Semiconductor device, method for manufacturing same, and electronic apparatus

Abstract

Provided are a semiconductor device, a method for manufacturing the same, and an electronic apparatus with which attachment and detachment of a sealing member is facilitated, a residue produced when the sealing member is detached is prevented from affecting the fixing of a mounting member, and a firm and highly accurate fixing can be achieved. The present technology provides, inter alia, a semiconductor device comprising: a detachable sealing member for sealing a semiconductor element; a first fixing surface to which the sealing member is fixed; and a second fixing surface to which a mounting member different from the sealing member is fixed after the sealing member is detached, the first fixing surface and the second fixing surface being different.

Description

Semiconductor device, manufacturing method thereof, and electronic device

[0001] The technology according to the present disclosure (hereinafter also referred to as "the present technology") relates to a semiconductor device, a manufacturing method thereof, and an electronic device.

[0002] In recent years, with the miniaturization and high performance of semiconductor elements such as solid-state imaging devices mounted on electronic devices such as digital cameras and smartphones, further improvements have been demanded for the packages that protect these elements.

[0003] Conventionally, as a package for hermetically sealing a semiconductor element, a sensor package is known in which a hollow portion is formed of ceramic, metal, or the like, and the opening thereof is sealed with a sealing member such as a glass plate. In such a sensor package, generally, in the package manufacturing process, the sealing member is fixed to the package using an adhesive such as a thermosetting resin so as to cover the opening.

[0004] For example, in Patent Document 1, a technology related to "a solid-state imaging device including a solid-state imaging element that receives incident light, a concave-shaped housing portion main body having an opening for housing the solid-state imaging element, a light-transmitting plate that covers the opening, a sealing material that is interposed between the light-transmitting plate and the housing portion main body and seals the solid-state imaging element in the housing portion main body, and a holding member that detachably holds the light-transmitting plate with respect to the housing portion main body" is disclosed.

[0005] Japanese Patent Application Laid-Open No. 2011-243754

[0006] However, the sealing member used here only serves as a temporary fixing for preventing foreign matter from being mixed in and damage during the manufacturing process. Ultimately, this sealing member is expected to be removed and replaced with a mounting member such as a special glass or a set housing according to the application. Therefore, the fixing of the sealing member at this stage needs to be performed in a manner that allows easy removal and leaves no residue on the package side when removed.

[0007] In conventional sensor packages, such as those described in Patent Document 1, once the sealing member is fixed to the package, removing the sealing member leaves resin residue on the adhesive surface between the package and the sealing member, which is difficult to remove. In particular, when thermosetting resin is used, once the resin hardens, it is difficult to completely remove it even with solvents.

[0008] Therefore, even when attempting to attach another component (such as special glass or a set housing) after removing the sealing component, the resin residue would obstruct the attachment, making it difficult to securely fix the component and thus hindering high-precision mounting. Furthermore, the resin residue would impair the airtightness between the package and the attached component, leading to problems such as reduced airtightness and adverse effects on the imaging performance of the image sensor.

[0009] Against this backdrop, further performance improvements in semiconductor devices are desired in this technological field, and in particular, there is a need for technology that facilitates the attachment and detachment of sealing members, and that allows mounting members to be firmly and precisely fixed even after the sealing members have been removed.

[0010] This technology was developed in view of these challenges, and its main objective is to provide a semiconductor device, a method for manufacturing the same, and electronic equipment that facilitates the attachment and detachment of sealing members, prevents residue generated during the removal of sealing members from affecting the fixing of mounting members, and achieves strong and highly accurate fixing.

[0011] This technology provides a semiconductor device comprising: a removable sealing member for sealing a semiconductor element; a first fixing surface to which the sealing member is fixed; and a second fixing surface to which a mounting member different from the sealing member is fixed after the sealing member is removed, wherein the first fixing surface and the second fixing surface are different. A step may be provided between the first fixing surface and the second fixing surface. A groove may be provided between the first fixing surface and the second fixing surface. The heights of the first fixing surface and the second fixing surface may be the same. The semiconductor element may be a solid-state image sensor disposed in a hollow portion. The semiconductor device has a package for housing the semiconductor element, and the package may contain ceramic. The semiconductor device has a package for housing the semiconductor element, and the package may contain an organic substrate. The sealing member may be fixed to the first fixing surface via a thermoplastic resin. The sealing member may be fixed to the first fixing surface via tape. The semiconductor device has a package for housing the semiconductor element, and the package may have a spring portion that presses the sealing member toward the inside of the package. The spring portion may be made of metal or resin. The tip of the spring portion may be circular. The tip of the spring portion may be parallel to the end face of the sealing member. The spring portion may be blackened. The package and the spring portion may be integrally molded. The package and the spring portion may be detachably attached. Multiple spring portions may be provided. Furthermore, this technology provides a method for manufacturing a semiconductor device, which includes removing the sealing member from the semiconductor device and fixing the mounting member to the second fixing surface. The semiconductor device may further include a sealing resin that at least partially covers the semiconductor element, and a dam disposed around the semiconductor element. The dam may have a wall-like structure that restricts the sealing resin from flowing onto the semiconductor element. The first fixing surface may be provided on the upper surface of the dam, and the second fixing surface may be provided on the upper surface of the sealing resin.The first fixing surface is provided on the upper surface of the sealing resin, and the second fixing surface may be provided on the upper surface of the dam. The sealing resin may have a shape formed using a mold. The sealing resin may have a shape formed by a transfer mold. The dam may contain a thermosetting resin or a photocurable resin. The sealing member may be fixed to the first fixing surface via a thermoplastic resin. The sealing member may be fixed to the first fixing surface via tape. Furthermore, this technology provides a method for manufacturing a semiconductor device, comprising the steps of: forming a dam around a semiconductor element; forming a sealing resin so as to at least partially cover the semiconductor element; and fixing a removable sealing member for sealing the semiconductor element to the first fixing surface, wherein a second fixing surface, to which a mounting member different from the sealing member is fixed after the sealing member is removed, is provided at a different position from the first fixing surface. The step of forming the sealing resin may include the step of molding the sealing resin using a mold. The method for manufacturing the semiconductor device may include, after the step of forming the dam, a step of fixing the sealing member, and after the step of fixing the sealing member, a step of forming the sealing resin. The method for manufacturing the semiconductor device may further include a step of removing the sealing member and a step of fixing the mounting member to the second fixing surface. Furthermore, this technology provides electronic equipment including the semiconductor device.

[0012] This is a schematic diagram of semiconductor device 100A according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100B according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100C according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100D according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100E according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100F according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100G according to one embodiment of the present technology. This is a schematic diagram of semiconductor device 100H according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 100I according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 10 This is a schematic diagram of semiconductor device 200A according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200B according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200C according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200D according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200E according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 200 according to one embodiment of the present technology. This is a schematic diagram of semiconductor device 300A according to one embodiment of the present technology.This is an enlarged view of region 87 in Figure 33B. This is a schematic diagram of semiconductor device 300B according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300C according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300D according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to one embodiment of the present technology. This is a schematic plan view and schematic cross-sectional view of semiconductor device 300 according to this embodiment. This is a schematic cross-sectional view of semiconductor device 300E according to one embodiment of this technology. This is a schematic cross-sectional view of semiconductor device 300F according to one embodiment of this technology. This is a schematic diagram of semiconductor device 300G according to one embodiment of this technology. This is a schematic diagram of semiconductor device 300H according to one embodiment of this technology. This is a schematic diagram of semiconductor device 300I according to one embodiment of this technology. This is a block diagram showing an example of the general configuration of an internal body information acquisition system. This is a block diagram showing an example of the general configuration of a vehicle control system. This is an explanatory diagram showing an example of the installation position of an external information detection unit and an imaging unit. This is a schematic cross-sectional view of semiconductor device 900 according to a comparative example of this technology. This is a schematic cross-sectional view of semiconductor device 900 according to a comparative example of this technology. This is a schematic cross-sectional view of semiconductor device 900 according to a comparative example of this technology. This is a schematic cross-sectional view of semiconductor device 400A according to one embodiment of this technology. This is a schematic cross-sectional view of semiconductor device 400A according to one embodiment of this technology.This is a schematic cross-sectional view of semiconductor device 400B according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400B according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400B according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400C according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400C according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400D according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400D according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400D according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400E according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400E according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400E according to one embodiment of the present technology. This is a schematic cross-sectional view of semiconductor device 400F showing an example of the manufacturing process of semiconductor device 400A according to one embodiment of the present technology. This is a schematic cross-sectional view showing an example of the manufacturing process of semiconductor device 400A according to one embodiment of the present technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400A according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400A according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400B according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400B according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400C according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400C according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400E according to one embodiment of this technology. This is a schematic cross-sectional view showing an example of the manufacturing process for semiconductor device 400E according to one embodiment of this technology.

[0013] Hereinafter, preferred embodiments for implementing this technology will be described with reference to the drawings. The embodiments described below are merely examples of typical embodiments of this technology and do not limit the scope of this technology. Furthermore, this technology can be implemented by combining any of the following embodiments and their modifications.

[0014] In the following description of embodiments, configurations may be described using terms with "approximately" attached, such as "approximately parallel" and "approximately orthogonal." For example, "approximately parallel" means not only that they are perfectly parallel, but also that they are substantially parallel, that is, that is, they are deviated from a perfectly parallel state by, for example, a few percent. The same applies to other terms with "approximately." Also, each figure is a schematic diagram and is not necessarily a strictly accurate representation. The scale of the drawings is exaggerated to make the technical features easier to understand. Therefore, it should be noted that the scale of the drawings and the scale of the actual device are not necessarily the same.

[0015] Unless otherwise specified, in drawings, "up" means the upper direction or upper side in the drawing, "down" means the lower direction or lower side in the drawing, "left" means the left direction or left side in the drawing, and "right" means the right direction or right side in the drawing. In addition, in drawings, the same or equivalent elements or components are denoted by the same reference numeral, and redundant explanations are omitted.

[0016] The embodiments described below represent typical embodiments of the Technology and should not be interpreted as narrowing the scope of the Technology. The effects described herein are illustrative and not limiting, and other effects may also exist.

[0017] The explanation will proceed in the following order: 1. First Embodiment of the Technology (Example 1 of a Semiconductor Device) (1) Comparative Example (2) First Example (3) Second Example (4) Third Example (5) Fourth Example (6) Fifth Example (7) Sixth Example (8) Seventh Example (9) Manufacturing Process 2. Second Embodiment of the Technology (Example 2 of a Semiconductor Device) (1) Eighth Example (2) Ninth Example (3) Tenth Example (4) Eleventh Example (5) Twelfth Example (6) Manufacturing Process 3. Third Embodiment of the Technology (Example 3 of a Semiconductor Device) (1) Thirteenth Example (2) Fourteenth Example (3) Attachment and Removal Process of Sealing Member (4) Manufacturing Process (5) Fifteenth Example (6) Sixteenth Example (7) Seventeenth Example (8) Eighteenth Example (9) Nineteenth Example 4. Fourth Embodiment of this Technology (Example 4 of a Semiconductor Device) (1) Configuration of the Semiconductor Device (2) Modification: Configuration of the Fixed Surface (3) Modification: Shape of the Sealing Resin (4) Operation and Effects of this Embodiment (5) Manufacturing Process (5-1) Manufacturing Process of Semiconductor Device 400A (5-2) Manufacturing Process of Semiconductor Device 400B (5-3) Manufacturing Process of Semiconductor Devices 400C to 400F 5. Fifth Embodiment of this Technology (Example of Application to an In-Body Information Acquisition System) 6. Sixth Embodiment of this Technology (Example of Application to a Mobile Device)

[0018] [1. First Embodiment of the Technology (Example 1 of a Semiconductor Device)] [(1) Comparative Example] First, before describing the embodiments of the Technology, a comparative example of the Technology will be described with reference to Figures 60 to 62. Figures 60 to 62 are schematic cross-sectional views of a semiconductor device 900 according to a comparative example of the Technology.

[0019] As shown in Figure 60, the semiconductor device 900 includes a solid-state image sensor 1, which is an example of a semiconductor element, a package 910 that houses the solid-state image sensor 1, and a sealing member 920 that seals the opening of the package 910.

[0020] The package 910 forms an internal space 913 for housing the solid-state image sensor 1 inside.

[0021] A solid-state image sensor 1 is mounted in the internal space 913 via a die bond material or the like. The electrode pads (not shown) of the solid-state image sensor 1 and the electrode pads (not shown) of the package 910 are electrically connected by wires 3.

[0022] The opening of the package 910 is sealed by a sealing member 920. The sealing member 920 is, for example, a glass plate, and is fixed to the upper surface of the frame 912 via a thermosetting resin 921.

[0023] In the manufacturing process of package 910, the sealing member 920 is fixed to cover the opening of package 910 using thermosetting resin 921. When the sealing member 920 is removed after sealing, as shown in Figure 61, residue of thermosetting resin 921 remains on the upper surface of package 910 (i.e., the mounting surface of the sealing member 920), and it is difficult to remove.

[0024] As shown in Figure 62, when fixing the mounting member (for example, the set housing 31) to the package 910 after removing the sealing member 920, the residue of the thermosetting resin 921 becomes an obstacle to fixing, making it impossible to firmly secure the mounting member. In addition, the residue of the thermosetting resin 921 reduces the mounting accuracy of the mounting member, leading to problems such as worsening of the tilt of the set housing 31 or impaired adhesion with the set housing 31.

[0025] Thus, in the semiconductor device 900 of the comparative example, the problem of resin residue adversely affects the adhesion and mounting accuracy of the mounting member. In this technical field, further performance improvements of semiconductor devices are desired, and in particular, it is desired to facilitate the attachment and detachment of sealing members, firmly fix the mounting member after the sealing member is removed, and achieve high-precision mounting.

[0026] [(2) First Embodiment] The present invention provides a semiconductor device comprising a removable sealing member for sealing a semiconductor element, a first fixing surface to which the sealing member is fixed, and a second fixing surface to which a mounting member different from the sealing member is fixed after the sealing member has been removed, wherein the first fixing surface and the second fixing surface are different.

[0027] Figure 1 is a schematic diagram of a semiconductor device 100A according to one embodiment of the present technology. Figure 1A is a schematic top view of the semiconductor device 100A, Figure 1B is a cross-sectional view taken along line A-A in Figure 1A, and Figure 1C is a schematic bottom view of the semiconductor device 100A.

[0028] The semiconductor device 100A includes a solid-state image sensor 1, which is an example of a semiconductor element; a package 10 that houses the solid-state image sensor 1; and a sealing member 20 that seals the opening of the package 10.

[0029] As shown in Figure 1B, the package 10 forms an internal space 13 for housing the solid-state image sensor 1 inside.

[0030] A solid-state image sensor 1 is mounted in the internal space 13 via a die bond material (not shown). The electrode pads (not shown) of the solid-state image sensor 1 and the electrode pads (not shown) of the package 10 are electrically connected by wires 3.

[0031] Examples of solid-state image sensors 1 include CCD (Charge Coupled Device) image sensors and CMOS (Complementary Metal Oxide Semiconductor) image sensors.

[0032] The opening (internal space 13) of the package 10 is sealed by a sealing member 20. The sealing member 20 is, for example, a glass plate and is fixed to the upper surface of the frame 12 via a thermoplastic resin 21.

[0033] By placing the solid-state image sensor 1 within the internal space 13 and hermetically sealing it with the package 10, the solid-state image sensor 1 can be protected from external environmental factors such as dust and moisture.

[0034] In this embodiment, a step 14 is provided on the upper surface of the package 10. The step 14 distinguishes between a first fixing surface 15 to which the sealing member 20 is fixed and a second fixing surface 16 to which the mounting member (for example, special glass or a set housing) is fixed after the sealing member 20 has been removed.

[0035] Figure 2 is a schematic cross-sectional view of a semiconductor device 100B according to one embodiment of this technology. After removing the sealing member 20, the special glass 30 is fixed to the second fixing surface 16 as a mounting member, as shown in Figure 2. The special glass 30 is a glass with various functions depending on the application, such as an optical filter that transmits light in a specific wavelength band, a cut filter that blocks light in a specific wavelength band, or a mirror that reflects light in a specific wavelength band.

[0036] The special glass 30 is bonded to the second fixing surface 16 using an adhesive 7, such as epoxy resin, silicone resin, or acrylic resin. Note that other fixing methods besides the adhesive 7 may be used to fix the special glass 30; for example, tape or mechanical fixing means (such as screws or clamps) may be used.

[0037] Figure 3 is a schematic cross-sectional view of a semiconductor device 100C according to one embodiment of the present technology. As shown in Figure 3, a set housing 31 may be fixed to the second fixing surface 16 as a mounting member. The set housing 31 is, for example, a housing used when mounting a semiconductor device onto a final product (e.g., a digital camera, smartphone, in-car camera, medical camera, etc.). The set housing 31 is formed from a material such as metal (e.g., aluminum, stainless steel, copper, etc.) or resin (e.g., polycarbonate, ABS resin, etc.) and is fixed to the second fixing surface 16 using an adhesive 7 such as epoxy resin or mechanical fixing means such as screws.

[0038] In addition to adhesive 7 and screws, other methods of fixing the set housing 31 may also be used, such as tape or a fixing method using an engaging structure (e.g., claws or hooks).

[0039] Here, "the first fixed surface 15 and the second fixed surface 16 are different" means that the first fixed surface 15 and the second fixed surface 16 are not on the same plane. For example, in this embodiment, the first fixed surface 15 and the second fixed surface 16 are separated by a step 14 and are provided at different heights. In this embodiment, the first fixed surface 15 is provided at a higher position than the second fixed surface 16.

[0040] Note that the first fixing surface 15 and the second fixing surface 16 are not limited to being provided at different heights. For example, as will be described later, they may be partitioned by grooves.

[0041] Also, the first fixing surface 15 and the second fixing surface 16 may be provided on different surfaces even if they are at the same height. The width of the first fixing surface 15 and the width of the second fixing surface 16 may be the same or different.

[0042] In this embodiment, an example using a solid-state imaging device as a semiconductor element has been described, but the present technology is not limited to this, and can also be applied to other semiconductor elements (for example, MEMS sensors).

[0043] Also, in this embodiment, an example using a glass plate as a sealing member has been described, but the present technology is not limited to this, and a sealing member made of other materials (for example, resin) may be used.

[0044] The package 10 may have a space for providing a target mark (not shown) on the solid-state imaging device 1. The target mark is used, for example, for alignment of the package and inspection of the solid-state imaging device 1.

[0045] According to the present technology, by providing the step 14 in the package 10, the first fixing surface 15 for fixing the sealing member 20 and the second fixing surface 16 for fixing the mounting member can be partitioned. Therefore, when the sealing member 20 is removed, it is possible to prevent the residue of the thermoplastic resin 21 remaining on the first fixing surface 15 from adhering to the second fixing surface 16.

[0046] As a result, the mounting member can be firmly fixed to the second fixing surface 16, and high-precision attachment can be realized. In addition, it is possible to prevent deterioration of the warp of the set housing and inhibition of adhesion, and to facilitate thinning of the set.

[0047] Note that in this embodiment, the first fixing surface 15 is made higher than the second fixing surface 16, but the first fixing surface 15 may be made lower than the second fixing surface 16. <​Further, the width and height of the step 14 can be appropriately set according to the size of the package 10, the type and dimensions of the sealing member 20, the mounting member, etc.

[0049] Note that the effects described in this specification are merely illustrative and not limiting, and there may be other effects.

[0050] [(3) Second Embodiment] FIG. 4 is a schematic cross-sectional view of a semiconductor device 100D according to an embodiment of the present technology. As shown in FIG. 4, the method of fixing the sealing member 20 is not limited to adhesion using the thermoplastic resin 2, and for example, the sealing member 20 may be fixed via a tape 40. As the tape 40, for example, an adhesive tape in which an adhesive such as an acrylic adhesive, a silicone adhesive, or a rubber adhesive is applied to a base material such as a polyethylene terephthalate (PET) film, a polyimide film, or a polyester film can be used.

[0051] Generally, the thermoplastic resin 21 needs to be heated to its melting temperature. On the other hand, the tape 40 can adhere to the sealing member 20 without heating or at a temperature lower than the melting temperature of the thermoplastic resin 21. Therefore, by using the tape 40, thermal damage to the solid-state imaging device 1 can be reduced.

[0052] Further, since the tape 40 generally has a weaker adhesive force than the thermoplastic resin 21, the sealing member 20 can be easily removed. Specifically, when the thermoplastic resin 21 is used, when removing the sealing member 20, the melted and solidified resin may adhere to the first fixing surface 15 or the sealing member 20 and become a residue. On the other hand, when the tape 40 is used, since the tape 40 adheres to the sealing member 20 while maintaining a solid state, it is difficult for a residue to remain.

[0053] The procedure for fixing the sealing member 20 using the tape 40 is as follows. First, the tape 40 is attached to either the first fixing surface 15 or the sealing member 20. Next, the sealing member 20 is aligned with the first fixing surface 15, and the two are bonded together via the tape 40.

[0054] [(4) Third Embodiment] Figure 5 is a schematic cross-sectional view of a semiconductor device 100E according to one embodiment of the present technology. As shown in Figure 5, there may be two or more steps. For example, the package 10 may be provided with two steps 14a and 14b. In this case, the highest surface can be used to fix the sealing member 20, the intermediate height surface can be used to fix the set housing 31, and the lowest surface can be used to fix the special glass 30.

[0055] In this way, by providing two or more steps, it becomes possible to fix the sealing member 20, the special glass 30, and the set housing 31 at different heights, further increasing the design flexibility. In addition, each step acts as a buffer zone, preventing, for example, the resin used at the top step from flowing down to the step below.

[0056] When two or more steps are provided, the height and width of each step can be appropriately set according to the size of the package 10, the type and dimensions of the sealing member 20 and mounting member, etc.

[0057] [(5) Fourth Embodiment] Figure 6 is a schematic cross-sectional view of a semiconductor device 100F according to one embodiment of the present technology. As shown in Figure 6, the first fixed surface 15 may be positioned closer to the semiconductor element (solid-state image sensor 1) than the second fixed surface 16. That is, the surface located on the inner circumference side (solid-state image sensor 1 side) of the package 10 may be the first fixed surface 15, and the surface located on the outer circumference side may be the second fixed surface 16.

[0058] In this way, by positioning the first fixed surface 15 closer to the semiconductor element (solid-state image sensor 1) than the second fixed surface 16, the sealing member 20 can be positioned closer to the solid-state image sensor 1.

[0059] This reduces the risk of the mounting member coming into contact with the solid-state image sensor 1 or wire 3 when fixing the mounting member to the second fixing surface 16 after removing the sealing member 20. This is particularly effective when using tall mounting members or when fixing the mounting member with a thick adhesive.

[0060] [(6) Fifth Embodiment] Figure 7 is a schematic cross-sectional view of a semiconductor device 100G according to one embodiment of the present technology. As shown in Figure 7, the second fixed surface 16 may be a slope that inclins downward toward the inner circumference side (solid-state image sensor 1 side) of the package 10.

[0061] Thus, by making the second fixing surface 16 an inclined surface, there is an advantage in that the positioning of the mounting member (for example, the special glass 30 or the set housing 31) becomes easier when fixing the mounting member to the second fixing surface 16. Specifically, by sliding the mounting member along the inclined surface, the mounting member can be easily guided to the predetermined position.

[0062] Furthermore, by creating an inclined surface, the contact area between the mounting member and the second fixing surface 16 can be increased, thereby improving the fixing strength of the mounting member.

[0063] Furthermore, creating a slope has the advantage of making it easier for the adhesive to flow along the slope when applied, thus facilitating uniform application of the adhesive.

[0064] The inclination angle of the second fixing surface 16 can be appropriately set according to the type and dimensions of the mounting member, the type of adhesive, the required fixing strength, etc. For example, the inclination angle can be set to about 10 to 45 degrees.

[0065] Furthermore, the second fixed surface is not limited to a planar inclined surface with a constant angle of inclination, as shown in Figure 7, but may also be a curved inclined surface. Moreover, an inclined surface may be provided only on a part of the second fixed surface, with the remaining part being a horizontal surface.

[0066] [(7) Sixth Embodiment] Figure 8 is a schematic diagram of a semiconductor device 100H according to one embodiment of the present technology. Figure 8A is a schematic cross-sectional view of 100H, and Figure 8B is a cross-sectional view taken along line A-A in Figure 8A.

[0067] In this embodiment, the package 110 includes ceramic. The package 110 has a ceramic substrate 51 and a frame-shaped frame 52 provided on the ceramic substrate 51. That is, the package 110 in this embodiment is a so-called frame + ceramic package. The frame 52 is formed of an insulating material such as ceramic. The ceramic can be an inorganic material such as alumina (Al2O3) or aluminum nitride (AlN).

[0068] Similar to the first embodiment, a step 14 is provided on the upper surface of the frame 52. The step 14 separates a first fixing surface 15 to which the sealing member 20 is fixed and a second fixing surface 16 to which the mounting member is fixed after the sealing member 20 is removed.

[0069] In this embodiment as well, the same effects and advantages as in the first embodiment can be obtained. In particular, ceramics have high thermal conductivity and excellent heat resistance, mechanical strength, and electrical insulation properties. Furthermore, because they are chemically stable, they are less susceptible to corrosion and degradation, and can maintain stable performance over a long period of time. Due to these characteristics, ceramics are very suitable as packaging materials for semiconductor devices.

[0070] Furthermore, ceramics have a low coefficient of thermal expansion, which is advantageous because they are less prone to warping when the solid-state image sensor 1 is mounted on them. Therefore, it is possible to suppress the degradation of the quality of the captured image.

[0071] [(8) Seventh Embodiment] Figure 9 is a schematic cross-sectional view of a semiconductor device 100I according to one embodiment of the present technology. In this embodiment, the package 120 includes an organic substrate 61. The package 120 has an organic substrate 61 and a frame-shaped frame 62 provided on the organic substrate 61. That is, the package 120 of this embodiment is a so-called frame + organic substrate package. The frame 62 is formed of an organic material such as glass epoxy resin or a metal material, for example.

[0072] Similar to the first embodiment, a step 14 is provided on the upper surface of the frame 62. The step 14 separates a first fixing surface 15 to which the sealing member 20 is fixed and a second fixing surface 16 to which the mounting member is fixed after the sealing member 20 is removed.

[0073] In this embodiment as well, the same effects and advantages as in the first embodiment can be obtained. In particular, the organic substrate 61 has the advantage of reducing stress on the solid-state image sensor 1 due to temperature changes, because its thermal expansion coefficient is closer to that of the solid-state image sensor 1 compared to the ceramic substrate.

[0074] Specifically, the thermal expansion coefficient of a ceramic substrate is approximately 7 ppm / °C, while that of an organic substrate (e.g., a glass epoxy substrate) is approximately 15 ppm / °C. On the other hand, the thermal expansion coefficient of the solid-state image sensor 1 is approximately 10 to 20 ppm / °C.

[0075] Therefore, by using an organic substrate, the difference in thermal expansion between the solid-state image sensor 1 and the package 710 can be reduced compared to when a ceramic substrate is used, thereby reducing stress on the solid-state image sensor 1 due to temperature changes. This improves the reliability and lifespan of the solid-state image sensor 1.

[0076] [(9) Manufacturing Process] The manufacturing process of the semiconductor device 100 according to this embodiment will be described with reference to Figures 10 to 18. Figures 10 to 18 are schematic cross-sectional views of the semiconductor device 100 according to one embodiment of this technology.

[0077] First, as shown in Figure 10, the solid-state image sensor 1 is mounted in the opening of the package 10 using a die bond material (not shown). As the die bond material, for example, an adhesive such as epoxy resin or silicone resin can be used.

[0078] Next, as shown in Figure 11, the electrode pads (not shown) of the solid-state image sensor 1 and the electrode pads (not shown) of the package substrate 11 are electrically connected by wire bonding using wire 3. For example, metal wires such as gold (Au), aluminum (Al), and copper (Cu) can be used as wire 3.

[0079] Next, as shown in Figure 12, a thermoplastic resin 21 is applied to the first fixing surface 15 of the package 10. For example, the thermoplastic resin 21 can be polyethylene, polypropylene, polystyrene, or other thermoplastic resins.

[0080] Next, as shown in Figure 13, a sealing member 20 (for example, a glass plate) is placed on the first fixing surface 15 to which the thermoplastic resin 21 has been applied, and the thermoplastic resin 21 is melted by heating, then cooled and solidified to fix the sealing member 20 to the package 10.

[0081] Next, the sealing member 20 is removed in order to fix the mounting member (for example, special glass or set housing). The sealing member 20 can be removed by, for example, attaching double-sided tape 81 to the upper surface of the sealing member 20 as shown in Figure 14. Then, as shown in Figure 15, fixing a jig 82 (for example, a rectangular block) to the double-sided tape 81, and then pulling the jig 82 upwards on the package 10.

[0082] After removing the sealing member 20, the special glass 30 is fixed to the second fixing surface 16 as a mounting member, as shown in Figure 16. The special glass 30 is a type of glass with various functions depending on the application, such as an optical filter that transmits light in a specific wavelength range or a cut filter that blocks light in a specific wavelength range. The special glass 30 is bonded to the second fixing surface 16 using an adhesive 7, such as epoxy resin.

[0083] Furthermore, as shown in Figure 17, the set housing 31 may be fixed to the second fixing surface 16 as a mounting member. The set housing 31 is, for example, a housing used when mounting the semiconductor device 100 onto the final product. The set housing 31 is formed from a material such as metal or resin and is fixed to the second fixing surface 16 using an adhesive 7 such as epoxy resin.

[0084] Alternatively, as shown in Figure 18, the relative positions of the first fixing surface 15 and the second fixing surface 16 may be reversed. That is, the surface located on the inner circumference may be designated as the first fixing surface 15, and the surface located on the outer circumference may be designated as the second fixing surface 16. In this case, the sealing member 20 is fixed to the first fixing surface 15, and the mounting member (special glass 30 or set housing 31) is fixed to the second fixing surface 16A.

[0085] The above description of the semiconductor device according to this embodiment can be applied to other embodiments of this technology, unless there are any particular technical inconsistencies.

[0086] [2. Second Embodiment of the Technology (Example 2 of a Semiconductor Device)] [(1) Eighth Embodiment] Figure 19 is a schematic diagram of a semiconductor device 200A according to one embodiment of the Technology. Figure 19A is a schematic top view of the semiconductor device 200A, Figure 19B is a cross-sectional view taken along line A-A of Figure 19A, and Figure 19C is a schematic bottom view.

[0087] This embodiment is a modification of the first embodiment, differing in that a groove is provided on the upper surface of the frame. The following description will focus on the differences from the first embodiment.

[0088] In this embodiment, a groove 57 is provided on the upper surface of the frame 52. The groove 57 is formed between a first fixing surface 15 to which the sealing member 20 is fixed and a second fixing surface 16 to which the mounting member is fixed after the sealing member 20 is removed. The first fixing surface 15 and the second fixing surface 16 are spaced apart via the groove 57.

[0089] The groove 57 is formed in an annular shape along the outer circumference of the package 50. The cross-sectional shape of the groove 57 is, for example, rectangular.

[0090] According to this embodiment, by providing a groove 57 on the upper surface of the frame 52, when removing the sealing member 20, the residue of thermoplastic resin 21 remaining on the first fixing surface 15 can be contained within the groove 57 and more reliably prevented from flowing onto the second fixing surface 16. As a result, the mounting member can be fixed more firmly to the second fixing surface 16, enabling high-precision mounting.

[0091] In this embodiment, the first fixing surface 15 and the second fixing surface 16 provided on the upper surface of the frame 52 are spaced apart via a groove 57, but their heights are the same (i.e., they are the same height from the upper surface of the ceramic substrate 51).

[0092] In this way, by making the heights of the first fixing surface 15 and the second fixing surface 16 the same, the heights of the sealing member 20 and the mounting member can be made the same, which makes it easier to control the height dimensions when mounting the semiconductor device 200A onto the final product.

[0093] In addition, compared to creating steps in the manufacturing process, making the first fixing surface 15 and the second fixing surface 16 the same height has the advantage of making the manufacturing of the package 50 (especially the frame 52) easier.

[0094] In this embodiment, since a groove 57 is provided between the first fixing surface 15 and the second fixing surface 16, even if the heights of the two surfaces are the same, it is possible to prevent resin residue (for example, residue of thermoplastic resin 21) generated when the sealing member 20 is removed from adhering to the second fixing surface 16. As a result, the mounting member can be firmly adhered to the second fixing surface 16, enabling high-precision mounting.

[0095] [(2) Ninth Embodiment] Figure 20 is a schematic cross-sectional view of a semiconductor device 200B according to one embodiment of the present technology. As shown in Figure 20, in this embodiment, the height of the second fixed surface 16 is formed to be higher than the height of the first fixed surface 15. Specifically, the height of the second fixed surface 16, which is located on the outer circumference side, from the upper surface of the ceramic substrate 51 is higher than that of the first fixed surface 15, which is located on the inner circumference side (solid-state image sensor 1 side) of the frame 52.

[0096] In this way, by making the second fixing surface 16 higher than the first fixing surface 15, the risk of the mounting member (for example, the special glass 30 or the set housing 31) coming into contact with the solid-state image sensor 1 or the wire 3 when fixing the mounting member (for example, the special glass 30 or the set housing 31) to the second fixing surface 16 after removing the sealing member 20 can be reduced. This is particularly effective when using tall mounting members or when fixing mounting members with a thick adhesive.

[0097] In Figure 20, an example is shown where the height of the second fixing surface 16 is higher than that of the first fixing surface 15. However, the opposite is also possible: the height of the first fixing surface 15 may be higher than that of the second fixing surface 16.

[0098] [(3) Tenth Embodiment] Figure 21 is a schematic cross-sectional view of a semiconductor device 200C according to one embodiment of the present technology. As shown in Figure 21, in this embodiment, the cross-sectional shape of the groove 57 is formed in a V shape.

[0099] In this way, by forming the groove 57 in a V-shape, when removing the sealing member 20, any residue such as the thermoplastic resin 21 remaining on the first fixing surface 15 is more easily guided into the groove 57. As a result, it is possible to more effectively prevent the residue from spreading to the second fixing surface 16.

[0100] [(4) Eleventh Embodiment] Figure 22 is a schematic cross-sectional view of a semiconductor device 200D according to one embodiment of the present technology. As shown in Figure 22, in this embodiment, the bottom of the groove 57 is formed in a rounded shape (arc shape).

[0101] In this way, by rounding the bottom of the groove 57, when removing the sealing member 20, any residue such as thermoplastic resin 21 remaining on the first fixing surface 15 can be easily collected at the bottom of the groove 57. As a result, it is possible to more effectively prevent residue from spreading to the second fixing surface 16. In addition, rounding the bottom of the groove 57 has the advantage of suppressing the occurrence of defects such as cracks at the bottom of the groove 57.

[0102] [(5) Twelfth Embodiment] Figure 23 is a schematic cross-sectional view of a semiconductor device 200E according to one embodiment of the present technology. As shown in Figure 23, in this embodiment, the width of the first fixed surface 15 is formed to be longer than the width of the second fixed surface 16. Specifically, the width of the first fixed surface 15 located on the inner circumference side (solid-state image sensor 1 side) of the frame 52 is, for example, 4.5 mm, and the width of the second fixed surface 16 located on the outer circumference side is, for example, 3.0 mm.

[0103] In this way, by making the width of the first fixing surface 15 longer than the width of the second fixing surface 16, the sealing member 20 can be fixed more stably. In particular, when the sealing member 20 is fixed using a fixing material such as thermoplastic resin or tape, a sufficient bonding area can be secured, thereby increasing the fixing strength of the sealing member 20.

[0104] In Figure 23, an example is shown where the width of the first fixing surface 15 is longer than the width of the second fixing surface 16. However, the opposite may be true: the width of the second fixing surface 16 may be longer than the width of the first fixing surface 15. In this case, a larger area can be secured for fixing the mounting member (for example, the special glass 30 or the set housing 31), thereby increasing the fixing strength of the mounting member.

[0105] Furthermore, the cross-sectional shape of the groove 57 is not limited to the shape described above. The width of the groove 57 is not limited to the value described above and can be set appropriately according to the size of the package 50, the type and dimensions of the sealing member 20 and mounting member, etc.

[0106] [(6) Manufacturing Process] The manufacturing process of the semiconductor device 200 according to this embodiment will be described with reference to Figures 24 to 32. Figures 24 to 32 are schematic cross-sectional views of the semiconductor device 200 according to one embodiment of this technology.

[0107] First, as shown in Figure 24, a package 50 is prepared in which a frame-shaped frame 52 is provided on a ceramic substrate 51. A groove 57 is formed on the upper surface of the frame 52, which separates the first fixing surface 15 and the second fixing surface 16.

[0108] A solid-state image sensor 1 is mounted on the upper surface of the ceramic substrate 51 of this package 50 using a die-bonding material (not shown).

[0109] Next, as shown in Figure 25, the electrode pads (not shown) of the solid-state image sensor 1 and the electrode pads (not shown) of the ceramic substrate 51 are electrically connected by wire bonding using wire 3.

[0110] Next, as shown in Figure 26, a thermoplastic resin 21 is applied to the first fixing surface 15 on the upper surface of the frame 52. For example, a thermoplastic resin such as polyethylene, polypropylene, or polystyrene can be used as the thermoplastic resin 21.

[0111] Next, as shown in Figure 27, a sealing member 20 (for example, a glass plate) is placed on the first fixing surface 15 to which the thermoplastic resin 21 has been applied, and the sealing member 20 is fixed to the frame 52 by heating to melt the thermoplastic resin 21 and then cooling to solidify it.

[0112] Alternatively, as shown in Figure 28, the relative positions of the first fixing surface 15 and the second fixing surface 16 may be reversed. That is, the surface located on the outer circumference of the frame 52 may be designated as the first fixing surface 15, and the surface located on the inner circumference may be designated as the second fixing surface 16. In this case, the sealing member 20 is fixed to the first fixing surface 15, and the mounting member (special glass 30 or set housing 31) is fixed to the second fixing surface 16.

[0113] Alternatively, although not shown in the illustration, the sealing member 20 may be fixed to the first fixing surface 15 using tape instead of the thermoplastic resin 21.

[0114] Next, the sealing member 20 is removed in order to fix the mounting member (for example, special glass or set housing). The sealing member 20 can be removed by, for example, attaching double-sided tape 81 to the upper surface of the sealing member 20 as shown in Figure 29. Then, as shown in Figure 30, a jig 82 (for example, a rectangular block) is attached to the double-sided tape 81, and the jig 82 is pulled upwards on the package 50.

[0115] After removing the sealing member 20, the special glass 30 is fixed to the second fixing surface 16 as a mounting member, as shown in Figure 31. The special glass 30 is a type of glass with various functions depending on the application, such as an optical filter that transmits light in a specific wavelength range or a cut filter that blocks light in a specific wavelength range. The special glass 30 is bonded to the second fixing surface 16 using an adhesive 7, such as epoxy resin.

[0116] Furthermore, as shown in Figure 32, the set housing 31 may be fixed to the second fixing surface 16 as a mounting member. The set housing 31 is, for example, a housing used when mounting the semiconductor device 200 onto the final product. The set housing 31 is formed from a material such as metal or resin and is fixed to the second fixing surface 16 using an adhesive 7 such as epoxy resin or mechanical fastening means such as screws.

[0117] The above description of the semiconductor device according to this embodiment can be applied to other embodiments of this technology, unless there are any particular technical inconsistencies.

[0118] [3. Third Embodiment of the Technology (Example 3 of a Semiconductor Device)] [(1) Thirteenth Embodiment] Figure 33 is a schematic diagram of a semiconductor device 300A according to one embodiment of the Technology. Figure 33A is a schematic top view of the semiconductor device 300A, Figure 33B is a cross-sectional view taken along line A-A of Figure 33A, and Figure 33C is a cross-sectional view taken along line B-B of Figure 33A.

[0119] In this embodiment, the package 10 has a spring portion 85 that presses the sealing member 20 toward the inside of the package 10. The spring portion 85 extends from the frame 12 toward the sealing member 20 and is positioned to press against the end face of the sealing member 20. The sealing member 20 is fixed to the first fixed surface 15.

[0120] The spring portion 85 is made of metal or resin. Specifically, the spring portion 85 can be made of a metal material such as a Cu alloy or a Ni alloy. These metal materials have the advantage of having excellent elastic deformability and being easy to process into a desired shape. Alternatively, the spring portion 85 can also be made of an engineering plastic such as polyacetal, polycarbonate, or polyamide. These resin materials have the advantage of being lightweight and having excellent chemical resistance and wear resistance.

[0121] The frame 12 has a canopy shape 86 to prevent the sealing member 20 from coming off. The canopy shape 86 is formed to protrude on the inner circumference of the frame 12 and covers the end face and top surface of the sealing member 20. By providing the canopy shape 86, it is possible to prevent the sealing member 20 from falling out of the package 10.

[0122] Figure 34 is an enlarged view of region 87 in Figure 33B. As shown in Figure 34, it is preferable to apply a black treatment (for example, black nickel plating, blackening treatment, etc.) to the surface 88 of the spring portion 85. By applying a black treatment, it is possible to prevent light reflection from the spring portion 85 and prevent unwanted light from entering the solid-state image sensor 1. Specifically, black nickel plating is a type of nickel plating that forms a black film on the surface. Blackening treatment is a treatment that chemically oxidizes the metal surface to form a black oxide film. Both of these black treatments have the effect of suppressing light reflection.

[0123] The spring portion 85 has a V-shaped bend, and one end of it is fitted into a recess (groove) formed in the frame 12.

[0124] D1 indicates the thickness of the spring portion 85, which can be, for example, 0.1 to 0.125 mm. The shape of the spring portion 85 is not particularly limited and may be other shapes (e.g., U-shaped, wave-shaped, coil-shaped, etc.) depending on the application. The other end of the spring portion 85 abuts against the sealing member 20 (e.g., a glass plate), which is the fixed member, and its elastic force presses the sealing member 20 toward the inside of the package 10. D2 indicates the width of the spring portion 85, which can be, for example, 1 to 2 mm. D3 indicates the height of the spring portion 85, which can be, for example, 0.5 to 1 mm.

[0125] The shape and dimensions of the spring portion 85 (especially the dimensions of D1 and D2) are appropriately designed to firmly fix the sealing member 20 while allowing for easy removal. Specifically, increasing the dimension of D2 can strengthen the fixing force of the spring portion 85, but if it is too large, it becomes difficult to attach and detach the spring portion 85. On the other hand, decreasing the dimension of D2 makes it easier to attach and detach the spring portion 85, but if it is too small, sufficient fixing force cannot be obtained. Therefore, the dimension of D2 is determined by considering these balances.

[0126] Furthermore, the thickness D1 of the spring portion 85 is determined according to the required spring force (the force pressing the sealing member 20). Generally, increasing the thickness D1 of the spring portion 85 increases the spring force.

[0127] It should be noted that this figure merely shows one example of a fixing structure using a spring, and the actual structure can vary considerably depending on the application and required performance. For example, the shape and material of the spring portion 85, the shape of the frame 12, and the shape and depth of the recess are not limited to those shown in the figure.

[0128] After removing the sealing member 20, the result is as shown in Figure 35. Figure 35 is a schematic diagram of a semiconductor device 300B according to one embodiment of this technology. Figure 35A is a schematic top view of the semiconductor device 300B, Figure 35B is a cross-sectional view taken along line A-A in Figure 35A, and Figure 35C is a cross-sectional view taken along line B-B in Figure 35A.

[0129] Subsequently, as shown in Figure 36, the special glass 30 is fixed to the second fixing surface 16 as a mounting member. Figure 36 is a schematic cross-sectional view of a semiconductor device 300C according to one embodiment of this technology. The special glass 30 is a glass with various functions depending on the application, such as an optical filter that transmits light in a specific wavelength band or a cut filter that blocks light in a specific wavelength band. The special glass 30 is bonded to the second fixing surface 16 using an adhesive 7 such as epoxy resin.

[0130] According to this embodiment, by using the spring portion 85, the sealing member 20 can be fixed solely by the elastic force of the spring portion 85, without the need to use adhesives such as thermoplastic resin or tape. This eliminates the need to wait for the adhesive to harden, making assembly and disassembly easier. Furthermore, it avoids the problem of adhesive residue, making it useful, for example, in applications where the sealing member 20 is fixed in a semiconductor device package and then replaced with special glass or a set housing in a later process.

[0131] Furthermore, by adjusting the elastic force of the spring portion 85, it is possible to achieve both strong fixing and easy removal of the sealing member 20. Specifically, by adjusting the material, shape, dimensions, etc., of the spring portion 85, the elastic force of the spring portion 85 can be optimized so that the sealing member 20 is securely fixed while being easily removable.

[0132] Furthermore, by applying a black coating to the spring portion 85, light reflection at the spring portion 85 can be prevented, thus preventing unwanted light from entering the solid-state image sensor 1. This improves the quality of the captured image.

[0133] [(2) Fourteenth Embodiment] Figure 37 is a schematic cross-sectional view of a semiconductor device 300D according to one embodiment of the present technology. As shown in Figure 37, in this embodiment, a plurality of spring portions 85 are arranged to sandwich the sealing member 20 from two opposing sides. By arranging a plurality of spring portions 85 to sandwich the sealing member 20 in this way, the sealing member 20 can be fixed more stably.

[0134] [(3) Installation and Removal Process of Sealing Members] The installation and removal process of sealing members will be described with reference to Figures 38 to 45. Figures 38 to 45 are schematic cross-sectional views of a semiconductor device 300 according to one embodiment of this technology.

[0135] First, as shown in Figure 38, the jig 82 is attached to the sealing member 20 (for example, a glass plate) via double-sided tape (not shown) or the like.

[0136] Next, as shown in Figure 39, the sealing member 20 is fixed to the first fixing surface 15 of the frame 12 by utilizing the elastic force of the spring portion 85. Specifically, first, the spring portion 85 is pushed outward and the sealing member 20 is inserted into the opening of the frame 12.

[0137] Next, as shown in Figure 40, the spring portion 85 presses the sealing member 20 inward, and the overhang shape 86 is positioned to cover the end face and top surface of the sealing member 20. The force pressing the sealing member 20 inward (pressing force) can be appropriately set by adjusting the material, shape, dimensions, etc., of the spring portion 85.

[0138] Next, as shown in Figure 41, the jig 82 that was attached to the sealing member 20 is removed.

[0139] Next, the sealing member 20 is removed in order to fix the mounting member (for example, the special glass 30 or the set housing 31). When removing the sealing member 20, first, as shown in Figure 42, the jig 82 is attached to the sealing member 20 via double-sided tape (not shown) or the like.

[0140] Next, as shown in Figure 43, the spring portion 85 is pushed outward to create a gap between the sealing member 20 and the frame 12 (specifically, the canopy shape 86). Then, as shown in Figures 44 and 45, the sealing member 20 is removed through that gap.

[0141] Although not shown in the diagram, after removing the sealing member 20, a special glass or set housing is fixed to the second fixing surface 16 as a mounting member.

[0142] [(4) Manufacturing Process] The manufacturing process of the semiconductor device 300 according to this embodiment will be described with reference to Figures 46 to 51. Figures 46 to 51 are schematic plan views and schematic cross-sectional views of the semiconductor device 300 according to this embodiment.

[0143] This embodiment describes a manufacturing method in which a resin frame is molded using a metal mold, and a metal spring is attached to the frame. Specifically, the frame is manufactured by separately molding the upper and lower parts of the frame from resin and then bonding them together. In addition, a structure for attaching the metal spring is formed on the upper part of the frame.

[0144] First, as shown in Figure 46 (Figure 46A is a schematic plan view, and Figure 46B is a cross-sectional view along line A-A in Figure 46A), the basic shape of the upper part of the frame is molded from resin using a metal mold. In this process, a metal frame 92 is first manufactured, which includes a metal spring and an outer frame 85b for supporting and positioning it.

[0145] For the metal frame 92, metal materials such as Cu alloy, Ni alloy, and stainless steel can be used. These metal materials are suitable as spring materials because they have excellent workability and can provide the desired spring characteristics.

[0146] The metal frame 92 can be manufactured, for example, by pressing or etching a metal sheet. At this stage, as shown in Figure 46A, the metal frame 92 is formed to include a plurality of protrusions 92a, an outer frame 85b that supports them, and connecting parts 92b that connect each protrusion 92a to the outer frame 85b.

[0147] Next, as shown in Figure 47, the tip of each protrusion 92a is processed to form a spring portion 85 or a canopy shape 86. The shape and dimensions of the spring portion 85 and the canopy shape 86 are appropriately designed according to the type and dimensions of the sealing member 20, the required fixing force, etc. For processing the spring portion 85 and the canopy shape 86, for example, press working, etching, laser processing, wire cutting, etc. can be used.

[0148] Next, as shown in Figure 48, resin 93 is injected into the metal frame 92 in its current position to integrate it. For example, thermosetting resins such as epoxy resin, polyimide resin, and phenolic resin can be used as the resin. These resins are suitable as frame materials because they have excellent heat resistance and mechanical strength.

[0149] Next, as shown in Figure 49, the outer frame 85b is removed. Specifically, the connecting portion 92b that connected the outer frame 85b to the spring portion 85, etc., is cut, separating the outer frame 85b from the spring portion 85, etc. This completes the upper part 90 of the frame.

[0150] On the other hand, as shown in Figure 50, the lower part of the frame 91 can be manufactured by mold molding using, for example, the same thermosetting resin as described above. Specifically, the lower part of the frame 91 is formed by injecting molten resin 93 into a mold having a cavity corresponding to the shape of the lower part of the frame 91 and allowing it to harden. The lower part of the frame 91 is formed, for example, in the shape of a roughly rectangular frame.

[0151] Finally, as shown in Figure 51, the upper frame 90 and the lower frame 91 manufactured as described above are bonded together using an adhesive. As the adhesive, for example, thermosetting adhesives such as epoxy adhesives, acrylic adhesives, and silicone adhesives can be used. These adhesives have excellent adhesion between resins, so they can firmly bond the upper frame 90 and the lower frame 91.

[0152] Through the above steps, the frame 12 equipped with the spring portion 85 is completed.

[0153] In the above explanation, an example was shown in which both the upper and lower parts of the frame are made of resin, but the materials for the upper and lower parts of the frame are not limited to this. For example, either one or both of the upper and lower parts of the frame may be made of ceramic.

[0154] Furthermore, although the above description shows an example in which the spring portion 85 and the visor shape 86 are integrated into a single metal part during resin molding, the spring portion 85 and the visor shape 86 may be fixed to the resin separately. Alternatively, the spring portion 85 may be attached to the resin frame by soldering, adhesive, or other methods after the upper part 90 of the frame has been molded from resin.

[0155] Furthermore, although the above description shows an example of bonding the upper frame 90 and the lower frame 91 using an adhesive, the method of bonding them is not limited to this. For example, the upper frame 90 and the lower frame 91 may each have protrusions and recesses, and these may be fitted together to mechanically connect them.

[0156] [(5) 15th Embodiment] The tip shape of the spring portion 85 is not particularly limited, and various shapes can be adopted. As an example, the tip of the spring portion 85 can be made circular.

[0157] Figure 52 is a schematic cross-sectional view of a semiconductor device 300E according to one embodiment of this technology. As shown in Figure 52, by making the tip of the spring portion 85 circular, the contact point with the sealing member 20 can be reduced. This provides the following effects.

[0158] First, by reducing the contact area with the sealing member 20, the stress applied to the sealing member 20 can be dispersed, preventing excessive stress from being applied locally. In particular, when the sealing member 20 is made of a brittle material such as glass, this has a significant effect in suppressing damage and cracking due to stress concentration. By making the tip of the spring portion 85 circular, the contact with the sealing member 20 approaches point contact, and the contact area can be minimized. This prevents the pressing force of the spring portion 85 from concentrating in a narrow area of ​​the sealing member 20, and allows the stress to be distributed over a wider area.

[0159] Furthermore, by making the tip of the spring portion 85 circular, the tip of the spring portion 85 slides more easily across the surface of the sealing member 20 when removing it, which has the advantage of making the removal process easier. In addition, friction between the tip of the spring portion 85 and the sealing member 20 is reduced, preventing scratches on the surface of the sealing member 20.

[0160] The radius of curvature of the circular tip of the spring portion 85 can be appropriately designed considering the thickness and material of the sealing member 20, the required fixing force, ease of removal, etc. For example, reducing the radius of curvature can reduce the contact area and enhance the effect of suppressing stress concentration. On the other hand, increasing the radius of curvature makes it easier to apply the tip of the spring portion 85 to the surface of the sealing member 20, which can be expected to improve ease of positioning and the holding stability of the sealing member.

[0161] [(6) Sixteenth Embodiment] As another example of the tip shape of the spring portion 85, the tip of the spring portion 85 can be made parallel to the end face of the sealing member 20.

[0162] Figure 53 is a schematic cross-sectional view of a semiconductor device 300F according to one embodiment of this technology. As shown in Figure 53, by making the tip of the spring portion 85 parallel to the end face of the sealing member 20, the contact area with the sealing member 20 can be increased. This provides the following effects.

[0163] First, by increasing the contact area with the sealing member 20, the sealing member 20 can be held more stably. In particular, even if the sealing member 20 is subjected to vibration or shock, it can be prevented from shifting or coming off. By making the tip of the spring portion 85 parallel to the end face of the sealing member 20, the contact with the sealing member 20 approaches surface contact, and the contact area can be maximized. As a result, the pressing force of the spring portion 85 is distributed over a wide area of ​​the sealing member 20, and the sealing member 20 can be held more securely.

[0164] Furthermore, by increasing the contact area, the pressing force of the spring portion 85 is dispersed, preventing pressure from concentrating on specific points on the sealing member 20, thus preventing the sealing member 20 from chipping or cracking. This effect of suppressing damage due to such pressure concentration is particularly significant when the sealing member 20 is made of a brittle material such as glass.

[0165] Furthermore, by making the tip of the spring portion 85 parallel to the end face of the sealing member 20, it becomes easier to apply the tip of the spring portion 85 to the end face of the sealing member 20 when attaching the sealing member 20, which has the advantage of making positioning easier.

[0166] The degree of parallelism between the tip of the spring portion 85 and the end face of the sealing member 20 can be appropriately designed, taking into consideration the required fixing force and positioning accuracy. For example, by making them nearly perfectly parallel, the contact area can be increased, thereby improving the fixing force. On the other hand, by allowing a certain angle, the ease of attaching and detaching the sealing member 20 can be improved.

[0167] [(7) 17th Embodiment] In the embodiments shown in Figures 33 to 37, the spring portion 85 and the frame 12 are formed as separate parts, but they may be integrally molded. Also, in the embodiments shown in Figure 33, etc., a spring portion 85 in the shape of a bent plate-shaped spring member is used, but it is not limited to this, and for example, a coil-shaped spring portion may be used.

[0168] These points will be explained with reference to Figure 54. Figure 54 is a schematic diagram of a semiconductor device 300G according to one embodiment of this technology. Figure 54A is a schematic top view of the semiconductor device 300G, Figure 54B is a cross-sectional view taken along line A-A in Figure 54A, and Figure 54C is a cross-sectional view taken along line B-B in Figure 54A.

[0169] As shown in Figure 54, the frame 12, the spring portion 85a, and the visor shape 86a are integrally molded. For example, when manufacturing the frame 12 using a 3D printer, the spring portion 85a and the visor shape 86a can also be integrally formed.

[0170] In this embodiment, the spring portion 85a is coil-shaped. By using a coil-shaped spring portion 85a, a long spring stroke can be secured, making it easier to attach and detach the sealing member 20.

[0171] Furthermore, the coil-shaped spring portion 85a can exert a more uniform spring force compared to a plate-shaped spring member, thus stably holding the sealing member 20.

[0172] Furthermore, by forming the spring portion 85a and the canopy shape 86a integrally with the frame 12 in resin, the number of parts can be reduced, thereby lowering manufacturing costs. In addition, since the positioning and fixing processes that would be necessary if the spring portion 85a and the canopy shape 86a were separate parts are eliminated, the manufacturing process can be simplified.

[0173] In this case, the spring portion 85a and the visor shape 86a are formed from resin. Specifically, resin materials used in 3D printers include, for example, ABS resin, PLA resin, nylon resin, etc. All of these resin materials are suitable for 3D printing and can form a spring portion 85a with the desired elasticity. By integral molding, the number of parts can be reduced and manufacturing costs can be lowered. Furthermore, by forming the spring portion 85a, the visor shape 86a and the frame 12 from the same resin material, the unity between the two can be enhanced.

[0174] In this embodiment, the sealing member 20 is fixed to the first fixing surface 15 located on the inner circumference of the frame, and the mounting member (not shown) is fixed to the second fixing surface 16 located on the outer circumference of the frame.

[0175] [(8) 18th Embodiment] Figure 55 is a schematic diagram of a semiconductor device 300H according to one embodiment of the present technology, and in particular shows an example in which the spring portion 85 is of the snap-fit ​​type. Figure 55A is a schematic top view of 300H, Figure 55B is a cross-sectional view taken along line A-A of Figure 55A, Figure 55C is a cross-sectional view taken along line B-B of Figure 55A, and Figure 55D is a cross-sectional view taken along line C-C of Figure 55A.

[0176] As shown in Figure 55A, the semiconductor device 300H comprises a package 10, a sealing member 20 positioned to cover the opening of the package 10, and a spring portion 85 for fixing the sealing member 20 to the package 10. Multiple spring portions 85 can be provided, but this embodiment shows the case where one is provided.

[0177] The spring portion 85 is a snap-in type that can be detachably attached to the frame 10. Specifically, as shown in Figures 55B, 55C, and 55D, the frame 10 has a step 14, which forms a protrusion 85c on the upper surface of the frame 10.

[0178] The spring portion 85 has a recess that fits into the protrusion 85c. By fitting this recess into the protrusion 85c, the spring portion 85 can be easily fixed to the frame 10. Furthermore, when removing the spring portion 85, it can be easily removed by pulling the recess out of the protrusion 85c.

[0179] As shown in Figure 55C (section A-A), the spring portion 85 presses the sealing member 20 against the opposing frame 12 by having its tip contact the end face of the sealing member 20.

[0180] On the other hand, as shown in Figure 55D (B-B cross section), in the area where the spring portion 85 is not located, a canopy shape 86 is provided that protrudes above the upper surface of the sealing member 20. This shape prevents the sealing member 20 from falling out of the package 10.

[0181] By making the package 10 and the spring portion 85 detachable in this way, the following effects can be obtained.

[0182] First, after removing the sealing member 20, the spring portion 85 can also be removed. This prevents the spring portion 85 from causing unnecessary malfunctions. For example, it prevents the spring portion 85 from coming into contact with other components and generating abnormal noise, or from casting a shadow on the solid-state image sensor 1. In particular, if the spring portion 85 is made of metal, contact with other metal components may cause short circuits or noise, but removing the spring portion 85 can avoid these problems.

[0183] Furthermore, making the spring portion 85 detachable offers the advantage of facilitating maintenance and replacement of the spring portion 85. For example, if the spring portion 85 is damaged or its spring force decreases, only the spring portion 85 can be replaced. In addition, multiple spring portions 85 with different spring forces can be prepared and used according to the application. For example, the spring portion 85 with the optimal spring force can be selected depending on the type and thickness of the sealing member 20.

[0184] The method for attaching and detaching the spring portion 85 is not limited to the method described above, and other methods may be used. For example, the spring portion 85 can be fixed to the frame 10 by providing a claw portion on the spring portion 85 and hooking this claw portion onto the frame 10.

[0185] [(9) 19th Embodiment] Figure 56 is a schematic diagram of a semiconductor device 300I according to one embodiment of the present technology. Figure 56A is a schematic top view of the semiconductor device 300I, and Figure 56B is a cross-sectional view taken along line A-A of Figure 56A.

[0186] As shown in Figure 56, in this embodiment, the package 10 has a plurality of spring portions 85. The plurality of spring portions 85 are arranged along the periphery of the sealing member 20. Specifically, two spring portions 85 are arranged on the end face of the sealing member 20. Note that the number of spring portions 85 is not limited to two, but may be three, four, or five or more. Also, the plurality of spring portions 85 may be arranged at equal intervals along the periphery of the sealing member 20, or they may be arranged at unequal intervals.

[0187] According to this embodiment, the sealing member 20 can be fixed more stably by using multiple spring portions 85. Furthermore, the fixing force and ease of removal of the sealing member 20 can be adjusted by adjusting the number of spring portions 85. Specifically, increasing the number of spring portions 85 can increase the fixing force of the sealing member 20. On the other hand, decreasing the number of spring portions 85 can make it easier to remove the sealing member 20.

[0188] The above description of the semiconductor device according to this embodiment can be applied to other embodiments and models of this technology, unless there are any particular technical inconsistencies.

[0189] [4. Fourth Embodiment of the Technology (Example 4 of a Semiconductor Device)] The fourth embodiment of the technology will be described with reference to Figures 63, 66, 69, 72, 75, and 78. Unlike the so-called "hollow package" having an internal space 13 as described in the first to third embodiments, this embodiment relates to a semiconductor device with a structure that does not have a hollow structure, and is called an ASO (Advanced Structure on Substrate) or iMBGA (Injection Molded Ball Grid Array).

[0190] [(1) Configuration of Semiconductor Device] Figures 63, 66, 69, 72, 75, and 78 are schematic cross-sectional views of semiconductor devices 400A to 400F according to this embodiment. These semiconductor devices 400A to 400F include a substrate 11, a semiconductor element 1 (for example, a solid-state image sensor) mounted on the substrate 11, and wires 3 that electrically connect the semiconductor element 1 and the substrate 11.

[0191] The semiconductor device of this embodiment further includes a dam 53 and a sealing resin 54.

[0192] The dam 53 is a wall-like or dam-like component positioned around the semiconductor element 1, particularly around the pixel region 1a and the area where the wires 3 are located. In the manufacturing process described later, the dam 53 has the function of physically restricting (damming) the liquid sealing resin 54 from flowing into unintended areas, such as the pixel region of the semiconductor element 1. In other words, the dam 53 has a wall-like structure that restricts the flow of the sealing resin 54 onto the semiconductor element 1.

[0193] The materials used to construct Dam 53 are not particularly limited, but for example, thermosetting resins (such as those primarily composed of epoxy resin) or photocurable resins (such as those primarily composed of acrylic resin) can be used.

[0194] The sealing resin 54 is provided to at least partially cover the semiconductor element 1 and the wire 3, and is a component that protects them from the external environment. In the examples shown in Figures 63, 66, 69, 72, 75, and 78, the sealing resin 54 is arranged to cover the outer circumference of the dam 53 and above the wire 3.

[0195] The semiconductor device of this embodiment further includes a removable sealing member 20 (for example, a glass plate). Similar to the sealing members 20 described in the first to third embodiments, this sealing member 20 is a temporary cover intended to protect the semiconductor element 1 during the manufacturing process and transportation, and is removed when mounted on the final product, as shown in Figures 64, 67, 70, 73, 76, and 79.

[0196] In this embodiment, the surface to which the detachable sealing member 20 is fixed is the first fixing surface 15. As shown in Figures 63, 69, and 75, the first fixing surface 15 is formed by the upper surface of the dam 53.

[0197] The sealing member 20 is fixed to the first fixing surface 15 via a temporary adhesive resin 21. As the temporary adhesive resin 21, a thermoplastic resin as described in the first embodiment or a tape 40 as described in the second embodiment can be used.

[0198] Furthermore, this embodiment includes a second fixing surface 16 to which a mounting member different from the sealing member 20 (for example, a special glass 30 or a set housing 31) is fixed after the sealing member 20 has been removed. As shown in Figures 63, 69, and 75, the second fixing surface 16 is formed by the upper surface of the sealing resin 54.

[0199] Thus, the semiconductor devices 400A to 400F of this embodiment are equipped with a first fixing surface 15 (upper surface of the dam 53) to which the sealing member 20 is fixed, and a second fixing surface 16 (upper surface of the sealing resin 54) to which the mounting members (30, 31) are fixed, and the first fixing surface 15 and the second fixing surface 16 are different.

[0200] [(2) Modified example: Configuration of the fixed surface] In the semiconductor device 400A shown in Figure 63, the first fixed surface 15 is formed by the upper surface of the dam 53. The second fixed surface 16 is formed by the upper surface of the sealing resin 54.

[0201] As shown in Figure 64, the sealing member 20 is removed when mounting to the final product. Then, as shown in Figure 65, the mounting member (for example, the set housing 31) is fixed to the second fixing surface 16.

[0202] On the other hand, as shown in Figure 66, the semiconductor device 400B may have a first fixed surface 15 formed by the upper surface of the sealing resin 54. In this embodiment, the second fixed surface 16 is formed by the upper surface of the dam 53.

[0203] As shown in Figure 67, the sealing member 20 is removed when mounting to the final product. Then, as shown in Figure 68, the mounting member (for example, the set housing 31) is fixed to the second fixing surface 16.

[0204] [(3) Modified example: Shape of sealing resin] The semiconductor device 400A shown in Figure 63 and the semiconductor device 400B shown in Figure 66 show examples in which the sealing resin 54 is formed by applying (dispensing) a liquid resin to the outer circumference of the dam 53 and curing it.

[0205] On the other hand, semiconductor devices 400C, 400D, 400E, and 400F shown in Figures 69, 72, 75, and 78 represent more complex variations in the shape of the sealing resin 54. Such shapes can be obtained by molding the sealing resin 54 using a mold in a manufacturing process described later.

[0206] In particular, it is preferable to use the transfer molding method, which is commonly used in the manufacturing of semiconductor packages.

[0207] As shown in Figures 70, 73, 76, and 79, the sealing member 20 is removed when mounting to the final product. Then, as shown in Figures 71, 74, 77, and 80, the mounting member (e.g., the set housing 31) is fixed to the second fixing surface 16.

[0208] [(4) Operation and Effects of this Embodiment] The semiconductor device according to this embodiment (fourth embodiment) has the following operation and effects.

[0209] Firstly, similar to the first embodiment, the first fixing surface 15 for fixing the temporary sealing member 20 and the second fixing surface 16 for fixing the final mounting member (e.g., the set housing 31) are physically separated.

[0210] Therefore, even if residue of the temporary adhesive resin (e.g., thermoplastic resin 21) remains on the first fixing surface 15 when the sealing member 20 is removed, it is possible to prevent that residue from adhering to or affecting the second fixing surface 16. As a result, the mounting member (e.g., the set housing 31) is fixed to the clean second fixing surface 16, achieving a firm and highly accurate fixation.

[0211] Secondly, as an effect unique to this embodiment, the dam 53 acts as a "weir" to reliably prevent the sealing resin 54 from flowing into important areas such as the pixel area of ​​the semiconductor element 1 or the connection part of the wire 3 during the manufacturing process when the sealing resin 54 is in liquid form.

[0212] Thirdly, the structure of this embodiment (ASO or iMBGA construction) does not require an outer frame (frame 12) like the ceramic "hollow package" exemplified in the first embodiment. This makes it possible to miniaturize the entire semiconductor device.

[0213] Fourth, similar to the first embodiment, since the sealing member (glass) 20 is ultimately removed from the optical path, the effect of suppressing image quality degradation such as flare and ghosting caused by unwanted light reflection on the back surface of the glass is also obtained.

[0214] Furthermore, the effects described herein are merely illustrative and not limiting, and other effects may also occur.

[0215] [(5) Manufacturing Process] Next, an example of a method for manufacturing a semiconductor device according to this embodiment will be described with reference to Figures 81 to 90.

[0216] [(5-1) Manufacturing process of semiconductor device 400A] Figures 81 to 84 show an example of a manufacturing method for semiconductor device 400A.

[0217] First, as shown in Figure 81, the semiconductor element 1 is die-bonded onto the substrate 11, and wire bonding is performed using the wire 3.

[0218] Next, as shown in Figure 82, a dam 53 is formed around the semiconductor element 1. This is done, for example, by applying a liquid resin (such as a thermosetting epoxy resin or a UV-curing acrylic resin) with a dispenser and allowing it to harden.

[0219] Next, as shown in Figure 83, a removable sealing member 20 (glass) is mounted and fixed to the upper surface (first fixing surface 15) of the dam 53 via a temporary adhesive resin (such as thermoplastic resin 21).

[0220] Next, as shown in Figure 84, the sealing resin 54 is formed. The liquid sealing resin 54 is applied to the outer circumference of the dam 53 and allowed to harden.

[0221] The above manufacturing process is as follows: "the process of forming the dam" (Figure 82), followed by "the process of fixing the sealing member" (Figure 83), and then "the process of forming the sealing resin" (Figure 84).

[0222] However, the order of the processes is not limited to this. For example, the "dam formation process" and the "sealing resin formation process" can be performed first, for example, by integral molding, and then the "sealing member fixing process" can be performed afterward.

[0223] [(5-2) Manufacturing process of semiconductor device 400B] Next, an example of a manufacturing method for semiconductor device 400B is shown.

[0224] The die bonding, wire bonding, and formation of the dam 53 are the same as those for the manufacturing method of the semiconductor device 400A shown in Figures 81 and 82.

[0225] Next, as shown in Figure 85, a sealing resin 54 is formed. The liquid sealing resin 54 is applied to the outer circumference of the dam 53 and allowed to harden.

[0226] Next, as shown in Figure 86, a removable sealing member 20 (glass) is mounted and fixed to the upper surface (first fixing surface 15) of the sealing resin 54 via a temporary adhesive resin (such as thermoplastic resin 21).

[0227] [(5-3) Manufacturing process of semiconductor device 400C to 400F] Next, an example of a manufacturing method for semiconductor device 400C to 400F is shown.

[0228] The die bonding, wire bonding, and formation of the dam 53 are the same as those for the manufacturing method of the semiconductor device 400A shown in Figures 81 and 82.

[0229] Next, as shown in Figures 87 and 89, the sealing resin 54 is molded into the desired shape using the mold 70. When using the mold 70, a release film 71 may be interposed to improve the release properties between the mold 70 and the sealing resin 54.

[0230] Here, a transfer molding method suitably used for forming the sealing resin 54 according to this embodiment will be described in detail. The transfer molding method is a molding technique used when resin-encapsulating electronic components such as semiconductor elements using a thermosetting resin.

[0231] In this method, first, a mold die is prepared, consisting of an upper mold and a lower mold (neither of which are shown in the diagram), with a cavity formed inside to define the shape of the product. The mold also has a transfer pot (hereinafter simply referred to as the "pot") for introducing, heating, and pressurizing the resin material, and a runner and gate, which are flow channels for guiding the molten resin in the pot into the cavity.

[0232] In the resin encapsulation process, first, the object to be encapsulated, such as a substrate 11 on which the semiconductor element 1 is mounted and electrical connections by wires 3 are completed, is set in a predetermined position corresponding to the cavity of the mold (usually the lower mold).

[0233] Next, the mold is clamped and preheated to a predetermined molding temperature (for example, around 170°C to 185°C). Then, a solid (usually tablet-shaped) thermosetting resin (for example, a sealing material mainly composed of epoxy resin) is poured into the pot.

[0234] Next, a plunger (not shown) located at the top of the pot is lowered, applying pressure to the resin tablet inside the pot. The resin tablet is heated and melted (fluidized) by heat transfer from the mold, and then pushed out of the pot by the pressure from the plunger.

[0235] The pressurized molten resin is injected into the cavity through the runner and gate, filling the cavity. At this time, the molten resin flows in such a way that it completely covers the semiconductor elements 1 and wires 3 on the substrate 11.

[0236] Even after the resin has been filled into the cavity, the mold maintains heating and holding conditions for a predetermined time (curing time, e.g., several tens of seconds to several minutes) until the resin has undergone a thermochemical reaction and fully hardened.

[0237] After the resin has hardened, the mold is opened (mold opening), and the substrate 11 (i.e., molded product) on which the sealing resin 54 has been formed is removed from the mold (mold release) using ejector pins (not shown).

[0238] The transfer molding method has the advantage of suppressing deformation of the bonding wire (wire sweep) because the resin is filled at relatively low pressure. In addition, it is possible to mold a large number of packages simultaneously in a single molding cycle (multi-cavity molding), which significantly improves productivity while maintaining high dimensional accuracy.

[0239] Next, as shown in Figures 88 and 90, a removable sealing member 20 (glass) is mounted and fixed to the upper surface (first fixing surface 15) of the sealing resin 54 via a temporary adhesive resin (such as thermoplastic resin 21).

[0240] The semiconductor device manufactured through the above process is shipped or transported to the next process with the sealing member 20 temporarily fixed in place.

[0241] In the process of mounting the final product (electronic device), the worker first performs the step of removing the sealing member. This can be done using a jig 82 as shown in Figures 14 and 15 of the first embodiment.

[0242] After removing the sealing member 20, the worker performs the step of fixing the mounting member (special glass 30 or set housing 31) to the second fixing surface (i.e., the upper surface of the sealing resin 54).

[0243] Because the first fixing surface 15 and the second fixing surface 16 are different, even if resin residue is generated on the first fixing surface 15 during the removal process, the second fixing surface 16 remains clean, making it possible to firmly and precisely fix the mounting member.

[0244] Furthermore, this embodiment (the fourth embodiment) can also be implemented in combination with the first embodiment (step), the second embodiment (groove), and the third embodiment (spring portion). For example, in the ASO / iMBGA structure of the fourth embodiment, a step (first embodiment) or groove (second embodiment) may be provided between the first fixing surface (upper surface of the dam 53) and the second fixing surface (upper surface of the sealing resin 54) to more reliably prevent residue from flowing to the second fixing surface.

[0245] [5. Fifth Embodiment of the Technology (Example of Application to an Intra-Body Information Acquisition System)] The technology can be applied to various products. For example, the technology may be applied to an endoscopic surgical system.

[0246] Figure 57 is a block diagram showing an example of a schematic configuration of a patient's internal body information acquisition system using a capsule endoscope to which the technology described herein (the technology) may be applied.

[0247] The internal body information acquisition system 10001 consists of a capsule endoscope 10100 and an external control device 10200.

[0248] The capsule endoscope 10100 is swallowed by the patient during the examination. The capsule endoscope 10100 has imaging and wireless communication functions, and while moving through the inside of organs such as the stomach and intestines by peristaltic movement until it is naturally expelled from the patient, it sequentially captures images of the inside of the organs (hereinafter also referred to as intracellular images) at predetermined intervals, and sequentially transmits information about these intracellular images wirelessly to an external control device 10200 outside the body.

[0249] The external control device 10200 comprehensively controls the operation of the internal body information acquisition system 10001. The external control device 10200 also receives information about internal body images transmitted from the capsule endoscope 10100 and generates image data for displaying the internal body images on a display device (not shown) based on the received information about the internal body images.

[0250] In this way, the internal information acquisition system 10001 can continuously obtain images of the patient's internal condition from the time the capsule endoscope 10100 is swallowed until it is expelled.

[0251] The configuration and functions of the capsule endoscope 10100 and the external control device 10200 will be explained in more detail.

[0252] The capsule endoscope 10100 has a capsule-shaped housing 10101, which houses a light source unit 10111, an imaging unit 10112, an image processing unit 10113, a wireless communication unit 10114, a power supply unit 10115, a power supply unit 10116, and a control unit 10117.

[0253] The light source unit 10111 is composed of a light source such as an LED (light-emitting diode) and illuminates the imaging field of view of the imaging unit 10112 with light.

[0254] The imaging unit 10112 consists of an image sensor and an optical system comprising a plurality of lenses provided in front of the image sensor. Reflected light (hereinafter referred to as observation light) irradiated onto the body tissue to be observed is focused by the optical system and incident on the image sensor. In the imaging unit 10112, the observation light incident on the image sensor is photoelectrically converted, and an image signal corresponding to the observation light is generated. The image signal generated by the imaging unit 10112 is provided to the image processing unit 10113.

[0255] The image processing unit 10113 is composed of processors such as a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit), and performs various signal processing on the image signal generated by the imaging unit 10112. The image processing unit 10113 provides the processed image signal to the wireless communication unit 10114 as RAW data.

[0256] The wireless communication unit 10114 performs predetermined processing, such as modulation processing, on the image signal that has been processed by the image processing unit 10113, and transmits the image signal to the external control device 10200 via the antenna 10114A. The wireless communication unit 10114 also receives control signals related to the drive control of the capsule endoscope 10100 from the external control device 10200 via the antenna 10114A. The wireless communication unit 10114 provides the control signals received from the external control device 10200 to the control unit 10117.

[0257] The power supply unit 10115 consists of an antenna coil for receiving power, a power regeneration circuit that regenerates power from the current generated in the antenna coil, and a boost circuit, etc. Power is generated in the power supply unit 10115 using the principle of so-called contactless charging.

[0258] The power supply unit 10116 is composed of a secondary battery and stores the power generated by the power supply unit 10115. In Figure 57, to avoid making the drawing complicated, arrows and other symbols indicating the destinations of the power supply from the power supply unit 10116 are omitted, but the power stored in the power supply unit 10116 can be supplied to the light source unit 10111, the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the control unit 10117, and used to drive them.

[0259] The control unit 10117 is composed of a processor such as a CPU and appropriately controls the operation of the light source unit 10111, the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the power supply unit 10115 according to control signals transmitted from the external control device 10200.

[0260] The external control device 10200 is composed of a processor such as a CPU or GPU, or a microcomputer or control board that combines a processor and memory elements such as memory. The external control device 10200 controls the operation of the capsule endoscope 10100 by transmitting control signals to the control unit 10117 of the capsule endoscope 10100 via the antenna 10200A. In the capsule endoscope 10100, for example, the light irradiation conditions for the object of observation in the light source unit 10111 may be changed by control signals from the external control device 10200. Also, the imaging conditions (for example, frame rate, exposure value, etc. in the imaging unit 10112) may be changed by control signals from the external control device 10200. Furthermore, the content of processing in the image processing unit 10113 and the conditions for the wireless communication unit 10114 to transmit image signals (for example, transmission interval, number of transmitted images, etc.) may be changed by control signals from the external control device 10200.

[0261] Furthermore, the external control device 10200 performs various image processing on the image signals transmitted from the capsule endoscope 10100 to generate image data for displaying the captured internal images on a display device. This image processing can include, for example, development processing (demosaic processing), image enhancement processing (bandwidth enhancement, super-resolution processing, NR (Noise reduction) processing, and / or image stabilization processing), and / or magnification processing (electronic zoom processing). The external control device 10200 controls the drive of the display device to display the captured internal images based on the generated image data. Alternatively, the external control device 10200 may record the generated image data on a recording device (not shown) or print it out on a printing device (not shown).

[0262] The above describes an example of an internal body information acquisition system to which this technology may be applied. This technology can be applied, for example, to the imaging unit 10112 of the configuration described above.

[0263] The above description of the semiconductor device according to this embodiment can be applied to other embodiments and models of this technology, unless there are any particular technical inconsistencies.

[0264] [6. Sixth Embodiment of the Technology (Example of Application to Mobile Devices)] The technology can be applied to various products (electronic devices). For example, the technology may be implemented as a device mounted on any type of mobile device such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, and robots.

[0265] Figure 58 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile control system to which the technology described herein may be applied.

[0266] The vehicle control system 12000 comprises a plurality of electronic control units connected via a communication network 12001. In the example shown in Figure 58, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an external information detection unit 12030, an internal information detection unit 12040, and an integrated control unit 12050. The functional configuration of the integrated control unit 12050 is shown in the figure, which includes a microcomputer 12051, an audio / image output unit 12052, and an in-vehicle network interface 12053.

[0267] The drivetrain control unit 12010 controls the operation of devices related to the vehicle's drivetrain according to various programs. For example, the drivetrain control unit 12010 functions as a control device for a drivetrain generating device that generates driving force for the vehicle, such as an internal combustion engine or a drive motor; a drivetrain transmission mechanism that transmits driving force to the wheels; a steering mechanism that adjusts the steering angle of the vehicle; and a braking device that generates braking force for the vehicle.

[0268] The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window system, or various lamps such as headlights, reverse lights, brake lights, turn signals, or fog lights. In this case, the body system control unit 12020 may receive radio waves transmitted from a portable device that replaces a key or signals from various switches. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock system, power window system, lamps, etc.

[0269] The external information detection unit 12030 detects information from outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the external information detection unit 12030. The external information detection unit 12030 causes the imaging unit 12031 to capture images of the outside of the vehicle and receives the captured images. Based on the received images, the external information detection unit 12030 may perform object detection processing such as detecting people, cars, obstacles, signs, or characters on the road surface, or distance detection processing.

[0270] The imaging unit 12031 is a light sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0271] The in-vehicle information detection unit 12040 detects information inside the vehicle. The in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the driver's state. The driver status detection unit 12041 includes, for example, a camera that captures images of the driver, and the in-vehicle information detection unit 12040 may calculate the driver's level of fatigue or concentration, or determine whether the driver is drowsy, based on the detection information input from the driver status detection unit 12041.

[0272] The microcomputer 12051 can calculate control target values ​​for the drive force generator, steering mechanism, or braking device based on information inside and outside the vehicle acquired by the external information detection unit 12030 or the internal information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing ADAS (Advanced Driver Assistance System) functions, including collision avoidance or impact mitigation, following driving based on distance between vehicles, maintaining vehicle speed, vehicle collision warning, or vehicle lane departure warning.

[0273] Furthermore, the microcomputer 12051 can perform cooperative control for purposes such as autonomous driving, where the vehicle drives autonomously without driver intervention, by controlling the drive force generating device, steering mechanism, or braking device, etc., based on information about the vehicle's surroundings acquired by the external information detection unit 12030 or the internal information detection unit 12040.

[0274] Furthermore, the microcomputer 12051 can output control commands to the body system control unit 12020 based on external information acquired by the external information detection unit 12030. For example, the microcomputer 12051 can control the headlights according to the position of a preceding or oncoming vehicle detected by the external information detection unit 12030, and perform coordinated control aimed at reducing glare, such as switching from high beams to low beams.

[0275] The audio-image output unit 12052 transmits at least one of audio and image output signals to an output device capable of visually or audibly notifying information to the vehicle's occupants or to those outside the vehicle. In the example shown in Figure 58, the output devices are exemplified as an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an onboard display and a head-up display.

[0276] Figure 59 shows an example of the installation position of the imaging unit 12031.

[0277] In Figure 59, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0278] The imaging units 12101, 12102, 12103, 12104, and 12105 are installed, for example, on the front nose, side mirrors, rear bumper, back door, and the upper part of the windshield inside the vehicle 12100. The imaging unit 12101 installed on the front nose and the imaging unit 12105 installed on the upper part of the windshield inside the vehicle mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 installed on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 installed on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 installed on the upper part of the windshield inside the vehicle is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, or lanes.

[0279] Figure 59 shows an example of the imaging ranges of imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of imaging unit 12101 located on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of imaging units 12102 and 12103 located on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of imaging unit 12104 located on the rear bumper or back door. For example, by superimposing the image data captured by imaging units 12101 to 12104, an overhead view image of the vehicle 12100 can be obtained.

[0280] At least one of the imaging units 12101 to 12104 may have a function for acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera consisting of multiple image sensors, or an image sensor having pixels for phase difference detection.

[0281] For example, the microcomputer 12051, based on distance information obtained from the imaging units 12101 to 12104, can determine the distance to each object within the imaging range 12111 to 12114 and the temporal change of this distance (relative speed to the vehicle 12100). In particular, it can extract the closest object on the vehicle 12100's path that is traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or more) as the preceding vehicle. Furthermore, the microcomputer 12051 can set a predetermined distance to be maintained before the preceding vehicle and perform automatic braking control (including follow-and-stop control) and automatic acceleration control (including follow-and-start control), etc. In this way, cooperative control aimed at autonomous driving, where the vehicle drives autonomously without driver intervention, can be performed.

[0282] For example, the microcomputer 12051 can use distance information obtained from imaging units 12101 to 12104 to classify and extract three-dimensional object data related to three-dimensional objects, such as motorcycles, passenger cars, large vehicles, pedestrians, utility poles, and other three-dimensional objects, and use this data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines the collision risk, which indicates the degree of risk of collision with each obstacle. If the collision risk is above a set value and there is a possibility of collision, the microcomputer 12051 can provide driving assistance to avoid collisions by outputting a warning to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or evasive steering via the drive system control unit 12010.

[0283] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light. For example, the microcomputer 12051 can recognize pedestrians by determining whether or not pedestrians are present in the images captured by the imaging units 12101 to 12104. Such pedestrian recognition is performed, for example, by a procedure to extract feature points from the images captured by the imaging units 12101 to 12104 as infrared cameras, and a procedure to perform pattern matching on a series of feature points that indicate the contour of an object to determine whether or not it is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the imaging units 12101 to 12104 and recognizes a pedestrian, the audio-image output unit 12052 controls the display unit 12062 to superimpose a rectangular contour line for emphasis on the recognized pedestrian. The audio-image output unit 12052 may also control the display unit 12062 to display an icon indicating a pedestrian at a desired position.

[0284] The above describes an example of a vehicle control system to which this technology may be applied. This technology can be applied, for example, to the imaging unit 12031 in the configuration described above.

[0285] The specific numerical values, shapes, materials (including composition), etc., described herein are examples only and are not limited to these.

[0286] Furthermore, this technology can also take the following configurations: [1] A semiconductor device comprising: a removable sealing member for sealing a semiconductor element; a first fixing surface to which the sealing member is fixed; and a second fixing surface to which a mounting member different from the sealing member is fixed after the sealing member has been removed, wherein the first fixing surface and the second fixing surface are different. [2] The semiconductor device according to [1], wherein a step is provided between the first fixing surface and the second fixing surface. [3] The semiconductor device according to [1], wherein a groove is provided between the first fixing surface and the second fixing surface. [4] The semiconductor device according to [3], wherein the heights of the first fixing surface and the second fixing surface are the same. [5] The semiconductor device according to any one of [1] to [4], wherein the semiconductor element is a solid-state image sensor disposed in a hollow portion. [6] The semiconductor device according to any one of [1] to [5], comprising: a package for housing the semiconductor element, wherein the package includes ceramic. [7] A semiconductor device according to any one of [1] to [6], comprising a package for housing the semiconductor element, wherein the package includes an organic substrate. [8] A semiconductor device according to any one of [1] to [7], wherein the sealing member is fixed to the first fixed surface via a thermoplastic resin. [9] A semiconductor device according to any one of [1] to [8], wherein the sealing member is fixed to the first fixed surface via tape.

[10] A semiconductor device according to any one of [1] to [9], comprising a package for housing the semiconductor element, wherein the package has a spring portion that presses the sealing member toward the inside of the package.

[11] A semiconductor device according to

[10] , wherein the spring portion is made of metal or resin.

[12] A semiconductor device according to

[10] or

[11] , wherein the tip of the spring portion is circular.

[13] A semiconductor device according to

[10] or

[11] , wherein the tip of the spring portion is shaped parallel to the end face of the sealing member.

[14] The spring portion is blackened, the semiconductor device according to any one of

[10] to

[13] .

[15] The semiconductor device according to any one of

[10] to

[14] , wherein the package and the spring portion are integrally molded.

[16] The semiconductor device according to any one of

[10] to

[14] , wherein the package and the spring portion are detachably attached.

[17] The semiconductor device according to any one of

[10] to

[16] , wherein a plurality of spring portions are provided.

[18] A method for manufacturing a semiconductor device, comprising: removing the sealing member of the semiconductor device according to [1]; and fixing the mounting member to the second fixing surface.

[19] The semiconductor device according to any one of [1] to

[18] , further comprising: a sealing resin that at least partially covers the semiconductor element; and a dam disposed around the semiconductor element.

[20] The semiconductor device according to

[19] , wherein the dam has a wall-like structure that restricts the flow of the sealing resin onto the semiconductor element.

[21] The semiconductor device according to

[19] or

[20] , wherein the first fixing surface is provided on the upper surface of the dam, and the second fixing surface is provided on the upper surface of the sealing resin.

[22] The semiconductor device according to

[19] or

[20] , wherein the first fixing surface is provided on the upper surface of the sealing resin, and the second fixing surface is provided on the upper surface of the dam.

[23] The semiconductor device according to any one of

[19] to

[22] , wherein the sealing resin has a shape formed using a mold.

[24] The semiconductor device according to

[23] , wherein the sealing resin has a shape formed by a transfer mold.

[25] The semiconductor device according to any one of

[19] to

[24] , wherein the dam includes a thermosetting resin or a photocurable resin.

[26] The semiconductor device according to any one of

[19] to

[25] , wherein the sealing member is fixed to the first fixing surface via a thermoplastic resin.

[27] The semiconductor device according to any one of

[19] to

[26] , wherein the sealing member is fixed to the first fixed surface via tape.

[28] A method for manufacturing a semiconductor device, comprising the steps of: forming a dam around a semiconductor element; forming a sealing resin so as to at least partially cover the semiconductor element; and fixing a removable sealing member for sealing the semiconductor element to a first fixing surface, wherein a second fixing surface, which is located at a different position from the first fixing surface, is to which a mounting member different from the sealing member is fixed after the sealing member is removed.

[29] The method for manufacturing a semiconductor device according to

[28] , wherein the step of forming the sealing resin includes a step of molding the sealing resin using a mold.

[30] The method for manufacturing a semiconductor device according to

[28] or

[29] , wherein the step of fixing the sealing member is performed after the step of forming the dam; and the step of forming the sealing resin is performed after the step of fixing the sealing member.

[31] The method for manufacturing a semiconductor device according to any one of

[28] to

[30] , further comprising the steps of: removing the sealing member; and fixing the mounting member to the second fixing surface.

[32] Electronic equipment including a semiconductor device according to any one of [1] to

[27] .

[0287] 1 Solid-state image sensor 10 Package 11 Package substrate 12 Frame 13 Internal space 14 Step 15 First fixing surface 16 Second fixing surface 20 Sealing material 21 Thermoplastic resin 30 Special glass 31 Set housing 40 Tape 53 Dam 54 Sealing resin 57 Groove 85 Spring part 86 Overhang shape 100 Semiconductor device 200 Semiconductor device 300 Semiconductor device 400A Semiconductor device 400B Semiconductor device 400C Semiconductor device 400D Semiconductor device 400E Semiconductor device 400F Semiconductor device

Claims

1. A semiconductor device comprising: a removable sealing member for sealing a semiconductor element; a first fixing surface to which the sealing member is fixed; and a second fixing surface to which a mounting member different from the sealing member is fixed after the sealing member has been removed, wherein the first fixing surface and the second fixing surface are different.

2. The semiconductor device according to claim 1, wherein a step is provided between the first fixed surface and the second fixed surface.

3. The semiconductor device according to claim 1, wherein a groove is provided between the first fixing surface and the second fixing surface.

4. The semiconductor device according to claim 3, wherein the height of the first fixed surface and the second fixed surface are the same.

5. The semiconductor device according to claim 1, wherein the semiconductor element is a solid-state image sensor disposed within a hollow portion.

6. The semiconductor device according to claim 1, comprising a package for housing the semiconductor element, wherein the package includes ceramic.

7. The semiconductor device according to claim 1, having a package for housing the semiconductor element, wherein the package includes an organic substrate.

8. The semiconductor device according to claim 1, wherein the sealing member is fixed to the first fixed surface via a thermoplastic resin.

9. The semiconductor device according to claim 1, wherein the sealing member is fixed to the first fixed surface via tape.

10. The semiconductor device according to claim 1, comprising a package for housing the semiconductor element, wherein the package has a spring portion that presses the sealing member toward the inside of the package.

11. The semiconductor device according to claim 10, wherein the spring portion is formed of metal or resin.

12. The semiconductor device according to claim 10, wherein the tip of the spring portion is circular.

13. The semiconductor device according to claim 10, wherein the tip of the spring portion is shaped parallel to the end face of the sealing member.

14. The spring portion is treated with a black finish, according to claim 10.

15. The semiconductor device according to claim 10, wherein the package and the spring portion are integrally molded.

16. The semiconductor device according to claim 10, wherein the package and the spring portion are detachably attached.

17. The semiconductor device according to claim 10, wherein a plurality of spring portions are provided.

18. A method for manufacturing a semiconductor device, comprising: removing the sealing member of the semiconductor device described in claim 1; and fixing the mounting member to the second fixing surface.

19. The semiconductor device according to claim 1, further comprising: a sealing resin that covers at least partially the semiconductor element; and a dam disposed around the semiconductor element.

20. The semiconductor device according to claim 19, wherein the dam has a wall-like structure that restricts the flow of the sealing resin onto the semiconductor element.

21. The semiconductor device according to claim 19, wherein the first fixing surface is provided on the upper surface of the dam, and the second fixing surface is provided on the upper surface of the sealing resin.

22. The semiconductor device according to claim 19, wherein the first fixing surface is provided on the upper surface of the sealing resin, and the second fixing surface is provided on the upper surface of the dam.

23. The semiconductor device according to claim 19, wherein the sealing resin has a shape formed using a mold.

24. The semiconductor device according to claim 23, wherein the sealing resin has a shape formed by transfer molding.

25. The semiconductor device according to claim 19, wherein the dam comprises a thermosetting resin or a photocurable resin.

26. The semiconductor device according to claim 19, wherein the sealing member is fixed to the first fixed surface via a thermoplastic resin.

27. The semiconductor device according to claim 19, wherein the sealing member is fixed to the first fixed surface via tape.

28. A method for manufacturing a semiconductor device, comprising the steps of: forming a dam around a semiconductor element; forming a sealing resin so as to at least partially cover the semiconductor element; and fixing a removable sealing member for sealing the semiconductor element to a first fixing surface, wherein a second fixing surface, which is located at a different position from the first fixing surface, is to which a mounting member different from the sealing member is fixed after the sealing member is removed.

29. The method for manufacturing a semiconductor device according to claim 28, wherein the step of forming the sealing resin includes a step of molding the sealing resin using a mold.

30. A method for manufacturing a semiconductor device according to claim 28, wherein after the step of forming the dam, a step of fixing the sealing member is performed, and after the step of fixing the sealing member, a step of forming the sealing resin is performed.

31. A method for manufacturing a semiconductor device according to claim 28, further comprising the steps of: removing the sealing member; and fixing the mounting member to the second fixing surface.

32. Electronic device including the semiconductor device described in claim 1.

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