Slurry, polishing method, method for manufacturing component, and cerium oxide particles

Abstract

Provided is a slurry containing abrasive grains and water, wherein the abrasive grains contain cerium oxide particles, the ratio of the BET diameter to the crystallite diameter in the (111) plane of the cerium oxide particles is 0.90 or more, and the integrated value of the differential pore volume distribution in the pore diameter range of 1.4-3.0 nm, is 0.0020-0.0070 cm3 / g in the pore distribution curve of the cerium oxide particles. This polishing method comprises a step for polishing a member to be polished using the slurry. Also provided is a method for manufacturing a component including a step of obtaining a component using the member to be polished polished with the polishing method.

Claims

It contains abrasive particles and water. The abrasive grains include cerium oxide particles, The ratio of the BET diameter to the crystallite diameter in the (111) plane of the cerium oxide particle is 0.90 or more. The cumulative value of the differential pore volume in the pore diameter range of 1.4 to 3.0 nm in the pore distribution curve of the cerium oxide particles is 0.0020 to 0.0070 cm³. ３ It is / g, slender. 　 The slurry according to claim 1, wherein the BET diameter is 21.0 nm or more. 　 The slurry according to claim 1, wherein the crystallite size is 23.0 nm or less. 　 The slurry according to claim 1, wherein the ratio is 1.70 or more. 　 The cumulative value of the differential pore volume in the range of pore diameters from 1.4 to 180 nm in the aforementioned pore distribution curve is 0.12 to 0.21 cm³. ３ The slurry according to claim 1, wherein the amount is / g. 　 The cumulative value of the differential pore volume in the range of pore diameters from 10 to 180 nm in the aforementioned pore distribution curve is 0.11 to 0.17 cm³. ３ The slurry according to claim 1, wherein the amount is / g. 　 The slurry according to claim 1, wherein the abrasive content is 0.01 to 10.00% by mass. 　 The slurry according to claim 1, wherein the average particle size of the abrasive grains is 100 to 600 nm. 　 The slurry according to claim 1, wherein the pH is 1.0 to 7.

0. A polishing method comprising the step of polishing a member to be polished using a slurry described in any one of claims 1 to 9. 　 The polishing method according to claim 10, wherein the member to be polished contains silicon oxide. 　 A method for manufacturing a part, comprising the step of obtaining a part using the member to be polished by the polishing method described in claim 10. The ratio of the BET diameter to the crystallite diameter on the (111) plane is 0.90 or greater. The integrated value of the differential pore volume in the pore diameter range of 1.4 to 3.0 nm in the pore distribution curve is 0.0020 to 0.0070 cm³. ３ Cerium oxide particles, weighing / g.

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