Electrically conductive grid and electronic device

Abstract

The present invention relates to the technical field of electronic devices. Disclosed are an electrically conductive grid and an electronic device. The electrically conductive grid comprises a plurality of preset lines, wherein the plurality of preset lines are connected to each other and are configured to form a grid, and the ratio of the line thickness of each preset line to the line width thereof is greater than or equal to 1. The electrically conductive grid further comprises a pin region and a main body region, wherein the main body region is provided with the plurality of preset lines. The technical solution provided by the present invention aims to improve the strength of lines in a main body region where a grid is arranged, thereby ensuring the structural strength of the electrically conductive grid.

Description

Conductive grids and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202411907811.X, filed on December 23, 2024, entitled “Conductive Mesh and Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of electronic device technology, and in particular to a conductive grid and an electronic device. Background Technology

[0003] Conductive meshes typically consist of pins and mesh lines. To achieve a transparent visual effect in the mesh areas corresponding to the mesh lines, the mesh lines are made relatively thin, resulting in poor mesh line strength and a tendency to break during the fabrication process. Summary of the Invention

[0004] The main objective of this invention is to provide a conductive grid and electronic device, which aims to improve the strength of the lines in the main area where the grid is set, so as to ensure the structural strength of the conductive grid.

[0005] To achieve the above objectives, the conductive mesh proposed in this invention includes multiple preset lines, which are connected to form a mesh. The ratio of the thickness to the width of each preset line is greater than or equal to 1. The conductive mesh includes a pin area and a main body area, and the main body area has multiple preset lines.

[0006] In one embodiment, the thickness of the preset line is 6 micrometers to 12 micrometers.

[0007] In one embodiment, the ratio of the thickness to the width of the preset line body is greater than or equal to 1.5.

[0008] In one embodiment, the conductive mesh is disposed on a substrate, and the preset line has a first surface and a second surface that are relatively distributed in the line thickness direction. The first surface is located on the side closer to the substrate, and the line width of the second surface exceeds the line width of the first surface by less than 10%.

[0009] In one embodiment, the line width of the preset line gradually increases in the direction from the first surface to the second surface.

[0010] In one embodiment, the cross-section of the preset line body is configured as a quasi-isosceles trapezoid or a quasi-rectangular shape.

[0011] In one embodiment, the conductive mesh is formed by an etching process.

[0012] In one embodiment, the conductive mesh is formed from rolled metal material.

[0013] In one embodiment, the conductive mesh further includes a buffer zone located between the pin area and the main body area, a boundary line is provided between the buffer zone and the main body area, the main body area is provided with a first line connecting the boundary line, the buffer zone is provided with at least one row of second lines distributed along the extension direction of the boundary line, and the multiple positions where the boundary line is connected to the first line are staggered from the positions where the boundary line is connected to the second line.

[0014] In one embodiment, the second line body is provided in multiple rows, and a third line body is provided between two adjacent rows of the second line body. The third line body and the dividing line body are parallel, and the position of the third line body connecting to one of the adjacent rows of the second line body is staggered from the position of the third line body connecting to the second line body connecting to another adjacent row.

[0015] In one embodiment, the lines that construct the grid of the main area and the lines that construct the grid of the buffer zone are both configured as the preset lines.

[0016] In one embodiment, the lines that construct the grid of the main area are all configured as the preset lines, and the buffer zone is provided with a row of second lines, the line width of the second lines being at least twice the line width of the first lines.

[0017] In one embodiment, the distance between the pin area and the dividing line body is greater than or equal to 8 mm.

[0018] In one embodiment, the grid of the buffer is rhomboid, rectangular, or parallelogram-shaped.

[0019] In one embodiment, the grid of the main area is diamond-shaped or rectangular.

[0020] In one embodiment, the line width of the preset line is within 10 micrometers.

[0021] The present invention also proposes an electronic device comprising the aforementioned conductive mesh.

[0022] In one embodiment, the electronic device is configured as a head-mounted display device, the lenses of which are provided with at least one of an antenna structure, an electrochromic film, and an electrothermal film, wherein at least one of the antenna structure, the electrochromic film, and the electrothermal film includes the conductive mesh.

[0023] In one embodiment, the electronic device includes a touch screen, the touch screen including the conductive mesh.

[0024] In one embodiment, the electronic device has an electromagnetic shielding structure, the electromagnetic shielding structure including the conductive mesh.

[0025] In this invention, the pre-formed wire increases its thickness, thereby enhancing the structural strength of the wire in the main body area. This improves the structural stability of the conductive mesh, making it less prone to wire breakage in the main body area and improving the manufacturability of the conductive mesh. Simultaneously, the thicker pre-formed wire provides better conductivity, the ability to carry large currents, and excellent heat dissipation, ensuring the performance of the conductive mesh. Furthermore, the pre-formed wire can maintain a relatively fine linewidth to ensure a transparent visual effect, thus guaranteeing its applicability in fields such as touch screens and transparent antennas. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0027] Figure 1 is a schematic diagram of the application structure of an embodiment of the conductive mesh provided by the present invention;

[0028] Figure 2 is a schematic diagram of a structural embodiment of the conductive mesh provided by the present invention;

[0029] Figure 3 is a schematic diagram of another embodiment of the conductive mesh provided by the present invention;

[0030] Figure 4 is a schematic diagram of another embodiment of the conductive mesh provided by the present invention;

[0031] Figure 5 is a structural schematic diagram of another embodiment of the conductive mesh provided by the present invention;

[0032] Figure 6 is a schematic diagram of the cross-sectional structure of a preset line of the conductive mesh provided by the present invention in each processing step.

[0033] Figure 7 is a schematic diagram of the structure of a conductive mesh installed on the lens of a head-mounted display device.

[0034] Explanation of reference numerals: 100, conductive grid; 110, main body area; 120, buffer zone; 130, pin area; 101, first line body; 102, second line body; 103, third line body; 104, boundary line body; 210, substrate; 220, cover layer; 230, adhesive layer.

[0035] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0038] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0039] In order to achieve a transparent visual effect for the grid area corresponding to the grid line, the line width of the grid line is set to be relatively small. However, the line thickness of the grid line is generally smaller than the line width. As a result, the grid line strength of the conductive grid is poor, and it is prone to breakage during the manufacturing process.

[0040] This invention proposes a conductive mesh in which the thickness of a preset line body is greater than the line width. This preset line body serves as the line body for constructing the mesh, thereby increasing the thickness of the mesh lines and improving the structural strength of the mesh lines, which is beneficial to improving the manufacturability of the conductive mesh.

[0041] Referring to Figures 2 to 6, in one embodiment of the present invention, the conductive mesh 100 includes multiple preset lines connected to form a mesh. The ratio of the thickness to the width of each preset line is greater than or equal to 1. The conductive mesh 100 includes a pin area 130 and a main body area 110, with the main body area 110 having multiple preset lines. The pin area 130 has pins for connecting to a circuit, and the main body area 110 has lines forming the mesh. The lines forming the mesh in the main body area 110 can be entirely or partially composed of these preset lines.

[0042] It can be understood that the line thickness direction is the direction of penetration within the grid space, while the line width direction is the distribution direction of the grid formed on both sides of the line. The ratio of line thickness (refer to h in Figure 6) to line width (refer to w1 and w2 in Figure 6) is the ratio of line thickness to line width.

[0043] In this invention, the pre-formed wire increases its thickness, thereby enhancing the structural strength of the wire in the main body region 110. This improves the structural stability of the conductive mesh 100, making it less prone to wire breakage and improving the manufacturability of the conductive mesh 100. Simultaneously, the thicker pre-formed wire provides better conductivity, the ability to carry large currents, and excellent heat dissipation, ensuring the performance of the conductive mesh 100. Furthermore, the pre-formed wire can maintain a relatively fine line width to ensure a transparent visual effect, thus guaranteeing its applicability in fields such as touch screens and transparent antennas.

[0044] Preferably, the ratio of the thickness to the width of the preset line body is greater than or equal to 1.4, which allows for a smaller line width and is more conducive to creating a transparent visual effect. Furthermore, a ratio of less than 3 makes the line body less prone to tipping over, thus helping to ensure the structural stability of the conductive mesh 100.

[0045] In one embodiment, the line width of the preset line is within 10 micrometers. This allows the preset line to be relatively thin, making it suitable for more precise applications and easier to create a transparent visual effect.

[0046] In one embodiment, the thickness of the preset line body is 6 to 12 micrometers. That is, the thickness of the preset line body is greater than or equal to 6 micrometers and less than or equal to 12 micrometers. In this way, the thickness and width of the preset line body are both within a suitable range to ensure the performance of the conductive grid 100. Preferably, the thickness of the preset line body is 8 to 10 micrometers.

[0047] In one embodiment, referring to Figures 1 and 6 together, the conductive mesh 100 is disposed on a substrate 210. The preset line has a first surface and a second surface that are relatively distributed in the line thickness direction. The first surface is located on the side closer to the substrate 210. The linewidth of the second surface w2 exceeds the linewidth w1 of the first surface by less than 10%. That is, the linewidth w2 at the second surface exceeds the linewidth w1 at the first surface, and the ratio of the linewidth exceeding the first surface by the second surface to the linewidth of the first surface is less than 10%, i.e., the value of (w2-w1) / w1 is less than or equal to 10%. In this way, the preset line can exhibit a relatively uniform linewidth in the line thickness direction, which is beneficial to ensuring the conductivity and structural stability of the preset line.

[0048] It is understood that the first surface is connected to the substrate 210 via adhesive layer 230, and the second surface is connected to the cover layer 220 or other structures via adhesive layer 230. Due to the larger linewidth at the second surface, the contact area between the second surface and the cover layer 220 or other upper components can be increased, thereby improving the uniformity of lateral current distribution and reducing surface resistance. When viewed from one side, the second surface can shield other parts of the conductive mesh 100, making the mesh appear finer and less conspicuous, thus improving the product's visual appearance. Furthermore, when the cover layer 220 or other materials are bonded to the conductive mesh 100, the wider second surface helps guide and disperse the adhesive, ensuring its uniform distribution and avoiding the formation of bubbles or voids, thereby improving the overall packaging quality. Of course, in other embodiments, the first surface may also have a wider linewidth.

[0049] In one embodiment, referring to Figure 6, the linewidth of the preset line gradually increases in the direction from the first surface to the second surface. This allows the linewidth of the preset line to vary uniformly, which helps ensure the structural stability and conductivity of the preset line. Of course, in other embodiments, the linewidth of the preset line may also have a uniform portion in the line thickness direction.

[0050] In one embodiment, referring to Figure 6, the cross-section of the preset line body is configured as a quasi-isosceles trapezoid or a quasi-rectangular shape. It can be understood that this cross-section is formed by cutting along the line width direction. The quasi-isosceles trapezoid or quasi-rectangular shape indicates that the preset line body has strong symmetry in the line width direction, which is beneficial for ensuring the structural stability and conductivity of the preset line body. Specifically, configuring the cross-section of the preset line body as a quasi-isosceles trapezoid or a quasi-rectangular shape means that the shapes of the two surfaces of the preset line body distributed in the line width direction closely match the two sides of an isosceles trapezoid or the two long sides of a rectangle, with low deviation. Without loss of generality, the maximum deviation should preferably not exceed 5% of the average line width. Of course, in other embodiments, the cross-section of the preset line body can also be configured as a shape close to a non-rectangular parallelogram.

[0051] It is understood that the conductive mesh 100 is generally formed by placing a conductor on a substrate 210 and then etching it. When processing materials with significant thickness, the etching process can easily lead to uneven width in the thickness direction. In the present invention, with a dry film covering the second surface, an over-etching process is first used to make the line form an inverted trapezoidal shape on the substrate 210, meaning the width of the second surface is much wider than the width of the first surface. Then, the dry film is removed, and rapid etching is performed. At this point, there is no dry film on the second surface, while the first surface adheres to the substrate 210. The substrate 210 provides some protection for the line on this side, making the etching rate at the second surface greater than that at the first surface, thereby forming a line with uniform thickness. Specifically, since the line is formed by etching, pits will be formed on the two surfaces distributed in the line width direction, which distinguishes it from other processes. Of course, in other embodiments, the mesh area of ​​the conductive mesh 100 can also be formed by laser direct writing, imprint lithography, or other processes.

[0052] In one embodiment, the conductive mesh 100 is formed by etching a rolled metal material. Before coating with a dry film, the rolled metal material can be surface-treated using a micro-etching process to ensure its thickness meets the line thickness range of the conductive mesh 100. Without loss of generality, the rolled metal material can be copper, silver, etc. Alternatively, in other embodiments, the conductive mesh 100 can be formed by etching a deposited indium tin oxide film.

[0053] In one embodiment, referring to Figures 2 to 5, the conductive mesh 100 further includes a buffer zone 120 located between the pin area 130 and the main body area 110. A boundary line 104 is provided between the buffer zone 120 and the main body area 110. The main body area 110 is provided with a first line 101 connecting the boundary line 104. The buffer zone 120 is provided with at least one row of second lines 102 distributed along the extension direction of the boundary line 104. The multiple locations where the boundary line 104 is connected to the first line 101 are staggered from the locations where the boundary line 104 is connected to the second lines 102.

[0054] The first line body 101 can be arranged in a row along the extension direction of the dividing line body 104 to form a rectangular grid. Alternatively, the first line bodies 101 can be intersecting to form a rhomboid grid. When constructing a rectangular grid, a row of first line bodies 101 can include at least two first line bodies 101 to construct at least one grid in the area of ​​the row. The remaining areas of the main body area 110 can also be constructed in this way to form multiple rows of grids. Alternatively, the two ends of the first line body 101 can be connected to the two dividing line bodies 104 to form a row of grids in the main body area 110. By setting multiple first line bodies 101, multiple grids can be formed in the area of ​​the row.

[0055] The second line body 102 can be arranged in a row, with the dividing line body 104 connected to one end of the second line body 102, and the pins of the pin area 130 connected to the other end of the second line body 102. When there is a vacancy in the pin area 130, the buffer 120 also has an edge line body parallel to the dividing line body 104 on the side near the pin area 130, for the second line body 102 to be connected to the end near the pin area 130.

[0056] The second line body 102 can also be configured in two or more rows. A third line body 103 parallel to the dividing line body 104 is provided between two adjacent rows of second line bodies 102 for connecting the two connected rows of second line bodies 102. The second line body 102 near the main body area 110 is connected to the dividing line body 104, and the second line body 102 near the pin area 130 is connected to the pin or edge line body of the aforementioned pin area 130.

[0057] In this invention, the buffer zone 120 effectively releases the stress between the main body region 110 and the pin region 130. The connection positions of the second wire 102 of the buffer zone 120 on the dividing line 104 are staggered with the multiple connection positions of the first wire 101 of the main body region 110 on the dividing line 104. This disperses the stress between the pin region 130 and the main body region 110, allowing for a more uniform load distribution and reducing the risk of localized overload. It also lowers the probability of wire detachment or breakage at the connection points between the pin region 130 and the main body region 110, thereby improving the manufacturability of the conductive mesh 100. Furthermore, the extremely fine linewidth of the wires in the main body region 110 ensures the structural stability of the conductive mesh 100. Simultaneously, the conductive mesh 100 exhibits good electrical performance and high light transmittance, making it suitable for applications such as transparent antennas and touch screens. Moreover, since the buffer zone 120 also forms a mesh, its impact on the light transmittance and conductivity of the conductive mesh 100 is minimal, further ensuring the performance of the conductive mesh 100.

[0058] Among them, the lines forming the grid include the lines of the buffer zone 120, the boundary lines 104, and the lines of the main area 110, which can be set as preset lines as needed, or set with reference to some features in the aspect ratio, thickness value and cross-sectional shape of the preset lines.

[0059] Furthermore, the connection positions of the second line 102 of the buffer zone 120 on the dividing line 104 and the connection positions of the first line 101 of the main body region 110 on the dividing line 104 are staggered, which can further improve the degree of stress dispersion and help avoid the line floating or breaking at the connection between the pin region 130 and the main body region 110.

[0060] In one embodiment, referring to Figures 2, 3, and 5, multiple second lines 102 are arranged alternately in the same row. This allows a quadrilateral grid to be formed by the row of second lines 102, with the connection points on the boundary lines between adjacent second lines 102 not overlapping, which is more conducive to improving the stress dispersion effect. Of course, in other embodiments, provided that the stress dispersion requirements are met, multiple second lines 102 in the same row can also be connected sequentially to form a triangular grid.

[0061] Furthermore, in this embodiment, multiple second lines 102 in the same row are parallel. This allows for the construction of a parallelogram-shaped mesh, which improves the stress distribution uniformity of the buffer zone 120, thereby ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, multiple second lines 102 in the same row can also be constructed to form a trapezoidal mesh, wherein an isosceles trapezoidal mesh is beneficial for ensuring the stress distribution uniformity of the buffer zone 120.

[0062] Furthermore, in this embodiment, multiple second wires 102 in the same row are evenly spaced. This results in a relatively uniform mesh size formed by a row of second wires 102, which helps to further improve the stress distribution uniformity of the buffer zone 120, thereby ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, the distribution density of the second wires 102 can be increased in areas with higher stress concentration and decreased in areas with lower stress.

[0063] Optionally, referring to Figures 2 and 3, the second line 102 is parallel to the distribution direction of the pin area 130 and the main body area 110. Parallel means parallel or approximately parallel, so that the second line 102 can be set perpendicular or approximately perpendicular to the dividing line 104, thereby constructing a rectangular grid, which facilitates the processing and shaping of the conductive grid 100. Optionally, referring to Figure 5, the second line 102 is inclined relative to the distribution direction of the pin area 130 and the main body area 110. The parallelogram grid formed in this way has strong deformation capability and can absorb a certain amount of energy through deformation after being subjected to external force, thereby reducing the possibility of breakage.

[0064] In one embodiment, referring to FIG4, the multiple second lines 102 in the same row include multiple groups of lines formed by the intersection of two first lines 101. In this way, the groups of lines can connect with the structures on both sides to form a triangular structure. The triangular structure improves the structural stability of the buffer zone 120, thereby ensuring the connection stability between the main body area 110 and the pin area 130.

[0065] Furthermore, in this embodiment, adjacent sides of two adjacent line groups are connected to the dividing line 104 at the same position. This creates a direct connection between adjacent line groups, providing more paths for stress conduction and dispersion, thereby further improving the structural stability of the buffer zone 120 and ensuring the connection stability between the main body area 110 and the pin area 130. Of course, in other embodiments, adjacent sides of two adjacent line groups may be connected to the dividing line 104 at different positions.

[0066] In one embodiment, referring to Figures 2 to 5, the dividing line 104 has at least one second line 102 connected between every two adjacent first line 101s. This ensures that the number of second line 102 along the extension of the dividing line is sufficient and their distribution density is relatively uniform, which helps to ensure the structural strength of the buffer zone 120, thereby ensuring the structural stability of the conductive mesh 100.

[0067] Referring to Figures 2, 3, and 5, for the second line body 102 connected to the dividing line body 104, each second line body 102 is positioned in the middle of the region between two adjacent first line bodies 101. It is understood that "middle" does not refer to the exact midpoint, but rather the region near the midpoint. In this embodiment, the second line body 102 is positioned in the middle of the dividing line between two adjacent first line bodies 101, ensuring sufficient offset between the connection positions of the first line bodies 101 and the second line body 102, thereby ensuring the force dispersion effect of the lines in the buffer zone 120. This method is particularly suitable when the line widths of the second line body 102 and the first line body 101 are comparable, because in this case, sufficient offset ensures uniform stress distribution, which is beneficial for maintaining the structural stability of the conductive mesh 100.

[0068] Of course, the second wire 102 connected to the dividing line 104 can also be positioned close to the first wire 101, as shown in Figure 3. This shortens the force transmission path from the first wire 101 to the second wire 102. When the second wire 102 has sufficient structural strength, it can effectively help the first wire 101 absorb external forces, thereby ensuring the connection stability between the main body area 110 and the pin area 130.

[0069] Without loss of generality, the dividing line 104 connects a second line 102 between every two adjacent first lines 101. That is, the spacing between two second lines 102 is roughly the same as the spacing between two first lines 101, which helps to improve the uniformity of the grid distribution, thereby improving the uniformity of stress distribution and ensuring the structural stability of the conductive grid 100. Of course, in other embodiments, the dividing line 104 may connect more than one second line 102 between every two adjacent first lines 101, such that the distribution density of the second lines 102 is greater than the distribution density of the first lines 101.

[0070] In one embodiment, referring to Figure 2, the buffer zone 120 is formed with multiple rows of second wires 102. The position of the third wire 103 connected to one of the adjacent rows of second wires 102 is staggered from the position connected to the second wires 102 connected to the other adjacent row. Thus, by sequentially and alternately arranging multiple rows of wires, the buffer zone 120 achieves further stress dispersion. The load can be evenly distributed in both the extension directions of the second wires 102 and the third wires 103, further reducing the risk of excessive local stress and helping to prevent the wires in the buffer zone 120 from floating away or breaking, thereby ensuring the structural stability of the conductive wires.

[0071] Furthermore, in this embodiment, the second wire 102 is arranged in at least four rows, which can effectively disperse the stress between the pin area 130 and the main body area 110, reduce the stress on the wires of the buffer zone 120, and thus prevent the wires of the buffer zone 120 from floating or breaking. Of course, in other embodiments, if the requirements for the use of the conductive mesh 100 can be met, the second wire 102 can also be arranged in two or three rows.

[0072] Furthermore, for both sides of the third wire 103, each of the second wires 102 on one side is centrally located in the region between two adjacent second wires 102 on the other side. Similarly, this ensures that the second wires 102 on both sides of the third wire 103 have sufficient offset, thereby guaranteeing the force dispersion effect of the buffer zone 120. Without loss of generality, between each pair of adjacent second wires 102 on one side, the third wire 103 is connected to a second wire 102. Thus, the spacing between the second wires 102 on opposite sides of the third wire 103 is relatively uniform, which helps improve the uniformity of the mesh distribution, thereby improving the uniformity of stress distribution and ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, the second wires 102 on both sides of the third wire 103 can also be configured with different distribution densities.

[0073] In one embodiment, referring to Figure 3, the line width of the second line body 102 is greater than the line width of the first line body 101. Thus, by increasing the line width of the second line body 102, its resistance to external forces can be improved, making it less prone to deformation and thus helping to prevent breakage, thereby ensuring the structural stability of the conductive mesh 100.

[0074] Furthermore, in this embodiment, the linewidth of the second line body 102 is at least twice the linewidth of the first line body 101. This ensures that the second line body 102 possesses sufficient strength to guarantee its resistance to deformation, thereby ensuring the structural stability of the conductive mesh 100. Additionally, it should be noted that the linewidth of the second line body 102 should be less than or equal to the line spacing between two adjacent second line bodies 102. Of course, in other embodiments, the linewidth of the second line body 102 can also be 1.5 times or 1.8 times the linewidth of the first line body 101.

[0075] In one embodiment, the distance between the pin area 130 and the boundary line 104 is greater than or equal to 8 mm. This ensures that the buffer zone 120 covers the high-risk area between the pin area 130 and the main body area 110, which is the area where the wire is prone to breakage. The mesh of the buffer zone 120 can thus disperse stress in this high-risk area, preventing structural damage at the connection between the pin area 130 and the main body area 110, thereby ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, this distance can be adjusted to less than 8 mm, provided that the structural stability of the conductive mesh 100 is ensured.

[0076] In one embodiment, referring to Figure 2, both the main body region 110 and the buffer zone 120 are constructed to form multiple rows of rectangular grids. In this case, the line width of the second line body 102 can be set to be comparable to (equal to or approximately equal to) the line width of the first line body 101, and the line spacing between two adjacent second line bodies 102 can also be comparable to the line spacing between two adjacent first line bodies 101. This helps to ensure that a transparent visual effect can also be formed in the buffer zone 120, thereby ensuring the applicability of the conductive grid 100 in fields such as transparent antennas and touch screens. Specifically, a row of first line bodies 101 forms multiple grids, and a row of second line bodies 102 also forms multiple grids. The number of grids formed by a row of second line bodies 102 and a row of first line bodies 101 is comparable. This allows the second line bodies 102 to disperse stress, ensuring the structural stability of the conductive grid 100, while also ensuring that the grid size formed by the second line bodies 102 is appropriate, so that a transparent visual effect can also be formed in the buffer zone 120. Furthermore, the spacing between each second line body 102 and its two adjacent first lines body 101 is also approximately equal, thereby ensuring a uniform distribution of stress. Even further, the lines in the main body region 110 and the buffer zone 120, as well as the boundary lines 104, are all configured as preset lines, ensuring consistency in the lines of the grid region of the conductive mesh 100, facilitating the processing and shaping of the conductive mesh 100.

[0077] In one embodiment, referring to Figure 3, the main body region 110 forms multiple rows of rectangular grids, while the buffer zone 120 forms only one row of rectangular grids. The line width of the second line body 102 in the buffer zone 120 is greater than the line width of the line body in the main body region 110, and each second line body 102 is offset from a first line body 101 by a small displacement. This ensures that the second line bodies 102 are evenly distributed on the same side of the corresponding first line body 101 and are positioned close to the corresponding first line body 101. In this way, the force on the first line body 101 can be transmitted to the structurally stronger second line body 102 more quickly. By absorbing the energy of external forces through the second line body 102, it is beneficial to prevent line breakage at the connection between the main body region 110 and the pin region 130. If the length of the second line body 102 is greater than 8 mm, it can effectively cover the area between the main body region 110 and the pin region 130 that is prone to line breakage. Furthermore, the lines and dividing lines 104 of the main area 110 are configured as preset lines, and the second line 102 of the buffer zone 120, apart from the ratio of line width to line thickness, can also have other features such as line thickness and cross-sectional shape set with reference to the preset lines.

[0078] In one embodiment, referring to Figures 4 and 5, the main body region 110 forms a rhomboid grid. The lines of the buffer zone 120 can be constructed to form a rhomboid grid as arranged in the main body region 110. Alternatively, the buffer zone 120 can be provided with multiple evenly spaced and parallel second lines 102. The second lines 102 and the lines in one direction of the main body region 110 are inclined in the same direction to form a parallelogram grid. Without loss of generality, the lines and boundary lines 104 of the main body region 110 are configured as preset lines. The lines of the buffer zone 120 can also be configured as lines, or, except for the ratio of line width to line thickness, other features such as line thickness and cross-sectional shape can be set with reference to the preset lines.

[0079] The present invention also proposes an electronic device, which includes a conductive mesh 100. The specific structure of the conductive mesh 100 is as described in the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0080] The electronic device is configured as a head-mounted display device. An antenna structure is disposed on the lens of the head-mounted display device. The lens of the head-mounted display device is disposed on at least one of the antenna structure, an electrochromic film, and an electrothermal film. At least one of the antenna structure, electrochromic film, and electrothermal film includes the conductive mesh. The antenna structure, electrochromic film, and electrothermal film may completely cover the lens of the head-mounted display device or may partially cover it.

[0081] Referring to Figure 7, without loss of generality, for the antenna structure, the main body region 110, the buffer zone 120, and the pin region 130 are arranged in a ring shape and distributed sequentially from the inside out. The pin region 130 is located near the edge of the lens to facilitate concealment within the lens frame. This effectively utilizes the peripheral area of ​​the lens while ensuring that the signal transmission path between the pins of the pin region 130 and the lines in the grid area is as short as possible. Furthermore, the overall ring-shaped structure of the antenna can shield external electromagnetic interference to a certain extent, protect the internal circuitry from external noise, help reduce the impact of electromagnetic radiation generated by the antenna itself on the external environment, and improve the antenna's directivity and gain characteristics, thereby enhancing its ability to resist multipath effects.

[0082] Of course, in other embodiments, the conductive mesh 100 can also be configured on the touch screen or electromagnetic shielding structure of an electronic device, or on the display screen of a HUD display device, i.e., on the windshield of a vehicle.

[0083] It is understandable that the conductive meshes in the above structures can take the same form to improve the standardization of materials, or they can take different forms to better adapt to different functions.

[0084] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A conductive mesh, characterized in that, The conductive mesh includes multiple preset lines, which are connected to form a mesh. The ratio of the thickness to the width of the preset lines is greater than or equal to 1. The conductive mesh includes a pin area and a main body area, and the main body area has multiple preset lines.

2. The conductive mesh as described in claim 1, characterized in that, The thickness of the preset line body is 6 micrometers to 12 micrometers; And / or, the ratio of the thickness to the width of the preset line body is greater than or equal to 1.

4.

3. The conductive mesh as described in claim 1, characterized in that, The conductive mesh is disposed on the substrate, and the preset line has a first surface and a second surface that are relatively distributed in the line thickness direction. The first surface is located on the side close to the substrate, and the line width of the second surface exceeds the line width of the first surface by less than 10%.

4. The conductive mesh as described in claim 3, characterized in that, The line width of the preset line gradually increases in the direction from the first surface to the second surface.

5. The conductive mesh as described in claim 1, characterized in that, The cross-section of the preset line body is configured as a trapezoidal or rectangular shape.

6. The conductive mesh as described in claim 1, characterized in that, The conductive mesh is formed by an etching process; And / or, the conductive mesh is formed from rolled metal material.

7. The conductive mesh as claimed in claim 1, characterized in that, The conductive mesh further includes a buffer zone located between the pin area and the main body area. A dividing line is provided between the buffer zone and the main body area. The main body area is provided with a first line connecting the dividing line. The buffer zone is provided with at least one row of second lines distributed along the extension direction of the dividing line. The positions where the dividing line connects to the first line are staggered from the positions where the dividing line connects to the second line.

8. The conductive mesh as described in claim 7, characterized in that, The second line body has multiple rows, and a third line body is provided between two adjacent rows of the second line bodies. The third line body and the dividing line body are parallel. The position of the third line body connecting to one of the adjacent rows of the second line bodies is staggered from the position connecting to the second line body connecting to another adjacent row. And / or, the lines that construct the grid of the main area and the lines that construct the grid of the buffer are both configured as the preset lines.

9. The conductive mesh as described in claim 7, characterized in that, The lines that construct the grid of the main area are all configured as the preset lines, and the buffer zone is provided with a row of second lines, the line width of the second lines being at least twice the line width of the first lines; And / or, the distance between the pin area and the boundary line body is greater than or equal to 8 mm.

10. The conductive mesh as claimed in claim 7, characterized in that, The grid of the buffer zone is rhomboid, rectangular, or parallelogram-shaped; And / or, the grid of the main area is diamond-shaped or rectangular.

11. The conductive mesh as claimed in claim 1, characterized in that, The line width of the preset line body is within 10 micrometers.

12. An electronic device comprising the conductive mesh according to any one of claims 1 to 10.

13. The electronic device as claimed in claim 12, characterized in that, The electronic device is configured as a head-mounted display device, and the lenses of the head-mounted display device are provided with at least one of an antenna structure, an electrochromic film, and an electroheating film, wherein at least one of the antenna structure, the electrochromic film, and the electroheating film includes the conductive mesh. And / or, the electronic device includes a touch screen, the touch screen including the conductive mesh; And / or, the electronic device has an electromagnetic shielding structure, the electromagnetic shielding structure including the conductive mesh.

Images