Aluminum alloy composition

Abstract

Described herein is an alloy composition including aluminum and one or more additional elements including at least one of silicon, magnesium, iron, manganese, zinc, or titanium. The alloy composition is substantially free of at least one of chromium or copper.

Description

Attorney Docket No.: 28245.1414 (L1215PCT)ALUMINUM ALLOY COMPOSITIONTECHNICAL FIELD

[0001] Embodiments of the present invention relate, in general, to an alloy composition. In particular, the alloy composition includes aluminum and one or more additional elements, wherein the alloy is substantially free of at least one of chromium (Cr) or copper (Cu).BACKGROUND

[0002] In the semiconductor industry, devices used in manufacturing are fabricated of a variety of materials, such as ceramic or metal alloys. Commonly a chamber component may be made of an alloy, such as an aluminum alloy. The most common aluminum alloy used is often called A16061.BRIEF SUMMARY OF EMBODIMENTS

[0003] In certain embodiments, the instant disclosure is directed to an alloy including aluminum (Al) and one or more additional elements comprising at least one of silicon (Si), magnesium (Mg), iron (Fe), manganese (Mn), zinc (Zn), or titanium (Ti). The alloy is also substantially free of at least one of chromium (Cr) or copper (Cu).

[0004] In certain embodiments, the instant disclosure is directed to a chamber component including a body including an alloy. In some embodiments, the alloy may include Al and one or more additional elements may include at least one of Si, Mg, Fe, Zn or Ti, wherein the alloy may be substantially free of at least one of Cr or Cu.BRIEF DESCRIPTION OF THE DRAWINGS

[0005] The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that different references to "an" or "one" embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

[0006] FIG. 1 depicts a cross sectional view of a processing chamber.

[0007] FIG. 2 depicts a bottom view of a showerhead.

[0008] FIG. 3 depicts a top view of a top plate of a processing chamber.Attorney Docket No.: 28245.1414 (L1215PCT)DETAILED DESCRIPTION OF EMBODIMENTS

[0009] Process chambers used in manufacturing of devices such as semiconductor devices generally include multiple chamber components. Such chamber components are used in a variety of ways and to perform a variety of functions during the manufacturing process of a device such as a semiconductor device. Some chamber components are exposed to an interior of a process chamber, and to any environment of the process chamber interior. For example, during manufacturing of a device, a chamber component in a process chamber used to perform one or more processes for manufacturing of the device may be subject to a variety of conditions including exposure to a plasma, corrosive gases and / or high temperatures. Over time, exposure to such conditions can cause the chamber component to corrode and / or erode, such that the performance of the chamber component is impacted and it is replaced, or maintenance may need to be performed. Many chamber components may be made from an aluminum alloy composition such as A16061 that includes trace metals that provide strength, grain size and / or refinement of an alloy composition.

[0010] Recently, semiconductor manufacturers have found that there are issues with trace metals present in available aluminum alloys such as A16061. These trace metals include, but are not limited to, copper and chromium. For example, as semiconductor devices are getting smaller and smaller, those semiconductor devices are becoming more sensitive to metal contamination. Accordingly, levels of metal contamination (e.g., of copper and / or chromium) that were previously acceptable may lead to scrapping of product for newer smaller devices.

[0011] Coatings may be used in an attempt to seal in metal traces in aluminum alloys of chamber components and avoid metal contamination. However, coatings are not always effective to prevent trace metals from entering a processing chamber. Embodiments provide an improved aluminum alloy composition that has reduced levels of certain metals (e.g., such as copper and / or chromium) such that metal contamination of processed substrates caused by the trace metals in the aluminum alloy used in the chamber components may be reduced or eliminated.

[0012] Because of the exposure the conditions described herein, the trace metals in alloys used to construct chamber components my interact with a processed substrate, such as a wafer, in the processing chamber. The present disclosure includes various alloy compositions (e.g., aluminum alloy compositions) for a chamber component that prevent or mitigate contamination of substrates by trace metals. The aluminum alloy compositions described in embodiments lack copper and / or chromium, which may eliminate the aluminum alloy as a source of metal contamination during processing.Attorney Docket No.: 28245.1414 (L1215PCT)

[0013] Embodiments described herein are directed to new and useful aluminum alloy compositions that can be tailored for specific uses with respect to device processing (e.g., semiconductor processing). Aluminum alloy compositions may be adjusted in embodiments to improve corrosion resistance, adjust material strength, adjust hardness, adjust thermal conductivity, adjust impedance, adjust coefficient of thermal expansion, and / or other properties.

[0014] In standard alloy compositions, Cr and / or Cu are often added for grain refinement and strengthening of the alloy composition. It was surprisingly found that even though the alloy composition as described herein is substantially free of at least one of Cr or Cu, the strength of the alloy composition is not significantly reduced as compared to traditional aluminum alloys that include such metal additives. For example, A16061 has a yield strength of 35 ksi and an ultimate tensile strength of 42 ksi. In embodiments, the aluminum alloy that is used has a yield strength of 28 ksi and a tensile strength of 35 ksi, which the inventors have found is still sufficiently strong for manufacturing of chamber components. The generally understood best practice is to include copper and chromium in aluminum alloys to improve strength and for grain size control. This is true across industries. However, the embodiments of aluminum alloys described herein lack copper and / or chromium without impacting an ability of chamber components manufactured from such aluminum alloys to perform their designated functions. For example, such process chamber components may still have similar corrosion resistance, longevity, erosion resistance, and so on as traditional aluminum alloys. That is, when at least one of Cr or Cu was minimized in the alloy composition, then this eliminates a contamination source to the processing chamber.

[0015] Embodiments disclosed herein cover various new aluminum compositions that have material properties that are beneficial for certain applications, such as for use in chamber components that will be exposed to plasma.

[0016] In an embodiment, an alloy composition is provided. The alloy composition may include Al and one or more additional elements including at least one of Si, Mg, Fe, Mn, Zn, or Ti, wherein the alloy is substantially free of at least one of Cr or Cu. As understood throughout, the term “substantially free” refers to less than 0.05 wt%.

[0017] In some embodiments, the alloy composition does not include at least one of Cr or Cu.

[0018] In some embodiments of the alloy composition, the one or more additional elements may include Si in an amount of about 0.2 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may includeAttorney Docket No.: 28245.1414 (L1215PCT)Si in an amount of about 0.3 wt% to about 0.9 wt%, about 0.4 wt% to about 0.8 wt%, or about 0.5 wt% to about 0.7 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Si in an amount of about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0019] In some embodiments of the alloy composition, the one or more additional elements may include Mg in an amount of about 0.4 wt% to about 10 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mg in an amount of about 0.4 wt% to about 2.5 wt%, about 1 wt% to about 9 wt%, about 1.5 wt% to about 8.5 wt%, about 2 wt% to about 8 wt%, about 2.5 wt% to about 7.5 wt%, about 3 wt% to about 7 wt%, about 3.5 wt% to about 6.5 wt%, or about 4 wt% to about 6 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mg in an amount of about 0.4 wt%, about 1 wt%, about 1.5 wt%, about 2 wt%, about 2.5 wt%, about 3 wt%, about 3.5 wt%, about 4 wt%, about 4.5 wt%, about 5 wt%, about 5.5 wt%, about 6 wt%, about 6.5 wt%, about 7 wt%, about 7.5 wt%, about 8 wt%, about 8.5 wt%, about 9 wt%, about 9.5 wt% or about 10 wt%, based on total weight of the alloy composition.

[0020] In some embodiments of the alloy composition, the one or more additional elements may include Fe in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Fe in an amount of about 0.05 wt% to about 0.9 wt%, about 0.1 wt% to about 0.8 wt%, about 0.2 wt% to about 0.7 wt%, about 0.3 wt% to about 0.6 wt%, or about 0.4 wt% to about 0.5 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Fe in an amount of about 0.05 wt%, about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0021] In some embodiments of the alloy composition, the one or more additional elements may include Mn in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mn in an amount of about 0.1 wt% to about 0.9 wt%, about 0.15 wt% to about 0.8 wt%, about 0.2 wt% to about 0.7 wt%, about 0.25 wt% to about 0.6 wt%, or about 0.3 wt% to about 0.5 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mn in an amount of about 0.05 wt%, about 0.1Attorney Docket No.: 28245.1414 (L1215PCT)wt%, about 0.15 wt%, about 0.2 wt%, about 0.25 wt%, about 0.3 wt%, about 0.35 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0022] In some embodiments of the alloy composition, the one or more additional elements may include Zn in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Zn in an amount of about 0.1 wt% to about 0.9 wt%, about 0.15 wt% to about 0.8 wt%, about 0.2 wt% to about 0.7 wt%, about 0.25 wt% to about 0.6 wt%, or about 0.3 wt% to about 0.5 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Zn in an amount of about 0.05 wt%, about 0.1 wt%, about 0.15 wt%, about 0.2 wt%, about 0.25 wt%, about 0.3 wt%, about 0.35 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0023] In some embodiments of the alloy composition, the one or more additional elements may include Ti in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Ti in an amount of about 0.1 wt% to about 1.8 wt%, about 0.15 wt% to about 1.7 wt%, about 0.2 wt% to about 1.5 wt%, about 0.25 wt% to about 1.25 wt%, about 0.3 wt% to about 1 wt%, about 0.4 wt% to about 0.9 wt%, or about 0.5 wt% to about 0.8 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Ti in an amount of about 0.05 wt%, about 0.1 wt%, about 0.15 wt%, about 0.2 wt%, about 0.25 wt%, about 0.3 wt%, about 0.35 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, about 1.0 wt%, about 1.1 wt%, about 1.2 wt%, about 1.3 wt%, about 1.4 wt%, about 1.5 wt%, about 1.6 wt%, about 1.7 wt%, about 1.8 wt%, about 1.9 wt%, or about 2 wt%, based on total weight of the alloy composition.

[0024] In some embodiments of the alloy composition, the Al may be included in an amount of at least about 90 wt%, based on total weight of the alloy composition. In some embodiments, the Al may be included in an amount of at least about 92 wt%, or at least about 95 wt%, based on total weight of the alloy composition.

[0025] In some embodiments, the one or more additional elements of the alloy composition may include Si, Mg, Fe, Mn Zn and Ti. In some embodiments, the alloy composition may include Si in an amount of about 0.2 wt% to about 1 wt%; Mg in an amount of about 04 wt% to about 10 wt%; Fe in an amount of about 0.05 wt% to about 1 wt%; Mn in an amount ofAttorney Docket No.: 28245.1414 (L1215PCT)about 0.05 wt% to about 1 wt%; Zn in an amount of about 0.05 wt% to about 1 wt%; and Ti in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy.

[0026] In some embodiments, the alloy composition may have an ultimate tensile strength of about 30 ksi to about 40 ksi. In some embodiments, the alloy composition may have an ultimate tensile strength of about 30 ksi, about 31 ksi, about 32 ksi, about 33 ksi, about 34 ksi, about35 ksi, about36 ksi, about 37 ksi, about 38 ksi, about 39 ksi, or about 40 ksi. In some embodiments, the alloy composition may have a yield strength of about 25 ksi to about 40 ksi. In some embodiments, the alloy composition may have a yield strength of about 25 ksi, about 26 ksi, about 27 ksi, about 28 ksi, about 29 ksi, about 30 ksi, about 31 ksi, about 33 ksi, about 35 ksi, about 37 ksi, or about 40 ksi.

[0027] In another embodiment, a method to prepare the alloy composition is provided. The method may include melting aluminum, such as highly pure aluminum (prime aluminum) in a suitable vessel. In some embodiments, the one or more additional elements as described herein may be added to the molten aluminum, which may then be mixed in. That is, the one or more additional elements including at least one of Si, Mg, Fe, Mn, Zn, or Ti. In accordance with the present disclosure, the one or more additional elements does not include either Cu or Cr. After mixing in the one or more additional elements, the alloy composition may then be cast into a mold or ingot as understood by one of skill in the art. The alloy composition may then be cooled and solidified.

[0028] After solidifying, the cast ingot / mold may then undergo a thermal treatment to homogenize the one or more additional elements within the alloy composition. Thus, the one or more additional elements may be more even within the ingot. The thermal treatment of the alloy composition may include annealing, quenching, slow cooling, or intermediate temperature holds etc. After this thermal treatment, the cast ingot / mold may be further treated to induce strengthening mechanisms, forged into a shape, rolled into a plate, cut into a machine features, or similar processes related to post thermal treatment of an aluminum alloy as understood by one of skill in the art.

[0029] In another embodiment, a chamber component is also provided. The chamber component may include a body including an alloy composition as described herein. In some embodiments, the chamber component may include a chamber lid, a shower head, or a gas distribution plate. In some embodiments, the chamber component may have improved corrosion resistance when used in process chambers for processes such as non-plasma etchers, non-plasma cleaners, chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, plasma enhanced chemical vapor deposition (PECVD)Attorney Docket No.: 28245.1414 (L1215PCT)chambers, plasma enhanced physical vapor deposition (PEPVD) chambers, plasma enhanced atomic layer deposition (PEALD) chambers, an atomic layer deposition (ALD) chamber, and so forth. In some embodiments, the chamber component may have a diameter of about 10 inches to about30 inches, about 12 inches to about 28 inches, about 15 inches to about25 inches, or about 18 inches to about 22 inches

[0030] Referring now to the figures, FIG. 1 is a sectional view of a processing chamber 100 (e.g., a semiconductor processing chamber) having one or more chamber components in accordance with embodiments of the present disclosure. For example, one or more chamber components may include one or more alloy compositions as described herein. The processing chamber 100 may be used for processes in which a corrosive plasma environment and / or corrosive chemistry is provided. The processing chamber 100 may also be used for processes that do not include the use of a plasma environment or a corrosive chemistry in embodiments. In an example, the processing chamber 100 may be a chamber for a plasma etch reactor (also known as a plasma etcher), a deposition chamber, a rapid thermal processor, a lithography device, and / or any other type of process chamber. Examples of chamber components that may be exposed an interior of the processing chamber 100 (and that may shed metal particles that can ultimately contaminate a processed substrate) are a substrate support assembly 148, an electrostatic chuck (ESC), a ring (e.g., a process kit ring or single ring), a chamber wall, a base, a showerhead 130, a gas distribution plate, a face plate, a liner, a liner kit, a shield, a plasma screen, a remote plasma source, a flow equalizer, a cooling base, a chamber viewport, a chamber lid, a ceramic insulator, a quartz insulator, a nozzle, and so on. In some embodiments, processing chamber 100 is used to perform an etch process on a patterned substrate that includes a plurality of trenches formed thereon. In other embodiments, processing chamber 100 may be used to in a deposition chamber, an oxidation chamber, a lithography chamber, or other type of chamber.

[0031] In one embodiment, the processing chamber 100 includes a chamber body 102 and a showerhead 130 that enclose an interior volume 106. The showerhead 130 may or may not include a gas distribution plate. For example, the showerhead may be a multi-piece showerhead that includes a showerhead base and a showerhead gas distribution plate bonded to the showerhead base. Alternatively, the showerhead 130 may be replaced by a lid and a nozzle in some embodiments, or by multiple pie shaped showerhead compartments and plasma generation units in other embodiments. The chamber body 102 may be fabricated from nickel, copper, cobalt, chromium, molybdenum, aluminum, stainless steel, ruthenium, tungsten, platinum, an alloy of any of the above, or other suitable material. TheAttorney Docket No.: 28245.1414 (L1215PCT)chamber body 102 generally includes sidewalls 108 and a bottom 110. Any of the showerhead 130 (or lid and / or nozzle), sidewalls 108 and / or bottom 110 may include a multi-layer plasma resistant coating, or a single layer plasma resistant coating.

[0032] An outer liner 116 may be disposed adjacent the sidewalls 108 to protect the chamber body 102. The outer liner 116 may be a halogen-containing gas resist material such as A12O3or Y2O3. The outer liner 116 may be coated with the multi-layer plasma resistant ceramic coating in some embodiments.

[0033] An exhaust port 126 may be defined in the chamber body 102, and may couple the interior volume 106 to a pump system 128. The pump system 128 may include one or more pumps and throttle valves utilized to evacuate and regulate the pressure of the interior volume 106 of the processing chamber 100.

[0034] The showerhead 130 may be supported on the sidewalls 108 of the chamber body 102 and / or on atop portion of the chamber body. The showerhead 130 (or lid) may be opened to allow access to the interior volume 106 of the processing chamber 100, and may provide a seal for the processing chamber 100 while closed. A gas panel 158 may be coupled to the processing chamber 100 to provide process and / or carrier gases to the interior volume 106 through the showerhead 130 or lid and nozzle. Examples of process gas that may be delivered by the gas panel 158 and used to process substrates / samples in the processing chamber 100 include a silicon containing gas, halogen-containing gases, such as C2F6, SF6, HBr, NF3, CF4, CHF3, CH2F2, F2, NF3, Cl2, CC14, BC13and SiF4, among others, and other gases such as O2or N2O. Examples of carrier gases (also referred to herein as a diluent) include N2, He, Ar, and other gases inert to process gases (e.g., non-reactive gases). The showerhead 130 includes multiple gas delivery holes 132 throughout the showerhead 130. The showerhead 130 may be or may include aluminum, anodized aluminum, an aluminum alloy, or an anodized aluminum alloy. In some embodiments, the showerhead 130 may include the aluminum alloy composition according to the present disclosure. In some embodiments, the showerhead 130 may further include an additional coating. In some embodiments, the showerhead includes a gas distribution plate (GDP) bonded to the showerhead. The GDP may be, for example, Si or SiC, or may be a ceramic such as Y2O3, A12O3, Y3A150I2(TAG), and so forth. The GDP may additionally include multiple holes that line up with the holes in the showerhead.

[0035] For processing chambers used for conductor etch (etching of conductive materials), a lid may be used rather than a showerhead. The lid may include a center nozzle that fits into a center hole of the lid. The lid may be a ceramic such as Y2O3, A12O3, YAG or a ceramicAttorney Docket No.: 28245.1414 (L1215PCT)compound comprising Y4AI2O9 and a solid-solution of Y2O3-ZrO2. The nozzle may also be a ceramic, such as Y2C>3, A12C>3, YAG or a ceramic compound comprising Y4A12O9 and a solidsolution of Y2O3-ZrO2.

[0036] A substrate support assembly 148 is disposed in the interior volume 106 of the processing chamber 100 below the showerhead 130. The substrate support assembly 148 holds a substrate 144 (e.g., a wafer) during processing. The substrate support assembly 148 may include an electrostatic chuck that secures the substrate 144 during processing, a metal cooling plate bonded to the electrostatic chuck, and / or one or more additional components. An inner liner may cover a periphery of the substrate support assembly 148. The inner liner may be a halogen-containing gas resist material such as A12C>3 or Y2C>3. The substrate support assembly, portions of the substrate support assembly, and / or the inner liner may be coated with the metal layer and barrier layer in some embodiments.

[0037] In some embodiments, any of the chamber components of the process chamber, such as a substrate support assembly, an electrostatic chuck (ESC), a ring (e.g. a process kit ring or single ring), a chamber wall, abase, a gas distribution plate or showerhead, a liner, a liner kit, a shield, a plasma screen, a flow equalizer, a cooling base, a chamber viewport, a chamber lid, a face plate, a surface mount device (SMD), and so on may be manufactured from an advanced metal alloy that lacks or substantially lacks copper and / or chromium. The body of a chamber component or other article may include an aluminum alloy as described herein, a ceramic, a metal-ceramic composite, a polymer or a polymer-ceramic composite, or a combination thereof. In an embodiment, the body of the article may be or include an aluminum alloy composition of the present disclosure.

[0038] FIG. 2 illustrates one embodiment of a bottom view of a showerhead 200. The showerhead 200 may have a series of gas conduits 204 (also referred to as holes) arranged concentrically that evenly distribute plasma gasses directly over a substrate or wafer to be etched or processed. The showerhead 200 may alternatively have a series of gas conduits 204 arranged in different configurations, such as a spiral array. The showerhead is depicted here having approximately 1100 gas conduits 204 arranged in evenly distributed concentric rings for even distributing of gasses. In another embodiment, the gas conduits 204 may be configured in alternative geometric configurations on the lower surface 205 of the showerhead (or on a lower surface of a GDP bonded to a showerhead). For example, the showerhead may have a square or rectangular configuration having rows and columns of gas conduits 204. It is to be understood that other shapes (e.g., triangle, pentagon, etc.) may be implemented. The showerhead 200 can have many gas conduits 204, as depicted, or as fewAttorney Docket No.: 28245.1414 (L1215PCT)gas conduits as appropriate depending on the type of reactor and / or process utilized. In embodiments, the showerhead 200 is a 3D printed part.

[0039] In one embodiment, some or all gas conduits 204 do not include branches (e.g., each gas conduit may have a single entry point and a single exit point). Additionally, the gas conduits may have various lengths and orientation angles. Gas may be delivered to the gas conduits 204 via one or more gas delivery nozzles. Some gas conduits 204 may receive the gas before other gas conduits 204 (e.g., due to a proximity to a gas delivery nozzle). In some embodiments, one or more gas conduits 204 include branches, changing internal diameters, changes in direction, and / or other internal features that would be impractical to form via traditional manufacturing processes. In embodiments, the complex internal features of the showerhead 200 are achieved via 3D printing of the showerhead 200. The gas conduits 204 may be configured to deliver gas to a substrate resting beneath the showerhead at approximately the same time based on varying the orientation angles, diameters and / or lengths of the gas conduits 204, or by using an additional flow equalizer in embodiments. For example, gas conduits 204 that will receive gas first may be longer and / or have a greater angle (e.g., an angle that is further from 90 degrees) than conduits that will receive gas later.

[0040] In some embodiments, the shower head 200 and / or any other chamber component or other article may be made from an alloy composition as described herein. That is, the alloy composition may include Al and one or more additional elements including at least one of Si, Mg, Fe, Mn, Zn, or Ti, wherein the alloy is substantially free of at least one of Cr or Cu. As understood throughout, the term “substantially free” refers to less than 0.05 wt%.

[0041] In some embodiments, the alloy composition does not include at least one of Cr or Cu.

[0042] In some embodiments of the alloy composition, the one or more additional elements may include Si in an amount of about 0.2 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Si in an amount of about 0.3 wt% to about 0.9 wt%, about 0.4 wt% to about 0.8 wt%, or about 0.5 wt% to about 0.7 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Si in an amount of about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0043] In some embodiments of the alloy composition, the one or more additional elements may include Mg in an amount of about 0.4 wt% to about 10 wt%, based on total weight of theAttorney Docket No.: 28245.1414 (L1215PCT)alloy composition. In some embodiments, the one or more additional elements may include Mg in an amount of about 0.4 wt% to about 9 wt%, about 0.5 wt% to about 2.5 wt% about 1 wt% to about 9 wt%, about 1.5 wt% to about 8.5 wt%, about 2 wt% to about 8 wt%, about 2.5 wt% to about 7.5 wt%, about 3 wt% to about? wt%, about 3.5 wt% to about 6.5 wt%, or about 4 wt% to about 6 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mg in an amount of about 0.4 wt%, about 1 wt%, about 1.5 wt%, about 2 wt%, about 2.5 wt%, about 3 wt%, about 3.5 wt%, about 4 wt%, about 4.5 wt%, about 5 wt%, about 5.5 wt%, about 6 wt%, about 6.5 wt%, about 7 wt%, about 7.5 wt%, about 8 wt%, about 8.5 wt%, about 9 wt%, about 9.5 wt% or about 10 wt%, based on total weight of the alloy composition.

[0044] In some embodiments of the alloy composition, the one or more additional elements may include Fe in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Fe in an amount of about 0.05 wt% to about 0.9 wt%, about 0.1 wt% to about 0.8 wt%, about 0.2 wt% to about 0.7 wt%, about 0.3 wt% to about 0.6 wt%, or about 0.4 wt% to about 0.5 wt%, , based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Fe in an amount of about 0.05 wt%, about 0.1 wt%, about 0.2 wt%, about 0.3 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0045] In some embodiments of the alloy composition, the one or more additional elements may include Mn in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mn in an amount of about 0.1 wt% to about 0.9 wt%, about 0.15 wt% to about 0.8 wt%, about 0.2 wt% to about 0.7 wt%, about 0.25 wt% to about 0.6 wt%, or about 0.3 wt% to about 0.5 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Mn in an amount of about 0.05 wt%, about 0.1 wt%, about 0.15 wt%, about 0.2 wt%, about 0.25 wt%, about 0.3 wt%, about 0.35 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0046] In some embodiments of the alloy composition, the one or more additional elements may include Zn in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Zn in an amount of about 0.1 wt% to about 0.9 wt%, about 0.15 wt% to about 0.8 wt%, aboutAttorney Docket No.: 28245.1414 (L1215PCT)0.2 wt% to about 0.7 wt%, about 0.25 wt% to about 0.6 wt%, or about 0.3 wt% to about 0.5 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Zn in an amount of about 0.05 wt%, about 0.1 wt%, about 0.15 wt%, about 0.2 wt%, about 0.25 wt%, about 0.3 wt%, about 0.35 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about 0.7 wt%, about 0.8 wt%, about 0.9 wt%, or about 1.0 wt%, based on total weight of the alloy composition.

[0047] In some embodiments of the alloy composition, the one or more additional elements may include Ti in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Ti in an amount of about 0.1 wt% to about 1.8 wt%, about 0.15 wt% to about 1.7 wt%, about 0.2 wt% to about 1.5 wt%, about 0.25 wt% to about 1.25 wt%, about 0.3 wt% to about 1 wt%, about 0.4 wt% to about 0.9 wt%, or about 0.5 wt% to about 0.8 wt%, based on total weight of the alloy composition. In some embodiments, the one or more additional elements may include Ti in an amount of about 0.05 wt%, about 0.1 wt%, about 0.15 wt%, about 0.2 wt%, about 0.25 wt%, about 0.3 wt%, about 0.35 wt%, about 0.4 wt%, about 0.5 wt%, about 0.6 wt%, about0.7 wt%, about0.8 wt%, about0.9wt%, about 1.0 wt%, about 1.1 wt%, about 1.2 wt%, about 1.3 wt%, about 1.4 wt%, about 1.5 wt%, about 1.6 wt%, about 1.7 wt%, about 1.8 wt%, about 1.9 wt%, or about 2 wt%, based on total weight of the alloy composition.

[0048] In some embodiments of the alloy composition, the Al may be included in an amount of at least about 90 wt%, based on total weight of the alloy composition. In some embodiments, the Al may be included in an amount of at least about 92 wt%, or at least about 95 wt%, based on total weight of the alloy composition.

[0049] In some embodiments, the one or more additional elements of the alloy composition may include Si, Mg, Fe, Mn Zn and Ti. In some embodiments, the alloy composition may include Si in an amount of about 0.2 wt% to about 1 wt%; Mg in an amount of about 0.4 wt% to about 10 wt%; Fe in an amount of about 0.05 wt% to about 1 wt%; Mn in an amount of about 0.05 wt% to about 1 wt%; Zn in an amount of about 0.05 wt% to about 1 wt%; and Ti in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy.

[0050] In some embodiments, the alloy composition of the shower head may have an ultimate tensile strength of about 30 ksi to about 40 ksi. In some embodiments, the alloy composition may have an ultimate tensile strength of about 30 ksi, about 31 ksi, about 32 ksi, about33 ksi, about34 ksi, about35 ksi, about36 ksi, about37 ksi, about38 ksi, about39 ksi, or about 40 ksi. In some embodiments, the alloy composition may have a yield strength of about 25 ksi to about 40 ksi. In some embodiments, the alloy composition may have a yieldAttorney Docket No.: 28245.1414 (L1215PCT)strength of about 25 ksi, about 26 ksi, about 27 ksi, about 28 ksi, about 29 ksi, about 30 ksi, about 31 ksi, about 33 ksi, about 35 ksi, about 37 ksi, or about 40 ksi.

[0051] FIG. 3 depicts a top view of a top plate 300 of a processing chamber. The top plate 300 may be a spinner top plate that is placed in a process chamber. The top plate 300 may have a circular plate body with a central aperture 310 and four symmetrically arranged circular openings 305 that may surround the central aperture 310. The top plate 300 may include a plurality of holes along the outside perimeter (not pictured) to secure the top plate 300 to the process chamber. In some embodiments, the diameter of the top plate 300 may be about25 inches to about 60 inches, about30 inches to about50 inches, or about 35 inches to about 45 inches.

[0052] In some embodiments, the top plate 300 and / or any other chamber component or other article may be made from an alloy composition as described herein. That is, the alloy composition may include Al and one or more additional elements including at least one of Si, Mg, Fe, Mn, Zn, or Ti, wherein the alloy is substantially free of at least one of Cr or Cu. As understood throughout, the term “substantially free” refers to less than 0.05 wt%. The alloy composition may be the same as described when referring to FIG. 2.EXAMPLES

[0053] An illustrative example of the alloy composition that does not include chromium and copper is provided in Table 1.Table 1 : Alloy Composition of the present disclosureAttorney Docket No.: 28245.1414 (L1215PCT)

[0054] The preceding description sets forth numerous specific details such as examples of specific systems, components, methods, and so forth, in order to provide a good understanding of several embodiments of the present invention. It will be apparent to one skilled in the art, however, that at least some embodiments of the present invention may be practiced without these specific details. In other instances, well-known components or methods are not describedin detail or are presentedin simple block diagram format in order to avoid unnecessarily obscuring the present invention. Thus, the specific details set forth are merely exemplary. Particular implementations may vary from these exemplary details and still be contemplated to be within the scope of the present invention.

[0055] Reference through out this specification to “one embodiment” or “an embodiment’ means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrase “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. In addition, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” When the term “about” or “approximately” is used herein, this is intended to mean that the nominal value presented is precise within ±10%.

[0056] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be altered so that certain operations may be performed in an inverse order or so that certain operation may be performed, at least in part, concurrently with other operations. In another embodiment, instructions or sub-operations of distinct operations may be in an intermittent and / or alternating manner.

[0057] It is to be understood that the above description is intended to be illustrative, and not restrictive. Many other embodiments will be apparent to those of skill in the art upon reading and understanding the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

Attorney Docket No.: 28245.1414 (L1215PCT)CLAIMSWhat is claimed is:

1. An alloy composition comprising:aluminum (Al), andone or more additional elements comprising at least one of silicon (Si), magnesium (Mg), iron (Fe), manganese (Mn), zinc (Zn), or titanium (Ti),wherein the alloy is substantially free of at least one of chromium (Cr) or copper (Cu).

2. The alloy composition of claim 1, wherein the one or more additional elements does not include at least one of Cr or Cu.

3. The alloy composition of claim 1, wherein the one or more additional elements include Si in an amount of about 0.2 wt% to about 1 wt%, based on total weight of the alloy composition.

4. The alloy composition of claim 1, wherein the one or more additional elements include Mg in an amount of about 0.4 wt% to about 10 wt%, based on total weight of the alloy composition.

5. The alloy composition of claim 1, wherein the one or more additional elements include Fe in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition.

6. The alloy composition of claim 1, wherein the one or more additional elements include Mn in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition.

7. The alloy composition of claim 1, wherein the one or more additional elements include Zn in an amount of about 0.05 wt% to about 1 wt%, based on total weight of the alloy composition.Attorney Docket No.: 28245.1414 (L1215PCT)8. The alloy composition of claim 1, wherein the one or more additional elements include Ti in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy composition.

9. The alloy composition of claim 1, wherein Al is included in an amount of at least about 90 wt%, based on total weight of the alloy composition.

10. The alloy composition of claim 1, wherein the one or more additional elements comprise Si, Mg, Fe, Mn, Zn and Ti.

11. The alloy composition of claim 1, wherein Si is included in an amount of about 0.2 wt% to about 1 wt%; Mg is included in an amount of about 0.4 wt% to about 10 wt%; Fe is included in an amount of about 0.05 wt% to about 1 wt%; Mn is included in an amount of about 0.05 wt% to about 1 wt%; Zn is included in an amount of about 0.05 wt% to about 1 wt%; and Ti is included in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy composition.

12. The alloy composition of claim 1, wherein the alloy composition has a tensile strength of about 30 ksi to about 40 ksi.

13. The alloy composition of claim 1, wherein the alloy composition has a yield strength of about 25 ksi to about 40 ksi.

14. A chamber component comprising a body comprising an alloy composition, wherein the alloy composition comprises Al and one or more additional elements comprising at least one of Si, Mg, Fe, Mn, Zn, or Ti, wherein the alloy is substantially free of at least one of Cr or Cu.

15. The chamber component of claim 14, wherein the chamber component comprises a chamber lid, a shower head, or a gas distribution plate.

16. The chamber component of claim 14, wherein the chamber component has a diameter of 10 inches to 50 inches.Attorney Docket No.: 28245.1414 (L1215PCT)17. The chamber component of claim 14, wherein alloy composition does not include at least one of Cr or Cu.

18. The chamber component of claim 14, wherein the one or more additional elements comprise Si, Mg, Fe, Mn, Zn and Ti.

19. The chamber component of claim 14, wherein Si is included in an amount of about 0.2 wt% to about 1 wt%; Mg is included in an amount of about 0.4 wt% to about 10 wt%; Fe is included in an amount of about 0.05 wt% to about 1 wt%; Mn is included in an amount of about 0.05 wt% to about 1 wt%; Zn is included in an amount of about 0.05 wt% to about 1 wt%; and Ti is included in an amount of about 0.05 wt% to about 2 wt%, based on total weight of the alloy composition.

20. The chamber component of claim 14, wherein Al is included in an amount of at least about 90 wt%, based on total weight of the alloy composition.

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