Probe pin unit
The probe pin unit with elastic and heat-insulating features addresses the challenge of maintaining contact and heat management in probe pins, ensuring consistent performance across varying electrode heights.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- OMRON CORP
- Filing Date
- 2025-11-17
- Publication Date
- 2026-07-02
Smart Images
Figure JP2025040058_02072026_PF_FP_ABST
Abstract
Description
Probe Pin Unit
[0001] The present invention relates to a probe pin unit including a plurality of probe pins used, for example, for conduction inspection of electronic components.
[0002] Generally, in the manufacturing process of an electronic component module, conduction inspection, operation characteristic inspection, etc. are performed. In these inspections, by using probe pins, the terminals for connecting to the main body substrate installed in the electronic component module and the terminals of the inspection device are connected. For example, Patent Document 1 discloses a probe pin including an elastic portion that can be elastically deformed along a first direction, a first contact portion to which one end of the elastic portion in the first direction is connected, and a second contact portion to which the other end of the elastic portion in the first direction is connected. The elastic portion has a first abutting portion that extends from the first contact portion along a second direction and constitutes one end of the elastic portion, and a second abutting portion that is disposed on the same side of the first contact portion and the second contact portion in the second direction and extends from the second contact portion along the second direction and constitutes the other end of the elastic portion. Each of the first abutting portion and the second abutting portion is configured to be able to abut against the inside of the socket in the first direction in a state of being accommodated in the socket.
[0003] Further, Patent Document 2 discloses an inspection socket for electronic equipment having a plurality of elastic pins in an insulator that becomes deformable from a fluid state to a solid state by solidification, with the central portions being buried and both ends protruding. Each tip portion of each elastic pin is a portion that is respectively received in a plurality of recesses provided in an inspection socket manufacturing device for electronic equipment, and the insulator is a portion that is formed by being solidified after being injected in a fluid state between both ends in a state where each end is received in each recess.
[0004] Japanese Patent Application Laid-Open No. 2020-201161 International Publication No. 2021 / 166949
[0005] However, the conventional probe pins described above have the following problems. Specifically, in the probe pins disclosed in the above publication, for example, if a material with low rigidity such as copper is used to make it non-magnetic, there is a risk that the required physical properties cannot be maintained. Furthermore, in order to ensure the required physical properties of the probe pin, it is possible to obtain the necessary strength by solidifying the resin injected in a fluid state, as described in Patent Document 2, but in such a configuration, if the height of the electrode side where the ends of multiple probe pins make contact is different, the solidified resin portion becomes integrated, and there is a problem that the probe pins do not easily come into contact with each other with different expansion and contraction.
[0006] The object of the present invention is to provide a probe pin unit that can ensure contact with an electrode even when there is variation in the height of the electrode to which each probe pin contacts, in a unit structure that holds multiple probe pins.
[0007] (Means for solving the problem) The probe pin unit according to the first invention is a probe pin unit including a plurality of probe pins used for continuity testing performed by contacting electrodes of an electronic component, and comprises a plurality of probe pins and a holding member. The plurality of probe pins have an elastic portion that is elastically deformable and expandable in a first direction, a first contact portion located at the first end of the elastic portion in the first direction, a second contact portion located at the second end of the elastic portion opposite to the first end in the first direction, and a filling member provided between the elastic portions and made of a flexible material. The holding member independently holds each of the plurality of probe pins in a state in which the probe pins are expandable and contractible in the first direction.
[0008] Here, in a unit structure including multiple probe pins used for continuity testing performed by contacting electrodes of electronic components, the multiple probe pins, each having an elastic portion that elastically deforms in a first direction, are independently arranged in a state where they can extend and retract in the first direction. Here, the continuity testing performed using this probe pin unit is performed, for example, by bringing one end of the probe pin into contact with an electrode provided on an electronic component. The first direction refers to the direction in which the probe pin is brought into contact with the component being tested when performing continuity testing using the probe pin. The elastic portion of the probe pin is, for example, a portion that combines multiple curved portions and a straight portion substantially perpendicular to the first direction, and the elastic deformation of the curved portions causes the probe pin to extend and retract in the first direction.
[0009] As a result, in a holding member that holds multiple probe pins, each probe pin is held in a state where it can independently extend and retract in the first direction. Therefore, even if there are variations in the height of the electrodes of the various components to be tested for continuity, the test can be performed while ensuring contact with the electrodes. Consequently, in a unit structure that holds multiple probe pins, even if there are variations in the height of the electrodes that each probe pin contacts, the contact state with the electrodes can be ensured.
[0010] The probe pin unit according to the second invention is the same as the probe pin unit according to the first invention, wherein the plurality of probe pins are arranged in the holding member such that an insulating layer is provided between adjacent probe pins. As a result, the transfer of heat generated in the plurality of probe pins held by the holding member is blocked by the insulating layer, thereby preventing the heat from affecting adjacent probe pins.
[0011] The probe pin unit according to the third invention is the probe pin unit according to the second invention, wherein the heat insulating layer is made of a material with a lower thermal conductivity than the probe pins. As a result, the transfer of heat generated in the multiple probe pins held by the holding member is blocked by the heat insulating layer made of a material with a lower thermal conductivity than the probe pins, thereby preventing the heat from affecting adjacent probe pins.
[0012] The probe pin unit according to the fourth invention is the probe pin unit according to the second invention, wherein the heat insulating layer is an air layer. As a result, the transfer of heat generated in the multiple probe pins held by the holding member is blocked by the air layer, thereby preventing the heat from affecting adjacent probe pins.
[0013] The probe pin unit according to the fifth invention is the probe pin unit according to the second invention, wherein the heat insulating layer is formed from a foamed material. As a result, the transfer of heat generated in the multiple probe pins held by the holding member is blocked by the heat insulating layer formed from the foamed material, thereby preventing the heat from affecting adjacent probe pins.
[0014] The probe pin unit according to the sixth invention is the probe pin unit according to the first invention, further comprising an insulating layer provided between adjacent probe pins in the holding member. As a result, the multiple probe pins held by the holding member are electrically isolated from adjacent probe pins, thereby preventing the influence of current flowing through adjacent probe pins from affecting them.
[0015] The probe pin unit according to the seventh invention is a probe pin unit according to the first invention, further comprising a heat dissipation layer in the holding member, which is provided between adjacent probe pins and releases heat generated in the probe pins. As a result, the heat generated in the multiple probe pins held by the holding member is released to the outside through the heat dissipation layer, thereby preventing the heat from affecting adjacent probe pins. In addition, the heat dissipation layer also provides an electromagnetic shielding effect for the probe pins.
[0016] The probe pin unit according to the eighth invention is the probe pin unit according to the seventh invention, wherein the heat dissipation layer is formed from a material with a higher thermal conductivity than the probe pins. As a result, the heat transfer generated in the multiple probe pins held by the holding member is promoted by the heat dissipation layer, which has a higher thermal conductivity than the probe pins, thereby preventing the heat from affecting adjacent probe pins.
[0017] The probe pin unit according to the ninth invention is a probe pin unit according to any one of the first to eighth inventions, wherein the filling member is a resin having elastic properties. This makes it possible to reinforce the elastically deformable elastic portion of the probe pin with the elastic resin of the filling member.
[0018] The probe pin unit according to the tenth invention is the probe pin unit according to the ninth invention, wherein the resin is silicone, urethane, a hot-melt material, or a rubber-based material. This makes it possible to construct the filler member using inexpensive materials such as silicone or urethane.
[0019] The probe pin unit according to the 11th invention is a probe pin unit according to the 9th invention, wherein the filling member contains a material with a higher thermal conductivity than the probe pin. This allows for the effective dissipation of heat generated in the probe pin to the outside by adding a highly thermally conductive carbon-based (graphite, carbon nanotubes, graphene) or ceramic-based (alumina, aluminum nitride, boron nitride) filler to a filling member such as silicone or urethane resin. While using a carbon-based material in the filling member results in high thermal conductivity, it also imparts electrical conductivity. Therefore, it is more preferable to use ceramic-based materials such as alumina, aluminum nitride, or boron nitride.
[0020] The probe pin unit according to the twelfth invention is a probe pin unit according to any one of the first to eighth inventions, wherein the material of the probe pin is a non-magnetic material. By using a non-magnetic material, it is possible to construct a probe pin that is less susceptible to the effects of magnetic force while maintaining the rigidity required for a probe pin.
[0021] The probe pin unit according to the 13th invention is the probe pin unit according to the 12th invention, wherein the material of the probe pin is nickel-phosphorus, copper, or a copper alloy. This makes it possible to construct an inexpensive probe pin that is less susceptible to magnetic fields by using a non-magnetic material such as copper or a copper alloy.
[0022] The probe pin unit according to the 14th invention is a probe pin unit according to any one of the first to eighth inventions, wherein the holding member has an insertion hole into which a probe pin is inserted. As a result, by inserting a plurality of probe pins into the insertion holes provided in the holding member, a unit configuration can be easily made in which each probe pin can extend and retract in a first direction.
[0023] The probe pin unit according to the 15th invention is the probe pin unit according to the 14th invention, wherein the holding member further has a support portion that supports the lower end of the elastic portion of the probe pin inserted through the insertion hole. By supporting the lower end of the elastic portion of the probe pin with the support portion of the holding member, a unit configuration can be made in which the probe pin can extend and retract in a first direction when performing a continuity test.
[0024] (Effects of the Invention) According to the probe pin unit of the present invention, in a unit structure holding a plurality of probe pins, even if there is variation in the height of the electrode that each probe pin contacts, it is possible to ensure contact with the electrode.
[0025] Figure 1 shows an overall perspective view of the probe pin unit according to one embodiment of the present invention. Figure 2 shows a perspective view of the multiple probe pins included in the probe pin unit of Figure 1 being inserted into the case. Figure 3 shows an enlarged top view of a part of the case in which the probe pin unit of Figure 1 is held. Figure 4 shows a cross-sectional view of the probe pins inserted into the holding holes of the case included in the probe pin unit of Figure 1 in a retractable state. Figure 4 shows a front view of the probe pin configuration. Figure 4 shows a graph showing the relationship between resin hardness and spring constant when the filling resin is changed for beryllium copper probe pins. Figure 4 shows a graph showing the relationship between resin hardness and spring constant when the filling resin is changed for pure copper probe pins.
[0026] A probe pin unit 1 according to one embodiment of the present invention will be described below with reference to Figures 1 to 7. In this embodiment, unnecessary detailed explanations may be omitted. For example, detailed explanations of already well-known matters and redundant explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily verbose and to facilitate understanding by those skilled in the art. Furthermore, the applicant provides the accompanying drawings and the following explanation so that those skilled in the art can fully understand the present invention, and does not intend to limit the subject matter described in the claims by means of these.
[0027] (1) Configuration of the probe pin unit 1 The probe pin unit 1 according to this embodiment is used for continuity testing, for example, by bringing the first end of the probe pin 10 into contact with an electronic component such as a semiconductor, IC (Integrated Circuit), or COMS (Complementary Metal Oxide Semiconductor). As shown in Figure 1, the probe pin unit 1 comprises a plurality of probe pins 10 and a case portion (holding member) 20 that holds the plurality of probe pins 10.
[0028] The multiple probe pins 10 are thin, plate-like members formed, for example, from a non-magnetic material such as copper by electroforming, and are held in an inserted state in insertion holes 21 provided in the case portion 20, as shown in Figure 1. The probe pins 10 also have filling members 11 made of a flexible material provided between the elastic portions 10a, which will be described later, as shown in Figure 2.
[0029] The detailed configuration of the probe pins 10 will be described in detail later. The case portion 20 is formed of, for example, LCP (Liquid Crystal Polymer), and as shown in Figure 1, is a substantially rectangular parallelepiped member that independently holds multiple probe pins 10 in a state where they can extend and retract in the vertical direction (first direction) in the figure. More specifically, as shown in Figures 2 and 3, the case portion 20 has a substantially rectangular parallelepiped main body portion 20a, an insertion hole 21 formed on the upper surface of the main body portion 20a, and a support portion 20b (see Figure 4) provided near the bottom of the insertion hole 21.
[0030] As a result, the probe pin 10 inserted through the insertion hole 21 is supported from below by the support portion 20b that supports the lower end of the elastic portion 10a. Furthermore, as shown in Figure 3, an air layer 22 is formed around the probe pin 10 inserted into the insertion hole 21 of the case portion 20, between it and adjacent probe pins 10. As a result, when a continuity test is performed, the heat generated in the probe pin 10 is blocked by the air layer 22, preventing it from affecting adjacent probe pins 10. The case portion 20 is required to have dimensional accuracy and durability, and preferably has insulating properties to avoid electrical conductivity between multiple probe pins 10. It is even more preferable that it is formed of a material with heat-shielding or heat-dissipating properties.
[0031] (2) Configuration of the probe pins 10 As shown in Figure 4, the probe pins 10 according to this embodiment are held in a state in which they can be extended and retracted in the direction of the arrows in the figure (up and down direction, first direction), and are inserted into insertion holes 21 formed on the upper surface of the main body portion 20a of the case portion 20.
[0032] As shown in Figure 4, the probe pin 10 has an elastic portion 10a, a first end (first contact portion) 10b, a second end (second contact portion) 10c, and a filling member 11. As shown in Figure 4, the elastic portion 10a is the part that elastically deforms in the vertical direction in the figure, and is made of a non-magnetic material such as copper. The elastic portion 10a has a meandering shape in which curved portions and straight portions are arranged alternately in a continuous manner, and it elastically deforms and expands and contracts in the vertical direction (first direction).
[0033] The first end (first contact portion) 10b is located at one end (upper end in the figure) of the elastic portion 10a in the vertical direction. As shown in Figure 2, the first end 10b is positioned to protrude from the upper surface of the main body portion 20a when the probe pin 10 is inserted into the insertion hole 21 of the case portion 20. The second end (second contact portion) 10c is located at the other end (lower end in the figure) of the elastic portion 10a in the vertical direction. The second end 10c is positioned to protrude from the lower surface of the main body portion 20a when the probe pin 10 is inserted into the insertion hole 21 of the case portion 20.
[0034] The filling member 11 is molded from an elastic resin such as silicone, for example, and is provided around the elastic portion 10a. More specifically, as shown in Figure 5, the filling member 11 is formed to fill the area where stress tends to concentrate when the probe pin 10 is squeezed from above and below (between the multiple curved portions and straight portions that make up the elastic portion 10a). This ensures that the necessary spring characteristics for the probe pin 10 can be sufficiently secured, regardless of the material of the probe pin 10.
[0035] Furthermore, the filler member 11 may be integrally molded with the probe pin during the molding process. This facilitates the replacement of the probe pin and prevents accidental plastic deformation. Additionally, the physical properties of the probe pin 10 can be changed by changing the type of resin according to the required physical properties.
[0036] Furthermore, since the filling members 11 are separately provided around the elastic portion 10a of the multiple probe pins 10, distortion of the probe pins 10 due to the filling members 11 can be minimized. When performing a continuity test, the probe pins 10 are elastically deformed in the vertical direction (first direction) while sandwiched between the substrate electrode 31 and the DUT (Duty Under Test) 32, as shown in Figure 4.
[0037] As a result, even when the probe pin 10 is molded using a non-magnetic material such as copper that does not have sufficient rigidity, the necessary rigidity for the probe pin 10 can be ensured by reinforcing the elastic portion 10a with a filler member 11 such as silicone. Furthermore, in the probe pin unit 1 of this embodiment, as described above, the multiple probe pins 10 held in the case portion 20 are independently arranged within the insertion hole 21 in a state that allows them to expand and contract vertically.
[0038] This ensures contact between the substrate electrode 31 and the DUT 32 even when there are variations in the distance between the substrate electrode 31 and the DUT 32 when conducting continuity tests on multiple DUTs 32 simultaneously. Furthermore, since multiple probe pins 10 are held in a detachable state in the case portion 20, repairability can be improved by replacing only the faulty probe pin 10 each time a malfunction occurs in one of the probe pins 10.
[0039] <Spring Constants for Each Material of Filling Member 11> In this embodiment, when the type of resin used for the filling member 11 surrounding the elastic portion 10a of the probe pin 10 is changed, the spring constant of the probe pin 10 changes according to the hardness (Shore A hardness) of each resin used as the filling member 11, as shown in Figure 6. Specifically, for example, in the case of a probe pin 10 molded from beryllium copper, when silicone KE1316 (Shin-Etsu Chemical Co., Ltd.) is used as the filling member 11, the hardness is low (approximately 23), and there is almost no change in the spring constant (approximately 550 N / m) compared to when there is no filling member 11.
[0040] Next, when urethane EF568 (Daiichi Kogyo Seiyaku Co., Ltd.) was used as the filler material 11, the spring constant increased from approximately 550 N / m to approximately 800 N / m as the hardness (Shore A) increased (from approximately 23 to approximately 44). Next, when silicone KE17 (Shin-Etsu Chemical Co., Ltd.) was used as the filler material 11, the spring constant increased from approximately 800 N / m to approximately 900 N / m as the hardness (Shore A) increased (from approximately 44 to approximately 50).
[0041] Next, when urethane EF703 (Daiichi Kogyo Seiyaku Co., Ltd.) was used as the filler material 11, the spring constant increased from approximately 900 N / m to approximately 1800 N / m as the hardness (Shore A) increased (from approximately 50 to approximately 82). Next, when silicone KE26 (Shin-Etsu Chemical Co., Ltd.) was used as the filler material 11, the spring constant increased from approximately 1800 N / m to approximately 2200 N / m as the hardness (Shore A) increased (from approximately 82 to approximately 88).
[0042] Similarly, for example, in the case of a probe pin 10 molded from pure copper, changing the type of resin used for the filler material 11 around the elastic portion 10a changes the spring constant of the probe pin 10 according to the hardness (Shore A hardness) of each resin used as the filler material 11, as shown in Figure 7. Although a direct comparison between the graphs shown in Figure 6 and Figure 7 is not possible due to the different shapes of the probe pins 10, it was found that the effect of adding the filler material 11 to the elastic portion 10a can be obtained regardless of whether the material is beryllium copper or pure copper.
[0043] Specifically, for a probe pin 10 molded from pure copper, as shown in Figure 7, when silicone KE1316 (Shin-Etsu Chemical Co., Ltd.) was used as the filler material 11, the spring constant increased from approximately 3100 N / m to approximately 3700 N / m compared to the case without filler. Next, when urethane EF568 (Daiichi Kogyo Seiyaku Co., Ltd.) was used as the filler material 11, the spring constant increased from approximately 3700 N / m to approximately 4000 N / m as the hardness (Shore A) increased (from approximately 23 to approximately 48).
[0044] Next, when silicone KE26 (Shin-Etsu Chemical Co., Ltd.) was used as the filling member 11, as the hardness (Shore A) increased (from about 48 to about 86), the spring constant increased from about 4000 N / m to about 4800 N / m. As described above, by changing the material of the filling member 11 of the probe pin 10, the probe pin 10 having the required physical properties can be formed. In particular, for the probe pin 10 made of pure copper (non-magnetic material) with low rigidity of the material itself, the filling member 11 provided around the elastic portion 10a can provide a probe pin 10 having the hardness and spring constant required for a general probe pin 10.
[0045] <Major features> The probe pin unit 1 of the present embodiment includes a plurality of probe pins 10 used for a conduction test performed by contacting a substrate electrode 31, and a case portion 20. The plurality of probe pins 10 include an elastic portion 10a that can elastically deform and expand and contract in the first direction, a first end portion 10b disposed at a first end of the elastic portion 10a in the first direction, and a second end portion 10c disposed at a second end of the elastic portion 10a opposite to the first end in the first direction, and a filling member 11 provided between the elastic portions 10a and formed of a flexible material. The case portion 20 holds the plurality of probe pins 10 independently in a state where the probe pins 10 can expand and contract in the first direction.
[0046] Thereby, in the case portion 20 that holds the plurality of probe pins 10, since each probe pin 10 is held in a state where it can independently expand and contract in the first direction, even when there is a variation in the height of the electrodes of various components to be subjected to the conduction test, the test can be carried out while ensuring contact with the electrodes. As a result, in the unit structure in which the plurality of probe pins 10 are held, even when there is a variation in the height of the electrodes with which each probe pin 10 abuts, the contact state with the electrodes can be ensured.
[0047] [Other Embodiments] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the gist of the invention. (A) In the above embodiment, an example has been described in which a plurality of probe pins 10 are held in a case portion 20 in which a plurality of insertion holes 21 are formed on the upper surface of the main body portion 20a. However, the present invention is not limited to this. For example, the form in which a plurality of probe pins are held in the case portion (holding member) is not limited to the configuration inserted from the insertion holes formed on the upper surface, and may be a configuration in which they are held in a state of being inserted from a gap formed on the side surface or the lower surface.
[0048] (B) In the above embodiment, an example has been described in which an air layer 22 is formed between adjacent probe pins 10 among the plurality of probe pins 10 held in the case portion 20. However, the present invention is not limited to this. For example, instead of the air layer, a unit configuration provided with a member such as rubber as an insulating layer that blocks the voltage applied to the probe pins may be used.
[0049] (C) In the above embodiment, an example has been described in which an air layer 22 is formed between adjacent probe pins 10 among the plurality of probe pins 10 held in the case portion 20. However, the present invention is not limited to this. For example, instead of the air layer, a unit configuration provided with a thin film made of metal or the like as a heat dissipation layer that releases the heat generated in the probe pins to the outside may be used.
[0050] (D) In the above embodiment, an example has been described in which an air layer 22 as a heat insulating layer is formed between adjacent probe pins 10 among the plurality of probe pins 10 held in the case portion 20. However, the present invention is not limited to this. For example, instead of the air layer, a unit configuration using a heat insulating layer formed of a material having a lower thermal conductivity than the probe pins, such as a foamed material such as polyethylene foam, polyurethane foam, or phenol foam, or an inorganic material such as glass wool, foamed glass, or aerogel, may be used.
[0051] (E) In the above embodiment, an example was given in which silicone was used as the elastic filler provided between the elastic portions 10a of the probe pin 10. However, the present invention is not limited thereto. For example, instead of silicone, other resins or rubber-based materials such as urethane, hot melt resins, or thermoplastic elastomers may be used as the filler.
[0052] (F) In the above embodiment, an example was given in which silicone was used as the elastic filling member provided between the elastic portions 10a of the probe pin 10. However, the present invention is not limited thereto.
[0053] For example, a filler with good thermal conductivity, such as a carbon-based (graphite, carbon nanotube, graphene) or ceramic-based (alumina, aluminum nitride, boron nitride) filler, may be added to a filler material such as silicone. However, when using a carbon-based additive, although it increases thermal conductivity, it also imparts electrical conductivity, so it is more preferable to use ceramic-based alumina, aluminum nitride, boron nitride, etc.
[0054] (G) In the above embodiment, a probe pin 10 formed from a non-magnetic material, copper, was described as an example. However, the present invention is not limited thereto. For example, instead of copper, the probe pin may be formed from Ni-based materials such as NiP (nickel phosphorus), NiW (nickel tungsten), NiPd (nickel palladium), or other metals such as copper alloys, gold, platinum, silver, or copper-silver alloys.
[0055] <Note> The probe pin unit according to the first invention is a probe pin unit including a plurality of probe pins used for continuity testing performed by contacting electrodes of an electronic component, comprising: a plurality of probe pins having an elastic portion that is elastically deformable and expandable in a first direction; a first contact portion disposed at the first end of the elastic portion in the first direction; a second contact portion disposed at the second end of the elastic portion opposite to the first end in the first direction; and a filling member provided around the elastic portion and made of a flexible material; and a holding member that independently holds each of the plurality of probe pins while the probe pins are in a state where they are expandable and contractible in the first direction.
[0056] The probe pin unit according to the second invention is the probe pin unit according to the first invention, wherein the plurality of probe pins are arranged in the holding member such that a heat insulating layer is provided between adjacent probe pins. The probe pin unit according to the third invention is the probe pin unit according to the second invention, wherein the heat insulating layer is formed of a material with a lower thermal conductivity than the probe pins.
[0057] The probe pin unit according to the fourth invention is a probe pin unit according to any one of the second inventions, wherein the heat insulating layer is an air layer. The probe pin unit according to the fifth invention is a probe pin unit according to the second invention, wherein the heat insulating layer is molded from a foamed material.
[0058] The probe pin unit according to the sixth invention is a probe pin unit according to any one of the first to fifth inventions, further comprising an insulating layer provided between adjacent probe pins in the holding member. The probe pin unit according to the seventh invention is a probe pin unit according to any one of the second inventions, further comprising a heat dissipation layer provided between adjacent probe pins in the holding member, which releases heat generated on the probe pins.
[0059] The probe pin unit according to the eighth invention is the probe pin unit according to the seventh invention, wherein the heat dissipation layer is molded from a material with a higher thermal conductivity than the probe pin. The probe pin unit according to the ninth invention is the probe pin unit according to any one of the first to eighth inventions, wherein the filling member is a resin with elastic properties.
[0060] The probe pin unit according to the tenth invention is the probe pin unit according to the ninth invention, wherein the resin is silicone, urethane, a hot melt material, or a rubber-based material. The probe pin unit according to the eleventh invention is the probe pin unit according to the ninth or tenth invention, wherein the filling member includes a material with a higher thermal conductivity than the probe pin.
[0061] The probe pin unit according to the twelfth invention is a probe pin unit according to any one of the first to eleventh inventions, wherein the material of the probe pin is a non-magnetic material. The probe pin unit according to the thirteenth invention is a probe pin unit according to the twelfth invention, wherein the material of the probe pin is nickel-phosphorus, copper, or a copper alloy.
[0062] The probe pin unit according to the 14th invention is a probe pin unit according to any one of the 1st to 13th inventions, wherein the holding member has an insertion hole into which the probe pin is inserted. The probe pin unit according to the 15th invention is a probe pin unit according to the 14th invention, wherein the holding member further has a support portion that supports the lower end of the elastic portion of the probe pin inserted through the insertion hole.
[0063] The probe pin unit of the present invention has the effect of ensuring contact with the electrode even when there is variation in the height of the electrode that each probe pin contacts, in a unit structure that holds multiple probe pins. Therefore, it can be widely applied to units containing probe pins used in various inspections.
[0064] 1 Probe pin unit 10 Probe pin 10a Elastic part 10b First end (first contact part) 10c Second end (second contact part) 11 Filling member 20 Case part (holding member) 20a Main body part 20b Support part 21 Insertion hole 22 Air layer 31 Substrate electrode 32 DUT (Duty-Under-Test Part)
Claims
1. A probe pin unit for use in continuity testing performed by contacting electrodes of an electronic component, comprising: a plurality of probe pins having an elastic portion that is elastically deformable and expandable in a first direction; a first contact portion located at the first end of the elastic portion in the first direction; a second contact portion located at the second end of the elastic portion opposite to the first end in the first direction; and a filling member provided around the elastic portion and made of a flexible material; and a holding member that independently holds each of the plurality of probe pins while the probe pins are in a state where they are expandable and contractible in the first direction.
2. The probe pin unit according to claim 1, wherein the plurality of probe pins are arranged in the holding member such that a heat insulating layer is provided between adjacent probe pins.
3. The probe pin unit according to claim 2, wherein the heat insulating layer is formed of a material with a lower thermal conductivity than the probe pin.
4. The probe pin unit according to claim 2, wherein the heat insulating layer is an air layer.
5. The probe pin unit according to claim 2, wherein the heat insulating layer is formed from a foamed material.
6. The probe pin unit according to claim 1, further comprising an insulating layer provided between adjacent probe pins in the holding member.
7. The probe pin unit according to claim 1, further comprising a heat dissipation layer provided between adjacent probe pins in the holding member for releasing heat generated in the probe pins.
8. The probe pin unit according to claim 7, wherein the heat dissipation layer is formed from a material with a higher thermal conductivity than the probe pin.
9. The probe pin unit according to any one of claims 1 to 8, wherein the filling member is a resin having elastic properties.
10. The probe pin unit according to claim 9, wherein the resin is silicone, urethane, a hot melt material, or a rubber material.
11. The probe pin unit according to claim 9, wherein the filling member comprises a material with a higher thermal conductivity than the probe pin.
12. The probe pin unit according to any one of claims 1 to 8, wherein the material of the probe pin is a non-magnetic material.
13. The probe pin unit according to claim 12, wherein the material of the probe pin is nickel-phosphorus, copper, or a copper alloy.
14. The probe pin unit according to any one of claims 1 to 8, wherein the holding member has an insertion hole into which the probe pin is inserted.
15. The probe pin unit according to claim 14, wherein the holding member further has a support portion that supports the lower end of the elastic portion of the probe pin inserted through the insertion hole.