Driving device and display device including same

Abstract

This driving device comprises: a printed circuit board having an upper surface on which a main IC and a memory adjacent to the main IC are mounted; and a heat dissipation plate disposed to be spaced apart from the upper surface of the printed circuit board by a predetermined distance, the heat dissipation plate being in contact with the main IC, wherein the heat dissipation plate includes an opening formed at a position corresponding to the memory, and the opening is formed to have a size including the size of the memory and the size of an area in which a connection line electrically connecting the memory and the main IC is disposed. Through the opening formed in the heat dissipation plate, the driving device can reduce EMI noise without installing a separate conductive member for shielding electromagnetic waves.

Description

Driving device and display device having the same

[0001] The present invention relates to a driving device capable of reducing EMI noise without installing a separate conductive member to shield electromagnetic waves through an opening formed in a heat dissipation plate, and a display device equipped with the same.

[0002] Generally, display devices have been developed to the extent that they can fully perform the role of flat-panel displays, and are used not only as LCDs for mobile phones, PDAs, digital cameras, and camcorders, and as computer monitors, but also, in particular, in large display devices such as TVs.

[0003] In the case of the display device described above, signals are processed through a Timing Controller (T-CON), which is a Printed Circuit Board (PCB) located on the back of the display panel for image display.

[0004] Generally, electromagnetic waves are emitted between electronic components mounted on printed circuit boards in electronic devices, causing electromagnetic interference (EMI). EMI causes problems such as malfunctions in electronic devices or adverse effects on the human body, and the EMI problem is becoming even more serious, especially recently as the operating frequency of electronic devices has increased to the range of tens of MHz to several GHz.

[0005] EMI noise refers to noise that causes noise problems due to interference, resulting from electromagnetic waves generated from one electronic circuit, component, or part being transmitted to other circuits, components, or parts.

[0006] Conventionally, to reduce EMI noise, a separate conductive member was installed between cover members covering a printed circuit board to shield electromagnetic waves generated between electronic components, thereby reducing EMI noise.

[0007] In addition, the printed circuit board and the cover member were fastened with screws, and the ground voltage of the printed circuit board was provided to the cover member, thereby expanding the ground area and reducing EMI noise.

[0008] However, as the higher the frequency of the electromagnetic wave, the stronger its directivity and reflectivity, EMI noise is reflected and superimposed between the printed circuit board and the cover member and amplified, so there was a limit to the reduction of EMI noise even with a separate conductive member.

[0009] In addition, the method of reducing EMI noise by expanding the ground area through screw fastening also has the problem that there is a variation in the reduction of EMI noise due to screw fastening.

[0010] Therefore, structural means are required to solve these problems and efficiently reduce EMI noise generated by electronic devices.

[0011] The present invention aims to provide a driving device and a display device equipped with the same, and more specifically, to provide a driving device and a display device equipped with the same that can reduce EMI noise without installing a separate conductive member to shield electromagnetic waves through an opening formed in a heat dissipation plate.

[0012] In addition, the purpose is to provide a driving device capable of reducing EMI noise by forming an opening in a heat dissipation plate at a position corresponding to the memory, so that the original EMI noise is freely radiated through the opening before the EMI noise is reflected, superimposed, and amplified on the heat dissipation plate, and a display device equipped with the same.

[0013] In addition, the invention aims to provide a driving device and a display device equipped with the same, which can prevent an electronic device from malfunctioning or being damaged by releasing heat generated by the operation of electronic components mounted on a printed circuit board through an opening formed in a heat dissipation plate.

[0014] The problems to be solved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which the present invention belongs from the description below.

[0015] A driving device is provided that includes a printed circuit board having a main IC and a memory adjacent to the main IC mounted on its upper surface; and a heat dissipation plate disposed at a certain distance from the upper surface of the printed circuit board and in contact with the main IC, wherein the heat dissipation plate includes an opening formed at a position corresponding to the memory, and the opening is formed with a size including the size of the memory and the size of an area in which a connecting line electrically connecting the main IC to the memory is disposed.

[0016] The above opening can be formed so that the main IC is not exposed.

[0017] A plurality of the above-mentioned memories are mounted adjacent to one side of the main IC, and the opening may be formed with a size including the size of the plurality of memories and the size of an area where a connecting line electrically connecting the plurality of memories to the main IC is arranged.

[0018] At least one electronic component is mounted adjacent to the main IC and the memory on the printed circuit board, and the opening may be formed so as not to expose the electronic component.

[0019] A plurality of the above-mentioned memories are mounted adjacent to the main IC, and a plurality of the above-mentioned openings may be formed at positions corresponding to each of the plurality of memories.

[0020] The above plurality of openings may be formed with different sizes so as not to expose the main IC.

[0021] The above heat dissipation plate may include a metal material to absorb heat generated from the main IC, or its outer surface may be plated with metal.

[0022] The above opening may include a polygonal shape.

[0023] A display device is provided that includes: a display panel for outputting an image; a printed circuit board that provides a driving signal to the display panel and has a main IC and a memory adjacent to the main IC mounted on its upper surface; and a heat dissipation plate that is spaced apart from the upper surface of the printed circuit board by a certain distance and contacts the main IC, wherein the heat dissipation plate includes an opening formed at a position corresponding to the memory, and the opening is formed with a size including the size of the memory and the size of an area where a connecting line electrically connecting the memory to the main IC is arranged.

[0024] The above opening can be formed so that the main IC is not exposed.

[0025] A plurality of the above-mentioned memories are mounted adjacent to one side of the main IC, and the opening may be formed with a size including the size of the plurality of memories and the size of an area where a connecting line electrically connecting the plurality of memories to the main IC is arranged.

[0026] At least one electronic component is mounted adjacent to the main IC and the memory on the printed circuit board, and the opening may be formed so as not to expose the electronic component.

[0027] A plurality of the above-mentioned memories are mounted adjacent to the main IC, and a plurality of the above-mentioned openings may be formed at positions corresponding to each of the plurality of memories.

[0028] The above plurality of openings may be formed with different sizes so as not to expose the main IC.

[0029] The above display panel may include an OLED panel.

[0030] The driving device according to the present invention and the display device equipped therewith can reduce EMI noise without installing a separate conductive member to shield electromagnetic waves through an opening formed in a heat dissipation plate.

[0031] In addition, EMI noise can be reduced by forming an opening in the heat dissipation plate at a position corresponding to the memory, so that the original EMI noise is freely radiated through the opening before it is reflected, superimposed, and amplified by the heat dissipation plate.

[0032] In addition, by releasing heat generated by the operation of electronic components mounted on a printed circuit board through an opening formed in a heat dissipation plate, it is possible to prevent the electronic device from malfunctioning or being damaged.

[0033] The effects obtainable from the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below.

[0034] Figure 1 is a block diagram illustrating each configuration of a display device.

[0035] FIG. 2 is a front perspective view illustrating an example of a display device.

[0036] Figure 3 is an exploded view of the display device.

[0037] FIG. 4 is a perspective view illustrating a driving device according to one embodiment of the present invention.

[0038] Figure 5 is a frontal view of area A of Figure 4, illustrating the shape of an opening formed in a heat dissipation plate.

[0039] Figure 6 is a drawing illustrating Case 1, in which no opening is formed in the heat dissipation plate.

[0040] Figure 7 is data analyzing the EMI noise for Case 1 of Figure 6.

[0041] Figure 8 is a drawing illustrating Case 2, in which an opening is formed in a heat dissipation plate at a location unrelated to the memory.

[0042] Figure 9 is data analyzing the EMI noise for Case 2 of Figure 8.

[0043] FIGS. 10 and FIGS. 11 are data for explaining the effect of reducing EMI noise through a driving device according to one embodiment of the present invention.

[0044] FIG. 12 is a drawing illustrating the shape of a heat dissipation plate having a plurality of openings formed therein in a driving device according to one embodiment of the present invention.

[0045] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols will be assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the spirit and technical scope of the present invention.

[0046] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0047] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0048] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0049] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0050] Meanwhile, the display device described in this specification is, for example, an intelligent display device that adds computer support functions to broadcast reception functions. While faithful to broadcast reception functions, it also includes internet functions, and can be equipped with interfaces that are more convenient to use, such as a handwriting input device, a touch screen, or a spatial remote control. Furthermore, by supporting wired or wireless internet functions, it can be connected to the internet and computers, and can perform functions such as email, web browsing, banking, or games. A standardized general-purpose OS may be used for these various functions.

[0051] Accordingly, the display device described in the present invention allows various applications to be freely added or removed, for example, on a general-purpose OS kernel, thereby enabling various user-friendly functions to be performed. More specifically, the display device may be, for example, a network TV, HBBTV, a smart TV, etc., and may also be applicable to a smartphone depending on the circumstances.

[0052] FIG. 1 is a block diagram for explaining each configuration of a display device (100). The display device (100) may include a broadcast receiver (110), an external device interface unit (171), a network interface unit (172), a storage unit (140), a user input interface unit (173), an input unit (130), a control unit (180), a display module (150), an audio output unit (160), and / or a power supply unit (190).

[0053] The broadcast receiving unit (110) may include a tuner unit (111) and a demodulating unit (112).

[0054] Meanwhile, unlike the drawing, the display device (100) may include only the external device interface unit (171) and the network interface unit (172) among the broadcast receiver (110), the external device interface unit (171), and the network interface unit (172). That is, the display device (100) may not include the broadcast receiver (110).

[0055] The tuner unit (111) can select a broadcast signal corresponding to a channel selected by the user or all previously stored channels among the broadcast signals received through an antenna (not shown) or a cable (not shown). The tuner unit (111) can convert the selected broadcast signal into an intermediate frequency signal or a baseband video or audio signal.

[0056] For example, the tuner unit (111) can convert the selected broadcast signal into a digital IF signal (DIF) if it is a digital broadcast signal, and convert it into an analog baseband video or audio signal (CVBS / SIF) if it is an analog broadcast signal. That is, the tuner unit (111) can process a digital broadcast signal or an analog broadcast signal. The analog baseband video or audio signal (CVBS / SIF) output from the tuner unit (111) can be directly input to the control unit (180).

[0057] Meanwhile, the tuner unit (111) can sequentially select broadcast signals of all broadcast channels stored through a channel memory function among the received broadcast signals and convert them into intermediate frequency signals or baseband video or audio signals.

[0058] Meanwhile, the tuner unit (111) may be equipped with multiple tuners to receive multiple channels of broadcast signals. Alternatively, a single tuner that simultaneously receives multiple channels of broadcast signals is also possible.

[0059] The demodulator (112) can receive the digital IF signal (DIF) converted by the tuner (111) and perform a demodulation operation. The demodulator (112) can output a stream signal (TS) after performing demodulation and channel decoding. At this time, the stream signal may be a signal in which a video signal, an audio signal, or a data signal is multiplexed.

[0060] The stream signal output from the demodulation unit (112) can be input to the control unit (180). After performing demultiplexing, video / audio signal processing, etc., the control unit (180) can output video through the display module (150) and output audio through the audio output unit (160).

[0061] The sensing unit (120) refers to a device that detects changes within the display device (100) or detects external changes. For example, it may include at least one proximity sensor, illumination sensor, touch sensor, infrared sensor (IR sensor), ultrasonic sensor, optical sensor (e.g., camera), voice sensor (e.g., microphone), battery gauge, and environmental sensor (e.g., hygrometer, thermometer, etc.).

[0062] The control unit (180) can check the status of the display device (100) based on information collected from the sensing unit (120), and if a problem occurs, notify the user or control it to maintain the best state by self-adjusting.

[0063] In addition, the content, quality, size, etc. of the video provided to the display module (150) can be controlled differently according to the viewer detected by the sensing unit (120) or the ambient light level, thereby providing an optimal viewing environment. As smart TVs advance, the number of functions installed in the display device (100) increases, and the number of sensing units (120) also increases accordingly.

[0064] The input unit (130) may be provided on one side of the main body of the display device (100). For example, the input unit (130) may include a touch pad, a physical button, etc. The input unit (130) may receive various user commands related to the operation of the display device (100) and transmit a control signal corresponding to the input command to the control unit (180).

[0065] Recently, as the size of the bezel of the display device (100) decreases, there are many display devices (100) in which the physical button-shaped input part (130) exposed externally on the device itself is minimized. Instead, a minimum number of physical buttons are located on the back or side, and user input can be received through a remote control device (200) via a touchpad or a user input interface part (173) to be described later.

[0066] The storage unit (140) may store programs for each signal processing and control within the control unit (180), and may also store signal-processed video, audio, or data signals. For example, the storage unit (140) may store applications designed for the purpose of performing various tasks that can be processed by the control unit (180), and may selectively provide some of the stored applications upon request from the control unit (180).

[0067] The program, etc. stored in the storage unit (140) is not specifically limited as long as it can be executed by the control unit (180). The storage unit (140) may also perform the function of temporarily storing video, audio, or data signals received from an external device through the external device interface unit (171). The storage unit (140) may store information regarding a predetermined broadcast channel through a channel memory function such as a channel map.

[0068] Although the storage unit (140) of FIG. 1 is illustrated in an embodiment in which it is provided separately from the control unit (180), the scope of the present invention is not limited thereto, and the storage unit (140) may be included within the control unit (180).

[0069] The storage unit (140) may include at least one of volatile memory (e.g., DRAM, SRAM, SDRAM, etc.) or non-volatile memory (e.g., flash memory, hard disk drive (HDD), solid-state drive (SSD), etc.).

[0070] The display module (150) can generate a driving signal by converting a video signal, data signal, OSD signal, control signal processed by the control unit (180), or a video signal, data signal, control signal, etc. received from the interface unit (171). The display module (150) may include a display panel (151) having a plurality of pixels.

[0071] A plurality of pixels provided in the display panel (151) may have RGB subpixels. Alternatively, a plurality of pixels provided in the display panel (151) may have RGBW subpixels. The display module (150) can convert a video signal, data signal, OSD signal, control signal, etc. processed by the control unit (180) to generate a driving signal for a plurality of pixels.

[0072] The display module (150) can be a PDP (Plasma Display Panel), LCD (Liquid Crystal Display), OLED (Organic Light Emitting Diode), flexible display, etc., and can also be a 3D display. The 3D display module (150) can be classified into a glasses-free type and a glasses type.

[0073] The display device (100) includes a display module (150) that occupies most of the front surface area and a case that packages the display module (150) and covers the back side of the display module (150).

[0074] Recently, the display device (100) may use a flexible display module (150), such as an LED (Light Emitting Diode) or an OLED (Organic Light Emitting Diode), to implement a curved screen, going beyond a flat surface.

[0075] Conventional LCDs, which were primarily used, received light through a backlight unit because the LCD itself has difficulty emitting light. A backlight unit is a device that supplies light from a light source uniformly to a liquid crystal located on the front. While thin LCDs could be realized as the backlight unit became thinner, it is difficult to implement the backlight unit using a flexible material, and when the backlight unit bends, it becomes difficult to supply light uniformly to the liquid crystal, resulting in a problem where the brightness of the screen changes.

[0076] On the other hand, in the case of LED or OLED, since the elements forming the pixels each emit light on their own, a backlight unit is not used, so it can be implemented to be flexible. In addition, since each element emits light on its own, it does not affect its own brightness even if the positional relationship with neighboring elements changes, so a flexible display module (150) can be implemented using LED or OLED.

[0077] OLED (Organic Light Emitting Diode) panels made their debut in earnest in the mid-2010s and are rapidly replacing LCDs in the small and medium-sized display market. OLEDs are displays created using the self-luminous phenomenon where light is emitted when an electric current flows through fluorescent organic compounds; they have a faster image response speed compared to LCDs, resulting in almost no ghosting when displaying videos.

[0078] OLEDs use three types of phosphor organic compounds, such as red, green, and blue, which have self-emissive functions. Since they are light-emitting display products that utilize the phenomenon where electrons injected from the cathode and anode combine with positively charged particles within the organic material to emit light on their own, they do not require a backlight that degrades color quality.

[0079] An LED (Light Emitting Diode) panel is a technology that uses a single LED element as a single pixel, and since the size of the LED element can be reduced compared to conventional methods, a flexible display module (150) can be realized. In the past, devices called LED TVs used LEDs as a light source for a backlight unit that supplied light to an LCD, but the LEDs themselves could not form the screen.

[0080] The display module (150) includes a display panel (151), a coupling magnet located on the back of the display panel (151), a first power supply, and a first signal module. The display panel (151) may include a plurality of pixels (R, G, B). The plurality of pixels (R, G, B) may be formed in each area where a plurality of data lines and a plurality of gate lines intersect. The plurality of pixels (R, G, B) may be arranged or arranged in a matrix form.

[0081] For example, multiple pixels (R, G, B) may include a red (Red, hereinafter 'R') subpixel, a green (Green, 'G') subpixel, and a blue (Blue, 'B') subpixel. Multiple pixels (R, G, B) may further include a white (White, hereinafter 'W') subpixel.

[0082] The side of the display module (150) that displays an image may be referred to as the front or front. When the display module (150) displays an image, the side where the image cannot be observed may be referred to as the rear or rear. Meanwhile, the display module (150) may be configured as a touch screen and may be used as an input device in addition to an output device.

[0083] The audio output unit (160) receives a voice-processed signal from the control unit (180) and outputs it as voice.

[0084] The interface section (170) serves as a passage for various types of external devices connected to the display device (100). The interface section may include not only a wired method of transmitting and receiving data through a cable but also a wireless method using an antenna.

[0085] The interface section (170) may include at least one of a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (Input / Output) port, a video I / O (Input / Output) port, and an earphone port.

[0086] As an example of a wireless method, the aforementioned broadcast receiver (110) may be included, and may include not only broadcast signals but also mobile communication signals, short-range communication signals, wireless internet signals, etc.

[0087] The external device interface unit (171) can transmit or receive data with a connected external device. To this end, the external device interface unit (171) may include an A / V input / output unit (not shown).

[0088] The external device interface section (171) can be connected wirelessly or via wired connection to external devices such as DVD (Digital Versatile Disk), Blu-ray, game console, camera, camcorder, computer (laptop), set-top box, etc., and can also perform input / output operations with external devices.

[0089] Additionally, the external device interface unit (171) can establish a communication network with various remote control devices (200) to receive control signals related to the operation of the display device (100) from the remote control device (200) or transmit data related to the operation of the display device (100) to the remote control device (200).

[0090] The external device interface unit (171) may include a wireless communication unit (not shown) for short-range wireless communication with other electronic devices. Through this wireless communication unit (not shown), the external device interface unit (171) can exchange data with an adjacent mobile terminal. In particular, the external device interface unit (171) can receive device information, information on an application being executed, an application image, etc. from a mobile terminal in mirroring mode.

[0091] The network interface unit (172) may provide an interface for connecting the display device (100) to a wired / wireless network including the Internet network. For example, the network interface unit (172) may receive content or data provided by the Internet or a content provider or network operator through the network. Meanwhile, the network interface unit (172) may include a communication module (not shown) for connecting to a wired / wireless network.

[0092] The external device interface section (171) and / or network interface section (172) may include a communication module for short-range communication such as Wi-Fi (Wireless Fidelity), Bluetooth, Bluetooth Low Energy (BLE), Zigbee, NFC (Near Field Communication), a communication module for cellular communication such as LTE (long-term evolution), LTE-A (LTE Advance), CDMA (code division multiple access), WCDMA (wideband CDMA), UMTS (universal mobile telecommunications system), WiBro (Wireless Broadband), etc.

[0093] The user input interface unit (173) can transmit a signal input by the user to the control unit (180) or transmit a signal from the control unit (180) to the user. For example, it can transmit / receive user input signals such as power on / off, channel selection, and screen settings from the remote control device (200), transmit user input signals input from local keys (not shown) such as power key, channel key, volume key, and setting value to the control unit (180), transmit user input signals input from a sensor unit (not shown) that senses user gestures to the control unit (180), or transmit a signal from the control unit (180) to the sensor unit.

[0094] The control unit (180) may include at least one processor and can control the overall operation of the display device (100) using the included processor. Here, the processor may be a general processor such as a CPU (central processing unit). Of course, the processor may be a dedicated device such as an ASIC or a processor based on other hardware.

[0095] The control unit (180) can demultiplex a stream input through the tuner unit (111), demodulator unit (112), external device interface unit (171), or network interface unit (172), or process the demultiplexed signals to generate and output a signal for video or audio output.

[0096] The image signal processed by the control unit (180) is input to the display module (150) and can be displayed as an image corresponding to the image signal. Additionally, the image signal processed by the control unit (180) may be input to an external output device through the external device interface unit (171).

[0097] The voice signal processed by the control unit (180) can be sound-outputted to the audio output unit (160). Additionally, the voice signal processed by the control unit (180) can be input to an external output device through the external device interface unit (171). Although not shown in FIG. 1, the control unit (180) may include a demultiplexer, an image processing unit, etc. This will be described later with reference to FIG. 2.

[0098] In addition, the control unit (180) can control the overall operation within the display device (100). For example, the control unit (180) can control the tuner unit (111) to control the selection (tuning) of a broadcast corresponding to a channel selected by the user or a previously stored channel.

[0099] Additionally, the control unit (180) can control the display device (100) by means of a user command or an internal program input through the user input interface unit (173). Meanwhile, the control unit (180) can control the display module (150) to display an image. At this time, the image displayed on the display module (150) may be a still image or a video, and may be a 2D image or a 3D image.

[0100] Meanwhile, the control unit (180) can make a predetermined 2D object appear within the image displayed on the display module (150). For example, the object may be at least one of a connected web screen (newspaper, magazine, etc.), an EPG (Electronic Program Guide), various menus, widgets, icons, still images, videos, and text.

[0101] Meanwhile, the control unit (180) can modulate and / or demodulate the signal using an Amplitude Shift Keying (ASK) method. Here, the Amplitude Shift Keying (ASK) method may refer to a method of modulating the signal by varying the amplitude of the carrier wave according to the data value, or restoring the analog signal to a digital data value according to the amplitude of the carrier wave.

[0102] For example, the control unit (180) can modulate the video signal using an amplitude shift keying (ASK) method and transmit it through a wireless communication module.

[0103] For example, the control unit (180) can demodulate and process the video signal received through the wireless communication module using an amplitude shift keying (ASK) method.

[0104] Through this, the display device (100) can easily transmit and receive signals with other adjacent video display devices without using a unique identifier such as a MAC address (Media Access Control Address) or a complex communication protocol such as TCP / IP.

[0105] Meanwhile, the display device (100) may further include a shooting unit (not shown). The shooting unit can photograph the user. The shooting unit may be implemented with one camera, but is not limited thereto, and may also be implemented with multiple cameras. Meanwhile, the shooting unit may be embedded in the display device (100) on the upper part of the display module (150) or may be placed separately. Image information captured by the shooting unit may be input to the control unit (180).

[0106] The control unit (180) can recognize the user's location based on the image captured by the capturing unit. For example, the control unit (180) can determine the distance (z-axis coordinate) between the user and the display device (100). Additionally, the control unit (180) can determine the x-axis coordinate and y-axis coordinate within the display module (150) corresponding to the user's location.

[0107] The control unit (180) can detect a user's gesture based on each of the images captured by the shooting unit or the signals detected by the sensor unit, or a combination thereof.

[0108] The power supply unit (190) can supply power throughout the display device (100). In particular, it can supply power to a control unit (180) which can be implemented in the form of a System On Chip (SOC), a display module (150) for image display, and an audio output unit (160) for audio output.

[0109] Specifically, the power supply unit (190) may be equipped with a converter (not shown) that converts AC power into DC power and a DC / DC converter (not shown) that converts the level of DC power.

[0110] Meanwhile, the power supply unit (190) receives power from an external source and distributes power to each component. The power supply unit (190) may use a method of supplying AC power by directly connecting to an external power source, and may include a power supply unit (190) that can be recharged and used by including a battery.

[0111] In the former case, it is used by connecting a wired cable, making movement difficult or limiting the range of motion. In the latter case, movement is free, but the weight increases by the amount of the battery, the volume becomes larger, and for charging, it must be directly connected to a power cable for a certain period of time or combined with a charging dock (not shown) that supplies power.

[0112] The charging dock can be connected to a display device through an externally exposed terminal, or the built-in battery can be charged by bringing it close using a wireless method.

[0113] The remote control device (200) can transmit user input to the user input interface unit (173). To this end, the remote control device (200) may use Bluetooth, RF (Radio Frequency) communication, infrared (Infrared Radiation) communication, UWB (Ultra-wideband), ZigBee, etc. Additionally, the remote control device (200) may receive video, audio, or data signals output from the user input interface unit (173) and display or output audio from the remote control device (200).

[0114] Meanwhile, the above-described display device (100) may be a digital broadcast receiver capable of receiving fixed or mobile digital broadcasts.

[0115] Meanwhile, the block diagram of the display device (100) shown in FIG. 1 is merely a block diagram for one embodiment of the present invention, and each component of the block diagram may be integrated, added, or omitted according to the specifications of the actual implemented display device (100).

[0116] That is, as needed, two or more components may be combined into a single component, or a single component may be subdivided into two or more components. In addition, the functions performed in each block are intended to explain embodiments of the present invention, and the specific operations or devices thereof do not limit the scope of the present invention.

[0117] FIG. 2 is a front perspective view illustrating an example of a display device (100).

[0118] Referring to FIG. 2, the display device (100) may have a rectangular body comprising a first long side (LS1), a second long side (LS2) facing the first long side (LS1), a first short side (SS1) adjacent to the first long side (LS1) and the second long side (LS2), and a second short side (SS2) facing the first short side (SS1).

[0119] Here, it is possible to refer to the first side area (SS1) as the first side area, the second side area (SS2) as the second side area facing the first side area, the first long side area (LS1) as the third side area located between the first side area and the second side area and adjacent to the first side area and the second side area, and the second long side area (LS2) as the fourth side area located between the first side area and the second side area and facing the third side area.

[0120] In addition, for the convenience of explanation, the lengths of the first and second long sides (LS1, LS2) are depicted and described as being longer than the lengths of the first and second short sides (SS1, SS2), but it is also possible for the lengths of the first and second long sides (LS1, LS2) to be approximately the same as the lengths of the first and second short sides (SS1, SS2).

[0121] In addition, the first direction (DR1) below may be a direction parallel to the long side (LS1, LS2) of the display device (100), and the second direction (DR2) may be a direction parallel to the short side (SS1, SS2) of the display device (100). The third direction (DR3) may be a direction perpendicular to the first direction (DR1) and / or the second direction (DR2).

[0122] From another perspective, the side where the display device (100) displays an image may be referred to as the front or front side. When the display device (100) displays an image, the side where the image cannot be observed may be referred to as the rear or rear side. When viewing the display device (100) from the front or front side, the side of the first long side (LS1) may be referred to as the upper side or upper surface. Likewise, the side of the second long side (LS2) may be referred to as the lower side or lower surface. Likewise, the side of the first short side (SS1) may be referred to as the right side or right surface, and the side of the second short side (SS2) may be referred to as the left side or left surface.

[0123] In addition, the first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) can be referred to as edges of the display device (100). Also, the point where the first long side (LS1), the second long side (LS2), the first short side (SS1), and the second short side (SS2) meet each other can be referred to as a corner. For example, the point where the first long side (LS1) and the first short side (SS1) meet can be the first corner (C1), the point where the first long side (LS1) and the second short side (SS2) meet can be the second corner (C2), the point where the second short side (SS2) and the second long side (LS2) meet can be the third corner (C3), and the point where the second long side (LS2) and the first short side (SS1) meet can be the fourth corner (C4).

[0124] Here, the direction from the first short side (SS1) toward the second short side (SS2) or from the second short side (SS2) toward the first short side (SS1) can be called the left-right direction (LR). The direction from the first long side (LS1) toward the second long side (LS2) or from the second long side (LS2) toward the first long side (LS1) can be called the up-down direction (UD).

[0125] FIG. 3 is an exploded view of a display device (100) according to an embodiment of the present invention. The display device (100) may include a display module (150), a case top (101) that covers the front perimeter of the display module (150) and wraps around the side perimeter, a cover bottom (102) that covers the back of the display module (150), and a back cover (103) that covers a component mounted on the back (102a) of the cover bottom (102) and is coupled to the back of the cover bottom (102).

[0126] Recently, as the display module (150) becomes thinner, the housing (101, 102) also becomes thinner, and the thickness of the case top (101) that constitutes the bezel located around the front perimeter of the display module (150) can also be thinned or omitted. For example, in the case of an OLED panel, the backlight unit is omitted and the layered structure exposed laterally is simpler than that of a liquid crystal display panel, so the case top (101) can be omitted.

[0127] The display module (150) includes a display panel (151) on which an image is output and a support panel (153) for supporting the back surface, and the two members can be joined using an adhesive member (152) such as OCA.

[0128] A flexible substrate extending from the end of the display panel (151) can be bent in the back direction to connect with a control board mounted on the cover bottom (102). When using a liquid crystal panel, the display panel (151) can be configured by using a panel guide to mount the light source substrate, optical sheet, and liquid crystal panel in that order.

[0129] A wall-mounted type includes a structure (not shown) that is fastened to the wall on the back of the display device (100), and a floor-mounted type of display device (100) may include a stand (108) that extends to the lower part of the display module (150).

[0130] FIG. 4 is a perspective view illustrating a driving device (300) according to an embodiment of the present invention. FIG. 5 is a front view of area A of FIG. 4, illustrating a shape in which an opening (350) is formed in a heat dissipation plate (340). FIG. 6 is a drawing illustrating Case 1 in which no opening (350) is formed in the heat dissipation plate (340). FIG. 7 is data analyzing EMI noise for Case 1 of FIG. 6. FIG. 8 is a drawing illustrating Case 2 in which an opening (350) is formed in the heat dissipation plate (340) at a location unrelated to the memory (330). FIG. 9 is data analyzing EMI noise for Case 2 of FIG. 8. FIG. 10 and FIG. 11 are data for explaining the effect of reducing EMI noise through a driving device (300) according to an embodiment of the present invention. And FIG. 12 is a drawing showing a shape in which a plurality of openings (351, 352) are formed in a heat dissipation plate (340) in a driving device (300) according to one embodiment of the present invention.

[0131] A driving device (300) according to one embodiment of the present invention may include a printed circuit board (310) which is a timing controller. A main IC (320) and a memory (330) may be mounted on the upper surface of the printed circuit board (310).

[0132] Here, the main IC (320) is an electronic component that integrates many components into a single chip to process signals. And the memory (330) mounted on the upper surface of the printed circuit board (310) adjacent to the main IC (320) may include a DDR (Double Data Rate) memory (330).

[0133] As the speed of the circuit operation frequency increases recently, the clock frequency of the device exchanging data with the memory (330) increases, and the need to read data from the memory (330) having a very high bandwidth is gradually increasing. And the DDR memory (330) operates at a relatively high clock speed and transmits data during two transitions of the clock cycle.

[0134] As a result of using a high-frequency DDR memory (330), the phenomenon of the highest EMI noise occurs around the memory (330) mounted on the upper surface of the printed circuit board (310), and between the main IC (320) and the memory (330).

[0135] Conventionally, to reduce EMI noise, a separate conductive member that shields electromagnetic waves is installed between the printed circuit board and the cover member, or the ground area is expanded through screw fastening to reduce EMI noise. However, in this case, there is a problem that separate manufacturing costs or additional manufacturing processes are required to install the conductive member, and there is a problem that there is variation in the reduction of EMI noise due to screw fastening.

[0136] Accordingly, the driving device (300) according to one embodiment of the present invention is intended to provide a method for more stably reducing EMI noise without the need for separate additional materials.

[0137] Accordingly, a driving device (300) according to one embodiment of the present invention may include a heat dissipation plate (340) that is spaced apart from the upper surface of a printed circuit board (310) by a certain distance (G) and contacts a main IC (320), as shown in FIGS. 4 and FIGS. 10. Here, the heat dissipation plate (340) may serve to absorb heat generated from the main IC (320).

[0138] The heat dissipation plate (340) may be made of a metal material or have its outer surface plated with metal. The main IC (320) and the heat dissipation plate (340) may be in contact with the main IC (320) to absorb and conduct high-temperature heat generated by the operation of the main IC (320).

[0139] In a driving device (300) according to one embodiment of the present invention, an opening (350) may be formed in a heat dissipation plate (340) at a position corresponding to a memory (330). Here, the opening (350) may be formed with a size that includes the size of the memory (330) and the size of an area (311) where a connecting line electrically connecting the main IC (320) to the memory (330) is arranged.

[0140] EMI noise is mainly generated around the memory (330), particularly in the area (311) where the connection line between the main IC (320) and the memory (330) is placed. At this time, the generated EMI noise is reflected by the upper surface of the printed circuit board (310) and the heat dissipation plate (340), and is amplified as a result of the superposition. The amplified EMI noise is then conducted between the printed circuit board (310) and the heat dissipation plate (340).

[0141] As described above, since the directivity increases with higher frequency, the amplified EMI noise is radiated from the opening (350) formed in the heat dissipation plate (340) and the edges of the heat dissipation plate (340). This radiated EMI noise causes problems such as malfunction of electronic devices or adverse effects on the human body.

[0142] Accordingly, the driving device (300) according to one embodiment of the present invention aims to reduce EMI noise by allowing the original EMI noise to be freely radiated through the opening (350) before the EMI noise is reflected and superimposed on the upper surface of the printed circuit board (310) and the heat dissipation plate (340) and amplified.

[0143] Below, the effect of reducing EMI noise through the driving device (300) of the present invention will be explained.

[0144] FIG. 6 is a drawing showing Case 1 in which no opening (350) is formed in the heat dissipation plate (340). FIG. 7 (a) is data analyzing EMI noise for Case 1 of FIG. 6, and FIG. 7 (b) is a drawing showing region B, which is the cross-sectional area of ​​FIG. 7 (a).

[0145] As described above, EMI noise generated in the area (311) where the connection line between the main IC (320) and the memory (330) is placed is reflected and amplified by the heat dissipation plate (340) which is spaced apart from the upper surface of the printed circuit board (310) by a certain distance (G), and superposition occurs.

[0146] And the amplified EMI noise is conducted between the printed circuit board (310) and the heat dissipation plate (340). Since the directivity increases with higher frequency, the amplified EMI noise is radiated from the edges of the heat dissipation plate (340).

[0147] FIG. 8 is a drawing illustrating Case 2 in which an opening (350) is formed in a heat dissipation plate (340) at a location unrelated to the memory (330). FIG. 9 (a) is data analyzing EMI noise for Case 2 of FIG. 8, and FIG. 9 (b) is a drawing illustrating region C, which is a cross-sectional area of ​​FIG. 9 (a).

[0148] As described above, EMI noise generated in the area (311) where the connection line between the main IC (320) and the memory (330) is placed is reflected and amplified by the heat dissipation plate (340) which is spaced apart from the upper surface of the printed circuit board (310) by a certain distance (G), and superposition occurs.

[0149] And the amplified EMI noise is conducted between the printed circuit board (310) and the heat dissipation plate (340). Since the directivity increases with higher frequency, the amplified EMI noise is radiated from the opening (350) formed in the heat dissipation plate (340) and the edge of the heat dissipation plate (340).

[0150] As a result of comparing the data of FIG. 9 with the data of FIG. 7, it was confirmed that EMI noise is primarily radiated through the opening (350), thereby reducing the EMI noise radiated from the edge of the heat dissipation plate (340). However, it was confirmed that when the opening (350) is not formed at a position corresponding to the memory (330), amplified EMI noise is still radiated between the printed circuit board (310) and the heat dissipation plate (340).

[0151] To solve these problems, a driving device (300) according to one embodiment of the present invention may include an opening (350) formed at a position corresponding to the memory (330) in a heat dissipation plate (340) as shown in FIGS. 4 and 5.

[0152] Here, the opening (350) may be formed with a size including the size of the memory (330) and the size of the area (311) where the connecting line electrically connecting the main IC (320) to the memory (330) is placed.

[0153] By doing so, EMI noise generated in the area (311) where the connection line between the main IC (320) and the memory (330) is placed can be reduced by allowing the original EMI noise to be freely radiated through the opening (350) before it is reflected and superimposed on the heat dissipation plate (340) and amplified.

[0154] FIG. 10(a) is data analyzing EMI noise when an opening (350) is formed in a heat dissipation plate (340) at a position corresponding to the memory (330) in a driving device (300) according to one embodiment of the present invention, and FIG. 10(b) is a drawing showing region D, which is a cross-sectional area of ​​FIG. 10(a).

[0155] As a result of comparing with the data of FIGS. 7 and FIG. 9 described above, it was confirmed that the driving device (300) according to one embodiment of the present invention significantly reduces the EMI noise radiated from the edge of the heat dissipation plate (340). This is because the original EMI noise is freely radiated through the opening (350) formed at a position corresponding to the memory (330) before the EMI noise is reflected, superimposed, and amplified on the heat dissipation plate (340).

[0156] In addition, to achieve this effect, the driving device (300) according to one embodiment of the present invention may have an opening (350) formed in the heat dissipation plate (340) formed so that the main IC (320) is not exposed. Furthermore, in the driving device (300) according to one embodiment of the present invention, at least one electronic component is mounted adjacent to the main IC (320) and memory (330) on the upper surface of the printed circuit board (310), and to achieve the above-described effect, the opening (350) may be formed so that the electronic component is not exposed.

[0157] By doing so, the driving device (300) according to one embodiment of the present invention can reduce EMI noise by minimizing the phenomenon in which EMI noise generated in the area (311) where the connection line between the main IC (320) and the memory (330) is placed is reflected on the upper surface of the printed circuit board (310) and the heat dissipation plate (340) and superimposed, thereby amplifying the noise.

[0158] FIG. 11 is data for explaining the effect of reducing EMI noise through a driving device (300) according to an embodiment of the present invention. The data in FIG. 11 is data for measuring EMI noise for Case 1, in which no opening (350) is formed in the heat dissipation plate (340) described above through FIG. 6; Case 2, in which an opening (350) is formed in the heat dissipation plate (340) at a location unrelated to the memory (330); and this case, in which an opening (350) is formed in the heat dissipation plate (340) at a location corresponding to the memory (330).

[0159] In the graph of FIG. 11, the horizontal axis represents frequency (MHz), and the vertical axis represents EMI noise level (dBμV / m). The table shown in FIG. 11 is a table showing the measured EMI noise levels for the aforementioned Case 1, Case 2, and the present case in the 925 MHz, 1850 MHz, 2775 MHz, and 3700 MHz clock frequency bands of the memory (330).

[0160] The clock frequency mainly used by the DDR memory (330) for applying a driving signal to the display panel (151) in the driving device (300) according to one embodiment of the present invention is the 925 MHz, 1850 MHz, and 2775 MHz band.

[0161] As shown in FIG. 11, it was confirmed that Case 1, in which no opening (350) is formed in the heat dissipation plate, has the highest EMI noise level. In the case of Case 2, in which an opening (350) is formed in the heat dissipation plate (340) at a location unrelated to the memory (330), it was confirmed that the EMI noise level in the frequency band is relatively lower compared to Case 1. That is, it was confirmed that radiating EMI noise through the opening (350) is a method to reduce EMI noise.

[0162] Furthermore, in the case of this case, in which an opening (350) is formed in the heat dissipation plate (340) at a position corresponding to the memory (330), it was confirmed that the EMI noise level was significantly lower compared to Case 2. In particular, as shown in the table of FIG. 11, at clock frequency bands of 925 MHz, 1850 MHz, and 2775 MHz where the above-described DDR memory (330) is mainly used, it was confirmed that the EMI noise level was lower by 7.8 dBμV / m, 10.4 dBμV / m, and 9.8 dBμV / m, respectively, compared to Case 2.

[0163] Accordingly, by forming an opening (350) in the heat dissipation plate (340) at a position corresponding to the memory (330), the phenomenon in which EMI noise generated in the area (311) where the connection line between the main IC (320) and the memory (330) is placed is reflected and superimposed on the upper surface of the printed circuit board (310) and the heat dissipation plate (340) and amplified is minimized, thereby reducing EMI noise and ensuring a sufficient EMI margin, can be confirmed through experiment.

[0164] Accordingly, the driving device (300) according to one embodiment of the present invention has the effect of reducing EMI noise by forming an opening (350) in the heat dissipation plate (340) at a position corresponding to the memory (330) and allowing the original EMI noise to be freely radiated as is before the EMI noise is superimposed and amplified.

[0165] Referring again to FIG. 5, in order to process data faster, a driving device (300) according to one embodiment of the present invention may have a plurality of memories (330) mounted adjacent to a main IC (320) on the upper surface of a printed circuit board (310). At this time, the plurality of memories (330) may be mounted adjacent to one side of the main IC (320).

[0166] In this case, in order to ensure that EMI noise between the main IC (320) and the multiple memories (330) is not reflected by the heat dissipation plate (340) but is instead radiated directly, the opening (350) may be formed so that the multiple memories (330) are exposed. That is, the opening (350) may be formed with a size that includes the size of the multiple memories (330) and the size of the area (311) where the connecting line electrically connecting the main IC (320) to the multiple memories (330) is placed.

[0167] Additionally, as shown in FIG. 12, in order to ensure that EMI noise between the main IC (320) and the plurality of memories (330) is not reflected by the heat dissipation plate (340) but is radiated directly, the heat dissipation plate (340) may have a plurality of openings (351, 352) corresponding to the number of memories (330) formed at positions corresponding to each of the plurality of memories (330).

[0168] And the plurality of openings (351, 352) can be formed with a size including the size of each of the plurality of memories (330) and the size of the area (311) where the connecting line electrically connecting the main IC (320) in the plurality of memories (330) is placed.

[0169] At this time, in order to ensure that EMI noise is not reflected by the heat dissipation plate (340) but is radiated directly, the multiple openings (351, 352) may be formed with different sizes so that the main IC is not exposed. Similarly, the multiple openings (351, 352) may be formed with different sizes so that electronic components are not exposed.

[0170] Additionally, on the upper surface of the printed circuit board (310), in addition to the main IC (320) and memory (330), other electronic components may be mounted adjacent to the main IC (320) and memory (330) as described above. In this case, in order to ensure that EMI noise is not reflected by the heat dissipation plate (340) but is radiated directly, it is necessary to form a plurality of openings (351, 352) so that other electronic components are not exposed.

[0171] For this reason, a plurality of openings (351, 352) formed in the heat dissipation plate (340) may be formed in different sizes so as not to expose electronic components. More specifically, referring to FIG. 5 and FIG. 12 together, in a driving device (300) according to one embodiment of the present invention, the opening (350) may be formed in a size including the size of the memory (330) and the size of the area (311) where a connecting line electrically connecting the main IC (320) to the memory (330) is placed.

[0172] For example, as shown in FIG. 12, the size of each opening (351, 352) corresponding to one memory (330) may be 25mm x 17mm. In this case, the lengths of L3 and L4 may be 25mm, and the length of L5 may be 17mm. Or, the lengths of L3 and L4 may be 17mm, and the length of L5 may be 25mm.

[0173] In addition, as described above, the multiple openings (351, 352) can be formed in different sizes so that the main IC (320) is not exposed and the electronic components are not exposed. In this case, the lengths of L3 and L4 can be formed differently.

[0174] Again, referring to FIG. 5, in a driving device (300) according to one embodiment of the present invention, the opening (350) may be formed with a size including the size of a plurality of memories (330) and the size of an area (311) in which a connecting line electrically connecting the main IC (320) to the plurality of memories (330) is arranged.

[0175] At this time, as described above through FIG. 12, the size of each opening (351, 352) corresponding to one memory (330) may be 25mm x 17mm, and the opening (350) shown in FIG. 5 may be formed with the size of an opening (350) corresponding to two memories (330). For example, the length of L1 may be 50mm, and the length of L2 may be 17mm.

[0176] Furthermore, considering the spacing between the memories (330), the opening (350) may be formed with a larger size than the opening (350) corresponding to the two memories (330) described above. For example, the length of L1 may be formed with a length longer than 50 mm.

[0177] In addition, in a driving device (300) according to one embodiment of the present invention, a heat dissipation plate (340) may be positioned at a certain distance (G) from the upper surface of a printed circuit board (310), as shown in FIG. 10. High-temperature heat is generated on the printed circuit board (310) depending on the operation of the main IC (320) and memory (330) mounted on the upper surface of the printed circuit board (310). By preventing the heat dissipation plate (340) and the printed circuit board (310) from coming into direct contact, heat can be released through the opening (350) formed in the heat dissipation plate (340).

[0178] In addition, as described above, the heat dissipation plate (340) may be made of metal or have its outer surface plated with metal, thereby allowing the heat generated from the printed circuit board (310) to be absorbed or the heat to be conducted to the heat dissipation plate (340).

[0179] In addition, the opening (350) formed in the heat dissipation plate (340) in the driving device (300) according to one embodiment of the present invention may include a polygonal shape. This is so that the opening (350) is formed with a size corresponding to the shape of the main IC (320) and the memory (330), including the size of the memory (330) and the size of the area (311) where the connecting line electrically connecting the memory (330) to the main IC (320) is arranged, while preventing the main IC (320) from being exposed.

[0180] At the same time, ease of processing can be ensured in forming the opening (350) in the heat dissipation plate (340). Additionally, in a display device (100) equipped with a driving device (300) according to an embodiment of the present invention described above through FIGS. 1 to 3, the display panel (151) may include an OLED (Organic Light Emitting Diodes) panel. In particular, given that recent OLED TVs require larger displays, high brightness, and high response speeds, there has been a problem of reduced product lifespan due to EMI noise and internal heat generation.

[0181] Accordingly, the above-mentioned problems can be solved by reducing EMI noise and solving the internal heat generation problem through the driving device (300) according to one embodiment of the present invention.

[0182] In summary, the driving device according to the present invention and the display device equipped therewith can reduce EMI noise without installing a separate conductive member to shield electromagnetic waves through an opening formed in a heat dissipation plate. Furthermore, by forming an opening in the heat dissipation plate at a position corresponding to the memory, the EMI noise can be reduced by allowing the original EMI noise to be freely radiated through the opening before it is reflected, superimposed, and amplified by the heat dissipation plate. Additionally, by releasing heat generated by the operation of electronic components mounted on a printed circuit board through the opening formed in the heat dissipation plate, it is possible to prevent the electronic device from malfunctioning or being damaged.

[0183] The foregoing detailed description should not be interpreted restrictively in all respects and should be considered exemplary. The scope of the invention shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of the invention are included within the scope of the invention.

Claims

1. A printed circuit board having a main IC and a memory adjacent to the main IC mounted on its upper surface; and It includes a heat dissipation plate that is spaced apart from the upper surface of the printed circuit board by a certain distance and contacts the main IC, and The above heat dissipation plate is, It includes an opening formed at a position corresponding to the memory above, and The above opening is, A driving device formed with a size including the size of the memory and the size of an area where a connecting line electrically connecting the main IC to the memory is arranged.

2. In Paragraph 1, The above opening is, A driving device characterized by being formed so as not to expose the main IC.

3. In Paragraph 1, The above memory is, A plurality of units are mounted adjacent to one side of the main IC, and The above opening is, A driving device characterized by being formed with a size including the size of the plurality of memories and the size of an area in which a connecting line electrically connecting the main IC to the plurality of memories is arranged.

4. In Paragraph 1, At least one electronic component is mounted adjacent to the main IC and the memory on the upper surface of the printed circuit board, and The above opening is, A driving device characterized by being formed so that the above electronic component is not exposed.

5. In Paragraph 1, The above memory is, Multiple units are mounted adjacent to the main IC, and The above opening is, A driving device characterized by having a plurality of memory units formed at positions corresponding to each of the plurality of memory units.

6. In Paragraph 5, The above plurality of openings are, A driving device characterized by having different sizes formed so as not to expose the main IC.

7. In Paragraph 1, The above heat dissipation plate is, A driving device characterized by including a metal material to absorb heat generated from the main IC above, or having an outer surface plated with metal.

8. In Paragraph 1, The above opening is, A driving device characterized by including a polygonal shape.

9. A display panel that outputs an image; A printed circuit board that provides a driving signal to the above-mentioned display panel and has a main IC and a memory adjacent to the main IC mounted on its upper surface; and It includes a heat dissipation plate that is spaced apart from the upper surface of the printed circuit board by a certain distance and contacts the main IC, and The above heat dissipation plate is, It includes an opening formed at a position corresponding to the memory above, and The above opening is, A display device formed with a size including the size of the memory and the size of an area where a connecting line electrically connecting the main IC to the memory is arranged.

10. In Paragraph 9, The above opening is, A display device characterized by being formed so as not to expose the main IC.

11. In Paragraph 9, The above memory is, A plurality of units are mounted adjacent to one side of the main IC, and The above opening is, A display device characterized by being formed with a size including the size of the plurality of memories and the size of an area in which a connecting line electrically connecting the main IC to the plurality of memories is arranged.

12. In Paragraph 9, At least one electronic component is mounted adjacent to the main IC and the memory on the upper surface of the printed circuit board, and The above opening is, A display device characterized by being formed so that the above electronic component is not exposed.

13. In Paragraph 9, The above memory is, Multiple units are mounted adjacent to the main IC, and The above opening is, A display device characterized by having a plurality of memory units formed at positions corresponding to each of the plurality of memory units.

14. In Paragraph 13, The above plurality of openings are, A display device characterized by having different sizes formed so as not to expose the main IC.

15. In Paragraph 9, The above display panel is, A display device characterized by including an OLED panel.

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