Camera module and assembly method

Abstract

A camera module and assembly method, the method comprising: mounting an image sensor chip on a substrate; applying an adhesive to a bracket placement area of ​​the substrate to form a first adhesive layer; placing the bracket on the first adhesive layer, wherein the bracket has a first opening and a sealing glass placement area, the first opening is used to expose the image sensor chip, the sealing glass is bonded to the sealing glass placement area through a second adhesive layer and seals the first opening, the substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity, and the image sensor chip is located in the cavity; curing the first adhesive layer and escaping through an air vent; wherein the location of the air vent includes any one of the following: the side wall of the cavity, the sealing glass placement area and the second adhesive layer, and the side wall of the bracket and the first adhesive layer form the side wall of the cavity. The above scheme can improve the yield rate of the camera module.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of camera modules, and in particular to a camera module and an assembly method thereof. Background Art

[0002] During the assembly of the camera module, black glue is usually used to bond the bracket to the substrate to obtain a semi-finished product of the camera module, in which the bracket is used to carry the infrared transparent sheet and the lens assembly. In order to firmly adhere the bracket to the substrate, the black glue is usually cured under high temperature conditions. During the black glue curing process, an air escape hole is usually provided on the top of the bracket, through which hot air is released to balance the air pressure inside and outside the bracket, to prevent hot air from pushing up the bracket and affecting the firmness of the bonding between the bracket and the substrate.

[0003] After obtaining the semi-finished product, it is usually necessary to clean the semi-finished product. When the semi-finished product is cleaned by centrifugal water washing, in order to prevent the detergent from entering the semi-finished product through the vent hole and damaging the semi-finished product, it is usually necessary to seal the vent hole.

[0004] However, when sealing the air escape holes, the packaging process of the air escape holes is difficult and is prone to glue overflow, bubbling, and insufficient glue. Glue overflow or bubbling may affect the subsequent installation of lens components, while insufficient glue may cause water ingress, resulting in a low yield rate of the camera module. Summary of the invention

[0005] The technical problem solved by the embodiments of the present invention is that the yield rate of the camera module is low.

[0006] To solve the above technical problems, an embodiment of the present invention provides a camera module assembly method, comprising: mounting an image sensor chip on a substrate; applying an adhesive to a bracket placement area of ​​the substrate to form a first adhesive layer; placing the bracket on the first adhesive layer, wherein the bracket has a first opening and a sealing glass placement area, the first opening is used to expose the image sensor chip, the sealing glass is bonded to the sealing glass placement area through a second adhesive layer and seals the first opening, the substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity, and the image sensor chip is located in the cavity; curing the first adhesive layer and escaping through an air vent; wherein the setting position of the air vent includes any one of the following: the side wall of the cavity, the sealing glass placement area and the second adhesive layer, the side wall of the bracket and the first adhesive layer form the side wall of the cavity.

[0007] Optionally, after curing the first adhesive layer, the method further includes: sealing the air escape port.

[0008] Optionally, the closing of the air escape port comprises any one of the following: closing the air escape port when applying a reinforcement layer to the connection end of the substrate; closing the air escape port before applying a reinforcement layer to the connection end of the substrate; closing the air escape port after applying a reinforcement layer to the connection end of the substrate.

[0009] Optionally, the camera module assembly method further includes: after closing the air escape port, obtaining a semi-finished product, and cleaning the semi-finished product by centrifugal water washing.

[0010] Optionally, when the air escape port is arranged in the first adhesive layer, the air escape port is formed in the following manner: an adhesive is applied to the bracket placement area of ​​the substrate, and when forming the first adhesive layer, the adhesive is applied intermittently, and no adhesive is applied in the first preset area, so that the first adhesive layer has a second opening in the first preset area, and at a position corresponding to the second opening, the air escape port is formed in the gap between the bracket and the substrate, wherein the bracket placement area includes the first preset area.

[0011] Optionally, the length range of the first preset area is 3mm-4mm.

[0012] Optionally, the first preset area is close to the connection end of the substrate.

[0013] Optionally, the air escape port is arranged in the second adhesive layer, and the air escape port is formed in the following manner: adhesive is applied to the sealing glass placement area of ​​the bracket, and when forming the second adhesive layer, the adhesive is applied intermittently, and the adhesive is not applied in the second preset area, so that the second adhesive layer has a third opening in the second preset area, and the air escape port is formed in the gap between the sealing glass and the bracket at the position corresponding to the third opening, wherein the sealing glass placement area includes the second preset area.

[0014] An embodiment of the present invention further provides a camera module comprising: a substrate, a first adhesive layer, a bracket, an image sensor chip, a second adhesive layer, a sealing glass and an air escape port, wherein: the first adhesive layer is arranged in the bracket placement area of ​​the substrate and is located between the substrate and the bracket; the bracket has a first opening and a sealing glass placement area, the first opening is used to expose the image sensor chip, the bracket is bonded to the substrate through the first adhesive layer, and the substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity; the second adhesive layer is arranged in the sealing glass placement area and is located between the bracket and the sealing glass; the sealing glass is connected to the bracket through the second adhesive layer and seals the first opening; the image sensor chip is mounted on the substrate and is located in the cavity; the setting position of the air escape port may include any one of the following: the side wall of the cavity, the sealing glass placement area and the second adhesive layer, the side wall of the bracket and the first adhesive layer form the side wall of the cavity.

[0015] Optionally, the air escape port is arranged on a side wall of the bracket.

[0016] Optionally, the air escape port is arranged on the first adhesive layer.

[0017] Optionally, the first adhesive layer has a second opening in the first preset area, and the gap between the bracket and the substrate at a position corresponding to the second opening serves as the air escape port.

[0018] Optionally, the length of the first preset area is 3mm-4mm.

[0019] Optionally, the gas escape port is close to the connection end of the substrate.

[0020] Optionally, the camera module further includes a sealing body, and the sealing body is used to seal the air escape port.

[0021] Optionally, the second adhesive layer has a third opening in the second preset area, and the gap between the bracket and the sealing glass at a position corresponding to the third opening serves as the air escape port.

[0022] Optionally, the air escape port is arranged in the sealing glass placement area, and the sealing glass placement area is formed by a depression of an area along the first opening on the bracket.

[0023] Optionally, the bracket may further include an extension groove communicating with the sealing glass placement area, wherein the extension groove corresponds to the setting position of the air escape port and extends in a direction away from the air escape port.

[0024] Optionally, an infrared filter film is coated on the sealing glass.

[0025] Optionally, the camera module also includes a lens assembly connected to the bracket.

[0026] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0027] There is a first adhesive layer between the bracket and the substrate, and the first adhesive layer is used to adhere the bracket to the substrate. A sealing glass placement area is provided on the bracket, wherein the sealing glass is used to seal the first opening on the bracket. The substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity. An air escape port can be provided at any position of the side wall of the cavity, the sealing glass placement area and the second adhesive layer. When the first adhesive layer is cured, air can escape through the air escape port. When there is a need to seal the air escape port, since the side wall of the cavity, the sealing glass placement area and the second adhesive layer do not need to cooperate with the lens assembly, the difficulty of packaging the air escape port can be reduced. Even if glue overflow, bubbling and other phenomena occur during the sealing process of the air escape port, it will not affect the yield rate of the camera module. Therefore, the yield rate of the camera module can be improved.

[0028] Furthermore, when the reinforcing layer is applied to the connection end of the substrate, the air escape port is closed. Applying the reinforcing layer and closing the air escape port are completed in the same process, which can save processes and improve the assembly efficiency of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a flow chart of a camera module assembly method in an embodiment of the present invention;

[0030] Figure 2 is a structural schematic diagram of a camera module in an embodiment of the present invention;

[0031] Figure 3 is a structural schematic diagram of another camera module in an embodiment of the present invention;

[0032] Figure 4 is a schematic structural diagram of a substrate in an embodiment of the present invention;

[0033] Figure 5 is a partial structural schematic diagram of a camera module in an embodiment of the present invention;

[0034] Figure 6 is a partial structural schematic diagram of another camera module in an embodiment of the present invention;

[0035] Figure 7 is a schematic structural diagram of a bracket in an embodiment of the present invention;

[0036] Figure 8 is a partial structural schematic diagram of another camera module in an embodiment of the present invention;

[0037] Fig. 9 is a partial structural schematic diagram of another camera module in an embodiment of the present invention;

[0038] Fig.10 is a partial structural schematic diagram of another camera module in an embodiment of the present invention;

[0039] Fig.11 It is a partial structural diagram of another camera module in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] As mentioned above, the current location of the vent hole of the camera module places high demands on the packaging process of the vent hole when it needs to be closed later. If glue overflow, bubbling, etc. occur, it will affect the installation of the subsequent lens assembly. If there is insufficient glue, water may easily enter during centrifugal washing, resulting in a low yield rate of the camera module.

[0041] To solve the above problems, in an embodiment of the present invention, there is a first adhesive layer between the bracket and the substrate, the first adhesive layer is used to bond the bracket to the substrate, and a sealing glass placement area is provided on the bracket, wherein the sealing glass is used to close the first opening on the bracket. The substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity, and an air escape port can be provided at any position of the side wall of the cavity, the sealing glass placement area and the second adhesive layer, and air can escape through the air escape port when the first adhesive layer is cured. When there is a need to seal the air escape port, since the side wall of the cavity, the sealing glass placement area and the second adhesive layer do not need to cooperate with the lens assembly, the difficulty of packaging the air escape port can be reduced. Even if glue overflow, bubbling and other phenomena occur during the sealing process of the air escape port, the yield rate of the camera module will not be affected. Therefore, the yield rate of the camera module can be improved.

[0042] In order to make the above-mentioned purposes, features and beneficial effects of the embodiments of the present invention more obvious and understandable, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0043] Reference Figure 1 , a flowchart of a camera module assembly method in an embodiment of the present invention is given, which may specifically include the following steps:

[0044] Step S11, mounting the image sensor chip on the substrate.

[0045] Step S12, applying adhesive to the support placement area of ​​the substrate to form a first adhesive layer.

[0046] In a specific implementation, the substrate may be a flexible substrate or a rigid substrate. When the substrate is a flexible substrate, it may be a flexible printed circuit (FPC).

[0047] The adhesive may be black glue or other glues, etc., and it only needs to have a certain viscosity and be able to adhere the bracket to the bracket placement area.

[0048] Step 13, placing the bracket on the first adhesive layer.

[0049] In a specific implementation, the bracket has a first opening and a sealing glass placement area. The first opening is used to expose the image sensor chip. A second adhesive layer is provided above the sealing glass placement area, and the sealing glass is bonded to the bracket through the second adhesive layer. After the sealing glass is bonded to the bracket, the first opening can be sealed. The substrate, the bracket, the first adhesive layer, the second adhesive layer and the sealing glass can enclose a cavity, and the image sensor chip can be located in the cavity.

[0050] Step S14, curing the first adhesive layer and escaping gas through the escaping port.

[0051] In a specific implementation, in order to improve the firmness of the bonding between the bracket and the substrate, after the bracket is placed on the first bonding layer, the first bonding layer can be cured. The first bonding layer is usually cured by high-temperature baking. Since the substrate, the bracket, the first bonding layer, the second bonding layer and the sealing glass can form a cavity, when the first bonding layer is cured, the air in the cavity expands due to heat, and the hot air tends to push the bracket away from the substrate, thereby affecting the bonding firmness between the bracket and the substrate. In order to avoid the influence of hot air on the bonding firmness when the first bonding layer is cured, air can be escaped through the vent to maintain the air pressure balance inside and outside the cavity.

[0052] In a specific implementation, there are multiple locations where the vent can be set. For example, the vent is set on the side wall of the cavity, wherein the side wall of the cavity is formed by the side wall of the bracket and the first adhesive layer, so the vent can be set on the side wall of the bracket or on the first adhesive layer. For another example, the vent is set in the sealing glass placement area. For another example, the vent is set on the second adhesive layer.

[0053] In a specific implementation, the number of the gas escape ports can be one or more. When the number of the gas escape ports is more than one, each gas escape port can be arranged on the side wall of the cavity; each gas escape port can also be arranged on the second adhesive layer; each gas escape port can also be arranged in the sealed glass placement area; each gas escape port can also be partially arranged on the side wall of the cavity, partially arranged on the second adhesive layer, and partially arranged in the sealed glass placement area; each gas escape port can also be partially arranged on the side wall of the cavity, and partially arranged on the second adhesive layer; each gas escape port can also be partially arranged on the second adhesive layer, and partially arranged in the sealed glass placement area; each gas escape port can also be partially arranged on the side wall of the cavity, and partially arranged in the sealed glass placement area.

[0054] In a specific implementation, the shape or size of the air escape port can be set according to actual needs and is not limited here.

[0055] It should be noted that, depending on the packaging method of the image sensor chip, the execution order of the above steps S11 to S13 may be different.

[0056] For example, when the image sensor chip is packaged in a chip on board (COB) or chip scale package (CSP), both step S11 and step 12 are performed before step S13, wherein step S11 and step S12 can be performed synchronously or asynchronously. When step S11 and step S12 are performed asynchronously, step S11 can be before or after step S12.

[0057] For another example, when the image sensor chip is packaged using the Chips On Module (COM) method, the COM packaging method refers to connecting the image sensor chip to the bracket in advance, so that the image sensor chip, the bracket and other components (sealing glass, etc.) form a module, so that when the module including the bracket is placed on the first adhesive layer, the image sensor chip is also mounted on the substrate accordingly, that is, step S12 is executed before step S11, and step S11 and step S13 are executed simultaneously.

[0058] As can be seen from the above, there is a first adhesive layer between the bracket and the substrate, and the first adhesive layer is used to bond the bracket to the substrate. A sealing glass placement area is provided on the bracket, wherein the sealing glass is used to close the first opening on the bracket. The substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity, and an air escape port can be provided at any position of the side wall of the cavity, the sealing glass placement area and the second adhesive layer, and air can escape through the air escape port when the first adhesive layer is cured. When there is a need to seal the air escape port, due to the side wall of the cavity, the sealing glass placement area and the second adhesive layer, it is not necessary to cooperate with the lens assembly, thereby reducing the difficulty of packaging the air escape port. Even if glue overflow, bubbling and other phenomena occur during the sealing process of the air escape port, it will not affect the yield rate of the camera module. Therefore, the yield rate of the camera module can be improved.

[0059] In a specific implementation, during the assembly process of the camera module, after the first adhesive layer is cured, the camera module usually needs to be cleaned. The camera module can be cleaned manually. In order to improve the cleaning efficiency of the camera module, the camera module can also be cleaned by centrifugal water washing.

[0060] When the camera module is cleaned by centrifugal water washing, in order to improve the cleaning efficiency of the camera module, water is prevented from entering the cavity through the air escape port and damaging the image sensor chip. In an embodiment of the present invention, the air escape port can be closed. After the air escape port is closed, a semi-finished product is obtained, and the semi-finished product can be cleaned by centrifugal water washing. By closing the air escape port, when the camera module is centrifugally washed, water can be prevented from entering the cavity through the air escape port and damaging the image sensor chip. In addition, closing the air escape port can make the cavity a closed cavity, and can also prevent dust and the like from entering the cavity and affecting the normal operation of the image sensor chip.

[0061] The air escape port can be closed in multiple processes. For example, when applying a reinforcement layer to the connecting end of the substrate, the air escape port is closed at the same time, that is, the application of the reinforcement layer and the closing of the air escape port are completed in one process. The simultaneous completion of the application of the reinforcement layer and the closing of the air escape port in the same process can improve the assembly efficiency of the camera module. For another example, before applying a reinforcement layer to the connecting end of the substrate, the air escape port is closed. For another example, after applying a reinforcement layer to the connecting end of the substrate, the air escape port is closed. Among them, the substrate may include a connecting end and a circuit board end, and the connecting end (also called the neck side) refers to one end of the lead of the substrate. The reinforcement layer can also be called neck glue, and the reinforcement layer can enhance the strength of the connecting end of the substrate to avoid breakage.

[0062] Specifically, the timing of closing the air vent or the process of closing the air vent is different according to the different locations of the air vent.

[0063] In one embodiment of the present invention, when the gas escape port is provided in the first adhesive layer, the reinforcing layer coating and the gas escape port sealing can be completed simultaneously in the process of coating the reinforcing layer at the connection end of the substrate. In particular, when the setting position of the gas escape port corresponds to the connection end of the substrate, the operation of coating the reinforcing layer is the gas escape port sealing operation.

[0064] In another embodiment of the present invention, when the air escape port is arranged on the side wall of the bracket, the air escape port can be closed when the reinforcing layer is applied to the connecting end of the substrate; the air escape port can also be closed before the reinforcing layer is applied to the connecting end of the substrate; the air escape port can also be closed after the reinforcing layer is applied to the connecting end of the substrate.

[0065] In another embodiment of the present invention, when the gas escape port is arranged in the sealing glass placement area, the gas escape port can be closed before the reinforcing layer is applied to the connection end of the substrate; the gas escape port can also be closed after the reinforcing layer is applied to the connection end of the substrate; the gas escape port can also be closed when the reinforcing layer is applied to the connection end of the substrate.

[0066] In a specific implementation, the sealing glass placement area provided on the bracket may be provided along the edge of the first opening.

[0067] In some embodiments, in order to avoid interference between the sealing glass and other components and to protect the sealing glass and prevent damage to the sealing glass, the sealing glass placement area can be formed by a depression in the area along the edge of the first opening at the top of the bracket, so that after the sealing glass is placed in the sealing glass placement area, it is possible for the upper surface of the sealing glass to be lower than or flush with the upper surfaces of other places in the bracket.

[0068] After the sealing glass is placed in the sealing glass placement area, the air escape port is at least partially not blocked by the sealing glass. When the air escape port is sealed, the air escape port can be sealed by dispensing glue.

[0069] In a specific implementation, in order to facilitate closing the air escape port, the bracket also includes an extended groove, which corresponds to the setting position of the air escape port and is connected to the sealing glass placement area. The extended groove extends in a direction away from the air escape port. When closing the air escape port, the extended groove can provide a certain operating space, which is convenient for dispensing glue to the air escape port through the extended groove.

[0070] In another embodiment of the present invention, the air escape port is arranged in the second adhesive layer, and the air escape port can be closed before the reinforcing layer is applied to the connection end of the substrate; the air escape port can also be closed after the reinforcing layer is applied to the connection end of the substrate; the air escape port can also be closed when the reinforcing layer is applied to the connection end of the substrate.

[0071] In a specific implementation, the air vent is formed in different ways according to the different locations of the air vent. Specifically:

[0072] In one embodiment of the present invention, the air escape port is provided in the first adhesive layer. When the first adhesive layer is formed in step S12, the adhesive is applied intermittently, and the adhesive may be applied intermittently in the first preset area, that is, the adhesive is not applied in the first preset area, so that the first adhesive layer has a second opening in the first preset area. After the bracket is placed on the first adhesive layer, the gap between the bracket and the substrate at the position corresponding to the second opening may form an air escape port, wherein the bracket placement area includes the first preset area.

[0073] In a specific implementation, the length of the first preset area ranges from 3 mm to 4 mm. It is understandable that, depending on the size of the camera module and the number of air escape ports, the length of the first preset area can also be other values, which will not be listed one by one here.

[0074] In a specific implementation, the first preset area can be set at any position of the first adhesive layer.

[0075] In an embodiment of the present invention, in order to reduce the assembly process of the camera module and improve the assembly efficiency of the camera module, the first preset area can be set at the connection end close to the substrate, so that it is possible to close the air vent while coating the reinforcement layer on the connection end of the substrate, that is, the coating of the reinforcement layer and the closing of the air vent can be completed in the same process. Compared with the prior art, which requires the coating of the reinforcement layer and the closing of the air vent to be completed in different processes respectively, it can save processes and thus improve the assembly efficiency of the camera module.

[0076] In another embodiment of the present invention, the air escape port is arranged in the second adhesive layer, and when the adhesive is applied to the sealing glass placement area of ​​the bracket, the adhesive may be applied intermittently, and the adhesive may not be applied to the second preset area, so that the second preset area has a third opening. When the sealing glass is placed on the second adhesive layer, the air escape port may be formed in the gap between the sealing glass and the bracket at the position corresponding to the third opening, wherein the sealing glass placement area may include the second preset area.

[0077] In a specific implementation, when applying adhesive to the second adhesive layer, the process of forming the air escape port by intermittently applying adhesive in the second preset area may be performed before step S14. Specifically, it may be performed before step S11, step S12 or step S13, or after step S11, step S12 or step S13, or synchronously with any of step S11, step S12 or step S13.

[0078] In order to facilitate those skilled in the art to better understand and implement the embodiments of the present invention, the embodiments of the present invention further provide a camera module.

[0079] Reference Figure 2 , a schematic structural diagram of a camera module in an embodiment of the present invention is given. Figure 3 A structural schematic diagram of another camera module in an embodiment of the present invention is given. Figure 4 A schematic diagram of the structure of a substrate in an embodiment of the present invention is given. Figure 7 , a schematic diagram of the structure of a bracket in an embodiment of the present invention is given. Figures 2 to 4 , Figure 7 , the specific structure of the camera module is explained.

[0080] In a specific implementation, the camera module 100 may include a substrate 10 , a first adhesive layer 20 , a bracket 30 , an image sensor chip 40 , a second adhesive layer 50 , a sealing glass 60 , and an air escape port 70 .

[0081] The first adhesive layer 20 is disposed in the support placement region 12 of the substrate 10 and is located between the substrate 10 and the support 30 .

[0082] The bracket 30 has a first opening 36 and a sealing glass placement area 31 . The first opening 36 can be used to expose the image sensor chip 40 , preferably to expose part of the photosensitive area 41 . The bracket 30 can be bonded to the substrate 10 via the first bonding layer 20 .

[0083] The second adhesive layer 50 is disposed in the sealing glass placement area 31 and is located between the bracket 30 and the sealing glass 60. The sealing glass 60 can be connected to the bracket 30 through the second adhesive layer 50 and seal the first opening 36, so that the substrate 10, the first adhesive layer 20, the bracket 30, the second adhesive layer 50 and the sealing glass 60 can enclose a cavity 37.

[0084] The image sensor chip 40 may be mounted on the substrate 10 and located in the cavity 37 .

[0085] In a specific implementation, the air vent 70 can be arranged in various positions. For example, the air vent 70 is arranged on the side wall of the cavity 37, wherein the side wall of the cavity 37 is formed by the side wall of the bracket 30 and the first adhesive layer 20, and the air vent 70 can be arranged on the side wall of the bracket 30 or on the first adhesive layer 20. For another example, the air vent 70 is arranged in the sealing glass placement area 31. For another example, the air vent 70 is arranged in the second adhesive layer 50.

[0086] In the specific implementation, refer to Figure 5 , a partial structural diagram of a camera module in an embodiment of the present invention is given, referring to Figure 6 , a partial structural diagram of another camera module in an embodiment of the present invention is given, referring to Figures 2 to 6When the air escape port 70 is disposed on the first adhesive layer 20 , the first adhesive layer 20 has a second opening in the first preset area 32 , and the gap between the bracket 30 and the substrate 10 at the position corresponding to the second opening can serve as the air escape port 70 . Figure 4 is a top view before the bracket 30 is placed on the substrate 10, Figure 5 is a top view after the bracket 30 and the sealing glass 60 are placed on the substrate 10. Figure 6 It is a top view after the reinforcement layer 80 is applied.

[0087] Specifically, the second opening can be formed in the following manner: when the first adhesive layer 20 is formed by applying adhesive to the bracket placement area 12 of the substrate 10, the adhesive can be applied intermittently in the first preset area 32. Since the adhesive is not applied in the first preset area 32 of the bracket placement area 12, the adhesive is applied to other areas of the bracket placement area 12 except the first preset area 32, so that the second opening can be formed in the first preset area 32.

[0088] In a specific implementation, the length L of the first preset area 32 may be 3 mm to 4 mm. It is understandable that, depending on the size of the camera module 100 and the number of the air escape ports 70 provided, the length of the first preset area 32 may also be other values, which are not listed one by one here.

[0089] In a specific implementation, the first preset area 32 can be set at any position of the first adhesive layer 20 .

[0090] In the embodiment of the present invention, in order to reduce the assembly process of the camera module 100 and improve the assembly efficiency of the camera module 100, as shown in FIG. Figure 4 and Figure 6 As shown, the first preset area 32 can be arranged near the connection end 11 of the substrate 10. Thus, it is possible to seal the air vent 70 while coating the reinforcing layer 80 on the connection end 11 of the substrate 10, that is, coating the reinforcing layer 80 and sealing the air vent 70 can be completed in the same process. Compared with the prior art, which requires coating the reinforcing layer 80 and sealing the air vent 70 in different processes, processes can be saved, thereby improving the assembly efficiency of the camera module 100.

[0091] In the specific implementation, refer to Fig.10 A partial structural diagram of another camera module in an embodiment of the present invention is given, referring to Fig.11 A schematic diagram of the structure of another camera module according to an embodiment of the present invention is given. Figure 2 , Figure 3 , Fig.10 and Fig.11The second adhesive layer 50 has a third opening in the second preset area 51 , and the gap between the bracket 30 and the sealing glass 60 at a position corresponding to the third opening can serve as an air escape port 70 .

[0092] Specifically, the third opening can be formed in the following manner: when the adhesive is applied to the sealing glass placement area 31 of the bracket 30 to form the second adhesive layer 50, the adhesive can be applied intermittently in the second preset area 51. Since the adhesive is not applied in the second preset area 51 of the sealing glass placement area 31, the adhesive is applied to other areas of the sealing glass placement area 31 except the second preset area 51, so that the third opening can be formed in the second preset area 51.

[0093] To facilitate the placement and removal of the sealing glass 60, some protruding notches may be provided at the edge of the sealing glass placement area 31. After the sealing glass 60 is placed in the sealing glass placement area 31, the outer edge of the sealing glass 60 may have a certain gap with the inner edge of the sealing glass placement area 31, or they may be in contact.

[0094] It should be noted that the sealing glass placement area 31, the shape of the sealing glass placement area 31, the application position of the second adhesive layer 50 on the sealing glass placement area 31, etc. are only for schematic illustration. In specific implementations, there may be other deformations, which all fall within the protection scope of the present invention and will not be exemplified one by one here.

[0095] In a specific implementation, the number of the gas escape port 70 may be one or more. When there are multiple air escape ports 70, each air escape port 70 may be arranged on the side wall of the cavity 37; each air escape port 70 may also be arranged on the second adhesive layer 50; each air escape port 70 may also be arranged in the sealed glass placement area 31; some of the air escape ports 70 may be arranged on the side wall of the cavity 37, some of the air escape ports 70 may be arranged on the second adhesive layer 50, and some of the air escape ports 70 may be arranged in the sealed glass placement area 31; some of the air escape ports 70 may be arranged on the side wall of the cavity 37, and some of the air escape ports 70 may be arranged on the second adhesive layer 50; some of the air escape ports 70 may be arranged on the second adhesive layer 50, and some of the air escape ports 70 may be arranged in the sealed glass placement area 31; some of the air escape ports 70 may be arranged on the side wall of the cavity 37, and some of the air escape ports 70 may be arranged in the sealed glass placement area 31.

[0096] In a specific implementation, the shape or size of the air escape port 70 can be set according to actual needs and is not limited here.

[0097] The first adhesive layer 20 is used to bond the bracket 30 to the substrate 10. In order to improve the bonding strength between the bracket 30 and the substrate 10, the first adhesive layer 20 needs to be cured. The first adhesive layer 20 is usually cured by high-temperature baking. Since the substrate 10, the bracket 30, the first adhesive layer 20, the second adhesive layer 50 and the sealing glass 60 can surround the cavity 37, when the first adhesive layer 20 is cured, the air in the cavity 37 expands due to heat and escapes through the vent 70 to maintain the air pressure balance inside and outside the cavity 37, thereby preventing the hot air from pressing against the bracket 30 in the direction away from the substrate 10, so as to improve the bonding strength between the bracket 30 and the substrate 10.

[0098] As can be seen from the above, there is a first adhesive layer between the bracket and the substrate, and the first adhesive layer is used to bond the bracket to the substrate. A sealing glass placement area is provided on the bracket, wherein the sealing glass is used to seal the first opening on the bracket. The substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity, and an air escape port can be provided at any position in the side wall of the cavity, the sealing glass placement area and the second adhesive layer. When the first adhesive layer is cured, air can escape through the air escape port. When there is a need to seal the air escape port, since the side wall of the cavity, the sealing glass placement area and the second adhesive layer do not need to cooperate with the lens assembly, the difficulty of packaging the air escape port can be reduced. Even if glue overflow, bubbling and other phenomena occur during the sealing process of the air escape port, it will not affect the yield rate of the camera module. Therefore, the yield rate of the camera module can be improved.

[0099] In practical applications, during the assembly process of the camera module 100, it is usually necessary to clean the camera module 100. The camera module 100 can be cleaned manually. In order to improve the cleaning efficiency of the camera module 100, the camera module 100 can also be cleaned by centrifugal water washing.

[0100] When the camera module 100 is cleaned by centrifugal water washing, in order to prevent water from entering the cavity 37 through the air escape port 70 and damaging the image sensor chip 40 , in an embodiment of the present invention, the camera module 100 may further include a sealing body for sealing the air escape port 70 .

[0101] In a specific implementation, the sealing body can be formed by applying an adhesive, or can be a component that can be inserted into and block the air escape port 70 , wherein the component can be an elastic component to facilitate inserting the sealing body into the air escape port 70 and improve the sealing performance of the air escape port 70 .

[0102] In the specific implementation, refer to Figure 8 and Fig. 9 , respectively give partial structural schematic diagrams of a camera module in an embodiment of the present invention. Figure 2 , Figure 3 , Figures 7 to 9 The air escape port 70 is disposed in the sealed glass placement area 31. The air escape port 70 can be disposed at any position in the sealed glass placement area 31. Figure 7 is a top view when no sealing glass is placed on the bracket 30, Figure 8 is a top view after the second adhesive layer 50 is formed on the bracket 30, Fig. 9 It is a top view after the sealing glass 60 is placed on the bracket 30.

[0103] The sealing glass placement area 31 can be formed by a depression in the area along the edge of the first opening 36 on the bracket 30, so that the surface of the sealing glass placement area 31 can be lower than the surfaces of other areas. After the sealing glass 60 is placed in the sealing glass placement area 31, it is possible for the upper surface of the sealing glass 60 to be lower than or flush with the upper surfaces of other areas of the bracket 30, thereby avoiding interference between the sealing glass 60 and other components and protecting the sealing glass 60 from damage.

[0104] In the specific implementation, refer to Figures 7 to 10 The bracket 30 may further include an extension groove 34 communicating with the sealing glass placement area 31, the extension groove 34 corresponds to the setting position of the gas escape port 70, and extends in a direction away from the gas escape port 70. When the gas escape port 70 is closed, the extension groove 34 can provide a certain operating space, which is convenient for dispensing glue to the gas escape port 70 through the extension groove 34.

[0105] In a specific implementation, the sealing glass 60 may be coated with an infrared filter film, and the sealing glass 60 coated with the infrared filter film may be called a filter.

[0106] In the specific implementation, refer to Figure 2 The bracket 30 extends toward the substrate 10 to form a supporting portion 38 , and the supporting portion 38 can contact the image sensor chip 40 to support the image sensor chip 40 , thereby preventing the image sensor chip 40 from moving.

[0107] In a specific implementation, the camera module 100 may further include a lens assembly 90 connected to the bracket 30 .

[0108] In a specific implementation, the specific structure and assembly process of the camera module 100 can refer to the description of the assembly method of the camera module provided in the above embodiment of the present invention, and will not be repeated here.

[0109] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A camera module assembly method, characterized in that: include: Mounting the image sensor chip on the substrate; Applying adhesive to the support placement area of ​​the substrate to form a first adhesive layer; Placing a bracket on the first adhesive layer, wherein the bracket has a first opening and a sealing glass placement area, the first opening is used to expose the image sensor chip, the sealing glass is bonded to the sealing glass placement area through a second adhesive layer and seals the first opening, the substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity, and the image sensor chip is located in the cavity; Curing the first adhesive layer and escaping gas through the gas escaping port; The gas escape port is arranged on the side wall of the cavity formed by the first adhesive layer, the first adhesive layer has a second opening in the first preset area, and the gap between the bracket and the substrate forms the gas escape port at a position corresponding to the second opening; When the reinforcing layer is applied to the connection end of the substrate, the air escape port is closed.

2. The camera module assembly method according to claim 1, characterized in that: Also includes: After the gas escape port is closed, a semi-finished product is obtained, and the semi-finished product is cleaned by centrifugal water washing.

3. The camera module assembly method according to claim 1, characterized in that: When the air escape port is disposed on the first adhesive layer, the air escape port is formed in the following manner: The adhesive is applied to the support placement area of ​​the substrate to form the first adhesive layer, and the adhesive is applied intermittently, and no adhesive is applied to the first preset area, wherein the support placement area includes the first preset area.

4. The camera module assembly method according to claim 3, characterized in that: The length of the first preset area ranges from 3mm to 4mm.

5. The camera module assembly method according to claim 3 or 4, characterized in that: The first preset area is close to the connection end of the substrate.

6. A camera module, characterized in that: include: A substrate, a first bonding layer, a bracket, an image sensor chip, a second bonding layer, a sealing glass and an air escape port, wherein: The first adhesive layer is disposed in a support placement area of ​​the substrate and is located between the substrate and the support; The bracket has a first opening and a sealing glass placement area, the first opening is used to expose the image sensor chip, the bracket is bonded to the substrate through the first adhesive layer, and the substrate, the first adhesive layer, the bracket, the second adhesive layer and the sealing glass form a cavity; The gas escape port is arranged on the first adhesive layer, the first adhesive layer has a second opening in the first preset area, and at a position corresponding to the second opening, the gap between the bracket and the substrate serves as the gas escape port; The second adhesive layer is arranged in the sealing glass placement area and is located between the bracket and the sealing glass; The sealing glass is connected to the bracket through the second adhesive layer and seals the first opening; The image sensor chip is mounted on the substrate and is located in the cavity; The gas escape port is arranged on the side wall of the cavity formed by the first adhesive layer, and the gas escape port is closed when the reinforcing layer is coated on the connecting end of the substrate.

7. The camera module according to claim 6, characterized in that: The length of the first preset area is 3mm-4mm.

8. The camera module according to claim 6, wherein: The gas escape port is close to the connection end of the substrate.

9. The camera module according to any one of claims 6 to 8, characterized in that: It also includes a sealing body, which is used to seal the air escape port.

10. The camera module according to claim 9, wherein: The sealing body is a reinforcing layer disposed at the connection end of the substrate.

11. The camera module according to claim 6, wherein: The sealing glass is coated with an infrared filter film.

12. The camera module according to claim 6, wherein: Also included is a lens assembly connected to the bracket.

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