Power semiconductor module and method of arranging the module on a motor

Abstract

The invention proposes a power semiconductor module and a method for arranging the module on a motor, the power semiconductor module having: a power semiconductor assembly; a housing having a recess in a housing side having an outer surface, the recess having a passage direction along the direction of the normal to the outer surface; having an internal contact device that electrically contacts an external connection element, in particular designed as a load terminal element, in the interior of the housing, and a section is arranged in the recess; and having a spring element, wherein the connection element is designed as a rigid metal profile having an internal contact surface and an external contact surface, wherein the external contact surface is accessible from the outside, wherein the connection element is connected to the housing via an electrically insulating and mechanically resilient holding device, such that the connection element is movable along the passage direction, and wherein the spring element is arranged and designed such that its spring action acts directly or indirectly on the connection element along the passage direction.

Description

Technical Field

[0001] In summary, this invention describes a power semiconductor module having a power semiconductor arrangement, a housing, and internal contact devices that electrically contact external connecting elements inside the housing, wherein the connecting elements are designed as rigid metal molded bodies with internal and external contact surfaces. The invention also describes a method for arranging such a power semiconductor module on a motor (preferably on an electric motor of a road vehicle). As used herein, the term "electric motor" should generally be understood to refer to an electric motor that can operate as both a motor and a generator. Background Technology

[0002] For example, DE 10 2006 006 425 A1 discloses a standard power semiconductor module employing a pressure contact design, designed for placement on a cooling assembly, wherein the load terminal element is, in each case, implemented as a metal molded body having at least one strip segment and a plurality of contact feet extending therefrom. In this case, one strip segment of the load terminal element is arranged parallel to and spaced apart from the substrate surface. Furthermore, the contact feet extend from the strip segment to the substrate, where they form circuit-compatible contacts for the load terminals. A molded insulator is disposed between the strip segment of the load terminal element and the substrate, and the molded insulator has recesses for the contact feet to pass through.

[0003] In view of the prior art, the object of the present invention is particularly to improve the design and arrangement of external (i.e., outwardly extending) connecting elements in such a way that, as part of the improved method, the power semiconductor module can be easily arranged relative to the motor (especially the electric motor). Summary of the Invention

[0004] According to the invention, this objective is achieved by a power semiconductor module comprising: a power semiconductor component; a housing having a recess in a housing side having an outer surface, the recess having a channel direction along the normal direction of the outer surface; an internal contact device having electrical contact with an external connecting element (particularly designed as a load terminal element) inside the housing, and a portion thereof being disposed in the recess; and a spring element, wherein the connecting element is designed as a rigid metal formwork having an internal contact surface and an external contact surface, wherein the external contact surface is accessible from the outside, wherein the connecting element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connecting element is movable along the channel direction, and wherein the spring element is arranged and designed such that its spring action acts directly or indirectly on the connecting element along the channel direction.

[0005] Particularly advantageous is that the connecting element has a first connecting element position relative to the channel direction, in which the outer contact surface has a first contact surface position relative to the outer surface, and wherein the connecting element can be displaced in the negative channel direction against the spring force of the spring element.

[0006] In each case, it is advantageous for the first contact surface to be recessed relative to the outer surface in the channel direction, or for the first contact surface to be flush with the outer surface, or for the first contact surface to protrude through the outer surface.

[0007] On one hand, it is preferable that the spring element is designed to press the internal contact device along the channel direction onto the internal contact surface of the connecting element, and thus the internal contact device is arranged between the spring element and the connecting element. On the other hand, the internal contact device may have a sleeve in which a section of the connecting element and the spring element are arranged.

[0008] In principle, it is advantageous that the housing side is designed as a substrate, and therefore the recess is arranged in the substrate. Simultaneously, the substrate can have a cooling device, especially a fluid cooling device.

[0009] Preferably, the internal contact device is designed as an integral part of the power semiconductor assembly, particularly an integral part of the substrate of the power semiconductor assembly, or the internal contact device is electrically connected to the power semiconductor assembly, particularly electrically connected to its substrate.

[0010] In one advantageous manner, the spring element is implemented as a helical spring, a Bavarian spring, or an elastomer.

[0011] Advantageously, the mechanoelic retaining device is implemented as a sealing device that encloses the connecting element on all sides of a section of the connecting element, and the sealing device seals the recess to protect it from environmental influences.

[0012] Preferably, the mechanically elastic retaining device is securely mounted in the housing by means of a fixing device.

[0013] It is particularly advantageous that the housing may also house a control circuit board, a capacitor bank, or both of these.

[0014] Furthermore, this objective is achieved by a method for arranging the aforementioned power semiconductor module on a motor, the motor having motor contact devices for conductive connection to the power semiconductor module, the method comprising the following steps:

[0015] a) Deploying a power semiconductor module, wherein an external contact surface is positioned at a first contact surface location relative to the outer surface of the housing side of the power semiconductor module housing.

[0016] b) A power semiconductor module is arranged relative to the power module surface of the motor, such that the external contact surface of the connecting element of the power semiconductor module rests on a motor contact device assigned to the external contact surface, wherein the external contact surface is held in the first contact surface position relative to the external surface.

[0017] c) Using a mounting device, the power semiconductor module is fixed to the surface of the power module by means of the outer surface of the power semiconductor module, wherein the outer contact surface is displaced from the first contact surface position to the second contact surface position along the negative channel direction, thereby forming a conductive pressure contact generated by the spring element of the power semiconductor module between the outer contact surface and the associated motor contact device.

[0018] Advantageously, a sealing device can be arranged between the power module surface and the external surface. This sealing device can be arranged around the location of the connecting element.

[0019] Preferably, the sealing device is implemented as a static, self-sealing, and removable sealing device, especially as a flat seal, a shaped gasket, and here particularly as an O-ring seal.

[0020] Of course, unless explicitly or inherently excluded or in conflict with the spirit of the invention, each feature or group of features mentioned in the singular form, in particular external load terminal elements, or groups of features, may appear more than once in the power semiconductor module according to the invention.

[0021] It goes without saying that the various embodiments of the invention can be implemented individually or in any combination, regardless of whether they are described in the context of a power semiconductor module or method, in order to achieve improvements. In particular, the features mentioned above and below can be applied not only in the specified combinations, but also in other combinations or individually, without departing from the scope of the invention. Attached Figure Description

[0022] According to the following Figures 1 to 10 The description of exemplary embodiments of the invention, illustrated schematically, or related portions thereof, leads to further explanation, advantageous details, and features of the invention.

[0023] Figures 1 to 4 Various embodiments of the power semiconductor module according to the present invention are shown in cross-section.

[0024] Figure 5 and Figure 6 The power semiconductor module according to the invention is shown prior to step b) of the method according to the invention.

[0025] Figure 7 The completed step b) of the method according to the invention is shown.

[0026] Figure 8 The completed step c) of the method according to the invention is shown.

[0027] Figure 9 and Figure 10 Various embodiments of the power semiconductor module according to the present invention are illustrated in three-dimensional cross-sectional views. Detailed Implementation

[0028] Figures 1 to 4 Various embodiments of the power semiconductor module 1 according to the invention are shown in cross-section. The corresponding power semiconductor module 1 has a housing 7, which is here without general limitation designed as two parts, having a metal substrate 72 and a cup-shaped plastic body 70. These embodiments are substantially standard in the art.

[0029] The power semiconductor module 1 also includes a power semiconductor component 2, which has a substrate in a standard manner that electrically insulates the power semiconductor component 2 from the substrate 72. A plurality of conductor tracks (not explicitly shown) are arranged on the substrate, on which power semiconductor devices are placed and connected in a circuit-compatible manner.

[0030] According to Figure 1 In one embodiment, an elastic pad-like element 60 is disposed between the substrate and the base plate 72. In this case, the elastic pad-like element 60 is formed of permanently elastic industrial rubber. The pad-like element 60 forms the spring element 6 of the power semiconductor module 1.

[0031] The housing 7 (here, the cup-shaped housing portion 70) has a housing side 700 (here, the top side of the housing 7) having an outer surface 702 and a recess 704 extending through that side of the housing. A section of the connecting element 4 protrudes through the recess 704 of the housing 7. The connecting element 4 is designed as a rigid (in other words, unlike standard material properties), inelastic metal formwork having an inner contact surface 40 and an outer contact surface 42. The outer contact surface 42 is used to connect the power semiconductor module 1, particularly to the motor, and is therefore accessible from the outside.

[0032] The power semiconductor module 1 also has an electrically insulated and mechanically resilient retaining device 5. This retaining device 5 is connected to the housing 7 of the power semiconductor module 1 on one side and to the connecting element 4 on the other. The section between these connections is the area that essentially provides the resilience of the retaining device. For this purpose, the retaining device 5 is used to encapsulate the connecting element 4, and the retaining device is connected to the housing 7 in a standard manner (here, using adhesive bonding).

[0033] With the aid of the electrically insulating and mechanically elastic retaining device 5, and especially with the aforementioned section, the connecting element 4 is arranged to be movable in the recess 704 along the normal direction N of the outer surface 702 of the housing side 700.

[0034] The internal contact device 3 is designed here as an integral part 30 of the power semiconductor assembly 2, specifically as a component of the conductor track of the substrate of the power semiconductor assembly 2, more precisely as a segment thereof. This segment of the conductor track is connected to the external connecting element 4 in a material-bonded and therefore directly conductive manner, which is designed herein as a load terminal element. Of course, a connection medium, such as solder, can be arranged between the internal contact surface 40 of the connecting element 4 and this segment of the conductor track, but no other object. In this example, the connection between the internal contact device 3 and the connecting element 4 is directly formed. An alternative embodiment of the direct connection between the internal contact device 3 and the internal contact surface 40 is a force-fit connection. This can be even advantageous, especially when combined with an arrangement where the power semiconductor module 1 is directly mounted on the motor, because material-bonded connections, especially solder connections, do not have sufficient durability due to potentially high ambient temperatures.

[0035] The spring element 6, the internal contact device 3, the connecting element 4, and the retaining device 5 interact such that the connecting element 4 is pressed outward through the recess in the normal direction N until it reaches the connecting element position, in which the external contact surface 42 is in the first contact surface position P1, see [reference]. Figure 7 In this case, the spring element 6 acts indirectly on the connecting element 4 via the base. During this process, the outer contact surface 42 protrudes from the housing 7 through the outer surface 702. When an external force is applied along the negative normal direction N, the connecting element 4 can overcome the spring force of the spring element 6 and displace in that direction.

[0036] According to Figure 2 In the design, the power semiconductor module 1 does not have a spring element 6 between the base of the power semiconductor component 2 and the substrate 72, but instead, these components are connected to each other in a standard thermal conduction manner.

[0037] Furthermore, the internal contact device 3 is designed here as a metal sleeve 32, which is connected to the substrate in a material-bonded manner, more precisely, to a section of the conductor track connected to the substrate. The end section of the connecting element 4 associated with the internal contact surface 40 of the connecting element 4 is arranged in the sleeve 32 and is connected to the inner surface of the sleeve 32 in a force-fit and conductive manner. The sleeve 32 is widened in its base region, where it has an elastomer 62, which is formed of permanently elastic industrial rubber, forming the spring element 6 of the power semiconductor module 1. Here, the connecting element 4 is in direct mechanical contact with the spring element 6.

[0038] Furthermore, the design of power semiconductor module 1 is similar to that based on Figure 1 The power semiconductor module is designed in a similar manner and has essentially the same function, particularly in the interaction of the internal contact device 3, spring element 6, connecting element 4, and retaining device 5. However, here, the spring device 6 acts directly on the connecting element 4.

[0039] According to Figure 3 In this embodiment, the power semiconductor module 1 has a substrate 72 and two through holes 74 for screws 76, which form part of a mounting device and are used to mount the power semiconductor module 1, particularly, onto a motor. Furthermore, in this embodiment of the power semiconductor module 1, the substrate 72 includes a recess 724 in which a section of the connecting element 4 is disposed. Thus, the connecting element 4 protrudes through the substrate 72 from the interior of the housing 7, such that its internal contact surface 40 is positioned within the interior of the housing 7 of the power semiconductor module 1, while its external contact surface 42 protrudes through the external surface 722 of the substrate 72.

[0040] Here, the electrically insulating and mechanically resilient retaining device 5 is connected to the substrate 72 by means of a recess in the substrate 72. It also includes a section of the connecting element 4, and thus further ensures electrical insulation between the connecting element 4 and the metal substrate 72. Although not shown, a separate insulating device may also enclose the connecting element in the necessary section to provide electrical insulation.

[0041] The retaining device 5 is also used to flexibly support the connecting element 4 relative to the substrate 72 and its recess 724. This flexible mounting allows for movement of the connecting element 4 in the normal direction N of the substrate 72, and thus allows for changes in the contact surface position of the outer contact surface 42 relative to the outer surface 722 of the substrate 72 (more generally, the outer surface including the housing side of the recess).

[0042] Here, the internal contact device 3 of this embodiment of the power semiconductor module 1 is a segment of the internal connection device 34 of the power semiconductor assembly 2. Here, the internal connection device 34 is designed as a standard stack consisting of conductive films and electrically insulating films, and if necessary, the standard stack has vias through one or more electrically insulating layers between the conductive layers.

[0043] The internal contact device 3 and the internal contact surface 40 of the connecting element 4 are in direct conductive pressure contact. This pressure contact is generated by means of a spring element 6, which is implemented here as a helical spring 64 having a spring axis or spring direction parallel to the normal direction N. In this embodiment, since the helical spring 64 is made of a metallic material, an insulator 640 is located between the end of the helical spring and the internal contact device 34. This insulator additionally performs the function of uniformly transmitting the pressure of the helical spring 64 to the internal connecting device 34.

[0044] Furthermore, particularly regarding the interaction between the internal contact device 3, the spring element 6, the connecting element 4, and the holding device 5, this embodiment of the power semiconductor module 1 implements an interaction with the one provided by [the relevant authority / organization]. Figure 1 and Figure 2 The functions shown in the two variations above are basically the same.

[0045] According to Figure 4 In the design, power semiconductor component 1 is designed to be basically similar to that according to Figure 1 and Figure 2 The power semiconductor assembly 2. However, here, the internal contact device 3 is not an integral part of the power semiconductor assembly 2. Instead, an L-shaped metal formwork 36 forms the internal contact device 3. The metal formwork 36 has a section parallel to or at least approximately parallel to the substrate 72. Two helical springs 64, 360 press against this parallel section. The first helical spring 64 forms the spring element 6 of the power semiconductor module 1, which directly presses a sub-segment of the parallel section onto the internal contact surface 40 of the connecting element 4, thereby forming a conductive contact between them. The other spring 360 presses a section of the internal contact device 36 extending perpendicular to the substrate 72 onto the conductor track of the substrate, thus contacting the power semiconductor assembly 2.

[0046] In this embodiment of the power semiconductor module 1, particularly regarding the interaction between the internal contact device 3, the spring element 6, the connecting element 4, and the holding device 5, a method according to [the relevant regulations] is also implemented. Figure 3 The functions in the above-described variations are basically the same.

[0047] Figure 5 and Figure 6Each shows a portion of the power semiconductor module 1 and electric motor 9 according to the invention prior to step b) of the method according to the invention. Figure 5 The power semiconductor module 1 and according to Figure 4 The power semiconductor module 1 is basically the same, except that the substrate 72 has a groove 728 extending around the recess 724 on its outer surface 724. The groove 728 is designed to partially receive the sealing device 8, which is the O-ring seal 80 in this case.

[0048] Motor 9 has a power module surface 92, which is designed such that power semiconductor module 1 rests flush with its outer surface 722 on power module surface 92. Power module surface 92 also has grooves 928 that align with and interact with grooves 728 on substrate 72, such that O-ring seal 80 rests in both grooves, and thus seals recesses 724 after power semiconductor module 1 is mounted on power module surface 92, protecting them from environmental influences, including pressurized water.

[0049] In addition, the motor 9 has a thread 96 that interacts with the screw 76 of the power semiconductor module 1 and forms a mounting device.

[0050] In the recess 902, a motor contact device 94 is arranged on the surface of the power module surface 92 of the motor 9. This contact device, together with the external contact surface 42 of the connecting element 4, is designed to form a conductive contact between the power semiconductor module 1 and the motor 9. In this respect, as with all previous power semiconductor modules 1, the first contact surface position P1 protrudes in the channel direction N relative to the external surface 722.

[0051] According to Figure 5 Conversely, according to the power semiconductor module 1, Figure 6 The power semiconductor module 1 has an internal contact device 3 that is bonded to the conductor track of the substrate by means of material bonding and has a length compensation structure perpendicular to the substrate 72. In addition, the power semiconductor module 1 has a fixing device 50 that clamps a section of the holding device 5 against the housing 7, thus fixing it to the housing 7, or more precisely, fixing it in the housing 7.

[0052] In the raised section 904, a motor contact device 94 is arranged on the surface of the power module surface 92 of the motor 9. This contact device, together with the external contact surface 42 of the connecting element 4, is designed to form a conductive contact between the power semiconductor module 1 and the motor 9. In this embodiment of the semiconductor module 1, the first contact surface position P1 is recessed in the channel direction N relative to the external surface 722.

[0053] Furthermore, the motor 9 here also has a fluid cooling device 900 for cooling the power semiconductor module 1. This is particularly preferred if the substrate 72 itself does not have an explicit cooling device.

[0054] Figure 7 Step b) of the method according to the invention is shown. In this example, according to Figure 4 The power semiconductor module 1 (by way of example only, and since it can be used to explain the method) is arranged on the power module surface 92 of the motor 9, but no external force is applied to the power semiconductor module 1. Therefore, the first contact surface position P1 relative to the outer surface 722 is defined by the interaction of the internal components. Of course, in this case, the associated portions of the mounting devices 76, 96 are each arranged relative to each other in a normal direction and slightly inclined. Similarly, the outer contact surfaces 42 of the motor contact device 94 and the connecting element 4 are aligned in the normal direction and also slightly inclined relative to each other.

[0055] Figure 8 The completed step c) of the method according to the invention is shown. During step c), the power semiconductor module 1 is flush-mounted to the power module surface 92 of the motor 9 with its outer surface 724 by means of the respective associated portions of the mounting devices 76, 96. As a result, the connecting element 4 is displaced along the negative normal direction N against the action of the spring device 6. This causes the outer contact surface 42 to reach the second contact surface position P2, which is offset relative to the first contact surface position P1 along the negative normal direction N. In other words, after assembly, the outer contact surface 42 protrudes less relative to the surface 722 of the housing side 720 (here, the substrate 72) compared to before assembly. Due to this assembly, the spring element 6 is tensioned for the first time or more strongly, resulting in a conductive pressure contact between the outer contact surface 42 and the motor contact device 94. Of course, this means that the inner contact device 36 is now tilted. In other embodiments, particularly according to Figure 3 and Figure 6 The inclination of the internal contact device 3 is low or non-existent.

[0056] Figure 9 and Figure 10 Various different but similar embodiments of the power semiconductor module 1 according to the invention are shown in three-dimensional cross-sectional views. The housing 7 is also shown again, which in this example is a cup-shaped metal housing with a plastic cap (not shown). The metal housing 7 has a housing side 720 at its base, which forms a housing surface 722 and two recesses 724, see... Figure 10 According to Figure 10In the design, the housing side 720 has another sealing device 8 extending around its edge, here a flat seal 82, which interacts with the power module surface of the motor (not shown) in a sealing manner.

[0057] Power semiconductor components 2 are arranged inside each housing 7. This refers to the thin-film composite 34, as already present. Figure 3 As described, the thin-film composite also forms an internal contact device 3 that contacts the connecting element 4. The connecting element 4 itself is designed as a rigid metal molded body with an internal contact surface 40 and an external contact surface 42. This molded body is almost completely enclosed by a retaining device 5 in the normal direction N, which effectively exposes only the areas of the contact surfaces 40, 42. The retaining device 5 encloses the connecting element and has multiple segments through which the retaining device 5 is force-fitted within the housing 7. The retaining device is designed not only to be electrically insulated, but is also additionally designed as a sealing device that seals the interior of the power semiconductor module 1 (even if it is not mounted on a motor) from environmental influences such as dust and moisture.

[0058] The retaining device 5 alone ensures that the connecting element 4, arranged in the recess 724, has limited movement capability in the normal direction N. The spring device 6 (basically similar to...) Figure 3 The spring device is designed and sized such that it presses the connecting element 4 slightly off-center from its rest position along the normal direction N, which is the position without the positioning spring element 6. The outer contact surface 42 is therefore located at a first contact surface position relative to the outer surface 722. Since the power semiconductor module 1 is mounted on the motor by means of a mounting device (not shown), where the outer surface 722 rests flush with the power module surface of the motor, the outer contact surface 42 shifts from the first contact surface position P1 in the negative direction N to a second contact surface position P2, see... Figure 7 and Figure 8 Furthermore, conductive pressure contacts generated by the spring element 6 of the power semiconductor module 1 are formed between the internal contact surface 40 and the internal contact device 34, and between the external contact surface 42 and the associated motor contact device.

Claims

1. A power semiconductor module (1), having a power semiconductor assembly (2) and having a housing (7) with a recess (404, 724) in a housing side (700, 720) having an outer surface (702, 722), the recess having a passage direction along a normal direction (N) of the outer surface (702, 722), and having an internal contact device (3) which is in electrical contact with an external connection element (4) inside the housing (7) and which is arranged in the recess (704, 724) for a section, and having a spring element (6), wherein The connecting element (4) is designed as a rigid metal profile having an inner contact surface (40) and an outer contact surface (42), wherein the outer contact surface (42) is accessible from the outside, wherein the connecting element (4) is connected to the housing (7) via an electrically insulating and mechanically resilient holding device (5) such that the connecting element is movable along the passage direction (704, 724), and wherein the spring element (6) is arranged and designed such that a spring action of the spring element (6) acts directly or indirectly on the connecting element (4) along the passage direction, wherein the connecting element (4) has a first connecting element position relative to the passage direction, in which the outer contact surface (42) has a first contact surface position (P1) relative to the outer surface (402, 422), and wherein the connecting element (4) is displaceable against the spring force of the spring element in the negative passage direction, and when the power semiconductor module is arranged on a motor, the connecting element (4) is displaceable against the spring force of the spring element in the negative passage direction from the first contact surface position to a second contact surface position, whereby an electrically conductive pressure contact between the outer contact surface (42) and an associated motor contact device (94) is formed by the spring element (6) of the power semiconductor module (1), the inner contact device (3) being arranged between the spring element (6) and the connecting element (4).

2. The power semiconductor module according to claim 1, wherein the first contact surface position (P1) is recessed relative to the outer surface (702, 722) in the passage direction, or the first contact surface position (P1) is formed flush with the outer surface (702, 722), or the first contact surface position (P1) protrudes through the outer surface (702, 722).

3. The power semiconductor module according to any one of claims 1 to 2, wherein the spring element (6) is designed to press the inner contact device (3) against the inner contact surface (40) of the connecting element (4) along the passage direction.

4. The power semiconductor module according to any one of claims 1 to 2, wherein the inner contact device (3) has a sleeve (32) in which a section of the connecting element (4) and the spring element (6, 62) are arranged.

5. The power semiconductor module according to any one of claims 1 to 2, wherein the housing side is designed as a base plate (72) and the recess (724) is therefore arranged in this base plate (72).

6. The power semiconductor module according to any one of claims 1 to 2, wherein The internal contact means (3) are designed as an integral component (30) of the power semiconductor assembly, or wherein the internal contact means (3) are electrically conductively connected to the power semiconductor assembly.

7. The power semiconductor module according to any of claims 1-2, wherein The spring element (6) is embodied as a coil spring (64) or a belleville spring or an elastomeric material (60, 62).

8. The power semiconductor module according to any of claims 1-2, wherein The mechanically resilient holding means (5) are embodied as a sealing means which encloses the connection element (4) on all sides in a section of the connection element (4) and seals the recess (704, 724) against the environment.

9. The power semiconductor module according to any of claims 1-2, wherein The mechanically resilient holding means (5) are firmly mounted in the housing (7) by means of a fixing means (50).

10. The power semiconductor module according to any of claims 1-2, wherein The housing (7) additionally accommodates a control circuit board, a capacitor means or both.

11. The power semiconductor module according to any of claims 1-2, wherein The external connection element (4) is designed as a load terminal element.

12. The power semiconductor module according to any of claims 1-2, wherein The internal contact means (3) are designed as an integral component of a base of the power semiconductor assembly, or wherein the internal contact means (3) are electrically conductively connected to the base of the power semiconductor assembly.

13. Method for arranging a power semiconductor module (1) according to any of the preceding claims on a motor (9), the motor (9) comprising motor contact means (94), the method having the following method steps: a) deploying the power semiconductor module (1), wherein The external contact surface (42) is positioned in the first contact surface position (PI) relative to the external surface (702, 722) of the housing side (700, 720) of the housing (7) of the power semiconductor module (1); b) arranging the power semiconductor module (1) relative to a power module surface (92) of the motor such that the external contact surface (42) of the connection element (4) of the power semiconductor module (1) rests on the motor contact means (94) associated with the external contact surface, wherein the external contact surface (42) is held in the first contact surface position (PI) relative to the external surface (702, 722); c) by means of mounting means (76, 96), fixing the power semiconductor module (1) on the power module surface (92) with the outer surface (702, 722) of the power semiconductor module (1), wherein the outer contact surface (42) is displaced from the first contact surface position to the second contact surface position (P2) along the negative channel direction, whereby an electrically conductive pressure contact generated by the spring element (6) of the power semiconductor module (1) is formed between the outer contact surface (42) and the associated motor contact means (94).

14. The method according to claim 13, wherein arranging a sealing means (8) between the power module surface (92) and the outer surface (702, 722).

15. The method according to claim 14, wherein arranging the sealing means (8) around the position of the connection element (4).

16. The method according to claim 14 or 15, wherein the sealing means (8) is embodied as a static, self-sealing and removable sealing means.

17. The method according to claim 14 or 15, wherein the sealing means (8) is embodied as a flat seal (82) or as a profiled gasket (80).

18. The method according to claim 14 or 15, wherein the sealing means (8) is embodied as an O-ring seal.

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