Inspection apparatus and inspection method for side surface electrodes of chip stacking device

Abstract

The present disclosure provides an inspection apparatus capable of inspecting side surface electrodes of a chip stacking device. The present disclosure concerns an inspection apparatus for side surface electrodes of a chip stacking device. The chip stacking device includes a first surface through a fourth surface. The first surface has a side surface electrode and an edge mark at a prescribed position with respect to the side surface electrode. The chip stacking device includes a quantitative phase microscope and an inspection unit. The inspection unit is provided with an optical information acquisition unit that acquires optical information measured by the quantitative phase microscope. The optical information includes: first information, which is based on light reflected from the first surface where the side surface electrode is exposed or light reflected from a surface where the edge mark is exposed and which includes information relating to the side surface electrode or the edge mark in a direction following the first surface or the surface where the edge mark is exposed; and second information, which includes information relating to the side surface electrode or the edge mark in a direction intersecting the first surface or the surface where the edge mark is exposed.

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