Hybrid integrated circuits and systems and methods for manufacturing same
By integrating thin-film active devices over CMOS devices, the method enhances chip density and functionality, addressing manufacturing complexity and reliance on few fabrication facilities, thus improving semiconductor production efficiency and diversity.
WO2026115526A2PCT designated stage Publication Date: 2026-06-04ZINITE CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ZINITE CORP
- Filing Date
- 2026-04-17
- Publication Date
- 2026-06-04
AI Technical Summary
Technical Problem
The semiconductor industry faces challenges in achieving high-density integrated circuits with complex manufacturing processes and high costs, with planar density approaching its limits and reliance on a few critical fabrication facilities.
Method used
A hybrid approach is introduced where CMOS active devices are partially completed using conventional methods, followed by thin-film active devices and wiring formed over them, enhancing functionality without requiring changes to existing CMOS fabrication lines.
Benefits of technology
This method increases density and adds valued-added functionality to CMOS chips, diversifies the global semiconductor supply chain, and reduces reliance on specific fabrication facilities, while maintaining or reducing manufacturing complexity.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure IB2026053833_04062026_PF_FP_ABST
Abstract
A partially completed wafer contains complementary metal–oxide–semiconductor (CMOS) active devices formed with a CMOS fabrication line. Thin-film active devices are formed over the CMOS active devices with a thin-film fabrication line. Wiring between the CMOS active devices and the thin-film active devices may be formed with either or both fabrication lines. Wiring above the thin-film active devices may be formed with the thin-film fabrication line. The thin-film active devices and related wiring provide enhanced functionality to functionality provided by the CMOS active devices.
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