Colored Resin Composition, Photoresist Structure, Color Filter, and Display Device Using the Same

Abstract

A colored resin composition includes a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photoinitiator, and a solvent, wherein the alkali-soluble resin contains a photocurable resin, and the weight average molecular weight (Mw) of this photocurable resin is less than 20,000, and the potassium hydroxide (KOH) titration acid value is less than 100 mg / g. The display device using the colored resin composition disclosed herein can avoid the exposure defects generated by the pixels of the display device due to partial peeling of the photoresist, and can also greatly improve the problem that the uneven bright and dark lines generated by the defective photoresist lead to an overestimation of the number of photoresist defects by the inspection machine.

Description

Technical Field

[0001] The present invention relates to a composition and a photoresist structure, a color filter, and a display device using the same, and more particularly to a colored resin composition and a photoresist structure, a color filter, and a display device using the same. Background Art

[0002] Display devices have been widely used in daily life, including various portable or non-portable electronic products, workplace devices, smart household appliances, transportation vehicles, or public utilities, etc., to provide relevant information and / or interaction modes to enhance the convenience and interest of users in life and work. Photoresist plays an important role in display devices. Taking a color liquid crystal display device as an example, in a color liquid crystal display device, a color filter is used to present a color display screen. The color filter includes photoresist layers of different colors. A typical color filter includes photoresists of four colors, such as red, green, blue, and black. The optical properties of the color filter have a crucial impact on the optical display effect of the color liquid crystal display device.

[0003] Although current photoresist compositions are generally appropriate in terms of forming methods, they do not fully meet all requirements, and various attempts and adjustments have been made on the photoresist compositions in color filters to date. Summary of the Invention

[0004] Some embodiments of the present invention disclose a colored resin composition including a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photoinitiator, and a solvent, wherein the alkali-soluble resin contains a photocurable resin, the weight average molecular weight (Mw) of the photocurable resin is less than 20,000, and the acid value titrated with potassium hydroxide (KOH) is less than 100 mg / g.

[0005] In some embodiments, the acid value titrated with potassium hydroxide (KOH) of the photocurable resin is less than 55 mg / g.

[0006] In some embodiments, the weight average molecular weight of the photocurable resin is less than 10,000.

[0007] In some embodiments, the weight average molecular weight of the photocurable resin is between 6,000 and 20,000. Furthermore, the -COOH groups contained in the photocurable resin, for example, account for less than 7 mol% of the photocurable resin.

[0008] Some embodiments of the present invention disclose a color filter including a photoresist layer, and this photoresist layer is formed by applying the above-mentioned colored resin composition on a substrate and then exposing and developing.

[0009] Some embodiments of the present invention disclose a display device, including the above-described color filter. The color filter is formed by applying the above-described coloring resin composition onto a substrate and curing it. Description of the Drawings

[0010] Figure 1A FIG. is a schematic cross-sectional view of a photoresist structure formed by the current coloring resin composition;

[0011] Figure 1B FIG. is a top view of a photoresist structure formed by the current coloring resin composition;

[0012] Figure 2A FIG. is a schematic cross-sectional view of a photoresist structure formed by the coloring resin composition of some embodiments of the present disclosure;

[0013] Figure 2B FIG. is a top view of a photoresist structure formed by the coloring resin composition of some embodiments of the present disclosure;

[0014] Figures 3A to 3G are simple schematic diagrams of the film edge and undercut portion of the SEM images according to Experiments 1-1 to 1-7, respectively;

[0015] Figures 4A to 4G are simple schematic diagrams of the film edge and undercut portion of the SEM images according to Experimental Examples 2-1 to 2-7, respectively;

[0016] Figures 5A to 5C are simple schematic diagrams of the film edge and undercut portion of the SEM images according to Experimental Examples 3-1 to 3-3, respectively;

[0017] Figures 6A to 6C are simple schematic diagrams of the film edge and undercut portion of the SEM images according to Experimental Examples 4-1 to 4-3, respectively;

[0018] Among them, the symbol descriptions are as follows:

[0019] 10, 20, 30, 40, 50, 60: substrates 11, 21, 31, 41, 51, 61: photoresist structures

[0020] 21b: bottom surface 21c: arc segment

[0021] d0, d: undercut depth A1: vertical projection area

[0022] A2: contact area L1: parallel line

[0023] L2: vertical line U C : notch

[0024] a, b, c: points. Detailed Description of the Embodiments

[0025] In addition to common liquid crystal displays, mainstream display technologies such as organic light-emitting diode (OLED) displays have become increasingly popular in recent years. Other new types of display technologies, such as highly luminous and long-life micro light-emitting diodes (Mini LED) and sub-millimeter light-emitting diodes (Micro LED), which have great market prospects, have also attracted much attention. With the development of various types of display technologies, the demand for the characteristics of photoresist has also increased. Taking a display device including a color filter substrate as an example, a colored resin composition can be used as a photoresist material to form a photoresist structure of a color filter on a substrate. Generally, in order to match various types of display applications, the components of the colored resin composition can be adjusted and optimized to form various color filters with predetermined characteristics, including forming a photoresist structure with a complete profile and a small undercut and a complete profile, which is also one of the goals that the industry focuses on and strives for. However, the photoresist structure formed by the current colored resin composition on the substrate is still prone to having a large or even too deep undercut, resulting in defects such as local peeling or incomplete profile.

[0026] In addition, general photoresist materials can include resin materials, polymerizable unsaturated compounds, photoinitiators, solvents, and other additives. Among them, the resin material is used as a binder, and the solvent is a diluting liquid that can dissolve other materials / compounds, so that the photoresist exists in a liquid form for easy use. General photoresist materials can be classified into positive photoresists and negative photoresists according to their characteristics. Positive photoresists are insoluble in the developer solution itself, but after being irradiated with light and reacting, they will dissociate into an acidic polymer compound that is soluble in the developer solution (alkaline); on the contrary, negative photoresists (which are acidic substances) are soluble in the developer solution, but after being irradiated with light and reacting, they will generate new polymer bonds to strengthen the structure and become insoluble in the developer solution. The following is a description of some embodiments of the present disclosure using negative photoresist as the photoresist material.

[0027] Figure 1A FIG. is a schematic cross-sectional view of a photoresist structure formed by the current colored resin composition. Figure 1B FIG. is a top view of a photoresist structure formed by the current colored resin composition. In the photoresist process, since the exposure intensity decreases with the decrease of the photoresist thickness, the crosslinking at the bottom of the photoresist structure 11 close to the substrate 10 is relatively insufficient. Furthermore, during the development process of the photoresist, the bottom of the photoresist will have a certain undercut depth d0 due to the side etching effect, resulting in a photoresist structure. The photoresist structure 11 prepared by the current colored resin composition has a slightly concave top surface in its cross-section, and the outermost edge end point of the photoresist structure 11 and the bottom surface 11b in contact with the substrate 10 have a large undercut depth d0, as shown in Figure 1A shown. If the undercut is too deep, it is easy to cause photoresist peeling during the development process, such as Figure 1BIn the circled area, the profile of the strip-shaped photoresist structure 11 has a missing corner, causing the pixels of the display device to be exposed to light, or resulting in uneven bright and dark lines, which makes the inspection machine misjudge the number of defects in the photoresist to be too high.

[0028] To meet the above needs, embodiments of the present disclosure propose a colored resin composition, as well as a photoresist structure, a color filter, and a display device formed by applying this colored resin composition. In some embodiments, the colored resin composition is coated above a substrate of a display device and cured by baking and photolithography processes (such as exposure and development steps) to form a patterned photoresist layer, where this patterned photoresist layer includes a plurality of photoresist structures. In some embodiments, the aforementioned photoresist structure is, for example, a convex body. The colored resin composition proposed in the embodiments includes an alkali-soluble resin, and one or more copolymers included in the alkali-soluble resin can make the photoresist structure formed after exposure and development of the colored resin composition present a relatively intact mushroom-shaped cross-section, and significantly improve the problem of excessive undercut after the traditional colored resin composition forms the photoresist structure.

[0029] The following presents various embodiments for detailed description. The embodiments are only used as examples for illustration and will not limit the scope to be protected by the present disclosure. The present disclosure can still be implemented using other features, elements, methods, and parameters. The presentation of the embodiments is only used to illustrate the technical features of the present disclosure and is not used to limit the scope of the patent application of the present disclosure. Those with ordinary knowledge in the technical field can make equivalent modifications and changes without departing from the spirit of the present disclosure according to the description in the following specification.

[0030] Figure 2A FIG. is a cross-sectional schematic diagram of a photoresist structure formed by the colored resin composition of some embodiments of the present disclosure. In some embodiments, the colored resin composition proposed includes an alkali-soluble resin, and the photo-curable resin that the alkali-soluble resin can include, or a combination of a photo-curable resin and a thermosetting resin. Through appropriate matching of the molecular weight and acid value, the upper part (farther from the substrate 20) and the lower part (closer to the substrate 20) of the photoresist layer formed by the colored resin composition of the embodiments can have less difference in the degree of crosslinking, thereby narrowing the strength difference between the upper part and the lower part of the composition after crosslinking. Therefore, when the colored resin composition of the embodiments is coated on the substrate 20 and undergoes a photolithography process, the upper part and the lower part of the photoresist layer can have similar or even close resistance to side etching. Therefore, the photoresist structure 21 after development has a good and complete shape, and there is no defect of excessive undercut after the traditional colored resin composition forms the photoresist structure.

[0031] In some embodiments, such as Figure 2AAs shown, the photoresist structure 21 on the substrate 20 is a convex body. For example, the photoresist structure 21 has a mushroom-shaped cross-section, that is, the top of the photoresist structure 21 is larger and the lower part is slightly tapered inward. In some embodiments, the vertical projection area of the convex photoresist structure 21 on the substrate 20 is larger than the contact area between the bottom surface 21b of the photoresist structure 21 and the substrate 20. As Figure 2A shown, the photoresist structure 21 has a vertical projection area A1 on the substrate 20, and there is a contact area A2 between the bottom surface 21b of the photoresist structure 21 and the substrate 20, wherein the area of the vertical projection area A1 is larger than the area of the contact area A2. According to the coloring resin composition proposed in some embodiments of this case, the area of the contact area A2 of the formed photoresist structure 21 can be at least in the range of 94% to 100% of the area of the vertical projection area A1.

[0032] In some embodiments, as Figure 2A shown, the top of the convex photoresist structure 21 has a curvature. Furthermore, in some embodiments, the cross-section of the photoresist structure 21 also includes an arc segment from the top towards the side edge. For example, a parallel line L1 is drawn parallel to the substrate 20 at the highest vertex of the convex body (such as the point a marked in Figure 2A ), and a vertical line L2 is drawn perpendicular to the substrate 20 at the farthest point on the edge of the convex body (such as the point b marked in Figure 2A ), wherein the parallel line L1 and the vertical line L2 form an angle equal to 90 degrees, and the cross-section of this convex body (such as along the XZ plane) includes an arc segment 21c between the parallel line L1 and the vertical line L2.

[0033] Furthermore, in some embodiments, as Figure 2A shown, there is a notch U between the outermost edge endpoint (such as the point b marked in Figure 2A ) of the cross-section of the photoresist structure 21 perpendicular to the substrate 20 (such as along the XZ plane) and the position where the bottom surface 21b of the convex body contacts the substrate 20. C . This notch U C can also be called an undercut, and the depth of this notch U C in the direction along, for example, the X direction is also called the undercut depth d.

[0034] In other words, as Figure 2A shown, the vertical projection of the farthest point on one edge of the photoresist structure 21 (such as the point b marked in Figure 2A ) on the substrate 20 and the position where the bottom surface 21b of the photoresist structure 21 contacts the substrate 20 (such as the point c marked in Figure 2A ) have a distance in the direction along, for example, the X direction, and this distance is defined as the undercut depth d of this photoresist structure 21.

[0035] According to the coloring resin composition proposed in some embodiments of the present case, the undercut depth d of the photoresist structure 21 formed can be less than about 1 μm. Therefore, compared with the photoresist structure 11 as shown in Figure 1A the photoresist structure 21 (as shown in Figure 2A ) formed on the substrate 20 with the coloring resin composition proposed in the embodiments can effectively improve the problem of excessive undercut depth after the formation of the photoresist structure by traditional photoresist materials.

[0036] Figure 2B FIG. is a top view of a photoresist structure formed with the coloring resin composition of some embodiments of the present disclosure. Please also refer to Figure 1B and Figure 2B . Compared with the strip-shaped photoresist structure 11 as shown in Figure 1B , the plurality of strip-shaped photoresist structures 21 (as shown in Figure 2B ) formed on the substrate 20 with the coloring resin composition of the embodiments can present a complete profile without defects such as excessive undercut, local peeling, or uneven bright and dark lines, which may cause the inspection machine to misjudge the number of photoresist defects and affect the process.

[0037] Some embodiments of the present disclosure relate to a coloring resin composition and its applications, including a photoresist structure formed using the coloring resin composition, a color filter including the photoresist structure, and a display device including the color filter. In some embodiments, the coloring resin composition includes a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photoinitiator, and a solvent, wherein the alkali-soluble resin includes a photocurable resin, the weight average molecular weight (Mw) of the photocurable resin is less than 20,000, and the acid value titrated with potassium hydroxide (KOH) is less than 100 mg KOH / g. Using the coloring resin composition of the embodiments has good anti-undercutting properties and can improve problems such as peeling or uneven bright and dark lines caused by the photoresist structure formed during the development process. In some embodiments, the alkali-soluble resin may include one or more photocurable resins, one or more thermosetting resins, or a combination of the foregoing resins.

[0038] In some embodiments, based on the total weight of the colored resin composition being 100% by weight, the colorant accounts for about 10% to about 30% of the colored resin composition; the alkali-soluble resin accounts for about 5% to about 50% of the colored resin composition; the polymerizable unsaturated compound accounts for about 5% to about 50% of the colored resin composition; and the photoinitiator accounts for about 0.1% to about 10% of the colored resin composition. In some embodiments, the alkali-soluble resin is a binder that enables the colored resin composition to adhere smoothly to the surface of the substrate and effectively provides resistance to erosion by acids, alkalis, or plasmas.

[0039] In some embodiments, the colorant of the colored resin composition may include pigments and dyes. There are no particular limitations on the pigments of the colorant, and known pigments can be used. For example, compounds classified as pigments in The Society of Dyers and Colourists publication can be cited. According to some embodiments, there are no particular limitations on the dyes of the colorant, and they can be appropriately selected as long as they conform to the spectral characteristics of the desired color filter.

[0040] In some embodiments, the colorant includes a green pigment and / or a yellow pigment and / or a blue pigment

[0041] In some embodiments, the pigment of the colorant refers to a dispersion liquid including a green pigment and / or a yellow pigment and / or a blue pigment. In the embodiments, the dispersion liquid of the green pigment and / or the yellow pigment and / or the blue pigment is prepared by uniformly dispersing a mixture of an acrylic pigment dispersant, a pigment-dispersing resin, and propylene glycol monomethyl ether acetate in a bead mill.

[0042] In some embodiments, as the green pigment in the colorant of the present invention, phthalocyanine pigments, metal imine complex pigments, etc. can be cited. Specifically, for example, C.I. Pigment Green 1, C.I. Pigment Green 4, C.I. Pigment Green 7, C.I. Pigment Green 8, C.I. Pigment Green 36, C.I. Pigment Green 58, etc. can be used. In one embodiment, the colorant of the present invention may include a metal halide phthalocyanine pigment as the pigment. The metal halide phthalocyanine pigment can include a copper halide phthalocyanine pigment and a zinc halide phthalocyanine pigment. Zinc halide phthalocyanine pigments such as C.I. Pigment Green 58 and C.I. Pigment Green 59 are particularly preferred. In the present invention, C.I. Pigment Green 58 is particularly preferred.

[0043] In some embodiments, the colorant of the present invention may include yellow pigments, such as monoazo pigments, monoazo lake pigments, disazo pigments, anthraquinone pigments, monoazo pyrazolone pigments, condensed azo pigments, isoindoline pigments, benzimidazolone pigments, azomethine metal complex pigments, quinophthalone pigments, quinoxaline pigments, etc. Specifically, for example, the following may be used: C.I. Pigment Yellow 1, C.I. Pigment Yellow 2, C.I. Pigment Yellow 3, C.I. Pigment Yellow 4, C.I. Pigment Yellow 5, C.I. Pigment Yellow 6, C.I. Pigment Yellow 10, C.I. Pigment Yellow 12, C.I. Pigment Yellow 13, C.I. Pigment Yellow 14, C.I. Pigment Yellow 15, C.I. Pigment Yellow 16, C.I. Pigment Yellow 17, C.I. Pigment Yellow 18, C.I. Pigment Yellow 20, C.I. Pigment Yellow 24, C.I. Pigment Yellow 31, C.I. Pigment Yellow 32, C.I. Pigment Yellow 34, C.I. Pigment Yellow 35, C.I. Pigment Yellow 35:1, C.I. Pigment Yellow 36, C.I. Pigment Yellow 36:1, C.I. Pigment Yellow 37, C.I. Pigment Yellow 37:1, C.I. Pigment Yellow 40, C.I. Pigment Yellow 42, C.I. Pigment Yellow 43, C.I. Pigment Yellow 53, C.I. Pigment Yellow 55, C.I. Pigment Yellow 60, C.I. Pigment Yellow 61, C.I. Pigment Yellow 62, C.I. Pigment Yellow 63, C.I. Pigment Yellow 65, C.I. Pigment Yellow 73, C.I. Pigment Yellow 74, C.I. Pigment Yellow 77, C.I. Pigment Yellow 81, C.I. Pigment Yellow 83, C.I. Pigment Yellow 86, C.I. Pigment Yellow 93, C.I. Pigment Yellow 94, C.I. Pigment Yellow 95, C.I. Pigment Yellow 97, C.I. Pigment Yellow 98, C.I. Pigment Yellow 100, C.I. Pigment Yellow 101, C.I. Pigment Yellow 104, C.I. Pigment Yellow 106, C.I. Pigment Yellow 108, C.I. Pigment Yellow 109, C.I. Pigment Yellow 110, C.I. Pigment Yellow 113, C.I. Pigment Yellow 114, C.I. Pigment Yellow 115, C.I. Pigment Yellow 116, C.I. Pigment Yellow 117, C.I. Pigment Yellow 118, C.I. Pigment Yellow 119, C.I. Pigment Yellow 120, C.I.Yellow pigments such as Pigment Yellow 123, C.I. Pigment Yellow 125, C.I. Pigment Yellow 126, C.I. Pigment Yellow 127, C.I. Pigment Yellow 128, C.I. Pigment Yellow 129, C.I. Pigment Yellow 137, C.I. Pigment Yellow 138, C.I. Pigment Yellow 139, C.I. Pigment Yellow 147, C.I. Pigment Yellow 148, C.I. Pigment Yellow 150, C.I. Pigment Yellow 151, C.I. Pigment Yellow 152, C.I. Pigment Yellow 153, C.I. Pigment Yellow 154, C.I. Pigment Yellow 155, C.I. Pigment Yellow 156, C.I. Pigment Yellow 161, C.I. Pigment Yellow 162, C.I. Pigment Yellow 164, C.I. Pigment Yellow 166, C.I. Pigment Yellow 167, C.I. Pigment Yellow 168, C.I. Pigment Yellow 169, C.I. Pigment Yellow 170, C.I. Pigment Yellow 171, C.I. Pigment Yellow 172, C.I. Pigment Yellow 173, C.I. Pigment Yellow 174, C.I. Pigment Yellow 175, C.I. Pigment Yellow 176, C.I. Pigment Yellow 177, C.I. Pigment Yellow 179, C.I. Pigment Yellow 180, C.I. Pigment Yellow 181, C.I. Pigment Yellow 182, C.I. Pigment Yellow 185, C.I. Pigment Yellow 187, C.I. Pigment Yellow 188, C.I. Pigment Yellow 193, C.I. Pigment Yellow 194, C.I. Pigment Yellow 199, C.I. Pigment Yellow 213, C.I. Pigment Yellow 214, etc. In the present invention, C.I. Pigment Yellow 138 is particularly preferred.

[0044] In some embodiments, as the blue pigment in the colorant of the present invention, C.I. Pigment Blue 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 60, 64, 80, etc. can be cited. Alternatively, in some embodiments, the colorant may include, for example, C.I. Pigment Violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50, etc.

[0045] In some embodiments, the pigments can be used alone or in combinations of two or more of them to increase color purity.

[0046] In some embodiments, in addition to the green pigment, yellow pigment, and / or blue pigment, the colorant resin composition may, according to actual needs, have pigments of other colors, or dyes of green, yellow, blue, or other colors.

[0047] Furthermore, in the present invention, the pigments and dyes can be used separately alone or mixed in combinations of two or more. As other pigments, yellow pigments, brown pigments, purple pigments, etc. can be exemplified.

[0048] The dyes that can be used in the examples are not particularly limited, and known dyes can be used. For example, solvent dyes, acid dyes, direct dyes, mordant dyes, etc. can be cited. As dyes, for example, compounds classified in the Color Index (published by The Society of Dyers and Colourists) as substances having hues other than pigments, and known dyes described in the Dyeing Notes (Color Dyeing Society) can be cited. In addition, according to the chemical structure, azo dyes, cyanine dyes, triphenylmethane dyes, xanthene dyes, phthalocyanine dyes, naphthoquinone dyes, quinoneimine dyes, methylene dyes, azomethine dyes, squaric dyes, acridine dyes, styryl dyes, coumarin dyes, cyanine dyes, anthraquinone dyes, azo dyes, squarylium dyes, dipyrromethene dyes, quinoline dyes, porphyrin dyes, quinoline dyes, and nitro dyes, etc. can be cited.

[0049] In some embodiments, for the colorant in the colored resin composition, if the total weight of the colored resin composition is 100 parts by weight, it is preferably 5 to 50 parts by weight, and more preferably 10 to 25 parts by weight.

[0050] According to actual needs, the colored resin composition may further contain a dispersant to uniformly disperse the colorant in the solution. As the above-mentioned dispersant, for example, surfactants such as cationic, anionic, nonionic, amphoteric, polyester-based, polyamine-based, acrylic-based, etc. can be cited. These dispersants can be used alone or in combination of two or more. As pigment dispersants, represented by trade names, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), FLOREN (manufactured by Kyoeisha Chemical Co., Ltd.), Solsperse (manufactured by Zeneca Co., Ltd.), EFKA (manufactured by CIBA), Adisper (manufactured by Ajinomoto Fine-Techno Co., Ltd.), Disperbyk (manufactured by BYK Chemie), etc. can be cited.

[0051] In some embodiments, the alkali-soluble resin of the colorant resin composition may contain resin monomer units and silyl monomer units, wherein the resin monomer units contain unsaturated double bonds and / or epoxy groups.

[0052] In some embodiments, the alkali-soluble resin of the colorant resin composition can be selected to have a structure with an alkyl or cycloalkyl side chain, and the side chain structure may contain acid branch functional groups or unsaturated bonds.

[0053] In some embodiments, the alkali-soluble resin of the colorant resin composition can be, for example, but not limited to, having a structural unit derived from (meth)acrylic acid.

[0054] In some embodiments, the alkali-soluble resin may be a copolymer having a structural unit derived from a monomer (m2-1) and a structural unit derived from a monomer having a cyclic ether structure with 2 to 4 carbon atoms and an ethylenically unsaturated bond (hereinafter referred to as "monomer (m2-2)"). The copolymer may also contain other structural units. As other structural units, for example, a structural unit derived from a monomer different from monomer (m2-1) and monomer (m2-2) (hereinafter referred to as "monomer (m2-3)"), or a structural unit having an ethylenically unsaturated bond, etc. In the copolymer, each of the above structural units contains only one kind, or may contain two or more kinds.

[0055] Examples of monomer (m2-1) include (1) unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid (MAA), succinic acid (SA), crotonic acid, o-, m-, p-vinylbenzoic acid; (2) unsaturated dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, 1,4-cyclohexenedicarboxylic acid; (3) bicyclic unsaturated compounds containing a carboxyl group such as methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene; (4) anhydrides of unsaturated dicarboxylic acids such as maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene anhydride; (5) unsaturated mono[(meth)acryloyloxyalkyl] esters of polycarboxylic acids with 2 or more members such as succinic acid mono[2-(meth)acryloyloxyethyl] ester, phthalic acid mono[2-(meth)acryloyloxyethyl] ester; or (6) unsaturated acrylate esters containing a hydroxyl group and a carboxyl group in the same molecule such as α-(hydroxymethyl)acrylic acid.

[0056] Among these, from the aspects of copolymerization reactivity and solubility of the resulting resin in an aqueous alkali solution, acrylic acid (AA), methacrylic acid (MAA), maleic anhydride, etc. are preferred.

[0057] The monomer (m2-2) refers to a polymerizable compound having, for example, a cyclic ether structure with 2 to 4 carbon atoms (such as an ethylene oxide ring, an oxetane ring, or a tetrahydrofuran ring) and an ethylenically unsaturated bond.

[0058] Examples of the monomer (m2-2) include a monomer (m2-2-1) having an epoxyethyl group and an ethylenically unsaturated bond (hereinafter sometimes also referred to as "monomer (m2-2-1)"), a monomer (m2-2-2) having an oxetanyl group and an ethylenically unsaturated bond (hereinafter sometimes also referred to as "monomer (m2-2-2)"), or a monomer (m2-2-3) having a tetrahydrofuranyl group and an ethylenically unsaturated bond (hereinafter sometimes also referred to as "monomer (m2-2-3)").

[0059] Examples of the monomer (m2-2-1) include a monomer (m2-2-1a) having a structure in which a linear or branched aliphatic unsaturated hydrocarbon is epoxidized (hereinafter sometimes referred to as "monomer (m2-2-1a)"), and a monomer (m2-2-1b) having a structure in which an alicyclic unsaturated hydrocarbon is epoxidized (hereinafter sometimes referred to as "monomer (m2-2-1b)").

[0060] As the monomer (m2-2-1a), a monomer having a glycidyl group and an ethylenically unsaturated bond is preferably used. Examples of the monomer (m2-2-1a) include glycidyl (meth)acrylate (GMA), β-methyl glycidyl (meth)acrylate, β-ethyl glycidyl (meth)acrylate, glycidyl vinyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene, 2,4-bis(glycidyloxymethyl)styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxymethyl)styrene, 2,3,4-tris(glycidyloxymethyl)styrene, 2,3,5-tris(glycidyloxymethyl)styrene, 2,3,6-tris(glycidyloxymethyl)styrene, 3,4,5-tris(glycidyloxymethyl)styrene, 2,4,6-tris(glycidyloxymethyl)styrene, and the like.

[0061] As the monomer (m2-2-1b), vinylcyclohexene monooxide, 1,2-epoxy-4-vinylcyclohexane (e.g., CELLOXIDE 2000; manufactured by Daicel Corporation), methyl 3,4-epoxycyclohexyl (meth)acrylate (e.g., CYCLOMERA 400; manufactured by Daicel Corporation), methyl 3,4-epoxycyclohexyl (meth)acrylate (e.g., CYCLOMER M100; manufactured by Daicel Corporation), etc. can be cited.

[0062] As the monomer (m2-3), for example, methyl (meth)acrylate (MMA), ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl acrylate (2-Ethylhexyl acrylate; 2EHA), 2-ethylhexyl (meth)acrylate, dodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, tricyclo[5.2.1.0 2,6 decane-8-yl ester (in this technical field, as a common name, it is called "(meth)acrylic acid dicyclopentyl ester". In addition, it is sometimes called "(meth)acrylic acid tricyclodecyl ester"), tricyclo[5.2.1.0 2,6 decene-8-yl ester (in this technical field, as a common name, it is called "(meth)acrylic acid dicyclopentenyl ester"), dicyclopentyloxyethyl (meth)acrylate, isobornyl (meth)acrylate, adamantyl (meth)acrylate, allyl (meth)acrylate, propargyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, benzyl (meth)acrylate (BZMA), etc. (meth)acrylate esters;

[0063] (meth)acrylic acid 2-hydroxyethyl ester (HEMA), (meth)acrylic acid 2-hydroxypropyl ester, etc. hydroxy-containing (meth)acrylate esters;

[0064] Dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, and diethyl itaconate; bicyclic unsaturated compounds such as bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-bis(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene, etc.;

[0065] Dicarbonimide derivatives such as N-phenylmaleimide, N-cyclohexylmaleimide (CHMI), N-benzylmaleimide, N-succinimidyl 3-maleimidobenzoate, N-succinimidyl 4-maleimidobutyrate, N-succinimidyl 6-maleimidohexanoate, N-succinimidyl 3-maleimidopropionate, N-(9-acridinyl)maleimide, etc.;

[0066] Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, etc.

[0067] Among these, from the viewpoints of copolymerization reactivity and heat resistance, styrene, vinyltoluene, 2-hydroxyethyl (meth)acrylate, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo[2.2.1]hept-2-ene, and benzyl (meth)acrylate, etc. are preferred.

[0068] The constituent unit having an ethylenically unsaturated bond is preferably a structural unit having a (meth)acryloyl group. The first adhesive polymer (B1) having such a structural unit can be obtained by reacting a polymer containing a structural unit derived from a monomer (m2-1) and a structural unit derived from a monomer (m2-2) with a monomer having a group capable of reacting with the aforementioned constituent unit and an ethylenically unsaturated bond.

[0069] As the constituent unit having an ethylenically unsaturated bond, for example, a constituent unit obtained by adding glycidyl (meth)acrylate to a (meth)acrylic acid unit, a constituent unit obtained by adding 2-hydroxyethyl (meth)acrylate to a maleic anhydride unit, a constituent unit obtained by adding (meth)acrylic acid to a glycidyl (meth)acrylate unit, and a constituent unit obtained by adding a carboxylic anhydride to a constituent unit having a hydroxyl group, etc.

[0070] In some embodiments, the alkali-soluble resin comprises a photocurable resin having a weight average molecular weight (Mw) of less than 20,000 and a potassium hydroxide (KOH) titration acid value of less than 100 mg KOH / g. The unit of the potassium hydroxide (KOH) titration acid value can also be simply expressed as mg / g in the text. In some embodiments, the potassium hydroxide (KOH) titration acid value of this photocurable resin is less than 55 mg / g. In one embodiment, the photocurable resin contained in the alkali-soluble resin may be a copolymer having a structure represented by the following formula (I) (described later).

[0071] In some embodiments, the alkali-soluble resin of the colorant resin composition may, for example, comprise a copolymer having a structure represented by the following formula (I):

[0072]

[0073] Wherein, m, e, f, and g are positive integers.

[0074] In one example, if the entire molecular chain is set to 100%, m accounts for 1 to 10% of the polymer chain, e accounts for 20 to 70% of the polymer chain, f accounts for 20 to 70% of the polymer chain, and g accounts for 1 to 35% of the polymer chain.

[0075] In some embodiments, the copolymer having the structure represented by the above formula (I) contained in the alkali-soluble resin is a photocurable resin which is a copolymer of dicyclopentyl (meth)acrylate (TCDMA) / (meth)methyl acrylate (MMA) / (glycidyl (meth)acrylate (GMA) / (meth)acrylic acid (MAA). Here, the compounds described in parentheses mean the cases where the words in the parentheses are present or absent. For example, the aforementioned dicyclopentyl (meth)acrylate includes the cases of dicyclopentyl acrylate and dicyclopentyl methacrylate.

[0076] In some embodiments, the main chain of the copolymer having the structure shown in formula (I) includes: dicyclopentanyl (meth)acrylate (TCDMA), which accounts for 3 mol% of the aforementioned main chain; methyl (meth)acrylate (MMA), which accounts for 70 mol% to 27 mol% of the aforementioned main chain; and glycidyl (meth)acrylate (GMA), which accounts for 27 mol% to 70 mol% of the aforementioned main chain.

[0077] In some embodiments according to the present disclosure, the photocurable resin included in the alkali-soluble resin is, for example, the copolymer prepared in Preparation Examples 3 to 8.

[0078] Furthermore, in some embodiments, the photocurable resin included in the alkali-soluble resin, for example, but not limited to, has the structure shown in formula (I) above, with a weight average molecular weight of less than 20,000, and a potassium hydroxide (KOH) titration acid value of less than 55 mg / g being preferred; and a weight average molecular weight of less than 10,000, and a potassium hydroxide (KOH) titration acid value of less than 100 mg / g being less preferred.

[0079] In addition, according to some comparative examples, if the photocurable resin included in the alkali-soluble resin, for example, but not limited to, has the structure shown in formula (I) above, with a weight average molecular weight greater than 10,000 and a potassium hydroxide (KOH) titration acid value greater than 55 mg / g, then the formed photoresist structure will have a deeper undercut depth, and there may be defects such as local peeling or uneven bright and dark lines.

[0080] In some embodiments, the photocurable resin included in the alkali-soluble resin, for example, but not limited to, has the structure shown in formula (I) above, with a weight average molecular weight of less than 10,000, and the -COOH groups included in this photocurable resin account for approximately 3.5 mol% to approximately 31.2 mol% of the photocurable resin. In some other embodiments, the weight average molecular weight of the photocurable resin is less than 10,000, and the -COOH groups included in this photocurable resin account for approximately 3.5 mol% to approximately 10 mol% of the photocurable resin.

[0081] In some embodiments, the photocurable resin included in the alkali-soluble resin, for example, but not limited to, has the structure shown in formula (I) above, with a weight average molecular weight between 6,000 and 20,000, and the -COOH groups included in the photocurable resin account for less than approximately 7 mol% of the photocurable resin.

[0082] In some embodiments, the proportion (Binder / Monomer Ratio) of the photocurable resin contained in the alkali-soluble resin to the monomers of the polymerizable unsaturated compounds in the colored resin composition is from about 6.7% to about 300%. In some other embodiments, the proportion of the aforementioned photocurable resin to the monomers of the aforementioned polymerizable unsaturated compounds is from about 6.7% to about 166.7%.

[0083] Furthermore, according to some embodiments of the present disclosure, the alkali-soluble resin of the colored resin composition may further contain a thermosetting resin in addition to the photocurable resin. In some embodiments, the aforementioned thermosetting resin may include a copolymer of EDCPA / methacrylic acid (MAA), wherein the trade name "E-DCPA" (manufactured by Daicel Corporation) contains 3,4-epoxytricyclo[5.2.1.0 2,6 decane-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.0 2,6 decane-9-yl acrylate in a molar ratio of 50:50 mixture. Furthermore, in some embodiments, the aforementioned thermosetting resin includes one of Resin I-1 (shown in Chemical Formula 1-4), Resin I-2 (shown in Chemical Formula 1-5), Resin J-1 (shown in Chemical Formula 1-4), Resin J-2 (shown in Chemical Formula 1-5), Resin K-1 (shown in Chemical Formula 1-4), Resin K-2 (shown in Chemical Formula 1-5) prepared in Preparation Examples 9 to 11 described below, or a combination of the aforementioned resins. Table III also lists the composition ratios, molecular weights, and -COOH group ratios of Resins I, J, and K.

[0084] In some embodiments, the weight average molecular weight of the thermosetting resin contained in the alkali-soluble resin is between about 5000 and about 20000, and the potassium hydroxide (KOH) titration acid value is between about 100 mg / g and about 120 mg / g. In some other embodiments, the weight average molecular weight of the thermosetting resin contained in the alkali-soluble resin may be less than about 10000.

[0085] In some embodiments, the thermosetting resin contained in the alkali-soluble resin accounts for about 8.9% to about 10% by weight of the colored resin composition, and the photocurable resin contained in the alkali-soluble resin accounts for about 1.5% to about 17.4% by weight of the colored composition. In some other embodiments, the photocurable resin contained in the alkali-soluble resin accounts for about 1.5% to about 14.6% by weight of the colored composition, and the potassium hydroxide (KOH) titration acid value is less than about 50 mg / g.

[0086] Furthermore, in some embodiments, the thermosetting resin contained in the alkali-soluble resin contains -COOH groups that account for approximately 18 mol% of the thermosetting resin, or less than approximately 18 mol%. In one embodiment, the alkali-soluble resin contains a thermosetting resin and a photocurable resin, wherein the -COOH groups contained in the thermosetting resin account for approximately 18 mol% of the thermosetting resin, and the weight average molecular weight of the photocurable resin is less than 10,000.

[0087] According to some embodiments, the polymerizable unsaturated compound of the colored resin composition may be a monomer that polymerizes by active radicals and / or acids generated by a photoinitiator, such as, but not limited to, an ethylenically unsaturated bond having polymerizability, like a (meth)acrylate compound. Herein, a compound described using parentheses means including the cases where the text inside the parentheses is present and absent. For example, the aforementioned (meth)acrylate compound includes the cases of acrylate compounds and methacrylate compounds. The polymerizable unsaturated compound may also be referred to as a polymerizable compound.

[0088] In some embodiments, the polymerizable unsaturated compound is, for example, a photopolymerizable monomer, which may include but is not limited to at least one selected from the group consisting of: nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, N-vinylpyrrolidone and other polymerizable compounds having one ethylenically unsaturated bond; 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, bis(acryloyloxyethyl) ether of bisphenol A, 3-methylpentanediol di(meth)acrylate and other polymerizable compounds having two ethylenically unsaturated bonds; and trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tripentaerythritol octa(meth)acrylate, tetra(pentaerythritol) deca(meth)acrylate, tetra(pentaerythritol) nona(meth)acrylate, tri(2-(meth)acryloyloxyethyl) isocyanate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate and other polymerizable compounds having three ethylenically unsaturated bonds. In some embodiments, the polymerizable unsaturated compound is, for example, a compound having an ethylenically unsaturated double bond. In some embodiments, the polymerizable unsaturated compound is, for example, a polymerizable compound having three ethylenically unsaturated double bonds.

[0089] Examples of commercially available products of the polymerizable unsaturated compound include KAYARAD (registered trademark) DPHA (Nippon Kayaku Co., Ltd.) and the product name "A-TMM-3LM-N" (pentaerythritol triacrylate; Shin-Nakamura Chemical Co., Ltd.).

[0090] In some embodiments, the weight average molecular weight of the polymerizable unsaturated compound is, for example, 150 or more and 2,900 or less. In some embodiments, the weight average molecular weight of the polymerizable unsaturated compound is, for example, 250 or more and 1,500 or less.

[0091] In some embodiments, the polymerizable unsaturated compound may account for about 1 to 10 wt% of the colored resin composition.

[0092] According to some embodiments, the photopolymerization initiator can be any compound that can generate active radicals, acids, etc. by the action of light, thereby initiating the photopolymerization reaction, and there is no particular limitation.

[0093] In some embodiments, the photoinitiator of the colored resin composition may include, but is not limited to, at least one selected from the group consisting of: O-acyloxime compounds, alkyl phenyl ketone compounds, bisimidazole compounds, triazine compounds, acyl phosphine oxides, benzoin compounds, benzophenone compounds, quinone compounds, 10-butyl-2-chloroacridone, benzyl, methyl phenylglyoxylate, acetophenone, and titanocene compounds.

[0094] In some embodiments, the photoinitiator preferably includes at least one selected from the group consisting of: O-acyloxime compounds, alkyl phenyl ketone compounds, bisimidazole compounds, acetophenone compounds, triazine compounds, acyl phosphine oxide compounds, and biimidazole compounds. For example, in the case of using an O-acyloxime compound as the photoinitiator (D), commercially available products such as OXE-01 (manufactured by BASF), OXE-02 (manufactured by BASF), N-1919 (manufactured by ADEKA), etc. can be used.

[0095] The above O-acyloxime compound is a compound having a partial structure represented by formula (d1). Hereinafter, * represents a bonding end.

[0096]

[0097] Examples of the above O-acyl oxime compounds include N-benzoyloxy-1-(4-phenylthio)phenylbutane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthio)phenyloctane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthio)phenyl-3-cyclopentylpropane-1-one-2-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethane-1-imine, N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxolanylmethoxy)benzoyl}-9H-carbazol-3-yl]ethane-1-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-3-cyclopentylpropane-1-imine, N-benzoyloxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-3-cyclopentylpropane-1-one-2-imine, and the like. Commercially available products such as IRGACURE OXE01 and OXE02 (manufactured by BASF), and N-1919 (manufactured by ADEKA Corporation) can be used. Among them, the O-acyl oxime compound is preferably at least one selected from N-benzoyloxy-1-(4-phenylthio)phenylbutane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthio)phenyloctane-1-one-2-imine, and N-benzoyloxy-1-(4-phenylthio)phenyl-3-cyclopentylpropane-1-one-2-imine, and more preferably N-benzoyloxy-1-(4-phenylthio)phenyloctane-1-one-2-imine. If these O-acyl oxime compounds are used, a color filter with high brightness tends to be obtained.

[0098] The above alkyl phenyl ketone compounds are compounds having a partial structure represented by formula (d2) or a partial structure represented by formula (d3). In these partial structures, the benzene ring may have substituents.

[0099]

[0100] Examples of the compound having a partial structure represented by formula (d2) include 2-methyl-2-morpholino-1-(4-methylthio)phenylpropane-1-one, 2-dimethylamino-1-(4-morpholinophenyl)-2-benzylbutane-1-one, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]butane-1-one, and the like. Commercially available products such as IRGACURE 369, 907, and 379 (manufactured by BASF) can be used.

[0101] Examples of the compound having a partial structure represented by formula (d3) include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2-hydroxy-2-methyl-1-[4-(2-hydroxyethoxy)phenyl]propan-1-one, 1-hydroxycyclohexyl phenyl ketone, oligomers of 2-hydroxy-2-methyl-1-(4-isopropenylphenyl)propan-1-one, α,α-diethoxyacetophenone, benzil dimethyl ketal, and the like.

[0102] In terms of photosensitivity, as the alkyl phenyl ketone compound, a compound having a partial structure represented by formula (d2) is preferred.

[0103] Examples of the above-mentioned triazine compounds include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(piperonyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine, and the like.

[0104] Examples of the above-mentioned acylphosphine oxide compounds include 2,4,6-trimethylbenzoyl diphenylphosphine oxide. Commercially available products such as IRGACURE (registered trademark) 819 (manufactured by BASF) can be used.

[0105] Examples of the above-mentioned benzimidazole compounds include 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbenzimidazole, 2,2'-bis(2,3-dichlorophenyl)-4,4',5,5'-tetraphenylbenzimidazole (see, for example, Japanese Patent Laid-Open No. 6-75372, Japanese Patent Laid-Open No. 6-75373, etc.), 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbenzimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(alkoxyphenyl)benzimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(dialkoxyphenyl)benzimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(trialkoxyphenyl)benzimidazole (see, for example, Japanese Patent Publication No. 48-38403, Japanese Patent Laid-Open No. 62-174204, etc.), imidazole compounds in which the phenyl groups at the 4,4',5,5'-positions are substituted with alkoxycarbonyl groups (see, for example, Japanese Patent Laid-Open No. 7-10913, etc.), and the like.

[0106] Examples of other polymerization initiators include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, 3,3',4,4'-tetrakis(tert-butylperoxycarbonyl)benzophenone, and 2,4,6-trimethylbenzophenone; quinone compounds such as 9,10-phenanthrenequinone, 2-ethylanthraquinone, and camphorquinone; 10-butyl-2-chloroacridone, benzil, methyl phenylglyoxylate, titanocene compounds, and the like. Preferably, these polymerization initiators can be used in combination with the polymerization initiation aids (especially amines) described later.

[0107] Examples of the acid generator include onium salts such as 4-hydroxyphenyldimethylsulfonium p-toluenesulfonate, 4-hydroxyphenyldimethylsulfonium hexafluoroantimonate, 4-acetoxyphenyldimethylsulfonium p-toluenesulfonate, 4-acetoxyphenylmethylbenzylsulfonium hexafluoroantimonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfonium hexafluoroantimonate, diphenyliodonium p-toluenesulfonate, and diphenyliodonium hexafluoroantimonate; nitrobenzyl toluenesulfonate, benzoin toluenesulfonate, and the like.

[0108] In some embodiments, the photoinitiator may account for about 0.1 wt% to 10 wt% of the colored resin composition.

[0109] In some embodiments, the solvent of the colored resin composition may include, but is not limited to, at least one selected from the group consisting of: ester solvents (herein meaning solvents containing -COO- but not -O- in the molecule), ether solvents (herein meaning solvents containing -O- but not -COO- in the molecule), ether ester solvents (herein meaning solvents containing -COO- and -O- in the molecule), ketone solvents (herein meaning solvents containing -CO- but not -COO- in the molecule), alcohol solvents (herein meaning solvents containing OH but not -O-, -CO-, and -COO- in the molecule), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide, and the like.

[0110] Examples of ester solvents include methyl lactate, ethyl lactate, butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexyl acetate, and γ-butyrolactone.

[0111] Examples of ether solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenetole, and methyl anisole.

[0112] Examples of ketone solvents include 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone (CHN), and isophorone.

[0113] Examples of alcohol solvents include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerol.

[0114] Examples of aromatic hydrocarbon solvents include benzene, toluene, xylene, and 1,3,5-trimethylbenzene.

[0115] Examples of amide solvents include N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0116] Among the above solvents, from the aspects of coatability and drying property, an organic solvent with a boiling point of 120 °C or higher and 180 °C or lower under 1 atm is preferred. As the solvent, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone, N-methylpyrrolidone, and N,N-dimethylformamide are preferred, and propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, N-methylpyrrolidone, ethyl lactate, and ethyl 3-ethoxypropionate are more preferred.

[0117] In some embodiments, relative to the total amount of the colored resin composition, the content of the solvent can be about 30 wt% to about 95 wt%, or 40 wt% to 60 wt%, such as about 45 wt%. When the content of the solvent is appropriate, the flatness during coating can be improved, and there is no shortage of color concentration when forming the color filter, so that the display characteristics can be made better.

[0118] To make the above and other objects, features, and advantages of the present disclosure more obvious and understandable, several experimental examples and comparative examples of the preparation of colored resin compositions are specifically given below. After coating the colored resin compositions in these examples on a substrate, several detection analyses and evaluations are carried out to observe the characteristics of the film layer containing the composition. These experimental contents can specifically illustrate the effects that the colored resin composition according to the embodiments of the present disclosure can achieve, and the characteristics of the color photoresist composition prepared by applying the present disclosure. However, the following examples and comparative examples are only for illustrative purposes and should not be construed as limitations on the implementation of the present disclosure.

[0119] In addition, the formation of the coating film and the evaluation method of the film layer characteristics of the colored resin composition proposed in the experimental examples are briefly described as follows. The detection and evaluation methods will not be repeated when analyzing the detection results of each experimental example subsequently.

[0120] [Formation of Coating Film]

[0121] (a) First, on a substrate with a thickness of about 0.4 mm to about 0.7 mm, spin coating is used to coat the colored resin composition of each experimental example;

[0122] (b) The substrate coated with the colored resin composition is placed on a hot plate at about 80 °C to about 90 °C, and pre-baking is carried out for about 38 seconds to about 88 seconds to remove most of the solvent in the composition; and

[0123] (c) After the substrate is cooled, after performing the exposure step using an exposure machine, the substrate is moved to a developing machine to perform the developing step to form a colored film layer on the substrate.

[0124] [Development Process Conditions]

[0125] Development process: Development is carried out using an alkaline developer at a development pressure of 0.07 MPa and a development time of 50 seconds. After that, rinsing is performed with clean water (deionized water) at a rinsing pressure of 0.1 MPa and a rinsing time of 40 seconds.

[0126] After development is completed, a colored film layer is formed on the substrate.

[0127] [Evaluation Method for Colored Film Layer]

[0128] In this disclosure, for the colored resin composition of each experimental example, after steps such as pre-baking, exposure, and development, the edge and undercut part of the colored film layer formed on the substrate are photographed with a scanning electron microscope (SEM) (model: HITACH Regulus 8100) to observe the cross-sectional shape of the film layer and measure the undercut depth. Among them, the definition of the undercut depth can be referred to the depth d of the photoresist structure 21 along the X direction and the related description as shown above Figure 2A shown, such as the depth d of the photoresist structure 21 along the X direction and the related description.

[0129] Furthermore, an optical microscope (model: NiKon eclipse LV150N) is also used to take OM photos of the upper part of the colored film layer formed on the substrate at magnifications of 20 times and 50 times respectively to inspect and observe whether the edge of the colored film layer formed on the substrate is complete; for example, when viewed from above the colored film layer, if the formed colored film layer contains several long strip-shaped photoresist structures (as Figure 2B shown), then check whether the edges of these long strip-shaped photoresist structures have peeling, sinking, or other defects, and evaluate whether the proportion of these defects in all photoresist structures is too high.

[0130] (a) The evaluation criteria for the undercut depth of the colored film layer formed on the substrate are as follows:

[0131] When the undercut depth is less than or equal to 1 μm (≦1 μm), it is evaluated as O, indicating that the colored film layer has good undercut characteristics;

[0132] When the undercut depth is in the range greater than 1 μm to less than 3 μm (i.e., 1 μm < undercut depth μm < 3 μm), it is evaluated as Δ, indicating that the colored film layer has acceptable undercut characteristics; and

[0133] When the undercut depth is greater than or equal to 3 μm (≧3 μm), it is evaluated as X, indicating that the undercut characteristics of the colored film layer are poor.

[0134] (b) When inspecting the colored film layer formed on the substrate with an optical microscope, the evaluation criteria for the integrity of the film layer edge are as follows:

[0135] When examining the edge of the colored film layer formed on the substrate with an optical microscope, if the line color is uniform and there are no concave defects, it is evaluated as O, indicating that the colored film layer has excellent edge integrity;

[0136] If a small part of the color of the edge of the colored film layer is uneven, it is evaluated as Δ, indicating that the colored film layer has acceptable edge integrity. In the experiment, "a small part" is defined as the area ratio of all defects at the edge to the area of all film layer structures being less than 30%;

[0137] If examining the edge of the colored film layer, if most of the line colors are uneven or there is a sagging situation, it is evaluated as X, indicating that the colored film layer has unacceptable edge integrity.

[0138] Based on the undercut results and OM photos for a comprehensive evaluation, the judgment criteria are as follows:

[0139] Undercut result OM Overall evaluation O O ◎ O Δ O Δ O O Δ Δ Δ X X X

[0140] <Related Experiment 1: The alkali-soluble resin in the colored resin composition contains different photocurable resins>

[0141] Please refer to Table 1 and Table 2. In Related Experiment 1, the compositions (including components and their weight percentages) of the colored resin compositions of each experimental example and comparative example are listed in Table 1. Table 2 lists the types and characteristics of the photocurable resins used in each experimental example and comparative example (such as their weight average molecular weights and the -COOH groups contained), as well as the undercut depths of the colored film layers formed by the compositions containing such photocurable resins.

[0142] As shown in Table 1, the alkali-soluble resins in each experimental example contain a thermosetting resin-I (such as Preparation Example 9 later) and a photocurable resin (including 7 different types and / or different proportions of self-prepared resins, such as Preparation Examples 1 - 7 later). For the convenience of briefly showing the table, the components / copolymers in Table 1 are represented by commercial product names and / or component abbreviations, and the monomer names and proportions of each component / copolymer are listed and organized below Table 1 and in Table 2.

[0143] Table 1

[0144]

[0145]

[0146] (Continued Table 1)

[0147]

[0148] Colorant Pigment Blue B15:6: Organic blue pigment (purchased from Nippon Pigment Co., Ltd. -)

[0149] Thermosetting resin material - I: Refer to Preparation Example 9

[0150] Monomer DPHA of polymerizable unsaturated compound: Dipentaerythritol hexaacrylate (KAYARAD (registered trademark)) is used

[0151] Photoinitiator OXE - 01: O - acyloxime compound (purchased from BASF -)

[0152] Solvent PGMEA: Propylene glycol monomethyl ether acetate (purchased from Yuwa Trading -)

[0153] Table 2

[0154]

[0155] TCDMA: Dicyclopentyl (meth)acrylate

[0156] BZMA: Benzyl (meth)acrylate

[0157] MAA: Methacrylic acid

[0158] MMA: Methyl (meth)acrylate

[0159] GMA: Glycidyl (meth)acrylate

[0160] Furthermore, for the photocurable resins corresponding to Experiments 1 - 1 to 1 - 7 listed in Table 2, their chemical formulas and monomer ratios (mol%) are sorted as follows:

[0161]

[0162] In related Experiment 1, the characteristics of the colored resin compositions of each experimental example, the evaluation results of inspecting the edge and undercut part of the film layer formed on the substrate by scanning electron microscope (SEM), and the measured undercut depth are listed in Table 3. Table 3 and Figures 3A to 3G can be referred to simultaneously, where Figures 3A to 3G are simple schematic diagrams of the edge and undercut part of the film layer according to the SEM images of Experiments 1 - 1 to 1 - 7, showing the local photoresist structure 31 and the undercut depth d on the substrate 30 of each experimental example. Furthermore, the evaluation results of observing whether the edge of the colored film layer of each experimental example is complete with an optical microscope at magnifications of 20 times and 50 times are also listed in Table 3.

[0163] Table 3

[0164]

[0165] According to the results of the above-mentioned related Experiment 1, for the alkali-soluble resins of the colored resin compositions proposed in Experimental Examples 1-3, 1-4, 1-5, and 1-6, the photocurable resin using a copolymer containing, for example, dicyclopentanyl (meth)acrylate (TCDMA) / (meth)methyl acrylate (MMA) / (glycidyl methacrylate (GMA) / (meth)acrylic acid (MAA)), under appropriate molecular weight and acid value conditions, for example, when its molecular weight is less than 20,000 and the potassium hydroxide (KOH) titration acid value is less than 100 mg / g, after forming a colored film layer on the substrate, the undercut depth of the film layer can be improved and a complete edge can be formed. For example, for the photocurable resins used in Experimental Examples 1-3 to 1-6, their molecular weights are 17,200, 6,100, 6,400, and 6,500 (all less than 20,000), and the acid values are 28, 97, 35.4, and 33.7 mg / g (all less than 100 mg / g), respectively. The formed colored film layer has a good mushroom-shaped cross-section (as shown in Figures 3C to 3F), and the undercut depth is less than 1.5 μm. When the edge of the colored film layer formed on the substrate is inspected with an optical microscope, it also has good or acceptable edge integrity.

[0166] Furthermore, in some embodiments, for the photocurable resin using a copolymer containing, for example, dicyclopentanyl (meth)acrylate (TCDMA) / methyl acrylate (MMA) / glycidyl methacrylate (GMA) / (meth)acrylic acid (MAA), when the molecular weight is less than 20,000 and the potassium hydroxide (KOH) titration acid value is less than 55 mg / g, for example, the acid values in Experimental Examples 1-3, 1-5, and 1-6 are less than 40 mg / g. When the edge of the colored film layer formed on the substrate is inspected with an optical microscope, the line colors are uniform, and the edge of the colored film layer formed on the substrate has good edge integrity. For the photocurable resin of Experimental Example 1-4 with an acid value of 97 mg / g, after exposing and developing on the substrate to form a colored film layer, the color of a small part of the edge of the colored film layer is uneven, but it is still within the standard of acceptable edge integrity (that is, the inspection machine will not generate an excessive number of defect misjudgments).

[0167] Furthermore, in some embodiments, for the photocurable resin using a copolymer containing, for example, dicyclopentanyl (meth)acrylate (TCDMA) / methyl acrylate (MMA) / glycidyl methacrylate (GMA) / (meth)acrylic acid (MAA), when the molecular weight is less than 10,000 and the potassium hydroxide (KOH) titration acid value is less than 55 mg / g, for example, Experimental Examples 1-5 and 1-6, the undercut depth of the formed colored film layer can be reduced to less than 0.4 μm. When the edge of the colored film layer formed on the substrate is inspected with an optical microscope, it also has very excellent edge integrity.

[0168] <Related Experiment 2: A photocurable resin with the same components but different component ratios in the alkali-soluble resin of the colored resin composition>

[0169] Please refer to Table 4 and Table 5. In Related Experiment 2, the components of the thermosetting resin, photocurable resin, and monomer of the polymerizable unsaturated compound in the colored resin compositions of Experimental Examples 2-1 to 2-7, as well as the ratios (%) (Binder / Monomer Ratio) among the three, are listed in Table 4. In Experimental Examples 2-1 to 2-7, Resin I was selected as the thermosetting resin, Resin F was selected as the photocurable resin, and DPHA was selected as the monomer of the polymerizable unsaturated compound.

[0170] Table 4

[0171]

[0172] For the composition of the thermosetting resin I, please refer to Table 6.

[0173] The composition of the photocurable resin F is as described above.

[0174] In Related Experiment 2, the characteristics of the colored resin compositions of each experimental example, the evaluation results of examining the edge and undercut part of the film layer by scanning electron microscope (SEM) after forming the colored film layer on the substrate, and the measured undercut depth are listed in Table 5. Please refer to Table 5 and Figures 4A to 4F , where Figures 4A to 4G are simple schematic diagrams of the edge and undercut part of the film layer based on the SEM images of Experimental Examples 2-1 to 2-7, showing the local photoresist structure 41 and the undercut depth d on the substrate 40 of each experimental example. Furthermore, the evaluation results of observing whether the edge of the colored film layer of each experiment is complete under an optical microscope at magnifications of 20 times and 50 times are also listed in Table 5.

[0175] Table 5

[0176]

[0177]

[0178] According to the results of Related Experiment 2 above, for the alkali-soluble resin of the colored resin compositions proposed in Experimental Examples 2-1 to 2-7, the same thermosetting resin I and photocurable resin F were used, where the thermosetting resin I was ( Composition(Refer to Table 6 and the preparation method of Preparation Example 9), the photocurable resin F is a photocurable resin which is a copolymer of TCDMA / MMA / (GMA+MAA) / MAA = 3 / 70 / 23.5 / 3.5 (weight ratio is 3:70:23.5:3.5). In Related Experiment 2, the ratio of the photocurable resin to the monomers of the polymerizable unsaturated compounds in the colored resin composition (Binder / MonomerRatio) was further varied. According to the experimental results, when the ratio of the photocurable resin to the monomers of the polymerizable unsaturated compounds (Binder / Monomer Ratio) is from about 6.7% to about 300%, the formed colored film layer has a good or acceptable mushroom-shaped cross-section (as Figures 4A to 4G shown), and the undercut depth is less than 1.0 μm, and the edge of the colored film layer formed on the substrate examined with an optical microscope also has good or acceptable edge integrity.

[0179] Furthermore, in some embodiments, for example, when the ratio of the photocurable resin to the monomers of the polymerizable unsaturated compounds (Binder / Monomer Ratio) used in Experimental Examples 2-1 to 2-6 is from about 6.7% to about 166.7%, the formed colored film layer has a good mushroom-shaped cross-section, the undercut depth is less than 1.0 μm, and the edge of the colored film layer formed on the substrate examined with an optical microscope also has good or even excellent edge integrity.

[0180] <Related Experiment 3: Different thermosetting resins are included in the alkali-soluble resin of the colored resin composition>

[0181] Please refer to Table 6 and Table 7. In Related Experiment 3, the components (such as monomer ratios) and properties (such as its weight average molecular weight and the contained -OH groups and -COOH groups) of the thermosetting resins used in each colored resin composition in Experimental Examples 3-1 to 3-3 are listed in Table 6.

[0182] Table 6

[0183] Name of thermosetting resin Monomer ratio (%mol) Molecular weight COOH group I EDCPA / MAA = 84.9 / 15.1 7960 15.1 mol% J EDCPA / MAA = 82.9 / 17.1 18650 17 mol% K EDCPA / MAA = 81.7 / 18.3 24800 18.3 mol%

[0184] Furthermore, corresponding to the thermosetting resins listed in Table 6, taking the thermosetting resin K as an example, its Chemical Formula 1-4 is as follows:

[0185]

[0186] In Related Experiment 3, the properties of the colored resin compositions of each experimental example, the evaluation results of examining the edges and undercut parts of the film layer by scanning electron microscope (SEM) after forming the colored film layer on the substrate, and the measured undercut depth are listed in Table 7. Table 6 and Figures 5A to 5C, wherein Figures 5A to 5C are simple schematic diagrams of the film layer edges and undercut portions according to the SEM images of Experimental Examples 3-1 to 3-3, respectively. The local photoresist structure 51 and the undercut depth d on the substrate 50 of each experimental example are shown in the figure. Furthermore, the evaluation results of observing whether the edges of the colored film layers of each experiment are complete with an optical microscope at magnifications of 20 times and 50 times are also listed in Table 7.

[0187] Table 7

[0188]

[0189] According to the results of the above-mentioned Related Experiment 3 (using the same photocurable resin but different thermosetting resins), for example, the alkali-soluble resins of the colored resin compositions proposed in Experimental Examples 3-1 and 3-2, the weight-average molecular weight of the thermosetting resin contained therein is between about 5000 and about 20000, and the potassium hydroxide (KOH) titration acid value is between about 100 mg / g and about 120 mg / g. The formed colored film layer has a good or acceptable mushroom-shaped profile (as Figure 5A , Figure 5B shown), the undercut depths are all less than 1.0 μm (0.715 μm and 0.515 μm respectively), and the edges of the colored film layers formed on the substrate examined by an optical microscope also have good or acceptable edge integrity.

[0190] Furthermore, in some embodiments, the -COOH groups contained in the thermosetting resin contained in the alkali-soluble resin account for about 18 mol% or less than about 18 mol% of the thermosetting resin. For example, the -COOH groups contained in the thermosetting resins of Experimental Examples 3-1 and 3-2 account for 15.1 mol% and 17 mol% of the thermosetting resin respectively. The formed colored film layers have undercut depths less than 1.0 μm and good edge integrity.

[0191] In some other embodiments, for example, in Experimental Example 3-1, the weight-average molecular weight of the thermosetting resin contained in the alkali-soluble resin is less than about 10000, and the potassium hydroxide (KOH) titration acid value is between about 100 mg / g and about 120 mg / g. The formed colored film layer has a good profile. In addition to the undercut depth being less than 1.0 μm, the edges of the colored film layers formed on the substrate examined by an optical microscope also have very good edge integrity.

[0192] <Related Experiment 4: Two photocurable resins are included in the alkali-soluble resin of the colored resin composition>

[0193] Please refer to Table 8 and Table 9. In Related Experiment 4, the components and their weight percentages of the colored resin compositions in Experimental Examples 4-1 to 4-3 are listed in Table 8. As listed in Table 8 for Experimental Examples 4-1 to 4-3, the alkali-soluble resin of the colored resin composition in each experimental example contains a thermosetting resin (e.g., I) and two photocurable resins (e.g., 5% of F and another 5% of photocurable resin A, C, or H).

[0194] In Related Experiment 4, the components and properties of the thermosetting resin I, photocurable resins A and C used are as described above, while the copolymer monomer ratio (mol%) of the photocurable resin H is: TCDMA / MMA / MAA / (MAA + GMA) = 3 / 27 / 18.9 / 51.1. The molecular weight of the photocurable resin H is 17,800, the undercut depth is 6.11 μm, and the COOH group is 18.9 mol%. The preparation method of the photocurable resin H is, for example, referred to Preparation Example 8 below.

[0195] Table 8

[0196]

[0197] In Related Experiment 4, the characteristics of the colored resin composition in each experimental example, the evaluation results of inspecting the edge and undercut part of the film layer by scanning electron microscope (SEM) after forming the colored film layer on the substrate, and the measured undercut depth are listed in Table 9. Please refer to Table 9 and Figures 6A to 6C , where Figures 6A to 6C are simple schematic diagrams of the edge and undercut part of the film layer according to the SEM images of Experimental Examples 4-1 to 4-3, showing the local photoresist structure 61 and the undercut depth d on the substrate 60 of each experimental example. Furthermore, the edge integrity of each colored film layer in Experimental Examples 4-1 to 4-3 was observed with an optical microscope at magnifications of 20 times and 50 times respectively, and the evaluation results are also listed in Table 9.

[0198] Table 9

[0199]

[0200] According to the results of Related Experiment 4 above, it can be shown that by mixing two photocurable resins, a colored film layer with a good cross-sectional shape, an undercut depth close to or less than 1.0 μm, and a complete film layer edge can also be obtained.

[0201] Taking Experimental Example 4-3 as an example, in addition to using the photocurable resin F as in Experimental Examples 1-6 above, it also uses the photocurable resin H, and the weight average molecular weight is less than 20,000, and the formed colored film layer has a good mushroom-shaped cross-section (as Figure 6CAs shown, the undercut depth is 1.12 μm (close to 1.0 μm), and the edge of the colored film layer formed on the substrate has acceptable edge integrity when inspected with an optical microscope.

[0202] Furthermore, taking Experiment 4-2 as an example, it uses the photocurable resin F as in the above Experiment Examples 1-6 and the photocurable resin C as in Experiment Examples 1-3, for example, and the weight average molecular weight is less than 20,000. The formed colored film layer has a good mushroom-shaped cross-section (as Figure 6B shown), the undercut depth is 0.99 μm (less than 1.0 μm), and the edge of the colored film layer formed on the substrate has good edge integrity when inspected with an optical microscope.

[0203] <Synthesis of Photocurable Resin and Thermosetting Resin>

[0204] The synthesis methods of the above photocurable resins A to H are respectively as described in the following Preparation Examples 1 to 8. The synthesis methods of the above thermosetting resins I, J, and K are respectively as described in the following Preparation Examples 9 to 11. For convenient comparison, the compositions and preparation methods of the photocurable resins A to H used in the above experiments are sorted out as follows.

[0205]

[0206] [Preparation Example 1]:

[0207] Into a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, 213.6 g of propylene glycol monomethyl ether acetate was placed, and while stirring with nitrogen substitution, the temperature was raised to 90 °C. Then, a monomer mixture composed of 88.2 g (0.50 mol) of benzyl methacrylate, 22.0 g (0.1 mol) of methacrylic acid, tricyclodecyl ester, and 28.9 g (0.40 mol) of methacrylic acid with 4.0 g of t-butyl peroxy-2-ethylhexanoate added thereto was dropped into the aforementioned flask from the dropping funnel. After the dropping was completed, copolymerization reaction was carried out by stirring at 95 °C for about 3 hours to produce a copolymer. Then, after replacing the inside of the aforementioned flask with air, 21.4 g (0.15 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor) were added, and ring-opening addition reaction was carried out at 120 °C for about 6 hours to produce a copolymer. Then, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 27,000). The copolymer (photocurable resin A) prepared in Preparation Example 1 has a structural unit as shown in Chemical Formula 1-1.

[0208] [Chemical Formula 1-1]

[0209]

[0210] [Production Example 2]:

[0211] In a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, after placing 213.6 g of propylene glycol monomethyl ether acetate, it was stirred while replacing with nitrogen and heated to 90 °C. Then, a mixture obtained by adding 4.0 g of t-butyl peroxy-2-ethylhexanoate to a monomer mixture composed of 88.2 g (0.60 mol) of benzyl methacrylate and 22.0 g (0.4 mol) of methacrylic acid was dropped into the aforementioned flask from the dropping funnel. After the dropping was completed, the copolymerization reaction was carried out by stirring at 95 °C for 1.5 hours to produce a copolymer. Then, after replacing the inside of the flask with air, 221.3 g of propylene glycol monomethyl ether was added to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 10,500). The copolymer (photocurable resin B) prepared in Production Example 2 has a structural unit shown in Chemical Formula 1-2.

[0212] [Chemical Formula 1-2]

[0213]

[0214] [Production Example 3]:

[0215] In a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, after placing 213.6 g of propylene glycol monomethyl ether acetate, it was stirred while replacing with nitrogen and heated to 90 °C. Then, a mixture obtained by adding 4.0 g of t-butyl peroxy-2-ethylhexanoate to a monomer mixture composed of 30.0 g (0.30 mol) of methyl methacrylate, 11.0 g (0.05 mol) of tricyclodecanyl methacrylate, and 46.9 g (0.65 mol) of methacrylic acid was dropped into the aforementioned flask from the dropping funnel. After the dropping was completed, the copolymerization reaction was carried out by stirring at 95 °C for about 2 hours to produce a copolymer. Then, after replacing the inside of the flask with air, 82.5 g (0.58 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor) were added, and a ring-opening addition reaction was carried out at 120 °C for about 7 hours to produce a copolymer. Then, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 17,200). The copolymer (photocurable resin C) prepared in Production Example 3 has a structural unit shown in Chemical Formula 1-3.

[0216] [Chemical Formula 1-3]

[0217]

[0218] [Preparation Example 4]:

[0219] Into a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, 213.6 g of propylene glycol monomethyl ether acetate was placed, and while stirring with nitrogen substitution, the temperature was raised to 90 °C. Then, 4.0 g of t-butyl peroxy-2-ethylhexanoate was added to a monomer mixture composed of 30.0 g (0.30 mol) of methyl methacrylate, 11.0 g (0.05 mol) of tricyclodecanyl methacrylate, and 46.9 g (0.65 mol) of methacrylic acid, and the mixture was dropped into the aforementioned flask from the dropping funnel. After the dropping was completed, the copolymerization reaction was carried out by stirring at 95 °C for about 1 hour to produce a copolymer. Then, after replacing the inside of the flask with air, 49.8 g (0.35 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor) were added, and a ring-opening addition reaction was carried out at 120 °C for about 3 hours to produce a copolymer. Then, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 6,100). The copolymer (photocurable resin D) prepared in Preparation Example 4 has the structural units shown in Chemical Formula 1-3 above.

[0220] [Preparation Example 5]:

[0221] Into a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, 213.6 g of propylene glycol monomethyl ether acetate was placed, and while stirring with nitrogen substitution, the temperature was raised to 90 °C. Then, 4.0 g of t-butyl peroxy-2-ethylhexanoate was added to a monomer mixture composed of 30.0 g (0.30 mol) of methyl methacrylate, 11.0 g (0.05 mol) of tricyclodecanyl methacrylate, and 46.9 g (0.65 mol) of methacrylic acid, and the mixture was dropped into the aforementioned flask from the dropping funnel. After the dropping was completed, the copolymerization reaction was carried out by stirring at 95 °C for about 1 hour to produce a copolymer. Then, after replacing the inside of the flask with air, 78.2 g (0.55 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor) were added, and a ring-opening addition reaction was carried out at 120 °C for about 6 hours to produce a copolymer. Then, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 6,400). The copolymer (photocurable resin E) prepared in Preparation Example 5 has the structural units shown in Chemical Formula 1-3 above.

[0222] [Preparation Example 6]:

[0223] In a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, after placing 213.6 g of propylene glycol monomethyl ether acetate, stir while replacing with nitrogen and heat up to 90 °C. Then, a monomer mixture composed of 70.0 g (0.70 mol) of methyl methacrylate, 11.0 g (0.05 mol) of tricyclodecanyl methacrylate, and 18.1 g (0.25 mol) of methacrylic acid, to which 4.0 g of t-butyl peroxy-2-ethylhexanoate has been added, is dropped from the dropping funnel into the aforementioned flask. After the dropping is completed, carry out a copolymerization reaction by stirring at 95 °C for about 1 hour to produce a copolymer. Then, after replacing the inside of the flask with air, add 28.5 g (0.20 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor), and carry out a ring-opening addition reaction at 120 °C for 8 hours to produce a copolymer. Then, add 221.3 g of propylene glycol monomethyl ether to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 6,500). The copolymer (photocurable resin - F) prepared in Preparation Example 6 has structural units as shown in Chemical Formulas 1 - 3 above.

[0224] [Preparation Example 7]:

[0225] In a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, after placing 213.6 g of propylene glycol monomethyl ether acetate, stir while replacing with nitrogen and heat up to 90 °C. Then, a monomer mixture composed of 30.0 g (0.30 mol) of methyl methacrylate, 11.0 g (0.05 mol) of tricyclodecanyl methacrylate, and 46.9 g (0.65 mol) of methacrylic acid, to which 4.0 g of t-butyl peroxy-2-ethylhexanoate has been added, is dropped from the dropping funnel into the aforementioned flask. After the dropping is completed, carry out a copolymerization reaction by stirring at 95 °C for about 3 hours to produce a copolymer. Then, after replacing the inside of the flask with air, add 49.8 g (0.35 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor), and carry out a ring-opening addition reaction at 120 °C for about 3 hours to produce a copolymer. Then, add 221.3 g of propylene glycol monomethyl ether to this reaction solution to obtain a copolymer solution with a solid content concentration of 30% by mass (weight average molecular weight 23,900). The copolymer (photocurable resin G) prepared in Preparation Example 7 has structural units as shown in Chemical Formulas 1 - 3 above.

[0226] [Preparation Example 8]:

[0227] In a flask equipped with a stirring device, a dropping funnel, a condenser, a thermometer, and a gas inlet tube, 213.6 g of propylene glycol monomethyl ether acetate was placed, and while stirring, it was purged with nitrogen and heated to 90 °C. Next, 4.0 g of t-butyl peroxy-2-ethylhexanoate added to a monomer mixture composed of 30.0 g (0.30 mol) of methyl methacrylate, 11.0 g (0.05 mol) of tricyclodecanyl methacrylate, and 46.9 g (0.65 mol) of methacrylic acid was dropped into the aforementioned flask from the dropping funnel. After the dropping was completed, copolymerization reaction was carried out by stirring at 95 °C for about 2 hours to produce a copolymer. Next, after replacing the inside of the flask with air, 64.0 g (0.45 mol) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst), and 0.6 g of hydroquinone (polymerization inhibitor) were added, and ring-opening addition reaction was carried out at 120 °C for about 4 hours to produce a copolymer. Next, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution (weight average molecular weight 17,800) having a solid content concentration of 30% by mass. The copolymer (photocurable resin H) prepared in Preparation Example 8 has structural units shown in Chemical Formula 1-3 above.

[0228] Furthermore, the thermosetting resin I is a resin material synthesized by itself. Please refer to the following Preparation Examples 9-1 to 9-2. The thermosetting resin I-1 of Preparation Example 9-1 and the thermosetting resin I-2 of Preparation Example 9-2 can be used alone or in combination as the material of the thermosetting resin I.

[0229] [Preparation Example 9-1: Preparation of Thermosetting Resin I-1]

[0230] An appropriate amount of nitrogen gas was allowed to flow in a flask equipped with a reflux condenser, a dropping funnel, and a stirrer to create a nitrogen atmosphere, and 100 parts of propylene glycol monomethyl ether acetate was placed therein. While stirring, it was heated to 85 °C. Then, into this flask, a solution prepared by dissolving 19 parts of methacrylic acid (for forming the constituent unit on the lower left), 171 parts of a mixture of 3,4-epoxytricyclo[5.2.1.02,6]dec-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02,6]dec-9-yl acrylate (with a molar ratio of 50:50) (trade name "E-DCPA", manufactured by Daicel Corporation) in 40 parts of propylene glycol monomethyl ether acetate was dropped in over about 5 hours using a dropping pump. On the other hand, into the flask, a solution prepared by dissolving 26 parts of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) in 120 parts of propylene glycol monomethyl ether acetate was dropped in over about 5 hours using another dropping pump. After the dropping of the polymerization initiator was completed, the temperature was maintained at the same temperature for about 3 hours, and then cooled to room temperature to obtain a solution of a copolymer (thermosetting resin I-1) with a solid content of 43.5%. The weight average molecular weight of the obtained resin I-1 was 8000. The copolymer prepared in Preparation Example 9-1 has the constituent units shown in Chemical Formula 1-4 below.

[0231] [Chemical Formula 1-4]

[0232]

[0233] [Preparation Example 9-2: Preparation of Thermosetting Resin I-2]

[0234] The atmosphere in a flask equipped with a reflux condenser, a dropping funnel, and a stirrer was replaced with a nitrogen atmosphere, 280 parts of propylene glycol monomethyl ether acetate was added, and it was heated to 80 °C while stirring. Then, a mixed solution of 38 parts of acrylic acid, 289 parts of a mixture of 3,4-epoxytricyclo[5.2.1.02,6]dec-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02,6]dec-9-yl acrylate (with a molar ratio of 1:1) in 125 parts of propylene glycol monomethyl ether acetate was dropped in over 5 hours. On the other hand, a solution in which 33 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in 235 parts of propylene glycol monomethyl ether acetate was dropped in over 6 hours. After the dropping was completed, the mixture was maintained at 80 °C for 4 hours and then cooled to room temperature to obtain a solution of a copolymer (thermosetting resin I-2) with a solid content of 35.1% and a viscosity of 125 mPas measured with a B-type viscometer (23 °C). The weight average molecular weight (Mw) of the obtained copolymer was 9200. The copolymer prepared in Preparation Example 9-2 has the constituent units shown in Chemical Formula 1-5 below.

[0235] [Chemical Formula 1-5]

[0236]

[0237] The thermosetting resin J is a self-synthesized resin material. Please refer to Preparation Examples 10-1 to 10-2 below. The thermosetting resin J-1 of Preparation Example 10-1 and the thermosetting resin J-2 of Preparation Example 10-2 can be used alone or in combination as the material of the thermosetting resin J.

[0238] [Preparation Example 10-1: Preparation of Thermosetting Resin J-1]

[0239] In a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, an appropriate amount of nitrogen gas was allowed to flow to create a nitrogen environment, and 100 parts of propylene glycol monomethyl ether acetate was placed. While stirring, it was heated to 85 °C. Then, into this flask, a solution prepared by dissolving 19 parts of methacrylic acid (for forming the constituent unit on the lower left) and 171 parts of a mixture of 3,4-epoxytricyclo[5.2.1.02,6]decane-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02,6]decane-9-yl acrylate (containing a molar ratio of 50:50) (trade name "E-DCPA", manufactured by Daicel Corporation) in 40 parts of propylene glycol monomethyl ether acetate was dropped using a dropping pump over about 5 hours. On the other hand, into the flask, a solution prepared by dissolving 26 parts of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) in 120 parts of propylene glycol monomethyl ether acetate was dropped using another dropping pump over about 5 hours. After the dropping of the polymerization initiator was completed, it was maintained at the same temperature for about 4.5 hours, and then cooled to room temperature to obtain a solution of a copolymer (thermosetting resin J-1) with a solid content of 43.5%. The weight average molecular weight of the obtained resin J-1 was 18,000. The copolymer prepared in Preparation Example 10-1 has the constituent units shown in Chemical Formula 1-4 above.

[0240] [Preparation Example 10-2: Preparation of Thermosetting Resin J-2]

[0241] In a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, the atmosphere was replaced with nitrogen, and 280 parts of propylene glycol monomethyl ether acetate was added. The mixture was heated to 80 °C with stirring. Subsequently, 38 parts of acrylic acid and a mixture of 3,4-epoxytricyclo[5.2.1.02,6]dec-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02,6]dec-9-yl acrylate (in a molar ratio of 1:1) were added dropwise over 5 hours as a mixed solution of 289 parts and 125 parts of propylene glycol monomethyl ether acetate. On the other hand, a solution of 33 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) dissolved in 235 parts of propylene glycol monomethyl ether acetate was added dropwise over 6 hours. After the addition was completed, the mixture was maintained at 80 °C for 6.5 hours and then cooled to room temperature to obtain a copolymer (thermosetting resin J-2) solution with a solid content of 35.1% and a viscosity of 125 mPas measured with a B-type viscometer (23 °C). The weight-average molecular weight (Mw) of the obtained copolymer was 19,100. The copolymer prepared in Preparation Example 10-2 has the structural units shown in Chemical Formula 1-5 above.

[0242] The thermosetting resin K is a self-synthesized resin material. Please refer to the following Preparation Examples 11-1 to 11-2. The thermosetting resin K-1 of Preparation Example 11-1 and the thermosetting resin K-2 of Preparation Example 11-2 can be used alternatively or in combination as the material for the thermosetting resin K.

[0243] [Preparation Example 11-1: Preparation of Thermosetting Resin K-1]

[0244] In a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, an appropriate amount of nitrogen was allowed to flow to create a nitrogen environment, and 100 parts of propylene glycol monomethyl ether acetate was placed. While stirring, the mixture was heated to 85 °C. Subsequently, into this flask, a solution prepared by dissolving 19 parts of methacrylic acid (for forming the structural unit on the lower left), 171 parts of a mixture of 3,4-epoxytricyclo[5.2.1.02,6]dec-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02,6]dec-9-yl acrylate (in a molar ratio of 50:50) (trade name "E-DCPA", manufactured by Daicel Corporation) in 40 parts of propylene glycol monomethyl ether acetate was added dropwise using a dropping pump over approximately 5 hours. On the other hand, into the flask, a solution prepared by dissolving 26 parts of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) in 120 parts of propylene glycol monomethyl ether acetate was added dropwise using another dropping pump over approximately 5 hours. After the addition of the polymerization initiator was completed, the temperature was maintained at the same level for approximately 6 hours, and then it was cooled to room temperature to obtain a solution of a copolymer (thermosetting resin K-1) with a solid content of 43.5%. The weight-average molecular weight of the obtained resin K-1 was 24,000. The copolymer prepared in Preparation Example 11-1 has the structural units shown in Chemical Formula 1-4 above.

[0245] [Production Example 11-2: Production of Thermosetting Resin K-2]

[0246] The inside of a flask equipped with a reflux condenser, a dropping funnel, and a stirrer was replaced with a nitrogen atmosphere, and 280 parts of propylene glycol monomethyl ether acetate was added, and the mixture was heated to 80°C with stirring. Then, a mixture of 38 parts of acrylic acid and 3,4-epoxytricyclo[5.2.1.02,6]dec-8-yl acrylate and 3,4-epoxytricyclo[5.2.1.02,6]dec-9-yl acrylate (containing a molar ratio of 1:1) was added dropwise over 5 hours to a mixed solution of 289 parts and 125 parts of propylene glycol monomethyl ether acetate. On the other hand, a solution of 33 parts of 2,2-azobis(2,4-dimethylvaleronitrile) dissolved in 235 parts of propylene glycol monomethyl ether acetate was added dropwise over 6 hours. After the addition was completed, the mixture was maintained at 80°C for about 6 hours and then cooled to room temperature to obtain a copolymer (thermosetting resin K-2) solution having a solid content of 35.1% and a viscosity of 125 mPas measured with a B-type viscometer (23°C). The weight average molecular weight (Mw) of the obtained copolymer was 25,400. The copolymer produced in Production Example 11-2 has a structural unit as shown in Chemical Formula 1-5 above.

[0247] In summary, the embodiments of the present disclosure propose a colored resin composition, a photoresist structure formed by applying this colored resin composition, a color filter including this photoresist structure, and a display device. In some embodiments, the colored resin composition includes a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photoinitiator, and a solvent. Among them, the alkali-soluble resin includes a photocurable resin, and the weight average molecular weight (Mw) of this photocurable resin is less than 20,000, and the acid value titrated by potassium hydroxide (KOH) is less than 100 mg / g. After the colored resin composition proposed by the embodiment is coated on a substrate and exposed, the composition of the alkali-soluble resin can significantly reduce the difference in the degree of crosslinking between the upper part of the composition far from the substrate and the lower part of the composition adjacent to the substrate, thereby narrowing the strength difference between the upper part and the lower part of the composition after crosslinking. In particular, the appropriate combination of the molecular weight and acid value of the photocurable resin and / or thermosetting resin included in the alkali-soluble resin proposed by some embodiments can significantly make the anti-etching ability of the upper and lower parts of the photoresist equivalent after the colored resin composition is coated on the substrate. After exposure and development, the formed photoresist structure can present a mushroom-shaped cross-section, and the undercut depth can be significantly reduced (for example, reduced to about 1.0 μm or less than 1.0 μm). Therefore, the colored resin composition proposed according to the embodiments of this case can avoid the problem of photoresist peeling after the development process, and the formed photoresist structure has acceptable or good integrity in both the overall and edge profiles. Therefore, the display device applying the embodiments of the present disclosure can avoid the exposure defects generated by the pixels of the display device due to local peeling of the photoresist, and can also significantly improve the problem that the uneven bright and dark lines caused by the defective photoresist lead to an overestimated number of photoresist defects detected by the inspection machine.

[0248] Although the present invention has been disclosed above with several preferred embodiments, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make any changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.

Claims

1. A colored resin composition comprising a colorant, an alkali-soluble resin, a polymerizable unsaturated compound, a photoinitiator, and a solvent, wherein, The alkali-soluble resin comprises a photocurable resin and a thermosetting resin, wherein the weight-average molecular weight (Mw) of the photocurable resin is less than 20,000, and the acid value titrated with potassium hydroxide (KOH) is less than 100 mg / g. The -COOH groups contained in the photocurable resin account for 3.5 mol% to 10 mol% of the photocurable resin. The weight-average molecular weight of the thermosetting resin is less than 10,000, and the acid value titrated with potassium hydroxide (KOH) is between 100 mg / g and 120 mg / g.

2. The colored resin composition according to claim 1, wherein the acid value titrated with potassium hydroxide (KOH) of the photocurable resin is less than 55 mg / g.

3. The colored resin composition according to claim 1 or 2, wherein the weight-average molecular weight of the photocurable resin is between 6,000 and 20,000.

4. The colored resin composition according to claim 3, wherein the -COOH groups contained in the photocurable resin account for less than 7 mol% of the photocurable resin.

5. The colored resin composition according to claim 1, wherein the weight ratio of the photocurable resin to the monomer of the polymerizable unsaturated compound is 6.7% to 300%.

6. The colored resin composition according to claim 1, wherein, The photocurable resin of the alkali-soluble resin comprises a copolymer having the structure shown in the following formula (I): Wherein, m, e, f, and g are positive integers.

7. The colored resin composition according to claim 6, wherein, As shown in the structure of formula (I), assuming the whole molecular chain is 100%, then m accounts for 1% to 10% of the polymer chain; e accounts for 20% to 70% of the polymer chain; f accounts for 20% to 70% of the polymer chain; and g accounts for 1% to 35% of the polymer chain.

8. The colored resin composition according to claim 6, wherein the copolymer having the structure represented by formula (I) comprises: Copolymer of dicyclopentyl (meth)acrylate (TCDMA) / (meth)acrylate methyl (MMA) / (glycidyl (meth)acrylate (GMA)) / (meth)acrylic acid (MAA).

9. The colored resin composition according to claim 8, wherein, The main chain of the copolymer having the structure shown in formula (I) comprises: Dicyclopentyl (meth)acrylate (TCDMA), which accounts for 3 mol% of the aforementioned main chain; (Meth)acrylate methyl (MMA), which accounts for 70 mol% to 27 mol% of the aforementioned main chain; and (Glycidyl (meth)acrylate (GMA)), which accounts for 27 mol% to 70 mol% of the aforementioned main chain.

10. The colored resin composition according to claim 1, wherein based on the total weight of the colored resin composition being 100% by weight, the alkali-soluble resin accounts for 5% to 50% by weight of the colored resin composition.

11. The colored resin composition according to claim 1, wherein the thermosetting resin accounts for 8.9% to 10% by weight of the colored resin composition, and the photocurable resin accounts for 1.5% to 17.4% by weight of the colored resin composition.

12. The colored resin composition according to claim 11, wherein the photocurable resin accounts for 1.5% to 14.6% by weight of the colored resin composition, and the acid value titrated with potassium hydroxide (KOH) is less than 50 mg / g.

13. The colored resin composition according to claim 1, wherein the weight-average molecular weight of the thermosetting resin is 5,000 or more.

14. The colored resin composition according to claim 1, wherein, based on 100% by weight of the total weight of the colored resin composition, the colorant ranges from 10% to 30% by weight of the colored resin composition; the polymerizable unsaturated compound ranges from 5% to 50% by weight of the colored resin composition; and the photoinitiator ranges from 0.1% to 10% by weight of the colored resin composition.

15. A photoresist structure comprising the colored resin composition according to any one of claims 1 to 14 coated on a substrate and formed after baking, exposure, and development steps, wherein the photoresist structure is a convex body, and a vertical projection area of the convex body on the substrate is larger than a contact area between a bottom surface of the convex body and the substrate.

16. The photoresist structure according to claim 15, wherein a top of the convex body has a curvature, and a notch is formed between a most remote point on an edge of the convex body and a position where the bottom surface of the convex body contacts the substrate.

17. The photoresist structure according to claim 15, wherein there is a distance between a vertical projection of a most remote point on an edge of the convex body on the substrate and a position where the bottom surface of the convex body contacts the substrate, and this distance is defined as an undercut depth, and the undercut depth is less than 1 μm.

18. The photoresist structure according to claim 17, wherein a parallel line is drawn parallel to the substrate at a highest vertex of the convex body, and a vertical line is drawn perpendicular to the substrate at the most remote point on the edge of the convex body, wherein an included angle formed by the parallel line and the vertical line is equal to 90 degrees, and a cross-section of the convex body between the parallel line and the vertical line includes an arc segment.

19. A color filter formed from the colored resin composition according to any one of claims 1 to 14.

20. The color filter according to claim 19, comprising a photoresist layer formed by applying the colored resin composition above a substrate and performing exposure and development.

21. A display device comprising the color filter according to claim 19.

Images