of the present disclosure.

[0051] Figure 5 is a top view of the radiating section according to an embodiment of this disclosure.

[0052] Figure 6 is a top view of the conductive mesh according to an embodiment of the present disclosure.

[0053] Figure 7 shows a brightness comparison between copper materials that have undergone blackening treatment and those that have undergone blackening treatment.

[0054] Figure 8 is a flowchart of the first method for preparing the radiative structure according to an embodiment of this disclosure.

[0055] Figure 9 is a flowchart of the second method for preparing the radiative structure according to an embodiment of this disclosure.

[0056] Figure 10 is a cross-sectional view of another radiating component according to an embodiment of this disclosure.

[0057] Figure 11 is a schematic diagram of the connection between the transmission cable and the second connection structure according to an embodiment of this disclosure.

[0058] Figure 12 is a schematic diagram of the connection between the transmission cable and the reflector in an embodiment of this disclosure.

[0059] Figure 13 is a schematic diagram of the third connection structure according to an embodiment of this disclosure.

[0060] Figure 14 is a schematic diagram of the first connection structure of this disclosure connecting the radiating structure and the reflector.

[0061] Figure 15 is a gain simulation diagram of the omnidirectional ceiling antenna according to an embodiment of this disclosure.

[0062] Figure 16 is a simulation diagram of the non-circularity of the omnidirectional ceiling antenna of this embodiment in the 900MHz frequency band.

[0063] Figure 17 is a simulation diagram of the non-circularity of the omnidirectional ceiling antenna of this embodiment in the 1800-D frequency band. Detailed Implementation

[0064] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0065] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0066] Figure 1 is a structural schematic diagram of an omnidirectional ceiling-mounted antenna according to an embodiment of the present disclosure; Figure 2 is an exploded view of an omnidirectional ceiling-mounted antenna according to an embodiment of the present disclosure; as shown in Figures 1 and 2, an embodiment of the present disclosure provides an omnidirectional ceiling-mounted antenna, which includes a reflector 2, a radiating structure 1, and a feeding structure 3. The reflector 2 and the radiating structure 1 are connected by a first connecting structure 4, and the planes in which they are located have a certain angle. The feeding structure 3 is electrically connected to the radiating structure 1 through a first through-hole penetrating the reflector 2.

[0067] It should be noted that in Figure 1, only the plane containing reflector 2 and the plane containing radiating structure 1 are orthogonal, that is, the angle between their planes is 90°. However, it should be understood that the plane containing reflector 2 and the plane containing radiating structure 1 are not necessarily orthogonal. For example, the angle between their planes can be 90° ± 15°.

[0068] The omnidirectional ceiling-mounted antenna in this embodiment includes only three main parts: a reflector 2, a radiating structure 1, and a feeding structure 3. The radiating structure 1 adopts a planar structure that is orthogonal to the reflector 2, which is simple and can reduce the cost of the antenna.

[0069] The omnidirectional ceiling antenna of the present disclosure will now be described in detail.

[0070] First, the radiation structure 1 will be explained in detail.

[0071] First example: Figure 3 is a cross-sectional view of the radiating structure 1 according to an embodiment of the present disclosure; as shown in Figure 3, the radiating structure 1 includes a first dielectric substrate 11 and a radiating component 12 disposed on the first dielectric substrate 11. The radiating component 12 is connected to the feeding structure 3.

[0072] In one example, FIG4 is a cross-sectional view of a radiating component 12 according to an embodiment of the present disclosure. As shown in FIG4, the radiating component 12 includes at least a first substrate 121, a radiating portion 122 disposed on the side of the first substrate 121 facing away from the first dielectric substrate 11, and a first adhesive layer 123 disposed on the side of the first substrate 121 facing away from the radiating portion 122, connecting the first substrate 121 and the first dielectric substrate 11. Further, a protective film 124 may be disposed on the side of the radiating portion 122 facing away from the first dielectric substrate 11 to isolate water and oxygen and prevent oxidation of the radiating portion 122. Additionally, before the radiating component 12 is bonded to the first dielectric substrate 11, a release film 125 is disposed on the side of the first adhesive layer 123 of the radiating component 12 facing away from the first substrate 121. The release film 125 can be removed when the radiating component 12 is bonded to the first dielectric substrate 11. In some examples, an encapsulation layer may also be disposed on the side of the radiating portion 122 facing away from the first dielectric substrate 11, in which case the protective film 124 is not required. The encapsulation layer can be made of transparent optical adhesive (OCA) or transparent oxide, such as silicon dioxide. The thickness of the encapsulation layer is approximately a few micrometers to tens of micrometers.

[0073] The radiating part 122 can be made of metal, such as copper; the thickness of the radiating part 122 is not less than three times the skin depth, preferably not less than 2.5 μm, to ensure the antenna's radiation performance. The first substrate 121 is preferably made of a material with low haze, high transmittance, and temperature and corrosion resistance, such as polyethylene terephthalate (PET), polyimide (PI), polymers of cycloolefin (COP), and poly1,4-cyclohexylene dimethylene terephthalate (PCT). PET is preferred for cost considerations. The first adhesive layer 123 is specifically made of transparent optical adhesive.

[0074] Further, Figure 5 is a top view of the radiating part 122 according to an embodiment of this disclosure; as shown in Figure 5, the radiating part 122 specifically includes a main body 1221 and a connecting part 1222 connecting the main body 1221. The connecting part 1222 is connected to the feed structure 3, for example, the connecting part 1222 and the feed structure 3 are connected by soldering. The main body 1221 may specifically include a conductive mesh, which helps to improve light transmittance, thereby improving the antenna's concealment. For the connecting part 1222 of the radiating part 122, since the connecting part 1222 serves as a connector between the radiating part 122 and the feed structure 3, a solid structure is adopted to ensure a stable connection between the radiating part 122 and the feed structure 3. In addition, the protective film 124 on the radiating assembly 12 only covers the main body 1221, and there is no protective film 124 covering the connecting part 1222, thus exposing the location where the radiating part 122 connects to the feed structure 3.

[0075] In some examples, Figure 6 is a top view of a conductive mesh according to an embodiment of the present disclosure. As shown in Figure 6, the conductive mesh may include multiple first conductive lines 601 and second conductive lines 602 arranged in a crisscrossing manner. Each first conductive line 601 is arranged side-by-side along a first direction and extends along a second direction; each second conductive line 602 is arranged side-by-side along the first direction and extends along a third direction. For example, the extension directions of the first conductive lines 601 and second conductive lines 602 of the conductive mesh may be perpendicular to each other, thus forming a square or rectangular cutout. Of course, the extension directions of the first conductive lines 601 and second conductive lines 602 of the conductive mesh may not be perpendicular. For example, the angle between the extension directions of the first conductive lines 601 and second conductive lines 602 is 45°, thus forming a rhomboid cutout. Of course, the shape of the cutout of the conductive mesh may also be a triangle or other polygons, etc. In this case, the conductive mesh is not limited to only including conductive lines in two extension directions. Specific settings can be made according to the specific shape. In this embodiment of the present disclosure, the conductive mesh may include multiple first conductive lines 601 and second conductive lines 602 arranged in a crisscrossing manner as an example.

[0076] In this embodiment, the ends of the first conductive line 601 and the second conductive line 602 of the conductive mesh are connected together, meaning the outer perimeter of the metal mesh forms a closed loop structure. In actual products, the ends of the first conductive line 601 and the second conductive line 602 of the conductive mesh may also be unconnected, meaning the outer perimeter of the conductive mesh is radial. In this embodiment, using a conductive mesh can achieve a light transmittance of approximately 70%-88% for the transparent antenna.

[0077] In some examples, the linewidth, line thickness, and line spacing of the first conductive line 601 and the second conductive line 602 of the conductive mesh are preferably the same, but they can also be different. For example, the linewidth W1 of the first conductive line 601 and the second conductive line 602 are both about 2-30 μm, the line spacing W2 is about 5-200 μm, and the line thickness is about 1-10 μm. It can be understood that the sheet resistance and transmittance can be adjusted by changing the linewidth, line thickness, and line spacing of the first conductive line 601 and the second conductive line 602. Therefore, the linewidth, line thickness, and line spacing of the first conductive line 601 and the second conductive line 602 of the conductive mesh can be specifically designed according to the sheet resistance and transmittance requirements.

[0078] In some examples, the conductive mesh can be made of metal. In this embodiment, copper is used as the material for the conductive mesh. To further improve the concealment of the conductive mesh, the copper surface can be blackened after the conductive mesh is formed, which will also reduce the brightness of the copper, as shown in Figure 7.

[0079] Furthermore, the main body 1221 of the radiating part 122 has a first window 100 recessed towards its center, and a connecting part 1222 is connected to the first window 100 and extends in a direction away from the center of the main body 1221. The connecting part 1222 has a first side and a second side disposed opposite to each other along its extending direction, and a third side and a fourth side connecting the first and second sides and disposed opposite to each other. The first side of the connecting part 1222 is connected to the main body 1221; the third and fourth sides of the connecting part 1222 are both spaced apart from the edge of the first window 100. This arrangement is because, since the connecting part 1222 is not protected by a protective film 124, spacing the third and fourth sides of the connecting part 1222 from the edge of the first window 100 prevents external water and oxygen from corroding the main body 1221, thus avoiding the problem of breakage due to oxidation in the conductive mesh of the main body 1221. The distance between the third and fourth sides of the connecting part 1222 and the edge of the first window 100 depends on the bonding accuracy of the protective film 124. Generally, the distance is greater than 1.5 times the bonding error of the protective film 124.

[0080] In some examples, continuing to refer to Figure 5, the radiating part 122 includes not only the main body 1221 and the connecting part 1222 connecting the main body 1221, but also a plurality of branches 1223 connecting the main body 1221. The plurality of branches 1223 are symmetrically arranged about the extension direction of the connecting part 1222 as an axis of symmetry. The arrangement of the branches 1223 extends the current path, reduces the size of the radiating structure 1, and achieves a miniaturized antenna design. The symmetrical arrangement of the plurality of branches 1223 about the extension direction of the connecting part 1222 is to reduce the non-circularity of the antenna pattern.

[0081] In some examples, the material of the first dielectric substrate 11 includes, but is not limited to, polycarbonate (PC), polymers of cycloolefin (COP), or acrylic / plexiglass (PMMA).

[0082] For the radiating structure 1 of this example, this embodiment also provides a method for preparing the radiating structure 1.

[0083] First method: Figure 8 is a flowchart of the preparation of the radiation structure 1 according to the first method of this disclosure; as shown in Figure 8, the preparation method of the radiation structure 1 specifically includes:

[0084] S11, Provide a first substrate 121.

[0085] S12. A first conductive film is sputtered on the first substrate 121, and a photoresist layer is formed on the side of the first conductive film away from the first substrate 121. The photoresist layer is then exposed and developed. After that, the first conductive film is etched to remove the remaining photoresist from the photoresist layer, thus completing the fabrication of the radiating part 122.

[0086] The main body 1221 of the radiating part 122 formed in step S12 is a conductive mesh structure, and the connecting part 1222 is a solid structure.

[0087] S13. A protective film 124 is formed on the side of the radiating portion 122 that is away from the first substrate 121.

[0088] In step S13, only the protective film 124 is formed as a protective layer for the radiating part 122. In actual processes, an encapsulation layer can also be formed as a protective layer for the radiating part 122. Alternatively, gold or tin can be sprayed to protect the radiating part 122. Since gold or tin is a non-transparent material, only a thin layer can be added to avoid affecting the transparency.

[0089] S14. The first substrate 121 on which the radiating portion 122 is formed is flipped over, and a first adhesive layer 123 is formed on the side of the first substrate 121 away from the radiating portion 122. A release film 125 is formed on the side of the first adhesive layer 123 away from the first substrate 121 as a temporary protection for the first adhesive layer 123.

[0090] S15. Remove the release film 125 and attach the radiation component 12 to the first dielectric substrate 11.

[0091] The second method: Figure 9 is a flowchart of the second method for preparing the radiating structure 1 according to an embodiment of this disclosure; as shown in Figure 9, the method for preparing the radiating structure 1 specifically includes:

[0092] S21, Provide a first substrate 121.

[0093] S22. A first conductive film is sputtered on the first substrate 121, and the first conductive film is used as a seed layer. The seed layer is electroplated to form a first conductive layer. A photoresist layer is formed on the side of the first conductive layer away from the first substrate 121. The photoresist layer is then exposed and developed. After that, the first conductive film is etched to remove the remaining photoresist from the photoresist layer, thus completing the fabrication of the radiating part 122.

[0094] The main body 1221 of the radiating part 122 formed in step S22 is a conductive mesh structure, and the connecting part 1222 is a solid structure.

[0095] S23. The surface of the radiating part 122 is blackened to reduce the brightness of the material of the radiating part 122 and at the same time protect the radiating part 122.

[0096] In step S13, the surface of the radiating part 122 may not be blackened (the black line part in the figure), or an encapsulation layer or protective film 124 may be formed on the side of the radiating part 122 away from the first substrate 121 to protect the radiating part 122.

[0097] S24. The first substrate 121 on which the radiating portion 122 is formed is flipped over, and a first adhesive layer 123 is formed on the side of the first substrate 121 away from the radiating portion 122. A release film 125 is formed on the side of the first adhesive layer 123 away from the first substrate 121 as a temporary protection for the first adhesive layer 123.

[0098] S25. Remove the release film 125 and attach the radiation component 12 to the first dielectric substrate 11.

[0099] A second example: Figure 10 is a cross-sectional view of another radiating component 12 according to an embodiment of this disclosure; as shown in Figure 10, the material selected before the conductive mesh of the radiating part 122 in this example is copper foil, that is, the radiating part 122 is obtained by patterning the copper foil. In this case, a second adhesive layer 126 is provided between the first substrate 121 and the radiating part 122 to fix the copper foil and the first substrate together. The remaining structure of the radiating structure 1 in this example can be the same as in the first example.

[0100] In this example, copper foil was chosen as the raw material for the radiating part 122 because copper foil is already mass-produced industrially, thus significantly reducing costs. Battery-grade copper foil and standard industrial copper foil can be used. Battery-grade copper foil is relatively thin, and a thin copper plating layer can be applied on top to make the surface smoother, flatter, and more corrosion-resistant, resulting in better aesthetics. Standard industrial copper foil is relatively thick, and its morphological quality is inferior to that of battery-grade copper foil, leading to a lower aesthetic appeal, but it is also relatively cheaper. The choice of copper foil should consider both cost and aesthetics. The second adhesive layer 126 can be made of polyester adhesive or acrylic adhesive, requiring temperature resistance, corrosion resistance, and high transmittance.

[0101] When copper foil is used as the raw material for the radiating part 122, the preparation method of the radiating structure 1 requires forming a second adhesive layer 126 on the first dielectric substrate 11 before forming the copper foil on the first dielectric substrate 11, followed by the formation of the copper foil, and then a patterning process to form a pattern including the radiating part 122. The steps for forming other structures of the radiating structure 1 are the same as the steps described above, so they will not be repeated here.

[0102] Next, the power supply structure 3 in the embodiments of this disclosure will be described.

[0103] The power supply structure 3 in this embodiment can specifically be a transmission cable. The transmission cable includes two transmission ends, one end connected to the radiating structure 1 is called the first transmission end, and the other end is called the second transmission end. The second transmission end can be connected to an N-type female connector for connection with external devices. Figure 11 is a schematic diagram of the connection between the transmission cable and the second connection structure 5 in this embodiment; Figure 12 is a schematic diagram of the connection between the transmission cable and the reflector 2 in this embodiment; as shown in Figures 11 and 12, specifically, the transmission cable has, from the inner layer to the outer layer, a wire core 31, an interlayer dielectric layer, a shielding layer 32, and a protective layer; wherein, the wire core 31 is mainly used for signal transmission, so it is the wire core 31 of the transmission cable that is electrically connected to the radiating structure 1. That is to say, the wire core 31 at the first transmission end of the transmission cable is exposed. In this case, the first transmission end passes through the first through-hole of the reflector 2 so that the wire core 31 is connected to the radiating structure 1. The shielding layer 32 of the transmission cable can be connected to the reflector 2. At this point, the shielding layer at the first transmission end can be exposed. A second connecting structure 5 is then fitted over the exposed shielding layer, and the second connecting structure 5 is fixedly connected to the reflector 2. This achieves both the fixing of the transmission cable to the reflector 2 and the connection of the shielding layer to the reflector 2. It should be noted that a portion of the second connecting structure 5 rests against the side of the reflector 2 facing away from the radiating structure 1, while the other portion protrudes through the first connecting hole. A nut can then be used to fix the second connecting structure 5, thus securing the transmission cable to the reflector 2.

[0104] Furthermore, Figure 13 is a schematic diagram of the third connection structure 6 according to an embodiment of this disclosure; as shown in Figures 1, 2, and 13, the omnidirectional ceiling antenna further includes a third connection structure 6 that is sleeved outside the transmission cable, and the third connection structure 6 is fixedly connected to the reflector 2. The third connection structure 6 is a connection structure that connects to the indoor roof. Specifically, the third connection structure 6 includes a first connection component 61 and a second connection component 62; wherein, the first connection component 61 has a hollow portion, the second connection component 62 has a first connection through hole, the first connection component 61 and the second connection component 62 are connected, and the hollow portion communicates with the first connection through hole; the third connection structure 6 is sleeved outside the transmission cable through the hollow portion and the first connection through hole, and the second connection component 62 is fixed on the side of the reflector 2 facing away from the radiation structure 1. In one example, the first connection component 61 can specifically be a threaded post to facilitate fixation to the indoor roof, and the threaded post can be made of ABS or PP material.

[0105] Furthermore, continuing to refer to 1, 2 and 13, the third connection structure 6 also includes a third connection component 63 disposed at the end of the first connection component 61 opposite to the second connection component 62. The third connection component 63 is installed in the hollow part and serves as a cable sleeve for fixing the transmission cable to the first connection component 61.

[0106] Finally, the fixing of reflector 2 and radiation structure 1 will be explained.

[0107] Figure 14 is a schematic diagram of the first connection structure 4 connecting the radiation structure 1 and the reflector 2 in an embodiment of the present disclosure. As shown in Figures 1, 2 and 14, the radiation structure 1 includes a first dielectric substrate 11 and a radiation component 12 disposed on the first dielectric substrate 11. The radiation component 12 includes a first substrate 121 and a radiation portion 122 disposed on the first substrate 121.

[0108] In this embodiment, the reflector 2 and the radiating structure 1 are connected by a first connecting structure 4, which includes at least one fourth connecting component. In Figures 1, 2, and 14, only two fourth connecting components are used as an example. Each fourth connecting component is an "L"-shaped connector, comprising a first part 41 and a second part 42 connected to each other. The first part 41 is connected to the radiating structure 1, and the second part 42 is connected to the reflector 2, thus fixing the reflector 2 and the radiating structure 1 together. Specifically, the first part 41 of the fourth connecting component has a first threaded hole, and the radiating structure 1 has a second threaded hole penetrating the first substrate 121 and the first dielectric substrate 11. A screw is screwed into the first and second threaded holes to complete the fixed connection between the first part 41 of the fourth connecting component and the radiating structure 1. Similarly, the second part 42 of the fourth connecting component has a third threaded hole, and the reflector 2 has a fourth threaded hole. A screw is screwed into both the third and fourth threaded holes to complete the fixed connection between the second part 42 and the reflector 2, thus completing the fixed connection between the reflector 2 and the radiating structure 1.

[0109] In the omnidirectional ceiling antenna of this embodiment, the radiating structure 1 adopts the radiating component 12 formed on the first dielectric substrate 11. Although the main working element of the radiating component 12 is only a single-layer radiating part 122, its antenna performance is suitable for 900MHz band / 1800MHz band / F band / A band / E band / WLAN band / D band. The antenna gain is shown in Figure 15. In the 900MHz band, the gain is greater than 1.8dBi, and in the 1800-D band, the antenna gain reaches 3.6-5.3dBi, both of which meet the requirements of traditional single-polarization ceiling antennas.

[0110] The antenna non-circularity is shown in Figures 16 and 17. The non-circularity is excellent in the 900MHz band, less than 0.3. While the non-circularity deteriorates somewhat in the high-frequency range, it remains less than 0.9, fully meeting the requirements of traditional single-polarized ceiling-mounted antennas. This disclosure provides a method for fabricating the above-mentioned omnidirectional ceiling-mounted antenna, comprising the following steps S1 and S2.

[0111] S1. Provide a reflector and a power supply structure.

[0112] S2. A radiating structure is formed, and the reflector and the radiating structure are connected by a first connecting structure. The plane where the reflector is located and the plane where the radiating structure is located have a certain angle. The power feeding structure is electrically connected to the radiating structure through a first through-hole penetrating the reflector.

[0113] The radiating structures in the embodiments of this disclosure can be prepared using any of the methods described in the above examples, and therefore will not be repeated here.

[0114] The fabrication method of the omnidirectional ceiling antenna in this embodiment is simple, easy to implement, and low in cost.

[0115] This disclosure provides an electronic device, which includes an antenna.

[0116] The antenna also includes a transceiver unit, an RF transceiver, a signal amplifier, a power amplifier, and a filtering unit. This antenna can function as either a transmitting or receiving antenna. The transceiver unit can include a baseband and a receiver. The baseband provides signals in at least one frequency band, such as 2G, 3G, 4G, or 5G signals, and transmits these signals to the RF transceiver. The transparent antenna in the communication system receives the signal, which is then processed by the filtering unit, power amplifier, signal amplifier, and RF transceiver (not shown in the diagram) before being transmitted to the receiver in the transceiver unit. The receiver could be, for example, a smart gateway.

[0117] Furthermore, the RF transceiver is connected to the transceiver unit and is used to modulate the signals transmitted by the transceiver unit, or to demodulate the signals received by the transparent antenna before transmitting them to the transceiver unit. Specifically, the RF transceiver may include a transmitting circuit, a receiving circuit, a modulation circuit, and a demodulation circuit. After the transmitting circuit receives various types of signals provided by the baseband, the modulation circuit can modulate the various types of signals provided by the baseband before transmitting them to the antenna. The transparent antenna receives the signals and transmits them to the receiving circuit of the RF transceiver. The receiving circuit then transmits the signals to the demodulation circuit, which demodulates the signals before transmitting them to the receiving end.

[0118] Furthermore, the RF transceiver is connected to a signal amplifier and a power amplifier, which are then connected to a filtering unit. The filtering unit is connected to at least one antenna. During signal transmission in the communication system, the signal amplifier improves the signal-to-noise ratio (SNR) of the RF transceiver's output signal before transmitting it to the filtering unit; the power amplifier amplifies the power of the RF transceiver's output signal before transmitting it to the filtering unit. The filtering unit may specifically include a duplexer and a filtering circuit. The filtering unit combines the signals output from the signal amplifier and power amplifier, filters out clutter, and transmits them to the transparent antenna, which radiates the signal. During signal reception in the communication system, the antenna receives the signal and transmits it to the filtering unit. The filtering unit filters out clutter from the received signal and transmits it to the signal amplifier and power amplifier. The signal amplifier increases the gain of the received signal, improving the SNR; the power amplifier amplifies the power of the received signal. The signal received by the antenna, after processing by the power amplifier and signal amplifier, is transmitted to the RF transceiver, which then transmits it to the transceiver unit.

[0119] In some examples, the signal amplifier may include various types of signal amplifiers, such as low-noise amplifiers, without limitation.

[0120] In some examples, the antenna provided in this disclosure also includes a power management unit connected to a power amplifier to provide voltage to the power amplifier for amplifying signals.

[0121] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An omnidirectional ceiling-mount antenna comprising a reflector, a radiating structure and a feed structure; wherein, The reflecting plate and the radiation structure are connected by a first connecting structure, and the planes of the reflecting plate and the radiation structure have a certain included angle; the feeding structure is electrically connected with the radiation structure through a first via hole penetrating the reflecting plate.

2. The omni-directional ceiling mount antenna of claim 1, wherein, The radiation structure comprises a first dielectric substrate and a radiation component disposed on the first dielectric substrate; the feeding structure is connected with the radiation component.

3. The omni-directional ceiling mount antenna of claim 2, wherein, The radiation component comprises a first base material disposed on the first dielectric substrate, a radiation part disposed on a side of the first base material away from the first dielectric substrate, and a first adhesive layer bonding the first base material and the first dielectric substrate.

4. The omni-directional ceiling mount antenna of claim 3, wherein, The radiation component further comprises a second adhesive layer disposed between the radiation part and the first base material.

5. The omni-directional ceiling mount antenna of claim 4, wherein, The radiation part adopts a copper foil.

6. The omni-directional ceiling-mountable antenna according to any of claims 3-5, wherein, The radiation component further comprises a protective film or an encapsulation layer disposed on a side of the radiation part away from the first dielectric substrate.

7. The omni-directional ceiling-mountable antenna according to any of claims 3-5, wherein, The radiation part comprises a main body part and a connecting part connected with the main body part; the connecting part is connected with the feeding structure. The main body part comprises a conductive grid.

8. The omni-directional ceiling mount antenna of claim 7, wherein, The main body part has a first window concave toward the center thereof, and the connecting part is connected at the first window and extends away from the center of the main body part.

9. The omni-directional ceiling mount antenna of claim 7, wherein, The main body part further comprises a plurality of branches connected therewith, and the plurality of branches are symmetrically disposed with the extension direction of the connecting part as a symmetric axis.

10. The omni-directional ceiling mount antenna of claim 1, wherein, The feeding structure comprises a transmission cable; the transmission cable comprises a first transmission end and a second transmission end; the first transmission end is connected with the radiation structure through the first via hole, and a shielding layer of the transmission cable is fixedly connected with the reflecting plate at the position of the first transmission end through a second connecting structure.

11. The omni-directional ceiling mount antenna of claim 1, wherein, The feeding structure comprises a transmission cable. The omnidirectional ceiling antenna further comprises a third connecting structure; the third connecting structure comprises a first connecting component and a second connecting component; the first connecting component has a hollow part, the second connecting component has a first connecting through hole, the first connecting component and the second connecting component are connected, and the hollow part communicates with the first connecting through hole; the third connecting structure is sleeved outside the transmission cable through the hollow part and the first connecting through hole, and the second connecting component is fixed on a side of the reflecting plate away from the radiation structure.

12. The omni-directional ceiling mount antenna of claim 11, wherein, The third connecting structure further comprises a third connecting component disposed at an end of the first connecting component away from the second connecting component, and the third connecting component is installed in the hollow part and used for fixing the transmission cable and the first connecting component.

13. The omni-directional ceiling mountable antenna of claim 1, wherein, The first connecting structure comprises at least one fourth connecting component; the fourth connecting component comprises a first part and a second part connected with each other; the first part is connected with the radiation structure, and the second part is connected with the reflecting plate.

14. A method of manufacturing an omni-directional ceiling mount antenna as claimed in any one of claims 1-13, wherein, The method comprises: providing a reflecting plate and a feeding structure; forming a radiation structure, connecting the reflecting plate and the radiation structure by a first connecting structure, the plane of the reflecting plate and the plane of the radiation structure having a certain included angle; and electrically connecting the feeding structure with the radiation structure through a first via hole penetrating the reflecting plate.

15. The method of claim 14, wherein the omnidirectional ceiling-mount antenna is prepared by the steps of: The forming the radiating structure comprises: providing a first dielectric substrate, and forming a radiating component on the first dielectric substrate; The step of forming the radiating component on the first dielectric substrate comprises: providing a first substrate; sputtering a first conductive film on the first substrate, and forming a pattern comprising a radiating part through a patterning process; turning over the first substrate with the radiating part, sequentially forming a first adhesive layer and a release film on a side of the first substrate away from the radiating part; tearing off the release film, and adhering the first adhesive layer to the first dielectric substrate.

16. The method of claim 14, wherein the omnidirectional ceiling-mount antenna is prepared by the steps of: The forming the radiating structure comprises: providing a first dielectric substrate, and forming a radiating component on the first dielectric substrate; The step of forming the radiating component on the first dielectric substrate comprises: providing a first substrate; sputtering a first conductive film on the first substrate, forming a first conductive layer by electroplating the seed layer, and forming a pattern comprising a radiating part through a patterning process on the first conductive layer; turning over the first substrate with the radiating part, sequentially forming a first adhesive layer and a release film on a side of the first substrate away from the radiating part; tearing off the release film, and adhering the first adhesive layer to the first dielectric substrate.

17. The method of claim 14, wherein the omnidirectional ceiling-mount antenna is prepared by the steps of: The forming the radiating structure comprises: providing a first dielectric substrate, and forming a radiating component on the first dielectric substrate; The step of forming the radiating component on the first dielectric substrate comprises: providing a first substrate; forming a second adhesive layer on the first substrate, forming a copper foil on a side of the second adhesive layer away from the first substrate, and forming a pattern comprising a radiating part through a patterning process on the copper foil; turning over the first substrate with the radiating part, sequentially forming a first adhesive layer and a release film on a side of the first substrate away from the radiating part; tearing off the release film, and adhering the first adhesive layer to the first dielectric substrate.

18. The method of making an omni-directional ceiling mount antenna of any of claims 15-17, wherein, Before the turning over the first substrate with the radiating part, the method further comprises: forming a protective film or an encapsulation layer on a side of the radiating part away from the first substrate.

19. The method of making an omni-directional ceiling mountable antenna according to any one of claims 15-17, wherein, Before the turning over the first substrate with the radiating part, the method further comprises: a step of blackening the radiating part.

20. An omnidirectional ceiling antenna comprising the omnidirectional ceiling antenna of any one of claims 1-13.

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