Spike pin, shoe provided with spike pin, and method for producing spike pin

Abstract

The purpose of the present invention is to provide a spike pin excellent in insertion / extraction performance and ease of handling, a shoe provided with the spike pin, and a method for producing the spike pin.　The present invention achieving the above-mentioned purpose is a spike pin X and a shoe Y provided with the spike pin X. The spike pin X has a ground-penetrating part 1. The ground-penetrating part 1 has an area in which two or more dimple parts 11 per four square millimeters are provided. The dimple parts 11 are recessed relative to a virtual outer peripheral surface formed by connecting the outer edges of the ground-penetrating part 1.

Description

Spike pins, shoes provided with spike pins, and method for manufacturing spike pins

[0001] The present invention relates to spike pins for track and field and shoes provided with spike pins.

[0002] Spike pins for track and field are attached to the bottom surface of shoes. These pins are used to enhance grip performance between the foot and the ground, prevent slipping, and support acceleration and direction changes.

[0003] In spike pins, while improving grip performance is important, it is also important to make it easy to pull out from the track. Under such problems, there are spikes with a contrived shape, for example, the spikes described in Patent Document 1.

[0004] Japanese Patent Publication for Opposition Purpose No. 56 - 501708

[0005] The spikes described in Patent Document 1 have lower strength compared to the currently mainstream tapered or stepped cylindrical spikes in 2024. There are also problems such as difficulty in attachment and often not conforming to the regulations of the tournament.

[0006] In view of the above problems, an object of the present invention is to provide a spike pin excellent in insertion and extraction performance and easy to handle, a shoe provided with the same, and a method for manufacturing a spike pin.

[0007] The present invention that solves the above problems is a spike pin having a penetration portion that penetrates the ground, and the penetration portion has a region where 2 or more dimple portions recessed from a virtual outer peripheral surface formed by connecting the outer edges of the penetration portion are provided per 4 square millimeters. With such a configuration, it is possible to apply to spike pins of various shapes, and a spike pin that suppresses the contact area with the ground surface by the dimple portion and makes it easy to insert and extract can be provided.

[0008] Furthermore, the present invention provides a shoe equipped with a spike pin that has a penetrating portion that penetrates the ground, and the penetrating portion has a region in which dimples are provided at a rate of 2 or more per 4 square mm, which are recessed from the virtual outer surface formed by connecting the outer edges of the penetrating portion. This makes it possible to provide a shoe that can reduce resistance when inserting or removing it from the ground.

[0009] Furthermore, the present invention relates to a method for manufacturing a spike pin having a penetration portion that penetrates the ground, comprising: a molding step of forming a pin; and a dimple forming step of forming a region on the molded pin in which dimple portions are provided at a rate of 2 or more per 4 square mm, recessed from a virtual surface formed by connecting the outer edges of the penetration portion. This makes it possible to manufacture a spike pin that is easy to insert and remove from the ground and easy to handle.

[0010] The present invention, which solves the above problems, can provide a spike pin that is excellent in terms of insertion and removal performance and ease of handling, a shoe equipped with the spike pin, and a method for manufacturing the spike pin.

[0011] These are a front view and a side view of a spike pin according to an embodiment of the present invention. These are a bottom view and a schematic front view of a shoe to which a spike pin is attached, according to an embodiment of the present invention. These are a schematic cross-sectional view of a spike pin according to an embodiment of the present invention. These are a schematic cross-sectional view of the surface of a spike pin according to an embodiment of the present invention and a magnified photograph of a spike pin according to an embodiment of the present invention. These are a comparative example of the present invention. These are diagrams showing the arithmetic mean roughness according to an embodiment and a comparative example of the present invention. These are a schematic cross-sectional view of a spike pin and a schematic front view of a shoe to which a spike pin is attached, according to another embodiment of the present invention.

[0012] The spike pins according to each embodiment of the present invention will be described below with reference to the drawings. The description will detail the configuration of the embodiment, the method of implementation, and the modified examples. The embodiments shown below are examples of the present invention and are not limited to the embodiments below. In addition, the term "omitted" in the application documents is a concept that includes shapes that have been chamfered or rounded, and shapes in which the elements constituting the shape have been deformed or modified in length to the extent that it does not impede the purpose or effect of the configuration.

[0013] As shown in Figures 1 to 3, the present invention relates to a spike pin X and a shoe on which this spike pin X is attached, which has a penetrating portion 1 that penetrates the ground, and the penetrating portion 1 has a region in which dimple portions 11 are provided that are recessed from the virtual outer surface formed by connecting the outer edges of the penetrating portion 1, with two or more dimple portions per 4 square mm. It is presumed that by providing dimple portions 11 that do not directly contact the ground in this way, friction between the spike pin X and the ground is reduced, making it easier to insert and remove the spike pin. Here, Figure 1 is a front view and a side view of the spike pin X. Figure 2 is a schematic diagram of the bottom and a schematic side view of the shoe Y to which the spike pin X is attached. Figure 3 is a schematic cross-sectional view of the shoe Y to which the spike pin X is attached, showing the A-A section of Figure 2.

[0014] The spike pin X is a rigid member having a penetration portion 1 that penetrates into the ground (for example, the tartan flooring of an athletics stadium) when in use, and an attachment portion 2 for attaching to the shoe Y. The rigid member could be a metal such as steel or titanium, or a hard resin.

[0015] The penetration section 1 comprises a penetration section body 10 that actually penetrates the ground. In this embodiment, the penetration section body 10 is tapered, with its diameter decreasing towards the tip, to reduce friction when inserting or removing the spike pin. Alternatively, the penetration section body 10 may be arranged in a stepped manner by combining a cylinder, multiple cylindrical materials of different diameters, or tapered members, which can increase the grip force with the ground.

[0016] The axial length of the penetration portion 1 is preferably shorter than 20 mm, more preferably 12 mm or less, and even more preferably 9 mm or less. Furthermore, the axial length of the penetration portion 1 is preferably 1 mm or more, more preferably 2 mm or more, and even more preferably 3 mm or more. This makes it usable in official competitions, improves grip performance, and facilitates installation. In this embodiment, the axial length of the penetration portion 1 is 5 mm, but a spike pin X of a suitable length may be appropriately selected depending on the distance and ground characteristics.

[0017] The main body of the penetration section 10 is provided with notches 101 on opposing sides. The notches 101 are formed as surfaces parallel to the axial direction of the penetration section 1. This makes it easier for the entire main body of the penetration section 10 to penetrate the ground, thereby increasing grip. In particular, as shown in Figure 2(a), by aligning the surface of the notches 101 parallel to the axis of the shoe Y, it is possible to smoothly insert and remove the spike pins X from the ground. Furthermore, by deliberately offsetting the direction of the axis of the shoe Y and the surface of the notches 101, it is possible to increase the grip in a predetermined direction, thus allowing the grip to be adjusted according to the user's preference.

[0018] Here, as shown in Figure 4(a), the surface formed by connecting the outer edges of the penetration portion body 10 is defined as the virtual surface A. In this embodiment, the virtual surface A is tapered with notches 101 and substantially coincides with the surface when the process of forming the dimple portion 11 described later is not performed. The surface of the penetration portion body 10 has a region in which multiple dimple portions 11 are provided, which are recessed from the virtual surface A, and outer edge protrusions 12 protrude around the dimple portion 11. The entire surface of the penetration portion 1 is covered with a coating portion 13. The protruding height of the outer edge protrusions 12 is higher than the average height of the dimple portion 11 and less than or equal to the height of the virtual surface A. The dimple portion 11 and the outer edge protrusions 12 are provided to be of a size and depth that is not visible to the naked eye.

[0019] The mounting portion 2 includes a limiting portion 21 that contacts the shoe Y during mounting to prevent it from penetrating beyond a predetermined depth, and a mounting screw 22 that can be screwed into a hole provided in the shoe Y.

[0020] The limiting portion 21 is a plate material provided between the penetration portion body 10 and the mounting screw 22, and is provided such that its maximum length in the width direction is longer than at least the maximum diameter of the circumscribed circle of the penetration portion body 10 and the maximum diameter of the circumscribed circle of the mounting screw 22, thereby interfering with the bottom surface of the shoe Y. This keeps the protrusion height of the penetration portion body 10 from the shoe Y constant.

[0021] The mounting screw 22 is a male threaded member that protrudes from approximately the center of the limiting portion 21 and is provided so as to be attached to a female thread provided on the shoe Y. This makes it easy to remove the spike pin X and also makes it easy to change the mounting angle to the shoe Y.

[0022] The surface configuration of the penetration section body 10 will be described in detail below using Figures 4 to 6. Figure 4(a) is a schematic enlarged cross-sectional view of the vicinity of the surface of the penetration section body 10, and Figures 4(b) and 5 are scanning electron microscope images (hereinafter referred to as SEM images) of the surface of the penetration section 1. Figure 6 also shows an SEM image of a spike pin that has undergone only polishing treatment as a comparative example. The penetration section body 10 is provided with numerous dimple sections 11 and outer edge protrusions 12, and the dimple sections 11 have a region in which various shapes are arranged continuously. In this region, the outer edge protrusions 12 form a mesh-like pattern on the surface of the penetration section body 10, and the dimple sections 11 are provided so as to be surrounded between the outer edge protrusions 12.

[0023] As shown in Figure 4(a), the penetration portion body 10 has a coating portion 13 that covers the dimple portion 11 and the outer edge projection 12. The coating portion 13 is made of a material that has a lower static friction coefficient or dynamic friction coefficient than the surface of the penetration portion body 10 that does not have the coating portion 13. Preferably, this material is a carbon coating or a fluororesin coating. When a carbon coating is used, DLC (Diamond-Like Carbon) is more preferably used. This makes the surface itself slippery, further reducing the resistance when inserting and removing the spike pin X. Alternatively, the coating portion 13 may be plated. Various types of plating can be used, including nickel plating and chromium plating.

[0024] In the region where the dimple portion 11 is provided, the number of dimple portions 11 per 4 square mm is preferably 2 or more, more preferably 10 or more, even more preferably 30 or more, and most preferably 50 or more, as shown in Figure 4(b). By providing multiple dimple portions 11 in this way, even if the penetration portion 1 does not penetrate at a constant angle, the contact points are dispersed, reducing friction between the spike pin X and the ground, and preventing stress from concentrating on a specific outer edge projection 12 and causing it to break.

[0025] The height from the virtual surface A to the lowest surface of the dimple portion 11 is preferably 20 μm or less, more preferably 15 μm or less, and even more preferably 10 μm or less. By providing such irregularities that are not visible to the naked eye, it is presumed that the friction generated by the irregularities of the dimple portion 11 itself is reduced, making it easier to insert and remove the spike pin X. Furthermore, the lower limit of this height is preferably 1 μm or more, more preferably 2 μm or more, and even more preferably 3 μm or more. It is presumed that having a certain level of irregularities makes it difficult for the dimple portion 11 to come into contact with the ground, reducing the contact area and making it easier to insert and remove the spike pin X.

[0026] As shown in Figures 4(b) and 5, the area of ​​each dimple portion 11 preferably includes those of 1 square mm or less, more preferably 0.5 square mm or less, and even more preferably 0.1 square mm or less. The maximum width of the dimple portion 11 preferably includes those of 1 mm or less, more preferably 0.6 mm or less, and even more preferably 0.3 mm or less. The area of ​​each dimple portion 11, as shown in Figure 5(b), preferably 0.0001 square mm or more, more preferably 0.0002 square mm or more, and even more preferably 0.0004 square mm or more. The maximum width is preferably 0.010 mm or more, more preferably 0.015 mm or more, and even more preferably 0.020 mm or more. By making the size of the dimple portion 11 smaller than the unevenness of the ground assumed in track and field, it is presumed that contact between the ground and the dimple portion 11 will be prevented, thus preventing an increase in the contact resistance of the spike pin X. Furthermore, it is presumed that by setting the maximum diameter of the dimple portion 11 to be larger on average than the height of the dimple portion 11, friction caused by the dimple portion 11 itself catching on the ground can be reduced.

[0027] The area where the dimple portion 11 is provided preferably occupies 25% or more of the entire penetration portion 1, more preferably 50% or more, and even more preferably the entire area of ​​the penetration portion 1. The dimple portion 11 may also be provided throughout the entire area, including the mounting portion 2 for the spike pin X. This reduces the contact area with the ground in many parts of the penetration portion 1, and even if the penetration angle of the penetration portion 1 is varied, the contact position is dispersed to reduce friction and allow for smooth insertion and removal of the spike pin X. Furthermore, if the dimple portion 11 is also provided in the mounting portion 2, the friction generated during installation is reduced, making the installation work on the shoe Y easier.

[0028] As shown in Figure 7, the upper limit of the arithmetic mean roughness of the penetration portion body 10 in the generatrix direction is preferably 10 μm or less, more preferably 5.0 μm or less, and even more preferably 2.0 μm or less. This reduces friction during insertion and removal, enabling smoother insertion and removal of the spike pin X.

[0029] The arithmetic mean roughness of the penetration portion body 10 in the generatrix direction is preferably 0.2 μm or more, more preferably 0.3 μm or more, and even more preferably 0.4 μm or more. The presence of the dimple portion 11 and the outer edge projection 12 results in a higher arithmetic mean roughness than a pin that has simply undergone a polishing process, as shown in Figure 7(b). The dimple portion 11 has moderate irregularities that reduce the contact area, thereby reducing friction when inserting or removing the spike pin X.

[0030] As shown in Figures 4(b) and 5, the surface of the outer edge projection 12 is designed to have greater irregularities compared to the surface of the dimple portion 11. In other words, the arithmetic mean roughness of the outer edge projection 12 is designed to be greater than the arithmetic mean roughness of the dimple portion 11. This creates areas within the outer edge projection 12 that are more or less likely to come into contact with the ground, and it is presumed that the reduced contact area with the ground makes it easier to insert and remove the spike pin X.

[0031] The following describes how the manufacturer produces the spike pin X. Note that the manufacturing method is not limited to the following, and the order of steps may vary. First, as a molding process, the manufacturer casts a pin comprising a penetration portion 1 and a mounting portion 2 by pouring material into a mold. In this embodiment, the material is steel. The molding process may be carried out by other methods such as machining.

[0032] Next, the manufacturer performs a surface treatment process, smoothing the surface of the molded pin by polishing it. Subsequently, the manufacturer performs a dimple formation process, blasting the pin with predetermined particles to form regions where two or more dimples 11 and outer edge protrusions 12 are provided.

[0033] Finally, the manufacturer applies a coating to the surface with a smooth material as part of the film formation process. Possible coating materials include carbon (especially DLC (Diamond-Like Carbon)) and fluororesins.

[0034] Furthermore, if a plating process is performed as part of the film formation process, the surface treatment process may be performed after the film formation process. This prevents metal from being deposited inside the dimple portion 11 and allows for the proper formation of dimples on the surface of the penetration portion 1. Nickel plating and chromium plating are examples of possible plating methods.

[0035] Herein, regarding the method for manufacturing the spike pin X of the present invention, preferred embodiments can be found by referring to the above description.

[0036] Furthermore, the dimple portion 11 is not limited to the penetration portion 1, but may be formed on the entire spike pin X.

[0037] Furthermore, even though the surface of the penetration portion 1 is provided with dimples 11, the arithmetic mean roughness is less than 10 μm, which allows the spike pin X to be inserted into and removed from the ground smoothly.

[0038] Furthermore, the dimple portion 11 is provided surrounded by outer edge projections 12 whose outer edges are higher than the average height of the dimple portion 11, and the outer edge projections 12 are provided so that the area of ​​the dimple portion 11 is 1 square mm or less, and / or so that the maximum width of the dimple portion is 1 mm or less. This narrows the spacing of the outer edge projections 12, making it less likely for the dimple portion 11 to come into contact with the ground, reducing the contact area between the penetration portion 1 and the ground, and making insertion and removal easier. Note that if there are two or more dimple portions 11 that satisfy the above conditions on the penetration portion 1, the ease of insertion and removal can be achieved.

[0039] Further, the dimple portion 11 is provided surrounded by an outer edge protrusion 12 whose outer edge is higher than the average height of the dimple portion 11, and the arithmetic mean roughness of the outer edge protrusion 12 is larger than the arithmetic mean roughness of the dimple portion 11. Thereby, among the outer edge protrusions 12 that are likely to actually contact the ground, portions that are more likely to contact and portions that are less likely to contact are provided. The portion that is less likely to contact further reduces the contact area with the ground and reduces the friction generated between the spike pin X and the ground.

[0040] Further, the penetration portion 1 is provided with a notch 101 that forms opposing parallel surfaces on its side surface, thereby increasing and adjusting the grip force of the spike pin X by adding steps to the shape.

[0041] Further, since the penetration portion 1 is provided with a coating portion 13 on its surface, the durability of the dimple portion 11 and the outer edge protrusion 12 can be enhanced. In particular, by using a material that is more slippery than the surface of the penetration portion main body 10 for the material of the coating portion 13, the sliding performance during insertion and removal of the spike pin X can be further enhanced.

[0042] Further, by making the dimple portion non-circular, a plurality of dimple portions 11 can be provided adjacent to each other regardless of the shape of the penetration portion 1. Also, in order to reduce the manufacturing cost, the dimple portion may be non-circular, and the dimple portion 11 may be formed on the entire spike pin X.

[0043] Further, regarding the manufacturing method of the spike pin X, by including a molding step of molding the pin and a dimple forming step of forming a region where two or more dimple portions 11 are provided per 4 square millimeters, recessed from a virtual surface A formed by connecting the outer edges of the penetration portion 1, the dimple portion 11 can be appropriately formed. Also, by including a film forming step of forming the coating portion 13 on the surface of the penetration portion 1 thereafter, the coating portion 13 can be appropriately formed. Test Example

[0044] Hereinafter, the effects of the present invention will be described using test examples using the implementation product and the comparative product of the present invention. Note that the present invention is not limited to the configurations in the following examples.

[0045] The product of the implementation is obtained by performing a forming process, a polishing process, and a dimple forming process on a steel material, and then performing a film forming process by nickel plating. As shown in FIG. 5, which is a SEM image of the penetration part 1, the surface of the product of the implementation has a region where 2 or more dimple parts 11 are provided recessed from the virtual surface A per 4 square millimeters. Also, when focusing on each dimple part 11, dimple parts 11 with an area of 1 square millimeter or less and dimple parts 11 with a maximum width of 1 millimeter or less are included. Furthermore, the surface of the outer edge protrusion 12 surrounding the dimple part 11 is rougher and has a larger arithmetic mean roughness compared to the dimple part 11.

[0046] Regarding the product of the implementation, the measurement of the arithmetic surface roughness was performed as follows using a confocal laser microscope (VK-X150, manufactured by Keyence). First, for the penetration part 1 of each product of the implementation, a region was extracted. This region is approximately rectangular, with a length in the busbar direction of 1912.8 μm and a width in the direction perpendicular to the busbar direction of 520.6 μm. In this region, along a straight line in the busbar direction, the heights of the peaks and valleys on the surface were measured from the mounting part 2 side towards the tip side of the penetration part 1, and the arithmetic mean roughness was calculated based on the measurement results. As a result, the arithmetic mean roughness of the penetration part 1 was 10 μm or less.

[0047] The comparative product is obtained by performing a forming process and a polishing process on a steel material, and then performing a film forming process by nickel plating without performing a dimple forming process. As shown in FIG. 6, which is a SEM image of the penetration part 1, its surface is smooth. Also, regarding the penetration part 1 of the comparative product, when the arithmetic mean roughness was calculated in the same manner as described above, the result was 10 μm or less.

[0048] ≪Regarding the product of the implementation≫ The details of the product of the implementation of the present invention used in the test are shown below. The product of the implementation is obtained by performing a forming process, a polishing process, and a dimple forming process on a steel material, and then performing a film forming process by nickel plating. In the test, when a large number of products of the implementation manufactured by the same manufacturing method as described above were used, among these products of the implementation, for ns1, ns2, and ns3 randomly sampled, the arithmetic mean roughness was measured, and the surface shape of ns2 was observed.

[0049] For measuring arithmetic surface roughness, three roughly rectangular areas were randomly selected from the penetration section 1 of each sample. In these areas, the height of the peaks and valleys was measured along a straight line in the direction of the generatrix, from the mounting section 2 to the tip of the penetration section 1. Based on the measurement results, the arithmetic mean roughness was calculated. This measurement was performed four times in each area.

[0050] The measurement results for arithmetic surface roughness are shown in Figure 7(a). In Figure 7(a), the bar graph for each sample represents the average of 12 data points, and the whiskers represent the maximum and minimum values. As shown in Figure 7(a), the arithmetic mean roughness of the samples fell within the range of 0.4 μm to 1.6 μm.

[0051] Observation of ns2 using a scanning electron microscope revealed, as shown in Figures 4 and 5, that inside the mesh structure formed by the outer edge protrusions 12, there are dimple portions 11 of 0.0004 square mm or more and 1 square mm or less, and dimple portions 11 of 0.1 square mm or less, and that in the penetration portion 1, there is a region containing at least 30 or more dimple portions 11 per 4 square mm. Furthermore, regarding the maximum width of the dimple portions 11, it was confirmed that there are multiple dimple portions 11 of 0.02 mm or more and 1 mm or less, and dimple portions 11 of 0.0004 square mm or more and 0.3 square mm or less.

[0052] ≪About the Comparative Samples≫ Details of the comparative samples used in the test are shown below. The comparative samples had the same shape as the actual product, and after forming and polishing processes were performed on the steel material, the dimple formation process was omitted, and a nickel plating film formation process was performed. In the test, a large number of comparative samples manufactured using the same manufacturing method were used, and the arithmetic mean roughness was measured for n1, n2, and n3, which were randomly sampled from these comparative samples, and the surface shape of n1 was observed.

[0053] The arithmetic mean roughness was calculated in the same manner as for the actual samples. The results are shown in Figure 6(b). In Figure 6(b), the bar graph for each comparison product represents the average of 12 data points, and the whiskers represent the maximum and minimum values. As shown in Figure 6(b), the arithmetic mean roughness of the comparison products fell within the range of 0.2 μm to 1.2 μm.

[0054] Observation of n1 using a scanning electron microscope revealed fine scratches and dirt on its smooth surface, as shown in Figure 5. On the other hand, the dimple portion 11 and the mesh-like outer edge protrusions 12 were not observed.

[0055] <<First Test>> As the first test, three testers were instructed to perform their usual training using shoes equipped with the comparison product and the same shoes equipped with the product being tested, and to compare their performance. All three testers had experience in track and field; Tester 1 had experience competing in the Japanese National Championships, Tester 2 had experience competing in the University Championships, and Tester 3 had experience competing in regional competitions. The performance comparison was conducted by having the testers rate the feel of using the product being tested in each phase—acceleration, maximum sprinting, and deceleration—on a 10-point scale, with the comparison product being rated as 5.

[0056] The results of this test are shown in Table 1. According to Table 1, the product received a higher evaluation than the comparative product in all phases. In particular, it received a higher evaluation in the acceleration phase than in the maximum speed phase and the deceleration phase. It is presumed that the dimpled portion 11 reduced friction and made it easier for the pins to come out, making it easier to increase the pitch and allowing for advantageous acceleration. The relatively low evaluation in the deceleration phase is presumed to be due to a slight decrease in braking performance due to the reduction in friction, but it is thought that the grip performance was maintained by the penetration portion 1, resulting in a higher evaluation than the comparative product.

[0057]

[0058] ≪Second Test≫ As the second test, monitors who purchased the product were asked to compare the product with their own regular product (not the product being tested) (65 responses). All monitors were experienced in track and field. The questionnaire included: Question 1, asking whether there was a difference from a regular needle pin (choice of "yes," "no," or "don't know"); Question 2, asking how it felt to run (on a five-point scale: "very good," "good," "average," "bad," or "very bad"); Question 3, asking how the strain on the legs was reduced (on a five-point scale: "very good," "good," "average," "bad," or "very bad"); Question 4, asking all the differences that applied to the product from a list of items; and Question 5, asking for free-response comments on the product. The items in Question 4 included: "reduced strain on the feet," "reduced resistance when inserting and removing," "easier to slide," "lighter running," "heavier running," and "felt like there were no pins."

[0059] The results of the responses to Question 1 were: "Yes" (64 responses), "No" (0 responses), and "Don't know" (1 response). Therefore, it can be inferred that the product being tested is different from the standard product.

[0060] The results of the responses to Question 2 were: "Very Good" (47 responses), "Good" (17 responses), "Average" (1 response), and "Bad" and "Very Bad" (0 responses). Therefore, it can be inferred that the test product performed better than the standard product.

[0061] The results of the responses to Question 3 were: "Very good" 18 times, "Good" 35 times, "Average" 11 times, and "Bad" and "Very bad" 0 times. There was also one response of "Don't know". Therefore, it can be inferred that the improvement in insertion and removal due to the dimple section will generally reduce the burden on the legs.

[0062] The results of the responses to Question 4 were as follows: 18 people said "the burden on the feet was reduced," 49 people said "the resistance when inserting and removing the pins was reduced," 3 people said "it became easier to slip," 26 people said "running became lighter," and 23 people said "it felt like there were no pins." No monitors responded that "running became heavier." Therefore, it can be said that the product reduces the resistance when inserting and removing the pins by providing dimples 11 of a predetermined size, making running lighter. In addition, it is thought that the reduction in resistance reduces the burden on the feet and helps to maintain a certain level of grip performance.

[0063] In question 5, we received feedback such as, "I've only used it in practice so far, but I feel that the resistance of the pins when running is reduced, and I feel that it's easier to increase my pitch. I want to continue using it," "Because the surface is smooth and it's 5mm, I had the impression that there was no pin feeling when landing, and it was easier to increase my pitch. This led to a reduction in ground contact time," "Thanks to the NS needle pins (the actual product), the feeling of inserting and removing the pins has decreased, and I feel closer to the feeling of landing on a larger surface, making running more enjoyable!", and "I feel that the resistance of inserting and removing the pins is low. I haven't had it for long, so I want to continue checking it."

[0064] <<Other Embodiments>> The following describes spike pins according to other embodiments of the present invention. Note that components similar to those in the previously described embodiments are denoted by the same reference numerals and their descriptions are omitted. The embodiments shown below are examples of the present invention and do not limit the present invention to these embodiments. Furthermore, the term "omitted" in the application documents refers to shapes that have been chamfered or rounded, and includes shapes where the elements constituting the shape have been modified or altered in length to the extent that it does not impede the purpose or effect of the configuration.

[0065] As shown in Figure 8a, the spike pin X according to this embodiment is integrally formed with the shoe Y. In other words, the spike pin X is integrally molded to the sole of the shoe Y in a way that prevents it from being detached, and has a continuous structure without any dividing lines. In this configuration, there is no attachment part 2, which prevents the spike pin X from unintentionally falling off while the shoe Y is in use.

[0066] X Spike pin Y Shoe A Virtual surface 1 Penetration part 10 Penetration part body 101 Notch 11 Dimple part 12 Outer edge projection 13 Coating part 2 Mounting part 21 Restricting part 22 Mounting screw

Claims

1. A spike pin having a penetrating portion that penetrates the ground, wherein the penetrating portion has a region in which two or more dimples are provided per 4 square mm, which are recessed from the virtual surface formed by connecting the outer edges of the penetrating portion.

2. The spike pin according to claim 1, wherein the surface of the penetration portion has an arithmetic mean roughness less than 10 μm.

3. The spike pin according to claim 1, wherein the dimple portion is provided surrounded by outer edge projections whose outer edge is higher than the average height of the dimple portion, and the area of ​​the dimple portion is 1 square mm or less.

4. The spike pin according to claim 1, wherein the dimple portion is provided surrounded by outer edge projections whose outer edge is higher than the average height of the dimple portion, and the maximum width of the dimple portion is 1 mm or less.

5. The spike pin according to claim 1, wherein the dimple portion is provided surrounded by outer edge projections whose outer edge is higher than the average height of the dimple portion, and the arithmetic mean roughness of the outer edge projections is greater than the arithmetic mean roughness of the dimple portion.

6. The spike pin according to claim 1, wherein the penetration portion is provided with a notch on its side surface that forms opposing parallel surfaces.

7. The spike pin according to any one of claims 1 to 6, wherein the penetration portion is provided with a coating on its surface.

8. A shoe having a spike pin that has a penetrating portion that penetrates the ground, wherein the penetrating portion has a region in which two or more dimples are provided per 4 square mm, which are recessed from the virtual surface formed by connecting the outer edges of the penetrating portion.

9. The shoe according to claim 8, wherein the spike pins are provided integrally with the sole.

10. A method for manufacturing a spike pin having a penetrating portion that penetrates the ground, comprising: a molding step of forming a pin; and a dimple forming step of forming a region on the molded pin in which dimple portions are provided in a manner that is recessed from a virtual surface formed by connecting the outer edges of the penetrating portions, with two or more dimple portions per 4 square mm.

11. The method for manufacturing a spike pin according to claim 10, comprising a film-forming step of forming a coating on the surface of the penetration portion.

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