Power module, switching power supply, and manufacturing method for power module

Abstract

The present disclosure provides a power module, a switching power supply, and a manufacturing method for a power module. The power module comprises a power device, a highly thermally conductive layer, an easily-molded thermally-conductive insulating layer, a heat dissipation structure, and a circuit board. The power device comprises a first surface and a second surface that are arranged opposite to each other. The first surface of the power device is disposed on the circuit board in a surface-mounted manner. The highly thermally conductive layer comprises a third surface and a fourth surface that are arranged opposite to each other, the third surface is directly disposed on the second surface, and the areas of the third surface and the fourth surface are greater than the areas of the first surface and the second surface. The easily-molded thermally-conductive insulating layer comprises a fifth surface and a sixth surface that are arranged opposite to each other, and the fifth surface is disposed on the fourth surface. The heat dissipation structure is disposed on the sixth surface. The thermal conductivity of the highly thermally conductive layer is greater than the thermal conductivity of the easily-molded thermally-conductive insulating layer. The power module in the present disclosure has the advantages of low thermal resistance and high heat dissipation efficiency.

Description

[0001] Power modules, switching power supplies and power module manufacturing methods

[0002] Technical Field

[0003] This disclosure relates to the field of electronic technology, and more particularly to a power module, a switching power supply, and a method for manufacturing the power module. Background Art

[0004] In switching power supplies, especially in applications like automotive power supplies, surface mount devices (SMDs) are increasingly used for power devices due to manufacturability considerations. Top-side cooling (TSC) SMD power devices are commonly used in these power supplies. Because their surface mount surface faces away from the printed circuit board (PCB) > towards the cooling system (e.g., water channels or heat sinks), they are easier to integrate with cooling designs. Therefore, they have good application potential in these types of power supplies.

[0005] Due to the packaging design, existing TSC-SMD power devices have a small exposed metal heat dissipation area, which affects thermal resistance. Therefore, when the power consumption of the device is high, it will face serious heat dissipation problems.

[0006] Please refer to Figure 1, which shows a schematic diagram of the configuration and heat conduction path of the TSC-SMD power device and heat dissipation structure in the prior art. The power module 3 includes a power device 31, a thermally conductive insulating layer 32, a heat dissipation structure 33, and a circuit board 34. The power device 31 is disposed on the circuit board 34 on one side and on the heat dissipation structure 33 on the other side through the thermally conductive insulating layer 32. In this configuration, due to the small exposed metal heat dissipation area of ​​the power device 31 itself, and the low thermal conductivity (k) of the thermally conductive insulating layer 32 (for example, generally less than 30 W / mK), the thermal resistance from the power device 31 to the heat dissipation structure 33 is difficult to reduce, resulting in poor heat dissipation efficiency. As shown by the arrow in Figure 1, the heat generated from the power device 31 can only be vertically transferred to the heat dissipation structure 33 through the thermally conductive insulating layer 32 within the area of ​​the power device 31.

[0007] Currently, several solutions exist for addressing the heat dissipation problem of TSC-SMD power devices. One solution is to increase the number of power devices to reduce the losses on individual TSC-SMD power devices, thereby reducing heat generation. Another solution is to use an insulating material with high thermal conductivity (k) as the thermally conductive insulating layer 32, thereby minimizing the thermal resistance from the TSC-SMD power device to the heat dissipation system by increasing thermal conductivity. While these solutions partially solve the problem, both increasing the number of power devices and using insulating materials with high thermal conductivity result in a significant increase in cost.

[0008] Therefore, if there is a genuine need, a solution can be found to address the heat dissipation problem of TSC-SMD power devices without drastically increasing costs.

[0009] Summary of the Invention

[0010] The purpose of this disclosure is to provide a power module, a switching power supply, and a method for manufacturing a power module, in order to solve and improve the problems and shortcomings of the aforementioned technologies.

[0011] To achieve the aforementioned objectives, this disclosure provides a power module comprising a power device, a circuit board, a high thermal conductivity layer, a malleable thermally conductive insulating layer, and a heat dissipation structure. The power device includes a first surface and a second surface disposed opposite to each other. The first surface of the power device is surface-mounted onto the circuit board. The high thermal conductivity layer includes a third surface and a fourth surface disposed opposite to each other, the third surface being directly disposed on the second surface, and the area of ​​the third and fourth surfaces being larger than the area of ​​the first and second surfaces. The malleable thermally conductive insulating layer includes a fifth surface and a sixth surface disposed opposite to each other, the fifth surface being disposed on the fourth surface. The heat dissipation structure is disposed on the sixth surface. The thermal conductivity of the high thermal conductivity layer is greater than the thermal conductivity of the malleable thermally conductive insulating layer.

[0012] To achieve the aforementioned objectives, this disclosure further provides a switching power supply, which includes the aforementioned power module.

[0013] To achieve the aforementioned objectives, this disclosure further provides a method for manufacturing a power module, comprising the steps of: providing a power device, the power device including a first side and a second side disposed opposite to each other; providing a circuit board, the first side of the power device being surface-mount disposed on the circuit board; providing a high thermal conductivity layer, the high thermal conductivity layer including a third side and a fourth side disposed opposite to each other, the third side being directly disposed on the second side, and the area of ​​the third side and the fourth side being larger than the area of ​​the first side and the second side; providing a malleable thermally conductive insulating layer, the malleable thermally conductive insulating layer including a fifth side and a sixth side disposed opposite to each other, the fifth side being disposed on the fourth side; and providing a heat dissipation structure disposed on the sixth side; wherein, the thermal conductivity of the high thermal conductivity layer is greater than the thermal conductivity of the malleable thermally conductive insulating layer, and the heat of the power device is transferred to the malleable thermally conductive insulating layer through the high thermal conductivity layer.

[0014] The power module disclosed herein increases the heat dissipation area of ​​the power device by adding a high thermal conductivity layer with a high thermal conductivity that is in direct contact with the power device between the power device and the heat dissipation structure. This effectively reduces the overall thermal resistance of the power module, thereby improving the heat dissipation effect and reducing the module temperature rise.

[0015] Attached Figure Description

[0016] Figure 1 shows a schematic diagram of the configuration and heat conduction path of TSC-SMD power devices and heat dissipation structures in the prior art. Figure 2A shows a cross-sectional schematic diagram of a power module according to an embodiment of the present disclosure.

[0017] Figure 2B shows a schematic cross-sectional view of a power module according to an embodiment of the present disclosure.

[0018] Figure 3 shows a schematic diagram of the heat conduction path in a power module according to an embodiment of the present disclosure.

[0019] Figure 4 shows a schematic diagram of the configuration of high thermal conductivity layers of different areas and power devices according to this disclosure.

[0020] Figure 5 shows a schematic diagram of the positioning structure of the high thermal conductivity layer according to an embodiment of the present disclosure.

[0021] Figure 6 shows a flowchart of a power module manufacturing method according to an embodiment of the present disclosure.

[0022] The reference numerals in the attached figures are explained as follows:

[0023] 1: Power Module

[0024] 11: Power Devices

[0025] 111: First Page

[0026] 112: Second page

[0027] 113: Heat dissipation area

[0028] 12: Easy-to-shape thermally conductive insulating layer

[0029] 121: Page 5

[0030] 122: Page Six

[0031] 13: Heat dissipation structure 131: Heat dissipation plane

[0032] 14: Circuit board

[0033] 15, 15a, 15b, 15c, 15d: High thermal conductivity layer

[0034] 151: Third Page

[0035] 152: Page 4

[0036] 153: First positioning component

[0037] 154: Second positioning component

[0038] 3: Existing power modules

[0039] 31: Power Devices

[0040] 32: Thermally conductive insulating layer

[0041] 33: Heat dissipation structure

[0042] 34: Circuit board

[0043] Detailed Implementation

[0044] Some typical embodiments of the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can be varied in different ways without departing from the scope of this disclosure, and the description and drawings therein are for illustrative purposes only and not for limiting the scope of this disclosure.

[0045] The present disclosure will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments are implemented based on the technical solutions of the present disclosure, and provide implementation methods and operating procedures; however, the scope of protection of the present disclosure is not limited to the following embodiments.

[0046] According to the thermal resistance formula R = M(k*A), under the same power devices and configuration, the main factors affecting thermal resistance are the thermal conductivity k and the cross-sectional area Ao. In the existing power module shown in Figure 1, the cross-sectional area A is basically equal to the exposed metal heat dissipation area of ​​the power device 31, and increasing the area of ​​the thermally conductive insulating layer 32 does not help increase the heat dissipation area. On the other hand, as mentioned earlier, increasing the thermal conductivity k and increasing the number of power devices are both too costly. Therefore, a solution is needed that can effectively increase the cross-sectional area A while controlling costs to reduce thermal resistance.

[0047] Please refer to Figures 2A, 2B, and 3. Figure 2A shows a cross-sectional schematic diagram of a power module according to an embodiment of the present disclosure, Figure 2B shows a cutaway cross-sectional schematic diagram of a power module according to an embodiment of the present disclosure, and Figure 3 shows a schematic diagram of the heat conduction path in a power module according to an embodiment of the present disclosure. The power module 1 of the present disclosure includes a power device 11, a malleable thermally conductive insulating layer 12, a heat dissipation structure 13, a circuit board 14, and a high thermal conductivity layer 15. The power device 11 includes a first surface 111 and a second surface 112 disposed opposite to each other; the high thermal conductivity layer 15 includes a third surface 151 and a fourth surface 152 disposed opposite to each other; and the easily moldable thermally conductive insulating layer 12 includes a fifth surface 121 and a sixth surface 122 disposed opposite to each other. The power device 11 is surface-mounted on the circuit board 14 via the first surface 111; the high thermal conductivity layer 15 is directly disposed on the second surface 112 of the power device 11 via the third surface 151. In some embodiments of this invention, the third surface 151 of the high thermal conductivity layer 15 can be directly disposed on the second surface 112 of the power device 11 using a smoothness / roughness filling material such as silicone grease or solder paste; the easily moldable thermally conductive insulating layer 12 is disposed on the fourth surface 152 of the high thermal conductivity layer 15 via the fifth surface 121; and the heat dissipation structure 13 is disposed on the sixth surface 122 of the easily moldable thermally conductive insulating layer 12. o

[0048] More specifically, the power module 1 disclosed herein uses TSC-SMD power devices, and the heat dissipation structure 13 has a heat dissipation plane 13L to dissipate heat corresponding to the TSC-SMD power devices. Such a power module 1 is suitable for use in switching power supplies, such as automotive power supplies. The heat dissipation structure 13 can be a liquid-cooled or air-cooled heat dissipation structure with a heat dissipation plane in the automotive system, or a natural cooling structure.

[0049] With the above configuration, the power module 1 disclosed herein has a structure in which the power device 11 is sandwiched between the circuit board 15 and the heat dissipation structure 13, and a high thermal conductivity layer 15 and a malleable thermally conductive insulating layer 12 are provided between the power device 11 and the heat dissipation structure 13. More specifically, compared to the existing power module 3 shown in Figure 1, the power module 1 of this disclosure adds a high thermal conductivity layer 15 between the power device 11 and the easily moldable thermally conductive insulating layer 12, which directly contacts the second surface 112 of the power device 11. The thermal conductivity of the high thermal conductivity layer 15 is greater than that of the easily moldable thermally conductive insulating layer 12. Furthermore, the high thermal conductivity layer 15 is made of a thermally conductive material with a thermal conductivity greater than 100 W / mK, which can provide extremely high heat conduction effect. Therefore, the original heat dissipation area on the second surface 112 of the power device 11 is extended to the high thermal conductivity layer 15. In this way, the heat dissipation area of ​​the power device 11 can be changed by changing the area of ​​the high thermal conductivity layer 15.

[0050] In other words, given a fixed heat dissipation area for the surface-mount power device 11 (for example, the heat dissipation surface of a common surface-mount power device is its exposed metal surface), the fixed heat dissipation area can be increased by providing a high thermal conductivity layer 15 that directly contacts it. This also means that the heat dissipation contact area between the power device 11 and the heat dissipation structure 13 can be increased, thereby improving heat dissipation efficiency.

[0051] Comparing Figure 1 and Figure 3, in Figure 1, although a thermally conductive insulating layer 32 with an area larger than that of the power device 31 is provided between the power device 31 and the heat dissipation structure 33, the thermal conductivity of the insulating layer 32 is low, generally below 30 W / mK. Therefore, the heat generated from the power device 31 can only be transferred vertically to the heat dissipation structure 33. On the other hand, as shown by the arrow in Figure 3, due to the addition of a high thermal conductivity layer 15 with a thermal conductivity greater than 100 W / mK, the heat dissipation area on the second surface 112 of the power device 11 can be expanded to the area of ​​the high thermal conductivity layer 15, achieving lateral expansion. In this way, the heat generated from the power device 11 can be transferred to the entire expanded area of ​​the high thermal conductivity layer 15, and then come into contact with the heat dissipation structure 13, greatly improving the heat dissipation efficiency.

[0052] As mentioned earlier, if the cross-sectional area A can be effectively increased, the thermal resistance of the power module can be effectively reduced, thereby solving the heat dissipation problem. This disclosure achieves the effect of increasing the cross-sectional area A and reducing the thermal resistance by adding a high thermal conductivity layer with a thermal conductivity greater than 100 W / mK that is in direct contact with the original heat dissipation surface of the power device, and further effectively reducing the temperature rise.

[0053] As shown in List 1 below, experiments have confirmed that, compared with existing power modules, the power module of this disclosure with the addition of a high thermal conductivity layer 15 can indeed effectively improve heat dissipation and reduce the operating temperature of the module.

[0054] Table 1

[0055] Voltage (V) Current (A) Temperature (°C) Temperature drop (°C) Existing power module 0.603 20 86

[0056] 12.4 This disclosure pertains to power modules* 0.64 20 73.6

[0057] Existing power module 0.563 30 119

[0058] 24.9

[0059]

[0060] This disclosed power module* 0.615 30 94.1 Existing power modules 0.526 40 130.7

[0061] 17.2 This disclosure pertains to a power module* 0.591 40 113.5

[0062]

[0063] *The thermally conductive insulating layer is a copper sheet with an area of ​​400 mm2 and a thickness of 1.5 mm.

[0064] Moreover, since high thermal conductivity materials are inexpensive to obtain—for example, common high thermal conductivity materials include copper, aluminum, and / or their alloys—the thermal resistance of the overall power module can be reduced without significantly increasing costs, thereby reducing losses and temperature rise. This is a solution with significant industrial application value. It is understood that the material of the high thermal conductivity layer 15 disclosed herein can be a high thermal conductivity solid material, and is not limited to the aforementioned metallic materials such as copper, aluminum, and / or their alloys.

[0065] This disclosure further explores the influence of the area size of the high thermal conductivity layer 15 on the thermal resistance of the power module 1, and the influence of the area size of the high thermal conductivity layer 15 on the operating temperature of the power module 1. Examples (a) to (d) shown in Figure 4 are schematic diagrams of the configuration of high thermal conductivity layers and power devices with different area sizes. In example (a), the area of ​​the high thermal conductivity layer 15a (dashed box) is approximately equal to the heat dissipation area 113 on the second surface 112 of the power device 11, for example, the exposed metal area. In example (b), the area of ​​the high thermal conductivity layer 15b (dashed box) is approximately equal to the area of ​​the second surface 112 of the power device 11. In example (c), the area of ​​the high thermal conductivity layer 15c (dashed box) is larger than the area of ​​the second surface 112 of the power device 11, roughly covering the area surrounding the pins of the power device 11. In example (d), the high thermal conductivity layer 15d is implemented to correspond to multiple power devices 11, and its coverage extends significantly beyond the second surface 112 of each power device 11. o First, the thermal resistance at different layers in the power module was measured to understand the impact of the area of ​​the high thermal conductivity layer on thermal resistance in practical applications. The experimental results are shown in Table 2 below. According to the data in Table 2, the most significant thermal resistance in the power module originates from the easily malleable thermally conductive insulating layer. It can also be seen that increasing the heat dissipation area of ​​the power device by setting a high thermal conductivity layer can effectively reduce the thermal resistance of the easily malleable thermally conductive insulating layer, thus reducing the main thermal resistance in the power module. Furthermore, as the area of ​​the high thermal conductivity layer gradually increases, the thermal resistance of the easily malleable thermally conductive insulating layer gradually decreases, thereby reducing the overall thermal resistance of the power module.

[0066] Table 2

[0067] Example (a) Example (b) Example (c) Example (d) High thermal conductivity layer* Area 124 mm 2 240 mm 2 320 mm 2 2000 mm 2 Thermal resistance - Power device and high thermal conductivity layer combination: 0.78 KAV, 0.76 KAV, 0.76 KAV, 0.75 KAV; Thermal resistance - Flexible thermally conductive insulation layer: 1.61 KAV, 0.84 KAV, 0.69 KAV, 0.38 KAV; Thermal resistance - Heat dissipation structure: 0.16 KAV, 0.08 KAV, 0.07 KAV, 0.04 KAV; Total thermal resistance: 2.55 KAV, 1.68 KAV, 1.52 KAV, 1.17 KAV

[0068]

[0069] *The high thermal conductivity layer is a 1.5 mm thick copper sheet. Furthermore, the influence of the area of ​​the high thermal conductivity layer on the operating temperature of the power device was also investigated. The experimental results are shown in Table 3 below. According to the data in Table 3, as the area of ​​the high thermal conductivity layer gradually increases, the temperature of the power device gradually decreases. This also indicates that the reduction in thermal resistance has a positive impact on heat dissipation, effectively improving heat dissipation efficiency.

[0070] Table 3

[0071] Example (a) Example (b) Example (c) Example (d) High thermal conductivity layer * area 124 mm 2 240 mm 2 320 mm 2 2000 mm 2 Power device operating temperatures: 142 °C, 124 °C, 120 °C, 110 °C; Temperature rise relative to 80 °C: 62 °C, 44 °C, 40 °C, 30 °C; Temperature drop relative to previous example: -6 °C, 4 °C, 10 °C; Temperature drop relative to example (a): -18 °C, 22 °C, 32 °C

[0072]

[0073] *The high thermal conductivity layer is a 1.5 mm thick copper sheet.

[0074] It should be noted that in example (d), the material used for the high thermal conductivity layer can vary depending on the potential changes among the second surfaces 112 of the multiple power devices 11 disposed on the large-area high thermal conductivity layer 15d. For example, when the potentials of the multiple second surfaces 112 are the same, the high thermal conductivity layer has no insulation requirement; when the potentials of the multiple second surfaces 112 are different, the material of the high thermal conductivity layer they share is a high thermal conductivity insulating material or a thermally conductive insulating coating. This can be changed depending on the actual application. According to the above experimental results, under the premise that the power devices remain unchanged, the setting of the high thermal conductivity layer can have a positive effect on mitigating the temperature rise for both the easily malleable thermally conductive insulating layer and the power module. That is, as the area of ​​the high thermal conductivity layer increases, the thermal resistance of both the power module and the easily malleable thermally conductive insulating layer can be effectively reduced. In other words, the area of ​​the third and fourth surfaces of the high thermal conductivity layer is negatively correlated with the thermal resistance of the power module, and the area of ​​the third and fourth surfaces of the high thermal conductivity layer is also negatively correlated with the thermal resistance of the easily malleable thermally conductive insulating layer.

[0075] Therefore, in practical applications, the material and area of ​​the high thermal conductivity layer can be selected according to the application requirements of the power module to meet cost requirements. In addition, various standard products can be designed to meet the requirements of various TSC-SMD power devices in the market, taking into account the models and application fields of various TSC-SMD power devices, to further reduce the manufacturing cost of the high thermal conductivity layer.

[0076] Different methods can be selected for fixing and positioning the high thermal conductivity layer 15 and the power device 11. Besides machine positioning, positioning can also be achieved by setting a positioning structure. Please refer to Figure 5, which shows a schematic diagram of the positioning structure of the high thermal conductivity layer according to an embodiment of this disclosure. A positioning structure may be further provided on the third surface 151 of the high thermal conductivity layer 15 where the power device 11 is mounted, so as to position the high thermal conductivity layer 15 by the positioning position of the positioning structure. For example, the positioning structure may include two first positioning components 153, such as two positioning steps, arranged opposite each other along a first direction to limit the movement range of the high thermal conductivity layer 15 in the first direction, and further include a second positioning component 154, such as a positioning post, arranged in a second direction, such as perpendicular to the first direction, to limit the movement of the power device 11 in the second direction. In this way, the power device 11 can be positioned by limiting its position in both directions. It should be noted that after the movement in the first direction is positioned by the two positioning components, the positioning component in the second direction can be set on only one side or on opposite sides, both of which can achieve the positioning effect. In addition, the structural shape and quantity of the first positioning component and the second positioning component may be the same or different depending on the actual implementation, and are not limited to the drawings.

[0077] In summary, this disclosure increases the heat dissipation area of ​​the power device by adding a high thermal conductivity layer with a high thermal conductivity, disposed between the power device and the heat dissipation structure and in direct contact with the power device. This effectively reduces the thermal resistance of the easily malleable thermally conductive insulating layer, which is the main source of thermal resistance in the power module, thereby improving heat dissipation and reducing the temperature rise during operation, thus effectively improving the operating efficiency of the power module. The power module using the high thermal conductivity layer disclosed in this disclosure has significant industrial application value.

[0078] In some embodiments of this case, the power modules of this disclosure can be applied to switching power supplies, particularly vehicle power supplies.

[0079] This case also discloses a method for manufacturing a power module, as shown in Figure 6, including the following steps:

[0080] S1: A power device is provided, the power device including a first surface and a second surface disposed opposite to each other;

[0081] S2: A circuit board is provided, wherein the first side of the power device is surface-mounted on the circuit board;

[0082] S3: Provides a high thermal conductivity layer, which includes a third surface and a fourth surface disposed opposite to each other, the third surface being directly disposed on the second surface, and the area of ​​the third surface and the fourth surface being larger than the area of ​​the first surface and the second surface;

[0083] S4: Provides a malleable thermally conductive insulating layer, the malleable thermally conductive insulating layer including a fifth side and a sixth side disposed opposite to each other, the fifth side being disposed on the fourth side;

[0084] S5: Provides a heat dissipation structure, which is located on the sixth side; wherein, the thermal conductivity of the high thermal conductivity layer is greater than that of the easily malleable thermally conductive insulating layer, and the heat of the power device is transferred to the easily malleable thermally conductive insulating layer through the high thermal conductivity layer.

[0085] It should be noted that the above steps are not a limitation on the manufacturing order of the power module in this case. In some embodiments of this case, the power device can be installed on the circuit board first, then the high thermal conductivity layer can be installed on the power device, and finally the assembled circuit board + power device + high thermal conductivity layer can be connected to the easily moldable thermally conductive insulating layer and the heat dissipation structure. In other embodiments of this case, the high thermal conductivity layer can be installed on the power device first, and then the power device + high thermal conductivity layer can be installed on the circuit board.

[0086] It should be noted that the above are merely preferred embodiments for illustrating this disclosure, and this disclosure is not limited to the described embodiments. The scope of this disclosure is determined by the appended claims. Furthermore, this disclosure may be modified in various ways by those skilled in the art, without departing from the protection sought by the appended claims.

Claims

Claims 1. A power module, characterized in that, include: A power device, comprising a first surface and a second surface arranged opposite to each other; The circuit board, wherein the first side of the power device is surface-mounted on the circuit board; A high thermal conductivity layer includes a third surface and a fourth surface disposed opposite to each other, wherein the third surface is directly disposed on the second surface, and the area of ​​the third surface and the fourth surface is larger than the area of ​​the first surface and the second surface; A malleable thermally conductive insulating layer includes a fifth surface and a sixth surface disposed opposite to each other, wherein the fifth surface is disposed on the fourth surface; and A heat dissipation structure is provided on the sixth surface; The thermal conductivity of the high thermal conductivity layer is greater than that of the easily moldable thermally conductive insulating layer.

2. The power module as described in claim 1, characterized in that, The thermal conductivity of the high thermal conductivity layer is greater than 100 W / mK, and the thermal conductivity of the easily malleable thermally conductive insulating layer is less than 30 W / mK.

3. The power module as described in claim 1, characterized in that... The areas of the third and fourth surfaces are negatively correlated with the thermal resistance of the power module.

4. The power module as described in claim 1, characterized in that... The areas of the third and fourth surfaces are negatively correlated with the thermal resistance of the easily malleable thermally conductive insulating layer.

5. The power module as described in claim 1, characterized in that... The high thermal conductivity layer includes a positioning structure for positioning the power device on the third surface.

6. The power module as described in claim 5, characterized in that... The positioning structure includes two first positioning components arranged opposite each other along a first direction, and at least one second positioning component arranged opposite each other along a second direction, wherein the first direction and the second direction are perpendicular to each other.

7. The power module as described in claim 1, characterized in that, The number of power devices on the second surface of the high thermal conductivity layer is multiple.

8. The power module as described in claim 1, characterized in that, When the second surface potential of the power device is different, the material of the high thermal conductivity layer is a high thermal conductivity insulating material or a thermal conductivity insulating coating.

9. The power module as described in claim 1, characterized in that, The high thermal conductivity layer is made of a high thermal conductivity solid material.

10. The power module as described in claim 9, characterized in that, The high thermal conductivity solid material includes copper, aluminum, and / or their alloys.

11. The power module as claimed in claim 1, characterized in that, The heat dissipation structure has a heat dissipation plane, which is disposed on the sixth surface.

12. The power module as claimed in claim 1, characterized in that, The heat dissipation structure is either liquid-cooled or air-cooled.

13. A switching power supply, characterized in that, Includes the power module as described in any one of claims 1-12.

14. A method for manufacturing a power module, characterized in that, The steps include: providing a power device, the power device comprising a first surface and a second surface disposed opposite to each other; A circuit board is provided, wherein the first side of the power device is disposed on the circuit board in a surface mount manner; a high thermal conductivity layer is provided, the high thermal conductivity layer includes a third side and a fourth side disposed opposite to each other, the third side is directly disposed on the second side, and the area of ​​the third side and the fourth side is larger than the area of ​​the first side and the second side; A malleable thermally conductive insulating layer is provided, the malleable thermally conductive insulating layer including a fifth surface and a sixth surface disposed opposite to each other, the fifth surface being disposed on the fourth surface; and A heat dissipation structure is provided, the heat dissipation structure being disposed on the sixth surface; The thermal conductivity of the high thermal conductivity layer is greater than that of the easily malleable thermally conductive insulating layer, and the heat of the power device is transferred to the easily malleable thermally conductive insulating layer through the high thermal conductivity layer.

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