Package circuit board, heat dissipation system and electronic device

Abstract

The present application applies to the field of electronic device heat dissipation. Disclosed are a package circuit board, a heat dissipation system and an electronic device. The package circuit board comprises: a substrate on which an electronic component is mounted; a packaging member arranged on the substrate, the electronic component being located inside the packaging member; and at least one liquid-cooling microtube used for carrying a heat dissipation medium, the liquid-cooling microtube being located inside the package member, and the liquid-cooling microtube extending from an inlet of the packaging member to an outlet of the packaging member. The package circuit board provided in the present application has high heat dissipation efficiency, involves easy processing, and occupies a small volume, eliminating the need to provide cold plates or heat sinks, and thereby facilitating the lightweight design of a chassis.

Description

Packaged circuit boards, heat dissipation systems and electronic devices

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202510187950.8, filed on February 20, 2025, entitled "A packaged circuit board, heat dissipation system and electronic device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation in electronic devices, and in particular to a packaged circuit board, a heat dissipation system, and an electronic device. Background Technology

[0004] In the heat dissipation process of electronic devices, two methods are generally used: immersion liquid cooling and cooling plate liquid cooling. Immersion liquid cooling technology directly immerses heat-generating electronic components, such as CPUs (Central Processing Units), GPUs (Graphics Processing Units), memory, and hard drives, in a non-conductive inert fluid medium, i.e., coolant, to achieve heat transfer and dissipation. Cooling plate liquid cooling technology refers to indirectly transferring the heat generated by electronic components to the cooling liquid enclosed in the circulation pipes through a cold plate (usually a closed cavity made of highly thermally conductive metals such as copper or aluminum), and then using the cooling liquid to carry away the heat.

[0005] However, in related technologies, when using immersion liquid cooling, servers may experience corrosion due to prolonged immersion in coolant, affecting functionality and performance. Furthermore, immersion liquid cooling typically employs a box-type deployment structure, resulting in lower deployment density compared to cold plate liquid cooling. The need to switch to box-type deployment also increases the difficulty and cost of modifying data center infrastructure and servers. When using cold plate liquid cooling, the multi-layered thermal interface materials and complex thermal interface contacts lead to high overall thermal resistance of the circuit board, making it unable to meet the cooling requirements of future high-power-density data centers. Additionally, the heavy weight of the cold plate itself can easily cause sagging and deformation of rack-mounted servers.

[0006] Application content

[0007] The purpose of this application is to provide a packaged circuit board, a heat dissipation system, and an electronic device, which can significantly improve the heat dissipation efficiency of the packaged circuit board and reduce its size.

[0008] To achieve the above objectives, this application provides the following technical solution:

[0009] According to a first aspect of this application, a packaged circuit board is provided, comprising:

[0010] The substrate on which electronic components are mounted;

[0011] The packaged component is disposed on the substrate, and the electronic components are located inside the packaged component;

[0012] At least one liquid-cooled microtube is used to carry the heat dissipation medium. The liquid-cooled microtube is located within the package component and extends from the inlet of the package component to the outlet of the package component.

[0013] In some embodiments, the liquid-cooled microtube is attached to the surface of the electronic component, and the liquid-cooled microtube extends from one side of the electronic component to the other side.

[0014] In some embodiments, the inlet of the packaging component is located on the side of the packaging component closer to the substrate, and the substrate is provided with a substrate clearance hole. The liquid-cooled microtube passes through the substrate clearance hole and enters the inlet of the packaging component.

[0015] In some implementations, the outlet of the packaging component is located on the side of the packaging component away from the substrate, and the liquid-cooled microtube extends out of the outlet of the packaging component and extends to the target height.

[0016] In some implementations, the outer diameter of the liquid-cooled microtube is 1mm-2mm and the wall thickness is 0.4mm-0.6mm.

[0017] In some embodiments, the liquid-cooled microtube is provided with an inlet section, a cooling section and an outlet section in sequence from the first end to the second end. The extension directions of the inlet section and the outlet section are both perpendicular to the extension direction of the cooling section, and the cooling section is arranged parallel to the surface of the electronic component.

[0018] In some embodiments, a high-speed signal pin and a power signal pin are connected between the substrate and the motherboard. The high-speed signal pin and the power signal pin are arranged on the surface of the substrate along a first direction, and the liquid-cooled microtube is arranged on the surface of the electronic component along a second direction. The first direction is perpendicular to the second direction.

[0019] According to a second aspect of this application, a heat dissipation system is also provided, including the aforementioned packaged circuit board.

[0020] In some embodiments, the system also includes a chassis housing, which contains a liquid storage chamber for storing cooling medium and a circuit board mounting chamber for mounting circuit boards. A motherboard is located inside the chassis housing, between the liquid storage chamber and the circuit board mounting chamber, and the packaged circuit board is mounted on the motherboard. The motherboard has a motherboard clearance hole, through which the liquid cooling microtube passes and communicates with the liquid storage chamber.

[0021] In some embodiments, the chassis housing includes a chassis shell, a cover plate, and a partition plate. The partition plate is installed inside the chassis shell, and a liquid storage chamber is formed between the partition plate and the side wall of the chassis shell, and between the motherboard and the bottom plate of the chassis shell.

[0022] In some embodiments, the liquid storage chamber includes a liquid storage portion and a liquid supply portion that are in communication with each other. The liquid storage portion is located next to the motherboard, and the liquid supply portion is located at the bottom of the motherboard. The liquid level of the liquid storage portion is higher than the liquid level of the liquid supply portion.

[0023] In some embodiments, the top of the circuit board mounting chamber is also provided with a flow guiding component, the cooling medium is a two-phase cooling medium, the outlet of the liquid-cooled microtube faces the flow guiding component, and the flow guiding component is used to allow the liquefied cooling medium to flow into the liquid storage chamber.

[0024] In some implementations, the cover is detachably connected to the chassis housing; and / or, the airflow guide is detachably connected to the chassis housing.

[0025] In some embodiments, the upper part of the flow guiding component forms a gas storage area, and the flow guiding component is a waterproof and breathable membrane component; the flow guiding component is inclined downward from the side away from the liquid storage part to the side closer to the liquid storage part.

[0026] In some embodiments, the waterproof and breathable membrane component is a polymer material membrane component.

[0027] In some embodiments, the angle of inclination of the guide member relative to the horizontal direction is 10° to 60°.

[0028] In some embodiments, a condensation zone is provided on the upper part of the liquid storage section, and a cooling fan, heat-conducting fins and / or a heat dissipation plate are provided on the outer side of the chassis corresponding to the condensation zone.

[0029] In some embodiments, the condensation zone is provided with heat dissipation fins and / or capillary heat dissipation components to allow the vaporized cooling medium to liquefy and flow into the liquid storage section.

[0030] In some implementations, the liquid level in the reservoir is higher than the height of the electronic components but lower than the height of the outlet port of the liquid-cooled microtube.

[0031] According to a third aspect of this application, an electronic device is also provided, including the aforementioned heat dissipation system.

[0032] The beneficial effects of the packaged circuit board provided by the technical solution of this application are as follows: By setting liquid-cooled microtubes inside the packaged component, the heat of the electronic components is removed by the cooling medium in the liquid-cooled microtubes, thus achieving effective cooling of the electronic components; the cooling medium in the liquid-cooled microtubes can be a flowing cooling medium. For example, a circulation system can be set up to supply cooling medium to the liquid-cooled microtubes. The cooler cooling medium flows into the liquid-cooled microtubes. When the cooling medium flows through the packaged component, the heat of the electronic components is transferred to the cooling medium through heat exchange. The heated cooling medium flows out of the packaged component along the liquid-cooled microtubes. Through the circulation of the cooling medium, the heat of the electronic components located inside the packaged component is removed; or, the cooling medium in the liquid-cooled microtubes can also be a two-phase cooling medium, which refers to a cooling medium that undergoes a phase change during the cooling process, that is, changes from a liquid state to a gaseous state. When the cooling medium flows into the packaged component through the liquid-cooled microtubes, it undergoes a phase change from liquid to gas due to the high heat of the electronic components. This process carries away the heat from the electronic components. The vaporized cooling medium can be condensed in the chassis and then reintroduced into the liquid-cooled microtubes, or it can be introduced outside the chassis for further condensation. This method allows for direct energy exchange within the packaged component, eliminating the need for a cold plate. This effectively avoids the space occupied by a cold plate within the chassis and eliminates the need for multiple layers of thermal interface materials and complex thermal interface contacts, thus effectively reducing thermal resistance. This allows for minimizing the thickness of the packaged circuit board and motherboard, which is beneficial for deploying high-density systems. Furthermore, it avoids the corrosion that can occur when electronic devices are immersed in coolant for extended periods, as is common in immersion liquid cooling solutions, preventing any impact on the functionality and performance of electronic components.

[0033] The packaged circuit board provided by the technical solution of this application has high heat dissipation efficiency, is easy to process, occupies a small volume, and does not require the deployment of a cold plate or heat sink, which is conducive to the lightweight design of the chassis.

[0034] In the technical solution of this application, a high-speed signal pin and a power signal pin are connected between the substrate and the motherboard. The high-speed signal pin enables signal transmission between the substrate and the motherboard, and the power signal pin enables power transmission between the motherboard and the substrate. The high-speed signal pin and the power signal pin are arranged on the surface of the substrate along a first direction. Specifically, there can be multiple high-speed signal pins and power signal pins. Generally, the high-speed signal pins and the power signal pins are arranged in parallel. The high-speed signal pins and the power signal pins extend from the surface of the substrate to the side of the substrate, and after bending, they connect to the motherboard. Furthermore, liquid-cooled microtubes are arranged on the surface of the electronic components along a second direction. There can also be multiple liquid-cooled microtubes, which can also be arranged in parallel. To improve heat dissipation efficiency, a portion of the structure of the liquid-cooled microtubes is positioned... On the surface of the substrate, the inlet and outlet of the liquid-cooled microtube can extend vertically to facilitate the entry of the cooling medium into the liquid-cooled microtube. That is, the inlet of the liquid-cooled microtube is located on the side of the package component closer to the substrate, and the outlet of the liquid-cooled microtube is located on the side of the package component away from the substrate. The surface of the electronic component can be parallel to the surface of the substrate. To avoid interference between the liquid-cooled microtube and the placement of high-speed signal pins and power signal pins, the first direction is set to be perpendicular to the second direction. In other words, the arrangement direction of the high-speed signal pins and power signal pins on the surface of the substrate is perpendicular to the arrangement direction of the liquid-cooled microtube on the surface of the electronic component. That is, the high-speed signal pins and power signal pins in the package component are orthogonally distributed with the liquid-cooled microtube, which can effectively ensure the integration and signal transmission efficiency of the package component, reduce interference, facilitate layout, and ensure the performance.

[0035] The heat dissipation system provided by the technical solution of this application is equipped with the above-mentioned packaged circuit board. Since the packaged circuit board has the above-mentioned technical effects, the heat dissipation system equipped with the packaged circuit board should also have the corresponding technical effects.

[0036] The electronic device provided by the technical solution of this application is equipped with the above-mentioned heat dissipation system. Since the heat dissipation system has the above-mentioned technical effects, the electronic device equipped with the heat dissipation system should also have the corresponding technical effects. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 is a schematic diagram of the packaged circuit board provided in an embodiment of this application;

[0039] Figure 2 is a left view of the packaged circuit board shown in Figure 1;

[0040] Figure 3 is a top view of the packaged circuit board shown in Figure 1;

[0041] Figure 4 is a schematic diagram of the structure of the packaged circuit board provided in the embodiment of this application after removing the packaged components and the motherboard;

[0042] Figure 5 is a side view of the motherboard and the packaged circuit board shown in Figure 4;

[0043] Figure 6 is a top view of the motherboard and the packaged circuit board shown in Figure 4;

[0044] Figure 7 is a cross-sectional view of the heat dissipation system provided in an embodiment of this application;

[0045] Figure 8 is a cross-sectional view of a heat dissipation system provided in some other embodiments of this application;

[0046] Figure 9 is a cross-sectional view of a heat dissipation system provided in some other embodiments of this application;

[0047] Figure 10 is a cross-sectional view of a heat dissipation system provided in some other embodiments of this application;

[0048] Figure 11 is a cross-sectional view of a heat dissipation system provided in some other embodiments of this application;

[0049] Figure 12 is a schematic diagram of the chassis structure in the heat dissipation system provided in the embodiment of this application;

[0050] Figure 13 is a schematic diagram of the internal structure of the chassis shown in Figure 12;

[0051] Figure 14 is a schematic diagram of the structure of the motherboard and the packaged circuit board in the heat dissipation system provided in the embodiment of this application.

[0052] Reference numerals: 1. Packaging circuit board; 11. Substrate; 111. Substrate clearance hole; 12. Electronic component; 13. Packaging part; 14. Liquid-cooled microtube; 141. Inlet section; 142. Cooling section; 143. Outlet section; 15. High-speed signal pin; 16. Power signal pin; 2. Chassis housing; 201. Chassis outer shell; 202. Cover plate; 203. Partition; 21. Liquid storage chamber; 211. Liquid storage section; 212. Liquid supply section; 213. Condensation zone; 214. Cooling fan; 215. Thermal fins; 216. Cooling plate; 217. Cooling fins; 218. Capillary cooling component; 219. Liquid level sensor; 22. Circuit board mounting chamber; 23. Main board; 231. Main board clearance hole; 24. Flow guiding component; 241. Gas storage area; 25. Protective plate. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0054] The core of this application is to provide a packaged circuit board, a heat dissipation system, and an electronic device that can significantly reduce thermal resistance, improve heat dissipation efficiency, and facilitate structural deployment.

[0055] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0056] With the accelerated iteration of AI (Artificial Intelligence) integrated circuits, the power consumption of integrated circuits increases with each generation, making liquid cooling technology a key to improving heat dissipation efficiency. Liquid cooling microchannel technology optimizes the spatial layout and improves the overall design compactness by penetrating the motherboard 23 and extending to the liquid storage tank. Compared with the cold plate solution of related technologies, it saves the thickness space occupied by the cold plate and its mounting structure. Compared with traditional immersion liquid cooling, liquid cooling microchannel technology using two-phase cooling medium can keep the motherboard 23 dry, avoiding the process of handling liquid first and then maintaining the motherboard 23, reducing maintenance needs and potential failure risks.

[0057] Please refer to Figures 1 to 6. In this embodiment, the packaged circuit board 1 includes:

[0058] Substrate 11, on which electronic components 12 are mounted;

[0059] The encapsulation component 13 is disposed on the substrate 11, and the electronic component 12 is located inside the encapsulation component 13;

[0060] At least one liquid-cooled microtube 14 is provided for carrying a heat dissipation medium. The liquid-cooled microtube 14 is located within the encapsulation component 13 and extends from the inlet of the encapsulation component 13 to the outlet of the encapsulation component 13.

[0061] Specifically, the substrate 11 is used to mount electronic components 12, and the encapsulation component 13 can be made of materials such as plastic. The integrated circuit is connected to the substrate 11 or the lead frame through specific processes and technologies to protect the integrated circuit from the influence of the external environment. The liquid-cooled microtube 14 forms a heat dissipation microchannel inside. With the help of heat dissipation microchannel technology, it is suitable for the heat dissipation needs of high-performance GPUs that generate a lot of heat when running under high load. By setting the heat dissipation microchannel inside the encapsulation component 13, the cooling medium flows in these channels to absorb and remove heat. The cooling medium is cooled directly near the heat source, which can significantly improve the heat dissipation efficiency. For the flow dynamics of the cooling medium, a liquid-cooled pump can be set to drive the cooling medium to circulate in the liquid-cooled microtube 14. Then, a heat sink is set to dissipate the heat absorbed by the cooling medium to the external environment. The liquid-cooled microtube 14 and the heat sink are connected by liquid supply / return pipelines to form a complete cooling cycle. The structure of the liquid-cooled microtube 14 can distribute heat more evenly and avoid local overheating.

[0062] Furthermore, there can be multiple liquid-cooled microtubes 14, which are installed inside the encapsulation component 13 in a parallel arrangement, or there can be only one liquid-cooled microtube 14, which is installed inside the encapsulation component 13 in a ring arrangement. In order to ensure the heat dissipation effect of the liquid-cooled microtube 14 and avoid the blockage of a single liquid-cooled microtube 14, it is better to set multiple liquid-cooled microtubes 14.

[0063] The packaged circuit board 1 utilizes a liquid-cooled microtube 14 within the package component 13. The cooling medium within the microtube 14 removes heat from the electronic components 12, effectively cooling the components. The cooling medium in the microtube 14 can be a flowing medium. For example, a circulation system can be used to supply cooling medium to the microtube 14. The cooler medium flows into the microtube 14, and as it passes through the package component 13, heat from the electronic components 12 is transferred to the cooling medium through heat exchange. The heated cooling medium then flows out of the package component 13 along the microtube 14. This circulation of the cooling medium removes heat from the electronic components 12 located inside the package component 13. Alternatively, the cooling medium in the microtube 14 can be a two-phase cooling medium, which is a cooling medium that undergoes a phase change during cooling, transitioning from a liquid to a gaseous state. When the cooling medium flows into the packaged component 13 through the liquid-cooled microtube 14, due to the high heat of the electronic component 12, the cooling medium undergoes a phase change, transforming from a liquid to a gaseous state, thereby carrying away the heat from the electronic component 12. The vaporized cooling medium can be condensed in the chassis and then reintroduced into the liquid-cooled microtube 14, or it can be introduced outside the chassis for further condensation. This method allows for direct energy exchange within the packaged component 13, eliminating the need for a cold plate. This effectively avoids the space occupied by a cold plate within the chassis and eliminates the need for multiple layers of thermal interface materials and complex thermal interface contacts, effectively reducing thermal resistance. This allows for minimizing the thickness space between the packaged circuit board 1 and the motherboard 23, facilitating the deployment of high-density systems. Simultaneously, it avoids the corrosion that may occur when electronic devices are immersed in coolant for extended periods in immersion liquid cooling solutions, preventing any impact on the function and performance of the electronic component 12. The packaged circuit board 1 exhibits high heat dissipation efficiency, is easy to manufacture, occupies a small volume, and requires no cold plate or heat sink, contributing to a lightweight chassis design.

[0064] In some embodiments, the liquid-cooled microtube 14 is attached to the surface of the electronic component 12, and the liquid-cooled microtube 14 extends from one side of the electronic component 12 to the other side. Specifically, by attaching the liquid-cooled microtube 14 to the surface of the electronic component 12, the heat from the electronic component 12 can be transferred to the liquid-cooled microtube 14 most quickly. To ensure sufficient heat dissipation from the electronic component 12 by the liquid-cooled microtube 14, the liquid-cooled microtube 14 can extend from one side of the electronic component 12 to the other side, that is, the liquid-cooled microtube 14 can cover the entire electronic component 12. Of course, To further improve the heat dissipation effect of the liquid-cooled microtubes 14 on the electronic components 12, multiple liquid-cooled microtubes 14 are arranged sequentially and attached to each other. The total width of each liquid-cooled microtube 14 is the same as the width of the electronic components 12, and the liquid-cooled microtubes 14 extend along the length of the electronic components 12. Alternatively, the total width of each liquid-cooled microtube 14 can be set to be the same as the length of the electronic components 12, and the liquid-cooled microtubes 14 extend along the width of the electronic components 12. In other words, after the liquid-cooled microtubes 14 are arranged, they can cover the entire electronic components 12, resulting in better heat dissipation.

[0065] In some embodiments, the inlet of the packaging component 13 is located on the side of the packaging component 13 close to the substrate 11, that is, the liquid-cooled microtube 14 extends from the bottom of the packaging component 13 into the interior of the packaging component 13, and the substrate 11 is provided with a substrate clearance hole 111. After the liquid-cooled microtube 14 passes through the substrate clearance hole 111, it enters the inlet of the packaging component 13. With this arrangement, the liquid-cooled microtube 14 will not occupy the space on the side of the substrate 11, and the space of the packaging component 13 is saved due to the arrangement of the electronic components 12. In order to ensure the sealing effect of the packaging component 13, the space between the liquid-cooled microtube 14 and the substrate clearance hole 111 and the inlet of the packaging component 13 needs to be filled with sealing material, such as sealant.

[0066] In some embodiments, the outlet of the encapsulation component 13 is located on the side of the encapsulation component 13 away from the substrate 11, and the liquid-cooled microtube 14 extends out of the outlet of the encapsulation component 13 and extends to the target height, which can prevent the heat dissipation medium from entering the interior of the encapsulation component 13. Specifically, the outlet of the encapsulation component 13 can extend vertically, extending out of the top of the encapsulation component 13, which can make full use of space. Moreover, when the cooling medium is a two-phase cooling medium, it is also beneficial for the gaseous cooling medium to flow out from the liquid-cooled microtube 14. Similarly, in order to ensure the sealing effect of the encapsulation component 13, a sealing material, such as sealant, also needs to be filled between the liquid-cooled microtube 14 and the outlet of the encapsulation component 13.

[0067] In some embodiments, the outer diameter of the liquid-cooled microtube 14 is 1mm-2mm and the wall thickness is 0.4mm-0.6mm, for example, 0.5mm. With this configuration, the liquid-cooled microtube 14 can utilize the siphon effect to adsorb the cooling medium, thereby maintaining a constant liquid flow within the liquid-cooled microtube 14 without the risk of dry burning. To enhance the siphon effect, a capillary structure can also be provided inside the liquid-cooled microtube 14. Furthermore, the liquid-cooled microtube 14 can be made of materials with good thermal conductivity, such as copper, aluminum, or diamond.

[0068] In some embodiments, the liquid-cooled microtube 14 is provided with an inlet section 141, a cooling section 142, and an outlet section 143 sequentially from the first end to the second end. That is, the inlet section 141, the cooling section 142, and the outlet section 143 are connected in sequence. The extension directions of the inlet section 141 and the outlet section 143 are both perpendicular to the extension direction of the cooling section 142. Specifically, the extension directions of the inlet section 141 and the outlet section 143 are vertical, and the extension direction of the cooling section 142 is horizontal. The cooling section 142 is arranged parallel to the surface of the electronic component 12. This arrangement is beneficial for the cooling section 142 to make more sufficient contact with the surface of the electronic component 12. At the same time, the inlet section 141 and the outlet section 143 do not occupy the horizontal space of the packaged circuit board 1, thereby avoiding the occupation of space on the motherboard 23. The inlet section 141 and the outlet section 143 only occupy the vertical space of the packaged circuit board 1, which is beneficial for the space deployment of the chassis.

[0069] In some embodiments, a high-speed signal pin 15 and a power signal pin 16 are connected between the substrate 11 and the main board 23. The high-speed signal pin 15 and the power signal pin 16 are arranged on the surface of the substrate 11 along a first direction, and the liquid-cooled microtube 14 is arranged on the surface of the electronic component 12 along a second direction. The first direction is perpendicular to the second direction. Specifically, a high-speed signal pin 15 and a power signal pin 16 are connected between the substrate 11 and the motherboard 23. The high-speed signal pin 15 enables signal transmission between the substrate 11 and the motherboard 23, and the power signal pin 16 enables power transmission between the motherboard 23 and the substrate 11. The high-speed signal pin 15 and the power signal pin 16 are arranged along a first direction on the surface of the substrate 11. Specifically, there can be multiple high-speed signal pins 15 and power signal pins 16. Generally, the high-speed signal pins 15 and the power signal pins 16 are arranged in parallel. The high-speed signal pins 15 and the power signal pins 16 extend from the surface of the substrate 11 to the side of the substrate 11, and after bending, connect to the motherboard 23. Furthermore, liquid-cooled microtubes 14 are arranged along a second direction on the surface of the electronic components 12. There can also be multiple liquid-cooled microtubes 14, which can also be arranged in parallel. To improve heat dissipation efficiency, a portion of the structure of the liquid-cooled microtubes 14 is located in... On the surface of substrate 11, the inlet and outlet of liquid-cooled microtube 14 can extend vertically to facilitate the entry of cooling medium into liquid-cooled microtube 14. That is, the inlet of liquid-cooled microtube 14 is located on the side of the packaging component 13 close to substrate 11, and the outlet of liquid-cooled microtube 14 is located on the side of the packaging component 13 away from substrate 11. The surface of electronic component 12 can be parallel to the surface of substrate 11. To avoid interference between the liquid-cooled microtube 14 and the placement of high-speed signal pin 15 and power signal pin 16, the first direction is set perpendicular to the second direction. That is, the arrangement direction of high-speed signal pin 15 and power signal pin 16 on the surface of substrate 11 is perpendicular to the arrangement direction of liquid-cooled microtube 14 on the surface of electronic component 12. That is, the high-speed signal pin 15 and power signal pin 16 in the packaging component 13 are orthogonally distributed with liquid-cooled microtube 14, which can effectively ensure the integration and signal transmission efficiency of packaging component 13, reduce interference, facilitate layout, and ensure the performance.

[0070] In one specific embodiment, the packaged circuit board 1 includes a substrate 11, a packaged component 13, and at least one liquid-cooled microtube 14. Electronic components 12 are mounted on the substrate 11, and the packaged component 13 is disposed on the substrate 11, with the electronic components 12 located inside the packaged component 13. The liquid-cooled microtube 14 contains a cooling medium and is located inside the packaged component 13, extending from the inlet to the outlet of the packaged component 13. Multiple liquid-cooled microtubes 14 can be installed inside the packaged component 13 in a parallel arrangement. The liquid-cooled microtubes 14 are attached to the surface of the electronic components 12 and extend from one side of the electronic components 12 to the other. The inlet of the packaged component 13 is located on the side of the packaged component 13 closest to the substrate 11, and the liquid-cooled microtube 14 is located on the substrate 11. A substrate clearance hole 111 is provided. The liquid-cooled microtube 14 passes through the substrate clearance hole 111 and enters the inlet of the packaging component 13. The outlet of the packaging component 13 is located on the side of the packaging component 13 away from the substrate 11. The liquid-cooled microtube 14 is provided with an inlet section 141, a cooling section 142 and an outlet section 143 in sequence from the first end to the second end. The extension directions of the inlet section 141 and the outlet section 143 are both perpendicular to the extension direction of the cooling section 142, and the cooling section 142 is arranged parallel to the surface of the electronic component 12. A high-speed signal pin 15 and a power signal pin 16 are connected between the substrate 11 and the main board 23. The high-speed signal pin 15 and the power signal pin 16 are arranged on the surface of the substrate 11 along a first direction, and the liquid-cooled microtube 14 is arranged on the surface of the electronic component 12 along a second direction. The first direction is perpendicular to the second direction.

[0071] In addition to the aforementioned packaged circuit board 1, this application also provides a heat dissipation system including the aforementioned packaged circuit board 1.

[0072] In some embodiments, referring to Figures 7 to 14, the heat dissipation system further includes a chassis housing 2, a motherboard 23 is installed inside the chassis housing 2, and at least one packaged circuit board 1 is mounted on the motherboard 23. The chassis housing 2 is provided with a liquid storage chamber 21 and a circuit board mounting chamber 22. The liquid storage chamber 21 should be sealed, and the cooling medium is filled in the liquid storage chamber 21. The motherboard 23 is located between the liquid storage chamber 21 and the circuit board mounting chamber 22. The motherboard 23 can be used to separate the liquid storage chamber 21 and the circuit board mounting chamber 22, thereby making full use of the structure of the motherboard 23. In other embodiments, to reduce damage to the motherboard 23, a protective plate 25 can be added between the motherboard 23 and the liquid storage chamber 21. The protective plate 25 is used to separate the liquid storage chamber 21 and the circuit board mounting chamber 22, with the motherboard 23 located on the side of the protective plate 25 away from the liquid storage chamber 21. Furthermore, the encapsulated circuit board 1 is mounted on the motherboard 23, and multiple encapsulated circuit boards 1 can be set on a single motherboard 23. The liquid-cooled microtubes 14 connected to each encapsulated circuit board 1 can be supplied with liquid through a separate circulation system and communicate with the liquid storage chamber 21, or they can share the same circulation system for liquid supply, saving costs. When the cooling medium in the liquid-cooled microtubes 14 is a two-phase cooling medium, the liquid-cooled microtubes 14 connected to each encapsulated circuit board 1 are all connected to the liquid storage chamber 21. The cooling medium, after vaporization, is condensed through the same channel and flows back into the liquid storage chamber 21. This process is highly efficient, requires no partitioning, and facilitates layout. The motherboard 23 has a motherboard clearance hole 231. The liquid cooling microtube 14 passes through the motherboard clearance hole 231 and connects to the liquid storage chamber 21. Specifically, the inlet section 141 of the liquid cooling microtube 14 is connected to the motherboard clearance hole 231 and connects to the liquid storage chamber 21. The liquid cooling microtube 14 sequentially passes through the motherboard clearance hole 231 on the motherboard 23, the substrate clearance hole 111 on the substrate 11, and the inlet of the packaging component 13, extending to the surface of the electronic component 12 and carrying away the heat of the electronic component 12. After effectively cooling the electronic component 12, it extends out through the outlet of the packaging component 13.

[0073] In some embodiments, the chassis housing 2 includes a chassis outer shell 201, a cover plate 202, and a partition plate 203. The partition plate 203 is installed inside the chassis outer shell 201, and a liquid storage chamber 21 is formed between the partition plate 203 and the side wall of the chassis outer shell 201, and between the motherboard 23 and the bottom plate of the chassis outer shell 201. Specifically, the partition plate 203 and the side wall of the chassis outer shell 201 can form a liquid storage portion 211 of the liquid storage chamber 21, and the motherboard 23 and the bottom plate of the chassis outer shell 201 can form a liquid supply portion 212 of the liquid storage chamber 21. This only requires adding the structure of the partition plate 203 and setting a sandwich between the motherboard 23 and the bottom plate of the chassis outer shell 201, which has low manufacturing cost and is convenient to use.

[0074] In some embodiments, the cover plate 202 is detachably connected to the chassis housing 201; and / or, the airflow guiding component 24 is detachably connected to the chassis housing 201. Specifically, both the cover plate 202 and the airflow guiding component 24 can be detachably connected to the chassis housing 201. Specifically, a support step can be provided around the periphery of the chassis housing 201, and the periphery of the airflow guiding component 24 is placed on the support step. The top cover of the chassis is also detachably connected to the chassis housing 201. When the various packaged circuit boards 1 on the motherboard 23 need maintenance, the top cover of the chassis can first be separated from the chassis housing 201, and then the airflow guiding component 24 can be disassembled. This facilitates the maintenance of the packaged circuit boards 1, meeting the heat dissipation requirements while also facilitating disassembly and maintenance.

[0075] In some embodiments, the liquid storage chamber 21 includes a liquid storage portion 211 and a liquid supply portion 212 that are interconnected. The liquid storage portion 211 is located beside the main board 23, and the liquid supply portion 212 is located at the bottom of the main board 23. The liquid level of the liquid storage portion 211 is higher than that of the liquid supply portion 212. Specifically, the liquid storage portion 211 and the liquid supply portion 212 form an L-shaped structure. The liquid storage portion 211 provides cooling medium to the liquid supply portion 212. The liquid supply portion 212 is connected to the liquid cooling microtube 14. This arrangement not only facilitates condensation but also helps to push the cooling medium into the liquid cooling microtube 14 from the liquid level of the liquid storage portion 211, which is beneficial to the circulation of the cooling medium.

[0076] In some embodiments, the top of the circuit board mounting chamber 22 is also provided with a flow guide 24. The cooling medium is a two-phase cooling medium, and the outlet of the liquid-cooled microtube 14 faces the flow guide 24. The flow guide 24 is used to allow the liquefied cooling medium to flow into the liquid storage chamber 21. By setting the flow guide 24, the liquefied cooling medium can flow back into the liquid storage chamber 21 after condensation, so that the cooling medium can achieve self-circulation inside the chassis housing 2. As for how the liquid in the liquid storage chamber 21 enters the liquid-cooled microtube 14, the diameter of the liquid-cooled microtube 14 is set, or a capillary structure is set. Through the siphon effect, the cooling medium in the liquid storage chamber 21 is automatically drawn into the liquid-cooled microtube 14. There is no need to set a power component, which can effectively reduce costs.

[0077] In some embodiments, a gas storage area 241 is formed on the upper part of the flow guide 24, and the flow guide 24 is a waterproof and breathable membrane component; specifically, the four sides of the flow guide 24 are connected to the inner sidewall of the chassis shell 201, and the vaporized cooling medium flows from the lower side of the flow guide 24 to the upper side of the flow guide 24. After condensation in the gas storage area 241, it flows back to the liquid storage section 211 through the flow guide 24. Alternatively, the flow guide component 24 can also be configured as a plastic plate or similar structure. By setting an airflow channel on the side of the flow guide component 24 away from the liquid storage portion 211, that is, leaving a gap between the side of the flow guide component 24 away from the liquid storage portion 211 and the inner wall of the chassis shell 201, the gas storage area 241 is connected to the circuit board mounting chamber 22, so that the cooling medium in the liquid cooling microtube 14 can be vaporized and enter the gas storage area 241 through the airflow channel. In other words, for the flow guide component 24, an airflow channel can be opened on one side of the flow guide component 24, so that the vaporized cooling medium can flow from the lower side of the flow guide component 24 to the upper side of the flow guide component 24. Alternatively, a waterproof and breathable membrane can be selected to achieve the purpose of the gaseous cooling medium flowing from the lower side of the flow guide component 24 to the upper side. Furthermore, the two-phase cooling medium can be selected as needed, for example, it can be a fluorinated liquid. Fluorinated liquid is a high-performance cooling medium with good insulation and chemical stability, which can keep the liquid from freezing at extremely low temperatures. It also has a high latent heat of vaporization, which can effectively absorb heat. Its chemical properties are stable, non-flammable, have low corrosiveness to equipment, and have good dielectric properties, making it suitable for cooling electronic equipment. Furthermore, in order to ensure that the flow guiding component 24 can smoothly guide the condensed liquid to the liquid storage section 211, the flow guiding component 24 is inclined downward from the side away from the liquid storage section 211 to the side closer to the liquid storage section 211.

[0078] In some embodiments, the waterproof and breathable membrane component is a polymer material membrane component. Specifically, a PE polymer material membrane component or a PU polymer material membrane component can be selected, as long as it can achieve the functions of waterproofing and breathability.

[0079] In some embodiments, the angle of inclination of the guide member 24 relative to the horizontal direction is 10° to 60° to ensure that the condensed liquid can flow smoothly back to the liquid storage part 211. The angle of inclination should not be too large, which would result in a large space occupation, nor should it be too small, which would result in low liquid return efficiency.

[0080] In some embodiments, a condensation zone 213 is provided at the upper part of the liquid storage section 211. The vaporized cooling medium can be condensed in the gas storage area 241 or after entering the condensation zone 213. A cooling fan 214, heat-conducting fins 215 and / or heat dissipation plate 216 are provided on the outer side of the chassis 2 at a position corresponding to the condensation zone 213. The cooling fan 214, heat-conducting fins 215 and / or heat dissipation plate 216 can accelerate the condensation efficiency of the condensation zone 213, thereby improving the gas-liquid change efficiency of the cooling medium and ensuring that there is sufficient cooling medium in the liquid storage chamber 21.

[0081] In some embodiments, the condensation zone 213 is provided with heat dissipation fins 217 and / or capillary heat dissipation components 218 to allow the vaporized cooling medium to liquefy and flow into the liquid storage portion 211. Specifically, the arrangement of heat dissipation fins 217 and / or capillary heat dissipation components 218 can accelerate the liquefaction efficiency of the vaporized cooling medium inside the condensation zone 213, supplement the cooling fan 214, heat-conducting fins 215 and / or heat dissipation plate 216 on the outside of the chassis housing 2, and enhance the condensation efficiency of the cooling medium.

[0082] In some embodiments, the liquid level of the reservoir 211 is higher than the height of the electronic component 12 but lower than the height of the outlet port of the liquid-cooled microtube 14. Specifically, by setting the liquid level of the reservoir 211 to be higher than the height of the electronic component 12, the U-tube principle can be utilized to ensure that the liquid level of the cooling medium entering the liquid-cooled microtube 14 is higher than the height of the electronic component 12, thus ensuring sufficient heat exchange between the cooling medium and the electronic component 12. Simultaneously, the liquid level of the reservoir 211 being lower than the height of the outlet port of the liquid-cooled microtube 14 prevents the cooling medium from overflowing from the liquid-cooled microtube 14 under the U-tube principle, thus avoiding damage to the motherboard 23. Furthermore, to ensure the smooth flow of the cooling medium into the liquid-cooled microtube 14, components such as sponges or other porous structures can be incorporated into the liquid-cooled microtube 14 to enhance its adsorption effect on the cooling medium.

[0083] In some embodiments, the liquid storage section 211 is further provided with a liquid level sensor 219, which is used to obtain the liquid level height of the liquid storage section 211. When the liquid level height of the liquid storage section 211 is lower than a first preset height, the cooling fan 214 on the outside of the chassis housing 2 is controlled to increase its power, thereby improving the liquefaction efficiency of the gaseous cooling medium and replenishing the cooling medium of the liquid storage section 211 as soon as possible to ensure that it has sufficient cooling medium and thus has a sufficiently high pressure difference to avoid insufficient cooling medium in the liquid cooling microtube 14. Of course, when the liquid level height of the liquid storage section 211 is higher than a second preset height, the cooling fan 214 on the outside of the chassis housing 2 is controlled to reduce its power, thereby reducing energy consumption.

[0084] In one specific embodiment, the heat dissipation system includes a packaged circuit board 1 and a chassis housing 2. The packaged circuit board 1 includes a substrate 11, a packaged component 13, and at least one liquid-cooled microtube 14. Electronic components 12 are mounted on the substrate 11, and the packaged component 13 is disposed on the substrate 11, with the electronic components 12 located inside the packaged component 13. The liquid-cooled microtube 14 contains a cooling medium and is located inside the packaged component 13, extending from the inlet to the outlet of the packaged component 13. The chassis housing 2 is provided with a liquid storage chamber 21 for storing the cooling medium and a circuit board mounting chamber for mounting the circuit board. 22. A motherboard 23 is provided inside the chassis housing 2. The motherboard 23 is located between the liquid storage chamber 21 and the circuit board mounting chamber 22, and the packaged circuit board 1 is mounted on the motherboard 23. The motherboard 23 is provided with a motherboard clearance hole 231. The liquid cooling microtube 14 passes through the motherboard clearance hole 231 and communicates with the liquid storage chamber 21. The chassis housing 2 includes a chassis shell 201, a cover plate 202, and a partition plate 203. The partition plate 203 is installed inside the chassis shell 201, and the liquid storage chamber 21 is formed between the partition plate 203 and the side wall of the chassis shell 201, and between the motherboard 23 and the bottom plate of the chassis shell 201. The cover plate 202 and the flow guiding component 24 are both connected to the chassis. The outer casing 201 is detachably connected; the liquid storage chamber 21 includes a liquid storage section 211 and a liquid supply section 212 that are interconnected. The liquid storage section 211 is located beside the main board 23, and the liquid supply section 212 is located at the bottom of the main board 23, with the liquid level of the liquid storage section 211 being higher than that of the liquid supply section 212; the top of the circuit board mounting chamber 22 is also provided with a flow guide component 24, the cooling medium is a two-phase cooling medium, the outlet of the liquid cooling microtube 14 faces the flow guide component 24, the flow guide component 24 is used to supply the liquefied cooling medium to flow into the liquid storage chamber 21, the upper part of the flow guide component 24 forms a gas storage area 241, and the flow guide component 24 is for preventing... The device includes a water-permeable membrane component, and the flow guiding component 24 is inclined downward from the side away from the liquid storage section 211 to the side closer to the liquid storage section 211. The upper part of the liquid storage section 211 is provided with a condensation zone 213. The outer side of the chassis shell 2 is provided with a cooling fan 214, heat-conducting fins 215 and / or heat dissipation plate 216 at the position corresponding to the condensation zone 213. The condensation zone 213 is provided with heat dissipation fins 217 and / or capillary heat dissipation components 218 to liquefy the vaporized cooling medium and allow it to flow into the liquid storage section 211. The liquid level of the liquid storage section 211 is higher than the height of the electronic component 12 and lower than the height of the outlet port of the liquid-cooled microtube 14.

[0085] Specifically, by deploying liquid-cooled microtubes 14 within the packaged circuit board 1, a phase-change liquid-cooled microchannel is formed within the liquid-cooled microtubes 14. The phase change of the cooling medium directly removes heat from the electronic components 12. The phase-change gas rises to the gas storage area 241 and undergoes a phase change back to the liquid storage chamber 21 in the condensation area 213, and is then distributed to the liquid-cooled microtubes 14 within the packaged circuit board 1, thereby forming a phase-change heat dissipation circulation system within the sealed chassis. Specifically, the high-speed signal pin 15 and the power signal pin 16 are soldered to the motherboard 23 in a conventional manner. The liquid-cooled microtubes 14 penetrate the motherboard 23 and extend into the liquid supply section 212 below the motherboard 23. The substrate 11 and the motherboard 23 of the packaged circuit board 1 should be appropriately slotted to facilitate the passage of the liquid-cooled microtubes 14, and a seal should be ensured during packaging. The liquid-cooled microtubes 14 are made of materials with good thermal conductivity, such as copper, aluminum, and diamond, and have an outer diameter of 1m to 2m and a wall thickness of 0.The system uses a siphon effect to ensure a constant liquid flow within the liquid-cooled microtube 14, preventing the risk of dry burning. To enhance the siphon effect, a capillary structure can be incorporated inside the tube. In the packaged circuit board 1, the high-speed signal pin 15 is orthogonally positioned to the liquid-cooled microtube 14, extending along the X-axis and extending downwards from the package side. The liquid-cooled microtube 14 penetrates the substrate 11, extends along the Y-axis, and adheres to the heating surface of the electronic component 12, thus maintaining a constant liquid flow within the packaged components. The upper surface of 13 is extended; the chassis is divided into a gas storage area 241, a liquid storage chamber 21, a condensation area 213, and a circuit board mounting chamber 22. The condensation area 213 and the circuit board mounting chamber 22 are separated by a partition 203, and the gas storage area 241 and the circuit board mounting chamber 22 are separated by a flow guide component 24; the entire chassis must be sealed to prevent gas leakage; before the system operates, the cooling medium should be fully filled, and the air inside the chassis shell 2 should be vented during the vaporization of the cooling medium; the gas storage area 241 is composed of a waterproof and breathable membrane. A space isolated by the component; the membrane is at a certain angle to the horizontal plane; the phase change gas, that is, the gaseous cooling medium, can enter the gas storage area 241 through the waterproof and breathable membrane component, while the condensed liquid cannot drip back onto the motherboard 23, keeping the motherboard 23 dry; the gas storage area 241 is connected to the condensation area 213, and the gaseous cooling medium enters the condensation area 213 and cools down to change phase into liquid, flowing into the liquid storage part 211; the liquid storage chamber 21 is below the motherboard 23, and is filled with cooling medium, and the liquid cooling microtube 14 is immersed in the liquid storage chamber 21 to take liquid; The condensation zone 213 connects the gas storage zone 241 and the liquid storage chamber 21. Cooling methods such as installing fans, heat-conducting fins, and attaching cold plates are used on the outside of the condensation zone 213 to cool the gas and induce a phase change. Heat transfer can also be enhanced within the condensation zone 213 through fins and capillary structures. The liquid level in the condensation zone 213 ensures that the liquid level is not lower than the upper edge of the electronic components 12 on the encapsulated circuit board 1 and not higher than the upper edge of the liquid-cooled microtube 14. Therefore, the siphon effect can be used to maintain sufficient liquid in the phase-change liquid-cooled microtube 14, preventing dry burning.

[0086] This heat dissipation system has the following beneficial effects:

[0087] 1. High-efficiency heat dissipation: By deploying phase change liquid cooling microtubes 14 inside the packaged circuit board 1, heat is directly removed from the electronic components 12, improving heat dissipation efficiency; compared with the cold plate liquid cooling solution, it eliminates the need for multiple layers of thermal interface materials and complex thermal interface contact, greatly reducing thermal resistance.

[0088] 2. Circulating heat dissipation system: Through the interconnected design of the gas storage area 241, the condensation area 213, and the liquid storage chamber 21, a phase change heat dissipation circulation system is formed in the sealed chassis, ensuring continuous and effective heat dissipation; by precisely controlling the liquid filling volume and the capillary structure in the microchannel, an enhanced siphon effect is achieved, ensuring the continuous flow of liquid in the liquid-cooled microtube 14 and avoiding the risk of dry burning.

[0089] 3. Space utilization: The liquid-cooled microtube 14 penetrates the motherboard 23 and extends to the liquid supply section 212, which optimizes the space layout and improves the overall compactness of the design. Compared with the cold plate solution of related technologies, it saves the thickness space occupied by the cold plate and its mounting structure, and compresses the thickness space of the components formed by the motherboard 23 and the packaged circuit board 1 to the extreme. This is conducive to the deployment of high-density systems.

[0090] 4. Packaging Design: The orthogonal layout of the high-speed signal and the liquid-cooled microtube 14 in the packaging circuit board 1 ensures the integration of the package and the signal transmission efficiency.

[0091] 5. Unobstructed gas rising channel: The lower surface of the gas storage area 241 is inclined towards the condensation area 213, which accelerates the liquid discharge speed, prevents liquid from dripping back onto the main board 23, and keeps the gas rising channel unobstructed.

[0092] 6. Mainboard 23 is easy to maintain: The gas storage area 241 uses a waterproof and breathable membrane material to ensure that the condensed liquid will not drip back into the mainboard 23; compared with the immersion liquid cooling solution, the mainboard 23 does not directly contact the liquid, keeps it dry, and does not need to handle the liquid before maintenance, reducing maintenance needs and potential failure risks.

[0093] 7. High reliability: In this solution, the motherboard 23 does not need to come into contact with liquid, which improves the reliability of liquid cooling technology. In contrast, in general immersion liquid cooling solutions, electronic devices may corrode when immersed in the cooling medium for a long time, which may affect functionality and performance.

[0094] 8. Lightweight: No need to deploy a cold plate or heatsink, enabling a lightweight chassis design;

[0095] 9. Easy to implement in computer room: Liquid cooling can be achieved without deploying CDU (Coolant Distribution Unit), cooling medium, pipes, etc. in the computer room.

[0096] In addition to the aforementioned heat dissipation system, this application also provides an electronic device that includes the aforementioned heat dissipation system. For the structure of other parts of this electronic device, please refer to related technologies; details will not be repeated here.

[0097] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0098] The foregoing has provided a detailed description of the packaged circuit board and heat dissipation system provided in this application. Specific examples have been used to illustrate the principles and embodiments of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. A packaged circuit board, characterized in that, include: A substrate (11) on which electronic components (12) are mounted; A packaging component (13) is disposed on the substrate (11), and the electronic component (12) is located inside the packaging component (13); At least one liquid-cooled microtube (14) for carrying a heat dissipation medium is located within the encapsulation component (13) and extends from the inlet of the encapsulation component (13) to the outlet of the encapsulation component (13).

2. The packaged circuit board according to claim 1, characterized in that, The liquid-cooled microtube (14) is attached to the surface of the electronic component (12), and the liquid-cooled microtube (14) extends from one side of the electronic component (12) to the other side.

3. The packaged circuit board according to claim 2, characterized in that, The inlet of the encapsulation component (13) is located on the side of the encapsulation component (13) close to the substrate (11), and the substrate (11) is provided with a substrate clearance hole (111). The liquid cooling microtube (14) passes through the substrate clearance hole (111) and enters the inlet of the encapsulation component (13).

4. The packaged circuit board according to claim 1, characterized in that, The outlet of the encapsulation component (13) is located on the side of the encapsulation component (13) away from the substrate (11), and the liquid-cooled microtube (14) extends out of the outlet of the encapsulation component (13) and extends to the target height.

5. The packaged circuit board according to claim 1, characterized in that, The outer diameter of the liquid-cooled microtube (14) is 1-2 mm, and the wall thickness is 0.4-0.6 mm.

6. The packaged circuit board according to any one of claims 1 to 5, characterized in that, The liquid-cooled microtube (14) is provided with an inlet section (141), a cooling section (142) and an outlet section (143) from the first end to the second end. The extension directions of the inlet section (141) and the outlet section (143) are both perpendicular to the extension direction of the cooling section (142), and the cooling section (142) is arranged parallel to the surface of the electronic component (12).

7. The packaged circuit board according to claim 6, characterized in that, The substrate (11) and the motherboard (23) are connected by a high-speed signal pin (15) and a power signal pin (16). The high-speed signal pin (15) and the power signal pin (16) are arranged on the surface of the substrate (11) along a first direction. The liquid-cooled microtube (14) is arranged on the surface of the electronic component (12) along a second direction. The first direction is perpendicular to the second direction.

8. The packaged circuit board according to claim 1, characterized in that, When there are multiple liquid-cooled microtubes (14), the multiple liquid-cooled microtubes (14) are installed inside the encapsulation component (13) in a parallel arrangement; when there is only one liquid-cooled microtube (14), the liquid-cooled microtube (14) is installed inside the encapsulation component (13) in a circumferential manner.

9. A heat dissipation system, comprising a packaged circuit board (1), characterized in that, The encapsulated circuit board (1) is the encapsulated circuit board according to any one of claims 1 to 8.

10. The heat dissipation system according to claim 9, characterized in that, It also includes a chassis housing (2), which has a liquid storage chamber (21) for storing cooling medium and a circuit board mounting chamber (22) for mounting circuit boards. The chassis housing (2) has a motherboard (23) located between the liquid storage chamber (21) and the circuit board mounting chamber (22), and the packaged circuit board (1) is mounted on the motherboard (23). The motherboard (23) has a motherboard clearance hole (231), and the liquid cooling microtube (14) passes through the motherboard clearance hole (231) and communicates with the liquid storage chamber (21).

11. The heat dissipation system according to claim 10, characterized in that, The chassis housing (2) includes a chassis shell (201), a cover plate (202) and a partition plate (203). The partition plate (203) is installed inside the chassis shell (201), and the liquid storage chamber (21) is formed between the partition plate (203) and the side wall of the chassis shell (201) and between the motherboard (23) and the bottom plate of the chassis shell (201).

12. The heat dissipation system according to claim 11, characterized in that, The liquid storage chamber (21) includes a liquid storage part (211) and a liquid supply part (212) that are connected to each other. The liquid storage part (211) is located on the side of the main board (23), and the liquid supply part (212) is located at the bottom of the main board (23). The liquid level of the liquid storage part (211) is higher than that of the liquid supply part (212).

13. The heat dissipation system according to claim 12, characterized in that, The top of the circuit board mounting chamber (22) is also provided with a flow guide (24). The cooling medium is a two-phase cooling medium. The outlet of the liquid cooling microtube (14) faces the flow guide (24). The flow guide (24) is used to supply the liquefied cooling medium to flow into the liquid storage chamber (21).

14. The heat dissipation system according to claim 13, characterized in that, The cover plate (202) is detachably connected to the chassis shell (201); and / or, the flow guide (24) is detachably connected to the chassis shell (201).

15. The heat dissipation system according to claim 13, characterized in that, The upper part of the flow guide (24) forms a gas storage area (241), and the flow guide (24) is a waterproof and breathable membrane component; the flow guide (24) is inclined downward from the side away from the liquid storage part (211) to the side close to the liquid storage part (211).

16. The heat dissipation system according to claim 15, characterized in that, The waterproof and breathable membrane component is a polymer material membrane component.

17. The heat dissipation system according to claim 15, characterized in that, The angle of inclination of the flow guide component (24) relative to the horizontal direction is 10° to 60°.

18. The heat dissipation system according to claim 12, characterized in that, The upper part of the liquid storage section (211) is provided with a condensation zone (213), and the outer side of the chassis shell (2) is provided with a cooling fan (214), heat-conducting fins (215) and / or a heat dissipation plate (216) at the position corresponding to the condensation zone (213).

19. The heat dissipation system according to claim 18, characterized in that, The condensation zone (213) is provided with heat dissipation fins (217) and / or capillary heat dissipation components (218) to allow the vaporized cooling medium to liquefy and flow into the liquid storage section (211).

20. The heat dissipation system according to claim 18, characterized in that, The liquid level of the liquid storage section (211) is higher than the height of the electronic component (12) and lower than the height of the outlet port of the liquid-cooled microtube (14).

21. The heat dissipation system according to claim 12, characterized in that, The liquid storage section (211) is also provided with a liquid level sensor (219), which is used to obtain the liquid level height of the liquid storage section (211).

22. The heat dissipation system according to claim 10, characterized in that, The chassis housing (2) is also provided with a protective plate (25), which is located between the main board (23) and the liquid storage chamber (21).

23. An electronic device, comprising a heat dissipation system, characterized in that, The heat dissipation system is the heat dissipation system according to any one of claims 9 to 22.

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