Panel, photovoltaic module and preparation method for panel

Abstract

The present application relates to the technical field of photovoltaic power generation. Provided are a panel, a photovoltaic module and a preparation method for the panel. The panel comprises: a substrate; a first rough layer arranged on the back side of the substrate; and a first ink layer arranged on the back side of the first rough layer, wherein the area proportion of the first ink layer on the first rough layer ranges from 30% to 70%. The present application reduces the loss of charging power caused by light reflection from the panel in photovoltaic modules, improving the charging efficiency of photovoltaic cells within a battery encapsulation panel, and mitigating local current limiting in the photovoltaic cells.

Description

Panels, photovoltaic modules, and panel fabrication methods

[0001] This application claims priority to Chinese patent application filed on January 2, 2025, with application number 202510012690.0 and entitled "Panel, Photovoltaic Module and Method for Preparing Panel", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of photovoltaic power generation technology, and more specifically, to a panel, a photovoltaic module, and a method for preparing the panel. Background Technology

[0003] With the continuous development of photovoltaic technology, photovoltaic tiles, as a new type of building material that integrates power generation and architectural aesthetics, have received widespread attention.

[0004] In related technologies, photovoltaic cells in photovoltaic modules are all encapsulated in the panel on the light-receiving side. The inventors realized that the brighter the color of the photovoltaic cell panel, the more obvious the reflection of light, that is, the lower the energy that the photovoltaic cell can absorb, resulting in a greater loss of charging power of the photovoltaic cell.

[0005] Application content

[0006] This application aims to solve the problem of significant charging power loss caused by light reflection from photovoltaic cell panels in existing or related technologies.

[0007] Therefore, the first aspect of this application proposes a panel.

[0008] The second aspect of this application proposes a photovoltaic module.

[0009] The third aspect of this application proposes a method for preparing a panel.

[0010] In view of this, a panel is provided according to a first aspect of the present application, comprising: a substrate; a first roughening layer disposed on the backlight side of the substrate; and a first ink layer disposed on the backlight side of the first roughening layer, wherein the area ratio of the first ink layer on the first roughening layer ranges from 30% to 70%.

[0011] According to a second aspect of this application, a photovoltaic module is provided, comprising: a battery encapsulation plate and a panel, wherein the panel is the panel in any of the above-described technical solutions, and the panel is disposed on the light-receiving side of the battery encapsulation plate.

[0012] According to a third aspect of this application, a method for preparing a panel is provided for preparing a panel in any of the above-mentioned technical solutions. The method for preparing the panel includes: roughening a substrate to form a first roughened layer on the backlight side of the substrate; and performing a printing process on the first roughened layer to form a first ink layer on the first roughened layer; wherein the area ratio of the first ink layer on the first roughened layer is in the range of 30% to 70%.

[0013] The panel includes a substrate and a first roughened layer disposed on the substrate. The first roughened layer is located on the backlight side of the substrate, i.e., disposed on the backlight side surface of the substrate. A first ink layer is also disposed on the first roughened layer, located on the backlight side of the first roughened layer, i.e., the first roughened layer is located between the first ink layer and the substrate. The panel can serve as the upper support layer of a photovoltaic module, i.e., the panel is disposed on the light-receiving side of the battery encapsulation plate. Before light enters the battery encapsulation plate, it passes through the panel. When sunlight passes through the first roughened layer and the first ink layer on the backlight side of the panel, the first roughened layer and the first ink layer can diffusely reflect the light towards the battery encapsulation plate, allowing the battery encapsulation plate to receive the reflected light. Simultaneously, it can make the light distribution on the surface of the battery encapsulation plate more uniform, reducing local current limiting in the battery encapsulation plate. The area ratio of the first ink layer on the first roughening layer is set between 30% and 70%, which improves the effect of the first ink layer and the first roughening layer in diffusely reflecting light to the battery encapsulation plate. This reduces the loss of charging power caused by light reflection by the panel in the photovoltaic module, improves the charging efficiency of the photovoltaic cells in the battery encapsulation plate, and reduces local current limiting of the photovoltaic cells.

[0014] Additional aspects and advantages of this application will become apparent in the following description or may be learned by practice of this application. Attached Figure Description

[0015] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0016] Figure 1 shows a schematic diagram of the structure of a panel provided in some embodiments of this application;

[0017] Figure 2 shows a second schematic diagram of the structure of the panel provided in some embodiments of this application;

[0018] Figure 3 shows one of the schematic diagrams of ink distribution provided in some embodiments of this application;

[0019] Figure 4 shows a second schematic diagram of the distribution of ink printing provided in some embodiments of this application;

[0020] Figure 5 shows a schematic diagram of the distribution of ink printing provided in some embodiments of this application (the third one).

[0021] Figure 6 shows a third schematic diagram of the structure of the panel provided in some embodiments of this application;

[0022] Figure 7 shows a fourth schematic diagram of the structure of the panel provided in some embodiments of this application;

[0023] Figure 8 shows one of the structural schematic diagrams of a photovoltaic module provided in some embodiments of this application;

[0024] Figure 9 shows a second schematic diagram of the structure of a photovoltaic module provided in some embodiments of this application;

[0025] Figure 10 shows a flowchart of a panel fabrication method provided in some embodiments of this application;

[0026] Figure 11 shows a flowchart of a method for preparing a photovoltaic module provided in some embodiments of this application.

[0027] The reference numerals in the attached figures are as follows: 100 panel, 110 substrate, 120 first roughened layer, 130 first ink layer, 132 ink printing, 134 blank area, 140 second roughened layer, 200 photovoltaic module, 210 battery encapsulation board, 220 backplane, 221 third roughened layer, 222 second ink layer. Detailed Implementation

[0028] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, these embodiments and the features described herein can be combined with each other.

[0029] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0030] The following describes, with reference to Figures 1 to 11, some embodiments of the panel, photovoltaic module, and method of manufacturing the panel according to this application.

[0031] According to one embodiment of this application, FIG1 shows a schematic diagram of the structure of a panel provided in some embodiments of this application, and FIG2 shows a schematic diagram of the structure of a panel provided in some embodiments of this application. As shown in FIG1 and FIG2, a panel 100 is proposed, including: a substrate 110; a first roughening layer 120 disposed on the backlight side of the substrate 110; and a first ink layer 130 disposed on the backlight side of the first roughening layer 120, wherein the area ratio of the first ink layer 130 on the first roughening layer 120 ranges from 30% to 70%.

[0032] In this embodiment, the panel 100 includes a substrate 110 and a first roughening layer 120 disposed on the substrate 110. The first roughening layer 120 is located on the backlight side of the substrate 110, i.e., disposed on the backlight side surface of the substrate 110. A first ink layer 130 is also disposed on the first roughening layer 120, located on the backlight side of the first roughening layer 120, i.e., the first roughening layer 120 is located between the first ink layer 130 and the substrate 110. The panel 100 can serve as an upper support layer for a photovoltaic module. The panel 100 is disposed on the light-receiving side of the battery encapsulation plate. Before light enters the battery encapsulation plate, it passes through the panel 100. When sunlight passes through the first roughening layer 120 and the first ink layer 130 on the backlight side of the panel 100, the first roughening layer 120 and the first ink layer 130 can diffusely reflect the light towards the battery encapsulation plate, allowing the battery encapsulation plate to receive the reflected light. Simultaneously, it can make the light distribution on the surface of the battery encapsulation plate more uniform, reducing local current limiting in the battery encapsulation plate.

[0033] Arrow A in Figures 1 and 2 shows the illuminated side, and arrow B shows the shaded side.

[0034] It should be noted that the first ink layer 130 is disposed on the first rough layer 120. Since the surface of the first rough layer 120 is uneven, compared with the first ink layer 130 being disposed on a smooth surface, it can increase the diffuse reflection light to the cell encapsulation plate in the photovoltaic module by 50% to 80% or more, while making the light distribution more uniform and reducing the local current limiting of the solar cells in the cell encapsulation plate.

[0035] For example, the first roughness of the first rough layer 120 ranges from 0.2 μm to 2000 μm.

[0036] Specifically, the first roughening layer 120 is integrally formed with the substrate 110, which may be a glass substrate 110. The first roughening layer 120 is formed on the backlight side of the substrate 110 by rubbing the glass substrate 110. After the first roughening layer 120 is formed on the substrate 110, the first ink layer 130 is sprayed or printed on the surface of the first roughening layer 120, which simplifies the production steps.

[0037] In this embodiment, the first ink layer 130 covers the surface of the first roughening layer 120, and the area ratio of the first ink layer 130 on the first roughening layer 120 is greater than or equal to 30% and less than or equal to 70%. It is understood that setting the area ratio of the first ink layer 130 on the first roughening layer 120 to 30% to 70% ensures that the first ink layer 130, in conjunction with the first roughening layer 120, can diffusely reflect as much light as possible towards the battery encapsulation plate, thereby improving the uniformity of light on the surface of the battery encapsulation plate and further enhancing the absorption of light energy by the battery encapsulation plate, thus reducing the charging power loss of the photovoltaic module.

[0038] It should be noted that since the area ratio of the first ink layer 130 is between 30% and 70%, the first ink layer 130 includes multiple covering areas covering the first rough layer 120, and the multiple covering areas are equally spaced, that is, the multiple covering areas are evenly distributed in the first rough layer 120, thereby ensuring the uniformity of light transmission to the surface of the battery packaging board under the cooperation of the first ink layer 130 and the first rough layer 120.

[0039] For example, the substrate 110 may be ultra-white tempered glass.

[0040] In this embodiment, the panel 100 can be disposed in a photovoltaic module, that is, disposed on a solar cell encapsulation plate in a photovoltaic module. The shape of the cell encapsulation plate can be planar or curved.

[0041] For example, the photovoltaic cells in the battery encapsulation panel can be at least one of crystalline silicon solar cells and thin-film solar cells.

[0042] In this embodiment, a first roughened layer 120 is formed on the backlight side of the substrate 110 by performing frosting or etching. Then, a first ink layer 130 is formed by coating or printing on the surface of the first roughened layer 120. The area ratio of the first ink layer 130 on the first roughened layer 120 is set to be more than 30%, which improves the effect of the first ink layer 130 and the first roughened layer 120 in diffusely reflecting light to the battery encapsulation plate. This reduces the loss of charging power caused by the reflection of light by the panel 100 in the photovoltaic module, improves the charging efficiency of the photovoltaic cell in the battery encapsulation plate, and reduces the local current limiting of the photovoltaic cell.

[0043] In some embodiments, the first ink layer 130 may optionally include at least two ink stamps 132, which are uniformly distributed in the first rough layer 120.

[0044] In this embodiment, the first ink layer 130 includes at least two ink prints 132, which are evenly distributed on the backlight side of the first rough layer 120, so that the area covered by the at least two ink prints 132 is evenly distributed, and the area not covered by the at least two ink prints 132 is also evenly distributed, thereby improving the uniformity of diffuse reflection of light by the first ink layer 130 including the at least two ink prints 132.

[0045] Specifically, since the area ratio of the first ink layer 130 is between 30% and 70%, there are areas on the first roughening layer 120 that are not covered by the first ink layer 130. Multiple ink prints 132 cover the first roughening layer 120, with gaps between adjacent ink prints 132. The multiple ink prints 132 are arranged in an array, thereby ensuring that the multiple ink prints 132 are evenly distributed on the first roughening layer 120.

[0046] Figure 3 shows one of the schematic diagrams of the distribution of ink prints provided in some embodiments of this application, Figure 4 shows another schematic diagram of the distribution of ink prints provided in some embodiments of this application, and Figure 5 shows a third schematic diagram of the distribution of ink prints provided in some embodiments of this application. As shown in Figures 3 to 5, a plurality of ink prints 132 are arranged in a rectangular array on the first rough layer 120.

[0047] As shown in Figure 3, ink print 132 is a dot ink print, and the horizontal spacing between two adjacent columns of dot ink prints is the same, as is the vertical spacing between two adjacent rows of dot ink prints.

[0048] As shown in Figure 4, the ink print 132 is an elliptical ink print, and the substrate 110 is a curved substrate. The short axis direction of the elliptical ink print matches the bending direction of the substrate 110, and the horizontal spacing between two adjacent columns of elliptical ink prints is the same, as is the vertical spacing between two adjacent rows of elliptical ink prints.

[0049] As shown in Figure 5, the photovoltaic module also includes a backsheet. The surface of the backsheet on the light-receiving side is provided with a second ink layer. The second ink layer also includes multiple ink prints. The ink prints of the second ink layer and the ink prints 132 of the first ink layer 130 are both selected as diamond-shaped ink prints. The ink prints 132 on the first rough layer 120 are staggered with the ink prints of the second ink layer. That is, there is only one ink print in each region along the direction perpendicular to the substrate 110. There are blank areas 134 between the ink prints 132. The blank areas 134 are the regions corresponding to the ink prints of the second ink layer.

[0050] It should be noted that multiple ink stamps 132 can be printed or coated simultaneously on the first rough layer 120, which simplifies the operation steps of setting the first ink layer 130 on the first rough layer 120.

[0051] In this embodiment, the first ink layer 130 includes a plurality of ink prints 132. When the panel 100 is used for a photovoltaic module, since the panel 100 covers the light-receiving side of the battery encapsulation plate, the first ink layer 130 can diffusely reflect light to the battery encapsulation plate. Furthermore, by uniformly distributing the plurality of ink prints 132 on the first rough layer 120, the uniformity of the diffuse reflection of light by the first ink layer 130 can be further improved.

[0052] In some embodiments, optionally, the area of ​​each of the at least two ink prints 132 is in the range of 0.05 mm. 2 up to 0.8mm 2 .

[0053] In this embodiment, at least two ink prints 132 are distributed on the first roughened layer 120, and the area of ​​each ink print 132 is greater than or equal to 0.05 mm. 2 And less than or equal to 0.8mm 2 This makes the area of ​​each individual ink print 132 in the first ink layer 130 smaller, thereby improving the effect of diffuse reflection of light in the first ink layer 130.

[0054] It should be noted that the areas of at least two ink prints of 132 can be the same or different.

[0055] For example, at least two ink prints 132 have the same area, and the area of ​​each ink print 132 is 0.05 mm. 2 In this case, 3D printing is used to print ink 132 onto the first rough layer 120.

[0056] For example, at least two ink prints 132 have different areas, and the area of ​​each ink print 132 is greater than 0.4 mm. 2 Then, ink 132 is printed onto the first rough layer 120 using screen printing.

[0057] In this embodiment, the area of ​​each ink print 132 is designed to be greater than or equal to 0.05 mm. 2 And less than or equal to 0.8mm 2 This improves the diffuse reflection effect of the first ink layer 130 on light.

[0058] In some embodiments, optionally, at least two ink prints 132 include at least one of the following: dot ink print, elliptical ink print, and diamond ink print.

[0059] In this embodiment, when the first ink layer 130 includes at least two ink prints 132, the shape of the at least two ink prints 132 can be selected as at least one of dot ink prints, elliptical ink prints, and diamond ink prints. It should be noted that the shapes of the at least two ink prints 132 can be the same or different.

[0060] For example, at least two ink prints 132 are partially dotted ink prints and partially diamond-shaped ink prints, with the diamond-shaped ink prints and dotted ink prints interleaved on the first roughened layer 120, meaning that the diamond-shaped ink prints and dotted ink prints are positioned adjacent to each other. By interleaving the diamond-shaped ink prints and dotted ink prints, the coverage area of ​​the at least two ink prints on the first roughened layer 120 can be effectively increased.

[0061] In this embodiment of the application, by selecting at least one of the following ink prints 132: dot ink print, elliptical ink print, and diamond ink print, the aesthetics of the panel 100 can be improved, and the personalized needs of the user can be met. Furthermore, by combining and setting various ink prints 132 of different shapes, the diffuse reflection effect of the first ink layer 130 on light can be further improved, and the coverage area of ​​the first ink layer 130 on the first rough layer 120 can be increased.

[0062] In some embodiments, the first roughness of the first rough layer 120 may optionally range from 0.2 μm to 50 μm.

[0063] In this embodiment, when the panel 100 is applied to a photovoltaic module, the panel 100 needs to be assembled with the battery encapsulation plate. During the assembly process, since the first rough layer 120 is located on the backlight side of the panel 100, that is, the first rough layer 120 is in contact with the battery encapsulation plate, the first rough layer 120 can provide a gap between the panel 100 and the battery encapsulation plate, reducing the generation of air bubbles between the panel 100 and the battery encapsulation plate during encapsulation.

[0064] It is understandable that the first ink layer 130 is set on the first rough layer 120 by screen printing, 3D printing, or coating. Therefore, the roughness of the first ink layer 130 is close to that of the first rough layer 120. Even if the area of ​​the first ink layer 130 is relatively large, the possibility of air bubbles being generated between the panel 100 and the battery packaging board during packaging can be reduced by setting the roughness of the first rough layer 120.

[0065] In this embodiment, the first roughness is the roughness of the first rough layer 120. The value range of the first roughness is greater than or equal to 0.2 μm and less than or equal to 50 μm. Setting the value range of the roughness of the first rough layer 120 to be relatively large can further simplify the process of preparing the panel 100.

[0066] For example, the first roughness is 1.31 μm.

[0067] In this embodiment, by providing a first rough layer 120 on the backlight side of the substrate 110, and setting the first roughness of the first rough layer 120 to be greater than or equal to 0.2 μm and less than or equal to 50 μm, the generation of air bubbles between the panel 100 and the battery encapsulation plate is avoided without increasing the number of operation steps in the panel 100 preparation process, thereby improving the yield of photovoltaic modules.

[0068] Figure 6 shows a third schematic diagram of the structure of the panel provided in some embodiments of this application, and Figure 7 shows a fourth schematic diagram of the structure of the panel provided in some embodiments of this application. As shown in Figures 6 and 7, in some embodiments, the panel 100 may optionally include a second roughening layer 140 disposed on the light-receiving side of the substrate 110, wherein the second roughness of the second roughening layer 140 ranges from 0.8 μm to 2.2 μm.

[0069] In this embodiment, the panel 100 further includes a second roughening layer 140 disposed on the light-receiving side surface of the substrate 110. The second roughening layer 140 is provided on the light-receiving side of the photovoltaic module. The panel 100 can be the upper support layer of the photovoltaic module, that is, the panel 100 is disposed on the light-receiving side of the battery encapsulation plate. By providing the second roughening layer 140 on the light-receiving side of the substrate 110, the reflection of sunlight by the photovoltaic module can be reduced. The panel 100 with the first roughening layer 120 disposed on the light-receiving side surface is in an exposed state, and is less prone to dust accumulation than the panel 100 with a smooth surface.

[0070] Specifically, the second roughening layer 140 is integrally formed with the substrate 110, and the first roughening layer 120 is also integrally formed with the substrate 110. The second roughness of the second roughening layer 140 is greater than or equal to 0.8 μm and less than or equal to 2.2 μm. It can be seen that the value of the second roughness is within the value range of the first roughness. Therefore, the surfaces of the light-receiving side and the backlight side of the substrate 110 can be processed simultaneously to obtain the first roughening layer 120 and the second roughening layer 140 with the same roughness.

[0071] For example, the light-receiving side surface and the back-light-receiving side surface of the substrate 110 are simultaneously subjected to frosting or etching and polishing processes, and the frosting processing parameters are the same, so that a first rough layer 120 and a second rough layer 140 with similar roughness are formed on the light-receiving side surface and the back-light-receiving side surface of the substrate 110, respectively.

[0072] In this embodiment, a roughening treatment is performed on the substrate 110 to form a second rough layer 140 on the light-receiving side surface of the substrate 110. The second roughness corresponding to the second rough layer 140 is set to be greater than or equal to 0.8 μm and less than or equal to 2.2 μm, so that the panel 100 maintains good light transmittance while also having good anti-glare effect and being less prone to dust accumulation.

[0073] In some embodiments, the second roughness may optionally range from 1.31 μm to 2.2 μm.

[0074] In this application's technical solution, the second roughness value of the second rough layer 140 is greater than or equal to 1.31 μm and less than or equal to 2.2 μm. It is understood that by setting the target roughness to 1.31 μm or higher, sufficient roughness on the light-receiving side of the panel 100 can be ensured to reduce overall light reflection by the panel 100. Furthermore, setting the second roughness to less than or equal to 2.2 μm avoids the adverse effects of excessively rough texture on the light transmittance of the panel 100. This achieves both maintaining the light transmittance of the panel 100 and reducing its reflectivity, thereby reducing the glare caused by the panel 100 being installed on the photovoltaic module.

[0075] For example, the second roughness can be 1.4 μm.

[0076] In some embodiments, the transmittance of the substrate 110 may optionally range from 80% to 100%.

[0077] In this embodiment of the application, the light transmittance of the substrate 110 is set to be greater than or equal to 80% and less than or equal to 100%, so that the panel 100 processed based on the substrate 110 has good light transmittance. When the panel 100 is disposed in the photovoltaic module, the transmittance of sunlight in the panel 100 is improved, thereby improving the power generation efficiency of the photovoltaic module.

[0078] In some embodiments, the panel 100 may optionally include at least one of the following: a flat panel, a curved panel.

[0079] In this embodiment, the panel 100 can be either a planar shape or a curved shape, so that the panel 100 can be adapted to a variety of products with different shapes.

[0080] For example, when panel 100 is a curved panel, the curved panel can be assembled with a curved battery encapsulation plate to obtain a curved photovoltaic module. When panel 100 is a flat panel, the flat panel can be assembled with a flat battery encapsulation plate to obtain a flat photovoltaic module.

[0081] As shown in Figures 1 and 6, panel 100 is a planar panel, while as shown in Figures 2 and 7, panel 100 is a curved panel.

[0082] It should be noted that the cross-sectional shape of the curved photovoltaic module is a "sine wave," which easily concentrates light at the "crest" position, leading to more severe glare at that location. By assembling a panel 100 with a second roughening layer 140 on the light-receiving side surface into the curved photovoltaic module, the reflectivity at the "crest" position can be effectively reduced, thereby improving the anti-glare performance of the photovoltaic module. Furthermore, the uniformity of light received by the battery encapsulation panel can be improved through the first roughening layer 120 and the first ink layer 130 on the backlight side surface.

[0083] In this embodiment, the panel 100 is shaped as a planar shape or a curved shape, so that the panel 100 can be adapted to photovoltaic modules with planar or curved shapes, thus broadening the application scenarios of the panel 100. When the panel 100 is applied to photovoltaic modules with curved shapes, it can effectively reduce the glare of the photovoltaic modules, improve the charging efficiency of the photovoltaic cells in the battery encapsulation board, and reduce the local current limiting of the photovoltaic cells.

[0084] In some embodiments, the thickness of the substrate 110 may optionally range from 1.8 mm to 5 mm.

[0085] In this embodiment, the thickness of the substrate 110 is greater than or equal to 1.8 mm and less than or equal to 5 mm. By limiting the thickness of the substrate 110 to the above range, the first roughening layer 120 and the first ink layer 130 on the backlight side surface of the substrate 110 can further improve the uniformity of light on the surface of the battery encapsulation board and improve the absorption of light energy by the battery encapsulation board, thereby reducing the loss of charging power of the photovoltaic module.

[0086] For example, the thickness of the substrate 110 is 4 mm, specifically, the substrate 110 is selected as 4 mm ultra-white glass.

[0087] In some embodiments, the first ink layer 130 may be an opaque ink layer, and the first ink layer 130 may include at least one of the following: lead chromate, nano-calcium, fluorescent paste, manganese metal compound, and cobalt metal compound.

[0088] In this embodiment, the first ink layer 130 is an opaque ink layer obtained by printing with high-temperature resistant ink. The selection of opaque ink for the first ink layer 130 ensures the diffuse reflection effect of the first ink layer 130 on light. Furthermore, by adding at least one of lead chromate, nano-calcium, fluorescent paste, manganese metal compound, and cobalt metal compound to the ink of the first ink layer 130, the diffuse reflection effect of the first ink layer 130 on the solar cell encapsulation plate can be further improved, and the solar energy can be transmitted to the solar cell encapsulation plate more evenly, effectively reducing the local current limiting of the solar cells in the solar cell encapsulation plate.

[0089] According to one embodiment of this application, FIG8 shows one of the structural schematic diagrams of a photovoltaic module provided in some embodiments of this application, and FIG9 shows another structural schematic diagram of a photovoltaic module provided in some embodiments of this application. As shown in FIG8 and FIG9, a photovoltaic module 200 is proposed, including: a battery encapsulation plate 210 and a panel 100. The panel 100 is the panel in any of the above embodiments, and the panel 100 is disposed on the light-receiving side of the battery encapsulation plate 210.

[0090] In this embodiment, the photovoltaic module 200 includes a battery encapsulation plate 210 and a panel 100. The panel 100 is mounted on the light-receiving surface of the battery encapsulation plate 210, and light is transmitted through the panel 100 into the battery encapsulation plate 210. Since the backlight side of the panel 100 is provided with a first roughening layer and a first ink layer, the light transmitted to the battery encapsulation plate 210 is reflected by the battery encapsulation plate 210 and transmitted to the first ink layer. The first ink layer provided on the first roughening layer can diffusely reflect the light back toward the battery encapsulation plate 210, thereby improving the uniformity of light on the surface of the battery encapsulation plate 210 and further improving the absorption of light energy by the battery encapsulation plate 210, reducing the charging power loss of the photovoltaic module 200.

[0091] Arrow A in Figures 8 and 9 shows the illuminated side, and arrow B shows the shaded side.

[0092] It should be noted that the battery in the battery packaging board 210 is a photovoltaic cell, that is, a semiconductor element that generates an electromotive force under the irradiation of light.

[0093] For example, the battery in the battery encapsulation plate 210 can be a crystalline silicon solar cell or a thin-film solar cell, specifically an XBC (X Back Contact) photovoltaic cell.

[0094] In this embodiment, a first roughening layer and a first ink layer are formed on the backlight side surface of the panel 100 of the photovoltaic module 200. This improves the effect of the first ink layer and the first roughening layer in diffusely reflecting light to the battery encapsulation plate 210, thereby reducing the loss of charging power caused by the reflection of light by the panel 100 in the photovoltaic module 200, improving the charging efficiency of the photovoltaic cells in the battery encapsulation plate 210, and reducing the local current limiting of the photovoltaic cells.

[0095] In some embodiments, the photovoltaic module 200 may optionally include: a back sheet 220 disposed on the backlight side of the battery encapsulation plate 210; a third roughening layer 221 disposed on the light-receiving side of the back sheet 220; and a second ink layer 222 disposed on the third roughening layer 221, wherein the second ink layer 222 is located between the third roughening layer 221 and the battery encapsulation plate 210.

[0096] In this embodiment, the photovoltaic module 200 further includes a back sheet 220, a battery encapsulation plate 210 located between the back sheet 220 and the panel 100, and the surface of the back sheet 220 on the light-receiving side is provided with a third rough layer 221 and a second ink layer 222. That is, the battery encapsulation plate 210 is in contact with the first rough layer and the first ink layer on the back side of the panel 100, and the battery encapsulation plate 210 is in contact with the third rough layer 221 and the second ink layer 222 on the light-receiving side of the back sheet 220.

[0097] Specifically, when the photovoltaic module 200 is installed on the roof, sunlight passes through the panel 100, the battery encapsulation plate 210 and the back sheet 220. When the sunlight passes through the panel 100, it undergoes diffuse reflection through the first rough layer and the first ink layer, so that the sunlight is evenly transmitted to the light-receiving side of the battery encapsulation plate 210. When the sunlight is transmitted to the back sheet 220, it undergoes diffuse reflection through the third rough layer 221 and the second ink layer 222, so that the sunlight is evenly transmitted to the back side of the battery encapsulation plate 210.

[0098] It should be noted that the third roughness of the third rough layer 221 is the same as the first roughness of the first rough layer. The panel 100 and the back panel 220 have the same size. Therefore, the areas of the first rough layer and the third rough layer 221 are the same. The area ratio of the second ink layer 222 on the third rough layer 221 is the same as the area ratio of the first ink layer on the first rough layer.

[0099] For example, the back panel 220 can reuse the panel 100 by assembling the backlight side of the panel 100 as the light-receiving side with the battery encapsulation plate 210, thereby completing the reuse of the panel 100.

[0100] For example, when a second rough layer is provided on the light-receiving side of the panel 100 to serve as an anti-glare layer, since the back panel 220 does not need to serve as an anti-glare layer, the back panel 220 can be designed separately so that the roughness of the third rough layer 221 is greater than that of the second rough layer, thereby further improving the diffuse reflection effect of the back panel 220 on sunlight.

[0101] In this embodiment, by placing the battery encapsulation plate 210 between the panel 100 and the back plate 220, and also providing a corresponding third roughening layer 221 and a second ink layer 222 on the back plate 220, the back plate 220 also has the ability to diffusely reflect sunlight, thereby further improving the charging efficiency of the photovoltaic cells in the battery encapsulation plate 210 and reducing the local current limiting of the photovoltaic cells.

[0102] In some embodiments, the battery encapsulation plate 210 may optionally include at least one of the following: a planar battery encapsulation plate 210 and a curved battery encapsulation plate 210; wherein the shapes of the battery encapsulation plate 210, the front panel 100 and the back panel 220 are matched.

[0103] In this embodiment, the shape of the battery encapsulation plate 210 can be planar or curved, meaning the photovoltaic module 200 can be either planar or curved. When the battery encapsulation plate 210 is selected as a planar battery encapsulation plate 210, the panel 100 is selected as a planar panel 100, and the back plate 220 is selected as a planar back plate 220. When the battery encapsulation plate 210 is selected as a curved battery encapsulation plate 210, the back plate 220 is selected as a curved panel 100, and the back plate 220 is selected as a curved back plate 220. Based on the different shapes of the battery encapsulation plate 210, different shapes of panel 100 and back plate 220 are selected so that the assembled photovoltaic module 200 can be planar or curved, and the photovoltaic cells in the planar or curved battery encapsulation plate 210 all have good charging efficiency and uniform light irradiation.

[0104] It should be noted that the cross-sectional shape of the curved photovoltaic module 200 is a "sine wave" shape. Light tends to concentrate at the "crest" position of the photovoltaic module 200, leading to more severe glare at that location. By assembling a panel 100 with a second roughened layer on the light-receiving side surface into the curved photovoltaic module 200, the reflectivity at the "crest" position can be effectively reduced, thereby improving the anti-glare performance of the photovoltaic module 200. Furthermore, the uniformity of light received by the battery encapsulation plate 210 can be improved through the first roughened layer and the first ink layer on the backlight side surface.

[0105] In this embodiment, the panel 100 is shaped as a planar shape or a curved shape, so that the panel 100 can be adapted to the photovoltaic module 200 with a planar or curved shape, thus broadening the application scenarios of the panel 100. When the panel 100 is applied to the photovoltaic module 200 with a curved shape, it can effectively reduce the glare of the photovoltaic module 200, improve the charging efficiency of the photovoltaic cell in the battery encapsulation plate 210, and reduce the local current limiting of the photovoltaic cell.

[0106] According to one embodiment of this application, FIG10 shows a flowchart of a panel fabrication method provided in some embodiments of this application. As shown in FIG10, a panel fabrication method is proposed for fabricating the panel in any of the above embodiments. The panel fabrication method includes:

[0107] Step 1002: Roughen the substrate to form a first roughening layer on the backlight side of the substrate.

[0108] In this embodiment, the first roughening layer is disposed on the surface of the backlight side of the substrate. Therefore, it is possible to select roughening treatment on both the light-receiving side and the backlight side of the substrate, or only roughening treatment on the backlight side of the substrate. After roughening treatment of the substrate, the first roughening layer can be formed on the backlight side of the substrate.

[0109] For example, the first roughness of the first rough layer ranges from 0.2 μm to 50 μm.

[0110] Step 1004: A printing process is performed on the first roughened layer to form a first ink layer on the first roughened layer;

[0111] The area ratio of the first ink layer on the first roughened layer ranges from 30% to 70%.

[0112] In this embodiment, the first ink layer is printed on the upper surface of the first roughening layer and is located on the backlight side of the first roughening layer, i.e., the first roughening layer is located between the first ink layer and the substrate. The panel can serve as the upper support layer of the photovoltaic module; that is, the panel is positioned on the light-receiving side of the battery encapsulation plate. Before light enters the battery encapsulation plate, it passes through the panel. When sunlight passes through the first roughening layer and the first ink layer on the backlight side of the panel, the first roughening layer and the first ink layer can diffusely reflect the light towards the battery encapsulation plate, allowing the battery encapsulation plate to receive the reflected light. Simultaneously, it allows the light to be distributed more evenly on the surface of the battery encapsulation plate, reducing localized current limiting.

[0113] For example, the first ink layer is an opaque ink layer, comprising at least one of the following: lead chromate, nano-calcium, fluorescent paste, manganese metal compound, and cobalt metal compound. The first ink layer is an opaque ink layer obtained by printing with high-temperature resistant ink. Because the first ink layer is selected for opaque ink printing, the diffuse reflection effect of the first ink layer on light is guaranteed. Furthermore, by adding at least one of lead chromate, nano-calcium, fluorescent paste, manganese metal compound, and cobalt metal compound to the ink of the first ink layer, the diffuse reflection effect of the first ink layer on sunlight reflecting onto the battery encapsulation plate can be further improved, and the solar light can be transmitted to the battery encapsulation plate more uniformly, effectively reducing the local current limiting of the solar cells in the battery encapsulation plate.

[0114] It should be noted that the first ink layer is set on the first rough layer. Because the surface of the first rough layer is uneven, compared with the first ink layer being set on a smooth surface, it can increase the diffuse reflection of light to the cell encapsulation plate in the photovoltaic module by 50% to 80% or more, while making the light distribution more uniform and reducing the local current limiting of the solar cells in the cell encapsulation plate.

[0115] In this embodiment, a first ink layer covers the surface of a first roughened layer, and the area percentage of the first ink layer on the first roughened layer is greater than or equal to 30% and less than or equal to 70%. It is understood that setting the area percentage of the first ink layer on the first roughened layer to 30% to 70% ensures that the first ink layer, in conjunction with the first roughened layer, can diffusely reflect as much light as possible towards the battery encapsulation plate.

[0116] For example, the first ink layer includes at least two ink prints, i.e., the first ink layer is formed on the first roughened layer by printing at least two ink prints on the first roughened layer. Specifically, for example, the area of ​​each ink print in the at least two ink prints ranges from 0.05 mm. 2 up to 0.8mm 2 For example, at least two ink prints include at least one of the following: dot prints, oval prints, and diamond prints.

[0117] In this embodiment, the substrate is first roughened to form a first rough layer on the backlight side surface of the substrate, and then a first ink layer is printed on the surface of the first rough layer. The area ratio of the first ink layer on the first rough layer is greater than or equal to 30% and less than or equal to 70%, thereby improving the uniformity of light on the surface of the battery encapsulation board, further improving the absorption of light energy by the battery encapsulation board, reducing the charging power loss of the photovoltaic module, and the panel manufacturing process is simple and the manufacturing cost is low.

[0118] In some embodiments, optionally, a printing process is performed on the first roughened layer to form a first ink layer on the first roughened layer, including: printing the first ink layer on the surface of the first roughened layer by screen printing; or printing the first ink layer on the surface of the first roughened layer by three-dimensional printing; or printing the first ink layer on the surface of the first roughened layer by metal electroplating; or printing the first ink layer on the surface of the first roughened layer by ink coating.

[0119] In this embodiment, during the process of printing the first ink layer on the first roughened layer, printing can be performed by screen printing, 3D printing, metal electroplating, or ink coating. It should be noted that when the first ink layer includes at least two ink prints, the appropriate printing method can be selected according to the size of the ink prints to be printed.

[0120] For example, at least two ink prints have the same area, and each ink print has an area of ​​0.05 mm. 2 In this case, 3D printing is used to print the ink onto the first rough layer.

[0121] For example, at least two ink prints have different areas, and the area of ​​each ink print is greater than 0.4 mm. 2 Then, screen printing is used to print the ink onto the first rough layer.

[0122] In this embodiment, the printing method of the first ink layer is flexibly selected according to the size of the ink print in the first ink layer, which enables the size of the ink print in the first ink layer to meet the requirements of diffuse reflection, and further improves the uniformity of the first ink layer and the first roughening layer in cooperating to diffusely reflect light to the battery packaging plate.

[0123] In some embodiments, optionally, the substrate is roughened to form a first roughened layer on the backlight side of the substrate, including: etching the substrate in a frosting solution to form a granular structure on the substrate; chemically polishing the etched substrate to form the first roughened layer on the backlight side of the substrate, and forming a second roughened layer on the light-receiving side of the substrate; wherein the first roughness of the first roughened layer ranges from 0.8 μm to 2.2 μm, and the second roughness of the second roughened layer is the same as the first roughness.

[0124] In this embodiment, the substrate is immersed in a frosting solution for etching, during which a granular structure is formed on the substrate, and this granular structure is integrally formed with the substrate. It should be noted that the granular structure is formed on both the backlight side surface and the light-receiving side surface of the substrate.

[0125] In this embodiment, there is a granular structure on the etched substrate. At this time, the roughness of the backlight side surface and the light-receiving side surface of the substrate may not meet the requirements of the first roughness and the second roughness. By performing chemical polishing on the etched substrate, a first rough layer that meets the first roughness requirement can be formed on the backlight side surface of the substrate, and a second rough layer that meets the second roughness requirement can be formed on the light-receiving side surface of the substrate. Since the first roughness and the second roughness are the same, the light-receiving side surface and the backlight side surface of the substrate can be roughened simultaneously.

[0126] Chemical polishing is a method that uses the selective dissolution effect of chemical reagents on uneven areas of the substrate surface to eliminate scratches and smooth the surface. Chemical polishing requires simple equipment and has high production efficiency.

[0127] In this embodiment, when the first roughness of the first rough layer is between 0.8 μm and 2.2 μm, and the second roughness of the second rough layer on the light-receiving side of the substrate is also between 0.8 μm and 2.2 μm, the first rough layer and the second rough layer can be prepared simultaneously. Furthermore, when printing the first ink layer subsequently, either surface of the substrate can be selected for printing. The rough layer with the first ink layer is then used as the first rough layer, and the surface with the first ink layer is used as the backlight side surface of the panel. This eliminates the need to distinguish between the light-receiving side and the backlight side when printing the first ink layer, further simplifying the preparation process.

[0128] Specifically, glass with a thickness of 1.8mm to 5mm is selected as the substrate. First, the substrate is surface-etched using a frosting solution to form a fine uneven structure, i.e., a granular structure. Then, the substrate with the granular structure is chemically polished to make the roughness of the backlight side surface of the substrate reach the first roughness requirement, i.e., to form a first rough layer on the backlight side surface of the substrate.

[0129] In this embodiment, by etching and polishing the substrate, a first rough layer is formed on the backlight side surface of the substrate, and a second rough layer is formed on the light-receiving side surface of the substrate. The first roughness of the first rough layer is the same as the second roughness of the second rough layer. This enables simultaneous processing of the light-receiving side and the backlight side of the substrate. Furthermore, it eliminates the need to distinguish between the light-receiving side and the backlight side when printing the first ink layer, thus simplifying the panel manufacturing process.

[0130] In some embodiments, optionally, the substrate is roughened to form a first rough layer on the backlight side of the substrate, including: frosting the backlight side surface of the substrate to form a first rough layer on the backlight side of the substrate, wherein the first roughness of the first rough layer ranges from 0.2 μm to 50 μm.

[0131] In this embodiment, a first roughened layer is formed on the backlight side of the substrate by roughening the surface of the substrate. The first roughness of the first roughened layer is greater than 0.2 μm and less than or equal to 50 μm. When the first roughness of the first roughened layer is in a large range, the first roughened layer can be formed on the substrate simply by sanding the substrate, further simplifying the panel manufacturing process.

[0132] In some embodiments, optionally, before printing on the first roughened layer to form the first ink layer, the panel preparation method further includes: performing planar tempering on the substrate to obtain a planar panel; or performing curved bending tempering on the substrate to obtain a curved panel.

[0133] In this embodiment, the panel can be either planar or curved, allowing it to adapt to a variety of products with different shapes.

[0134] Specifically, when the panel is a flat panel, the substrate with the first roughening layer is subjected to planar tempering treatment to give the substrate a planar shape and high strength. When the panel is a curved panel, the substrate with the first roughening layer is subjected to curved bending tempering treatment to give the substrate a curved shape and high strength.

[0135] In this embodiment, the panel is set to a planar shape or a curved shape, so that the panel can be adapted to the planar or curved photovoltaic modules, which broadens the application scenarios of the panel. When the panel is applied to the curved photovoltaic module, it improves the absorption of light energy by the battery encapsulation plate, reduces the loss of charging power of the photovoltaic module, and the panel manufacturing process is simple and the manufacturing cost is low.

[0136] In some embodiments, the panel fabrication method may optionally include, before and after roughening the substrate, cleaning the substrate, wherein the cleaning process includes at least one of the following: acidic solution cleaning and neutral solution cleaning.

[0137] In this embodiment, the substrate is cleaned before and after roughening to remove dust and stains.

[0138] Specifically, before roughening the substrate, it is first placed in a weak acid bath and cleaned with an acidic solution to remove dust and stains. Then, it is placed in a clean water bath and cleaned with a neutral solution to remove any remaining acidic solution. After roughening, the substrate is again first cleaned with a neutral solution in a clean water bath to remove any remaining frosting solution, and then placed in a weak acid bath and cleaned with an acidic solution to remove dust and stains.

[0139] In this embodiment, by cleaning the substrate with an acidic solution and / or a neutral solution before and after roughening the substrate, the etching and polishing effects of the substrate are ensured, further improving the yield of the panel.

[0140] According to one embodiment of this application, Figure 11 shows a flowchart of a method for preparing a photovoltaic module provided in some embodiments of this application. As shown in Figure 11, a method for preparing a photovoltaic module is proposed for preparing the photovoltaic module in any of the above embodiments. The method for preparing the photovoltaic module includes:

[0141] Step 1101: Select a 4mm ultra-white glass plate as the substrate;

[0142] Step 1102: Place the substrate in a weak acid bath for cleaning;

[0143] Step 1103: Place the substrate in a clean water tank for cleaning;

[0144] Step 1104: Immerse the substrate in a frosting solution for etching to form a granular structure on the light-receiving and backlight-receiving surfaces of the substrate.

[0145] Step 1105: Place the substrate in a clean water tank for cleaning;

[0146] Step 1106: Place the substrate in a weak acid bath for cleaning;

[0147] Step 1107: Place the substrate into the etching bath for chemical polishing for 5 minutes.

[0148] Step 1108: The substrate is placed in a clean water tank for cleaning and then air-dried. A first rough layer is formed on the back side of the substrate and a second rough layer is formed on the light-receiving side.

[0149] The first roughness of the first rough layer is the same as the second roughness of the second rough layer, and the values ​​of the first roughness and the second roughness are both selected from 1.31 μm to 2.2 μm.

[0150] Step 1109: Print the first ink layer on the first roughened layer by screen printing;

[0151] Step 1110: Perform glass cutting on the substrate;

[0152] Step 1111: Drill holes and grind the edges on the substrate;

[0153] Step 1112: Perform planar tempering or curved bending tempering on the substrate to obtain the panel;

[0154] Step 1113: The panel and the battery encapsulation board are laminated and encapsulated to obtain a photovoltaic module.

[0155] It should be clarified that in the claims, description, and accompanying drawings of this application, the term "multiple" refers to two or more objects. Unless otherwise explicitly defined, the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description process, not to indicate or imply that the device or element referred to must have the described specific orientation, or be constructed and operated in a specific orientation. Therefore, these descriptions should not be construed as limitations on this application. The terms "connection," "installation," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection between multiple objects, a detachable connection between multiple objects, or an integral connection; it can be a direct connection between multiple objects or an indirect connection between multiple objects through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this application can be understood based on the specific circumstances of the above data.

[0156] In the claims, description, and accompanying drawings of this application, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. In the claims, description, and accompanying drawings of this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0157] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A panel, characterized in that, include: substrate; A first roughening layer is disposed on the backlight side of the substrate; A first ink layer is disposed on the backlight side of the first roughened layer, wherein the area ratio of the first ink layer on the first roughened layer ranges from 30% to 70%.

2. The panel according to claim 1, characterized in that, The first ink layer includes: At least two ink prints are uniformly distributed on the first roughened layer.

3. The panel according to claim 2, characterized in that, The area of ​​each of the at least two ink prints is in the range of 0.05 mm. 2 up to 0.8mm 2 .

4. The panel according to claim 2, characterized in that, At least two of the ink prints include at least one of the following: Dot ink printing, oval ink printing, and diamond ink printing.

5. The panel according to any one of claims 1 to 4, characterized in that, The first roughness of the first rough layer ranges from 0.2 μm to 50 μm.

6. The panel according to any one of claims 1 to 4, characterized in that, Also includes: A second roughening layer is disposed on the light-receiving side of the substrate, wherein the second roughness of the second roughening layer ranges from 0.8 μm to 2.2 μm.

7. The panel according to claim 6, characterized in that, The second roughness ranges from 1.31 μm to 2.2 μm.

8. The panel according to any one of claims 1 to 4, characterized in that, The transmittance of the substrate ranges from 80% to 100%.

9. The panel according to any one of claims 1 to 4, characterized in that, The panel includes at least one of the following: a flat panel and a curved panel.

10. The panel according to any one of claims 1 to 4, characterized in that, The thickness of the substrate ranges from 1.8 mm to 5 mm.

11. The panel according to any one of claims 1 to 4, characterized in that, The first ink layer is an opaque ink layer, and the first ink layer includes at least one of the following: lead chromate, nano-calcium, fluorescent paste, manganese metal compound, and cobalt metal compound.

12. A photovoltaic module, characterized in that, include: Battery encapsulation board; The panel as described in any one of claims 1 to 11, wherein the panel is disposed on the light-receiving side of the battery encapsulation plate.

13. The photovoltaic module according to claim 12, characterized in that, Also includes: A backplate is disposed on the backlight side of the battery encapsulation plate; A third roughening layer is disposed on the light-receiving side of the back plate; A second ink layer is disposed on the third roughened layer, and the second ink layer is located between the third roughened layer and the battery encapsulation plate.

14. The photovoltaic module according to claim 13, characterized in that, The battery encapsulation board includes at least one of the following: a planar battery encapsulation board, and a curved battery encapsulation board; The shapes of the battery encapsulation plate, the front panel, and the back panel are matched.

15. A method for preparing a panel, characterized in that, A method for preparing a panel according to any one of claims 1 to 11, the method comprising: The substrate is roughened to form a first roughened layer on the backlight side of the substrate; A printing process is performed on the first roughened layer to form a first ink layer on the first roughened layer; The area ratio of the first ink layer on the first roughened layer ranges from 30% to 70%.

16. The method for preparing a panel according to claim 15, characterized in that, The printing process on the first roughened layer to form a first ink layer on the first roughened layer includes: The first ink layer is printed on the surface of the first roughened layer by screen printing; or The first ink layer is printed on the surface of the first roughened layer using 3D printing; or The first ink layer is printed on the surface of the first roughened layer by metal electroplating; or The first ink layer is printed on the surface of the first roughened layer by means of ink coating.

17. The method for preparing a panel according to claim 15, characterized in that, The roughening treatment of the substrate to form a first roughened layer on the backlight side of the substrate includes: The substrate is etched in a frosting solution to form a granular structure on the substrate. The etched substrate is chemically polished to form a first roughening layer on the backlight side of the substrate and a second roughening layer on the light-receiving side of the substrate. The first roughness of the first rough layer ranges from 0.8 μm to 2.2 μm, and the second roughness of the second rough layer is the same as the first roughness.

18. The method for preparing a panel according to claim 15, characterized in that, The roughening treatment of the substrate to form a first roughened layer on the backlight side of the substrate includes: The backlight side surface of the substrate is sanded to form a first rough layer on the backlight side of the substrate. The roughness of the first rough layer ranges from 0.2 μm to 50 μm.

19. A method for preparing a panel according to any one of claims 15 to 18, characterized in that, Before performing the printing process on the first roughened layer to form a first ink layer on the first roughened layer, the method for preparing the panel further includes: The substrate is subjected to planar tempering treatment to obtain a planar panel.

20. The method for preparing a panel according to any one of claims 15 to 18, characterized in that, Before performing the printing process on the first roughened layer to form a first ink layer on the first roughened layer, the method for preparing the panel further includes: The substrate is subjected to curved bending tempering treatment to obtain a curved panel.

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