Heat dissipation apparatus, device node, liquid-cooled cabinet, and data center

Abstract

Provided are a heat dissipation apparatus, a device node, a liquid-cooled cabinet, and a data center, relating to the field of heat dissipation of electronic devices. The heat dissipation apparatus comprises: a cold plate assembly, a heat dissipation module, a first conduit, and a second conduit. The cold plate assembly comprises a first flow channel for dissipating heat from a first device in a device node, and a second flow channel for dissipating heat from a second device in the device node. The heat dissipation module is configured to supply a first cooling medium to the first flow channel. A second cooling medium can be input into the second flow channel by means of the first conduit, and the second cooling medium output by the second flow channel can be received by means of the second conduit. A temperature of the first cooling medium when input into the first flow channel is a first temperature, a temperature of the second cooling medium when input into the second flow channel is a second temperature, and the first temperature is not equal to the second temperature. This allows heat dissipation to be achieved for devices having different heat dissipation requirements. In addition, providing a cold plate assembly that occupies a relatively small space is advantageous for achieving, by means of cold plate assemblies, heat dissipation from various devices integrated into a compact package.

Description

Heat dissipation devices, equipment nodes, liquid-cooled cabinets and data centers

[0001] This application claims priority to Chinese patent application filed on February 20, 2025, with application number 202510194542.5 and entitled "Heat Dissipation Device, Equipment Node, Liquid Cooling Cabinet and Data Center", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation for electronic devices, and more particularly to heat dissipation devices, device nodes, liquid-cooled cabinets, and data centers. Background Technology

[0003] As data center computing power increases, so do their energy consumption and heat dissipation requirements. Liquid cooling is a reliable solution for heat dissipation in data centers.

[0004] Because different components in a data center may have varying heat dissipation requirements, uneven heat dissipation can easily occur in different areas of the data center, posing a challenge to data center thermal management. Therefore, it is necessary to optimize the heat dissipation effect of different heat-generating components to meet the heat dissipation requirements of the data center. Summary of the Invention

[0005] Embodiments of this application provide a heat dissipation device, device node, liquid-cooled cabinet, and data center. The heat dissipation device can simultaneously dissipate heat from devices with different heat dissipation requirements, and the cold plate assembly in the heat dissipation device is small in size, which is beneficial for differentiated heat dissipation of different compactly packaged devices.

[0006] In a first aspect, a heat dissipation device is provided for use in a device node. The heat dissipation device includes: a cold plate assembly, a heat dissipation module, a first pipe, and a second pipe. The cold plate assembly is provided with a first flow channel and a second flow channel. The first flow channel is used to dissipate heat from a first device in the device node, and the second flow channel is used to dissipate heat from a second device in the device node. The first device may include an HBM chip, and the second device may include an ASIC chip. The heat dissipation module is connected to the first flow channel and is configured to supply a first cooling medium to the first flow channel. The first cooling medium includes water or a non-aqueous refrigerant. The first pipe and the second pipe are respectively connected to the second flow channel to input a second cooling medium into the second flow channel through the first pipe and to receive the second cooling medium output from the second flow channel through the second pipe. The second cooling medium can be water or a non-aqueous liquid with heat dissipation effect. The temperature at which the first cooling medium enters the first flow channel is a first temperature, and the temperature at which the second cooling medium enters the second flow channel is a second temperature. The first temperature and the second temperature are not equal.

[0007] In the heat dissipation device provided in this application embodiment, the first cooling medium in the first flow channel can dissipate heat to the first device in the device node, and the second cooling medium in the second flow channel can dissipate heat to the second device in the device node. For example, if the first temperature is lower than the second temperature, and the thermal sensitivity of the first device is higher than that of the second device, that is, the heat dissipation requirement of the first device is higher than that of the second device, the first cooling medium with a lower temperature dissipates heat to the first device with higher thermal sensitivity, and the second cooling medium with a higher temperature dissipates heat to the second device with lower thermal sensitivity. In this way, the heat dissipation device can achieve heat dissipation for devices with different heat dissipation requirements, that is, it can simultaneously perform differentiated heat dissipation for the first device and the second device.

[0008] Furthermore, both the first and second cooling channels are located within the cold plate assembly. The cold plate assembly occupies a small space, which is beneficial for heat dissipation of different devices in a compact package. Taking a compact package of multiple HBM chips and a single ASIC chip as an example, the first cooling medium in the first channel can dissipate heat from multiple HBM chips with high heat dissipation requirements, while the second cooling medium in the second channel can dissipate heat from a single ASIC chip with lower heat dissipation requirements. This achieves good heat dissipation for both multiple HBM chips and a single ASIC chip simultaneously. Moreover, the small space occupied by the cold plate assembly alleviates the potential problem of insufficient heat dissipation for both multiple HBM chips and a single ASIC chip due to its large size.

[0009] In one possible implementation, the first flow channel has a first inlet and a first outlet; the heat dissipation module is connected to the first inlet and the first outlet respectively; the second flow channel has a second inlet and a second outlet, the second inlet is connected to the first pipe, and the second outlet is connected to the second pipe.

[0010] The first cooling medium supplied by the heat dissipation module can enter the first flow channel through the first inlet and then return to the heat dissipation module through the first outlet; the second cooling medium transported through the first pipe can enter the second flow channel through the second inlet and then exit to the second pipe through the second outlet. This allows for the circulation of both the first and second cooling media within the first and second flow channels, facilitating effective heat dissipation for both the first and second devices.

[0011] In one possible implementation, the first outlet and the second outlet are the same outlet. That is, the first flow channel and the second flow channel share the same outlet.

[0012] This reduces the number of outlets on the cold plate assembly, simplifies the structure of the cold plate assembly, facilitates centralized processing of the first cooling medium in the first flow channel and the second cooling medium in the second flow channel, and reduces the manufacturing cost of the cold plate assembly.

[0013] In one possible implementation, the heat dissipation module includes a condenser and a compressor connected to each other; the condenser is connected to a first inlet, and the compressor is connected to a first outlet. The condenser, compressor, and first flow channel can form an internal loop, in which a refrigerant, acting as a first cooling medium, circulates repeatedly to dissipate heat from the first device. The refrigerant may include water or other common refrigerants with cooling effects.

[0014] The refrigerant output from the condenser enters the first flow channel through the first inlet, and then returns to the condenser through the compressor. This cycle repeats, achieving heat dissipation for the first component. Furthermore, since the compressor can compress and deliver the refrigerant, there is no need for an additional pump, simplifying the component composition of the heat dissipation module and reducing its cost.

[0015] In some examples, the aforementioned heat dissipation module also includes an expansion valve, which may be located between the condenser and the first flow channel.

[0016] In one possible implementation, the heat dissipation module includes a condenser, a compressor, and an evaporator connected in sequence; the evaporator is connected to a first inlet and a first outlet. The condenser, compressor, and evaporator can form a refrigeration internal loop, in which a refrigerant is transported. The evaporator and the first flow channel can also form an internal loop, in which a first cooling medium is transported. In some examples, the heat dissipation device further includes a first pump, disposed between the heat dissipation module and the first flow channel, which provides power for the transport of the first cooling medium.

[0017] The first cooling medium output from the evaporator enters the first flow channel through the first inlet, and then returns to the evaporator through the first outlet. The evaporator will lower the temperature of the first cooling medium, and the cycle can achieve heat dissipation of the first device.

[0018] In one possible implementation, the first pipe, the second flow channel, the condenser, and the second pipe are connected in sequence. In this scheme, the coolant output from the first pipe is directly input into the second flow channel as the second cooling medium.

[0019] The coolant output from the first pipe is directly input into the second flow channel as the second cooling medium. The second cooling medium in the second flow channel is output from the second outlet. The second cooling medium output from the second flow channel is then input into the condenser. The high-temperature liquid output from the first condenser enters the second pipe.

[0020] In one possible implementation, the first pipe, the condenser, the second flow channel, and the second pipe are connected in sequence. In this scheme, the cold liquid output from the first pipe will be slightly heated after passing through the condenser, and the condenser will slightly cool it down. The slightly heated liquid is then input into the second flow channel as the second cooling medium.

[0021] The refrigerant output from the first pipe first enters the condenser. In the condenser environment, the refrigerant heats up slightly, while the condenser cools down slightly. The heated refrigerant is then used as a second cooling medium and input into the second flow channel. Finally, the second cooling medium in the second flow channel is transported to the second pipe. In this way, the refrigerant absorbs the heat dissipated by the condenser, lowering the condenser's temperature and promoting the condenser's cooling and condensation of the high-temperature, high-pressure gaseous refrigerant into liquid refrigerant through heat exchange, thereby improving the coefficient of performance (COP) of the heat dissipation module.

[0022] In one possible implementation, the heat dissipation module includes a condenser, a compressor, and an evaporator connected in sequence; the evaporator is connected to a first inlet, and the condenser is connected to a first outlet.

[0023] The first cooling medium output from the evaporator enters the first flow channel through the first inlet. The first cooling medium in the first flow channel exits the first flow channel through the first outlet. The first cooling medium exiting the first flow channel is then input into the condenser. The condenser dissipates heat to the first cooling medium, causing the temperature of the first cooling medium to increase further.

[0024] In one possible implementation, the first pipe, evaporator, first flow channel, condenser, and second pipe are connected, and the first pipe, second flow channel, condenser, and second pipe are also connected. In this scheme, the coolant output through the first pipe can be directly used as the second cooling medium and input into the second flow channel, or it can be used as the first cooling medium and input into the first flow channel after being cooled by the evaporator.

[0025] On one hand, the coolant output from the first pipe is directly input into the second flow channel as the second cooling medium to dissipate heat from the second device. On the other hand, the coolant output from the first pipe is first input into the evaporator for cooling, and then the cooled coolant is input into the first flow channel as the first cooling medium to dissipate heat from the first device. In this way, the temperature of the first cooling medium can be kept lower than that of the second cooling medium, and both the first and second cooling media can be supplied simultaneously through the first pipe, which can reduce the load on the heat dissipation module.

[0026] In one possible implementation, the heat dissipation module includes a thermoelectric cooling device, which has a cold-end module, a thermoelectric module, and a hot-end module. The cold-end module and the hot-end module are respectively connected to opposite sides of the thermoelectric module. The cold-end module is connected to a first flow channel. The first flow channel can form an internal circulation with the cold-end module, and the substance transported in this internal circulation is a first cooling medium.

[0027] The first cooling medium output from the cold-end module enters the first flow channel through the first inlet, and exits the first flow channel through the first outlet. The first cooling medium exiting the first flow channel is then input back into the cold-end module for cooling. This cycle repeats to achieve heat dissipation for the first device. Furthermore, because the thermoelectric cooling device is relatively small, it facilitates miniaturization of the heat dissipation device, mitigating the potential problem of an excessively large heat dissipation device being unable to effectively dissipate heat from compactly packaged devices. This also helps to broaden the application scenarios of the heat dissipation device.

[0028] In one possible implementation, the first pipe, the second flow channel, the hot end module, and the second pipe are connected in sequence.

[0029] The second cooling medium output from the first pipe enters the second flow channel to dissipate heat from the second device. The second cooling medium output from the second flow channel enters the hot end module. The high-temperature liquid output from the hot end module is delivered to the second pipe, thereby achieving heat dissipation for the second device.

[0030] In some examples, the first pipe, the hot-end module, the second flow channel, and the second pipe are connected in sequence. In this scheme, the cold liquid output from the first pipe will be slightly heated after passing through the hot-end module, and then slightly cooled by the hot-end module. The slightly heated liquid is then input into the second flow channel as the second cooling medium.

[0031] The coolant output from the first pipe is first introduced into the hot-end module. The coolant, being in the environment of the hot-end module, will slightly increase in temperature, while the hot-end module will slightly decrease in temperature. The heated coolant is then used as a second cooling medium and introduced into the second flow channel. Finally, the second cooling medium in the second flow channel is transported to the second pipe. In this way, the coolant absorbs the heat dissipated from the hot-end module, reducing its temperature and the temperature difference between the hot-end and cold-end modules, thereby improving the performance coefficient of the heat dissipation module.

[0032] In some examples, the first flow channel and the second flow channel share the same outlet; the first pipe, the second inlet, the common outlet, the hot end module and the second pipe are connected in sequence, and the first inlet, the common outlet and the cold end module are connected in sequence.

[0033] In one possible implementation, the cold plate assembly includes a first cold plate having a first flow channel and a second flow channel. In other words, a single cold plate has both a first flow channel and a second flow channel simultaneously.

[0034] The first device can be cooled by the first cooling medium in the first channel of the first cold plate, and the second device can be cooled by the second cooling medium in the second channel of the first cold plate. The cooling of devices with different cooling requirements can be achieved by a single cold plate, which reduces the space occupied by the cold plate and is conducive to differentiated cooling of different devices in compact packages.

[0035] In some examples, the first cold plate may also be provided with a third flow channel, and the heat dissipation module is configured to supply a first cooling medium to the first flow channel and the third flow channel.

[0036] In one possible implementation, the cold plate assembly includes a second cold plate and a third cold plate, the second cold plate being provided with a first flow channel and the third cold plate being provided with a second flow channel.

[0037] In this way, the first cooling medium in the first flow channel of the second cold plate can achieve heat dissipation of the first device, and the second cooling medium in the second flow channel of the third cold plate can achieve heat dissipation of the second device, thus achieving heat dissipation of devices with different heat dissipation requirements.

[0038] In one possible implementation, the second cold plate is arranged around the periphery of the third cold plate. Arranging the second cold plate around the periphery of the third cold plate reduces the total space occupied by the two cold plates, which is beneficial for heat dissipation of different devices in a compact package.

[0039] In one possible implementation, the heat dissipation device may include multiple cold plate assemblies, a heat dissipation module, a first pipe, and a second pipe. The heat dissipation module is connected to multiple first flow channels in the multiple cold plate assemblies, and is configured to supply a first cooling medium to the multiple first flow channels respectively. The first pipe, the second pipe, and the second flow channels in the multiple cold plate assemblies are connected to allow second cooling medium to be input to the multiple second flow channels through the first pipe, and to receive second cooling medium output from the multiple second flow channels through the second pipe.

[0040] The heat dissipation module supplies a first cooling medium to multiple first channels, inputs a second cooling medium to multiple second channels through a first pipe, and receives the second cooling medium output from multiple second channels through a second pipe, thus simultaneously dissipating heat for multiple first devices and multiple second devices.

[0041] Secondly, a device node is provided. The device node includes: a first device, a second device, and a heat dissipation device as described in any possible implementation of the first aspect; the first device and the second device are disposed on one side of a cold plate assembly of the heat dissipation device; the thermal sensitivity of the first device is greater than that of the second device, i.e., the heat dissipation requirement of the first device is higher than that of the second device; the projection of the first device on the cold plate assembly overlaps with a first flow channel of the cold plate assembly, and the projection of the second device on the cold plate assembly overlaps with a second flow channel of the cold plate assembly, i.e., the first cooling medium in the first flow channel mainly dissipates heat from the first device, and the second cooling medium in the second flow channel mainly dissipates heat from the second device.

[0042] The heat dissipation device can simultaneously cool devices with different heat dissipation requirements in the equipment node by using a first cooling medium with a lower temperature to dissipate heat from a first device with higher temperature and a second cooling medium with lower temperature to dissipate heat from a second device with lower temperature. In other words, it can simultaneously perform differentiated heat dissipation on the first device and the second device.

[0043] Thirdly, a liquid-cooled cabinet is provided. The liquid-cooled cabinet includes a liquid-cooling distribution unit and the equipment node mentioned in the third aspect. The liquid-cooling distribution unit is configured to input a second cooling medium into a second flow channel through a first pipe and to receive the second cooling medium output through the second pipe.

[0044] The liquid cooling distribution unit in the liquid-cooled cabinet inputs the second cooling medium into the second flow channel through the first pipe and receives the second cooling medium output through the second pipe. This is beneficial for compatibility with conventional liquid cooling distribution units and inlets, outlets and pipes on equipment nodes. It can reduce the time and cost of modifying the liquid-cooled cabinet due to the installation of heat dissipation devices, and also promote the large-scale use of the liquid-cooled cabinet provided in the embodiments of this application.

[0045] Fourthly, another liquid-cooled cabinet is provided. This liquid-cooled cabinet includes: a first device, a second device, a liquid-cooled distribution unit, and a device node in any possible implementation of the first aspect's heat dissipation device; the first device, the second device, and a cold plate assembly in the heat dissipation device are located within the device node; the first device and the second device are disposed on one side of the cold plate assembly; the thermal sensitivity of the first device is greater than that of the second device; the projection of the first device on the cold plate assembly overlaps with a first flow channel of the cold plate assembly, and the projection of the second device on the cold plate assembly overlaps with a second flow channel of the cold plate assembly.

[0046] In a liquid-cooled cabinet, the heat dissipation devices are located outside the equipment nodes, while the cold plate assemblies are located inside the equipment nodes. When multiple heat dissipation devices are installed in the liquid-cooled cabinet, heat dissipation modules can supply a first cooling medium to multiple first flow channels in multiple cold plate assemblies, and liquid-cooled distribution units can supply a second cooling medium to multiple second flow channels in multiple cold plate assemblies, thereby achieving heat dissipation for multiple first and second devices.

[0047] Fifthly, a data center is provided, which includes liquid-cooled cabinets as described in any possible implementation of the third aspect. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 is a schematic diagram of a data center architecture according to an embodiment of this application;

[0050] Figure 2 is a schematic diagram of the structure of some heat dissipation devices provided in the embodiments of this application;

[0051] Figure 3 is a schematic diagram of the structure of some device nodes provided in the embodiments of this application;

[0052] Figure 4 is a schematic diagram of the distribution of the first and second flow channels in the device node shown in Figure 3;

[0053] Figure 5 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0054] Figure 6 is a schematic diagram of the structure of some other device nodes provided in the embodiments of this application;

[0055] Figure 7 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0056] Figure 8 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0057] Figure 9 is a schematic diagram of the structure of some more device nodes provided in the embodiments of this application;

[0058] Figure 10 is a schematic diagram of the distribution of the first flow channel, the second flow channel and the third flow channel in the device node shown in Figure 9;

[0059] Figure 11 is a schematic diagram of the structure of some more device nodes provided in the embodiments of this application;

[0060] Figure 12 is a schematic diagram of the distribution of the first and second flow channels in the device node shown in Figure 11;

[0061] Figure 13 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0062] Figure 14 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0063] Figure 15 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0064] Figure 16 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0065] Figure 17 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0066] Figure 18 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0067] Figure 19 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0068] Figure 20 is a schematic diagram of the structure of some other heat dissipation devices provided in the embodiments of this application;

[0069] Figure 21 is a structural schematic diagram of some liquid-cooled cabinets provided in the embodiments of this application;

[0070] Figure 22 is a schematic diagram of the structure of some other liquid-cooled cabinets provided in the embodiments of this application.

[0071] Reference numerals: 1-Equipment node; 10-Heat dissipation device; 100-Heat dissipation module; 110-Condenser; 120-Evaporator; 130-Compressor; 140-Expansion valve; 150-First pump; 200-First cold plate; 200A-Second cold plate; 200B-Third cold plate; 210 / 210A / 210B-First inlet; 220 / 220A / 220B-First outlet; 230 / 230A-First flow channel; 240 / 240A / 240B-Second inlet; 250 / 250A / 250B-Second outlet; 260 / 260B-Second flow channel; 270-Third inlet; 280-Third outlet; 290-Third flow channel; 300-Thermal interface material; 410-First device; 420-Second device; 500-Circuit board. Detailed Implementation

[0072] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0073] Hereinafter, the terms "first," "second," etc., are used only for descriptive purposes to distinguish identical or similar items with substantially the same function and effect, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the embodiments of this application, the term "connection" should be interpreted broadly; unless otherwise explicitly specified and limited, "connection" can be a direct connection or an indirect connection through an intermediate medium.

[0074] As the volume of computing data continues to grow, data centers are becoming increasingly complex and large-scale, posing new challenges to thermal management within them. Currently, the main methods for heat dissipation and cooling in data centers include air cooling and liquid cooling. Compared to air cooling, liquid cooling has advantages such as high heat dissipation efficiency, low noise, and low energy consumption, thus gradually becoming a key means of heat dissipation and cooling for data centers.

[0075] Figure 1 is a schematic diagram illustrating the architecture of a data center according to an embodiment of this application. Referring to Figure 1, the data center may include a liquid-cooled server room and a cooling system.

[0076] A liquid-cooled server room can house one or more liquid-cooled racks. A liquid-cooled rack is a physical entity that provides high-performance computing and cools the nodes within it using liquid cooling. For example, a liquid-cooled rack may include multiple nodes. A node can be an independent physical device, such as a server or processor. A node can also be a virtual node, such as a virtual machine running on a server.

[0077] The cooling system may include one or more cooling systems used to cool the liquid-cooled server racks. The cooling system may include heat exchangers and cooling towers. Heat exchangers transfer heat to the outside of the liquid-cooled server racks through forced convection of air, water, or other cooling media in the channels, effectively reducing the power usage effectiveness (PUE) of the data center. The cooling tower uses a liquid medium (such as water) as a circulating cooling medium to dissipate heat into the atmosphere to lower the water temperature. Furthermore, pumps may be installed between the liquid-cooled server racks and heat exchangers, and also between the radiators and the cooling tower.

[0078] During operation in a data center, liquid-cooled cabinets provide liquid cooling to the nodes inside, ensuring they maintain low temperatures. Specifically, referring to Figure 1, the high-temperature liquid in the liquid-cooled cabinet is transferred to a heat exchanger in the cooling system, and then to a cooling tower for further cooling. The low-temperature liquid generated by the cooling tower is then transferred to the heat exchanger, and then back to the liquid-cooled cabinet for further liquid cooling of the nodes inside. This cycle repeats continuously, achieving effective heat dissipation for the nodes within the liquid-cooled cabinet.

[0079] This application does not limit the number of server racks or the deployment method of the cooling system in the data center; adjustments can be made according to actual needs. For example, the data center may also include air-cooled server racks.

[0080] With the explosive growth in computing power demand, the market has set higher standards for data centers. High bandwidth memory (HBM) chips offer numerous advantages, including high capacity, high bandwidth, low power consumption, and small size, making them ideal for use as internal storage chips in data centers. They are particularly frequently used in artificial intelligence chips (AI chips) that require high computing power. Because HBM chips are formed through multi-layer stacking, they have stringent thermal management requirements. Furthermore, data centers typically require application-specific integrated circuits (ASICs) to accelerate computational tasks during model training, thereby improving training efficiency and accuracy.

[0081] HBM chips are typically placed around ASIC chips, but HBM chips and ASIC chips have different heat dissipation requirements, making effective thermal management in data centers difficult. Especially with the continuous growth in computing power demands, data centers need to incorporate more HBM chips, often using 2.5D or 3D packaging (compact packaging) to integrate HBM and ASIC chips; for example, multiple HBM chips can be placed around an ASIC chip to achieve integration between a single ASIC chip and an HBM chip. This exacerbates the difficulty of data center thermal management and can lead to a significant decrease in data center reliability and security. Furthermore, as data centers continue to evolve, they require HBM chips with larger capacities and wider bandwidths, necessitating further increases in the number of HBM chip stacking layers, further complicating data center thermal management.

[0082] Based on this, embodiments of this application propose a heat dissipation device, device node, liquid-cooled cabinet, and data center. The heat dissipation device is used to simultaneously dissipate heat from devices with different heat dissipation requirements. Furthermore, the cold plate assembly in the heat dissipation device is relatively small in size, which is beneficial for differentiated heat dissipation of different compactly packaged devices.

[0083] Figures 2 and 5 are schematic diagrams of the structure of some heat dissipation devices provided in the embodiments of this application; Figures 3 and 6 are schematic diagrams of the structure of some device nodes provided in the embodiments of this application; Figure 4 is a schematic diagram of the distribution of the first flow channel and the second flow channel in the device node shown in Figure 3.

[0084] This application provides a heat dissipation device 10 applied to device node 1. Referring to Figures 2 and 5, the heat dissipation device 10 includes: a cold plate assembly, a heat dissipation module 100, a first pipe, and a second pipe.

[0085] The cold plate assembly is provided with a first flow channel and a second flow channel. The first flow channel is used to dissipate heat from the first device 410 in device node 1, and the second flow channel is used to dissipate heat from the second device 420 in device node 1. The cold plate assembly can be a single cold plate as shown in FIG2 or multiple cold plates as shown in FIG4. The first device 410 may include an HBM chip, and the second device 420 may include an ASIC chip.

[0086] A heat dissipation module 100 is connected to a first flow channel and is configured to supply a first cooling medium to the first flow channel; the first cooling medium includes water or a non-aqueous refrigerant, etc.

[0087] The first pipe and the second pipe are connected to the second flow channel to input a second cooling medium into the second flow channel through the first pipe and to receive the second cooling medium output from the second flow channel through the second pipe; the second cooling medium can be water or a non-aqueous liquid with heat dissipation effect.

[0088] The temperature at which the first cooling medium enters the first flow channel is the first temperature, and the temperature at which the second cooling medium enters the second flow channel is the second temperature. The first temperature and the second temperature are not equal. For example, the first temperature of the first cooling medium is lower than the second temperature of the second cooling medium. Using the lower-temperature first cooling medium can dissipate heat for devices with higher heat dissipation requirements, while using the higher-temperature second cooling medium can dissipate heat for devices with lower heat dissipation requirements.

[0089] The first cooling medium supplied by the heat dissipation module 100 flows in the first channel, and the circulation of the first cooling medium in the first channel carries away the heat of the first device 410. The second cooling medium output from the first pipe enters the second channel, and the circulation of the second cooling medium in the second channel carries away the heat of the second device 420. Since the first temperature and the second temperature are not equal, for example, the first temperature is lower than the second temperature, the thermal sensitivity of the first device 410 is higher than that of the second device 420, that is, the heat dissipation requirement of the first device 410 is higher than that of the second device 420. The first cooling medium with a lower temperature dissipates heat from the more thermally sensitive first device 410, and the second cooling medium with a higher temperature dissipates heat from the less thermally sensitive second device 420. In this way, the heat dissipation device 10 of this embodiment can simultaneously achieve heat dissipation for devices with different heat dissipation requirements, that is, it can simultaneously perform differentiated heat dissipation for the first device 410 and the second device 420.

[0090] Furthermore, referring to Figure 3, both the first and second cooling channels are located within the cold plate assembly. The cold plate assembly occupies a small space, which is beneficial for heat dissipation of compactly packaged devices. For example, different devices in a compact package may include a first device 410 and a second device 420 using 2.5D or 3D packaging. The first device 410 can be an HBM chip, and the second device 420 can be an ASIC chip, with multiple HBM chips surrounding a single ASIC chip. By setting the positions of the first and second cooling channels in the cold plate assembly, the lower-temperature first cooling medium in the first channel can dissipate heat for multiple HBM chips, while the higher-temperature second cooling medium in the second channel can dissipate heat for a single ASIC chip. This simultaneously achieves heat dissipation for both multiple HBM chips and a single ASIC chip. Moreover, the small size of the cold plate assembly effectively mitigates the potential problem of insufficient heat dissipation for both multiple HBM chips and a single ASIC chip due to its large size.

[0091] When the aforementioned heat dissipation device 10 is used in device node 1, referring to Figures 3 and 6, device node 1 includes: a first device 410, a second device 420, and the heat dissipation device 10 in the above embodiment; the first device 410 and the second device 420 are disposed on one side of the cold plate assembly of the heat dissipation device 10; the thermal sensitivity of the first device 410 is greater than that of the second device 420, that is, the heat dissipation requirement of the first device 410 is higher than that of the second device 420; the first cooling medium in the first flow channel can be used to mainly dissipate heat from the first device 410, and the second cooling medium in the second flow channel can be used to dissipate heat from the second device 420. By using the lower-temperature first cooling medium to dissipate heat from the higher-temperature first device 410, and using the higher-temperature second cooling medium to dissipate heat from the lower-temperature second device 420, the heat dissipation device 10 can simultaneously achieve heat dissipation for devices with different heat dissipation requirements in device node 1, that is, it can simultaneously perform differentiated heat dissipation for the first device 410 and the second device 420.

[0092] In the embodiments of this application, the first temperature of the first cooling medium may be lower than the second temperature of the second cooling medium. However, the fact that the first temperature is lower than the second temperature does not mean that the temperature of the first cooling medium in the first pipe is always lower than the temperature of the second cooling medium in the second pipe. It is possible that the temperature of the first cooling medium about to exit the first pipe is slightly higher than the second temperature, or it is possible that the temperature of the first cooling medium about to exit the first pipe is still lower than the second temperature. This application does not impose any limitations on this.

[0093] In other embodiments, the cold plate assembly includes a single cold plate, and the single cold plate has only one flow channel. Thus, the first device 410 and the second device 420 need to be cooled by the same cooling medium, making it difficult to achieve differentiated heat dissipation for the first device 410 and the second device 420.

[0094] Figure 4 is a top-view diagram showing the positional relationship between the first device 410, the second device 420, and the cold plate assembly. The first flow channel 230 and the second flow channel 260 shown in Figure 4(1) and Figure 4(2) do not intersect. Taking the cold plate assembly as a single rectangular plate as an example, the first flow channel 230 and the second flow channel 260 can be positioned on different thicknesses of the rectangular plate to achieve non-intersection of the first flow channel 230 and the second flow channel 260. Figure 4 only shows one feasible solution for setting the first flow channel 230 and the second flow channel 260 and does not limit the specific position or number of the first flow channel 230 and the second flow channel 260 in the cold plate assembly.

[0095] In the accompanying drawings of this application, the dashed lines in the first cold plate 200, the second cold plate 200A, and the third cold plate 200B do not represent the location of the flow channels. The dashed lines are only used to more clearly show the first inlet 210 and the first outlet 220 of the first flow channel 230, the second inlet 240 and the second outlet 250 of the second flow channel 260, and the third inlet 270 and the third outlet 280 of the third flow channel 290.

[0096] In some embodiments, referring to Figures 3 and 6, the device node 1 includes thermal interface materials (TIMs) 300, which are disposed between the first device 410 and the cold plate assembly, and between the second device 420 and the cold plate assembly. Since air gaps inevitably exist between the first device 410, the second device 420, and the cold plate assembly, and air has a very low thermal conductivity, it severely hinders heat transfer. The embodiments of this application, by providing thermal interface materials 300, can effectively fill these air gaps, reduce the contact thermal resistance between the first device 410, the second device 420, and the cold plate assembly, and improve the heat dissipation efficiency of the first device 410 and the second device 420. The embodiments of this application do not limit the specific type of thermal interface material 300; it can be freely selected according to actual conditions.

[0097] Figures 7 and 8 are schematic diagrams of different structures of the heat dissipation device provided in the embodiments of this application. Figure 9 is a schematic diagram of the structure of some device nodes provided in the embodiments of this application. Figure 10 is a schematic diagram of the distribution of the first flow channel, the second flow channel, and the third flow channel in the heat dissipation device shown in Figure 9. In the device nodes corresponding to Figures 7 and 8, the positions of the first device and the second device can be referred to Figures 3 and 4.

[0098] The following explanations are provided for the first inlet 210 and the first outlet 220 of the first flow channel in the cold plate assembly, as well as the second inlet 240 and the second outlet 250 of the second flow channel. The following explanations are for illustrative purposes only and do not constitute a limitation on the first inlet 210, the first outlet 220, the second inlet 240, and the second outlet 250.

[0099] In some examples, referring to Figure 7, the first flow channel has a first inlet 210 and a first outlet 220; the heat dissipation module 100 is connected to the first inlet 210 and the first outlet 220 respectively; the second flow channel has a second inlet 240 and a second outlet 250, the second inlet 240 being connected to the first pipe and the second outlet 250 being connected to the second pipe. The connection between the second outlet 250 and the second pipe can be a direct connection, or as shown in Figure 7, the second pipe and the second outlet 250 can be connected through the condenser 110.

[0100] The first cooling medium supplied by the heat dissipation module 100 enters the first flow channel through the first inlet 210. After absorbing heat from the first device 410, the first cooling medium exits the first flow channel through the first outlet 220 and then returns to the heat dissipation module 100. The second cooling medium, which exits through the first pipe, can enter the second flow channel through the second inlet 240. After absorbing heat from the second device 420, the second cooling medium exits to the second pipe through the second outlet 250. Thus, the circulation of the first cooling medium in the first flow channel and the circulation of the second cooling medium in the second flow channel can be realized, thereby achieving effective heat dissipation for the first device 410 and the second device 420.

[0101] In other examples, referring to Figure 8, the first outlet 220 and the second outlet 250 are the same outlet. In other words, the first flow channel and the second flow channel share the same outlet. Thus, the first cooling medium in the first flow channel and the second cooling medium in the second flow channel are centrally output through the same outlet, which reduces the number of outlets on the cold plate assembly, simplifies the structure of the cold plate assembly, facilitates centralized and effective treatment of the first cooling medium in the first flow channel and the second cooling medium in the second flow channel, and reduces the manufacturing cost of the cold plate assembly.

[0102] In some other examples, referring to Figures 9 and 10, a third flow channel 290 can also be provided in the cold plate assembly. The third flow channel 290 has a third inlet 270 and a third outlet 280. The first cooling medium supplied by the heat dissipation module 100 enters the third flow channel 290 through the third inlet 270. After absorbing the heat of the first device 410, the first cooling medium exits the third flow channel 290 through the third outlet 280 and then returns to the heat dissipation module 100. In this way, the third flow channel 290 can be used to dissipate heat from the first device 410. Of course, the cold plate assembly can also be provided with more flow channels to dissipate heat from the first device 410 (a device with high heat dissipation requirements), or to dissipate heat from the second device 420 (a device with low heat dissipation requirements). The configuration method can be referred to Figure 10, and will not be described in detail here.

[0103] Referring to Figure 10(1) and Figure 10(2), multiple first devices 410 (such as HBM chips) surround a single second device 420 (such as an ASIC chip). By setting a portion of the first devices 410 close to the first flow channel 230 and far from the second flow channel 260, and another portion of the first devices 410 close to the third flow channel 290 and far from the second flow channel 260, precise heat dissipation and cooling of the multiple first devices 410 can be achieved. By setting a single second device 420 close to the second flow channel 260 and far from the first flow channel 230 and the third flow channel 290, precise heat dissipation and cooling of the single second device 420 can be achieved. Due to the small size of the cold plate assembly, differentiated heat dissipation of different devices in a compact package can be achieved.

[0104] Figure 11 is a structural schematic diagram of some device nodes provided in the embodiments of this application; Figure 12 is a schematic diagram of the distribution of the first flow channel and the second flow channel in the heat dissipation device shown in Figure 10. Figure 13 is a structural schematic diagram of some heat dissipation devices provided in the embodiments of this application; in the device nodes corresponding to Figure 13, the positions of the first device and the second device can be referred to Figure 6.

[0105] In some examples, the cold plate assembly in the heat dissipation device 10 includes only a single cold plate. For example, the cold plate assembly includes only the first cold plate 200 as shown in Figures 2 and 3. The first cold plate 200 is provided with a first flow channel and a second flow channel. The first cooling medium in the first flow channel dissipates heat from the first device 410, and the second cooling medium in the second flow channel dissipates heat from the second device 420. In other words, this solution simultaneously provides a first flow channel for cooling the first device 410 and a second flow channel for cooling the second device 420 on the first cold plate 200.

[0106] A first flow channel and a second flow channel are provided on the first cold plate 200. The first cooling medium in the first flow channel can realize the heat dissipation and cooling of the first device 410, and the second cooling medium in the second flow channel can realize the heat dissipation and cooling of the second device 420. In addition, since the first flow channel and the second flow channel are integrated on the first cold plate 200, the space occupied by the first cold plate 200 can be reduced, which is conducive to differentiated heat dissipation of different devices in compact packages and increases the application scenarios of the first cold plate 200.

[0107] In other examples, the cold plate assembly in the heat dissipation device 10 may also include multiple cold plates. For example, the cold plate assembly may include a second cold plate 200A and a third cold plate 200B as shown in FIG. 5. The second cold plate 200A is provided with a first flow channel (not shown in the figure), which includes a first inlet 210A and a first outlet 220A. The third cold plate 200B is provided with a second flow channel (not shown in the figure), which includes a second inlet 240B and a second outlet 250B. The first cooling medium in the first flow channel dissipates heat from the first device 410, and the second cooling medium in the second flow channel dissipates heat from the second device 420. In other words, this solution provides a first flow channel for cooling the first device 410 on the second cold plate 200A and a second flow channel for cooling the second device 420 on the third cold plate 200B.

[0108] A first flow channel is provided on the second cold plate 200A, and a second flow channel is provided on the third cold plate 200B. The first device 410 can be cooled by the first cooling medium in the first flow channel on the second cold plate 200A, and the second device 420 can be cooled by the second cooling medium in the second flow channel on the third cold plate 200B.

[0109] In some other examples, the cold plate assembly in the heat dissipation device 10 may also include multiple cold plates. For example, the cold plate assembly may include a second cold plate 200A and a third cold plate 200B as shown in Figures 11, 12 and 13. The second cold plate 200A is provided with a first flow channel 230A, which includes a first inlet 210A and a first outlet 220A. The third cold plate 200B is provided with a second flow channel 260B, which includes a second inlet 240B and a second outlet 250B. The first cooling medium in the first flow channel 230A dissipates heat from the first device 410, and the second cooling medium in the second flow channel 260B dissipates heat from the second device 420. Referring to (1) and (2) in Figure 12, the central region of the second cold plate 200A may be enclosed to form a cavity, and the third cold plate 200B may be disposed within this cavity. In other words, this solution involves setting a flow channel for cooling the first device 410 on the second cold plate 200A and a flow channel for cooling the second device 420 on the third cold plate 200B, with the second cold plate 200A surrounding the periphery of the third cold plate 200B.

[0110] In this way, by surrounding the third cold plate 200B with the second cold plate 200A, the space occupied by the second cold plate 200A and the third cold plate 200B can be reduced, which is beneficial to heat dissipation of different devices in a compact package.

[0111] Figure 12 only shows one feasible scheme for the first flow channel 230A in the second cold plate 200A and the second flow channel 260B in the third cold plate 200B, and does not limit the specific location of the first flow channel 230A and the second flow channel 260B.

[0112] In some other examples, the cold plate assembly in the heat dissipation device 10 may also include multiple cold plates. For example, the cold plate assembly may include a second cold plate 200A and a third cold plate 200B as shown in FIG. 13. The second cold plate 200A is provided with a first flow channel and a second flow channel, and the third cold plate 200B is provided with a first flow channel and a second flow channel. The first flow channel in the second cold plate 200A includes a first inlet 210A and a first outlet 220A, and the second flow channel in the second cold plate 200A includes a second inlet 240A and a second outlet 250A. The first flow channel in the third cold plate 200B includes a first inlet 210B and a first outlet 220B, and the second flow channel in the third cold plate 200B includes a second inlet 240B and a second outlet 250B. The first cooling medium in the first flow channel of the second cold plate 200A and the first cooling medium in the first flow channel of the third cold plate 200B can dissipate heat from the first device 410. The second cooling medium in the second flow channel of the second cold plate 200A and the second cooling medium in the second flow channel of the third cold plate 200B can dissipate heat from the second device 420.

[0113] The following explains the component composition of the heat dissipation module 100. The following embodiments are only examples and do not constitute a limitation on the component composition of the heat dissipation module 100.

[0114] In some embodiments, referring to Figures 2 to 13, the heat dissipation module 100 can be a device corresponding to a compression refrigeration system. This device has a large coefficient of performance (COP) for heat dissipation, which can achieve heat dissipation of the first device 410 with lower energy consumption, thereby reducing the cost of heat dissipation of the first device 410.

[0115] In some examples, referring to Figure 7, the heat dissipation module 100 includes a condenser 110 and a compressor 130 connected to each other; the condenser 110 is connected to a first inlet 210, and the compressor 130 is connected to a first outlet 220. The condenser 110, compressor 130, and first flow channel can form an internal loop, in which the refrigerant, as the first cooling medium, circulates repeatedly to dissipate heat from the first device 410. The refrigerant may include water or other common refrigerants with cooling effects.

[0116] The refrigerant output from the condenser 110 enters the first flow channel through the first inlet 210. The refrigerant in the first flow channel dissipates heat from the first device 410. During the heat dissipation process of the first device 410, the temperature of the refrigerant rises. The heated refrigerant is then returned to the condenser 110 through the compressor 130. This cycle repeats, achieving heat dissipation for the first device 410. Furthermore, since the compressor 130 can compress and deliver the refrigerant, there is no need for an additional pump to deliver the refrigerant, which simplifies the component composition of the heat dissipation module 100 and reduces its cost.

[0117] In some possible implementations, referring to FIG7, an expansion valve 140 may be provided between the condenser 110 and the first flow channel. The expansion valve 140 can throttle and reduce the pressure of the first cooling medium, regulate the flow rate of the first cooling medium, and mitigate the potential risk of liquid slugging caused by the first cooling medium entering the compressor 130.

[0118] In other examples, referring to Figures 2, 5, and 9, the heat dissipation module 100 includes a condenser 110, an evaporator 120, and a compressor 130 connected in sequence; the evaporator 120 is connected to a first inlet 210 and a first outlet 220. In some possible embodiments, referring to Figure 2, an expansion valve 140 may be provided between the condenser 110 and the evaporator 120.

[0119] The condenser 110, compressor 130, and evaporator 120 form a refrigeration internal cycle, in which the refrigerant is transported. The main function of the condenser 110 is to cool and condense the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 130 into liquid refrigerant through heat exchange. In this process, the refrigerant releases heat to the surrounding air or water, thereby lowering its own temperature and pressure. The main function of the compressor 130 is to draw in the low-temperature, low-pressure gaseous refrigerant from the evaporator 120 and compress it into a high-temperature, high-pressure gaseous refrigerant. The main function of the evaporator 120 is to absorb heat from the liquid refrigerant exiting the condenser 110, causing the low-pressure liquid refrigerant to evaporate into gaseous refrigerant. This process requires absorbing heat from the surrounding environment, specifically from the first cooling medium, to ensure that the first cooling medium output from the evaporator 120 has a lower temperature. In addition, the main function of the expansion valve 140 is to reduce the pressure of the high-pressure liquid refrigerant, so that it becomes a low-pressure liquid refrigerant through throttling. During this process, the temperature of the refrigerant will be further reduced, in preparation for subsequent evaporation and heat absorption in the evaporator 120.

[0120] The evaporator 120 and the first flow channel can form an internal loop, in which the substance transported is the first cooling medium. The first cooling medium output from the evaporator 120 enters the first flow channel through the first inlet 210, and the first cooling medium in the first flow channel exits the first flow channel through the first outlet 220. The first cooling medium exiting the first flow channel will then enter the evaporator 120 again, where it will lower the temperature of the first cooling medium. Finally, the cooled first cooling medium will be returned to the first flow channel. This cycle repeats to achieve heat dissipation for the first device 410.

[0121] In some embodiments, referring to FIG2, the first pipe, the second flow channel, the condenser 110, and the second pipe are connected in sequence. In this embodiment, the coolant output from the first pipe is directly input into the second flow channel as the second cooling medium. The descriptions of FIG5, 7, 9, 11, and 13 can be referred to FIG2.

[0122] The cool liquid output from the first pipe is directly input into the second flow channel as the second cooling medium. The second cooling medium in the second flow channel is output from the second flow channel through the second outlet 250. The second cooling medium output from the second flow channel is then input into the condenser 110. The high-temperature liquid output from the first condenser 110 enters the second pipe.

[0123] In other embodiments, the first pipe, condenser 110, second flow channel, and second pipe are connected in sequence. In this scheme, the cold liquid output from the first pipe will be slightly heated after passing through the condenser 110, and the condenser 110 will be slightly cooled. The slightly heated liquid is then input into the second flow channel as the second cooling medium.

[0124] The refrigerant output from the first pipe first enters the condenser 110. The refrigerant experiences a slight temperature increase in the environment of the condenser 110, while the condenser 110 experiences a slight temperature decrease. The heated refrigerant is then used as a second cooling medium and input into the second flow channel. Finally, the second cooling medium in the second flow channel is transported to the second pipe. In this way, the refrigerant absorbs the heat dissipated by the condenser 110, lowering the temperature of the condenser 110 and promoting the condenser 110 to cool and condense the high-temperature, high-pressure gaseous refrigerant into liquid refrigerant through heat exchange, thereby improving the coefficient of performance (COP) of the heat dissipation module 100.

[0125] In some other examples, referring to FIG8, the heat dissipation module 100 includes a condenser 110, an evaporator 120 and a compressor 130 connected to each other; the evaporator 120 is connected to a first inlet 210 and the condenser 110 is connected to a first outlet 220.

[0126] The first cooling medium output from the evaporator 120 is input into the first flow channel through the first inlet 210. The first cooling medium in the first flow channel dissipates heat to the first device 410. During the heat dissipation process of the first device 410, the temperature of the first cooling medium will rise. The heated first cooling medium is input into the condenser 110. The condenser 110 may dissipate heat to the first cooling medium, causing the temperature of the first cooling medium to increase further.

[0127] In some embodiments, referring to FIG8, the first pipe, evaporator 120, first flow channel, condenser 110, and second pipe are connected, and the first pipe, second flow channel, condenser 110, and second pipe are also connected. In this scheme, the coolant output through the first pipe can be directly used as the second cooling medium and input into the second flow channel, or it can be used as the first cooling medium and input into the first flow channel after being cooled by the evaporator 120.

[0128] On one hand, the coolant output from the first pipe is directly input into the second flow channel as the second cooling medium to dissipate heat from the second device 420. On the other hand, the coolant output from the first pipe is first input into the evaporator 120 for cooling, and then the cooled coolant is input into the first flow channel as the first cooling medium to dissipate heat from the first device 410. In this way, the temperature of the first cooling medium can be kept lower than that of the second cooling medium, and both the first and second cooling media can be supplied simultaneously through the first pipe, which can reduce the load on the heat dissipation module 100.

[0129] The embodiments of this application do not limit the number of condensers 110, compressors 130, evaporators 120 and expansion valves 140. For example, the heat dissipation module 100 may include multiple compressors 130, and some compressors 130 may serve as redundant backups.

[0130] In some embodiments, the heat dissipation device 10 further includes a first pump 150, which is disposed between the heat dissipation module 100 and the first flow channel. Taking the heat dissipation device 10 shown in FIG2 as an example, since the evaporator 120 of the heat dissipation module 100 and the first flow channel form an internal circulation, by providing the first pump 150, the first cooling medium can be transported in the internal circulation.

[0131] For example, the first pump 150 can be located between the evaporator 120 and the first inlet 210 of the first flow channel, or it can be located between the evaporator 120 and the first outlet 220 of the first flow channel. Furthermore, the number of first pumps 150 in the heat dissipation device 10 is not particularly limited; there can be one or more.

[0132] In the heat dissipation device 10 shown in Figure 7, the first pump 150 can be omitted because: in the heat dissipation device 10 shown in Figure 5, the condenser 110, the compressor 130 and the first flow channel can form an internal circulation. The compressor 130 can compress and deliver the refrigerant, so there is no need to set up an additional first pump 150 to deliver the refrigerant. In this way, the component composition of the heat dissipation module 100 can be simplified and the cost of the heat dissipation module 100 can be reduced.

[0133] In the heat dissipation device 10 shown in Figure 8, the first pump 150 may not be required. This is because there is no internal circulation between the heat dissipation module 100 and the first flow channel. The second cooling medium output through the first pipe has a certain pressure, therefore, there is no need to additionally install the first pump 150 to deliver the refrigerant. This simplifies the component composition of the heat dissipation module 100 and reduces its cost. Of course, the heat dissipation device 10 shown in Figures 5 and 6 may also include a first pump 150 to deliver the first cooling medium.

[0134] Figures 14 to 18 are schematic diagrams of other heat dissipation devices provided in the embodiments of this application. The positions of the first and second devices in the device nodes corresponding to Figures 14, 16, 17, and 18 can be referred to Figure 2, and the positions of the first and second devices in the device node corresponding to Figure 15 can be referred to Figure 4.

[0135] The following explains some other specific configurations of the heat dissipation module 100. The following embodiments are only examples and do not constitute a limitation on the heat dissipation module 100.

[0136] In some embodiments, referring to FIG14, the heat dissipation module 100 includes a thermoelectric cooling device, which has a cold end module, a thermoelectric module, and a hot end module. The two sides of the thermoelectric module are respectively connected to the cold end module and the hot end module. In this way, heat dissipation of the first device 410 can be achieved with a relatively small thermoelectric cooling device, which can realize the miniaturization of the heat dissipation device 10. It can alleviate the potential problem that the heat dissipation device 10 is not suitable for compactly packaged devices due to its large size, and is conducive to broadening the application scenarios of the heat dissipation device 10.

[0137] Thermoelectric cooling devices, also known as thermoelectric coolers (TECs), are heat dissipation devices made using the Peltier effect. This means that when a direct current passes through a thermocouple composed of two different conductors, one end absorbs heat, and the other end releases heat. In this embodiment, the end that absorbs heat is called the cold end module, the end that releases heat is called the hot end module, and the area connecting the cold end module and the hot end module is called the thermoelectric module.

[0138] In some examples, referring to Figures 14, 15, 17, and 18, the cold end module and the first flow channel in the thermoelectric refrigeration device are connected.

[0139] The first cooling medium output from the cold-end module enters the first flow channel through the first inlet 210, and the first cooling medium in the first flow channel exits the first flow channel through the first outlet 220. The first cooling medium exiting the first flow channel is then input back into the cold-end module for cooling. This cycle repeats to achieve heat dissipation for the first device 410. In addition, because the thermoelectric cooling device is relatively small, it is easy to miniaturize the heat dissipation device 10. This can alleviate the potential problem of the heat dissipation device 10 being too large to effectively dissipate heat from compactly packaged devices, and is beneficial to broadening the application scenarios of the heat dissipation device 10.

[0140] In some embodiments, referring to Figures 14, 15, and 17, the first pipe, the second flow channel, the hot end module, and the second pipe are connected in sequence.

[0141] The second cooling medium output from the first pipe enters the second flow channel to dissipate heat from the second device 420. The second cooling medium output from the second flow channel enters the hot end module. The high-temperature liquid output from the hot end module is delivered to the second pipe, thereby achieving heat dissipation of the second device 420.

[0142] In other embodiments, referring to Figure 18, the first pipe, the hot-end module, the second flow channel, and the second pipe are connected in sequence. In this scheme, the cold liquid output from the first pipe will be slightly heated after passing through the hot-end module, and then slightly cooled by the hot-end module. The slightly heated liquid is then input into the second flow channel as the second cooling medium.

[0143] The coolant output from the first pipe is first introduced into the hot-end module. The coolant, being in the environment of the hot-end module, will slightly increase in temperature, while the hot-end module will slightly decrease in temperature. The heated coolant is then used as a second cooling medium and introduced into the second flow channel. Finally, the second cooling medium in the second flow channel is transported to the second pipe. In this way, the coolant absorbs the heat dissipated from the hot-end module, reducing its temperature and the temperature difference between the hot-end and cold-end modules, thereby improving the performance coefficient of the heat dissipation module 100.

[0144] In other examples, referring to Figure 16, the first outlet 220 of the first flow channel and the second outlet 250 of the second flow channel share the same outlet. The first inlet 210 of the first flow channel and the shared outlet are connected to the cold end module. The first pipe, the second inlet 240, the shared outlet, the hot end module, and the second pipe are connected. In this scheme, the first cooling medium output from the first flow channel can be cooled by both the cold end module and the second heat dissipation module.

[0145] In some embodiments, the heat dissipation device 10 further includes a second pump disposed between the first pipe or the second pipe, the second pump being able to provide power for the delivery of the second cooling medium.

[0146] In some embodiments, referring to FIG19, the heat dissipation device 10 may further include multiple cold plate assemblies, multiple heat dissipation modules 100, a single first pipe, and a single second pipe. Each heat dissipation module 100 is respectively connected to each first flow channel in each cold plate assembly, and the heat dissipation module 100 is configured to supply a first cooling medium to the first flow channel respectively. The first pipe, the second pipe, and the second flow channels in the multiple cold plate assemblies are connected to input a second cooling medium to the multiple second flow channels through the first pipe respectively, and to receive the second cooling medium output from the multiple second flow channels through the second pipe. The connection method of different components has been explained in detail in the above embodiments and will not be repeated here. In this way, differentiated heat dissipation can be performed on multiple first devices 410 and multiple second devices 420 simultaneously.

[0147] In other embodiments, referring to FIG20, the heat dissipation device 10 may include a plurality of cold plate assemblies, a heat dissipation module 100, a first pipe, and a second pipe. The heat dissipation module 100 is respectively connected to a plurality of first flow channels in the plurality of cold plate assemblies, and is configured to supply a first cooling medium to the plurality of first flow channels respectively. The first pipe, the second pipe, and the second flow channels in the plurality of cold plate assemblies are connected to input a second cooling medium into the plurality of second flow channels through the first pipe, and to receive the second cooling medium output from the plurality of second flow channels through the second pipe.

[0148] The heat dissipation module 100 supplies a first cooling medium to multiple first channels, inputs a second cooling medium to multiple second channels through a first pipe, and receives the second cooling medium output from multiple second channels through a second pipe, thus simultaneously dissipating heat for multiple first devices 410 and multiple second devices 420.

[0149] In the embodiments of this application, the connection between different components can be achieved through pipes. For example, the heat dissipation module 100 can supply a first cooling medium to the first flow channel through a pipe. The specific parameters such as the size and material of the pipe can be selected according to the actual situation, and this application embodiment does not limit this. In addition, the specific parameters such as the size and material of the first pipe and the second pipe can also be selected according to the actual situation.

[0150] This application provides a device node 1. Referring to Figures 3 and 6, device node 1 further includes a first device 410, a second device 420, and the aforementioned heat dissipation device 10. The first device 410 and the second device 420 are disposed on one side of the cold plate assembly of the heat dissipation device 10. The thermal sensitivity of the first device 410 is greater than that of the second device 420, meaning that the heat dissipation requirement of the first device 410 is higher than that of the second device 420. The projection of the first device 410 on the cold plate assembly overlaps with the first flow channel of the cold plate assembly, and the projection of the second device 420 on the cold plate assembly overlaps with the second flow channel of the cold plate assembly. That is, the first cooling medium in the first flow channel mainly dissipates heat from the first device 410, and the second cooling medium in the second flow channel mainly dissipates heat from the second device 420. The beneficial effects of this device node 1 have been described in detail in the above embodiments and will not be repeated here.

[0151] In some embodiments, the device node 1 may further include: a circuit board 500, which is disposed on the side of the first device 410 and the second device 420 away from the cold plate assembly. The circuit board 500 can provide support for the first device 410 and the second device 420, and can interconnect the first device 410 and the second device 420, or interconnect the first device 410 and the second device 420 with other electronic components.

[0152] Figure 21 is a schematic diagram of the structure of some liquid-cooled cabinets provided in the embodiments of this application.

[0153] This application provides a liquid-cooled cabinet. Referring to FIG21, the liquid-cooled cabinet includes a liquid-cooled distribution unit and the aforementioned device node 1. The liquid-cooled distribution unit is configured to input a second cooling medium into a second flow channel through a first pipe and to receive the second cooling medium output through the second pipe.

[0154] Liquid-cooled cabinets typically include a cooling distribution unit (CDU), which regulates the cooling capacity, chilled water temperature, and flow rate of the cabinet. Using a CDU within the cabinet to input the second cooling medium into the second flow channel via a first pipe and to receive the second cooling medium output via the second pipe facilitates compatibility with conventional liquid cooling distribution units' inlets, outlets, and pipes. This reduces the time and cost of modifying the liquid-cooled cabinet to accommodate the heat dissipation device 10, and promotes the large-scale use of the liquid-cooled cabinet provided in this embodiment. Furthermore, this liquid-cooled cabinet also possesses the beneficial effects of the heat dissipation device 10 described in the above embodiments, which will not be elaborated further here.

[0155] In some embodiments, referring to FIG21, the liquid-cooled cabinet may further include a cabinet body, and the liquid-cooled distribution unit and equipment node 1 may be disposed in the cabinet body.

[0156] In some embodiments, referring to FIG. 21, the liquid-cooled cabinet further includes a manifold, through which the liquid-cooled distribution unit and the second flow channel are connected. The manifold enables precise distribution of the coolant output by the liquid-cooled distribution unit. For example, referring to FIG. 21, when the heat dissipation device 10 has multiple cold plate assemblies, the manifold can accurately distribute the coolant output by the liquid-cooled distribution unit as a second cooling medium to the second flow channel in each cold plate assembly.

[0157] In some embodiments, referring to FIG21, the liquid-cooled cabinet may include multiple device nodes 1, each of which is provided with a cold plate assembly, a first device 410, a second device 420, and a heat dissipation module 100. The liquid-cooled cabinet shown in FIG21 has only two device nodes 1, but the liquid-cooled cabinet may also have more device nodes 1, and the arrangement method is shown in FIG21.

[0158] Equipment node 1 in a liquid-cooled cabinet typically has a liquid cooling inlet and a liquid cooling outlet. The cold plate assembly of the heat dissipation device 10, the first device 410, the second device 420, and the heat dissipation module 100 are all housed within equipment node 1. The liquid cooling distribution unit and the second flow channel can be connected through the existing liquid cooling inlet and outlet on equipment node 1. This further reduces the time and cost of modifying the liquid-cooled cabinet due to the installation of the heat dissipation device 10, and also facilitates the large-scale use of the liquid-cooled cabinet provided in this embodiment.

[0159] Figure 22 is a schematic diagram of the structure of some other liquid-cooled cabinets provided in the embodiments of this application.

[0160] This application provides another liquid-cooled cabinet. Referring to FIG22, the liquid-cooled cabinet includes a first device 410, a second device 420, a liquid-cooled distribution unit, and a device node 1 in the heat dissipation device 10 described above. The first device 410, the second device 420, and the cold plate assembly in the heat dissipation device 10 are located within the device node 1. The first device 410 and the second device 420 are disposed on one side of the cold plate assembly. The thermal sensitivity of the first device 410 is greater than that of the second device 420. The projection of the first device 410 on the cold plate assembly overlaps with the first flow channel of the cold plate assembly, and the projection of the second device 420 on the cold plate assembly overlaps with the second flow channel of the cold plate assembly. In other words, the main difference between the liquid-cooled cabinet shown in FIG22 and the liquid-cooled cabinet shown in FIG21 is that in the liquid-cooled cabinet shown in FIG22, the cold plate assembly is located within the device node 1, and the heat dissipation module 100 is located outside the device node 1, while in the liquid-cooled cabinet shown in FIG21, both the cold plate assembly and the heat dissipation module 100 are located within the device node 1.

[0161] In the liquid-cooled cabinet, the heat dissipation device 10 is located outside the equipment node 1, and the cold plate assembly is located inside the equipment node 1. When multiple heat dissipation devices 10 are provided in the liquid-cooled cabinet, the heat dissipation module 100 can supply a first cooling medium to multiple first channels in multiple cold plate assemblies, and the liquid-cooled distribution unit can supply a second cooling medium to multiple second channels in multiple cold plate assemblies, so as to achieve heat dissipation of multiple first devices 410 and second devices 420.

[0162] The liquid-cooled cabinet shown in Figure 22 may also include components corresponding to the liquid-cooled cabinet shown in Figure 21, such as the cabinet body and distribution pipes. In addition, Figures 21 and 22 only show some components of the liquid-cooled cabinet, and the liquid-cooled cabinet may also include other components. This application embodiment does not limit this.

[0163] This application provides a data center that includes the liquid-cooled cabinet described above. This data center possesses the beneficial effects of the liquid-cooled cabinet described in the above embodiments, which will not be elaborated further here.

[0164] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of this application as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from the spirit and scope of this application. Thus, if such modifications and modifications of this application fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and modifications.

Claims

1. A heat dissipation device, characterized in that, Applied to device nodes, including: The cold plate assembly is provided with a first flow channel and a second flow channel. The first flow channel is used to dissipate heat from a first device in the device node, and the second flow channel is used to dissipate heat from a second device in the device node. A heat dissipation module, connected to the first flow channel, is configured to supply a first cooling medium to the first flow channel; A first pipe and a second pipe are connected to a second flow channel to input a second cooling medium into the second flow channel through the first pipe and to receive the second cooling medium output from the second flow channel through the second pipe. Wherein, the temperature at which the first cooling medium enters the first flow channel is the first temperature, and the temperature at which the second cooling medium enters the second flow channel is the second temperature, and the first temperature and the second temperature are not equal.

2. The heat dissipation device according to claim 1, characterized in that, The first flow channel has a first inlet and a first outlet; the heat dissipation module is connected to the first inlet and the first outlet respectively; The second flow channel has a second inlet and a second outlet, the second inlet being connected to the first pipe and the second outlet being connected to the second pipe.

3. The heat dissipation device according to claim 2, characterized in that, The first outlet and the second outlet are the same outlet.

4. The heat dissipation device according to claim 2, characterized in that, The heat dissipation module includes a condenser and a compressor that are interconnected; the condenser is connected to the first inlet, and the compressor is connected to the first outlet.

5. The heat dissipation device according to claim 2, characterized in that, The heat dissipation module includes a condenser, a compressor, and an evaporator connected in sequence; the evaporator is connected to the first inlet and the first outlet respectively.

6. The heat dissipation device according to claim 4 or 5, characterized in that, The first pipe, the second flow channel, the condenser, and the second pipe are connected in sequence.

7. The heat dissipation device according to claim 4 or 5, characterized in that, The first pipe, the condenser, the second flow channel, and the second pipe are connected in sequence.

8. The heat dissipation device according to claim 3, characterized in that, The heat dissipation module includes a condenser, a compressor, and an evaporator connected in sequence; the evaporator is connected to the first inlet, and the condenser is connected to the first outlet.

9. The heat dissipation device according to claim 8, characterized in that, The first pipe, the evaporator, the first flow channel, the condenser and the second pipe are connected, and the first pipe, the second flow channel, the condenser and the second pipe are also connected.

10. The heat dissipation device according to claim 2, characterized in that, The heat dissipation module includes a thermoelectric cooling device, which has a cold end module, a thermoelectric module, and a hot end module. The two sides of the thermoelectric module are respectively connected to the cold end module and the hot end module. The cold end module is connected to the first flow channel.

11. The heat dissipation device according to claim 10, characterized in that, The first pipe, the second flow channel, the hot end module, and the second pipe are connected in sequence.

12. The heat dissipation device according to claim 6, 10 or 11, characterized in that, The heat dissipation device further includes a first pump, which is disposed between the heat dissipation module and the first flow channel.

13. The heat dissipation device according to any one of claims 1-12, characterized in that, The heat dissipation device also includes a second pump, which is disposed on the first pipe or the second pipe.

14. The heat dissipation device according to any one of claims 1-13, characterized in that, The cold plate assembly includes a first cold plate, which is provided with a first flow channel and a second flow channel.

15. The heat dissipation device according to any one of claims 1, 2, 4-6, and 9-13, characterized in that, The cold plate assembly includes a second cold plate and a third cold plate, wherein the second cold plate is provided with a first flow channel and the third cold plate is provided with a second flow channel.

16. The heat dissipation device according to claim 15, characterized in that, The second cold plate is arranged around the periphery of the third cold plate.

17. The heat dissipation device according to any one of claims 1-16, characterized in that, Includes multiple of the aforementioned cold plate assemblies; The heat dissipation module is connected to a plurality of the first flow channels in the plurality of the plurality of cold plate assemblies and is configured to supply the first cooling medium to the plurality of the first flow channels respectively. The first pipe, the second pipe, and the first flow channel in the plurality of cold plate assemblies are connected to each other so as to input the second cooling medium into the plurality of second flow channels through the first pipe and to receive the second cooling medium output from the plurality of second flow channels through the second pipe.

18. A device node, characterized in that, include: The first device, the second device, and the heat dissipation device according to any one of claims 1-17; the first device and the second device are disposed on one side of the cold plate assembly of the heat dissipation device; the thermal sensitivity of the first device is greater than that of the second device; The projection of the first device on the cold plate assembly overlaps with the first flow channel of the cold plate assembly, and the projection of the second device on the cold plate assembly overlaps with the second flow channel of the cold plate assembly.

19. A liquid-cooled cabinet, characterized in that, include: The liquid-cooled distribution unit and the device node as described in claim 18; The liquid cooling distribution unit is configured to input a second cooling medium into a second flow channel through a first pipe, and to receive the second cooling medium output through the second pipe.

20. A liquid-cooled cabinet, characterized in that, include: The heat dissipation device, the first device, the second device, the liquid cooling distribution unit, and the device node are as described in any one of claims 1 to 17; the first device, the second device, and the cold plate assembly in the heat dissipation device are located within the device node; The first device and the second device are disposed on one side of the cold plate assembly; the thermal sensitivity of the first device is greater than that of the second device; the projection of the first device on the cold plate assembly overlaps with the first flow channel of the cold plate assembly, and the projection of the second device on the cold plate assembly overlaps with the second flow channel of the cold plate assembly.

21. A data center, characterized in that, Includes the liquid-cooled cabinet as described in claim 19 or 20.

Images