System for cooling dissipative components
The two-phase cooling system with parallel evaporators and high-pressure drop restrictors addresses the challenge of managing high heat dissipation in dissipative components, achieving efficient cooling and balanced pressure drops for enhanced computing power.
WO2026135452A1PCT designated stage Publication Date: 2026-06-25STICHTING NAT LUCHTEN RUIMTEVAART LABUM
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- STICHTING NAT LUCHTEN RUIMTEVAART LABUM
- Filing Date
- 2025-04-25
- Publication Date
- 2026-06-25
Smart Images
Figure NL2025050193_25062026_PF_FP_ABST
Abstract
The invention relates to a system for cooling dissipative components, such electrical or electronic components, in particular CPUs and / or GPUs, e.g. in one or more servers, e.g. in one or more server racks in a data center, batteries, and fuel cell stacks, which cooling system comprises a thermal loop for transporting heat from at least one of such components to a heat sink, the loop comprising at least two evaporators connected in parallel, a condenser, conduits connecting the evaporators to the condenser, and restrictors providing a pressure drop upstream from the evaporators, the loop containing a heat transfer medium for absorbing in the evaporators heat from the dissipative component or components, transporting the absorbed heat to the condenser, and releasing the absorbed heat to the heat sink. The system comprises at least one further restrictor providing a pressure drop upstream from said parallel restrictors.
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