Heat dissipation module and heat dissipation system

Abstract

The present application relates to the fields of heat dissipation, servers, etc., and discloses a heat dissipation module and a heat dissipation system. The heat dissipation module is used for dissipating heat of an electronic device. The electronic device comprises a device housing, and a primary heating element and a secondary heating element which are arranged in the device housing. The device housing is provided with a first input port for inputting a heat dissipation medium and a first output port for outputting the heat dissipation medium; and the first input port and the first output port are separately communicated with an inner cavity of the device housing. The heat dissipation module is adapted to be arranged in the device housing. The heat dissipation module comprises a first pump body, a first transfer pipe and a heat dissipation member; an inlet of the first pump body is adapted to be communicated with the inner cavity of the device housing, and an outlet of the first pump body is connected to the first transfer pipe; the first transfer pipe is adapted to be communicated with a device main body; and the heat dissipation member is connected to the first transfer pipe, and is adapted to be in contact with the primary heating element.

Description

Heat dissipation module and heat dissipation system

[0001] Cross-references

[0002] This application claims priority to Chinese Patent Application No. 202411853283.4, filed on December 16, 2024, entitled "Heat Dissipation Module and Heat Dissipation System", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application belongs to the technical fields of heat dissipation and servers, and specifically relates to a heat dissipation module and heat dissipation system. Background Technology

[0004] In the context of the digital age, production and daily life are inseparable from the support of computing power. With the continuous increase in computing power demand, chip power consumption and heat flux density are also increasing, resulting in high pressure and cost for traditional air cooling, which cannot meet energy-saving requirements.

[0005] Immersion liquid cooling technology is a novel, efficient, green, and energy-saving cooling solution with high heat dissipation efficiency. Single-phase immersion liquid cooling systems in this technology primarily utilize dielectric liquids as the thermally conductive cooling medium to remove heat generated by various components in electronic devices.

[0006] However, due to the significant differences in power consumption among different components, the coolant in the immersion chamber is no longer sufficient to meet the heat dissipation requirements of chips with high heat flux densities. To meet the heat dissipation requirements of high heat flux density chips, the circulation rate of the coolant must be continuously increased to improve heat exchange efficiency, but increasing the circulation rate will increase heat dissipation power consumption. Summary of the Invention

[0007] The purpose of this application is to provide a heat dissipation module and a heat dissipation system.

[0008] This application provides a heat dissipation module for cooling an electronic device. The electronic device includes a housing and a primary heat-generating device and a secondary heat-generating device disposed within the housing. The housing has a first input port for inputting a heat dissipation medium and a first output port for outputting a heat dissipation medium. The first input port and the first output port are respectively connected to the inner cavity of the housing. The heat dissipation module is disposed within the housing and includes a first pump body, a first delivery pipeline, and a heat dissipation component. The inlet of the first pump body is connected to the inner cavity of the housing, and the outlet of the first pump body is connected to the first delivery pipeline, which is connected to the inner cavity of the housing. The heat dissipation component is connected to the first delivery pipeline and is used to contact the primary heat-generating device.

[0009] This application embodiment also provides a heat dissipation system, including: a housing, a heat dissipation path, and the aforementioned heat dissipation module; the housing is used to accommodate a heat dissipation medium and the electronic device, and the inner cavity of the housing is used to communicate with the first input port and the first output port respectively; the input end and the output end of the heat dissipation path are respectively communicated with the inner cavity of the housing. Attached Figure Description

[0010] Figure 1 is a first schematic diagram of the heat dissipation module and main heat-generating devices disclosed in an embodiment of this application;

[0011] Figure 2 is a second schematic diagram of the heat dissipation module and main heat-generating devices disclosed in the embodiments of this application;

[0012] Figure 3 is a schematic diagram of the heat dissipation module and electronic device disclosed in the embodiments of this application;

[0013] Figure 4 is a schematic diagram of the finned heat sink disclosed in the embodiments of this application;

[0014] Figure 5 is a schematic diagram of the heat pipe radiator disclosed in an embodiment of this application;

[0015] Figure 6 is a schematic diagram of the manifold radiator disclosed in an embodiment of this application;

[0016] Figure 7 is a schematic diagram of the VC composite fin heat sink disclosed in the embodiments of this application;

[0017] Figure 8 is a schematic diagram of the VC composite heat pipe radiator disclosed in the embodiments of this application;

[0018] Figure 9 is a schematic diagram of the VC composite manifold heat sink disclosed in the embodiments of this application.

[0019] Figure 10 is a schematic diagram of the first type of heat dissipation system and electronic device disclosed in the embodiments of this application;

[0020] Figure 11 is a schematic diagram of a second type of heat dissipation system and electronic device disclosed in the embodiments of this application.

[0021] Explanation of reference numerals in the attached drawings: 01-Heat dissipation system; 10-Heat dissipation module; 11-First pump body; 12-First delivery pipeline; 13-Heat dissipation component; 14-Flow regulating valve; 15-Flow equalization shroud; 16-Bearing component; 20-Box; 21-Receiving cavity; 22-Overflow cavity; 23-Baffle; 231-Overflow hole; 24-Second input port; 25-Second output port; 26-Flow equalization cavity; 27-First branch pipeline; 271-First main pipeline; 272-First branch pipeline; 28-Second branch pipeline Piping; 281-Second main pipeline; 282-Second branch pipeline; 30-Heat dissipation path; 31-Second delivery pipeline; 32-Second pump body; 33-Heat exchange device; 34-Third delivery pipeline; 35-Cooling device; 41-First temperature detection element; 42-Second temperature detection element; 43-Third temperature detection element; 44-Fourth temperature detection element; 45-Liquid level detection element; 02-Electronic equipment; 021-Equipment housing; 022-Main heat-generating device; 023-Secondary heat-generating device. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0024] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0025] Referring to Figures 1 to 11, this application discloses a heat dissipation module 10 for dissipating heat from an electronic device 02 to prevent damage to some components of the electronic device 02 due to overheating during operation, thus ensuring the normal operation of the electronic device 02. Exemplarily, the electronic device 02 can be a server, switch, etc., and can be applied to high-performance electronic devices 02 with high computing power requirements, such as those used in aerospace and artificial intelligence. Of course, it can also be in other forms, which are not specifically limited here. Furthermore, it can be other devices requiring heat dissipation, which are also not specifically limited here.

[0026] Electronic device 02 may include a housing 021, a primary heat-generating device 022, and a secondary heat-generating device 023. Both the primary and secondary heat-generating devices 022 and 023 are housed within the housing 021, which serves to house and protect them. It should be noted that the primary heat-generating device 022 generates and dissipates more heat during operation, resulting in a higher operating temperature; while the secondary heat-generating device 023 generates and dissipates less heat than the primary heat-generating device 022, resulting in a lower operating temperature.

[0027] For example, the primary heat-generating device 022 can be a chip such as a GPU or CPU, while the secondary heat-generating device 023 can be some low-power electrical components. In addition, the electronic device 02 may also include other electrical components to ensure its normal operation. The specific structure and working principle of the electronic device 02 can be referred to the prior art, and will not be described in detail here.

[0028] To achieve heat dissipation and cooling of the primary heat-generating device 022 and the secondary heat-generating device 023, the device housing 021 may have a first input port and a first output port, which are respectively connected to the inner cavity of the device housing 021. The first input port is used to input a heat dissipation medium into the device housing 021, allowing the medium to contact the primary and secondary heat-generating devices 022 and 023 for heat dissipation. The first output port allows the heat dissipation medium, which has absorbed heat and increased in temperature, to flow out of the device housing 021. This ensures the circulation of the heat dissipation medium within the device housing 021, carrying away the heat dissipated by the primary and secondary heat-generating devices 022 and 023. Optionally, the heat dissipation medium can be an electronic dielectric coolant such as fluorinated liquid, a mineral oil-based working fluid such as insulating oil, or other forms, which are not specifically limited here.

[0029] Optionally, the first input port can be positioned lower than the first output port, allowing the heat dissipation medium to flow from bottom to top within the device housing 021, which improves heat dissipation efficiency. For example, the first input port can be located at the bottom of the device housing 021, and the first output port can be located at the top of the device housing 021.

[0030] In this embodiment, the heat dissipation module 10 is disposed inside the device housing 021. The heat dissipation module 10 is used to achieve targeted heat dissipation of the main heat-generating components 022, thereby improving heat dissipation efficiency.

[0031] Referring to Figures 1 to 3, the heat dissipation module 10 includes a first pump body 11, a first delivery pipe 12, and a heat sink 13. The inlet of the first pump body 11 communicates with the inner cavity of the device housing 021, allowing the heat dissipation medium entering the inner cavity of the device housing 021 via the first input port to be drawn in by the first pump body 11. Alternatively, in other embodiments, the inlet of the first pump body 11 may also be connected separately to a heat dissipation medium pipe outside the device housing 021 via a separate pipe. Exemplarily, the first pump body 11 can be a centrifugal pump, a micropump, etc. Furthermore, the first pump body 11 can be a variable frequency pump to adjust the operating frequency according to the power consumption of the main heat-generating device 022. Optionally, the heat sink 13 may have a heat dissipation cavity to accommodate the main heat-generating device 022; of course, the main heat-generating device 022 may also be disposed on the outside of the heat sink 13, forming good contact.

[0032] The first delivery pipe 12 is used to communicate with the inner cavity of the equipment housing 021, and the heat sink 13 is connected to the first delivery pipe 12 and is used to contact the main heat-generating device 022. Thus, under the action of the first pump body 11, the heat dissipation medium in the equipment housing 021 can enter the first delivery pipe 12 and be delivered to the heat sink 13 through the first delivery pipe 12. This allows the heat dissipation medium entering the heat sink 13 to absorb the heat emitted by the main heat-generating device 022, thereby achieving heat dissipation and cooling of the main heat-generating device 022 to prevent the main heat-generating device 022 from overheating. The heat dissipation medium that has absorbed heat and heated up can flow back to the first delivery pipe 12 and then back to the equipment housing 021 through the first delivery pipe 12, and finally flow out through the first output port.

[0033] Referring to Figures 1 and 3, in some embodiments, the electronic device 02 may include multiple main heat-generating devices 022. Correspondingly, the heat dissipation module 10 may include multiple first delivery pipes 12 and multiple heat sinks 13. The multiple heat sinks 13 are disposed one-to-one with the multiple first delivery pipes 12, and the multiple main heat-generating devices 022 are in contact with the multiple heat sinks 13. The multiple first delivery pipes 12 may all be connected to the same first pump body 11. In this way, under the action of the first pump body 11, heat dissipation medium can be delivered to the multiple heat sinks 13 through the multiple first delivery pipes 12 respectively, so as to dissipate heat and cool down the multiple main heat-generating devices 022 through the multiple heat sinks 13 respectively. Of course, there may also be multiple first pump bodies 11, which supply heat dissipation medium to the multiple first delivery pipes 12 respectively.

[0034] In other embodiments, multiple main heat-generating devices 022 may also share the same heat sink 13, so that the multiple main heat-generating devices 022 can be cooled down by the same heat sink 13.

[0035] In this embodiment, under the action of the first pump body 11, the cooling medium can enter the heat sink 13 through the first delivery pipe 12, so that the cooling medium can contact the main heat-generating device 022 located at the first heat sink 13, thereby removing the heat emitted by the main heat-generating device 022 to achieve the effect of heat dissipation and cooling, and preventing the main heat-generating device 022 from being damaged due to excessive temperature; in addition, the cooling medium can also enter the device housing 021 through the first input port and contact the secondary heat-generating device 023 inside the device housing 021, thereby removing the heat emitted by the secondary heat-generating device 023 to achieve the effect of heat dissipation and cooling.

[0036] Based on the above settings, the embodiments of this application can perform targeted heat dissipation and cooling on the main heat-generating device 022 and the secondary heat-generating device 023 with different heat dissipation amounts. This allows the heat dissipation medium to be supplied to the main heat-generating device 022 without increasing the overall heat dissipation medium flow rate, thereby ensuring the heat dissipation effect on different heat-generating devices in the electronic device 02 without increasing the overall heat dissipation power consumption of the heat dissipation module.

[0037] Referring to Figures 1 to 9, in some embodiments, the heat dissipation module 10 may include a flow equalization shroud 15, which is disposed within the device housing 021. The inlet of the flow equalization shroud 15 is connected to the first input port, and the outlet of the flow equalization shroud 15 is connected to the inlet of the first pump body 11. Based on this configuration, the flow equalization shroud 15 can collect the heat dissipation medium, allowing a portion of the heat dissipation medium entering the device housing 021 through the first input port to flow into the flow equalization shroud 15, and then into the first pump body 11. Finally, it is delivered to the heat sink 13 via the first delivery pipe 12, thereby achieving a cooling effect on the main heat-generating device 022.

[0038] Optionally, there is a certain gap between the inlet of the flow equalizer 15 and the wall of the equipment housing 021 with the first input port, so that another part of the heat dissipation medium entering the equipment housing 021 through the first input port can enter the area of ​​the equipment housing 021 located outside the flow equalizer 15, so as to ensure that the other part of the heat dissipation medium can contact the secondary heat-generating device 023 in the equipment housing 021 and achieve the heat dissipation effect on the secondary heat-generating device 023.

[0039] For example, the flow equalization shroud 15 can be a cylindrical shroud, a polygonal shroud, an elliptical shroud, etc., and of course, it can also be other forms, which are not specifically limited here. In addition, the cross-sectional area of ​​the inlet of the flow equalization shroud 15 can be larger than the cross-sectional area of ​​the outlet to improve the collection effect of the heat dissipation medium, and the flow velocity of the heat dissipation medium can be increased at the outlet, making it easier for the heat dissipation medium to be sucked into the first pump body 11.

[0040] Referring to Figures 1 and 3, in some embodiments, the heat dissipation module 10 may further include a support member 16, which is used to be disposed on the inner side wall of the device housing 021; the first delivery pipe 12 may be disposed on the support member 16, so that the first delivery pipe 12 can be installed on the inner side wall of the device housing 021 through the support member 16, thereby ensuring the stability of the first delivery pipe 12.

[0041] In other embodiments, the heat sink 13 may be disposed on the support member 16 so that the heat sink 13 can be installed on the inner wall of the device housing 021 through the support member 16, thereby ensuring the stability of the heat sink 13.

[0042] In other embodiments, the first delivery pipe 12 and the heat sink 13 may both be disposed on the support member 16, so that the first heat sink pipe and the heat sink 13 can be installed on the inner side wall of the equipment housing 021 through the support member 16, thereby ensuring the stability of the first delivery pipe 12 and the heat sink 13.

[0043] Furthermore, the carrier 16 is movable relative to the equipment housing 021, so that at least one of the first delivery pipe 12 and the heat sink 13 can move and change position within the equipment housing 021, thereby cooling down the main heat-generating device 022 at different locations within the equipment housing 021 and improving the applicability of the heat dissipation module 10.

[0044] Optionally, the carrier 16 can be slidably connected to the inner wall of the equipment housing 021 via a slide rail or other means; of course, it can also move relative to the equipment housing 021 in other ways, which are not specifically limited here.

[0045] To regulate the flow rate of the heat dissipation medium, the heat dissipation module 10 may also include a flow regulating valve 14, as shown in Figures 1 and 3. The flow regulating valve 14 is connected to the first delivery pipeline 12 and is located between the first pump body 11 and the heat sink 13. In this way, the flow rate of the heat dissipation medium delivered in the first delivery pipeline 12 can be regulated by the flow regulating valve 14, so as to satisfy the heat dissipation effect of the main heat-generating device 022, and also to deliver the excess heat dissipation medium to other heat-generating devices, thereby improving the utilization rate of the heat dissipation medium.

[0046] It should be noted that the heat dissipation module 10 may also include a pressure relief pipeline equipped with a pressure relief valve. This pressure relief pipeline is connected to the first delivery pipeline 12 at the position between the first pump body 11 and the flow regulating valve 14. Thus, when the flow regulating valve 14 is opened to its full diameter, all the heat dissipation medium supplied by the first pump body 11 is delivered to the heat sink 13 through the first delivery pipeline 12 to maximize the heat dissipation effect on the main heat-generating device 022. When the flow regulating valve 14 is opened to its small diameter, a portion of the heat dissipation medium supplied by the first pump body 11 is delivered to the heat sink 13 through the first delivery pipeline 12. When the flow rate of the heat dissipation medium supplied by the first pump body 11 remains constant, reducing the opening diameter of the flow regulating valve 14 will increase the pressure in the first delivery pipeline 12. Under the action of pressure, the pressure relief valve can be opened, allowing another portion of the heat dissipation medium to flow back into the equipment housing 021 through the pressure relief pipeline.

[0047] In some embodiments, the electronic device 02 may include a plurality of main heat-generating devices 022. In this case, there may be a plurality of first delivery pipes 12 and heat sinks 13 to deliver heat dissipation medium to the plurality of main heat-generating devices 022 respectively. Correspondingly, there may also be a plurality of flow regulating valves 14, which are respectively provided in the plurality of first delivery pipes 12. In this way, the flow rate of heat dissipation medium in the plurality of first delivery pipes 12 can be adjusted by the plurality of flow regulating valves 14 respectively to meet the heat dissipation requirements of each main heat-generating device 022.

[0048] Optionally, the heat sink 13 may include at least one of the following: finned heat sink, microchannel heat sink, heat pipe heat sink, VC composite finned heat sink, VC composite heat pipe heat sink, VC composite cold plate heat sink, manifold heat sink, VC composite manifold heat sink, and two-phase heat sink. The specific type can be selected according to the actual operating conditions.

[0049] As shown in Figure 4, when the heat sink 13 is a finned heat sink or a microchannel heat sink, it may include a current limiting shell, a heat sink body and fins. The fins may be disposed inside the current limiting shell, and the main heat-generating device 022 may be attached to the current limiting shell and disposed adjacent to the fins. By introducing a heat dissipation medium into the current limiting shell, the heat dissipation medium can absorb the heat emitted by the main heat-generating device 022 through the fins and the current limiting shell, so as to achieve heat dissipation and cooling of the main heat-generating device 022.

[0050] As shown in Figure 5, when the heat sink 13 is a heat pipe heat sink, a heat pipe is added to the finned or microchannel heat sink. The heat pipe can pass through multiple fins arranged side by side, which is beneficial to improving heat dissipation efficiency.

[0051] As shown in Figure 6, when the heat sink 13 is a manifold heat sink, it includes a current limiting shell and multiple manifolds. The multiple manifolds are arranged inside the current limiting shell. The main heat-generating device 022 can be attached to the current limiting shell. In this way, the heat dissipation and cooling effect of the main heat-generating device 022 can be achieved by introducing heat dissipation medium into the current limiting shell and the manifolds.

[0052] As shown in Figure 7, when the heat sink 13 is a VC composite fin heat sink or a VC microchannel heat sink, a uniform temperature VC is added on the basis of the above-mentioned fin heat sink or microchannel heat sink. The uniform temperature VC is set on the outside of the current limiting shell and is set in correspondence with the fins. The main heat-generating device 022 is attached to the uniform temperature VC. In this way, when the heat dissipation medium is introduced into the current limiting shell, the heat exchange efficiency between the heat dissipation medium and the main heat-generating device 022 can be improved by the uniform temperature VC.

[0053] As shown in Figure 8, when the heat sink 13 is a VC composite heat pipe radiator, a uniform temperature VC is added on the basis of the above heat pipe radiator to improve the heat exchange efficiency.

[0054] As shown in Figure 9, when the heat sink 13 is a VC composite manifold heat sink, a uniform temperature VC is added on the basis of the above-mentioned manifold heat sink to improve the heat exchange efficiency.

[0055] It should be noted that the specific structure and working principle of the above-mentioned heat sinks can also be found in other related technologies.

[0056] Based on the aforementioned heat dissipation module 10, this application embodiment also discloses a heat dissipation system 01, which can dissipate heat for multiple electronic devices 02. Optionally, the heat dissipation system 01 can be a horizontal immersion liquid cooling system; exemplaryly, the heat dissipation system 01 can be a single-phase immersion heat dissipation system 01, or a two-phase immersion heat dissipation system 01, etc. The disclosed heat dissipation system 01 includes a housing 20, a heat dissipation path 30, and the aforementioned heat dissipation module 10.

[0057] The enclosure 20 is a basic component that provides a foundation for supporting and housing the electronic device 02. Specifically, the enclosure 20 houses the heat dissipation medium and the electronic device 02, allowing the electronic device 02 to be immersed in the heat dissipation medium within the enclosure 20 to absorb the heat dissipated by the electronic device 02 and achieve a heat dissipation effect. Optionally, multiple electronic devices 02 can be housed within the enclosure 20 to simultaneously dissipate heat and cool multiple electronic devices 02.

[0058] In addition, the inner cavity of the housing 20 is used to communicate with the first input port and the first output port. In this way, the heat dissipation medium inside the housing 20 can enter the device housing 021 of the electronic device 02 through the first input port to achieve the heat dissipation and cooling effect on the main heat-generating device 022 and the secondary heat-generating device 023 inside. The heat dissipation medium that has absorbed heat and heated up then flows back to the housing 20 through the first output port.

[0059] The input and output ends of the heat dissipation path 30 are connected to the inner cavity of the housing 20, respectively. In this way, the heat dissipation medium can be supplied to the housing 20 through the heat dissipation path 30, and the heat dissipation medium that has absorbed heat and heated up can flow out of the housing 20, thereby realizing the circulation of the heat dissipation medium in the housing 20 and improving the heat dissipation effect.

[0060] Referring to Figure 10, in some embodiments, the housing 20 may include a receiving cavity 21 and an overflow cavity 22, wherein the receiving cavity 21 is used to hold the electronic device 02 and the heat dissipation medium, and the overflow cavity 22 is used to recover the heat dissipation medium overflowing from the receiving cavity 21; the receiving cavity 21 and the overflow cavity 22 are separated by a partition 23, and an overflow hole 231 is provided in the area of ​​the partition 23 near the top of the housing 20.

[0061] Furthermore, the enclosure 20 may be provided with a second input port 24 and a second output port 25, wherein the second input port 24 is connected to the output end of the heat dissipation path 30 and the receiving cavity 21, and the second output port 25 is connected to the input end of the heat dissipation path 30 and the overflow cavity 22.

[0062] Based on the above configuration, a heat dissipation medium can be delivered to the housing cavity 21 through the heat dissipation path 30 to dissipate heat and cool down the electronic device 02. The heat dissipation medium, which absorbs heat and heats up, flows into the overflow cavity 22 through the overflow hole 231 and finally flows back to the heat dissipation path 30 through the opening of the overflow cavity 22, thereby realizing the circulation of the heat dissipation medium to dissipate heat and cool down the electronic device 02 in the housing cavity 21.

[0063] Optionally, the output end of the heat dissipation path 30 can be connected to the bottom region of the receiving cavity 21 to allow the heat dissipation medium to flow in from the bottom of the receiving cavity 21. As the amount of heat dissipation medium in the receiving cavity 21 increases, it eventually overflows into the overflow cavity 22 through the overflow hole 231. The input end of the heat dissipation path 30 can be connected to the bottom region of the overflow cavity 22 so that the heat dissipation medium in the overflow cavity 22 can flow back from the bottom to the heat dissipation path 30. Based on this configuration, the electronic device 02 in the receiving cavity 21 can be immersed in the heat dissipation medium, thereby increasing the contact area between the heat dissipation medium and the electronic device 02 and further improving the heat dissipation effect on the electronic device 02.

[0064] Referring again to Figure 10, in some embodiments, the housing 20 may further include a flow equalization cavity 26, which is located at the bottom of the receiving cavity 21. The flow equalization cavity 26 and the receiving cavity 21 are connected by multiple flow equalization holes, and the second input port 24 is connected to the flow equalization cavity 26. Based on this, the heat dissipation medium supplied by the heat dissipation path 30 via the second input port 24 can first enter the flow equalization cavity 26, and then be evenly distributed through the multiple flow equalization holes, so that the evenly distributed heat dissipation medium enters the receiving cavity 21 in a dispersed manner. This can increase the contact area between the heat dissipation medium and the electronic device 02, which is beneficial to improving the heat dissipation efficiency of the electronic device 02.

[0065] Optionally, multiple flow equalization holes can be evenly formed on the top wall of the flow equalization cavity 26 and the bottom wall of the receiving cavity 21 so that the flow equalization cavity 26 and the receiving cavity 21 are in communication.

[0066] In some embodiments, the housing 20 can be used to accommodate a plurality of electronic devices 02 arranged in a horizontal direction, and a plurality of uniform flow holes can be distributed in the surrounding area of ​​each electronic device 02. This can help increase the contact area between the heat dissipation medium and the electronic device 02, thereby improving the heat dissipation efficiency of the electronic device 02.

[0067] In other embodiments, as shown in FIG11, the housing 20 can also be used to accommodate multiple electronic devices 02 arranged in a vertical direction. To achieve heat dissipation for the multiple electronic devices 02, the housing 20 can also be provided with a first diversion pipe 27 and a second diversion pipe 28, so that heat dissipation medium is introduced into the multiple electronic devices 02 through the first diversion pipe 27, and the heat dissipation medium in the multiple electronic devices 02 is discharged through the multiple second diversion pipes 28.

[0068] The first branch pipe 27 may include a first main pipe 271 and a plurality of first branch pipes 272, and the plurality of first branch pipes 272 are respectively connected to the first main pipe 271. The first main pipe 271 is connected to the output end of the heat dissipation path 30 to receive the heat dissipation medium supplied by the heat dissipation path 30. The plurality of first branch pipes 272 are respectively used to connect to the first input ports of the plurality of electronic devices 02. In this way, the heat dissipation medium received by the first main pipe 271 can be distributed to the plurality of electronic devices 02 through the plurality of first branch pipes 272 to facilitate heat dissipation and cooling of the main heat-generating device 022 and the secondary heat-generating device 023 inside the electronic device 02.

[0069] The second branch line 28 may include a second main line 281 and a plurality of second branch lines 282, and the plurality of second branch lines 282 are respectively connected to the second main line 281. The second main line 281 is connected to the input end of the heat dissipation path 30 to deliver a heat dissipation medium that absorbs heat and rises in temperature to the heat dissipation path 30; the plurality of second branch lines 282 are respectively connected to the first output ports of a plurality of electronic devices 02 to receive the heat dissipation medium that absorbs heat and rises in temperature output from the plurality of electronic devices 02.

[0070] It should be noted that, in addition to being connected to the first main pipeline 271 and the second main pipeline 281 respectively, the heat dissipation path 30 can also be connected to the inner cavity of the housing 20 to ensure that the inner cavity of the housing 20 contains heat dissipation medium, thereby immersing the electronic device 02. Furthermore, when multiple electronic devices 02 are arranged vertically, they can also be housed in the receiving cavity 21 of the housing 20, and the heat dissipation medium in the receiving cavity 21 can overflow into the overflow cavity 22 via the overflow hole 231.

[0071] Referring to Figures 10 and 11, in some embodiments, the heat dissipation path 30 may include a second delivery pipe 31, a second pump body 32, and a heat exchange device 33. The input and output ends of the second delivery pipe 31 are respectively connected to the inner cavity of the housing 20, and both the second pump body 32 and the heat exchange device 33 are located within the second delivery pipe 31. Based on this arrangement, the heat dissipation medium that has absorbed heat and heated up flowing out of the housing 20 enters the second delivery pipe 31 and is transported via it to the heat exchange device 33 for heat exchange and cooling, resulting in a cooled heat dissipation medium. Under the action of the second pump body 32, the heat dissipation medium flows back into the housing 20 via the second delivery pipe 31. This cycle allows for the circulation of the heat dissipation medium, thereby achieving heat dissipation and cooling of the electronic device 02 within the housing 20. For example, the second pump body 32 may be a centrifugal pump, a micro pump, an axial flow pump, etc.

[0072] Optionally, along the flow direction of the heat dissipation medium in the second delivery pipeline 31, the second pump body 32 can be located in the downstream region of the heat exchange device 33. That is, the heat dissipation medium after heat exchange can be transported downstream through the second delivery pipeline 31 under the action of the second pump body 32.

[0073] It should be noted that the specific structure and heat exchange principle of the heat exchange device 33 can be referred to the existing technology, and will not be elaborated here.

[0074] Referring again to Figures 10 and 11, in some embodiments, the heat dissipation path 30 may further include a third conveying pipe 34 and a cooling device 35. The cooling device 35 provides a cold source for the entire heat dissipation system 01 and dissipates the heat generated by the heat dissipation system 01 to the outside. The third conveying pipe 34 connects the heat exchange device 33 and the cooling device 35. Thus, the cold source output by the heat exchange device 33 for heat exchange with the heat dissipation medium can be conveyed to the cooling device 35 via the third conveying pipe 34 for cooling. The cooled cold source can then flow back to the heat exchange device 33 via the third conveying pipe 34 to absorb heat from the heat dissipation medium and achieve cooling of the heat dissipation medium.

[0075] It should be noted that the cooling device 35 can be an air-cooled cooling device 35, etc.

[0076] In some embodiments, the heat dissipation path 30 may further include a first temperature detection element 41, a second temperature detection element 42, a third temperature detection element 43, and a fourth temperature detection element 44. The first temperature detection element 41 may be disposed in the second delivery pipe 31 and located downstream of the second pump body 32 to detect the temperature of the heat dissipation medium returning to the housing 20; the second temperature detection element 42 may be disposed in the second delivery pipe 31 and located upstream of the heat exchange device 33 to detect the temperature of the heat dissipation medium output from the housing 20; the third temperature detection element 43 may be disposed in the third delivery pipe 34 and located between the inlet of the heat exchange device 33 and the outlet of the cooling device 35 to detect the temperature of the cold source input to the heat exchange device 33; and the fourth temperature detection element 44 may be disposed in the fourth delivery pipe and located between the outlet of the heat exchange device 33 and the inlet of the cooling device 35 to detect the temperature of the cold source output from the heat exchange device 33.

[0077] For example, the first temperature sensing element 41, the second temperature sensing element 42, the third temperature sensing element 43 and the fourth temperature sensing element 44 can all be temperature sensors.

[0078] The heat dissipation path 30 may also include a liquid level detection element 45, which is disposed on the side wall of the housing 20 for detecting the liquid level of the heat dissipation medium inside the housing 20.

[0079] In this embodiment of the application, the installation process of the heat dissipation system 01 is as follows:

[0080] The cooling device 35 and the heat exchange device 33 are connected through the third conveying pipeline 34, and the heat exchange device 33 is connected to the housing 20 through the second conveying pipeline 31.

[0081] The electronic device 02 is placed in the housing 20, and the flow equalization holes are distributed around the area of ​​each electronic device 02;

[0082] Install the heat dissipation module 10 into the device housing 021 of the electronic device 02, and make the heat dissipation component 13 contact the main heat-generating component 022. Install the first pump body 11 into the device housing 021, and connect the power cord of the first pump body 11 to the power interface of the device housing 021.

[0083] Based on the above configuration, a heat dissipation system 01 for cooling electronic device 02 can be formed. The heat dissipation system 01 includes three parts: the first part is an external circulation part on the primary side, which is cooled by a 35-degree cold source of the cooling device; the second part is a circulation part between the secondary side heat exchange device 33 and the housing 20, which allows the heat exchange medium to exchange heat with the cold source through the heat exchange device 33, thereby cooling the heat dissipation medium; the third part is a local circulation part inside electronic device 02, which dissipates heat from the main heat-generating device 022 and the secondary heat-generating device 023 inside electronic device 02 through the heat dissipation medium.

[0084] The control process of the heat dissipation system 01 in this embodiment is as follows:

[0085] After all the components of the heat dissipation system 01 are installed, the heat dissipation system 01 is run under no-load to detect the operation of each component, including parameters such as the pressure of the delivery pipeline, the temperature of the heat dissipation medium and the cold source, and the liquid level in the box 20.

[0086] Electronic device 02 is powered on, and cooling system 01 is activated;

[0087] Based on the power consumption of the main heat-generating device 022 during operation, the first pump body 11 is frequency-adjusted to adapt to the power consumption changes of the main heat-generating device 022.

[0088] Depending on the heat dissipation requirements of the main heat-generating device 022, the heat sink 13 can be replaced periodically. For example, for the main heat-generating device 022 with medium power consumption and medium heat flux density, a VC heat sink can be used, while for the main heat-generating device 022 with high power consumption and high heat flux density, a VC composite manifold heat sink can be used.

[0089] For the electronic device 02, in addition to the main heat-generating device 022 and the secondary heat-generating device 023, other electronic devices with greater heat dissipation requirements can have their outlets of the first delivery pipe 12 moved to the corresponding positions to further improve the heat dissipation requirements of other electronic devices.

[0090] When the main heat-generating device 022 in the electronic device 02 is partially running, the flow regulating valve 14 on the first delivery pipeline 12 connected to the heat sink corresponding to the non-running main heat-generating device 022 can be closed, and the operating power of the first pump body 11 can be adjusted by frequency conversion to reduce the power consumption of the heat dissipation system 01.

[0091] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A heat dissipation module for dissipating heat from an electronic device (02), the electronic device (02) comprising a device housing (021) and a primary heat-generating device (022) and a secondary heat-generating device (023) disposed within the device housing (021), the device housing (021) having a first input port for inputting a heat dissipation medium and a first output port for outputting a heat dissipation medium; the first input port and the first output port are respectively connected to the inner cavity of the device housing (021); The heat dissipation module (10) is used to be disposed inside the device housing (021). The heat dissipation module (10) includes a first pump body (11), a first delivery pipeline (12), and a heat sink (13). The inlet of the first pump body (11) is used to communicate with the inner cavity of the device housing (021). The outlet of the first pump body (11) is connected to the first delivery pipeline (12). The first delivery pipeline (12) is used to communicate with the inner cavity of the device housing (021). The heat sink (13) is connected to the first delivery pipeline (12) and is used to contact the main heat-generating device (022).

2. The heat dissipation module according to claim 1, wherein, The heat dissipation module (10) also includes a flow equalization shroud (15), the inlet of which is connected to the first input port, and the outlet of which is connected to the inlet of the first pump body (11).

3. The heat dissipation module according to claim 1, wherein, The heat dissipation module (10) further includes a support member (16), which is used to be disposed on the inner side wall of the device housing (021) and is movable relative to the device housing (021); The first delivery pipe (12) and / or the heat dissipation component (13) are disposed on the carrier (16).

4. The heat dissipation module according to claim 1, wherein, The heat dissipation module (10) also includes a flow regulating valve (14), which is connected to the first delivery pipeline (12) and located between the first pump body (11) and the heat dissipation component (13).

5. The heat dissipation module according to claim 1, wherein, The heat sink (13) includes at least one of the following: finned heat sink, microchannel heat sink, heat pipe heat sink, VC composite finned heat sink, VC composite heat pipe heat sink, VC composite cold plate heat sink, manifold heat sink, VC composite manifold heat sink and two-phase heat sink.

6. A heat dissipation system, comprising: The enclosure (20), the heat dissipation path (30), and the heat dissipation module (10) as described in any one of claims 1 to 5; The enclosure (20) is used to house the heat dissipation medium and the electronic device (02), and the inner cavity of the enclosure (20) is used to communicate with the first input port and the first output port respectively; The input and output ends of the heat dissipation path (30) are respectively connected to the inner cavity of the housing (20).

7. The heat dissipation system according to claim 6, wherein, The housing (20) includes a receiving cavity (21) and an overflow cavity (22), the receiving cavity (21) and the overflow cavity (22) are separated by a partition (23), and an overflow hole (231) is provided in the area of ​​the partition (23) near the top of the housing (20); The housing (20) is provided with a second input port (24) and a second output port (25). The second input port (24) is connected to the output end of the heat dissipation path (30) and the receiving cavity (21). The second output port (25) is connected to the input end of the heat dissipation path (30) and the overflow cavity (22).

8. The heat dissipation system according to claim 7, wherein, The housing (20) further includes a flow equalization cavity (26), which is located at the bottom of the receiving cavity (21); The uniform flow cavity (26) and the receiving cavity (21) are connected by a plurality of uniform flow holes (261); The second input port (24) is connected to the uniform flow cavity (26).

9. The heat dissipation system according to claim 8, wherein, The housing (20) is used to accommodate a plurality of the electronic devices (02) arranged in a horizontal direction; Multiple flow equalization holes (261) are distributed around each of the electronic devices (02).

10. The heat dissipation system according to claim 6, wherein, The housing (20) is used to accommodate a plurality of the electronic devices (02) arranged in a vertical direction; The housing (20) is further provided with a first branch pipe (27) and a second branch pipe (28); the first branch pipe (27) includes a first main pipe (271) and a plurality of first branch pipes (272) respectively connected to the first main pipe (271), the first main pipe (271) is connected to the output end of the heat dissipation path (30), and the plurality of first branch pipes (272) are respectively used to connect to the first input ports of the plurality of electronic devices (02); the second branch pipe (28) includes a second main pipe (281) and a plurality of second branch pipes (282) respectively connected to the second main pipe (281), the second main pipe (281) is connected to the input end of the heat dissipation path (30), and the plurality of second branch pipes (282) are respectively used to connect to the first output ports of the plurality of electronic devices (02).

11. The heat dissipation system according to any one of claims 6 to 10, wherein, The heat dissipation path (30) includes a second delivery pipeline (31), a second pump body (32), and a heat exchange device (33); The input and output ends of the second delivery pipeline (31) are respectively connected to the inner cavity of the box (20); The second pump body (32) and the heat exchange device (33) are both located in the second delivery pipeline (31).

12. The heat dissipation system according to claim 11, wherein, The heat dissipation path (30) also includes a third delivery pipeline (34) and a cooling device (35); The third delivery pipeline (34) is connected between the heat exchange device (33) and the cooling device (35).

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