Semiconductor manufacturing jig
The semiconductor manufacturing jig addresses the size challenge by using an expandable rod member and elastic member to align semiconductor elements and frames efficiently, reducing the jig's size and ensuring precise joining.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI ELECTRIC CORP
- Filing Date
- 2024-12-24
- Publication Date
- 2026-07-02
AI Technical Summary
Existing semiconductor manufacturing jigs face an issue of increased size due to the need for larger thermal expansion members to manage thermal expansion, which complicates the joining process of semiconductor elements and frames.
A semiconductor manufacturing jig with a main body, a rod member that expands along the substrate, and an elastic member that presses the substrate against the hole's wall upon heating, reducing the jig's size by minimizing misalignment and requiring less space.
The configuration allows for precise alignment and reduced size of the manufacturing jig while maintaining effective joining of semiconductor elements and frames, enhancing productivity and alignment accuracy.
Smart Images
Figure JP2024045750_02072026_PF_FP_ABST
Abstract
Description
Semiconductor manufacturing jig
[0001] The present disclosure relates to a semiconductor manufacturing jig.
[0002] When joining a semiconductor element and a frame by heating, a semiconductor manufacturing jig may be used to suppress displacement between the semiconductor element and the frame in a plan view. For example, in Patent Document 1, a semiconductor manufacturing jig is proposed in which thermal expansion members are provided at each of the upper, lower, left, and right positions surrounding a substrate provided with a semiconductor element, and the substrate is pressed from four directions by thermal expansion to suppress displacement.
[0003] Japanese Unexamined Patent Application Publication No. 2018-120972
[0004] Generally, in order to increase the change in the size of a thermal expansion member due to thermal expansion, it is necessary to increase the size of the thermal expansion member itself. For example, in order to increase the change in the size of a thermal expansion member made of aluminum due to thermal expansion at a temperature of 300°C to 0.5 mm, it is necessary to increase the size of the thermal expansion member itself to about 300 mm. However, when such thermal expansion members are provided at each of the upper, lower, left, and right positions surrounding the substrate, there is a problem that the size of the semiconductor manufacturing jig increases.
[0005] Therefore, the present disclosure has been made in view of the above problems, and an object thereof is to provide a technology capable of reducing the size of a semiconductor manufacturing jig.
[0006] The semiconductor manufacturing jig according to the present disclosure is a semiconductor manufacturing jig for joining a semiconductor element provided on a substrate and a frame by heating, and includes a main body larger than the substrate and provided with a hole capable of accommodating the substrate, a rod member extending along the substrate accommodated in the hole and provided on the main body so as to be expandable in the extending direction in response to the heating, and an elastic member connected to the rod member and extending in a direction different from the extending direction of the rod member. When the rod member expands in the extending direction by the heating, the elastic member presses the substrate to bring the substrate into contact with the side wall of the hole.
[0007] According to this disclosure, when a rod member extending along a substrate housed in a hole expands in the extending direction due to heating, an elastic member presses against the substrate, causing the substrate to come into contact with the side wall of the hole. With such a configuration, the size of the semiconductor manufacturing jig can be reduced.
[0008] The purpose, features, aspects, and advantages of this disclosure will become clearer from the following detailed description and accompanying drawings.
[0009] Figure 1 is a plan view showing the configuration of a semiconductor manufacturing jig according to Embodiment 1. Figure 2 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Embodiment 1. Figure 3 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Embodiment 1. Figure 4 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Embodiment 1. Figure 5 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Embodiment 1. Figure 6 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Modification 1. Figure 7 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Modification 2. Figure 8 is a plan view showing the configuration of a semiconductor manufacturing jig according to Modification 3. Figure 9 is a plan view showing a manufacturing process using the semiconductor manufacturing jig according to Modification 3.
[0010] The embodiments will be described below with reference to the attached drawings. The features described in each of the embodiments below are illustrative, and not all features are necessarily required. In addition, in the descriptions below, the same or similar reference numerals are used for similar components in multiple embodiments, and the different components are mainly described. Also, in the descriptions below, specific positions and directions such as "top," "bottom," "left," "right," "front," or "back" do not necessarily have to coincide with the positions and directions in actual implementation.
[0011] <Embodiment 1> Figure 1 is a plan view showing the configuration of a semiconductor manufacturing jig according to this embodiment 1, and Figure 2 is a plan view showing the configuration of Figure 1 with the frame 22 placed on top. The semiconductor manufacturing jig according to this embodiment 1 is a semiconductor manufacturing jig for joining a semiconductor element 21 provided on a substrate 23 and a frame 22 superimposed on the semiconductor element 21 in Figure 2 by heating. First, the components relating to the semiconductor element 21 and the frame 22 will be described below.
[0012] The semiconductor device 21 in Figure 1 is, for example, a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), an IGBT (Insulated Gate Bipolar Transistor), an RC-IGBT (Reverse Conducting-IGBT), an SBD (Schottky Barrier Diode), and a PND (PN junction diode). The semiconductor device 21 may be made of ordinary silicon (Si), or silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga ２ O ３ ), or it may be composed of a wide-bandgap semiconductor such as diamond. When the semiconductor element 21 is composed of a wide-bandgap semiconductor, stable operation of the semiconductor element 21 at high temperatures and high voltages, and faster switching speeds become possible.
[0013] The semiconductor element 21 is provided on the substrate 23. For example, the substrate 23 is a rectangular insulating substrate made of ceramic, and the semiconductor element 21 is connected to the upper surface of the substrate 23 by a die bond or the like. In this embodiment 1, the outline of the substrate 23 in plan view includes a first side 23a and a second side 23b that form an angle. In the example in Figure 1, the angle is approximately 90 degrees, but it is not limited to this.
[0014] The frame 22 in Figure 2 is made of a conductive material and is placed on the main body 1 in the state shown in Figure 2. For example, a bonding member, such as solder (not shown), is provided between the semiconductor element 21 and the frame 22, and the semiconductor element 21 and the frame 22 are joined by the bonding member when the bonding member is heated.
[0015] Next, the configuration of the semiconductor manufacturing jig shown in Figure 1 will be described. The semiconductor manufacturing jig shown in Figure 1 comprises a main body 1, a rod member 2, and a leaf spring 3.
[0016] The main body 1 is provided with a storage hole 1a. The storage hole 1a is larger than the substrate 23 and is a bottomed hole capable of housing the substrate 23. In this embodiment 1, the outline of the storage hole 1a in plan view includes the third side 1b and the fourth side 1c. The third side 1b and the fourth side 1c of the storage hole 1a correspond to the first side 23a and the second side 23b of the substrate 23, respectively, and the angle formed by the third side 1b and the fourth side 1c is approximately the same as the angle formed by the first side 23a and the second side 23b.
[0017] The size of the storage hole 1a is designed taking into account the size of the substrate 23 and the variation in the position of the substrate 23 when it is stored (i.e., the maximum outer diameter tolerance). To prevent the substrate 23 from coming into contact with the side wall of the storage hole 1a due to these variations, the substrate 23 is stored in the storage hole 1a with a margin of distance between the substrate 23 and the side wall of the storage hole 1a.
[0018] As shown in Figure 1, after the substrate 23 is housed in the storage hole 1a, as shown in Figure 2, when the frame 22 is placed on the main body 1 so as to cover the storage hole 1a, the portion of the frame 22 that overlaps with the semiconductor element 21 is misaligned with the semiconductor element 21. The semiconductor manufacturing jig according to this embodiment 1 is capable of suppressing the misalignment between the semiconductor element 21 and the frame 22, as will be explained below.
[0019] As shown in Figure 1, the rod member 2 extends along the substrate 23 housed in the storage hole 1a, and the rod member 2 according to this embodiment 1 includes a first rod member 2a and a second rod member 2b.
[0020] The first rod member 2a extends in the direction of extension of the rod member 2, and its side is connected to the leaf spring 3. The side of the rod member corresponds to the columnar side of the rod member. The second rod member 2b extends in the direction of extension of the rod member 2 and is connected to a part of the first rod member 2a on the side opposite to the side of the first rod member 2a connected to the leaf spring 3. The coefficient of thermal expansion of the second rod member 2b is greater than that of the main body 1 and the first rod member 2a.
[0021] In the example shown in Figure 1, one end 2b1 of the second rod member 2b is fixed to the main body 1. The other end 2b2 of the second rod member 2b is movable relative to the fixed end 2b1 and is connected to one end 2a1 of the first rod member 2a. The side of the first rod member 2a on the other end 2a2 side is movable relative to the fixed end 2b1 and is connected to the leaf spring 3.
[0022] The rod member 2 configured as described above is provided on the main body 1 so as to be expandable in the extending direction of the rod member 2 in response to heating that joins the semiconductor element 21 and the frame 22. Note that the configuration of the rod member 2 is not limited to the above configuration. For example, the rod member 2 may include a second rod member 2b without including a first rod member 2a, and the side of the second rod member 2b may be connected to the leaf spring 3. However, according to the configuration in which the rod member 2 has a folded shape as shown in Figure 1, the space required for the rod member 2 can be reduced, and the amount of movement of the other end 2b2 and the first rod member 2a due to the linear expansion of the second rod member 2b relative to the size of the second rod member 2b can be increased.
[0023] The leaf spring 3, which is an elastic member, is connected to the rod member 2 and extends in a direction different from the extending direction of the rod member 2. When the rod member 2 expands in the extending direction due to heating, the leaf spring 3 is configured to press against the substrate 23, causing the substrate 23 to come into contact with the side wall of the housing hole 1a. The extending direction of the leaf spring 3 may be oblique to the extending direction of the rod member 2, as shown in Figure 1, or it may be perpendicular. Furthermore, the elastic member is not limited to the leaf spring 3.
[0024] Next, a method for manufacturing a semiconductor device using the semiconductor manufacturing jig according to this embodiment 1 will be described.
[0025] First, as shown in Figure 1, the substrate 23 on which the semiconductor element 21 is provided is placed in the storage hole 1a, leaving a margin between the substrate 23 and the side wall of the storage hole 1a. Next, as shown in Figure 2, the frame 22 is placed on the main body 1 so as to cover the storage hole 1a.
[0026] Then, when heating is performed to join the semiconductor element 21 and the frame 22, the second rod member 2b expands significantly as shown by the arrow in Figure 3, but the first rod member 2a does not expand much. Therefore, the leaf spring 3 moves relative to the fixed end 2b1 of the second rod member 2b and the substrate 23 in the extending direction of the rod member 2, pressing the substrate 23 and causing it to come into contact with the side wall of the storage hole 1a. As an example, in this embodiment 1, when the rod member 2 expands due to heating, the leaf spring 3 causes the first side 23a and the second side 23b of the substrate 23 to come into contact with the third side 1b and the fourth side 1c of the storage hole 1a, respectively, thereby causing the substrate 23 to come into contact with the side wall of the storage hole 1a.
[0027] Furthermore, the temperature at which the leaf spring 3 brings the substrate 23 into contact with the side wall of the storage hole 1a is lower than the temperature at which the semiconductor element 21 and the frame 22 are joined. Therefore, the joining of the semiconductor element 21 and the frame 22 (for example, melting of the joining member) begins after the leaf spring 3 brings the substrate 23 into contact with the side wall. It is preferable that the joining of the semiconductor element 21 and the frame 22 begins immediately after the substrate 23 comes into contact with the side wall of the storage hole 1a.
[0028] Next, when heating is further performed to join the semiconductor element 21 and the frame 22, the temperature rises and the semiconductor element 21 and the frame 22 are joined. Figure 4 shows the state when the semiconductor element 21 and the frame 22 are joined. The second rod member 2b in Figure 4 is more expanded than the second rod member 2b in Figure 3, so the connection portion between the leaf spring 3 and the rod member 2 in Figure 4 has moved further in the extending direction of the rod member 2 than the connection portion in Figure 3. Even if the connection portion between the leaf spring 3 and the rod member 2 moves further in the extending direction of the rod member 2, the leaf spring 3 is capable of elastic deformation, so it is possible to suppress the pressure from the leaf spring 3 to the substrate 23 from becoming excessively large.
[0029] Then, as shown in Figure 5, cooling completes the bonding between the semiconductor element 21 and the frame 22 (for example, solidification of the bonding member). Due to the cooling, the second rod member 2b contracts, causing the leaf spring 3 to separate from the substrate 23 and return to the same position as in Figure 2.
[0030] <Summary of Embodiment 1> According to the semiconductor manufacturing jig of Embodiment 1 described above, when the rod member 2 expands in the extending direction due to heating for joining the semiconductor element 21 and the frame 22, the leaf spring 3 presses against the substrate 23, causing the substrate 23 to come into contact with the side wall of the storage hole 1a. With this configuration, by simply providing a linearly expandable rod member 2 on one side of the substrate 23, it is possible to suppress misalignment between the semiconductor element 21 and the frame 22 in at least one of the vertical and horizontal directions, thereby reducing the size of the semiconductor manufacturing jig. Furthermore, since the leaf spring 3 presses against the substrate 23 rather than the rod member 2, it is possible to suppress the pressure from the leaf spring 3 on the substrate 23 from becoming unnecessarily large.
[0031] Furthermore, in this embodiment 1, when the rod member 2 expands due to heating, the leaf spring 3 causes the first side 23a and the second side 23b of the substrate 23 to abut against the third side 1b and the fourth side 1c of the storage hole 1a, respectively, thereby causing the substrate 23 to abut against the side wall of the storage hole 1a. With this configuration, by simply providing a linearly expandable rod member 2 on one side of the substrate 23, it is possible to suppress positional misalignment between the semiconductor element 21 and the frame 22 in the vertical and horizontal directions, thereby reducing the size of the semiconductor manufacturing jig.
[0032] In this embodiment 1, the rod member 2 includes a first rod member 2a and a second rod member 2b connected to a part of the first rod member 2a, which has a larger coefficient of thermal expansion than the first rod member 2a. With this configuration in which the rod member 2 has a folded shape, the space required for the rod member 2 can be reduced, and the amount of movement of the other end 2b2 and the first rod member 2a due to the thermal expansion of the second rod member 2b can be increased relative to the size of the second rod member 2b.
[0033] <Modification 1> Figure 6 is a plan view showing the configuration of the semiconductor manufacturing jig according to Modification 1 with the frame 22 placed on it. The first substrate 23-1 and the second substrate 23-2 are the same as the substrate 23 of Embodiment 1. The storage hole 1a is capable of accommodating the first substrate 23-1 and the second substrate 23-2. Note that the portion of the storage hole 1a for accommodating the first substrate 23-1 and the portion of the storage hole 1a for accommodating the second substrate 23-2 may be separated from each other.
[0034] The rod member 2 is provided for each of the first substrate 23-1 and the second substrate 23-2, and the leaf spring 3 is provided for each of the first substrate 23-1 and the second substrate 23-2. With this configuration, the semiconductor elements 21 of multiple substrates 23 and the frame 22 can be joined together at once, thereby increasing productivity.
[0035] <Modification 2> Figure 7 is a plan view showing the configuration of the semiconductor manufacturing jig according to Modification 2 with the frame 22 placed on it. In Modification 2, the rod member 2 of Modification 1 is shared between the first substrate 23-1 and the second substrate 23-2. With this configuration, the number of parts in the semiconductor manufacturing jig can be reduced.
[0036] <Modification 3> Figure 8 is a plan view showing the configuration of the semiconductor manufacturing jig according to Modification 3. Figure 9 is a diagram showing the state when the semiconductor element 21 and the frame 22 are joined by the semiconductor manufacturing jig according to Modification 3. Note that the frame 22 is not shown in Figure 9 in order to avoid making the diagram too complex.
[0037] In this modified example 3, the leaf spring 3 includes a first leaf spring 3-1, which is a first elastic member, and a second leaf spring 3-2, which is a second elastic member. When the rod member 2 expands due to heating, the first leaf spring 3-1 presses the base plate 23 laterally, causing the first side 23a of the base plate 23 to come into contact with the third side 1b of the storage hole 1a. Also, when the rod member 2 expands due to heating, the tip of the second leaf spring 3-2 is pushed up vertically by a part of the main body 1, pressing the base plate 23 vertically, causing the second side 23b of the base plate 23 to come into contact with the fourth side 1c of the storage hole 1a. As a result, the first leaf spring 3-1 and the second leaf spring 3-2 bring the base plate 23 into contact with the side wall of the storage hole 1a. With this configuration, if the substrate 23 cannot be brought into close contact with the side wall of the storage hole 1a using only one leaf spring 3, the first leaf spring 3-1 and the second leaf spring 3-2 can be used to bring the substrate 23 into close contact with the side wall of the storage hole 1a.
[0038] In this disclosure in English, 'a' and 'an' mean one or more. Therefore, 'a', 'an', 'one or more', and 'at least one' can be used interchangeably.
[0039] Furthermore, it is possible to freely combine each embodiment and each variation, and to modify or omit each embodiment and each variation as appropriate.
[0040] The above explanation is illustrative and not limiting in all respects. It should be understood that countless variations not illustrated are conceivable.
[0041] 1 Main body, 1a Storage hole, 1b Third side, 1c Fourth side, 2 Rod members, 2a First rod member, 2b Second rod member, 3 Leaf springs, 3-1 First leaf spring, 3-2 Second leaf spring, 21 Semiconductor element, 22 Frame, 23 Substrate, 23a First side, 23b Second side, 23-1 First substrate, 23-2 Second substrate.
Claims
1. A semiconductor manufacturing jig for joining a semiconductor element provided on a substrate and a frame by heating, comprising: a main body larger than the substrate and provided with a hole capable of housing the substrate; a rod member provided on the main body that extends along the substrate housed in the hole and is expandable in the extending direction in response to heating; and an elastic member connected to the rod member and extending in a direction different from the extending direction of the rod member, wherein when the rod member expands in the extending direction due to heating, the elastic member presses the substrate and brings the substrate into contact with the side wall of the hole.
2. A semiconductor manufacturing jig according to claim 1, wherein the rod member includes a first rod member extending in the extending direction and having a side portion connected to the elastic member, and a second rod member extending in the extending direction and having a part of the first rod member on the side opposite to the side portion, and having a larger coefficient of linear expansion than the first rod member.
3. A semiconductor manufacturing jig according to claim 1 or claim 2, wherein the holes are capable of housing a first substrate and a second substrate, each of which is the substrate, the rod member is provided for each of the first substrate and the second substrate, and the elastic member is provided for each of the first substrate and the second substrate.
4. A semiconductor manufacturing jig according to claim 1 or claim 2, wherein the holes are capable of accommodating a first substrate and a second substrate, each of which is the substrate; the rod member is shared by the first substrate and the second substrate; and the elastic member is provided for each of the first substrate and the second substrate.
5. A semiconductor manufacturing jig according to any one of claims 1 to 4, wherein the outline of the substrate in a plan view includes a first side and a second side that form an angle, the outline of the hole in a plan view includes a third side and a fourth side corresponding to the first side and the second side, respectively, and when the rod member expands due to heating, the elastic member brings the first side and the second side into contact with the third side and the fourth side, respectively, thereby bringing the substrate into contact with the side wall of the hole.
6. A semiconductor manufacturing jig according to any one of claims 1 to 4, wherein the outline of the substrate in a plan view includes a first side and a second side that form an angle, the outline of the hole in a plan view includes a third side and a fourth side corresponding to the first side and the second side, respectively, the elastic member includes a first elastic member and a second elastic member, and when the rod member expands due to heating, the first elastic member causes the first side to abut against the third side, and the second elastic member causes the second side to abut against the fourth side, thereby causing the substrate to abut against the side wall of the hole.
7. A semiconductor manufacturing jig according to any one of claims 1 to 6, wherein the temperature at which the elastic member brings the substrate into contact with the side wall of the hole is lower than the temperature at which the semiconductor element and the frame are joined.