Foamed vinyl substrate for composite floorboard, and composite floorboard and mounting method therefor

Abstract

Disclosed in the present invention are a foamed vinyl substrate for a composite floorboard, and a composite floorboard and a mounting method therefor. In the foamed vinyl substrate for a composite floorboard of the present invention, the foamed vinyl substrate is used and has certain elasticity; the structures, which are not provided with recess holes, on tongue connecting surfaces and groove connecting surfaces have elasticity; and when the tongue connecting surfaces and the groove connecting surfaces engage and come into contact with each other, the recess holes therein deform, thereby making misaligned engagement more likely to occur, wherein some of the recess holes in the tongue connecting surfaces accommodate the structures on the groove connecting surfaces that are not provided with recess holes. At this time, when a load is generated at the joint between each tongue and each groove, under the action of pressure and due to the elasticity of the substrate, the recess holes and the structures that are not provided with the recess holes are further pressed to form a structure similar to a suction cup, such that each tongue and each groove engage with each other more tightly, thereby further improving a pull-out force between each tongue and each groove, and improving the firmness of the connection between substrates.

Description

A foamed vinyl board for composite flooring, composite flooring, and installation method thereof. Technical Field

[0001] This invention relates to the field of decorative flooring technology, and more specifically, to a foamed vinyl board for composite flooring, composite flooring, and a method for installing the same. Background Technology

[0002] In the field of building decoration materials, decorative materials have coverings on their surfaces, such as ceramic tiles, leather, or wood veneer. Ceramic tiles, with their durability and aesthetic appeal, are widely used in both residential and commercial renovations. However, with the accelerating pace of modern life and increased environmental awareness, the complexity of traditional ceramic tile installation and its environmental friendliness have become increasingly prominent issues. The installation process of traditional ceramic tiles is cumbersome and complex, usually requiring professional technicians, which not only increases construction costs but also extends the renovation period. Furthermore, the installation of traditional ceramic tiles relies heavily on materials such as cement mortar, which easily generates significant dust and noise, negatively impacting the construction site and surrounding environment, thus contradicting modern green and environmentally friendly construction concepts. Secondly, the weight of traditional ceramic tiles undoubtedly increases the load on the floor slabs in high-rise buildings or locations requiring lightweight decoration, increasing the difficulty and cost of structural design.

[0003] To reduce tile costs, ultra-thin tiles are increasingly used in current methods. However, the thinner the tile, the weaker its strength. Currently, ultra-thin tiles are mostly used on walls. When used on floors, they are usually laminated with other substrates, such as wood. However, wood substrates expand in humid environments, and their coefficient of expansion differs from that of the tile, easily causing cracking. Furthermore, the use of locking tongues and grooves on the wood substrate results in a less secure fit.

[0004] Some solutions use a plastic substrate to bond with ceramic tiles; however, using this type of substrate on large ceramic tiles makes the tiles heavier, which is not conducive to lightweighting and increases the load on the floor. Moreover, after this type of substrate is used to form an interlocking mechanism, the surface of the interlocking mechanism is relatively smooth, resulting in poor fit and stability. Summary of the Invention

[0005] This invention provides a foamed vinyl board and composite flooring for composite flooring. The composite flooring is formed by using the foamed vinyl board, which enables convenient installation of the composite flooring and improves the firmness between the splices of the composite flooring, while also enabling the composite flooring to be used in more occasions.

[0006] To achieve the above objectives, the technical solution provided by the present invention is as follows:

[0007] A foamed vinyl board for use in composite flooring, for splicing adjacent composite floorboards;

[0008] Includes a substrate, said substrate having a density of 0.65–1.4 g / cm³. 3 The substrate is made of foamed vinyl board, with a latch protruding on at least one side and a lock groove recessed on at least one side; when the substrates are spliced, the latches and lock grooves on adjacent substrates are connected; the two opposite sides of the latch that are in contact with the lock groove are the latch connecting surfaces, and the two opposite sides of the lock groove that are in contact with the latch are the lock groove connecting surfaces.

[0009] The substrate is foamed to form a plurality of closed pores. After the material is removed from the substrate to form the latch and the lock groove, the closed pores are exposed. A large number of grooves are formed on the latch connection surface and / or the lock groove connection surface. The grooves increase the pull-out force between the latch and the lock groove by more than 1% under the same degree of fit.

[0010] The density of the aforementioned foamed substrate is 0.65-1.4 g / cm³. 3 The foam substrate can be any commercially available, known foam substrate (including PVC foam substrate, polystyrene (EPS) foam substrate, polyurethane (PU) foam substrate, polypropylene (PP) foam substrate, and polyethylene (PE) foam substrate). The foaming ratio of the foam substrate is 0.6-1.34, for example, the foaming ratio can be 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.34, etc., or within any two of the above values. If the foaming ratio is too small, the degree of foaming is low, and there are few closed cells formed in the substrate; if the foaming ratio is too large, the degree of foaming is high, and the closed cells formed in the substrate are too large, both of which are not conducive to the setting of groove holes.

[0011] In this solution, the base plate is connected to the cover plate in the composite flooring. When laying and splicing the composite flooring, the interlocking tongues and grooves between adjacent base plates engage to complete the installation. Compared to traditional composite flooring installation methods, this solution greatly simplifies the process. During installation, only the ground needs to be leveled before splicing the composite flooring; there is no need to lay cement on the ground, reducing the building's load-bearing capacity and improving the ease of installation. The interlocking tongues and grooves allow for simple splicing; the tongues are simply inserted into the grooves, making the installation process simple and convenient, requiring no professional workers.

[0012] Furthermore, the composite flooring in this solution is primarily installed on the ground, with the substrates connected by latches and grooves to form the finished decorative flooring. This flooring bears a certain weight, but there may be some errors in the ground leveling process before installation. If the connection between the latches and grooves is not secure, the floorboards will often loosen, reducing the comfort of use. To prevent loosening of the latches and grooves, this solution incorporates numerous grooves on both the latch and groove connecting surfaces. When the latches and grooves are engaged, the contact between their surfaces causes misalignment of these grooves. This means that some grooves on the latch surface will contain structures not present on the groove surface, and vice versa. This increases the roughness between the latch and groove connecting surfaces, increasing friction and thus enhancing the pull-out force, improving the connection strength between the substrates and reducing the likelihood of loosening during use. More importantly, this solution uses foamed vinyl board, which has a certain degree of elasticity. The structure without grooves on the latch and lock groove connecting surfaces is elastic. When the latch and lock groove connecting surfaces come into contact, the grooves on them deform, making misalignment more likely. Some of the grooves on the latch connecting surface incorporate the structure without grooves on the lock groove connecting surface. When load is applied at the connection between the latch and lock groove, under pressure, and due to the elasticity of the substrate, the grooves and the structure without grooves are further compressed, forming a suction cup-like structure. This makes the connection between the two more tight, thereby further increasing the pull-out force between the latch and lock groove and improving the strength of the connection between the substrates.

[0013] As a further improvement, a foamed region A1 is formed within the substrate, and the thickness of the foamed region A1 accounts for 95%-100% of the total thickness of the substrate. Preferably, the thickness of the foamed region A1 accounts for more than 99% of the total thickness of the substrate. More preferably, the thickness of the foamed region A1 accounts for 100% of the total thickness of the substrate. Since the substrate is a foamed substrate, in order to ensure that the strength of the latch and the lock groove meets the usage requirements, the thickness of the latch and the lock groove is usually required to be 30% to 60% of the substrate thickness. In order to ensure that a large number of grooves and holes can be distributed on the latch connection surface and the lock groove connection surface, the thickness of the foamed region A1 is at least 95% of the total thickness of the substrate. In this solution, a full foaming method is used in actual prototyping, and a skinning treatment is applied to the two opposite large surfaces of the substrate. Since the skin thickness is very thin, the ideal state is that the thickness of the foamed region A1 accounts for 100% of the total thickness of the substrate, thereby ensuring that a large number of grooves and holes are formed on the latch connection surface and / or the lock groove connection surface when the substrate is processed to form the latch and the lock groove.

[0014] As a further improvement, the average closed-cell size within the foaming zone is 80-120 micrometers. This range allows for maximum consistency between the size of the recessed pores and the structure without recessed pores, making them easier to fit together.

[0015] As a further improvement, the average closed-cell size per unit volume within the substrate decreases from its center to its top or bottom surface.

[0016] As a further improvement, both the latch connecting surface and the lock groove connecting surface are located in the foaming area A1.

[0017] As a further improvement, the irregularly distributed closed-cell foam within the substrate results in an irregular distribution of the grooved holes on the latch connecting surface and the lock groove connecting surface. This irregular distribution of the grooved holes increases the probability of misalignment during contact between the latch connecting surface and the lock groove connecting surface. For example, it allows more grooved holes on the latch connecting surface to accommodate more structures on the lock groove connecting surface that do not have grooved holes, further improving the robustness of the connection between the latch connecting surface and the lock groove connecting surface.

[0018] As a further improvement, the groove hole includes an opening and a recessed portion connected to the opening and recessed in the substrate. The opening is located on the latch connection surface or the lock groove connection surface. The recessed portion is arc-shaped, and the maximum arc length of the recessed portion is less than the maximum circumference of the closed hole when the groove hole in which it is located is a closed hole.

[0019] The preferred embodiment is an arc-shaped recess. The maximum arc length of the recess is less than the maximum circumference of the closed hole when its corresponding recess is closed. For example, the arc length of some recesses is equal to half the maximum circumference of the closed hole, some are greater than half, and some are less than half. Furthermore, recesses of different sizes are irregularly distributed on the latch connecting surface and the lock groove connecting surface. In this case, the different sizes of recesses on the latch connecting surface and the lock groove connecting surface are misaligned, resulting in a more uniform and similar roughness on different parts of the latch connecting surface and the lock groove connecting surface. This improves the uniformity of the connection between different parts of the latch and the lock groove, especially for longer substrates, such as those with a length of 1000cm or more, thus avoiding poor connection strength at some points between the latch and the lock groove.

[0020] As a further improvement, the average maximum diameter of the recessed holes is 60-100 micrometers. The openings of all the recessed holes on each of the latch connecting surfaces or lock groove connecting surfaces occupy 30%-90% of the surface area of ​​each latch connecting surface or lock groove connecting surface, and the substrate portion between adjacent recessed holes is elastic. The size of the recessed holes and the distribution area of ​​their openings on the latch connecting surfaces or lock groove connecting surfaces ensure that the recessed holes on the latch connecting surfaces or lock groove connecting surfaces have a suitable number distribution, maximizing the possibility of misaligned fits.

[0021] As a further improvement, the centerline of the thickness of the latch and the locking groove deviates from the centerline of the substrate thickness by less than 20% of the total substrate thickness, and the thickness of the latch and the locking groove accounts for 30% to 60% of the substrate thickness. Furthermore, the width of the latch and the depth of the locking groove are 3 to 8 mm. Since the strength of the latch and locking groove formed after foaming is lower than that of the unfoamed substrate, to ensure that the strength of the latch and locking groove of the foamed substrate meets the layup requirements, the thickness of the latch and the locking groove accounts for 30% to 60% of the substrate thickness, and the centerline of the thickness of the latch and the locking groove deviates from the centerline of the substrate thickness by less than 20% of the total substrate thickness.

[0022] As a further improvement, the bolt and the lock groove are connected by an interference fit.

[0023] As a further improvement, the foamed vinyl board is obtained as follows: the raw material components of the foamed substrate include: 25-40 parts by weight of vinyl monomer copolymer and / or homopolymer, 3-8 parts by weight of plasticizer, 1-5 parts by weight of stabilizer, 0.5-2 parts by weight of lubricant, 10-50 parts by weight of filler, and 0.5-5 parts by weight of foaming agent. The raw material components are mixed and shaped, extruded, cooled, and cut to obtain a foamed vinyl board with a thickness of 3-12 mm.

[0024] The aforementioned foamed substrate raw material, after foaming treatment, yields a density of 0.65-1.4 g / cm³. 3 The foamed vinyl board, with its numerous closed cells, possesses a high modulus of elasticity, resulting in a comfortable feel underfoot for the composite flooring. Furthermore, the foamed vinyl board's matrix compensates for gaps during assembly, making the composite flooring more stable and less prone to gaps, especially in environments with high temperature and humidity. In addition, the aforementioned foamed vinyl board is suitable for underfloor heating. When the temperature does not exceed 65°C, the closed cells within the substrate provide both insulation and expansion compensation, resulting in a very small, almost negligible, coefficient of thermal expansion, thus not affecting the use of the composite flooring.

[0025] When considering the filler and foaming agent in the raw material composition of foamed substrates, it is necessary to take into account not only the effects of foaming and filling, but also the impact of the filler and foaming agent on the subsequent processing effects. For example, when applying corona pulses to two opposite large surfaces of the substrate, the foaming agent forms closed pores inside the substrate, while the filler can fill some of the pores, thereby controlling the amount of closed pores. Since closed pores can absorb energy during corona treatment, increasing energy consumption, the mass fraction of the foaming agent is preferably controlled at 0.5-5 parts by mass, and the mass fraction of the filler is preferably controlled at 10-50 parts by mass.

[0026] As a further improvement, the foamed vinyl board also includes 0.05-1 part of an antifungal agent.

[0027] As a further improvement, when mixing the raw material components of the foamed substrate, the mixing cycle is 20-25 minutes, and the order of addition is vinyl monomer copolymer and / or homopolymer, filler, stabilizer, lubricant, plasticizer, and finally, 5 minutes before the end of mixing, foaming agent and antifungal agent are added.

[0028] As a further improvement, a 1-3mm thick film containing an antifungal agent is laminated onto one surface of the substrate. The film can be selected from EVA sheets, EVA films, IXPE sheets, IXPE films, IXPP sheets, IXPP films, PP sheets, PP films, PVC sheets, or PVC films. The film is relatively soft, not only isolating it from ground moisture but also providing antifungal protection; furthermore, its lightweight nature helps reduce the overall weight of the composite flooring; and it prevents noise from footsteps, giving the composite flooring a certain degree of shock absorption.

[0029] The present invention also provides a composite flooring comprising a foamed vinyl board for composite flooring as described in any one of the inventions, and a cover member bonded to the surface of the substrate. The cover member may be made of a material selected from slicable natural stone, marble, granite, slate, glass, ceramic, leather, and wood veneer.

[0030] This invention also provides a method for installing the composite flooring described above. After leveling the ground, the composite flooring described above is placed on the ground, and the next composite flooring described above is assembled with the previous composite flooring using locking tongues and locking grooves. All the cover parts of the composite flooring face upwards. Leveling the ground can be achieved using equipment such as a level or theodolite to ensure the laid surface appears flat and without slope.

[0031] Compared with the prior art, the technical solution provided by this invention has the following advantages:

[0032] (1) A foamed vinyl board for composite flooring according to the present invention. In this solution, the substrate is connected to the cover in the composite flooring. When the composite flooring is laid and spliced, the installation of the composite flooring can be completed by the interlocking of the locking tongue and locking groove between adjacent substrates. Compared with the traditional method of laying composite flooring, this solution greatly simplifies the installation method of composite flooring and improves the convenience of flooring installation. The foamed vinyl board has a certain elasticity. The structure without groove holes on the locking tongue connection surface and the locking groove connection surface is elastic. When the locking tongue connection surface and the locking groove connection surface are in contact with each other, the groove holes on them are deformed and more prone to misalignment. At this time, when the load is generated at the connection between the locking tongue and the locking groove, under the action of pressure, and due to the elasticity of the substrate, the groove holes and the structure without groove holes are further squeezed to form a suction cup-like structure, making the two more tightly connected, thereby further improving the pull-out force between the locking tongue and the locking groove and improving the firmness of the connection between the substrates.

[0033] (2) In order to ensure that a large number of groove holes can be distributed on the latch connection surface and the lock groove connection surface, the thickness of the foamed area A1 is at least 95% of the total thickness of the substrate.

[0034] (3) The foamed vinyl board for composite flooring of the present invention has a substrate that has undergone foaming treatment, forming a large number of closed pores inside, and has a high modulus of elasticity. Therefore, the composite flooring is comfortable underfoot. At the same time, the matrix of the foamed vinyl board can compensate for the gaps in the assembly when the environment changes (especially in high temperature and high humidity environments), making the splicing of the composite flooring more stable and less prone to gaps. In addition, the above-mentioned foamed vinyl board is also suitable for floors with underfloor heating. When the temperature of the foamed vinyl board is not higher than 65°C, the closed pores inside the substrate have both a heat insulation effect and can compensate for expansion, making the coefficient of thermal expansion very small and almost negligible, thus not affecting the use of the composite flooring. Attached Figure Description

[0035] Figure 1 is a schematic diagram of the substrate structure;

[0036] Figure 2 is a schematic cross-section of the substrate along its thickness direction;

[0037] Figure 3 is a magnified structural diagram of point A in Figure 2;

[0038] Figure 4 is a schematic diagram of the inclined setting of the locking tongue connecting surface;

[0039] Figure 5 is a schematic diagram of the connection state between the lock tongue and the lock groove when the lock tongue connecting surface is tilted.

[0040] Figure 6 is an enlarged schematic diagram of the foamed structure of the substrate along its thickness direction;

[0041] Figure 7 is a schematic diagram of the splicing state of adjacent substrates in one actual case.

[0042] Figure 8 is a schematic diagram showing the chamfering at the connection between the laying surface and the side of the base plate near the latch.

[0043] Figure 9 is a schematic diagram showing the chamfering at the connection between the laying surface and the side of the substrate near the lock groove.

[0044] Figure 10 is a schematic diagram of the structure when the end of the latch tongue away from the base plate is set with an arc;

[0045] Figure 11 shows the trend of the average pull-out force under one condition;

[0046] Figure 12 is a schematic diagram of the composite floor structure;

[0047] Figure 13 is an example diagram of the pull-out force test process.

[0048] Labeling Explanation: 1. Base plate; 11. Lock tongue; 111. Lock tongue connecting surface; 12. Lock groove; 121. Lock groove connecting surface; 13. Groove hole; 100. Chamfer; 101. Side side one; 102. Side side two; 2. Cover piece. Detailed Implementation

[0049] To further understand the content of this invention, a detailed description of the invention will be provided in conjunction with the accompanying drawings and embodiments.

[0050] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0051] Furthermore, terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and not intended to limit the scope of implementation. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention. In addition to indicating orientation or positional relationships, some of the aforementioned terms may also have other meanings; for example, the term "upper" may, in certain circumstances, indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0052] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate for the embodiments of this application described herein.

[0053] This embodiment provides a foamed vinyl board for composite flooring. The substrate 1 has two opposing target surfaces, one of which is used to connect with a cover 2. The cover 2 can be made of leather, wood veneer, or ceramic tile, etc. When ceramic tile is used, it is an ultra-thin ceramic tile, typically with a thickness of less than 6 mm, such as 4 mm, 5 mm, or 6 mm. This embodiment uses an ultra-thin ceramic tile as an example for illustration.

[0054] Referring to Figures 1 and 2, the foamed vinyl board for composite flooring provided in this embodiment includes a substrate 1. The substrate 1 has two opposing target surfaces as large surfaces, where target surface one is used for connection with ceramic tiles as a connecting surface, and target surface two is used as a laying surface. The sides adjacent to the target surfaces include two opposing side surfaces 101 and 102. A locking tongue 11 is protruding on one of the adjacent side surfaces 101 and 102, and a locking groove 12 is recessed on the other adjacent side surfaces 101 and 102. When two substrates 1 are spliced ​​together, the locking tongue 11 and locking groove 12 on the adjacent substrates 1 engage and connect; the two opposing sides of the locking tongue 11 that engage with the locking groove 12 are the locking tongue connecting surfaces 111, and the two opposing sides of the locking groove 12 that engage with the locking tongue 11 are the locking groove connecting surfaces 121.

[0055] It should be noted that in some cases, only one of the two opposite sides 101 is provided with a locking tongue 11 or a locking groove 12, and only one of the two opposite sides 102 is provided with a locking tongue 11 or a locking groove 12.

[0056] Typically, the substrate 1 is a complete square. The locking tongue 11 and the locking groove 12 are formed by milling on the substrate 1, so that the locking tongue 11 and the locking groove 12 are integrally formed on the substrate 1, giving the substrate 1 good integrity.

[0057] Referring to Figures 2, 3, and 6, substrate 1 is a foamed vinyl board with a density of 0.65–1.4 g / cm³. 3After foaming, several closed holes are formed inside the substrate 1. After the locking tongue 11 and locking groove 12 are formed on the substrate 1 by material removal, the closed holes on the locking tongue connecting surface 111 and the locking groove connecting surface 121 are exposed to form a large number of groove holes 13. The groove holes increase the pull-out force between the locking tongue and the locking groove by more than 1% under the same degree of fit. Specifically, increasing pull-out force can result in increases of 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, and 40%. 6%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, 100%.

[0058] Regarding the recessed hole 13, specifically, the foaming inside the substrate 1 forms a closed hole, and the substrate 1 forms a locking tongue 11 and a locking groove 12 by removing material through milling. At the locking tongue connecting surface 111 and the locking groove connecting surface 121, part of the closed hole becomes an open hole, namely the recessed hole 13.

[0059] It should be noted that in some cases, groove holes can be provided only on the latch connecting surface 111 or only on the lock groove connecting surface 121. This can also increase the roughness between the latch connecting surface 111 and the lock groove connecting surface 121, increase the friction between them, and thus enhance the pull-out force between the latch and the lock groove. This can be applied to some occasions where the pull-out force requirement between the substrates is low.

[0060] The same degree of fit between the latch 11 and the lock groove 12 means that the depth and width of the latch 11 and the lock groove 12 are the same, the contact area at the fit is the same when they are connected to each other, and the interference fit between the latch 11 and the lock groove 12 is the same.

[0061] The pull-out force is the force measured when the latch and groove of adjacent base plates move at a constant speed relative to each other during pull-out, along the width direction of the protruding latch or the depth direction of the recessed groove. The pull-out direction is indicated by direction B in Figures 1 and 13.

[0062] In this solution, the base plate is connected to the cover plate in the composite flooring. When laying and splicing the composite flooring, the interlocking tongues 11 and grooves 12 between adjacent base plates cooperate to complete the installation. Compared to traditional composite flooring installation methods, this solution greatly simplifies the installation process. During installation, the composite flooring can be spliced ​​only after the ground is leveled, eliminating the need for cement mortar, reducing the building's load-bearing capacity, and improving the ease of installation. The interlocking tongues 11 and grooves 12 are used for connection; simply insert the tongue into the groove during splicing. The installation process is simple and convenient, requiring no professional workers.

[0063] Furthermore, the composite flooring in this design is primarily installed on the ground. The substrates 1 are connected via latches 11 and grooves 12, forming the finished decorative flooring. This flooring bears a certain weight, but there may be errors in the ground leveling process before installation. If the connection between the latches 11 and grooves 12 is not secure, the floorboards may become loose, reducing the comfort of use. To prevent loosening of the latches 11 and grooves 12, this design incorporates numerous recessed holes on the latch connection surface 111 and groove connection surface 121. When the latches 11 and grooves 12 are connected, the recessed holes 13 on the latch connection surface 111 and groove connection surface 121 may misalign during contact. This means that some recessed holes 13 on the latch connection surface 111 may contain structures that do not have recessed holes on the groove connection surface 121, and the same applies to the recessed holes on the groove connection surface. This design increases the roughness between the latch connecting surface 111 and the lock groove connecting surface 121, increasing the friction between them and thus enhancing the pull-out force between the latch 11 and the lock groove 12. This improves the firmness of the connection between the substrates and reduces the likelihood of loosening during use. More importantly, this design uses foamed vinyl board, which has a certain degree of elasticity. The structure without grooves on the latch connecting surface 111 and the lock groove connecting surface 121 is elastic. When the latch connecting surface 111 and the lock groove connecting surface 121 come into contact with each other, the grooves on them deform, making misalignment more likely. Some of the grooves on the latch connecting surface 111 accommodate the structure without grooves on the lock groove connecting surface 121. When the load is generated at the connection between the latch 11 and the lock groove 12, under the action of pressure, and due to the elasticity of the substrate, the groove hole and the structure without groove hole are further squeezed to form a suction cup-like structure, making the two more tightly connected, thereby further increasing the pull force between the latch and the lock groove and improving the firmness of the connection between the substrates.

[0064] Furthermore, substrate 1 is made of foamed vinyl board, further reducing the added building weight during decoration. Moreover, substrate 1 has a large number of closed-cell structures, which reduces its coefficient of expansion. When substrate 1 is used together with tiles to form a floor, the flooring installation environment may be outdoor or indoor, and may vary in temperature and humidity. Especially when substrate and tiles are used together, tiles typically expand or contract less under different environments, but substrate 1 has a larger coefficient of expansion compared to tiles. In this design, substrate 1 has a large number of closed-cell structures. Under certain conditions, when substrate 1 expands or contracts, these closed-cell structures can balance the changes in substrate 1's dimensions, thereby reducing its coefficient of expansion and preventing tile cracking due to large changes in substrate 1's dimensions.

[0065] Furthermore, in this solution, the flooring is laid on the ground, where heavy objects are often dropped. When ultra-thin ceramic tiles are used, the substrate 1 forms a large number of closed-cell structures, which can improve the elasticity of the substrate 1 and give it a better cushioning effect. If a heavy object falls onto the tile, the cushioning effect of the substrate 1 can effectively prevent the heavy object from damaging the tile.

[0066] In the experiment, foamed and non-foamed vinyl boards of the same size were selected, with the foamed vinyl board having a density of 0.85 g / cm³. 3 The density of the non-foamed vinyl board is 1.6 g / cm³. 3 All samples are 100mm*100mm*5mm (length*width*thickness). The thickness of the latch 11 and the locking groove 12 is 1.8mm. The protruding width of the latch 11 is 3.5mm, and the recess depth of the locking groove 12 is 5mm. The length of the mating connection between the latch 11 and the locking groove 12 is 100mm. The testing speed is 100mm / min. Referring to Figure 13, the testing equipment used is a JF-100A, manufactured by Dongguan Jianfeng Instrument Co., Ltd. Each sample consists of 5 pieces, and the average pull-out force is calculated. Details are shown in the table below.

[0067] As shown in Figure 6, a foamed region A1 is formed near the center of substrate 1, and the thickness of foamed region A1 accounts for more than 95% of the total thickness of substrate 1. Preferably, the thickness of foamed region A1 accounts for 99%-100% of the total thickness of substrate. More preferably, the thickness of foamed region A1 accounts for 100% of the total thickness of substrate. Since the substrate is a foamed substrate, in order to ensure that the strength of latch 11 and latch groove 12 meets the usage requirements, the thickness of latch 11 and latch groove 13 is usually required to account for 30% to 60% of the substrate thickness. In order to ensure that a large number of grooves and holes 13 can be distributed on latch connecting surface 111 and latch connecting surface 121, the thickness of foamed region A1 is at least 95% of the total thickness of substrate. In this scheme, substrate 1 adopts a full foaming method in actual prototyping, and a skinning treatment is applied to the two opposite large surfaces of substrate 1. Since the skin thickness is very thin, the ideal state is that the thickness of foamed region A1 accounts for 100% of the total thickness of substrate.

[0068] The average closed-cell size in foaming region A1 is 80-120 micrometers. The average closed-cell size per unit volume in substrate 1 decreases from its center to its top or bottom surface.

[0069] Both the latch connecting surface 111 and the lock groove connecting surface 121 are located in the foaming area A1. The irregular distribution of the foamed closed pores formed in the substrate 1 results in an irregular distribution of the recessed holes 13 on the latch connecting surface 111 and the lock groove connecting surface 121. Regarding the irregular distribution of the recessed holes 13, the recessed holes 13 are randomly located at different positions on the latch connecting surface 111 and the lock groove connecting surface 121, and the size, shape, and depth of each recessed hole 13 embedded in the substrate may be the same or different.

[0070] Specifically, the recessed hole 13 includes an opening and a recessed portion connected to the opening and recessed in the substrate. The opening is located on the latch connecting surface 111 or the lock groove connecting surface 121. The recessed portion is arc-shaped, and the maximum arc length of the recessed portion is less than the maximum circumference of the closed hole when the recessed hole is closed. As shown in FIG3, the recessed hole 13 is embedded to different depths in the substrate 1. The arc-shaped recessed portion is the most preferred embodiment. In the above-mentioned embodiment, the maximum arc length of the recessed portion is less than the maximum circumference of the closed hole when the recessed hole is closed. For example, the arc length of some recessed portions is equal to half of the maximum circumference of the closed hole when the recessed hole is closed, the arc length of some recessed portions is greater than half of the maximum circumference of the closed hole when the recessed hole is closed, and the arc length of some recessed portions is less than half of the maximum circumference of the closed hole when the recessed hole is closed. Moreover, the recessed portions of different sizes are irregularly distributed on the latch connecting surface and the lock groove connecting surface. In this case, the recesses of different sizes on the latch connecting surface 111 and the lock groove connecting surface 121 are misaligned, making the roughness of different parts on the latch connecting surface 111 and the lock groove connecting surface 121 more uniform and similar. This results in better uniformity of connection between different parts of the latch and the lock groove, especially for cases where the base plate is long, such as when the base plate length is set to more than 1000cm. This avoids the possibility of poor connection at some connection points between the latch 11 and the lock groove 12.

[0071] In this design, the average maximum diameter of the recessed hole 13 is 60-100 micrometers, more preferably 70-90 micrometers. The opening of all the recessed holes 13 on each latch connecting surface 111 or lock groove connecting surface 121 occupies 30%-90% of the surface area of ​​each latch connecting surface 111 or lock groove connecting surface 121, and the substrate portion between adjacent recessed holes 13 is elastic, allowing the recessed holes 13 to deform.

[0072] Referring to Figure 6, the average closed-cell size per unit volume within substrate 1 decreases from its center towards the top or bottom surface. The closer to the center of substrate 1 in the thickness direction, the higher the degree of foaming, and the lower the structural strength at that point. To ensure that the strength of the latch and groove of the foamed substrate meets the layup requirements, preferably, the thickness of the latch 11 and groove 12 accounts for 30% to 60% of the substrate thickness, and the deviation of the centerline of the latch and groove thickness from the centerline of the substrate thickness is less than 20% of the total substrate thickness. For example, the thickness of the latch 11 and the locking groove 12 accounts for, for example, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, or 60% of the thickness of the substrate 1. The protruding width of the latch 11 and the recessed depth of the locking groove 12 are 3 to 8 mm, for example, the width or depth can be selected as 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7 mm, 7.5 mm, or 8 mm, and the protruding width of the latch 11 and the recessed depth of the locking groove 12 can be the same or different. On the one hand, it meets the requirements of elasticity and number of closed holes of substrate 1, and on the other hand, it needs to meet certain strength requirements of substrate 1, such as preventing damage when locking tongue 11 and locking groove 12 are engaged.

[0073] Referring to Figures 7, 8, and 9, substrate 1 has two opposing target surfaces. Target surface one is used for connection with the cover, and target surface two serves as the laying surface. When adjacent substrates 1 are spliced, for example, after the first substrate is laid, the locking groove 12 of the first substrate awaits splicing, and the second substrate is held close to the first substrate for splicing, with the locking tongue 11 of the second substrate awaiting splicing. During this process, the second substrate is held with a certain tilt. As the locking tongue 11 enters the locking groove 12 during splicing, the second substrate is gradually flattened. A chamfer 100 is provided at the connection between the laying surface and the side of the substrate 1 where the locking tongue 11 is located, to prevent the locking tongue 11 from jamming when splicing the second substrate, and to make the second substrate easier to push.

[0074] In other cases, a transition arc can also be provided at the connection between the laying surface and the side where the latch 11 is provided on the substrate 1.

[0075] In another scenario, the rounded or chamfered design can also be located at the connection point between the laying surface and the side of the locking groove 12 on the substrate 1. In this case, the locking tongue 11 awaits splicing after the first substrate is laid.

[0076] Furthermore, the 100° chamfer or transition arc can better prevent the substrate from being damaged by debris on the ground during installation. Compared to the absence of a chamfer or transition arc, where the substrate 1 is at a right angle, if there are debris on the ground during installation, the right angle is easily damaged or scratched by the debris when the substrate 1 is pushed, forming a stress concentration point. During the use of the substrate 1, if a sudden external force occurs, such as a heavy object falling, or under heating conditions, cracks are likely to appear at the stress concentration point, affecting the service life of the substrate 1.

[0077] As shown in Figure 10, the end of the latch 11 away from the base plate is arc-shaped, which provides a certain guide when the latch 11 is inserted into the lock groove 1, and improves the convenience of splicing.

[0078] In a preferred embodiment, the latch connecting surface 111 and the lock groove connecting surface 121 are flush with the surface of the substrate 1, which facilitates the processing and formation of the latch 11 and the lock groove 12.

[0079] Referring to Figures 4 and 5, in another embodiment, the latch 11 has its root at one end near the center of the substrate 1 and its free end at the other end; at least one latch connecting surface 111 is inclined, so that the thickness of the latch 11 gradually increases from the free end to the root. Alternatively, at least one lock groove connecting surface 121 may be inclined, so that the size of the lock groove 12 gradually increases from the opening to the bottom surface. Furthermore, the inclination angle of the latch connecting surface 111 or the lock groove connecting surface 121 relative to the surface of the substrate 1 is α, where α ranges from 0° to 10°. This arrangement makes it easier for the latch 11 to be inserted into the latch 12.

[0080] Whether the latch connecting surface 111 and the lock groove connecting surface 121 are flush or inclined, the connection between the latch 11 and the lock groove 12 is an interference fit. This interference fit allows the lock groove to clamp the latch more tightly, further improving the pull-out force. The degree of interference between the latch 11 and the lock groove 12 depends on the substrate itself, such as its density. In this embodiment, the foamed vinyl board has a density of 0.85 g / cm³. 3 The relationship between the interference between the latch 11 and the lock groove 12 and the pull-out force between the latch and the lock groove is explained.

[0081] Table 1. Record of Pull-out Force Test Between Lock Tongue and Lock Groove

[0082] As shown in Figure 13, the testing equipment used is a JF-100A, manufactured by Dongguan Jianfeng Instrument Co., Ltd., and the sample foamed vinyl board has a density of 0.85 g / cm³. 3The latch connecting surface 111 and the lock groove connecting surface 121 are flush with the surface of the substrate 1, and their dimensions are both 100mm*100mm*5mm (length*width*thickness). The protruding width of the latch 11 is 3.5mm, the recess depth of the lock groove 12 is 5mm, and the length of the mating connection between the latch 11 and the lock groove 12 is 100mm. The test speed is 100mm / min, and the results are tested three times for each sample.

[0083] As shown in Figure 11, the curves of Series 1 indicate that when the interference between the latch 11 and the lock groove 12 is greater than 0.15, the pull-out force between them increases more significantly with the increase of the interference. Therefore, the interference between the latch 11 and the lock groove 12 can preferably be set within the range of 0.15 or higher. Tests revealed that when the interference between the latch 11 and the lock groove 12 reaches 0.3, the lock groove 12 tends to break after the latch 11 enters it. Therefore, the interference between the latch 11 and the lock groove 12 should be set below 0.3.

[0084] It should be noted that the data in Table 1 represents a substrate density of 0.85 g / cm³. 3 When the substrate density is otherwise obtained, the interference fit between the latch 11 and the lock groove 12 will also be otherwise selected, and the specific value will be obtained based on the test.

[0085] It should also be noted that the interference fit between the latch 11 and the lock groove 12 is related to the foaming ratio. For example, when the same pull-out force is required, a higher foaming ratio results in more grooves and holes, which has a greater impact on the roughness between the latch 11 and the lock groove 12. In this case, the interference fit between the latch 11 and the lock groove 12 can be reduced. Similarly, the specific data for the interference fit can be obtained through testing.

[0086] In this scheme, the closed pores in substrate 1 are formed by foaming. As a preferred embodiment, the foamed vinyl sheet is obtained by mixing and extrusion. The mixing step involves uniformly mixing 25 parts of vinyl monomer copolymer and / or homopolymer, 3 parts of plasticizer, 1 part of stabilizer, 0.5 parts of lubricant, 10 parts of filler, and 0.5 parts of foaming agent to obtain a vinyl mixed raw material. The extrusion step involves shaping the vinyl mixed raw material, extruding, cooling, and cutting it to obtain a vinyl sheet with a thickness of 3 mm.

[0087] Furthermore, the foamed vinyl board also includes 0.05 parts of antifungal agent. The mixing process takes 20 minutes, and the order of addition is vinyl raw material, filler, stabilizer, lubricant, plasticizer, and finally, the foaming agent and antifungal agent are added 5 minutes before the end of the mixing process.

[0088] In another embodiment, the foamed vinyl sheet is obtained by mixing and extrusion. The mixing step involves uniformly mixing 40 parts of vinyl monomer copolymer and / or homopolymer, 8 parts of plasticizer, 5 parts of stabilizer, 2 parts of lubricant, 50 parts of filler, and 5 parts of foaming agent to obtain a vinyl mixture. The extrusion step involves shaping the vinyl mixture, extruding, cooling, and cutting it to obtain a vinyl sheet with a thickness of 12 mm.

[0089] Furthermore, the foamed vinyl board also includes one part of anti-mold agent. The mixing process takes 25 minutes, and the order of addition is vinyl raw material, filler, stabilizer, lubricant, plasticizer, and finally, the foaming agent and anti-mold agent are added 5 minutes before the end of the mixing process.

[0090] In another embodiment, the foamed vinyl sheet is obtained by mixing and extrusion. The mixing step involves uniformly mixing 32 parts of vinyl monomer copolymer and / or homopolymer, 5 parts of plasticizer, 3 parts of stabilizer, 1 part of lubricant, 30 parts of filler, and 3 parts of foaming agent to obtain a vinyl mixture. The extrusion step involves shaping the vinyl mixture, extruding, cooling, and cutting it to obtain a vinyl sheet with a thickness of 6 mm.

[0091] Furthermore, the foamed vinyl board also includes 0.5 parts of anti-mold agent. The mixing process takes 22 minutes, and the order of addition is vinyl raw material, filler, stabilizer, lubricant, plasticizer, and finally, the foaming agent and anti-mold agent are added 5 minutes before the end of the mixing process.

[0092] Preferably, in the above-mentioned materials, the vinyl monomer copolymers and / or homopolymers are selected from polyethylene, polyvinyl chloride, polystyrene, polymethacrylate, polyacrylate, polyacrylamide, ABS, (acrylonitrile-butadiene-styrene) copolymer, polypropylene, ethylene-propylene copolymer, polyvinylidene chloride, polytetrafluoroethylene, polyvinylidene fluoride, hexafluoropropylene, and styrene-maleic anhydride copolymer. The plasticizer is dibutyl phthalate, the stabilizer is an organotin stabilizer, the lubricant is one or more combinations of calcium stearate and n-butyl stearate, the filler is one or more combinations of powdered calcium carbonate, talc, silica powder, glass fiber, alumina, and wollastonite, and the foaming agent is one or more combinations of azobisisobutyronitrile and hydrogen peroxide. To give the foamed vinyl board anti-mildew properties, it also contains 0.05-1 parts by weight of an anti-mildew agent, which is one or more combinations of potassium sorbate and butylamine 3-iodo-2-propynylcarbamate. The above-mentioned raw materials are foamed to obtain the vinyl board of the invention, the density of which is 0.65-1.4 g / cm³. 3 The interior of the vinyl ester sheet contains a large number of closed pores and some closed air pores.

[0093] The substrate is laminated with a 1-3mm thick membrane containing an antifungal agent. The membrane can be selected from EVA sheets, EVA films, IXPE sheets, IXPE films, IXPP sheets, IXPP films, PP sheets, PP films, PVC sheets, or PVC films. The membrane is relatively soft, effectively isolating moisture from the ground and providing antifungal properties. Furthermore, its lightweight nature helps reduce the overall weight of the composite flooring and minimizes noise from footsteps, thus providing some shock absorption.

[0094] The present invention also provides a composite flooring, comprising the aforementioned foamed vinyl board for composite flooring, and further comprising a cover 2, wherein the cover 2 is bonded to the surface of the substrate 1. The cover 2 and the surface of the substrate 1 are bonded together, and the two can be connected by any existing means, such as by adhesive bonding.

[0095] As shown in Figure 5, taking ultra-thin ceramic tiles as an example, the cover 2 is bonded to the target surface of the substrate 1. After the ceramic tile and the substrate 1 are connected, the relative position between the edge of the ceramic tile and the edge of the substrate 1 also determines whether there is a gap between adjacent ceramic tiles after installation.

[0096] For example, in one scenario, the tile size is relatively small compared to the substrate size, and after installation, the edges of adjacent substrates are close together. In this case, there is a certain gap between adjacent tiles, and grout can be applied into this gap.

[0097] In another scenario, the substrate size is relatively small compared to the tile size, and after installation, the edges of adjacent tiles are close together. In this case, a seamless tile installation is formed.

[0098] The relative position between the edge of the tile and the edge of the substrate 1 can be determined according to customer requirements.

[0099] This invention also provides a method for installing composite flooring. Compared to traditional flooring, especially ceramic tile flooring, this method eliminates the need for laying cement on the ground. During installation, after leveling the ground, the composite flooring described above is placed on the ground. The next type of composite flooring is then assembled with the previous type using locking tongues and grooves. All the cover pieces of the composite flooring face upwards. This method greatly simplifies the installation of composite flooring, reduces the building's load-bearing capacity, and improves the convenience of flooring installation.

[0100] The present invention and its embodiments have been described above illustratively. This description is not restrictive, and the figures shown are only one embodiment of the present invention; the actual structure is not limited thereto. Therefore, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A foamed vinyl board for use in composite flooring, for splicing adjacent composite floorboards; characterized in that: Includes a substrate (1), said substrate (1) having a density of 0.65 to 1.4 g / cm³. 3 The substrate (1) is made of foamed vinyl board material. At least one side of the substrate (1) is provided with a protruding latch (11) and at least one side is provided with a recessed locking groove (12). When the substrates (1) are spliced, the latches (11) and locking grooves (12) on adjacent substrates (1) are connected. The two opposite sides of the latch (11) that are in contact with the locking groove (12) are the latch connecting surfaces (111), and the two opposite sides of the locking groove (12) that are in contact with the latch (11) are the locking groove connecting surfaces (121). The substrate (1) is foamed to form a plurality of closed pores. After the material is removed from the substrate (1) to form the latch (11) and the lock groove (12), the closed pores are exposed on the latch connecting surface (111) and / or the lock groove connecting surface (121) to form a large number of groove holes (13). The groove holes (13) increase the pull-out force between the latch (11) and the lock groove (12) by more than 1% under the same degree of fit between the latch (11) and the lock groove (12).

2. The foamed vinyl board for composite flooring according to claim 1, characterized in that: The foaming ratio of the substrate (1) is 0.6-1.

34.

3. The foamed vinyl board for composite flooring according to claim 1, characterized in that: A foamed region (A1) is formed in the substrate (1), and the thickness of the foamed region (A1) accounts for 95%-100% of the total thickness of the substrate (1).

4. The foamed vinyl board for composite flooring according to claims 1-3, characterized in that: The average closed pore size in the foaming zone (A1) is 80-120 micrometers.

5. The foamed vinyl board for composite flooring according to claim 4, characterized in that: The average size of closed holes per unit volume in the substrate (1) decreases from its center to its top or bottom surface.

6. The foamed vinyl board for composite flooring according to claim 5, characterized in that: Both the latch connecting surface (111) and the lock groove connecting surface (121) are located in the foaming area (A1).

7. The foamed vinyl board for composite flooring according to claim 6, characterized in that: The irregular distribution of foamed closed pores formed in the substrate (1) results in the irregular distribution of the groove holes (13) on the latch connecting surface (111) and the lock groove connecting surface (121).

8. The foamed vinyl board for composite flooring according to claim 6, characterized in that: The groove hole (13) includes an opening and a recessed portion connected to the opening and recessed in the substrate. The opening is located on the latch connecting surface (111) or the lock groove connecting surface (121). The recessed portion is arc-shaped, and the maximum arc length of the recessed portion is less than the maximum circumference of the closed hole when the groove hole is closed.

9. The foamed vinyl board for composite flooring according to claim 6, characterized in that: The average size of the maximum diameter of the groove (13) is 60-100 micrometers.

10. The foamed vinyl board for composite flooring according to claim 6, characterized in that: The opening of all the groove holes (13) on each of the latch connecting surfaces (111) or lock groove connecting surfaces (121) occupies 30%-90% of the surface area of ​​each of the latch connecting surfaces (111) or lock groove connecting surfaces (121) where it is located, and the base plate portion between adjacent groove holes (13) is elastic.

11. The foamed vinyl board for composite flooring according to claim 6, characterized in that: The center line of the thickness of the latch (11) and the lock groove (12) deviates from the center line of the thickness of the substrate (1) by less than 20% of the total thickness of the substrate (1), and the thickness of the latch (11) and the lock groove (12) accounts for 30% to 60% of the thickness of the substrate (1).

12. The foamed vinyl board for composite flooring according to claim 11, characterized in that: The width of the protruding latch (11) and the depth of the recessed lock groove (12) are 3 to 8 mm.

13. The foamed vinyl board for composite flooring according to claim 11, characterized in that: The locking tongue (11) and the locking groove (12) are connected by an interference fit.

14. The foamed vinyl board for composite flooring according to claim 4, characterized in that: The foamed vinyl board is obtained as follows: the raw material components of the foamed substrate include: 25-40 parts by weight of vinyl monomer copolymer and / or homopolymer, 3-8 parts by weight of plasticizer, 1-5 parts by weight of stabilizer, 0.5-2 parts by weight of lubricant, 10-50 parts by weight of filler, and 0.5-5 parts by weight of foaming agent. The raw material components are mixed and shaped, extruded, cooled, and cut to obtain a foamed vinyl board with a thickness of 3-12 mm.

15. The foamed vinyl board for composite flooring according to claim 14, characterized in that: The foamed vinyl board also includes 0.05-1 part of antifungal agent.

16. The foamed vinyl board for composite flooring according to claim 14, characterized in that: When mixing the raw material components of the foamed substrate, the mixing cycle is 20-25 minutes. The order of addition is vinyl monomer copolymer and / or homopolymer, filler, stabilizer, lubricant, plasticizer, and finally, the foaming agent is added 5 minutes before the end of mixing.

17. The foamed vinyl board for composite flooring according to claim 14, characterized in that: The substrate has a 1-3 mm thick film containing an antifungal agent laminated to one surface.

18. A composite flooring, characterized in that: The foamed vinyl board for composite flooring as described in any one of claims 1-17 further includes a cover that is bonded to the surface of the substrate (1).

19. A method for installing the composite flooring according to claim 18, characterized in that: After the ground is leveled, the composite flooring described above is placed on the ground. The composite flooring described below is then assembled with the composite flooring described above using latches and locking grooves, with all the cover parts of the composite flooring facing upwards.

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