Test table of handler for testing electronic components, and handler for testing electronic components

Abstract

The present invention relates to a test table of a handler for testing electronic components, and a handler to which the corresponding test table is applied. A seating chuck of the test table according to the present invention has a cooling flow path through which a cooling fluid can move, an inlet and an outlet of the cooling flow path are disposed adjacent to each other, the cooling flow path can be divided, on the basis of a middle section located in the middle on the cooling flow path leading to the inlet and the outlet, into a first section extending from an inlet to the middle section and a second section extending from the middle section to an outlet, the first section and the second section are disposed adjacent and parallel to each other, and the direction in which the cooling fluid moves in the first section is opposite to the direction in which the cooling fluid moves in the second section. According to the present invention, electronic components seated on the seating chuck can be evenly cooled, thereby improving test reliability.

Description

Test table of electronic component test handler and electronic component test handler

[0001] The present invention relates to a handler that supports testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Dies are very thin and have fine spacing between contact pads, so they can easily break or shatter. Until now, no automated test capable of adequately supporting the testing of electronic components in the die or HBM state has been proposed. Accordingly, the applicant has proposed a handler according to Korean Published Patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0010] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0011] The prior art scans electronic components on a test table (named 'chuck' in the prior art) with a camera to determine their current position and readjusts the position of the electronic components to reduce the error range.

[0012] According to the prior art, automated testing of electronic components at the die level is possible by precisely resetting the position of the electronic components.

[0013] Electronic components must be tested in a given temperature environment.

[0014] In order for electronic components to be tested within a constant temperature environment, the handler must have the function of controlling the temperature of the electronic components being tested.

[0015] For the reliability of the test, the temperature of the electronic components must be precisely controlled, so the electronic components need to be heated or cooled.

[0016] In a handler according to the prior art, temperature control for electronic components is performed on a test table.

[0017] If the temperature of an electronic component mounted on a test table drops below the tolerance range, the electronic component must be heated.

[0018] Electronic components can be heated by a heating heater.

[0019] If the temperature of the electronic component mounted on the test table rises above the tolerance range, it must be cooled.

[0020] Electronic components can be cooled by a cooling fluid.

[0021] A cooling channel through which the cooling fluid moves is formed in the test table.

[0022] The cooling channel has an inlet where the cooling fluid is input and an outlet where the cooling fluid is output.

[0023] The temperature of the cooling fluid rises as it flows through the cooling channel.

[0024] This means that the temperature of the test table on a flat surface can vary depending on the location.

[0025] If the temperature of the test table varies depending on the location, the temperatures of the electronic components become uneven and deviations occur. This phenomenon causes a decrease in the reliability of the test.

[0026] [Prior Art Literature]

[0027] [Patent Literature]

[0028] (Patent Document 1) Republic of Korea Published Patent No. 10-2021-0088373

[0029] Technology is needed to uniformly control the temperature of electronic components mounted on a test table.

[0030] A test table of a handler for testing electronic components according to the present invention can accommodate an electronic component and has vacuum passages formed therein for fixing the electronic component with vacuum pressure, and has a mounting chuck having a predetermined thickness in the vertical direction; and a heating heater for heating the mounting chuck; The above-mentioned mounting chuck includes a cooling channel through which a cooling fluid can move, and the cooling channel has an inlet into which the cooling fluid is input and an outlet into which the cooling fluid is output, and the inlet and the outlet are arranged adjacent to each other, and the cooling channel can be divided into a first section extending from the inlet to the intermediate section and a second section extending from the intermediate section to the outlet based on an intermediate section located in the middle of the cooling channel leading from the inlet to the outlet, and the cooling fluid input through the inlet passes sequentially through the first section, the intermediate section, and the second section and is output to the outlet, and the first section and the second section are arranged adjacent to each other, and the direction in which the cooling fluid moves in the first section and the direction in which the cooling fluid moves in the second section are opposite to each other.

[0031] The above intermediate section is positioned in the central part of the above-mentioned mounting chuck, the above-mentioned first section extends from the above-mentioned inlet to the above-mentioned intermediate section in a spiral shape, and the above-mentioned second section extends from the above-mentioned intermediate section to the above-mentioned outlet in a spiral shape.

[0032] The above-mentioned inlet and outlet are positioned on the side of the above-mentioned mounting chuck, the first section is in the shape of a spiral with a gradually decreasing radius, and the second section is in the shape of a spiral with a gradually increasing radius.

[0033] The above first section and the above second section have parallel zones that are adjacent to each other in a straight line shape.

[0034] In a plane, the first points where the first section intersects a virtual straight line passing through the center of the mounting rod and the second points where the second section intersects the virtual straight line are arranged alternately.

[0035] The above first section, intermediate section, and second section are arranged at the same height.

[0036] There are multiple cooling channels mentioned above.

[0037] The aforementioned multiple cooling channels are arranged at the same height.

[0038] The aforementioned multiple cooling channels are arranged at different heights.

[0039] The aforementioned plurality of cooling channels are positioned higher than the heating heater.

[0040] At least one specific cooling channel among the aforementioned plurality of cooling channels is positioned at a lower position than the heating heater.

[0041] The electronic component test handler according to the present invention applies the above-described test table.

[0042] According to the present invention, since a first section and a second section with opposite directions of movement of the cooling fluid are arranged adjacent to each other, the entire surface area of ​​the mounting chuck is cooled evenly, thereby allowing the temperature of the electronic component mounted on the mounting chuck to be uniformly controlled, which improves the reliability of the test.

[0043] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to the present invention.

[0044] FIGS. 2 to 11 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0045] FIGS. 12 to 14 are reference drawings for explaining a test table according to a first embodiment of the present invention.

[0046] FIG. 15 is a reference diagram for explaining a test table according to a second embodiment of the present invention.

[0047] FIG. 16 is a reference diagram for explaining a test table according to a third embodiment of the present invention.

[0048] FIG. 17 is a reference diagram for explaining a test table according to a fourth embodiment of the present invention.

[0049] FIG. 18 is a reference diagram for explaining a test table according to the fifth embodiment of the present invention.

[0050] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0051] <Description of Handlers for Electronic Component Testing>

[0052] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0053] The handler (TH) according to the present invention may be divided into a loading section (LU), a relocation section (RP), a connecting section (CP), and a moving section (MP), and includes a transport shuttle (100), a first picker hand (210), a second picker hand (220), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), and a controller (700).

[0054] The unloading unit (LU) supplies electronic components to be tested or retrieves electronic components for which testing is complete.

[0055] In the relocation section (RP), the positions of the electronic components to be tested supplied from the unloading section (LU) are precisely relocated.

[0056] In the connection section (CP), electronic components whose positions have been precisely repositioned in the relocation section (RP) are electrically connected to the tester.

[0057] In the moving section (MF), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP).

[0058] The moving section (MF) moves electronic components to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components that have completed testing from the relocation section (RP) to the unloading section (LU).

[0059] A transport shuttle (100) for carrying electronic components is installed in the moving part (MP).

[0060] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).

[0061] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0062] The transport shuttle (100) has a movable transport table (110).

[0063] The transport shuttle (100) may have at least one transport table (110).

[0064] The transport table (110) can move back and forth in one direction.

[0065] The transport table (110) can move back and forth in the X-axis direction.

[0066] In the case where there are multiple transport tables (100), multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0067] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).

[0068] Electronic components can be placed on the transport table (110).

[0069] The transport table (110) has a vacuum structure that fixes electronic components placed on a flat surface by vacuum pressure.

[0070] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0071] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0072] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).

[0073] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0074] Since the electronic component is fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110).

[0075] The vacuum holes (VH) and vacuum grooves (VG) are arranged in a 2x8 matrix.

[0076] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0077] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0078] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0079] Electronic components can be loaded onto a Jetec Tray, Ring Frame, or other types of customer tray and supplied to or retrieved from the handler (TH).

[0080] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.

[0081] The electronic components to be tested in the unloading section (LU) are loaded onto the transport table (110) in the first area (A1).

[0082] The electronic components that have completed testing and are loaded on the transport table (110) of the first area (A1) are unloaded from the transport table (110) and moved to the unloading section (LU).

[0083] A first picker hand (210) is provided in the unloading section (LU).

[0084] The first picker hand (210) is provided to load electronic components onto the transport table (110) or to unload them from the transport table (110).

[0085] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0086] The first picker hand (210) carries the electronic components to be tested on the transport table (110) in the first area (A1).

[0087] The first picker hand (210) picks up the electronic components that have been tested from the transport table (110) in the first area (A1).

[0088] The first picker hand (210) has one or more pickers capable of gripping or releasing electronic components (ED).

[0089] The picker can grip electronic components by vacuum pressure.

[0090] The first picker hand (210) can be implemented to improve processing capacity by having four paired pickers.

[0091] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.

[0092] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.

[0093] In the relocation section (RP), electronic components to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated.

[0094] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components.

[0095] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0096] The repositioning part (RP) is equipped with a second picker hand (220).

[0097] The second picker hand (220) takes electronic components to be tested from the transport table (110) or loads electronic components that have been tested onto the transport table (110).

[0098] For unloading operations by the second picker hand (220), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0099] The second picker hand (220) takes electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0100] The second picker hand (220) can be configured in the same way as the first picker hand (210).

[0101] The number of pickers provided in the second picker hand (220) may be different from the number of pickers (P) provided in the first picker hand (210).

[0102] The second picker hand (220) loads the electronic components (ED) to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).

[0103] In order for the electronic components (ED) to be tested by the second picker hand (220) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP).

[0104] The second picker hand (220) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0105] The test table (300) is provided to load electronic components that are unloaded from the transport table (110) by the second picker hand (220).

[0106] The electronic components are electrically connected to the tester while seated on the test table (300).

[0107] As shown in the schematic excerpt of FIG. 4, the test table (300) is in the shape of a disc and has a flat top surface.

[0108] The test table (300) may be in the shape of a square plate when viewed from a flat plane, and in this case, the top surface is also flat.

[0109] The electronic components are placed and loaded on the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0110] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0111] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0112] Generally, when an electronic component (ED) is moved to a test table (300), shock or inertia accompanying the movement occurs.

[0113] Impact or inertia, etc., can disrupt the position of the electronic components (ED) loaded on the test table (300). To prevent this, vacuum channels (311) are formed in the area where the electronic components (ED) are loaded on the test table (300).

[0114] The vacuum structure of the test table (300) for fixing the electronic component (ED) may be the same as the vacuum structure of the transport table (110).

[0115] The test table (300) is a characteristic feature of the present invention, so it will be explained in more detail later in a different section.

[0116] When an electronic component is placed on the test table (300) by the second picker hand (220), the electronic component can be placed in the same position by vacuum pressure.

[0117] The vacuum device (400) provides vacuum pressure to the vacuum channels (311) in the test table (300) through a vacuum circuit (not shown).

[0118] The vacuum device (400) may be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (TH) to each electronic component through a vacuum circuit.

[0119] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components through the vacuum channel (311), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0120] The vacuum channels (311) are implemented to be selectively opened and closed depending on the control of the vacuum circuit.

[0121] The electronic components may optionally be fixed to the test table (300) or detached from the test table (300).

[0122] The electronic components (ED) are electrically connected to the tester while loaded on the test table (300).

[0123] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (TB).

[0124] The test board (TB) is fixedly coupled to the handler (TH) at the connection part (CP).

[0125] A test space (TS) is formed below the test board (TB) where a test table (300) can be positioned.

[0126] The test board (TB) has test pins that make electrical contact with electronic components.

[0127] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).

[0128] The test board (TB) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0129] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc, just like the probe card.

[0130] The test board (TB) may have a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0131] As shown in the bottom view of FIG. 5, test zones (TZ) corresponding to one electronic component are arranged on the test board (TB).

[0132] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).

[0133] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0134] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic components.

[0135] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on a single electronic component. The test pins (t) on the probe card are also commonly referred to as probe pins.

[0136] In the case where the test board (TB) has a structure with a socket module, a set of test pins (t) are installed in one socket module (22), and one socket module (22) forms one test zone (TZ). Therefore, replacing one socket module (22) replaces one test zone (TZ).

[0137] The test area (TZ) and the electronic component must be aligned. If the coordinates of the electronic component on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a defect occurs in the electrical connection between the electronic component and the tester.

[0138] As shown in the conceptual example of FIG. 6, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0139] By relocating the electronic component (ED) to align it with the test zone (TZ), the test zone (TZ) and the electronic component (ED) can be aligned.

[0140] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0141] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (220). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (220).

[0142] The positions or angular positions of the electronic components (ED) that are placed and loaded on the test table (300) by the second picker hand (220) may differ in the XY plane, and the electronic components (ED) loaded on the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.

[0143] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0144] In the present invention, when the second picker hand (220) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0145] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (220).

[0146] The temporary area is a location that is not set or fixed by the controller (700) and is arbitrarily determined by the operation of the second picker hand (220).

[0147] For example, when the second picker hand (220) places the electronic component (ED) onto the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.

[0148] Exaggerated Figure 7 shows an example of a temporary zone (BZ) on a test table (300).

[0149] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.

[0150] The fixed position zone refers to the location where the electronic component (ED) and the test zone (TZ) coincide. The exaggerated figure 8 shows the relationship between the temporary zone (BZ) and the fixed position zone (RZ) on the test table (300).

[0151] The RZ (Right Zone) may be pre-set.

[0152] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before the test operation of the handler (TH).

[0153] As shown in Fig. 8, the temporary zone (BZ) may have errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0154] The relocation mechanism (500) is provided to precisely relocate the position of the electronic component (ED) loaded on the test table (300) in the relocation space (RS).

[0155] The relocation mechanism (500) is provided to relocate electronic components (ED) loaded in the temporary zone (BZ) of the test table (300) to the fixed zone (RZ) by the second picker hand (220).

[0156] According to the present embodiment, the second picker hand (220) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0157] As shown in the schematic diagram of FIG. 9, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and an elevator (530).

[0158] The relocation mechanism (500) has its position fixed.

[0159] The relocation mechanism (500) can be fixedly mounted to the frame forming the skeleton of the handler (TH).

[0160] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0161] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0162] The repositioning picker (510) can be provided to be able to move up and down.

[0163] The relocation camera (520) is positioned apart from the relocation picker (510).

[0164] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.

[0165] A repositioning camera (520) is provided to photograph electronic components (ED).

[0166] As in the example of FIG. 10, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0167] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M).

[0168] The object being photographed by the repositioning camera (520) may be replaced with the edge of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable object.

[0169] The relocation picker (510) and the relocation camera (520) are connected and fixed as a single module.

[0170] On a plane, the mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0171] The elevator (530) raises the relocation picker (510).

[0172] By raising the repositioning picker (510) by the elevator (530), the repositioning picker (510) can grasp the electronic component (ED) placed on the test table (300) or properly place the electronic component (ED) on the test table (300).

[0173] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0174] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0175] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0176] As shown in the schematic excerpt of FIG. 11, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0177] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0178] The test table (300) can be rotated by the rotating mechanism (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.

[0179] The elevator (620) raises the test table (300).

[0180] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0181] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0182] The first moving device (640) moves the test table (300) in the X-axis direction.

[0183] As the test table (300) is moved in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS).

[0184] When the test table (300) is in the test space (TS), an electrical connection is made between the electronic component (ED) and the tester by raising the test table (300).

[0185] The second mover (660) moves the test table (300) in the Y-axis direction.

[0186] The above-mentioned moving mechanism (600) has three functions.

[0187] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0188] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0189] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0190] Since the position of the repositioning picker (510) is fixed in the plane, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0191] Depending on the implementation, the test table (300) is raised in parallel with the raising and lowering of the relocation picker (510) during the relocation process of the electronic component (ED), thereby enabling the gripping or release of the electronic component (ED) by the relocation picker (510).

[0192] Here, the operation during the relocation of electronic components (ED) is explained.

[0193] As shown in Fig. 8, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0194] During the relocation process, the elevator (620) maintains the test table (300) at a certain height, thereby positioning the electronic component (ED) at the focal length of the relocation camera (520).

[0195] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0196] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the elevator (530) operates to lower the relocation picker (510).

[0197] When the repositioning picker (510) adsorbs and grasps an electronic component (ED) located in the temporary zone (BZ) of the test table (300) using vacuum pressure, the elevator (530) operates to raise the repositioning picker (510). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the fixed position zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the fixed position zone (RZ). In this state, the elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the fixed position zone (RZ).

[0198] When the electronic component (ED) is fixed to the test table (300) by the vacuum pressure applied to the vacuum channel (311) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the repositioning picker (510) rises and begins repositioning the next electronic component (ED).

[0199] If precise control of the operation of the second picker hand (220) is possible, the second picker hand (220) may be equipped with a camera, and the relocation mechanism (500) may be omitted. In this case, the relocation of the electronic component (ED) can be achieved by utilizing the second picker hand (220).

[0200] Furthermore, the second picker hand (220) may be implemented to move the electronic component (ED) directly to the positioning zone (RZ) when moving it from the transport table (110) to the test table (300).

[0201] The controller (700) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first picker hand (210), the second picker hand (220), the vacuum device (400), the relocation mechanism (500), and the moving mechanism (600).

[0202] Next, the method of operation of the handler (TH) according to the present invention is explained from the perspective of the logistics of electronic components (ED).

[0203] In the unloading section (LU), the first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0204] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0205] The second picker hand (220) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (220) are temporary zones (BZ).

[0206] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (700) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0207] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS) formed in the connection part (CP). Afterwards, the connector (700) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0208] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (220) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first picker hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0209] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0210] <First Example of Test Table>

[0211] FIG. 12 is a perspective view of a test table (300) according to a first embodiment of the present invention.

[0212] In the test table (300) of Fig. 12, the manifold to be described later is omitted.

[0213] The test table (300) includes a mounting chuck (310) and a heating heater (320).

[0214] The mounting chuck (310) is made of a metallic material with good thermal conductivity, such as aluminum.

[0215] Electronic components (ED) are loaded and seated on the mounting chuck (310).

[0216] The mounting chuck (310) has a predetermined thickness in the vertical direction and is in the shape of a disc on a flat surface.

[0217] The mounting chuck (310) has vacuum channels (311) formed therein for fixing electronic components (ED) with vacuum pressure.

[0218] The vacuum channel (311) has an inlet (311i), an outlet (311o), and an expansion groove (311g).

[0219] Vacuum pressure is input through the inlet (311i).

[0220] The entrance (311i) is positioned on the side of the mounting chuck (310).

[0221] Vacuum pressure is output through the outlet (311o).

[0222] The exit (311o) is positioned on the upper surface of the mounting chuck (310) on which the electronic component (ED) is mounted.

[0223] The vacuum pressure output through the outlet (311o) expands through the expansion groove (311g) and acts on the electronic component (ED) seated on the seating chuck (310).

[0224] In the expansion groove (311g), the vacuum pressure output through the outlet (311o) expands, causing the vacuum pressure to act evenly over the entire surface area of ​​the electronic component (ED).

[0225] The electronic component (ED) mounted on the mounting chuck (310) is fixed to the mounting chuck (3100) by vacuum pressure acting through the outlet (311o) and the expansion groove (311g).

[0226] A cooling channel (312) is formed in the mounting chuck (310).

[0227] The cooling channel (312) has an inlet (312i) and an outlet (312o).

[0228] Cooling fluid is input through the inlet (312i).

[0229] Cooling fluid is discharged through the outlet (312o).

[0230] The entrance (312i) and the exit (312o) are positioned on the side of the mounting rod (310).

[0231] The cooling fluid input through the inlet (312i) travels along the cooling channel (312) to cool the mounting chuck (310) and is then discharged through the outlet (312o). During this process, the temperature of the cooling fluid gradually rises as it exchanges heat with the mounting chuck (310).

[0232] FIG. 13 is a conceptual plan view of the test table (300) of FIG. 12 to explain the shape of the cooling channel (312).

[0233] The inlet (312i) and outlet (312o) of the cooling channel (312) are positioned adjacent to each other.

[0234] FIG. 14 is a conceptual diagram of a spiral-shaped cooling channel (312) arbitrarily straightened out.

[0235] The cooling channel (312) can be divided into an intermediate section (312-m), a first section (312-1), and a second section (312-2).

[0236] The intermediate section (312-m) is the section located approximately in the middle of the cooling channel (312) between the inlet (312i) and the outlet (312o).

[0237] The first section (312-1) and the second section (312-2) are divided into two sides based on the middle section (312-m).

[0238] The first section (312-1) is the section leading from the entrance (312i) to the middle section (312-m).

[0239] The second section (312-2) is the section extending from the intermediate section (312-m) to the exit (312o).

[0240] The cooling fluid input through the inlet (312i) passes sequentially through the first section (312-1), the intermediate section (312-m), and the second section (312-2) and is output through the outlet (312o).

[0241] The first section (312-1), the intermediate section (312-m), and the second section (312-2) are formed at the same height.

[0242] The cooling fluid exchanges heat with the seating chuck (310) while moving from the inlet (312i) to the outlet (312o).

[0243] The temperature of the first section (312-1) is relatively lower than that of the second section (312-2).

[0244] The second section (312-2) has a relatively higher temperature compared to the first section (312-1).

[0245] For example, assuming the temperature of the cooling fluid input at the inlet (312i) is -40 degrees, the temperature of the cooling fluid travels from the inlet (312i) to the outlet (312o) and becomes -30 degrees at the outlet when output.

[0246] The first section (312-1) and the second section (312-2) are arranged adjacent to each other at all points. To this end, the cooling channel (312) can have various shapes.

[0247] In a disc-shaped mounting chuck (310) like Fig. 12, it is preferable that the cooling channel (312) be formed in a spiral shape.

[0248] The intermediate section (312-m) is positioned approximately in the central part of the mounting bracket (310).

[0249] The first section (312-1) extends from the entrance (312i) to the middle section (312-m) in a spiral shape with decreasing radius.

[0250] The second section (312-2) extends to the exit (312o) in a spiral shape with increasing radius from the intermediate section (312-m).

[0251] The direction in which the cooling fluid moves in the first section (312-1) and the direction in which the cooling fluid moves in the second section (312-2) are opposite to each other.

[0252] When considering a virtual straight line (L) passing through the center (O) of the mounting rod (310) on a plane, the first points (P1) where the first section (312-1) meets the virtual straight line (L) and the second points (P2) where the second section (312-2) meets the virtual straight line (L) are arranged alternately.

[0253] The average temperature of the cooling fluid at a point (P1) in the adjacent first section (312-1) and a point (P2) in the second section (312-2) is approximately the same across all regions. Therefore, cold air can be evenly conducted to all regions of the mounting chuck (310), and the temperature of all regions of the mounting chuck (310) becomes uniform.

[0254] In response to the uniform temperature of the settling area (310), the temperature of the electronic component (ED) is also uniform.

[0255] As shown in FIG. 13, the test table (300) further includes manifolds (330) and temperature sensors (340).

[0256] The manifolds (330) have a vacuum circuit that distributes the vacuum pressure of the vacuum machine (400) to each vacuum path (311).

[0257] The manifolds (330) are connected to the sides of the mounting chuck (310).

[0258] In the area where the inlet (312i) and outlet (312o) of the cooling channel (312) are located, the inlet (311i) of the vacuum channel (311) is not located, and the manifold (330) is not located either.

[0259] A number of temperature sensors (340) are arranged.

[0260] Temperature sensors (340) are installed so as not to interfere with the vacuum channel (311) and the cooling channel (312).

[0261] In the example of FIG. 13, three temperature sensors (340) are installed at the 3 o'clock, 9 o'clock, and 12 o'clock directions from the center (O) of the mounting chuck (310), but it is sufficient to provide as many temperature sensors (340) as are necessary for precise temperature control of the electronic components (ED) mounted on the mounting chuck (310).

[0262] Multiple temperature sensors (340) detect the temperature of the mounting chuck (310) in real time at different points.

[0263] A heating heater (320) is provided to heat the mounting chuck (310).

[0264] When the mounting chuck (310) is heated, the electronic component (ED) is heated by heat conduction.

[0265] The heating heater (320) prevents the phenomenon of the seating chuck (310) being overcooled by the cooling fluid.

[0266] The heating heater (320) prevents the electronic component (ED) from being overcooled by the cooling fluid.

[0267] The controller (700) checks information regarding the temperature of the mounting chuck (310) detected by the temperature sensors (340) and appropriately controls the heating heater (320) so that the mounting chuck (310) maintains a temperature state according to the test temperature conditions.

[0268] The heating heater (320) may also be used to raise the temperature of the mounting chuck for high-temperature testing.

[0269] It is preferable that the heating heater (320) be in the form of a plate so that it can uniformly heat the mounting chuck (310) over its entire surface area.

[0270] <Second Embodiment for Test Table>

[0271] The test table (300) of FIG. 15 has a square plate-shaped mounting chuck (310).

[0272] The cooling channel (312) has an inlet (312i) and an outlet (312o) positioned adjacent to each other.

[0273] The first section (312-1) is in the form of being bent at a 90-degree angle and wound in one direction, and starting from the middle section (312-m), the second section (312-2) is in the form of being bent at a 90-degree angle and unwound in the other direction.

[0274] The first section (312-1) and the second section (312-2) have parallel sections (S1, S2) that are adjacent to each other in a straight line shape.

[0275] In the second embodiment as well, the mounting chuck (310) has vacuum passages (311), and the test table (300) includes a heating heater (320), manifolds (330), and temperature sensors (340).

[0276] <Third Embodiment for Test Table>

[0277] In the test table (300) of FIG. 16, the mounting chuck (310) has two cooling channels (312A, 312B).

[0278] The inlet (312Ai) and outlet (312Ao) of the first cooling channel (312A) are positioned adjacent to each other.

[0279] The inlet (312bi) and outlet (312Bo) of the second cooling channel (312B) are positioned adjacent to each other.

[0280] The pair of inlets (312Ai) and outlets (312Ao) of the first cooling channel (312A) are positioned adjacent to the pair of inlets (311Bi) and outlets (311Bo) of the second cooling channel (312B).

[0281] The first cooling channel (312A) is divided into an intermediate section (312A-m), a first section (312A-1), and a second section (312A-2).

[0282] The first section (312A-1) and the second section (312A-2) of the first cooling channel (312A) are arranged adjacent to each other.

[0283] The first section (312A-1) and the second section (312A-2) of the first cooling channel (312A) have parallel sections that are arranged adjacent to each other.

[0284] The second cooling channel (312B) is divided into an intermediate section (312B-m), a first section (312B-1), and a second section (312B-2).

[0285] The first section (312B-1) and the second section (312B-2) of the second cooling channel (312B) are arranged adjacent to each other.

[0286] The first section (312B-1) and the second section (312B-2) of the second cooling channel (312B) have adjacent parallel sections.

[0287] The first cooling channel (312A) and the second cooling channel (312B) are positioned at the same height.

[0288] As in the present embodiment, if a cooling channel (312A, 312B) can be formed in a form where the first section (312A-1, 312B-1) and the second section (312A-2, 312A-2) are arranged adjacent to each other, the cooling channel (312A, 312B) may be provided in multiple numbers of two or more.

[0289] The test table (300) according to the third embodiment also includes a heating heater (320), a manifold (330), and a temperature sensor (340).

[0290] It is preferable that the temperature sensors (340) be installed in an area where the first section (312A-1, 312B-2) becomes adjacent to each other while changing direction, or where the second section (312A-2, 312B-2) becomes adjacent to each other while changing direction, taking into account the structural form of the cooling channels (312A, 312B). Accordingly, the height of the mounting chuck (310) can be reduced.

[0291] <Fourth Example for Test Table>

[0292] In the test table (300) of FIG. 17, the mounting chuck (310) has two cooling channels (312A, 312B).

[0293] In the fourth embodiment, the first cooling channel (312A) and the second cooling channel (312B) are positioned at different heights.

[0294] The first cooling channel (311A) is positioned at a height between the inlets (311i) of the vacuum channel (311).

[0295] The second cooling channel (312B) is positioned lower than the position of the first cooling channel (312A).

[0296] The second cooling channel (312B) is positioned lower than the inlets (311i) of the vacuum channel (311).

[0297] The second cooling path (312B) can be controlled by an opening / closing valve (OC).

[0298] The second cooling channel (312B) may be used continuously, but may also be used intermittently only when the cooling from the first cooling channel (312A) alone is insufficient to lower the temperature of the mounting chuck (310) to the required temperature.

[0299] Both cooling channels (312A) are positioned higher than the heating heater (320).

[0300] As shown in FIG. 18, the heating heaters (320: 321, 322) are in the shape of square plates, and two may be provided to secure heating capacity.

[0301] The test table (300) according to the fourth embodiment also includes manifolds (330) and temperature sensors (340).

[0302] The fourth embodiment can be appropriately applied in cryogenic testing.

[0303] <Fifth Example for Test Table>

[0304] In the test table (300) of FIG. 19, an insertion groove (IG) is formed in the seating chuck (310).

[0305] A heating heater (320) is inserted into the insertion groove (IG).

[0306] Two cooling channels (312A, 312B) are formed in the mounting chuck (310).

[0307] The first cooling channel (312A) is positioned higher than the heating heater (320).

[0308] The second cooling channel (312B) is positioned lower than the heating heater (320).

[0309] The second cooling channel (312B) can be interrupted.

[0310] The test table (300) according to the fifth embodiment also includes manifolds (330) and temperature sensors (340).

[0311] The fifth embodiment can be appropriately applied when both cryogenic and high-temperature tests are to be performed.

[0312] The above 4th and 5th embodiments show that a plurality of cooling channels (312A, 312B) can be arranged at different heights.

[0313] The cooling channels (312A, 312B) in the fourth and fifth embodiments may follow the shape of the cooling channels in the first to third embodiments.

[0314] However, the cooling channels (312A, 312B) in the fourth and fifth embodiments are not necessarily bound to the shape of the cooling channels in the first to third embodiments.

[0315] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. A mounting chuck having a predetermined thickness in the vertical direction, with vacuum channels formed therein for fixing the electronic component with vacuum pressure, and capable of mounting an electronic component; and A heating heater for heating the above-mentioned mounting chuck; comprising, The above-mentioned mounting chuck has a cooling channel formed therein through which a cooling fluid can move, and The above cooling channel has an inlet for receiving a cooling fluid and an outlet for receiving a cooling fluid, and The above-mentioned entrance and the above-mentioned exit are arranged adjacent to each other, and The above cooling channel may be divided into a first section extending from the inlet to the intermediate section and a second section extending from the intermediate section to the outlet, based on an intermediate section located in the middle of the cooling channel leading to the inlet and the outlet. The cooling fluid input through the above inlet passes sequentially through the above first section, the above intermediate section, and the above second section and is output through the above outlet, and The above-mentioned first section and the above-mentioned second section are arranged side by side adjacent to each other, and The direction in which the cooling fluid moves in the first section and the direction in which the cooling fluid moves in the second section are opposite to each other. Test table for a handler for testing electronic components.

2. In Paragraph 1, The above intermediate section is positioned in the central part of the above mounting chuck, and The first section extends in a spiral shape from the entrance to the intermediate section, and the second section extends in a spiral shape from the intermediate section to the exit. Test table of a handler for testing electronic components.

3. In Paragraph 2, The above inlet and the above outlet are positioned on the side of the above mounting chuck, and The above-mentioned first section is in the shape of a spiral with a gradually decreasing radius, and The above second section is in the shape of a spiral with a gradually increasing radius. Test table for a handler for testing electronic components.

4. In Paragraph 1, The above first section and the above second section have parallel zones adjacent to each other in a straight line form. Test table of a handler for testing electronic components.

5. In Paragraph 1, In a plane, the first points where the first section intersects a virtual straight line passing through the center of the mounting rod and the second points where the second section intersects the virtual straight line are arranged alternately. Test table of a handler for testing electronic components.

6. In Paragraph 1, The above first section, intermediate section, and second section are arranged at the same height. Test table of a handler for testing electronic components.

7. In Paragraph 1, The above cooling channel is multiple Test table of a handler for testing electronic components.

8. In Paragraph 7, The aforementioned plurality of cooling channels are arranged at the same height Test table of a handler for testing electronic components.

9. In Paragraph 7, The aforementioned plurality of cooling channels are arranged at different heights Test table of a handler for testing electronic components.

10. In Paragraph 9, The aforementioned plurality of cooling channels are positioned at a higher location than the heating heater. Test table of a handler for testing electronic components.

11. In Paragraph 9, At least one specific cooling channel among the plurality of cooling channels described above is positioned at a lower position than the heating heater. Test table of a handler for testing electronic components.

12. A test table according to any one of paragraphs 1 through 11 applied Handler for testing electronic components.

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