Capacitive sensor

Abstract

Provided is a capacitive sensor capable of suppressing short circuit defects when cutting a laminated electrode body.　In a capacitive sensor (1), a capacitance part (60) is formed by a first electrode body (10), a second electrode body (20), and a dielectric layer laminated between the first electrode body (10) and the second electrode body (20), a plurality of capacitance parts (60) are formed, a connection region (70) for connecting the capacitance parts (60) by the first electrode body (10) and the second electrode body (20) is provided between each of the capacitance parts (60), and in each connection region (70), the first electrode body (10) and the second electrode body (20) are formed so as not to overlap in the lamination direction.

Description

Capacitive sensor

[0001] The present invention relates to a capacitive sensor.

[0002] As a sensor for detecting expansion / contraction, bending, and distortion applied to a detection object, a capacitive sensor is known. A capacitive sensor includes a capacitance unit obtained by laminating a pair of electrode layers on both surfaces of a dielectric layer. The capacitive sensor detects a change in capacitance caused by expansion / contraction, bending, and distortion occurring in the detection object in the capacitance unit (see, for example, Patent Documents 1 and 2).

[0003] Japanese Patent Application Laid-Open No. 2023-3244, Japanese Patent Application Laid-Open No. 2018-96797

[0004] By the way, in a conventional capacitive sensor, when adjusting the length by cutting the capacitance unit according to the size of the measurement object, the distance between the electrode bodies laminated by stress becomes shorter, and there is a possibility of contact and short-circuit failure.

[0005] The present invention takes the above problems as an example, and an object thereof is to provide a capacitive sensor capable of suppressing short-circuit failure when cutting a laminated electrode body.

[0006] In order to achieve the above object, a capacitive sensor according to the present invention includes a first electrode body, a second electrode body, and a dielectric layer laminated between the first electrode body and the second electrode body, and a capacitance unit is formed by these. A plurality of the capacitance units are formed, and between each of the capacitance units, there is a connection region that connects each of the capacitance units by the first electrode body and the second electrode body. In the connection region, the first electrode body and the second electrode body are formed so as not to overlap in the lamination direction.

[0007] In the capacitive sensor according to one aspect of the present invention, the dielectric layer is not disposed in the connection region.

[0008] In the capacitive sensor according to one aspect of the present invention, in the connection region, the first electrode body and the second electrode body are disposed on the same plane.

[0009] In a capacitive sensor according to one aspect of the present invention, the capacitance portion is expandable and contractible in the longitudinal direction.

[0010] In a capacitive sensor according to one aspect of the present invention, the connection region is provided between a plurality of capacitive portions at regular intervals.

[0011] According to the capacitive sensor of the present invention, short-circuit failures when stacked electrode bodies are cut can be suppressed.

[0012] This is a schematic plan view showing the configuration of a capacitive sensor according to an embodiment of the present invention. This is a cross-sectional view of the capacitance portion in the capacitive sensor according to this embodiment. This is a cross-sectional view of the connection region in the capacitive sensor according to this embodiment. This is a plan view showing the process of manufacturing the lower layer of the insulating layer in the capacitive sensor according to this embodiment. This is a plan view showing the process of manufacturing the ground layer in the capacitive sensor according to this embodiment. This is a plan view showing the process of manufacturing the dielectric layer in the capacitive sensor according to this embodiment. This is a plan view showing the process of manufacturing the voltage application layer in the capacitive sensor according to this embodiment. This is a graph showing the relationship between charging time, discharging time and voltage in the capacitance portion of the capacitive sensor according to this embodiment. This is a graph showing the relationship between charging time and voltage due to differences in the longitudinal length of the capacitance portion of the capacitive sensor according to this embodiment. This is a schematic plan view showing the capacitance portion and connection region in the capacitive sensor according to this embodiment. This is a side view showing an example of a mating component attached to the connection region of the capacitive sensor according to this embodiment.

[0013] Hereinafter, a capacitive sensor according to an embodiment of the present invention will be described with reference to the drawings.

[0014] Figure 1 is a schematic plan view showing the configuration of a capacitive sensor 1 according to an embodiment of the present invention. Figure 2 is a cross-sectional view (A-A cross-section) of the capacitance portion 60 in the capacitive sensor 1. Figure 3 is a cross-sectional view (B-B cross-section) of the connection region 70 in the capacitive sensor 1.

[0015] In the following description, the horizontal direction (left-right direction, length direction) in the plan view of the capacitive sensor shown in Figure 1 is defined as the x-axis direction, or the direction perpendicular to the x-axis, and the vertical direction (up-down direction, width direction) in the plan view shown in Figure 1 is defined as the y-axis direction. Furthermore, in the following description, the direction perpendicular to the x-axis and y-axis, that is, the direction that penetrates the drawing in the plan view shown in Figure 1, is defined as the z-axis direction (height direction, stacking direction). In the following description, the horizontal direction, vertical direction, left-right direction, up-down direction, etc., are based solely on the drawing in this embodiment and are not limited to the actual embodiment. In the following description, the direction of the xy plane, which is a plane perpendicular to the z-axis direction, is called the surface direction. Furthermore, in the following description, the surface shown in the plan view shown in Figure 1 is called the front surface, and the surface opposite the front surface is called the back surface.

[0016] As shown in Figures 1 to 3, the capacitive sensor 1 comprises a plurality of capacitance sections 60, each formed by a voltage application layer 10 as a first electrode, a ground layer 20 as a second electrode, and a dielectric layer 30 stacked between the voltage application layer 10 and the ground layer 20. The capacitive sensor 1 also has connection regions 70 between each capacitance section 60, for example, provided at the end 61, and connected by the voltage application layer 10 and the ground layer 20. In the connection regions 70, the voltage application layer 10 and the ground layer 20 are formed so as not to overlap in the stacking direction. The configuration and operation of the capacitive sensor 1 will be described in detail below.

[0017] [Configuration of Capacitive Sensor] The capacitive sensor 1 includes the capacitance portion 60 and connection region 70 described above, as well as a substrate bonding portion 80. In Figure 1, the capacitive sensor 1 measures the expansion and contraction of the object to be measured in the x-axis direction, with the x-axis direction being the expansion and contraction direction. Here, the expansion and contraction direction is set to the direction in which the expansion and contraction of the capacitive sensor 1 is greater, for example, set in the longitudinal direction of the capacitive sensor 1.

[0018] As shown in Figure 1, the capacitive sensor 1 is formed in the shape of a long tape (rectangular or approximately rectangular), for example, with the x-axis direction as the length and the y-axis direction as the width. The capacitive sensor 1 has connection regions 70 at the ends 61 where each of the capacitance portions 60 connects. The connection regions 70 are provided, for example, at the longitudinal ends 61 of the capacitance portion 60. In other words, the capacitive sensor 1 is configured such that connection regions 70 are provided between the ends 61 of each capacitance portion 60. In Figure 1, the dashed lines are lines provided to indicate the position of the connection regions 70. In the capacitive sensor 1, the portion other than the connection regions 70 and the substrate bonding portion 80 is the capacitance portion 60. That is, the longitudinal dimension of the connection region 70 is shorter than that of the capacitance portion 60.

[0019] In the capacitive sensor 1, the capacitance portion 60, the connection region 70, and the substrate bonding portion 80 are integrally formed on the base material 100. The base material 100 is, for example, made by processing fibers such as woven fabric or nonwoven fabric into a thin sheet. The base material 100 has the property of being able to deform to follow the surface shape of the object to be measured, for example, being soft and having little force to maintain its shape. The base material 100 has an area on which the capacitance portion 60, the connection region 70, and the substrate bonding portion 80 can be placed. For example, the surface shape of the base material 100 is formed in a rectangular or substantially rectangular shape as shown in Figure 1. The surface shape of the base material 100 is not limited to the example described above.

[0020] Furthermore, the capacitive sensor 1 may have capacitance portions 60 and connection regions 70 alternately arranged at predetermined intervals in the longitudinal direction, for example, at regular intervals, and is not limited to having a straight outer edge as shown in Figure 1. The capacitive sensor 1 may have a curved shape, such as a wave shape, for example, at its outer edge. Also, the material of the base material 100 is not limited to the fibers mentioned above, but may be a thin sheet-like member that is deformable to conform to the surface shape of the object to be measured, and is capable of forming the capacitance portions 60, connection regions 70, and substrate bonding portions 80. Moreover, the capacitive sensor 1 does not have a base material 100. In other words, the capacitive sensor 1 may have the capacitance portions 60, connection regions 70, and substrate bonding portions 80 directly provided on the surface of the object to be measured.

[0021] As shown in Figure 2, in the capacitance section 60 of the capacitance sensor 1, the ground layer 20, dielectric layer 30, and voltage application layer 10 are stacked in the height direction from bottom to top. In other words, in the capacitance section 60, the planar shapes of the ground layer 20, dielectric layer 30, and voltage application layer 10, that is, the dimensions in the longitudinal direction (length direction) and the short direction (width direction), are identical or approximately identical. However, in the capacitance section 60, the dimensions in the short direction may differ as long as the ground layer 20, dielectric layer 30, and voltage application layer 10 have stacked portions. In the capacitance section 60, the outside of the ground layer 20, dielectric layer 30, and voltage application layer 10 is covered by an insulating layer 40. Specifically, the insulating layer 40 covers the lower surface of the ground layer 20, the upper surface of the voltage application layer 10, and both longitudinal sides of each layer. The configuration of each layer constituting the capacitance section 60 will be described later.

[0022] As shown in Figure 3, in the capacitive sensor 1, the connection region 70 is connected to the capacitance portion 60 by a ground layer 20 and a voltage application layer 10, and the ground layer 20 and the voltage application layer 10 are not stacked in the height direction. In the connection region 70, the ground layer 20 and the voltage application layer 10 are formed at positions that coincide or substantially coincide in the height direction, but at different positions in the planar direction. The planar shape of the parts of the voltage application layer 10 and the ground layer 20 that constitute the connection region 70 and the substrate bonding portion 80 differs from the planar shape of the parts that constitute the capacitance portion 60, and has a narrower dimension (width) in the left-right direction. In the connection region 70, the dimensions of the ground layer 20 and the voltage application layer 10 in the short-side direction (width direction) may coincide or substantially coincide.

[0023] In the connection region 70, the insulating layer 40 covers the outside of the ground layer 20 and the voltage application layer 10, that is, the upper and lower sides of the voltage application layer 10 and the ground layer 20, and both the left and right sides in the longitudinal direction. In the connection region 70, the insulating layer 40 is also formed between the ground layer 20 and the voltage application layer 10, which are formed to coincide or nearly coincide in the height direction. Furthermore, unlike the capacitance portion 60, the dielectric layer 30 is not formed in the connection region 70. The configuration of each layer constituting the connection region 70 will be described later.

[0024] Furthermore, in the connection region 70, the ground layer 20 and the voltage application layer 10 do not need to be located on the same plane, provided they are not stacked.

[0025] The substrate bonding portion 80 is provided on the shorter side of the capacitive sensor 1, for example, on the outer edge of the left side. In the capacitive sensor 1, the substrate bonding portion 80, like the connection region 70, does not have the ground layer 20 and the voltage application layer 10 stacked in the height direction. That is, in the substrate bonding portion 80 as well, the ground layer 20 and the voltage application layer 10 are formed to be adjacent on the same plane, coinciding or substantially coinciding in the height direction. In the substrate bonding portion 80, the insulating layer 40 covers the lower surfaces of the ground layer 20 and the voltage application layer 10, as well as both the left and right longitudinal sides of each layer, leaving the upper surfaces of the ground layer 20 and the voltage application layer 10 exposed to the outside. Also, in the substrate bonding portion 80, no dielectric layer is formed, similar to the connection region 70. The configuration of each layer constituting the substrate bonding portion 80 will be described later.

[0026] [Configuration of Voltage Application Layer, Ground Layer, Dielectric Layer, and Insulating Layer] The configuration of the voltage application layer 10, ground layer 20, dielectric layer 30, and insulating layer 40 in the capacitive sensor 1 will be described below.

[0027] The dielectric layer 30 functions as a dielectric in the capacitor. The dielectric layer 30 is a sheet-like member integrally formed from an elastomer composition. The dielectric layer 30 can be reversibly deformed so that the area of ​​its front and back surfaces changes. Furthermore, the dielectric layer 30 has a relatively large relative permittivity, for example, 3 or more (measurement frequency 100 Hz). Examples of elastomer compositions include those containing an elastomer and, if necessary, other optional components such as dielectric particles. Examples of elastomers include natural rubber, isoprene rubber, nitrile rubber (NBR), ethylene propylene rubber (EPDM), styrene-butadiene rubber (SBR), butadiene rubber (BR), chloroprene rubber (CR), silicone rubber, fluororubber, acrylic rubber, hydrogenated nitrile rubber, urethane rubber, etc. These may be used individually or in combination of two or more.

[0028] The ground layer 20 functions as the negative electrode in the capacitor. The voltage application layer 10 functions as the positive electrode in the capacitor. The ground layer 20 and the voltage application layer 10 are made of, for example, an elastomer composition as described above, containing conductive materials such as carbon black, carbon nanotubes, silver nanoparticles, or other conductive particles.

[0029] The insulating layer 40 electrically insulates the ground layer 20 and other components from the outside. Furthermore, the insulating layer 40 can enhance the strength and durability of the capacitive sensor 1. The insulating layer 40 can be made of the same elastomer composition as the material constituting the dielectric layer 30.

[0030] Figure 4 is a plan view showing the process (1) for manufacturing the lower insulating layer 41 in the capacitive sensor 1. Figure 5 is a plan view showing the process (2) for manufacturing the ground layer 20 in the capacitive sensor 1. Figure 6 is a plan view showing the process (3) for manufacturing the dielectric layer 30 in the capacitive sensor 1. Figure 7 is a plan view showing the process (4) for manufacturing the voltage application layer 10 in the capacitive sensor 1.

[0031] Capacitive sensor 1 can be manufactured, for example, by the following process. Capacitive sensor 1 can be manufactured, for example, by performing the following steps (1) to (5).

[0032] First, in step (1), the lower insulating layer 41 is manufactured as shown in Figure 4. The lower insulating layer 41 includes a first lower insulating layer 411 that constitutes the lower portion of the voltage application layer 10 and the ground layer 20 of the insulating layer 40 in the capacitance portion 60 and the connection region 70, and a second lower insulating layer 412 that constitutes the lower portion of the voltage application layer 10 and the ground layer 20 of the insulating layer 40 in the substrate bonding portion 80.

[0033] After step (1), as shown in Figure 5, in step (2), a conductive elastomer composition is applied to the upper side of the lower insulating layer 41 to create a ground layer 20. The ground layer 20 includes a first ground layer 201 located in the capacitance portion 60, a second ground layer 202 located in the substrate bonding portion 80, and a third ground layer 203 located in the connection region 70. As described above, the planar shape of the second ground layer 202 and the third ground layer 203, which constitute the connection region 70 and the substrate bonding portion 80, is narrower in the left-right dimension (width) than the planar shape of the first ground layer 201, which constitutes the capacitance portion 60.

[0034] After step (2), as shown in Figure 6, in step (3), the elastomer composition is applied to the upper side of the ground layer 20 to create a dielectric layer 30. As described above, the dielectric layer 30 is formed only in the capacitance portion 60 and not in the connection region 70 and the substrate bonding portion 80.

[0035] After step (3), as shown in Figure 7, in step (4), a conductive elastomer composition is applied to the upper side of the dielectric layer 30 and the upper side of the lower insulating layer 41 to create a voltage application layer 10. The voltage application layer 10 includes a first voltage application layer 101 located in the capacitance portion 60, a second voltage application layer 102 located in the substrate bonding portion 80, and a third voltage application layer 103 located in the connection region 70. As described above, the planar shape of the second voltage application layer 102 and the third voltage application layer 103, which constitute the connection region 70 and the substrate bonding portion 80, is narrower in the left-right dimension (width) than the planar shape of the first voltage application layer 101, which constitutes the capacitance portion 60. The second voltage application layer 102 is formed at a different position in the planar direction (on the +y side of the second ground layer 202 in Figure 7) so as to be adjacent to the second ground layer 202 on the same plane. Furthermore, the third voltage application layer 103 is formed at a different position in the planar direction (on the +y side of the third ground layer 203 in Figure 7) so as to be adjacent to the third ground layer 203 on the same plane.

[0036] After step (4), in step (5), an insulating layer 40 is fabricated on the upper and side sides of the lower insulating layer 41, the voltage application layer 10, and the ground layer 20, which are located at the positions of the capacitance portion 60 and the connection region 70, thereby completing the capacitive sensor 1 as shown in Figures 1 to 3.

[0037] In the above process, for example, the ground layer 20 and the voltage application layer 10 produced in process (2) and process (4) have different laminated structures in the capacitance portion 60, connection region 70, and substrate bonding portion 80, respectively. Therefore, it is sufficient to mask the areas where layers should not be formed according to their respective shapes before producing the layers. Each layer can be produced by an appropriate method such as spray coating, screen printing, or inkjet printing.

[0038] [Operation of Capacitive Sensor] Figure 8 is a graph showing the relationship between charging time, discharging time, and voltage in the capacitance portion 60 of the capacitive sensor 1. Figure 9 is a graph showing the relationship between charging time and voltage depending on the difference in the longitudinal length of the capacitance portion 60 of the capacitive sensor 1. Figure 10 is a schematic plan view showing the capacitance portion 60 and connection area 70 in the capacitive sensor 1.

[0039] Figure 8 shows the relationship between the time t (charging time) for charging the capacitance unit 60 and the time t (discharge time) for discharging the capacitance unit 60 in the capacitive sensor 1, and the voltage V applied to the capacitance unit 60. In Figure 8, curve C1 shows an example where the time until the voltage V applied to the capacitance unit 60 exceeds a predetermined threshold Vb is short. In Figure 8, curve C2 shows an example where the time until the voltage V applied to the capacitance unit 60 exceeds a predetermined threshold Vb is appropriate. In Figure 8, curve C3 shows an example where the time until the voltage V applied to the capacitance unit 60 exceeds a predetermined threshold Vb is slow (does not exceed the threshold).

[0040] In the capacitive sensor 1, the difference in the charge (capacitance value) that can be charged by the capacitance section 60 is due to the difference in the length of the capacitance section 60. In other words, in the capacitive sensor 1, the charging time and discharging time shown in Figure 8 differ due to the difference in the length of the capacitance section 60.

[0041] In the curve C1 in FIG. 8, unlike the case of the curve C2, the time to reach the threshold voltage is short. Therefore, in a sensor having the properties of the curve C1 in FIG. 8, the time tc1 during which the difference in capacitance values can be measured is shorter than the time tc2 during which the difference in capacitance values due to bending or stretching of a sensor having the properties of the curve C2 can be measured. For this reason, it becomes difficult to measure the difference in capacitance values, and the accuracy of the sensor decreases.

[0042] On the other hand, in the curve C3 in FIG. 8, unlike the case of the curve C2, the time to reach the threshold voltage is long. Therefore, in a sensor having the properties of the curve C3 in FIG. 8, charging ends before the difference in capacitance values due to bending or stretching of the sensor can be measured. That is, in a sensor having the properties of the curve C3, the time tc3 during which the difference in capacitance values can be measured is shorter than the time tc2 during which the difference in capacitance values of a sensor having the properties of the curve C2 can be measured, so that it becomes difficult to measure the difference in capacitance values.

[0043] As described above, in the capacitance-type sensor 1, when measuring the variation in capacitance value accompanying bending or stretching of the capacitance unit 60, if the time to reach the threshold voltage is too short or too long, there is a risk that the difference in capacitance values cannot be appropriately read. For this reason, in the capacitance-type sensor 1, when making the capacitance unit 60 cuttable with respect to the connection region 70, it is necessary to consider the length of the capacitance unit 60, that is, the difference in charge and discharge times due to the difference in capacitance values.

[0044] Therefore, when using the capacitance-type sensor 1, according to the difference in the length from the substrate coupling portion 80 to the connection region 70, the charge time of the capacitance unit 60 is set and the necessary capacitance value is calculated, thereby performing charge and discharge control suitable for the length of the capacitance unit 60.

[0045] Specifically, as shown in FIGS. 9 and 10, in the case of the length L1 from the substrate bonding portion 80 to the connection region 70, since the time t to reach the threshold voltage Vb is shorter compared to the length L2, the charging time t1 is set shorter than the charging time t2 of the length L2. In the case of the length L3 from the substrate bonding portion 80 to the connection region 70, since the time t to reach the threshold voltage Vb is longer compared to the length L2, the charging time t3 is set longer than the charging time t2 of the length L2.

[0046] By performing charge / discharge control as described above, in the capacitance-type sensor 1, even when the necessary capacitance values are different due to differences in the lengths of the capacitance portions 60 by having a connection region 70 that can be cut between the plurality of capacitance portions 60, appropriate charge / discharge control can be performed.

[0047] FIG. 11 is a side view showing an example in which a fitting component 90 is attached to the connection region 70 of the capacitance-type sensor 1.

[0048] As shown in FIG. 11, the fitting component 90 includes a lower fitting portion 91, an upper fitting portion 92, a hinge pin 93, and a claw portion 94. In the fitting component 90, the lower fitting portion 91 and the upper fitting portion 92 are connected by the hinge pin 93 so as to be openable and closable. The fitting component 90 can bite into the insulating layer 40 etc. of the capacitance-type sensor 1 by the claw portion 94 provided on the fitting surface of the lower fitting portion 91 and the upper fitting portion 92.

[0049] In the capacitance-type sensor 1, the length of the capacitance portion 60 can be adjusted by cutting with the connection region 70 as a boundary. However, in the capacitance-type sensor 1, when cutting with the connection region 70 as a boundary, in that state, the voltage application layer 10 and the ground layer 20 having conductivity are exposed to the outside.

[0050] Further, in the capacitance-type sensor 1 having a laminated structure, when a fixing component for fixing to a measurement object etc. is attached, there is a possibility that the capacitance value fluctuates due to the fixing component and the measurement accuracy decreases. In addition, it takes time for the adhesive to cure to bond the capacitance portion 60 of the capacitance-type sensor 1 and the fixing component.

[0051] Therefore, in the capacitive sensor 1, for example, by covering the cut surface of the connection area 70 with the mating part 90, it is possible to prevent conductive parts from touching each other and causing a short circuit. In addition, by mating the mating part 90 into the connection area 70, insulation protection can be achieved in a short time without being affected by fluctuations in capacitance value.

[0052] As described above, the capacitive sensor 1 has multiple capacitance portions 60 formed by a voltage application layer 10, a ground layer 20, and a dielectric layer 30 stacked between the voltage application layer 10 and the ground layer 20, and a connection region 70 formed between each of the multiple capacitance portions 60 in the longitudinal direction such that the voltage application layer 10 and the ground layer 20 do not overlap in the stacking direction.

[0053] The capacitive sensor 1, which is attached to the object being measured and has the flexibility to follow its movement, requires different lengths depending on the application.

[0054] On the other hand, since the capacitive sensor 1 has a structure in which flexible thin films are stacked, if the capacitance portion 60 is cut to a shorter length to match the size of a small object to be measured, there is a risk that the voltage application layer 10 and the ground layer 20 forming the capacitance portion 60 will come into contact with each other and short-circuit.

[0055] Therefore, the capacitive sensor 1 has connection regions 70 in the middle of the flexible capacitive section 60 where the voltage application layer 10 and the ground layer 20 are not stacked, and these regions are provided at predetermined intervals.

[0056] Therefore, the capacitive sensor 1 can provide a capacitive sensor that can suppress short-circuit failures when cutting stacked electrode bodies. In addition, with the capacitive sensor 1, the capacitive part 60 can be cut to a size suitable for various applications using a single product.

[0057] In the capacitive sensor 1, the dielectric layer 30 does not necessarily have to be placed in the connection region 70. With this configuration, when the connection region 70 is used as a boundary in the capacitive sensor 1, the portion where the dielectric layer 30 is provided between the voltage application layer 10 and the ground layer 20 reliably functions as the capacitive portion 60. Therefore, the accuracy of the sensor can be ensured in the capacitive sensor 1.

[0058] In the capacitive sensor 1, the connection region 70 may have the voltage application layer 10 and the ground layer 20 arranged on the same plane. With this configuration, the capacitive sensor 1 can avoid short-circuiting by preventing contact between the voltage application layer 10 and the ground layer 20 when the connection region 70 is used as a boundary.

[0059] In the capacitive sensor 1, the capacitance portion 60 may be expandable or contractible in the longitudinal direction. With this configuration, the capacitive sensor 1 can follow the deformation of the object being measured when it is attached to the object being measured.

[0060] In the capacitive sensor 1, multiple connection areas 70 may be provided at predetermined intervals. With this configuration, the length of the capacitance section 60 in the capacitive sensor 1 can be easily adjusted according to various requirements such as the shape and deformation characteristics of the object to be measured.

[0061] Furthermore, those skilled in the art may modify the present invention as appropriate in accordance with prior art knowledge. Such modifications, insofar as they still possess the configuration of the present invention, are of course included within the scope of the present invention.

[0062] For example, in the capacitive sensor 1 described above, an example was described in which the first electrode body is the voltage application layer 10 and the second electrode body is the ground layer 20, but the second electrode body may be the voltage application layer 10 and the first electrode body may be the ground layer 20.

[0063] For example, in the capacitive sensor 1 described above, the insulating layer 40 was shown to cover the ground layer 20, the upper and lower surfaces and sides of the voltage application layer 10, and the sides of the dielectric layer 30. However, the insulating layer 40 may cover only the ground layer 20 and the upper and lower surfaces of the voltage application layer 10.

[0064] For example, in the capacitive sensor 1 described above, an example was described in which the connection region 70 is provided at the longitudinal end of the capacitive portion 60, but the present invention is not limited to this. The connection region 70 may also be provided at the short end.

[0065] For example, in the capacitive sensor 1 described above, the capacitance portion 60 was described as having a rectangular planar shape with a longitudinal direction and a transverse direction, but the present invention is not limited to this. The capacitance portion 60 may also be square in shape with equal lengths at both ends.

[0066] 1...Capacitive sensor, 10...Voltage application layer (first electrode), 20...Ground layer (second electrode), 30...Dielectric layer, 40...Insulating layer, 41...Lower insulating layer, 60...Capacitive part, 61...End, 70...Connection area, 80...Substrate bonding part, 90...Mating part, 91...Lower mating part, 92...Upper mating part, 93...Hinge pin, 94...Claw part, 100...Base material, 101...First voltage application layer, 1 02...Second voltage application layer, 103...Third voltage application layer, 201...First ground layer, 202...Second ground layer, 203...Third ground layer, 411...First lower insulating layer, 412...Second lower insulating layer, C1, C2, C3...Curves, t...Time, t1, t2, t3...Charging time, tc1, tc2, tc3...Time during which the difference in capacitance value can be measured, V...Voltage, Vb...Voltage threshold

Claims

1. A capacitive sensor having a capacitance portion formed by a first electrode body, a second electrode body, and a dielectric layer stacked between the first electrode body and the second electrode body, wherein a plurality of capacitance portions are formed, and each of the capacitance portions has a connection region between the first electrode body and the second electrode body that connects each of the capacitance portions, and in the connection region, the first electrode body and the second electrode body are formed so as not to overlap in the stacking direction.

2. The capacitance sensor according to claim 1, wherein the dielectric layer is not disposed in the connection region.

3. The capacitive sensor according to claim 1 or 2, wherein the connection region is such that the first electrode body and the second electrode body are arranged on the same plane.

4. The capacitance portion is expandable in the longitudinal direction, as described in claim 1 or 2.

5. The capacitive sensor according to claim 1, wherein the connection area is provided between a plurality of capacitive portions at regular intervals.

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