Surface treatment method for electrolytic copper foil coating excellent in chemical resistance and cohesive force

A technology of electrolytic copper foil and chemical resistance, applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of unsatisfactory copper foil acid resistance degradation rate, inconvenient operation, etc., and achieve favorable The effect of cleaner production

CN100554528CInactive Publication Date: 2009-10-28HARBIN INST OF TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2009-10-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a surface treatment method of an electrolytic copper foil coating with good chemical resistance and adhesion, relating to a treatment method of a ternary alloy coating. In order to solve the problem of inconvenient operation caused by the step-by-step electroplating method in the existing copper foil surface treatment process, and the unsatisfactory current situation that the acid resistance degradation rate of the existing surface treated copper foil is not satisfactory, in the electrolytic copper foil coating of the present invention , the mass percentage of Zn is 65-75%, the mass percentage of Ni is 20-30%, and the mass percentage of Sn is 3-7%. The treatment method is as follows: 1. Preparation of electroplating solution; 2. Selection of additives; 3. Pretreatment of electrolytic copper foil; 4. Electrodeposition. The invention adopts a one-step electroplating method to deposit the ternary alloy. The FR4 copper-clad laminate made of the copper foil obtained by the method of the present invention can repeatedly obtain a peel strength of 1.9-2.0 N / mm or more and a hydrochloric acid degradation rate of 2% or less.
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Description

technical field

[0001] The invention relates to a ternary alloy coating treatment method. Background technique

[0002] Electrolytic copper foil is an important material for making printed circuit boards (PCB). PCB is mainly used in electronic computers, industrial control, aerospace and all consumer appliances and other fields. With the rapid development of the electronic information industry, my country's demand for printed circuit boards is also increasing, which brings a good market prospect and development opportunities for the electrolytic copper foil industry. As an important copper processing product, the importance of copper foil in the modernization of industry and national defense is becoming more and more obvious. It can be said that the level of copper foil production technology reflects the level of a country's industrial products to some extent.

[0003] Electrolytic copper foil is processed into printed circuit boards through circuit etching. The etching pr...

Examples

specific Embodiment approach 1

[0014] Embodiment 1: In the electrolytic copper foil coating in this embodiment, the mass percentage of Zn is 65-75%, the mass percentage of Ni is 20-30%, and the mass percentage of Sn is 3-7% %.

specific Embodiment approach 2

[0015] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the mass percentage of Zn in the electrolytic copper foil coating is 75%, the mass percentage of Ni is 22%, and the mass percentage of Sn is 3% %.

specific Embodiment approach 3

[0016] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the mass percentage of Zn in the electrolytic copper foil coating is 70%, the mass percentage of Ni is 25%, and the mass percentage of Sn is 5% %.