Method and apparatus for locating wire saw anomaly, storage medium, device and product

Abstract

A method and apparatus for locating a wire saw anomaly, a storage medium, a device and a product. The method comprises: acquiring parameters associated with the modification of a cutting process of a wire saw during silicon ingot cutting; performing statistical analysis on the associated parameters to obtain a statistical result; and on the basis of the statistical result and on the basis of a machine serial number, locating an anomaly that has been present in the wire saw, wherein the anomaly is caused by the cutting process, a cutting auxiliary material, or the wire saw itself.

Description

Method, device, storage medium, equipment and product for positioning abnormality of wire saw machine

[0001] The present disclosure claims priority to the Chinese patent application No. 202411895894.5, filed on December 20, 2024, and entitled "Method, device, storage medium, equipment and product for positioning abnormality of wire saw machine", the entire content of which is incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to a method, device, storage medium, equipment and product for positioning abnormality of wire saw machine. BACKGROUND

[0003] The wire saw machine is a machine for cutting silicon rods, and the wire saw machine usually uses diamond wire as a cutting tool. The wire saw machine may occur abnormality due to various reasons during the working process. The wire saw machine can automatically adjust the cutting process according to the abnormality to ensure the continuous cutting work. However, if the wire saw machine frequently modifies the cutting process, it may be that the wire saw machine itself has an abnormality. However, in the related art, whether the wire saw machine has an abnormality can only be determined by stopping and repairing, which reduces the working efficiency of the wire saw machine. SUMMARY

[0004] The following is a summary of the detailed description of the present application. This summary is not intended to limit the scope of protection of the claims.

[0005] In a first aspect, the embodiments of the present disclosure provide a method for positioning abnormality of a wire saw machine, comprising: obtaining associated parameters of a cutting process of a wire saw machine modified during cutting of a silicon rod, wherein the associated parameters comprise: a specification of the silicon rod, a machine number, a modified parameter, a modification frequency and a modification time, and the modified parameter comprises: a parameter type and parameter data; performing statistics on the associated parameters of the cutting process modification to obtain a statistical result; and positioning an abnormality existing in the wire saw machine according to the machine number based on the statistical result, wherein the abnormality is caused by the cutting process, cutting auxiliary materials or the wire saw machine itself.

[0006] In a second aspect, the embodiments of the present disclosure provide a device for locating an abnormality of a wire saw, comprising: an obtaining module configured to obtain associated parameters of a wire saw that are modified during cutting of a silicon rod, wherein the associated parameters comprise: a specification of the silicon rod, a machine number, a modified parameter, a number of modifications, and a modification time, and the modified parameter comprises: a parameter type and parameter data; a statistical module configured to statistically analyze the associated parameters that are modified, to obtain a statistical result; and a locating module configured to locate an abnormality existing in the wire saw corresponding to the machine number based on the statistical result and the machine number, wherein the abnormality is caused by a cutting process, a cutting auxiliary material, or the wire saw itself.

[0007] In a third aspect, the embodiments of the present disclosure provide a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, performs the method for locating an abnormality of a wire saw according to any one of the embodiments of the first aspect.

[0008] In a fourth aspect, the embodiments of the present disclosure provide an electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the computer program, when executed by the processor, performs the method for locating an abnormality of a wire saw according to any one of the embodiments of the first aspect.

[0009] In a fifth aspect, the embodiments of the present disclosure provide a computer program product comprising a computer program, wherein the computer program, when executed by a processor, performs the method for locating an abnormality of a wire saw according to any one of the embodiments of the first aspect. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of some embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0011] FIG. 1 is a system diagram of a method for locating an abnormality of a wire saw according to some embodiments of the present disclosure;

[0012] FIG. 2 is a flowchart of a method for locating an abnormality of a wire saw according to some embodiments of the present disclosure;

[0013] FIG. 3 is a column chart of a process modification result of a steel wire type according to some embodiments of the present disclosure;

[0014] FIG. 4 is a column chart of a machine modification rate statistical result according to some embodiments of the present disclosure;

[0015] Fig. 5 is a flowchart of a method for locating an abnormality of a wire mesh cutting machine according to some embodiments of the present disclosure;

[0016] Fig. 6 is a block diagram of an apparatus for locating an abnormality of a wire mesh cutting machine according to some embodiments of the present disclosure.

[0017] Fig. 7 is a schematic diagram of an electronic device according to some embodiments of the present disclosure.

[0018] Reference signs: 100 - terminal; 110 - first cutting machine; 120 - second cutting machine; 610 - obtaining module; 620 - statistical module; 630 - locating module; 700 - electronic device; 710 - memory; 720 - processor; 730 - bus. Embodiments of the present disclosure

[0019] The technical solutions in some embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0020] It should be noted that similar reference numerals and letters refer to similar items in the accompanying drawings, and therefore, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings. Meanwhile, in the description of the present disclosure, the terms "first", "second", and the like are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance.

[0021] Some embodiments of the present disclosure aim to provide a method, apparatus, storage medium, device and product for locating an abnormality of a wire mesh cutting machine. The technical solutions of some embodiments of the present disclosure can realize the locating of the abnormality of the wire mesh cutting machine through the related parameters of the cutting process automatically modified, which is efficient and accurate.

[0022] Some embodiments of the present disclosure can realize the locating of the abnormality of the wire mesh cutting machine through the related parameters of the cutting process automatically modified, which is efficient and accurate.

[0023] In some embodiments, the triggering condition of the modification of the cutting process includes at least one of the following: the wire mesh of the wire mesh cutting machine has at least one of the following abnormalities: wire bow abnormality, plying abnormality, wire skipping abnormality and wire breakage abnormality.

[0024] Some embodiments of the present disclosure can realize the automatic modification of the process by triggering the automatic modification operation of the cutting process under various abnormal conditions.

[0025] In some embodiments, the statistical result of the modified cutting process is obtained by using the control variable method to statistically analyze the modified cutting process. In some embodiments, the statistical result of the modified cutting process is obtained by using the control variable method to statistically analyze the modified cutting process.

[0026] In some embodiments, the statistical method of control variables is used to statistically analyze the associated parameters of the modified cutting process to obtain statistical results, including: fixing the size of the wire mesh cutting machine and the silicon rod, and taking the type of any cutting auxiliary material as a variable, while keeping the types of the rest of the cutting auxiliary materials unchanged, to obtain the associated parameters under different types of auxiliary materials; or taking the type of any cutting auxiliary material unchanged and taking the parameter of any cutting auxiliary material as a variable to obtain the associated parameters; and statistically analyzing the associated parameters to obtain statistical results.

[0027] In some embodiments, the statistical results are represented by statistical charts or tables; and the statistical results include process modification results.

[0028] Some embodiments of the present disclosure statistically analyze the associated parameters by the statistical method of control variables to obtain process modification results, which can achieve accurate positioning of the abnormal wire mesh cutting machine.

[0029] In some embodiments, the process modification results include a process modification rate, which represents the proportion of the number of modification cycles in a preset period to the entire time period.

[0030] In some embodiments, the cutting auxiliary materials include cutting wires, groove wheels, cooling liquids, guide wheels, material seats, material plates, stick glues, plate glues, resin plates, and glue pulleys; and the types of auxiliary materials include: model, factory batch, and manufacturer.

[0031] In some embodiments, based on the statistical results, the abnormal wire mesh cutting machine corresponding to the machine number is located according to the machine number, including: comparing the process modification results in the statistical results with a preset threshold to determine whether any cutting auxiliary material is abnormal, so as to achieve positioning of the abnormal wire mesh cutting machine.

[0032] Some embodiments of the present disclosure compare the process modification results with the preset threshold to determine the abnormal wire mesh cutting machine, which achieves rapid and accurate positioning of the abnormality.

[0033] In some embodiments, comparing the process modification results in the statistical results with the preset threshold to determine whether any cutting auxiliary material is abnormal includes: in the case that the process modification results in the statistical results exceed the preset threshold, it is determined that any cutting auxiliary material is abnormal.

[0034] In some embodiments, the method for positioning the abnormal wire mesh cutting machine further includes: based on the statistical results, optimizing the modification parameters in the associated parameters of the modified cutting process.

[0035] In some embodiments, the parameter types and parameter data in the modification parameters include: feeding speed and wire winding and unwinding amount.

[0036] Some embodiments of the present disclosure modify the parameters of the cutting process by optimizing the statistical results, reduce the occurrence of abnormal situations caused by inaccurate automatic modification of parameters, and enable the wire mesh cutting machine to work normally.

[0037] The wire mesh cutting machine can automatically adjust the working parameters of the diamond wire cutting device during the working process through the detection mechanism and the control system. Specifically, the detection mechanism is configured to detect the state parameters of the diamond wire cutting device; the control system is in communication connection with the detection mechanism and the diamond wire cutting device, and the control system can adjust the working parameters of the diamond wire cutting device according to the state parameters. Through the cooperation of the detection mechanism and the control system, the working parameters of the diamond wire cutting device can be automatically adjusted according to the current state parameters of the diamond wire cutting device to avoid the influence of the differences in the quality of the silicon rod and the electroplated diamond wire on the cutting quality. However, if the working parameters are frequently adjusted during the cutting process, it may be that some cutting accessories in the wire mesh cutting machine are abnormal. However, the related art cannot confirm whether the wire mesh cutting machine is abnormal according to the automatic adjustment of the parameters.

[0038] In view of this, some embodiments of the present disclosure provide a method for positioning the abnormality of a wire mesh cutting machine. The method can statistically analyze the parameters associated with the modification of the cutting process of the wire mesh cutting machine during the cutting of a silicon rod, and determine whether the abnormality of the wire mesh cutting machine is caused by the cutting process, the cutting accessories, or the wire mesh cutting machine itself. Some embodiments of the present disclosure can achieve abnormal detection and positioning of the wire mesh cutting machine through automatic modification of the process, have a wide detection range, can improve the comprehensiveness and timeliness of detection, and ensure the working efficiency of the wire mesh cutting machine.

[0039] The overall structure of the system for positioning the abnormality of a wire mesh cutting machine provided by some embodiments of the present disclosure will be described below with reference to FIG. 1.

[0040] As shown in FIG. 1, some embodiments of the present disclosure provide a system for positioning the abnormality of a wire mesh cutting machine, which can include a terminal 100 and a first cutting machine 110, a second cutting machine 120, and an Nth cutting machine. The terminal 100 can establish a communication connection with the first cutting machine 110, the second cutting machine 120, and the Nth cutting machine to obtain the parameters associated with the modification of the cutting process of the first cutting machine 110, the second cutting machine 120, and the Nth cutting machines during the cutting process. Then, the terminal 100 can statistically analyze the parameters associated with the modification of the cutting process to locate the abnormality of the wire mesh cutting machine. The first cutting machine 110, the second cutting machine 120, and the Nth cutting machine are all wire mesh cutting machines. N is the number of wire mesh cutting machines and can be a positive integer.

[0041] In some embodiments of the present disclosure, the number of wire net cutting machines can be set according to actual needs, which is not specifically limited herein. The terminal 100 can be a mobile terminal, or a non-portable computer terminal, or the terminal 100 can be a monitoring module, unit or controller connected to each wire net cutting machine. As long as the terminal 100 can realize the above functions, the type of the terminal 100 is not specifically limited herein.

[0042] The implementation process of the wire net cutting machine abnormality positioning performed by the terminal 100 provided by some embodiments of the present disclosure will be exemplarily described below in conjunction with FIG. 2.

[0043] Please refer to FIG. 2, which is a flow chart of a wire net cutting machine abnormality positioning method provided by some embodiments of the present disclosure. The wire net cutting machine abnormality positioning method can include the following steps.

[0044] In S210, the associated parameters of the wire net cutting machine modifying the cutting process during the cutting of the silicon rod are acquired, wherein the associated parameters include the cutting silicon rod specification, the machine number, the modification parameter, the modification times and the modification time, and the modification parameter includes the parameter type and the parameter data.

[0045] For example, in some embodiments of the present disclosure, during the cutting of the silicon rod by the wire net cutting machine, the associated parameters of the automatic modification of the cutting process of the wire net cutting machine monitored by the wire net monitoring system are acquired. When the automatic modification of the cutting process is performed, the feed speed of the silicon rod cutting and the wire net winding and unwinding amount (as a specific example of the parameter type and the parameter data in the modification parameter) can be adjusted. The associated parameters can include the machine number of the specific wire net cutting machine, the modification process times (as a specific example of the modification times), the modification process time (as a specific example of the modification time), and the like. The associated parameters can be extended according to the actual application scenario, and the embodiments of the present disclosure are not limited thereto. Exemplarily, the associated parameter examples shown in Table 1 can be referred to. The start time and the end time represent the start time and the end time of one cut; scanning is continuously performed during the cutting process, and the cutting process is automatically modified when the detected data exceeds the set range. The process modification times represent the number of times of automatically modifying the cutting process from the start time to the end time; the process modification type represents the parameter type of the automatic modification of the cutting process, the start speed represents the speed before modification, the end speed represents the speed after modification, the start wire bow maximum value and the start wire bow minimum value represent the wire bow parameters before the speed modification, and the end wire bow maximum value represents the wire bow parameters after the speed modification.

[0046] Table 1: Associated parameter examples

[0047]

[0048] The terminal 100 can be a mobile terminal, or a non-portable computer terminal, orIn some embodiments of the present disclosure, the trigger condition of the cutting process modification includes at least one of the following: wire bow abnormality, doubling abnormality, skipping abnormality, and wire breakage abnormality of the wire net cutting machine.

[0049] For example, in some embodiments of the present disclosure, during the cutting of a silicon rod, by setting relevant rules, the equipment can autonomously determine the occurrence of an abnormality and find the relevant parameters to automatically modify the cutting process. For example, the wire net monitoring system can monitor the wire net in real time to determine whether an abnormality exists. For example, by monitoring the cutting wire bow value of the wire net in real time, when the cutting wire bow value exceeds a preset threshold value (i.e., the judgment rule of the wire bow abnormality), the cutting process automatic modification operation is triggered to reduce the risk of wire breakage. Alternatively, by monitoring whether the wire net has an abnormality such as wire breakage, skipping, or doubling, the cutting process automatic modification operation can also be triggered to ensure that the wire net cutting machine can work normally and continuously.

[0050] S220, statistics of the associated parameters of the modified cutting process are obtained to obtain a statistical result.

[0051] For example, in some embodiments of the present disclosure, the associated parameters of the above-mentioned automatic modification of the cutting process are statistically analyzed to obtain a statistical result. For example, the machine number, modified parameter, modification frequency, modification time, and other data of each occurrence of the automatic modification of the cutting process are statistically analyzed to determine the statistical result.

[0052] In some embodiments of the present disclosure, S220 can include: fixing the size of the wire net cutting machine and the silicon rod, obtaining the associated parameters under different auxiliary material types in the case that the auxiliary material type of any cutting auxiliary material is used as a variable and the auxiliary material types of the remaining cutting auxiliary materials remain unchanged; or obtaining the associated parameters in the case that the auxiliary material type of any cutting auxiliary material remains unchanged and the auxiliary material parameter of any cutting auxiliary material is used as a variable; statistically analyzing the associated parameters to obtain a statistical result, wherein the statistical result is represented by a statistical chart or a statistical table; and the statistical result includes the process modification result. The cutting auxiliary material includes: cutting wire, groove wheel, cooling liquid, guide wheel, material seat, material plate, stick adhesive, plate adhesive, resin plate, and glue sliding wheel. The auxiliary material type includes: model, factory batch, and manufacturer.

[0053] For example, in some embodiments of the present disclosure, in actual production, the wire mesh cutting machine itself and different cutting accessories in the wire mesh cutting machine may come from different manufacturers, different models and different production batches, which may have certain influence on the working process of the wire mesh cutting machine. Therefore, in the present embodiment, the control variable method is used to statistically analyze the associated parameters of the cutting work automatic modification of multiple wire mesh cutting machines in the cutting process, and the statistical results are obtained. For example, the machine table of the fixed wire mesh cutting machine (that is, all machine table models, production batches and production manufacturers are consistent) and the size of the cut silicon rod are taken as variables, other cutting accessories have the same accessory type and parameter (for example, the wire mesh cutting machine belongs to the same batch of a manufacturer, the groove wheel belongs to the same batch of a manufacturer, etc.) in the case of steel wire category (as a specific example of the accessory type) as a variable, the associated parameters are obtained for statistics, and the steel wire category process modification result column chart (as a specific example of the statistical result) is obtained within a preset time period as shown in FIG. 3. Specifically, multiple wire mesh cutting machines use different steel wire types of steel wire for cutting, and the process modification results (that is, the vertical axis in FIG. 3) of multiple wire mesh cutting machines under different types of steel wire (that is, the horizontal axis in FIG. 3) are counted. For another example, in the case of taking the machine table model of the wire mesh cutting machine as a variable, and the accessory type and accessory parameter of other cutting accessories being the same, the associated parameters of the automatic modification of the cutting process are counted within a preset time period to obtain the machine table modification rate statistical result as shown in FIG. 4. It can be clearly seen from FIG. 4 that the modification rate of those models is higher. In other scenarios, the accessory type of any cutting accessory can be fixed, the accessory parameter of the accessory type of the any cutting accessory can be changed, and the influence of the accessory parameter on the cutting process can be counted to set appropriate accessory parameters later.

[0054] For example, in some embodiments of the present disclosure, the control variable method can be used to count the associated parameters of the modified cutting process to obtain the statistical results.

[0055] Specifically, the triggering condition of the cutting process modification includes at least one of the wire bow abnormality, the line abnormality, the line jump abnormality and the line breakage abnormality of the wire mesh cutting machine. In the case of triggering the cutting process modification, the associated parameters of the modified cutting process can be obtained, and the control variable method can be used to statistically analyze the associated parameters of the modified cutting process to obtain the statistical results.

[0056] S230, based on the statistical results, locating the abnormality existing in the wire mesh cutting machine corresponding to the machine table number according to the machine table number, wherein the abnormality is caused by the cutting process, the cutting accessory or the wire mesh cutting machine itself.

[0057] For example, in some embodiments of the present disclosure, by analyzing the data in the above-mentioned statistical chart or statistical table, it is determined whether the abnormality of the wire mesh cutting machine is caused by a component (i.e., caused by a cutting auxiliary material), or caused by an internal modification process (i.e., caused by a cutting process), or caused by an abnormal problem of the wire mesh cutting machine itself. There can be various factors causing the cutting abnormality, and the embodiments of the present disclosure are not limited thereto.

[0058] In some embodiments of the present disclosure, S230 can include comparing the process modification result in the statistical result with a preset threshold value to determine whether any cutting auxiliary material is abnormal, so as to realize the abnormality positioning of the wire mesh cutting machine.

[0059] For example, in some embodiments of the present disclosure, a preset threshold value can be set, and when the process modification rate (as a specific example of the process modification result) exceeds the preset threshold value, it is considered that the cutting auxiliary material or the machine table is abnormal. The process modification rate represents the proportion of the number of modification cycles in the preset period to the entire time period. For example, it is counted whether the cutting process is automatically modified in each preset period, and a total of 10 time periods, and 8 periods are modified, so the process modification rate is 80%.

[0060] Alternatively, in another embodiment, under the control of the same variable, the modification times in general are 6 times, and the process modification times (as another specific example of the process modification result) of the cutting auxiliary material, the auxiliary material parameter or the machine table as the variable exceed the preset threshold value (for example, the preset threshold value is 18 times), and it is considered that the certain parameter of the cutting auxiliary material is abnormal.

[0061] It should be noted that the representation of the process modification result can be flexibly selected and extended, and the embodiments of the present disclosure are not limited thereto.

[0062] For example, taking the statistical results shown in FIG. 3 as an example, within 3 days, 15 JS390 type wire mesh cutting machines are selected to cut G10 silicon rods at the same time, 3 machines use original 30 wire, 3 machines use original 32 wire, 3 machines use original 33 wire, 3 machines use crystal 30 wire, and 3 machines use original 28 wire. For example, the preset threshold is 60%, it can be seen that in the case of using original 30 wire, the process modification rate is 80%, at this time it can be confirmed that the cutting effect of the steel wire is poor and there is an anomaly. In the later stage, the steel wire can be used as little as possible or not used for cutting. For another example, as shown in FIG. 4, taking the machine type as a variable, within 7 days, 12 JS390 type wire mesh cutting machines are selected to cut G10 silicon rods at the same time, 20 wire mesh cutting machines use the same steel wire original 30 wire, and taking the machine type as a variable, the process modification rate can be used to statistically determine which type (i.e. model) of wire mesh cutting machine has an anomaly, and in the later stage, the wire mesh cutting machine of the machine type can be used as little as possible or not used for cutting. If the process modification rate meets the preset threshold, it is considered that there is a problem with the parameter setting of the automatic modification of the cutting process, at which time the cutting parameters of the automatic modification of the cutting process need to be optimized.

[0063] In some embodiments of the present disclosure, the method for positioning the anomaly of the wire mesh cutting machine can further include: based on the statistical results, optimizing the modification parameters of the automatic modification of the cutting process.

[0064] For example, in some embodiments of the present disclosure, through the positioning of the anomaly results, the modification parameters of the cutting process in the wire mesh cutting machine can be optimized to reduce the abnormal situation caused by inaccurate modification of the process parameters.

[0065] The specific process of the method for positioning the anomaly of the wire mesh cutting machine provided by some embodiments of the present disclosure will be described below in conjunction with FIG. 5.

[0066] Please refer to FIG. 5, which is a flow chart of a method for positioning the anomaly of a wire mesh cutting machine provided by some embodiments of the present disclosure.

[0067] The above process will be described below.

[0068] S510, when the wire mesh cutting machine cuts the silicon rod and meets the triggering condition, the wire mesh cutting machine automatically modifies the cutting process parameters.

[0069] S520, the associated parameters of the automatic modification of the cutting process parameters are obtained.

[0070] S530, the associated parameters are counted according to the preset time period to generate statistical results.

[0071] S540, the process modification rate in the statistical results is compared with the preset threshold to position the anomaly of the wire mesh cutting machine.

[0072] It can be understood that the specific implementation process of S510-S540 can refer to the method embodiments provided in the foregoing, and the detailed description is appropriately omitted here to avoid repetition.

[0073] As can be known from the above some embodiments of the present disclosure, the method for statistically positioning an anomaly based on automatic modification of process parameters provided by the present disclosure can realize fast and accurate positioning of an abnormal auxiliary material or process in a wire mesh cutting machine, has high efficiency, and has a wide and comprehensive anomaly detection range.

[0074] Referring to FIG. 6, FIG. 6 shows a composition block diagram of the device for positioning an anomaly of a wire mesh cutting machine provided by some embodiments of the present disclosure. It should be understood that the device for positioning an anomaly of a wire mesh cutting machine corresponds to the method embodiments for positioning an anomaly of a wire mesh cutting machine described above, and can perform each step involved in the method embodiments for positioning an anomaly of a wire mesh cutting machine described above. The specific functions of the device for positioning an anomaly of a wire mesh cutting machine can be referred to the description in the foregoing, and the detailed description is appropriately omitted here to avoid repetition.

[0075] The device for positioning an anomaly of a wire mesh cutting machine in FIG. 6 includes at least one software function module that can be stored in the form of software or firmware in the memory or solidified in the device for positioning an anomaly of a wire mesh cutting machine. The device for positioning an anomaly of a wire mesh cutting machine includes: an acquisition module 610 configured to acquire associated parameters of a cutting process of a wire mesh cutting machine during cutting of a silicon rod, wherein the associated parameters include: a cutting silicon rod specification, a machine number, a modified parameter, a modification number, and a modification time, the modified parameter includes: a parameter type and parameter data; a statistical module 620 configured to statistically process the associated parameters of the modified cutting process to obtain a statistical result; and a positioning module 630 configured to position an anomaly existing in the wire mesh cutting machine corresponding to the machine number based on the statistical result according to the machine number, wherein the anomaly is caused by the cutting process, cutting auxiliary material, or the wire mesh cutting machine itself.

[0076] In some embodiments of the present disclosure, the trigger condition of automatic modification of the cutting process includes at least one of the following: the wire net of the wire mesh cutting machine has at least one of the following anomalies: wire bow anomaly, parallel wire anomaly, wire skipping anomaly, and wire breaking anomaly.

[0077] In some embodiments of the present disclosure, the statistical module 620 is configured to fix the size of the wire mesh cutting machine and the silicon rod, acquire the associated parameters under different auxiliary material types in a case where the auxiliary material type of any cutting auxiliary material is taken as a variable and the auxiliary material types of the remaining cutting auxiliary materials are unchanged, or acquire the associated parameters in a case where the auxiliary material type of any cutting auxiliary material is unchanged and the auxiliary material parameter of any cutting auxiliary material is taken as a variable, statistically process the associated parameters to obtain a statistical result, wherein the statistical result is represented by a statistical chart or a statistical table, and the statistical result includes a process modification result.

[0078] In some embodiments of the present disclosure, the positioning module 630 is configured to compare the process modification result in the statistical result with a preset threshold, and determine whether the cutting auxiliary material is abnormal, so as to realize abnormal positioning of the wire cutting machine.

[0079] In some embodiments of the present disclosure, the device for positioning the abnormality of the wire cutting machine further comprises an optimization module (not shown in the figure) configured to optimize the modification parameter in the associated parameter of the automatic modification of the cutting process based on the statistical result.

[0080] In some embodiments of the present disclosure, the cutting auxiliary material comprises the wire cutting machine and the components of the wire cutting machine; the components comprise the cutting wire, the groove wheel, the cooling liquid, the resin plate and the glue; and the auxiliary material type comprises the model, the factory batch and the manufacturer of the wire cutting machine and the model, the factory batch and the manufacturer of the components.

[0081] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the device described above can refer to the corresponding process in the foregoing method, and will not be described in detail here.

[0082] Some embodiments of the present disclosure also provide a computer readable storage medium having a computer program stored thereon, wherein the computer program is executable by a processor to perform the operations of the method for positioning the abnormality of the wire cutting machine corresponding to any of the foregoing embodiments.

[0083] Some embodiments of the present disclosure also provide a computer program product comprising a computer program, wherein the computer program is executable by a processor to perform the operations of the method for positioning the abnormality of the wire cutting machine corresponding to any of the foregoing embodiments.

[0084] As shown in FIG. 7, some embodiments of the present disclosure provide an electronic device 700 comprising a memory 710, a processor 720 and a computer program stored in the memory 710 and executable on the processor 720, wherein the processor 720 can realize the method for positioning the abnormality of the wire cutting machine according to any of the foregoing embodiments by reading the program from the memory 710 through the bus 730 and executing the program.

[0085] The processor 720 can process digital signals and can include various computing structures. For example, a complex instruction set computer structure, a reduced instruction set computer structure or a structure implementing a combination of multiple instruction sets. In some examples, the processor 720 can be a microprocessor.

[0086] The memory 710 can be configured to store instructions executed by the processor 720 or data related to the instruction execution process. The instructions and / or data can include code configured to implement some or all of the functions of one or more modules described in the embodiments of the present disclosure. The processor 720 of the embodiments of the present disclosure can be configured to execute the instructions in the memory 710 to implement the methods shown in the above. The memory 710 includes a dynamic random access memory, a static random access memory, a flash memory, an optical memory, or other memory well known to those skilled in the art.

[0087] The above merely provides embodiments of the present disclosure and is not configured to limit the protection scope of the present disclosure. For those skilled in the art, the present disclosure can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0088] The above merely provides embodiments of the present disclosure and is not configured to limit the protection scope of the present disclosure. For those skilled in the art, the present disclosure can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0089] It should be noted that, in the present document, the relationship terms such as first and second are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms “include”, “contain” or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement “including a” does not exclude the presence of another identical element in the process, method, article or device including the element.

Claims

1. A method for locating an anomaly of a wire saw, comprising: obtaining associated parameters of a modification of a cutting process of a wire saw during a cutting of a silicon rod, wherein the associated parameters comprise a specification of the silicon rod, a machine number, a modification parameter, a modification number, and a modification time, and the modification parameter comprises a parameter type and parameter data; counting the associated parameters of the modification of the cutting process to obtain a statistical result; locating, based on the statistical result, an anomaly existing in the wire saw corresponding to the machine number according to the machine number, wherein the anomaly is caused by the cutting process, a cutting auxiliary material, or the wire saw itself.

2. The method of wire EDM anomaly localization of claim 1, wherein, The triggering condition of the modification of the cutting process comprises at least one of a wire bow anomaly, a wire overlap anomaly, a wire jump anomaly, and a wire breakage anomaly of the wire of the wire saw.

3. The method of wire EDM anomaly localization of claim 1, wherein, The counting of the associated parameters of the modification of the cutting process to obtain the statistical result comprises: counting the associated parameters of the modification of the cutting process using a control variable method to obtain the statistical result.

4. The method of wire EDM anomaly localization of claim 3, wherein, The counting of the associated parameters of the modification of the cutting process using the control variable method to obtain the statistical result comprises: fixing the size of the wire saw and the silicon rod, and obtaining the associated parameters under different auxiliary material types of a cutting auxiliary material in a case where the auxiliary material types of the rest of the cutting auxiliary materials remain unchanged, or obtaining the associated parameters in a case where the auxiliary material types of the cutting auxiliary material remain unchanged and the auxiliary material parameters of the cutting auxiliary material are taken as variables; counting the associated parameters to obtain the statistical result.

5. The method of wire EDM anomaly localization of claim 3, wherein, The statistical result is represented by a statistical chart or a statistical table; and the statistical result comprises a process modification result.

6. The method of wire web cutting machine anomaly localization of claim 5, wherein, The process modification result comprises a process modification rate, which represents a proportion of a period number of a modification occurring in a preset period to a whole time period.

7. The method of wire EDM anomaly localization of claim 3, wherein, The cutting auxiliary material comprises a cutting wire, a groove wheel, a cooling liquid, a guide wheel, a material seat, a material plate, a stick gluing agent, a plate gluing agent, a resin plate, and a gluing roller; and the auxiliary material type comprises a model number, a factory batch, and a manufacturer.

8. The method of wire EDM anomaly localization of claim 3, wherein, The locating of the anomaly existing in the wire saw corresponding to the machine number according to the machine number based on the statistical result comprises: comparing the process modification result in the statistical result with a preset threshold to determine whether the cutting auxiliary material exists an anomaly, so as to locate the anomaly of the wire saw.

9. The method of wire EDM anomaly localization of claim 8, wherein, The comparison of the process modification result in the statistical result with the preset threshold to determine whether the cutting auxiliary material exists an anomaly comprises: in a case where the process modification result in the statistical result exceeds the preset threshold, it is determined that the cutting auxiliary material exists an anomaly.

10. The method of wire EDM anomaly localization of any of claims 1-9, wherein, The method for locating the anomaly of the wire saw further comprises: optimizing the modification parameter in the associated parameters of the modification of the cutting process based on the statistical result.

11. The method of wire EDM anomaly localization of claim 1, wherein, The parameter type and parameter data in the modification parameter comprise a feeding speed and a wire winding and unwinding amount.

12. An apparatus for locating an anomaly of a wire saw, comprising: An acquisition module is configured to acquire associated parameters of a wire mesh cutting machine modifying a cutting process during cutting of a silicon rod, wherein the associated parameters include a silicon rod specification, a machine number, a modification parameter, a modification number, and a modification time, and the modification parameter includes a parameter type and parameter data; A statistics module is configured to statistically analyze the associated parameters of the modification of the cutting process to obtain a statistical result; A positioning module is configured to locate an abnormality existing in the wire mesh cutting machine corresponding to the machine number based on the statistical result and the machine number, wherein the abnormality is caused by the cutting process, cutting auxiliary materials, or the wire mesh cutting machine itself.

13. A computer-readable storage medium having stored thereon a computer program, wherein, The computer program is run by the processor to execute the method for positioning an abnormality of a wire mesh cutting machine according to any one of claims 1-11.

14. An electronic device comprising a memory, a processor, and a computer program stored on the memory and running on the processor, wherein, The computer program is run by the processor to execute the method for positioning an abnormality of a wire mesh cutting machine according to any one of claims 1-11.

15. A computer program product comprising a computer program, wherein, The computer program is run by the processor to execute the method for positioning an abnormality of a wire mesh cutting machine according to any one of claims 1-11.

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