A segmented content-addressable memory architecture uses independent sub-word circuits to minimize cycle time and reduce power consumption.
Segmented dielectric deposition relaxes high aspect ratio memory stacks, preventing contact shorts and metal residues during metallization.
A time control unit measures signal propagation times on a system bus to define dynamic cycle times for connected modules.
Priority operation control portion selects data from semiconductor memory based on assigned levels, preventing exclusive bus usage by multiple masters.
A ternary memory cell arrangement uses two ferroelectric field-effect transistors to store data in three distinct logic states.
A memory decoding system manages bit line voltages using specific PMOS and NMOS transistor control sequences during read operations.
Memory controller adjusts DRAM refresh frequency based on measured temperature change rates to optimize power consumption.
A double row buffer DRAM system decouples precharge and restore operations from data I/O lines to reduce critical path latency.
Band-gap reference current circuits compensate temperature variations to maintain write current amplitude precision across varying cell technologies.
Fractional row activation selectively energizes predicted storage cell patterns, reducing activation power consumption without increasing memory latency.
A refresh control circuit generates non-adjacent wordline sequences to prevent noise interference between adjacent memory mats during refresh operations.
A D-MRAM bit-cell replicates volatile DRAM data into a magneto-electric magnetic tunnel junction using shared circuitry.