Processing device and processing method

WO2026140448A1PCT designated stage Publication Date: 2026-07-02NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
NITTO DENKO CORP
Filing Date
2025-10-20
Publication Date
2026-07-02

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Abstract

A processing device (1A) includes a vacuum chamber (200), a heating part (Pm), a sputtering part (Ps), and conveyance parts (70). The heating part (Pm) and the sputtering part (Ps) are positioned inside the vacuum chamber (200). The heating part (Pm) heats an object (10) by irradiation with microwaves under a reduced-pressure atmosphere. The sputtering part (Ps) performs sputtering film formation on the object (10) under the reduced-pressure atmosphere. The conveyance parts (70) convey the object (10) to the heating part (Pm) and the sputtering part (Ps) in the stated order.
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