Method for manufacturing flow passage member, flow passage member, liquid ejecting head, recording device, and displacement measuring device

Abstract

This method for manufacturing a flow passage member having a plurality of plates stacked in a first direction includes measurement of a first displacement and measurement of a second displacement. In the measurement of the first displacement, in each of a plurality of plate groups obtained by dividing the plurality of plates in the first direction so that each of the plurality of plate groups includes two or more plates, the positional displacement between the plates in a plan view is measured. In the measurement of the second displacement, the positional displacement between the plate groups in the plan view is measured.

Description

Method for manufacturing a flow path member, flow path member, liquid ejection head, recording apparatus, and deviation measuring apparatus

[0001] The present disclosure relates to a method for manufacturing a flow path member through which a liquid (e.g., ink) flows, a flow path member to which the manufacturing method can be applied, a liquid ejection head having the flow path member, a recording apparatus having the liquid ejection head, and a deviation measuring apparatus for the flow path member.

[0002] In a liquid ejection head such as an inkjet head, a flow path member through which a liquid flows is configured by, for example, laminating a plurality of plates. By laminating the plurality of plates, holes (e.g., through holes or recesses) each plate has are connected to each other to form a flow path.

[0003] In Patent Document 1, each plate has a plurality of holes for alignment when laminating the plurality of plates. Among the plurality of plates, the positions of the plurality of holes are the same as each other, and when the plurality of plates are laminated, the plurality of holes overlap each other. In each plate, one of the plurality of holes is a positioning hole having a smaller diameter than the other holes. Among the plurality of plates, the positions of the positioning holes are different from each other.

[0004] Therefore, when the plurality of plates are stacked, the positioning holes of each plate are observed through holes other than the positioning holes of the other plates. Then, alignment of the plurality of plates is performed based on the positional relationship between the positioning holes of the plurality of plates. In a through hole formed by overlapping (connecting) the holes of the plurality of plates, only the hole (positioning hole) of one plate has a smaller diameter than the other holes located above and below it.

[0005] Japanese Unexamined Patent Application Publication No. 2008 - 265342

[0006] A method for manufacturing a flow channel member according to one aspect of the present disclosure, wherein the flow channel member has a plurality of plates stacked in a first direction. The manufacturing method includes measuring a first misalignment and measuring a second misalignment. The measurement of the first misalignment involves measuring the positional misalignment of the plates in a plan view in each of the plurality of plate groups, which are divided in the first direction such that each plate group contains two or more plates. The measurement of the second misalignment involves measuring the positional misalignment of the plate groups in a plan view.

[0007] A flow channel member according to one aspect of the present disclosure has a first surface facing a first side in a first direction. The flow channel member has a plurality of plate groups stacked in the first direction. Each plate group has a plurality of standard plates stacked in the first direction and a specific plate that overlaps the plurality of standard plates on the first side. The flow channel member has a plurality of inspection parts at different positions in a plan view. The plurality of inspection parts include a plurality of standard inspection parts that individually correspond to the plurality of standard plates in the plurality of plate groups. Each standard inspection part has a standard marker on the corresponding standard plate and a viewing hole extending from the first surface to the standard marker. The hole that constitutes the viewing hole and is in the specific plate is referred to as the specific hole. The hole that constitutes the viewing hole and is in the standard plate is referred to as the standard hole. In this case, in a plan view of each of the plurality of viewing holes that has the standard hole, the specific hole is smaller than any of the standard holes in the plate group to which it belongs.

[0008] A liquid discharge head according to one aspect of the present disclosure comprises a flow path member and an actuator for applying pressure to the flow path member.

[0009] A recording device according to one aspect of the present disclosure includes a liquid discharge head and a transport device for moving the liquid discharge head and a recording medium relative to each other.

[0010] A displacement measuring device according to one aspect of the present disclosure includes an imaging device that images a plurality of plates stacked in a first direction in the first direction, and a processing device that identifies the displacement of the plates in a plan view based on the image data captured by the imaging device. The processing device identifies the displacement of the plates in a plan view between plates that are imaged together in each of a plurality of plate groups obtained by dividing the plurality of plates in the first direction such that each group of plates includes two or more plates. The processing device identifies the displacement of the plates in a plan view between groups of plates that are imaged together.

[0011] A side view of a recording device according to an embodiment. A plan view of the recording device. An exploded perspective view of the head in the recording device. A cross-sectional view of a part of the head. A plan view showing an enlarged view of region R2 shown in Figure 3 of the flow channel member of the head. A plan view of a plurality of plates constituting the lower part of region R2 of the flow channel member. A plan view of a plurality of plates constituting the upper part of region R2 of the flow channel member. A cross-sectional view along the line VIII-VIII in Figure 5. A cross-sectional view along the line IX-IX in Figure 5. A cross-sectional view corresponding to Figure 8 of a flow channel member according to another example. A plan view and a cross-sectional view of a part of a flow channel member according to yet another example. A cross-sectional view illustrating the outline of the manufacturing method according to the embodiment. A block diagram showing the configuration of the displacement measuring device according to an embodiment. A flowchart showing the processing performed by the displacement measuring device.

[0012] The diagrams used in the following explanation are schematic. Therefore, for example, the dimensional ratios on the drawings do not necessarily match those of reality. Furthermore, dimensional ratios may not match between drawings. Certain shapes and / or dimensions may be exaggerated, or details may be omitted. However, the above does not negate the possibility that the actual shape and / or dimensions may be as shown in the drawings, or that the characteristics of the shape and / or dimensions may be extracted from the drawings.

[0013] For convenience, the drawings may include a Cartesian coordinate system D1, D2, and D3, and terms such as D1 direction, D2 direction, and D3 direction may be used. The liquid discharge head according to the embodiment may be used in any orientation. However, for convenience, terms (top surface, bottom surface, etc.) that assume the +D3 side is upward may be used.

[0014] Regarding aspects described relatively later, only the differences from aspects described relatively earlier will be mentioned. Unless otherwise specified, matters may be treated the same as those described earlier, or inferred from those aspects. For convenience, the same symbols may be used for corresponding components in different aspects, even if there are differences.

[0015] In the description of the embodiments, the term "shape" may or may not include dimensions. Either interpretation is acceptable as long as it does not create a contradiction. Furthermore, the terms "image" and "image data" are not strictly distinguished. They may be interchangeable as long as it does not create a contradiction.

[0016] (Outline of Embodiments) Figure 1 is a schematic side view showing a printer 1 (an example of a recording device) according to an embodiment. Figure 2 is a schematic top view of the printer 1.

[0017] In printer 1, for example, media P (an example of a recording medium), such as paper, is generally transported from the -D1 side to the +D1 side (or to the opposite side). One or more (multiple in the illustrated example) heads 3 (each an example of a liquid ejection head) are located above the media P. An image (which may include characters) is formed on the media P by ejecting ink (an example of a liquid) from the heads 3 toward the media P.

[0018] Figure 3 is a schematic exploded perspective view of the head body 5, which constitutes at least the lower part of the head 3. The head body 5 has a flow channel member 7 that constitutes the lower surface (discharge surface 7a) of the head body 5. The flow channel member 7 is, for example, a generally plate-shaped member. Multiple nozzles 9 (only one is shown in Figure 4, which will be described later) open into the discharge surface 7a. Ink is discharged from the multiple nozzles 9 toward the media P.

[0019] Figure 4 is a cross-sectional view of a portion of the flow channel member 7. Since the area shown in Figure 4 corresponds to a relatively narrow area for one nozzle 9, lines indicating the position of the cross-section in Figure 4 are not shown in Figure 3, etc. Figure 4 may also be a D1D3 cross-section, a D2D3 cross-section, or a cross-section inclined to these.

[0020] The flow channel member 7 is constructed by stacking multiple plates 11 (11A to 11K). For convenience, the designations 11A to 11K are used, omitting "I" which is easily confused with "1". Each plate 11 has a hole (for example, a through hole or recess). The holes of the multiple plates 11 are connected by the stacking, forming a flow channel 31 including the nozzle 9. The number of plates 11 is arbitrary, but for convenience, unless otherwise specified, the explanation may be based on the assumption that there are 10 plates 11, as in the illustrated example.

[0021] Figure 12 is a diagram illustrating the general method for manufacturing the flow channel member 7, and in particular, it is a schematic diagram illustrating the general method for inspection included in the above manufacturing method. In the above inspection method, the positional misalignment of the multiple plates 11 in a plan view (hereinafter sometimes simply referred to as "misalignment" or "stack misalignment") is measured.

[0022] In this inspection method, first, multiple plates 11 are divided into multiple plate groups 13 (13A and 13B) in the stacking direction (D3 direction). Note that "dividing" does not mean physically separating the plates, but rather dividing the multiple plates 11 into two or more sections in the stacking direction to define two or more plate groups 13 (the same applies hereafter). Each plate group 13 contains two or more plates 11. The number of divisions and the division positions are arbitrary. In the illustrated example, it is divided into two between plate 11E and plate 11F.

[0023] Next, for example, as shown by hatching in the upper part of Figure 12, the displacement between plates 11 (11F to 11K) within the first plate group 13A is measured. Next, for example, as shown by hatching in the middle part of Figure 12, the displacement between plates 11 (11A to 11E) within the second plate group 13B is measured.

[0024] Next, as shown in the lower part of Figure 12, the displacement between the first plate group 13A and the second plate group 13B is measured. When measuring the displacement between plate groups 13, the displacement between any two plates 11 included in each plate group 13 may also be measured. In the illustrated example, as indicated by the hatching, the displacement between plate 11E and plate 11K is measured.

[0025] As described above, the method according to this embodiment performs two types of measurements: measurement of the displacement of the plates 11 within each plate group 13, and measurement of the displacement between the plate groups 13 themselves. The effects of this are, for example, as follows.

[0026] In measuring stacking misalignment, for example, the flow channel member 7 is imaged from above to obtain a single image in which specific parts of multiple plates 11 (parts not hidden by other plates located above) are shown together. Then, the distance between these specific parts is measured within that image. Finally, the measured distance is compared with the design value to identify the stacking misalignment.

[0027] Figure 12 schematically shows the lens 15a of the imaging device 15 (Figure 13) that images multiple plates 11. The depth of field (DOF) of the imaging device 15 is also schematically shown. In the illustrated example, the depth of field (DOF) is smaller than the thickness of the flow channel member 7. In such a case, even if all plates 11 are imaged together, the image of one or more plates 11 will be unclear. As a result, the accuracy of measuring the stacking misalignment decreases.

[0028] However, when applying the method according to the embodiment, not all plates 11 are to be imaged (measured), but only the multiple plates 11 in each plate group 13 are to be imaged (upper and middle sections of Figure 12). Also, only some of the plates 11 (11E and 11F) in the multiple plate groups 13 are to be imaged (lower section of Figure 12). As a result, the multiple plates 11 to be imaged can be placed within the depth of field (DOF).

[0029] Furthermore, the measurement of deviation in the manufacturing method according to the embodiment is not limited to imaging, as will be described later. Also, the above effects do not necessarily have to be achieved. Technical ideas from a different perspective than the overview of the embodiments described above may be extracted from this disclosure. In this case, the two types of measurements do not necessarily have to be performed.

[0030] The above is an overview of the embodiments. Below, the embodiments will be described in general order. 1. Printer (Figures 1 and 2) 2. Head (Figures 3 and 4) 3. Flow channel member 4. Measurement of stacking misalignment 4.1. General measurement 4.2. First example 4.2.1. Overview of the first example (Figures 5 to 9) 4.2.2. Part under inspection 4.2.3. Dummy part under inspection 4.2.4. Stacked part under inspection 4.2.5. Arrangement position of parts under inspection, etc. 4.2.6. Method for measuring misalignment (Figure 12) 4.3. Second example (Figure 10) 4.4. Third example (Figure 11) 4.5. Other examples 5. Misalignment measuring device (Figures 13 and 14) 6. Summary of embodiments

[0031] (1. Printer) The configuration of printer 1 shown in Figures 1 and 2 may be various, and may be a known configuration, for example. The configurations shown in Figures 1 and 2 are merely examples. In the following, we will briefly describe printer 1 in general, using the configurations shown in Figures 1 and 2 as an example.

[0032] As previously described, printer 1 has multiple heads 3. In addition, printer 1 may also have, for example, a transport device 17 for transporting media P and a controller 19 for controlling various parts of printer 1.

[0033] Printer 1 is configured as a so-called line printer. That is, the head unit 21, which includes at least one head 3 (five in the example in Figure 2), extends over approximately the entire width (D2 direction) of the media P. When the media P is transported, printing is performed on a strip-shaped area extending in the D2 direction, thereby forming a two-dimensional image.

[0034] In each head unit 21, the five heads 3 are arranged in a staggered pattern so that there are no gaps in the D2 direction when viewed in the D1 direction. Depending on the configuration of the heads 3, multiple heads 3 may be arranged linearly in the D2 direction. The configuration for fixing the multiple heads 3 to each other in each head unit 21 is arbitrary. Figures 1 and 2 illustrate a frame 23 having an opening (not shown) that exposes the heads 3 downwards.

[0035] Note that printer 1 is not limited to line printers. For example, printer 1 may be a serial printer. In a serial printer, for example, the operation of printing while moving the head (head unit) in a direction intersecting the media P transport direction (D2 direction) and the transport of media P are performed alternately.

[0036] Printer 1 has a total of four head units 21. The four head units 21 are arranged, for example, in the direction of media P transport. The five heads 3 within each head unit 21 correspond to ink of the same color. The four head units 21 correspond to inks of different colors (four colors of ink). As a result, printer 1 functions as a color printer.

[0037] Contrary to the above explanation, printer 1 may perform single-color printing, or conversely, print with more than four colors. In other words, the number of colors is arbitrary. Also, two or more head units 21 may correspond to one color. Conversely, one head unit 21 may correspond to two or more colors, for example, by having one head 3 correspond to two or more colors. The number of heads 3 contained in one head unit 21 is arbitrary, and it may be just one. As can be understood from the above, the number of heads 3 that printer 1 has is arbitrary.

[0038] Printer 1 prints on, for example, a roll of paper as media P. However, media P may also be sheet-fed paper. The size of media P is also arbitrary. For example, media P can be as small as a receipt, as large as standard office paper, or as large as a poster.

[0039] The configuration of the conveying device 17 is arbitrary. Figures 1 and 2 illustrate a configuration in which the media P is conveyed by rotating rollers that hold the media P. Other configurations include, for example, a configuration in which the media P is conveyed by conveying a belt that holds the media P, and a configuration in which the media P is conveyed by rotating a drum around which the media P is wound. In a broader sense, the conveying device 17 moves the head 3 and the media P relative to each other.

[0040] The controller 19, for example, includes a computer and controls the head 3 and transport device 17 based on print data, which includes image data.

[0041] Printer 1 may have various other components in addition to those described above. Examples are given below, although they are not specifically shown in the diagrams: • Drying device: For example, to accelerate the drying of ink. • Coating device: For example, to uniformly apply a transparent coating agent to media P. • Cleaning device: For example, to clean the head 3. Note that Printer 1 may use the head 3 for coating an agent in addition to, or instead of, printing with colored ink.

[0042] (2. Head) The configuration of the head 3 (head body 5) shown in Figure 3 may be various configurations, for example, a known configuration may be used. The configuration shown in Figure 3 is merely one example. In the following, we will take the configuration shown in Figure 3 as an example and briefly describe the head 3 in general.

[0043] The manner in which the head 3 applies pressure to the liquid in order to discharge the liquid is arbitrary. For example, the head 3 may be piezoelectric or thermal. The piezoelectric type applies pressure to the liquid by utilizing the deformation of a piezoelectric body. The thermal type heats the liquid to generate bubbles, thereby applying pressure to the liquid.

[0044] Also, the mode of deformation of the piezoelectric body utilized by the piezoelectric type head 3 is also arbitrary, and may be, for example, a flexure mode, a longitudinal mode, or a shear mode. In the flexure mode, the elongation and / or contraction due to the transverse piezoelectric effect is converted into a flexural deformation, and this flexural deformation is utilized to apply pressure to the liquid. In the longitudinal mode, the elongation and / or contraction due to the transverse piezoelectric effect or the longitudinal piezoelectric effect is directly utilized to apply pressure to the liquid. In the shear mode, the shear deformation of the piezoelectric body is utilized. In FIGS. 3 and 4, an aspect in which the head 3 is a piezoelectric type that utilizes the flexure mode is illustrated.

[0045] The head 3 may be one that is only supplied with ink from a tank (not shown), or may be one that is supplied with ink from a tank (not shown) and the ink is recovered into a tank (not shown). In other words, in the head 3, the ink may not be circulated or may be circulated.

[0046] Although not particularly shown, the head 3 may have, for example, the following components in addition to the head body 5. ・ Circuit board: For example, it is connected to the head body 5 (more specifically, the flexible board 29 described later). ・ Connector: Mounted on the above circuit board, contributing to the electrical connection between the head body 5 and the controller 19. ・ Housing: For example, it covers the upper part of the head body 5 and houses the above circuit board. Note that regardless of whether the head 3 has components other than the head body 5, the head body 5 may be regarded as an example of the liquid discharge head of the present disclosure.

[0047] In addition to the aforementioned flow path member 7, the head body 5 may have, for example, the following components. - Actuator 25: Applies pressure to the liquid in the flow path member 7 for droplet ejection. - Rear member 27: Contributes to ink supply to the flow path member 7 and reinforcement of the head body 5. - Flexible substrate 29: Connected to the actuator 25. - Driver (not shown): Mounted on the flexible substrate 29 and inputs a drive signal to the actuator 25 based on a signal from the controller 19. Note that, different from the above description, a combination of the flow path member 7 and the actuator 25 may be regarded as the head body.

[0048] In FIG. 3, a region R1 indicated by a dotted line on the upper surface 7b of the flow path member 7 is a region where the actuator 25 is overlaid. The rear member 27 overlaps with the peripheral region of the region R1 on the upper surface 7b. Although not particularly shown, openings (and, if necessary, openings for discharging ink to the rear member 27) for supplying ink from the rear member 27 are formed in this peripheral region.

[0049] (3. Flow path member) The flow path member 7 may have various configurations, for example, it may have a known configuration. In the examples of FIGS. 3 and 4, it is as follows.

[0050] The shape of the flow path member 7 is, for example, generally a rectangular flat plate shape. A rectangle can be said to be a shape having a longitudinal direction and a lateral direction. Various dimensions and dimensional ratios are arbitrary. For example, the length in the longitudinal direction may be 50 mm or more and 300 mm or less. The length in the lateral direction may be 20 mm or more and 100 mm or less (however, it is shorter than the length in the longitudinal direction). The thickness may be 500 μm or more and 3 mm or less.

[0051] As shown in FIG. 4 and as described above, the flow path member 7 is configured by laminating a plurality of plates 11 laminated in the D3 direction. An adhesive (not shown) is interposed between the plates 11 adjacent to each other in the lamination direction (directly overlapping each other without passing through other plates 11). The thickness of the adhesive is usually sufficiently thin with respect to the thickness of the plate 11. The adhesive may cover the inner surface of the holes in the plate 11 (the surface where the plates 11 are not adhered to each other).

[0052] The plate 11 is a flat plate of approximately constant thickness, ignoring the presence of holes that constitute the flow channels, etc. The shape and size of the outer edge of each plate 11 is approximately the same as the shape and size of the outer edge of the flow channel member 7. In other words, the shape and size of the outer edges of multiple plates 11 are approximately the same as each other. The number of layers and thickness of the plates 11 are arbitrary. For example, the number of layers may be 6 to 30. The thickness of the plate 11 may be 10 μm to 300 μm.

[0053] Each plate 11 is, for example, integrally formed from a single type of material. The materials of multiple plates 11 may be the same as those of each other, or they may differ in some respects. The material of the plates 11 is arbitrary and may be, for example, metal, resin, or ceramic.

[0054] The shape of the flow path 31, including the nozzle 9, is arbitrary. The flow path 31 has, for example, one or more common flow paths 33 and a plurality of individual flow paths 35 branching off from each common flow path 33. Each individual flow path 35 has a nozzle 9 at its tip. The plurality of nozzles 9 are arranged on the discharge surface 7a at a pitch and arrangement corresponding to a desired resolution.

[0055] (4. Measurement of stacking misalignment) (4.1. General measurement) The manner in which the measurement method according to the embodiment is used is arbitrary. For example, the measurement method may be used in the process of gradually stacking the plates 11, and / or after all the plates 11 have been stacked. Also, the measurement may be performed before the adhesive (not shown) between the plates 11 hardens, and / or after it hardens. The measurement results may be used to correct stacking misalignment before the adhesive hardens, or they may simply be used to detect defective products before and / or after hardening. In any case, the measurement method may be considered as part of the manufacturing method of the flow channel member 7 (or head 3 or printer 1).

[0056] The measurement method according to the embodiment may be used in various specific forms. For example, in the general description of the embodiment, an example was given in which a specific part of the plate 11 is imaged by an imaging device 15 to measure the stacking misalignment. However, instead of such an optical measurement, contact, electrical, or ultrasonic measurement may be performed. Furthermore, the optical measurement is not limited to imaging, but may also involve detecting changes in interference fringes, changes in light intensity, or changes in diffraction patterns caused by stacking misalignment using an optical sensor (which may be in the form of an array). Various specific forms are also possible for imagering a specific part of the plate 11 by the imaging device 15.

[0057] As mentioned earlier, the flow channel member 7 to which the measurement method according to the embodiment is applied may have a known configuration. However, for example, the flow channel member 7 may have a new configuration that facilitates the application of the measurement method according to the embodiment and / or improves the accuracy of the measurement method according to the embodiment.

[0058] In the following, we will first describe the configuration of the new flow channel member 7 and a specific measurement method (first example) corresponding to the flow channel member 7, using an imaging device 15 to image a specific part of the plate 11 as an example. Then, other examples will be described.

[0059] (4.2. First Example) (4.2.1. Overview of the First Example) As shown in Figure 3, the flow channel member 7 has a plurality of inspection parts 37 at mutually different positions in a plan view. The plurality of inspection parts 37 are parts that are imaged from the +D3 side by the imaging device 15 in order to measure the stacking misalignment by the measurement method according to the embodiment. In the illustrated example, the inspection parts 37 are provided in two regions located on a pair of diagonal sides of the flow channel member 7. The configuration of the two regions is, for example, 180° rotationally symmetric with respect to the center of the flow channel member 7 in a plan view.

[0060] In the first example, the inspection section 37 is primarily intended to be used for detecting stacking misalignment after all the plates 11 have been stacked. For measuring stacking misalignment during the process of gradually stacking the plates 11, for example, the stacking inspection section 39 is used. In the illustrated example, two stacking inspection sections 39 are provided on the short side of the flow channel member 7. The configurations of the two stacking inspection sections 39 are, for example, identical to each other (or 180° rotationally symmetric).

[0061] Figure 5 is an enlarged view of region R2 in Figure 3.

[0062] The multiple inspection sections 37 include inspection sections 37A to 37J (the designation "37A to 37J" is used, skipping "I" to match "11A to 11J") for measuring the stacking misalignment of each of the multiple plates 11A to 11J. Furthermore, the multiple inspection sections 37 form one or more rows (two in the illustrated example). This row also includes dummy inspection sections 41 that are not used for measuring stacking misalignment.

[0063] The inspected sections 37 and plates 11 that are assigned the same uppercase alphabet letter correspond to each other. For example, inspected section 37A is used to measure the stacking misalignment of plate 11A relative to any of the other plates 11. As will be described later, in this embodiment, the uppermost plate 11K is only used as a reference when measuring the stacking misalignment of the other plates 11. Therefore, there is no inspected section 37 corresponding to plate 11K.

[0064] Figures 6 and 7 show plan views of plates 11A to 11K in region R2. Figure 8 shows a cross-sectional view along line VIII-VIII in Figure 5. Figure 9 shows a cross-sectional view along line IX-IX in Figure 5.

[0065] As shown in these figures, the part under inspection 37 is basically composed of a hole in the shape of a downward-growing channel member 7. This hole is formed by connecting holes 45 in multiple plates 11. The part under inspection 37 also has a marker 43 formed on the plate 11 corresponding to it. For example, the part under inspection 37A has a marker 43 on plate 11A. Therefore, by imaging the inside of the part under inspection 37 from the -D3 side and detecting the displacement of the marker 43, the displacement of the plate 11 corresponding to the part under inspection 37 can be measured.

[0066] The misalignment of the marker 43 is measured, for example, by measuring the misalignment between the marker 43 and the hole 45 in each inspected section 37. This measurement is also used to measure the stacking misalignment between the plates 11 within the plate group 13 and the stacking misalignment between the plate group 13 itself.

[0067] Specifically, for example, when measuring the stacking misalignment within the first plate group 13A, the positional misalignment of the markers 43 of each of the other plates 11 (11F to 11J) relative to the hole 45 of the uppermost plate 11K in the first plate group 13A is measured. Similarly, when measuring the stacking misalignment within the second plate group 13B, the positional misalignment of the markers 43 of each of the other plates 11 (11A to 11D) relative to the hole 45 of the uppermost plate 11E in the second plate group 13B is measured.

[0068] Furthermore, for example, when measuring the stacking misalignment between the first plate group 13A and the second plate group 13B, the positional misalignment between the hole 45 of plate 11K and the marker 43 of plate 11E is measured. Plates 11K and 11E can be described as the uppermost plate 11 in each plate group 13, and from another perspective, they can be described as the plate 11 used as a reference when measuring the stacking misalignment within the plate group 13.

[0069] (4.2.2. Inspection Section) In describing the embodiments, the following terms may be used for convenience: ・Specific plate 11Z: A plate that serves as a reference when measuring the displacement between plates 11 in each plate group 13 (in the above example, the uppermost plates 11K and 11E in each plate group 13) ・Standard plate 11Y: A plate 11 other than the specific plate 11Z ・Specific hole 45Z: A hole 45 in the specific plate 11Z ・Standard hole 45Y: A hole 45 in the standard plate 11Y ・Peep hole 47: A hole in each inspection section 37 that extends from the upper surface 7b of the flow channel member 7 to the marker 43 (a hole that contributes to imaging the marker 43 from above) ・Auxiliary hole 49: A hole located below the marker 43 in each inspection section 37.

[0070] In the illustrated example, in each specific plate 11Z, the multiple specific holes 45Z have the same shape and dimensions in a planar perspective view. Similarly, in each standard plate 11Y, the multiple standard holes 45Y have the same shape and dimensions in a planar perspective view. The markers 43 on the multiple plates 11 (or, from another viewpoint, the multiple inspection parts 37) have the same shape and dimensions in a planar view.

[0071] Therefore, the relative sizes of the specific hole 45Z, the standard hole 45Y, and the marker 43 in a planar view of each inspected part 37 are the same for all of the inspected parts 37. For convenience, the description of the embodiment may omit the explanation of the relative sizes when focusing on each inspected part 37.

[0072] In each inspected section 37, for example, the shape and dimensions of the multiple standard holes 45Y in a plan view are the same. Consequently, the shape and dimensions of the D1D2 cross-section of the peephole 47 are constant in the D3 direction, except for the portion formed by a specific hole 45Z, and ignoring the effects of stacking misalignment, etc. In the description of the embodiment, when explaining the relative sizes of the multiple holes 45 etc. that constitute each inspected section 37, expressions assuming no stacking misalignment may be used for convenience.

[0073] Furthermore, in each inspected section 37, the auxiliary holes 49 penetrate from plate 11 to plate 11B, which overlaps the lower surface of plate 11 having the marker 43, but do not penetrate the bottom layer plate 11A. In other words, the bottom layer plate 11A only has the marker 43 for measuring its own stacking misalignment and does not have the standard holes 45Y.

[0074] Let us focus on each inspected section 37 and each plate group 13. In plan view, the specific hole 45Z is smaller than the standard hole 45Y. That is, the entire edge of the specific hole 45Z can be positioned inward from the edge of the standard hole 45Y (the same applies to the explanation of the size relationship in plan view for other shapes). Also, in plan view, the marker 43 is smaller than the specific hole 45Z.

[0075] Therefore, for example, even if a stacking misalignment occurs, the probability of the edges of the specific hole 45Z, the standard hole 45Y, and the marker 43 overlapping in a planar view is reduced. As a result, measuring the misalignment between the specific hole 45Z and the marker 43 becomes easier.

[0076] When focusing on each inspected section 37, the multiple specific holes 45Z are larger in planar projection as they are located on the upper surface 7b side. In the illustrated example, in planar projection, the specific holes 45Z of plate 11K are larger than the specific holes 45Z of plate 11E. This allows for imaging of the entire edge of the lower specific holes 45Z, facilitating the measurement of displacement.

[0077] As can be understood from the above explanation, and as shown in Figure 5, in the inspected sections 37F to 37J corresponding to the measurement of stacking misalignment of plates 11 in the first plate group 13A, when image is taken from the +D3 side, the specific hole 45Z of plate 11K and the marker 43 are in the same image. In the inspected sections 37A to 37D corresponding to the measurement of stacking misalignment of plates 11 in the second plate group 13B, when image is taken from the +D3 side, the specific hole 45Z of plates 11K and 11E and the marker 43 are in the same image. In the inspected section 37E corresponding to the measurement of stacking misalignment between the plate groups 13, the specific hole 45Z of plate 11K and the marker 43 are in the same image.

[0078] The shapes of the holes 45 (45Z and 45Y) and the markers 43 are arbitrary. In the illustrated example, the planar shape of the holes 45 is circular. The markers 43 have a planar shape that is a circular recess. The depth of the recess is arbitrary and may be, for example, 1 / 3 to 2 / 3 of the thickness of the plate 11 (approximately 1 / 2 in the illustrated example). Other examples of the planar shapes of the holes 45 and the markers 43 include, for example, ellipses, convex polygons (rectangles, etc.) and cross shapes. The holes 45 and the recesses (markers 43) may have a constant shape in the thickness direction of the plate 11, or they may be tapered in cross-sectional view.

[0079] The degree of difference in size between the specific hole 45Z, the standard hole 45Y, and the marker 43 in a plan view is arbitrary. For example, in each plate group 13, let the diameter of the specific hole 45Z be a, the diameter of the standard hole 45Y be b, and the diameter of the marker 43 be c. Furthermore, let the allowable error for stacking misalignment be x. In this case, the following equations (1) and / or (2) may hold: (b - a) / 2 > x (1) (a - c) / 2 > x (2)

[0080] When a, b, and c of the first plate group 13A are a1, b1, and c1 respectively, and a, b, and c of the second plate group 13B are a2, b2, and c2 respectively, equations (1) and (2) can be rewritten as follows: (b1 - a1) / 2 > x (1 - 1) (b2 - a2) / 2 > x (1 - 2) (a1 - c1) / 2 > x (2 - 1) (a2 - c2) / 2 > x (2 - 2) In the illustrated example, b1 = b2 and c1 = c2.

[0081] In addition to, or instead of, equation (1) and / or equation (2) above, equation (3) below may also hold. Note that when there are three or more plate groups 13, for example, a1 and a2 may be considered as the diameters of specific holes 45Z in adjacent plate groups 13. (a1 - a2) / 2 > x (3)

[0082] In the case of a circle, the diameter is the diameter. Also, in the case of a circle, each equation may or may not hold in any direction in the plan view. Considering other planar shapes, the diameter is the length from one edge to the other, passing through the geometric center of the planar shape. The difference on the left side of each equation may be, for example, the difference between diameters in the same direction. Then, it may be determined whether or not the value in the direction in which this difference is minimized satisfies each equation.

[0083] The tolerance x may be set according to the shape of the flow path 31 of the flow path member 7, for example. Specifically, for example, if adjacent plates 11 are misaligned, the holes in these plates 11 will be misaligned, and the flow path 31 may be blocked. The part of the flow path 31 that is most likely to be blocked by the misalignment of adjacent plates 11 (and the direction of that misalignment) is identified. The tolerance x may then be set such that when adjacent plates 11 are misaligned by tolerance x in the direction that is most likely to block the above part, the area (D1D2 cross section) that is blocked is 50% of the area when no misalignment occurs.

[0084] Examples of specific values ​​for the tolerance x are given below. Note that instead of the concept of tolerance, the specific values ​​exemplified below may be used for x. For example, x may be 0.01 mm, 0.02 mm, or 0.04 mm. Alternatively, it may be 1 / 20, 1 / 10, or 1 / 5 of the c of the marker 43 (the minimum value if c differs among the plate groups 13).

[0085] The specific dimensions of diameters a, b, and c are arbitrary. Examples are given below. Diameter a1 may be 0.3 mm or more and 1.2 mm or less. Diameter b (b1 and / or b2) may be 0.4 mm or more and 1.3 mm or less. Diameter c (c1 and / or c2) may be 0.1 mm or more and 0.3 mm or less. Diameter a2 may be 0.2 mm or more and 0.8 mm or less.

[0086] The method for forming the holes 45 and markers 43 may be the same as the method for forming the holes constituting the flow channel 31, and they may be formed simultaneously with the holes constituting the flow channel 31. For example, the holes constituting the flow channel 31 may be formed by dry etching, wet etching, or half etching, or by other processing directions (e.g., laser processing). In this case, the holes 45 and markers 43 may also be formed.

[0087] (4.2.3. Dummy Inspection Section) The dummy inspection section 41 contributes, for example, to uniformizing the shape of the adhesive area around multiple inspection sections 37, and / or to facilitating design changes related to the number of plates 11 (number of inspection sections 37). The dummy inspection section 41 is optional. The number of dummy inspection sections 41 is arbitrary and may be one or multiple.

[0088] The dummy inspection section 41 is configured, for example, in the inspection section 37 without the marker 43. Therefore, the dummy inspection section 41 has a hole extending from the upper surface 7b to the upper surface of the bottom plate 11A. The terms hole 45, specific hole 45Z, and standard hole 45Y refer to the holes that make up the inspection section 37, but for convenience, they are also used for the dummy inspection section 41. In this case, the holes in the dummy inspection section 41 are composed of a plurality of (two in the illustrated example) specific holes 45Z and a plurality of standard holes 45Y.

[0089] (4.2.4. Inspection Section for Stacking) The specific configuration of the inspection section 39 for stacking shown in Figure 3 is arbitrary. For example, although not specifically shown, the inspection section 39 for stacking is composed of holes formed in a plurality of plates 11. The bottom plate 11A may have recesses instead of holes. The holes in the plurality of plates 11 are, for example, larger towards the +D3 side. Therefore, each time a plate 11 is stacked, an image is taken from the +D3 side and the displacement between the holes is measured to detect the displacement between the newly stacked plate 11 and any of the plates 11 below it.

[0090] (4.2.5. Arrangement of parts to be inspected, etc.) The arrangement of the multiple parts to be inspected 37 is arbitrary. In the example of Figure 3, as previously described, identical configurations are provided in region R2 and in a region that is 180° rotationally symmetric with respect to region R2. From another perspective, each of the parts to be inspected 37A to 37J is arranged in a position that is 180° rotationally symmetric with respect to each other. For example, two parts to be inspected 37A are arranged in positions that are 180° rotationally symmetric with respect to each other.

[0091] In each region, multiple inspection units 37 are arranged linearly in a row, for example, one or more (two in the example of Figure 5). The number of rows is arbitrary. The order of the inspection units 37 in each row corresponds, for example, to the stacking order of the corresponding plates 11. In this case, the direction in which the multiple inspection units 37 are arranged, corresponding to the stacking order from bottom to top (the direction from the -D1 side to the +D1 side in the illustrated example), may be the same for adjacent rows (as in the illustrated example) or may be different for adjacent rows.

[0092] As previously described, the rows formed by the inspected sections 37 may include dummy inspected sections 41. The dummy inspected sections 41 may be located at one end or both ends of at least one of one or more rows. The number of dummy inspected sections 41 at each end is also arbitrary.

[0093] In each row, the pitch (for example, the distance between centers) of the positions of the inspected parts 37 (and dummy inspected parts 41) may be constant. The pitch may be the same for all rows. The distance between the centerlines of the rows may be shorter, the same as, or longer than the pitch. The specific size of the pitch, etc., is arbitrary.

[0094] The number of positions for the inspected parts 37 included in each row (including the number of positions for the dummy inspected parts 41 if dummy inspected parts 41 are provided) may be the same for all rows, for example. The positions of the positions along the rows may be the same for all rows (as shown in the illustration), or they may be shifted by half a pitch.

[0095] (4.2.6. Method for Measuring Displacement) As already described with reference to Figure 12, the method for measuring displacement according to the embodiment involves measuring the displacement between plates 11 within each plate group 13 and measuring the displacement between adjacent plate groups 13. In Figure 12, the former measurement (and / or imaging; the same applies hereinafter) is performed before the latter measurement. However, the order of measurement is arbitrary.

[0096] For example, the displacement between plate groups 13 may be measured first, and then the displacement within each plate group 13 may be measured. Alternatively, the displacement within one plate group 13 may be measured first, then the displacement between plate groups 13 may be measured, and then the displacement within other plate groups 13 may be measured.

[0097] Furthermore, for example, the measurement of stacking misalignment within each plate group 13 does not have to be performed consecutively. For example, the misalignment of some plates 11 within one plate group 13 may be measured, then the misalignment of some or all plates 11 within another plate group 13 may be measured, and then the misalignment of the remaining plates 11 within the first plate group 13 may be measured.

[0098] The imaging of the inspected section 37 may be performed for each inspected section 37, or for two or more inspected sections 37. In relation to the latter, when measuring the displacement between plates 11 within each plate group 13, the multiple inspected sections 37 corresponding to the multiple plates 11 included in each plate group 13 may be imaged in parts, or all may be imaged at once. In the description of the embodiment, the method of imaging each inspected section 37 one by one will be used as an example.

[0099] The specific method for measuring the stacking misalignment from the image is arbitrary. For example, one could identify the edges of the specific hole 45Z and the marker 43, determine the geometric center from each of the identified edges, and then compare the positions of the geometric centers to measure the misalignment of the specific hole 45Z and the marker 43. Of course, one could also measure the misalignment of the specific hole 45Z and the marker 43 by comparing the positions of the edges.

[0100] (4.3. Second Example) Figure 10 shows a flow channel member 7A relating to the second example, and corresponds to Figure 8 of the first example. In this example, the part under inspection 37E has a specific hole 45Z in the plate 11E corresponding to itself, instead of a marker 43. When measuring the stacking misalignment between the plate group 13, the specific hole 45Z of plate 11E is used as a marker to be compared with the specific hole 45Z of plate 11K. In the illustrated example, the configuration of the part under inspection 37E and the dummy part under inspection 41 (Figure 9) are the same, only their positions differ.

[0101] (4.4. Third Example) Figure 11 shows the uppermost plate 11K-3 (corresponding to plate 11K) in the third example. The plan view shown in the upper part of Figure 11 corresponds to a part of the uppermost plan view in Figure 7. The lower part of Figure 11 is a cross-sectional view of the part shown in the upper part of Figure 11.

[0102] In this example, the plate 11K-3 has a groove 51 on its upper surface that extends along the edge of the specific hole 45Z in a plan view. With such a groove 51 provided, for example, the groove 51 can be used as a reference for measuring displacement, either in place of or in addition to the edge of the specific hole 45Z.

[0103] The specific shape and dimensions of the groove 51 are arbitrary. For example, the groove 51 extends with a constant width. The distance between the groove 51 (inner edge, outer edge and / or center line) and the edge of the specific hole 45Z is, for example, constant. In another respect, the shape of the groove 51 is similar to the shape of the specific hole 45Z. The groove 51 extends, for example, around the entire circumference of the specific hole 45Z. The depth of the groove 51 may be, for example, 1 / 3 or more and 2 / 3 or less of the plate 11K-3.

[0104] (4.5. Other Examples) Although not specifically shown in the figures, the manufacturing method (inspection method) and the flow path member 7 according to the embodiment may be in the following specific forms.

[0105] In each of the multiple inspected parts 37, the shape and dimensions of the specific holes 45Z may differ from each other, the shape and dimensions of the standard holes 45Y may differ from each other, and the shape and dimensions of the markers 43 may differ from each other. In each inspected part 37, the shapes and dimensions of the multiple standard holes 45Y may differ from each other.

[0106] When each inspected section 37 is viewed from above, the standard holes 45Y of the second plate group 13B may be larger than the specific holes 45Z of the second plate group 13B, while being smaller than the specific holes 45Z of the first plate group 13A. In other words, the specific holes 45Z do not have to be smaller than all the standard holes 45Y, and may only be smaller than the standard holes 45Y of the plate group 13 to which it belongs.

[0107] The imaging for measurement may be performed from the -D3 side (opposite side from the discharge surface 7a) instead of the +D3 side. From another point of view, in the flow path member 7, the configuration of the part to be inspected 37, etc., may be reversed vertically from what has been described above.

[0108] The holes constituting the inspected section 37 may open to the discharge surface 7a. However, if the holes in the inspected section 37 do not open to the discharge surface 7a, as shown in the illustrated example, the probability of ink entering the holes in the inspected section 37 is reduced. Consequently, the probability of ink that enters the holes adhering to the media P is reduced. Furthermore, the auxiliary holes 49 do not need to be provided.

[0109] As can be seen from the second example (Figure 10), the specific hole 45Z can be used as a marker. Therefore, the inspection section 37E may be omitted. When measuring the displacement between the plate group 13, the displacement between plate 11K and plate 11E may be measured using the specific hole 45Z in any of the inspection sections 37A to 37D. Alternatively, a dummy inspection section 41 may be used to measure the displacement between the plate group 13.

[0110] The marker 43 may be a hole penetrating the plate 11, rather than a recess, or it may be a printed pattern. The shape of the marker 43 (which is not necessarily a recess) may also be a cross, as described above. In this case, instead of the geometric center of the marker 43, the intersection of the cross may be used as a comparison point with the specific hole 45Z. In this case, the cross only needs to capture the intersection. That is, the marker 43 does not need to be smaller than the specific hole 45Z being compared. Also, the part directly used for measuring the displacement (the part under inspection 37 in the illustrated example) may be the edge of the plate 11, rather than a hole. In this case, the edge does not need to have a special shape.

[0111] In each plate group 13, the specific plate 11Z used as a reference when measuring the stacking misalignment is not limited to the uppermost plate 11K or 11E. When focusing on each inspected section 37, the reference hole (specific hole 45Z in the illustrated example) only needs to be located above the marker 43. Therefore, for example, in inspected sections 37F to 37H, the reference hole may be provided in a plate 11 below the uppermost plate 11K. Furthermore, as can be understood from the above, the upper and lower positions of the reference holes may differ among inspected sections 37 belonging to the same plate group 13.

[0112] The vertical positional relationship between the reference specific shape (specific hole 45Z in the illustrated example) and the specific shape being compared (marker 43 in the illustrated example) may be reversed from the illustrated example. For example, when focusing on the first plate group 13A, reference holes are provided at the positions of multiple inspection sections 37 on plate 11F. In addition, in plates 11G to 11K, comparison holes with a larger diameter than the reference holes are formed at the positions of the corresponding inspection sections 37 (at different positions on each plate 11). The reference holes and comparison holes are then compared, and the deviation is measured.

[0113] The plate 11 used as a reference when measuring the misalignment between plates 11 within each plate group 13 and the plates 11 that are compared with each other when measuring the misalignment between the plate groups 13 may be different from each other. For example, in the inspection section 37E, the diameter of the hole 45 in plate 11K may be made as large as the diameter of the standard hole 45Y, and the diameter of the hole 45 in any of plates 11F to 11J may be made smaller than the diameter of the standard hole 45Y to serve as a reference hole. Then, this reference hole may be compared with a specific shape (marker 43 or specific hole 45Z) of plate 11E. In this case, it is easier to place the plates 11 being compared within the depth of field (DOF).

[0114] The measurement of stacking misalignment based on imaging of the marker 43 is not limited to comparing the marker 43 with a specific hole 45Z in each inspected section 37. For example, the misalignment may be measured by comparing the design value with the measured value for the relative positions of the markers 43 in multiple inspected sections 37. In this case, the specific hole 45Z used as the basis for comparison is unnecessary. Therefore, for example, in each inspected section 37, all holes 45 (excluding the marker 43) may have the same shape and dimensions as each other.

[0115] The inspection section 37 does not have to be located at different positions on the plates 11. For example, a configuration like the previously described inspection section 39 for stacking (a hole whose diameter gradually increases in the stacking direction) may be provided. Furthermore, at one inspection section (37), both the displacement between plates 11 within the plate group 13 and the displacement between the plate group 13 itself may be measured.

[0116] If the flow channel member 7 has three or more plate groups 13, for example, the displacement between adjacent plate groups 13 may be measured. For example, although not specifically shown, if they are arranged in the order of a first group, a second group, and a third group, the displacement between the first group and the second group may be measured, and the displacement between the second group and the third group may be measured (conversely, the displacement between the first group and the third group does not need to be measured).

[0117] However, the plate groups 13 whose displacements are measured do not necessarily have to be adjacent to each other. For example, in the above example, the displacement between the first group and the second group may be measured, and the displacement between the first group and the third group may also be measured (conversely, the displacement between the second group and the third group does not need to be measured).

[0118] (5. Misalignment Measurement Device) Figure 13 is a block diagram showing the configuration of a measurement device 61 (an example of a misalignment measurement device) for measuring stacking misalignment. The measurement device 61 has, for example, the following components: - Imaging device 15: Captures images of the flow channel member 7. - Moving device 63: Moves the imaging device 15 and the flow channel member 7 relative to each other. - Processing device 65: Controls the imaging device 15 and the moving device 63, and identifies the stacking misalignment based on the images captured by the imaging device 15.

[0119] The imaging device 15 includes, for example, a lens 15a (Figure 12) and an image sensor (not shown) positioned behind the lens 15a. The lens 15a is a broad concept that includes single lenses and lens groups. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor, which converts light incident from the lens 15a side into an electrical signal and outputs it.

[0120] One imaging device 15 is provided, for example, to measure the displacement of one flow channel member 7. Therefore, for example, the imaging device 15 images two sets of multiple inspection parts 37 located on diagonal sides of a pair of flow channel members 7. However, an imaging device 15 may be provided for each diagonal. Furthermore, when considering various flow channel members 7 and inspection parts 37, two or more imaging devices 15 may be provided for one set of multiple inspection parts 37.

[0121] The moving device 63 moves at least one of the imaging device 15 and the flow channel member 7 (the former in the illustrated example) in order to image each of the multiple parts 37 under inspection one by one. That is, the moving device 63 moves the imaging device 15 and the flow channel member 7 relative to each other in the D1 and D2 directions. The moving device 63 also moves at least one of the imaging device 15 and the flow channel member 7 (the former in the illustrated example) in order to change the position of the depth of field DOF relative to the flow channel member 7. That is, the moving device 63 moves the imaging device 15 and the flow channel member 7 relative to each other in the D3 direction.

[0122] Furthermore, the position of the depth of field (DOF) relative to the flow channel member 7 may be changed by a function of the imaging device 15, either in addition to or instead of the function of the moving device 63. For example, the position of the depth of field (DOF) may be changed by the movement of a lens within the lens group, and / or the relative movement of the lens 15a and the image sensor. In describing the embodiments, examples will be given in which the imaging device 15 does not have the above function, or in which the imaging device 15 has the above function but the above function is not utilized.

[0123] The configuration of the moving device 63 is arbitrary. For example, although not specifically shown, the moving device 63 may have a linear guide for supporting and guiding the imaging device 15, and a rotary or linear motor that generates a driving force to move the imaging device 15. Such a moving mechanism including a linear guide and motor may be provided for each of the D1 axis, D2 axis, and D3 axis. When two or more imaging devices 15 are provided, the moving device 63 may hold the two or more imaging devices 15 so that they cannot move from one another, or it may hold them so that they can move independently from one another.

[0124] The processing unit 65 may include, for example, a computer. The computer may include, for example, a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and auxiliary storage devices (e.g., an HDD (Hard Disk Drive) or SSD (Solid State Drive)), although these are not specifically shown in the diagram. By the CPU executing programs stored in the ROM and / or auxiliary storage devices, various functional units (described later) that perform various calculations (including control) are constructed. The processing unit 65 (or the functional units described later) may also include logic circuits and / or analog circuits that perform certain operations, power supply circuits, or drivers. The processing unit 65 may be hardware-integrated in one location or distributed across multiple locations.

[0125] The processing unit 65 has, for example, the following functional units: • Movement controller 67: Controls the movement device 63. • Measurement processing unit 69: Controls the imaging device 15 and identifies stacking misalignment based on image data from the imaging device 15.

[0126] The measurement processing unit 69 has the following two functional units, for example, as functional units that identify stacking misalignment based on image data: • Plate measurement unit 69a: Identifies the misalignment between plates 11 within each plate group 13. • Group measurement unit 69b: Identifies the misalignment between plate groups 13. The plate measurement unit 69a and the group measurement unit 69b may share hardware (CPU and ROM, etc.), and may also share at least a part of the program that constructs these functional units.

[0127] The plate measurement unit 69a identifies the stacking misalignment based on an image G1 in which at least two plates 11 within each plate group 13 are captured together. More specifically, in the embodiment, the image G1 includes a specific plate 11Z and one of the standard plates 11Y (or, in other words, a specific hole 45Z and marker 43 within the same plate group 13).

[0128] Furthermore, the plate measurement unit 69a inputs imaging conditions MC1 (and their data) to the movement controller 67, which are set so that the two plates 11 are within the depth of field (DOF) when the image G1 is acquired. The imaging conditions MC1 may include, for example, information on the position of the imaging device 15 in the three axes. The movement controller 67 controls the movement device 63 so that the input imaging conditions MC1 are satisfied.

[0129] The group measurement unit 69b identifies the stacking misalignment based on an image G2 in which two plates 11 being compared with each other in at least an adjacent plate group 13 are captured together. More specifically, in the embodiment, the image G2 includes two specific plates 11Z (in other words, for example, a specific hole 45 of plate 11K and a marker 43 (or specific hole 45Z) of plate 11E).

[0130] Furthermore, the group measurement unit 69b inputs imaging conditions MC2 (and their data) to the movement controller 67, which are set so that the two plates 11 fall within the depth of field (DOF) when the image G2 is acquired. The imaging conditions MC2 may include, for example, information on the position of the imaging device 15 in the three axes. The movement controller 67 controls the movement device 63 so that the input imaging conditions MC2 are satisfied.

[0131] Figure 14 is a flowchart showing the procedure of the processing performed by the processing unit 65.

[0132] As previously mentioned, the order in which the displacement between plates 11 within each plate group 13 is measured and the order in which the displacement between the plate groups 13 are measured is arbitrary. Here, we will take the example of a configuration in which the latter is performed after the former. Also, as previously mentioned, the number of inspection units 37 to be imaged in a single imaging is arbitrary. Here, we will take the example of a configuration in which inspection units 37 are imaged one by one.

[0133] Steps ST1 to ST5 describe the procedure for measuring the displacement between plates 11 within each plate group 13. Steps ST6 to ST9 describe the procedure for measuring the displacement between plate groups 13. The processor executing steps ST1 to ST5 corresponds to the plate measurement unit 69a. The processor executing steps ST6 to ST9 corresponds to the group measurement unit 69b.

[0134] In step ST1, the processing unit 65 (or processor, in other words; the same applies hereinafter) sets the depth of field DOF position (part of the imaging condition MC1) corresponding to the target plate group 13. In step ST2, the processing unit 65 controls the moving device 63 to move the imaging device 15 to an imaging position that satisfies the imaging condition MC1 (position in the three axes) corresponding to the target part to be inspected 37. In step ST3, the processing unit 65 controls the imaging device 15 to acquire an image G1 and identifies the displacement between the plates 11 based on the image G1.

[0135] In step ST4, the processing unit 65 determines whether the measurement of the displacement of all standard plates 11Y within the target plate group 13 relative to a specific plate 11Z has been completed. If the determination is negative, the processing unit 65 returns to step ST2 and performs processing on the next target unit to be inspected 37. In step ST2 at this time, for example, only movement in the D1 direction and D2 direction may be performed. If the determination in step ST4 is positive, the processing unit 65 proceeds to step ST5.

[0136] In step ST5, the processing unit 65 determines whether the displacement measurement has been completed for all plate groups 13. If the determination is negative, the processing unit 65 returns to step ST1 and processes the next target plate group 13. If the determination in step ST5 is positive, the processing unit 65 proceeds to step ST6.

[0137] In step ST6, the processing unit 65 sets the depth of field (DOF) position (part of the imaging condition MC2) corresponding to the two target plate groups 13. In step ST7, the processing unit 65 controls the moving device 63 to move the imaging device 15 to an imaging position that satisfies the imaging condition MC2 (position in the three axes) corresponding to the target part to be inspected 37. In step ST8, the processing unit 65 controls the imaging device 15 to acquire image G2 and identifies the misalignment between the plate groups 13 based on image G2.

[0138] Step ST9 assumes a configuration in which the number of plate groups 13 may be three or more. In step ST9, the processing unit 65 determines whether the measurement of the displacement has been completed for all pairs of plate groups 13 whose displacements are measured relative to each other. If the determination is negative, the processing unit 65 returns to step ST6 and performs processing on the next two target plate groups 13. If the determination in step ST9 is positive, the processing unit 65 completes the processing shown in the figure.

[0139] Although not specifically shown in the figures, the processing device 65 may make a pass / fail judgment based on the measured deviation after the process in Figure 14, or during the process in Figure 14. For example, the processing device 65 may compare the measured deviation value with an allowable value, and if the former exceeds the latter, it may be determined to be defective. The measured value may be, for example, the values ​​measured in steps ST3 and ST8 (i.e., not a representative value such as an average value). The allowable value may be common to all deviations, or it may differ for each plate 11, or it may differ between the deviations between plates 11 and the deviations between the plate groups 13.

[0140] The above is merely an example and may be modified as appropriate. For example, in the illustrated example, imaging and misalignment identification are performed together, but the misalignment may be identified after imaging of all inspected parts 37 is completed, or the misalignment identification and processing for the next imaging may be performed in parallel after imaging. Also, for example, the pass / fail judgment described above may be performed immediately after step ST3, and if it is determined to be defective, the process may be terminated without executing the subsequent steps.

[0141] (6. Summary of Embodiments) Below, we will extract the configurations and / or procedures according to the embodiments and describe their effects. Note that the extracted configurations and / or procedures do not necessarily have to produce the effects exemplified below. Hereinafter, the measurement of the displacement between plates 11 within the plate group 13 may be referred to as "measurement of the first displacement," and the measurement of the displacement between the plate group 13 may be referred to as "measurement of the second displacement."

[0142] The manufacturing method according to this embodiment manufactures a flow channel member 7 having a plurality of plates 11 stacked in the D3 direction (an example of a first direction). The manufacturing method includes measuring a first misalignment (see the upper and middle sections of Figure 12 and steps ST1 to ST5 in Figure 14) and measuring a second misalignment (see the lower section of Figure 12 and steps ST6 to ST9 in Figure 14). In the first misalignment measurement, the positional misalignment of the plates 11 in a plan view is measured in each of a plurality of plate groups 13, each of which contains two or more plates 11, divided in the D3 direction. In the second misalignment measurement, the positional misalignment of the plate groups 13 in a plan view is measured.

[0143] Therefore, for example, the need for a configuration that allows measurement operations (e.g., imaging) to be performed relative to the thickness of the flow channel member 7 (the total thickness of all plates 11) can be reduced. For example, when measurement is performed by imaging, as explained with reference to Figure 12, the depth of field DOF can be made smaller than the thickness of the flow channel member 7. In the contact type, the contact area can be made smaller and / or the travel distance of the contact area can be shortened. In the electrical type, the terminals for detecting conductivity or capacitance can be shortened and the travel distance of the terminals can be shortened. In other words, components directly involved in measurement can be miniaturized, or constraints on the performance of the above components (e.g., depth of field) can be reduced. Similar effects can be achieved in other methods as well.

[0144] The first displacement measurement may be performed based on an image G1 (an example of a first image) obtained by imaging at least two plates 11 of each plate group 13 together in the D3 direction under imaging condition MC1 (an example of a first imaging condition). The second displacement measurement may be performed based on an image G2 (an example of a second image) obtained by imaging at least two plate groups 13 together in the D3 direction under imaging condition MC2 (an example of a second imaging condition) which is different from imaging condition MC1.

[0145] In this case, for example, imaging conditions suitable for measuring the first deviation and the second deviation can be set. In the illustrated example, the position of the depth of field (DOF) is given as an item in which imaging conditions MC1 and MC2 differ from each other. Other examples include the size of the depth of field (DOF) and the lighting conditions of an illumination device not shown.

[0146] Image G1 and Image G2 may be captured by the same imaging device 15. The depth of field DOF (its size in the D3 direction) of the imaging device 15 may be smaller than the thickness of the flow channel member 7.

[0147] In this case, since the depth of field is smaller than the thickness of the flow channel member 7, the image of one of the plates 11 becomes blurry in the conventional method, reducing the accuracy of the displacement measurement. On the other hand, in this embodiment, since both a first displacement measurement and a second displacement measurement are performed, the accuracy of the displacement measurement can be improved by making the depth of field positions different for the two measurements. From another perspective, the constraints on the performance of the imaging device 15 are reduced.

[0148] The imaging device 15 may also have a function to change the depth of field. In this case, regarding the method, when determining whether the depth of field is smaller than the thickness of the flow channel member 7, the depth of field actually set during imaging may be referred to. Also, regarding the measuring device 61, when determining whether the depth of field is smaller than the thickness of the flow channel member 7, for example, the maximum depth of field may be referred to. The depth of field is usually described in the specifications of the imaging device 15, so that value may be referred to.

[0149] Under imaging condition MC1, the imaging target areas (e.g., specific holes 45Z and markers 43) of at least two plates 11 (e.g., a specific plate 11Z and one of the standard plates 11Y) in each plate group 13 may both fall within the depth of field DOF of the imaging device 15. Under imaging condition MC2, the imaging target areas (e.g., specific holes 45Z of the specific plate 11Z or markers 43) of adjacent plate groups 13 in the D3 direction may both fall within the depth of field DOF of the imaging device 15.

[0150] When the position of the depth of field is varied depending on the object being measured, it is not necessarily required to follow the above procedure. That is, even simply reducing the discrepancy in the relative position between the object being measured and the depth of field will reduce blurriness to some extent. However, as described above, if the two plates 11 being compared are within the depth of field, the effect of improving accuracy by reducing blurriness will be greatly increased.

[0151] Each plate group 13 may have multiple plates 11, including a specific plate 11Z and multiple standard plates 11Y. In the first displacement measurement, the displacement between each specific plate 11Z and each of the multiple standard plates 11Y in each plate group 13 may be measured. In the second displacement measurement, the displacement between each of the multiple plate groups 13, including the specific plates 11Z, may be measured.

[0152] In this case, the plate 11 (specific plate 11Z) used as a reference when measuring the first displacement and the plate 11 that is compared with each other when measuring the second displacement are the same. Therefore, compared to, for example, a different configuration, the probability of errors in displacement measurement accumulating is reduced, and the accuracy of the measurement is improved.

[0153] In each plate group 13, the specific plate 11Z may be the plate 11 located furthest to the +D3 side (an example of the first side).

[0154] In this case, for example, the likelihood that imaging of the specific plate 11Z (specific hole 45Z) will be obstructed by the standard plate 11Y is reduced. As a result, for example, the configuration of the inspection unit 37 can be simplified.

[0155] The flow channel member 7 may have a plurality of inspection sections 37 at different positions in a plan view. The plurality of inspection sections 37 may include a plurality of inspection sections 37A to 37D and 37F to 37J (examples of standard inspection sections) that individually correspond to a plurality of standard plates 11Y of a plurality of plate groups 13. Each standard inspection section may have a marker 43 (an example of a standard marker) that the corresponding standard plate 11Y has, and a viewing hole 47 that extends from the upper surface 7b on the +D3 side of the flow channel member 7 (an example of a first surface) to the standard marker. The hole 45 that constitutes the viewing hole 47 and has a specific plate 11Z is referred to as the specific hole 45Z, and the hole 45 that constitutes the viewing hole 47 and has a standard plate 11Y is referred to as the standard hole 45Y. In this case, in a plan view of each of the multiple peepholes 47 that have a standard hole 45Y, the specific hole 45Z may be smaller than any of the standard holes 45Y of the plate group 13 to which it belongs (however, as stated in "in a plan view of each peephole 47", the standard hole 45Y belonging to the peephole 47 to which the specific hole 45Z belongs).

[0156] In this case, for example, when imaging both the marker 43 and the specific hole 45Z of each inspected part 37, the probability of the edge of the standard hole 45Y located between them being captured is reduced. As a result, for example, the algorithm for detecting the edges of the marker 43 and the specific hole 45Z is simplified, and the probability of misidentifying the edge of the standard hole 45Y as the edge of the marker 43 or the specific hole 45Z is reduced. Consequently, the accuracy of displacement measurement is improved.

[0157] The flow channel member 7 according to this embodiment has an upper surface 7b (an example of a first surface) facing the +D3 side in the D3 direction (an example of a first side in the first direction). The flow channel member 7 also has a plurality of plate groups 13 stacked in the D3 direction. Each plate group 13 has a plurality of standard plates 11Y stacked in the D3 direction and a specific plate 11Z that overlaps the plurality of standard plates 11Y on the +D3 side. The flow channel member 7 has a plurality of inspection parts 37 at mutually different positions in a plan view. The plurality of inspection parts include a plurality of inspection parts 37A to 37D and 37F to 37J (examples of standard inspection parts) that individually correspond to a plurality of standard plates 11Y of a plurality of plate groups 13 (2 or more) (2 or more). Each standard inspection part has a marker 43 (an example of a standard marker) that the corresponding standard plate 11Y has and a viewing hole 47 that extends from the upper surface 7b to the standard marker. The hole 45 in the specific plate 11Z that constitutes the peephole 47 is referred to as the specific hole 45Z, and the hole 45 in the standard plate 11Y that constitutes the peephole 47 is referred to as the standard hole 45Y. In a planar view of each peephole 47 that has a standard hole 45Y among the multiple peepholes 47, the specific hole 45Z is smaller than any of the standard holes 45Y in the plate group 13 to which it belongs.

[0158] In this case, for example, when applying the manufacturing method (measurement method) according to the embodiment to the flow channel member 7, the aforementioned effect (the probability that the edge of the standard hole 45Y located between the marker 43 and the specific hole 45Z of each inspected part 37 will be captured in the image is reduced) is achieved. Furthermore, since the flow channel member 7 is manufactured by a manufacturing method that provides high accuracy in measuring deviations, the accuracy of the shape of the flow channel 31 is improved, and consequently, the stability of the ink ejection characteristics is improved.

[0159] In the case of the multiple peepholes 47 that span two or more plate groups 13 (inspection areas 37A to 37D), the specific holes 45Z may be larger in planar projection the closer they are to the +D3 side.

[0160] In this case, when imaging the lower specific hole 45Z, the probability of the edge of the upper specific hole 45Z overlapping with the lower specific hole 45Z is reduced. As a result, the algorithm for detecting the edge of the lower specific hole 45Z is simplified, and the probability of misidentifying the edge of the upper specific hole 45Z as the edge of the lower specific hole 45Z is reduced. Consequently, the accuracy of displacement measurement is improved.

[0161] In each standard inspected section (inspected sections 37A to 37D and 37F to 37J), the marker 43 (standard marker) may be smaller than any of the specific holes 45Z in planar perspective (however, as specified in "in each standard inspected section", the specific hole 45Z belonging to the inspected section 37 to which the marker 43 belongs).

[0162] In this case, for example, the probability that the edge of the specific hole 45Z will overlap with the edge of the marker 43 is reduced. As a result, the algorithm for detecting the edge of the marker 43 is simplified, and the probability of misidentifying the edge of the specific hole 45Z as the edge of the marker 43 is reduced. Consequently, the accuracy of displacement measurement is improved.

[0163] The multiple inspection sections 37 may further include an inspection section 37E (example of a specific inspection section) corresponding to a specific plate 11Z having at least one of the second and subsequent plate groups 13 from the +D3 side. The specific plate 11Z (plate 11E) corresponding to the inspection section 37E may have a marker 43 in the inspection section 37E that is different in nature from the specific hole 45Z having in the standard inspection section (inspection sections 37A to 37D) (see the first example shown in Figure 8).

[0164] In this case, for example, the method of measuring the displacement between plate groups 13 (measuring the displacement between a specific hole 45Z on plate 11K and a marker 43 on plate 11E) is similar to the method of measuring the displacement between plates 11 within plate group 13. This simplifies, for example, the algorithm for measuring the displacement.

[0165] Unlike the above, the specific plate 11Z (plate 11E) corresponding to the part under inspection 37E may have a hole 45 as a marker that has the same shape and dimensions as the specific hole 45Z in the standard part under inspection (parts under inspection 37A to 37D) (see the second example shown in Figure 10). None of the standard plates 11Y may have a marker 43 (example of a standard marker) in the part under inspection 37E.

[0166] In this case, for example, the plate 11E may have a configuration that has only specific holes 45Z, unlike the plate 11E according to the first example (Figure 6). As a result, for example, the design of the plate 11E may be simplified and / or the versatility of the design may be increased.

[0167] Multiple inspection sections 37 may be arranged in one or more rows. The order of the inspection sections 37 in each row may correspond to the stacking order of the corresponding plates 11. A dummy inspection section 41 may be located at the end of any row. The dummy inspection section 41 does not have to have any standard markers (markers 43 on the standard plate 11Y), and may have a hole extending from the top surface 7b to the standard plate 11Y (plate 11A) on the -D3 side.

[0168] In this case, for example, the arrangement of the holes constituting the inspected portion 37 and the dummy inspected portion 41 can be adjusted by the number and position of the dummy inspected portion 41. As a result, the adhesive strength can be made uniform. In addition, for example, it becomes easier to change the design of the number of inspected portions 37 in accordance with a change in the design of the number of plates 11.

[0169] The marker 43 on the standard plate 11Y may be configured not to penetrate the standard plate 11Y to which it belongs.

[0170] In this case, for example, the strength of the plate 11 can be improved compared to the configuration in which the marker 43 is a through hole. Furthermore, it becomes easier to highlight the difference between the plate and the edge of the specific hole 45Z.

[0171] At least some of the plates 11 in the group of plates 13 may have holes 45 (holes 45 that constitute auxiliary holes 49) at positions that overlap in plan view with markers 43 (non-through holes) on a standard plate 11Y located +D3 side of itself.

[0172] The auxiliary hole 49 is highly likely to be unnecessary for applications where the marker 43 (not a through hole) is imaged from the +D3 side. However, by providing the auxiliary hole 49, for example, the strength or adhesive strength in multiple inspected parts 37 (or their surroundings) can be made uniform.

[0173] The multiple plate groups 13 may include a first plate group 13A and a second plate group 13B that overlaps the first plate group 13A on the -D3 side. In this case, equations (1-1), (1-2), and (3) described above may hold.

[0174] In this case, for example, if a deviation exceeding the tolerance occurs, the probability of the edge of the specific hole 45Z overlapping with the edge of the standard hole 45Y, or of the edges of the specific holes 45Z overlapping with each other, is reduced. As a result, the algorithm for detecting these edges is simplified, and the probability of false detection of these edges is reduced. Consequently, the accuracy of deviation measurement is improved.

[0175] The specific plate 11Z (plate 11K-3 in Figure 11) located furthest towards +D3 may have a groove 51 on its +D3 side that extends along the edge of the specific hole 45Z in a plan view.

[0176] In this case, for example, as described above, the groove 51 can be used as a reference for measuring displacement in place of, or in addition to, the edge of the specific hole 45Z. This is effective, for example, when the detection accuracy of the edge of the specific hole 45Z is low. Such a situation is, for example, when the plate 11K-3 is relatively thin.

[0177] The head 3 according to the embodiment (an example of a liquid discharge head) includes a flow path member 7 according to the embodiment and an actuator 25 that applies pressure to the flow path member 7. The printer 1 according to the embodiment (an example of a recording device) includes the head 3 according to the embodiment and a transport device 17 that moves the head 3 and the media P (an example of a recording medium) relative to each other.

[0178] In these cases, for example, since a flow channel member 7 according to an embodiment with high dimensional accuracy of the flow channel 31 is used, the image quality is improved.

[0179] The measuring device 61 according to this embodiment (an example of a displacement measuring device) includes an imaging device 15 that images a plurality of plates 11 stacked in the D3 direction in the D3 direction, and a processing device 65 that identifies the displacement of the plates 11 in a plan view based on the image data captured by the imaging device 15. The processing device 65 identifies the displacement of the plates 11 in a plan view in each of a plurality of plate groups 13 obtained by dividing the plurality of plates 11 in the D3 direction such that each group contains two or more plates 11 (step ST3), and identifies the displacement of the plates 13 in a plan view in a plan view (step ST8).

[0180] Therefore, for example, the manufacturing method (measurement method) according to the embodiment can be realized.

[0181] The technology relating to this disclosure is not limited to the embodiments described above and may be implemented in various forms.

[0182] For example, the recording device may be a plotter. The recording device may be a handheld printer, which is held and moved by the user and moves relative to the recording medium (a transport device is not required). The recording device may move the head relative to the recording medium by moving the head with a robot or the like (a transport device may transport the head).

[0183] The recording medium is not limited to paper. For example, the recording medium may be cloth, wood, tile, printed circuit board (more specifically, an insulating layer on which a conductive pattern is printed), a vehicle body, or a building.

[0184] The liquid dispensing head may be used for purposes other than recording devices. For example, the liquid dispensing head may be used in the preparation of chemicals. Specifically, for example, the liquid dispensing head may dispense a predetermined amount of liquid chemical agent or a liquid containing a chemical agent toward a reaction vessel or the like.

[0185] As can be seen from the examples of recording media above, the liquid is not limited to ink. For example, it may be paint or a conductive material printed on a printed circuit board.

[0186] 1...Printer (recording device), 3...Head (liquid ejection head), 7...Flow channel member, 7b...Top surface (first surface) of (flow channel member), 11...Plate, 11Y...Standard plate, 11Z...Specific plate, 13...Plate group, 13A...First plate group, 13B...Second plate group, 43...Marker, 45...Hole, 45Y...Standard hole, 45Z...Specific hole, 47...Peep hole.

Claims

1. A method for manufacturing a flow channel member having a plurality of plates stacked in a first direction, comprising: measuring a first displacement of the positions of the plates in a plan view in each of the plurality of plate groups, each of which is divided in the first direction such that each of the plurality of plate groups contains two or more of the plates; and measuring a second displacement of the positions of the plate groups in a plan view.

2. The manufacturing method according to claim 1, wherein the measurement of the first displacement is performed based on a first image obtained by imaging at least two of the plates of each plate group together in a first direction under first imaging conditions, and the measurement of the second displacement is performed based on a second image obtained by imaging at least two of the plate groups together in a first direction under second imaging conditions different from the first imaging conditions.

3. The method for manufacturing a flow channel member according to claim 2, wherein the first image and the second image are captured by the same imaging device, and the depth of field of the imaging device is smaller than the thickness of the flow channel member.

4. The method for manufacturing a flow channel member according to claim 3, wherein, under the first imaging condition, the imaging target areas of at least two plates in each plate group are both within the depth of field of the imaging device, and under the second imaging condition, the imaging target areas of adjacent plate groups in the first direction are both within the depth of field of the imaging device.

5. The method for manufacturing a flow channel member according to any one of claims 1 to 4, wherein each plate group comprises a specific plate and a plurality of standard plates, and in the first measurement of displacement, the displacement between the specific plate and each of the plurality of standard plates in each plate group is measured, and in the second measurement of displacement, the displacement between the specific plates in the plurality of plate groups is measured.

6. The method for manufacturing a flow channel member according to claim 5, wherein in each group of plates, the specific plate is the plate located on the first side in the first direction.

7. The method for manufacturing a flow channel member according to claim 6, wherein the flow channel member has a plurality of inspection portions at different positions in a plan view, the plurality of inspection portions include a plurality of standard inspection portions that individually correspond to the plurality of standard plates of the plurality of plate groups, each standard inspection portion has a standard marker that the corresponding standard plate has, and a viewing hole that extends from the first side surface of the flow channel member to the standard marker, and the hole that constitutes the viewing hole and is in the specific plate is referred to as the specific hole, and the hole that constitutes the viewing hole and is in the standard plate is referred to as the standard hole, in a plan view of each of the plurality of viewing holes that has the standard hole, the specific hole is smaller than any of the standard holes that belong to the plate group to which it belongs.

8. A flow channel member having a first surface facing a first side in a first direction, having a plurality of plate groups stacked in the first direction, each plate group having a plurality of standard plates stacked in the first direction, and a specific plate overlapping the plurality of standard plates on the first side, the flow channel member having a plurality of inspection parts at different positions in a plan view, the plurality of inspection parts including a plurality of standard inspection parts that individually correspond to the plurality of standard plates of the plurality of plate groups, each standard inspection part having a standard marker on the corresponding standard plate, and a viewing hole extending from the first surface to the standard marker, the viewing hole is defined as the specific hole, and the viewing hole is defined as the standard hole, in a plan view of each of the plurality of viewing holes that have the standard hole, the specific hole is smaller than any of the standard holes of the plate group to which it belongs.

9. In a plurality of peepholes, the peepholes extend across two or more plate groups, and the specific holes are larger in plan view the closer they are to the first side, according to claim 8.

10. The flow channel member according to claim 8 or 9, wherein in each of the standard inspected sections, the standard marker is smaller than any of the specified holes in a planar view.

11. The flow channel member according to any one of claims 8 to 10, wherein the plurality of inspection portions further include a specific inspection portion corresponding to the specific plate having at least one of the second and subsequent plate groups from the first side, and the specific plate corresponding to the specific inspection portion has a marker in the specific inspection portion that is different in nature from the specific hole having in the standard inspection portion.

12. The flow channel member according to any one of claims 8 to 10, wherein the plurality of inspection portions further include a specific inspection portion corresponding to the specific plate having at least one of the second and subsequent plate groups from the first side, the specific plate corresponding to the specific inspection portion has a hole as a marker having the same shape and dimensions as the specific hole having in the standard inspection portion, and none of the standard plates have the standard marker in the specific inspection portion.

13. The flow channel member according to any one of claims 8 to 12, wherein the plurality of inspection parts are arranged in one or more rows, the order of the inspection parts in each row corresponds to the stacking order of the corresponding plates, a dummy inspection part is located at the end of any row, the dummy inspection part does not have the standard marker on any of the standard plates, and has a hole extending from the first surface to the standard plate furthest away from the first side.

14. The flow channel member according to any one of claims 8 to 13, wherein the standard marker does not penetrate the standard plate to which it belongs.

15. The flow channel member according to claim 14, wherein at least some of the plates of the plurality of plate groups have holes in a position that overlaps in plan view with the standard markers of the standard plate located to the first side of itself.

16. The flow channel member according to any one of claims 8 to 15, wherein the plurality of plate groups include a first plate group and a second plate group overlapping the first plate group on the opposite side from the first side, and in the first plate group, the diameter of the specific hole is a1 and the diameter of the standard hole is b1, in the second plate group, the diameter of the specific hole is a2 and the diameter of the standard hole is b2, and the allowable error of the planar displacement between the plates is x, such that (b1-a1) / 2 > x, (b2-a2) / 2 > x, and (a1-a2) / 2 > x.

17. The flow channel member according to any one of claims 8 to 16, wherein the specific plate located on the first side has a groove on its first surface that extends along the edge of the specific hole in a plan view.

18. A liquid discharge head having a flow channel member according to any one of claims 8 to 17, and an actuator for applying pressure to the flow channel member.

19. A recording device comprising: a liquid discharge head according to claim 18; and a transport device for moving the liquid discharge head and a recording medium relative to each other.

20. An imaging device that images a plurality of plates stacked in a first direction in the first direction, and a processing device that identifies the positional displacement of the plates in a plan view based on the image data captured by the imaging device, wherein the processing device identifies the positional displacement of the plates in a plan view in each of the plurality of plate groups obtained by dividing the plurality of plates in the first direction such that each of the plurality of plate groups includes two or more of the plates, and a displacement measuring device that identifies the positional displacement of the plate groups in a plan view in each of the plate groups obtained by imaging together.

Images