LED device and LED packaging method

Abstract

The present application is applicable to the technical field of LED packaging. Provided are an LED device and an LED packaging method. The LED device comprises a substrate, an LED chip, a dam, an optical window and a sealing member, wherein the dam has a first end, a second end and side walls, the side walls define a chamber, and the dam is mounted on the substrate by means of the first end; the LED chip is disposed in the chamber and packaged on the substrate; the optical window is connected to the second end to cover the chamber; the sealing member is disposed between the optical window and the second end; the dam further has a mounting space, and the mounting space is configured as a region enclosed when inner and outer end portions of the second end of the dam respectively horizontally extend toward two sides until the included angle between the lines connecting the inner and outer end portions of the second end to inner and outer end portions of the first end satisfies aW70; and the optical window is connected and fixed to the dam by means of a snap-fit structure, and when the optical window is connected and fixed to the dam, the snap-fit structure is located in the mounting space. The present application overcomes the defects of semi-inorganic and all-inorganic packaging processes on the market, can ensure the airtightness of products, and greatly improves the packaging efficiency and service life of LED devices.

Description

An LED device and an LED packaging method Technical Field

[0001] This application belongs to the field of LED packaging technology, and in particular relates to an LED device and an LED packaging method. Background Technology

[0002] Light-emitting diodes (LEDs) are semiconductor light sources characterized by high luminous efficiency and long lifespan. To expand the application range of LEDs, ultraviolet light-emitting diode (UV-LED) lamps have emerged. Today, UV-LED lamps are already being used in fields such as biomedicine, anti-counterfeiting, and purification. The technology of UV-LED lamps is still under continuous development.

[0003] UV-LED packaging typically consists of a chip, a ceramic substrate, and a glass lens. The tightness of the bond between the glass lens and the ceramic substrate is crucial for ensuring the product's airtightness. Airtightness is a major factor affecting product lifespan; poor airtightness allows moisture from the environment to enter the product during use, reducing LED lifespan and potentially causing LED failure. Currently, the mainstream technologies for bonding glass lenses and ceramic substrates are: 1) using organic adhesives to bond the glass lens to the ceramic substrate, commonly known as a semi-inorganic packaging process; and 2) embedding metal around the glass lens or metallizing the bottom of the glass lens and then soldering the metal to the ceramic substrate, commonly known as a fully inorganic packaging process.

[0004] Currently available semi-inorganic and fully inorganic packaging technologies all have the following drawbacks:

[0005] 1. The defects of semi-inorganic packaging on the market are:

[0006] ① During product use, ultraviolet light will irradiate the adhesive. Organic adhesive will age and fail under UV irradiation for a long time, which will cause the glass lens to fall off.

[0007] ② The bonding of glass requires first applying glue, and after covering with glass, the glue needs to be baked and cured at high temperature. Not only is the process complicated, but the high temperature will also cause secondary damage to the chip (the primary damage is that the chip needs to go through high temperature during die bonding in order to weld the chip to the substrate).

[0008] 2. The drawbacks of fully inorganic packaging on the market are:

[0009] ① There are generally two types of all-inorganic packaging. One type is to metallize the bottom of the glass lens and then use reflow soldering to solder the glass lens onto the ceramic substrate. The disadvantage of this type of all-inorganic packaging is that the entire product is heated during reflow soldering, and the high temperature will also cause secondary damage to the chip.

[0010] ② Another method uses a TO-type metal casing with a light window, which is laser-welded onto the ceramic substrate. This is currently the mainstream all-inorganic packaging method on the market. Although this all-inorganic packaging method involves localized heating, preventing secondary damage to the chip, its disadvantages include: slower laser welding efficiency, more complex procedures, and higher costs.

[0011] Application content

[0012] This application aims to solve at least one of the above-mentioned technical problems by providing an LED device and an LED packaging method, which overcomes the defects of semi-inorganic and fully inorganic packaging processes on the market, and can ensure the airtightness of the product, greatly improving the packaging efficiency and lifespan of the LED device.

[0013] The technical solution of this application is: an LED device, including a substrate, an LED chip, a dam, a light window, and a sealing element. The dam has a first end and a second end opposite to each other, and sidewalls extending from the first end and the second end. The sidewalls define a cavity. The dam is mounted on the substrate through the first end. The LED chip is disposed in the cavity and encapsulated on the substrate. The light window is connected to the second end to cover the cavity. The sealing element is disposed between the light window and the second end. The dam also has an installation space, which is defined as: an area extending horizontally from the inner edge and the outer edge of the second end of the dam to both sides, and enclosed within an angle α formed by the line connecting the inner edge and the outer edge of the first end of the dam, which does not exceed 70°. The light window is connected and fixed to the dam by a snap-fit ​​structure, wherein when the light window is connected and fixed to the dam, the snap-fit ​​structure is located within the installation space.

[0014] This application also provides an LED packaging method for packaging the above-mentioned LED device, comprising the following steps:

[0015] Preparing a substrate;

[0016] A dam is prepared having opposing first and second ends and sidewalls extending from the first and second ends, the sidewalls defining a cavity. The dam is mounted on the substrate via the first end, such that the LED chip is disposed within the cavity.

[0017] An LED chip is installed in the cavity;

[0018] A sealing element is provided on the second end, and the light window is placed on the sealing element. A force is applied to the light window from the second end toward the first end, so that the light window is connected and fixed to the dam through a snap-fit ​​structure. When the light window is connected and fixed to the dam, the snap-fit ​​structure is located within the installation space.

[0019] This application provides an LED device and LED packaging method that utilizes a snap-fit ​​structure to mechanically connect and fix the light window to the enclosure. A sealing element located between the second end of the light window and the enclosure ensures the airtightness of the LED device packaging. Furthermore, after the light window is fixed to the enclosure, the snap-fit ​​structure resides within the installation space, reducing its impact on the LED chip's light-emitting path and ensuring the LED device's luminous effect. Compared to existing semi-inorganic and fully inorganic packaging methods, this application eliminates the process of bonding or welding the light window to the enclosure, avoiding secondary damage to the LED chip from high temperatures and simplifying the packaging process, making it more concise and efficient. Simultaneously, because the LED device of this application does not cause secondary high-temperature damage to the LED chip during the packaging process, it significantly extends the lifespan of the LED device. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 is a cross-sectional view of the LED device provided in an embodiment of this application;

[0022] Figure 2 is a cross-sectional view of Figure 1 with the light window and the snap-fit ​​part omitted;

[0023] Figure 3 is a partial structural schematic diagram of the positional relationship between the latching part and the slot part in the LED device provided in the embodiment of this application;

[0024] Figure 4 is a partial structural schematic diagram of the positional relationship between the latching part and the slot part when the side wall of the LED device provided in the embodiment of this application has a slot.

[0025] Figure 5 is a schematic diagram of the snap-fit ​​part in the LED device provided in the embodiment of this application;

[0026] Figure 6 is another structural schematic diagram of the snap-fit ​​part in the LED device provided in the embodiment of this application;

[0027] Figure 7 is another structural schematic diagram of the slot portion in the LED device provided in the embodiment of this application;

[0028] Figure 8 is another structural schematic diagram of the slot portion in the LED device provided in the embodiment of this application.

[0029] Figure 9 is a schematic diagram of the LED device light window encapsulated in the dam according to an embodiment of this application;

[0030] Figure 10 is a cross-sectional view of the LED device provided in the embodiment of this application when the sidewall is provided with a guide groove;

[0031] Figure 11 is a cross-sectional view of Figure 10 with the light window and snap-fit ​​part omitted.

[0032] Figure 12 is another cross-sectional view of the LED device provided in the embodiment of this application when the sidewall is provided with a guide groove;

[0033] Figure 13 is another cross-sectional view of the LED device provided in the embodiment of this application when the sidewall is provided with a guide groove;

[0034] Figure 14 is a schematic diagram of the mounting space in the LED device provided in the embodiment of this application.

[0035] 1-Substrate, 2-LED chip, 3-Dam, 31-First end, 32-Second end, 33-Side wall, 34-Cavity, 4-Light window, 5-Sealing component, 6-Snap-on assembly, 61-Snap-on part, 611-Extension section, 612-Connecting section, 613-Barb, 62-Slot part, 7-Step structure, 71-Step surface, 72-Chamfer, 8-Solder, 9-Auxiliary component, 10-Guide groove, 11-First circuit, 12-Second circuit, 13-Conductive hole, 14-Mounting space. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0037] It should be noted that the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to direct setup, installation, or connection, or indirect setup or connection through centered components or centered structures.

[0038] Furthermore, in the embodiments of this application, the orientations or positional relationships indicated by terms such as "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are based on the orientations or positional relationships shown in the accompanying drawings or the conventional placement or usage state. These are merely for the convenience of describing this application and simplifying the description, and do not indicate or imply that the structure, feature, device, or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this application. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0039] The various specific technical features and embodiments described in the detailed implementation can be combined in any suitable manner without contradiction. For example, different implementation methods can be formed by combining different specific technical features / implementations. In order to avoid unnecessary repetition, the various possible combinations of the various specific technical features / implementations in this application will not be described separately.

[0040] As shown in Figures 1 and 10 to 13, the LED device of this application includes a substrate 1, an LED chip 2, a dam 3, a light window 4, and a sealing member 5. The light window 4 is configured to allow light emitted from the LED chip 2 to pass through. The dam 3 has a first end 31 and a second end 32, and sidewalls 33 extending from the first end 31 and the second end 32. The sidewalls 33 enclose a cavity 34. The dam 3 is mounted on the substrate 1 via the first end 31. The LED chip 2 is disposed within the cavity 34 and encapsulated on the substrate 1. The light window 4 covers the second end 32. The substrate 1 and the light window 4 enclose the cavity 34 into a sealed cavity. The sealing member 5 is disposed between the light window 4 and the second end 32, and the light window 4 is connected and fixed to the dam 3 by a snap-fit ​​structure.

[0041] The LED device provided in this application utilizes a snap-fit ​​structure to mechanically connect and fix the light window 4 and the enclosure 3, eliminating the need for bonding or soldering the light window to the enclosure. This avoids secondary damage to the LED chip from high temperatures, making the packaging simpler and more efficient, effectively improving packaging efficiency. Furthermore, the sealing element 5 located between the light window 4 and the second end 32 of the enclosure 3 ensures the hermeticity of the LED device packaging. The LED device provided in this application features simple and efficient packaging and reliable product quality.

[0042] In one embodiment, the dam 3 further includes an installation space 14 (as shown in Figure 14). The installation space 14 is defined as the area enclosed by lines extending symmetrically to both sides from the inner and outer edges of the second end 32 of the dam 3, within an angle α formed by the lines connecting the inner and outer edges of the first end 31 of the dam 3 to the outer edge of the dam 3, which does not exceed 70°. When the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure 6 is located within the installation space 14. The installation space 14 is used to limit the position of the snap-fit ​​structure during the structural design of the LED device, ensuring that the snap-fit ​​structure is located within the installation space 14 after the light window 4 is connected and fixed to the dam 3. If the snap-fit ​​structure extends beyond the installation space inside the dam, it will block some of the light emitted by the LED chip, affecting the light emission efficiency of the LED device, and will occupy more of the internal space of the dam, reducing the working space when installing the LED chip, which is detrimental to manufacturing. If the snap-fit ​​structure extends beyond the installation space outside the dam, it will affect the aesthetics of the LED device and is prone to detachment under external force.

[0043] Specifically, please refer to Figure 14. The inner edge of the first end 31 refers to endpoint A where the first end 31 intersects with the inner surface of the sidewall 33, and the outer edge of the first end 31 refers to endpoint B where the first end 31 intersects with the outer surface of the sidewall 33. The inner edge of the second end 32 refers to endpoint C where the second end 32 intersects with the inner surface of the sidewall 33, and the outer edge of the second end 32 refers to endpoint D where the second end 32 intersects with the outer surface of the sidewall 33. Extending a horizontal distance S inward from endpoint C, we obtain endpoint C'. Connecting endpoint C' with endpoint A, we obtain line segment L1. Extending a horizontal distance S outward from endpoint D, we obtain endpoint D'. Connecting endpoint D' with endpoint B, we obtain line segment L2. The included angle α between line segment L1 and line segment L2 is ≤ 70°. In this case, the installation space 14 refers to the area enclosed by endpoints A, B, D', and C'. After the light window 4 is connected and fixed to the dam 3, the buckle part 61 and the slot part 62 are both located in the area enclosed by the endpoints A, B, D' and C'.

[0044] In one embodiment, the installation space 14 can also be defined as: the area enclosed by extending horizontally from the inner edge and the outer edge of the second end 32 of the dam 3 to both sides, and within the range where the included angle α formed by the line connecting the inner edge and the outer edge of the first end 31 of the dam 3 does not exceed 40°, that is, the included angle α of line segment L1 and line segment L2 is ≤ 40°.

[0045] Specifically, as shown in Figures 1 and 11 to 13, the substrate 1 of this application is a ceramic substrate. A first line 11 is provided on the front side of the ceramic substrate for connection to the LED chip 2. Preferably, a second line 12 is provided on the back side of the substrate 1 for electrical connection to a PCB (Printed Circuit Board). The substrate 1 has conductive holes 13 penetrating both the front and back sides. The first line 11 and the second line 12 can be electrically connected through the conductive holes 13, thereby realizing the connection between the LED chip 2 and the first line 11 and the second line 12. In specific applications, the first line 11 and the second line 12 on the ceramic substrate can be implemented using DPC (Direct Plating Copper) technology.

[0046] In some embodiments, when the dam 3 is viewed along a direction perpendicular to the light window 4, the cross-section of the chamber 34 defined by the sidewall 33 of the dam 3 can be square, rectangular, or circular. In this embodiment, the cross-section of the chamber 34 defined by the sidewall 33 of the dam 3 is rectangular. The dam 3 is a metal component. Specifically, the dam 3 is made of copper, i.e., a copper dam. The first end 31 of the copper dam is welded to the substrate 1 to achieve the connection and fixation between the dam 3 and the substrate 1. Alternatively, the copper dam and the substrate 1 can be integrally formed by DPC process. Specifically, the sealing member 5 is annular, and the outer contour shape of the sealing member 5 is the same as the top opening shape of the dam 3. The outer contour shape of the light window is also the same as the top opening shape of the dam 3.

[0047] In some embodiments, the snap-fit ​​structure may include at least one set of snap-fit ​​components 6 arranged opposite each other, and the stability of the connection between the light window 4 and the dam 3 is ensured by at least two snap-fit ​​components 6. The snap-fit ​​components 6 can be arranged in two, three, four, or other groups as needed. The two snap-fit ​​components 6 in each group are arranged at intervals relative to each other along a direction parallel to the plane of the light window 4. The line connecting the two snap-fit ​​components 6 in each group is defined as a first line segment, and the relationship between adjacent first line segments is either parallel or intersecting. In this application, when the number of snap-fit ​​components 6 is more than two groups, the arrangement of the multiple first line segments is not limited, as long as the connection strength between the light window 4 and the dam 3 can be ensured.

[0048] In some embodiments, as shown in Figures 1, 3, 4, and 10 to 13, the snap-fit ​​assembly 6 may include a snap-fit ​​part 61 and a slot part 62. The light window 4 may be provided with the snap-fit ​​part 61, and the dam 3 may be provided with the slot part 62. The light window 4 is connected and fixed to the dam 3 by the snap-fit ​​cooperation between the snap-fit ​​part 61 and the slot part 62.

[0049] Optionally, the relationship between the dam 3, the light window 4, the latching part 61, and the slot part 62 includes at least the following two structures:

[0050] The first structure: As shown in Figure 3b, the slot 62 is located on the inner side of the side wall 33, and the latch 61 is coupled to the light window 4. When the light window 4 covers the second end 32 of the dam 3, the latch 61 extends into the chamber 34 and is latched and connected to the slot 62.

[0051] The second structure, as shown in Figure 3a, has a slot 62 located on the outside of the side wall 33, and a latch 61 coupled to the light window 4. When the light window 4 covers the second end 32 of the dam 3, the latch 61 is located outside the chamber 34 and is latched and connected to the slot 62.

[0052] In some embodiments, the slot portion 62 is located on the sidewall 33 and recessed relative to the surface of the sidewall 33. For example, as shown in FIG3a, the slot portion 62 is located on the sidewall 33 and may be recessed relative to the outer surface of the sidewall 33 towards the inner surface of the sidewall 33; or, as shown in FIG3b, the slot portion 62 is located on the sidewall 33 and may be recessed relative to the inner surface of the sidewall 33 towards the outer surface of the sidewall 33. The depth of the recess is less than the distance between the inner and outer surfaces of the sidewall 33. By providing the slot portion 62 on the surface of the sidewall 33, processing is facilitated.

[0053] In some embodiments, as shown in FIG5, the latching part 61 includes an extension section 611, a connecting section 612, and a barb 613. The extension section 611 extends along a first direction and is connected and fixed to the light window 4. The first direction is parallel to the light window 4. One end of the connecting section 612 is connected to the extension section 611 and extends along a second direction, which is the direction from the second end 32 to the first end 31. The other end of the connecting section 612 is connected to the barb 613, which faces the latching slot 62, so that the barb 613 can be latched into the latching slot 62. By providing the extension section 611 extending along the first direction, the contact area between the latching part 61 and the light window 4 is increased, thereby ensuring the connection strength between the latching part 61 and the light window 4.

[0054] Specifically, as shown in Figure 5, the connecting segment 612 can be connected to the end of the extension segment 611. At this time, the shape of the extension segment 611 and the connecting segment 612 after connection is L-shaped.

[0055] Optionally, the extension section 611 can be connected and fixed to the light window 4 by means of bonding, welding, locking connection, etc.

[0056] Optionally, the light window 4 is made of glass, and the latching part 61 is made of metal. The latching part 61 is manufactured by a stamping process. For example, the latching part 61 is preferably made of Kova alloy. A solder 8 is provided between the latching part 61 and the light window 4 (see Figure 1), and the latching part 61 and the light window 4 are welded together by brazing. The extension section 611 is located above the stepped surface 71, and the extension section 611 serves as the welding area for the latching part 61 and the light window 4. Kova alloy can achieve a tight mechanical connection between the two materials within a certain temperature range, thus enabling it to be well bonded to the light window 4. In this application, the specific material of the light window 4 is not limited, as long as it can achieve the function of light transmission.

[0057] Optionally, as shown in Figure 5, the included angle β between the extension segment 611 and the connecting segment 612 is less than 90°, that is, the end of the connecting segment 612 away from the extension segment 611 is inclined towards the sidewall 33. In this way, when the barb 613 is engaged with the slot 62, it will not easily come out of the slot 62, further ensuring the reliability of the LED device package. In practical applications, the included angle β between the extension segment 611 and the connecting segment 612 can also be 90°.

[0058] Optionally, as shown in Figures 2 and 9, the inner edge of the step surface 71 may be provided with a chamfer 72. Since the included angle β between the extension section 611 and the connecting section 612 is less than 90°, by providing the chamfer 72, the chamfer 72 can guide the barb 613 during the process of the external force F pushing the light window 4 closer to the second end 32, so that the barb 613 can smoothly enter the cavity 34.

[0059] In some embodiments, as shown in Figures 2 and 9, the inner side of the second end 32 (i.e., the side near the chamber 34) can be recessed to form a stepped structure 7. The stepped structure 7 has a stepped surface 71, which is lower than the end face of the second end 32, creating a height difference between the stepped surface 71 and the end face of the second end 32. The light window 4 can be installed onto the stepped structure 7 by embedding, with the slot 61 located below the stepped structure 7. By setting the stepped structure 7, it serves two purposes: firstly, it provides positioning, allowing the light window 4 to be precisely encapsulated onto the dam 3; secondly, after the light window 4 is embedded into the stepped structure 7, the stepped structure 7 effectively protects the light window 4, preventing its edges from being damaged or chipped due to accidental stress.

[0060] When the light window 4 is embedded in the stepped structure 7, both the latching part 61 and the slot part 62 are located within the cavity 34, preventing the connection between the latching part 61 and the slot part 62 from being affected by the external environment, thus ensuring the reliability of the LED device packaging. Simultaneously, hiding the latching part 61 and the slot part 62 within the cavity 34 also ensures the neat appearance of the LED device. The structure of the slot part 62, located on the inner side of the side wall 33, can be shown in Figures 2, 7, and 8. In this application, the specific structure of the slot part 62 is not limited, as long as the barb 613 can engage with the slot part 62.

[0061] Preferably, as shown in Figures 1, 10, 12, and 13, the height difference between the step surface 71 and the end face of the second end 32 is limited such that when the light window 4 is installed on the step structure 7, the upper surface of the light window 4 is flush with the end face of the second end 32, which helps to improve the flatness of the LED device appearance. In practical applications, when the light window 4 is installed on the step structure 7, the upper surface of the light window 4 may also be lower than the end face of the second end 32, or the upper surface of the light window 4 may also be higher than the end face of the second end 32. In this application, as long as it is ensured that the light window 4 can be installed on the step structure 7, the height difference between the step surface 71 and the end face of the second end 32 is not limited.

[0062] Optionally, as shown in Figures 1, 10, 12, and 13, the sealing element 5 can be located between the step surface 71 and the extension section 611. The sealing element 5 is made of an elastic material, such as silicone resin, epoxy resin, Teflon, or rubber, so that the sealing element 5 has a rebound force after molding. Referring to Figure 10, after the light window 4 is covered on the second end 32, an external force F needs to be applied to the light window 4 from the second end 32 toward the first end 31. During this process, the sealing element 5 undergoes elastic deformation under pressure until the light window 4 is fixed to the dam 3 through the snap-fit ​​structure (i.e., the barb 613 is snapped into the slot 62). After the external force F is removed, the sealing element 5 tends to return to its initial state. The light window 4 moves away from the step surface 71 under the action of the sealing element 5, and the snap-fit ​​part 61 also moves with the light window 4, so that the barb 613 is tightly snapped into the slot 62, further ensuring the stability of the connection between the light window 4 and the dam 3. At the same time, the seal 5 tends to return to its original state and will fully fill the space between the light window 4 and the step surface 71 to ensure the airtightness of the LED device and prevent moisture from entering the LED device during use.

[0063] Optionally, the seal 5, after being deformed under pressure, has a minimum thickness H1, which is defined as: H1 ≤ H2 - H3 - H4, where H2 is the length of the connecting section 612, H3 is the length of the barb 613, and H4 is the distance from the slot 62 to the step surface 71 (see Figures 2 and 5). Specifically, the length of the barb 613 is the length between the position of the barb 613 closest to the first end 31 and the position of the barb 613 closest to the second end 32. By defining the relationship between H1, H2, H3, and H4, it is ensured that when the seal 5 is deformed under pressure to the minimum thickness H1, the barb 613 can engage with the slot 62.

[0064] In some embodiments, as shown in FIG4, a guide groove 10 extending in a second direction may be provided on the sidewall 33. The guide groove 10 passes through the second end 32 and communicates with the slot portion 62. The connecting section 612 passes through the guide groove 10 so that the barb 613 is engaged with the slot portion 62. During encapsulation, the snap-fit ​​portion 61 needs to be aligned with the guide groove 10. After the light window 4 covers the second end 32, the connecting section 612 of the snap-fit ​​portion 61 can pass through the guide groove 10, and the barb 613 is engaged with the slot portion 62. By providing the guide groove 10, the extension section 612 and the barb 613 of the snap-fit ​​portion 61 are hidden within the enclosure 3, resulting in good overall appearance consistency of the encapsulated LED device.

[0065] Specifically, the position of the guide groove 10 is determined by the position of the slot portion 62. For example, as shown in Figure 4c, the slot portion 62 is located on the side wall 33 and is recessed relative to the outer surface of the side wall 33 toward the inner surface of the side wall 33. In this case, the guide groove 10 is located on the side of the side wall 33 closer to the outer surface. As shown in Figure 4d, the slot portion 62 is located on the side wall 33 and is recessed relative to the inner surface of the side wall 33 toward the outer surface of the side wall 33. In this case, the guide groove 10 is located on the side of the side wall 33 closer to the inner surface.

[0066] Specifically, when a guide groove 10 is provided on the side wall 33, a clearance hole (not shown in the figure) is provided on the sealing member 5 at a position corresponding to the guide groove 10, so that the connecting section 612 of the snap-fit ​​part 61 passes through the clearance hole first and then enters the guide groove 10. With this arrangement, the snap-fit ​​part 61 can be used to limit the sealing member 5, ensuring that the sealing member 5 always remains in the correct position during the sealing process.

[0067] In some embodiments, such as when a stepped structure 7 is formed by a recess on the inner side of the second end 32 (i.e., the side near the chamber 34), as shown in Figures 10 to 13, the sidewall 33 can also be provided with a guide groove 10 extending in the second direction. In this case, the guide groove 10 penetrates the stepped surface 71 and communicates with the slot portion 62. During encapsulation, the snap-fit ​​portion 61 needs to be aligned with the guide groove 10. When the light window 4 is installed onto the stepped structure 7, the connecting section 612 of the snap-fit ​​portion 61 passes through the guide groove 10, and the barb 613 engages with the slot portion 62. By providing the guide groove 10, the extension section 612 of the snap-fit ​​portion 61 and the barb 613 are hidden inside the enclosure 3, resulting in good overall appearance consistency of the encapsulated LED device. For the case where a stepped structure 7 is formed by a recess on the inner side of the second end 32 (i.e., the side near the chamber 34), the sealing member 5 can also have a clearance hole at the position corresponding to the guide groove 10.

[0068] In some embodiments, as shown in FIG4e, FIG6, FIG12 and FIG13, when a guide groove 10 is provided on the side wall 33, that is, whether the guide groove 10 passes through the second end 32 and is connected to the slot 62, or the guide groove 10 passes through the step surface 71 and is connected to the slot 62, the number of barbs 613 can be set to two. The two barbs 613 are arranged opposite to each other about the connecting section 612, and the barbs 613 will produce elastic deformation after being pressed. Understandably, in order to ensure the stability of the engagement between the barb 613 and the slot 62, the maximum distance between the two barbs 613 must be greater than the width of the guide groove 10 when no elastic deformation occurs. Since the barb 613 will undergo elastic deformation after being pressed, during the process of inserting the buckle 61 into the guide groove 10, the two barbs 613 are squeezed and elastically deformed by the groove wall of the guide groove 10, and the maximum distance between the two barbs 613 becomes smaller, so that the two barbs can smoothly enter the guide groove 10, and after exiting the guide groove 10, the two barbs 613 return to their original shape. At this time, the two barbs 613 are just engaged with the slot 62.

[0069] Specifically, as shown in Figures 4e, 6, 12, and 13, when there are two barbs 613, the connecting segment 613 can be connected to the middle of the extension segment 611. In this case, the shape of the extension segment 611 and the connecting segment 612 after connection is T-shaped. Understandably, the number of barbs 613 can also be three, four, five, etc. When there are more than three barbs 613, multiple barbs 613 are connected to the end of the connecting segment 612 and are distributed at intervals along the circumference of the connecting segment 612.

[0070] In practical applications, as shown in Figure 13, by reducing the size of the extension 611 of the latching part 61, the extension 611 located below the light window is less noticeable when viewing the LED device from above, further improving the overall appearance consistency of the LED device. At the same time, the number of latching components is increased to ensure the connection strength between the latching part 61 and the light window 4.

[0071] In some embodiments, the LED chip 2 is packaged on the substrate 1 in at least one of the following ways: flip-chip, upright, or vertical packaging. That is, when the LED chip 2 is a flip chip, it can be packaged on the substrate 1 by a eutectic bonding process; or, when the LED chip 2 is an upright or vertical chip, it can be packaged on the substrate 1 by a wire bonding process. The type of LED chip 2 can be selected according to actual needs and is not specifically limited here.

[0072] This application also provides an LED packaging method for packaging the above-mentioned LED device, comprising the following steps:

[0073] Prepare substrate 1;

[0074] A dam 3 is fabricated, having a first end 31 and a second end 32, and sidewalls 33 extending from the first end 31 and the second end 32, the sidewalls 33 defining a chamber 34. The dam 3 is mounted on the substrate 1 via the first end 31.

[0075] LED chip 2 is installed inside chamber 34;

[0076] A sealing element 4 is provided on the second end 32, and the light window 4 is placed on the sealing element 5. A force is applied to the light window 4 from the second end 32 toward the first end 31. The light window 4 is connected and fixed to the dam 3 through a snap-fit ​​structure. After the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure is located in the installation space 14.

[0077] This packaging method utilizes a snap-fit ​​structure to mechanically connect and fix the light window 4 and the dam 3, eliminating the need for bonding or welding the light window to the dam. This avoids secondary damage to the LED chip from high temperatures, making the packaging simpler and more efficient, and effectively improving packaging efficiency. Furthermore, the sealing element 5 located between the second end 32 of the light window 4 and the dam 3 ensures the airtightness of the LED device packaging.

[0078] In the above steps, the order of steps can be adjusted in the event of a conflict. For example, the dam 3 can be prepared first, and then the LED chip 2 can be installed in the chamber 34. Alternatively, the LED chip can be installed on the substrate 1 first, and then the dam can be prepared, so that the LED chip 2 is located in the chamber 34.

[0079] In one embodiment, the dam 3 also has an installation space 14, which is configured to be an area enclosed by extending horizontally symmetrically from the inner and outer ends of the second end 32 of the dam 3 to both sides, with the angle between the line connecting the inner and outer ends of the first end 31 and the line being α≤70°. At the same time, after the light window 4 is connected and fixed to the dam 3, the snap-fit ​​structure is positioned exactly within the installation space 14.

[0080] In some embodiments, the preparation of substrate 1 includes:

[0081] A ceramic substrate is provided, on which a first line 11 and a second line 12 for connecting to an LED chip 2 can be respectively provided on the front and back sides. The first line 11 and the second line 12 can be fabricated using a DPC (Direct Plating Copper) process. Furthermore, the substrate 1 has a through-hole conductive via 13, through which the first line 11 and the second line 12 are connected, thereby enabling conductive communication between the LED chip 2 and the first line 11 and the second line 12, facilitating electrical connection to the LED chip 2. A nickel layer and a gold layer are sequentially plated onto the first line 11 and the second line 12 respectively to obtain the substrate 1. The purpose of the nickel and gold plating is to improve conductivity and oxidation resistance. Further, the thickness of the nickel layer is >3µm, and the thickness of the gold layer is >0.05µm to ensure conductivity and oxidation resistance.

[0082] Optionally, an LED chip 2 is packaged on the substrate 1, including:

[0083] LED chip 2 is a flip chip, which is soldered onto the surface of substrate 1 using a eutectic furnace.

[0084] In the soldering process, at least one temperature zone of the eutectic furnace is maintained between 280°C and 340°C. Since the pads of the flip chip are made of gold-tin alloy, and the melting point of gold-tin alloy is 280°C, maintaining at least one temperature zone of the eutectic furnace between 280°C and 340°C ensures a strong bond between the flip chip and substrate 1.

[0085] Optionally, flux may also be applied to the surfaces of the flip chip and substrate 1, serving as a medium for eutectic bonding and improving the adhesion between the flip chip and substrate 1 during eutectic soldering. Specifically, rosin and its metal mixture may be used as the flux.

[0086] Optionally, flux can be applied to the substrate surface by dotting, and then the LED chip 2 can be placed on the flux. It is understood that the flux can be dotted onto the surface of the substrate 110 by manual or mechanical means, such as using a smart robot to evenly apply a fixed amount of flux, thereby further improving the welding effect.

[0087] Optionally, during the welding process, the eutectic furnace is kept under vacuum, or an inert gas is introduced into the eutectic furnace. Vacuum or inert gas protection reduces the welding void ratio of the LED chip 2 and prevents high-temperature oxidation of the LED chip 2's electrodes. Specifically, nitrogen gas can be used as the inert gas.

[0088] In some embodiments, the preparation of substrate 1 includes:

[0089] A ceramic substrate is provided, on which a first line 11 and a second line 12 for connecting to an LED chip 2 can be respectively provided on the front and back sides. The first line 11 and the second line 12 can be fabricated using a DPC (Direct Plating Copper) process. Furthermore, the substrate 1 has a through-hole conductive via 13, through which the first line 11 and the second line 12 are connected, thereby enabling conductive communication between the LED chip 2 and the first line 11 and the second line 12, facilitating electrical connection to the LED chip 2. A nickel layer, a palladium layer, and a gold layer are sequentially plated onto the first line 11 and the second line 12 respectively to obtain the substrate 1. The purpose of plating the nickel, palladium, and gold layers is to ensure solderability, conductivity, and oxidation resistance. Further, the thickness of the nickel layer is >3 μm, the thickness of the palladium layer is >0.05 μm, and the thickness of the gold layer is >0.05 μm.

[0090] Optionally, an LED chip 2 is packaged on the substrate 1, including:

[0091] LED chip 2 is either a standard or vertical chip. Die-attach adhesive is applied to the corresponding positions on the surface of substrate 1. The standard or vertical chip is then placed on the adhesive and baked at high temperature to cure the adhesive, thus bonding the standard or vertical chip to substrate 1. Wire bonding is then performed between the electrodes of the standard or vertical chip and the circuitry of substrate 1 using soldering equipment. The die-attach adhesive ensures a stronger bond between the standard or vertical chip and substrate 1. The die-attach adhesive can be insulating glue, silver paste, or solder paste.

[0092] For details of other effects of the LED packaging method provided in this application, please refer to the description above. To avoid repetition, these will not be repeated here.

[0093] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An LED device, characterized in that, The device includes a substrate, an LED chip, a dam, a light window, and a seal. The dam has opposing first and second ends and sidewalls extending from the first and second ends, the sidewalls defining a cavity. The dam is mounted on the substrate via the first end. The LED chip is disposed within the cavity and encapsulated on the substrate. The light window is connected to the second end to seal the cavity. The seal is disposed between the light window and the second end. The light window is connected and fixed to the dam via a snap-fit ​​structure.

2. The LED device as described in claim 1, characterized in that, The dam also has an installation space, which is defined as: an area that extends horizontally symmetrically to both sides from the inner and outer edges of the second end of the dam, and is enclosed within an angle α formed by the line connecting the inner and outer edges of the first end of the dam, which does not exceed 70°, wherein when the light window is connected and fixed to the dam, the snap-fit ​​structure is located within the installation space.

3. The LED device as described in claim 1, characterized in that, The buckle structure includes at least one set of buckle components arranged opposite to each other. Each buckle component includes a buckle part and a slot part. The light window is provided with the buckle part, and the dam is provided with the slot part.

4. The LED device as described in claim 3, characterized in that, The slot is located on the side wall and is recessed relative to the surface of the side wall.

5. The LED device as described in claim 3, characterized in that, The latching part includes an extension section, a connecting section, and a barb. The extension section extends along a first direction and connects to the light window. The first direction is parallel to the light window. The connecting section extends along a second direction, which is the direction from the second end to the first end. One end of the connecting section is connected to the extension section, and the other end is connected to the barb. The barb can be latched into the slot.

6. The LED device as described in claim 5, characterized in that, The sidewall is provided with a guide groove extending along the second direction. The guide groove passes through the second end and communicates with the slot portion. The connecting section passes through the guide groove so that the barb is engaged with the slot portion.

7. The LED device as described in claim 3, characterized in that, The inner side of the second end is recessed to form a stepped structure, the light window is installed on the stepped structure, and the slot is located below the stepped structure.

8. The LED device as described in claim 7, characterized in that, The stepped structure has a stepped surface that is lower than the end face of the second end. The side wall is provided with a guide groove extending along the second direction. The guide groove passes through the stepped surface and communicates with the slot portion. The connecting section passes through the guide groove so that the barb engages with the slot portion.

9. The LED device of claim 5, wherein, The number of barbs is two, and the two barbs are arranged opposite to each other about the connecting section, and the barbs undergo elastic deformation under pressure.

10. The LED device of claim 7, wherein, The sealing element is a flexible element, and the sealing element has a minimum thickness H1 after being deformed by pressure. The first thickness H1 is limited to: H1≤H2-H3-H4, where H2 is the length of the connecting section, H3 is the length of the barb, and H4 is the distance from the slot to the step surface of the step structure.

11. An LED encapsulation method, characterized by, A method for encapsulating an LED device as described in any one of claims 1 to 10 includes the following steps: Preparing a substrate; A dam is fabricated having opposing first and second ends and sidewalls extending from the first and second ends, the sidewalls defining a chamber, the dam being mounted on the substrate via the first end. An LED chip is installed in the cavity; A sealing element is provided on the second end, and the light window is placed on the sealing element. A force is applied to the light window from the second end toward the first end, so that the light window is connected and fixed to the dam through a snap-fit ​​structure.

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