Apparatuses and methods for adjusting showerheads in semiconductor processing

The system allows for precise adjustment and electrical isolation of RF hot showerheads in semiconductor processing, addressing misalignment and parasitic plasma issues, ensuring uniform plasma generation and substrate processing.

WO2026136071A1PCT designated stage Publication Date: 2026-06-25LAM RES CORP

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
LAM RES CORP
Filing Date
2025-12-09
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Conventional methods for adjusting RF hot showerheads in semiconductor processing face challenges such as misalignment, parasitic plasma formation, and nonuniform plasma generation due to high stack up tolerances, which conventional adjustment methods like shimming and bellows cannot adequately address.

Method used

A system comprising a showerhead plate connected to a showerhead stem through a collar and securement block, utilizing an adjustment assembly with spherical washers and adjustment screws to tilt the showerhead relative to the securement block, providing electrical isolation and adjustable positioning.

Benefits of technology

Enables precise adjustment and electrical isolation of the showerhead, reducing parasitic plasma formation and ensuring uniform plasma generation and substrate processing, thereby improving deposition and etching uniformity.

✦ Generated by Eureka AI based on patent content.

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Abstract

Systems for semiconductor processing may have a showerhead plate configured to connect to a showerhead stem of a showerhead, an collar having an top portion coupled to the showerhead plate and having a first through-hole, and a collar central bore extending through the top portion and configured to receive the stem, a securement block having a block central bore and a first threaded bore extending partially into the securement block and an adjustment assembly extending through the top portion of the collar and coupled to the securement block, and the adjustment assembly has an adjustment screw, a first spherical washer, a plug, and a second spherical washer, and rotation of one adjustment screw causes the collar and showerhead plate to tilt with respect to the securement block.
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Description

Docket No. LAM1P083WOAPPARATUSES AND METHODS FOR ADJUSTING SHOWERHEADS IN SEMICONDUCTOR PROCESSINGINCORPORATION BY REFERENCE

[0001] A PCT Request Form is filed concurrently with this specification as part of the present application. Each application that the present application claims benefit of or priority to as identified in the concurrently filed PCT Request Form is incorporated by reference herein in its entirety and for all purposes.BACKGROUND

[0002] Semiconductor manufacturing typically involves one or more processing operations to deposit and / or etch a structure on or in a semiconductor wafer (or substrate). Such processes may employ one or more gas delivery systems in which vapor-phase and sometimes gas precursors are reacted with and / or on a surface of a substrate to deposit material thereon or to remove material therefrom. Various gases are used during the one or more processing operations, including flowing purge gases during purge operations and flowing gases during precursor delivery. Although many forms of gas delivery systems exist, they are generally configured to provide controlled gas flow and delivery of gases and precursors.

[0003] The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.SUMMARY

[0004] Details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages will become apparent from the description, the drawings, and the claims. The following, non-limiting implementations are considered part of the disclosure; other implementations will be evident from the entirety of this disclosure and the accompanying drawings as well.

[0005] In some embodiments, the system may include a showerhead plate configured to connect to a showerhead stem of a showerhead; a collar having: an top portion coupled to the showerhead plate and having a first through-hole, and a collar central bore extending throughDocket No. LAM1P083WO the top portion and configured to receive the showerhead stem; a securement block having a block central bore and a first threaded bore extending partially into the securement block; and an adjustment assembly extending through the top portion of the collar and coupled to the securement block. The adjustment assembly may have an adjustment screw having a screw head with a screw face, a screw body threaded into the first threaded bore, and a first interface, a first spherical washer in contact with, and interposed between, the screw face of the screw head and a bottom surface of the top portion, a plug having a plug head, a plug body extending at least partially through one first through-hole, and a second interface, and a second spherical washer in contact with, and interposed between, the plug head and a top surface of the top portion, the first interface is configured to interface with the second interface, rotation of the plug may be configured to cause the second interface to interface with the first interface and cause the adjustment screw to rotate within the first threaded bore, and rotational movement of the adjustment screw within the first threaded bore may cause the collar and showerhead plate to tilt with respect to the securement block.

[0006] In some embodiments, the screw face may be a convex face that faces the top portion, and the first spherical washer may have a concave spherical seat in contact with the convex face and a planar surface in contact with the bottom surface of the top portion.

[0007] In some embodiments, the second spherical washer may have a top washer with a second convex face, and a bottom washer in contact with the top surface of the top portion and having a second concave face in contact with the second convex face.

[0008] In some embodiments, the showerhead plate and the collar may be configured to move together.

[0009] In some embodiments, the collar may have a collar center axis, the showerhead plate may have a plate center axis colinear with the collar center axis, the block central bore may have a bore center axis, and tilt of the collar and the showerhead plate with respect to the securement block may cause the collar center axis and the plate center axis to be unparallel with the bore center axis.

[0010] In some embodiments, the system may further include an O-ring seal. The securement block may have a groove extending around the central and radially inwards of the first threaded bore, and the O-ring seal may be positioned in the groove and in contact with the bottom surface of the top portion and the securement block.

[0011] In some embodiments, the system may further include the showerhead stem. The showerhead plate may be coupled to the showerhead stem, the showerhead stem may extend through the central bore and the collar central bore, and the rotational movement of oneDocket No. LAM1P083WO adjustment screw within the first threaded bore may further cause the collar, the showerhead plate, and the showerhead stem to tilt with respect to the securement block.

[0012] In some such embodiments, the showerhead stem may be electrically coupled to the showerhead plate, and the showerhead plate and the showerhead stem may be electrically isolated from the adjustment assembly and the securement block.

[0013] In some such embodiments, the collar may further have a cylindrical body portion with a first length and the collar central bore extends through the cylindrical body portion, the showerhead stem may extend through the cylindrical body portion, the showerhead stem may be radially offset from the cylindrical body portion by an offset distance, and the offset distance may remain constant during and after the rotational movement of one adjustment screw within the first threaded bore.

[0014] In some embodiments, the showerhead plate may have an outer periphery, and the adjustment assembly may be offset from the outer periphery by a non-zero clearance distance.

[0015] In some embodiments, the system may further include a plurality of stoppers. Each stopper may be positioned partially inside the securement block and offset from a top surface of the securement block, and each stopper may have a stopper top configured to be contacted by the bottom surface of the top portion.

[0016] In some such embodiments, the plurality of stoppers may be configured to prevent any adjustment screw from being linearly translated with respect to the securement block by a maximum linear distance.

[0017] In some embodiments, the adjustment assembly may have a set screw, the adjustment screw may have a screw central bore, the first spherical washer has a first washer central bore, the plug may have a plug central bore, the second spherical washer has a second washer central bore, the first threaded bore may have a first threaded portion with a first outer diameter and a second threaded portion with a second outer diameter smaller than the first outer diameter, and the set screw may extend through the plug central bore, the second washer central bore, the respective first through-hole, the first washer central bore, and the screw central bore, is threaded into the second threaded portion, and may be configured to retain the plug, top portion, and the showerhead plate in a fixed position.

[0018] In some such embodiments, the set screw may be configured to provide an axial compressive force onto the second spherical washer, the top portion, the first spherical washer, and the adjustment screw.

[0019] In some embodiments, the showerhead plate may be coupled to the collar with connection means that extend only partially into the collar.Docket No. LAM1P083WO

[0020] In some embodiments, the first interface may extend partially into the first through- hole, the second interface may extend partially into the first through-hole, and the first interface and second interface may partially overlap when viewed perpendicular to a center axis of the block central bore.

[0021] In some such embodiments, the first interface may have a first extension body and a second extension body that extend away from the screw head and are offset from each other, the plug body forms the second interface, and the plug body has a third extension body and fourth extension body that extend away from the plug head and are offset from each other.

[0022] In some embodiments, the collar may be included of a dielectric material.

[0023] In some embodiments, the securement block may be coupled to a top of a semiconductor processing chamber.

[0024] In some embodiments, an adjustment assembly for semiconductor processing is provided. The adjustment assembly may include an adjustment screw having a first interface, a screw head with a screw face, and a screw body with external threading and configured to mate with a corresponding set of threads; a first spherical washer in contact with the screw face of the screw head, configured to be in contact with a bottom surface of a movement body, and configured to be interposed between the screw face and the bottom surface; a plug having a plug head, a plug body configured to extend at least partially through a first through-hole of the movement body, and a second interface; and a second spherical washer in contact with the plug head, configured to be in contact with a top surface of the movement body, and configured to be interposed between the plug head and the top surface. The first spherical washer is configured to tilt relative to the adjustment screw, a first portion of the second spherical washer is configured to tilt relative to a second portion of the second spherical washer and the plug head, and the first interface is configured to interface with the second interface.

[0025] Additional aspects will be set forth in the detailed description which follows, and, in part, will be apparent from the disclosure, or may be learned by practice of the disclosed implementations and / or the claimed subject matter.

[0026] The foregoing general description and the following detailed description are illustrative and explanatory and are intended to provide further explanation of the claimed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Various implementations disclosed herein are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings, in which like reference numerals refer to similar elements.Docket No. LAM1P083WO

[0028] Figure 1 schematically shows an implementation of a processing station for semiconductor processing.

[0029] Figure 2 depicts a magnified cross-sectional view of a portion of the processing station of Figure 1.

[0030] Figure 3 depicts a magnified portion of Figure 2.

[0031] Figure 4 depicts an exploded cross-sectional side view of a portion of the top portion and the adjustment assembly of Figure 3.

[0032] Figure 5 depicts an off-angle exploded view of an implementation of the adjustment assembly of Figures 3 and 4.

[0033] Figures 6A and 6B depict magnified cross-sectional side views of a portion of the adjustment assembly, portion of the securement block, and portion of the top portion in example positions.

[0034] Figure 7 depicts the magnified portion of Figure 2 in another example configuration.

[0035] Figure 8 depicts a top view of a portion of the system of Figure 3.

[0036] Figure 9 depicts a magnified cross-sectional slice of a portion of another processing station.

[0037] Figure 10 depicts a schematic view of an implementation of a multi-station processing tool.DETAILED DESCRIPTION

[0038] In the following description, numerous specific details are set forth in order to provide a thorough understanding of various implementations. The disclosed implementations may be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail to not unnecessarily obscure the disclosed implementations. While the disclosed implementations will be described in conjunction with specific implementations, it will be understood that it is not intended to limit the disclosed implementations.

[0039] In this application, the terms “semiconductor wafer,” “wafer,” “substrate,” “wafer substrate” and “partially fabricated integrated circuit” are used interchangeably. One of ordinary skill in the art would understand that the term “partially fabricated integrated circuit” can refer to a silicon wafer during any of many stages of integrated circuit fabrication thereon. A wafer or substrate used in the semiconductor device industry typically has a diameter of 200 mm, or 300 mm, or 450 mm. In addition to semiconductor wafers, other work pieces that may take advantage of the disclosed implementations include various articles, such as printed circuitDocket No. LAM1P083WO boards, magnetic recording media, magnetic recording sensors, mirrors, optical elements, micro-mechanical devices, and the like.

[0040] Various semiconductor manufacturing processes, such as atomic layer deposition (ALD), atomic layer etching (ALE), chemical vapor deposition (CVD), chemical vapor etching (CVE), and the like, as well as plasma-enhanced versions of the same, may employ at least one gas delivery system in which vapor-phase and sometimes gas precursors are reacted with and / or on a surface of a substrate to deposit material thereon or remove material therefrom. Many semiconductor processing tools and apparatuses have a gas delivery system with a showerhead in a processing chamber that is configured to flow process gases onto a substrate in the chamber.

[0041] Some new and emerging showerheads and processes provide radio frequency (RF) power to the showerhead, referred to as an “RF hot” showerhead, instead of having the showerhead electrically grounded. In contrast, the outer walls of many semiconductor processing chambers, including the top, are electrically grounded. While having the showerhead as RF hot may be advantageous for various processing operations, it presents numerous challenges, including forming unwanted parasitic plasma around the showerhead and processing chamber top, and adjustment of the showerhead being difficult or unable to be done during installation or process tuning. For example, some new hardware has developed to reduce and prevent formation of parasitic plasma, but this new hardware has resulted in additional challenges, such as high stack up tolerances that can lead to numerous problems, such as a misaligned showerhead, additional locations for parasitic plasma formation, nonuniform plasma generation, and nonuniform substrate processing, such as nonuniform deposition or etching, and station-to- station nonuniformity. This parasitic plasma formation can damage the showerhead and cause unwanted chemical reactions. Conventional methods for adjusting showerheads, such as shimming, were unable to properly account for these high stack up tolerances, and some other conventional methods could also not be used, such as bellows, given the RF hot nature of the showerhead.

[0042] Provided herein are new and novel apparatuses and systems that provide desirable adjustment of a showerhead, including an RF hot showerhead. Some showerheads may be considered a chandelier-type showerhead which have a showerhead body positioned in the chamber and offset from the top of the chamber, and a showerhead stem extending through the top of the chamber and secured thereto. The apparatuses and systems herein provide for the positioning of such showerheads to be adjusted with respect to the processing chamber, such as an axial tilt. In some implementations, the systems may have a showerhead plate that isDocket No. LAM1P083WO configured to connect with a showerhead stem and provide, in part, connection between the showerhead and the processing chamber. The showerhead plate may be electrically coupled to the showerhead stem and with the showerhead configured to receive RF power. Coupled electrically and physically may be directly or indirectly coupled, such as via one or more intermediate elements. It is desirable to electrically isolate the RF hot showerhead, showerhead stem, and showerhead plate from the grounded processing chamber top. In some instances, a collar, such as an electrical insulator collar, may be provided that electrically isolates the RF hot elements from the grounded components. The collar, including an electrical insulator collar, may also be used for adjusting the showerhead plate and showerhead.

[0043] In some implementations, the collar is fixedly coupled with the showerhead plate such that movement of the collar causes the showerhead plate and showerhead to move. The collar is movably coupled to a stationary element, such as a securement block which may be a part of the processing chamber top, with a plurality of adjustment assemblies. Each adjustment assembly is configured to engage with the collar, connect with the securement block, and be movable to cause the collar to move with respect to the securement block. In some instances, each adjustment assembly has an adjustment screw with a screw body threaded into a threaded bore of the securement block and a screw head with a screw face underneath an top portion of the insulator collar. In some implementations, the screw face may be a spherical, conical, frustoconical, tapered, or angled face. A first spherical washer is in contact with, and interposed between, the screw face and a bottom surface of the top portion. Each adjustment assembly also has a plug with a plug head above the top portion and plug body extending through a respective through-hole in the top portion. Another spherical washer is interposed between, and in contact with, the plug head and the top surface of the top portion.

[0044] In some instances, the adjustment assembly may be configured to compress or sandwich a movement body that is configured to tilt. The movement body may be a plate, flange, or structure, such as the top portion of the collar. This movement body may be sandwiched between, or interposed between, the adjustment assembly. As described herein, the first spherical washer may be on one side of the movement body and the second spherical washer may be on the other side of the movement body, with the plug and adjustment screw extending at least partially through a through hole of the movement body.

[0045] The plug and adjustment screw have interfaces configured to interface with each other can cause movement of the adjustment screw in the securement block. For example, rotation of the plug is configured to cause its interface to engage with and contact the interface of the adjustment screw, and further cause the screw body to rotate within the securement block.Docket No. LAM1P083WORotating the screw body in the securement block causes the adjustment screw to move axially, or vertically, with respect to the securement block. With the connection and contact between the adjustment assemblies and the insulator collar, axial movement of the adjustment screw causes vertical movement of a portion of the insulator collar which results in its axial tilt. The spherical washers on both sides of the top portion are configured to provide tilt of the top portion, showerhead plate, and showerhead with respect to the securement block. A set screw may extend through the adjustment assembly and into the securement block. Rotating the set screw and causing it to move towards the securement block may result in an axial compressive force being applied to the plug, second spherical washer, top portion, and the adjustment screw. This may compress the top portion between the plug and adjustment screw.

[0046] Figure 1 depicts an implementation of a semiconductor processing station, which may also be considered a semiconductor processing system, that may be used to deposit material using atomic layer deposition (ALD), chemical vapor deposition (CVD), atomic layer etching (ALE), or other etching process, all of which may be plasma enhanced. For simplicity, the processing station 100 is depicted as a standalone process station having a processing chamber body 102 for maintaining a low-pressure environment. The processing chamber body 102 has a top 128 and forms a chamber interior 111. However, it will be appreciated that a plurality of process stations 100 may be included in a common process tool environment. Further, it will be appreciated that, in some implementations, one or more hardware parameters of process station 100, including those discussed in detail below, may be adjusted programmatically by one or more computer controllers.

[0047] Process station 100 fluidly communicates with gas delivery system 101 for delivering process gases to a showerhead 106. The showerhead 106 has a showerhead body 113 positioned in the chamber interior 111 and a showerhead stem 115 extending through the top 128 of the processing chamber body 102. The gas delivery system 101 includes a first process gas source 120 and a second process gas source 122 that are both fluidically coupled to a mixer junction 104. The mixer junction 104 is configured to blend, condition, or mix process gases for delivery to showerhead 106. One or more mixing vessel inlet valves 121 may control introduction of process gases to the mixer junction 104. Similarly, a showerhead inlet valve 105 may control introduction of process gasses to an inlet 107 of the showerhead 106. The first process gas 120 may be a reactant, precursor, or a mixture, and the second process gas 122 may be a purge gas source which may be an inert gas, like argon or nitrogen.

[0048] Showerhead 106 distributes process gases toward substrate 112. In the implementation shown in Figure 1, substrate 112 is located beneath showerhead 106, and is shown resting onDocket No. LAM1P083WO a pedestal 108. As depicted, the showerhead 106 is a chandelier-type with the showerhead body 113 positioned in the chamber interior 111 and the showerhead stem 115 coupled to the showerhead body 113 and extending from the chamber interior 111, through the top 128 and a securement block 157, and to an area outside the chamber body 102. As described in more detail below, the showerhead stem 115 is directly coupled to a showerhead plate 155 that is directly coupled to a collar 182 that is movably coupled to a securement block 157. In some implementations, the collar is an electrical insulator collar that is comprised of a dielectric and provides electrical insulation. In some instances, the securement block 157 is a part of the chamber top 128 or a separate structure coupled to and positioned partially inside the chamber top 128. For example, in some implementations discussed below and not shown in Figure 1, the securement block 157 may be a gas injection manifold 130 positioned at least partially in the chamber top 128 that is configured to flow gas into the chamber interior 111.

[0049] In some implementations, a microvolume 103 is located beneath showerhead 106. Performing an ALD and / or CVD process in a microvolume rather than in the entire volume of a process station may reduce reactant exposure and sweep times, may reduce times for altering process conditions (e.g., pressure, temperature, etc.), may limit an exposure of process station robotics to process gases, etc. Example microvolume sizes include, but are not limited to, volumes between 0.1 liter and 2 liters. This microvolume also impacts productivity throughput. While deposition rate per cycle drops, the cycle time also simultaneously reduces. In certain cases, the effect of the latter is dramatic enough to improve overall throughput of the module for a given target thickness of film.

[0050] In some implementations, pedestal 108 may be raised or lowered to expose substrate 112 to microvolume 103 and / or to vary a volume of microvolume 103. For example, in a substrate transfer phase, pedestal 108 may be lowered to allow substrate 112 to be loaded onto pedestal 108. During a deposition process phase, pedestal 108 may be raised to position substrate 112 within microvolume 103. In some implementations, microvolume 103 may completely enclose substrate 112 as well as a portion of pedestal 108 to create a region of high flow impedance during a deposition process.

[0051] Optionally, pedestal 108 may be lowered and / or raised during portions the deposition process to modulate process pressure, reactant concentration, etc., within microvolume 103. In one scenario where processing chamber body 102 remains at a base pressure during the deposition process, lowering pedestal 108 may allow microvolume 103 to be evacuated. Example ratios of microvolume to processing chamber volume include, but are not limited to,Docket No. LAM1P083WO volume ratios between 1: 100 and 1:10. It will be appreciated that, in some implementations, pedestal height may be adjusted programmatically by a suitable computer controller.

[0052] In another scenario, adjusting a height of pedestal 108 may allow a plasma density to be varied during plasma activation and / or treatment cycles included in the deposition process. At the conclusion of the deposition process phase, pedestal 108 may be lowered during another substrate transfer phase to allow removal of substrate 112 from pedestal 108.

[0053] While the example microvolume variations described herein refer to a height-adjustable pedestal, it will be appreciated that, in some implementations, a position of showerhead 106 may be adjusted relative to pedestal 108 to vary a volume of microvolume 103. Further, it will be appreciated that a vertical position of pedestal 108 and / or showerhead 106 may be varied by any suitable assembly within the scope of the present disclosure. In some implementations, pedestal 108 may include a rotational axis for rotating an orientation of substrate 112. It will be appreciated that, in some implementations, one or more of these example adjustments may be performed programmatically by one or more suitable computer controllers.

[0054] Returning to the implementation shown in Figure 1, showerhead 106 and pedestal 108 electrically communicate with RF power supply 114 and matching network 116 for powering a plasma. In some implementations, the plasma energy may be controlled by controlling one or more of a process station pressure, a gas concentration, an RF source power, an RF source frequency, and a plasma power pulse timing. For example, RF power supply 114 and matching network 116 may be operated at any suitable power to form a plasma having a desired composition of radical species. Examples of suitable powers are included above. Likewise, RF power supply 114 may provide RF power of any suitable frequency. In some implementations, RF power supply 114 may be configured to control high- and low-frequency RF power sources independently of one another. Example low-frequency RF frequencies may include, but are not limited to, frequencies between 50 kHz and 100 kHz. Example high- frequency RF frequencies may include, but are not limited to, frequencies between 1.8 MHz and 2.45 GHz. It will be appreciated that any suitable parameters may be modulated discretely or continuously to provide plasma energy for the surface reactions. In one non-limiting example, the plasma power may be intermittently pulsed to reduce ion bombardment with the substrate surface relative to continuously powered plasmas.

[0055] In some implementations, the showerhead 106 is electrically coupled to the RF power supply 114 and may be considered an RF hot showerhead 106. The pedestal 108, the chamber body 102 including the top 128 and the securement block 157 may be electrically grounded.Docket No. LAM1P083WOAs detailed below, the showerhead stem 115 and showerhead plate 155 are electrically isolated from the securement block 157 and the chamber top 128.

[0056] In some implementations, the plasma may be monitored in-situ by one or more plasma monitors. In one scenario, plasma power may be monitored by one or more voltage, current sensors (e.g., VI probes). In another scenario, plasma density and / or process gas concentration may be measured by one or more optical emission spectroscopy sensors (OES). In some implementations, one or more plasma parameters may be programmatically adjusted based on measurements from such in-situ plasma monitors. For example, an OES sensor may be used in a feedback loop for providing programmatic control of plasma power. It will be appreciated that, in some implementations, other monitors may be used to monitor the plasma and other process characteristics. Such monitors may include, but are not limited to, infrared (IR) monitors, acoustic monitors, and pressure transducers.

[0057] In some implementations, the plasma may be controlled via input / output control (IOC) sequencing instructions. In one example, the instructions for setting plasma conditions for a plasma process phase may be included in a corresponding plasma activation recipe phase of a deposition process recipe. In some cases, process recipe phases may be sequentially arranged, so that all instructions for a deposition process phase are executed concurrently with that process phase. In some implementations, instructions for setting one or more plasma parameters may be included in a recipe phase preceding a plasma process phase. For example, a first recipe phase may include instructions for setting a flow rate of an inert and / or a reactant gas, instructions for setting a plasma generator to a power set point, and time delay instructions for the first recipe phase. A second, subsequent recipe phase may include instructions for enabling the plasma generator and time delay instructions for the second recipe phase. A third recipe phase may include instructions for disabling the plasma generator and time delay instructions for the third recipe phase. It will be appreciated that these recipe phases may be further subdivided and / or iterated in any suitable way within the scope of the present disclosure.

[0058] In some deposition processes, plasma strikes last on the order of a few seconds or more in duration. In certain implementations, much shorter plasma strikes may be used. These may be on the order of 10 ms to 1 second, typically, about 20 to 80 ms, with 50 ms being a specific example. Such very short RF plasma strikes require extremely quick stabilization of the plasma. To accomplish this, the plasma generator may be configured such that the impedance match is set preset to a particular voltage, while the frequency is allowed to float. Conventionally, high-frequency plasmas are generated at an RF frequency at about 13.56 MHz. In various implementations disclosed herein, the frequency is allowed to float to a value that isDocket No. LAM1P083WO different from this standard value. By permitting the frequency to float while fixing the impedance match to a predetermined voltage, the plasma can stabilize much more quickly, a result which may be important when using the very short plasma strikes associated with some types of deposition cycles.

[0059] In some implementations, pedestal 108 may be temperature controlled via heater 110. Further, in some implementations, pressure control for deposition process station 100 may be provided by butterfly valve 118. As shown in the implementation of Figure 1, butterfly valve 118 throttles a vacuum provided by a downstream vacuum pump (not shown). However, in some implementations, pressure control of process station 100 may also be adjusted by varying a flow rate of one or more gases introduced to process station 100.

[0060] As provided herein, the showerhead stem 115 is physically and electrically coupled to the showerhead plate 155 while the chamber top 128 and securement block 157 are electrically grounded. Due to this, the showerhead plate 155 is unable to be directly coupled to the securement block 157. The showerhead plate 155, and by extension the showerhead 106, are indirectly coupled to, and electrically isolated from, the chamber top 128 and securement block 157. This indirect connection is provided by the collar 182 and a plurality of adjustment assemblies 159. The showerhead plate 155 is directly coupled to the collar 182, and the collar 182 is directly and movably coupled to the securement block 157. The collar 182 may be an electrical insulator collar that is made of electrically insulated material, such as a dielectric or ceramic, to electrically isolate the securement block 157 from the showerhead plate 155 and showerhead stem 115. The showerhead 106 may be considered indirectly supported by the chamber body 102 by the showerhead stem’s 115 connection to the showerhead plate 155, the showerhead plate’s 155 direct connection to the collar 182, and the collar’s 182 direct and movable connection to the securement block 157.

[0061] With the collar 182 movably coupled to the securement block 157, the showerhead plate 155 and showerhead stem 115, are also movably coupled to the securement block 157. This movable connection provides adjustability of the showerhead plate 155, the collar 182, and the showerhead 106 with respect to the securement block 157 and chamber top 128. This movable connection between the collar 182 and the securement block 157 may be provided by a plurality of adjustment assemblies 159. Each adjustment assembly 159 is configured to connect with the collar 182 and the securement block 157 and provide linear, vertical movement of the showerhead plate 155 with respect to the securement block 157. Some implementations may have three adjustment assemblies arranged around a center axis in an equally spaced manner which provide multiple degrees of movement for the collar 182 and showerhead. As describedDocket No. LAM1P083WO in more detail below, each adjustment assembly 159 has movable components and spherical washers on the top and bottom of the collar 182 to allow for an adjustment screw threaded into the securement block 157 to be moved up and down. In this example, the collar 182 may be considered the movement body that is configured to tilt and that the adjustment assembly is configured to compress or sandwich.

[0062] As provided herein, some implementations of a spherical washer may have an annular body with a spherical, conical, frustoconical, tapered, or angled surface. In some instances, a spherical washer may be interfaced with another spherical washer to form a spherical washer assembly. These two washers may be contact with each other, with one washer having a surface at one orientation, such as angled or concave (or rounded inward), and the other washer having a surface at another orientation, such as a complementary angles or surfaces to each other, like a convex (or rounded outward) surface that is complementary with the concave surface. For example, the concave and convex surfaces may have the same curvature, or cross-sectional linear profiles at complementary or supplementary angles. In another example, the surfaces may be frustoconical surfaces that are complementary or supplementary to each other.

[0063] Figure 2 depicts a magnified cross-sectional view of a portion of the processing station of Figure 1. Here in Figure 2, a portion of the chamber top 128 of the processing chamber body 102 is shown along with the chamber interior 111 and the showerhead body 113 positioned in the chamber interior 111. The showerhead 106 has the showerhead inlet 107 at the top of the showerhead stem 115 outside the chamber interior 111, the showerhead stem 115 has an internal flowpath 117 and the showerhead body 113 has an internal plenum 119 and a plurality of through-holes 123 fluidically coupled to the internal plenum 119 and the internal flowpath 117. Gas is configured to flow into the showerhead 106 via the showerhead inlet 107, through the internal flowpath 117 of the showerhead stem 115, into the internal plenum 119, and out the through-holes 123 onto a wafer during processing operations.

[0064] The chamber body 102 also has the chamber top 128 and securement block 157 coupled to the chamber top 128. As illustrated, the securement block 157 is positioned partially inside the chamber top 128, such as partially inside a body of the top 128. The securement block 157 has a block center axis 131 (also referred to as the center axis 131) and a block central bore 138 that extends through the securement block 157 and extends around the center axis 131. The securement block 157 may have an inner bore surface 152 that partially defines the block central bore 138. The block central bore 138 is configured to receive the showerhead stem 115, as illustrated. The block central bore 138 may be considered a central through-hole, or cavity. Here, the showerhead stem 115 extends fully through the block central bore 138. TheDocket No. LAM1P083WO showerhead stem 115 is also seen positioned partially in the chamber interior 111, extending through the chamber top 128 and the securement block 157, and outside and above the chamber body 102.

[0065] In some implementations, the showerhead is configured to receive RF power, or RF signals, such that it is RF hot. Figure 2 illustrates the showerhead stem 115 electrically coupled to RF power, which also makes the showerhead 106 RF hot. The showerhead plate 155 is also physically and electrically coupled to the showerhead stem 115, thereby making the showerhead plate 155 electrically coupled to RF power or RF hot. The chamber top 128 is seen electrically grounded. The securement block 157 is physically and electrically coupled to, and thus electrically grounded by, the chamber top 128. In some implementations, the securement block 157 and the chamber top 128 may be an electrically conductive material, such as an aluminum or aluminum alloy.

[0066] To electrically isolate the grounded chamber top 128 and securement block 157 from the RF hot showerhead 106 and showerhead plate 155, the collar may be the electrical insulator collar 182 that is provided between the showerhead plate 155 and the securement block 157, and between the showerhead stem 115 and the securement block 157 and chamber top 128. The electrical insulator collar 182 has a top portion 161, which in some instances may be considered an annular top portion, that extends around a collar center axis, which is collinear with the bore center axis 131 in this Figure, a cylindrical body portion 184, and a collar central bore 186 that is a through-hole through the entire electrical insulator collar 182. In some implementations, the top portion may be the annular top portion 161 that may have an annular, or ring-shaped, body. As can be seen in Figure 2, the collar 182 extends through the block central bore 138 and the inner bore surface 152 extends around and is radially outwards of the collar 182. Further, the showerhead stem 115 extends through the collar central bore 186 of the collar 182 and the collar 182 is radially interposed between the showerhead stem 115 and the block central bore 138. The collar 182 may have an outer collar surface 188 that faces the inner bore surface 152 of the securement block 157. These surfaces may be offset from each other by a non-zero offset distance. The radial placement and spacing of the insulator collar assist with electrically isolating, or separating, the RF hot showerhead stem 115 and the grounded securement block 157.

[0067] The collar 182 may also have a collar bottom end 192 that is positioned inside the chamber interior 111. This may provide additional electrical insulation between the RF hot showerhead stem 115 and the grounded securement block 157 and chamber top 128. As shown, the collar 182 may have a collar height CHI in the direction parallel to the center axis 131 thatDocket No. LAM1P083WO is greater than a first height Hl of the securement block 157. At the opposite end, the insulator collar 182 has the annular top portion 161 which may be considered a flange, positioned outside the chamber interior 111 and above the securement block 157 and chamber top 128. The annular top portion 161 may have an outer collar diameter CD1 greater than the diameter of the block central bore 138. The annular top portion 161 is directly coupled with the showerhead plate 155 and movably coupled to the securement block 157 with the adjustment assemblies 159.

[0068] Features of the adjustment assemblies and chamber are further described in Figure 3 which depicts a magnified portion of Figure 2. Here in Figure 3, the details of one adjustment assembly 159 are shown, along with the showerhead plate 155, the collar 182, the securement block 157, portion of the showerhead stem 115, and portion of the chamber top 128. For clarity, some of the cross-hatching has been removed. In some implementations, the system 100 has three adjustment assemblies 159 that are positioned around the center axis in an equally spaced manner, as described in more detail below. The top portion 161 of the collar 182 has a plurality of first through-holes that extend fully through the top portion 161. These first through-holes may extend in a direction parallel to the center axis of the collar 182. Aspects of each adjustment assembly 159 extend through a respective first through-hole 163, as shown in Figure 3. Similarly, the securement block 157 has a plurality of first threaded bores 165 that are arranged around the block central bore 138 in an equally spaced manner and aspects of each adjustment assembly extend into these first threaded bores 165. Each first threaded bore 165 may have a first threaded portion 165 A with a first outer diameter DI and a second threaded portion 165B with a second outer diameter D2 smaller than the first outer diameter DI.

[0069] As shown in Figure 3, the adjustment assembly 159 has an adjustment screw 167 with a screw head 169 having a screw face, and a screw body 171 threaded into the respective first threaded bore 165. As provided above, in some implementations the screw face may be a spherical, conical, frustoconical, tapered, or angled face. The adjustment assembly 159 also has a first spherical washer 173 in contact with the screw face (not labeled here for clarity) of the screw head 169. In some implementations, the screw face may be considered a convex face that faces the top portion 161, and the first spherical washer 173 may have a concave spherical seat, or concave face, in contact with the screw face, or convex face. The first spherical washer 173 is in contact with the first spherical face of the screw head 169 and in contact with a bottom surface 175 of the top portion 161. In some instances, the first spherical washer 173 may be considered interposed between the first spherical face and a bottom surface 175, or interposed between the screw head 169 and the top portion 161.Docket No. LAM1P083WO

[0070] In some implementations, the adjustment assembly 159 further has a plug 177 with a plug head 179 above the top portion 161 and a plug body 180 that extends at least partially through the respective first through-hole 163. The adjustment assembly 159 also has a second spherical washer 181 in contact with, and interposed between, the plug head 179 and a top surface 183 of the top portion 161. The respective plug 177 and adjustment screw 167 are configured to interface with each other and the adjustment screw 167 is configured to be rotated by rotational movement of the plug 177. For example, the adjustment screw 167 has a first interface, and plug 177 has a second interface, and the first and second interfaces are configured to interface with each other, such as contact each other on side surfaces. When the plug 177 is rotated, its second interface contacts the first interface of the adjustment screw and causes the adjustment screw 167 to rotate in the same direction. In some instances, the plug acts as a screwdriver for the adjustment screw. Rotating the adjustment screw 167 within the first threaded bore 165 causes the adjustment screw 167 to rotate and move vertically in the first threaded bore 165 with respect to the securement block 157. Vertical movement of the adjustment screw 167, also causes, in part, vertical and angular movement of the collar 182 which in turn causes vertical and angular movement of the showerhead plate 155 and the showerhead 106. The spherical face of the screw head 169, and spherical washers 173 and 181 are configured to allow the collar 182 to move vertically and tilt at an angle, and to allow the adjustment screw 167 to move vertically.

[0071] Figure 4 depicts an exploded cross-sectional side view of a portion of the top portion and the adjustment assembly of Figure 3. The adjustment screw 167 is shown at the bottom and it has the screw body 171, which has external threads (the threads are not shown for clarity), and the screw head 169 with the screw face 185. In some implementations, as illustrated, the screw face 185 is a convex face that faces upwards and towards the bottom surface 175 of the top portion 161. The adjustment screw 167 also has the first interface 187 that extends upwards from the screw head 169 and has a plurality of surfaces that are configured to be contacted and engaged by the second interface of the plug 177. In some instances, the first interface 187 extends partially into the respective first through-hole 163 and overlaps along a center axis of that first through-hole 163.

[0072] Also in Figure 4 is the first spherical washer 173 that may be considered one half of a spherical washer assembly that is formed with the screw surface (or face) 185 of the screw head 169. In some instances, a spherical washer assembly may have two washers in contact with each other, with one washer having a concave (or rounded inward) surface and the other washer having a convex (or rounded outward) surface that is complementary with the concaveDocket No. LAM1P083WO surface. For example, the concave and convex surfaces may have the same curvature, or cross- sectional linear profiles at complementary angles. When the concave and concave surfaces are in contact with each other, they may pivot with respect to each other and self-align, which can provide even pressure on a clamping surface, such as the top portion, despite the orientation of the top portion. The first spherical washer 173 has a spherical surface 189, which here is a concave spherical seat 189, that is rounded inwards and is configured to contact and engage with the screw surface (or face) 185. The first spherical washer 173 also has a planar surface 191 that is opposite the concave spherical seat 189, and is configured to contact the bottom surface 175 of the top portion 161.

[0073] For illustration purposes, a section of the top portion 161 along with one first through- hole 163 is provided in Figure 4. As can be seen, the first spherical washer 173 is interposed between the top portion 161 and the screw head 169. On the other side of the top portion 161 in this exploded view is a second spherical washer 181 that is configured to be in contact with the top surface 183 of the top portion 161. The second spherical washer 181 may be considered a second spherical washer assembly with a first portion 181 A, or bottom washer 181 A, having the concave surface Cl and a second portion 18 IB, or top washer 18 IB, having the convex surface C2 positioned in contact with the concave surface Cl. The second spherical washer 181 has a bottom planar surface 181-1 in contact with the top surface 183 of the top portion 161 and a top planar surface 181-2 in contact with the plug head 179.

[0074] The plug 177 in Figure 4 has the plug head 179 and the plug body 180. The plug head 179 has an outer diameter, or diameter D3, that is greater than the diameter D4 of the plug body 180. By having this configuration, the plug body 180 is able to extend through the second spherical washer 181 and through at least part of the first through-hole 163 of the top portion 161. The plug head 179 is able to be in contact with the second spherical washer 181 and connect with the top portion 161 to provide a portion of the movable connection between the top portion 161 and securement block 157. In some implementations, the plug body 180 may have the second interface that is configured to interface with the first interface 187 of the screw head 169. This may include a plurality of surfaces configured to contact the first interface 187.

[0075] As also visible in Figure 4, each of the components of the adjustment assembly 159 has a through-hole to allow a set screw (not shown here) to extend through all of the components as well as the first through-hole 163. These through-holes, while potentially having different diameters in different implementations, are collectively referred to as second through-holes 126A-126D. For example, the adjustment screw 167 has the second through-hole 126A, the first spherical washer 173 has the second through-hole 126B, the second spherical washer 181Docket No. LAM1P083WO has the second through-hole 126C, and the plug 177 has the second through-hole 126D. In some instances, through-hole 126 A may be considered a screw central bore 126 A, the through- hole 126B may be considered a first washer central bore, through-hole 126C may be considered a second washer central bore, and through-hole 126D may be considered a plug central bore. The set screw, shown in Figure 3 as set screw 124, is configured to pass through all the second through-holes 126A-126D as well as the first through-hole 163. The set screw 124 is also configured to be threaded to the securement block 157 and retain the adjustment assembly 159 and collar 182 in a fixed position. The plug head 179 also has a recess 125 configured to receive a head of the set screw 124 which provides for axial compression of the adjustment assembly 159 and top portion 161 between the plug head 179 and the securement block 157.

[0076] Figure 5 depicts an off-angle exploded view of an implementation of the adjustment assembly of Figures 3 and 4. Here, the top portion is not shown and the view is not cross- sectional. Various features shown in Figures 3 and 4 are shown here and for conciseness, their discussion is not repeated. In some implementations, as shown in Figure 5, the plug body 180 may have a non-circumferential shape, such as having two extension bodies, a first extension body EB1 and a second extension body EB2, that are offset from each other and may be arcs. Similarly, the first interface 187 may also have a non-circumferential shape, such as two extension bodies, a third extension body EB3 and a fourth extension body EB4, that are also offset from each other and may be arcs. The third and fourth extension bodies EB3 and EB4 may extend away from the screw head 169 as illustrated. By having these shapes, the plug body 180 has gaps for receiving the first interface 187 structures, and the first interface 187 likewise has gaps for receiving the plug body 180. This configuration further provides the plug body 180 and first interface 187 to overlap with, and contact, each other. This overlap may be when viewed perpendicular to a center axis 135 of the first threaded bore 165. With this contact, rotational movement of the plug 177 causes rotational and linear movement of the adjustment screw 167 with respect to the securement block 157. Also visible in Figure 5 is the second interface 187B of the plug 177 which may be configured to receive a tool, such as grooves or slots to receive a flathead screwdriver like illustrated.

[0077] Figures 6A and 6B depict magnified cross-sectional side views of a portion of the adjustment assembly, portion of the securement block, and portion of the top portion in example positions. In Figure 6A, a portion of the securement block 157 is shown, without cross-hatching for clarity, along with the adjustment assembly 159, and a portion of the top portion 161. These features are arranged as in Figure 3 and described herein; for brevity, some aspects are not repeated here. As can be seen in Figure 6A, the first threaded bore 165 has theDocket No. LAM1P083WO first threaded portion 165 A with the first outer diameter DI, and the second threaded portion 165B with the second outer diameter D2 less than the first outer diameter DI. The screw body 171 is threaded into the first threaded portion 165A of the securement block 157 and the set screw 124 extends through the plug 177, the second spherical washer 181, the first through- hole 163, the first spherical washer 173, the adjustment screw 167, and into second threaded portion 165B.

[0078] The set screw 124 is configured to provide axial compression on aspects of the adjustment assembly and the top portion 161. As can be seen, the top portion 161 is interposed between various features of the adjustment assembly 159. Below the top portion 161 is the first spherical washer 173, screw head 169, and screw body 171. Above the top portion 161 is the second spherical washer 181, plug head 179, and a portion of the plug body 180. In some implementations, as shown herein, the plug body 180 extends through at least some of the first through-hole 163. Similarly, in some instances, aspects of the adjustment screw 167 also extend partially into the first through-hole 163, such as the first interface 187. The top portion 161 is maintained in position by axial compression caused by the adjustment assembly 159 with respect to the securement block 157. Here in this example, as provided above, the collar 182 may be considered the movement body that is configured to tilt and that the adjustment assembly is configured to compress or sandwich while tilted.

[0079] For example, below the top portion 161, the adjustment screw 167 and first spherical washer 173 provide support of the top portion 161. The adjustment screw 167 is configured to be both movable and remain stationary with respect to the securement block 157. When stationary, the adjustment screw 167 provides stationary and vertical support of the top portion 161. Axial compression along a center axis 135 of the first threaded bore 165 is provided by threading the set screw 124 into the securement block 157 and moving the set screw 124 closer to the securement block 157. For instance, when the head 124A of the set screw 124 moves vertically downward toward the securement block 157, the head 124A contacts the plug head 179 and causes the plug 177 to move axially toward (e.g., vertically downwards in Figures 6A- 6B) and relative to the securement block 157. The axial or vertical movement of the plug 177 causes the plug head 179 to contact and apply a downward force on the second spherical washer 181. The second spherical washer 181 in turn applies the downward axial force onto the top portion 161. These collective downwards vertical movements and axial forces are represented by arrow Al. The set screw is configured to move relative to the plug 177 and screw head 169.

[0080] The collective downwards force applied by the set screw 124, plug 177, secondDocket No. LAM1P083WO spherical washer 181, and top portion 161 is applied to the first spherical washer 173 and the adjustment screw 167. The adjustment screw 167 and first spherical washer 173 are configured to remain stationary to provide a counteractive, supporting force against the top portion 161 and compressive forces Al. For example, the adjustment screw 167 is threaded into first threaded bore 165 and this threaded connection causes the adjustment screw 167 to remain stationary as the collective downwards force Al is applied to the adjustment screw 167. This counteractive force is represented by arrow A2. The top portion 161 therefore is axially compressed between the adjustment screw 167, the first spherical washer 173, and securement block 157 on the bottom side, or bottom surface 175, and the plug 177, second spherical washer181, and set screw 124 on the top side, or top surface 183. As illustrated, the axial forces Al and A2 are in a direction parallel to the center axis 135 and are in opposite directions from each other. As the set screw 124 is rotated and moves towards the securement block 157, the set screw 124 moves relative to the annular top portion 161 and the adjustment screw 167 and the this set screw 124 movement causes the plug 177 to move relative to the top portion 161 and adjustment screw 167 until the plug 177 cannot move farther. The set screw 124 may continue to move relative to the annular top portion 161 and the adjustment screw 167 to increase the axial compression along axis 135 to the second spherical washer 181, the top portion 161, and the adjustment screw 167.

[0081] This configuration and axial compression may provide advantageous connection to and with the collar, such as the electrical insulator collar 182. To provide electrical isolation, the electrical insulator collar 182 may be made of a dielectric, such as a ceramic, which can be brittle and fragile, and therefore difficult to connect with other components. This first spherical washer 173 and second spherical washer 181 advantageously provide a distributed force onto the electrical insulator collar 182 which can prevent damage to the electrical insulator collar182.

[0082] The adjustment assembly 159 is configured to move and tilt the top portion 161, allow the top portion 161 to be tilted, and to apply axial compressive forces on the top portion 161 while tilted. Figure 6B depicts the portion of the adjustment assembly, the portion of the securement block, and the portion of the top portion of Figure 6A in a second example position. Here, the top portion 161 of the collar 182 is moved vertically with respect to the securement block 157 in a direction parallel to the center axis 135 of the first though-hole 163. As can be seen, the top portion 161, and collar 182, is tilted as compared to Figure 6 A. This tilt may be referenced between a referential plane 127 A of the collar 182 that is perpendicular to the collar center axis and a referential plane 127B of the securement block 157 that is perpendicular toDocket No. LAM1P083WO the block center axis 131, or the center axis 131. In some instances, this tilt may be referenced between the collar center axis and the referential plane 127B of the securement block 157 or the block center axis 131.

[0083] In Figure 6B, the referential plane 127 A of the collar 182 is oriented at a non-parallel angle with respect to the referential plane 127B of the securement block 157 and the center axis 131. This may be considered a tilt. In some implementations, this non-parallel angle may range from about 0.15 degrees to about 0.35 degrees, about 0.1 degrees to about 0.5 degrees, or about 0.1 degrees to about 0.75 degrees. In Figure 6A, the top portion 161, and collar 182, may be considered not tilted. Here, the referential plane 127 A of the collar 182 is parallel to the referential plane 127B of the securement block 157 and perpendicular to the center axis 131.

[0084] Referring back to Figure 6B, the adjustment screw 167 has been moved vertically upwards with respect to the securement block 157 by a linear distance LD1. In some implementations, the adjustment screw 167 is configured to move a maximum linear distance, and this distance may range from 0.02 inches to 0.04 inches, from 0.01 inches to 0.1 inches, or from 0.015 inches to about 0.05 inches, for example. As described herein, the adjustment screw 167 can be moved vertically within the first threaded bore 165 and with respect to the securement block 157 by rotating the plug 177 about the center axis 135. Rotating the plug 177 causes the second interface of the plug 177 to interface with and contact the first interface of the adjustment screw 167, and cause the adjustment screw 167 to rotate about the center axis 135 within the first threaded bore 165. This rotational movement is illustrated by the doublesided arrow above the adjustment assembly 159. The movement of the adjustment screw 167 also causes the rest of the adjustment assembly 159 and the top portion 161 to move vertically as well. As can be seen, the first spherical washer 173, second spherical washer 181, plug 177 and set screw 124 have all moved vertically upwards, or away from, the securement block 157. In some instances, this vertical movement is due to the rotation of the plug 177 which caused the rotation of the adjustment screw 167. Although this example shows the adjustment assembly 159 and top portion 161 moving upwards, these features can also be moved vertically downwards closer to the securement block 157 by rotating the plug 177 the opposite rotational direction.

[0085] As the adjustment assembly 159 moves vertically with respect to the securement block 157, the spherical surfaces and washers are configured to maintain contact with the top portion 161 as it tilts and thereby allow for misalignment of their surfaces. For example, the first spherical washer 173 is configured to move on the screw face 185 as the top portion 161 tiltsDocket No. LAM1P083WO and configured to maintain contact between the top portion 161 and the spherical screw face 185. Similarly, the second spherical washer 181 is configured to move and as the top portion 161 tilts and configured to maintain contact between the top portion 161 and the plug head 179.

[0086] As further illustrated in Figures 6A and 6B, various components may move relative to other components. For example, the adjustment screw 167 is configured to move rotationally and axially along the axis 135 relative to the securement block 157. The plug 177 is also configured to move rotationally and axially along the axis 135 relative to the securement block 157. The plug 177 and the adjustment screw 167 are configured to rotate together with respect to each other, with the rotation of the plug 177 configured to cause rotation of the adjustment screw 167. As the adjustment screw 167 moves rotationally, its threading into the securement block is configured to cause the adjustment screw 167 to move axially along the axis 135. As the adjustment screw 167 moves axially and rotationally, the first spherical washer 173 is configured to move axially with the adjustment screw 167.

[0087] The first spherical washer 173 is configured to tilt with respect to the adjustment screw 167. For example, the top portion 161 is configured to be tilted relative to the axis 135 and the adjustment screw 167is configured to remain aligned with the axis 135. As the top portion 161 is tilted, the first spherical washer 173 is configured to tilt with the top portion 161 and to tilt relative to the adjustment screw 167. The engagement between the first spherical washer 173 and the spherical screw face 185 provides for this movement and alignment. For instance, the referential plane 127 A in Figures 6A and 6B may represent another referential plane of the first spherical washer 173 and the referential plane 127B may be another referential plane of the adjustment screw 167. In Figure 6B, the first spherical washer 173 is oriented parallel to the referential plane 127 A which is at a tilt, or nonparallel angle, with respect to the second referential plane 127B.

[0088] Similarly, the first portion 181 A of the second spherical washer 181 is configured to tilt relative to the second portion 18 IB. The second portion 18 IB is configured to remain at the same angle relative to the axis 135 and to the plug 177. As the plug 177 moves axially along the axis 135, the second spherical washer is configured to move with it along the axis 135. As the top portion 161 is tilted, the first portion 181 A of the second spherical washer 181 is configured to tilt with the top portion 161 and to tilt relative to the second portion 18 IB. The engagement between the surfaces of the first portion 181 A and the second portion 18 IB provides for this movement and alignment. For instance, the referential plane 127 A in Figures 6 A and 6B may represent another referential plane of the first portion 181 A and the referential plane 127B may be another referential plane of the second portion 18 IB. In Figure 6B, the firstDocket No. LAM1P083WO portion 181A is oriented parallel to the referential plane 127A which is at a tilt, or nonparallel angle, with respect to the second referential plane 127B.

[0089] In some instances, the first spherical washer 173 and the first portion 181 A of the second spherical washer 181 are configured to tilt relative to the adjustment screw 167and to the second portion 18 IB. As the top portion 161 is tilted, both the first spherical washer 173 and the first portion 181A are configured to tilt relative to adjustment screw 167, the second portion 181B, and the plug 177. In some instances, axial compression by the set screw 124A provided above may be configured to cause the first spherical washer 173 and the first portion 181 A of the second spherical washer 181 to tilt relative to the second portion 18 IB and the adjustment screw 167.

[0090] As provided above, the electrical insulator collar 182 is coupled to the showerhead plate, which is coupled to the showerhead stem. Referring back to Figure 3, the showerhead plate 155 is coupled to the electrical insulator collar 182 with a plurality of connection means, one of which is shown as connection means 129, and each connection means extends only partially through the electrical insulator collar 182. This configuration may advantageously provide electrical isolation between the showerhead plate 155 and the securement block 157. In some implementations, the electrical insulator collar 182 has a plurality of holes that extend only partially through the electrical insulator collar 182 and have internal threads configured to engage with threads of the connection means 129, which may be a threaded bolt or screw.

[0091] With these physical connections, the showerhead plate and the collar, including the electrical insulator collar, are configured to move together, including tilting together. The tilt provided to the annular to the top portion 161 by the adjustment assemblies is also configured to tilt the showerhead plate, showerhead stem, and showerhead. For example, referring to Figure 6B, the referential plane 127A of the collar 182 may represent the positioning of the showerhead plate, showerhead stem, and showerhead. In some instances, this means that angling the referential plane 127 A of the collar 182 also angles the showerhead plate, showerhead stem, and showerhead, which may be the same angle. Due to this, the collar, the showerhead plate, showerhead stem, and showerhead are all configured to be tilted to a nonparallel angle with respect to the referential plane 127B of the securement block 157 and the center axis 131. This may be considered a showerhead tilt. As provided above, this non-parallel angle may range from about 0.15 degrees to about 0.35 or about 0.1 degrees to about 0.5 degrees, in some instances.

[0092] The tilt of the showerhead, showerhead plate, and collar is further illustrated in Figure 7 which depicts the magnified portion of Figure 2 in another example configuration. Here, theDocket No. LAM1P083WO adjustment assembly 159 has been moved vertically upwards like in Figure 6B. For instance, the adjustment screw 167 has been moved vertically upwards which has caused the top portion 161 of the collar 182 to move vertically upwards. The first spherical washer 173 has moved on the screw face 185 to account for this tilt and to maintain contact between the top portion 161 and the spherical screw face 185. Similarly, the second spherical washer 181 has moved to account for the tilt of the top portion 161 and to maintain contact between the top portion 161 and the plug head 179.

[0093] The vertical movement upwards of the adjustment screw 167 and adjustment assembly 159 causes the top portion 161 and collar 182 to move vertically and tilt. The collar 182 has a collar center axis, and the showerhead plate 155 has a plate center axis colinear with the collar center axis. The showerhead stem 115 also has a stem center axis. These three center axes may be colinear with each other and collectively represented by center axis 131. The block central bore 138 also has a bore center axis 143. With the collar 182 fixedly coupled to the showerhead plate 155, and the showerhead plate 155 fixedly coupled to the showerhead stem 115, movement and axial tilt of the collar 182 causes the showerhead plate 155 and the showerhead stem 115 to tilt and move vertically. For example, the positioning of the collar 182, the showerhead plate 155, and showerhead stem 115 with respect to each other remains constant during and after movement of the adjustment assembly, such as when tilted as in Figure 7.

[0094] As seen in Figure 7, the collar 182, the showerhead plate 155 and showerhead stem 115 (and by extension the showerhead) are tilted. Movement of the collar 182 by the adjustment assembly 159 causes the collective center axis 131 of the collar 182, the showerhead plate 155, and showerhead stem 115, to become oriented at a non-parallel angle, or unparallel, with respect to the bore center axis 143. Similar to provided above, this angle 9 may range from about 0.15 degrees to about 0.35 degrees or about 0.1 degrees to about 0.5 degrees. This axial tilt of the showerhead stem 115 may result from rotating the plug 177 which causes the adjustment screw 167 to rotate and move vertically, or axially, along the center axis 135, and cause the collar 182 to move and tilt.

[0095] While tilted, the showerhead stem 115 and showerhead 106 may be electrically coupled to the RF power, as illustrated in Figure 7. The collar 182 provides electrical insulation of the grounded adjustment assembly 159 and securement block 157 from the RF hot showerhead 106, showerhead stem 115, and showerhead plate 155. By having the showerhead stem 115, showerhead plate 155, and collar 182 fixedly coupled to each other, the relative offset distances between these items also remains constant which further maintains the electrical isolation between these items and the securement block 157. For example, the showerhead stem 115Docket No. LAM1P083WO extends through the collar central bore 186 of the cylindrical body portion 184 and is offset from the cylindrical body portion 184 by an offset distance OD. This offset distance OD remains constant during and after movement of the adjustment assembly, such as when tilted as in Figure 7. This configuration advantageously provides electric insulation between components and also reduces or eliminates the formation of parasitic plasma by maintaining the desired offset distance and other spacing.

[0096] To provide the ability to tilt the collar 182, the system may have three adjustment assemblies that are positioned equally spaced around the bore center axis 143. These three adjustment assemblies provide three pivot points for the collar 182, showerhead plate 155, and showerhead stem 115 and thereby provide multiple degrees of rotational and axial movement and tilting. Figure 8 depicts a top view of a portion of the system of Figure 3. Here, the showerhead stem 115, showerhead plate 155, collar 182, and securement block 157 are shown. Three adjustment assemblies 159A-159C are also illustrated and as can be seen, they are arranged around the bore center axis 131 in an equally spaced manner. They are also spaced the same radial distance R1 from the bore center axis 131. Three first through-holes 163A- 163C are also shown and illustrated with dashed lines to indicate they are underneath the three adjustment assemblies 159A-159C, respectively. There are also three connection means 129A-129C positioned around the bore center axis 131 in an equally spaced manner.

[0097] Also overlapping with these first through-holes are the first threaded bores 165A-165C, respectively, which are also marked. As arranged, center axes of the adjustment assemblies 159A-159C, the three first through-holes 163A-163C, and the first threaded bores 165A- 165C, respectively are colinear with each other. For example, the center axis of the adjustment assembly 159A is colinear with the center axis 135A of first through-hole 163A and first threaded bore 165A. These three first through-holes 163A-163C and the first threaded bores 165A-165C are also arranged around the bore center axis 131 in an equally spaced manner and in some instances, are at the same radial distance R1 as each other and the adjustment assemblies 159A-159C. While the bore center axis 131 is referenced in some instances, in other instances, the three first through-holes 163A-163C and the first threaded bores 165A- 165C may also be considered arranged in an equally spaced manner around the collar center axis. Positioning the adjustment assemblies 159A-159C and the respective three first through- holes 163A-163C the first threaded bores 165A-165C around the bore center axis 131, the collar 182 and showerhead 106 has three pivots, or rotation points, about which it can be tilted and rotated. This provides for the showerhead to have multiple degrees of rotational and angular movement for adjustment, as well as vertical adjustment with respect to the chamberDocket No. LAM1P083WO top.

[0098] In some implementations, there is an electrical clearance area between each adjustment assembly 159A-159C and the showerhead plate 155. With the showerhead plate 155 configured to be RF hot and the adjustment assemblies 159A-159C electrically grounded, it is advantageous to keep them separate by having the electrical clearance area. If the showerhead plate 155 and adjustment assemblies 159A-159C are too close to each other, parasitic plasma or arcing may occur which can be dangerous to personnel and the system. The showerhead plate 155 may therefore have an outer periphery 145, or outer boundary, that is configured to remain offset from each adjustment assembly 159A-159C by a clearance distance CD1 (one of which is labeled). As illustrated in Figure 8, the showerhead plate 155 have a plurality of cutouts 145A-145C around each location where the adjustment assemblies 159A-159C are positioned. These cutouts 145A-145C are offset from the adjustment assemblies by the clearance distance CD1. The cutouts 145A-145C thereby position the showerhead plate 155 far enough away from the adjustment assemblies 159A-159C to prevent unwanted effects, like arcing.

[0099] In some implementations, it may also be advantageous to provide features configured to prevent the showerhead 106 from being tilted past an undesired angle. For example, if the showerhead 106 is tilted too far, it may contact aspects of the chamber body 102 or result in nonuniform gas flow or plasma generation. The system or station 100 provided herein may have a plurality of stoppers 147 positioned partially in the securement block 157. These stoppers 147 may be arranged around the bore center axis 131 in an equally spaced manner and positioned proximate to a respective adjustment assembly, in some implementations, and also radially outwards of the adjustment assemblies. Each stopper 147 may extend above a top surface TS1 of the securement block 157 and have a stopper top 147-1 configured to be contacted by the top portion 161 of the collar 182.

[0100] Referring back to Figures 3 and 7, one stopper 147 is shown positioned partially in the securement block 157 and partially above the top surface TS1 of the securement block 157. As the collar 182 is titled, it is configured to contact a stopper 147 which prevents further tilting or movement by the collar 182. The location of the stopper 147 in Figures 3 and 7 is for illustration purposes. As shown in Figure 8, in some implementations, the stoppers 147A-147C are positioned radially outwards of the adjustment assemblies 159A-159C, and proximate to a respective adjustment assembly 159A-159C. In some instances, each stopper 147 is threaded into the securement block 157. The stoppers may be configured to prevent the showerhead 106 from being tilted past a maximum tilt angle which may range from 0.2 degrees to 0.35 degrees,Docket No. LAM1P083WO from 0.15 degrees to 0.35 degrees, or from 0.1 degrees to 0.6 degrees, in some implementations. Similarly, each stopper 147 may be configured to prevent any adjustment screw 167 from being linearly translated with respect to the securement block 157 by a maximum linear distance. This maximum linear distance may range from 0.02 inches to 0.04 inches, or 0.01 inches to 0.1 inches, for example. In some implementations, there may be three stoppers 147, as shown in Figure 8.

[0101] In some implementations, an annular seal may be positioned between the securement block and the bottom surface of the top portion of the collar. Referring to Figure 3, an annular seal SI is seen extending around the center axis 131 and in between, and in contact with, the securement block 157 and the bottom surface 175 of the top portion 161. This may provide a seal between chamber interior 111 and the environment outside the chamber body 102. In some instances, this annular seal SI may be an O-ring and may be positioned in a groove G1 of the securement block 157. As illustrated, the annular seal is positioned radially inwards of the adjustment assemblies to exposure of these assemblies to the environment of the chamber interior which could damage the adjustment assemblies. This is illustrated in Figure 8 which also shows the annular seal SI in dashed lines indicated it is underneath features.

[0102] In some implementations, the securement block and electrical insulator collar may have their electrical properties switched. For example, the securement block may be an electrical insulator, such as a dielectric or ceramic material, and the electrical insulator collar may be electrically conductive and electrically coupled to the RF power. The plurality of adjustment assemblies and other features provided herein retain their ability to adjust the showerhead and electrical insulator collar while electrically isolating the securement block and chamber top, from the electrical insulator collar and showerhead.

[0103] In some implementations, the securement block 157 may be a part of the chamber top 128. In some instances, the securement block 157 may be a separate structure that is coupled to the chamber top 128. As provided herein below, the securement block 157 may be a gas injection manifold 130 configured to provide a gas into the chamber interior through a chamber outlet 144 that extends around the showerhead stem 115.

[0104] Figure 9 depicts a magnified cross-sectional slice of a portion of another processing station. This processing station 902 is similar to that of Figure 2 with some noted differences. For example, the securement block is a gas injection manifold 130 and the chamber top 128 also has the gas injection manifold 130 positioned partially inside the chamber top 128, such as partially inside a body of the top 128. The showerhead stem 115 is positioned partially in the chamber interior 111, extends through the chamber top 128 and the gas injection manifoldDocket No. LAM1P083WO130, and outside and above the chamber body 102. The showerhead 106 has the showerhead inlet 107 outside the chamber body 102. In some implementations, the gas injection manifold 130 has a center axis 131, a central bore portion 136 extending around the center axis, and an outer body portion 137 that extends around, and is radially outwards of, the central bore portion 136. The central bore portion 136 defines a central bore 138 configured to receive the showerhead stem 115, as illustrated. The central bore 138 may be considered a central through- hole, or cavity. Here, the showerhead stem 115 extends fully through the central bore 138.

[0105] In some implementations, the gas injection manifold 130 also has an annular gas plenum 140 that is radially outwards of the central bore 138 and that extends around the center axis 131 and the central bore portion 136. The gas inlet 132 is fluidically coupled to the annular gas plenum 140 by a gas supply passage 142 that spans between the gas inlet 132 and the annular gas plenum 140. As discussed in more detail below, the annular gas plenum 140 may be partially defined by a groove in the outer body portion 137 and an outer surface of the central bore portion 136.

[0106] Gas in the gas injection manifold 130 is configured to flow into the chamber interior 111 through a secondary chamber outlet 144. The secondary chamber outlet 144 may be positioned at the chamber top 128, such as coplanar or even with an inner surface 146 of the chamber top 128. In some instances, as seen in Figure 2, the secondary chamber outlet 144 may be defined by the inner surface 146, which may be a top internal surface of the top 128 or top edge of the chamber top 128, and the central bore portion 136. In some instances, the secondary chamber outlet 144 may be considered outside the chamber interior 111 and may be considered to define an outer boundary of the chamber interior 111. In some instances, the secondary chamber outlet 144 may be parallel to or coplanar with the inner surface 146, and the secondary chamber outlet 144 may also be configured to flow gas into the chamber in a direction parallel to the showerhead stem 115 or center axis 131.

[0107] In some implementations, gas is configured to flow through one or more flow passages of the gas injection manifold 130 to reach the secondary chamber outlet 144. For example, the gas injection manifold 130 has a plurality of gas passages 148 fluidically coupled to the annular gas plenum 140 and the secondary chamber outlet 144. These passages 148 may be radially arranged around the center axis in an equally spaced manner which may provide symmetric and uniform gas flow therethrough. As shown, these passages 148 are fluidically interposed between the annular gas plenum 140 and the secondary chamber outlet 144. Similar to the annular gas plenum, each passage 148 may be partially defined by a channel in the outer bodyDocket No. LAM1P083WO portion 137 and an outer surface of the central bore portion 136. These passages may extend in a direction parallel to the center axis 131.

[0108] In some instances, the gas injection manifold 130 may also have a gas distribution plenum 150 extending around and radially outwards of the central bore 138, and fluidically coupled to and interposed between the gas passages 148 and the secondary chamber outlet 144. This gas distribution plenum 150 may be an annular channel and may provide uniform and balanced flow into the chamber interior 111. Also similar to the annular gas plenum, the gas distribution plenum 150 may be partially defined by a circumferential surface of the chamber top 128 and an outer surface of the central bore portion 136.

[0109] The gas injection manifold may have a central bore portion 136 with have a cylindrical body that extends around the center axis 131 and that has a first radial thickness. The central bore portion 136 has an inner bore surface 152 defining the central bore 138. The outer bore surface 154 may partially define an annular gas plenum 140, the plurality of gas passages 148, and a gas distribution plenum 150.

[0110] In Figure 9, the outer body portion 137 is seen extending around the center axis 131, the central bore portion 136, and radially outwards of the central bore portion 136. In some implementations, the outer body portion 137 is in direct, and electrical, contact with the central bore portion 136 and they may be separate structures coupled together, such as by a shrink fit. In some other implementations described below, the outer body portion 137 may be the same contiguous structure as the central bore portion 136. The outer body portion 137 has the gas inlet 132 and the gas supply passage 142 spanning between and fluidically connecting the annular gas plenum 140 to the gas inlet 132. The outer body portion 137 may also have an upper body portion 156 with the gas inlet 132 and a lower body portion 158 having the annular gas plenum 140 which is radially outwards of the central bore 138. The gas supply passage 142 extends through the upper body portion 156 and lower body portion 158.

[0111] The annular gas plenum 140 extends around and is radially outwards from the central bore 138 and the central bore portion 136. In some instances, the annular gas plenum 140 is partially defined by the outer bore surface 154 and an annular groove in the lower body portion 158. Although the annular gas plenum 140 may be partially defined by the outer bore surface 154 of the central bore portion 136, the annular gas plenum 140 may still be considered radially outwards from the central bore portion 136 with respect to the center axis 131. The cross- sectional area of the annular groove in a plane parallel to the center axis 131 may be rectangular, U-shaped, or C-shaped, and in a plane perpendicular to the center axis 131, it may be annular or ring-shaped.Docket No. LAM1P083WO

[0112] Each gas passage 148 fluidically connects the annular gas plenum 140 to the gas distribution plenum 150 and the secondary chamber outlet 144. The gas distribution plenum 150 is also seen and partially defined by the outer bore surface 154 of the central bore portion 136. In the illustrated example of Figure 3, the gas distribution plenum 150 is also defined by a circumferential surface 160 that extends around the center axis 131 and is radially offset from the central bore portion 136. In some implementations, like in Figure 9, the circumferential surface 160 may be a surface of the chamber top 128 itself. The gas distribution plenum 150 may be an annular channel. For example, the cross-sectional area of the gas distribution plenum 150 in a plane perpendicular to the center axis 131 may be annular or ring-shaped.

[0113] In some implementations, the gas injection manifold 130 may have a manifold gas flowpath spanning from, and fluidically connecting, the gas inlet 132 and the secondary chamber outlet 144. For example, the manifold gas flowpath may provide fluidic connection between the gas inlet, gas supply passage 142, the annular gas plenum 140, the gas passage 148, the gas distribution plenum 150, and the secondary chamber outlet 144. This manifold gas flowpath may be considered at least a portion of a secondary purge gas flowpath. Here, gas flows through the gas inlet 132 into the gas supply passage 142, then into and through the annular gas plenum 140, into and through the gas passage 148, into and through the gas distribution plenum 150, and out the secondary chamber outlet 144 into the chamber interior 111. The secondary chamber outlet 144 is encircled with a dashed ellipse for clarity.

[0114] Figure 10 shows a schematic view of an implementation of a multi-station processing tool 1000 with an inbound load lock 1002 and an outbound load lock 1004, either or both of which may comprise a remote plasma source. A robot 1006, at atmospheric pressure, is configured to move wafers from a cassette loaded through a pod 1008 into inbound load lock 1002 via an atmospheric port 1010. A wafer is placed by the robot 1006 on a pedestal 1012 in the inbound load lock 1002, the atmospheric port 1010 is closed, and the load lock is pumped down. Where the inbound load lock 1002 comprises a remote plasma source, the wafer may be exposed to a remote plasma treatment in the load lock prior to being introduced into a processing chamber 1014. Further, the wafer also may be heated in the inbound load lock 1002 as well, for example, to remove moisture and adsorbed gases. Next, a chamber transport port 1016 to processing chamber 1014 is opened, and another robot (not shown) places the wafer into the reactor on a pedestal of a first station shown in the reactor for processing. While the implementation depicted in Figure 10 includes load locks, it will be appreciated that, in some implementations, direct entry of a wafer into a process station may be provided.

[0115] The depicted processing chamber 1014 comprises four process stations, numbered fromDocket No. LAM1P083WO1 to 4 in the implementation shown in Figure 10. Each station has a heated pedestal (shown at 1018 for station 1), and gas line inlets. It will be appreciated that in some implementations, each process station may have different or multiple purposes. While the depicted processing chamber 1014 comprises four stations, it will be understood that a processing chamber according to the present disclosure may have any suitable number of stations. For example, in some implementations, a processing chamber may have five or more stations, while in other implementations a processing chamber may have three or fewer stations.

[0116] One or more of the stations in Figure 13 also may have the features provided above, such as the electrical insulator collar, securement block, showerhead plate, and adjustment assemblies.

[0117] Figure 10 also depicts an implementation of a wafer handling system 1090 for transferring wafers within processing chamber 1014. In some implementations, wafer handling system 1090 may transfer wafers between various process stations and / or between a process station and a load lock. It will be appreciated that any suitable wafer handling system may be employed. Non-limiting examples include wafer carousels and wafer handling robots. Figure 10 also depicts an implementation of a system controller 1050 employed to control process conditions and hardware states of process tool 1000. System controller 1050 may include one or more memory devices 1056, one or more mass storage devices 1054, and one or more processors 1052. Processor 1052 may include a CPU or computer, analog and / or digital input / output connections, stepper motor controller boards, etc.

[0118] In some implementations, system controller 1050 controls all of the activities of process tool 1000. System controller 1050 executes system control software 1058 stored in mass storage device 1054, loaded into memory device 1056, and executed on processor 1052. System control software 1058 may include instructions for controlling the timing, mixture of gases, chamber and / or station pressure, chamber and / or station temperature, purge conditions and timing, wafer temperature, RF power levels, RF frequencies, substrate, pedestal, chuck and / or susceptor position, and other parameters of a particular process performed by process tool 1000. System control software 1058 may be configured in any suitable way. For example, various process tool component subroutines or control objects may be written to control operation of the process tool components necessary to carry out various process tool processes in accordance with the disclosed methods. System control software 1058 may be coded in any suitable computer readable programming language.

[0119] In some implementations, system control software 1058 may include input / output control (IOC) sequencing instructions for controlling the various parameters described above.Docket No. LAM1P083WOFor example, each phase of a PEALD process may include one or more instructions for execution by system controller 1050. The instructions for setting process conditions for a PEALD process phase may be included in a corresponding PEALD recipe phase. In some implementations, the PEALD recipe phases may be sequentially arranged, so that all instructions for a PEALD process phase are executed concurrently with that process phase.

[0120] Other computer software and / or programs stored on mass storage device 1054 and / or memory device 1056 associated with system controller 1050 may be employed in some implementations. Examples of programs or sections of programs for this purpose include a substrate positioning program, a process gas control program, a pressure control program, a heater control program, and a plasma control program.

[0121] A substrate positioning program may include program code for process tool components that are used to load the substrate onto pedestal 1018 and to control the spacing between the substrate and other parts of process tool 1000.

[0122] A process gas control program may include code for controlling gas composition and flow rates and optionally for flowing gas into one or more process stations prior to deposition in order to stabilize the pressure in the process station. The process gas control program may include code for controlling gas composition and flow rates within any of the disclosed ranges. A pressure control program may include code for controlling the pressure in the process station by regulating, for example, a throttle valve in the exhaust system of the process station, a gas flow into the process station, etc. The pressure control program may include code for maintaining the pressure in the process station within any of the disclosed pressure ranges.

[0123] A heater control program may include code for controlling the current to a heating unit that is used to heat the substrate. Alternatively, the heater control program may control delivery of a heat transfer gas (such as helium) to the substrate. The heater control program may include instructions to maintain the temperature of the substrate within any of the disclosed ranges.

[0124] A plasma control program may include code for setting RF power levels and frequencies applied to the process electrodes in one or more process stations, for example using any of the RF power levels disclosed herein. The plasma control program may also include code for controlling the duration of each plasma exposure.

[0125] In some implementations, there may be a user interface associated with system controller 1050. The user interface may include a display screen, graphical software displays of the apparatus and / or process conditions, and user input devices such as pointing devices, keyboards, touch screens, microphones, etc.

[0126] In some implementations, parameters adjusted by system controller 1050 may relate toDocket No. LAM1P083WO process conditions. Non-limiting examples include process gas composition and flow rates, temperature, pressure, plasma conditions (such as RF power levels, frequency, and exposure time), etc. These parameters may be provided to the user in the form of a recipe, which may be entered utilizing the user interface.

[0127] Signals for monitoring the process may be provided by analog and / or digital input connections of system controller 1050 from various process tool sensors. The signals for controlling the process may be output on the analog and digital output connections of process tool 1000. Non-limiting examples of process tool sensors that may be monitored include mass flow controllers, pressure sensors (such as manometers), thermocouples, etc. Appropriately programmed feedback and control algorithms may be used with data from these sensors to maintain process conditions.

[0128] Similarly, in some implementations, the controller 1050 is part of a system, which may be part of the above-described examples. Such systems can include semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller 1050, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings in some systems, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0129] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system.Docket No. LAM1P083WOThe operational parameters may, in some implementations, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0130] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0131] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.Docket No. LAM1P083WO

[0132] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

[0133] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some implementations, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0134] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabrication operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g. a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that theDocket No. LAM1P083WO controller is configured to interface with or control. Thus as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0135] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an ALD chamber or module, an ALE chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0136] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

[0137] Unless otherwise specified, the illustrated implementations are to be understood as providing example features of varying detail of some implementations. Thus, unless otherwise specified, the features, components, modules, layers, films, regions, aspects, structures, etc. (hereinafter individually or collectively referred to as an “element” or “elements”), of the various illustrations may be otherwise combined, separated, interchanged, and / or rearranged without departing from the teachings of the disclosure.

[0138] The terminology used herein is for the purpose of describing some implementations and is not intended to be limiting. As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It is to be understood that the phrases “for each <item> of the one or more <items>,” “each <item> of the one or more <items>,” and / or the like, if used herein, are inclusive of both a single-item group and multiple-item groups, i.e., the phrase “for . . . each” is used in the sense that it is used in programming languages to refer to each item of whatever population of items is referenced. For example, if the population of items referenced is a single item, then “each”Docket No. LAM1P083WO would refer to only that single item (despite dictionary definitions of “each” frequently defining the term to refer to “every one of two or more things”) and would not imply that there must be at least two of those items. Similarly, the term “set” or “subset” should not be viewed, in itself, as necessarily encompassing a plurality of items — it is to be understood that a set or a subset can encompass only one member or multiple members (unless the context indicates otherwise). The terms “comprises,” “comprising,” “includes,” and / or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It is also noted that, as used herein, the terms “substantially,” “about,” and other similar terms, are used as terms of approximation and not as terms of degree, and, as such, are utilized to account for inherent deviations in measured, calculated, and / or provided values that would be recognized by one of ordinary skill in the art. Accordingly, the term “substantially” as used herein, unless otherwise specified, means within 5% of a referenced value. For example, substantially perpendicular means within ±5% of parallel.

[0139] The use of cross-hatching and / or shading in the accompanying drawings is generally provided to clarify boundaries between adjacent elements. As such, neither the presence nor the absence of cross-hatching or shading conveys or indicates any preference or requirement for particular materials, material properties, dimensions, proportions, commonalities between illustrated elements, and / or any other characteristic, attribute, property, etc., of the elements, unless specified. Further, in the accompanying drawings, the size and relative sizes of elements may be exaggerated for clarity and / or descriptive purposes. As such, the sizes and relative sizes of the respective elements are not necessarily limited to the sizes and relative sizes shown in the drawings. When an implementation may be implemented differently, a specific process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially at the same time or performed in an order opposite to the described order.

[0140] When an element, such as a layer, is referred to as being “on,” “connected to,” or “coupled to” another element, it may be directly on, directly connected to, or directly coupled to the other element or at least one intervening element may be present. When, however, an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element, there are no intervening elements present. Other terms and / or phrases if used herein to describe a relationship between elements should be interpreted in a like fashion, such as “between” versus “directly between,” “adjacent” versus “directly adjacent,” “on” versusDocket No. LAM1P083WO“directly on,” etc. Further, the term “connected” may refer to physical, electrical, and / or fluid connection. To this end, for the purposes of this disclosure, the phrase “fluidically connected” is used with respect to volumes, plenums, holes, etc., that may be connected to one another, either directly or via one or more intervening components or volumes, to form a fluidic connection, similar to how the phrase “electrically connected” is used with respect to components that are connected to form an electric connection. The phrase “fluidically interposed,” if used, may be used to refer to a component, volume, plenum, hole, etc., that is fluidically connected with at least two other components, volumes, plenums, holes, etc., such that fluid flowing from one of those other components, volumes, plenums, holes etc., to the other or another of those components, volumes, plenums, holes, etc., would first flow through the “fluidically interposed” component before reaching that other or another of those components, volumes, plenums, holes, etc.. For example, if a pump is fluidically interposed between a reservoir and an outlet, fluid flowing from the reservoir to the outlet would first flow through the pump before reaching the outlet. The phrase "fluidically adjacent," if used, refers to placement of a fluidic element relative to another fluidic element such that no potential structures fluidically are interposed between the two elements that might potentially interrupt fluid flow between the two fluidic elements. For example, in a flowpath having a first valve, a second valve, and a third valve arranged sequentially therealong, the first valve would be fluidically adjacent to the second valve, the second valve fluidically adjacent to both the first and third valves, and the third valve fluidically adjacent to the second valve.

[0141] For the purposes of this disclosure, “at least one of X, Y, . . ., and Z” and “at least one selected from the group consisting of X, Y, . . ., and Z” may be construed as X only, Y only, . . ., Z only, or any combination of two or more of X, Y, . . ., and Z, such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0142] Although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Thus, a first element discussed below could be termed a second element without departing from the teachings of the disclosure. To this end, use of such identifiers, e.g., “a first element,” should not be read as suggesting, implicitly or inherently, that there is necessarily another instance, e.g., “a second element.” Further, the use, if any, of ordinal indicators, such as (a), (b), (c), . . ., or (1), (2), (3), . . ., or the like, in this disclosure and accompanying claims, is to be understood as not conveying any particular order or sequence, except to the extent that such an order or sequence is explicitly indicated. ForDocket No. LAM1P083WO example, if there are three steps labeled (i), (ii), and (iii), it is to be understood that these steps may be performed in any order (or even concurrently, if not otherwise contraindicated), unless indicated otherwise. For example, if step (ii) involves the handling of an element that is created in step (i), then step (ii) may be viewed as happening at some point after step (i). In a similar manner, if step (i) involves the handling of an element that is created in step (ii), the reverse is to be understood.

[0143] Spatially relative terms, such as “beneath,” “below,” “under,” “lower,” “above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), and the like, may be used herein for descriptive purposes, and, thereby, to describe one element’s spatial relationship to at least one other element as illustrated in the drawings. Spatially relative terms are intended to encompass different orientations of an apparatus in use, operation, and / or manufacture in addition to the orientation depicted in the drawings. For example, if the apparatus in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” or “over” the other elements or features. Thus, the term “below” can encompass both an orientation of above and below. Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and, as such, the spatially relative descriptors used herein interpreted accordingly.

[0144] The term “between,” as used herein and when used with a range of values, is to be understood, unless otherwise indicated, as being inclusive of the start and end values of that range. For example, between 1 and 5 is to be understood as inclusive of the numbers 1, 2, 3, 4, and 5, not just the numbers 2, 3, and 4.

[0145] As used herein, the phrase “operatively connected” is to be understood as referring to a state in which two components and / or systems are connected, either directly or indirectly, such that, for example, at least one component or system can control the other. For instance, a controller may be described as being operatively connected with (or to) a resistive heating unit, which is inclusive of the controller being connected with a sub-controller of the resistive heating unit that is electrically connected with a relay that is configured to controllably connect or disconnect the resistive heating unit with a power source that is capable of providing an amount of power that is able to power the resistive heating unit so as to generate a desired degree of heating. The controller itself likely will not supply such power directly to the resistive heating unit due to the current(s) involved, but it is to be understood that the controller is nonetheless operatively connected with the resistive heating unit.

[0146] As used herein, the singular forms, “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It is also to be understoodDocket No. LAM1P083WO that the phrases “for each <item> of the one or more <items>,” “each <item> of the one or more <items>,” and / or the like, if used herein, are inclusive of both a single-item group and multiple-item groups, i.e., the phrase “for . . . each” is used in the sense that it is used in programming languages to refer to each item of whatever population of items is referenced. For example, if the population of items referenced is a single item, then “each” would refer to only that single item (despite dictionary definitions of “each” frequently defining the term to refer to “every one of two or more things”) and would not imply that there must be at least two of those items. Similarly, the term “set” or “subset” should not be viewed, in itself, as necessarily encompassing a plurality of items — it is to be understood that a set or a subset can encompass only one member or multiple members (unless the context indicates otherwise). In addition, the terms “comprises,” “comprising,” “includes,” and / or “including,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0147] Various implementations are described herein with reference to sectional views, isometric views, perspective views, plan views, and / or exploded illustrations that are schematic depictions of idealized implementations and / or intermediate structures. As such, variations from the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances, are to be expected. Thus, implementations disclosed herein should not be construed as limited to the particular illustrated shapes of regions, but are to include deviations in shapes that result from, for instance, manufacturing. To this end, regions illustrated in the drawings may be schematic in nature and shapes of these regions may not reflect the actual shapes of regions of a device, and, as such, are not intended to be limiting.

[0148] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and are not to be interpreted in an idealized or overly formal sense, unless expressly so defined herein.

[0149] As customary in the field, some implementations are described and illustrated in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, hard-wired circuits, memory elements, wiring connections, and the like, which may be formedDocket No. LAM1P083WO using semiconductor-based fabrication techniques or other manufacturing technologies. In the case of the blocks, units, and / or modules being implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform various functions discussed herein and may optionally be driven by firmware and / or software. It is also contemplated that each block, unit, and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Also, each block, unit, and / or module of some implementations may be physically separated into two or more interacting and discrete blocks, units, and / or modules without departing from the inventive concepts. Further, the blocks, units, and / or modules of some implementations may be physically combined into more complex blocks, units, and / or modules without departing from the teachings of the disclosure.

[0150] Although the foregoing implementations have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the appended claims. It should be noted that there are many alternative ways of implementing the processes, systems, and apparatuses of the disclosed implementations. Accordingly, implementations are to be considered as illustrative and not as restrictive, and implementations are not to be limited to the details given herein.

[0151] It is to be understood that the above disclosure, while focusing on a particular example implementation or implementations, is not limited to only the discussed example, but may also apply to similar variants and mechanisms as well, and such similar variants and mechanisms are also considered to be within the scope of this disclosure. For example, the above disclosure is directed to at least, but not exclusively, the following numbered implementations.

[0152] Implementation 1: A system for semiconductor processing, the system comprising: a showerhead plate configured to connect to a showerhead stem of a showerhead; a collar having: an top portion coupled to the showerhead plate and having a first through-hole, and a collar central bore extending through the top portion and configured to receive the showerhead stem; a securement block having a block central bore and a first threaded bore extending partially into the securement block; and an adjustment assembly extending through the top portion of the collar and coupled to the securement block, wherein: the adjustment assembly has:Docket No. LAM1P083WO an adjustment screw having a screw head with a screw face, a screw body threaded into the first threaded bore, and a first interface, a first spherical washer in contact with, and interposed between, the screw face of the screw head and a bottom surface of the top portion, a plug having a plug head, a plug body extending at least partially through one first through-hole, and a second interface, and a second spherical washer in contact with, and interposed between, the plug head and a top surface of the top portion, the first interface is configured to interface with the second interface, rotation of the plug is configured to cause the second interface to interface with the first interface and cause the adjustment screw to rotate within the first threaded bore, and rotational movement of the adjustment screw within the first threaded bore causes the collar and showerhead plate to tilt with respect to the securement block.

[0153] Implementation 2: The system of implementation 1, wherein: the screw face is a convex face that faces the top portion, and the first spherical washer has a concave spherical seat in contact with the convex face and a planar surface in contact with the bottom surface of the top portion.

[0154] Implementation 3: The system of implementation 1, wherein the second spherical washer has: a top washer with a second convex face, and a bottom washer in contact with the top surface of the top portion and having a second concave face in contact with the second convex face.

[0155] Implementation 4: The system of implementation 1, wherein the showerhead plate and the collar are configured to move together.

[0156] Implementation 6: The system of implementation 1, wherein: the collar has a collar center axis, the showerhead plate has a plate center axis colinear with the collar center axis, the block central bore has a bore center axis, and tilt of the collar and the showerhead plate with respect to the securement block causes the collar center axis and the plate center axis to be unparallel with the bore center axis.

[0157] Implementation 7: The system of implementation 6, wherein:Docket No. LAM1P083WO the tilt of the collar and the showerhead plate with respect to the securement block causes the collar center axis and the plate center axis to be oriented at a first angle with respect the bore center axis, and the first angle ranges from 0.15 degrees to 0.35 degrees.

[0158] Implementation 8: The system of implementation 1, further comprising an O-ring seal, wherein: the securement block has a groove extending around the central and radially inwards of the first threaded bore, and the O-ring seal is positioned in the groove and in contact with the bottom surface of the top portion and the securement block.

[0159] Implementation 9: The system of implementation 1, further comprising the showerhead stem, wherein: the showerhead plate is coupled to the showerhead stem, the showerhead stem extends through the central bore and the collar central bore, and the rotational movement of one adjustment screw within the first threaded bore further causes the collar, the showerhead plate, and the showerhead stem to tilt with respect to the securement block.

[0160] Implementation 10: The system of implementation 9, wherein: the showerhead stem is electrically coupled to the showerhead plate, the showerhead plate and the showerhead stem are electrically isolated from the adjustment assembly and the securement block.

[0161] Implementation 11: The system of implementation 10, wherein: the showerhead stem is configured to receive radio frequency (RF) power, and the showerhead plate and the showerhead stem are electrically isolated from the adjustment assembly and the securement block when the showerhead stem receives RF power.

[0162] Implementation 12: The system of implementation 9, wherein the positioning of the collar, the showerhead plate, and the showerhead stem with respect to each other remains constant during and after the rotational movement of one adjustment screw within the first threaded bore.

[0163] Implementation 13: The system of implementation 9, wherein: the collar further has a cylindrical body portion with a first length and the collar central bore extends through the cylindrical body portion, the showerhead stem extends through the cylindrical body portion,Docket No. LAM1P083WO the showerhead stem is radially offset from the cylindrical body portion by an offset distance, and the offset distance remains constant during and after the rotational movement of one adjustment screw within the first threaded bore.

[0164] Implementation 14: The system of implementation 1, wherein: the showerhead plate has an outer periphery, and the adjustment assembly is offset from the outer periphery by a non-zero clearance distance.

[0165] Implementation 15: The system of implementation 1, further comprising a plurality of stoppers, wherein: each stopper is positioned partially inside the securement block and offset from a top surface of the securement block, and each stopper has a stopper top configured to be contacted by the bottom surface of the top portion.

[0166] Implementation 16: The system of implementation 15, wherein each stopper is configured to prevent the collar, the showerhead plate, and the showerhead stem from being tilted past a maximum tilt angle.

[0167] Implementation 17: The system of implementation 16, wherein the maximum tilt angle ranges from 0.2 degrees to 0.35 degrees.

[0168] Implementation 18: The system of implementation 15, wherein the plurality of stoppers is configured to prevent any adjustment screw from being linearly translated with respect to the securement block by a maximum linear distance.

[0169] Implementation 19: The system of implementation 18, wherein the maximum linear distance ranges from 0.02 inches to 0.04 inches.

[0170] Implementation 20: The system of implementation 1, wherein: the adjustment assembly has a set screw, the adjustment screw has a screw central bore, the first spherical washer has a first washer central bore, the plug has a plug central bore, the second spherical washer has a second washer central bore, the first threaded bore has a first threaded portion with a first outer diameter and a second threaded portion with a second outer diameter smaller than the first outer diameter, and the set screw:Docket No. LAM1P083WO extends through the plug central bore, the second washer central bore, the respective first through-hole, the first washer central bore, and the screw central bore, is threaded into the second threaded portion, and is configured to retain the plug, top portion, and the showerhead plate in a fixed position.

[0171] Implementation 21: The system of implementation 20, wherein the set screw is configured to provide an axial compressive force onto the second spherical washer, the top portion, the first spherical washer, and the adjustment screw.

[0172] Implementation 22: The system of implementation 1, wherein the showerhead plate is coupled to the collar with connection means that extend only partially into the collar.

[0173] Implementation 23: The system of implementation 1, wherein: the first interface extends partially into the first through-hole, the second interface extends partially into the first through-hole, and the first interface and second interface partially overlap when viewed perpendicular to a center axis of the block central bore.

[0174] Implementation 24: The system of implementation 23, wherein: the first interface has a first extension body and a second extension body that extend away from the screw head and are offset from each other, the plug body forms the second interface, and the plug body has a third extension body and fourth extension body that extend away from the plug head and are offset from each other.

[0175] Implementation 25: The system of implementation 1, wherein the collar is comprised of a dielectric material.

[0176] Implementation 26: The system of implementation 1, wherein the securement block is coupled to a top of a semiconductor processing chamber.

[0177] Implementation 27: The system of implementation 1, wherein the system has three adjustment assemblies.

[0178] Implementation 28: An adjustment assembly for semiconductor processing, the adjustment assembly comprising: an adjustment screw having a first interface, a screw head with a screw face, and a screw body with external threading and configured to mate with a corresponding set of threads; a first spherical washer in contact with the screw face of the screw head, configured to be in contact with a bottom surface of a movement body, and configured to be interposed between the screw face and the bottom surface;Docket No. LAM1P083WO a plug having a plug head, a plug body configured to extend at least partially through a first through-hole of the movement body, and a second interface; and a second spherical washer in contact with the plug head, configured to be in contact with a top surface of the movement body, and configured to be interposed between the plug head and the top surface, wherein: the first spherical washer is configured to tilt relative to the adjustment screw, a first portion of the second spherical washer is configured to tilt relative to a second portion of the second spherical washer and the plug head, and the first interface is configured to interface with the second interface.

[0179] Implementation 29: The adjustment assembly of implementation 28, wherein the first spherical washer and the first portion are configured to tilt with a tilt of the movement body.

[0180] Implementation 30: The adjustment assembly of implementation 28, wherein: the plug body extends through the second spherical washer, and the plug body has an outer diameter greater than a diameter of a through-hole of the second spherical washer.

[0181] Implementation 31: The adjustment assembly of implementation 28, wherein rotation of the plug is configured to cause the second interface to interface with the first interface and cause the adjustment screw to rotate within a respective first threaded bore.

[0182] Implementation 32: The adjustment assembly of implementation 28, wherein: the first interface has a first extension body and a second extension body that extend away from the screw head and are offset from each other, the plug body forms the second interface, the plug body has a third extension body and fourth extension body that extend away from the plug head and are offset from each other.

[0183] Implementation 33: The adjustment assembly of implementation 28, wherein: the first spherical washer has a planar surface configured to be in contact with the bottom surface of the movement body, and the first portion of the second spherical washer has a planar surface configured to be in contact with the top surface of the movement body.

Claims

Docket No. LAM1P083WOCLAIMSWhat is claimed is:

1. A system for semiconductor processing, the system comprising: a showerhead plate configured to connect to a showerhead stem of a showerhead; a collar having: an top portion coupled to the showerhead plate and having a first through-hole, and a collar central bore extending through the top portion and configured to receive the showerhead stem; a securement block having a block central bore and a first threaded bore extending partially into the securement block; and an adjustment assembly extending through the top portion of the collar and coupled to the securement block, wherein: the adjustment assembly has: an adjustment screw having a screw head with a screw face, a screw body threaded into the first threaded bore, and a first interface, a first spherical washer in contact with, and interposed between, the screw face of the screw head and a bottom surface of the top portion, a plug having a plug head, a plug body extending at least partially through one first through-hole, and a second interface, and a second spherical washer in contact with, and interposed between, the plug head and a top surface of the top portion, the first interface is configured to interface with the second interface, rotation of the plug is configured to cause the second interface to interface with the first interface and cause the adjustment screw to rotate within the first threaded bore, and rotational movement of the adjustment screw within the first threaded bore causes the collar and showerhead plate to tilt with respect to the securement block.

2. The system of claim 1, wherein: the screw face is a convex face that faces the top portion, and the first spherical washer has a concave spherical seat in contact with the convex face and a planar surface in contact with the bottom surface of the top portion.Docket No. LAM1P083WO3. The system of claim 1, wherein the second spherical washer has: a top washer with a second convex face, and a bottom washer in contact with the top surface of the top portion and having a second concave face in contact with the second convex face.

4. The system of claim 1, wherein the showerhead plate and the collar are configured to move together.

5. The system of claim 1, wherein: the collar has a collar center axis, the showerhead plate has a plate center axis colinear with the collar center axis, the block central bore has a bore center axis, and tilt of the collar and the showerhead plate with respect to the securement block causes the collar center axis and the plate center axis to be unparallel with the bore center axis.

6. The system of claim 1, further comprising an O-ring seal, wherein: the securement block has a groove extending around the central and radially inwards of the first threaded bore, and the O-ring seal is positioned in the groove and in contact with the bottom surface of the top portion and the securement block.

7. The system of claim 1, further comprising the showerhead stem, wherein: the showerhead plate is coupled to the showerhead stem, the showerhead stem extends through the central bore and the collar central bore, and the rotational movement of one adjustment screw within the first threaded bore further causes the collar, the showerhead plate, and the showerhead stem to tilt with respect to the securement block.

8. The system of claim 7, wherein: the showerhead stem is electrically coupled to the showerhead plate, and the showerhead plate and the showerhead stem are electrically isolated from the adjustment assembly and the securement block.

9. The system of claim 7, wherein:Docket No. LAM1P083WO the collar further has a cylindrical body portion with a first length and the collar central bore extends through the cylindrical body portion, the showerhead stem extends through the cylindrical body portion, the showerhead stem is radially offset from the cylindrical body portion by an offset distance, and the offset distance remains constant during and after the rotational movement of one adjustment screw within the first threaded bore.

10. The system of claim 1, wherein: the showerhead plate has an outer periphery, and the adjustment assembly is offset from the outer periphery by a non-zero clearance distance.

11. The system of claim 1, further comprising a plurality of stoppers, wherein: each stopper is positioned partially inside the securement block and offset from a top surface of the securement block, and each stopper has a stopper top configured to be contacted by the bottom surface of the top portion.

12. The system of claim 11, wherein the plurality of stoppers is configured to prevent any adjustment screw from being linearly translated with respect to the securement block by a maximum linear distance.

13. The system of claim 1, wherein: the adjustment assembly has a set screw, the adjustment screw has a screw central bore, the first spherical washer has a first washer central bore, the plug has a plug central bore, the second spherical washer has a second washer central bore, the first threaded bore has a first threaded portion with a first outer diameter and a second threaded portion with a second outer diameter smaller than the first outer diameter, and the set screw: extends through the plug central bore, the second washer central bore, the respective first through-hole, the first washer central bore, and the screw central bore,Docket No. LAM1P083WO is threaded into the second threaded portion, and is configured to retain the plug, top portion, and the showerhead plate in a fixed position.

14. The system of claim 13, wherein the set screw is configured to provide an axial compressive force onto the second spherical washer, the top portion, the first spherical washer, and the adjustment screw.

15. The system of claim 1, wherein the showerhead plate is coupled to the collar with connection means that extend only partially into the collar.

16. The system of claim 1, wherein: the first interface extends partially into the first through-hole, the second interface extends partially into the first through-hole, and the first interface and second interface partially overlap when viewed perpendicular to a center axis of the block central bore.

17. The system of claim 16, wherein: the first interface has a first extension body and a second extension body that extend away from the screw head and are offset from each other, the plug body forms the second interface, and the plug body has a third extension body and fourth extension body that extend away from the plug head and are offset from each other.

18. The system of claim 1, wherein the collar is comprised of a dielectric material.

19. The system of claim 1, wherein the securement block is coupled to a top of a semiconductor processing chamber.

20. An adjustment assembly for semiconductor processing, the adjustment assembly comprising: an adjustment screw having a first interface, a screw head with a screw face, and a screw body with external threading and configured to mate with a corresponding set of threads;Docket No. LAM1P083WO a first spherical washer in contact with the screw face of the screw head, configured to be in contact with a bottom surface of a movement body, and configured to be interposed between the screw face and the bottom surface; a plug having a plug head, a plug body configured to extend at least partially through a first through-hole of the movement body, and a second interface; and a second spherical washer in contact with the plug head, configured to be in contact with a top surface of the movement body, and configured to be interposed between the plug head and the top surface, wherein: the first spherical washer is configured to tilt relative to the adjustment screw, a first portion of the second spherical washer is configured to tilt relative to a second portion of the second spherical washer and the plug head, and the first interface is configured to interface with the second interface.