Electronic device and electronic unit

Abstract

This electronic device comprises: a first heat dissipation group and a second heat dissipation group each including a plurality of electronic elements and arranged in a first direction; and a heat dissipation module having a first fin group and a second fin group each including a plurality of fins. The first fin group is arranged corresponding to the first heat dissipation group, and the second fin group is arranged corresponding to the second heat dissipation group.

Description

Electronic device and electronic unit

[0001] The present disclosure relates to an electronic device and an electronic unit.

[0002] Conventionally, electronic devices including power switching elements such as MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) and IGBTs (Insulated Gate Bipolar Transistors) are known. Such electronic devices are mounted in all electronic devices from industrial equipment to home appliances, information terminals, and automotive equipment. Patent Document 1 discloses a conventional electronic device (power module). The electronic device described in Patent Document 1 includes a semiconductor element and a support substrate (ceramic substrate). The semiconductor element is, for example, an IGBT made of Si (silicon). The support substrate supports the semiconductor element. The support substrate includes an insulating base material and conductor layers laminated on both surfaces of the base material. The base material is made of, for example, ceramic. Each conductor layer is made of, for example, Cu (copper), and a semiconductor element is joined to one of the conductor layers. The semiconductor element is covered with, for example, a sealing resin.

[0003] Japanese Patent Application Laid-Open No. 2021-190505

[0004] [Summary] When the electronic device operates, the semiconductor element generates heat. In order for the electronic device to operate properly, it is preferable to quickly dissipate the heat from the semiconductor element to the outside.

[0005] One problem of the present disclosure is to provide an electronic device and an electronic unit that have been improved from the prior art. In particular, in view of the above circumstances, one problem of the present disclosure is to provide an electronic device and an electronic unit capable of improving heat dissipation.

[0006] The electronic device provided by the first aspect of the present disclosure includes a first heat dissipation group and a second heat dissipation group each including a plurality of electronic elements and arranged in a first direction, and a first fin group and a second fin group each including a plurality of fins. The first fin group is arranged corresponding to the first heat dissipation group. The second fin group is arranged corresponding to the second heat dissipation group.

[0007] An electronic unit provided by a second aspect of this disclosure comprises an electronic device provided by a first aspect of this disclosure and a cooling device having a housing for housing the first fin group and the second fin group, a supply unit for supplying a cooling medium to the housing, and a discharge unit for discharging the cooling medium from the housing.

[0008] Other features and advantages of this disclosure will become more apparent from the detailed description below, with reference to the accompanying drawings.

[0009] Figure 1 is a perspective view showing an electronic device according to the first embodiment of the present disclosure. Figure 2 is a perspective view showing an electronic device according to the first embodiment of the present disclosure. Figure 3 is a partial perspective view showing an electronic device according to the first embodiment of the present disclosure. Figure 4 is a plan view showing an electronic device according to the first embodiment of the present disclosure. Figure 5 is a partial plan view showing an electronic device according to the first embodiment of the present disclosure. Figure 6 is a partial side view showing an electronic device according to the first embodiment of the present disclosure. Figure 7 is a partially enlarged plan view showing an electronic device according to the first embodiment of the present disclosure. Figure 8 is a partial plan view showing an electronic device according to the first embodiment of the present disclosure. Figure 9 is a partial plan view showing an electronic device according to the first embodiment of the present disclosure. Figure 10 is a side view showing an electronic device according to the first embodiment of the present disclosure. Figure 11 is a front view showing an electronic device according to the first embodiment of the present disclosure. Figure 12 is a bottom view showing an electronic device according to the first embodiment of the present disclosure. Figure 13 is a cross-sectional view along the line XIII-XIII in Figure 5. Figure 14 is a cross-sectional view along the line XIV-XIV in Figure 5. Figure 15 is a partially enlarged cross-sectional view showing an electronic device according to the first embodiment of the present disclosure. Figure 16 is a partially enlarged cross-sectional view showing an electronic device according to the first embodiment of the present disclosure. Figure 17 is a cross-sectional view along the line XVII-XVII in Figure 5. Figure 18 is a cross-sectional view along the line XVIII-XVIII in Figure 5. Figure 19 is a cross-sectional view along the line XIX-XIX in Figure 5. Figure 20 is a cross-sectional view along the line XX-XX in Figure 5. Figure 21 is a cross-sectional view along the line XXI-XXI in Figure 5. Figure 22 is a perspective view showing an electronic unit according to the first embodiment of the present disclosure. Figure 23 is a plan view showing an electronic unit according to the first embodiment of the present disclosure. Figure 24 is a partial plan view showing an electronic unit according to the first embodiment of the present disclosure. Figure 25 is a cross-sectional view along the line XXV-XXV in Figure 24. Figure 26 is a cross-sectional view along the line XXVI-XXVI in Figure 24. Figure 27 is a perspective view showing an electronic device according to the second embodiment of this disclosure. Figure 28 is a plan view showing an electronic device according to the second embodiment of this disclosure. Figure 29 is a plan view showing a first modified example of the electronic device according to the second embodiment of this disclosure. Figure 30 is a perspective view showing an electronic device according to the third embodiment of this disclosure. Figure 31 is a plan view showing an electronic device according to the third embodiment of this disclosure.Figure 32 is a perspective view showing an electronic device according to the fourth embodiment of this disclosure. Figure 33 is a plan view showing an electronic device according to the fourth embodiment of this disclosure. Figure 34 is a perspective view showing an electronic device according to the fifth embodiment of this disclosure.

[0010] [Detailed Description] Preferred embodiments of this disclosure will be described below with reference to the drawings.

[0011] The terms "first," "second," "third," etc., used in this disclosure are for identification purposes only and are not intended to assign any order to the objects.

[0012] In this disclosure, "object A is formed on object B" and "object A is formed on object B" include, unless otherwise specified, "object A is directly formed on object B" and "object A is formed on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" and "object A is located on object B" include, unless otherwise specified, "object A is directly located on object B" and "object A is located on object B with another object interposed between object A and object B." Similarly, "object A is located on object B" includes, unless otherwise specified, "object A is located on object B in contact with object B" and "object A is located on object B with another object interposed between object A and object B." Furthermore, unless otherwise specified, "object A overlaps with object B when viewed in a certain direction" includes "object A overlapping with all of object B" and "object A overlapping with a part of object B." Also, in this disclosure, "a surface A facing direction B (one or the other side of it)" is not limited to the case where the angle of surface A with respect to direction B is 90°, but also includes the case where surface A is inclined with respect to direction B.

[0013] First Embodiment: Figures 1 to 26 show an electronic device and an electronic unit according to the first embodiment of the present disclosure. The electronic device A1 of this embodiment comprises a first heat dissipation group 1A and a second heat dissipation group 1B, and a heat dissipation module 2. The electronic device A1 may also comprise an electronic module B1 including the first heat dissipation group 1A and the second heat dissipation group 1B. The electronic module B1 may comprise a plurality of first electronic elements 10A, a plurality of second electronic elements 10B, a heat dissipation module 2, a support substrate 3, a first terminal 41, a second terminal 42, a plurality of third terminals 43, a fourth terminal 44, a plurality of control terminals 45, a control terminal support 48, a first conductive member 5, a second conductive member 6, and a sealing resin 8.

[0014] Figure 1 is a perspective view showing electronic device A1. Figure 2 is a perspective view showing electronic device A1. Figure 3 is a partial perspective view showing electronic device A1. Figure 4 is a plan view showing electronic device A1. Figure 5 is a partial plan view showing electronic device A1. Figure 6 is a partial side view showing electronic device A1. Figure 7 is a partially enlarged plan view showing electronic device A1. Figure 8 is a partial plan view showing electronic device A1. Figure 9 is a partial plan view showing electronic device A1. Figure 10 is a side view showing electronic device A1. Figure 11 is a front view showing electronic device A1. Figure 12 is a bottom view showing electronic device A1. Figure 13 is a cross-sectional view along line XIII-XIII in Figure 5. Figure 14 is a cross-sectional view along line XIV-XIV in Figure 5. Figure 15 is a partially enlarged cross-sectional view showing electronic device A1. Figure 16 is a partially enlarged cross-sectional view showing electronic device A1. Figure 17 is a cross-sectional view along line XVII-XVII in Figure 5. Figure 18 is a cross-sectional view along the line XVIII-XVIII in Figure 5. Figure 19 is a cross-sectional view along the line XIX-XIX in Figure 5. Figure 20 is a cross-sectional view along the line XX-XX in Figure 5. Figure 21 is a cross-sectional view along the line XXI-XXI in Figure 5. Figure 22 is a perspective view showing the electronic unit C1. Figure 23 is a plan view showing the electronic unit C1. Figure 24 is a partial plan view showing the electronic unit C1. Figure 25 is a cross-sectional view along the line XXV-XXV in Figure 24. Figure 26 is a cross-sectional view along the line XXVI-XXVI in Figure 24.

[0015] In these diagrams, for example, one side of the first direction x is referred to as the x1 side of the first direction x, and the other side of the first direction x is referred to as the x2 side of the first direction x. Also, for example, one side of the second direction y is referred to as the y1 side of the second direction y, and the other side of the second direction y is referred to as the y2 side of the second direction y. Also, for example, one side of the thickness direction z is referred to as the z1 side of the thickness direction z, and the other side of the thickness direction z is referred to as the z2 side of the thickness direction z.

[0016] Each of the multiple first electronic elements 10A and each of the multiple second electronic elements 10B are electronic components that form the functional core of the electronic module B1. The first heat dissipation group 1A of this embodiment includes a plurality of first electronic elements 10A. The second heat dissipation group 1B of this embodiment includes a plurality of second electronic elements 10B. The specific configuration of each first electronic element 10A and each second electronic element 10B is not limited in any way. Each first electronic element 10A and each second electronic element 10B may be, for example, a semiconductor element, a metal element, an alloy element, etc., and may be an active element or a passive element. In this embodiment, each first electronic element 10A and each second electronic element 10B may be, for example, a semiconductor element. The constituent material of each first electronic element 10A and each second electronic element 10B is, for example, a semiconductor material mainly composed of SiC (silicon carbide). This semiconductor material is not limited to SiC, and may be Si (silicon), GaN (gallium nitride), or C (diamond), etc. Each first electronic element 10A and each second electronic element 10B are, for example, power semiconductor chips having a switching function, such as MOSFETs (Metal Oxide Semiconductor Field Effect Transistors). In this embodiment, the case where the first electronic element 10A and the second electronic element 10B are MOSFETs is shown, but it is not limited to this, and other transistors such as IGBTs (Insulated Gate Bipolar Transistors) may also be used. Each first electronic element 10A and each second electronic element 10B are the same element. Each first electronic element 10A and each second electronic element 10B are, for example, n-channel type MOSFETs, but they may also be p-channel type MOSFETs.

[0017] As shown in Figures 15 and 16, the first electronic element 10A and the second electronic element 10B each have a main element surface 101 and a back element surface 102. In each first electronic element 10A and each second electronic element 10B, the main element surface 101 and the back element surface 102 are separated in the thickness direction z. The main element surface 101 faces the z1 side in the thickness direction z, and the back element surface 102 faces the z2 side in the thickness direction z.

[0018] In this embodiment, the electronic module B1 comprises four first electronic elements 10A and four second electronic elements 10B. However, the number of first electronic elements 10A and the number of second electronic elements 10B are not limited to this configuration and can be appropriately changed according to the performance required of the electronic module B1. In the example shown in Figures 8 and 9, four first electronic elements 10A and four second electronic elements 10B are arranged. The number of first electronic elements 10A and two second electronic elements 10B may be two or three, or five or more. The number of first electronic elements 10A and two second electronic elements 10B may be equal or different. The number of first electronic elements 10A and two second electronic elements 10B is determined by the current capacity handled by the electronic module B1.

[0019] The electronic module B1 is configured, for example, as a half-bridge type switching circuit. In this case, a plurality of first electronic elements 10A constitute the upper arm circuit of the electronic module B1, and a plurality of second electronic elements 10B constitute the lower arm circuit. In the upper arm circuit, the plurality of first electronic elements 10A are connected in parallel with each other, and in the lower arm circuit, the plurality of second electronic elements 10B are connected in parallel with each other. Each first electronic element 10A and each second electronic element 10B are connected in series to form a bridge layer.

[0020] Each of the multiple first electronic elements 10A is mounted on a first conductive portion 32A of a support substrate 3, which will be described later, as shown in Figures 8, 9, and 20. In the example shown in Figures 8 and 9, the multiple first electronic elements 10A are arranged, for example, in a second direction y, and spaced apart from each other. Each first electronic element 10A is electrically connected to the first conductive portion 32A via a first conductive bonding material 19A. When each first electronic element 10A is connected to the first conductive portion 32A, the back surface 102 of the element faces the first conductive portion 32A. In contrast to this embodiment, the multiple first electronic elements 10A may be mounted on a metal member different from a part of the DBC substrate, etc. In this case, the metal member corresponds to the first conductive portion in this disclosure. This metal member may be supported, for example, by the first conductive portion 32A.

[0021] Each of the multiple second electronic elements 10B is mounted on the second conductive portion 32B of the support substrate 3, which will be described later, as shown in Figures 8, 9, and 19. In the example shown in Figures 8 and 9, the multiple second electronic elements 10B are arranged, for example, in the second direction y, and are spaced apart from each other. Each second electronic element 10B is electrically connected to the second conductive portion 32B via the second conductive bonding material 19B. When each second electronic element 10B is connected to the second conductive portion 32B, the back surface 102 of the element faces the second conductive portion 32B. As can be seen from Figure 9, when viewed in the first direction x, the multiple first electronic elements 10A and the multiple second electronic elements 10B overlap, but do not have to overlap. In contrast to this embodiment, the multiple second electronic elements 10B may be mounted on a metal member different from a part of the DBC substrate, etc. In this case, the metal member corresponds to the second conductive portion in this disclosure. This metal member may be supported, for example, by the second conductive portion 32B.

[0022] Each of the multiple first electronic elements 10A and multiple second electronic elements 10B has a first main surface electrode 11, a second main surface electrode 12, a third main surface electrode 13, and a back surface electrode 15. The configurations of the first main surface electrode 11, the second main surface electrode 12, the third main surface electrode 13, and the back surface electrode 15, as described below, are common to each of the first electronic elements 10A and each of the second electronic elements 10B. The first main surface electrode 11, the second main surface electrode 12, and the third main surface electrode 13 are provided on the main surface 101 of the element. The first main surface electrode 11, the second main surface electrode 12, and the third main surface electrode 13 are insulated by an insulating film (not shown). The back surface electrode 15 is provided on the back surface 102 of the element.

[0023] The first main surface electrode 11 is, for example, a gate electrode, to which a drive signal (for example, a gate voltage) for driving the first electronic element 10A (second electronic element 10B) is input. In the first electronic element 10A (second electronic element 10B), the second main surface electrode 12 is, for example, a source electrode, through which a source current flows. The second main surface electrode 12 in this embodiment has a gate finger 121. The gate finger 121 is, for example, made of a linear insulator extending in a first direction x, and divides the second main surface electrode 12 into two in a second direction y. The third main surface electrode 13 is, for example, a source sense electrode, through which a source current flows. The back surface electrode 15 is, for example, a drain electrode, through which a drain current flows. The back surface electrode 15 covers substantially the entire back surface 102 of the element. The back surface electrode 15 is, for example, made of Ag (silver) plating.

[0024] Each first electronic element 10A (each second electronic element 10B) switches between a conduction state and an interrupted state in response to a drive signal (gate voltage) input to the first main surface electrode 11 (gate electrode). In the conduction state, current flows from the back surface electrode 15 (drain electrode) to the second main surface electrode 12 (source electrode), and in the interrupted state, this current does not flow. In other words, each first electronic element 10A (each second electronic element 10B) performs a switching operation. The electronic module B1, through the switching function of the multiple first electronic elements 10A and multiple second electronic elements 10B, converts the DC voltage input between one fourth terminal 44 and two first terminals 41 and second terminals 42 into, for example, an AC voltage, and outputs the AC voltage from the third terminal 43.

[0025] Electronic module B1 may include a thermistor 17, as shown in Figures 5, 8, and 9. The thermistor 17 is used as a temperature detection sensor. In addition to the thermistor 17, the module may also include, for example, a temperature-sensitive diode, or it may not include the thermistor 17 at all.

[0026] The support substrate 3 supports a plurality of first electronic elements 10A and a plurality of second electronic elements 10B. The specific configuration of the support substrate 3 is not limited in any way and may consist of, for example, a DBC (Direct Bonded Copper) substrate or an AMB (Active Metal Brazing) substrate. The support substrate 3 includes an insulating layer 31, a first metal layer 32, and a back metal layer 33. The first metal layer 32 includes a first conductive portion 32A and a second conductive portion 32B. The dimension of the support substrate 3 in the thickness direction z is, for example, 0.4 mm or more and 3.0 mm or less.

[0027] The insulating layer 31 is, for example, a ceramic with excellent thermal conductivity. Such a ceramic is, for example, SiN (silicon nitride). The insulating layer 31 is not limited to ceramics; it may also be an insulating resin sheet or the like. The insulating layer 31 is, for example, rectangular in plan view. The dimension of the insulating layer 31 in the thickness direction z is, for example, 0.05 mm or more and 1.0 mm or less.

[0028] The first conductive portion 32A supports a plurality of first electronic elements 10A, and the second conductive portion 32B supports a plurality of second electronic elements 10B. The first conductive portion 32A and the second conductive portion 32B are formed on the upper surface (the surface facing the z1 side in the thickness direction z) of the insulating layer 31. The constituent material of the first conductive portion 32A and the second conductive portion 32B includes, for example, Cu (copper). The constituent material may also include, for example, Al (aluminum) other than Cu (copper). The first conductive portion 32A and the second conductive portion 32B are separated in a first direction x. The first conductive portion 32A is located on the x1 side in the first direction x of the second conductive portion 32B. The first conductive portion 32A and the second conductive portion 32B are each, for example, rectangular in plan view. The first conductive portion 32A and the second conductive portion 32B, together with the first conductive member 5 and the second conductive member 6, constitute a path for the main circuit current that is switched by a plurality of first electronic elements 10A and a plurality of second electronic elements 10B.

[0029] The first conductive portion 32A has a first main surface 301A. The first main surface 301A is a plane facing the z1 side in the thickness direction z. Multiple first electronic elements 10A are bonded to the first main surface 301A of the first conductive portion 32A via a first conductive bonding material 19A. The second conductive portion 32B has a second main surface 301B. The second main surface 301B is a plane facing the z1 side in the thickness direction z. Multiple second electronic elements 10B are bonded to the second main surface 301B of the second conductive portion 32B via a second conductive bonding material 19B. The constituent materials of the first conductive bonding material 19A and the second conductive bonding material 19B are not particularly limited and include, for example, solder, a metal paste material containing a metal such as Ag (silver), or a sintered metal containing a metal such as Ag (silver). The dimension in the thickness direction z of the first conductive portion 32A and the second conductive portion 32B is, for example, 0.1 mm or more and 1.5 mm or less.

[0030] The back metal layer 33 is formed on the lower surface of the insulating layer 31 (the surface facing the z2 side in the thickness direction z). The constituent material of the back metal layer 33 is the same as the constituent material of the first metal layer 32. The back metal layer 33 has a back surface 302. The back surface 302 is a plane facing the z2 side in the thickness direction z. The back surface 302 is exposed from the sealing resin 8. In a plan view, the back metal layer 33 overlaps the first conductive portion 32A and the second conductive portion 32B.

[0031] As shown in Figures 2, 6, 10-14, 17-21, and 24-26, the heat dissipation module 2 is positioned on the back surface 302 of the back metal layer 33 of the support substrate 3. The material of the heat dissipation module 2 is not limited in any way, and is formed using, for example, a metal plate material. This metal plate material includes, for example, metals such as Cu (copper), Al (aluminum), stainless steel, or alloys thereof. The method of positioning the heat dissipation module 2 on the back surface 302 is not limited in any way. The heat dissipation module 2 may be positioned on the back surface 302 by, for example, various welding methods including laser welding, various joining materials including solder or silver paste, or solid-phase diffusion bonding. The heat dissipation module 2 includes a first fin group 2A and a second fin group 2B.

[0032] The first fin group 2A includes a plurality of first fins 21A. Each of the plurality of first fins 21A is oriented along a first direction x and protrudes towards the z2 side in the thickness direction z. In addition to being shaped along the first direction x, each of the plurality of first fins 21A may have a curved shape, a bent shape, etc. when viewed in the thickness direction z. The plurality of first fins 21A are arranged in the second direction y at intervals. The first fin group 2A in this embodiment may include a first base 20A. The first base 20A is a plate-shaped portion oriented along the first direction x and the second direction y. The plurality of first fins 21A may be connected to the first base 20A. In this embodiment, the first base 20A may be joined to the back surface 302.

[0033] The second fin group 2B includes a plurality of second fins 21B. Each of the plurality of second fins 21B is oriented along the first direction x and protrudes towards the z2 side in the thickness direction z. In addition to being oriented along the first direction x, each of the plurality of second fins 21B may have a curved shape, a bent shape, etc. when viewed in the thickness direction z. The plurality of second fins 21B are arranged in the second direction y at intervals. The second fin group 2B in this embodiment may include a second base portion 20B. The second base portion 20B is a plate-like portion oriented along the first direction x and the second direction y. The plurality of second fins 21B may be connected to the second base portion 20B. In this embodiment, the second base portion 20B may be joined to the back surface 302.

[0034] The first fin group 2A is arranged in correspondence with the first heat dissipation group 1A. The arrangement of the first fin group 2A in correspondence with the first heat dissipation group 1A means that the heat generated from the first heat dissipation group 1A is primarily dissipated by the first fin group 2A. For example, the first fin group 2A may overlap with the first heat dissipation group 1A when viewed in the thickness direction z. In this example, the first fin group 2A may overlap with all of the first electronic elements 10A that constitute the first heat dissipation group 1A when viewed in the thickness direction z.

[0035] The second fin group 2B is arranged in correspondence with the second heat dissipation group 1B. The arrangement of the second fin group 2B in correspondence with the second heat dissipation group 1B means that the heat generated from the second heat dissipation group 1B is primarily dissipated by the second fin group 2B. For example, the second fin group 2B may overlap with the second heat dissipation group 1B when viewed in the thickness direction z. In this example, the second fin group 2B may overlap with all of the multiple second electronic elements 10B that constitute the second heat dissipation group 1B when viewed in the thickness direction z.

[0036] The first fin group 2A and the second fin group 2B are arranged side by side in the first direction x, corresponding to the arrangement of the first heat dissipation group 1A and the second heat dissipation group 1B. The first fin group 2A and the second fin group 2B may be in contact with each other or may be separated from each other. In this example, the first fin group 2A and the second fin group 2B are either in contact with each other or adjacent with a small gap that is considered to be substantially in contact with each other.

[0037] The arrangement pitch of the multiple first fins 21A in the second direction y is the first pitch p1, and the arrangement pitch of the multiple second fins 21B in the second direction y is the second pitch p2. The first pitch p1 and the second pitch p2 may be the same or different. In this example, the first pitch p1 and the second pitch p2 are substantially the same. Substantially the same means that they include differences that may inevitably be present, such as manufacturing tolerances.

[0038] The space between two adjacent first fins 21A can become a flow path for a cooling medium flowing in a first direction x, for example. The distance between two adjacent first fins 21A is the first flow path width w1, and the distance between two adjacent second fins 21B is the second flow path width w2. The first flow path width w1 and the second flow path width w2 may be the same or different. In this example, the first flow path width w1 and the second flow path width w2 are substantially the same.

[0039] The space between two adjacent second fins 21B can, for example, become a flow path for a cooling medium flowing in the first direction x. One first fin 21A included in the plurality of first fins 21A and the second fin 21B closest to one of the plurality of second fins 21B may or may not be in the same position in the second direction y. That is, any of the plurality of first fins 21A and any of the plurality of second fins 21B may be in the same position in the second direction y. In this example, all of the plurality of first fins 21A and all of the plurality of second fins 21B are substantially in the same position in the second direction y.

[0040] The first terminal 41, the second terminal 42, the multiple third terminals 43, and the fourth terminal 44 may each be made of, for example, a plate-shaped metal plate. This metal plate may contain, for example, Cu (copper) or a Cu (copper) alloy. In the examples shown in Figures 1 to 5, 8, 9, and 12, the electronic module B1 has one first terminal 41, one second terminal 42, one fourth terminal 44, and two third terminals 43, but the number of each terminal is not limited in any way.

[0041] The first terminal 41, the second terminal 42, and the fourth terminal 44 receive a DC voltage to be converted. The fourth terminal 44 is the positive terminal (P terminal), and the first terminal 41 and the second terminal 42 are each the negative terminals (N terminals). Multiple third terminals 43 output AC voltages converted by the first electronic element 10A and the second electronic element 10B. The first terminal 41, the second terminal 42, the multiple third terminals 43, and the fourth terminal 44 each include a portion covered by the sealing resin 8 and a portion exposed from the sealing resin 8.

[0042] As shown in Figure 14, the fourth terminal 44 is electrically connected to the first conductive portion 32A. The method of electrical connection is not limited in any way, and methods such as ultrasonic bonding, laser bonding, welding, or methods using solder, metal paste, silver sintered body, etc., can be used as appropriate. As shown in Figures 8 and 9, the fourth terminal 44 is located on the x1 side of the first direction x with respect to the plurality of first electronic elements 10A and the first conductive portion 32A. The fourth terminal 44 is electrically connected to the first conductive portion 32A and is electrically connected to the back electrode 15 (drain electrode) of each first electronic element 10A via the first conductive portion 32A.

[0043] The first terminal 41 and the second terminal 42 are electrically connected to the second conductive member 6. In this embodiment, the first terminal 41 and the second conductive member 6 are integrally formed. The integral formation of the first terminal 41 and the second conductive member 6 means that they are formed, for example, by cutting and bending a single metal plate material, and do not include any joining materials for joining them together. Also in this embodiment, the second terminal 42 and the second conductive member 6 are integrally formed. Note that the first terminal 41 and the second terminal 42 only need to be configured to be electrically connected to the second conductive member 6, and unlike this embodiment, they may have a configuration in which they are joined together. As shown in Figures 5 and 8, the first terminal 41 and the second terminal 42 are located on the x1 side of the first direction x with respect to the plurality of first electronic elements 10A and the first conductive part 32A. The first terminal 41 and the second terminal 42 are electrically connected to the second conductive member 6, and are electrically connected to the second main surface electrode 12 (source electrode) of each second electronic element 10B via the second conductive member 6.

[0044] As shown in FIGS. 1 to 5 and FIG. 12, etc., the first terminal 41, the second terminal 42, and the fourth terminal 44 each protrude from the sealing resin 8 to the x1 side in the first direction x in the electronic module B1. The first terminal 41, the second terminal 42, and the fourth terminal 44 are spaced apart from each other. The first terminal 41 and the second terminal 42 are located on opposite sides of each other with the fourth terminal 44 interposed therebetween in the second direction y. The first terminal 41 is located on the y1 side in the second direction y of the fourth terminal 44, and the second terminal 42 is located on the y2 side in the second direction y of the fourth terminal 44. The first terminal 41, the second terminal 42, and the fourth terminal 44 overlap each other when viewed in the second direction y.

[0045] As can be understood from FIGS. 8, 9, and 13, the two third terminals 43 are each conductively joined to the second conductive portion 32B. The method of conductive joining is not limited in any way, and methods such as ultrasonic joining, laser joining, welding, etc., or methods using solder, metal paste, silver sintered body, etc., are appropriately adopted. As shown in FIG. 8, etc., the two third terminals 43 are each located on the x2 side in the first direction x with respect to the plurality of second electronic elements 10B and the second conductive portion 32B. Each third terminal 43 is electrically connected to the second conductive portion 32B and, via the second conductive portion 32B, is electrically connected to the back electrode 15 (drain electrode) of each second electronic element 10B. Note that the number of the third terminals 43 is not limited to two, and for example, it may be one, or three or more. For example, when there is one third terminal 43, it is desirable that it is connected to the central portion in the second direction y of the second conductive portion 32B.

[0046] The plurality of control terminals 45 are each terminals for controlling each first electronic element 10A and each second electronic element 10B, and may be, for example, pin-shaped terminals. The plurality of control terminals 45 includes a plurality of first control terminals 46A to 46E and a plurality of second control terminals 47A to 47D. The plurality of first control terminals 46A to 46E are used for controlling each first electronic element 10A, etc. The plurality of second control terminals 47A to 47D are used for controlling each second electronic element 10B, etc.

[0047] The plurality of first control terminals 46A to 46E are arranged at intervals in the second direction y. As shown in FIGS. 8, 14, 21, etc., each of the first control terminals 46A to 46E is supported by the first conductive portion 32A via a control terminal support 48 (a first support portion 48A described later). As shown in FIGS. 5 and 8, each of the first control terminals 46A to 46E is located between the plurality of first electronic elements 10A and the first terminal 41, the second terminal 42, and the fourth terminal 44 in the first direction x.

[0048] The first control terminal 46A is a terminal (gate terminal) for inputting a drive signal to the plurality of first electronic elements 10A. A drive signal for driving the plurality of first electronic elements 10A (for example, a gate voltage is applied) is input to the first control terminal 46A.

[0049] The first control terminal 46B is a terminal (source sense terminal) for detecting a source signal of the plurality of first electronic elements 10A. A voltage (a voltage corresponding to the source current) applied to each of the second main surface electrodes 12 (source electrodes) of the plurality of first electronic elements 10A is detected from the first control terminal 46B. <N

[0050] The first control terminal 46C and the first control terminal 46D are terminals that conduct to the thermistor 17.

[0051] The first control terminal 46E is a terminal (drain sense terminal) for detecting a drain signal of the plurality of first electronic elements 10A. A voltage (a voltage corresponding to the drain current) applied to each of the back surface electrodes 15 (drain electrodes) of the plurality of first electronic elements 10A is detected from the first control terminal 46E.

[0052] The plurality of second control terminals 47A to 47D are arranged at intervals in the second direction y. As shown in FIGS. 8 and 14, etc., each of the second control terminals 47A to 47D is supported by the second conductive portion 32B via a control terminal support 48 (a second support portion 48B described later). As shown in FIGS. 5 and 8, each of the second control terminals 47A to 47D is located between the plurality of second electronic elements 10B and the two third terminals 43 in the first direction x.

[0053] The second control terminal 47A is a terminal (gate terminal) for inputting drive signals to the multiple second electronic elements 10B. Drive signals for driving the multiple second electronic elements 10B are input to the second control terminal 47A (for example, a gate voltage is applied). The second control terminal 47B is a terminal (source sense terminal) for detecting the source signals of the multiple second electronic elements 10B. The voltage applied to each second main surface electrode 12 (source electrode) of the multiple second electronic elements 10B (voltage corresponding to the source current) is detected from the second control terminal 47B. The second control terminals 47C and 47D are terminals that conduct to the thermistor 17.

[0054] Each of the control terminals 45 (a plurality of first control terminals 46A to 46E and a plurality of second control terminals 47A to 47D) includes a holder 451 and a metal pin 452.

[0055] The holder 451 is made of a conductive material. As shown in Figures 15 and 16, the holder 451 is joined to the control terminal support 48 (the first metal layer 482 described later) via a conductive bonding material 459. The holder 451 includes a cylindrical portion, an upper flange portion, and a lower flange portion. The upper flange portion connects to the upper part of the cylindrical portion, and the lower flange portion connects to the lower part of the cylindrical portion. A metal pin 452 is inserted through at least the upper flange portion and the cylindrical portion of the holder 451. The holder 451 may be covered with a sealing resin 8.

[0056] The metal pin 452 is a rod-shaped member extending in the thickness direction z. The metal pin 452 is supported by being press-fitted into the holder 451. The metal pin 452 is electrically connected to the control terminal support 48 (the first metal layer 482 described later) at least via the holder 451. As shown in the examples in Figures 15 and 16, when the lower end of the metal pin 452 (the end on the z2 side in the thickness direction z) is in contact with the conductive bonding material 459 within the insertion hole of the holder 451, the metal pin 452 is electrically connected to the control terminal support 48 via the conductive bonding material 459.

[0057] The control terminal support 48 supports a plurality of control terminals 45. The control terminal support 48 is interposed between the first main surface 301A and the second main surface 301B and the plurality of control terminals 45 in the thickness direction z.

[0058] The control terminal support 48 includes a first support portion 48A and a second support portion 48B. The first support portion 48A is positioned on the first conductive portion 32A and supports a plurality of first control terminals 46A to 46E among the plurality of control terminals 45. As shown in Figure 15, the first support portion 48A is joined to the first conductive portion 32A via a bonding material 49. The bonding material 49 may be conductive or insulating, but solder, for example, is used. The second support portion 48B is positioned on the second conductive portion 32B and supports a plurality of second control terminals 47A to 47D among the plurality of control terminals 45. As shown in Figure 16, the second support portion 48B is joined to the second conductive portion 32B via a bonding material 49.

[0059] The control terminal support 48 (the first support portion 48A and the second support portion 48B, respectively) is made of, for example, a DBC (Direct Bonded Copper) substrate. The control terminal support 48 has an insulating layer 481, a first metal layer 482, and a second metal layer 483 that are stacked on top of each other.

[0060] The insulating layer 481 is made of, for example, ceramics. The insulating layer 481 is, for example, rectangular in plan view.

[0061] The first metal layer 482 is formed on the upper surface of the insulating layer 481, as shown in Figures 15 and 16. Each control terminal 45 is erected on the first metal layer 482. The first metal layer 482 includes, for example, Cu (copper) or a Cu (copper) alloy. As shown in Figure 8, the first metal layer 482 includes a first portion 482A, a second portion 482B, a third portion 482C, a fourth portion 482D, a fifth portion 482E, and a sixth portion 482F. The first portion 482A, the second portion 482B, the third portion 482C, the fourth portion 482D, the fifth portion 482E, and the sixth portion 482F are separated from each other and insulated from each other.

[0062] The first portion 482A has multiple wires 71 joined to it, and each wire 71 provides electrical conductivity to the first main surface electrode 11 (gate electrode) of each first electronic element 10A (each second electronic element 10B). The first portion 482A and the sixth portion 482F are connected by multiple wires 73. As a result, the sixth portion 482F provides electrical conductivity to the first main surface electrode 11 (gate electrode) of each first electronic element 10A (each second electronic element 10B) via wires 73 and wires 71. As shown in Figure 8, the first control terminal 46A is joined to the sixth portion 482F of the first support portion 48A, and the second control terminal 47A is joined to the sixth portion 482F of the second support portion 48B.

[0063] The second portion 482B has multiple wires 72 joined to it, and each wire 72 provides electrical conductivity to the third main surface electrode 13 (source sense electrode) of each first electronic element 10A (each second electronic element 10B). As shown in Figure 8, the first control terminal 46B is joined to the second portion 482B of the first support portion 48A, and the second control terminal 47B is joined to the second portion 482B of the second support portion 48B.

[0064] The third portion 482C and the fourth portion 482D are connected to the thermistor 17. As shown in Figure 8, the first control terminals 46C and 46D are connected to the third portion 482C and the fourth portion 482D of the first support portion 48A, and the second control terminals 47C and 47D are connected to the third portion 482C and the fourth portion 482D of the second support portion 48B.

[0065] The fifth portion 482E of the first support portion 48A is joined to a wire 74, and is electrically connected to the first conductive portion 32A via the wire 74. As shown in Figure 8, the first control terminal 46E is joined to the fifth portion 482E of the first support portion 48A. The fifth portion 482E of the second support portion 48B is not electrically connected to other components. Each of the above wires 71 to 74 is, for example, a bonding wire. The constituent material of each of the wires 71 to 74 includes, for example, Au (gold), Al (aluminum), or Cu (copper).

[0066] The second metal layer 483 is formed on the lower surface of the insulating layer 481, as shown in Figures 15 and 16. The second metal layer 483 of the first support portion 48A is joined to the first conductive portion 32A via a bonding material 49, as shown in Figure 15. The second metal layer 483 of the second support portion 48B is joined to the second conductive portion 32B via a bonding material 49, as shown in Figure 16.

[0067] The first conductive member 5 and the second conductive member 6, together with the first conductive portion 32A and the second conductive portion 32B, constitute a path for the main circuit current switched by a plurality of first electronic elements 10A and a plurality of second electronic elements 10B. The first conductive member 5 and the second conductive member 6 are spaced apart from the first main surface 301A and the second main surface 301B on the z1 side in the thickness direction z, and overlap the first main surface 301A and the second main surface 301B in a plan view. In this embodiment, the first conductive member 5 and the second conductive member 6 are each made of a metal plate. The metal includes, for example, Cu (copper) or a Cu (copper) alloy. Specifically, the first conductive member 5 and the second conductive member 6 are metal plates that have been appropriately bent.

[0068] The first conductive member 5 is connected to the second main surface electrode 12 (source electrode) of each first electronic element 10A and the second conductive portion 32B, thereby creating electrical conductivity between the second main surface electrode 12 of each first electronic element 10A and the second conductive portion 32B. The first conductive member 5 constitutes the path for the main circuit current switched by the plurality of first electronic elements 10A. As shown in Figures 7 and 8, the first conductive member 5 includes a main portion 51, a plurality of first junctions 52, and a plurality of second junctions 53.

[0069] The main portion 51 is located between the multiple first electronic elements 10A and the second conductive portion 32B in the first direction x, and is a band-shaped portion that extends in the second direction y in a plan view. In a plan view, the main portion 51 overlaps the first conductive portion 32A and the second conductive portion 32B, and is spaced away from the first main surface 301A and the second main surface 301B on the z1 side in the thickness direction z in the thickness direction z. As shown in Figure 17 and other figures, the main portion 51 is located on the z2 side in the thickness direction z relative to the third path portion 66 and the fourth path portion 67 of the second conductive member 6, which will be described later, and is in a position closer to the first main surface 301A and the second main surface 301B than the third path portion 66 and the fourth path portion 67.

[0070] In this embodiment, the main portion 51 is arranged parallel to the first main surface 301A and the second main surface 301B.

[0071] As shown in Figure 8 and other figures, the main portion 51 extends in a series corresponding to the region in the second direction y where the plurality of first electronic elements 10A are arranged. In this embodiment, as shown in Figures 7, 8, and 14, a plurality of first openings 514 are formed in the main portion 51. Each of the plurality of first openings 514 is a through hole that penetrates, for example, in the thickness direction z (the plate thickness direction of the main portion 51). The plurality of first openings 514 are arranged at intervals in the second direction y. The plurality of first openings 514 are provided corresponding to each of the plurality of first electronic elements 10A. In this embodiment, the main portion 51 is provided with four first openings 514, and the positions of these first openings 514 and the plurality (four) first electronic elements 10A in the second direction y are equal to each other.

[0072] In this embodiment, as shown in Figures 8 and 14, each first opening 514 overlaps the gap between the first conductive portion 32A and the second conductive portion 32B in a plan view. The multiple first openings 514 are formed to facilitate the flow of the resin material between the upper side (z1 side in the thickness direction z) and the lower side (z2 side in the thickness direction z) near the main portion 51 (first conductive member 5) when injecting the fluid resin material to form the sealing resin 8.

[0073] As shown in Figure 8 and other figures, the multiple first joints 52 and the multiple second joints 53 are each connected to the main part 51 and are arranged corresponding to the multiple first electronic elements 10A. Specifically, each first joint 52 is located on the x1 side of the first direction x with respect to the main part 51. Each second joint 53 is located on the x2 side of the first direction x with respect to the main part 51. As shown in Figure 15, each first joint 52 and the second main surface electrode 12 of any of the corresponding first electronic elements 10A are joined via a conductive bonding material 59. Each second joint 53 and the second conductive part 32B are joined via a conductive bonding material 59. The constituent material of the conductive bonding material 59 is not particularly limited and may be solder, metal paste, or sintered metal, for example. In this embodiment, the first joint 52 has two parts separated in the second direction y. These two parts are joined to the second main surface electrode 12 of the first electronic element 10A on both sides in the second direction y, with the gate finger 121 of the second main surface electrode 12 of the first electronic element 10A in between.

[0074] The second conductive member 6 connects the second main surface electrode 12 (source electrode) of each second electronic element 10B with the first terminal 41 and the second terminal 42. The second conductive member 6 is integrally formed with the first terminal 41 and the second terminal 42. The second conductive member 6 constitutes a path for the main circuit current switched by the plurality of second electronic elements 10B. As shown in Figures 3, 5 to 7, 13, 14, and 17 to 19, the second conductive member 6 includes a plurality of third junctions 61, a first path portion 64, a second path portion 65, a plurality of third path portions 66 and a fourth path portion 67. In the illustrated example, the second conductive member 6 also includes a first stepped portion 602 and a second stepped portion 603.

[0075] The multiple third joints 61 are portions that are individually joined to the multiple second electronic elements 10B. Each third joint 61 and the second main surface electrode 12 of each second electronic element 10B are joined via a conductive bonding material 69. The constituent material of the conductive bonding material 69 is not particularly limited and may be solder, metal paste, or sintered metal, for example. In this embodiment, the third joint 61 has two flat portions 611 and two first inclined portions 612.

[0076] The two flat portions 611 are aligned in the second direction y. The two flat portions 611 are spaced apart from each other in the second direction y. The shape of the flat portions 611 is not limited in any way, and in the illustrated example, it is rectangular. The two flat portions are joined to the second main surface electrode 12 of the second electronic element 10B on both sides in the second direction y, with the gate finger 121 of the second main surface electrode 12 of the second main surface electrode 12 in between.

[0077] The two first inclined portions 612 are connected to the outside of the two flat portions 611 in the second direction y. That is, the first inclined portion 612 located on the y1 side of the second direction y is connected to the y1 side of the flat portion 611 located on the y1 side of the second direction y. Also, the first inclined portion 612 located on the y2 side of the second direction y is connected to the y2 side of the flat portion 611 located on the y2 side of the second direction y. The first inclined portions 612 are inclined such that the further they are from the flat portion 611 in the second direction y, the further they are located on the z1 side of the thickness direction z.

[0078] The first path portion 64 is interposed between the multiple third joint portions 61 and the first terminal 41. In the illustrated example, the first path portion 64 is connected to the first terminal 41 via the first stepped portion 602. In plan view, the first path portion 64 overlaps the first conductive portion 32A. The first path portion 64 as a whole has a shape that extends in the first direction x.

[0079] The first path portion 64 includes a first strip portion 641 and a first extension portion 643. The first strip portion 641 is located on the x2 side of the first direction x with respect to the first terminal 41 and is substantially parallel to the first main surface 301A. The first strip portion 641 as a whole has a shape that extends in the first direction x. In the illustrated example, the first strip portion 641 has a recess 649. The recess 649 is a portion of the first strip portion 641 that is recessed on the y1 side of the second direction y. In Figure 5, the first metal portion 35 is visible through the recess 649.

[0080] The first extension portion 643 extends from the y1 side end of the first strip portion 641 in the second direction y to the z2 side in the thickness direction z. The first extension portion 643 is separated from the first conductive portion 32A. In the illustrated example, the first extension portion 643 has a shape along the thickness direction z and is a long rectangle with the first direction x as the longitudinal direction. Note that the first path portion 64 may be configured without the first extension portion 643.

[0081] The second path portion 65 is interposed between the multiple third joint portions 61 and the second terminal 42. In the illustrated example, the second path portion 65 is connected to the second terminal 42 via the second stepped portion 603. In plan view, the second path portion 65 overlaps the first conductive portion 32A. The second path portion 65 as a whole has a shape that extends in the first direction x.

[0082] The second path portion 65 includes a second strip portion 651 and a second extension portion 653. The second strip portion 651 is located on the x2 side of the first direction x with respect to the second terminal 42 and is substantially parallel to the first main surface 301A. The second strip portion 651 as a whole has a shape that extends in the first direction x. In the illustrated example, the second strip portion 651 has a recess 659. The recess 659 is a portion of the second strip portion 651 that is recessed on the y2 side of the second direction y. In Figure 5, the second metal portion 36 is visible through the recess 659.

[0083] The second extension portion 653 extends from the y2 side end of the second strip portion 651 in the second direction y towards the z2 side in the thickness direction z. The second extension portion 653 is separated from the first conductive portion 32A. In the illustrated example, the second extension portion 653 has a shape along the thickness direction z and is a long rectangle with the first direction x as the longitudinal direction. Note that the second path portion 65 may be configured without the second extension portion 653.

[0084] Multiple third path portions 66 are individually connected to multiple third junction portions 61. Each third path portion 66 has a shape that extends in the first direction x and is arranged spaced apart from each other in the second direction y. The number of multiple third path portions 66 is not limited in any way, and in the illustrated example, five third path portions 66 are arranged. Each third path portion 66 is arranged so as to be located between multiple second electronic elements 10B in the second direction y, or so as to be located outside of multiple second electronic elements 10B in the second direction y.

[0085] Recesses 669 are formed in the two third path portions 66 located on both outer sides in the second direction y. The recesses 669 are recessed from the inside outward in the second direction y. In the illustrated example, one recess 669 is formed in each of the two third path portions 66. In Figure 5, the second conductive portion 32B is visible through these recesses 669.

[0086] In this embodiment, one third joint 61 is positioned between two adjacent third path sections 66 in the second direction y. In one third joint 61, the first inclined portion 612 located on the y1 side of the second direction y is connected to the third path section 66 located on the y1 side of the second direction y, out of the two adjacent third path sections 66 in the second direction y. In one third joint 61, the first inclined portion 612 located on the y2 side of the second direction y is connected to the third path section 66 located on the y2 side of the second direction y, out of the two adjacent third path sections 66 in the second direction y.

[0087] The fourth path section 67 is connected to the x1 end of the multiple third path sections 66 in the first direction x. The fourth path section 67 has a shape that extends long in the second direction y. The fourth path section 67 is connected to the x2 end of the first strip-shaped section 641 of the first path section 64 and the second strip-shaped section 651 of the second path section 65 in the first direction x. In the illustrated example, the first path section 64 is connected to the y1 end of the fourth path section 67 in the second direction y. Also, the second path section 65 is connected to the y2 end of the fourth path section 67 in the second direction y.

[0088] The sealing resin 8 covers a plurality of first electronic elements 10A, a plurality of second electronic elements 10B, a support substrate 3 (excluding the back surface 302), a portion of each of the first terminal 41, second terminal 42, a plurality of third terminals 43, and fourth terminal 44, a portion of each of the plurality of control terminals 45, a control terminal support 48, a first conductive member 5, a second conductive member 6, and a plurality of wires 71 to 74. The sealing resin 8 is made of, for example, black epoxy resin. The sealing resin 8 is formed, for example, by mold molding. The sealing resin 8 has dimensions of, for example, 35 mm to 60 mm in the first direction x, 35 mm to 50 mm in the second direction y, and 4 mm to 15 mm in the thickness direction z. These dimensions are the size of the largest portion along each direction. The sealing resin 8 has a resin main surface 81, a resin back surface 82, and a plurality of resin side surfaces 831 to 834.

[0089] As shown in Figures 10, 13, and 19, the resin main surface 81 and the resin back surface 82 are separated in the thickness direction z. The resin main surface 81 faces the z1 side in the thickness direction z, and the resin back surface 82 faces the z2 side in the thickness direction z. Multiple control terminals 45 (multiple first control terminals 46A to 46E and multiple second control terminals 47A to 47D) protrude from the resin main surface 81. As shown in Figure 12, the resin back surface 82 is frame-shaped in plan view, surrounding the back surface 302 of the support substrate 3 (the lower surface of the back metal layer 33). The back surface 302 of the support substrate 3 is exposed from the resin back surface 82 and is, for example, flush with the resin back surface 82. Multiple resin side surfaces 831 to 834 are connected to the resin main surface 81 and the resin back surface 82, respectively, and are sandwiched between them in the thickness direction z. As shown in Figure 4, the resin side surface 831 and the resin side surface 832 are separated in the first direction x. The resin side surface 831 faces the x2 side of the first direction x, and the resin side surface 832 faces the x1 side of the first direction x. Two third terminals 43 protrude from the resin side surface 831, and the first terminal 41, second terminal 42, and fourth terminal 44 protrude from the resin side surface 832. As shown in Figure 4, the resin side surface 833 and the resin side surface 834 are separated in the second direction y. The resin side surface 833 faces the y2 side of the second direction y, and the resin side surface 834 faces the y1 side of the second direction y.

[0090] As shown in Figure 4, a plurality of recesses 832a are formed on the resin side surface 832. Each recess 832a is a portion that is recessed in the first direction x in a plan view. The plurality of recesses 832a are formed between the first terminal 41 and the fourth terminal 44 in a plan view, and between the second terminal 42 and the fourth terminal 44. The plurality of recesses 832a are provided to increase the creepage distance along the resin side surface 832 between the first terminal 41 and the fourth terminal 44, and the creepage distance along the resin side surface 832 between the second terminal 42 and the fourth terminal 44.

[0091] Furthermore, the sealing resin 8 may have grooves 89. The grooves 89 are recessed portions on the z1 side in the thickness direction z from the back surface 82 of the resin. The grooves 89 traverse the back surface 82 of the resin in the second direction y. In the illustrated example, the sealing resin 8 has two grooves 89. The two grooves 89 are spaced apart in the x direction. The back metal layer 33 (back surface 302) is located between the two grooves 89. The sealing resin 8 does not have to have grooves 89.

[0092] As shown in Figures 22 to 26, the electronic unit C1 includes an electronic module B1 and a cooling device 9.

[0093] The cooling device 9 is located on the z2 side of the thickness direction z of the electronic module B1. The cooling device 9 may have a housing 91, a supply unit 92, and a discharge unit 93.

[0094] The housing 91 is a box-shaped member made of metal or resin. The housing 91 may have a housing section 910. The housing section 910 houses the first fin group 2A and the second fin group 2B and can house the heat dissipation module 2. In this embodiment, the housing 91 has a groove 911. The groove 911 is annular in shape, surrounding the housing section 910 when viewed in the thickness direction z, and is recessed on the z2 side in the thickness direction z. A sealing material 95 may be placed in the groove 911. The sealing material 95 is made of a material with high elastic deformation, such as silicone rubber. The sealing material 95 is intended to prevent unintended gaps from forming between the housing 91 and the electronic module B1, thereby improving the airtightness of the housing section 910.

[0095] The supply unit 92 is a part for supplying cooling refrigerant to the housing unit 910. The specific configuration of the supply unit 92 is not limited in any way, and in this example it includes a supply pipe section 921 and one or more supply holes 922. The supply pipe section 921 constitutes a tubular flow path extending in a second direction y. The supply pipe section 921 may be located outside and inside the housing 91. The one or more supply holes 922 are parts connected to the supply pipe section 921 and the housing unit 910. In this example the supply unit 92 is located on the x1 side of the first direction x with respect to the housing 91. The supply unit 92 may include a plurality of supply holes 922. In this example the plurality of supply holes 922 are arranged in the first direction x.

[0096] The discharge section 93 is a part for discharging cooling refrigerant from the housing section 910. The specific configuration of the discharge section 93 is not limited in any way, and in this example it includes a discharge pipe section 931 and one or more discharge holes 932. The discharge pipe section 931 constitutes a tubular flow path extending in the second direction y. The discharge pipe section 931 may be located outside and inside the housing 91. The one or more discharge holes 932 are parts that connect to the supply pipe section 921 and the housing section 910. In this example, the discharge section 93 is located on the x2 side of the first direction x with respect to the housing 91. The discharge section 93 may include only one discharge hole 932. In this example the discharge hole 932 has a shape that extends in the second direction y.

[0097] In this example, the cooling medium that flows into the supply pipe section 921 is supplied to the housing section 910 via a plurality of supply holes 922. The cooling medium supplied to the housing section 910 flows within the housing section 910 from the x1 side to the x2 side in the first direction x. At this time, the cooling medium can flow in the spaces between the plurality of first fins 21A and the plurality of second fins 21B in the first fin group 2A and the second fin group 2B. The cooling medium that has flowed within the housing section 910 is guided from the discharge hole 932 to the discharge pipe section 931 and discharged from the discharge hole 932.

[0098] Next, the operation of this embodiment will be described.

[0099] The electronic device A1 has a first fin group 2A and a second fin group 2B. As shown in Figures 6, 9, 14, and 17-19, the first fin group 2A is arranged in correspondence with the first heat dissipation group 1A, and the second fin group 2B is arranged in correspondence with the second heat dissipation group 1B. That is, the first fin group 2A overlaps with the first heat dissipation group 1A when viewed in the thickness direction z, and the second fin group 2B overlaps with the second heat dissipation group 1B when viewed in the thickness direction z. As a result, the first fin group 2A can promote heat dissipation from the first heat dissipation group 1A, and the second fin group 2B can promote heat dissipation from the second heat dissipation group 1B. Therefore, the heat dissipation of the electronic device A1 can be improved.

[0100] The first fin group 2A includes a plurality of first fins 21A, each aligned along a first direction x and in a second direction y intersecting the first direction x, and the second fin group 2B includes a plurality of second fins 21B, each aligned along a first direction x and in a second direction y. As a result, the gaps between the plurality of first fins 21A and the gaps between the plurality of second fins 21B can constitute a flow path for the cooling medium flowing along the first direction x. Therefore, heat dissipation from the first fin group 2A and the second fin group 2B to the cooling medium can be further promoted.

[0101] The first pitch p1, which is the pitch of the multiple first fins 21A in the second direction y, and the second pitch p2, which is the pitch of the multiple second fins 21B in the second direction y, are equal. This allows the cooling medium that has flowed through the first fin group 2A to flow more smoothly through the second fin group 2B, which is preferable for improving heat dissipation.

[0102] The first heat dissipation group 1A includes a plurality of first electronic elements 10A arranged in the second direction y. As a result, the plurality of first electronic elements 10A are arranged in a direction that intersects, or more specifically, is orthogonal to, the flow direction of the cooling medium flowing through the first fin group 2A (first direction x). Therefore, the heat dissipation of the plurality of first electronic elements 10A can be made more uniform. Similarly, the second heat dissipation group 1B includes a plurality of second electronic elements 10B arranged in the second direction y. As a result, the heat dissipation of the plurality of second electronic elements 10B can be made more uniform.

[0103] The first fin group 2A and the second fin group 2B are arranged on the back surface 302. On the opposite side of the back surface 302 of the support substrate 3, a plurality of first electronic elements 10A and a plurality of second electronic elements 10B are arranged. This further promotes heat dissipation from the plurality of first electronic elements 10A and a plurality of second electronic elements 10B.

[0104] As shown in Figures 22 to 26, in the electronic unit C1, the cooling medium can be appropriately flowed along the first fin group 2A and the second fin group 2B within the housing 910. Therefore, this is preferable for improving heat dissipation from the electronic device A1.

[0105] By flowing the cooling medium from the supply unit 92 through the storage unit 910 to the discharge unit 93, the cooling medium flows in the order of the first fin group 2A to the second fin group 2B. This allows the multiple first electronic elements 10A constituting the upper arm circuit to be cooled preferentially over the multiple second electronic elements 10B constituting the lower arm circuit. The flow direction of the cooling medium is not limited in any way, and it may be configured to flow in the reverse order of this embodiment, from the second fin group 2B to the first fin group 2A.

[0106] Figures 27 to 34 show other embodiments of the present disclosure. In these figures, elements that are the same as or similar to those in the above embodiments are denoted by the same reference numerals. Furthermore, the configurations of the parts in each embodiment can be combined with each other as appropriate, to the extent that no technical inconsistencies arise.

[0107] Second Embodiment: Figures 27 and 28 show an electronic device according to a second embodiment of the present disclosure. The electronic device A2 of this embodiment comprises an electronic module B2 and a heat dissipation module 2. The electronic module B2 may have a configuration similar to, for example, the electronic module B1 described above.

[0108] In this embodiment, the heat dissipation module 2 has a different position in the second direction y between one of the multiple first fins 21A and the second fin 21B closest to one of the multiple second fins 21B. Furthermore, in this embodiment, all of the multiple first fins 21A and all of the multiple second fins 21B have different positions in the second direction y.

[0109] In this embodiment, the number of multiple first fins 21A is less than the number of multiple second fins 21B. The length occupied by the multiple first fins 21A in the second direction y is shorter than the length occupied by the multiple second fins 21B in the second direction y.

[0110] As shown in Figure 28, the first fin 21A and the second fin 21B, which are in the closest relative positions to each other, differ in position by a displacement g in the second direction y. The magnitude of the displacement g is not limited in any way. In this embodiment, the first pitch p1 and the second pitch p2 are substantially the same, and the displacement g may be half of the first pitch p1 or the second pitch p2.

[0111] Electronic device A2 can be combined with, for example, the cooling device 9 described above to form an electronic unit similar to electronic unit C1.

[0112] This embodiment improves heat dissipation of the electronic device A2. In this embodiment, all of the multiple first fins 21A and all of the multiple second fins 21B are positioned differently in the second direction y. As a result, when the cooling medium that has flowed through the first fin group 2A flows into the second fin group 2B, it may collide with the multiple second fins 21B. This can cause the cooling medium to be stirred as it flows from the first fin group 2A to the second fin group 2B. This makes it possible to make the temperature distribution in the cooling medium more uniform and improve the cooling efficiency.

[0113] The first pitch p1 and the second pitch p2 are the same, and the offset g is half of either the first pitch p1 or the second pitch p2. This makes it possible to avoid localized imbalances in the flow of the cooling medium from the multiple first fins 21A to the multiple second fins 21B, and to make the cooling state more uniform throughout the electronic device A1.

[0114] Figure 29 shows a first modified example of electronic device A2. In this modified electronic device A21, the first pitch p1 and the second pitch p2 are different from each other. As a result, most of the first fins 21A and most of the second fins 21B are at different positions in the second direction y. The displacement g may vary depending on the combination of the first fins 21A and the second fins 21B. In the illustrated example, the two first fins 21A and two second fins 21B located furthest to y1 and furthest to y2 in the second direction y have the same position in the second direction y. However, the positions in the second direction y of all first fins 21A and all second fins 21B may be different.

[0115] The electronic device A21 can be combined with, for example, the cooling device 9 described above to form an electronic unit similar to the electronic unit C1.

[0116] This embodiment can improve heat dissipation of the electronic device A21. As can be seen from this modified example, the arrangement of the plurality of first fins 21A and the plurality of second fins 21B is not limited in any way, and the first pitch p1 and the second pitch p2 may be different.

[0117] Third Embodiment: Figures 30 and 31 show an electronic device according to a third embodiment of the present disclosure. The electronic device A3 of this embodiment comprises an electronic module B3 and a heat dissipation module 2. The electronic module B3 may have a configuration similar to, for example, the electronic module B1 described above.

[0118] In this embodiment, the heat dissipation module 2 has a first fin group 2A and a second fin group 2B that are separated by a gap s in the first direction x. The positional relationship between the multiple first fins 21A and the multiple second fins 21B may be the same as, for example, the positional relationship between the electronic devices A1, A2, and A21 described above. In the illustrated example, the positional relationship between the multiple first fins 21A and the multiple second fins 21B is the same as the positional relationship in electronic device A2.

[0119] The size of the gap s is not limited in any way. The size of the gap s in the first direction x may be, for example, 0.1 times or more and 2 times or less the size of the first flow path width w1.

[0120] Electronic device A3 can be combined with, for example, the cooling device 9 described above to form an electronic unit similar to electronic unit C1.

[0121] This embodiment improves heat dissipation of the electronic device A3. The gap s reduces pressure loss when the cooling medium that has flowed through the first fin group 2A flows into the second fin group 2B. When the gap s is between 0.1 and 2 times the size of the first flow path width w1, the pressure loss reduction effect can be appropriately achieved while avoiding unintended disturbance of the cooling medium flow between the first fin group 2A and the second fin group 2B.

[0122] Fourth Embodiment: Figures 32 and 33 show an electronic device according to the fourth embodiment of the present disclosure. The electronic device A4 of this embodiment comprises an electronic module B4 and a heat dissipation module 2. The electronic module B4 may have a configuration similar to, for example, the electronic module B1 described above.

[0123] In this embodiment, the multiple first fins 21A are arranged in multiple rows that are parallel to each other in the first direction x. That is, the multiple first fins 21A constitute a row located on the x1 side of the first direction x and a row located on the x2 side of the first direction x. The pitch in each row is not limited in any way. In the illustrated example, each row has multiple first fins 21A arranged at a first pitch p1. Furthermore, these two rows are offset by half the first pitch p1 in the second direction y.

[0124] Multiple second fins 21B are arranged in multiple parallel rows in the first direction x. That is, the multiple second fins 21B constitute a row located on the x1 side of the first direction x and a row located on the x2 side of the first direction x. The pitch in each row is not limited in any way. In the illustrated example, each row has multiple second fins 21B arranged at a second pitch p2. Furthermore, these two rows are offset by half the second pitch p2 in the second direction y. Also, the first pitch p1 and the second pitch p2 may be the same.

[0125] In this example, adjacent rows of first fins 21A and rows of second fins 21B in the first direction x differ from each other by a displacement g. The magnitude of the displacement g is not limited in any way and may be, for example, half of the first pitch p1 or the second pitch p2.

[0126] Electronic device A4 can be combined with, for example, the cooling device 9 described above to form an electronic unit similar to electronic unit C1.

[0127] This embodiment can improve heat dissipation of the electronic device A4. By arranging the multiple first fins 21A and the multiple second fins 21B in multiple rows, it is possible to increase the cooling efficiency. As can be seen from this embodiment, the multiple first fins 21A and the multiple second fins 21B may each be arranged in one row, or in two or more rows of three or more.

[0128] Fifth Embodiment: Figure 34 shows an electronic device according to a fifth embodiment of the present disclosure. The electronic device A5 of this embodiment comprises a first electronic module B51 and a second electronic module B52, and a heat dissipation module 2. The heat dissipation module 2 may include a first fin group 2A and a second fin group 2B. The electronic device A5 may further include the first electronic module B51. The heat dissipation module 2 may further include a third fin group 2C.

[0129] The first electronic module B51, the second electronic module B52, and the third electronic module B53 may have the same configuration as the electronic module B1 described above. In this embodiment, the first electronic module B51 may constitute the first heat dissipation group 1A, the second electronic module B52 may constitute the second heat dissipation group 1B, and the third electronic module B53 may constitute the third heat dissipation group 1C. The first electronic module B51, the second electronic module B52, and the third electronic module B53 are arranged in this order in the first direction x.

[0130] The first fin group 2A is arranged in correspondence with the first electronic module B51 as the first heat dissipation group 1A, and may be located on the back surface 302 of the first electronic module B51. The second fin group 2B is arranged in correspondence with the second electronic module B52 as the second heat dissipation group 1B, and may be located on the back surface 302 of the second electronic module B52. The third fin group 2C is arranged in correspondence with the third electronic module B53 as the third heat dissipation group 1C, and may be located on the back surface 302 of the third electronic module B53.

[0131] The multiple first fins 21A, multiple second fins 21B, and multiple third fins 21C are all shaped along the first direction x and are arranged in the second direction y.

[0132] The electronic device A5 can be combined with, for example, the cooling device 9 described above to form an electronic unit similar to the electronic unit C1.

[0133] This embodiment can improve heat dissipation of the electronic device A5. As can be seen from this embodiment, the first heat dissipation group 1A and the second heat dissipation group 1B in this disclosure may be configured to be included in a single electronic module B1, and each of the first heat dissipation group 1A and the second heat dissipation group 1B may be individually configured by the first electronic module B51 and the second electronic module B52.

[0134] The electronic devices and electronic units relating to this disclosure are not limited to the embodiments described above. The specific configurations of the electronic devices and electronic units relating to this disclosure can be modified in various ways.

[0135] Note 1. An electronic device (A1) comprising: a first heat dissipation group (1A) and a second heat dissipation group (1B), each containing a plurality of electronic elements and arranged in a first direction (x); and a heat dissipation module (2) having a first fin group (2A) and a second fin group (2B), each containing a plurality of fins, wherein the first fin group (2A) is arranged corresponding to the first heat dissipation group (1A), and the second fin group (2B) is arranged corresponding to the second heat dissipation group (1B). Note 1-1. The electronic device (A1) according to Note 1, wherein the first fin group (2A) overlaps with the first heat dissipation group (1A) when viewed in the thickness direction (z) intersecting the first direction (x). Note 1-2. The electronic device (A1) described in Appendix 1 or 1-1, wherein the second fin group (2B) overlaps with the second heat dissipation group (1B) when viewed in the thickness direction (z) intersecting the first direction (x). Appendix 2. The electronic device (A1) described in Appendix 1, wherein the first fin group (2A) includes a plurality of first fins (21A) each aligned along the first direction (x) and arranged in a second direction (y) intersecting the first direction (x). Appendix 3. The electronic device (A1) described in Appendix 2, wherein the second fin group (2B) includes a plurality of second fins (21B) each aligned along the first direction (x) and arranged in a second direction (y). Appendix 4. Electronic device (A2) as described in Appendix 3, wherein one of the plurality of first fins (21A) and the second fin (21B) among the plurality of second fins (21B) that is closest to the one first fin (21A) are in different positions in the second direction (y). Appendix 5. Electronic device (A2) as described in Appendix 4, wherein all of the plurality of first fins (21A) and all of the plurality of second fins (21B) are in different positions in the second direction (y). Appendix 6. Electronic device (A2) as described in Appendix 5, wherein the first pitch (p1), which is the pitch of the plurality of first fins (21A) in the second direction (y), and the second pitch (p2), which is the pitch of the plurality of second fins (21B) in the second direction (y), are equal.Note 7. The electronic device (A2) described in Note 6, wherein the displacement (g) of the first pitch (p1) and the second pitch (p2) of the plurality of first fins (21A) and second fins (21B) in the second direction (y) is 1 / 2 of the first pitch (p1) or the second pitch (p2). Note 8. The electronic device (A21) described in Note 4 or 5, wherein the first pitch (p1), which is the pitch of the plurality of first fins (21A) in the second direction (y), and the second pitch (p2), which is the pitch of the plurality of second fins (21B) in the second direction (y), are different from each other. Note 9. The electronic device (A1) described in Note 3, wherein the number of the plurality of first fins (21A) is less than the number of the plurality of second fins (21B). Note 10. The first fin group (2A) and the second fin group (2B) are separated by a gap (s) in the first direction (x), as described in any of the appendices 4 to 8, as described in appendice 11. The size of the gap (s) in the first direction (x) is 0.1 times or more and 2 times or less the size of the first flow path width (w1) between two adjacent first fins (21A) in the second direction (y), as described in appendice 10, as described in appendice 12. The plurality of first fins (21A) are arranged in a plurality of rows that are arranged in parallel in the first direction (x), as described in any of the appendices 2 to 11, as described in appendice 13. The first heat dissipation group (1A) includes a plurality of first electronic elements (10A) arranged in the second direction (y), as described in any of the appendices 3 to 12, as described in appendice 14. The electronic device (A1) according to Appendix 13, wherein the second heat dissipation group (1B) includes a plurality of second electronic elements (10B) arranged in the second direction (y). Appendix 15. The electronic device (A1) according to Appendix 14, comprising an electronic module (B1) including a plurality of first electronic elements (10A) and a plurality of second electronic elements (10B), and a support substrate (3) on which the plurality of first electronic elements (10A) and the plurality of second electronic elements (10B) are mounted and which has a back surface (302), wherein the heat dissipation module (2) is arranged on the back surface (302).Note 15-1. The electronic device (A1) according to Note 15, wherein the electronic module (B1) comprises a sealing resin (8) that covers the plurality of first electronic elements (10A) and the plurality of second electronic elements (10B) and a part of the support substrate (3), and the back surface (302) is exposed from the sealing resin (8). Note 15-2. The electronic device (A1) according to Note 15-1, wherein the plurality of first electronic elements (10A) and the plurality of second electronic elements (10B) are each switching elements, and the electronic module (B1) includes a half-bridge circuit having an upper arm circuit including the plurality of first electronic elements (10A) and a lower arm circuit including the plurality of second electronic elements (10B). Note 15-3. The electronic device (A1) according to Appendix 15-2, wherein the electronic module (B1) has a plurality of input terminals (41, 42, 44) and an output terminal (43), and the plurality of input terminals (41, 42, 44) and the third terminal (43) protrude on the opposite side from the sealing resin (8) in the first direction (x). Appendix 15-4. The electronic device (A1) according to Appendix 15-2 or Appendix 15-3, wherein the electronic module (B1) is equipped with a plurality of control terminals (45) to which signals for controlling the plurality of first electronic elements (10A) and the plurality of second electronic elements (10B) are input and output. Appendix 15-5. The electronic device (A1) according to Appendix 15-4, wherein the plurality of control terminals (45) protrude on the opposite side from the side in which the back surface (302) is exposed in the thickness direction (z) intersecting the first direction (x) and the second direction (y). Appendix 15-6. An electronic device (A5) according to any one of appendices 1 to 14, comprising: a first electronic module (B51) having the first heat dissipation group (1A); and a second electronic module (B52) having the second heat dissipation group (1B), wherein the first fin group (2A) is arranged in the first electronic module (B21) corresponding to the first heat dissipation group (1A), and the second fin group (2B) is arranged in the second electronic module (B22) corresponding to the second heat dissipation group (1B).Appendix 16. An electronic unit (C1) comprising an electronic device (A1) described in any of Appendix 1 to 15, and a cooling device (9) having a housing section (910) for housing the first fin group (2A) and the second fin group (2B), a supply section (92) for supplying a cooling medium to the housing section (910), and a discharge section (93) for discharging the cooling medium from the housing section (910).

[0136] A1, A2, A21, A3, A4, A5: Electronic devices, B1, B2, B3, B4: Electronic modules, B51: First electronic module, B52: Second electronic module, B53: Third electronic module, C1: Electronic unit, 1A: First heat dissipation group, 1B: Second heat dissipation group, 1C: Third heat dissipation group, 2: Heat dissipation module, 2A: First fin group, 2B: Second fin group, 2C: Third Fin group, 3: Support substrate, 5: First conductive member, 6: Second conductive member, 8: Sealing resin, 9: Cooling device, 10A: First electronic element, 10B: Second electronic element, 11: First main surface electrode, 12: Second main surface electrode, 13: Third main surface electrode, 15: Back surface electrode, 17: Thermistor, 19A: First conductive bonding material, 19B: Second conductive bonding material, 20A: First base, 20B: Second base, 21 A: First fin, 21B: Second fin, 21C: Third fin, 31: Insulating layer, 32: First metal layer, 32A: First conductive part, 32B: Second conductive part, 33: Backside metal layer, 35: First metal part, 36: Second metal part, 41: First terminal, 42: Second terminal, 43: Third terminal, 44: Fourth terminal, 45: Control terminal, 46A, 46B, 46C, 46D, 46E: First control terminal, 47A, 47B, 47C, 47D: Second control terminal, 48: Control terminal support, 48A: First support part, 48B: Second support part, 49: Bonding material, 51: Main part, 52: First joint part, 53: Second joint part, 59: Conductive bonding material, 61: Third joint part, 64: First path part, 65: Second path part, 66: Third path part, 67: Fourth path part, 69: Conductive bonding material, 71, 72, 73,74: Wire, 81: Main resin surface, 82: Back of resin surface, 89: Groove, 91: Housing, 92: Supply section, 93: Discharge section, 95: Sealing material, 101: Main element surface, 102: Back of element surface, 121: Gate finger, 301A: First main surface, 301B: Second main surface, 302: Back surface, 451: Holder, 452: Metal pin, 459: Conductive bonding material, 481: Insulating layer, 482: First metal layer, 482A: First part, 482B: Second part, 482C: Third part, 482D: Fourth part, 482E: Fifth part, 482F: Sixth part, 483: Second metal layer, 514: First opening, 602: First stepped section , 603: second stepped section, 611: flat section, 612: first inclined section, 641: first strip section, 643: first extension section, 649: recess, 651: second strip section, 653: second extension section, 659: recess, 669: recess, 831: resin side surface, 832: resin side surface, 832a: recess, 833: resin side surface, 834: resin side surface, 910: housing section, 911: groove section, 921: supply pipe section, 922: supply hole, 931: discharge pipe section, 932: discharge hole, g: misalignment, p1: first pitch, p2: second pitch, s: gap, w1: first flow path width, w2: second flow path width, x: first direction, y: second direction, z: thickness direction,

Claims

1. An electronic device comprising: a first heat dissipation group and a second heat dissipation group, each containing a plurality of electronic elements and arranged in a first direction; and a heat dissipation module having a first fin group and a second fin group, each containing a plurality of fins, wherein the first fin group is arranged in correspondence with the first heat dissipation group and the second fin group is arranged in correspondence with the second heat dissipation group.

2. The electronic device according to claim 1, wherein the first fin group includes a plurality of first fins, each aligned along the first direction and arranged in a second direction intersecting the first direction.

3. The electronic device according to claim 2, wherein the second fin group includes a plurality of second fins, each oriented along the first direction and arranged in the second direction.

4. The electronic device according to claim 3, wherein one of the plurality of first fins and the second fin that is closest to the one of the plurality of second fins are in different positions in the second direction.

5. The electronic device according to claim 4, wherein all of the plurality of first fins and all of the plurality of second fins are in different positions in the second direction.

6. The electronic device according to claim 5, wherein the first pitch, which is the pitch of the plurality of first fins in the second direction, and the second pitch, which is the pitch of the plurality of second fins in the second direction, are equal.

7. The electronic device according to claim 6, wherein the displacement of the plurality of first fins and second fins in the second direction of the first pitch and the second pitch is 1 / 2 of the first pitch or the second pitch.

8. The electronic device according to claim 4 or 5, wherein the first pitch, which is the pitch of the plurality of first fins in the second direction, and the second pitch, which is the pitch of the plurality of second fins in the second direction, are different from each other.

9. The electronic device according to claim 3, wherein the number of the plurality of first fins is less than the number of the plurality of second fins.

10. The electronic device according to any one of claims 4 to 8, wherein the first fin group and the second fin group are spaced apart with a gap in the first direction.

11. The electronic device according to claim 10, wherein the size of the gap in the first direction is 0.1 times or more and 2 times or less the size of the first flow channel width between two adjacent first fins in the second direction.

12. The electronic device according to any one of claims 2 to 11, wherein the plurality of first fins are arranged in a plurality of rows that are arranged in parallel in the first direction.

13. The electronic device according to any one of claims 3 to 12, wherein the first heat dissipation group includes a plurality of first electronic elements arranged in the second direction.

14. The electronic device according to claim 13, wherein the second heat dissipation group includes a plurality of second electronic elements arranged in the second direction.

15. The electronic device according to claim 14, comprising an electronic module including the plurality of first electronic elements and the plurality of second electronic elements, and a support substrate on which the plurality of first electronic elements and the plurality of second electronic elements are mounted and which has a back surface, wherein the heat dissipation module is disposed on the back surface.

16. The electronic device according to claim 15, wherein each of the plurality of first electronic elements and the plurality of second electronic elements is a switching element, and the electronic module includes a half-bridge circuit having an upper arm circuit including the plurality of first electronic elements and a lower arm circuit including the plurality of second electronic elements.

17. An electronic unit comprising: an electronic device according to any one of claims 1 to 15; and a cooling device having a housing section for housing the first fin group and the second fin group, a supply section for supplying a cooling medium to the housing section, and a discharge section for discharging the cooling medium from the housing section.

Images