Maintenance substrate and plating device
The maintenance substrate with an elastic cleaning member addresses the limited cleaning area and contamination issues in existing plating apparatuses by effectively cleaning power supply contacts over a wide area, minimizing holder contamination and enhancing cleaning efficiency.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- EBARA CORP
- Filing Date
- 2024-12-23
- Publication Date
- 2026-07-02
AI Technical Summary
Existing plating apparatuses fail to effectively clean a wide range of power supply contacts while minimizing contamination within the substrate holder, with the risk of foreign matter spreading and limited cleaning area due to abrasive polishing.
A maintenance substrate with an elastic cleaning member, capable of holding cleaning liquid, is used to clean a wide area of power supply contacts by immersing them in the cleaning solution, suppressing contamination and preventing spillage.
The elastic cleaning member allows for thorough cleaning of power supply contacts over a wide area without generating contaminants, reducing the risk of holder contamination and optimizing cleaning efficiency.
Smart Images
Figure JP2024045328_02072026_PF_FP_ABST
Abstract
Description
Maintenance Substrate and Plating Apparatus
[0001] This application relates to a maintenance substrate and a plating apparatus.
[0002] Patent Document 1 discloses a dip-type plating apparatus as an example of an electrolytic plating apparatus. This plating apparatus holds a substrate (e.g., a semiconductor wafer) with its plating surface facing sideways in a substrate holder, immerses it in a plating solution, and applies a voltage between the substrate (cathode) and the anode to deposit a conductive film on the surface of the substrate.
[0003] The plating apparatus of Patent Document 1 has a maintenance member that can easily maintain the power supply contact of the substrate holder. Specifically, the maintenance member has an abrasive body arranged to contact the power supply contact when held by the substrate holder. When the maintenance member is held by the substrate holder, the power supply contact contacts the abrasive body and slides on the abrasive body. As a result, the power supply contact is polished by the abrasive body, and foreign matter adhering to the surface of the power supply contact is removed, so that the power supply contact can be maintained.
[0004] Japanese Patent Application Laid-Open No. 2021-132153
[0005] The plating apparatus disclosed in Patent Document 1 does not consider cleaning a wide range of the power supply contact while suppressing contamination inside the substrate holder.
[0006] That is, in the plating apparatus disclosed in Patent Document 1, foreign matter adhering to the surface of the power supply contact is removed by polishing the power supply contact with an abrasive body, so there is a risk that the inside of the substrate holder will be contaminated by the particles of the removed foreign matter. Also, in the plating apparatus disclosed in Patent Document 1, the area where foreign matter can be removed is limited to the contact range between the rigid power supply contact and the abrasive body, so the area where foreign matter can be removed is relatively narrow.
[0007] Therefore, one object of this application is to clean a wide range of the power supply contact while suppressing contamination inside the substrate holder.
[0008] According to one embodiment, a maintenance substrate for cleaning power supply contacts of a plating apparatus is disclosed, comprising: a maintenance substrate body; and a cleaning member disposed in a contact area of the maintenance substrate body where the power supply contacts come into contact when the maintenance substrate body is clamped to a substrate holder having power supply contacts, the cleaning member being formed of an elastic body capable of holding a cleaning liquid.
[0009] Figure 1 is a cross-sectional view showing the overall configuration of a plating apparatus according to one embodiment. Figure 2 is a schematic perspective view of a substrate holder according to one embodiment. Figure 3 is a schematic plan view of a substrate holder according to one embodiment. Figure 4 is a cross-sectional view taken along line 4-4 in Figure 3. Figure 5 is a plan view of a maintenance substrate according to one embodiment. Figure 6 is a diagram showing the configuration of a maintenance substrate storage according to one embodiment. Figure 7 is a flowchart of a method for cleaning power supply contacts using a maintenance substrate. Figure 8 is a flowchart of a method for supplying cleaning solution to a maintenance substrate. Figure 9 is a diagram showing the configuration of a maintenance substrate storage according to one embodiment.
[0010] Embodiments of the present invention will be described below with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.
[0011] <Overall Configuration of Plating Apparatus> Figure 1 is a plan view showing the overall configuration of the plating apparatus of this embodiment. The plating apparatus 1000 comprises a load port 100, a transport robot 110, a load stage 120, an unload stage 130, a loader 140, a fixing module 200, a maintenance substrate storage 280, a stocker module 300, a swap module 310, a holder cleaning module 320, a pre-wet module 400, a pre-soak module 500, a pre-soak cleaning module 510, a plating module 600, a plating cleaning module 700, a blow module 710, a temporary storage module 720, a cleaning module 800, a transport device 900, and a control module 950.
[0012] The load port 100 is a module for loading substrate WF stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000, and for unloading substrate WF from the plating apparatus 1000 into a cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of load ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrate WF horizontally and is configured to transfer substrate WF between the load port 100 and the load stage 120.
[0013] The loading stage 120 is a stage for transferring the substrate WF before plating between the transport robot 110 and the loader 140. The unloading stage 130 is a stage for transferring the substrate WF after plating between the transport robot 110 and the loader 140. The loader 140 is a robot for horizontally transporting the substrate WF and is configured to transfer the substrate WF between the loading stage 120, the unloading stage 130, the fixing module 200, and the cleaning module 800.
[0014] The maintenance board storage 280 is a module for storing maintenance boards MWF. The fixing module 200 is a module for attaching boards WF to the board holder 210 and removing boards WF from the board holder 210. The fixing module 200 is also a module for attaching maintenance boards MWF to the board holder 210 and removing maintenance boards MWF from the board holder 210. The loader 140 is a robot for transporting maintenance boards MWF between the maintenance board storage 280 and the fixing module 200. The stocker module 300 is a module for vertically storing the board holder 210. The swap module 310 is a module for temporarily storing board holders 210 that need to be replaced or maintained, and has a structure that allows the board holder 210 to be inserted and removed. The substrate holder 210 removed from the swap module 310 is maintained within the plating apparatus 1000 or taken outside the plating apparatus 1000 for maintenance, and the maintained substrate holder 210 or a new substrate holder 210 can be placed back into the swap module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.
[0015] The pre-wet module 400 is a module for replacing air inside patterns formed on the substrate surface with a treatment solution by wetting the surface of the substrate WF to be plated with a treatment solution such as pure water or degassed water before the plating process. The pre-wet module 400 is configured to perform a pre-wetting treatment that makes it easier to supply the plating solution inside the pattern by replacing the treatment solution inside the pattern with the plating solution during plating.
[0016] The pre-soak module 500 is configured to perform a pre-soak treatment, which involves etching away an oxide film with high electrical resistance present on the surface of the seed layer formed on the surface of the substrate WF to be plated before plating, using a treatment solution such as sulfuric acid or hydrochloric acid, thereby cleaning or activating the surface of the plating substrate. The pre-soak cleaning module 510 is a module for cleaning the substrate WF that has undergone the pre-soak treatment.
[0017] The plating module 600 is a module for applying a plating treatment to the substrate WF. The plating cleaning module 700 is a module for cleaning the substrate WF to remove any remaining plating solution after the plating treatment. In this embodiment, three plating modules 600 and three plating cleaning modules 700 are arranged horizontally, but the number and arrangement of the plating modules 600 and three plating cleaning modules 700 are arbitrary. The blow module 710 is a module for drying the substrate WF after the cleaning treatment. The temporary storage module 720 is a module for temporarily storing the substrate holder 210 to which the substrate WF is attached, so that it can be transferred between multiple transport devices 900. In this embodiment, the temporary storage module 720 holds one substrate holder 210, but the number is arbitrary.
[0018] The cleaning module 800 is a module for performing cleaning and drying treatments on the substrate WF in order to remove any remaining plating solution, etc., from the substrate WF after plating treatment, which has been removed from the substrate holder 210. In this embodiment, two cleaning modules 800 are arranged horizontally on either side of the load stage 120 and the unload stage 130, but the number and arrangement of the cleaning modules 800 are arbitrary. The transport device 900 is a device for transporting the substrate holder 210 vertically between multiple modules in the plating apparatus 1000. In one example, the transport device 900 is a device for transporting the substrate holder 210 between the stocker module 300 and the fixing module 200. In this embodiment, three transport devices 900 are arranged side by side, but the number and arrangement of the transport devices 900 are arbitrary.
[0019] The control module 950 is configured to control multiple modules of the plating apparatus 1000 and can consist of, for example, a general-purpose computer or a dedicated computer with an input / output interface with an operator.
[0020] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, substrates WF stored in a cassette are loaded into the load port 100. Next, the transport robot 110 takes the substrates WF from the cassette in the load port 100 and places them on the load stage 120. The loader 140 receives the substrates WF from the load stage 120 and transports them to the fixing module 200.
[0021] The fixing module 200 attaches the substrate WF to the substrate holder 210. The transport device 900 transports the substrate holder 210 with the substrate WF attached to the pre-wet module 400. The pre-wet module 400 performs a pre-wet treatment on the substrate WF. The transport device 900 transports the substrate holder 210 with the pre-wet treated substrate WF attached to the pre-soak module 500. The pre-soak module 500 performs a pre-soak treatment on the substrate WF. The transport device 900 transports the substrate holder 210 with the pre-soaked substrate WF attached to the pre-soak cleaning module 510. The pre-soak cleaning module 510 cleans the substrate WF. The transport device 900 transports the substrate holder 210 with the cleaned substrate WF attached to the plating module 600. The plating module 600 performs a plating treatment on the substrate WF.
[0022] The transport device 900 transports the substrate holder 210, to which the plated substrate WF is attached, to the plating cleaning module 700. The plating cleaning module 700 performs a cleaning treatment on the substrate WF and the substrate holder 210. The transport device 900 transports the substrate holder 210, to which the cleaned substrate WF is attached, to the blow module 710. The blow module 710 performs a drying treatment on the substrate WF. The transport device 900 transports the substrate holder 210, to which the dried substrate WF is attached, to the temporary storage module 720, and another transport device 900 transports the substrate holder 210 from the temporary storage module 720 to the fixing module 200. The fixing module 200 removes the substrate WF from the substrate holder 210.
[0023] The loader 140 transports the plated substrate WF removed from the substrate holder 210 to the cleaning module 800. The cleaning module 800 performs cleaning and drying on the substrate WF. The loader 140 places the cleaned and dried substrate WF on the unload stage 130. The transport robot 110 receives the substrate WF from the unload stage 130 and transports it to the cassette in the load port 100. Finally, the cassette containing the substrate WF is discharged from the load port 100.
[0024] In the fixing module 200, the substrate holder 210 from which the substrate WF has been removed is either fitted with the next substrate WF or returned to the stocker module 300 by the transport device 900. The substrate holder 210 that does not hold a substrate WF is cleaned in the holder cleaning module 320 as needed.
[0025] <Substrate Holder> Figure 2 is a schematic perspective view of a substrate holder according to one embodiment. Figure 3 is a schematic plan view of a substrate holder according to one embodiment. Figure 4 is a cross-sectional view taken along line 4-4 in Figure 3. Figures 3 and 4 show the substrate holder 210 clamping the maintenance substrate MWF.
[0026] As shown in Figures 2 to 4, the substrate holder 210 includes a front frame 220 and a rear frame 230 for holding a substrate WF or maintenance substrate MWF together with the front frame 220. The front frame 220 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. In this embodiment, an example is shown where the central opening 234a is formed in a rectangular shape to correspond to a rectangular substrate WF or maintenance substrate MWF, but it is not limited to this. For example, if the substrate WF or maintenance substrate MWF is circular, the central opening 234a is formed in a circular shape.
[0027] Furthermore, although this embodiment shows an example in which a central opening is formed in the rear frame 230, this is for the purpose of performing plating treatment on both sides of the substrate. Therefore, if plating treatment is to be performed on only one side of the substrate, a central opening does not need to be formed in the rear frame 230.
[0028] As shown in Figures 2 and 3, the substrate holder 210 has a plurality of locking mechanisms 270 for locking and unlocking the front frame 220 and the rear frame 230. The plurality of locking mechanisms 270 are provided along the outer circumference of the front frame 220 and the rear frame 230.
[0029] As shown in Figure 4, the substrate holder 210 includes an inner sealing member 250 and an outer sealing member 260 positioned outside the inner sealing member 250 at a distance from it. The substrate holder 210 also includes a power supply contact 243 for supplying power to the substrate WF. The power supply contact 243 is provided between the inner sealing member 250 and the outer sealing member 260. This ensures that when the substrate holder 210 is immersed in the plating solution, the power supply contact 243 and the edges of the substrate are sealed from the plating solution.
[0030] The locking mechanism 270 includes a holder plate 222 located on the rear frame 230 side, and a holder hook 224 protruding from the holder plate 222 towards the front frame 220 side. On the other hand, the locking mechanism 270 also includes a clamper plate 236 located on the front frame 220 side, and a clamper hook 238 provided on the clamper plate 236.
[0031] The holder hook 224 is configured to rotate around the axis 224a. The locking mechanism 270 is configured to lock the front frame 220 and the rear frame 230 when the holder hook 224 engages with the clamper hook 238. On the other hand, the locking mechanism 270 is configured such that when the holder hook 224 is rotated, the engagement between the holder hook 224 and the clamper hook 238 is released, and the lock on the front frame 220 and the rear frame 230 is released.
[0032] <Maintenance Substrate> Next, the details of the maintenance substrate MWF will be described. Figure 5 is a plan view of a maintenance substrate according to one embodiment. The maintenance substrate MWF of this embodiment is a substrate for cleaning the power supply contacts 243. The maintenance substrate MWF includes a maintenance substrate body 290 and a cleaning member 292 positioned in the contact area 243a of the maintenance substrate body 290 where the power supply contacts 243 come into contact when the maintenance substrate body 290 is clamped to a substrate holder 210 having power supply contacts 243. The cleaning member 292 is formed of an elastic body capable of holding cleaning liquid. For example, the cleaning member 292 may be a sheet with minute grooves or irregularities formed thereon, or a fibrous member. Alternatively, the cleaning member 292 may be a porous elastic body capable of holding cleaning liquid. In one example, the cleaning member 292 is a sponge. In this embodiment, power supply contacts 243 are provided on the four sides of the frame member 234 in order to supply power to the four sides of the substrate WF. Therefore, the cleaning member 292 is positioned in the contact areas 243a on all four sides of the maintenance substrate body 290.
[0033] According to this embodiment, a wide area of the power supply contact can be cleaned while suppressing contamination inside the substrate holder. In other words, in the conventional technology, foreign matter adhering to the surface of the power supply contact is removed by polishing the power supply contact with an abrasive, so there is a risk that the inside of the substrate holder may be contaminated by the removed foreign matter particles. Also, in the conventional technology, the area from which foreign matter can be removed is limited to the contact area between the rigid power supply contact and the abrasive, so the area from which foreign matter can be removed is relatively narrow.
[0034] In contrast, according to this embodiment, when the maintenance substrate body 290 is clamped to the substrate holder 210, the power supply contact 243 comes into contact with the cleaning member 292. Since the cleaning member 292 holds a cleaning solution, the power supply contact 243 is immersed in the cleaning solution, and foreign matter adhering to the surface of the power supply contact 243 can be removed. In one example, by having the cleaning member 292 hold an acidic solution as the cleaning solution, oxide or resist residue adhering to the power supply contact 243 can be cleaned. According to this embodiment, since no foreign matter particles are generated, contamination inside the substrate holder can be suppressed. In addition, according to this embodiment, since the cleaning member 292 is elastic, when the power supply contact 243 comes into contact with the cleaning member 292, the cleaning member 292 indents, and a wide area of the power supply contact 243 is immersed in the cleaning solution. This allows a wide area of the power supply contact 243 to be cleaned.
[0035] As shown in Figure 5, the cleaning member 292 has a length extending in the direction of the arrangement of the multiple power supply contacts, and a width 292W perpendicular to that length. The width 292W of the cleaning member 292 is formed to be larger than the width 243W of the contact area 243a. By forming the width 292W of the cleaning member 292 in this way, when the power supply contact 243 comes into contact with the cleaning member 292, cleaning fluid can be accumulated in the recess of the cleaning member 292, so that a wide area of the power supply contact 243 can be immersed in the cleaning fluid.
[0036] Furthermore, as shown in Figure 5, the cleaning member 292 is positioned in the contact area 243a such that its outer end 292EG is located inside the outer end WEG of the maintenance substrate body 290. As a result, an outer peripheral region 294 for receiving the cleaning liquid is formed on the maintenance substrate body 290 outside of the cleaning member 292. Consequently, spillage of the cleaning liquid into the substrate holder 210 can be suppressed. That is, since the cleaning member 292 is made of a porous elastic material capable of holding the cleaning liquid, when the power supply contact 243 contacts and presses the cleaning member 292, the cleaning liquid may drip from the cleaning member 292. In this respect, according to this embodiment, the cleaning liquid that drips from the cleaning member 292 can be received by the outer peripheral region 294 of the maintenance substrate body 290, thus suppressing spillage of the cleaning liquid into the substrate holder 210.
[0037] <Maintenance Board Storage> Next, a maintenance board storage 280 for storing maintenance boards MWF will be described. Figure 6 is a diagram showing the configuration of a maintenance board storage according to one embodiment. Figure 6 shows a plan view and a side view of the maintenance board storage 280. The maintenance board storage 280 includes a stage 282 configured to hold the maintenance board MWF with the cleaning member 292 facing upward. The maintenance board storage 280 also includes a nozzle 289 positioned opposite the cleaning member 292 of the maintenance board MWF held on the stage 282 and configured to discharge cleaning liquid.
[0038] Furthermore, the maintenance board storage 280 includes a tank 284 for storing cleaning fluid, a pump 286 for pressurizing the cleaning fluid stored in the tank 284 to the nozzle 289, and a valve 288 for opening and closing the flow path of the cleaning fluid sent to the nozzle 289.
[0039] <Method for cleaning power supply contacts> Next, a method for cleaning the power supply contacts 243 using the maintenance board MWF will be described. Figure 7 is a flowchart of the method for cleaning the power supply contacts using the maintenance board. First, the transport device 900 sets an empty board holder 210 into the fixing module 200 (step 102). Next, the loader 140 takes out the maintenance board MWF from the maintenance board storage 280 (step 104).
[0040] Next, the loader 140 places the maintenance substrate MWF on the fixing module 200 (substrate holder 210) (step 106). Subsequently, the fixing module 200 clamps the maintenance substrate MWF with the substrate holder 210 (step 108) and presses the tip of the power supply contact 243 against the cleaning member 292 of the maintenance substrate MWF (step 110). This cleans the power supply contact 243.
[0041] The fixing module 200 waits in a clamped state for a preset cleaning time (step 112). Once the preset cleaning time has elapsed, the fixing module 200 unclams the substrate holder 210 (step 114).
[0042] Next, the loader 140 removes the maintenance board MWF from the fixing module 200 (board holder 210) (step 116). Then, the loader 140 places the maintenance board MWF into the maintenance board storage 280 (step 118).
[0043] Meanwhile, the fixing module 200 semi-clamps the substrate holder 210 (step 120). Next, the transport device 900 transports the substrate holder 210 to the holder cleaning module 320 (step 122). The holder cleaning module 320 cleans the substrate holder 210 and the power supply contact 243 with pure water (step 124). Next, the transport device 900 returns the substrate holder 210 to the stocker module 300 (step 126).
[0044] Figure 8 is a flowchart of a method for supplying a cleaning liquid to a maintenance substrate. In the cleaning liquid supply method of the present embodiment, first, the loader 140 places the maintenance substrate MWF that has been cleaned of the power supply contact 243 on the stage 282 (step 202). At this time, the loader 140 places the maintenance substrate MWF on the stage 282 with the cleaning member 292 facing upward. Subsequently, the maintenance substrate storage 280 raises the stage 282 (step 204).
[0045] Subsequently, the maintenance substrate storage 280 opens the valve 288 (step 206) and starts the pump 286 (step 208). As a result, the cleaning liquid is supplied to the cleaning member 292. When the preset supply time has elapsed, the maintenance substrate storage 280 stops the pump 286 (step 210) and closes the valve 288 (step 212). Subsequently, the maintenance substrate storage 280 lowers the stage 282 (step 214). Subsequently, the loader 140 removes the maintenance substrate MWF placed on the stage 282 for cleaning the power supply contact 243 (step 216). By the above steps, it is possible to wash away foreign substances adhering to the cleaning member 292 with respect to the maintenance substrate MWF after cleaning the power supply contact 243, and to hold the cleaning liquid in the cleaning member 292 for the next cleaning of the maintenance substrate MWF.
[0046] In the above embodiment, an example has been described in which an acidic solution is supplied as the cleaning liquid to the cleaning member 292 to remove oxides of the power supply contact 243 and the power supply contact 243 is cleaned with pure water in the holder cleaning module 320, but the present invention is not limited to this. Hereinafter, this point will be described.
[0047] FIG. 9 is a diagram showing the configuration of a maintenance substrate storage according to an embodiment. As shown in FIG. 9, the stage 282 includes a first stage 282-1 and a second stage 282-2. The nozzle 289 includes a first nozzle 289-1 that is disposed to face a cleaning member 292 of a maintenance substrate MWF held on the first stage 282-1 and is configured to discharge an acidic solution as a cleaning liquid. Further, the nozzle 289 includes a second nozzle 289-2 that is disposed to face a cleaning member 292 of a maintenance substrate MWF held on the second stage 282-2 and is configured to discharge pure water as a cleaning liquid.
[0048] According to the maintenance substrate storage 280 of the present embodiment, after cleaning oxides or the like of the power supply contact 243 using the maintenance substrate MWF holding the acidic solution in the cleaning member 292, the power supply contact 243 can be cleaned with pure water using the maintenance substrate MWF holding pure water in the cleaning member 292. Therefore, the step of transporting the substrate holder 210 to the holder cleaning module 320 for pure water cleaning can be omitted.
[0049] As described above, several embodiments of the present invention have been described. However, the above-described embodiments of the invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be changed and improved without departing from the gist thereof, and it is needless to say that equivalents thereof are included in the present invention. Also, any combination or omission of each component described in the claims and the specification is possible within the range that can solve at least a part of the above-described problems or exhibit at least a part of the effects.
[0050] As an embodiment, the present application discloses a maintenance substrate for cleaning a power supply contact of a plating apparatus, including a maintenance substrate body, and a cleaning member disposed in a contact area of the maintenance substrate body where the power supply contact contacts when the maintenance substrate body is clamped to a substrate holder having the power supply contact, the cleaning member being formed of an elastic body capable of holding a cleaning liquid.
[0051] Furthermore, the present application discloses a maintenance substrate in which, as one embodiment, the cleaning member has a length extending in the direction of arrangement of the plurality of power supply contacts and a width perpendicular to the length, and the width of the cleaning member is formed to be greater than the width of the contact area.
[0052] Furthermore, the present application discloses a maintenance substrate in which, as one embodiment, the cleaning member is arranged in the contact area such that the outer end of the cleaning member is located inside the outer end of the maintenance substrate body.
[0053] Furthermore, as one embodiment, the present application discloses a maintenance substrate in which the cleaning member is formed of a porous elastic body capable of holding a cleaning liquid.
[0054] Furthermore, the present application discloses a plating apparatus, as one embodiment, comprising: a maintenance substrate storage for storing maintenance substrates described in any of the above; a stocker module for storing substrate holders; a fixing module for attaching the maintenance substrates to the substrate holders and removing the maintenance substrates from the substrate holders; a loader for transporting the maintenance substrates between the maintenance substrate storage and the fixing module; and a transport device for transporting the substrate holders between the stocker module and the fixing module.
[0055] Furthermore, the present application discloses a plating apparatus in which, as one embodiment, the maintenance substrate storage includes a stage configured to hold the maintenance substrate with the cleaning member facing upward, and a nozzle positioned opposite the cleaning member of the maintenance substrate held on the stage and configured to discharge a cleaning solution.
[0056] Furthermore, the present application discloses a plating apparatus in which, as one embodiment, the stage includes a first stage and a second stage, and the nozzle includes a first nozzle positioned opposite the cleaning member of the maintenance substrate held on the first stage and configured to discharge an acidic solution, and a second nozzle positioned opposite the cleaning member of the maintenance substrate held on the second stage and configured to discharge pure water.
[0057] 140 Loader 200 Fixing module 210 Substrate holder 243 Power supply contact 243W Width of contact area 243a Contact area 280 Maintenance substrate storage 282 Stage 282-1 First stage 282-2 Second stage 289 Nozzle 289-1 First nozzle 289-2 Second nozzle 290 Maintenance substrate body 292 Cleaning member 292EG Outer end of cleaning member 292W Width of cleaning member 300 Stocker module 900 Conveying device 1000 Plating device MWF Maintenance substrate WEG Outer end of maintenance substrate body WF Substrate
Claims
1. A maintenance substrate for cleaning power supply contacts of a plating apparatus, comprising: a maintenance substrate body; and a cleaning member disposed in the contact area of the maintenance substrate body where the power supply contacts come into contact when the maintenance substrate body is clamped to a substrate holder having power supply contacts, the cleaning member being formed of an elastic body capable of holding a cleaning liquid.
2. The maintenance substrate according to claim 1, wherein the cleaning member has a length extending in the direction of the arrangement of the plurality of power supply contacts and a width perpendicular to the length, and the width of the cleaning member is formed to be greater than the width of the contact area.
3. The maintenance substrate according to claim 2, wherein the cleaning member is arranged in the contact area such that the outer end of the cleaning member is located inward from the outer end of the maintenance substrate body.
4. The maintenance substrate according to claim 3, wherein the cleaning member is formed of a porous elastic body capable of holding a cleaning liquid.
5. A plating apparatus comprising: a maintenance substrate storage for storing maintenance substrates according to any one of claims 1 to 4; a stocker module for storing substrate holders; a fixing module for attaching the maintenance substrates to the substrate holders and removing the maintenance substrates from the substrate holders; a loader for transporting the maintenance substrates between the maintenance substrate storage and the fixing module; and a transport device for transporting the substrate holders between the stocker module and the fixing module.
6. The plating apparatus according to claim 5, wherein the maintenance substrate storage comprises a stage configured to hold the maintenance substrate with the cleaning member facing upward, and a nozzle positioned opposite the cleaning member of the maintenance substrate held on the stage and configured to discharge a cleaning solution.
7. The plating apparatus according to claim 6, wherein the stage comprises a first stage and a second stage, and the nozzle comprises a first nozzle positioned opposite the cleaning member of the maintenance substrate held on the first stage and configured to discharge an acidic solution, and a second nozzle positioned opposite the cleaning member of the maintenance substrate held on the second stage and configured to discharge pure water.