Radio frequency front-end module and electronic device

By employing a substrate, shielding structure, and grounding stub design in the RF front-end module, the problem of RF front-end modules being susceptible to interference at high frequencies is solved, achieving better electromagnetic shielding and out-of-band suppression performance.

WO2026144618A1PCT designated stage Publication Date: 2026-07-09RADROCK (SHENZHEN) SEMICONDUCTOR LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
RADROCK (SHENZHEN) SEMICONDUCTOR LTD
Filing Date
2025-11-19
Publication Date
2026-07-09

AI Technical Summary

Technical Problem

Radio frequency front-end modules are susceptible to interference from external high-frequency signals at high frequencies and generate electromagnetic interference to the external environment, affecting their performance.

Method used

The design employs a substrate, shielding structure, and grounding branches. The shielding structure includes a shielding layer and a shielding sidewall. The grounding branches connect the metal layer and the shielding sidewall and are grounded through metal through-holes. Adjacent grounding branches are spaced apart to enhance the electromagnetic shielding effect and efficiently transmit interference signals to the ground.

Benefits of technology

It improves the out-of-band rejection performance of the RF front-end module, prevents interference signals from resonating inside the shielding structure, and enhances the overall performance.

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  • Figure CN2025136157_09072026_PF_FP_ABST
    Figure CN2025136157_09072026_PF_FP_ABST
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Abstract

Embodiments of the present application provide a radio frequency front-end module and an electronic device. The radio frequency front-end module comprises a substrate, a shielding structure, a radio frequency element, and a plurality of grounding stubs; the substrate comprises a metal layer; the shielding structure comprises a shielding layer arranged above the substrate, and shielding side walls; the shielding side walls extend from the shielding layer toward the substrate; at least one radio frequency element is arranged in the projection of the shielding structure on the substrate; the metal layer is connected to the shielding side walls by means of the grounding stubs, and the grounding stubs are grounded by means of metal through holes; and a spacing is formed between adjacent grounding stubs. The shielding structure is grounded by means of the grounding stubs arranged on the sides of the substrate, such that the electromagnetic shielding effect of the shielding structure can be enhanced, and interference signals generated in the shielding structure can be efficiently transmitted to the ground, so as to prevent the overall performance of the radio frequency front-end module from being affected by resonance formed by the interference signals inside the shielding structure, thereby improving the out-of-band suppression performance of the radio frequency front-end module.
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